WO2021134490A1

WO2021134490A1 - Mass transfer system and method for light-emitting diode

Info

Publication number: WO2021134490A1
Application number: PCT/CN2019/130532
Authority: WO
Inventors: 许时渊
Original assignee: 重庆康佳光电技术研究院有限公司
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2021-07-08
Also published as: CN113348541A; CN113348541B

Abstract

Disclosed is a mass transfer system (1000) for light-emitting diodes (10). The mass transfer system (1000) comprises: a transfer device (40) that captures the light-emitting diodes (10) to a display backplane (50); and a magnetic device (60) having a magnetic field that attracts the light-emitting diodes (10), wherein the light-emitting diodes (10) are selectively attracted from the transfer device (40) to the display backplane (50) under the action of the magnetic field. Disclosed is a mass transfer method for light-emitting diodes (10). The mass transfer method is applied to the mass transfer system (1000) for light-emitting diodes (10), and the mass transfer system (1000) comprises the transfer device (40) and the magnetic device (60). The mass transfer method comprises: using the transfer device (40) to achieve one-to-one correspondence between the light-emitting diodes (10) and fixing points, at which the light-emitting diodes (10) are to be mounted, of the display backplane (50); and using the magnetic field of the magnetic device (60) to attract the light-emitting diodes (10) so as to selectively attract the light-emitting diodes (10) from the transfer device (40) to the display backplane (50).

Description

Mass transfer system and mass transfer method of light emitting diode

Technical field

The present invention relates to the technical field of micro-light emitting diodes (Micro-LED), in particular to a mass transfer system and a mass transfer method of light emitting diodes.

Background technique

Miniature light-emitting diodes have good stability, longevity, and advantages in operating temperature. At the same time, miniature light-emitting diodes also inherit the advantages of light-emitting diodes such as low power consumption, high color saturation, fast response speed, and strong contrast. Therefore, miniature light-emitting diodes have great application prospects, such as miniature light-emitting diode display screens.

During the manufacturing process of the miniature light-emitting diode display, the light-emitting diode on the original substrate needs to be transferred and fixed to the display backplane. The traditional mass transfer method is to heat and melt the metal solder on the backplane of the display screen, and then use the transfer substrate to press the light-emitting diodes to bond the light-emitting diodes with the metal solder to fix the light-emitting diodes on the backplane of the display screen. . However, since it is difficult to control the pressure of the transfer substrate during the pressurization process, it is easy to cause cracks and damages of the light-emitting diodes. Moreover, in the traditional mass transfer method, the light-emitting diodes are usually fixed on the transfer substrate with a complex weakening structure of the light-emitting diodes. The manufacturing process of the light-emitting diode weakened structure is very difficult, which greatly affects the manufacturing efficiency of the light-emitting diode display screen.

technical problem

The invention provides a mass transfer system of light-emitting diodes, which can effectively avoid the phenomenon of cracking and damage of the light-emitting diodes during the transfer process, and at the same time can improve the manufacturing efficiency of the light-emitting diode display screens.

Technical solutions

In a first aspect, an embodiment of the present invention provides a mass transfer system for light-emitting diodes, and the mass transfer system includes:

A transfer device for grabbing the light-emitting diode to the display backplane; and

The magnetic device has a magnetic field for attracting the light-emitting diode, and the light-emitting diode is selectively adsorbed from the transfer device to the display back plate under the action of the magnetic field.

In a second aspect, an embodiment of the present invention provides a mass transfer method for light emitting diodes. The mass transfer method is applied to a mass transfer system for light emitting diodes. The mass transfer system includes a transfer device and a magnetic device. Mass transfer methods include:

Using the transfer device to correspond the light-emitting diodes to the fixing points of the display backplane where the light-emitting diodes are to be mounted in a one-to-one correspondence; and

The magnetic field of the magnetic device is used to attract the light-emitting diode to selectively adsorb the light-emitting diode from the transfer device to the display backplane.

