WO2021128639A1 - Array substrate, display panel, and electrical test method - Google Patents

Array substrate, display panel, and electrical test method Download PDF

Info

Publication number
WO2021128639A1
WO2021128639A1 PCT/CN2020/082720 CN2020082720W WO2021128639A1 WO 2021128639 A1 WO2021128639 A1 WO 2021128639A1 CN 2020082720 W CN2020082720 W CN 2020082720W WO 2021128639 A1 WO2021128639 A1 WO 2021128639A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electrode layer
array substrate
electrode
thin film
Prior art date
Application number
PCT/CN2020/082720
Other languages
French (fr)
Chinese (zh)
Inventor
安喜锋
潘鹏鹏
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Publication of WO2021128639A1 publication Critical patent/WO2021128639A1/en

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306Details
    • G02F1/1309Repairing; Testing
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

Definitions

  • This application relates to the field of display technology, and specifically to an array substrate, a display panel, and an electrical test method for the array substrate.
  • LTPS liquid crystal display panels With the gradual popularity of low temperature poly-silicon (LTPS) liquid crystal display panels, the circuit design of the thin film transistor layer has become more and more refined, and the pixel density (pixels per inch, PPI) of small-sized panels has gradually increased.
  • LTPS liquid crystal The display panel needs to undergo multiple manufacturing processes in the array substrate manufacturing process. During the manufacturing process, a dummy thin-film transistor (dummy thin-film transistor) exists at the outermost periphery of the thin-film transistor layer. transistors), only as a reference boundary when printing polyimide (PI) film, and does not play a display role.
  • PI polyimide
  • the purpose of this application is to provide an array substrate, a display panel, and an electrical test method.
  • the common electrode layer of the outermost thin film transistor of the array substrate is designed without openings, which can improve the gate of the outermost thin film transistor.
  • this application proposes an array substrate, including: a substrate including a display area and an electrical test area; a thin film transistor layer provided on the substrate, and the thin film transistor layer includes a thin film transistor layer provided on the electrical test area; Area of the test thin film transistor, wherein the test thin film transistor includes an active layer, a gate layer, and an electrode layer, one end of the active layer is connected to the first electrode of the electrode layer, and the active layer The other end is suspended, that is, not connected to the second electrode of the electrode layer; the planarization layer is provided on the electrode layer of the thin film transistor, wherein the planarization layer corresponds to the first electrode of the electrode layer A first via is provided; a common electrode layer is provided on a side of the planarization layer away from the electrode layer, and the common electrode layer is connected to the first electrode of the electrode layer through the first via.
  • the active layer may be amorphous silicon, low-temperature polysilicon, or organic semiconductor.
  • the electrode layer of the test thin film transistor further includes a second electrode, wherein the second electrode is suspended, that is, not connected to one end of the active layer.
  • the test thin film transistor further includes an insulating protection layer, the insulating protection layer is disposed on the surface of the common electrode layer away from the common electrode layer, and a second electrode layer, the second electrode layer is disposed on the surface of the common electrode layer.
  • the second electrode layer is connected to the electrode layer through a via hole in the display area to form a pixel electrode.
  • the test thin film transistor further includes an interlayer dielectric layer disposed between the active layer and the electrode layer, wherein the interlayer dielectric layer is provided with a second via hole, and the The first electrode is connected to one end of the active layer through the second via hole.
  • the gate layer of the test thin film transistor is provided between the active layer and the electrode layer, wherein a gate insulating layer is provided between the gate layer and the active layer,
  • the second via hole penetrates the interlayer dielectric layer and the gate insulating layer.
  • the gate layer of the test thin film transistor is provided on the surface of the active layer on the side away from the electrode layer, wherein a gate insulating layer is provided between the gate layer and the active layer ,
  • the second via hole penetrates the interlayer dielectric layer.
  • the common electrode layer and the second electrode layer are composed of indium tin oxide.
  • the present application additionally provides a display panel, including the aforementioned array substrate, and further including a color filter substrate disposed opposite to the array substrate, wherein a third surface of the color filter substrate close to the array substrate is provided.
  • the present application additionally provides an electrical test method for the aforementioned display panel, including: providing the array substrate; energizing the array substrate; performing electrical test on a plurality of block-shaped common electrodes in the electrical test area. Test to obtain multiple sets of voltage values; confirm whether there are abnormal values among the multiple sets of voltage values, the abnormal values can be defined as 1-3 standard deviations higher than the average of the multiple sets of voltage values, for example And if an abnormal value occurs in any of the plurality of sets of voltage values, it is determined that the array substrate is abnormal.
