WO2021135274A1 - 大规模阵列天线及天线模块 - Google Patents

大规模阵列天线及天线模块 Download PDF

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Publication number
WO2021135274A1
WO2021135274A1 PCT/CN2020/110586 CN2020110586W WO2021135274A1 WO 2021135274 A1 WO2021135274 A1 WO 2021135274A1 CN 2020110586 W CN2020110586 W CN 2020110586W WO 2021135274 A1 WO2021135274 A1 WO 2021135274A1
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WIPO (PCT)
Prior art keywords
insulating
insulator
plate
metal
antenna module
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PCT/CN2020/110586
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English (en)
French (fr)
Inventor
段红彬
李明超
王钦源
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京信通信技术(广州)有限公司
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Publication of WO2021135274A1 publication Critical patent/WO2021135274A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14—Reflecting surfaces; Equivalent structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • the present invention relates to the technical field of communication devices, in particular to a large-scale array antenna and an antenna module.
  • the antenna module usually includes a metal bottom plate, a metal partition set on the metal bottom plate, and a feeder network.
  • the metal bottom plate is often formed by metal die-casting or sheet metal technology
  • metal partitions are often formed by metal die-casting, aluminum profile pultrusion or sheet metal technology to meet the needs of antennas based on 5G large-scale dense high-frequency arrays for diverse layout spaces.
  • metal partitions are generally fixed to the metal bottom plate by screws or rivets or fixedly connected to the metal bottom plate by welding/metal die-casting process.
  • Frequency band antennas have requirements for radiation boundary gaps.
  • 5G antennas have higher insertion loss, increased intermodulation hazards, poor consistency, and excessive use of metal materials, resulting in many antenna parts, heavy weight, and complex assembly problems.
  • the feed network is mostly integrated on the PCB board, and the PCB board is fixedly connected to the metal bottom plate by screws or rivets.
  • the radiating unit usually adopts metal die-casting, sheet metal or PCB vibrator.
  • the radiating unit and the feed network are usually directly welded or connected by coaxial cable welding. Not only is the assembly complicated, the production cost is high, but it also has more solder joints. It is difficult to meet the index requirements of low insertion loss, low intermodulation and high consistency.
  • an antenna module comprising: a metal reflector, a first insulator, a second insulator, the metal reflector is embedded between the first insulator and the second insulator, and the metal reflector
  • the board, the first insulator, and the second insulator are integrally molded;
  • the feeder power divider network, the first insulator includes an insulating bottom plate located on one side of the metal reflector, the feeder
  • the electrical power dividing network is arranged on the insulating base plate;
  • the calibration network, the second insulator includes an insulating cavity located on the other side of the metal reflector, and the calibration network is arranged on the bottom wall of the insulating cavity on.
  • the above-mentioned antenna module does not need to separately form the feeder power dividing network and the calibration network on two PCB boards as in the traditional way, and then use screws and other connectors to divide the PCB board of the feeder power dividing network, the PCB board of the calibration network and
  • the metal reflector is assembled and combined, but the metal reflector, the first insulator and the second insulator are integrally molded, and then the feeder power distribution network is directly set on the insulating bottom plate, and the calibration network is directly installed. It is arranged on the bottom wall of the insulating cavity, so that the weight of the antenna can be reduced, the antenna structure is simplified, the antenna performance index is improved, and the assembly is simplified, which is conducive to the realization of automated production.
  • the first insulator further includes a plurality of insulating isolation plates arranged on the insulating bottom plate at intervals, and the insulating isolation plate is provided with a metal layer.
  • the antenna module further includes a plurality of radiating units located between the adjacent insulating isolation plates, the radiating units are dipole pieces arranged on the insulating bottom plate, and the radiating units It is electrically connected to the feeding power distribution network.
  • the antenna module further includes a guide piece corresponding to the radiating unit
  • the first insulator further includes a dielectric support column connected to the insulating base plate, and the dielectric support column is connected to the
  • the guiding piece is correspondingly arranged, and the guiding piece is installed on the medium support column; the guiding piece is a PCB board or a metal sheet. In this way, the guide piece can improve the radiation performance.
  • the feeder power division network is formed on the insulating isolation plate using 3D-MID technology, or is formed on the insulating isolation plate by plating, or is formed on the insulating isolation plate by using the LDS process.
  • the calibration network is formed on the bottom wall of the insulating cavity using 3D-MID technology, or plated on the bottom wall of the insulating cavity, or formed on the insulating cavity using LDS technology
  • the radiation unit is formed on the insulating isolation plate using 3D-MID technology, or plating is formed on the insulating isolation plate, or the LDS process is used to form the insulating isolation plate.
