WO2021120323A1 - Display panel and testing method therefor - Google Patents

Display panel and testing method therefor Download PDF

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Publication number
WO2021120323A1
WO2021120323A1 PCT/CN2019/129892 CN2019129892W WO2021120323A1 WO 2021120323 A1 WO2021120323 A1 WO 2021120323A1 CN 2019129892 W CN2019129892 W CN 2019129892W WO 2021120323 A1 WO2021120323 A1 WO 2021120323A1
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WO
WIPO (PCT)
Prior art keywords
area
touch
display panel
display
cutting area
Prior art date
Application number
PCT/CN2019/129892
Other languages
French (fr)
Chinese (zh)
Inventor
林丹
戴其兵
刘敏伦
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/955,047 priority Critical patent/US11379062B2/en
Publication of WO2021120323A1 publication Critical patent/WO2021120323A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
    • G06F11/2221—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested to test input/output devices or peripheral units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present application relates to the technical field of display panels, and in particular to a display panel and a test method thereof.
  • AMOLED display panels are one of the hotspots in the field of display device research. Compared with liquid crystal display devices, OLED has excellent performance such as high color saturation, wide viewing angle, thin thickness, fast response speed and flexibility; touch screens can be more intuitive Concise realization of man-machine communication, to achieve a good user experience. In order to improve the competitiveness of products, the touch technology and OLED display technology will be integrated and integrated to form an OLED display panel with touch function, which increases the differentiated design of products, saves costs, and maximizes profits.
  • the existing method of manufacturing a display panel with integrated touch is: first batch manufacture multiple display panels on one motherboard, and then roughly cut the motherboard into multiple daughter boards (each daughter board corresponds to a display panel)
  • the display panel includes a finished product area and a cutting area set around the finished product area.
  • the finished product area includes a display sub-area and a non-display sub-area.
  • the spacing between the touch traces in the non-display sub-area is small. Before the IC is bound, it cannot be connected to the touch traces in the non-display sub-area due to alignment accuracy problems. test.
  • the embodiments of the present application provide a display panel and a test method thereof, so as to solve the problem that in the manufacturing process of the existing display panel, because the display circuit and the touch wiring are integrated in the non-display sub-region of the display panel, the non-display sub-region touches each other.
  • the spacing between the control traces is small. Before the IC is bound, the connection test cannot be performed with the touch traces in the non-display sub-area due to the alignment accuracy problem.
  • the embodiment of the present application provides a display panel including a finished product area and a cutting area arranged outside the finished product area, the finished product area includes: a display sub-area and a non-display sub-area,
  • the display panel includes:
  • the thin film transistor layer is disposed on one side of the flexible substrate and corresponds to the display sub-region;
  • the organic light-emitting layer is arranged on the side of the thin film transistor layer away from the flexible substrate and corresponds to the display sub-region;
  • the encapsulation layer is arranged on the side of the organic light-emitting layer away from the thin film transistor, and at least corresponds to the finished product area;
  • the touch layer is arranged on the side of the encapsulation layer away from the organic light-emitting layer, the touch layer includes: touch electrodes and touch wires, and the touch electrodes are arranged corresponding to the display sub-regions, One end of the touch trace is connected to the touch electrode, the other end of the touch trace extends from the non-display sub-area to the cutting area, and the density of touch traces in the cutting area is less than that of the cut area.
  • the touch trace density of the non-display sub-area is described.
  • the cutting area is provided with a test pad group connected to the touch wiring.
  • the cutting area is arranged around the finished area, and the test pad group is arranged in the cutting area on the side of the non-display sub-area away from the display sub-area.
  • the cutting area is C-shaped and arranged around the upper and lower sides of the finished area and the finished area near the display sub-area
  • the test Pad group includes a first sub-area.
  • the Pad group and the second sub-Pad group, the first sub-Pad group and the second sub-Pad group are respectively located in the cutting area on the upper and lower sides of the non-display sub-area.
  • an insulating layer located in the non-display sub-area and the cutting area is provided between the flexible substrate and the touch wiring, and the insulating layer is provided with an insulating layer located in the The first via hole in the cutting area and the second via hole in the non-display sub-area, and the touch trace of the cutting area passes through the first via hole and the second via hole.
  • the touch trace connection of the non-display sub-area is provided between the flexible substrate and the touch wiring, and the insulating layer is provided with an insulating layer located in the The first via hole in the cutting area and the second via hole in the non-display sub-area, and the touch trace of the cutting area passes through the first via hole and the second via hole.
  • the distance between the center lines of any two adjacent touch traces in the cutting area is greater than or equal to 180 um.
  • the distance between the center lines of any two adjacent touch traces in the non-display subregion is less than or equal to 40 um.
  • the embodiment of the present application also provides a test method of the display panel as described above, including:
  • the part of the display panel corresponding to the cutting area is cut to obtain the part of the display panel corresponding to the finished product area.
  • the testing the touch electrodes through the touch traces in the cutting area includes:
  • a test signal is input to the touch trace in the cutting area through the touch electrode test board to test the touch electrode.
  • the part of the display panel corresponding to the cutting area is cut off by means of knife wheel cutting or laser cutting.
  • the touch traces from the non-display sub-area By extending the touch traces from the non-display sub-area to the cutting area, and the density of the touch traces in the cutting area is less than that of the non-display sub-area, so as to facilitate the external test circuit and
  • the touch wires in the cutting area are precisely aligned and connected, which is convenient for performing various performance tests on the touch electrodes before the display panel is bound to the IC; the detection efficiency is improved, and in addition, the display panel is also fully and reasonably utilized During the production process, the cutting area part, and after the test is completed, the cutting area part can be cut off for subsequent production.
  • FIG. 1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the application
  • FIG. 2 is a schematic diagram of a planar structure of another display panel provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of a hierarchical structure in a display subarea of a display panel provided by an embodiment of the application;
  • FIG. 4 is a schematic diagram of a partial structure of the touch wiring change layer bridge bridge in a display panel provided by an embodiment of the application.