Beneficial effect

The mass transfer system and mass transfer method for light-emitting diodes described above utilize the characteristics of the energized solenoid to generate a magnetic field. When the light-emitting diode is transferred to the display backplane, the light-emitting diode is directly absorbed from the transfer device to the display backplane, It effectively avoids the phenomenon that the light-emitting diode is broken or damaged due to pressure and other problems during the transfer process, and at the same time, the manufacturing efficiency of the light-emitting diode display screen is improved.

Description of the drawings

Fig. 1 is a schematic diagram of a mass transfer system provided by the first embodiment of the present invention.

Fig. 2 is a schematic diagram of a mass transfer system provided by a second embodiment of the present invention.

Fig. 3 is a schematic diagram of a mass transfer system provided by a third embodiment of the present invention.

Fig. 4 is a schematic diagram of a mass transfer system provided by a fourth embodiment of the present invention.

Fig. 5 is a flow chart of mass transfer provided by an embodiment of the present invention.

FIG. 6 is a schematic diagram of the mass transfer process in the first specific embodiment provided by the first embodiment of the present invention.

FIG. 7 is a schematic diagram of the mass transfer process in the second specific embodiment provided by the first embodiment of the present invention.

FIG. 8 is a sub-flow chart of the first specific embodiment mass transfer provided by the first embodiment of the present invention.

FIG. 9 is a sub-flow chart of mass transfer in the second specific embodiment provided by the first embodiment of the present invention.

FIG. 10 is a schematic diagram of the mass transfer sub-process of the first specific embodiment provided by the first embodiment of the present invention.

FIG. 11 is a schematic diagram of the mass transfer sub-process in the second specific embodiment provided by the first embodiment of the present invention.

FIG. 12 is a schematic diagram of the mass transfer process provided by the second embodiment of the present invention.

FIG. 13 is a schematic diagram of the mass transfer process provided by the third embodiment of the present invention.

FIG. 14 is a schematic diagram of the mass transfer process provided by the fourth embodiment of the present invention.

FIG. 15 is a flowchart of the sub-process of mass transfer provided by the fifth embodiment of the present invention.

FIG. 16 is a schematic diagram of the mass transfer sub-process provided by the fifth embodiment of the present invention.

The best mode of the present invention

In order to have a clearer and more accurate understanding of the content of the present invention, a detailed description will now be made in conjunction with the accompanying drawings. The drawings of the specification show examples of embodiments of the present invention, in which the same reference numerals denote the same elements. It can be understood that the scale shown in the drawings in the specification is not the scale of the actual implementation of the present invention, and is only for illustrative purposes, and is not drawn according to the original size.

Please refer to FIG. 1, which is a schematic diagram of the mass transfer system provided by the first embodiment of the present invention. The mass transfer system 1000 is used to transfer the light emitting diode 10 to the display backplane 50. The light emitting diode 10 includes a first end surface 101 facing the transfer device 40 and a second end surface 102 disposed opposite to the first end surface. The second end surface 102 is combined with the display backplane 50. The light emitting diode 10 has magnetism. Specifically, the electrode 11 of the light-emitting diode 10 can be made of a magnetic material such as gold, silver, copper, iron, cobalt, nickel, aluminum, titanium, molybdenum, chromium, and zinc. The electrode 11 of the light emitting diode 10 may also be vapor-deposited or doped with magnetic materials, so that the electrode 11 has stronger magnetic properties.

The mass transfer system 1000 includes a transfer device 40 and a magnetic device 60. Specifically, the transfer device 40 includes a transfer substrate 42 and a first adhesive layer 41 coated on the transfer substrate 42. The transfer device 40 grabs the light-emitting diode 10 through the first adhesive layer 41 and transfers it to the top of the display back plate 50, and the second end surface 102 of the light-emitting diode 10 faces the display back plate 50. Among them, the first adhesive layer 41 is a pyrolysis glue, and the viscosity of the pyrolysis glue decreases with the increase of temperature.

