WO2021135893A1

WO2021135893A1 - Hexahedral shielding device, electronic module applying hexahedral shielding device, and manufacturing method for electronic module

Info

Publication number: WO2021135893A1
Application number: PCT/CN2020/135710
Authority: WO
Inventors: 金亮; 梁文杰; 莫财旺
Original assignee: 广州金升阳科技有限公司
Priority date: 2019-12-31
Filing date: 2020-12-11
Publication date: 2021-07-08
Also published as: CN111010861B; CN111010861A

Abstract

A hexahedral shielding device, comprising a box-like shielding body (10), a sheet-like shielding bottom cover (20), a first connecting terminal (30), a second connecting terminal (40), and a PCB (50). The second connecting terminal (40) is provided with a first supporting protruding portion (401) and a second supporting protruding portion (402), so that the second connecting terminal (40) can be conveniently connected to a first metallized through hole (204) and a second metallized through hole (503) in an automatic welding manner. In addition, the sheet-like shielding bottom cover (20) is further provided with an empty slot (205), and a welding portion (303) of the first connecting terminal (30) is embedded into the empty slot (205), so that the welding portion (303) of the first connecting terminal (30) can be conveniently connected to a first pad (208), a second pad (209), and a side wall copper foil (206) in an automatic welding manner, and finally, the box-like shielding body (10), the sheet-like shielding bottom cover (20), and a reference ground of the PCB (50) are connected together. Compared with the prior art, automatic welding operation can be implemented in a whole process, the welding quality is high, the operation efficiency is high, the machining cost is low, and large-scale batch production is facilitated.

Description

Six-sided shielding device, electronic module using the six-sided shielding device and manufacturing method thereof

Technical field

The invention relates to a six-sided shielding device, an electronic module using the six-sided shielding device and a manufacturing method thereof, in particular to a low-cost, well-grounded six-sided shielding device and an electronic module using the six-sided shielding device And its production method.

Background technique

With the development of modern science and technology, small and easy-to-use electronic modules have become more and more widely used. Most of the electronic modules and other electronic devices in operation are accompanied by the conversion of electromagnetic energy. High-density, wide-spectrum electromagnetic signals fill the living space of human beings, forming a very complex electromagnetic environment. On the one hand, in order to improve the performance of electronic modules, manufacturers continue to refresh their operating frequencies. However, the electromagnetic disturbance generated by the high-frequency circuit seriously threatens the normal operation of other electronic equipment compatible with it, and also has a greater impact on communication quality and human health. On the other hand, when the electronic module is in such a complicated electromagnetic environment, it is also subject to electromagnetic interference from other electronic devices, which may affect the normal operation of the electronic module itself in severe cases. Therefore, it is necessary to improve the electromagnetic compatibility of the electronic module to improve the survivability of the electronic module in a complex electromagnetic environment.

In the existing electromagnetic compatibility technology, shielding is one of the technical means to suppress electromagnetic interference, that is, the shielding body is used to block or reduce the transmission of electromagnetic energy. According to the working principle of shielding, it can usually be divided into three categories: electrical shielding, magnetic shielding, and electromagnetic shielding.

Electrical shielding can prevent interference caused by capacitive coupling between two circuits (or two components or components). The electrical shielding body is made of good conductors and has a good grounding. Generally, the grounding resistance of the shielding body is required to be less than 2mΩ. In this way, the electrical shield can prevent the interference generated by the interference source inside the shield from leaking to the outside, and can also prevent the interference from the outside of the shield from intruding into the interior.

Magnetic shielding is mainly used in low-frequency situations. The shielding body uses high-permeability materials to form a low magnetic resistance path, which encloses the magnetic lines of force in the shielding body, thereby preventing the internal magnetic field from spreading out or the external magnetic field interference from entering, which can prevent low-frequency magnetic field interference.

Electromagnetic shielding is mainly used in high-frequency situations, using the reflection of electromagnetic waves on the surface of the conductor and the sharp attenuation of propagation in the conductor to isolate the mutual coupling of high-frequency electromagnetic fields, thereby preventing the interference of high-frequency electromagnetic fields.

It can be seen from the above that for different shielding methods, the shielding effectiveness is not only related to the material of the shielding body, but also related to whether the shielding body is grounded. For electrical shielding, the shielding body must be well grounded; for low-frequency magnetic shielding and high-frequency electromagnetic shielding, the shielding body may not need to be grounded. The "grounding" mentioned here can be "earth" or "system reference ground".

In order to illustrate the difference between capacitive coupling when the shielding body is grounded and not grounded, as follows:

Figure 1-1 shows the coupling model of the interference source S and the receiver R when they are not shielded;

Figure 1-2 shows the coupling model of the interference source S and the receiver R when an ungrounded shield P is added;

Figure 1-3 shows the coupling model and equivalent circuit of the interference source S and the receiver R when the grounding shield P is added.

For Figure 1-1, the induced voltage generated by the interference source S at the receiver R terminal through the distributed capacitive coupling between the two is:

In the formula, U _S is the interference voltage, C _SR0 is the coupling capacitance between the interference source S and the receiver, and C _R is the distributed capacitance of the receiver to the ground.

