TWM589833U - Image capturing device and electronic device using the same - Google Patents

Abstract

An image capturing device for capturing a fingerprint image comprises a substrate, an optical sensor, an optical assembly and a surrounding wall assembly. The optical sensor is disposed on a surface of the substrate, and conductive to the substrate via wires. The optical assembly has a light incident face and a light outputting surface opposite to the light incident face, wherein the optical assembly is disposed on the optical sensor, and the light outputting surface is facing to the optical sensor. The surrounding wall assembly is disposed on a surface of the substrate and surrounds the optical assembly and the optical sensor.

Description

Image pickup device and electronic device using the same

The present invention relates to an imaging device for acquiring fingerprint images, and in particular to an imaging device capable of being installed under a screen and an electronic device with a fingerprint recognition function using the imaging device.

Fingerprint identification devices are divided into capacitive and optical types. Capacitive fingerprint identification devices mainly record fingerprint characteristics through changes in capacitance at multiple touch points, while optical fingerprint identification devices directly acquire fingerprint images to record fingerprint characteristics . Capacitive fingerprint identification devices are susceptible to moisture or other electronic noise, and there is a problem of misjudgment. Furthermore, if an electronic device (such as a smart phone or tablet) that uses a capacitive fingerprint recognition device has items such as protective stickers or tempered glass attached, it may cause the capacitive fingerprint recognition device to fail to recognize the fingerprint.

Although the optical fingerprint recognition device can solve the technical problem that the fingerprint cannot be recognized due to the protective sticker or toughened glass, for the current electronic device, the image pickup device in the optical fingerprint recognition device needs to be installed in the electronic The specific location of the device. Although the image capturing device used to obtain the fingerprint image may be provided on the back plate of the handheld device, in order to make the user's fingers easily accessible, the location of the image capturing device cannot be close to or the same as the camera lens, which causes aesthetic problems. Another way is to place the imaging device under the screen, where the screen is realized by a display screen or a touch screen. However, when the image capturing device is disposed under the screen, it is still necessary to fix the image capturing device to the middle frame of the display screen or the touch screen.

In the traditional method, the lens module of the image capturing device is fixed by being locked to the outer wall (or housing) of the light sensor, and then the image capturing device is fixed to the middle frame by adhesion. The above locking method makes the distance between the lens modules of different image capturing devices relative to the light sensor have a larger tolerance. Furthermore, the lens module is locked to the outer wall (or housing) of the light sensor The way is also relatively easy to damage the lens module. In addition, due to the above tolerances, when the above-mentioned imaging device is shipped from the factory, it is necessary to adjust the distance of the lens module relative to the light sensor through testing to make the imaging of the light sensor meet the requirements. The way is to rotate the lens module.

Based on at least one of the foregoing purposes, embodiments of the present invention provide an image capturing device for acquiring fingerprint images, and the image capturing device includes a substrate, a light sensor, an optical component, and a surrounding wall component. The light sensor is located on the surface of the substrate and communicates with the substrate through a plurality of wires. The optical component has a light incident surface and a light exit surface opposite to the light incident surface, wherein the optical component is located above the light sensor, and the light exit surface faces the light sensor. The surrounding wall assembly is located on the surface of the substrate, and surrounds the light sensor and the optical assembly.

Based on at least one of the foregoing objectives, an embodiment of the present invention provides an electronic device. The electronic device includes the above-described image capturing device and a screen, wherein the image capturing device is disposed under the screen.

In short, the image capturing device for acquiring fingerprint images according to an embodiment of the present invention may be disposed under the screen of the electronic device and adhere to the middle frame of the screen. The imaging device can effectively reduce the tolerance of the distance of the optical component relative to the light sensor, and there is no need to adjust the distance of the optical component relative to the light sensor for optical focus adjustment at the factory. In addition, the imaging device has the advantages of simpler manufacturing process, easy mass production, higher yield and lower cost.

