WO2021135239A1 - 一种散热装置、电路板组件及电子设备 - Google Patents

一种散热装置、电路板组件及电子设备 Download PDF

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Publication number
WO2021135239A1
WO2021135239A1 PCT/CN2020/108348 CN2020108348W WO2021135239A1 WO 2021135239 A1 WO2021135239 A1 WO 2021135239A1 CN 2020108348 W CN2020108348 W CN 2020108348W WO 2021135239 A1 WO2021135239 A1 WO 2021135239A1
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WO
WIPO (PCT)
Prior art keywords
heat
circuit board
conductor
substrate
heat dissipation
Prior art date
Application number
PCT/CN2020/108348
Other languages
English (en)
French (fr)
Inventor
韦隆和
陈君
廉志晟
李泉明
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP20909331.9A priority Critical patent/EP4081006A4/en
Publication of WO2021135239A1 publication Critical patent/WO2021135239A1/zh
Priority to US17/854,210 priority patent/US20220338369A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Definitions

  • This application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, circuit board assembly and electronic equipment.
  • DPU Distributed Processing Unit
  • the components to be dissipated in the distributed power unit generally dissipate heat through the radiator.
  • a plurality of components to be dissipated 85 are mounted on the circuit board 81, and the upper part of the component to be dissipated 85 is attached with a heat sink 82 through an interface material.
  • Some smaller components to be dissipated 83 cannot be sized due to their small size. Attach the heat sink 82 directly.
  • the heat of the component to be radiated 85 is directly dissipated to the external environment through the radiator 82; the heat of the smaller component to be radiated 83 is first dissipated into the air, and then the heat is transferred to the radiator 82 by the air, and finally The heat is radiated to the external environment by the radiator 82.
  • the embodiments of the present application provide a heat dissipation device, a circuit board assembly, and an electronic device, and the heat dissipation device has high heat dissipation efficiency.
  • the first aspect of the embodiments of the present application provides a heat dissipation device, which is suitable for a circuit board.
  • the circuit board is provided with a plurality of heating elements.
  • the heat dissipation device includes a substrate.
  • the substrate is provided with at least one heat conductor on the side facing the circuit board. The substrates are connected, and the other end extends toward the circuit board and is close to the heating element.
  • At least one thermal conductor is provided on the side of the substrate facing the circuit board, one end of the thermal conductor is connected to the substrate, and the other end of the thermal conductor extends toward the circuit board and is close to the heating element.
  • Each heating element for example, is relatively far away from the substrate. The heat of the element can be quickly transferred to the substrate through the thermal conductor with low thermal resistance, and then radiated from the substrate to the external environment, effectively reducing the heat transfer resistance of the heating element to the substrate, and improving the heat dissipation efficiency of the heat sink.
  • one end of the at least one heat conductor extends between the adjacent high temperature element and the low temperature element in the heating element, and the high temperature element and the low temperature element are separated by the heat conductor.
  • Separating the high-temperature components from the low-temperature components by the heat conductor can realize temperature division, ensure the low-temperature application environment of the low-temperature components, and prevent the over-temperature situation caused by the baking of the low-temperature components by the high-temperature components.
  • a heat-insulating layer is provided on the heat conductor between the high-temperature element and the low-temperature element, and the heat-insulating layer faces the low-temperature element.
  • An insulation layer is provided on the side of the low-temperature component of the heat conductor, so that the heat radiated by the high-temperature component to the low-temperature component can be blocked by the insulation layer, which improves the temperature insulation effect of the heat conductor.
  • the heat conductor is a ring-shaped heat conductor, and the ring-shaped heat conductor is arranged on the outside of the high temperature element adjacent to the low temperature element, or multiple spaces are arranged on the outside of the high temperature element adjacent to the low temperature element Arranged thermal conductors.
  • a temperature barrier By enclosing the heat conductor on the outside of the high temperature component, a temperature barrier can be formed around the high temperature component.
  • the heat of the high temperature component can be more easily transferred to the substrate through the heat conductor, and on the other hand, the heat of the high temperature component can be better prevented Radiation to the surrounding low-temperature components.
  • the distance between the end of the heat conductor close to the circuit board and the circuit board is smaller than the minimum distance between the end of the heating element facing the substrate and the circuit board.
  • the bottom end of the heat conductor is lower than the top end of the heating element.
  • the heat conductor is extended to overlap with the heating element in the height direction, so that the parts on the heating element can be closer to the heat conductor, and more It is easy to transfer the heat of the heating element to the heat conductor.
  • it further includes a thermally conductive encapsulant, the thermally conductive encapsulant is arranged at least on the side of the substrate facing the circuit board, the heat conductor is located inside the thermally conductive encapsulant, and at least part of the heating element extends into the thermally conductive encapsulant.
  • the thermal conductive glue By setting the thermal conductive glue with low thermal resistance on the substrate, the thermal resistance from the heating element to the substrate can be reduced, and the heat dissipation efficiency of the heat sink can be improved.
  • the thermal conductive glue has no special requirements on the size and shape of the heating element. Strong compatibility and wide application range.
  • the thermal conductivity of the thermal conductor is greater than the thermal conductivity of the thermally conductive potting.
  • thermal conductivity of the thermal conductor is greater than the thermal conductivity of the thermally conductive potting, a heat dissipation channel with low thermal resistance is formed on or near the heating element and the substrate, which is more conducive to rapid heat transfer.
  • the thermal conductivity of the heating element In the process of heat transfer to the substrate, the heat actually tends to be transferred to the substrate through a thermal conductor with a larger thermal conductivity.
  • thermal conductive glue can fill the space between the circuit board and the substrate. After connecting the circuit board and the heat sink, it has a higher mechanical strength.
  • the extension direction of the heat conductor is perpendicular to the circuit board.
  • the heat conduction channel formed by the heat conductor can be perpendicular to the circuit board, so that the transmission path of heat conduction is the shortest, and the heat dissipation efficiency of the heat dissipation device is improved.
  • the heat conductor is at least one of a heat conductive sheet, a heat conduction plate, a heat conduction column, a heat conduction root system, and a heat conduction wire made of a high heat conduction material.
  • the heat conductor can be arranged between the heating elements without affecting the normal operation of the heating elements.
  • the heat conducting wire is a flexible heat conducting wire; or there are at least two heat conducting bodies and at least two heat conducting bodies are arranged crosswise; or, the heat conducting wire is a flexible heat conducting wire, and there are at least two heat conducting bodies, At least two heat conductors are arranged crosswise.
  • Multiple heat conductors can be arranged crosswise to meet the spatial arrangement requirements of different heating elements.
  • the cross-sectional shape of the heat conductor is square, circular or elliptical.
  • the cross-sectional shape of the heat conductor can be flexibly selected according to the space and spacing between different heating elements.
  • the thermal conductor and the substrate are connected to each other through a thermally conductive interface material; or, the thermal conductor and the substrate are integrally formed.
  • the thermal conductor and the substrate are formed separately, the thermal conductor and the substrate are connected by the thermal interface material bonding, which can avoid the decrease of heat transfer efficiency caused by the gap between the thermal conductor and the substrate, or to avoid the thermal conductor and the substrate.
  • the heat transfer efficiency between the substrates is affected, and the heat conductor and the substrate can be formed integrally.
  • At least one heat conductor is in contact with the side or end surface of the heating element.
  • the heat conductor is in direct contact with the heating element, so that the heat transfer efficiency between the two is higher.
  • This arrangement makes the heating element easy to process.
  • an insulating layer is provided on the surface of the heat conductor.
  • This arrangement can prevent a short circuit after the heat conductor contacts the heating element and the traces on the circuit board.
  • a plurality of heat dissipation fins are provided on the side of the substrate facing away from the heat conductor.
  • it further includes a side plate.
  • the side plate and the base plate enclose a cover, and the cover is arranged on the heating element on the circuit board.
  • a second aspect of the present application provides a heat dissipation device, including a substrate, one side of the substrate is provided with at least one thermal conductor, one end of the thermal conductor is connected to the substrate, and the other end of the thermal conductor extends in a direction away from the substrate.
  • At least one heat conductor is provided on one side of the substrate, and the other end of the heat conductor extends in the direction away from the substrate. Therefore, when the heat sink is applied to the heat dissipation of the circuit board, the heat conductor is directed toward the heating element provided on the circuit board.
  • Each heating element for example, the heat of the heating element relatively far away from the substrate, can be quickly transferred to the substrate through a heat conductor with low thermal resistance, and then radiated from the substrate to the external environment, effectively reducing the heating element
  • the heat transfer resistance to the substrate improves the heat dissipation efficiency of the heat sink.
  • a thermal insulation layer is provided on the heat conductor.
  • An insulation layer is provided on the heat conductor, so that when the heat sink is applied to the circuit board to dissipate the heat of the heating element, the heat radiated by the heating element to the surroundings can be blocked by the heat insulation layer, which improves the temperature insulation effect of the heat conductor.
  • the heat conductor is an annular heat conductor, or there are multiple heat conductors, and the plurality of heat conductors are arranged at intervals and surround a ring structure.
  • a temperature insulation barrier By enclosing the ring-shaped heat conductor on the outside of part of the heating element, a temperature insulation barrier can be formed around the heating element.
  • the heat of the heating element can be more easily transferred to the substrate through the heat conductor, and on the other hand, it can be better prevented.
  • the heat of the heating element is radiated to the surrounding heating elements.
  • it further includes a thermally conductive potting, the thermally conductive potting is arranged on the substrate, and the heat conductor is located inside the thermally conductive potting.
  • thermal potting has no special requirements on the size and shape of the heating element, with strong compatibility and a wide range of applications.
  • the thermal conductivity of the thermal conductor is greater than the thermal conductivity of the thermally conductive potting.
  • the thermal conductivity of the heat conductor is greater than the thermal conductivity of the thermally conductive glue, when the heat sink is applied to the circuit board to dissipate heat to the heating element, a heat dissipation channel with low thermal resistance is formed on or near the heating element and the substrate , It is more conducive to rapid heat transfer. In other words, in the process of heat transfer from the heating element to the substrate, the heat actually tends to be transferred to the substrate through a heat conductor with a larger thermal conductivity.
  • the extension direction of the heat conductor is perpendicular to the substrate.
  • the heat conduction channel formed by the heat conductor can be perpendicular to the circuit board, so that the transmission path of heat conduction is the shortest, and the heat dissipation efficiency of the heat dissipation device is improved.
  • the heat conductor is at least one of a heat conducting sheet, a heat dissipation plate, a heat dissipation pillar, a heat conduction root system, and a heat dissipation wire made of a high heat conductivity material.
  • the heat conductor can be arranged between the heating elements without affecting the normal operation of the heating elements.
  • the heat conducting wire is a flexible heat conducting wire; or there are at least two heat conducting bodies and at least two heat conducting bodies are arranged crosswise; or, the heat conducting wire is a flexible heat conducting wire, and there are at least two heat conducting bodies, At least two heat conductors are arranged crosswise.
  • Multiple heat conductors can be arranged crosswise to meet the spatial arrangement requirements of different heating elements.
  • the cross-sectional shape of the heat conductor is square, circular or elliptical.
  • the cross-sectional shape of the heat conductor can be flexibly selected according to the space and spacing between different heating elements.
  • the thermal conductor and the substrate are connected to each other through a thermally conductive interface material; or, the thermal conductor and the substrate are integrally formed.
  • the thermal conductor and the substrate are formed separately, the thermal conductor and the substrate are connected by the thermal interface material bonding, which can avoid the decrease of heat transfer efficiency caused by the gap between the thermal conductor and the substrate, or to avoid the thermal conductor and the substrate.