  • FIG. 5 is a schematic block diagram of a flow chart of a method for testing a display panel provided by an embodiment of the application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, “multiple” means two or more than two, unless otherwise specifically defined.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship.
  • connection should be understood according to specific circumstances.
  • the "on" or “under” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • the "above”, “above” and “above” of the first feature on the second feature include the first feature directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • an embodiment of the present application provides a display panel 10, which includes a finished product area 100 and a cutting area 200 disposed outside the finished product area 100.
  • the finished product area 100 includes: a display sub-area 110 and a non-display area.
  • the non-display sub-area 120 includes the bonding area of the display panel 10, and, in the structure of the existing integrated touch display panel, the non-display sub-area 120 is integrated with
  • the display lines and touch lines lead to denser touch lines in the non-display sub-area 120 (especially the binding area), which leads to the fact that the alignment accuracy cannot be corrected before the IC is bound. The problem with the touch trace for testing.
  • the display panel 10 includes a flexible substrate 300, a thin film transistor layer 400, an organic light emitting layer 500, an encapsulation layer 600, and a touch layer 700.
  • the thin film transistor layer 400 is disposed on a side of the flexible substrate 300.
  • the organic light-emitting layer 500 is arranged on the side of the thin film transistor layer 400 away from the flexible substrate 300 and corresponds to the display sub-region 110;
  • the encapsulation layer 600 is disposed on the side of the organic light-emitting layer 500 away from the thin film transistor and at least corresponding to the finished product area 100.
  • the touch control layer 700 is disposed on a side of the encapsulation layer 600 away from the organic light-emitting layer 500.
  • the touch layer 700 includes: touch electrodes 710 and touch wires 720, the touch electrodes 710 are arranged corresponding to the display sub-region 110, and one end of the touch wires 720 is connected to the touch wires 720.
  • the electrode 710 is connected, the other end of the touch trace 720 extends from the non-display sub-area 120 to the cutting area 200, and the density of the touch trace 720 in the cutting area 200 is less than that of the non-display sub-area 120 720 density of touch traces.
  • the touch trace 720 is extended from the non-display sub-area 120 to the cutting area 200 so as to make full use of the space of the cutting area 200.
  • the cutting area 200 of the display panel 10 The part is the part located outside the finished product area 100 of the display panel 10 after dividing a mother board prepared with a plurality of display panels 10 when the display panel 10 is manufactured in batches, and, in one embodiment, the The density of touch traces 720 in the cutting area 200 is less than the density of touch traces 720 in the non-display sub-area 120.
  • the center line of any two adjacent touch traces 720 in the cutting area 200 The distance between each of them is greater than or equal to 180 um; the distance between the center lines of any two adjacent touch traces 720 in the non-display sub-region 120 is less than or equal to 40 um.
  • the external measurement circuit is precisely connected to the touch trace 720 of the cutting area 200, so that it is convenient for the external measurement circuit to communicate with the touch electrode 710 through the touch trace 720 of the cutting area 200 to achieve mutual contact.
  • the test of the control electrode 710 specifically, can be through a touch electrode 710 test board provided with a test circuit.
  • the touch electrode 710 test board can be in the form of a flexible circuit board or other forms; after the test is completed, the application can be The part of the display panel 10 corresponding to the cutting area 200 is cut and removed to complete the subsequent panel manufacturing process; obviously, through this structure and test method, it is possible to accurately perform the touch wiring 720 during the production process of the display panel 10
  • the connection test can also make good use of the control of the cutting area 200. After the test, the part in the cutting area 200 is cut without affecting the subsequent manufacturing process; the entire process, the test effect is stable and efficient.
  • the cutting area 200 is provided with a test pad group 800 connected to the touch trace 720.
  • the test pad group 800 can be more conveniently and accurately connected with the external test circuit. It is understood that, in the process of manufacturing the display panels 10 in batches, a mother board prepared with a plurality of display panels 10 is cut, and the test Pad group 800 can be set according to the position of the cutting area 200 in the specific display panel 10, as in question 1.
  • the test Pad group 800 when the cutting area 200 is arranged around the finished product area 100, the test Pad group 800 is concentratedly arranged in the cutting area 200 on the side of the non-display sub-area 120 away from the display sub-area 110 As shown in Figure 2, when the cutting area 200 is C-shaped around the upper and lower sides of the finished area 100 and the finished area 100 is set close to the display sub-area 110, the test Pad group 800 includes a first sub-Pad group 810 and a second sub-Pad group 820.
  • the first sub-Pad group 810 and the second sub-Pad group 820 are respectively located in the cutting area 200 on the upper and lower sides of the non-display sub-area 120 Obviously, the test Pad group 800 is centrally arranged on the side of the non-display sub-area 120 away from the display sub-area 110 to facilitate connection with an external test circuit, and the test Pad group 800 is divided into the first sub-Pad group 810 and The second sub-Pad group 820 is respectively located in the cutting area 200 on the upper and lower sides of the non-display sub-area 120, which is more convenient for cutting the mother board prepared with a plurality of display panels 10, and when the mother board is specifically cut As shown in FIG. 2, the part of the display panel 10 located on the side of the non-display sub-region 120 far away from the display sub-region 110 can be completely removed, so as to reduce the subsequent process of cutting off the cutting region 200.
  • an insulating layer 900 located in the non-display sub-region 120 and the cutting region 200 is provided between the flexible substrate 300 and the touch trace 720.
  • the layer 900 is provided with a first via 910 located in the cutting area 200 and a second via 920 located in the non-display sub-area 120, and the touch trace 720 of the cutting area 200 passes through the first
  • the via 910 is connected to the touch trace 720 of the non-display sub-region 120 passing through the second via 920.
  • the density of the touch traces 720 in the cutting region 200 is less than that of the non-display sub-region 120.
