WO2021128366A1 - 电子元件封装结构 - Google Patents

电子元件封装结构 Download PDF

Info

Publication number
WO2021128366A1
WO2021128366A1 PCT/CN2019/129543 CN2019129543W WO2021128366A1 WO 2021128366 A1 WO2021128366 A1 WO 2021128366A1 CN 2019129543 W CN2019129543 W CN 2019129543W WO 2021128366 A1 WO2021128366 A1 WO 2021128366A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
electronic component
printed circuit
flexible circuit
packaging structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/129543
Other languages
English (en)
French (fr)
Inventor
金森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Pte Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Pte Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to PCT/CN2019/129543 priority Critical patent/WO2021128366A1/zh
Publication of WO2021128366A1 publication Critical patent/WO2021128366A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/43—Layouts of interconnections

Definitions

  • the utility model relates to the technical field of electronic component packaging, in particular to an electronic component packaging structure.
  • the purpose of the utility model is to provide an electronic component packaging structure with low cost and short production cycle.
  • the present invention provides an electronic component packaging structure, which includes a flexible circuit board and an electronic component stacked on the flexible circuit board and forming an electrical connection.
  • the electronic component packaging structure also includes stacking and fixing on the flexible circuit board.
  • a printed circuit board on the flexible circuit board that is electrically connected to the flexible circuit board, the electronic component is fixed on the side of the printed circuit board away from the flexible circuit board, and the electronic component is connected to the printed circuit board.
  • the circuit board is electrically connected and is electrically connected to the flexible circuit board through the printed circuit board.
  • the electronic component is completely located within the range of the printed circuit board.
  • the printed circuit board is completely located within the range of the flexible circuit board.
  • the height of the printed circuit board is 1 mm, and the height of the electronic component is 1 mm.
  • the printed circuit board and the flexible circuit board form a fixed electrical connection by welding.
  • the electronic component and the printed circuit board form a fixed electrical connection by welding.
  • the electronic component packaging structure of the present invention by stacking a layer of printed circuit boards on the flexible circuit board and forming electrical connections, and then fixing the electronic components on the printed circuit board, the printed circuit board and the flexible circuit
  • the boards form electrical connections, so that the height of the printed circuit board is used to achieve the required height of the electronic component packaging structure, which not only has a short production cycle and low cost.
  • Figure 1 is a top view of the electronic component packaging structure of the present invention
  • Figure 2 is a front view of the electronic component packaging structure of the present invention.
  • the present invention provides an electronic component packaging structure 100, which includes a flexible circuit board 1, an electronic component 3 stacked on the flexible circuit board 1 and forming electrical connections, and a printed circuit board 2. .
  • the printed circuit board 2 is fixed on the flexible circuit board 1 and forms an electrical connection with the flexible circuit board 1, and the electronic component 3 is fixed on a side of the printed circuit board 2 away from the flexible circuit board 1
  • the electronic component 3 is electrically connected to the printed circuit board 2 and is electrically connected to the flexible circuit board 1 through the printed circuit board 2.
  • the electronic component 3 is completely located within the range of the printed circuit board 2, and the printed circuit board 2 is completely located within the range of the flexible circuit board 1; the printed circuit board 2 and the flexible circuit board 1 A fixed electrical connection is formed by soldering, and the electronic component 3 and the printed circuit board 2 are formed by soldering a fixed electrical connection.
  • the printed circuit board 2 and the flexible circuit board 1 are welded and fixed, and the printed circuit board 2 and the electronic components 3 are welded and fixed; the two structures are fixed by welding, which has better stability, simple process and convenient operation .
  • the height a of the printed circuit board 2 and the height of the electronic component 3 are both 1 mm.
  • the height a of the printed circuit board 2 can also be other heights, which are determined according to actual needs.
  • the electronic component packaging structure 100 needs to be applied to some specific occasions, and the superimposed height of the electronic component 3 and the printed circuit board 2 needs to reach 2mm; however, as described in this embodiment
  • the height of the electronic component 3 is 1mm. If it is re-ordered, in real life, it takes a long period and high cost to re-order the electronic component 3;
  • the printed circuit board 2 is soldered between the electronic component 3 and the flexible circuit board 1 to increase the height of the electronic component 3, with short cycle, low cost, and simple structure.
  • the electronic component packaging structure of the present invention by stacking a layer of printed circuit boards on the flexible circuit board and forming electrical connections, and then fixing the electronic components on the printed circuit board, the printed circuit board and the flexible circuit
  • the boards form electrical connections, so that the height of the printed circuit board is used to achieve the required height of the electronic component packaging structure, which not only has a short production cycle and low cost.
  • This utility model provides an embodiment of the utility model described above, which does not limit the scope of the utility model's patent. Any equivalent structure or equivalent process transformation made by using the content of the utility model description and drawings, or Directly or indirectly used in other related technical fields are included in the scope of patent protection of the utility model for the same reason.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电子元件封装结构(100)，其包括柔性电路板(1)、叠设于所述柔性电路板(1)并形成电连接的电子元件(3)以及叠设固定于所述柔性电路板(1)上并与所述柔性电路板(1)形成电连接的印刷电路板(2)，所述电子元件(3)固定于所述印刷电路板(2)远离所述柔性电路板(1)的一侧，所述电子元件(3)与所述印刷电路板(2)电连接并通过所述印刷电路板(2)与所述柔性电路板(1)电连接。与相关技术相比，电子元件封装结构(100)成本低、制作周期短。

