WO2021120512A1

WO2021120512A1 - Electronic device

Info

Publication number: WO2021120512A1
Application number: PCT/CN2020/091359
Authority: WO
Inventors: 刘彦铭; 王冠渊; 林东毅
Original assignee: 神盾股份有限公司
Priority date: 2019-12-16
Filing date: 2020-05-20
Publication date: 2021-06-24
Also published as: TW202125320A; TWM602662U; CN111444900A; CN211857498U

Abstract

Provided is an electronic device (100), comprising a frame body (110), a display panel (120), a bottom plate (130) and a fingerprint sensing module (140). The frame body (110) has a first top surface (112) and a first bottom surface (114). The display panel (120) is configured on the first top surface (112) of the frame body (110) and provides an illumination light beam (L1) to a finger (10) so that a sensing light beam (L2) is reflected. The bottom plate (130) is configured on the frame body (110) and has a second top surface (132) and a second bottom surface (134), which are parallel to each other. The fingerprint sensing module (140) is configured on the second top surface (132) of the bottom plate (130) and receives the sensing light beam (L2).

Description

Electronic device

Technical field

The invention relates to an electronic device, in particular to an electronic device with fingerprint identification function.

Background technique

With the development of portable electronic devices (such as smart phones or tablet computers) towards large screen-to-body ratios or full screens. In the process of manufacturing an electronic device containing an optical fingerprint sensor module, the steel plate used to carry the fingerprint sensor module needs to be processed in a special shape, and then the middle frame of the electronic device is processed, so that the above two components are Assemble during the process. However, this method will cause the shape of the steel plate to be processed in accordance with the middle frame structure, which will increase the manufacturing cost. In addition, due to the large number of processing times, assembly tolerances are increased, resulting in a decrease in assembly yield and quality.

Summary of the invention

The invention provides an electronic device, which can reduce the processing process of the frame and the bottom plate of the electronic device, and reduce the assembly tolerance that needs to be controlled when the electronic device is assembled.

The invention provides an electronic device including a frame, a display panel, a bottom plate and a fingerprint sensing module. The frame has a first top surface and a first bottom surface. The display panel is disposed on the first top surface of the frame, and provides an illumination beam to the finger to reflect the sensing beam. The bottom plate is disposed on the frame and has a second top surface and a second bottom surface that are parallel to each other. The fingerprint sensing module is configured on the second top surface of the bottom plate and receives the sensing beam.

Based on the above, in the electronic device of the present invention, the bottom plate used to carry the fingerprint sensing module is a flat plate, and the bottom plate is disposed on the frame. Therefore, the bottom plate does not need additional processing and can be directly connected to the bottom surface of the frame. In this way, the processing process of the frame and the bottom plate of the electronic device can be reduced, and the assembly tolerance that needs to be controlled during the assembly of the electronic device can be reduced.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the accompanying drawings for detailed descriptions.

Description of the drawings

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention;

FIG. 2 is a schematic diagram of assembling the electronic device of FIG. 1;

3 is a schematic diagram of an electronic device according to another embodiment of the invention;

4 is a schematic diagram of an electronic device according to another embodiment of the invention;

5 is a schematic diagram of an electronic device according to another embodiment of the invention;

FIG. 6 is a schematic diagram of assembling the electronic device of FIG. 5;

FIG. 7 is a schematic diagram of an electronic device according to another embodiment of the invention.

Description of reference signs:

10: finger;

100, 100A, 100B, 100C, 100D: electronic devices;

110, 110A, 110B: frame;

112: the first top surface;

113: side;

114: the first bottom surface;

116: groove;

120: display panel;

130, 130A: bottom plate;

132: The second top surface;

134: The second bottom surface;

140, 140A: fingerprint sensor module;

142: Circuit board;

144: Sensing component;

146: Elastic connector;

148, 148A: filter layer;

150: Adhesive parts;

D1: horizontal direction;

D2: vertical direction;

L1: Illumination beam;

L2: sensing beam;

S: Connection surface.

Detailed ways

The embodiments of the present invention will be described in detail below with the accompanying drawings. It can be understood that the attached drawings are used for description and explanation purposes, not for limitation purposes. For the sake of clarity, the components may not be shown according to actual scale. In addition, some components and/or component symbols may be omitted in some drawings. In the specification and drawings, the same or similar component symbols are used to indicate the same or similar components. When it is stated that a component is "installed in", "connected to"... another component, the component can be "directly installed in", "directly connected"... another component, or an intermediary Components. It can be expected that the elements and features in one embodiment can be incorporated into another embodiment and bring benefits when feasible, and this is not further elucidated.

