WO2021126161A1 - Matrices à fluide à chauffage intégré - Google Patents

Matrices à fluide à chauffage intégré Download PDF

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Publication number
WO2021126161A1
WO2021126161A1 PCT/US2019/066658 US2019066658W WO2021126161A1 WO 2021126161 A1 WO2021126161 A1 WO 2021126161A1 US 2019066658 W US2019066658 W US 2019066658W WO 2021126161 A1 WO2021126161 A1 WO 2021126161A1
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WO
WIPO (PCT)
Prior art keywords
signal
warming
logic circuit
fire
fluid actuation
Prior art date
Application number
PCT/US2019/066658
Other languages
English (en)
Inventor
Eric Martin
Vincent C. Korthuis
Daryl Eugene ANDERSON
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2019/066658 priority Critical patent/WO2021126161A1/fr
Publication of WO2021126161A1 publication Critical patent/WO2021126161A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0458—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads based on heating elements forming bubbles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04528—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at warming up the head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04541—Specific driving circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/0455—Details of switching sections of circuit, e.g. transistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04563—Control methods or devices therefor, e.g. driver circuits, control circuits detecting head temperature; Ink temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04573—Timing; Delays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04596—Non-ejecting pulses

Definitions

  • An inkjet printing system may include a printhead, an ink supply which supplies liquid ink to the printhead, and an electronic controller which controls the printhead.
  • the printhead as one example of a fluid ejection device, ejects drops of ink through a plurality of nozzles or orifices and toward a print medium, such as a sheet of paper, so as to print onto the print medium.
  • the orifices are arranged in at least one column or array such that properly sequenced ejection of ink from the orifices causes characters or other images to be printed upon the print medium as the printhead and the print medium are moved relative to each other.
  • Figure 1 is a block diagram illustrating one example of a fluidic die.
  • Figure 2A is a timing diagram illustrating one example of the operation of the fluidic die of Figure 1.
  • Figure 2B is a timing diagram illustrating another example of the operation of the fluidic die of Figure 1.
  • Figure 3 is a schematic diagram illustrating one example of a warming logic circuit.
  • Figure 4A is a schematic diagram illustrating one example of a fluid actuation device.
  • Figure 4B is a schematic diagram illustrating another example of a fluid actuation device.
  • Figure 5A-5C are schematic diagrams illustrating other examples of warming logic circuits.
  • Figures 6A-6C are schematic diagrams illustrating other examples of warming logic circuits.
  • Figure 7A is a block diagram illustrating another example of a fluidic die.
  • Figure 7B is a block diagram illustrating one example of a control logic circuit.
  • Figure 8 is a block diagram illustrating one example of a fluid ejection system.
  • Figures 9A-9C are flow diagrams illustrating one example of a method for operating a fluidic die.
  • Nozzle logic may be one of the most circuit dense regions of a fluidic die, such as a thermal inkjet printhead.
  • Some printheads may use multi-pulse firing where the fire signal provided to the nozzle actuator (e.g., fluid actuation device) includes multiple pulses. The combined energy provided by the multiple pulses is sufficient to nucleate a drive bubble (e.g., to eject a drop).
  • a second subset of the multiple pulses is sufficient to warm the fluid (e.g., ink) in the nozzle chamber, but not sufficient to nucleate a drive bubble.
  • This method of warming may be referred to as precursor pulse (PCP) warming.
  • the most expensive (i.e., largest) nozzle logic elements may be flip-flops, which may be used for synchronously storing data used for controlling nozzle firing and warming for thermal control.
  • a fluidic die including a warming logic circuit that masks a fire signal with a clock signal to output a warming signal which is a dithered version of the fire signal.
  • the warming signal is selectively passed to a fluid actuation device to warm fluid within a fluidic chamber of the die.
  • the fire signal is selectively passed to the fluid actuation device to nucleate a drive bubble in the fluidic chamber.
  • the duty cycle of the warming signal, and hence the power supplied to the fluid actuation device to warm the fluid may be adjusted. In this way, at least one flip-flop for each group of fluid actuation devices may be eliminated from the nozzle logic, thus resulting in less expensive (e.g., smaller) nozzle logic.
  • the nozzle logic may be used for warming when single pulse firing is used.
