WO2018145234A1

WO2018145234A1 - Fingerprint recognition device

Info

Publication number: WO2018145234A1
Application number: PCT/CN2017/073021
Authority: WO
Inventors: 许炜添
Original assignee: 深圳市汇顶科技股份有限公司
Priority date: 2017-02-07
Filing date: 2017-02-07
Publication date: 2018-08-16
Also published as: CN108701212B; CN108701212A

Abstract

A fingerprint recognition device, comprising: a circuit board (1), a conductive component (2), a sensor chip (3), a collar (4) and a cover plate (6); the sensor chip (3) being provided on the circuit board (1) by means of the conductive component (2), the collar (4) surrounding the outer side of the sensor chip (3), the cover plate (6) covering the sensor chip (3) and the collar (4) from above. By adding, on the outer side of the sensor chip (3) having a minimum package, a collar (4) of which the color and material are close to those of the sensor chip (3), said fingerprint recognition device solves the problem that the dimensions of the sensor chip (3) having a minimum package cannot meet appearance requirements, avoids the problem of deformation of the cover plate (6), caused due to the fact that the cover plate (6) is prone to stress pulling after the cover plate (6) has been bonded in the case of use of a support frame, and the problem of color difference after the cover plate (6) has been bonded, and reduces module costs.

Description

Fingerprint identification device

[Technical Field]

The present invention relates to the field of biometrics, and in particular, to a fingerprint identification device.

【Background technique】

At present, with the increasing consumer's pursuit of product appearance, the internal components and modules of consumer electronic products are increasingly pursuing the ultimate in performance and technology. As shown in FIG. 1 , it is a schematic structural diagram of an existing fingerprint module. The existing fingerprint module includes components such as a cover plate 1, a sensor package piece 2, a circuit board 3, and a support frame 4.

The smallest package sensor chip is commonly used in existing fingerprint modules. However, since the size of the smallest package sensor chip often cannot meet the user's requirements for appearance, it is necessary to fill other spaces through the support frame 4 as shown in FIG. 1; since the material of the support frame is usually metal, and the minimum package sensor chip The material is resin, and the thermal expansion coefficient of the two is different during the assembly process, and the bonding of the cover plate is easily pulled by the stress to cause deformation. In addition, there is a big difference in the color of the support frame and the minimum package sensor chip, and chromatic aberration often occurs after the cover plate is attached.

[Summary of the Invention]

The embodiment of the invention provides a fingerprint identification device, which aims to solve at least one of the above technical problems in the prior art.

In order to solve the above problems, the technical solutions adopted by the embodiments of the present invention include:

A fingerprint identification device includes a circuit board, a conductive component, a sensor chip, a collar and a cover plate; the sensor chip is mounted on the circuit board through a conductive component, and the collar is disposed around the outer side of the sensor chip, A cover plate covers the sensor chip and the collar.

The technical solution adopted by the embodiment of the present invention further includes a support frame, and the support frame is disposed around the outer side of the collar.

The technical solution adopted by the embodiment of the invention further includes a first fixing component, and the bottom of the collar is fixed to the circuit board by the first fixing component.

The technical solution adopted by the embodiment of the present invention further includes: a second fixing component, the support frame has a stepped shape, and a stepped corner of the inner edge of the support frame is overlapped above the collar, and the bottom of the support frame The second fixing component is fixed to the circuit board, and the collar is fixed by the support frame.

The technical solution adopted by the embodiment of the present invention further includes: the support frame is an L-shaped structure, an inner edge of the vertical surface of the L-shaped structure is in contact with an outer edge of the collar, and a horizontal plane of the L-shaped structure passes through the second fixing component. Fixed to the board.

The technical solution adopted by the embodiment of the present invention further includes a bonding component, and the cover plate is bonded by the bonding component and covers the sensor chip and the collar.

The technical solution adopted by the embodiment of the invention further includes: an adhesive layer of the cover plate and the bonding component is provided with an ink layer.

The technical solution adopted by the embodiment of the present invention further includes: providing a blind hole on the cover plate at a position relative to the sensor chip and the collar.

The technical solution adopted by the embodiment of the present invention further includes: the collar is a ring structure, and the collar corresponds to a size of the sensor chip, and the material of the collar is synthetic resin or natural resin.