  • the gate insulator thin film at the film transistor falls off between the gate layer and the active layer, the gate layer and the active layer are short-circuited to cause leakage, and the first electrode leaks to the common electrode layer, This causes the bulk common electrode layer voltage to rise, so it can be detected by the electrical testing machine in advance.
  • the poor display of the module segment caused by the short circuit between the gate electrode line and the active layer of the test thin film transistor was reduced from 1.1% to 0%.
  • FIG. 1 is a schematic top view of an array substrate according to an embodiment of the application.
  • FIG. 2 is a schematic cross-sectional view of an electrical test area of an array substrate according to an embodiment of the application
  • FIG. 3 is a schematic diagram of a display panel according to an embodiment of the application.
  • FIG. 4 is a flowchart of a method for electrical testing of an array substrate according to an embodiment of the application.
  • the common electrode layer of the Dummy TFT is designed to facilitate the early detection of the electrical test machine and avoid losses in the module stage.
  • FIG. 1 is a schematic top view of an array substrate according to an embodiment of the application, including a display area 1001 and an electrical test area 1002, wherein the second electrode layer 113 and the common electrode layer 111 (a And refer to Figure 2) Not drilled.
  • FIG. 2 is a schematic cross-sectional view of an electrical test area of an array substrate according to an embodiment of the application.
  • the array substrate includes:
  • the electrode layer (109, 116) is, for example, a source electrode and a drain electrode.
  • An electrode layer, one end of the active layer 104 is connected to the first electrode 109 of the electrode layer, and the other end of the active layer 104 is suspended, that is, it is not connected to the second electrode 116 of the electrode layer;
  • the planarization layer 110 is provided on the electrode layers (109, 116) of the thin film transistor, wherein the planarization layer 110 is provided with a first via 114 corresponding to the first electrode 109 of the electrode layer; a common electrode layer 111. Located on the side of the planarization layer 110 away from the electrode layers (109, 116), the common electrode layer 111 is connected to the first electrode 109 of the electrode layer through the first via 114.
  • the current from the gate layer 106 is conducted to the common electrode layer through the active layer 104 and the first electrode 109 of the test thin film transistor. 111, and the voltage of the common electrode layer 111 in the electrical test area 1002 is increased.
  • the electrode layer of the test thin film transistor 900 further includes a second electrode 116, wherein the second electrode 116 is suspended, that is, not connected to the active layer 104.
  • the test thin film transistor 900 further includes an insulating protection layer 112 disposed on the surface of the common electrode layer 111 away from the common electrode layer 111, and a second electrode layer 113.
  • the second electrode layer 113 is disposed on the insulating protection layer 112; the second electrode layer 113 is connected to the electrode layers (109, 116) in the display area 1001 through via holes to form a pixel electrode.
  • the test thin film transistor 900 further includes an interlayer dielectric layer 107 composed of silicon nitride and a silicon layer between the active layer 104 and the electrode layer (109, 116).
  • the interlayer dielectric layer 108 composed of oxide, wherein the interlayer dielectric layer (107, 108) is provided with a second via 115, and the first electrode 109 passes through the second via 115 and the One end of the active layer 104 is connected.
  • the gate layer 106 of the test thin film transistor 900 is disposed between the active layer 104 and the electrode layer (109, 116), wherein the gate layer 106 is connected to the active layer (109, 116).
  • a gate insulating layer 105 composed of silicon oxide is also provided between the source layer 104, and the second via 115 penetrates the interlayer dielectric layer (107, 108) and the gate insulating layer 105.
  • the gate layer 106 of the test thin film transistor 900 is provided on the surface of the active layer 104 on the side away from the electrode layer (109, 116), wherein the gate layer 106 and the A gate insulating layer 105 is provided between the active layer 104, and the second via 115 penetrates the interlayer dielectric layer (107, 108).
  • the common electrode layer 111 and the second electrode layer 113 are composed of indium tin oxide.
  • FIG. 3 is a schematic diagram of a display panel 1 according to an embodiment of the application, including:
  • the array substrate 10 further includes a color filter substrate 20 disposed opposite to the array substrate 10, wherein a third electrode layer is provided on the surface of the color filter substrate 20 close to the side of the array substrate 10 201, wherein the common electrode layer 111 is connected to the third electrode layer 201.
  • FIG. 4 it is a flowchart of a method for performing electrical testing on an array substrate according to an embodiment of the application, and the method includes:
  • the abnormal value can be defined as, for example, 2 standard deviations higher than the average value of the plurality of sets of voltage values; and if any of the plurality of sets of voltage values has an abnormal value, it is determined that the The array substrate is abnormal.
  • the gate insulator film at the outermost thin film transistor falls off between the gate layer 106 and the active layer 104, because the gate layer 106 and the active layer 104 is short-circuited and leaked, and leaks to the common electrode layer 111 through the first electrode 109, causing the bulk common electrode layer 111 to increase in voltage, so it can be detected by the electrical testing machine in advance.
  • the poor display of the module segment caused by the short circuit between the gate electrode line and the active layer of the test thin film transistor was reduced from 1.1% to 0%.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