  • the antenna module further includes a plurality of radiating units located between adjacent insulating isolation plates, the radiating units are radiating plates, and the first insulator further includes Connected dielectric support column, the dielectric support column is arranged corresponding to the radiating plate, the radiating plate is installed on the dielectric support column, the side wall of the dielectric support column is provided with a power feeding layer, the The radiating plate is connected to the feeding power division network through the feeding layer.
  • the first insulator further includes a boundary plate arranged around the circumference of the insulating bottom plate, and a metal layer is provided on the surface of the boundary plate; the metal layer is formed using 3D-MID technology On the boundary plate, or plated and formed on the boundary plate, or formed on the boundary plate by using an LDS process.
  • the metal reflector is provided with a boundary plate, and the boundary plate is arranged around the circumference of the insulating bottom plate.
  • the antenna module further includes a plurality of feeding probes
  • the metal reflector is provided with via holes corresponding to the feeding probes
  • the feeding probes are arranged at all In the via hole, the outer wall of the feeding probe and the inner wall of the via hole are filled with an insulating medium, and one end of the feeding probe penetrates the first insulator and is electrically connected to the feeding power dividing network. Connected, the other end of the feeding probe penetrates the second insulator and is electrically connected to the calibration network.
  • the outer side wall of the insulating cavity and the inner side wall of the insulating cavity are both provided with a metal layer, and the metal layer on the outer side wall of the insulating cavity is electrically connected to the metal reflector
  • the inner side wall of the insulating cavity is provided with a metal layer, and the metal layer on the inner side wall of the insulating cavity is electrically connected to the metal reflector through a metalized via.
  • the antenna module further includes a metal shielding cover, the insulating cavity is provided with an opening on the cavity wall facing away from the first insulator, and the metal shielding cover is provided at the opening. .
  • a large-scale array antenna includes one of the above-mentioned antenna modules.
  • the above-mentioned large-scale array antenna does not need to form the feeder power dividing network and the calibration network on two PCB boards separately as traditionally, and then use screws and other connectors to divide the PCB board of the feeder power dividing network and the PCB of the calibration network.
  • the three components of the metal reflector plate and the metal reflector are assembled, but the metal reflector, the first insulator and the second insulator are integrally molded, and then the feeder power distribution network is directly set on the insulating bottom plate, and the calibration
  • the network is directly arranged on the bottom wall of the insulating cavity, so that the weight of the antenna can be reduced, while the antenna structure is simplified, the antenna performance index is improved, and the assembly is simplified, which is conducive to automatic production.
  • FIG. 1 is a structural view of an antenna module according to an embodiment of the present invention
  • FIG. 2 is a structural diagram from another perspective of the antenna module according to an embodiment of the present invention.
  • FIG. 3 is a structural diagram of another view angle of the antenna module according to an embodiment of the present invention.
  • FIG. 4 is an exploded schematic diagram of the antenna module according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the structure separated from the guiding piece of the antenna module according to an embodiment of the present invention.
  • Figure 6 is a schematic diagram of the enlarged structure of Figure 5 at A;
  • FIG. 7 is a schematic structural diagram of the antenna module according to an embodiment of the present invention after the shielding cover plate is removed;
  • Fig. 8 is a schematic diagram of the enlarged structure at B of Fig. 7.
  • Metal reflector 20. First insulator; 21. Insulating bottom plate; 22. Insulating isolation plate; 23. Dielectric support column; 24. Boundary plate; 30. Second insulator; 31. Insulating cavity; 311. Metallization Via; 40. Feeding power distribution network; 50. Calibration network; 60. Radiation unit; 70. Guide piece; 80. Metal shield cover; 81. Mounting parts.
  • first and second are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include at least one of the features.
  • “plurality” means at least two, such as two, three, etc., unless otherwise specifically defined.
  • an antenna module includes a metal reflector 10, a first insulator 20, a second insulator 30, a power distribution network 40 and a calibration network 50.
  • the metal reflector 10 is embedded between the first insulator 20 and the second insulator 30, and the metal reflector 10, the first insulator 20, and the second insulator 30 are integrally molded. Plastic molding.
  • the first insulator 20 includes an insulating bottom plate 21 located on one of the side surfaces of the metal reflector 10, and the feeding power dividing network 40 is provided on the insulating bottom plate 21.
  • the second insulator 30 includes an insulating cavity 31 located on the other side of the metal reflector 10, and the calibration network 50 is provided on the bottom wall of the insulating cavity 31.
  • the feeder power dividing network 40 and the calibration network 50 it is not necessary to form the feeder power dividing network 40 and the calibration network 50 on two PCB boards separately as traditionally, and then use screws and other connectors to connect the PCB board of the feeder power dividing network 40 and the calibration network 50.