In order to make the above-mentioned and other objects, features and advantages of the new model more obvious and understandable, with the accompanying drawings, detailed descriptions are as follows.

1‧‧‧Electronic device

11‧‧‧ screen

12‧‧‧Acquisition device

13‧‧‧Housing

AA‧‧‧hatching

212, 312, 412‧‧‧ shielding layer

512, 612, 712‧‧‧ masking layer

213, 313, 413‧‧‧ buffer layer

513, 613, 713‧‧‧ buffer layer

214, 314, 4144 ‧‧‧ middle frame

514, 614, 714

2~7‧‧‧Electronic device

21, 31, 41‧‧‧ screen

51, 61, 71‧‧‧ screen

211, 311, 411‧‧‧ Panel

511, 611, 711‧‧‧ Panel

523, 623, 723‧‧‧ filter

224, 324, 424 ‧‧‧ optical components

524,624,724‧‧‧Optical components

225, 325, 425

525, 625, 725‧‧‧ wire

226‧‧‧Colloid

215, 415, 515 ‧‧‧ adhesive layer

516、615‧‧‧adhesive layer

22, 32, 42‧‧‧ acquisition device

52, 62, 72 ‧‧‧ acquisition device

221, 321, 421‧‧‧ substrate

521, 621, 721‧‧‧ substrate

222, 322, 422

522, 622, 722

223, 323, 423‧‧‧ filter

227, 327, 427‧‧‧ light sensor

527, 627, 727‧‧‧ light sensor

34, 44, 64, 66, 74~76‧‧‧‧dispensing

35‧‧‧Inner edge

4211, 6211, 7211‧‧‧Locating hole

5211‧‧‧Second locking hole

5221‧‧‧First locking hole

628, 728‧‧‧ Base assembly

FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the invention.

2A is a cross-sectional view of an imaging device and a screen according to the first embodiment of the present invention.

FIG. 2B is a schematic diagram of the manufacturing process of the bonding between the imaging device and the screen according to the first embodiment of the present invention.

3 is a cross-sectional view of an imaging device and a screen of a second embodiment of the present invention.

4A is a cross-sectional view of an imaging device and a screen according to a third embodiment of the present invention.

FIG. 4B is a schematic diagram of the manufacturing process of the bonding between the image capturing device and the screen according to the third embodiment of the present invention.

5A is a cross-sectional view of an imaging device and a screen according to a fourth embodiment of the present invention.

FIG. 5B is a schematic diagram of the manufacturing process of the bonding between the imaging device and the screen according to the fourth embodiment of the present invention.

6A is a cross-sectional view of an imaging device and a screen of a fifth embodiment of the present invention.

FIG. 6B is a schematic diagram of the manufacturing process of the bonding between the imaging device and the screen according to the fifth embodiment of the present invention.

7 is a cross-sectional view of an imaging device and a screen according to a sixth embodiment of the present invention.

In order to fully understand the purpose, features and efficacy of the new model, the following specific examples and the accompanying drawings are used to make a detailed description of the new model, as described below.

An embodiment of the present invention provides an image capturing device including a substrate, a light sensor, an optical component and a component surrounding a wall surface, wherein the optical component includes a receiving part and a lens module, wherein the lens module is received by the receiving part In it. The manufacturing process of the imaging device is roughly explained as follows. First, a substrate is provided. Then, a light sensor is formed on the surface on the substrate, and wire bonding is performed to conduct the light sensor to the substrate through a plurality of wires. Next, the optical component is disposed on the light sensor, wherein the light exit surface of the optical component faces the light sensor. Then, a surrounding wall assembly for surrounding the photo sensor is formed on the surface of the substrate.

At least a part of the image capturing device surrounding the wall assembly is used for adhering the middle frame of the electronic device, so that the image capturing device can be disposed under the screen. In addition, the manufacturing process of the image capturing device is relatively simple, and there is no need for a locking step and an optical focusing step, so it has the advantages of mass production, higher yield and lower cost. After introducing the design concept of the image capturing device of the new embodiment of the present invention, the details of various embodiments derived from the above design concept and the schematic diagram of the electronic device using the image capturing device are further described.