  • the density of the traces 720 is controlled so that the external test circuit and the touch trace 720 of the cutting area 200 can be accurately aligned and connected, and it is convenient to perform various performance tests on the touch electrode 710 before the IC is bound to the display panel 10 Improve the detection efficiency.
  • the setting position of the test Pad group 800 described in this application is more flexible and can be set according to the actual position of the cutting area 200, and the touch trace 720 is in the non-display sub-area 120 and
  • the cutting area 200 adopts a layer-changing bridging method, which avoids the phenomenon of short circuit when cutting the cutting area 200 in the display panel 10.
  • the embodiment of the present application also provides a test method of the display panel 10 as described above, as shown in FIG. 5, including:
  • Step S10 Test the touch electrode 710 through the touch trace 720 of the cutting area 200;
  • Step S20 After the test is completed, cut off the portion of the display panel 10 corresponding to the cutting area 200 to obtain the portion of the display panel 10 corresponding to the finished area 100. Specifically, it can be cut by a knife wheel or laser The cutting method cuts off the portion of the display panel 10 corresponding to the cutting area 200.
  • the step S10: testing the touch electrode 710 through the touch trace 720 of the cutting area 200 includes:
  • Step S11 Connect a touch electrode 710 test board to the touch trace 720 of the cutting area 200 by means of false pressing;
  • Step S12 Input a test signal to the touch trace 720 of the cutting area 200 through the touch electrode 710 test board to test the touch electrode 710.
  • the test content of the touch electrode 710 may include: whether the touch electrode 710 has a short circuit, an open circuit, or the like.
  • step S20 after the test is completed, cut off the portion of the display panel 10 corresponding to the cutting area 200 to obtain the portion of the display panel 10 corresponding to the finished product area 100; wherein, the test is completed
  • the latter may be after the touch electrode 710 has passed the test for all indicators, of course, it also includes the touch electrode 710 being repaired after the test is unqualified, and then after the test is passed, the display panel 10 is then matched to the Part of the cutting area 200 is cut to obtain the part of the display panel 10 corresponding to the finished area 100.
  • the test indicators and eligibility of the touch electrode 710 can be set according to specific product requirements.
  • test method of the display panel 10 of the present application makes full use of the cutting area 200 part of the display panel 10 during the mass production process of the display panel 10, which is convenient for the touch electrode before the IC is bound to the display panel 10 710 performs various performance tests, and does not affect the preparation of other processes, and has high practicability and adaptability.
  • the present application extends touch traces 720 from the non-display sub-region 120 to the cutting area 200, and makes the density of touch traces 720 in the cutting region 200 smaller than that of the non-display sub-region 120.
  • the density of the traces 720 is controlled so that the external test circuit and the touch traces 720 of the cutting area 200 can be precisely aligned and connected, and it is convenient to perform various performance tests on the touch electrodes 710 before the display panel 10 binds the IC. ; Improve the detection efficiency, in addition, the display panel 10 in the production process of the cutting area 200 part is also fully and reasonably used, and after the test is completed, part of the cutting area 200 can be cut off for subsequent production .

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Abstract

A display panel (10) and a testing method therefor. The display panel (10) comprises a finished product area (100) and a cutting area (200), the finished product area (100) comprising a display sub-area (110) and a non-display sub-area (120); and the display panel (10) comprises a flexible substrate (300), a thin-film transistor layer (400), an organic light-emitting layer (500), an encapsulation layer (600) and a touch layer (700), the touch layer (700) comprising touch electrodes (710) and touch wires (720), one end of each touch wire (720) being connected to a touch electrode (710), the other end of the touch wire (720) extending from the non-display sub-area (120) to the cutting area (200), the density of the touch wires (720) of the cutting area (200) being less than that of the touch wires (720) of the non-display sub-area (120).

Description

显示面板及其测试方法Display panel and its testing method 技术领域Technical field
本申请涉及显示面板技术领域，尤其涉及一种显示面板及其测试方法。The present application relates to the technical field of display panels, and in particular to a display panel and a test method thereof.
背景技术Background technique
AMOLED显示面板是当今显示装置研究领域的热点之一，与液晶显示装置相比，OLED具有高色饱和度、广视角、薄厚度、响应速度快及能实现柔性化等优异性能；触摸屏能更直观简洁的实现人机交流，达到很好的用户体验。为了提高产品的竞争力，会将触控技术与OLED显示技术集成整合在一起，形成一种具有触控功能的OLED显示面板，加大产品的差异化设计，并节省成本，使利润最大化。AMOLED display panels are one of the hotspots in the field of display device research. Compared with liquid crystal display devices, OLED has excellent performance such as high color saturation, wide viewing angle, thin thickness, fast response speed and flexibility; touch screens can be more intuitive Concise realization of man-machine communication, to achieve a good user experience. In order to improve the competitiveness of products, the touch technology and OLED display technology will be integrated and integrated to form an OLED display panel with touch function, which increases the differentiated design of products, saves costs, and maximizes profits.
技术问题technical problem
现有集成触控的显示面板的制作方式是：先在一母板上进行多个显示面板的批量化制作，然后将母板粗切割分为多个子板（每一子板对应一显示面板），该显示面板包括成品区和绕所述成品区设置的切割区，所述成品区包括显示子区和非显示子区，在此过程中，因为显示线路和触控走线均集成在显示面板的非显示子区内，导致非显示子区中各触控走线之间的间距较小，在没有绑定IC之前，因为对位精度问题无法与非显示子区中触控走线进行连接测试。The existing method of manufacturing a display panel with integrated touch is: first batch manufacture multiple display panels on one motherboard, and then roughly cut the motherboard into multiple daughter boards (each daughter board corresponds to a display panel) The display panel includes a finished product area and a cutting area set around the finished product area. The finished product area includes a display sub-area and a non-display sub-area. In this process, because the display circuit and the touch wiring are integrated in the display panel In the non-display sub-area, the spacing between the touch traces in the non-display sub-area is small. Before the IC is bound, it cannot be connected to the touch traces in the non-display sub-area due to alignment accuracy problems. test.