  • a “logic high” signal is a logic “1 ” or “on” signal.
  • a “logic high” signal may be a signal having a voltage about equal to the logic power supplied to an integrated circuit (e.g., between about 1.8 V and 15 V, such as 5.6 V).
  • a “logic low” signal is a logic “0” or “off” signal.
  • a “logic low” signal may be a signal having a voltage about equal to a logic power ground return for the logic power supplied to the integrated circuit (e.g., about 0 V). In other examples, the voltages of the “logic high” and “logic low” signals may be inverted.
  • FIG. 1 is a block diagram illustrating one example of a fluidic die 100.
  • Fluidic die 100 includes a warming logic circuit 102, a control logic circuit 104, and at least one fluid actuation device 106.
  • a first input of the warming logic circuit 102 receives a fire signal on a fire signal path 108.
  • a second input of the warming logic circuit 102 receives a clock signal on a clock signal path 110.
  • An output of the warming logic circuit 102 is electrically coupled to an input of the control logic circuit 104 through a warming signal path 112.
  • Control logic circuit 104 may also include other inputs (not shown).
  • An output of the control logic circuit 104 is electrically coupled to an input of the at least one fluid actuation device 106 through a fire thermal inkjet (FIRE_TIJ) signal path 114.
  • FIRE_TIJ fire thermal inkjet
  • the fire signal on the fire signal path 108 is activated (e.g., one or multiple logic high pulses) to warm or energize a fluid actuation device.
  • the clock signal on the clock signal path 110 may be any cyclical signal having any suitable frequency.
  • the clock signal may be generated on the fluidic die 100 or generated off the fluidic die and passed to the fluidic die.
  • the warming logic circuit 102 masks the fire signal on the fire signal path 108 with the clock signal on the clock signal path 110 to generate a warming signal on the warming signal path 112.
  • the control logic circuit 104 selectively passes the warming signal on the warming signal path 112 to the at least one fluid actuation device 106 via the fire thermal inkjet signal path 114.
  • control logic circuit 104 selectively passes one of the fire signal on the fire signal path 108, the warming signal on the warming signal path 112, and a null signal (e.g., a logic low signal) to the at least one fluid actuation device 106 via the fire thermal inkjet signal path 114 based on a warming control signal and a data signal.
  • a null signal e.g., a logic low signal
  • FIG. 2A is a timing diagram 120 illustrating one example of the operation of the fluidic die 100 of Figure 1.
  • Timing diagram 120 includes the fire signal on the fire signal path 108, the clock signal on the clock signal path 110, and the warming signal on the warming signal path 112.
  • the fire signal is a single pulse fire signal, where a single pulse is used to fire (e.g., energize) a fluid actuation device.
  • the fire signal is logic low such that the warming logic circuit 102 outputs a logic low warming signal.
  • the fire signal is logic high such that the warming logic circuit 102 outputs a warming signal as a dithered version of the fire signal.
  • FIG. 2B is a timing diagram 130 illustrating another example of the operation of the fluidic die 100 of Figure 1.
  • Timing diagram 130 includes the fire signal on the fire signal path 108, the clock signal on the clock signal path 110, and the warming signal on the warming signal path 112.
  • the fire signal is a multi-pulse fire signal, where multiple pulses are used to fire (e.g., energize) a fluid actuation device.
  • the fire signal may include a precursor pulse between times Ti and T2and a fire pulse between times T3 and ⁇ 4 separated by a delay time between times T2 and T3.
  • the fire signal is logic low such that the warming logic circuit 102 outputs a logic low warming signal.
  • the fire signal is logic high such that the warming logic circuit 102 outputs a warming signal as a dithered version of the fire signal.
  • masking the fire signal with the clock signal includes logically ANDing the fire signal with the clock signal to generate the warming signal.
  • the fire signal is logic low such that the warming logic circuit 102 outputs a logic low warming signal.
  • the fire signal is logic high such that the warming logic circuit 102 outputs a warming signal as a dithered version of the fire signal.
  • the fire signal is logic low such that the warming logic circuit 102 outputs a logic low warming signal. In this way, the warming logic circuit 102 masks the fire signal with the clock signal to generate the warming signal for a multi-pulse fire signal.
  • FIG. 3 is a schematic diagram illustrating one example of a warming logic circuit 102a.