An array substrate (10), a display panel (1), and an electrical test method. The array substrate (10) comprises: a substrate (100), comprising a display area (1001) and an electrical test area (1002); a thin film transistor layer, which is disposed on the substrate (100) and which comprises a test thin film transistor (900) disposed in the electrical test area (1002), wherein the test thin film transistor (900) comprises an active layer (104), a gate layer (106), and an electrode layer (109, 116), one end of the active layer (104) is connected to a first electrode (109) of the electrode layer (109, 116), and the other end of the active layer (104) is suspended; a planarization layer (110), which is disposed on the electrode layer (109, 116) of the thin film transistor, a first via (114) being disposed at the first electrode (109) of the electrode layer (109, 116) corresponding to the planarization layer (110); and a common electrode layer (111), which is disposed on a side of the planarization layer (110) away from the electrode layer (109, 116) and which is connected, by means of the first via (114), to the first electrode (109) of the electrode layer (109, 116).

Description

阵列基板、显示面板、及电性测试方法Array substrate, display panel, and electrical testing method 技术领域Technical field
本申请涉及显示技术领域,具体涉阵列基板、显示面板和用于所述阵列基板的电性测试方法。This application relates to the field of display technology, and specifically to an array substrate, a display panel, and an electrical test method for the array substrate.
背景技术Background technique
随着低温多晶硅(low temperature poly-silicon,LTPS)液晶显示面板的逐渐普及,薄膜晶体管层的电路设计越来越精细,小尺寸面板的像素密度(pixels per inch,PPI)也逐渐增加,LTPS液晶显示面板在阵列基板制程段需进行多道制程。在制程中,薄膜晶体管层的最外围存在一条不作用的薄膜晶体管(dummy thin-film transistors),只作为聚酰亚胺(polyimide,PI)膜印刷时的参考边界,并不发挥显示作用。With the gradual popularity of low temperature poly-silicon (LTPS) liquid crystal display panels, the circuit design of the thin film transistor layer has become more and more refined, and the pixel density (pixels per inch, PPI) of small-sized panels has gradually increased. LTPS liquid crystal The display panel needs to undergo multiple manufacturing processes in the array substrate manufacturing process. During the manufacturing process, a dummy thin-film transistor (dummy thin-film transistor) exists at the outermost periphery of the thin-film transistor layer. transistors), only as a reference boundary when printing polyimide (PI) film, and does not play a display role.
技术问题technical problem
当最外围的一条不作用的薄膜晶体管(dummy thin-film transistors)的栅极绝缘层(gate insulator,GI)薄膜脱落在栅极层和有源层之间时,栅极层和有源层会因短路而漏电,导致显示画面出现水平线状的异常现象。但由于电性测试机台本身能力限制的问题,无法检测面板左右两侧约五个像素距离的区域,因此该问题无法被电性测试机台在薄膜晶体管制程完成后即时检测发现,而造成材料的浪费。When the gate insulator (GI) film of the outermost dummy thin-film transistors (dummy thin-film transistors) falls off between the gate layer and the active layer, the gate layer and the active layer will Electricity leakage due to short circuit causes horizontal line-shaped abnormalities on the display screen. However, due to the limitation of the capabilities of the electrical testing machine itself, it is impossible to detect the area at a distance of about five pixels on the left and right sides of the panel. Therefore, the problem cannot be detected by the electrical testing machine immediately after the thin film transistor manufacturing process is completed. Waste.
技术解决方案Technical solutions
本申请的目的在于提供一种阵列基板、显示面板、及电性测试方法,对于所述阵列基板的最外围的薄膜晶体管的公共电极层进行不开孔设计,可以提高最外围的薄膜晶体管的栅极层和有源层发生短路而漏电的异常检出率。The purpose of this application is to provide an array substrate, a display panel, and an electrical test method. The common electrode layer of the outermost thin film transistor of the array substrate is designed without openings, which can improve the gate of the outermost thin film transistor. The abnormal detection rate of leakage between the electrode layer and the active layer due to a short circuit.
为实现上述目的,本申请提出一种阵列基板,包括: 基板,包括显示区及电性测试区;薄膜晶体管层,设于所述基板上,所述薄膜晶体管层包括设于所述电性测试区的测试薄膜晶体管,其中,所述测试薄膜晶体管包括有源层、栅极层、及电极层,所述有源层的一端与所述电极层的第一电极相连,所述有源层的另一端悬空设置,即不与所述电极层的第二电极相连;平坦化层,设于所述薄膜晶体管的电极层上,其中,所述平坦化层对应所述电极层的第一电极处设有第一过孔;公共电极层,设在所述平坦化层远离所述电极层的一侧,所述公共电极层通过所述第一过孔与所述电极层的第一电极连接。In order to achieve the above objective, this application proposes an array substrate, including: a substrate including a display area and an electrical test area; a thin film transistor layer provided on the substrate, and the thin film transistor layer includes a thin film transistor layer provided on the electrical test area; Area of the test thin film transistor, wherein the test thin film transistor includes an active layer, a gate layer, and an electrode layer, one end of the active layer is connected to the first electrode of the electrode layer, and the active layer The other end is suspended, that is, not connected to the second electrode of the electrode layer; the planarization layer is provided on the electrode layer of the thin film transistor, wherein the planarization layer corresponds to the first electrode of the electrode layer A first via is provided; a common electrode layer is provided on a side of the planarization layer away from the electrode layer, and the common electrode layer is connected to the first electrode of the electrode layer through the first via.