  • the heat transfer efficiency between the substrates is affected, and the heat conductor and the substrate can be formed integrally.
  • This arrangement makes the heating element easy to process.
  • an insulating layer is provided on the surface of the heat conductor.
  • This arrangement can prevent a short circuit after the heat conductor contacts the heating element and the traces on the circuit board.
  • a plurality of heat dissipation fins are provided on the side of the substrate facing away from the heat conductor.
  • it further includes a side plate, and the side plate and the base plate enclose a cover.
  • a third aspect of the embodiments of the present application provides a circuit board assembly, which includes a circuit board provided with a plurality of heating elements and the above-mentioned heat dissipation device, and the heat dissipation device is arranged on the side of the circuit board with the heating elements.
  • the heat of each heating element for example, the heating element relatively far away from the substrate, can be quickly transferred to the substrate through a heat conductor with a small thermal resistance, and then radiated from the substrate to the external environment, effectively reducing the heating element’s heat to the external environment.
  • the heat transfer resistance of the substrate improves the heat dissipation efficiency of the components in the circuit board assembly.
  • one end of the at least one heat conductor extends between the adjacent high temperature element and the low temperature element in the heating element, and the high temperature element and the low temperature element are separated by the heat conductor.
  • Separating the high-temperature components from the low-temperature components by the heat conductor can realize temperature division, ensure the low-temperature application environment of the low-temperature components, and prevent the over-temperature situation caused by the baking of the low-temperature components by the high-temperature components.
  • the circuit board is a double-sided board, and both the front and the back of the circuit board are provided with heat dissipation devices.
  • the circuit board when the circuit board is a double-sided board and has heating elements on both sides, the circuit board can be dissipated.
  • a fourth aspect of the embodiments of the present application provides an electronic device, including a housing and the above-mentioned circuit board assembly, and the circuit board assembly is disposed inside the housing.
  • the heat of each heating element in the electronic device can be quickly transferred to the substrate through a heat conductor with lower thermal resistance, and then radiated from the substrate to the external environment, effectively reducing
  • the heat transfer resistance from the heating element to the substrate improves the heat dissipation efficiency of the components in the electronic equipment.
  • FIG. 1 is a schematic diagram of the structure of a heat sink in the prior art
  • FIG. 2 is a schematic cross-sectional structure diagram of the heat dissipation device provided in Embodiment 1 of the application;
  • FIG. 3 is a schematic cross-sectional structure diagram of another structure of the heat dissipation device according to Embodiment 1 of the present application;
  • FIG. 3a is a schematic cross-sectional structure diagram of another structure of the heat dissipation device according to Embodiment 1 of the present application;
  • FIG. 3b is a schematic cross-sectional structure diagram of another structure of the heat dissipation device according to Embodiment 1 of the application;
  • FIG. 3b is a schematic cross-sectional structure diagram of another structure of the heat dissipation device according to Embodiment 1 of the application;
  • 3c is a schematic cross-sectional structure diagram of another structure of the heat dissipation device according to Embodiment 1 of the present application;
  • 3d is a schematic cross-sectional structure diagram of another structure of the heat dissipation device according to Embodiment 1 of the present application;
  • 3e is a schematic cross-sectional structure diagram of another structure of the heat dissipation device according to Embodiment 1 of the application;
  • FIG. 4 is a cross-sectional view of still another structure of the heat dissipation device according to Embodiment 1 of the application;
  • FIG. 5 is a cross-sectional view of still another structure of the heat dissipation device according to Embodiment 1 of the application;
  • FIG. 6 is a schematic cross-sectional structure diagram of still another structure of the heat dissipation device according to Embodiment 1 of the present application;
  • FIG. 7 is a cross-sectional view of the heat dissipation device of FIG. 6;
  • FIG. 8 is a schematic cross-sectional structure diagram of still another structure of the heat dissipation device according to Embodiment 1 of the present application.
  • FIG. 9 is a schematic cross-sectional structure diagram of still another structure of the heat dissipation device according to Embodiment 1 of the application;
  • FIG. 10 is a schematic cross-sectional structure diagram of still another structure of the heat dissipation device according to Embodiment 1 of the application;
  • FIG. 11 is a schematic cross-sectional structure diagram of still another structure of the heat dissipation device according to Embodiment 1 of the application;
  • FIG. 12 is a schematic cross-sectional structure diagram of still another structure of the heat dissipation device according to Embodiment 1 of the application;
  • FIG. 13 is a schematic cross-sectional view of the circuit board assembly provided in the second embodiment of the application.
  • FIG. 14 is a schematic cross-sectional view of another structure of the circuit board assembly provided in the second embodiment of the application.
  • 15 is a schematic cross-sectional view of another structure of the circuit board assembly provided in the second embodiment of the application.
  • FIG. 16 is a schematic structural diagram of an electronic device provided in Embodiment 3 of this application.
  • the heat dissipation device 100 provided by the embodiment of the present application is suitable for a circuit board 10, and a plurality of heating elements 20 may be provided on the circuit board 10.
  • the circuit boards are classified according to the number of layers, which can be divided into single-panel, double-panel, and multi-panel.
  • the circuit board 10 is a single-panel as an example. The situation is similar to this, and will not be repeated in this embodiment.
  • the heating element 20 refers to the electronic components arranged on the circuit board, such as output inductors, capacitors, etc.
  • the heating elements on the circuit board 10 have different sizes and specifications according to different types. In this embodiment, heat is used
  • the element 20 includes a heating element 21 with a larger size (for example, relatively close to the substrate) and a heating element 22 with a smaller size (for example, relatively far from the substrate) as examples for illustration. 2, the heating element 21 and the heating element 22 will continuously generate heat during normal operation.
  • the heat sink 100 is used in this embodiment to dissipate the heating element 21 and the heating element 22.
  • the heat dissipating device 100 may include a substrate 30, and the substrate 30 is disposed opposite to the side of the circuit board 10 where the heating element 20 is provided; and, in order to quickly transfer the heat on the heating element 20 to the substrate 30
  • One or more thermal conductors 50 may be provided on the side of the substrate 30 facing the circuit board 10.
  • the thermal conductor 50 extends toward the circuit board 10 and is close to the heating element 20.
  • one end of the thermal conductor 50 is connected to the substrate 30, and the other end faces the circuit.
  • the board 10 extends and is close to the heating element 20.
  • the heat conductor 50 with lower thermal resistance is arranged near the heating element 20, a heat conduction with lower thermal resistance is formed between the heating element 20 and the substrate 30. The channel quickly transfers most of the heat of the heating element 20 to the substrate 30, which improves the heat dissipation efficiency of the heat dissipation device 100.
  • the distance H1 between the end of the heat conductor 50 close to the circuit board 10 and the circuit board 10 is smaller than the minimum distance H2 between the end of the heating element facing the substrate 30 and the circuit board 10. This can ensure that one end of the heat conductor 50 extends close to the lowest heating element 22, which ensures that the heat generated by the lowest heating element 22 can be exported through the heat conductor 50 in time.
  • the heat on the circuit board 10 The height of the element 20 is high or low, so as to ensure the lowest heating element 20, for example, the distance H2 between the top of the heating element 22 and the circuit board 10 is greater than the distance H1 between the bottom end of the heat conductor 50 and the circuit board 10.
  • the distance between the top of the higher heating element 20 and the circuit board 10 is greater than the distance H1 between the bottom end of the heat conductor 50 and the circuit board 10, so that the heat conductor 50 can heat the higher heating element 20 and the lower heating element.
  • the heat generated by the element 20 conducts heat conduction.
  • the distance H1 between the end of the heat conductor 50 facing the circuit board 10 and the circuit board 10 may be 0.
  • the end of the heat conductor 50 facing the circuit board 10 abuts on the circuit board 10. .
  • the bottom end of the heat-conducting body 50 can be lower than the top end of the heating element 20.
  • the heat-conducting body 50 can be extended to overlap with the heating element 20 in the height direction. Each part is closer to the heat-conducting body 50, and it is easier to transfer the heat of the heating element 20 to the heat-conducting body 50.
  • the heating element 20 may include multiple components of different specifications, for example, may include a high-temperature element with a higher rated operating temperature and a low-temperature element with a lower rated operating temperature.
  • “high temperature” and “low temperature” mean that a preset value can be set in advance according to needs.
  • heating elements 20 whose rated operating temperature is higher than the preset value they are called high-temperature elements, and the rated operating temperature is lower than the preset value.
  • the heating element 20 with a set value is called a low temperature element.
  • the higher three heating elements 20 are high temperature elements 23, and the lower two heating elements 20 are low temperature elements 24. It should be understood that this is only an example, and the size of the heating element 20 does not correspond to its rated operating temperature.
  • the three higher heating elements 20 may be low temperature elements 24, and the lower The two heating elements are high-temperature elements 23.
  • the circuit board 10 can be provided with a high-temperature component 23 and a low-temperature component 24 at the same time, and if the high-temperature component 23 and the low-temperature component 24 are adjacent to each other, the high-temperature component 23 will bake the low-temperature component 24 and the low-temperature component 24 will be overheated. .
  • one end of the at least one heat conductor 50 can be extended between the adjacent high temperature element 23 and the low temperature element 24 in the heating element, so that the high temperature element 23 and the low temperature element 24 are separated by the heat conductor 50.
  • part of the heat conductor 50 is arranged between the adjacent high temperature element 23 and the low temperature element 24, which can realize the temperature zone between the high temperature and the low temperature, thereby ensuring the low temperature application environment of the low temperature element 24 and preventing the low temperature device from being damaged.
  • at least part of one end of the heat conductor 50 may extend to the circuit board 10, or as shown in the figure, there may be a space between one end of the heat conductor 50 and the circuit board 10.
  • the heat conductor 50 can be arranged between the adjacent high temperature element 23 and the low temperature element 24, and the high temperature element 23 and the low temperature element 24 are randomly arranged. In the case of arrangement, it is necessary to provide a heat conductor 50 between at least part of or all adjacently arranged high-temperature components 23 and low-temperature components 24.
  • the location of the heat conductor 50 includes, but is not limited to, between the high-temperature element 23 and the low-temperature element 24 shown in FIG. 3, and as shown in FIG. 3a, it may also be between the high-temperature element 23 and the high-temperature element 23.
  • a thermal conductor 50 is provided, which separates the high-temperature component 23 and the high-temperature component 23, or, as shown in FIG. 3b, a thermal conductor 50 may be provided between the low-temperature component 24 and the low-temperature component 24, and the thermal conductor 50 separates the low-temperature component 24 It is separated from the low-temperature element 24, so that the low-temperature element 24 is not easily affected by the surrounding heat.
  • the heat conductor 50 may also be arranged in other positions.
  • the heat conductor 501 is not arranged between adjacent heating elements, but extends to the high temperature element 23a.
  • the top in the case of ensuring insulation, the heat conductor 502 can also be in contact with a side surface of the high-temperature component 23b.
  • the heat conductor 503 is not arranged between adjacent heating elements, but extends to the top of the low-temperature element 24a; under the condition of ensuring insulation, the heat conductor 504 can also be connected to One side surface of the low-temperature element 24b is in contact.
  • FIG. 3c the heat conductor 501 is not arranged between adjacent heating elements, but extends to the high temperature element 23a.
  • the top in the case of ensuring insulation, the heat conductor 502 can also be in contact with a side surface of the high-temperature component 23b.
  • the heat conductor 503 is not arranged between adjacent heating elements, but extends to the top of the low-temperature element 24a; under the condition
  • the heat conductor 505 is not arranged between adjacent heating elements, but extends to the top of the low-temperature element 24; under the condition of ensuring insulation, the heat conductor 506 can also be connected with One side of the high-temperature element 23 is in contact.