  • the PCB board and the metal reflector 10 are assembled together, but the metal reflector 10, the first insulator 20, and the second insulator 30 are integrally molded and molded, and then the feeder power division network 40 is directly set in On the insulating base plate 21 and the calibration network 50 directly on the bottom wall of the insulating cavity 31, the antenna can be lightened, the antenna structure can be simplified, the antenna performance index can be improved, and the assembly can be simplified, which is conducive to automatic production.
  • the above-mentioned metal reflector 10 can not only be used as a reflector, but also have the metal ground of the power distribution network 40 and the calibration network 50.
  • the first insulator 20 further includes a plurality of insulating isolation plates 22 arranged on the insulating bottom plate 21 at intervals.
  • the insulating isolation plate 22 is provided with a metal layer.
  • the 3D-MID technology is used to form a metal layer on the insulating isolation plate 22, or the metal layer is plated and formed on the insulating isolation plate 22, or the LDS (Laser-Direct-structuring, laser direct structuring technology) process is adopted.
  • a metal layer is formed on the insulating isolation plate 22.
  • the radiating unit 60 and the feeding network form an antenna sub-array.
  • the metal layer on the surface of the insulating isolation plate 22 is used for To isolate adjacent antenna sub-arrays. In this way, simple assembly, production automation, cost reduction, simple product structure, and lighter weight can be realized.
  • the antenna module further includes a plurality of radiation units 60 located between the adjacent insulating isolation plates 22.
  • the radiating unit 60 is a vibrator piece arranged on the insulating bottom plate 21, and the radiating unit 60 is electrically connected to the power supply division network 40.
  • the antenna module further includes a guide piece 70 corresponding to the radiation unit 60.
  • the guide piece 70 is a PCB board or a metal sheet.
  • the first insulator 20 further includes a dielectric support column 23 connected to the insulating bottom plate 21, and the dielectric support column 23 is arranged corresponding to the guide piece 70, and the guide piece 70 is installed on the dielectric support Column 23.
  • the guide piece 70 can improve the radiation performance.
  • the guiding piece 70 is provided with a clamping hole
  • the end of the media support column 23 is provided with a chuck that matches the clamping hole
  • the guiding piece 70 is detachably clamped on the media supporting column 23.
  • each guiding piece 70 may correspond to two, three, four or more medium supporting columns 23.
  • the feeder power division network 40 is formed on the insulating isolation plate 22 using 3D-MID technology, or is formed on the insulating isolation plate 22 by plating, or is formed on the insulating isolation plate 22 by using an LDS process.
  • the calibration network 50 is formed on the bottom wall of the insulating cavity 31 using 3D-MID technology, or is plated and formed on the bottom wall of the insulating cavity 31, or is formed using an LDS process
  • the radiation unit 60 is formed on the insulating isolation plate 22 using 3D-MID technology, or is formed on the insulating isolation plate 22 by plating, or is formed by using the LDS process On the insulating isolation plate 22.
  • the antenna module further includes a plurality of radiation units 60 located between the adjacent insulating isolation plates 22.
  • the radiation unit 60 is a radiation plate
  • the first insulator 20 further includes a dielectric support column 23 connected to the insulating bottom plate 21, the dielectric support column 23 is arranged corresponding to the radiation plate, and the radiation plate is installed On the dielectric supporting column 23, a power feeding layer is provided on the side wall of the dielectric supporting column 23, and the radiating plate is connected to the power feeding power dividing network 40 through the feeding layer.
  • the power feeding layer on the side wall of the dielectric support column 23 is formed on the outer wall of the dielectric support column 23 by 3D-MID technology, or is plated and formed on the outer wall of the dielectric support column 23, or The LDS process is used to form on the outer wall of the dielectric support column 23.
  • the weight of the antenna can be reduced, the antenna structure is simplified, the antenna performance index is improved, and the assembly is simplified, which is beneficial to the realization of automated production.
  • the first insulator 20 further includes a boundary plate 24 arranged around the circumference of the insulating bottom plate 21, and a metal layer is provided on the surface of the boundary plate 24 .
  • the metal layer on the boundary plate 24 is formed on the boundary plate 24 using 3D-MID technology, or is formed on the boundary plate 24 by plating, or is formed on the boundary plate 24 by using LDS technology. In this way, under the action of the boundary plate 24, the radiation pattern of the antenna can be optimized, and the performance index of the large-scale array antenna can be improved.
  • the metal reflector 10 is provided with a boundary plate, and the boundary plate is arranged around the circumference of the insulating bottom plate 21. In this way, under the action of the boundary plate, the radiation pattern of the antenna can be optimized, and the performance index of the large-scale array antenna can be improved.