Description

电子元件封装结构 技术领域
本实用新型涉及电子元件封装技术领域，尤其涉及一种电子元件封装结构。
 背景技术
随着工业的发展，电子元件的种类越来越多，电子元件一般有固定的封装规格。封装时，部分柔性线路板（Flexible Printed Circuit，FPC）焊接电子元件以实现特征性能。
 技术问题
然而，相关技术中，某些所述电子元件封装时需要达到特殊的高度，且这些特殊的高度超过所述标准封装规格，通过标准封装结构无法实现其封装，而订制该特殊高度要求的电子元件成本高，周期长。
因此，有必要提供一种新的电子元件封装结构解决上述问题。
 技术解决方案
本实用新型的目的在于提供一种成本低、制作周期短的电子元件封装结构。
为达到上述目的，本实用新型提供一种电子元件封装结构，其包括柔性电路板和叠设于所述柔性电路板并形成电连接的电子元件，所述电子元件封装结构还包括叠设固定于所述柔性电路板上并与所述柔性电路板形成电连接的印刷电路板，所述电子元件固定于所述印刷电路板远离所述柔性电路板的一侧，所述电子元件与所述印刷电路板电连接并通过所述印刷电路板与所述柔性电路板电连接。
优选的，所述电子元件完全位于所述印刷电路板范围内。
优选的，所述印刷电路板完全位于所述柔性电路板范围内。
优选的，所述印刷电路板的高度为1mm，所述电子元件的高度为1mm。
优选的，所述印刷电路板与所述柔性电路板通过焊接形成固定电连接。
优选的，所述电子元件与所述印刷电路板通过焊接形成固定电连接。
 有益效果
与相关技术相比，本实用新型的电子元件封装结构，通过在柔性电路板上叠设一层印刷电路板并形成电连接，再将电子元件固定于印刷电路板，通过印刷电路板与柔性电路板形成电连接，从而利用印刷电路板的高度实现所述电子元件封装结构所需的高度，不仅制作周期短且成本低。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型电子元件封装结构的俯视图；
图2为本实用新型电子元件封装结构的正视图。
 本发明的实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请参考图1-2所示，本实用新型提供一种电子元件封装结构100，其包括柔性电路板1、叠设于所述柔性电路板1并形成电连接的电子元件3以及印刷电路板2。
所述印刷电路板2固定于所述柔性电路板1上并与所述柔性电路板1形成电连接，所述电子元件3固定于所述印刷电路板2远离所述柔性电路板1的一侧，所述电子元件3与所述印刷电路板2电连接并通过所述印刷电路板2与所述柔性电路板1电连接。
本实施例中，所述电子元件3完全位于所述印刷电路板2范围内，所述印刷电路板2完全位于所述柔性电路板1范围内；所述印刷电路板2与所述柔性电路板1通过焊接形成固定电连接，所述电子元件3与所述印刷电路板2通过焊接形成固定电连接。
所述印刷电路板2与所述柔性电路板1焊接固定，所述印刷电路板2与电子元件3焊接固定；两两结构之间通过焊接固定，其稳定性更好，且工艺简单，操作方便。
本实施例中，所述印刷电路板2的高度a和所述电子元件3的高度均为1mm。当然所述印刷电路板2的高度a也可以为其他高度，根据实际需要确定。
如在本实施例中，电子元件封装结构100需要运用于某些特定的场合，其所述电子元件3和所述印刷电路板2的叠加起来的高度需要达到2mm；然而本实施例中所述电子元件3的高度为1mm，若重新订制，在实际生活中，重新订制电子元件3需要的周期长且成本高；本实施例中仅通过增加1mm高度的印刷电路板2，将所述印刷电路板2焊接在所述电子元件3和柔性电路板1之间，以增加所述电子元件3的高度，周期短，成本低，且结构简单。
与相关技术相比，本实用新型的电子元件封装结构，通过在柔性电路板上叠设一层印刷电路板并形成电连接，再将电子元件固定于印刷电路板，通过印刷电路板与柔性电路板形成电连接，从而利用印刷电路板的高度实现所述电子元件封装结构所需的高度，不仅制作周期短且成本低。
本实用新型提供一种以上所述仅为本实用新型的实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (6)