所述有源层可以是非晶硅、低温多晶硅、也可以为有机物半导体等。其中,当位于所述电性测试区的栅极层与所述有源层发生短路时,来自所述栅极层的电流经由所述有源层、所述测试薄膜晶体管的第一电极,传导至所述公共电极层,而拉高所述公共电极层在所述电性测试区的电压。The active layer may be amorphous silicon, low-temperature polysilicon, or organic semiconductor. Wherein, when a short-circuit occurs between the gate layer located in the electrical test area and the active layer, the current from the gate layer is conducted through the active layer and the first electrode of the test thin film transistor To the common electrode layer, and raise the voltage of the common electrode layer in the electrical test area.
较佳地,所述测试薄膜晶体管的电极层还包括第二电极,其中,所述第二电极悬空设置,即不与所述有源层的一端相连。Preferably, the electrode layer of the test thin film transistor further includes a second electrode, wherein the second electrode is suspended, that is, not connected to one end of the active layer.
较佳地,所述测试薄膜晶体管还包括绝缘保护层,所述绝缘保护层设于所述公共电极层远离所述公共电极层表面,以及第二电极层,所述第二电极层设于所述绝缘保护层上,所述第二电极层在显示区通过过孔与电极层相连接,形成像素电极。Preferably, the test thin film transistor further includes an insulating protection layer, the insulating protection layer is disposed on the surface of the common electrode layer away from the common electrode layer, and a second electrode layer, the second electrode layer is disposed on the surface of the common electrode layer. On the insulating protection layer, the second electrode layer is connected to the electrode layer through a via hole in the display area to form a pixel electrode.
较佳地,所述测试薄膜晶体管还包括设于所述有源层与所述电极层之间的层间介电层,其中,所述层间介电层设有第二过孔,所述第一电极通过所述第二过孔与所述有源层的一端连接。Preferably, the test thin film transistor further includes an interlayer dielectric layer disposed between the active layer and the electrode layer, wherein the interlayer dielectric layer is provided with a second via hole, and the The first electrode is connected to one end of the active layer through the second via hole.
较佳地,所述测试薄膜晶体管的栅极层设于所述有源层与所述电极层之间,其中,所述栅极层与所述有源层之间设有栅极绝缘层,所述第二过孔贯穿所述层间介电层与所述栅极绝缘层。Preferably, the gate layer of the test thin film transistor is provided between the active layer and the electrode layer, wherein a gate insulating layer is provided between the gate layer and the active layer, The second via hole penetrates the interlayer dielectric layer and the gate insulating layer.
较佳地,所述测试薄膜晶体管的栅极层设于所述有源层远离所述电极层一侧的表面,其中所述栅极层与所述有源层之间设有栅极绝缘层,所述第二过孔贯穿所述层间介电层。Preferably, the gate layer of the test thin film transistor is provided on the surface of the active layer on the side away from the electrode layer, wherein a gate insulating layer is provided between the gate layer and the active layer , The second via hole penetrates the interlayer dielectric layer.
较佳地,所述公共电极层与所述第二电极层由氧化铟锡组成。Preferably, the common electrode layer and the second electrode layer are composed of indium tin oxide.
本申请另外提供一种显示面板,包括前述的阵列基板,还包括与所述阵列基板相对设置的彩膜基板,其中,所述彩膜基板接近所述阵列基板一侧的表面上设有第三电极层,其中,所述公共电极层与所述第三电极层连接。The present application additionally provides a display panel, including the aforementioned array substrate, and further including a color filter substrate disposed opposite to the array substrate, wherein a third surface of the color filter substrate close to the array substrate is provided. The electrode layer, wherein the common electrode layer is connected to the third electrode layer.
本申请另外提供一种用于前述显示面板的电性测试方法,包括:提供一所述阵列基板;对所述阵列基板通电;对所述电性测试区的多个块状的公共电极进行电性测试以获得多组电压值;确认所述多组电压值之中有无出现异常值,所述异常值例如可定义为较所述多组电压值的平均值高出1-3个标准差;以及若所述多组电压值中之任一出现异常值,则判定所述阵列基板为异常。The present application additionally provides an electrical test method for the aforementioned display panel, including: providing the array substrate; energizing the array substrate; performing electrical test on a plurality of block-shaped common electrodes in the electrical test area. Test to obtain multiple sets of voltage values; confirm whether there are abnormal values among the multiple sets of voltage values, the abnormal values can be defined as 1-3 standard deviations higher than the average of the multiple sets of voltage values, for example And if an abnormal value occurs in any of the plurality of sets of voltage values, it is determined that the array substrate is abnormal.
有益效果Beneficial effect
通过本申请实施例的阵列基板设计,当最外围薄Through the design of the array substrate of the embodiment of this application, when the outermost periphery is thin
膜晶体管处的栅极绝缘层(gate insulator)薄膜脱落在栅极层和有源层之间时,因栅极层和有源层发生短路而漏电,并通过第一电极漏电至公共电极层,造成该处的块状公共电极层电压上升,因此可提前通过电性测试机台检出。模组段因测试薄膜晶体管的栅电极线和有源层短路造成的显示不良由1.1%降至0%。When the gate insulator thin film at the film transistor falls off between the gate layer and the active layer, the gate layer and the active layer are short-circuited to cause leakage, and the first electrode leaks to the common electrode layer, This causes the bulk common electrode layer voltage to rise, so it can be detected by the electrical testing machine in advance. The poor display of the module segment caused by the short circuit between the gate electrode line and the active layer of the test thin film transistor was reduced from 1.1% to 0%.
附图说明Description of the drawings
图1为本申请实施例的阵列基板的俯视示意图;FIG. 1 is a schematic top view of an array substrate according to an embodiment of the application;
图2为本申请实施例的阵列基板的电性测试区的截面示意图;2 is a schematic cross-sectional view of an electrical test area of an array substrate according to an embodiment of the application;