First, please refer to FIG. 1 of the present invention. FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 1 shows an electronic device 1 with a fingerprint identification function. The electronic device 1 includes a casing 13 and a screen 11 located inside the casing 13. In this implementation, the screen 11 is a touch screen, but the new model is not limited to this, and in some applications, the screen 11 may be a display screen without touch function.

An imaging device 12 is provided under the screen 11. The imaging device 12 is used to obtain the fingerprint image of the user, so that the electronic device 1 can identify the user according to the acquired fingerprint image. The installation position of the image capturing device 12 is generally located at the lower center of the screen 11, and the screen 11 defines a recognition area corresponding to the installation position of the image capturing device 12, so as to facilitate the user to press his finger on the recognition area on the screen 11. The shape of the recognition area is roughly related to the shape of the imaging device 12 in the plane projection. In this embodiment, although the shape of the recognition area is circular or elliptical, the present invention is not limited to the shape of the recognition area, and in other applications, the shape of the recognition area may be square or rectangular.

In addition, the electronic device 1 in FIG. 1 further includes a processing unit, a memory unit, a storage unit and a communication unit (not shown in FIG. 1), wherein the processing unit is electrically connected to the memory unit, the storage unit, the communication unit and the access unit像装置12。 Image device 12. The processing unit receives the fingerprint image signal generated by the imaging device 12 based on the fingerprint image, and recognizes the user based on the fingerprint image signal.

Next, various possible implementations of the image capturing device 12 are further described, wherein the cross-sectional views of the image capturing device and the screen of each embodiment are drawn along the section line AA of FIG. 1.

Please refer to FIG. 2A and FIG. 2B of the present invention. FIG. 2A is a cross-sectional view of the imaging device and the screen of the first embodiment of the present invention. The electronic device 2 includes a screen 21 and an imaging device 22. The screen 21 includes a panel 211, a shielding layer 212, a buffer layer 213, a middle frame 214, and an adhesive layer 215. The panel 211 may be a finger press plate, a light-transmitting cover plate, a touch panel or a display panel, or a combination of at least two of the above. In addition, it should be noted that, in any feasible embodiment of the present invention, the display panel may include an organic light-emitting display panel or a TFT display panel, and is not limited. Please refer to FIG. 1 at the same time. In the embodiment of the present case, the light beam emitted by the panel 211 is suitable for providing light beams for fingerprint imaging. If the panel 211 is a display panel (that is, the screen 11 shown in FIG. 1), The display panel has a display area, and the fingerprint imaging area corresponds to the imaging device 22 and is located in the display area. In addition, the fingerprint imaging area 12 corresponds to the imaging device 22 below, The optical component 224 in the image capturing device 22 is a lens barrel for accommodating at least one lens as a light source screen 211, which can be controlled by a panel brightness at a non-planar position of the lens A device (not shown) to adjust the luminous brightness when taking images to improve the problem of excessive brightness or excessive darkness caused by excessive brightness. In the same way, the brightness of the light emitted during image capturing can be adjusted by a panel brightness control element (not shown) at other positions on the non-planar surface of the lens. The present invention does not limit it here.

2A and 2B, the shielding layer 212, the buffer layer 213 and the middle frame 214 and the adhesive layer 215 are sequentially disposed under the periphery of the panel 211, wherein the shielding layer 212 is formed by a plurality of colored ink layers, And the buffer layer 213 may be formed of foam material or adhesive material. The middle frame 214 has a lower surface and a plurality of extending pillars extending downward from the lower surface. The adhesive layer 215 is disposed on the lower surface between the inner edge of the middle frame 214 and the extending pillars.