  • warming logic circuit 102a provides warming logic circuit 102 previously described and illustrated with reference to Figure 1.
  • Warming logic circuit 102a includes a single logic gate 140 to receive the fire signal on the fire signal path 108 and the clock signal on the clock signal path 110 to output the warming signal on the warming signal path 112.
  • the single logic gate 140 is an AND gate to logically AND the fire signal with the clock signal to generate the warming signal.
  • the single logic gate 140 may be a NAND gate or another suitable logic gate.
  • the single logic gate 140 may be replaced with a plurality of logic gates to mask the fire signal with the clock signal to generate the warming signal.
  • FIG 4A is a schematic diagram illustrating one example of a fluid actuation device 106a.
  • fluid actuation device 106a provides the at least one fluid actuation device 106 previously described and illustrated with reference to Figure 1.
  • Fluid actuation device 106a uses a low-side switch (LSS) firing topology.
  • Fluid actuation device 106a includes a transistor (e.g., FET) 150 and a firing resistor 152.
  • the gate of transistor 150 receives the fire thermal inkjet signal through the fire thermal inkjet signal path 114.
  • the source- drain path of transistor 150 is electrically coupled between a common or ground node 154 and one side of firing resistor 152.
  • the other side of firing resistor 152 is electrically coupled to a supply voltage node (e.g., VPP) 156.
  • VPP supply voltage node
  • the fluid actuation device 106a corresponds to a fluidic chamber 158. At least the firing resistor 152 of the fluid actuation device 106a may be within the fluidic chamber 158.
  • the transistor 150 energizes the firing resistor 152 based on the fire thermal inkjet signal. In response to the warming signal being passed to the gate of transistor 150, transistor 150 activates (i.e., energizes) firing resistor 152 sufficiently to heat fluid within the fluidic chamber 158 but insufficiently to nucleate a drive bubble in the fluidic chamber 158. In response to the fire signal being passed to the gate of transistor 150, transistor 150 activates (i.e., energizes) firing resistor 152 sufficiently to nucleate a drive bubble within the fluidic chamber 158. In response to a null signal being passed to the gate of transistor 150, transistor 150 deactivates firing resistor 152.
  • FIG 4B is a schematic diagram illustrating another example of a fluid actuation device 106b.
  • fluid actuation device 106b provides the at least one fluid actuation device 106 previously described and illustrated with reference to Figure 1.
  • Fluid actuation device 106b uses a high-side switch (FISS) firing topology.
  • Fluid actuation device 106b includes a transistor (e.g., FET) 151 , a firing resistor 152, and a level shifter 160.
  • the input of level shifter 160 receives the fire thermal inkjet signal through the fire thermal inkjet signal path 114.
  • the output of level shifter 160 is electrically coupled to the gate of transistor 151 through a signal path 162.
  • the source-drain path of transistor 151 is electrically coupled between a supply voltage node (e.g., VPP) 156 and one side of firing resistor 152.
  • the other side of firing resistor 152 is electrically coupled to a common or ground node 154.
  • the fluid actuation device 106b corresponds to a fluidic chamber 158. At least the firing resistor 152 of the fluid actuation device 106b may be within the fluidic chamber 158.
  • the transistor 151 energizes the firing resistor 152 based on the level shifted fire thermal inkjet signal. In response to the level shifted warming signal being passed to the gate of transistor 151 , transistor 151 activates (i.e., energizes) firing resistor 152 sufficiently to heat fluid within the fluidic chamber 158 but insufficiently to nucleate a drive bubble in the fluidic chamber 158.
  • transistor 151 In response to the level shifted fire signal being passed to the gate of transistor 151 , transistor 151 activates (i.e., energizes) firing resistor 152 sufficiently to nucleate a drive bubble within the fluidic chamber 158. In response to a level shifted null signal being passed to the gate of transistor 151 , transistor 151 deactivates firing resistor 152.
  • FIG. 5A is a schematic diagram illustrating another example of a warming logic circuit 102b.
  • warming logic circuit 102b provides warming logic circuit 102 previously described and illustrated with reference to Figure 1.
  • Warming logic circuit 102b includes a logic gate 140 and an output stage 170.
  • a first input of the logic gate 140 receives the fire signal on the fire signal path 108.