图3为本申请实施例的显示面板示意图;以及FIG. 3 is a schematic diagram of a display panel according to an embodiment of the application; and
图4为本申请实施例的对阵列基板进行电性测试的方法流程图。FIG. 4 is a flowchart of a method for electrical testing of an array substrate according to an embodiment of the application.
本发明的实施方式Embodiments of the present invention
以下实施例的说明是参考附加的图示,用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语,例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本申请,而非用以限制本申请。The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that can be implemented in the present application. The directional terms mentioned in this application, such as [Up], [Down], [Front], [Back], [Left], [Right], [Inner], [Outer], [Side], etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to illustrate and understand the application, rather than to limit the application.
以下将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of this application.
习知的阵列基板,其最外围存在一条无作用的薄膜晶体管(Dummy TFT),其中公共电极层在第二电极层与第一电极相接处的上方过孔周围附近断开,而不与第一电极相接,当该处的闸极介电质层(gate insulator)膜脱落在栅极走线与有源层之间时,会导致栅极层与有源层发生短路而漏电,产品模组完成后会导致显示画面中出现水平线状的显示异常,但无法被电性测试机台在薄膜晶体管侧制程完成时提前检测出来。针对此问题,对Dummy TFT的公共电极层进行设计,以利于电性测试机台提前检出,避免流入模组阶段产生损失。In the conventional array substrate, there is a dummy TFT on the outermost periphery, and the common electrode layer is disconnected near the upper via hole where the second electrode layer meets the first electrode, and is not connected to the first electrode. When an electrode is connected, when the gate insulator film at the place falls off between the gate traces and the active layer, it will cause a short circuit between the gate layer and the active layer, resulting in leakage. After the group is completed, a horizontal line-shaped display abnormality will appear in the display screen, but it cannot be detected in advance by the electrical testing machine when the thin film transistor side process is completed. In response to this problem, the common electrode layer of the Dummy TFT is designed to facilitate the early detection of the electrical test machine and avoid losses in the module stage.
请参考图1,为本申请实施例的阵列基板俯视示意图,包括显示区1001和电性测试区1002,其中在电性测试区1002的开口990的第二电极层113与公共电极层111(一并参照图2)未被钻开。Please refer to FIG. 1, which is a schematic top view of an array substrate according to an embodiment of the application, including a display area 1001 and an electrical test area 1002, wherein the second electrode layer 113 and the common electrode layer 111 (a And refer to Figure 2) Not drilled.
请参考图2,为本申请实施例的阵列基板的电性测试区的截面示意图,所述阵列基板包括:Please refer to FIG. 2, which is a schematic cross-sectional view of an electrical test area of an array substrate according to an embodiment of the application. The array substrate includes:
玻璃基板100;设于玻璃基板100上的遮光层101;薄膜晶体管层,设于所述玻璃基板100上,所述薄膜晶体管层包括设于所述电性测试区1002的测试薄膜晶体管900(请一并参考图1),其中,所述测试薄膜晶体管900包括有源层104、栅极层106、及电极层(109,116),所述电极层(109,116)例如为源极和漏极层,所述有源层104的一端与所述电极层的第一电极109相连,所述有源层104的另一端悬空设置,即不与所述电极层的第二电极116相连;平坦化层110,设于所述薄膜晶体管的电极层(109,116)上,其中,所述平坦化层110对应所述电极层的第一电极109处设有第一过孔114;公共电极层111,设在所述平坦化层110远离所述电极层(109,116)的一侧,所述公共电极层111通过所述第一过孔114与所述电极层的第一电极109连接。其中,当位于电性测试区1002的栅极层106与有源层104发生短路时,来自栅极层106的电流经由有源层104、测试薄膜晶体管的第一电极109,传导至公共电极层111,而拉高公共电极层111在电性测试区1002的电压。The glass substrate 100; the light shielding layer 101 provided on the glass substrate 100; the thin film transistor layer is provided on the glass substrate 100, and the thin film transistor layer includes a test thin film transistor 900 (please 1), wherein the test thin film transistor 900 includes an active layer 104, a gate layer 106, and an electrode layer (109, 116). The electrode layer (109, 116) is, for example, a source electrode and a drain electrode. An electrode layer, one end of the active layer 104 is connected to the first electrode 109 of the electrode layer, and the other end of the active layer 104 is suspended, that is, it is not connected to the second electrode 116 of the electrode layer; The planarization layer 110 is provided on the electrode layers (109, 116) of the thin film transistor, wherein the planarization layer 110 is provided with a first via 114 corresponding to the first electrode 109 of the electrode layer; a common electrode layer 111. Located on the side of the planarization layer 110 away from the electrode layers (109, 116), the common electrode layer 111 is connected to the first electrode 109 of the electrode layer through the first via 114. Wherein, when the gate layer 106 and the active layer 104 in the electrical test area 1002 are short-circuited, the current from the gate layer 106 is conducted to the common electrode layer through the active layer 104 and the first electrode 109 of the test thin film transistor. 111, and the voltage of the common electrode layer 111 in the electrical test area 1002 is increased.
于一具体实施例,所述测试薄膜晶体管900的电极层还包括第二电极116,其中,所述第二电极116悬空设置,即不与所述有源层104相连。In a specific embodiment, the electrode layer of the test thin film transistor 900 further includes a second electrode 116, wherein the second electrode 116 is suspended, that is, not connected to the active layer 104.