The imaging device 22 includes a substrate 221, a surrounding wall assembly 222, an optical assembly 224, a filter 223, and a light sensor 227. The substrate 221 may be a silicon substrate, a glass substrate, or an acrylic substrate provided with wires on its surface, and the present invention is not limited thereto. The surface of the substrate 221 is provided with a light sensor 227 and a surrounding wall assembly 222, wherein the light sensor 227 can be fixed on the surface of the substrate 221 by adhesive.

The surrounding wall assembly 222 is formed by dispensing, and the surrounding wall assembly 222 may be a ring-shaped surrounding wall or be composed of a plurality of surrounding wall connections. The light sensor 227 and the optical component 224 are surrounded by the wall assembly 222, wherein the height of the wall assembly 222 is greater than the height of the light sensor 227. Please note here that the height and forming method around the wall assembly 222 are not used to limit the present invention.

The filter 223 is, for example, an infrared filter, or another filter with a specific band-pass wavelength, which is used to pass a light beam with a specific wavelength to avoid ambient light from interfering with the photo sensor 227, but the present invention does not limit filtering The bandpass wavelength of the optical sheet 223, and even the optical filter 223 may be an unnecessary element. The filter 223 has upper and lower surfaces, and the upper and lower surfaces are respectively glued to the light emitting surface of the optical component 224 and the light sensor 227 s surface. The optical component 224 includes an accommodating member and a lens module, and the lens module is accommodated in the accommodating member. The optical component 224 has a light incident surface and a light exit surface corresponding to the light incident surface, the light incident surface faces the panel 211 of the screen 21, and the light exit surface faces the light sensor 227. The lens module includes a plurality of lenses to obtain a fingerprint image from the light incident surface, and image the fingerprint image on the light sensor 227 through the light exit surface.

The light sensor 227 may be other photoelectric conversion elements of the photodiode, and the reaction zone of the sensor 227 faces the light exit surface of the optical component 224 correspondingly, so as to convert the fingerprint image acquired by the optical component 224 into a fingerprint image signal. The photo sensor 227 is connected to the circuit of the substrate 221 through the plurality of wires 225 to transmit the fingerprint image signal to the processing unit of the electronic device 2 (not shown in FIG. 2 ).

The space within the inner surface surrounding the wall assembly 222 is filled with the colloid 226, and the height of the colloid 226 is approximately equal to the height surrounding the wall assembly 222, so that the surrounding wall assembly 222 and the colloid 226 are adhered to each other through the adhesive layer 215 The lower surface of the middle frame 214.

In the first embodiment, the formation of the imaging device 22 is described as follows. First, the photo sensor 227 is pasted on the surface of the substrate 221. Then, a wire 225 is formed by wire bonding so that the light sensor 227 and the substrate 221 are electrically connected. Next, the optical filter 223 and the optical component 224 are glued on the photo sensor 227 in sequence. Next, the glue is formed to form a space around the wall assembly 222 and to fill the glue 226 in the inner surface of the wall assembly 222.

Next, please refer to FIG. 2B of the present invention. FIG. 2B is a schematic diagram of a process of bonding the image capturing device and the screen of the first embodiment of the present invention. After the imaging device 22 is formed, through the adhesive layer 215 on the lower surface of the middle frame 214, the adhesive layer 215 on the lower surface of the middle frame 214 can be glued to surround the wall assembly 222 and the colloid 226 to allow the imaging The device 22 is bonded to the screen 21 to form the electronic device 2.

Please refer to FIG. 3 of the present invention. FIG. 3 is a cross-sectional view of the imaging device and the screen of the second embodiment of the present invention. Unlike the first embodiment, in the second embodiment, the space in the inner surface of the imaging device 32 of the electronic device 3 surrounding the wall surface assembly 322 is not filled with gel, and the middle frame 314 of the screen 31 of the electronic device 3 Of The lower surface is not provided with an adhesive layer, and the surrounding wall assembly 322 is disposed at a specific position on the substrate 321, so that the outer surface of the surrounding wall assembly 322 is glued to a plurality of inner edges of the middle frame 314 through the glue 34. In addition, in the second embodiment, the glue 34 is applied to the inner edge of the lower surface of the middle frame 314, but the inner edge 35 of the upper surface of the middle frame 314 can also be glued to increase the fixing strength.