The magnetic device 60 includes a controller 62 and a plurality of solenoids 61 arranged at intervals. Specifically, the solenoid 61 corresponds to the fixed point 501 provided on the display back plate 50 in a one-to-one correspondence. Both ends of the solenoid 61 are electrically connected to the controller 62 at the bottom of the magnetic device 60 through wires (not shown in the figure). The solenoid 61 is energized or de-energized by the controller 62. Each solenoid 61 generates a magnetic field when it is energized, and the magnetic field can attract the light-emitting diode 10. The light emitting diode 10 is attracted from the transfer device 40 to the display back plate 50 under the action of a magnetic field. The outer side of each solenoid 61 is covered with a diamagnetic sleeve 611, and the diamagnetic sleeve 611 can prevent the magnetic fields generated by the solenoids 61 from interfering with each other after being energized.

A heating platform 70 is provided between the display back plate 50 and the magnetic device 60. The heating platform 70 is attached to the display back plate 50, and the heating platform 70 is used to heat the fixed points 501 provided on the display back plate 50. The fixing point 501 becomes molten after being heated, and is used to fix the light-emitting diode 10 to the display back plate 50. Among them, the fixed point 501 is metal solder, and the metal solder includes tin, indium, and the like.

Please refer to FIG. 2, which is a schematic diagram of the mass transfer system provided by the second embodiment of the present invention. The difference between the mass transfer system 2000 provided in the second embodiment and the mass transfer system 1000 provided in the first embodiment is that each solenoid 61 includes a switch 610, and the switch 610 is used to control the corresponding solenoid. The tube 61 is electrically connected to the power supply 62. The magnetic field generated by the energized solenoid 61 can attract the light-emitting diode 10. The light emitting diode 10 is selectively adsorbed from the transfer device 40 to the display back plate 50 under the action of a magnetic field. The other structures of the mass transfer system 2000 are basically the same as those of the mass transfer system 1000, and will not be repeated here.

Please refer to FIG. 3, which is a schematic diagram of the mass transfer system provided by the third embodiment of the present invention. The difference between the mass transfer system 3000 provided by the third embodiment and the mass transfer system 2000 provided by the second embodiment is that the transfer substrate 42 is provided with a plurality of protrusions 420 at intervals, and the protrusions 420 are different from those provided on the display backplane. The fixed points 501 of 50 correspond one-to-one. The first adhesive layer 41 is coated on the plurality of protrusions 420. The light emitting diode 10 is pasted to the bump 420 through the first adhesive layer 41. The other structures of the mass transfer system 3000 are basically the same as those of the mass transfer system 2000, and will not be repeated here.

Please refer to FIG. 4, which is a schematic diagram of the mass transfer system provided by the fourth embodiment of the present invention. The difference between the mass transfer system 4000 provided by the fourth embodiment and the mass transfer system 3000 provided by the third embodiment is that the magnetic device 60 includes a plurality of magnets 63 arranged at intervals, and the magnets 63 are different from those provided on the display backplane. The fixed points 501 of 50 correspond one-to-one. The outer side of each magnet 63 is covered with a diamagnetic sleeve 631, and the diamagnetic sleeve 631 can prevent the magnetic fields generated by the magnets 63 from interfering with each other. The magnetic field generated by the magnet 63 can attract the light emitting diode 10. The light emitting diode 10 is attracted from the transfer device 40 to the display back plate 50 under the action of a magnetic field. The other structures of the mass transfer system 4000 are basically the same as those of the mass transfer system 3000, and will not be repeated here.

Please refer to FIG. 5 and FIG. 6 in combination, which are schematic diagrams of the mass transfer of the first specific embodiment provided by the first embodiment of the present invention. The light-emitting diode 10 is a flip-chip type, that is, the two electrodes 11 of the light-emitting diode 10 are both located on the second end surface 102 of the light-emitting diode 10. The light-emitting diodes 10 captured by the transfer device 40 through the first adhesive layer 41 coated on the transfer substrate 42 are pasted on the transfer substrate 42 at intervals, and the steps of transferring the light-emitting diodes 10 to the display backplane 50 specifically include:

In step S101, the light-emitting diode 10 is one-to-one corresponding to the fixed point 501 of the light-emitting diode 10 to be mounted on the display backplane 50 by using the transfer device 40. Specifically, move the transfer device 40 to above the display backplane 50, so that the light-emitting diodes 10 pasted on the transfer substrate 42 correspond one-to-one with the fixed points 501 of the light-emitting diodes 10 to be mounted on the display backplane 50;