For Figure 1-2, a shield P is inserted between the interference source S and the receiver R, but the shield P is not grounded. Suppose C _P is the distributed capacitance of the shield to ground, C _SP is the distributed capacitance between the interference source S and the shield P, C _RP is the distributed capacitance between the receiver R and the shield P, and C _SR is the added shield P After the remaining coupling capacitor. Since C _{SR is} very small and can be ignored, we can get:

therefore:

It can be seen from formula (1-3) that if C _{P is} much smaller than C _SP , and C _RP C _R /(C _RP +C _R ) is much smaller than C _SP , then:

Since the shield P is closer to the receiver R than the interference source S, and the size of the shield P is larger than the size of the interference source S, C _SR0 <C _RP . Comparing formula (1-1) with formula (1-4), it can be seen that U _N1 > U _N0 . That is, after adding the shielding body P that is not grounded, not only does it not play a shielding effect, but it increases the coupling between the interference source S and the receiver, which increases the interference effect.

For Figure 1-3(a), since the shield P is well grounded, the shield-to-ground capacitance C _P tends to infinity, making the potential U _{P of the} shield P tend to zero, so the induced voltage on the receiver R is also Tend to zero, and the shielding body P has a good shielding effect. In fact, the shield P is not infinite, and there must be a residual capacitance C _SR between the interference source S and the receiver. Figure 1-3(b) is the equivalent circuit of Figure 1-3(a) when _{C SR is considered. From this, we can get:}

It can be seen from formula (1-5) that in order to obtain a good shielding effect, in addition to a good grounding of the shield P, it is also necessary to reduce the residual capacitance C _SR as much as possible.

In order to make the residual capacitance C _SR as small as possible, the existing technology usually puts the PCB circuit board in a box-shaped six-sided shielding body with all six sides of the shielding body. Because the PCB circuit board needs to be placed inside the box-shaped hexahedral shield, the box-shaped hexahedral shield cannot be made into a whole at one time, but must be divided into two parts: one is a shielding shell with an opening on one side, and the other The second is a shielding bottom cover. At the same time, in order to achieve a good electrical shielding effect, the shielding shell and the shielding bottom cover must be connected to the reference ground of the PCB circuit board. The usual practice is as follows:

①Plating a layer of solderable film that can be soldered with tin-based solder on the inner and outer surfaces of the metal shell with one side opening, such as electroplating nickel;

② Solder one end of a wire to the grounding pad of the PCB circuit board;

③Put the welded wires and PCB circuit board into the metal shell after plating on the surface;

④ Weld the other end of the wire on the side wall of the metal shell so that the metal shell is electrically connected to the reference ground of the PCB circuit board;

⑤The PCB bottom cover with pads arranged on one edge is welded together with the metal shell through soldering to form a box-shaped hexahedral shield.

In this way, because the PCB circuit board is placed inside the box-shaped hexahedral shield, the residual capacitance C _SR can be relatively small, and because the box-shaped hexahedral shield is connected to the reference ground of the PCB circuit board, it can play a good role. Shielding effectiveness.

However, this approach will bring the following three problems:

First, the weldable film on the surface of the metal shell adopts an electroplating process, the total area of the inner and outer surfaces of the metal shell is relatively large, the processing cost caused by electroplating is high, and the environmental pollution is also relatively large;

Second, the box-shaped six-sided shield is electrically connected to the reference ground of the PCB circuit board by wire welding. In order to prevent short circuits, the wires generally have insulation on the surface. When soldering, you need to remove the insulation on the welding part first, and then The two ends of the wire are respectively welded to the metal shell and PCB circuit board. This method will not only increase the processing time of the insulation skin and increase the processing cost. In addition, the wire can only be welded to the inner wall of the metal shell, which is very inconvenient and difficult to implement. Automated operations.

Third, set the pads at the edge of the PCB bottom cover. Due to the limitation of the PCB processing technology, the pads cannot be set to the most edge of the PCB board, but a certain processing distance must be reserved from the most edge of the PCB board. This will cause the PCB There is a "gap" between the pad and the welding surface of the metal shell, so that when soldering, the solder cannot connect the PCB pad and the welding surface of the metal shell through the wetting force of the solder itself, but must be joined The amount of solder that exceeds the area of the PCB pad can be covered, causing the solder to "accumulate" on the PCB pad and overflow to the welding surface of the metal shell, and finally the metal shell surface and the PCB base pad are welded together. It can be seen that this method not only makes soldering difficult and difficult to achieve automation, but also has a large amount of solder in the soldering spot, which not only causes waste of solder, increases material costs, but also has an unsightly appearance.

In the Chinese patent application number 201120481304.6, a “six-sided shielding package box” is mentioned: the shielding shell is an aluminum alloy package box with anodized surface, and a connecting terminal is arranged inside the aluminum alloy package box; it also includes a plastic base A shielding sheet adapted to the plastic base is arranged on the inner side of the plastic base as a shielding bottom cover. In actual application, the customer first puts the PCB in the packaging box, and then solders the PCB to the connection terminals on the packaging box to electrically connect the customer PCB to the packaging box, and finally connects the customer PCB to the shielding sheet on the plastic base through a wire Welded and connected together to form a box-shaped six-sided shield and communicate with the customer's PCB. Due to the anodic oxidation treatment on the surface of the aluminum alloy packaging box, the environmental pollution caused by the electroplating process is avoided, and the cost of the surface treatment is also reduced.

However, the above-mentioned six-sided shielded packaging box:

On the one hand, the connecting terminals are arranged inside the packaging box, and the PCB needs to be placed in the packaging box before the PCB and the connecting terminals can be welded. This not only makes the welding inconvenient and difficult to achieve automation; at the same time, it is inevitable that there will be Tin beads, once the solder splash occurs, the PCB has been soldered to the connecting terminal at this time. The PCB, the connecting terminal and the shell are connected as a whole, so it is difficult to remove the splashed solder by cleaning, etc., and the remaining tin beads will be Make the PCB have the risk of short circuit, and cause the customer's product to work abnormally in severe cases.