Please refer to FIG. 4A of the present invention. FIG. 4A is a cross-sectional view of an imaging device and a screen of a third embodiment of the present invention. Unlike the first embodiment, in the third embodiment, the space around the inner surface of the wall assembly 422 of the imaging device 42 of the electronic device 4 is not filled with adhesive, and the surrounding wall assembly 422 is not through dispensing It is formed by a housing component.

The surrounding wall assembly 422 includes a top surface structure with exposed holes for optical components and a plurality of surrounding wall surfaces (or a single ring-shaped surrounding wall surface) connected to each other, and the top surface structure connects a plurality of surrounding wall surfaces (or a ring-shaped surrounding wall surface) , That is, to form a housing component with an optical component exposure hole. The plurality of surrounding walls (or a single ring-shaped surrounding wall) has a plurality of positioning piles, and the base plate 421 has positioning holes 4211 for the surrounding wall surface assembly 422 (or the housing assembly) to be disposed on the base plate 421. In addition, preferably, the glue 44 can be used to increase the fixing strength by contacting the outer surface of a plurality of surrounding walls (or a single ring-shaped surrounding wall) with the substrate 421.

Next, please refer to FIG. 4B of the present invention. FIG. 4B is a schematic view of the manufacturing process of the bonding between the image capturing device and the screen of the third embodiment of the present invention. In the third embodiment, first, the photo sensor 427, the optical filter 423, and the optical element 424 are sequentially adhered to the surface of the substrate 421. Next, the surrounding wall assembly 422 (or the housing assembly) is set on the base plate 421 through the positioning pile and the positioning hole 4211 (Note: optionally, additional glue 44 can be added to a plurality of surrounding wall (or a single annular surrounding wall The outer surface is in contact with the substrate 421), and the light incident surface of the optical component 424 is exposed through the optical component exposure hole. After that, through the adhesive layer 415 on the lower surface of the middle frame 414 of the screen 41, the image capturing device 42 is bonded to the screen 41 to form the electronic device 4.

Please refer to FIG. 5A of the present invention. FIG. 5A is a cross-sectional view of an imaging device and a screen according to a fourth embodiment of the present invention. Unlike the third embodiment, in the fourth embodiment, the wall assembly 522 (or housing The top surface structure of the component) has two top surfaces with different heights, instead of only one top surface; moreover, the surrounding wall component 522 (or housing component) is not positioned by positioning piles and positioning holes, but instead is used The substrate 521 is fixed in a locking manner.

The surrounding wall assembly 522 of the imaging device 52 of the electronic device 5 includes a top surface structure with an exposed hole of the optical component, a plurality of locking members and a plurality of surrounding wall surfaces (or a single ring-shaped surrounding wall surface) connected to each other, wherein the top The surface structure connects a plurality of surrounding wall surfaces (or a single ring-shaped surrounding wall surface), so that the surrounding wall components 522 form a housing component. There are a plurality of first locking holes 5221 surrounding the wall surface, and the base plate 521 has a plurality of second locking holes 5211 corresponding to the plurality of first locking holes 5221, wherein the locking member passes through the first locking holes 5221 and the second The locking hole 5211 locks the surrounding wall assembly 522 (or housing assembly) on the substrate 5211.

In the fourth embodiment, the top surface structure includes a first top surface having an optical component exposure hole, a connecting side component extending downward from the first top surface, and a second top surface connected to the first top surface through the connecting side component , Where the second top surface is connected to a plurality of surrounding walls (or ring-shaped surrounding walls). However, the present invention does not limit the number and configuration of the top surface, but the additional top surface can be bonded to the extension post of the middle frame 514 to increase the fixing strength.