  • the antenna module further includes a plurality of feeding probes
  • the metal reflector 10 is provided with via holes corresponding to the feeding probes
  • the feeding probes are arranged at the In the via hole, the outer wall of the feeding probe and the inner wall of the via hole are filled with an insulating medium, and one end of the feeding probe penetrates the first insulator 20 and connects to the feeding power dividing network 40. Electrically connected, the other end of the feeding probe penetrates the second insulator 30 and then is electrically connected to the calibration network 50.
  • the outer side wall of the insulating cavity 31 and the inner side wall of the insulating cavity 31 are both provided with a metal layer, and the metal of the outer side wall of the insulating cavity 31 The layer is electrically connected to the metal reflector 10.
  • the inner side wall of the insulating cavity 31 is provided with a metal layer, and the metal layer on the inner side wall of the insulating cavity 31 is electrically connected to the metal reflector 10 through a metalized via 311.
  • the metal layer on the sidewall of the insulating cavity 31 can also be formed, for example, by using 3D-MID technology, or formed by plating, or formed by using an LDS process.
  • the antenna module further includes a metal shielding cover 80.
  • An opening is provided on the cavity wall of the insulating cavity 31 facing away from the first insulator 20, and the metal shielding cover 80 is provided at the opening.
  • the metal shielding cover 80 is detachably installed on the insulating cavity 31 by using mounting members 81 such as screws, bolts, etc., for example.
  • a large-scale array antenna includes one or more of the antenna modules described in any of the foregoing embodiments.
  • the above-mentioned large-scale array antenna does not need to form the feeder power dividing network 40 and the calibration network 50 on two PCB boards separately as in the traditional way, and then use screws and other connectors to connect the PCB board and calibrate the feeder power dividing network 40