  • an insulation layer 51 may be provided on the heat conductor 50 between the high-temperature element 23 and the low-temperature element 24, and the insulation layer 51 faces the low-temperature element 24. It is understandable that by providing the heat-insulating layer 51 on the side of the low-temperature element 24 of the heat conductor 50, the heat radiated from the high-temperature element 23 to the low-temperature element 24 can be blocked by the heat-insulating layer 51, which improves the temperature resistance of the heat conductor 50. Isolation effect.
  • all the thermal conductors 50 between the high temperature component 23 and the low temperature component 24 can be provided with the above-mentioned thermal insulation layer 51, or at least part of the thermal conductor 50 between the high temperature component 23 and the low temperature component 24 is provided with The above-mentioned thermal insulation layer 51.
  • the heat dissipation device 100 may further include a thermally conductive potting 52.
  • the thermally conductive potting compound 52 is, for example, potting compound, which is used for bonding, sealing, and potting of electronic components.
  • the potting glue is liquid before curing and has fluidity. After the potting glue is completely cured, it can play the role of waterproof and moistureproof, dustproof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance and shock resistance.
  • There are many types of potting glues which can be divided into epoxy resin potting glue, silicone resin potting glue, polyurethane potting glue, etc. from the material type.
  • the thermally conductive potting 52 of the present application may adopt any of the above.
  • the thermally conductive potting 52 is provided at least on the side of the substrate 30 facing the circuit board 10, the thermal conductor 50 is located inside the thermally conductive potting 52, and at least part of the heating element 20 extends into the thermally conductive potting 52.
  • the thermal conductivity potting compound 52 with low thermal resistance is provided on the substrate 30, which can reduce the thermal resistance of the heating element to the substrate 30 and improve the heat dissipation efficiency of the heat sink 100.
  • the thermal conductivity potting compound 52 is in a liquid state. The underfill is between the substrate 30 and the circuit board 10. When filling, it will automatically cover the outer contour of the heating element 20. Therefore, there is no special requirement on the size and shape of the heating element 20. The compatibility is strong and the application range is relatively large. wide.
  • the thermal conductivity of the thermal conductor 50 can be greater than that of the thermally conductive potting 52. Since the thermally conductive body 50 is wrapped in the thermally conductive potting 52, it can be on or near the heating element 20 and the substrate 30. A plurality of heat dissipation channels with relatively large thermal conductivity are formed between them. In the process of transferring heat from the heating element 20 to the substrate 30, the heat is actually more likely to be transferred to the substrate 30 through the thermal conductor 50 with relatively low thermal resistance.
  • the heat dissipation device 100 further includes the thermally conductive glue 52
  • the weight of the heat dissipation device 100 will be heavier.
  • the thermally conductive glue 52 can be arranged between the side facing the circuit board 10 and the circuit board 10. interval.
  • the thermally conductive potting 52 fills the space between the circuit board 10 and the substrate 30.
  • the space between the circuit board 10 and the substrate 30 is filled with the thermally conductive potting 52 so that the circuit board After 10 and the heat sink 100 are connected, they have high mechanical strength and realize the purpose of rapid heat conduction to the circuit board 10.
  • the heat sink 100 may further include a side plate 53, and the side plate 53 and the base plate 30 together form a cover, which is arranged on the heating element 20 on the circuit board 10, which is convenient Glue is poured between the substrate 30 and the circuit board 10 to facilitate the formation of the entire heat sink 100 and the circuit board 10 as a whole. Taking the heat sink 100 of FIG.
  • the thermally conductive potting glue 52 is completed.
  • the potting process of the thermally conductive potting 52 of the present application includes but is not limited to the above methods.
  • the substrate 30 may be fixed above the heating element through other jigs, and then the substrate 30 The space between 30 and the circuit board 10 is filled with potting glue.
  • the extending direction of the heat conductor 50 may be perpendicular to the circuit board 10.
  • the heat conduction channel formed by the heat conductor 50 can be perpendicular to the circuit board 10, so that the transmission path of heat conduction is the shortest, and the heat dissipation efficiency of the heat dissipation device 100 is improved.
  • the extension direction of the above-mentioned heat conductor includes but is not limited to being perpendicular to the circuit board 10.
  • the extension direction of the heat conductor 50 may also have an oblique angle with the circuit board 10.
  • at least part of the heat conductor around the high-temperature element may be inclined toward the high-temperature element, so as to make the heat dissipation effect of the high-temperature element better.
  • the heating element 20 is not in contact with the heat conductor 50, but is spaced apart from the heat conductor 50.
  • the heat conductor 50 is There is a corresponding relationship between the installation position on the substrate 30 and the installation position of the heating element 20 on the circuit board 10. Therefore, before potting the thermally conductive potting compound 52, the positions of the substrate 30 and the circuit board 10 should be aligned to avoid occurrences. The case where the heat conductor 50 and the heating element 20 interfere with each other.
  • the installation height of the heat conductor 50 on the substrate 30 is higher.
  • the height of the heat conductor 50 near the heating element 20 with a lower height is lower.
  • the height of the multiple thermal conductors 50 may be the same.
  • the heights of the plurality of heat conductors 50 may also be different.
  • a plurality of heat dissipation fins 31 may be provided on the side of the substrate 30 away from the heat conductor 50. In this way, the heat on the substrate 30 can also be better dissipated to the surrounding environment through the heat dissipation fins 31. It should be understood that, in some cases, the heat dissipation fins may not be provided, for example, when the overall size of the heat dissipation device is small, or when the installation space is small, it is also not necessary for the substrate 30 to face away from the heat conductor.
  • the surface of 50 is provided with heat dissipation fins.
  • the heat conductor 50 when the heat conductor 50 is disposed between the adjacent high-temperature component 23 and the low-temperature component 24, it can play the role of high and low temperature partition.
  • the heat conductor 50 is an annular heat conductor 54, and the annular heat conductor 54 is arranged on the outside of the high temperature element 23 adjacent to the low temperature element 24.
  • the ring-shaped thermal conductor 54 encloses the high-temperature element 23 therein, the heat of the high-temperature element 23 can be more easily transferred to the substrate 30 through the ring-shaped thermal conductor 54 and more heat is transferred to the substrate 30 through the ring-shaped thermal conductor 54. Then the heat transferred to the low temperature element 24 will be reduced accordingly.
  • the "ring-shaped heat conductor” refers to a cross-sectional outer profile of the guiding heating body in a direction parallel to the substrate 30, which is roughly ring-shaped, and may include a square ring, a circular ring, a polygonal ring, or an irregular ring structure,
  • the ring structure may not be a continuously formed structure. For example, there may be discontinuities, discontinuities, etc., as long as it is substantially ring-shaped.
  • the annular heat conductor 54 may surround the high-temperature component 23 or the low-temperature component 24.
  • the heat conductor 50 may be plate-shaped, so as to better isolate the high-temperature component 23 and the low-temperature component 24.
  • the heat conductor 50 is plate-shaped and is a ring-shaped heat conductor, then The entire annular heat conductor 54 may be formed in a cylindrical shape or a square tube shape.
  • a plurality of heat conductors 50 arranged at intervals are arranged on the outside of the high temperature element 23 adjacent to the low temperature element 24.
  • the heat conductor 50 may be formed in a plate shape or Columnar.
  • a plurality of heat conductors 50 arranged at intervals can also be arranged on the outer side of the high temperature element 23 to form a temperature insulation barrier around the high temperature element 23.
  • the multiple thermal conductors 50 are at least one of a thermally conductive sheet, a thermally conductive plate, a thermally conductive column, a thermally conductive root system, and a thermally conductive wire made of highly thermally conductive materials.
  • the diameter of the heat-conducting column is small, it can be regarded as a needle-shaped heat dissipation pin.
  • all the plurality of thermal conductors 50 are thermally conductive sheets; or the plurality of thermal conductors 50 are all thermally conductive plates; or all the plurality of thermal conductors 50 are thermally conductive pillars; or The plurality of heat conductors 50 are all heat-conducting wires; or all the plurality of heat-conductors 50 are heat-conducting root systems.
  • the plurality of thermal conductors 50 include two structural forms, for example, the plurality of thermal conductors 50 include a thermally conductive sheet and a thermally conductive plate; or the plurality of thermal conductors 50 include a thermally conductive sheet and a thermally conductive pillar; or a plurality of thermally conductive materials.
  • the body 50 includes a thermally conductive sheet and a thermally conductive wire; or the plurality of thermally conductive bodies 50 includes a thermally conductive plate and a thermally conductive column; or the plurality of thermally conductive bodies 50 includes a thermally conductive plate and a thermally conductive wire; or the plurality of thermally conductive bodies 50 includes a thermally conductive column and a thermally conductive wire.
  • the plurality of thermal conductors 50 includes three structural forms.
  • the plurality of thermal conductors 50 includes a thermally conductive sheet, a thermally conductive plate, and a thermally conductive pillar; or, the plurality of thermally conductive members 50 includes a thermally conductive sheet, a thermally conductive plate, and a thermally conductive Wire; or, the plurality of thermal conductors 50 include a thermal conductive wire, a thermal conductive plate and a thermal conductive column.
  • the plurality of thermal conductors 50 includes four structural forms.
  • the plurality of thermal conductors 50 includes a thermally conductive sheet, a thermally conductive plate, a thermally conductive pillar, and a thermally conductive wire.
  • the cross-sectional shape of the heat conductor 50 in a direction parallel to the substrate 30 may be a square, a circle, or an ellipse.
  • the cross-sectional shape of the heat conductor 50 can be flexibly selected according to the space and spacing between different heating elements.
  • the heat conductor may also be a hollow structure with a cavity inside, or may be formed of two or more materials.
  • the cross section may be a cross section of the heat conductor 50 in a direction parallel to the substrate 30.
  • the heat conductor is located between each heating element.
  • the arrangement position of the heat conductor includes but is not limited to this. It can also be in contact with the surface of the heating element, for example, it can be in contact with the heating element. The side wall and the top surface contact and so on.
  • the arrangement position of the heat conductor 50 can be flexibly set, and set according to the outer contour structure of the heating element 20, the spacing between the heating elements, etc. .
  • one or more heat conductors 50 may be provided between adjacent heating elements 20.
  • heat conductors 50 located near the heating elements 20, but also at locations far away from the heating elements 20.
  • a heat conductor 50 may also be provided to facilitate better heat dissipation of the heating element 20.
  • At least two heat conductors are arranged crosswise.
  • the heat conductor 50 is a heat conduction sheet or a heat conduction plate
  • adjacent heat conductors 50 may cross each other. In this way, the heat of the heating element can be better transferred to the substrate 30, and at the same time, the space arrangement requirements of different heating elements can be met.
  • the distribution density of the heat conductor 50 between the heating elements is larger than that of the heat conductor 50 of other structural forms, and the distribution density of the heat conductor 50 between the heating elements is larger.
  • the shape of the space between the heating elements There is no specific requirement on the shape of the space between the heating elements, and the heat dissipation effect of the heating element 20 is better.
  • At least one heat conductor 50 is in contact with the side surface or end surface of the heating element 20.
  • the heat conductor 50 and the heating element 20 are in direct contact, so that the heat transfer efficiency between the two is higher.
  • the thermal conductor 50 shown in FIG. 9 is a thermal conductive wire
  • the thermal conductive wire is formed into a flexible structure.
  • the substrate 30 provided with the thermal conductive wire can be fixed on the circuit board 10 through other jigs. , And let the thermal conductive wire sag to the heating element 20 naturally, so that part of the thermal conductive wire is suspended between the heating element 20, and some of the thermal conductive wire is lifted up by the heating element 20.