Please refer to FIG. 5B of the present invention. FIG. 5B is a schematic diagram of the process of bonding the image capturing device to the screen of the fourth embodiment of the present invention. In the fourth embodiment, first, a light sensor 527, an optical filter 523, and an optical element 524 are sequentially bonded on the surface of the substrate 521. Then, the locking member locks the surrounding wall component 522 (or housing component) to the substrate 5211 through the first locking hole 5221 and the second locking hole 5211, and exposes the light incident surface of the optical component 524 through the optical component exposure hole . After that, the first top surface is adhered through the adhesive layer 515 on the lower surface of the middle frame 514 of the screen 51, and the second top surface is adhered through the plurality of extension post lower adhesive layers 516 extending through the lower surface of the middle frame 514. In this way, the image capturing device 52 and the screen 51 can be more firmly bonded to form the electronic device 5.

Please refer to FIG. 6A of the present invention. FIG. 6A is a cross-sectional view of an imaging device and a screen of a fifth embodiment of the present invention. Unlike the third embodiment, in the fifth embodiment, the filter 623 of the image capturing device 62 of the electronic device 6 is only adhered to the optical component 624, the photo sensor 627 and the filter 623 have a gap, and the image is captured The device 62 further includes a base assembly 628, wherein the optical assembly 624 is connected to the base assembly 628.

The base assembly 628 includes a top surface and a plurality of side surfaces (or a single annular side surface) connected to each other, wherein the plurality of side surfaces (or a single annular side surface) is connected to the top surface. The top surface of the base component 628 has holes to expose the optical component 624, and the multiple sides (or a single annular side) of the base component 628 are used to adhere to the surface of the substrate 621. For example, through the dispensing 66 on the outer surface of the multiple sides (or a single ring-shaped side) and the contact point of the substrate 621.

The surrounding wall assembly 622 is located outside the base assembly 628, and the base assembly 628 surrounds the light sensor 627. In addition, the connection method between the optical component 624 and the base component 628 can be through hole locking, or can be glued through the glue 66, or the optical component 624 and the base component 628 can be designed to correspond to each other Fasten the structure for fastening.

Please refer to FIG. 6B of the present invention. FIG. 6B is a schematic diagram of a process of bonding the image capturing device and the screen of the fifth embodiment of the present invention. In the fifth embodiment, first, a photo sensor 627 is bonded on the surface of the substrate 621. Next, the filter 623 is bonded to the optical component 624. Next, the optical component 624 is fixed to the base component 628. Next, the base assembly 628 is fixed on the surface of the substrate 621 through the glue 66. Next, the surrounding wall assembly 622 (or housing assembly) is set on the base plate 621 through positioning posts and positioning holes 6211 (Note: optionally, additional glue 64 can also be applied to multiple surrounding walls (or a single ring-shaped surrounding wall The outer surface is in contact with the substrate 621), and the light incident surface of the optical component 624 is exposed through the optical component exposure hole. After that, through the adhesive layer 615 on the lower surface of the middle frame 614 of the screen 61, the image capturing device 62 is bonded to the screen 61 to form the electronic device 6.

Please refer to FIG. 7 of the present invention. FIG. 7 is a cross-sectional view of an imaging device and a screen according to a sixth embodiment of the present invention. Unlike the sixth embodiment, in the seventh implementation, the surrounding wall of the imaging device 72 of the electronic device 7 The surface assembly 722 further has a plurality of surrounding inner wall surfaces (or a single ring-shaped surrounding inner wall surface) extending upward from the optical component exposure holes of the top surface structure and connected to each other; a plurality of surrounding inner wall surfaces (or a single ring-shaped surrounding inner wall surface) Around the inner wall surface) is arranged at a specific position around the wall surface component 722, so that the outer surfaces of the multiple inner wall surfaces (or a single ring around the inner wall surface) are glued to the middle frame of the screen 71 through the glue 75 The multiple inner edges of 714 can reduce the adhesive layer on the lower surface of frame 714 in screen 71.