  • a second input of the logic gate 140 receives the clock signal on the clock signal path 110.
  • the output of the logic gate 140 is electrically coupled to an input of the output stage 170 through a signal path 141.
  • An output of the output stage 170 provides the warming signal on the warming signal path 112.
  • the logic gate 140 masks the fire signal with the clock signal to generate a warming signal on the signal path 141.
  • the output stage 170 receives the warming signal on the signal path 141 and adjusts a duty cycle of the warming signal to provide a duty cycle adjusted warming signal on the warming signal path 112. By adjusting the duty cycle of the warming signal, the amount of energy applied to the fluid actuation device may be tuned to deliver the appropriate warming energy sufficient to warm fluid within the fluidic chamber but insufficient to nucleate a drive bubble in the fluidic chamber.
  • Output stage 170 may include an inverter, a buffer, or other suitable logic circuitry for adjusting the duty cycle of the warming signal.
  • FIG. 5B is a schematic diagram illustrating another example of a warming logic circuit 102c.
  • warming logic circuit 102c provides warming logic circuit 102 previously described and illustrated with reference to Figure 1.
  • Warming logic circuit 102c is similar to warming logic circuit 102b of Figure 5A, except that warming logic circuit 102c includes a pull-up circuit 172.
  • pull-up circuit 172 is electrically coupled between the output stage 170 and a supply voltage node 176.
  • a control input of pull-up circuit 172 receives a rise-time control signal (e.g., an analog voltage) through a rise-time control signal path 174.
  • the rise-time control signal may be a global signal generated by a voltage reference block of the fluidic die or of another die electrically coupled to the fluidic die.
  • Pull-up circuit 172 adjusts a rise-time of the output stage 170 based on the rise-time control signal. By adjusting the rise-time of the output stage 170, the duty cycle of the warming signal may be adjusted.
  • FIG. 5C is a schematic diagram illustrating another example of a warming logic circuit 102d.
  • warming logic circuit 102d provides warming logic circuit 102 previously described and illustrated with reference to Figure 1.
  • Warming logic circuit 102d is similar to warming logic circuit 102b of Figure 5A, except that warming logic circuit 102d includes a pull-down circuit 178.
  • pull-down circuit 178 is electrically coupled between the output stage 170 and a common or ground node 182.
  • a control input of pull down circuit 178 receives a fall-time control signal (e.g., an analog voltage) through a fall-time control signal path 180.
  • a fall-time control signal e.g., an analog voltage
  • the fall-time control signal may be a global signal generated by a voltage reference block of the fluidic die or of another die electrically coupled to the fluidic die.
  • Pull-down circuit 178 adjusts a fall-time of the output stage 170 based on the fall-time control signal. By adjusting the fall-time of the output stage 170, the duty cycle of the warming signal may be adjusted.
  • the pull-up circuit 172 of warming logic circuit 102c of Figure 5B may be combined with the pull-down circuit 178 to provide both rise-time and fall-time control for the warming logic circuit.
  • FIG. 6A is a schematic diagram illustrating another example of a warming logic circuit 102e.
  • warming logic circuit 102e provides warming logic circuit 102 previously described and illustrated with reference to Figure 1.
  • Warming logic circuit 102e includes a logic gate 142 and an output stage including a transistor (e.g., pFET) 190 and a transistor (e.g., nFET) 192.
  • logic gate 142 is a NAND gate and transistors 190 and 192 are arranged as an inverter logic gate.
  • a first input of the logic gate 142 receives the fire signal on the fire signal path 108.
  • a second input of the logic gate 142 receives the clock signal on the clock signal path 110.
  • the output of the logic gate 142 is electrically coupled to the gate of transistor 190 and the gate of transistor 192 through a signal path 143.
  • the source-drain path of transistor 190 is electrically coupled between a supply voltage node 176 and the warming signal path 112.
  • the source-drain path of transistor 192 is electrically coupled between the warming signal path 112 and a common or ground node 182.
  • the logic gate 142 masks the fire signal with the clock signal (by logically NANDing the fire signal with the clock signal) to generate a warming signal on signal path 143.
  • Transistors 190 and 192 receive the warming signal on signal path 143 and adjust a duty cycle of the warming signal to provide a duty cycle adjusted warming signal on warming signal path 112.