技术解决方案Technical solutions
本申请实施例提供一种显示面板及其测试方法，以解决现有显示面板的制作过程中，因为显示线路和触控走线均集成在显示面板非显示子区，导致非显示子区各触控走线之间的间距较小，在没有绑定IC之前，由于对位精度问题无法与非显示子区中触控走线进行连接测试的问题。The embodiments of the present application provide a display panel and a test method thereof, so as to solve the problem that in the manufacturing process of the existing display panel, because the display circuit and the touch wiring are integrated in the non-display sub-region of the display panel, the non-display sub-region touches each other. The spacing between the control traces is small. Before the IC is bound, the connection test cannot be performed with the touch traces in the non-display sub-area due to the alignment accuracy problem.
本申请实施例提供了一种显示面板，包括成品区和设置于所述成品区外侧的切割区，所述成品区包括：显示子区和非显示子区，The embodiment of the present application provides a display panel including a finished product area and a cutting area arranged outside the finished product area, the finished product area includes: a display sub-area and a non-display sub-area,
所述显示面板包括：The display panel includes:
柔性基板；Flexible substrate
薄膜晶体管层，设置于所述柔性基板的一侧，且与所述显示子区对应；The thin film transistor layer is disposed on one side of the flexible substrate and corresponds to the display sub-region;
有机发光层，设置在所述薄膜晶体管层远离所述柔性基板的一侧，且与所述显示子区对应；The organic light-emitting layer is arranged on the side of the thin film transistor layer away from the flexible substrate and corresponds to the display sub-region;
封装层，设置在所述有机发光层远离所述薄膜晶体管的一侧，且至少与所述成品区对应；及The encapsulation layer is arranged on the side of the organic light-emitting layer away from the thin film transistor, and at least corresponds to the finished product area; and
触控层，设置在所述封装层远离所述有机发光层的一侧，所述触控层包括：触控电极和触控走线，所述触控电极与所述显示子区对应设置，所述触控走线一端与所述触控电极连接，所述触控走线另一端从所述非显示子区延伸至所述切割区，且所述切割区的触控走线密度小于所述非显示子区的触控走线密度。The touch layer is arranged on the side of the encapsulation layer away from the organic light-emitting layer, the touch layer includes: touch electrodes and touch wires, and the touch electrodes are arranged corresponding to the display sub-regions, One end of the touch trace is connected to the touch electrode, the other end of the touch trace extends from the non-display sub-area to the cutting area, and the density of touch traces in the cutting area is less than that of the cut area. The touch trace density of the non-display sub-area is described.
在本申请实施例的显示面板中，所述切割区内设有与所述触控走线连接的测试Pad组。In the display panel of the embodiment of the present application, the cutting area is provided with a test pad group connected to the touch wiring.
在本申请实施例的显示面板中，所述切割区绕所述成品区四周设置，所述测试Pad组设置于所述非显示子区远离所述显示子区一侧的所述切割区内。In the display panel of the embodiment of the present application, the cutting area is arranged around the finished area, and the test pad group is arranged in the cutting area on the side of the non-display sub-area away from the display sub-area.
在本申请实施例的显示面板中，所述切割区呈C型绕所述成品区上下两侧和所述成品区靠近所述显示子区的一侧设置，所述测试Pad组包括第一子Pad组和第二子Pad组，所述第一子Pad组和第二子Pad组分别位于所述非显示子区上下两侧的所述切割区内。In the display panel of the embodiment of the present application, the cutting area is C-shaped and arranged around the upper and lower sides of the finished area and the finished area near the display sub-area, and the test Pad group includes a first sub-area. The Pad group and the second sub-Pad group, the first sub-Pad group and the second sub-Pad group are respectively located in the cutting area on the upper and lower sides of the non-display sub-area.
在本申请实施例的显示面板中，所述柔性基板与所述触控走线之间设有位于所述非显示子区和切割区内的绝缘层，所述绝缘层上设有位于所述切割区的第一过孔和位于所述非显示子区的第二过孔，所述切割区的触控走线穿过所述第一过孔与穿过所述第二过孔的所述非显示子区的触控走线连接。In the display panel of the embodiment of the present application, an insulating layer located in the non-display sub-area and the cutting area is provided between the flexible substrate and the touch wiring, and the insulating layer is provided with an insulating layer located in the The first via hole in the cutting area and the second via hole in the non-display sub-area, and the touch trace of the cutting area passes through the first via hole and the second via hole. The touch trace connection of the non-display sub-area.
在本申请实施例的显示面板中，所述切割区内任一相邻两所述触控走线中心线之间的距离均大于等于180um。In the display panel of the embodiment of the present application, the distance between the center lines of any two adjacent touch traces in the cutting area is greater than or equal to 180 um.
在本申请实施例的显示面板中，所述非显示子区内任一相邻两所述触控走线中心线之间的距离均小于等于40 um。In the display panel of the embodiment of the present application, the distance between the center lines of any two adjacent touch traces in the non-display subregion is less than or equal to 40 um.
本申请实施例还提供了一种如前所述的显示面板的测试方法，包括：The embodiment of the present application also provides a test method of the display panel as described above, including:
通过所述切割区的触控走线对所述触控电极进行测试；Testing the touch electrodes through the touch traces in the cutting area;
测试完成后，将所述显示面板对应所述切割区的部分切除，以得到所述显示面板对应所述成品区的部分。After the test is completed, the part of the display panel corresponding to the cutting area is cut to obtain the part of the display panel corresponding to the finished product area.
在本申请实施例显示面板的测试方法中，所述通过所述切割区的触控走线对所述触控电极进行测试包括：In the method for testing the display panel of the embodiment of the present application, the testing the touch electrodes through the touch traces in the cutting area includes:
将一触控电极测试板采用假压的方式与所述切割区的触控走线连接；Connecting a touch electrode test board to the touch trace in the cutting area by means of false pressing;
通过触控电极测试板对所述切割区的触控走线输入测试信号，以对所述触控电极进行测试。A test signal is input to the touch trace in the cutting area through the touch electrode test board to test the touch electrode.