In step S103, the light emitting diode 10 is attracted by the magnetic field of the magnetic device 60. Specifically, the controller 62 is used to energize the solenoid 61 so that the energized solenoid 61 generates a magnetic field to attract the light-emitting diode 10 from the transfer device 40 to the display back panel 50. At the same time, the transfer device 40 is heated by the heater 80. Specifically, the heater 80 is placed on the side of the transfer device 40 away from the light emitting diode 10. The heater 80 heats the transfer device 40 to increase the temperature of the first adhesive layer 41. Therefore, the viscosity of the first adhesive layer 41 is reduced, so that the viscosity of the first adhesive layer 41 to the light-emitting diode 10 is less than the attraction force of the energized solenoid 61 to the light-emitting diode 10, and the light-emitting diode 10 is adsorbed to the display back panel 50. The adsorbed light-emitting diode 10 is placed at the fixed point 501, and the two electrodes 11 of the light-emitting diode 10 are in contact with the fixed point 501;

Step S105, using the heating platform 70 to heat the display back plate 50 to melt the fixed point 501. The fixed point 501 after heating and melting is combined with the two electrodes 11 of the light-emitting diode 10 to fix the light-emitting diode 10 on the display back plate 50.

Please refer to FIG. 5 and FIG. 7 in combination, which are schematic diagrams of the mass transfer of the second specific embodiment provided by the first embodiment of the present invention. The difference between the mass transfer process provided by the second embodiment and the mass transfer process provided by the first embodiment is that the light-emitting diode 10 is vertical, that is, the two electrodes 11 of the light-emitting diode 10 are located on the side of the light-emitting diode 10, respectively. The first end surface 101 and the second end surface 102. The light emitting diode 10 is adsorbed to the display backplane 50 and placed at the fixed point 501, and the electrode 11 on the second end surface 102 of the light emitting diode 10 is in contact with the fixed point 501. The fixed point 501 after heating and melting is combined with the electrode 11 of the second end surface 102 of the light-emitting diode 10 to fix the light-emitting diode 10 to the display back plate 50. The other processes of the mass transfer provided in the second specific embodiment are basically the same as the process of mass transfer provided in the first specific embodiment, and will not be repeated here.

In the above embodiment, by using the characteristics of the energized solenoid 61 that can generate a magnetic field, when the light-emitting diode 10 is transferred to the display back panel 50, the magnetic light-emitting diode 10 is directly adsorbed to the display back panel 50 from the transfer device 40 This effectively avoids the phenomenon that the light-emitting diode 10 is broken or damaged due to pressure and other problems during the transfer process. At the same time, since the first adhesive layer 41 is made of pyrolytic glue, its viscosity decreases after being heated, so it is only necessary to apply a small current to the solenoid 61 to adsorb the light-emitting diode 10 to the display backplane 50. The method of using the first adhesive layer 41 to fix the light-emitting diode 10 on the transfer substrate 42 avoids the traditional complex weakening structure and improves the manufacturing efficiency of the light-emitting diode display screen.

Please refer to FIG. 12, which is a schematic diagram of the mass transfer process provided by the second embodiment of the present invention. The mass transfer process provided by the second embodiment is different from the mass transfer process provided by the first embodiment in that each solenoid 61 includes a switch 610, and the switch 610 is used to control the corresponding solenoid 61 and The electrical connection of the power supply 62. When the solenoid 61 is energized by the controller 62, the electric connection between the solenoid 61 and the controller 62 is controlled by the switch 610, and the magnetic field generated by the energized solenoid 61 can attract the light-emitting diode 10. The light emitting diode 10 to be transferred is selectively adsorbed from the transfer device 40 to the display back plate 50 under the action of a magnetic field. The other processes of the mass transfer provided in the second embodiment are basically the same as the process of mass transfer provided in the first embodiment, and will not be repeated here.

In the above-mentioned embodiment, each solenoid 61 is provided with a switch 610, so that each solenoid 61 can be independently energized or de-energized, and the light-emitting diode 10 can be selectively attracted to the display backplane 50, thereby achieving Selective mass transfer.