On the other hand, the shielding sheet is arranged inside the plastic base, and the shielding sheet needs to be connected to the customer PCB through a wire. In order to avoid short circuit between the wire and other components on the customer PCB, the wire surface is wrapped with insulation. As mentioned above, this will also add extra Increase the time for insulating skin treatment and increase the processing cost.

To sum up, in the existing technology, it is inconvenient to connect the shielding shell, the shielding bottom cover, and the PCB reference ground together, and it is very inconvenient to work together, and an additional wire is needed, and at the same time, it is necessary to wrap the surface of the wire first. Welding can only be carried out after the insulation skin is processed. The whole process has a long processing cycle, low operation efficiency and high man-hour cost. Even if the process is improved, it is difficult to realize automatic operation, which is not conducive to mass production of products.

Summary of the invention

In view of this, the problem to be solved by the present invention is to provide a low-cost, well-grounded six-sided shielding device, and at the same time provide an electronic module using the six-sided shielding device and a manufacturing method thereof.

The technical problem to be solved by the present invention is realized through the following technical solutions:

A six-sided shielding device, including a box-shaped shielding body, a sheet-shaped shielding bottom cover, a first connecting terminal, a second connecting terminal, and a PCB circuit board;

The box-shaped shielding body is a square structure with one side open;

The sheet-shaped shielding bottom cover is a PCB board, including an upper surface, a lower surface, and a shielding copper foil. The shielding copper foil is laid on at least one of the upper surface and the lower surface of the shielding bottom cover; the sheet-shaped shielding bottom The cover is also provided with a first metalized through hole, the first metalized through hole penetrates the upper surface and the lower surface of the shield bottom cover and the shielding copper foil; the first metalized through hole is in communication with the shielding copper foil;

The PCB circuit board includes an upper surface and a lower surface; the PCB circuit board is also provided with a second metallized through hole, the second metalized through hole penetrates the upper surface and the lower surface of the PCB circuit board, and the second metallized through hole penetrates the upper surface and the lower surface of the PCB circuit board. 2. The metallized through hole is connected with the reference ground of the PCB circuit board;

The first connecting terminal is arranged on the side wall of the box-shaped shielding body; it includes a connecting part, a fixing part and a welding part;

The sheet-shaped shielding bottom cover is also provided with a hollow slot for welding with the welding part of the first connecting terminal. The side wall of the hollow slot is covered with a side wall copper foil, and the upper surface of the sheet-shaped shielding bottom cover And the lower surface are respectively provided with a first pad and a second pad around the empty groove, the first pad and the second pad are respectively connected with the sidewall copper foil, the first pad and the second pad At least one of the two pads is in communication with the shielding copper foil; the welding part of the first connection terminal is embedded in the empty groove, and is at least connected with the first pad, the second pad, and the sidewall copper foil. One is connected by solder;

The second connection terminal is a GND pin terminal of the PCB circuit board.

As a specific implementation of the above technical solution, the second connecting terminal is provided with a first supporting convex portion and a second supporting convex portion; the first supporting convex portion is connected to the lower surface of the sheet-shaped shielding bottom cover. The first metallized through hole is connected by solder; the second supporting protrusion is connected with the second metalized through hole on the upper surface of the PCB circuit board by solder.

As a specific implementation of the above technical solution, the welding part of the first connecting terminal is a thin terminal, and the empty groove on the sheet-shaped shielding bottom cover is a groove formed by a recessed edge of a plate.

As a specific implementation of the above technical solution, the welding part of the first connection terminal is a terminal with a convex part, and the corresponding position of the sheet-shaped shielding bottom cover is opened with a slot for embedding the first connection terminal Welding department.

Preferably, the box-shaped shielding body is made of hard aluminum alloy, and the surface is subjected to anodizing and sandblasting treatments.

Preferably, the hole diameter of the second metallized hole is larger than the hole diameter of the first metallized through hole.

Preferably, the gap distance between the welding part of the first connecting terminal and the side wall copper foil is maintained in a range of 0.1 mm to 0.3 mm.

In addition, the technical solution of the present application also includes an electronic module applied to the above-mentioned six-sided shielding device, which is characterized in that:

The aforementioned six-sided shielding device also includes pin terminals for connecting to external circuits;

The sheet-shaped shield bottom cover is also provided with a third metalized through hole, and the metalized through hole does not communicate with the shielding copper foil;

The PCB circuit board is also provided with a fourth metallized through hole, and the surface of the PCB circuit board is also provided with components.

As a specific implementation of the above technical solution, the pin terminal includes a third support protrusion and a fourth support protrusion; the third support protrusion is on the lower surface of the sheet-shaped shielding bottom cover and the third support protrusion. The metallized through hole is communicated with solder; the fourth supporting protrusion is communicated with the fourth metalized through hole on the upper surface of the PCB circuit board through solder.

As a specific implementation of the above technical solution, the upper surface and the lower surface of the PCB circuit board are respectively provided with components and components.

Preferably, the number of the pin terminals is at least three.