在本申请实施例显示面板的测试方法中，通过刀轮切割或激光切割的方式将所述显示面板对应所述切割区的部分切除。In the test method of the display panel of the embodiment of the present application, the part of the display panel corresponding to the cutting area is cut off by means of knife wheel cutting or laser cutting.
有益效果Beneficial effect
通过将触控走线由非显示子区延伸至所述切割区，并且使所述切割区的触控走线密度小于所述非显示子区的触控走线密度，以便于外部测试电路与所述切割区的触控走线进行精确对位连接，方便在显示面板绑定IC前对所述触控电极进行各项性能测试；提高了检测效率，此外，也充分合理的利用了显示面板在制作过程中的切割区部分，并且，在进行测试完之后，可以将所述切割区的部分切掉，以便后续制作。By extending the touch traces from the non-display sub-area to the cutting area, and the density of the touch traces in the cutting area is less than that of the non-display sub-area, so as to facilitate the external test circuit and The touch wires in the cutting area are precisely aligned and connected, which is convenient for performing various performance tests on the touch electrodes before the display panel is bound to the IC; the detection efficiency is improved, and in addition, the display panel is also fully and reasonably utilized During the production process, the cutting area part, and after the test is completed, the cutting area part can be cut off for subsequent production.
附图说明Description of the drawings
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。The following detailed description of specific implementations of the present application in conjunction with the accompanying drawings will make the technical solutions and other beneficial effects of the present application obvious.
图1为本申请实施例提供的一种显示面板的平面结构示意图；FIG. 1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the application;
图2为本申请实施例提供的另一种显示面板的平面结构示意图；2 is a schematic diagram of a planar structure of another display panel provided by an embodiment of the application;
图3为本申请实施例提供的一种显示面板显示子区内的层级结构示意图；FIG. 3 is a schematic diagram of a hierarchical structure in a display subarea of a display panel provided by an embodiment of the application;
图4为本申请实施例提供的一种显示面板中所述触控走线换层桥接的局部结构示意图；及FIG. 4 is a schematic diagram of a partial structure of the touch wiring change layer bridge bridge in a display panel provided by an embodiment of the application; and
图5为本申请实施例提供的一种显示面板的测试方法的流程示意框图。FIG. 5 is a schematic block diagram of a flow chart of a method for testing a display panel provided by an embodiment of the application.
本发明的实施方式Embodiments of the present invention
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of this application.
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" and other directions or The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it cannot be understood as a restriction on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, "multiple" means two or more than two, unless otherwise specifically defined.
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense, unless otherwise clearly specified and limited. For example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in this application can be understood according to specific circumstances.
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。In this application, unless expressly stipulated and defined otherwise, the "on" or "under" of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them. Moreover, the "above", "above" and "above" of the first feature on the second feature include the first feature directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature. The “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples, and are not intended to limit the application. In addition, the present application may repeat reference numerals and/or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and/or settings discussed. In addition, this application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and/or the use of other materials.
下面结合附图和实施例对本申请作进一步说明。The application will be further described below in conjunction with the drawings and embodiments.
如图1所示，本申请实施例提供了一种显示面板10，包括成品区100和设置于所述成品区100外侧的切割区200，所述成品区100包括：显示子区110和非显示子区120；可以理解的是，所述非显示子区120包括显示面板10的绑定（bonding）区域，并且，在现有集成触控显示面板的结构中，非显示子区120内集成有显示线路和触控走线，导致非显示子区120（尤其是绑定区）中触控走线较为密集，从而导致在没有绑定IC之前，因为对位精度问题无法对绑定区中的触控走线进行测试的问题。As shown in FIG. 1, an embodiment of the present application provides a display panel 10, which includes a finished product area 100 and a cutting area 200 disposed outside the finished product area 100. The finished product area 100 includes: a display sub-area 110 and a non-display area. It is understood that the non-display sub-area 120 includes the bonding area of the display panel 10, and, in the structure of the existing integrated touch display panel, the non-display sub-area 120 is integrated with The display lines and touch lines lead to denser touch lines in the non-display sub-area 120 (especially the binding area), which leads to the fact that the alignment accuracy cannot be corrected before the IC is bound. The problem with the touch trace for testing.
如图3所示，所述显示面板10包括柔性基板300、薄膜晶体管层400、有机发光层500、封装层600和触控层700，所述薄膜晶体管层400设置于所述柔性基板300的一侧，且与所述显示子区110对应；所述有机发光层500设置在所述薄膜晶体管层400远离所述柔性基板300的一侧，且与所述显示子区110对应；所述封装层600设置在所述有机发光层500远离所述薄膜晶体管的一侧，且至少与所述成品区100对应，所述触控层700设置在所述封装层600远离所述有机发光层500的一侧，所述触控层700包括：触控电极710和触控走线720，所述触控电极710与所述显示子区110对应设置，所述触控走线720一端与所述触控电极710连接，所述触控走线720另一端从所述非显示子区120延伸至所述切割区200，且所述切割区200的触控走线720密度小于所述非显示子区120的触控走线720密度。As shown in FIG. 3, the display panel 10 includes a flexible substrate 300, a thin film transistor layer 400, an organic light emitting layer 500, an encapsulation layer 600, and a touch layer 700. The thin film transistor layer 400 is disposed on a side of the flexible substrate 300. The organic light-emitting layer 500 is arranged on the side of the thin film transistor layer 400 away from the flexible substrate 300 and corresponds to the display sub-region 110; the encapsulation layer 600 is disposed on the side of the organic light-emitting layer 500 away from the thin film transistor and at least corresponding to the finished product area 100. The touch control layer 700 is disposed on a side of the encapsulation layer 600 away from the organic light-emitting layer 500. On the other hand, the touch layer 700 includes: touch electrodes 710 and touch wires 720, the touch electrodes 710 are arranged corresponding to the display sub-region 110, and one end of the touch wires 720 is connected to the touch wires 720. The electrode 710 is connected, the other end of the touch trace 720 extends from the non-display sub-area 120 to the cutting area 200, and the density of the touch trace 720 in the cutting area 200 is less than that of the non-display sub-area 120 720 density of touch traces.