The technical solution adopted by the embodiment of the invention further includes that the conductive component comprises solder or conductive adhesive.

The technical solution adopted by the embodiment of the present invention further includes: the bonding component comprises an adhesive member or an adhesive film of an epoxy group, a silica gel system or an acrylic system.

The technical solution adopted by the embodiment of the present invention further includes: the first fixing component comprises an underfill or a structural adhesive.

The technical solution adopted by the embodiment of the present invention further includes: the second fixing component comprises a structural adhesive or a conductive silver glue.

Another technical solution adopted by the embodiment of the present invention is: a mobile terminal, including the fingerprint identification device described above.

Compared with the prior art, the beneficial effect of the embodiment of the present invention is that the fingerprint identification device of the embodiment of the present invention solves the minimum package sensor by adding a collar with a color and a material close to the outer side of the smallest package sensor chip. The size of the chip can not meet the appearance requirements, and avoids the problem that the use of the support frame causes the deformation of the cover to be easily pulled by the stress after the cover is attached, and the chromatic aberration occurs after the cover is attached, and the module cost is reduced.

[Description of the Drawings]

1 is a schematic structural view of a conventional fingerprint module;

2 is a schematic structural diagram of a fingerprint identification device according to a first embodiment of the present invention;

3 is a schematic structural diagram of a fingerprint identification device according to a second embodiment of the present invention;

4 is a view showing an application effect of the fingerprint identification device of the first embodiment and the second embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a fingerprint identification apparatus according to a third embodiment of the present invention; FIG.

6 is a schematic view of a cover plate provided with a blind hole according to a third embodiment of the present invention;

Fig. 7 is a view showing an application effect of the fingerprint recognition apparatus of the third embodiment of the present invention.

【detailed description】

In order to facilitate the understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the understanding of the present disclosure will be more fully understood.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention.

Please refer to FIG. 2, which is a schematic structural diagram of a fingerprint identification apparatus according to a first embodiment of the present invention. The fingerprint identification device of the first embodiment of the present invention comprises a circuit board 1, a conductive component 2, a sensor chip 3, a collar 4, a support frame 5, a cover plate 6, and a bonding assembly 7; wherein the sensor chip 3 is mounted by the conductive component 2 Set in electricity The circuit board 1 is electrically connected to the circuit board 1. The collar 4 is disposed around the outer side of the sensor chip 3. The bottom of the collar 4 is fixed to the circuit board 1 by the first fixing component 8. The support frame 5 is disposed on the outer side of the collar 4, and the support frame 5 has a stepped shape, the stepped corner of the inner edge overlaps the collar 4, and the bottom is fixed to the circuit board 1 by the second fixing component 9; The collar 4 is pressed by the support frame 5 to fix the collar 4. The cover plate 6 is bonded by the bonding member 7 and covers the sensor chip 3 and the collar 4, and the bonding surface of the cover plate 6 and the bonding member 7 is provided with an ink layer 10.

In the first embodiment of the present invention, the top ends of the support frame 5 and the cover plate 6 may be in the same plane or may not be in the same plane, and may be disposed according to assembly requirements.

In the first embodiment of the present invention, the conductive member 2 includes solder or conductive paste or the like.

In the first embodiment of the present invention, the collar 4 is a ring structure, the sensor chip 3 is a minimum package sensor chip, and the collar 4 corresponds to the size of the sensor chip 3. The collar 4 is made of high molecular weight synthetic resin or The natural resin is similar to the color and material of the sensor chip 3. Therefore, the size of the sensor chip can not meet the appearance requirements, and the deformation of the cover is easy to be deformed by the stress after the cover is attached, and the cover is attached. After the problem of chromatic aberration.

In the first embodiment of the present invention, the bonding member 7 is an epoxy group, a silica gel system, an adhesive of an acrylic system, or an adhesive film.

In the first embodiment of the present invention, the first fixing component 8 is a curing gel such as an underfill or a structural adhesive.

In the first embodiment of the present invention, the second fixing component 9 is a structural adhesive or a conductive silver adhesive, and the bottom of the support frame 5 can also be fixed on the circuit board 1 by soldering.