于一具体实施例,所述测试薄膜晶体管900还包括绝缘保护层112,所述绝缘保护层112设于所述公共电极层111远离所述公共电极层111一侧的表面,以及第二电极层113,所述第二电极层113设于所述绝缘保护层112上;所述第二电极层113在显示区1001通过过孔与电极层(109,116)相连接,形成像素电极。In a specific embodiment, the test thin film transistor 900 further includes an insulating protection layer 112 disposed on the surface of the common electrode layer 111 away from the common electrode layer 111, and a second electrode layer 113. The second electrode layer 113 is disposed on the insulating protection layer 112; the second electrode layer 113 is connected to the electrode layers (109, 116) in the display area 1001 through via holes to form a pixel electrode.
于一具体实施例,所述测试薄膜晶体管900还包括设于所述有源层104与所述电极层(109,116)之间,由硅氮化物所组成的层间介电层107及硅氧化物所组成的层间介电层108,其中,所述层间介电层(107,108)设有第二过孔115,所述第一电极109通过所述第二过孔115与所述有源层104的一端连接。In a specific embodiment, the test thin film transistor 900 further includes an interlayer dielectric layer 107 composed of silicon nitride and a silicon layer between the active layer 104 and the electrode layer (109, 116). The interlayer dielectric layer 108 composed of oxide, wherein the interlayer dielectric layer (107, 108) is provided with a second via 115, and the first electrode 109 passes through the second via 115 and the One end of the active layer 104 is connected.
于一具体实施例,所述测试薄膜晶体管900的栅极层106设于所述有源层104与所述电极层(109,116)之间,其中,所述栅极层106与所述有源层104之间还设有硅氧化物所组成的栅极绝缘层105,所述第二过孔115贯穿所述层间介电层(107,108)与所述栅极绝缘层105。In a specific embodiment, the gate layer 106 of the test thin film transistor 900 is disposed between the active layer 104 and the electrode layer (109, 116), wherein the gate layer 106 is connected to the active layer (109, 116). A gate insulating layer 105 composed of silicon oxide is also provided between the source layer 104, and the second via 115 penetrates the interlayer dielectric layer (107, 108) and the gate insulating layer 105.
于一具体实施例,所述测试薄膜晶体管900的栅极层106设于所述有源层104远离所述电极层(109,116)一侧的表面,其中所述栅极层106与所述有源层104之间设有栅极绝缘层105,所述第二过孔115贯穿所述层间介电层(107,108)。In a specific embodiment, the gate layer 106 of the test thin film transistor 900 is provided on the surface of the active layer 104 on the side away from the electrode layer (109, 116), wherein the gate layer 106 and the A gate insulating layer 105 is provided between the active layer 104, and the second via 115 penetrates the interlayer dielectric layer (107, 108).
于一具体实施例,所述公共电极层111与所述第二电极层113由氧化铟锡组成。In a specific embodiment, the common electrode layer 111 and the second electrode layer 113 are composed of indium tin oxide.
图3为本申请实施例的显示面板1的示意图,包括:FIG. 3 is a schematic diagram of a display panel 1 according to an embodiment of the application, including:
如前所述的阵列基板10,还包括与所述阵列基板10相对设置的彩膜基板20,其中,所述彩膜基板20接近所述阵列基板10一侧的表面上设有第三电极层201,其中,公共电极层111与所述第三电极层201连接。As mentioned above, the array substrate 10 further includes a color filter substrate 20 disposed opposite to the array substrate 10, wherein a third electrode layer is provided on the surface of the color filter substrate 20 close to the side of the array substrate 10 201, wherein the common electrode layer 111 is connected to the third electrode layer 201.
如图4所示,为本申请实施例对阵列基板进行电性测试的方法流程图,所述方法包括:As shown in FIG. 4, it is a flowchart of a method for performing electrical testing on an array substrate according to an embodiment of the application, and the method includes:
提供一所述阵列基板;对所述阵列基板通电;对所述电性测试区的多个块状公共电级进行电性测试以获得多组电压值;确认所述多组电压值之中有无出现异常值,所述异常值例如可定义为较所述多组电压值的平均值高出2个标准差;以及若所述多组电压值中之任一出现异常值,则判定所述阵列基板为异常。Provide an array substrate; energize the array substrate; conduct an electrical test on a plurality of block-shaped common electrical levels in the electrical test area to obtain multiple sets of voltage values; confirm that there are any of the multiple sets of voltage values No abnormal value occurs. The abnormal value can be defined as, for example, 2 standard deviations higher than the average value of the plurality of sets of voltage values; and if any of the plurality of sets of voltage values has an abnormal value, it is determined that the The array substrate is abnormal.
通过本申请实施例的阵列基板设计,当最外围薄膜晶体管处的栅极绝缘层(gate insulator)薄膜脱落在栅极层106和有源层104之间时,因栅极层106和有源层104发生短路而漏电,并通过第一电极109漏电至公共电极层111,造成该处的块状公共电极层111电压上升,因此可提前通过电性测试机台检出。模组段因测试薄膜晶体管的栅电极线和有源层短路造成的显示不良由1.1%降至0%。Through the design of the array substrate of the embodiment of the present application, when the gate insulator film at the outermost thin film transistor falls off between the gate layer 106 and the active layer 104, because the gate layer 106 and the active layer 104 is short-circuited and leaked, and leaks to the common electrode layer 111 through the first electrode 109, causing the bulk common electrode layer 111 to increase in voltage, so it can be detected by the electrical testing machine in advance. The poor display of the module segment caused by the short circuit between the gate electrode line and the active layer of the test thin film transistor was reduced from 1.1% to 0%.
综上所述,虽然本申请已以优选实施例揭露如上,但上述优选实施例并非用以限制本申请,本领域的普通技术人员,在不脱离本申请的精神和范围内,均可作各种更动与润饰,因此本申请的保护范围以权利要求界定的范围为准。In summary, although the application has been disclosed as above in preferred embodiments, the above-mentioned preferred embodiments are not intended to limit the application, and those of ordinary skill in the art can make various decisions without departing from the spirit and scope of the application. Such changes and modifications, so the protection scope of this application is subject to the scope defined by the claims.