可以理解的是，将所述触控走线720从所述非显示子区120延伸至所述切割区200，以便于充分利用切割区200的空间，显然，所述显示面板10的切割区200部分，为在批量制作显示面板10时将一制备有多个显示面板10的母板分割后，位于分割后所述显示面板10成品区100外侧的部分，并且，在一实施例中，所述切割区200的触控走线720密度小于所述非显示子区120的触控走线720密度，具体的，所述切割区200内任一相邻两所述触控走线720中心线之间的距离均大于等于180um；所述非显示子区120内任一相邻两所述触控走线720中心线之间的距离均小于等于40 um。It can be understood that the touch trace 720 is extended from the non-display sub-area 120 to the cutting area 200 so as to make full use of the space of the cutting area 200. Obviously, the cutting area 200 of the display panel 10 The part is the part located outside the finished product area 100 of the display panel 10 after dividing a mother board prepared with a plurality of display panels 10 when the display panel 10 is manufactured in batches, and, in one embodiment, the The density of touch traces 720 in the cutting area 200 is less than the density of touch traces 720 in the non-display sub-area 120. Specifically, the center line of any two adjacent touch traces 720 in the cutting area 200 The distance between each of them is greater than or equal to 180 um; the distance between the center lines of any two adjacent touch traces 720 in the non-display sub-region 120 is less than or equal to 40 um.
承上，显然，通过将所述非显示子区120内密集的触控走线720延伸至所述切割区200内，并且减少位于所述切割区200内的触控走线720的密度，以便于外部测设电路与所述切割区200的触控走线720精确对位连接，从而方便外部测设电路通过所述切割区200的触控走线720与触控电极710连通，实现对触控电极710的测试，具体的，可以是通过设有测试电路的触控电极710测试板，所述触控电极710测试板可以是柔性电路板形式或其它形式；待测试完成，可以将本申请显示面板10上对应所述切割区200的部分切割去除，以便完成后续面板的制程；显然，通过此种结构和测试方式，既可以实现在显示面板10生产过程中对触控走线720进行精确连接测试，又可以很好的利用切割区200的控制，测试完后将切割区200内的部分切割，不影响后续制程；整个过程，测试效果稳定高效。In conclusion, it is obvious that by extending the dense touch traces 720 in the non-display sub-region 120 into the cutting area 200, and reducing the density of the touch traces 720 in the cutting area 200, The external measurement circuit is precisely connected to the touch trace 720 of the cutting area 200, so that it is convenient for the external measurement circuit to communicate with the touch electrode 710 through the touch trace 720 of the cutting area 200 to achieve mutual contact. The test of the control electrode 710, specifically, can be through a touch electrode 710 test board provided with a test circuit. The touch electrode 710 test board can be in the form of a flexible circuit board or other forms; after the test is completed, the application can be The part of the display panel 10 corresponding to the cutting area 200 is cut and removed to complete the subsequent panel manufacturing process; obviously, through this structure and test method, it is possible to accurately perform the touch wiring 720 during the production process of the display panel 10 The connection test can also make good use of the control of the cutting area 200. After the test, the part in the cutting area 200 is cut without affecting the subsequent manufacturing process; the entire process, the test effect is stable and efficient.
在一实施例中，所述切割区200内设有与所述触控走线720连接的测试Pad组800，显然，所述测试Pad组800可以更方便与所述外部测试电路精准对接，可以理解的是，在批量制作显示面板10过程中，对制备有多个显示面板10的母板进行切割，所述测试Pad组800可以根据具体显示面板10内切割区200的位置进行设置，如题1所示，当所述切割区200绕所述成品区100四周设置时，所述测试Pad组800集中设置于所述非显示子区120远离所述显示子区110一侧的所述切割区200内；如图2所示，当所述切割区200呈C型绕所述成品区100上下两侧和所述成品区100靠近所述显示子区110的一侧设置时，所述测试Pad组800包括第一子Pad组810和第二子Pad组820，所述第一子Pad组810和第二子Pad组820分别位于所述非显示子区120上下两侧的所述切割区200内；显然，将测试Pad组800集中设置于所述非显示子区120远离所述显示子区110一侧更加便于与外接测试电路对接，而将测试Pad组800分为第一子Pad组810和第二子Pad组820分别位于所述非显示子区120上下两侧的所述切割区200内，则更便于对制备有多个显示面板10的母板进行切割，在对母板具体切割时，如图2所示，可以将显示面板10中位于所述非显示子区120远离所述显示子区110一侧的部分完全去除，以减少后续切除切割区200部分时的工序。In one embodiment, the cutting area 200 is provided with a test pad group 800 connected to the touch trace 720. Obviously, the test pad group 800 can be more conveniently and accurately connected with the external test circuit. It is understood that, in the process of manufacturing the display panels 10 in batches, a mother board prepared with a plurality of display panels 10 is cut, and the test Pad group 800 can be set according to the position of the cutting area 200 in the specific display panel 10, as in question 1. As shown, when the cutting area 200 is arranged around the finished product area 100, the test Pad group 800 is concentratedly arranged in the cutting area 200 on the side of the non-display sub-area 120 away from the display sub-area 110 As shown in Figure 2, when the cutting area 200 is C-shaped around the upper and lower sides of the finished area 100 and the finished area 100 is set close to the display sub-area 110, the test Pad group 800 includes a first sub-Pad group 810 and a second sub-Pad group 820. The first sub-Pad group 810 and the second sub-Pad group 820 are respectively located in the cutting area 200 on the upper and lower sides of the non-display sub-area 120 Obviously, the test Pad group 800 is centrally arranged on the side of the non-display sub-area 120 away from the display sub-area 110 to facilitate connection with an external test circuit, and the test Pad group 800 is divided into the first sub-Pad group 810 and The second sub-Pad group 820 is respectively located in the cutting area 200 on the upper and lower sides of the non-display sub-area 120, which is more convenient for cutting the mother board prepared with a plurality of display panels 10, and when the mother board is specifically cut As shown in FIG. 2, the part of the display panel 10 located on the side of the non-display sub-region 120 far away from the display sub-region 110 can be completely removed, so as to reduce the subsequent process of cutting off the cutting region 200.