Please note that in the above-mentioned embodiments, the filters 223, 323, 423, 523, 623, 723 can be disposed on the display panel 211, 311, 411, 511, 611, 711 and the substrates 221, 321, 421 , 521, 621, 721, or between the optical sensors 227, 327, 427, 527, 627, 727 and the optical components 224, 324, 424, 524, 624, 724, the filter 223, 323, 423, 523, 623, 723 can be used to filter other light beams than biometrics, to avoid the transmission of ambient light beams or light beams from other light sources to the light sensors 227, 327, 427, 527, 627, 727 Recognition ability of the image device. For example, the filters 223, 323, 423, 523, 623, and 723 may be band-pass filters, such as infrared band-pass filters, which pass a light beam with a wavelength of 800 nm to 900 nm and a filter wavelength of 800 nm Beams beyond 900nm. Correspondingly, the light sensors 227, 327, 427, 527, 627, and 727 can further sense infrared rays whose wavelength falls within the range of 800 nm to 900 nm. In other embodiments, the band-pass filter layer may be a band-pass filter layer that passes a light beam with a wavelength of 840 nm to 860 nm or a light beam with a wavelength of 890 nm to 990 nm, and the photo sensors 227, 327, 427, 527, 627 and 727 can further sense infrared rays whose wavelength falls within the range of 840 nm to 860 nm or 890 nm to 990 nm, but the present invention is not limited to this.

In summary, the embodiments of the present invention provide an image capturing device for acquiring fingerprint images. The image capturing device may be disposed under the screen of the electronic device and adhered to the middle frame of the screen. Place The optical component of the imaging device can be fixed on the wall component around the periphery of the light sensor without locking, so the distance tolerance of the optical component relative to the light sensor can be effectively reduced without the need to The factory adjusts the distance of the optical component relative to the light sensor for optical focusing. Furthermore, the manufacturing process of the imaging device of the new embodiment is relatively simple, and there is no need for a locking step and an optical focusing step, so it has the advantages of mass production, higher yield and lower cost.

The present invention has been disclosed in the above with preferred embodiments. However, those skilled in the art should understand that the above-mentioned embodiments are only used to depict the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to the foregoing embodiments should be included in the scope of the present invention.

2‧‧‧Electronic device

21‧‧‧ screen

211‧‧‧Panel

212‧‧‧ masking layer

213‧‧‧buffer layer

214‧‧‧middle frame

215‧‧‧ Adhesive layer

22‧‧‧Acquisition device

221‧‧‧Substrate

222‧‧‧Wall components

223‧‧‧filter

224‧‧‧Optical components

225‧‧‧Wire

226‧‧‧Colloid

227‧‧‧Light sensor

Claims (16)