  1. 一种电子元件封装结构，其包括柔性电路板和叠设于所述柔性电路板并形成电连接的电子元件，其特征在于，所述电子元件封装结构还包括叠设固定于所述柔性电路板上并与所述柔性电路板形成电连接的印刷电路板，所述电子元件固定于所述印刷电路板远离所述柔性电路板的一侧，所述电子元件与所述印刷电路板电连接并通过所述印刷电路板与所述柔性电路板电连接。
  2. 根据权利要求1所述的电子元件封装结构，其特征在于，所述电子元件完全位于所述印刷电路板范围内。
  3. 根据权利要求2所述的电子元件封装结构，其特征在于，所述印刷电路板完全位于所述柔性电路板范围内。
  4. 根据权利要求1所述的电子元件封装结构，其特征在于，所述印刷电路板的高度为1mm，所述电子元件的高度为1mm。
  5. 根据权利要求1所述的电子元件封装结构，其特征在于，所述印刷电路板与所述柔性电路板通过焊接形成固定电连接。
  6. 根据权利要求1所述的电子元件封装结构，其特征在于，所述电子元件与所述印刷电路板通过焊接形成固定电连接。
PCT/CN2019/129543 2019-12-28 2019-12-28 电子元件封装结构 Ceased WO2021128366A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/129543 WO2021128366A1 (zh) 2019-12-28 2019-12-28 电子元件封装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/129543 WO2021128366A1 (zh) 2019-12-28 2019-12-28 电子元件封装结构

Publications (1)

Publication Number Publication Date
WO2021128366A1 true WO2021128366A1 (zh) 2021-07-01

Family

ID=76573586

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/129543 Ceased WO2021128366A1 (zh) 2019-12-28 2019-12-28 电子元件封装结构

Country Status (1)

Country Link
WO (1) WO2021128366A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130083494A1 (en) * 2011-10-04 2013-04-04 Sierra Wireless, Inc. Three-dimensional electronics packaging
CN106028643A (zh) * 2016-05-25 2016-10-12 武汉华星光电技术有限公司 柔性主板、柔性显示设备及柔性主板的制作方法
CN108156756A (zh) * 2018-02-06 2018-06-12 国蓉科技有限公司 一种异构刚饶板及基于异构刚饶板的多层板卡制作方法
CN108307584A (zh) * 2017-01-13 2018-07-20 株式会社村田制作所 元器件模块
CN109478554A (zh) * 2016-04-29 2019-03-15 Lg伊诺特有限公司 相机模块及包括该相机模块的便携装置
CN110337178A (zh) * 2019-04-25 2019-10-15 维沃移动通信有限公司 一种电路板组件和电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130083494A1 (en) * 2011-10-04 2013-04-04 Sierra Wireless, Inc. Three-dimensional electronics packaging
CN109478554A (zh) * 2016-04-29 2019-03-15 Lg伊诺特有限公司 相机模块及包括该相机模块的便携装置
CN106028643A (zh) * 2016-05-25 2016-10-12 武汉华星光电技术有限公司 柔性主板、柔性显示设备及柔性主板的制作方法
CN108307584A (zh) * 2017-01-13 2018-07-20 株式会社村田制作所 元器件模块
CN108156756A (zh) * 2018-02-06 2018-06-12 国蓉科技有限公司 一种异构刚饶板及基于异构刚饶板的多层板卡制作方法
CN110337178A (zh) * 2019-04-25 2019-10-15 维沃移动通信有限公司 一种电路板组件和电子设备

Similar Documents

Publication Publication Date Title
CN102142411B (zh) 一种印刷电路组装板芯片封装部件以及焊接部件
US20130248237A1 (en) Printed circuit board
CN204464408U (zh) 软包柱式电池
CN207909913U (zh) 一种led器件的封装结构
CN211184421U (zh) 一种印刷电路板及一种半导体装置
WO2021128366A1 (zh) 电子元件封装结构
CN207199601U (zh) 贴片式sod二极管
CN209283623U (zh) 一种连接架板及移动终端
CN202262057U (zh) 一种fpc焊盘防断裂结构
CN102969292B (zh) 集成电源模块
CN101795545A (zh) 大板与功放的组装装置及基站
CN216217733U (zh) 一种射频滤波器焊盘兼容pcb板结构
CN102364995A (zh) Fpc的金手指
CN205546198U (zh) 显示屏及显示装置
CN204350460U (zh) 一种pcb板表面组装结构
CN222283570U (zh) 一种具有拖锡焊盘的电路板
CN201207759Y (zh) 软性信号传递板与信号传递板的连结结构
CN102970001B (zh) 一种石英晶体谐振器及其回流焊接方法
CN218415060U (zh) 功率单元及变频器
CN206559724U (zh) 一种增加通孔焊接器件连接可靠性的pcb板结构
CN206365157U (zh) 一种电极突出的电路板
CN206077837U (zh) 一种背光fpc
CN216146519U (zh) 表贴元件的连接结构
CN219718605U (zh) 终端设备及电路板
CN114551367B (zh) 并联结构的半导体器件

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19957612

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19957612

Country of ref document: EP

Kind code of ref document: A1