  • the filament-shaped heat conductor 50 is in a flexible state, can be in contact with the heating element, and can be lifted up.
  • the thermal conductive wire may be copper wire, aluminum wire or other high thermal conductivity materials.
  • one of the thermally conductive sheet, the thermally conductive plate, the thermally conductive column, and the thermally conductive root system may also be copper, aluminum, or other high thermal conductivity materials. It can be understood that the thermal conductive wire includes but is not limited to a flexible thermal conductive wire, and may also be a rigid thermal conductive wire.
  • the thermal conductive glue may not be provided on the substrate.
  • the substrate 30 provided with heat conducting wires can be fixed above and below the circuit board 10 by other jigs or the like.
  • the thermal conductor 50 is a thermally conductive sheet, a thermally conductive plate, a thermally conductive column and a thermally conductive root system
  • the substrate 30 provided with the thermally conductive body 50 can also be fixed above or below the circuit board 10 by a jig or the like, and then the substrate 30 and the circuit board Glue is poured between 10 so that the heat conductor 50 is located inside the heat-conducting glue 52.
  • a thermal pad or interface material may be provided between the heat conductor 50 and the heating element 20. This solution is particularly suitable for the case where no thermally conductive glue is provided between the substrate 30 and the circuit board 10.
  • the surface of the heat conductor 50 is provided with an insulating layer.
  • This arrangement can prevent short circuit between the heat conductor 50 and the heating element and the wiring on the circuit board 10.
  • a material with higher thermal conductivity may be selected to reduce the influence on the heat transfer efficiency of the thermal conductor 50.
  • the thermal conductor 50 and the substrate 30 can be connected by a thermally conductive interface material 55. This is because when the thermal conductor 50 and the substrate 30 are formed separately, the thermal conductor 50 and the substrate 30 There are gaps between the substrates 30, resulting in a decrease in heat transfer efficiency, and the thermal conductor 50 and the substrate 30 are bonded and connected by a thermally conductive interface material 55, so that the thermal conductor 50 and the substrate 30 can be seamlessly bonded to improve the heat transfer. effectiveness. Further, in order to enhance the connection strength between the thermal conductor 50 and the substrate 30, a screw or the like may also be used to connect the thermal conductor 50 and the substrate 30.
  • the thermal conductor 50 and the substrate 30 may be integrally formed.
  • the thermal conductor 50 may be a thermally conductive root system.
  • the thermal conductor 50 may include a main heating body 50a and a plurality of main heating bodies 50a.
  • the thermal conductor 50b by arranging a larger number of supporting heat conductors 50b on the main heating body 50a, the distribution density of the heat conductors 50 between the heating elements is greater, and the heat dissipation effect of the heating element 20 is better.
  • the main heating body 50a extends from one end of the substrate 30 toward the circuit board 10
  • one end of the supporting heat conductor 50b is connected to the main heating body 50a, and the other end of the supporting heat conductor 50b faces the main The side of the heating body 50a protrudes.
  • the heat conductor 50 includes a main heating body 50a and a supporting heat conductor 50b, and a plurality of side supporting heat conductors 50b are connected to the supporting heat conductor 50b.
  • the sub-heat conductor 50c extends from the square, so that the main heat conductor 50a, the branch heat conductor 50b, and the sub heat conductor 50c form a root structure, so that the heat conductor can conduct more heat outwards, and the heat conduction effect is better, ensuring the heating element 20
  • the generated heat can be dissipated to the outside in time through the heat-conducting root structure, which ensures that the heat dissipation device has a good heat dissipation effect on the circuit board 10.
  • FIGS. 11 and 12 are an example of a thermally conductive root system.
  • the structure of the thermally conductive root system includes, but is not limited to, those shown in FIGS. 11 and 12 including the main heating body 50a and the supporting heat conductor. 50b and the sub-heat conductor 50c, it is also possible to have one or more branch structures on the branch heat conductor 50b.
  • the branch heat conductor 50c is provided with the next level of branch heat conductor. If space permits, set More supporting heat conductors will make the heat dissipation more sufficient, and a heat-conducting root system with a net-like structure similar to tree roots can be formed between the substrate 30 and the circuit board 10.
  • the applicant conducted a heat generation comparison experiment on the circuit board provided with the heat sink of the prior art and the circuit board provided with the heat sink of the present application.
  • the heat dissipation device of the prior art is applied to a certain circuit board in a blade power supply with power of AkW (A can be selected according to actual needs).
  • the circuit board can be provided with a common mode inductor and a capacitor adjacent to the common mode inductor, among which, The temperature of the common mode inductor is 114.7°C, and the temperature of the capacitor adjacent to the common mode inductor is 111.8°C.
  • the heat sink 100 described in Embodiment 1 of the present application is applied to a circuit board in a blade power supply with a power of AkW, and a heat conductor is arranged around the common mode inductor for isolation. At this time, the common mode inductance is measured.
  • the temperature is 109.9°C, which is 4.8°C lower than the prior art; the temperature of the capacitor adjacent to the common-mode inductor is 107.2°C, which is 4.6°C lower than the prior art.
  • the heat dissipation device 100 of the first embodiment improves the heat dissipation capability of the circuit board.
  • the prior art heat sink is applied to another circuit board in a blade power supply with a power of BkW (A>B), and the temperature of the capacitor adjacent to the input inductor is 103.7°C.
  • the heat dissipating device 100 described in the first embodiment of the present application is applied to a circuit board in a blade power supply with a power of BkW, and a heat conductor 50 is arranged around the input inductor for isolation, and it is measured that it is adjacent to the input inductor
  • the temperature of the capacitor is 97.72°C, which is approximately 6°C lower than the prior art. From this, it can be seen that the use of the heat sink 100 of the first embodiment improves the heat dissipation capability of the circuit board.
  • the circuit board assembly 200 includes a circuit board 10 provided with a plurality of heating elements 20 and the aforementioned heat dissipation device 100.
  • the heat dissipation device 100 is provided on the circuit board 10 with heating elements 20.
  • One side The structure, function, and working principle of the heat dissipation device 100 have been described in detail in the first embodiment, and will not be repeated here.
  • a plurality of heating elements 20 may be provided on the circuit board 10.
  • the heat sink 100 may include a substrate 30, and the substrate 30 and the circuit board 10 are provided with heating elements 20
  • at least one heat conductor 50 may be provided on the side of the substrate 30 facing the circuit board 10. One end of the heat conductor 50 is connected to the substrate 30, and the other end faces The circuit board 10 extends and is close to the heating element.
  • the heat of each heating element can be quickly transferred to the substrate 30 through the thermal conductor 50 with a smaller thermal resistance, and then radiated from the substrate 30 to the external environment, effectively reducing heat generation
  • the heat transfer resistance from the component to the substrate 30 improves the heat dissipation efficiency of the components in the circuit board 10 assembly.
  • one end of the at least one heat conductor 50 extends between the adjacent high temperature element 23 and the low temperature element 24 in the heating element, and the high temperature element 23 and the low temperature element 24 are separated by the heat conductor 50. It should be understood that by separating the high-temperature element 23 and the low-temperature element 24 by the thermal conductor 50, temperature zoning can be realized, the low-temperature application environment of the low-temperature element 24 can be ensured, and the over-temperature situation caused by the baking of the low-temperature element by the high-temperature element can be prevented.
  • the illustration in this application lists the alternate distribution of high-temperature components and low-temperature components, but the distribution of heating components includes but is not limited to this. It can also be that some high-temperature components are concentratedly distributed, or some low-temperature components are concentratedly distributed. Some high-temperature components and some low-temperature components are arranged adjacent to each other, or a small number of low-temperature components are adjacent to many high-temperature components, or a small number of high-temperature components are adjacent to many low-temperature components. In these cases, at least one heat conductor 50 is required.
  • One end of the heating element extends between the adjacent high-temperature element 23 and the low-temperature element 24 in the heating element, so that the effect of avoiding the over-temperature caused by the baking of the low-temperature device by the high-temperature device can be achieved.
  • the circuit board 10 is a single panel as an example to describe the connection between the circuit board 10 and the heat sink 100.
  • the circuit board 10 includes but is not limited to a single panel, and the circuit board 10 can also be a double panel.
  • the heat dissipation device 100 can be provided on both the front and the back of the circuit board 10. In this way, when the circuit board 10 is a double-sided board, and both the front and back sides have heating elements, the two heat sinks 100 can both dissipate the circuit board 10.
  • the circuit board assembly may include two circuit boards 10 and two heat dissipation devices 100.
  • the two single-sided circuit boards 10 are arranged back-to-back, that is, the surfaces of the two circuit boards with heating elements 20 are arranged away from each other, and the surfaces opposite to the surfaces with the heating elements are arranged face to face with a certain interval.
  • a plurality of connecting sockets are provided on the surfaces of the circuit boards facing each other, and the connecting sockets can be used for plug-in connection of wiring, signal lines, etc. between the two circuit boards.
  • the space between the two circuit boards can be used to accommodate the above-mentioned connection sockets, wires, signal wires, etc.
  • the above two circuit boards 10 are similar in structure, both are provided with a plurality of heating elements 20 on the circuit board 10, the substrate 30 and the circuit board 10 are spaced apart, and a potting glue 52 is provided between the circuit board 10 and the substrate 30 ,
  • the heat conductor 50 is arranged between the heating elements 20 and extends from the substrate 10 to the circuit board 10 side.
  • the substrate 10 in FIG. 14 has a stepped portion 30', so that the height of the heat dissipation fins provided on the stepped portion can be changed according to the height of the stepped portion. In order to ensure the overall circuit assembly For aesthetics, the top of each heat dissipation fin can be located at the same height.
  • the heat dissipation of the heat dissipation device 100 in the present application is similar to the principle of water absorption by the roots of a big tree.
  • the heating element 20 can be regarded as a water source
  • the thermally conductive potting 52 can be regarded as soil
  • the thermal conductor 50 distributed in the thermally conductive potting 52 can be regarded as the root system of a big tree.
  • the substrate 30 can be regarded as the trunk of a big tree
  • the heat dissipation fins 31 can be regarded as the leaves of the big tree.
  • the heat dissipation device 100 of the present application when used for heat dissipation, the heat (moisture) of the heating element 20 (water source) passes through The heat conductor 50 (root system) is transferred to the substrate 30 (trunk), and then fully distributed to the external environment through the substrate 30 (trunk) and the heat dissipation fins 31 (leaves), so that the heat dissipation device 100 has a better heat dissipation effect.
  • the heat dissipation device 100 may further include a side plate 53 to facilitate the potting of the thermally conductive potting compound 52 on the substrate.
  • the electronic device 300 includes a housing 301 and the above-mentioned circuit board assembly 200, and the circuit board assembly 200 is disposed inside the housing 301.
  • the circuit board 10 of the electronic device may be provided with a plurality of heating elements 20.
  • the heat sink 100 may include a substrate 30, and the substrate 30 and the circuit board 10 are provided One side of the heating element 20 is arranged opposite to each other; and, in order to quickly transfer the heat on the heating element 20 to the substrate 30, at least one heat conductor 50 may be provided on the side of the substrate 30 facing the circuit board 10, and the heat conductor 50 extends toward the circuit board 10. And close to the heating element.
  • one end of the heat conductor 50 is connected to the substrate 30, and the other end of the heat conductor 50 extends toward the circuit board 10 and is close to the heating element 20.
  • the electronic devices provided in the embodiments of this application include, but are not limited to, mobile phones, tablet computers, laptop computers, ultra-mobile personal computers (UMPC), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants ( Mobile or fixed terminals with circuit boards, such as personal digital assistants, dash cams, wearable devices, or virtual reality devices.