在一实施例中，如图4所示，所述柔性基板300与所述触控走线720之间设有位于所述非显示子区120和切割区200内的绝缘层900，所述绝缘层900上设有位于所述切割区200的第一过孔910和位于所述非显示子区120的第二过孔920，所述切割区200的触控走线720穿过所述第一过孔910与穿过所述第二过孔920的所述非显示子区120的触控走线720连接，可以理解的是，通过所述第一过孔910和第二过孔920，便于所述切割区200的触控走线720与所述非显示子区120的触控走线720进行换层桥接，以便于防止在对显示面板10对应所述切割区200的部分切除的过程中造成触控走线720的短路。In one embodiment, as shown in FIG. 4, an insulating layer 900 located in the non-display sub-region 120 and the cutting region 200 is provided between the flexible substrate 300 and the touch trace 720. The layer 900 is provided with a first via 910 located in the cutting area 200 and a second via 920 located in the non-display sub-area 120, and the touch trace 720 of the cutting area 200 passes through the first The via 910 is connected to the touch trace 720 of the non-display sub-region 120 passing through the second via 920. It can be understood that through the first via 910 and the second via 920, it is convenient to The touch traces 720 of the cutting area 200 and the touch traces 720 of the non-display sub-area 120 are exchanged and bridged, so as to prevent the process of cutting the display panel 10 corresponding to the part of the cutting area 200. This causes a short circuit of the touch trace 720.
综上所述，通过将触控走线720由非显示子区120延伸至所述切割区200，并且使所述切割区200的触控走线720密度小于所述非显示子区120的触控走线720密度，以便于外部测试电路与所述切割区200的触控走线720进行精确对位连接，方便在显示面板10绑定IC前对所述触控电极710进行各项性能测试；提高了检测效率，此外，本申请中所述测试Pad组800的设置位置较为灵活，可根据实际的切割区200位置进行设置，并且，所述触控走线720在非显示子区120与切割区200之间采用换层桥接的方式，避免了在切除显示面板10中切割区200部分时造成短路的现象。In summary, by extending the touch traces 720 from the non-display sub-region 120 to the cutting area 200, the density of the touch traces 720 in the cutting region 200 is less than that of the non-display sub-region 120. The density of the traces 720 is controlled so that the external test circuit and the touch trace 720 of the cutting area 200 can be accurately aligned and connected, and it is convenient to perform various performance tests on the touch electrode 710 before the IC is bound to the display panel 10 Improve the detection efficiency. In addition, the setting position of the test Pad group 800 described in this application is more flexible and can be set according to the actual position of the cutting area 200, and the touch trace 720 is in the non-display sub-area 120 and The cutting area 200 adopts a layer-changing bridging method, which avoids the phenomenon of short circuit when cutting the cutting area 200 in the display panel 10.
本申请实施例还提供了一种如前所述的显示面板10的测试方法，如图5所示，包括：The embodiment of the present application also provides a test method of the display panel 10 as described above, as shown in FIG. 5, including:
步骤S10：通过所述切割区200的触控走线720对所述触控电极710进行测试；Step S10: Test the touch electrode 710 through the touch trace 720 of the cutting area 200;
步骤S20：测试完成后，将所述显示面板10对应所述切割区200的部分切除，以得到所述显示面板10对应所述成品区100的部分，具体的，可以是通过刀轮切割或激光切割的方式将所述显示面板10对应所述切割区200的部分切除。Step S20: After the test is completed, cut off the portion of the display panel 10 corresponding to the cutting area 200 to obtain the portion of the display panel 10 corresponding to the finished area 100. Specifically, it can be cut by a knife wheel or laser The cutting method cuts off the portion of the display panel 10 corresponding to the cutting area 200.
在本申请实施例的显示面板中，所述步骤S10：通过所述切割区200的触控走线720对所述触控电极710进行测试包括：In the display panel of the embodiment of the present application, the step S10: testing the touch electrode 710 through the touch trace 720 of the cutting area 200 includes:
步骤S11：将一触控电极710测试板采用假压的方式与所述切割区200的触控走线720连接；Step S11: Connect a touch electrode 710 test board to the touch trace 720 of the cutting area 200 by means of false pressing;
步骤S12：通过触控电极710测试板对所述切割区200的触控走线720输入测试信号，以对所述触控电极710进行测试。具体的，对所述触控电极710进行测试的内容可以包括：所述触控电极710是否有短路、断路等。Step S12: Input a test signal to the touch trace 720 of the cutting area 200 through the touch electrode 710 test board to test the touch electrode 710. Specifically, the test content of the touch electrode 710 may include: whether the touch electrode 710 has a short circuit, an open circuit, or the like.
可以理解的是，步骤S20：测试完成后，将所述显示面板10对应所述切割区200的部分切除，以得到所述显示面板10对应所述成品区100的部分；其中，所述测试完成后可以是所述触控电极710各项指标测试合格后，当然，也包括所述触控电极710在测试不合格进行返修，然后测试各项指标合格之后，再将所述显示面板10对应所述切割区200的部分切除，以得到所述显示面板10对应所述成品区100的部分，当然，所述触控电极710各项测试指标及是否合格可根据具体产品要求进行设置。It is understandable that step S20: after the test is completed, cut off the portion of the display panel 10 corresponding to the cutting area 200 to obtain the portion of the display panel 10 corresponding to the finished product area 100; wherein, the test is completed The latter may be after the touch electrode 710 has passed the test for all indicators, of course, it also includes the touch electrode 710 being repaired after the test is unqualified, and then after the test is passed, the display panel 10 is then matched to the Part of the cutting area 200 is cut to obtain the part of the display panel 10 corresponding to the finished area 100. Of course, the test indicators and eligibility of the touch electrode 710 can be set according to specific product requirements.