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention. Please refer to Figure 1. This embodiment provides an electronic device 100 including a frame 110, a display panel 120, a bottom plate 130, and a fingerprint sensing module 140. The electronic device 100 has a fingerprint recognition function, which is suitable for allowing a user to perform fingerprint sensing by pressing on the display panel 120. Specifically, the display panel 120 transmits the illumination light beam L1 to the user's finger 10 to reflect and generate the sensing light beam L2. The electronic device 100 receives the sensing light beam L2 for fingerprint sensing. For example, the electronic device 100 is, for example, a smart phone, a tablet computer, a notebook computer, or a touch-sensitive display device, etc., and the present invention is not limited thereto.

The frame 110 has a first top surface 112 and a first bottom surface 114. Specifically, the frame body 110 is, for example, a middle frame of the electronic device 100, and is used to carry, separate, and fix the electronic components in the electronic device 100. In different embodiments, the frame body 110 may be a stiffener additionally configured in the electronic device 100, and the present invention is not limited thereto.

The display panel 120 is disposed on the first top surface 112 of the frame 110, and provides the illumination beam L1 to the finger 10 to reflect the sensing beam L2. The display panel 120 is, for example, an organic light-emitting diode (OLED) display panel. However, in other embodiments, the display panel 120 can also be a liquid crystal display panel or other suitable display panels, and the present invention is not limited to this.

The bottom plate 130 has a second top surface 132 and a second bottom surface 134 parallel to each other. The bottom plate 130 is, for example, a steel plate for supporting the fingerprint sensor module 140. In other words, compared to the traditional shape of the bottom plate, the bottom plate 130 of this embodiment is flat, which means that the thickness of the bottom plate 130 is the same in the horizontal direction D1. In other words, in this embodiment, the bottom plate 130 does not require additional processing. The bottom plate 130 is disposed on the frame body 110. Specifically, the frame body 110 has a connecting surface S, and the bottom plate 130 is connected to the connecting surface S. In this embodiment, a part of the first bottom surface 114 of the frame 110 is the connecting surface S, but the present invention is not limited to this.

The fingerprint sensing module 140 is disposed on the second top surface 132 of the bottom plate 130 and receives the sensing light beam L2. In detail, the fingerprint sensing module 140 includes a circuit board 142, a sensing component 144 and an elastic connector 146. The circuit board 142 is connected to the display panel 120 through the elastic connecting member 146. The sensing component 144 is, for example, an image sensing chip such as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD). The elastic connecting member 146 is, for example, an elastic component with a foamed structure such as foam.

More specifically, the fingerprint sensing module 140 further includes a filter layer 148 disposed on the circuit board 142 to cover the sensing component 144. The filter layer 148 is, for example, an infrared light cutoff filter to filter out infrared light, thereby improving the quality of optical sensing. However, in other embodiments, the filter layer 148 may also be a filter for filtering other visible light wavebands or invisible light wavebands. In addition, this embodiment does not limit the type or form of the fingerprint sensing module 140, and its detailed structure and implementation manners can be obtained from the technical in the art with sufficient teachings, suggestions and implementation descriptions, and therefore will not be repeated.

FIG. 2 is a schematic diagram of assembling the electronic device of FIG. 1. Please refer to Figure 1 and Figure 2. In the process of assembling the electronic device 100, the display panel 120 is first arranged on the frame 110, and the fingerprint sensor module 140 is arranged on the bottom plate 130, and finally the fingerprint sensor module 140 is extended into the frame 110 to perform the bottom plate 130 The second top surface 132 is connected to the first bottom surface 114 of the frame 110. In detail, the electronic device 100 further includes an adhesive 150 connected between the frame 110 and the bottom plate 130. In this embodiment, the adhesive 150 is, for example, a curing glue, but the invention is not limited to this. Since the bottom plate 130 does not require additional processing, it can be directly connected to the first bottom surface 114 of the frame body 110, as shown in FIG. 1. In this way, the manufacturing process of the frame body 110 and the bottom plate 130 can be reduced, and the assembly tolerances that need to be controlled during the assembly of the electronic device 100 can be reduced.

FIG. 3 is a schematic diagram of an electronic device according to another embodiment of the invention. Please refer to Figure 3. The electronic device 100A of this embodiment is similar to the electronic device 100 shown in FIG. 1. The difference between the two is that, in this embodiment, the frame 110A has a groove 116 extending from the first bottom surface 114 to the first top surface 112, and the connecting surface S is located in the groove 116. Specifically, the bottom plate 130 is connected to the connecting surface S in the groove 116 through an adhesive 150. In this way, the thickness of the overall electronic device 100A can be further reduced. This embodiment does not limit the type or shape of the groove 116, and the detailed structure and implementation of the groove 116 can obtain sufficient teachings, suggestions, and implementation descriptions from the technology in the art, so it will not be repeated.