  • UMPC ultra-mobile personal computers
  • POS machines personal digital assistants
  • Mobile or fixed terminals with circuit boards, such as personal digital assistants, dash cams, wearable devices, or virtual reality devices Mobile or fixed terminals with circuit boards, such as personal digital assistants, dash cams, wearable devices, or virtual reality devices.
  • connection should be understood in a broad sense.
  • it can be a fixed connection or Indirect connection through an intermediate medium can be the internal communication between two elements or the interaction between two elements.
  • connection should be understood according to specific circumstances.

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本申请实施例提供一种散热装置、电路板组件及电子设备。散热装置适用于电路板，电路板上设有多个发热元件，散热装置包括基板，基板朝向电路板的一面设有至少一个导热体，导热体一端与基板相连，另一端朝向电路板延伸且靠近发热元件。通过基板朝向电路板的一面设有至少一个导热体，导热体一端与基板相连，导热体的另一端朝向所述电路板延伸且靠近所述发热元件，各发热元件产生的热量，可以通过热阻较小的导热体迅速传递至基板，再由基板散发到外部环境中，有效减小了发热元件到基板的传热热阻，提高了散热装置的散热效率。

Description

一种散热装置、电路板组件及电子设备
本申请要求于2019年12月30日提交中国专利局、申请号为201911398409.2、申请名称为“一种散热装置、电路板组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及散热技术领域，特别涉及一种散热装置、电路板组件及电子设备。
背景技术
随着高速通信时代的到来，电子设备、例如通信基站的能耗持续上升，分布式电源单元(Distributed Processing Unit，DPU)是未来基站供电主要产品之一，随着对其功率要求的增加，相应地器件发热也比较严重，如果无法将热量及时排出，将严重影响器件的正常运行以及使用寿命。
目前分布式电源单元中的待散热器件一般通过散热器进行散热。例如，参照图1所示，多个待散热器件85安装在电路板81上，待散热器件85的上部通过界面材料贴附有散热器82，部分较小的待散热器件83由于尺寸较小无法直接贴附散热器82。实际工作过程中，待散热器件85的热量直接通过散热器82散发到外部环境中；较小的待散热器件83的热量先散发到空气中，再由空气把热量传递到散热器82上，最终由散热器82将热量散发到外部环境中。
然而，在上述的散热方案中，可能会有部分待散热器件距离散热器相对较远，例如尺寸较小的待散热器件距离散热器较远，因此通过空气向散热器传递热量时的热阻较大，容易在小尺寸器件附近局部形成高温区，造成器件超温，从而导致散热器的散热效率较低。
发明内容
本申请实施例提供一种散热装置、电路板组件及电子设备，散热装置的散热效率较高。
本申请实施例第一方面提供一种散热装置，适用于电路板，电路板上设有多个发热元件，散热装置包括基板，基板朝向电路板的一面设有至少一个导热体，导热体一端与基板相连，另一端朝向电路板延伸且靠近发热元件。
通过基板朝向电路板的一面设有至少一个导热体，导热体一端与基板相连，所述导热体的另一端朝向电路板延伸且靠近发热元件，各发热元件，例如，距离基板相对较远的发热元件的热量，可以通过热阻较小的导热体迅速传递至基板，再由基板散发到外部环境中，有效减小了发热元件到基板的传热热阻，提高了散热装置的散热效率。
在一种可能的实现方式中，至少一个导热体的一端延伸到发热元件中相邻的高温元件和低温元件之间，高温元件和低温元件通过导热体隔开。
使高温元件和低温元件通过导热体隔开，可实现温度分区，保证低温元件的低温应用环境，防止低温器件被高温器件烘烤而导致的超温情况。
在一种可能的实现方式中，高温元件和低温元件之间的导热体上设有保温层，保温层朝向低温元件。
在导热体的低温元件一侧设有保温层，这样高温元件向低温元件辐射的热量能够被保温层阻隔，提高了导热体的隔温效果。
在一种可能的实现方式中，导热体为环形导热体，且环形导热体围设在与低温元件相邻的高温元件的外侧，或者，与低温元件相邻的高温元件的外侧设置多个间隔排列的导热体。
通过在高温元件的外侧围设导热体，可以在高温元件的周围形成一道隔温屏障，一方面使高温元件的热量更容易通过导热体传递至基板，另一方面更好地防止高温元件的热量辐射至其周围的低温元件上。
在一种可能的实现方式中，导热体靠近电路板的一端与电路板之间的距离小于发热元件朝向基板的一端与电路板之间的最小距离。
这样设置，使导热体的底端比发热元件的顶端更靠下，例如使导热体一直延伸到与发热元件在高度方向上重叠，这样能够使发热元件上的各部分距离导热体更近，更易于将发热元件的热量传递到导热体上。
在一种可能的实现方式中，还包括导热灌胶，导热灌胶至少设置在基板朝向电路板的一面，导热体位于导热灌胶内部，发热元件的至少部分伸入导热灌胶内。
通过在基板上设置热阻较小的导热灌胶，可减小发热元件到基板的热阻，提升散热装置的散热效率，另一方面，导热灌胶对发热元件的尺寸及形态无特殊要求，兼容性较强、应用范围较广。
在一种可能的实现方式中，导热体的导热系数大于导热灌胶的导热系数。
由于导热体的导热系数大于导热灌胶的导热系数，这样在发热元件上或者其附近与基板之间形成了一个热阻较小的散热通道，更利于热量迅速传递，换言之，在发热元件上的热量向基板传递的过程中，实际上热量更倾向于通过导热系数较大的导热体向基板传递。
在一种可能的实现方式中，导热灌胶朝向电路板的一面和电路板之间具有间隔，或者，导热灌胶填满在电路板与基板之间的空间中。
导热灌胶朝向电路板的一面和电路板之间具有间隔，可以在尽量不影响散热效率的情况下减小散热装置的重量；而导热灌胶填满在电路板与基板之间的空间中可以使电路板和散热装置连接起来后，具有较高的机械强度。
在一种可能的实现方式中，导热体的延伸方向垂直于电路板。
这样可以使导热体形成的导热通道垂直于电路板，使得热传导的传递路径最短，提高散热装置的散热效率。
在一种可能的实现方式中，导热体为高导热材料制成的导热片、导热板、导热柱、导热根系和导热丝中的至少一者。
这样可以将导热体设置在各个发热元件之间，且不会影响到各个发热元件的正常工作。
在一种可能的实现方式中，导热丝为柔性导热丝；或者导热体为至少两个，且至少两个导热体交叉设置；或者，导热丝为柔性导热丝，并且导热体为至少两个，至少两个导热体交叉设置。
多个导热体可以交叉设置，以满足不同发热元件的空间布置需求。
在一种可能的实现方式中，导热体的横截面形状为方形、圆形或者椭圆形。
导热体的横截面形状可以根据不同发热元件之间的空间、间距等灵活选择。
在一种可能的实现方式中，导热体和基板之间通过导热界面材料贴合相连；或者，导热体和基板一体形成。
导热体和基板之间分体形成时，导热体和基板之间通过导热界面材料贴合相连，可以避免导热体和基板之间存在缝隙而导致的热传递效率的下降，或者为了避免导热体和基板之间的热传递效率受到影响，可以将导热体和基板一体形成。
在一种可能的实现方式中，至少一个导热体与发热元件的侧面或端面接触。
导热体与发热元件直接接触，使得二者的热传递效率更高。
在一种可能的实现方式中，导热体包括多个，且多个所述导热体的高度相同。
这样设置使发热体易于加工。
在一种可能的实现方式中，导热体的表面设有绝缘层。
这样设置可以防止导热体与发热元件、电路板上的走线接触后发生短路的情况。
在一种可能的实现方式中，基板背离导热体的一面设有多个散热翅片。
利于基板上的热量更好地散发至周围环境中。
在一种可能的实现方式中，还包括侧板，侧板与基板围成罩体，罩体罩设在电路板上的发热元件上。
这样便于在基板和电路板之间灌胶，并且利于整个散热装置和电路板形成为一个整体。
本申请第二方面提供一种散热装置，包括基板，基板的一面设有至少一个导热体，所述导热体的一端与基板相连，导热体的另一端朝向背离基板的方向延伸。
通过基板的一面设有至少一个导热体，导热体的另一端朝向背离基板的方向延伸，因此当将散热装置应用在对电路板的散热中时，使导热体朝向电路板上设有的发热元件的方向延伸，各发热元件，例如，距离基板相对较远的发热元件的热量，可以通过热阻较小的导热体迅速传递至基板，再由基板散发到外部环境中，有效减小了发热元件到基板的传热热阻，提高了散热装置的散热效率。
在一种可能的实现方式中，导热体上设有保温层。
在导热体上设有保温层，这样将散热装置应用到电路板中对发热元件进行散热时，发热元件向周围辐射的热量能够被保温层阻隔，提高了导热体的隔温效果。
在一种可能的实现方式中，导热体为环形导热体，或者导热体为多个，多个导热体间隔设置且围成环状结构。
通过在将环形导热体围设在部分发热元件的外侧，可以在发热元件的周围形成一道隔温屏障，一方面使发热元件的热量更容易通过导热体传递至基板，另一方面更好地防止发热元件的热量辐射至其周围的发热元件上。
在一种可能的实现方式中，还包括导热灌胶，导热灌胶设置在基板上，且导热体 位于导热灌胶内部。
通过在基板上设置热阻较小的导热灌胶，当散热装置应用在电路板上对发热元件散热时，可减小发热元件到基板的热阻，提升散热装置的散热效率，另一方面，导热灌胶对发热元件的尺寸及形态无特殊要求，兼容性较强、应用范围较广。
在一种可能的实现方式中，导热体的导热系数大于导热灌胶的导热系数。
由于导热体的导热系数大于导热灌胶的导热系数，当散热装置应用在电路板上对发热元件散热时，这样在发热元件上或者其附近与基板之间形成了一个热阻较小的散热通道，更利于热量迅速传递，换言之，在发热元件上的热量向基板传递的过程中，实际上热量更倾向于通过导热系数较大的导热体向基板传递。
在一种可能的实现方式中，导热体的延伸方向垂直于基板。
这样可以使导热体形成的导热通道垂直于电路板，使得热传导的传递路径最短，提高散热装置的散热效率。
在一种可能的实现方式中，导热体为高导热材料制成的导热片、散热板、散热柱、导热根系和散热丝中的至少一者。
这样可以将导热体设置在各个发热元件之间，且不会影响到各个发热元件的正常工作。
在一种可能的实现方式中，导热丝为柔性导热丝；或者导热体为至少两个，且至少两个导热体交叉设置；或者，导热丝为柔性导热丝，并且导热体为至少两个，至少两个导热体交叉设置。
多个导热体可以交叉设置，以满足不同发热元件的空间布置需求。
在一种可能的实现方式中，导热体的横截面形状为方形、圆形或者椭圆形。
导热体的横截面形状可以根据不同发热元件之间的空间、间距等灵活选择。
在一种可能的实现方式中，导热体和基板之间通过导热界面材料贴合相连；或者，导热体和基板一体形成。