An imaging device includes: a substrate; a light sensor, which is located on a surface of the substrate and communicates with the substrate through a plurality of wires; and an optical component having a light incident surface and opposite to the A light exit surface of the light incident surface, wherein the optical component is located above the light sensor, and the light exit surface faces the light sensor; and a surrounding wall component, located on the substrate On the surface, and surrounding the light sensor and the optical component. The imaging device according to claim 1, wherein the optical component includes a receiving member and a lens module, wherein the lens module is received in the receiving member. The imaging device according to claim 1, wherein the height of the surrounding wall assembly is greater than the height of the light sensor. The imaging device according to any one of claims 1 to 3, further comprising: a filter, adhered to the light exit surface, and located on the light sensor. The imaging device according to claim 4, wherein the filter is attached to the photo sensor. The imaging device according to claim 1, wherein the surrounding wall surface component is a ring-shaped surrounding wall surface or a plurality of surrounding wall surfaces formed by a little glue, and the inner surface of the surrounding wall surface component A space inside is filled with colloid to make the colloid adhere to the lower surface of one of the middle frames and the surrounding wall assembly. The imaging device according to claim 1, wherein the surrounding wall assembly is a ring-shaped surrounding wall or a plurality of surrounding walls formed at a specific position on the substrate by a glue One or more outer surfaces of the surrounding wall assembly are glued to a plurality of inner edges of a middle frame. The imaging device according to claim 1, wherein the surrounding wall assembly includes a top surface structure having an optical component exposure hole, and includes a plurality of surrounding wall surfaces or an annular surrounding wall surface connected to each other, Wherein the top surface structure is connected to the plurality of surrounding wall surfaces or the ring-shaped surrounding wall surfaces, so that the surrounding wall surface components form a shell component, and the plurality of surrounding wall surfaces or the ring-shaped surrounding wall surfaces have A plurality of positioning piles, and the base plate has a plurality of positioning holes for the housing component to be disposed on the base plate, wherein a plurality of glues are disposed on the plurality of surrounding walls or the ring-shaped surrounding walls The contact point between the outer surface and the surface of the substrate. The imaging device according to claim 8, wherein the top surface structure is a top surface having an exposure hole of the optical component, so that the top surface is configured to be adhered to a lower surface of a middle frame. The imaging device according to claim 1, wherein the surrounding wall surface assembly further includes a top surface structure having an optical component exposure hole and a plurality of locking fasteners, and includes a plurality of surrounding wall surfaces connected to each other or A ring-shaped surrounding wall surface, wherein the top surface structure connects the plurality of surrounding wall surfaces or the ring-shaped surrounding wall surface, so that the surrounding wall surface component forms a shell component, and the plurality of surrounding wall surfaces or all The annular surrounding wall has a plurality of first locking holes, and the base plate has corresponding to the plurality of first locking holes A plurality of second locking holes, wherein the plurality of locking fasteners lock the housing assembly to the substrate through the plurality of first locking holes and the plurality of second locking holes. The imaging device according to claim 8, wherein the top surface structure includes a first top surface having an exposure hole of the optical component, and a connecting side component extending downward from the first top surface and A second top surface connected to the first top surface through the connecting side component, wherein the second top surface is connected to the plurality of surrounding wall surfaces or the ring-shaped surrounding wall surfaces, so that the first The top surface is pasted to the lower surface of a middle frame and the second top surface is pasted to a plurality of extending columns extending from the lower surface of the middle frame. The imaging device according to claim 4, wherein the filter and the light sensor have a gap, and the imaging device further includes a base assembly, the base assembly exposing the optical component , And the base assembly is used to be fixed on the surface of the substrate, wherein a plurality of glues are arranged at the contact between the outer surface of the base assembly and the surface of the substrate. The imaging device according to claim 12, wherein the surrounding wall assembly includes a top surface structure having an optical component exposure hole, and includes a plurality of surrounding wall surfaces or a ring-shaped surrounding wall surface connected to each other, Wherein the top surface structure is connected to the plurality of surrounding wall surfaces or the ring-shaped surrounding wall surfaces, so that the surrounding wall surface components form a shell component, and the plurality of surrounding wall surfaces or the ring-shaped surrounding wall surfaces have A plurality of positioning piles, and the base plate has a plurality of positioning holes for the housing component to be disposed on the base plate, wherein a plurality of glues are disposed on the plurality of surrounding walls or the ring-shaped surrounding walls The contact point between the outer surface and the surface of the substrate. According to the imaging device of claim 13, the top surface structure is a top surface having an exposure hole of the optical component, so that the top surface is configured to be adhered to a lower surface of a middle frame. According to the imaging device described in claim 13, the surrounding wall surface assembly further includes a plurality of surrounding inner wall surfaces or a ring shape extending upward from the exposed hole of the optical component of the top surface structure and connected to each other Surrounding the inner wall surface, the plurality of surrounding inner wall surfaces, the ring-shaped surrounding inner wall surfaces are arranged at specific positions of the surrounding wall surface assembly, so that the plurality of surrounding inner wall surfaces, the ring surrounding the inner wall surfaces The outer surface of the is adhered to the inner edges of a middle frame through multiple glue points. An electronic device, comprising: the image capturing device according to one of the items 1 to 15 of the request item; and a screen, wherein the image capturing device is arranged under the screen.

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