Please refer to FIG. 3, which is a schematic structural diagram of a fingerprint identification apparatus according to a second embodiment of the present invention. A fingerprint identification device according to a second embodiment of the present invention includes a circuit board 1, a conductive component 2, a sensor chip 3, a collar 4, a support frame 5, a cover plate 6, and a bonding assembly 7; wherein the sensor chip 3 is mounted by the conductive component 2 It is disposed on the circuit board 1 and electrically connected to the circuit board 1; the collar 4 is disposed around the outer side of the sensor chip 3, and the bottom of the collar 4 is fixed to the circuit board 1 by the first fixing component 8. The support frame 5 is disposed around the outer side of the collar 4, the support frame 5 is of an L-shaped structure, the inner edge of the vertical face of the L-shaped structure is in contact with the outer edge of the collar 4, and the horizontal plane of the L-shaped structure is fixed by the second fixing component 9 On board 1. Cover plate 6 is glued The joint assembly 7 is bonded and covered over the sensor chip 3 and the collar 4, and the adhesive layer of the cover 6 and the bonding assembly 7 is provided with an ink layer 10.

In the second embodiment of the present invention, the top ends of the support frame 5 and the cover plate 6 may be in the same plane or may not be in the same plane, and may be disposed according to assembly requirements.

In the second embodiment of the present invention, the conductive member 2 includes solder or conductive paste or the like.

In the second embodiment of the present invention, the collar 4 is a ring structure, the sensor chip 3 is a minimum package sensor chip, the collar 4 corresponds to the size of the sensor chip 3, and the collar 4 is made of a high molecular weight synthetic resin or The natural resin is similar to the color and material of the sensor chip 3. Therefore, the size of the sensor chip can not meet the appearance requirements, and the deformation of the cover is easy to be deformed by the stress after the cover is attached, and the cover is attached. After the problem of chromatic aberration.

In the second embodiment of the present invention, the bonding member 7 is an epoxy group, a silica gel system, an adhesive of an acrylic system, or an adhesive film.

In the second embodiment of the present invention, the first fixing component 8 is a curing gel such as an underfill or a structural adhesive.

In the second embodiment of the present invention, the second fixing component 9 is a structural adhesive or a conductive silver paste, and the bottom of the support frame 5 can also be fixed on the circuit board 1 by soldering.

Please refer to FIG. 4, which is an application effect diagram of the fingerprint identification device according to the first embodiment and the second embodiment of the present invention. In the first embodiment and the second embodiment, by adding a collar 4 having a color and a material close to the outside of the sensor chip 3 of the smallest package, and fixing the collar 4 through the outer support frame 5, Resolving the size of the smallest package sensor chip can not meet the appearance requirements, and avoids the problem that the use of the support frame causes the deformation of the cover plate to be easily pulled by the stress after the cover is attached, and the chromatic aberration occurs after the cover plate is attached.

Please refer to FIG. 5, which is a schematic structural diagram of a fingerprint identification apparatus according to a third embodiment of the present invention. A fingerprint identification device according to a third embodiment of the present invention includes a circuit board 1, a conductive component 2, a sensor chip 3, a collar 4, a cover plate 6, and a bonding assembly 7; wherein the sensor chip 3 is mounted on the circuit board through the conductive component 2 1 and electrically connected to the circuit board 1; the collar 4 is disposed around the outer side of the sensor chip 3, and the bottom of the collar 4 is fixed to the circuit board 1 by the first fixing component 8. The cover plate 6 is bonded and covered by the bonding assembly 7 Above the sensor chip 3 and the collar 4, an ink layer 10 is provided on the bonding surface of the cover 6 and the bonding assembly 7. A blind hole 11 is disposed on the cover plate 6 at a position relative to the sensor chip 3 and the collar 4, as shown in FIG. 6, which is a schematic view of a cover plate provided with a blind hole according to the third embodiment of the present invention.

In the third embodiment of the present invention, the conductive member 2 includes solder or conductive paste or the like.

In the third embodiment of the present invention, the collar 4 is a ring structure, the sensor chip 3 is a minimum package sensor chip, and the collar 4 corresponds to the size of the sensor chip 3. The collar 4 is made of high molecular weight synthetic resin or The natural resin is similar to the color and material of the sensor chip 3. Therefore, the size of the sensor chip can not meet the appearance requirements, and the deformation of the cover is easy to be deformed by the stress after the cover is attached, and the cover is attached. After the problem of chromatic aberration.