Please refer to FIG. 13, which is a schematic diagram of the mass transfer process provided by the third embodiment of the present invention. The mass transfer process provided by the third embodiment is different from the mass transfer process provided by the second embodiment in that a plurality of protrusions 420 are arranged at intervals on the transfer substrate 42, and the protrusions 420 are fixed on the display backplane 50. The points 501 correspond one to one. The first adhesive layer 41 is coated on the plurality of protrusions 420. The transfer device 40 is attached to the transfer substrate 42 at intervals by the light emitting diodes 10 grabbed by the first adhesive layer 41 coated on the protrusion 420. The other processes of the mass transfer provided in the third embodiment are basically the same as the process of the mass transfer provided in the second embodiment, and will not be repeated here.

In the above embodiment, a plurality of protrusions 420 are provided on the transfer substrate 42 so that when the light-emitting diode 10 is transferred to the display backplane 50, the light-emitting diode 10 can be accurately aligned with the position to be transferred on the display backplane 50. At the same time, it also avoids the displacement of other unabsorbed light-emitting diodes 10 during the process of selectively attracting the light-emitting diodes 10 by the magnetic device 60.

Please refer to FIG. 14, which is a schematic diagram of the mass transfer process provided by the fourth embodiment of the present invention. The mass transfer process provided by the fourth embodiment is different from the mass transfer process provided by the third embodiment in that the magnetic device 60 includes a plurality of magnets 63 arranged at intervals, and the magnets 63 are fixed on the display back plate 50. The points 501 correspond one to one. The outer side of each magnet 63 is covered with a diamagnetic sleeve 631, and the diamagnetic sleeve 631 can prevent the magnetic fields generated by the magnets 63 from interfering with each other. The magnetic field generated by the magnet 63 can attract the light emitting diode 10. The light emitting diode 10 is attracted from the transfer device 40 to the display back plate 50 under the action of a magnetic field. The other processes of the mass transfer provided by the fourth embodiment are basically the same as the process of the mass transfer provided by the third embodiment, and will not be repeated here.

Please refer to FIG. 8 and FIG. 10 in combination, which are schematic diagrams of the mass transfer sub-process of the first specific embodiment provided by the first embodiment of the present invention. The sub-process of mass transfer is used to transfer the light-emitting diode 10 from the original substrate 20 to the transfer device 40. The step of transferring the light-emitting diode 10 to the transfer device 40 specifically includes:

In step S201, the temporary substrate 30 coated with the second adhesive layer 31 is used to paste the light-emitting diodes 10 generated on the original substrate 20 at intervals to the temporary substrate 30. Specifically, the light emitting diodes 10 are generated on the original substrate 20 at intervals, and the first end surface 101 of the light emitting diode 10 faces the original substrate 20. The temporary substrate 30 coated with the second adhesive layer 31 is placed above the original substrate 20 with the second adhesive layer 31 facing the light emitting diode 10. The temporary substrate 30 is moved in the direction of the light-emitting diode 10 so that the light-emitting diode 10 is attached to the temporary substrate 30 through the second adhesive layer 31. Wherein, the second adhesive layer 31 is a pyrolytic glue, the viscosity of which decreases with the increase of temperature;

In step S203, the original substrate 20 is peeled off. Specifically, the laser device 90 is placed on the side of the original substrate 20 away from the light emitting diode 10, and the laser device 90 irradiates the original substrate 20 with laser light to peel off the original substrate 20;

In step S205, the light emitting diode 10 is grasped by the transfer device 40. Specifically, the transfer substrate 42 coated with the first adhesive layer 41 is placed above the temporary substrate 30 with the first adhesive layer 41 facing the light emitting diode 10. Move the transfer device 40 in the direction of the light emitting diode 10 so that the first adhesive layer 41 is in contact with the light emitting diode 10. At the same time, the temporary substrate 30 is heated by the heater 80. Specifically, the heater 80 is placed on the side of the temporary substrate 30 away from the light emitting diode 10. The heater 80 heats the temporary substrate 30 to increase the temperature of the second adhesive layer 31. As a result, the viscosity of the second adhesive layer 31 is reduced, so that the viscosity of the second adhesive layer 31 to the light-emitting diode 10 is smaller than that of the first adhesive layer 41 to the light-emitting diode 10, and the light-emitting diode 10 is grasped by the transfer device 40 to peel off the temporary substrate 30.