  • the duty cycle of the warming signal may be adjusted based on the size of each transistor 190 and 192 (e.g., to adjust the rise and/or fall time of the inverter formed by transistors 190 and 192).
  • the amount of energy applied to the fluid actuation device may be tuned to deliver the appropriate warming energy sufficient to warm fluid within the fluidic chamber but insufficient to nucleate a drive bubble in the fluidic chamber.
  • FIG. 6B is a schematic diagram illustrating another example of a warming logic circuit 102f.
  • warming logic circuit 102f provides warming logic circuit 102 previously described and illustrated with reference to Figure 1.
  • Warming logic circuit 102f is similar to warming logic circuit 102e of Figure 6A, except that warming logic circuit 102f includes a pull-up circuit including a transistor (e.g., pFET) 194.
  • transistor 194 is electrically coupled between one side of the source-drain path of transistor 190 and the supply voltage node 176.
  • the gate of transistor 194 receives a rise time control signal through a rise-time control signal path 174.
  • Transistor 194 adjusts a rise-time of the inverter formed by transistors 190 and 192 based on the rise-time control signal. By adjusting the rise-time of the inverter, the duty cycle of the warming signal may be adjusted.
  • FIG. 6C is a schematic diagram illustrating another example of a warming logic circuit 102g.
  • warming logic circuit 102g provides warming logic circuit 102 previously described and illustrated with reference to Figure 1.
  • Warming logic circuit 102g is similar to warming logic circuit 102e of Figure 6A, except that warming logic circuit 102g includes a pull-down circuit including a transistor (e.g., nFET) 196.
  • transistor 196 is electrically coupled between one side of the source-drain path of transistor 192 and the common or ground node 182. The gate of transistor 196 receives a fall time control signal through a fall-time control signal path 180.
  • Transistor 196 adjusts a fall-time of the inverter formed by transistors 190 and 192 based on the fall-time control signal. By adjusting the fall-time of the inverter, the duty cycle of the warming signal may be adjusted.
  • the pull-up circuit including transistor 194 of warming logic circuit 102f of Figure 6B may be combined with the pull-down circuit including transistor 196 to provide both rise time and fall-time control for the warming logic circuit.
  • FIG. 7A is a block diagram illustrating another example of a fluidic die 200.
  • Fluidic die 200 includes a plurality of delay circuits 201 o to 201 N, a plurality of warming logic circuits 202o to 202N, a plurality of control logic circuits 204o to 204N, and a plurality of fluid actuation devices 206 divided into a plurality of groups 0 to N.
  • Each group 0 to N includes a plurality of nozzles (corresponding to fluid actuation devices) addressed by corresponding addresses (ADDR 0 to ADDR 3) for each group.
  • group 0 may include a first nozzle (i.e., nozzle 0 corresponding to a first fluid actuation device of the group) addressed by a first address (i.e., ADDR 0) for the group, a second nozzle (i.e., nozzle 1 corresponding to a second fluid actuation device for the group) addressed by a second address (i.e., ADDR 1 ) for the group, a third nozzle (i.e., nozzle 2 corresponding to a third fluid actuation device for the group) addressed by a third address (i.e., ADDR 2) for the group, and a fourth nozzle (i.e., nozzle 3 corresponding to a fourth fluid actuation device for the group) addressed by a fourth address (i.e., ADDR 3) for the group.
  • a first nozzle i.e., nozzle 0 corresponding to a first fluid actuation device of the group addressed by a first address (i.e., ADDR 0) for the
  • group 1 may include a fifth nozzle (i.e., nozzle 4 corresponding to a first fluid actuation device for the group) addressed by the first address (i.e., ADDR 0) for the group, etc. While four nozzles are addressed by four addresses for each group for the fluid actuation devices 206 of Figure 7A, in other examples each group may include less than four nozzles and corresponding addresses or more than four nozzles and corresponding addresses.
  • An input of the delay circuit 201 o receives a fire signal on a fire signal path 207.
  • An output of the delay circuit 201 o is electrically coupled to a first input of the warming logic circuit 202o and the input of the delay circuit 2011 through a delayed fire (F_DEL[0]) signal path 208o.
  • An output of the delay circuit 2011 is electrically coupled to a first input of the warming logic circuit 202i and the input of delay circuit 2012 (not shown) through a delayed fire (F_DEL[1]) signal path 208i.