导热体和基板之间分体形成时，导热体和基板之间通过导热界面材料贴合相连，可以避免导热体和基板之间存在缝隙而导致的热传递效率的下降，或者为了避免导热体和基板之间的热传递效率受到影响，可以将导热体和基板一体形成。
在一种可能的实现方式中，所述导热体为多个，且多个导热体的高度相同。
这样设置使发热体易于加工。
在一种可能的实现方式中，导热体的表面设有绝缘层。
这样设置可以防止导热体与发热元件、电路板上的走线接触后发生短路的情况。
在一种可能的实现方式中，基板背离导热体的一面设有多个散热翅片。
利于基板上的热量更好地散发至周围环境中。
在一种可能的实现方式中，还包括侧板，侧板与基板围成罩体。
这样便于在基板上灌胶。
本申请实施例第三方面提供一种电路板组件，包括设有多个发热元件的电路板和上述的散热装置，散热装置设置在电路板具有发热元件的一面上。
这样设置，各发热元件，例如，距离基板相对较远的发热元件的热量，可以通过热阻较小的导热体迅速传递至基板，再由基板散发到外部环境中，有效减小了发热元 件到基板的传热热阻，提高了电路板组件中各元器件的散热效率。
在一种可能的实现方式中，至少一个导热体的一端延伸到发热元件中相邻的高温元件和低温元件之间，高温元件和低温元件通过导热体隔开。
使高温元件和低温元件通过导热体隔开，可实现温度分区，保证低温元件的低温应用环境，防止低温器件被高温器件烘烤而导致的超温情况。
在一种可能的实现方式中，电路板为双面板，电路板的正面和反面均设有散热装置。
这样在电路板为双面板，且正反两面都具有发热元件的情况下，均能够对电路板进行散热。
本申请实施例第四方面提供一种电子设备，包括壳体和上述的电路板组件，电路板组件设置在壳体的内部。
这样设置，电子设备中各发热元件、尤其是距离基板相对较远的发热元件的热量，可以通过热阻较小的导热体迅速传递至基板，再由基板散发到外部环境中，有效减小了发热元件到基板的传热热阻，提高了电子设备中各元器件的散热效率。
附图说明
图1为现有技术的散热装置的结构示意图；
图2为本申请实施例一提供的散热装置的剖视结构示意图；
图3为本申请实施例一提供的散热装置的另一种结构的剖视结构示意图；
图3a为本申请实施例一提供的散热装置的另一种结构的剖视结构示意图；
图3b为本申请实施例一提供的散热装置的另一种结构的剖视结构示意图；
图3c为本申请实施例一提供的散热装置的另一种结构的剖视结构示意图；
图3d为本申请实施例一提供的散热装置的另一种结构的剖视结构示意图；
图3e为本申请实施例一提供的散热装置的另一种结构的剖视结构示意图；
图4为本申请实施例一提供的散热装置的再一种结构的横剖视图；
图5为本申请实施例一提供的散热装置的再一种结构的横剖视图；
图6为本申请实施例一提供的散热装置的再一种结构的剖视结构示意图；
图7为图6的散热装置的横剖视图；
图8为本申请实施例一提供的散热装置的再一种结构的剖视结构示意图；
图9为本申请实施例一提供的散热装置的再一种结构的剖视结构示意图；
图10为本申请实施例一提供的散热装置的再一种结构的剖视结构示意图；
图11为本申请实施例一提供的散热装置的再一种结构的剖视结构示意图；
图12为本申请实施例一提供的散热装置的再一种结构的剖视结构示意图；
图13为本申请实施例二提供的电路板组件的剖视示意图；
图14为本申请实施例二提供的电路板组件的另一种结构的剖视示意图；
图15为本申请实施例二提供的电路板组件的另一种结构的剖视示意图；
图16为本申请实施例三提供的电子设备的结构示意图。
附图标记说明：
100-散热装置；10-电路板；11-输出共模电感；12-电容；13-功率因数校正输入电 感；14-抑制电源电磁干扰用电容器；20、21、22-发热元件；23、23a、23b-高温元件；24、24a、24b-低温元件；30-基板；30’-台阶部；31-散热翅片；50、501、502、503、504、505、506-导热体；50a-主导热体；50b-支导热体；50c-子导热体；51-保温层；52-导热灌胶；53-侧板；54-环形导热体；55-导热界面材料；81-电路板；82-散热器；83-较小的待散热器件；85-待散热器件；200-电路板组件；300-电子设备；301-壳体。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请，下面将结合附图对本申请实施例的实施方式进行详细描述。
随着高速通信时代的到来，末端站点数量激增，杆站和小站数量占比也在持续上升，为了实现4G、5G、6G杆站中的大功率供电，对于采用自然散热的刀片电源而言，对散热性能提出了更高的需求。本申请就是为了提高散热装置的散热效率而提出。应当理解的是，本申请提供的散热装置除了适用于刀片电源之外，还适用于具有电路板组件的其它电子设备。
实施例一
参照图2，本申请实施例提供的散热装置100，适用于电路板10，电路板10上可设有多个发热元件20。
其中，电路板按照层数来分，可以分为单面板、双面板和多面板等，本实施例的说明中，以电路板10为单面板为例来进行说明，对于双面板和多面板的情况与此类似，本实施例中不再赘述。
发热元件20是指设置在电路板上的电子元器件，例如输出电感、电容等，电路板10上的各发热元件根据种类的不同，尺寸大小及规格也会不同，本实施例中，以发热元件20包括尺寸较大的发热元件21(例如，距离基板相对较近)和尺寸较小的发热元件22(例如，距离基板相对较远)为例来进行说明。参照图2，发热元件21和发热元件22在正常工作中，会源源不断地产生热量，为了保证电路板10的正常工作，本实施例采用散热装置100对发热元件21和发热元件22进行散热。
为了对发热元件20进行散热，可以使散热装置100包括基板30，且基板30与电路板10的设有发热元件20的一面相对设置；并且，为了将发热元件20上的热量快速传递至基板30，可以在基板30朝向电路板10的一面设有一个或多个导热体50，导热体50朝向电路板10延伸且靠近发热元件20，例如，导热体50一端与基板30相连，另一端朝向电路板10延伸且靠近发热元件20。
可以理解的是，发热元件22的热量一部分散发到空气中，并由空气把热量传递至基板30，然而由于尺寸较小的发热元件22的顶端距离基板30较远，热阻较大，因此通过此种方式传递的热量极少；发热元件22的热量中的绝大部分通过发热元件22周围的导热体50传递至基板30，这是由于，发热元件22周围的导热体50热阻较小，相当于在基板30和发热元件22周围形成一个热阻较小的热量传递通道，因此发热元件22的大部分热量通过其周围的导热体50迅速传递至基板30，再由基板30散发到外部环境中，有效减小了发热元件到基板30的传热热阻，提高了散热装置100的散热 效率。
另外，发热元件21的热量少部分散发到空气中，并由空气把热量传递至基板30，绝大部分通过发热元件21周围的导热体50传递至基板30，最终，由基板30将热量散发到外部环境中。可以理解的是，对于其它尺寸发热元件20的情况也与此类似，由于在发热元件20附近设置热阻较低的导热体50，在发热元件20和基板30之间形成热阻较低的导热通道，将发热元件20的大部分热量迅速传递至基板30，提高了散热装置100的散热效率。
在一种可能的实现方式中，导热体50靠近电路板10的一端与电路板10之间的距离H1小于发热元件朝向基板30的一端与电路板10之间的最小距离H2。这样可以保证导热体50的一端延伸到与最低的发热元件22靠近，这样确保了最低的发热元件22产生的热量可以通过导热体50及时向外导出.如上述所示，电路板10上的发热元件20的高度尺寸有高有低，因此保证最低的发热元件20，例如发热元件22的顶部距离电路板10之间的距离H2大于导热体50的底端距离电路板10之间的距离H1，那么较高的发热元件20的顶部距离电路板10之间的距离大于导热体50的底端距离电路板10之间的距离H1，从而使得导热体50可以对较高发热元件20和较低发热元件20的产生的热量均进行导热。本申请实施例中，需要说明的是，导热体50朝向电路板10的一端与电路板10之间的距离H1可以为0，例如，导热体50朝向电路板10的一端抵在电路板10上。
应当理解的是，这样可以使导热体50的底端比发热元件20的顶端更靠下，例如使导热体50一直延伸到与发热元件20在高度方向上重叠，这样能够使发热元件20上的各部分距离导热体50更近，更易于将发热元件20的热量传递到导热体50上。
本申请实施例中，发热元件20可以包含多种不同规格的元器件，例如，可以包括额定工作温度较高的高温元件、以及额定工作温度较低的低温元件。其中，“高温”、“低温”是指可以预先根据需要设定一个预设值，对于额定工作温度高于该预设值的发热元件20，称为高温元件，将额定工作温度低于该预设值的发热元件20，称为低温元件。例如，在图3中示出的五个发热元件20中，较高的三个发热元件20为高温元件23，较低的两个发热元件20为低温元件24。应当理解的是，此处仅为举例，发热元件20的尺寸大小与其额定工作温度并无对应关系，在具体工作过程中，也可以是较高的三个发热元件20为低温元件24，较低的两个发热元件为高温元件23。
电路板10上可以同时设置有高温元件23和低温元件24，且高温元件23和低温元件24相邻的情况下，会产生高温元件23烘烤低温元件24、从而导致低温元件24超温的问题。为了解决这个问题，可以使至少一个导热体50的一端延伸到发热元件中相邻的高温元件23和低温元件24之间，从而使高温元件23和低温元件24通过导热体50隔开。可以理解的是，部分导热体50设置在相邻的高温元件23和低温元件24之间，可实现高温和低温之间的温度分区，由此保证低温元件24的低温应用环境，防止低温器件被高温器件烘烤而导致的超温情况。示例性的，至少部分导热体50的一端可以延伸到电路板10上，或者也可以像图中所示那样，导热体50的一端与电路板10之间具有间隔。
在图3所示的高温元件23和低温元件24依次间隔布置的情况下，可以使导热体 50分别布置在相邻的高温元件23和低温元件24之间，在高温元件23和低温元件24随机排布的情况下，至少需要在部分相邻布置、或者全部相邻布置的高温元件23和低温元件24之间设有导热体50。
应当理解的是，导热体50的设置位置包括但不限于为图3所示的高温元件23和低温元件24之间，参照图3a所示，也可以在高温元件23和高温元件23之间也设置导热体50，导热体50将高温元件23和高温元件23隔开，或者，参照图3b所示，也可以在低温元件24和低温元件24之间导热体50，导热体50将低温元件24和低温元件24隔开，这样使得低温元件24不易受到周围热量的影响。
在其它一些例示中，导热体50也可以设置在其它位置，例如，也可以像图3c所示那样，导热体501并未设置在相邻的发热元件之间，而是延伸至高温元件23a的顶部；在保证绝缘性的情况下，导热体502还可以与高温元件23b的一个侧面接触。或者，也可以像图3d所示那样，导热体503并未设置在相邻的发热元件之间，而是延伸至低温元件24a的顶部；在保证绝缘性的情况下，导热体504还可以与低温元件24b的一个侧面接触。或者，也可以像图3e所示那样，导热体505并未设置在相邻的发热元件之间，而是延伸至低温元件24的顶部；在保证绝缘性的情况下，导热体506还可以与高温元件23的一个侧面接触。
本申请实施例中，为了进一步实现高温元件23和低温元件24的分区隔离，可以在高温元件23和低温元件24之间的导热体50上设有保温层51，保温层51朝向低温元件24。可以理解的是，通过在导热体50的靠低温元件24一侧设有保温层51，这样高温元件23向低温元件24辐射的热量能够被保温层51阻隔，提高了导热体50的对温度的隔离效果。具体设置时，可以使高温元件23和低温元件24之间的所有导热体50上均设有上述保温层51，也可以是高温元件23和低温元件24之间的至少部分导热体50上设有上述保温层51。