The technical solution of the present application also provides a manufacturing method applied to the above electronic module, which is characterized in that it includes the following steps:

The sheet-shaped shielding bottom cover is welded to the second connecting terminal and the pin terminal: the first metallized through hole of the sheet-shaped shielding bottom cover is welded to the first supporting protrusion of the second connecting terminal, and the third of the sheet-shaped shielding bottom cover is welded. The metallized through hole is welded and communicated with the third supporting protrusion of the pin terminal to form a component A together;

Preferably, the welding is automatic manipulator welding;

Preferably, the soldering is through-hole reflow soldering;

Welding components on the bottom surface of the PCB circuit board: solder paste and component patches are printed on the bottom surface of the PCB circuit board, and then reflow soldering to form component B;

Assembly and welding of component B, components, and component A: solder paste and component patches are printed on the surface of the PCB circuit board of component B, and the second connection terminal on component A is aligned with the second metalized through hole on the PCB circuit board, Insert from the upper surface to the lower surface direction, so that the second supporting protrusion on the surface of the PCB circuit board is in contact with the second metalized through hole; similarly, the pin terminal on the component A is aligned with the fourth metalized through hole on the PCB circuit board. The hole is inserted from the upper surface to the lower surface direction, so that the fourth supporting protrusion is in contact with the fourth metalized through hole on the PCB circuit board surface, and then the assembled component B, components, and component A are reflow soldered to form component C ；

The step of inserting the component C into the box-shaped shielding body: inserting the component C into the box-shaped shielding body, and the welding part of the first connecting terminal on the box-shaped shielding body is embedded in the empty slot;

The welding part of the first connection terminal and the first pad, the second pad and the side wall copper foil welding step: connect the first connection terminal with the first pad, the second pad and the side wall copper foil through solder;

Preferably, the welding is automatic manipulator welding.

The beneficial effects of the present invention are:

1. By setting an empty slot on the sheet-shaped shield bottom cover, and embedding the welding part of the first connection terminal into the empty slot, the welding part and the first and second pads and the sidewall copper foil can be very convenient It is connected by automatic welding, which has high welding quality, high work efficiency and low processing cost. At the same time, since welding is performed on the upper surface of the sheet-shaped shielding bottom cover, it is easy to clean even if there are residues such as flux and tin beads;

2. By arranging the first supporting protrusion and the second supporting protrusion on the second connecting terminal, the second connecting terminal can be easily connected with the first metalized through hole and the second through hole by automatic welding. High quality, high work efficiency, low processing cost;

3. The second connecting terminal can be set as the GND pin terminal of the PCB circuit board. There is no need to add additional connecting wires in the existing scheme, and there is no need to spend time processing the insulating skin on the surface of the connecting wires, which saves material costs and reduces Processing cost and manufacturing cycle are convenient for mass production.

Description of the drawings

Figure 1-3(a) is the coupling model of the interference source S and the receiver R when the grounding shield P is added;

Figure 1-3(b) is the equivalent circuit of the interference source S and the receiver R when the grounding shield P is added;

2 is a structural diagram of the first embodiment of the six-sided shielding device of the present invention;

3 is a partial structural diagram of the second embodiment of the six-sided shielding device of the present invention;

FIG. 4 is a structural diagram of the first embodiment of the first connecting terminal 30;

5 is a partial structure diagram of the first embodiment of the sheet-shaped shielding bottom cover 20;

FIG. 6 is a structural diagram of the second embodiment of the first connecting terminal 30;

FIG. 7 is a partial structure diagram of the second embodiment of the sheet-shaped shielding bottom cover 20;

FIG. 8 is a partial front view of the sheet-shaped shield bottom cover 20;

9 is a partial cross-sectional view of the sheet-shaped shielding bottom cover 20 along the dashed line 211;

FIG. 10 is a structural diagram of the second connecting terminal 40;

11 is a front view of the communication between the sheet-shaped shield bottom cover 20, the PCB circuit board, and the second connection terminal 40;

Figure 12 is an exploded schematic diagram of the structure of the electronic module device of the present invention;

Figure 13-1(a) is a front view of the implementation method of component A;

Figure 13-1(b) is a front view of the second implementation method of component A;

Figure 13-2 is the front view of component B;

Figure 13-3 is the front view of component C;

Figure 13-4 is a front view of the electronic module device of the present invention;

FIG. 14 shows the steps of the manufacturing method of the electronic device of the present invention.

Detailed ways

For professionals in the industry, the components involved in the present invention have different structures during different processing periods. During the manufacturing process, depending on different mechanical equipment, fixtures and process implementation methods, they can be used in structure and processing. In terms of reference, various changes are derived without departing from the scope of the present invention. Moreover, the descriptions and illustrations therein are essentially for the purpose of general elaboration for the convenience of popular understanding, and are not intended to limit the present invention.

In order to make it easier for those skilled in the art to understand the present invention, the present invention will be described below in conjunction with specific embodiments.

2 is a structural diagram of the six-sided shielding device of the present invention. A six-sided shielding device includes a box-shaped shield body 10, a sheet-shaped shield bottom cover 20, a first connection terminal 30, a second connection terminal 40, and a PCB circuit board 50 .

The box-shaped shield 10 is open on one side to facilitate the installation of the PCB circuit board 50 into the box-shaped shield 10. The box-shaped shield 10 is made of hard aluminum alloy, which has a good shielding effect, and the surface is anodized and sprayed. Sand treatment.