  • the PCB board of the network 50 and the metal reflector 10 are assembled and assembled, but the metal reflector 10, the first insulator 20 and the second insulator 30 are integrally molded and molded, and then the feeder power divider network 40 is directly It is arranged on the insulating base plate 21 and the calibration network 50 is directly arranged on the bottom wall of the insulating cavity 31, so that the antenna can be lightened, while the antenna structure is simplified, the antenna performance index is improved, and the assembly is simplified, which is beneficial to realize automated production.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Aerials With Secondary Devices (AREA)

Abstract

本发明涉及一种天线模块及大规模阵列天线，包括金属反射板、第一绝缘体、第二绝缘体、馈电功分网络及校准网络。金属反射板嵌设于第一绝缘体与第二绝缘体之间，金属反射板、第一绝缘体及第二绝缘体三者一体化模塑成型。第一绝缘体包括位于金属反射板的其中一侧面的绝缘底板，馈电功分网络设于绝缘底板上。第二绝缘体包括位于金属反射板的另一侧面的绝缘腔体，校准网络设于绝缘腔体的底壁上。将金属反射板、第一绝缘体及第二绝缘体三者一体化模塑成型，然后再将馈电功分网络直接设于绝缘底板上，以及将校准网络直接设于绝缘腔体的底壁上，从而能够实现天线轻量化，同时简化天线结构，提升天线性能指标，装配简化，有利于实现自动化生产。

Description

大规模阵列天线及天线模块 技术领域
本发明涉及通信装置技术领域，特别是涉及一种大规模阵列天线及天线模块。
背景技术
随着移动通信技术和应用的迅猛发展，关于第五代移动通信技术(外文缩写为5G)已进入试商用阶段。传统的5G天线，其天线模块通常包括金属底板、设于金属底板上的金属隔板以及馈电网络。其中，金属底板常采用金属压铸或钣金工艺成型，金属隔板常采用金属压铸、铝型材拉挤或钣金工艺成型，以满足基于5G大规模密集高频阵列的天线对布局空间多样的需求。然而在工程实践中，金属隔板一般通过螺钉或铆钉固定于金属底板上或者采用焊接/金属压铸工艺与金属底板固定连接，在5G高频段应用的背景下，采用螺钉固定的方式难以满足5G高频段天线对辐射边界缝隙的要求，5G天线的插损较高、互调隐患增多、一致性较差以及过多采用金属材料带来天线零件多、重量重、装配复杂等问题。此外，馈电网络多采用集成于PCB板上，将PCB板通过螺钉或铆钉固定连接于金属底板上。辐射单元通常采用金属压铸、钣金或PCB振子，辐射单元与馈电网络之间通常直接焊接或通过同轴电缆焊接连接，不仅装配复杂，生产成本较高，还会具有较多焊点，同样难以满足低插损、低互调和高一致性的指标要求。
发明内容
基于此，有必要克服现有技术的缺陷，提供一种大规模阵列天线及天线模 块，它能够实现天线轻量化，同时简化天线结构，提升天线性能指标。
其技术方案如下：一种天线模块，包括：金属反射板、第一绝缘体、第二绝缘体，所述金属反射板嵌设于所述第一绝缘体与所述第二绝缘体之间，所述金属反射板、所述第一绝缘体及所述第二绝缘体三者一体化模塑成型；馈电功分网络，所述第一绝缘体包括位于所述金属反射板的其中一侧面的绝缘底板，所述馈电功分网络设于所述绝缘底板上；校准网络，所述第二绝缘体包括位于所述金属反射板的另一侧面的绝缘腔体，所述校准网络设于所述绝缘腔体的底壁上。
上述的天线模块，由于无需如传统地将馈电功分网络与校准网络分别形成于两个PCB板上，然后采用螺钉等连接件将馈电功分网络的PCB板、校准网络的PCB板及金属反射板三者拼装组合，而是将金属反射板、第一绝缘体及第二绝缘体三者一体化模塑成型，然后再将馈电功分网络直接设于绝缘底板上，以及将校准网络直接设于绝缘腔体的底壁上，从而能够实现天线轻量化，同时简化天线结构，提升天线性能指标，装配简化，有利于实现自动化生产。
在其中一个实施例中，所述第一绝缘体还包括间隔地设置于所述绝缘底板上的多个绝缘隔离板，所述绝缘隔离板上设有金属层。
在其中一个实施例中，所述的天线模块还包括位于相邻所述绝缘隔离板之间的若干个辐射单元，所述辐射单元为设于所述绝缘底板上的振子片，所述辐射单元与所述馈电功分网络电性连接。