本申请实施例中，为了进一步提升散热装置100的散热效率，可以使散热装置100还包括导热灌胶52。导热灌胶52例如为灌封胶，灌封胶用于电子元件的粘接，密封和灌封。灌封胶在未固化前属于液体状，具有流动性，灌封胶完全固化后可以起到防水防潮、防尘、绝缘、导热、保密、防腐蚀、耐温、防震的作用。灌封胶种类非常多，从材质类型来分，可分为环氧树脂灌封胶、有机硅树脂灌封胶、聚氨酯灌封胶等。例如，本申请的导热灌胶52可以采用上述的任一种。
在图3的示例中，导热灌胶52至少设置在基板30朝向电路板10的一面，导热体50位于导热灌胶52内部，发热元件20的至少部分伸入导热灌胶52内。这样设置，在基板30上设置热阻较小的导热灌胶52，可减小发热元件到基板30的热阻，提升散热装置100的散热效率，另一方面，导热灌胶52在液态的状态下填充在基板30和电路板10之间，在填充时，会自动包覆在发热元件20的外部轮廓外，因此对发热元件20的尺寸及形态无特殊要求，兼容性较强、应用范围较广。
本申请实施例中，可以使导热体50的导热系数大于导热灌胶52的导热系数，由于导热体50包覆在导热灌胶52中，这样可以在发热元件20上或者其附近与基板30之间形成多个导热系数较大的散热通道，在发热元件20上的热量向基板30传递的过程中，实际上热量更倾向于通过热阻较小的导热体50向基板30传递。
在上述散热装置100还包括导热灌胶52的情况下，会使散热装置100的重量较重，为了避免这种情况，可以使导热灌胶52朝向电路板10的一面和电路板10之间具有间隔。在其它一些示例中，导热灌胶52填满在电路板10与基板30之间的空间中，例如，电路板10与基板30之间的空间全部填充有导热灌胶52，这样可以使电路板10和散热装置100连接起来后，具有较高的机械强度以及对电路板10实现快速导热的目的。
为了便于导热灌胶52的灌封，可以使散热装置100还包括侧板53，侧板53与基板30共同围成罩体，罩体罩设在电路板10上的发热元件20上，这样便于在基板30和电路板10之间灌胶，并且利于整个散热装置100和电路板10形成为一个整体。以图3的散热装置100为例进行说明，在基板30上设有导热体50的情况下，将液态的灌封胶灌入罩体中，然后将设有发热元件20的电路板10倒插入罩体内，将电路板10承载在侧板53的端部边缘，待灌封胶固化后，即完成导热灌胶52的灌封过程。本申请的导热灌胶52的灌封过程包括但不限于上述方式，在不具有侧板53的情况下，还可以是先将基板30通过其它治具等固定在发热元件的上方，然后在基板30和电路板10之间的空间中填充灌封胶。
本申请实施例中，导热体50的延伸方向可以垂直于电路板10。这样可以使导热体50形成的导热通道垂直于电路板10，使得热传导的传递路径最短，提高散热装置100的散热效率。当然，上述导热体的延伸方向包括但不限于为垂直于电路板10，例如，导热体50的延伸方向还可以与电路板10之间具有倾斜角度。例如，高温元件周围的至少部分导热体可以朝向高温元件倾斜，以便使高温元件的散热效果更好。
应当理解的是，图3中，发热元件20并未与导热体50接触，而是与导热体50彼此保持间隔地设置，鉴于各个发热元件20之间的间隔并不均匀，因此导热体50在基板30上的设置位置和发热元件20在电路板10上的设置位置存在着对应关系，因此在对导热灌胶52进行灌封之前，要将基板30和电路板10的位置对准，避免发生导热体50和发热元件20相互干涉的情况。
应当理解的是，导热体50在基板30上的设置高度和发热元件20在电路板10上的设置高度也存在着对应关系，例如高度较高的发热元件20附近的导热体50的高度较高，高度较低的发热元件20附近的导热体50的高度较低。
在一种可能的实现方式中，为了便于各导热体50的加工，在导热体50是多个时，可以使多个导热体50的高度相同。当然，在其他示例中，多个导热体50的高度也可以不同。
本申请实施例中，为了进一步提高散热装置100的散热效率，可以使基板30背离导热体50的一面设有多个散热翅片31。这样基板30上的热量也可以通过散热翅片31而更好地散发至周围环境中。应当理解的是，在一些情况中，也可以不设置散热翅片，例如在散热装置的整体尺寸较小的情况下，或者在安装空间较小的情况下，也可以不在基板30的背离导热体50的表面上设置散热翅片。
本申请实施例中，当导热体50设置在相邻的高温元件23和低温元件24之间时，可以起到高低温分区的作用，为了使这种分区效果更为明显，参照图4，在一种可能的实现方式中，导热体50为环形导热体54，且环形导热体54围设在与低温元件24相邻的高温元件23的外侧。当环形导热体54将高温元件23围设在其中时，可以使高 温元件23的热量更容易通过环形导热体54传递至基板30，并且更多的热量通过环形导热体54传递至基板30时，则传递至低温元件24的热量就会相应减少。
应当理解的是，“环形导热体”是指导热体沿平行于基板30的方向上的横截面外轮廓大致为环形，可以包括方环、圆环、多边形环、或者不规则形环的结构，环形结构也可以不是连续形成的结构，例如可以存在断续、间断等，只要大致呈环状即可。此外，环形导热体54可围绕着高温元件23，也可以围绕着低温元件24。
本申请实施例中，导热体50可以为板状，以利于对高温元件23和低温元件24更好地隔离，在一些示例中，若导热体50为板状，且为环形的导热体，则可以使整个环形导热体54形成为圆筒状、或者形成为方筒状。
在其它一些示例中，参照图5所示，与低温元件24相邻的高温元件23的外侧设置多个间隔排列的导热体50，本示例中，导热体50可以形成为板状也可以形成为柱状。例如，也可以在高温元件23的外侧围设多个间隔排列的导热体50，以在高温元件23的周围形成一道隔温屏障。
本申请实施例中，在导热体50为多个时，多个导热体50为高导热材料制成的导热片、导热板、导热柱、导热根系和导热丝中的至少一者。其中导热柱的直径较小时，可以视为形成了针状的散热针。
例如，在多个导热体50均由相同结构形成的情况下，多个导热体50全部为导热片；或者多个导热体50全部为导热板；或者多个导热体50全部为导热柱；或者多个导热体50全部为导热丝；或者多个导热体50全部为导热根系。
在另一些示例中，多个导热体50中包含两种结构形式，例如，多个导热体50中包含导热片和导热板；或者多个导热体50包含导热片和导热柱；或者多个导热体50包含导热片和导热丝；或者多个导热体50包含导热板和导热柱；或者多个导热体50包含导热板和导热丝；或者多个导热体50包含导热柱和导热丝。
在其它一些示例中，多个导热体50中包含三种结构形式，例如，多个导热体50包含导热片、导热板和导热柱；或者，多个导热体50包含导热片、导热板和导热丝；或者，多个导热体50包含导热丝、导热板和导热柱。在其它一些示例中，多个导热体50包括四种结构形式，例如，多个导热体50中，包括有导热片、导热板、导热柱和导热丝。
本申请实施例中，导热体50在平行于基板30的方向上的横截面形状可以为方形、圆形或者椭圆形。实际中，导热体50的横截面形状可以根据不同发热元件之间的空间、间距等灵活选择。在其它一些示例中，导热体还可以为内部具有空腔的中空结构，或者，是由两种或者两种以上的材料形成。需要注意的是，本申请实施例中，横截面可以为导热体50在平行于基板30的方向上的截面。
应当理解的是，在本申请附图中，例示出了导热体位于各个发热元件之间的情况，导热体的布置位置包括但不限于此，还可以与发热体表面接触，例如可以和发热体的侧壁和顶端面接触等。
本实施例中，参照图6和图7，导热体50为导热柱时，导热体50的布置位置可以灵活设置，并根据发热元件20的外轮廓结构，各发热元件之间的间距等来设置。示例性的，在相邻发热元件20之间可以设置一个或多个导热体50，进一步的，不仅在 靠近发热元件20的位置处设有导热体50，在距离发热元件20较远的位置处也可以设有导热体50，以便于更好地对发热元件20进行散热。
在一种可能的实现方式中，至少两个导热体交叉设置，参照图8所示的散热装置100，在导热体50是导热片或者导热板的情况下，相邻的导热体50可以相互交叉，这样利于发热元件的热量更好地传递至基板30，同时也可以满足不同发热元件的空间布置需求。
本申请实施例中，参照图9，在导热体50是导热丝的情况下，与其它结构形式的导热体50相比，各发热元件之间的导热体50的分布密度较大，且对各发热元件之间的空间形状没有特定要求，对发热元件20的散热效果更好。
在一种可能的实现方式中，至少一个导热体50与发热元件20的侧面或端面接触。这样使导热体50与发热元件20直接接触，使得二者的热传递效率更高。例如图9所示的导热体50是导热丝的情况下，导热丝形成为柔性结构，例如在灌胶时，可以先将设有导热丝的基板30通过其它治具等固定在电路板10上方，并让导热丝自然下垂至发热元件20上，这样部分导热丝悬挂于发热元件20之间，部分导热丝被发热元件20顶起，在此状态下，可选的，可以向基板30和发热元件20之间填充导热灌胶52。在上述的示例中，丝状的导热体50呈柔性状态，可以与发热元件接触、并能够被顶起。在本申请实施例中，导热丝可以为铜丝、铝丝或其他高导热材料。可选的，导热片、导热板、导热柱和导热根系的其中一者也可以采用铜、铝、或其它高导热材料。可以理解的是，导热丝包括但不限于为柔性导热丝，还可以是刚性导热丝，在设置导热丝的情况下，也可以不在基板上设置导热灌胶。需要说明的是，当电路板10为双面板时，可以将设有导热丝的基板30分别通过其它治具等固定在电路板10上方和下方。当然，当导热体50为导热片、导热板、导热柱和导热根系时，设有导热体50的基板30也可以通过治具等固定在电路板10上方或下方，然后在基板30和电路板10之间灌胶，使得导热体50位于导热灌胶52的内部。
在其它一些示例中，为了使导热体50和发热元件20的接触更加充分，可以在导热体50和发热元件20之间设置导热垫或者界面材料。该方案尤其适用于基板30和电路板10之间未设置导热灌胶的情况。
本申请实施例中，导热体50的表面设有绝缘层。这样设置可以防止导热体50与发热元件、电路板10上的走线短路。进一步的，该绝缘层例如可以选择导热性较高的材料，以减少对导热体50的热传递效率的影响。
本申请实施例中，参照图10，导热体50和基板30之间可以通过导热界面材料55贴合相连，这是由于导热体50和基板30之间分体形成时，会在导热体50和基板30之间存在缝隙而导致热传递效率下降，而在导热体50和基板30之间通过导热界面材料55贴合相连，可以使导热体50和基板30之间无缝隙贴合，提高热传递效率。进一步的，为了增强导热体50和基板30的连接强度，还可以使用螺钉等将导热体50和基板30连接起来。
应当理解的是，为了进一步提高导热体50和基板30之间的热传递效率，可以使导热体50和基板30一体形成。
本申请实施例中，导热体50可以为导热根系，与其它结构形式的导热体50相比， 导热体50为导热根系时，导热体50可以包括主导热体50a和多个与主导热体50a连接的支导热体50b，通过在主导热体50a上设置数量较多的支导热体50b各发热元件之间的导热体50的分布密度更大，对发热元件20的散热效果更好。
例如，图11所示的散热装置中，主导热体50a从基板30的一端朝向电路板10的方向延伸，支导热体50b的一端和主导热体50a连接，支导热体50b的另一端朝向主导热体50a的侧方伸出。