The first connecting terminal 30 includes a connecting portion 301, a fixing portion 302, and a welding portion 303; the connecting portion 301 of the first connecting terminal 30 communicates with the side wall of the box-shaped shield 10, and can be accurately set in the place by riveting and other techniques. Where necessary; the fixing portion 302 of the first connecting terminal 30 is thicker than the connecting portion 301, and is used to fix the first connecting terminal 30 on the side wall of the six-sided shielding box, so that the first connecting terminal 30 is not easy to loosen and fall off; Since the box-shaped shield 10 finally needs to be connected with the reference ground of the PCB circuit board, but because the box-shaped shield 10 is made of hard aluminum alloy, the existing brazing technology mainly uses Sn-based solder and Sn-based solder. It is difficult to metallize with aluminum alloy to form an interface alloy layer. Therefore, the box-shaped shield 10 is not directly connected to the reference ground of the PCB circuit board, but is connected to the reference ground of the PCB circuit board through the soldering part 303 of the first connection terminal 30地Connected. In actual implementation, it is only necessary to select a material that can be soldered with Sn-based solder for the first connection terminal 30, such as electroplating tin on the surface of the copper substrate.

There are two implementations for the first connection terminal 30. The first implementation is shown in FIG. 4, where the soldering portion 303 is a thin terminal. Correspondingly, a sheet-shaped shielding bottom cover 20 is provided with a recess formed by the edge of the plate. The groove is an empty groove 205. As shown in FIG. 5, during welding, the welding part 303 of the first connecting terminal 30 is inserted into the empty groove 205 for welding.

In the second embodiment, as shown in FIG. 6, the welding part 303 is a terminal with a convex part, and an empty slot 205 needs to be provided at the corresponding position of the sheet-shaped shielding bottom cover 20, as shown in FIG. 7. When the first connecting terminal 30 adopts the second embodiment, the structure diagram of the six-sided shielding device is shown in FIG. 3. In the second embodiment, because the soldering part is raised, the top surface of the soldering part is flush with the sheet-shaped shielding bottom cover 20, so when the position of the first connecting terminal 30 is set, the sheet-shaped shielding bottom cover 20 is vertical The sinking depth is relatively reduced, and the space contained in the entire six-sided shield is relatively increased.

FIG. 8 is a front view of the sheet-shaped shield bottom cover 20. As shown in FIG. The sheet-shaped shielding bottom cover 20 is a PCB board, including an upper surface 201, a lower surface 202, and a shielding copper foil 203; the shielding copper foil 203 is laid on the upper surface 201 by a conventional PCB processing technology; the sheet-shaped shielding bottom cover 20 is also provided There are first metallized through holes 204, the first metallized through holes 204 penetrate the upper surface 201 and the lower surface 202 and the shielding copper foil 203, and are connected to the shielding copper foil 203; the provision of metalized through holes on the PCB is a well-known technology.

FIG. 9 is a cross-sectional view of the sheet-shaped shield bottom cover 20 taken along the broken line 211 of FIG. 5. A layer of sidewall copper foil 206 is laid on the side wall of the hollow groove 205, and a first pad 208 and a second pad 209 are respectively arranged on the upper surface 201 and the lower surface 202 of the sheet-shaped shielding bottom cover 20 around the hollow groove 205. The bonding pad 208 and the second bonding pad 209 are respectively connected to the sidewall copper foil 206 through the known technology of PCB sidewall copper sinking, and the bonding pad 208 is connected to the shielding copper foil 203.

FIG. 10 is a structural diagram of the second connecting terminal 40. The second connecting terminal 40 is provided with a first supporting protrusion 401 and a second supporting protrusion 402.

In actual implementation, as shown in FIG. 11, the second connecting terminal 40 is vertically inserted into the first metallized through hole 204 from the lower surface 202 to the upper surface 201, and the first supporting protrusion 401 is connected to the first metal on the lower surface 202. The diameter of the first supporting protrusion 401 is larger than the diameter of the first metalized through hole 204, and then the first supporting protrusion 401 and the first metalized through hole are welded by welding technology such as through-hole reflow soldering or automatic robot welding. The holes 204 are welded together by solder. After that, the other end of the second connecting terminal 40 is vertically inserted into the second metallized hole 503 from the upper surface 501 of the PCB circuit board 50 to the lower surface 502, and the second supporting protrusion 402 is formed on the upper surface 501 and the second metallization hole 503. The two metalized through holes 503 are in contact with each other, and the diameter of the second supporting protrusion 402 is larger than the diameter of the second metalized through hole 503, and then the second supporting protrusion 402 and the second metalized through hole 503 are passed through by using the through-hole reflow soldering technique The solder is soldered together. Since the diameter of the first support protrusion 401 and the diameter of the second support protrusion 402 are larger than the diameter of the first metalized through hole 204 and the second metalized through hole 503, respectively, the first support protrusion 401 and the second support The convex portion 402 can not only play a supporting role, so that the second connecting terminal is perpendicular to the sheet-shaped shield bottom cover 20 and the PCB circuit board 50, and at the same time, when the positions of the first supporting convex portion 401 and the second supporting convex portion 402 are fixed After that, the distance between the sheet-shaped shield bottom cover 20 and the PCB circuit board 50 can be fixed, so it can also play a role of limiting, so that the sheet-shaped shield bottom cover 20 and the PCB circuit board 50 maintain a set distance. In addition, since the second connection terminal 40 is inserted into the first metalized through hole 204, there will be a gap between the second connection terminal 40 and the first metalized through hole 204, so skew phenomenon of the second connection terminal 40 will inevitably occur. That is, the second connecting terminal 40 cannot be 90° perpendicular to the sheet-shaped shield bottom cover 20, which will cause the other end of the second connecting terminal 40 to be inserted into the second metalized hole 503 to be misaligned. Therefore, as a preferred solution, the aperture of the second metallized hole 503 is larger than the aperture of the first metallized through hole 204.