Claims (10)

  1. 一种阵列基板,包括:An array substrate, including:
    基板,包括显示区及电性测试区;Substrate, including display area and electrical test area;
    薄膜晶体管层,设于所述基板上,所述薄膜晶体管The thin film transistor layer is arranged on the substrate, and the thin film transistor
    层包括设于所述电性测试区的测试薄膜晶体管,其中,所述测试薄膜晶体管包括有源层、栅极层、及电极层,所述有源层的一端与所述电极层的第一电极相连,所述有源层的另一端悬空设置;The layer includes a test thin film transistor provided in the electrical test area, wherein the test thin film transistor includes an active layer, a gate layer, and an electrode layer, one end of the active layer and the first electrode layer The electrodes are connected, and the other end of the active layer is suspended;
    平坦化层,设于所述薄膜晶体管的电极层上,其中The planarization layer is arranged on the electrode layer of the thin film transistor, wherein
    所述平坦化层对应所述电极层的第一电极处设有第一过孔;The planarization layer is provided with a first via hole corresponding to the first electrode of the electrode layer;
    公共电极层,设在所述平坦化层远离所述电极层的The common electrode layer is provided on the planarization layer away from the electrode layer
    一侧,所述公共电极层通过所述第一过孔与所述电极层的第一电极连接。On one side, the common electrode layer is connected to the first electrode of the electrode layer through the first via hole.
  2. 如权利要求1所述的阵列基板,其中当位于所述电性5. The array substrate of claim 1, wherein when located in the electrical
    测试区的栅极层与所述有源层发生短路时,来自所述栅极层的电流经由所述有源层、所述测试薄膜晶体管的第一电极,传导至所述公共电极层,而拉高所述公共电极层在所述电性测试区的电压。When a short circuit occurs between the gate layer of the test area and the active layer, the current from the gate layer is conducted to the common electrode layer via the active layer and the first electrode of the test thin film transistor, and The voltage of the common electrode layer in the electrical test area is increased.
  3. 如权利要求1或2所述的阵列基板,其中所述测试薄The array substrate of claim 1 or 2, wherein the test thin
    膜晶体管的电极层还包括第二电极,其中,所述第二电极悬空设置。The electrode layer of the film transistor further includes a second electrode, wherein the second electrode is suspended.
  4. 如权利要求1所述的阵列基板,其中所述测试薄膜晶The array substrate of claim 1, wherein the test thin film crystal
    体管还包括绝缘保护层,所述绝缘保护层设于所述公共电极层远离所述公共电极层表面,以及第二电极层,所述第二电极层设于所述绝缘保护层上。The body tube further includes an insulating protection layer provided on the surface of the common electrode layer away from the common electrode layer, and a second electrode layer, the second electrode layer being provided on the insulating protection layer.
  5. 如权利要求1所述的阵列基板,其中所述测试薄膜晶The array substrate of claim 1, wherein the test thin film crystal
    体管还包括设于所述有源层与所述电极层之间的层间介电层,其中,所述层间介电层设有第二过孔,所述第一电极通过所述第二过孔与所述有源层的一端连接。The body tube further includes an interlayer dielectric layer disposed between the active layer and the electrode layer, wherein the interlayer dielectric layer is provided with a second via hole, and the first electrode passes through the first Two via holes are connected to one end of the active layer.
  6. 如权利要求5所述的阵列基板,其中所述测试薄膜晶The array substrate of claim 5, wherein the test thin film crystal
    体管的栅极层设于所述有源层与所述电极层之间,其中,所述栅极层与所述有源层之间设有栅极绝缘层,所述第二过孔贯穿所述层间介电层与所述栅极绝缘层。The gate layer of the body tube is provided between the active layer and the electrode layer, wherein a gate insulating layer is provided between the gate layer and the active layer, and the second via hole penetrates The interlayer dielectric layer and the gate insulating layer.
  7. 如权利要求5所述的阵列基板,其中所述测试薄膜晶The array substrate of claim 5, wherein the test thin film crystal
    体管的栅极层设于所述有源层远离所述电极层一侧的表面,其中所述栅极层与所述有源层之间设有栅极绝缘层,所述第二过孔贯穿所述层间介电层。The gate layer of the body tube is provided on the surface of the active layer away from the electrode layer, wherein a gate insulating layer is provided between the gate layer and the active layer, and the second via hole Through the interlayer dielectric layer.
  8. 如权利要求4所述的阵列基板,其中所述公共电极层The array substrate of claim 4, wherein the common electrode layer
    及所述第二电极层由氧化铟锡组成。And the second electrode layer is composed of indium tin oxide.
  9. 一种显示面板,包括如权利要求1所述的阵列基板,A display panel, comprising the array substrate according to claim 1,
    还包括与所述阵列基板相对设置的彩膜基板,其中,所述彩膜基板接近所述阵列基板一侧的表面上设有第三电极层,其中,所述公共电极层与所述第三电极层连接。It also includes a color filter substrate disposed opposite to the array substrate, wherein a third electrode layer is provided on the surface of the color filter substrate close to the side of the array substrate, wherein the common electrode layer and the third electrode layer The electrode layer is connected.
  10. 一种用于如权利要求9所述的显示面板的电性测试An electrical test for the display panel of claim 9
    方法,包括:Methods, including:
    提供一所述阵列基板;Providing the array substrate;
    对所述阵列基板通电;Energize the array substrate;
    对所述电性测试区的多个公共电极进行电性测试以获得多组电压值;Performing electrical testing on multiple common electrodes in the electrical testing area to obtain multiple sets of voltage values;
    确认所述多组电压值之中有无出现异常值;以及Confirm whether there is any abnormal value among the multiple sets of voltage values; and
    若所述多组电压值中之任一出现异常值,则判定所述阵列基板为异常。If an abnormal value occurs in any one of the multiple sets of voltage values, it is determined that the array substrate is abnormal.
PCT/CN2020/082720 2019-12-23 2020-04-01 Array substrate, display panel, and electrical test method WO2021128639A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911342489.X 2019-12-23
CN201911342489.XA CN111048020B (en) 2019-12-23 2019-12-23 Array substrate, display panel and electrical property testing method