在其中一个实施例中，所述的天线模块还包括与所述辐射单元对应设置的引向片，所述第一绝缘体还包括与所述绝缘底板相连的介质支撑柱，所述介质支撑柱与所述引向片对应设置，所述引向片装设于所述介质支撑柱上；所述引向片为PCB板或金属片。如此，引向片能够提高辐射性能。
在其中一个实施例中，所述馈电功分网络采用3D-MID技术形成于所述绝缘隔离板上，或者镀设形成于所述绝缘隔离板上，或者采用LDS工艺形成于所述绝缘隔离板上；所述校准网络采用3D-MID技术形成于所述绝缘腔体的底壁上，或者镀设形成于所述绝缘腔体的底壁上，或者采用LDS工艺形成于所述绝缘腔体的底壁上；所述辐射单元采用3D-MID技术形成于所述绝缘隔离板上，或者镀设形成于所述绝缘隔离板上，或者采用LDS工艺形成于所述绝缘隔离板上。
在其中一个实施例中，所述的天线模块还包括位于相邻所述绝缘隔离板之间的若干个辐射单元，所述辐射单元为辐射板，所述第一绝缘体还包括与所述绝缘底板相连的介质支撑柱，所述介质支撑柱与所述辐射板对应设置，所述辐射板装设于所述介质支撑柱上，所述介质支撑柱的侧壁上设有馈电层，所述辐射板通过所述馈电层与所述馈电功分网络相连。
在其中一个实施例中，所述第一绝缘体还包括绕所述绝缘底板的周向设置的边界板，所述边界板的板面上设有金属层；所述金属层采用3D-MID技术形成于所述边界板上，或者镀设形成于所述边界板上，或者采用LDS工艺形成于所述边界板上。
在其中一个实施例中，所述金属反射板设有边界板，所述边界板绕所述绝缘底板的周向设置。
在其中一个实施例中，所述的天线模块还包括若干个馈电探针，所述金属反射板设有与所述馈电探针相应设置的过孔，所述馈电探针设置于所述过孔中，所述馈电探针的外壁与所述过孔的内壁填充有绝缘介质，所述馈电探针的一端贯穿所述第一绝缘体后与所述馈电功分网络电性连接，所述馈电探针的另一端贯穿所述第二绝缘体后与所述校准网络电性连接。
在其中一个实施例中，所述绝缘腔体的外侧壁与所述绝缘腔体的内侧壁均 设有金属层，所述绝缘腔体的外侧壁的金属层与所述金属反射板电性连接；或者，所述绝缘腔体的内侧壁设有金属层，所述绝缘腔体的内侧壁的金属层通过金属化过孔与所述金属反射板电性连接。
在其中一个实施例中，所述的天线模块还包括金属屏蔽盖，所述绝缘腔体背向所述第一绝缘体的腔壁上设有开口，所述金属屏蔽盖盖设于所述开口处。
一种大规模阵列天线，包括一个以上所述的天线模块。
上述的大规模阵列天线，由于无需如传统地将馈电功分网络与校准网络分别形成于两个PCB板上，然后采用螺钉等连接件将馈电功分网络的PCB板、校准网络的PCB板及金属反射板三者拼装组合，而是将金属反射板、第一绝缘体及第二绝缘体三者一体化模塑成型，然后再将馈电功分网络直接设于绝缘底板上，以及将校准网络直接设于绝缘腔体的底壁上，从而能够实现天线轻量化，同时简化天线结构，提升天线性能指标，装配简化，有利于实现自动化生产。
附图说明
图1为本发明一实施例所述的天线模块的其中一视角结构图；
图2为本发明一实施例所述的天线模块的另一视角结构图；
图3为本发明一实施例所述的天线模块的又一视角结构图；
图4为本发明一实施例所述的天线模块的分解示意图；
图5为本发明一实施例所述的天线模块的引向片分离出的结构示意图；
图6为图5在A处的放大结构示意图；
图7为本发明一实施例所述的天线模块的屏蔽盖板去掉后的结构示意图；
图8为图7在B处的放大结构示意图。
附图标记：
10、金属反射板；20、第一绝缘体；21、绝缘底板；22、绝缘隔离板；23、介质支撑柱；24、边界板；30、第二绝缘体；31、绝缘腔体；311、金属化过孔；40、馈电功分网络；50、校准网络；60、辐射单元；70、引向片；80、金属屏蔽盖；81、安装件。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施例的限制。
在本发明的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明的描述中，需要理解的是，当一个元件被认为是“连接”另一个元件，可以是直接连接到另一个元件或者可能同时存在中间元件。相反，当元件为称作“直接”与另一元件连接时，不存在中间元件。
在一个实施例中，请参阅图1至图6，一种天线模块，包括金属反射板10、第一绝缘体20、第二绝缘体30、馈电功分网络40及校准网络50。所述金属反射板10嵌设于所述第一绝缘体20与所述第二绝缘体30之间，所述金属反射板10、所述第一绝缘体20及所述第二绝缘体30三者一体化模塑成型。所述第一 绝缘体20包括位于所述金属反射板10的其中一侧面的绝缘底板21，所述馈电功分网络40设于所述绝缘底板21上。所述第二绝缘体30包括位于所述金属反射板10的另一侧面的绝缘腔体31，所述校准网络50设于所述绝缘腔体31的底壁上。
上述的天线模块，由于无需如传统地将馈电功分网络40与校准网络50分别形成于两个PCB板上，然后采用螺钉等连接件将馈电功分网络40的PCB板、校准网络50的PCB板及金属反射板10三者拼装组合，而是将金属反射板10、第一绝缘体20及第二绝缘体30三者一体化模塑成型，然后再将馈电功分网络40直接设于绝缘底板21上，以及将校准网络50直接设于绝缘腔体31的底壁上，从而能够实现天线轻量化，同时简化天线结构，提升天线性能指标，装配简化，有利于实现自动化生产。