So far, since the second metalized hole 503 is connected with the reference ground of the PCB circuit board 50, the shielded copper foil 203 is connected to the first metalized hole 204, and the second connection terminal 40 is connected to the first metalized hole 204 and the second metalized hole 204. The hole 503 is connected, and therefore, the shielding copper foil 203 is connected to the reference ground of the PCB circuit board 50.

Next, the sheet-shaped shield bottom cover 20 and the PCB circuit board 50 that have been welded and communicated with the second connecting terminal 40 are put into the box-shaped shield together, and the welding part 303 of the first connecting terminal 30 is embedded in the sheet-shaped shield. In the empty slot 205 of the bottom cover 20, since the distance between the sheet-shaped shielding bottom cover 20 and the PCB circuit board 50 is defined by the first supporting protrusion 401 and the second supporting protrusion 402 according to the designed distance, it is very It is easy to make the top surface of the soldering portion 303 almost flush with the shielding copper foil 203.

Further, since the top surface of the soldering portion 303 is almost flush with the shielding copper foil 203, it is easy to pass the soldering portion 303, the sidewall copper foil 206, the first pad 208, and the second pad 209 through automatic robot welding technology. The soldering tin is connected together, and the welding surface of the welding part can also be kept flat and beautiful, and there will be no obvious solder bulge phenomenon.

In addition, in order to make the solder joints reliable, as a preferred solution, the minimum gap distance between the surface of the soldering portion 303 and the side wall copper foil 206 is maintained in the range of 0.1mm to 0.3mm. Within this range, the solder can be used during soldering. From the upper surface 201 through the gap to the lower surface 202 and the second pad 209 are welded together, this can increase the welding area and improve the reliability of the solder joint; the gap is less than 0.1mm, which is not conducive to tin penetration; the gap is greater than 0.3mm, If the amount of tin penetration is too much, there is a risk that the solder will fall off and fall onto the PCB circuit board 50.

So far, since the first connection terminal 30 is connected to the sidewall copper foil 206, the first pad 208, and the second pad 209 by welding, the sidewall copper foil 206, the first pad 208, and the second pad 209 are connected by welding. It is connected with the shielding copper foil 203, and the shielding copper foil 203 has been connected with the reference ground of the PCB circuit board 50. Therefore, the box-shaped shield 10, the sheet-shaped shield bottom cover 20, and the PCB circuit board 50 are connected with the reference ground to achieve six Surface shielding and reliable grounding.

Fig. 12 is an electronic module to which the above-mentioned six-sided shielding device is applied. An electronic module, on the basis of the six-sided shielding device of the first embodiment, further includes three pin terminals 60 with the same total length for connecting to external circuits. The sheet-shaped shielding bottom cover 20 is also provided with pins The third metallized through holes 210 with the same number of terminals 60 for welding and communicating with the pin terminals 60 are also provided on the PCB circuit board 50 with the same number of third metallized through holes 210 for connecting with the pin terminals 60 for welding and communicating with the pin terminals 60. Four metallized through holes 504, a number of

components

505 and 506 are respectively provided on the upper surface 501 and the lower surface 502 of the PCB circuit board to realize the electronic function of the electronic module. The second connecting terminal 40 has the same structural size as the pin terminal 60. The third supporting convex portion 601 and the fourth supporting convex portion 602 provided on the pin terminal 60 have the same structural size and function as those of the first connecting terminal 40. The supporting protrusion 401 and the second supporting protrusion 402 are the same; and the second connecting terminal 40 is the GND pin of the electronic module. Correspondingly, the shape, structure and size of the third metalized through hole 210 are the same as the first metalized through hole 204; the shape, structure and size of the fourth metalized through hole 504 are the same as the second metalized through hole 503. Because the pin terminal 60 needs to be connected to an external circuit, the third metallized through hole 210 does not communicate with the shielding copper foil 203.

Below, in conjunction with Figure 13-1, Figure 13-2, Figure 13-3, Figure 13-4, Figure 13-5, Figure 14 detailed description of the manufacturing method and design principles of the electronic module.

The step of welding the sheet-shaped shielding bottom cover 20, the second connecting terminal 40 and the pin terminal 60: the sheet-shaped shielding bottom cover 20, the first supporting protrusion 401 and the third supporting protrusion 601 are connected together by soldering to form the assembly A . For component A, it can be implemented by the following two welding methods.

Component A implementation method 1: As shown in Figure 13-1(a), first print solder paste at the positions of the first metallized holes 204 and the third metallized holes 210 on the upper surface 201 of the sheet-shaped shielding bottom cover 20, in order to prevent printing The solder paste fills the first metallized hole 204 and the third metallized hole 210. The position of the corresponding hole on the stencil is not windowed, and only a circle around the hole is opened and the solder paste is printed; the second connecting terminal 40 and The pin terminal 60 is vertically inserted into the positioning hole of the auxiliary jig. The position of the auxiliary jig positioning hole is corresponding to the position of the first metalized hole 204 and the third metalized hole 210. The auxiliary jig can easily pass the conventional design and Processing is achieved; then the sheet-shaped shielding bottom cover 20 is sleeved on the second connecting terminal 40 and the pin terminal 60, and the first supporting protrusion 401 and the third supporting protrusion 601 are on the lower surface of the sheet-shaped shielding bottom cover 20 202 is in contact with the first metallized hole 204 and the third metallized hole 210 respectively; finally, the shaped shield bottom cover 20, the second connecting terminal 40 and the pin terminal 60 are reflow soldered together, so that the sheet shaped shield bottom cover 20 and the second A supporting protrusion 401 and a third supporting protrusion 601 are welded and communicated to form a component A.