Please refer to FIG. 9 and FIG. 11, which are schematic diagrams of the mass transfer sub-process of the second specific embodiment provided by the first embodiment of the present invention. The sub-process of mass transfer is used to transfer the light-emitting diode 10 from the original substrate 20 to the transfer device 40. The step of transferring the light-emitting diode 10 to the transfer device 40 specifically includes:

In step S301, the transfer device 40 is used to capture the light-emitting diodes 10 generated on the native substrate 20 at intervals. Specifically, the light-emitting diodes 10 are generated on the original substrate 20 at intervals, and the second end surface 102 of the light-emitting diode 10 faces the original substrate 20. The transfer substrate 42 coated with the first adhesive layer 41 is placed above the original substrate 20 with the first adhesive layer 41 facing the light emitting diode 10. Move the transfer device 40 in the direction of the light-emitting diode 10, so that the light-emitting diode 10 is attached to the transfer substrate 40 through the first adhesive layer 41;

In step S303, the original substrate 20 is peeled off. Specifically, the laser device 90 is placed on the side of the original substrate 20 away from the light emitting diode 10, and the laser device 90 irradiates the original substrate 20 with laser light to peel off the original substrate 20.

Please refer to FIG. 15 and FIG. 16 in combination, which are schematic diagrams of the mass transfer sub-process provided by the fifth embodiment of the present invention. The mass transfer sub-process provided in the fifth embodiment is different from the mass transfer sub-process provided in the first embodiment in that the mass transfer sub-process provided in the fifth embodiment further includes:

In step S204, the etching device 100 is used to remove the second adhesive layer 31 between the light emitting diodes 10. Specifically, the etching device 100 is placed above the temporary substrate 30 and facing the light-emitting diode 10, and the second adhesive layer 31 between the light-emitting diodes 10 is removed by dry etching, so that only the second adhesive layer 31 is left under the light-emitting diode 10 . The light-emitting diodes 10 pasted on the temporary substrate 30 through the second adhesive layer 31 correspond to the plurality of protrusions 420 of the transfer substrate 42 in a one-to-one correspondence.

The other processes of the mass transfer sub-process provided in the fifth embodiment are basically the same as the mass transfer sub-processes provided in the first embodiment, and will not be repeated here.

In the above embodiment, the second adhesive layer 31 between the light-emitting diodes 10 is removed, so that the light-emitting diode 10 can be accurately aligned with the protrusion 420 on the transfer device 40 when the transfer device 40 grasps the light-emitting diode 10 The alignment also avoids the problem of offset of the light-emitting diode 10.

Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. In this way, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies, the present invention is also intended to include these modifications and variations.

The above-listed are only preferred embodiments of the present invention, which of course cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention still fall within the scope of the present invention.

Claims

A mass transfer system for light-emitting diodes, characterized in that the mass transfer system includes:

A transfer device for grabbing the light-emitting diode to the display backplane; and

The magnetic device has a magnetic field for attracting the light-emitting diode, and the light-emitting diode is selectively adsorbed from the transfer device to the display back plate under the action of the magnetic field.

To

2. The mass transfer system according to claim 1, wherein the magnetic device is an electromagnetic device, and the electromagnetic device is provided with:

Controller; and

A plurality of solenoids arranged at intervals, the plurality of solenoids are electrically connected to the controller, the solenoids are energized or de-energized by the controller, and each solenoid generates magnetic field.

To

3. The mass transfer system according to claim 2, wherein each solenoid includes a switch, and the switch is used to control the electric power of the corresponding solenoid and the controller. connection.

To

4. The mass transfer system of claim 1, wherein the magnetic device comprises a plurality of magnets arranged at intervals.