In the third embodiment of the present invention, the bonding member 7 is an epoxy group, a silica gel system, an adhesive of an acrylic system, or an adhesive film.

In the third embodiment of the present invention, the first fixing component 8 is a curing gel such as an underfill or a structural adhesive.

In the third embodiment of the present invention, the blind hole in the cover plate 6 can be processed by machining or chemical etching, and the blind hole is slightly larger than the size of the collar 4; in the embodiment of the present invention, blindness is set on the cover plate. The fingerprint recognition device of the embodiment of the present invention is used for IFS (Invisible Fingerprint Sensor), which is hidden under the touch panel, that is, the fingerprint recognition sensor is placed directly on the touch screen of the Android mobile phone. Above the panel) and ensure the penetration of the sensor chip 3.

Please refer to FIG. 7, which is a view showing an application effect of the fingerprint recognition apparatus according to the third embodiment of the present invention. In the third embodiment of the present invention, the fingerprint recognition device is used on the IFS by providing the blind hole 11 on the cover 6, and the penetration of the sensor chip 3 is ensured.

It should be understood that the fingerprint identification device provided by the above embodiments of the present invention can be applied to a mobile terminal having a fingerprint recognition function such as a mobile phone, a tablet computer, a notebook computer, or a media player.

The fingerprint identification device of the embodiment of the invention adds a collar and a material close to the outer side of the smallest package sensor chip, and the size of the minimum package sensor chip cannot meet the appearance requirement, and the use of the support frame is avoided. After the cover is attached, it is easily pulled by stress and deformed. And the problem of chromatic aberration after the cover is attached, and the cost of the module is reduced.

The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and combinations thereof may be made without departing from the spirit and scope of the invention. Simplifications should all be equivalent replacements and are included in the scope of the present invention.

Claims

A fingerprint identification device, comprising: a circuit board, a conductive component, a sensor chip, a collar and a cover; the sensor chip is mounted on the circuit board through a conductive component, and the collar is disposed around the sensor chip On the outside, the cover plate covers the sensor chip and the collar.
The fingerprint recognition device according to claim 1, further comprising a support frame disposed around the outer side of the collar.
The fingerprint recognition device according to claim 1 or 2, further comprising a first fixing component, the bottom of the collar being fixed to the circuit board by the first fixing component.
The fingerprint identification device according to claim 2, further comprising a second fixing component, wherein the support frame has a stepped shape, and a stepped corner of the inner edge of the support frame overlaps above the collar, The bottom of the support frame is fixed to the circuit board by a second fixing component, and the collar is fixed by the support frame.
The fingerprint identification device according to claim 4, wherein the support frame is an L-shaped structure, and an inner edge of the vertical surface of the L-shaped structure is in contact with an outer edge of the collar, and a horizontal plane of the L-shaped structure passes The second fixing component is fixed to the circuit board.
The fingerprint recognition device according to any one of claims 1 to 5, further comprising a bonding assembly, the cover plate being bonded by the bonding member and covering the sensor chip and the collar.
The fingerprint recognition device according to claim 6, wherein the bonding surface of the cover plate and the bonding member is provided with an ink layer.
The fingerprint recognition device according to claim 1, wherein a blind hole is provided in the cover plate at a position relative to the sensor chip and the collar.
The fingerprint identification device according to any one of claims 1 to 8, wherein the collar is a ring structure, the collar corresponds to a size of a sensor chip, and the collar is made of synthetic resin or Natural resin.
The fingerprint recognition device according to any one of claims 1 to 9, wherein the conductive component comprises solder or a conductive paste.
The fingerprint recognition device according to claim 6 or 7, wherein the bonding member comprises an adhesive member or an adhesive film of an epoxy group, a silica gel system or an acrylic system.
The fingerprint recognition device according to claim 3, wherein the first fixing component comprises an underfill or a structural adhesive.
The fingerprint identification device according to claim 4 or 5, wherein the second fixing component comprises a structural adhesive or a conductive silver paste.
A mobile terminal characterized by comprising the fingerprint identification device according to any one of claims 1 to 13.