Implementation method of component A: As shown in Figure 13-2(b), first place the bottom surface 202 of the sheet-shaped shielding bottom cover 20 on an auxiliary fixture, and place the sheet-shaped shielding bottom cover 20 on the first The positions of the metallized holes 204 and the third metallized holes 210 correspond to the corresponding positioning holes of the auxiliary jig; then the second connecting terminal 40 is inserted into the first metallized hole 204 and the corresponding direction from the lower surface 202 to the upper surface 201 In the corresponding auxiliary fixture positioning hole, the first supporting protrusion 401 is in contact with the first metalized hole 204 on the lower surface 202; the pin terminal 60 is inserted into the third metalized hole 210 from the lower surface 202 to the upper surface 201 direction And the corresponding auxiliary fixture positioning hole, so that the third supporting protrusion 601 is in contact with the third metalized hole 210 on the lower surface 202; finally, the sheet-shaped shielding bottom cover 20 is welded to the first support by automatic robot welding. The convex portion 401 and the third supporting convex portion 601 are welded and communicated together to form a component A.

The assembly and soldering steps of the components 506 on the lower surface of the PCB circuit board 50: solder paste is printed on the lower surface 502 of the PCB circuit board 50, and the components 506 are patched, and then reflow soldered to form the component B, as shown in FIG. 13-2.

Assembly and welding steps of component B, component 506, and component A: As shown in Figure 13-3, first place the corresponding component 505 pad position on the upper surface 501 of the PCB circuit board 50 on component B and the corresponding position of the second metallized hole 503 Solder paste is printed at the positions corresponding to the fourth metallized holes 504. Similarly, in order to prevent the printed solder paste from filling up the second metallized holes 503 and the fourth metallized holes 504, the positions of the corresponding holes on the stencil do not open windows. Open a window around the hole and print the solder paste; then the component 505 is mounted; then the second connecting terminal 40 and the pin terminal 60 on the component A are moved from the surface 501 of the PCB circuit board to the direction of the surface 502, respectively Corresponding to the second metallized hole 503 and the fourth metallized hole 504 are inserted, and the second supporting protrusion 402 is in contact with the solder paste printed on the second metallized hole 503 on the upper surface 501, and the fourth supporting protrusion 602 The upper surface 501 is in contact with the solder paste printed on the fourth metallized hole 504; finally, the assembled component B, the components 506, and the component A are reflow soldered to form the component C.

The step of installing component C into the box-shaped shield 10: insert the component C into the box-shaped shield 10, and the first connecting terminal 20 on the box-shaped shield 10 is embedded in the empty slot 205; because the sheet-shaped shield bottom cover 20 is connected to the PCB The distance between the circuit boards 50 is defined by the first and

second support protrusions

401 and 402, the third support protrusion 601 and the fourth support protrusion 602 according to the designed distance. Therefore, it is easy to make the welding portion 303 The top surface is almost flush with the shielding copper foil 203.

The first connection terminal 30 is welded to the first pad 208, the second pad 209, and the sidewall copper foil 206. Step: the first connection terminal 30 is connected to the first pad 208, the second pad 209, and the sidewall copper foil 206 Connected through automatic robot welding. The manufacturing steps of the entire electronic device are shown in Figure 14.

The above are only the preferred embodiments of the present invention. It should be pointed out that the above preferred embodiments should not be regarded as limiting the present invention. For those of ordinary skill in the art, without departing from the spirit and scope of the present invention, Several improvements and modifications can also be made, and these improvements and modifications should also be regarded as the protection scope of the present invention, and the embodiments will not be repeated here. The protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

A six-sided shielding device, comprising a box-shaped shielding body (10), a sheet-shaped shielding bottom cover (20), a first connecting terminal (30), a second connecting terminal (40), and a PCB circuit board (50);

The box-shaped shielding body (10) is a square structure with one side open;

The sheet-shaped shielding bottom cover (20) is a PCB board, including an upper surface (201), a lower surface (202), and a shielding copper foil (203). The shielding copper foil (203) is at least laid on the shielding bottom cover On one of the surface (201) and the lower surface (202); the sheet-shaped shield bottom cover (20) is also provided with a first metalized through hole (204), and the first metalized through hole (204) Pass through the upper surface (201) and the lower surface (202) of the shield bottom cover and the shield copper foil (203); the first metallized through hole (204) communicates with the shield copper foil (203);

The PCB circuit board (50) includes an upper surface (501) and a lower surface (502); the PCB circuit board (50) is also provided with a second metalized through hole (503), and the second metalized through The hole (503) penetrates the upper surface (501) and the lower surface (502), and the second metallized through hole (503) is in communication with the reference ground of the PCB circuit board (50);

Its characteristics are:

The first connecting terminal (30) is arranged on the side wall of the box-shaped shielding body (10); it includes a connecting part (301), a fixing part (302) and a welding part (303);