Publications (1)

Publication Number Publication Date
WO2021128639A1 true WO2021128639A1 (en) 2021-07-01

Family

ID=70238413

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/082720 WO2021128639A1 (en) 2019-12-23 2020-04-01 Array substrate, display panel, and electrical test method

Country Status (2)

Country Link
CN (1) CN111048020B (en)
WO (1) WO2021128639A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111697040B (en) * 2020-06-15 2022-11-29 合肥维信诺科技有限公司 Display panel and display device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101800227A (en) * 2009-02-05 2010-08-11 上海天马微电子有限公司 Thin film transistor array substrate and manufacturing method thereof
CN104183206A (en) * 2014-09-10 2014-12-03 南京中电熊猫液晶显示科技有限公司 Display panel detecting method
CN104317089A (en) * 2014-10-27 2015-01-28 合肥鑫晟光电科技有限公司 Array substrate, production method thereof, display panel and display device
CN107516483A (en) * 2017-09-28 2017-12-26 京东方科技集团股份有限公司 Electrical detection method, device and the display module of device fault
CN109061914A (en) * 2018-08-07 2018-12-21 京东方科技集团股份有限公司 Manufacturing method, display base plate, the display device of display base plate
US20190213936A1 (en) * 2018-01-05 2019-07-11 Samsung Display Co., Ltd. Short circuit detector and display device having the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102402044A (en) * 2011-11-29 2012-04-04 深圳市华星光电技术有限公司 Manufacture method of color film substrate, liquid crystal display panel and liquid crystal display device
CN104880840B (en) * 2015-05-08 2018-01-30 厦门天马微电子有限公司 Touch display substrate, VT method of testings and liquid crystal display panel
CN106201076B (en) * 2016-07-01 2019-11-19 厦门天马微电子有限公司 Array substrate and its driving method, display panel and display device
CN106775165B (en) * 2017-01-06 2019-12-24 武汉华星光电技术有限公司 Embedded touch display panel and electronic device
CN107170749B (en) * 2017-04-27 2020-03-24 上海天马微电子有限公司 Array substrate and manufacturing method thereof
CN108319065A (en) * 2018-02-06 2018-07-24 武汉华星光电技术有限公司 Liquid crystal display panel
CN108732837B (en) * 2018-05-29 2019-10-18 武汉华星光电技术有限公司 Tft array substrate and liquid crystal display panel
CN109670475B (en) * 2018-12-28 2020-11-03 上海天马有机发光显示技术有限公司 Light sensing module and display panel

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101800227A (en) * 2009-02-05 2010-08-11 上海天马微电子有限公司 Thin film transistor array substrate and manufacturing method thereof
CN104183206A (en) * 2014-09-10 2014-12-03 南京中电熊猫液晶显示科技有限公司 Display panel detecting method
CN104317089A (en) * 2014-10-27 2015-01-28 合肥鑫晟光电科技有限公司 Array substrate, production method thereof, display panel and display device
CN107516483A (en) * 2017-09-28 2017-12-26 京东方科技集团股份有限公司 Electrical detection method, device and the display module of device fault
US20190213936A1 (en) * 2018-01-05 2019-07-11 Samsung Display Co., Ltd. Short circuit detector and display device having the same
CN109061914A (en) * 2018-08-07 2018-12-21 京东方科技集团股份有限公司 Manufacturing method, display base plate, the display device of display base plate

Also Published As

Publication number Publication date
CN111048020A (en) 2020-04-21
CN111048020B (en) 2021-05-07

Similar Documents

Publication Publication Date Title
KR101322563B1 (en) Liquid crystal display device
US9366926B2 (en) Pixel unit, array substrate, method for manufacturing array substrate, method for repairing array substrate, and display device
US8728836B2 (en) Method for preventing electrostatic breakdown, method for manufacturing array substrate and display substrate
US9146436B2 (en) Liquid crystal panel
US10204939B2 (en) Display substrate, manufacturing method thereof and display device
CN107505762B (en) COA substrate, display panel and display device
WO2021012359A1 (en) Tft driving backboard and micro-led display
TWI651576B (en) Display device with redundant transistor structure
WO2016078230A1 (en) Pixel structure for improving bad detection rate, and detection method
WO2019169809A1 (en) Display panel and method for reducing capacitive load thereof
WO2016090724A1 (en) Array substrate and display apparatus
US11158717B1 (en) Method for manufacturing thin-film transistor (TFT) substrate and TFT substrate
WO2015014065A1 (en) Method for detecting short circuit of signal line and repair line
WO2020073695A1 (en) Tft substrate, display panel and display apparatus
WO2020082544A1 (en) Touch array substrate and touch display panel
US20200395384A1 (en) Display panel and method for manufacturing the same
WO2021128639A1 (en) Array substrate, display panel, and electrical test method
US20160062187A1 (en) Touch display panel and fabrication method thereof, and display device
TWI663718B (en) Display device and manufacturing method thereof
WO2015003406A1 (en) Tft-lcd array substrate and display device
CN104656328B (en) Display panel and display device
WO2015074335A1 (en) Thin-film transistor array substrate and repair method
WO2021128492A1 (en) Liquid crystal display panel and liquid crystal display device
JP6436333B2 (en) Display device
WO2019174261A1 (en) Array substrate

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20905039

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20905039

Country of ref document: EP

Kind code of ref document: A1