可以理解的是，上述的金属反射板10不仅可以作为反射板，还兼具馈电功分网络40和校准网络50的金属地层。
进一步地，请参阅图1、图2、图4及图6，所述第一绝缘体20还包括间隔地设置于所述绝缘底板21上的多个绝缘隔离板22。所述绝缘隔离板22上设有金属层。具体而言，采用3D-MID技术将金属层形成于绝缘隔离板22上，或者将金属层镀设形成于绝缘隔离板22上，或者采用LDS(Laser-Direct-structuring，激光直接成型技术)工艺将金属层形成于绝缘隔离板22上。相邻两个绝缘隔离板22之间有一个以上辐射单元60与连接辐射单元60的馈电网络，辐射单元60与馈电网络组成一个天线子阵，绝缘隔离板22的表面上的金属层用于对相邻的天线子阵起到隔离作用。如此，能实现装配简单，生产自动化，成本降低，产品结构简单，重量较轻。
在一个实施例中，请参阅图5及图6，所述的天线模块还包括位于相邻所述 绝缘隔离板22之间的若干个辐射单元60。所述辐射单元60为设于所述绝缘底板21上的振子片，所述辐射单元60与所述馈电功分网络40电性连接。
进一步地，请参阅图5及图6，所述的天线模块还包括与所述辐射单元60对应设置的引向片70，具体而言，所述引向片70为PCB板或金属片。所述第一绝缘体20还包括与所述绝缘底板21相连的介质支撑柱23，所述介质支撑柱23与所述引向片70对应设置，所述引向片70装设于所述介质支撑柱23上。如此，引向片70能够提高辐射性能。具体而言，引向片70上设有卡孔，介质支撑柱23的端部设有与卡孔相配合的卡头，引向片70可拆卸地卡设于介质支撑柱23上。其中，为了较为稳定地将引向片70装设于介质支撑柱23上，每个引向片70可以对应有两个、三个、四个或以上的介质支撑柱23。
在一个实施例中，所述馈电功分网络40采用3D-MID技术形成于所述绝缘隔离板22上，或者镀设形成于所述绝缘隔离板22上，或者采用LDS工艺形成于所述绝缘隔离板22上；所述校准网络50采用3D-MID技术形成于所述绝缘腔体31的底壁上，或者镀设形成于所述绝缘腔体31的底壁上，或者采用LDS工艺形成于所述绝缘腔体31的底壁上；所述辐射单元60采用3D-MID技术形成于所述绝缘隔离板22上，或者镀设形成于所述绝缘隔离板22上，或者采用LDS工艺形成于所述绝缘隔离板22上。如此，能够实现天线轻量化，同时简化天线结构，提升天线性能指标，装配简化，有利于实现自动化生产。
在另一个实施例中，所述的天线模块还包括位于相邻所述绝缘隔离板22之间的若干个辐射单元60。所述辐射单元60为辐射板，所述第一绝缘体20还包括与所述绝缘底板21相连的介质支撑柱23，所述介质支撑柱23与所述辐射板对应设置，所述辐射板装设于所述介质支撑柱23上，所述介质支撑柱23的侧壁上设有馈电层，所述辐射板通过所述馈电层与所述馈电功分网络40相连。具 体而言，介质支撑柱23的侧壁上的馈电层为通过3D-MID技术形成于所述介质支撑柱23的外壁上，或者镀设形成于所述介质支撑柱23的外壁上，或者采用LDS工艺形成于所述介质支撑柱23的外壁上。如此，能够实现天线轻量化，同时简化天线结构，提升天线性能指标，装配简化，有利于实现自动化生产。
在一个实施例中，请参阅图5及图6，所述第一绝缘体20还包括绕所述绝缘底板21的周向设置的边界板24，所述边界板24的板面上设有金属层。边界板24上的金属层采用3D-MID技术形成于所述边界板24上，或者镀设形成于所述边界板24上，或者采用LDS艺形成于所述边界板24上。如此，在边界板24的作用下，能优化天线的辐射方向图，提升大规模阵列天线的性能指标。
在另一个实施例中，所述金属反射板10设有边界板，所述边界板绕所述绝缘底板21的周向设置。如此，在边界板的作用下，能优化天线的辐射方向图，提升大规模阵列天线的性能指标。
在一个实施例中，所述的天线模块还包括若干个馈电探针，所述金属反射板10设有与所述馈电探针相应设置的过孔，所述馈电探针设置于所述过孔中，所述馈电探针的外壁与所述过孔的内壁填充有绝缘介质，所述馈电探针的一端贯穿所述第一绝缘体20后与所述馈电功分网络40电性连接，所述馈电探针的另一端贯穿所述第二绝缘体30后与所述校准网络50电性连接。
在一个实施例中，请参阅图7与图8，所述绝缘腔体31的外侧壁与所述绝缘腔体31的内侧壁均设有金属层，所述绝缘腔体31的外侧壁的金属层与所述金属反射板10电性连接。或者，所述绝缘腔体31的内侧壁设有金属层，所述绝缘腔体31的内侧壁的金属层通过金属化过孔311与所述金属反射板10电性连接。具体而言，金属化过孔311可以是多个，多个金属化过孔311沿着绝缘腔体31的侧壁间隔布置。如此，能起到较好的屏蔽作用，避免绝缘腔体31内 的校准网络50的电磁泄露。同样地，绝缘腔体31的侧壁上的金属层也可以例如采用3D-MID技术形成，或者镀设形成，或者采用LDS工艺形成。