  • each delay circuit 201 x is electrically coupled to a first input of a corresponding warming logic circuit 202x and the input of the next delay circuit 201 x +i , where “X” is an integer between 0 and N-1.
  • An output of the delay circuit 201 N is electrically coupled to a first input of the warming logic circuit 202N.
  • the fire signal on fire signal path 207 is delayed by delay circuit 2010 and further delayed by each delay circuit 2010 to 201 N such that the delayed fire signals on signal paths 208o to 208N are staggered. In this way, the number of fluid actuation devices 206 that will be energized simultaneously is reduced, thereby reducing peak power.
  • a second input of each warming logic circuit 202o to 202N receives a clock signal on a clock signal path 210.
  • An output of each warming logic circuit 202o to 202N is electrically coupled to an input of a control logic circuit 204o to 204N through a warming (WARM[0] to WARM[N]) signal path 212o to 212N, respectively.
  • An output of each control logic circuit 204o to 204N is electrically coupled to an input of a corresponding group 0 to N of the fluid actuation devices 206 through a fire thermal inkjet (F_TIJ[0] to F_TIJ[N]) signal path 214o to 214N, respectively.
  • F_TIJ[0] to F_TIJ[N] fire thermal inkjet
  • Each warming logic circuit 202o to 202N may include the features of any of the warming logic circuits 102 or 102a to 102g previously described above. Each warming logic circuit 202o to 202N masks the corresponding delayed fire signal on the delayed fire signal path 208o to 208N with the clock signal on the clock signal path 210 to generate a corresponding warming signal on the warming signal path 212o to 212N, respectively. Each control logic circuit 204o to 204N may include the features of control logic circuit 104 previously described above.
  • Each control logic circuit 204o to 204N selectively passes the corresponding warming signal on warming signal path 212o to 212N to the fluid actuation devices 206 of the corresponding group 0 to N via the fire thermal inkjet signal path 214o to 214N, respectively.
  • a single warming logic circuit e.g., warming logic circuit 202o
  • the other warming logic circuits e.g., warming logic circuits 202i to 202N
  • FIG. 7B is a block diagram illustrating one example of a control logic circuit 220.
  • control logic circuit 220 may be used for control logic circuit 104 or for each control logic circuit 204o to 204N previously described and illustrated with reference to Figures 1 and 7A, respectively.
  • control logic circuit 220 is configured to be used for control logic circuit 204N.
  • a first input of control logic circuit 220 receives a delayed fire (F_DEL[N]) signal on a delayed fire signal path 208N.
  • a second input of control logic circuit 220 receives a corresponding warming (WARM[N]) signal on a warming signal path 212N.
  • a third input of control logic circuit 220 receives a warming control signal on a warming control signal path 222.
  • a fourth input of control logic circuit 220 receives a data signal (DATA[N]) on a data signal path 224N.
  • An output of control logic circuit 220 provides a fire thermal inkjet (F_TIJ[N]) signal on fire thermal inkjet signal path 214N.
  • the warming control signal indicates whether warming should be enabled.
  • the warming control signal is active (e.g., logic high) in response to a measured temperature of a portion of the fluidic die being less than a target temperature and inactive (e.g., logic low) in response to the measured temperature of the portion of the fluidic die being greater than or equal to the target temperature.
  • the data signal indicates whether a fluid actuation device of the corresponding group of fluid actuation devices is to be energized to eject a drop of fluid.
  • the data signal is active (e.g., logic high) in response to image data indicating that a fluid actuation device of the corresponding group of fluid actuation devices is to be energized to eject a drop of fluid and inactive (e.g., logic low) in response to the image data indicating that a fluid actuation device of the corresponding group of fluid actuation devices is not to be energized to eject a drop of fluid.
  • the control logic circuit 220 selectively passes one of the delayed fire signal, the warming signal, and a null signal to provide the fire thermal inkjet signal based on the warming control signal and the data signal.
  • control logic circuit 220 In response to a logic low delayed fire signal and a logic low warming control signal, control logic circuit 220 outputs a null signal (e.g., logic low) on fire thermal inkjet signal path 214N.