或者，在上述图11的散热装置的基础上，如图12所示，导热体50包括主导热体50a和支导热体50b，且在支导热体50b上连接有多个向支导热体50b侧方伸出的子导热体50c，这样主导热体50a、支导热体50b和子导热体50c形成根系结构，从而使得导热体将更多的热量向外导出，导热效果更好，确保了发热元件20产生的热量通过导热根系结构可以及时向外散出，确保了散热装置对电路板10具有良好的散热效果。
应当理解的是，图11和图12为导热根系的一种示例，在其他示例中，导热根系的结构包括但不限于为图11和图12中所示的包括主导热体50a、支导热体50b以及子导热体50c，还可以在支导热体50b上再一级或两级以上的支路结构，例如，在支导热体50c上再设置下一级的支导热体，若空间允许，设置越多的支导热体会使散热更充分，可以在基板30和电路板10之间形成类似树根的网状结构的导热根系。
为了验证本实施例的散热装置100的散热效果，申请人针对设有现有技术的散热装置的电路板、以及设有本申请的散热装置的电路板进行了发热对比实验。
现有技术的散热装置应用在功率为AkW(A可以根据实际需要选择)的刀片电源中的某个电路板上，该电路板上可以设置共模电感和与共模电感相邻的电容，其中，共模电感的温度为114.7℃，与共模电感相邻的电容的温度为111.8℃。
而将本申请实施例一所述的散热装置100应用在功率为AkW的刀片电源中的电路板上，且在所述共模电感的周围设置导热体进行隔离，此时测得共模电感的温度为109.9℃，与现有技术相比，降低了4.8℃；与共模电感相邻的电容的温度为107.2℃，与现有技术相比，降低了4.6℃，由此，可以得知，采用了本实施例一的散热装置100使针对电路板的散热能力得到提升。
现有技术的散热装置应用在功率为BkW(A＞B)的刀片电源中的另一个电路板上，与输入电感相邻的电容器的温度为103.7℃。
而将本申请实施例一所述的散热装置100应用在功率为BkW的刀片电源中的电路板上，且在所述输入电感的周围设置导热体50进行隔离，测试测得与输入电感相邻的电容器的温度为97.72℃，与现有技术相比，大约降低了6℃，由此，可以得知，采用了本实施例一的散热装置100使针对电路板的散热能力得到提升。
实施例二
本实施例提供一种电路板组件，参照图13，电路板组件200包括设有多个发热元件20的电路板10和上述的散热装置100，散热装置100设置在电路板10具有发热元件20的一面上。散热装置100的结构、功能、工作原理等在实施例一中已经进行了详细介绍，此处不再赘述。
在本申请实施例中，电路板10上可以设有多个发热元件20，为了对发热元件20 进行散热，可以使散热装置100包括基板30，且基板30与电路板10的设有发热元件20的一面相对设置；并且，为了将发热元件上的热量快速传递至基板30，可以在基板30朝向电路板10的一面设有至少一个导热体50，导热体50一端与基板30相连，另一端朝向电路板10延伸且靠近发热元件。
像这样设置，各发热元件、尤其是尺寸较小的发热元件的热量，可以通过热阻较小的导热体50迅速传递至基板30，再由基板30散发到外部环境中，有效减小了发热元件到基板30的传热热阻，提高了电路板10组件中各元器件的散热效率。
本申请实施例中，至少一个导热体50的一端延伸到发热元件中相邻的高温元件23和低温元件24之间，高温元件23和低温元件24通过导热体50隔开。应当理解的是，通过使高温元件23和低温元件24通过导热体50隔开，可实现温度分区，保证低温元件24的低温应用环境，防止低温器件被高温器件烘烤而导致的超温情况。
可以理解的是，本申请图示中列举出了高温元件和低温元件交替分布的情况，但发热元件的分布情况包括但不限于此，还可以是部分高温元件集中分布、或者部分低温元件集中分布，部分高温元件和部分低温元件相邻设置，或者是少量低温元件与较多高温元件相邻，或者是少量高温元件与较多低温元件相邻，在上述这些情况下，只要至少一个导热体50的一端延伸到发热元件中相邻的高温元件23和低温元件24之间，就可以实现避免低温器件被高温器件烘烤而导致的超温情况的效果。
在图13的例示中，以电路板10为单面板的情况为例来介绍电路板10和散热装置100的连接，然而电路板10包括但不限于为单面板，电路板10还可以为双面板，可以使电路板10的正面和反面均设有散热装置100。这样在电路板10为双面板，且正反两面都具有发热元件的情况下，两个散热装置100均能够对电路板10进行散热。
在图14中，电路板组件可以包括两个电路板10和两个散热装置100。两个单面电路板10背靠背设置，即两个电路板的设有发热元件20的表面分别背离设置，而与设有发热元件的表面相反的表面之间面对面设置，且具有一定间隔，两个电路板之间彼此相对的表面设有多个连接插口，该连接插口可供两个电路板之间的走线、信号线等插接连接。而两个电路板之间的间隔可用于容置上述连接插口、走线、信号线等。
上述两个电路板10的结构类似，均为在电路板10上设有多个发热元件20，基板30与电路板10间隔设置，且在电路板10和基板30之间设有灌封胶52，导热体50设置在各发热元件20之间，且从基板10延伸到电路板10一侧。与上述各个示例不同的是，图14中的基板10具有台阶部30’，这样设置在台阶部上的散热翅片的高度可以根据台阶部的高度而发生变化，其中，为了保证电路组件整体的美观性，可以使各个散热翅片的顶端位于同一个高度上。
本申请中的散热装置100的散热类似于大树的根系吸水原理。例如，以图14示出的散热装置为例进行说明，发热元件20可以看作水源，导热灌胶52可以看作土壤，分布在导热灌胶52中的导热体50可以看作大树的根系，基板30可以看作大树的树干，散热翅片31可以看作大树的树叶，由此，在利用本申请的散热装置100进行散热时，发热元件20(水源)的热量(水分)通过导热体50(根系)而传递至基板30(树干)，再经由基板30(树干)和散热翅片31(树叶)充分散发到外界环境中，使得散热装置100的散热效果较好。
在其它一些示例中，参照图15所示，散热装置100还可以包括侧板53，以便于对基板灌封导热灌胶52。
实施例三
本申请实施例提供一种电子设备，参照图16，电子设备300包括壳体301和上述的电路板组件200，电路板组件200设置在壳体301的内部。
散热装置和电路板组件的结构、功能、工作原理等在实施例一、实施例二中已经进行了详细介绍，此处不再赘述。
在本申请实施例中，电子设备的电路板10上可以设有多个发热元件20，为了对发热元件20进行散热，可以使散热装置100包括基板30，且基板30与电路板10的设有发热元件20的一面相对设置；并且，为了将发热元件20上的热量快速传递至基板30，可以在基板30朝向电路板10的一面设有至少一个导热体50，导热体50朝向电路板10延伸且靠近发热元件，例如，导热体50一端与基板30相连，导热体50的另一端朝向电路板10延伸且靠近发热元件20，这样设置，各发热元件、尤其是尺寸较小的发热元件的热量，可以通过热阻较小的导热体50迅速传递至基板30，再由基板30散发到外部环境中，有效减小了发热元件到基板30的传热热阻，提高了电子设备中各元器件的散热效率。
本申请实施例提供的电子设备，包括但不限于为手机、平板电脑、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持计算机、对讲机、上网本、POS机、个人数字助理(personal digital assistant，PDA)、行车记录仪、可穿戴设备、或虚拟现实设备等具有电路板的移动或固定终端。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例各实施例技术方案的范围。

Claims (22)

  1. 一种散热装置，适用于电路板，所述电路板上设有多个发热元件，其特征在于，所述散热装置包括基板，所述基板朝向所述电路板的一面设有至少一个导热体，所述导热体一端与所述基板相连，所述导热体的另一端朝向所述电路板延伸且靠近所述发热元件。
  2. 根据权利要求1所述的散热装置，其特征在于，至少一个所述导热体的一端延伸到所述发热元件中相邻的高温元件和低温元件之间，所述高温元件和所述低温元件通过所述导热体隔开。
  3. 根据权利要求2所述的散热装置，其特征在于，所述高温元件和所述低温元件之间的所述导热体上设有保温层，所述保温层朝向所述低温元件。
  4. 根据权利要求2所述的散热装置，其特征在于，所述导热体为环形导热体，且所述环形导热体围设在与所述低温元件相邻的所述高温元件的外侧，或者，与所述低温元件相邻的所述高温元件的外侧设置多个间隔排列的所述导热体。
  5. 根据权利要求1-4任一项所述的散热装置，其特征在于，所述导热体靠近所述电路板的一端与所述电路板之间的距离小于所述发热元件朝向所述基板的一端与所述电路板之间的最小距离。
  6. 根据权利要求1-5任一项所述的散热装置，其特征在于，还包括导热灌胶，所述导热灌胶至少设置在所述基板朝向所述电路板的一面，所述导热体位于所述导热灌胶内部，所述发热元件的至少部分伸入所述导热灌胶内。
  7. 根据权利要求6所述的散热装置，其特征在于，所述导热体的导热系数大于所述导热灌胶的导热系数。
  8. 根据权利要求6或7所述的散热装置，其特征在于，所述导热灌胶朝向所述电路板的一面和所述电路板之间具有间隔，或者，所述导热灌胶填满在所述电路板与所述基板之间的空间中。
  9. 根据权利要求1-8任一项所述的散热装置，其特征在于，所述导热体的延伸方向垂直于所述电路板。
  10. 根据权利要求1-9任一项所述的散热装置，其特征在于，所述至少一个导热体为高导热材料制成的导热片、导热板、导热柱、导热根系和导热丝中的至少一者。
  11. 根据权利要求10所述的散热装置，其特征在于，
    所述导热丝为柔性导热丝；或者
    所述导热体为至少两个，且至少两个所述导热体交叉设置；
    或者，所述导热丝为柔性导热丝，并且所述导热体为至少两个，至少两个所述导热体交叉设置。
  12. 根据权利要求10或11所述的散热装置，其特征在于，所述导热体的横截面形状为方形、圆形或者椭圆形。
  13. 根据权利要求1-12任一项所述的散热装置，其特征在于，所述导热体和所述基板之间通过导热界面材料贴合相连；或者，所述导热体和所述基板一体形成。
  14. 根据权利要求1-13任一项所述的散热装置，其特征在于，所述至少一个所述 导热体与所述发热元件的侧面或端面接触。
  15. 根据权利要求1-14任一所述的散热装置，其特征在于，多个所述导热体的高度相同。
  16. 根据权利要求1-15任一项所述的散热装置，其特征在于，所述导热体的表面设有绝缘层。
  17. 根据权利要求1-16任一项所述的散热装置，其特征在于，所述基板背离所述导热体的一面设有多个散热翅片。
  18. 根据权利要求1-17任一项所述的散热装置，其特征在于，还包括侧板，所述侧板与所述基板围成罩体，所述罩体罩设在所述电路板上的所述发热元件上。
  19. 一种电路板组件，其特征在于，包括设有多个发热元件的电路板和上述权利要求1-32任一项所述的散热装置，所述散热装置设置在所述电路板具有所述发热元件的一面上。
  20. 根据权利要求19所述的电路板组件，其特征在于，所述散热装置中的至少一个所述导热体的一端延伸到所述发热元件中相邻的高温元件和低温元件之间，所述高温元件和所述低温元件通过所述导热体隔开。
  21. 根据权利要求19或20所述的电路板组件，其特征在于，所述电路板为双面板，所述电路板的正面和反面均设有所述散热装置。
  22. 一种电子设备，其特征在于，包括壳体和权利要求19-21任一项所述的电路板组件，所述电路板组件设置在所述壳体的内部。
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