To

5. The mass transfer system of claim 1, wherein the transfer device comprises:

Transfer substrate

The first adhesive layer is coated on the transfer substrate, and the light-emitting diode is grasped by the first adhesive layer and attached to the transfer substrate.

To

6. The mass transfer system of claim 5, wherein the first adhesive layer is a pyrolysis glue, and the viscosity of the pyrolysis glue decreases with increasing temperature.

To

7. The mass transfer system of claim 6, wherein the mass transfer system further comprises:

A heater, the heater is arranged on a side of the transfer device away from the light-emitting diode, and the heater is used to heat the transfer device when the light-emitting diode is adsorbed to the display backplane.

To

8. The mass transfer system of claim 1, wherein the mass transfer system further comprises:

A heating platform, the heating platform is arranged between the display backplane and the magnetic device and is attached to the display backplane, the heating platform is used to heat the fixed points provided on the display backplane, The fixing point becomes molten after being heated, and is used to fix the light-emitting diode to the display backplane.

To

9. A mass transfer method of light emitting diodes, characterized in that the mass transfer method is applied to a mass transfer system of light emitting diodes, the mass transfer system includes a transfer device and a magnetic device, the mass transfer Methods include:

Use the transfer device to map the light-emitting diodes to the fixed points on the display backplane where the light-emitting diodes are to be mounted in a one-to-one correspondence; and

The magnetic field of the magnetic device is used to attract the light-emitting diode to selectively adsorb the light-emitting diode from the transfer device to the display backplane.

To

10. The mass transfer method according to claim 9, wherein the one-to-one correspondence between the light-emitting diodes and the fixed points using the transfer device specifically comprises:

Coating a first adhesive layer on the transfer substrate of the transfer device, grabbing the light-emitting diode through the first adhesive layer and pasting on the transfer substrate.

To

11. The mass transfer method according to claim 9, wherein said using said transfer device to associate said light-emitting diodes with said fixed points one-to-one further comprises:

Coating a first adhesive layer on the plurality of protrusions of the transfer device, the plurality of protrusions are arranged on the transfer substrate of the transfer device at intervals, and the light-emitting diode is grasped by the first adhesive layer and pasted on The transfer substrate.

To

12. The mass transfer method of claim 9, wherein before transferring the light-emitting diodes to the transfer device, the mass transfer method further comprises:

A temporary substrate coated with a second adhesive layer is used to paste the light-emitting diodes generated on the original substrate at intervals to the temporary substrate. A diode and a second end face set back facing the first end face of the transfer device;

Peeling off the native substrate;

The light emitting diode is grasped by the transfer device, so that the light emitting diode peels off the temporary substrate.

To

13. The mass transfer method of claim 12, wherein after peeling off the native substrate, the mass transfer method further comprises:

An etching device is used to remove the second adhesive layer between the light-emitting diodes.

To

14. The mass transfer method of claim 12, wherein the second adhesive layer is a pyrolysis glue, and the viscosity of the pyrolysis glue decreases with increasing temperature.

To

15. The mass transfer method of claim 14, wherein when the light-emitting diode is grasped by the transfer device, the mass transfer method further comprises:

The temporary substrate is heated by a heater to reduce the viscosity of the second adhesive layer.

To

16. The mass transfer method of claim 9, wherein before transferring the light-emitting diodes to the transfer device, the mass transfer method further comprises:

The transfer device is used to capture the light-emitting diodes generated on the original substrate at intervals, wherein the light-emitting diodes are vertical, and the two electrodes of the light-emitting diodes are respectively located on the first end surface and the first end surface of the light-emitting diode facing the transfer device. A second end surface arranged opposite to the first end surface;

Peel off the native substrate.

To

17. The mass transfer method according to claim 12 or 16, wherein said peeling off said native substrate specifically comprises:

A laser device is used to irradiate the original substrate with laser light to peel off the original substrate.

To

18. The mass transfer method of claim 9, wherein selectively adsorbing the light-emitting diodes from the transfer device to the display backplane, and the mass transfer method further comprises:

A heating platform is used to heat the display backplane to melt the fixing points, so that the light-emitting diodes are fixed on the display backplane.