  • control logic circuit 220 In response to a logic high data signal, control logic circuit 220 outputs the delayed fire signal on fire thermal inkjet signal path 214N. In this case, control logic circuit 220 outputs the delayed fire signal whether the warming control signal is logic high or logic low.
  • control logic circuit 220 In response to a logic low data signal and a logic high warming control signal, control logic circuit 220 outputs the warming signal on fire thermal inkjet signal path 214N.
  • the signal on fire thermal inkjet signal path 214N may directly drive a fluid actuation device 206 or may drive an additional logic stage (e.g., an address decoding stage) that drives a fluid actuation device 206.
  • FIG. 8 is a block diagram illustrating one example of a fluid ejection system 300.
  • Fluid ejection system 300 includes a fluid ejection assembly, such as printhead assembly 302, and a fluid supply assembly, such as ink supply assembly 310.
  • fluid ejection system 300 also includes a service station assembly 304, a carriage assembly 316, a print media transport assembly 318, and an electronic controller 320. While the following description provides examples of systems and assemblies for fluid handling with regard to ink, the disclosed systems and assemblies are also applicable to the handling of fluids other than ink.
  • Printhead assembly 302 includes at least one printhead or fluid ejection die 306, which may include the features of fluidic die 100 or 200 previously described and illustrated with reference to Figures 1 and 7A, respectively.
  • Fluid ejection die 306 ejects drops of ink or fluid through a plurality of orifices or nozzles 308.
  • the drops are directed toward a medium, such as print media 324, so as to print onto print media 324.
  • print media 324 includes any type of suitable sheet material, such as paper, card stock, transparencies, Mylar, fabric, and the like.
  • print media 324 includes media for three-dimensional (3D) printing, such as a powder bed, or media for bioprinting and/or drug discovery testing, such as a reservoir or container.
  • nozzles 308 are arranged in at least one column or array such that properly sequenced ejection of ink from nozzles 308 causes characters, symbols, and/or other graphics or images to be printed upon print media 324 as printhead assembly 302 and print media 324 are moved relative to each other.
  • Ink supply assembly 310 supplies ink to printhead assembly 302 and includes a reservoir 312 for storing ink. As such, in one example, ink flows from reservoir 312 to printhead assembly 302. In one example, printhead assembly 302 and ink supply assembly 310 are housed together in an inkjet or fluid-jet print cartridge or pen. In another example, ink supply assembly 310 is separate from printhead assembly 302 and supplies ink to printhead assembly 302 through an interface connection 313, such as a supply tube and/or valve.
  • Carriage assembly 316 positions printhead assembly 302 relative to print media transport assembly 318, and print media transport assembly 318 positions print media 324 relative to printhead assembly 302.
  • a print zone 326 is defined adjacent to nozzles 308 in an area between printhead assembly 302 and print media 324.
  • printhead assembly 302 is a scanning type printhead assembly such that carriage assembly 316 moves printhead assembly 302 relative to print media transport assembly 318.
  • printhead assembly 302 is a non-scanning type printhead assembly such that carriage assembly 316 fixes printhead assembly 302 at a prescribed position relative to print media transport assembly 318.
  • Service station assembly 304 provides for spitting, wiping, capping, and/or priming of printhead assembly 302 to maintain the functionality of printhead assembly 302 and, more specifically, nozzles 308.
  • service station assembly 304 may include a rubber blade or wiper which is periodically passed over printhead assembly 302 to wipe and clean nozzles 308 of excess ink.
  • service station assembly 304 may include a cap that covers printhead assembly 302 to protect nozzles 308 from drying out during periods of non-use.
  • service station assembly 304 may include a spittoon into which printhead assembly 302 ejects ink during spits to ensure that reservoir 312 maintains an appropriate level of pressure and fluidity, and to ensure that nozzles 308 do not clog or weep.
  • Functions of service station assembly 304 may include relative motion between service station assembly 304 and printhead assembly 302.
  • Electronic controller 320 communicates with printhead assembly 302 through a communication path 303, service station assembly 304 through a communication path 305, carriage assembly 316 through a communication path 317, and print media transport assembly 318 through a communication path 319. In one example, when printhead assembly 302 is mounted in carriage assembly 316, electronic controller 320 and printhead assembly 302 may communicate via carriage assembly 316 through a communication path 301. Electronic controller 320 may also communicate with ink supply assembly 310 such that, in one implementation, a new (or used) ink supply may be detected. [0048] Electronic controller 320 receives data 328 from a host system, such as a computer, and may include memory for temporarily storing data 328.