FIG. 4 is a schematic diagram of an electronic device according to another embodiment of the invention. Please refer to Figure 4. The electronic device 100B of this embodiment is similar to the electronic device 100A shown in FIG. 3. The difference between the two is that in this embodiment, the fingerprint sensor module 140A is an embedded infrared filter layer module. Specifically, the filter layer 148A is directly formed on the upper surface of the sensing element 144, as shown in FIG. 4. In this way, the structure of the fingerprint sensing module 140A can be simplified, and can be further applied to different requirements.

FIG. 5 is a schematic diagram of an electronic device according to another embodiment of the invention. Please refer to Figure 5. The electronic device 100C of this embodiment is similar to the electronic device 100 shown in FIG. 1. The difference between the two is that, in this embodiment, the connecting surface S of the frame 110B is, for example, an oblique plane inclined to the first bottom surface 114, and extends from the first bottom surface 114 toward the side surface 113 of the frame 110B, and the bottom plate 130A Connected to the connecting surface S. Specifically, the bottom plate 130A is connected to the connecting surface S of the frame 110B through the adhesive 150. This embodiment does not limit the type or form of the connecting surface S, and its detailed structure and implementation manners can be obtained from the technology in the art with sufficient teaching, suggestion and implementation description, so it will not be repeated.

FIG. 6 is a schematic diagram of assembling the electronic device of FIG. 5. Please refer to Figure 5 and Figure 6. In addition, in this embodiment, the first bottom surface 114 of the frame 110B is coplanar with the second bottom surface 134 of the bottom plate 130A, and the bottom plate 130A and the circuit board 142 of the fingerprint sensor module 140 are aligned in the vertical direction D2. . Therefore, when assembling the electronic device 100A, the fingerprint sensor module 140 can be aligned on the bottom plate 130A and then assembled, and then the above-mentioned combination can be assembled in the hollow of the frame 110B, and the adhesive part can be provided after the assembly is completed. 150 (for example, it is provided on the connecting surface S in a dispensing manner) for connecting and fixing. In this way, the thickness of the overall electronic device 100C can be further reduced, and the ease of assembly can be simplified, thereby improving the yield of the electronic device 100C.

FIG. 7 is a schematic diagram of an electronic device according to another embodiment of the invention. Please refer to Figure 7. The electronic device 100D of this embodiment is similar to the electronic device 100C shown in FIG. 5. The difference between the two is that in this embodiment, the fingerprint sensor module 140A is an embedded infrared filter layer module. Specifically, the filter layer 148A is directly formed on the upper surface of the sensing element 144, as shown in FIG. 7. In this way, the structure of the fingerprint sensing module 140A can be simplified, and can be further applied to different requirements.

In summary, in the electronic device of the present invention, the bottom plate used to carry the fingerprint sensing module is a flat plate, and the bottom plate is disposed on the frame. Therefore, the bottom plate does not need additional processing and can be directly connected to the bottom surface of the frame. In this way, the processing process of the frame and the bottom plate of the electronic device can be reduced, and the assembly tolerance that needs to be controlled during the assembly of the electronic device can be reduced.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any person skilled in the art, without departing from the spirit and scope of the present invention, can make some changes and modifications, so the protection of the present invention The scope should be determined by the claims.

Claims

An electronic device, characterized in that it comprises:

The frame has a first top surface and a first bottom surface;

The display panel is disposed on the first top surface of the frame, and provides an illuminating beam to the finger to reflect the sensing beam;

The bottom plate is disposed on the frame and has a second top surface and a second bottom surface that are parallel to each other; and

The fingerprint sensing module is configured on the second top surface of the bottom plate and receives the sensing light beam.
The electronic device of claim 1, wherein the thickness of the bottom plate is the same in the horizontal direction.
The electronic device according to claim 1, further comprising:

The adhesive piece is connected between the frame body and the bottom plate.
The electronic device according to claim 3, wherein the adhesive member is a curing glue.
The electronic device according to claim 1, wherein the frame has a connecting surface, and the bottom plate is connected to the connecting surface.
The electronic device according to claim 5, wherein the frame has a groove, the groove extends from the first bottom surface toward the first top surface, and the connecting surface is located in the groove. groove.
The electronic device according to claim 5, wherein the connecting surface of the frame body is inclined to the first bottom surface.
3. The electronic device of claim 1, wherein the first bottom surface of the frame body is coplanar with the second bottom surface of the bottom plate.
The electronic device of claim 1, wherein the bottom plate and the circuit board of the fingerprint sensing module are aligned in a vertical direction.
The electronic device according to claim 1, wherein the fingerprint sensing module comprises a circuit board, a sensing component, and an elastic connector, and the circuit board is connected to the display panel through the elastic connector.