The sheet-shaped shield bottom cover (20) is also provided with a hollow groove (205) for welding with the welding part (303) of the first connecting terminal (30), and a side wall of the hollow groove (205) is covered Layer sidewall copper foil (206), the upper surface (201) and the lower surface (202) of the sheet-shaped shield bottom cover (20) are respectively provided with a first pad (208) and a second pad (208) and a second pad (208) and a second pad (208) around the cavity (205). The bonding pads (209), the first bonding pads (208) and the second bonding pads (209) are respectively connected to the sidewall copper foil (206), the first bonding pads (208) and the second bonding pads At least one of the disks (209) is in communication with the shielded copper foil (203); the welding part (303) of the first connecting terminal (30) is embedded in the empty slot (205) and is at least connected to the first One of the pad (208), the second pad (209), and the sidewall copper foil (206) is connected by solder;

The second connection terminal (40) is a GND pin terminal of the PCB circuit board (50).
According to a six-sided shielding device according to claim 1, the second connecting terminal (40) is provided with a first supporting convex portion (401) and a second supporting convex portion (402); the first supporting convex portion (401) The lower surface (202) of the sheet-shaped shielding bottom cover (20) is connected with the first metallized through hole (204) through solder; the second supporting protrusion (402) is connected to the PCB The upper surface (501) of the circuit board (50) and the second metallized through hole (503) are connected by solder.
The six-sided shielding device according to claim 1, wherein the welding part (303) of the first connecting terminal (30) is a thin terminal, and the slot (205) on the sheet-shaped shielding bottom cover (20) It is a groove formed by the concave edge of the board.
A six-sided shielding device according to claim 1, wherein the welding portion (303) of the first connecting terminal (30) is a terminal with a convex portion, and the corresponding position on the sheet-shaped shielding bottom cover (20) is opened There is a slot (205) for inserting the welding part (303) of the first connection terminal (30).
The six-sided shielding device according to claim 1, wherein the box-shaped shielding body (10) is made of hard aluminum alloy, and the surface is subjected to anodizing and sandblasting treatments.
The six-sided shielding device according to claim 1, wherein the aperture of the second metallized hole (503) is larger than the aperture of the first metallized through hole (204).
The six-sided shielding device according to claim 1, wherein the gap distance between the welding portion (303) of the first connection terminal (30) and the side wall copper foil (206) is maintained in the range of 0.1 mm to 0.3 mm.
An electronic module, comprising any six-sided shielding device according to claims 1 to 7, characterized in that:

It also includes pin terminals (60) for connecting to external circuits;

The sheet-shaped shield bottom cover (20) is also provided with a third metalized through hole (210), and the metalized through hole (210) does not communicate with the shielding copper foil (203);

The PCB circuit board (50) is also provided with a fourth metallized through hole (504), and the surface of the PCB circuit board (50) is also provided with components.
The electronic module according to claim 8, wherein the pin terminal (60) includes a third supporting protrusion (601) and a fourth supporting protrusion (602); the third supporting protrusion (601) is The lower surface (202) of the sheet-shaped shielding bottom cover (20) is connected with the third metalized through hole (210) through solder; the fourth supporting protrusion (602) is on the upper surface of the PCB circuit board (50) (501) communicates with the fourth metallized through hole (504) through solder.
The electronic module according to claim 8, wherein the upper surface (501) and the lower surface (502) of the PCB circuit board (50) are respectively provided with components (505) and components (506).
The electronic module according to claim 8, wherein the number of the pin terminals (60) is at least three.
A manufacturing method of the electronic module according to any one of claims 8 to 11, characterized in that it comprises the following steps:

The sheet-shaped shielding bottom cover (20) is welded to the second connecting terminal (40) and the pin terminal (60): the first metallized through hole (204) and the second connecting terminal (40) of the sheet-shaped shielding bottom cover (20) The first supporting protrusion (401) of) is connected by soldering, and the third metallized through hole (210) of the sheet-shaped shielding bottom cover (20) and the third supporting protrusion (601) of the pin terminal (60) pass through The solder is connected together to form component A;

Soldering components (506) on the bottom surface (502) of the PCB circuit board (50): solder paste and components (506) are printed on the bottom surface (502) of the PCB circuit board (50), and then reflow soldered to form component B;

Assembly and welding of component B, component (505), component A: printed solder paste on the upper surface (501) of the PCB circuit board (50) on component B, component (505) patch, second connection terminal (40) on component A ) Align the second metallized through hole (503) on the PCB circuit board (50), and insert it from the upper surface (501) to the lower surface (502) direction, so that the second supporting protrusion (402) is on the PCB circuit board ( 50) The upper surface (501) is in contact with the solder paste printed on the second metallization via (503); similarly, the pin terminal (60) on the component A is aligned with the fourth metallization on the PCB circuit board (50) The through hole (504) is inserted from the upper surface (501) to the lower surface (502) direction, so that the fourth supporting protrusion (602) is on the upper surface (501) of the PCB circuit board (50) and the fourth metalized through hole ( 504) The printed solder paste contacts, and then the assembled component B, components (505), and component A are reflow soldered together to form component C;

The step of inserting the component C into the box-shaped shield (10): insert the component C into the box-shaped shield (10), and the welding part (303) of the first connection terminal (30) on the box-shaped shield (10) is inserted into In the empty slot (205);

The welding part (303) of the first connecting terminal (30) is welded to the first pad (208), the second pad (209), and the sidewall copper foil (206). The welding step: the first connecting terminal (30) and the first A bonding pad (208), a second bonding pad (209), and the sidewall copper foil (206) are connected by solder.