  • a host system such as a computer
  • Data 328 may be sent to fluid ejection system 300 along an electronic, infrared, optical or other information transfer path.
  • Data 328 represent, for example, a document and/or file to be printed.
  • data 328 form a print job for fluid ejection system 300 and includes at least one print job command and/or command parameter.
  • electronic controller 320 provides control of printhead assembly 302 including timing control for ejection of ink drops from nozzles 308.
  • electronic controller 320 defines a pattern of ejected ink drops which form characters, symbols, and/or other graphics or images on print media 324. Timing control and, therefore, the pattern of ejected ink drops, is determined by the print job commands and/or command parameters.
  • logic and drive circuitry forming a portion of electronic controller 320 is located on printhead assembly 302. In another example, logic and drive circuitry forming a portion of electronic controller 320 is located off printhead assembly 302.
  • FIGS 9A-9C are flow diagrams illustrating one example of a method 400 for operating a fluidic die, such as fluidic die 100 or 200 previously described and illustrated with reference to Figures 1 and 7A, respectively.
  • method 400 includes receiving a clock signal and a fire signal.
  • a warming logic circuit 102 or 202o to 202N may receive a fire signal and a clock signal as illustrated in Figures 1 and 7A, respectively.
  • method 400 includes masking the fire signal using the clock signal to provide a warming signal.
  • a warming logic circuit 102 or 202o to 202N may mask the fire signal using the clock signal to provide a warming signal.
  • method 400 includes selectively applying the warming signal to a fluid actuation device.
  • a control logic circuit 104, 204o to 204N, or 220 may selectively apply the warming signal to a fluid actuation device 106 or 206.
  • method 400 may further include adjusting a duty cycle of the warming signal selectively applied to the fluid actuation device.
  • an output stage of a warming logic circuit 102b to 102g may adjust the duty cycle of the warming signal.
  • method 400 may further include selectively passing one of the warming signal, the fire signal, and a null signal to the fluid actuation device based on a warming control signal and a data signal.
  • a control logic circuit 220 may selectively pass one of the warming signal, the fire signal, and a null signal based on a warming control signal and a data signal as previously described and illustrated with reference to Figure 7B.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

Une matrice à fluide comprend un circuit logique de chauffage, au moins un dispositif d'actionnement de fluide et un circuit logique de commande. Le circuit logique de chauffage masque un signal de déclenchement avec un signal d'horloge pour générer un signal de chauffage. Le circuit logique de commande est couplé électriquement entre le circuit logique de chauffage et le(s)s dispositif(s) d'actionnement de fluide pour transférer sélectivement le signal de chauffage au(x) dispositif(s) d'actionnement de fluide.
PCT/US2019/066658 2019-12-16 2019-12-16 Matrices à fluide à chauffage intégré WO2021126161A1 (fr)

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Application Number Priority Date Filing Date Title
PCT/US2019/066658 WO2021126161A1 (fr) 2019-12-16 2019-12-16 Matrices à fluide à chauffage intégré

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182578A (en) * 1988-06-29 1993-01-26 Mannesmann Ag Heating mechanism for warming the ink in the write head of an ink printer means
JPH1016230A (ja) * 1996-07-04 1998-01-20 Canon Inc プリントヘッドおよびプリント装置
US6435668B1 (en) * 1999-02-19 2002-08-20 Hewlett-Packard Company Warming device for controlling the temperature of an inkjet printhead
US20080150977A1 (en) * 2005-04-08 2008-06-26 Xaarjet Limited Inkjet Printer Driver Circuit Architecture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5182578A (en) * 1988-06-29 1993-01-26 Mannesmann Ag Heating mechanism for warming the ink in the write head of an ink printer means
JPH1016230A (ja) * 1996-07-04 1998-01-20 Canon Inc プリントヘッドおよびプリント装置
US6435668B1 (en) * 1999-02-19 2002-08-20 Hewlett-Packard Company Warming device for controlling the temperature of an inkjet printhead
US20080150977A1 (en) * 2005-04-08 2008-06-26 Xaarjet Limited Inkjet Printer Driver Circuit Architecture

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