进一步地，请参阅4、图6及图8，所述的天线模块还包括金属屏蔽盖80。所述绝缘腔体31背向所述第一绝缘体20的腔壁上设有开口，所述金属屏蔽盖80盖设于所述开口处。如此，能起到较好的屏蔽作用，避免绝缘腔体31内的校准网络50的电磁泄露。具体而言，金属屏蔽盖80例如采用螺钉、螺栓等安装件81可拆卸地装设于绝缘腔体31上。
在一个实施例中，一种大规模阵列天线，包括一个以上上述任一实施例所述的天线模块。
上述的大规模阵列天线，由于无需如传统地将馈电功分网络40与校准网络50分别形成于两个PCB板上，然后采用螺钉等连接件将馈电功分网络40的PCB板、校准网络50的PCB板及金属反射板10三者拼装组合，而是将金属反射板10、第一绝缘体20及第二绝缘体30三者一体化模塑成型，然后再将馈电功分网络40直接设于绝缘底板21上，以及将校准网络50直接设于绝缘腔体31的底壁上，从而能够实现天线轻量化，同时简化天线结构，提升天线性能指标，装配简化，有利于实现自动化生产。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权 利要求为准。

Claims (12)

  1. 一种天线模块，其特征在于，包括：
    金属反射板、第一绝缘体、第二绝缘体，所述金属反射板嵌设于所述第一绝缘体与所述第二绝缘体之间，所述金属反射板、所述第一绝缘体及所述第二绝缘体三者一体化模塑成型；
    馈电功分网络，所述第一绝缘体包括位于所述金属反射板的其中一侧面的绝缘底板，所述馈电功分网络设于所述绝缘底板上；
    校准网络，所述第二绝缘体包括位于所述金属反射板的另一侧面的绝缘腔体，所述校准网络设于所述绝缘腔体的底壁上。
  2. 根据权利要求1所述的天线模块，其特征在于，所述第一绝缘体还包括间隔地设置于所述绝缘底板上的多个绝缘隔离板，所述绝缘隔离板上设有金属层。
  3. 根据权利要求2所述的天线模块，其特征在于，还包括位于相邻所述绝缘隔离板之间的若干个辐射单元，所述辐射单元为设于所述绝缘底板上的振子片，所述辐射单元与所述馈电功分网络电性连接。
  4. 根据权利要求3所述的天线模块，其特征在于，还包括与所述辐射单元对应设置的引向片，所述第一绝缘体还包括与所述绝缘底板相连的介质支撑柱，所述介质支撑柱与所述引向片对应设置，所述引向片装设于所述介质支撑柱上；所述引向片为PCB板或金属片。
  5. 根据权利要求3所述的天线模块，其特征在于，所述馈电功分网络采用3D-MID技术形成于所述绝缘隔离板上，或者镀设形成于所述绝缘隔离板上，或者采用LDS工艺形成于所述绝缘隔离板上；所述校准网络采用3D-MID技术形成于所述绝缘腔体的底壁上，或者镀设形成于所述绝缘腔体的底壁上，或者采用 LDS工艺形成于所述绝缘腔体的底壁上；所述辐射单元采用3D-MID技术形成于所述绝缘隔离板上，或者镀设形成于所述绝缘隔离板上，或者采用LDS工艺形成于所述绝缘隔离板上。
  6. 根据权利要求2所述的天线模块，其特征在于，还包括位于相邻所述绝缘隔离板之间的若干个辐射单元，所述辐射单元为辐射板，所述第一绝缘体还包括与所述绝缘底板相连的介质支撑柱，所述介质支撑柱与所述辐射板对应设置，所述辐射板装设于所述介质支撑柱上，所述介质支撑柱的侧壁上设有馈电层，所述辐射板通过所述馈电层与所述馈电功分网络相连。
  7. 根据权利要求1所述的天线模块，其特征在于，所述第一绝缘体还包括绕所述绝缘底板的周向设置的边界板，所述边界板的板面上设有金属层；所述金属层采用3D-MID技术形成于所述边界板上，或者镀设形成于所述边界板上，或者采用LDS工艺形成于所述边界板上。
  8. 根据权利要求1所述的天线模块，其特征在于，所述金属反射板设有边界板，所述边界板绕所述绝缘底板的周向设置。
  9. 根据权利要求1所述的天线模块，其特征在于，还包括若干个馈电探针，所述金属反射板设有与所述馈电探针相应设置的过孔，所述馈电探针设置于所述过孔中，所述馈电探针的外壁与所述过孔的内壁填充有绝缘介质，所述馈电探针的一端贯穿所述第一绝缘体后与所述馈电功分网络电性连接，所述馈电探针的另一端贯穿所述第二绝缘体后与所述校准网络电性连接。
  10. 根据权利要求1所述的天线模块，其特征在于，所述绝缘腔体的外侧壁与所述绝缘腔体的内侧壁均设有金属层，所述绝缘腔体的外侧壁的金属层与所述金属反射板电性连接；或者，所述绝缘腔体的内侧壁设有金属层，所述绝缘腔体的内侧壁的金属层通过金属化过孔与所述金属反射板电性连接。
  11. 根据权利要求10所述的天线模块，其特征在于，还包括金属屏蔽盖，所述绝缘腔体背向所述第一绝缘体的腔壁上设有开口，所述金属屏蔽盖盖设于所述开口处。
  12. 一种大规模阵列天线，其特征在于，包括一个以上如权利要求1至11任意一项所述的天线模块。
PCT/CN2020/110586 2019-12-31 2020-08-21 大规模阵列天线及天线模块 WO2021135274A1 (zh)

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