综上所述，本申请显示面板10的测试方法，充分利用显示面板10批量制作过程中所述显示面板10的切割区200部分，便于在生产显示面板10绑定IC前对所述触控电极710进行各项性能测试，并且，不影响其它工艺的制备，实用性和适应性较高。In summary, the test method of the display panel 10 of the present application makes full use of the cutting area 200 part of the display panel 10 during the mass production process of the display panel 10, which is convenient for the touch electrode before the IC is bound to the display panel 10 710 performs various performance tests, and does not affect the preparation of other processes, and has high practicability and adaptability.
综上，本申请通过将触控走线720由非显示子区120延伸至所述切割区200，并且使所述切割区200的触控走线720密度小于所述非显示子区120的触控走线720密度，以便于外部测试电路与所述切割区200的触控走线720进行精确对位连接，方便在显示面板10绑定IC前对所述触控电极710进行各项性能测试；提高了检测效率，此外，也充分合理的利用了显示面板10在制作过程中的切割区200部分，并且，在进行测试完之后，可以将所述切割区200的部分切掉，以便后续制作。In summary, the present application extends touch traces 720 from the non-display sub-region 120 to the cutting area 200, and makes the density of touch traces 720 in the cutting region 200 smaller than that of the non-display sub-region 120. The density of the traces 720 is controlled so that the external test circuit and the touch traces 720 of the cutting area 200 can be precisely aligned and connected, and it is convenient to perform various performance tests on the touch electrodes 710 before the display panel 10 binds the IC. ; Improve the detection efficiency, in addition, the display panel 10 in the production process of the cutting area 200 part is also fully and reasonably used, and after the test is completed, part of the cutting area 200 can be cut off for subsequent production .
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。It can be understood that for those of ordinary skill in the art, equivalent replacements or changes can be made according to the technical solutions of the present application and its inventive concept, and all these changes or replacements shall fall within the protection scope of the appended claims of the present application.

Claims (10)

  1. 一种显示面板，包括成品区和设置于所述成品区外侧的切割区，所述成品区包括：显示子区和非显示子区，A display panel includes a finished product area and a cutting area arranged outside the finished product area, the finished product area includes: a display sub-area and a non-display sub-area,
    所述显示面板包括：The display panel includes:
    柔性基板；Flexible substrate
    薄膜晶体管层，设置于所述柔性基板的一侧，且与所述显示子区对应；The thin film transistor layer is disposed on one side of the flexible substrate and corresponds to the display sub-region;
    有机发光层，设置在所述薄膜晶体管层远离所述柔性基板的一侧，且与所述显示子区对应；The organic light-emitting layer is arranged on the side of the thin film transistor layer away from the flexible substrate and corresponds to the display sub-region;
    封装层，设置在所述有机发光层远离所述薄膜晶体管的一侧，且至少与所述成品区对应；及The encapsulation layer is arranged on the side of the organic light-emitting layer away from the thin film transistor, and at least corresponds to the finished product area; and
    触控层，设置在所述封装层远离所述有机发光层的一侧，所述触控层包括：触控电极和触控走线，所述触控电极与所述显示子区对应设置，所述触控走线一端与所述触控电极连接，所述触控走线另一端从所述非显示子区延伸至所述切割区，且所述切割区的触控走线密度小于所述非显示子区的触控走线密度。The touch layer is arranged on the side of the encapsulation layer away from the organic light-emitting layer, the touch layer includes: touch electrodes and touch wires, and the touch electrodes are arranged corresponding to the display sub-regions, One end of the touch trace is connected to the touch electrode, the other end of the touch trace extends from the non-display sub-area to the cutting area, and the density of touch traces in the cutting area is less than that of the cut area. The touch trace density of the non-display sub-area is described.
  2. 根据权利要求1所述的显示面板，其中，所述切割区内设有与所述触控走线连接的测试Pad组。4. The display panel of claim 1, wherein the cutting area is provided with a test pad group connected to the touch trace.
  3. 根据权利要求2所述的显示面板，其中，所述切割区绕所述成品区四周设置，所述测试Pad组设置于所述非显示子区远离所述显示子区一侧的所述切割区内。The display panel of claim 2, wherein the cutting area is arranged around the finished area, and the test pad group is arranged in the cutting area on the side of the non-display sub-area away from the display sub-area Inside.
  4. 根据权利要求2所述的显示面板，其中，所述切割区呈C型绕所述成品区上下两侧和所述成品区靠近所述显示子区的一侧设置，所述测试Pad组包括第一子Pad组和第二子Pad组，所述第一子Pad组和第二子Pad组分别位于所述非显示子区上下两侧的所述切割区内。The display panel according to claim 2, wherein the cutting area is C-shaped and is arranged around the upper and lower sides of the finished product area and a side of the finished product area close to the display sub-area, and the test Pad group includes a first A sub-Pad group and a second sub-Pad group, the first sub-Pad group and the second sub-Pad group are respectively located in the cutting area on the upper and lower sides of the non-display sub-area.
  5. 根据权利要求1所述的显示面板，其中，所述柔性基板与所述触控走线之间设有位于所述非显示子区和切割区内的绝缘层，所述绝缘层上设有位于所述切割区的第一过孔和位于所述非显示子区的第二过孔，所述切割区的触控走线穿过所述第一过孔与穿过所述第二过孔的所述非显示子区的触控走线连接。The display panel according to claim 1, wherein an insulating layer located in the non-display sub-region and the cutting area is provided between the flexible substrate and the touch trace, and the insulating layer is provided with The first via hole of the cutting area and the second via hole located in the non-display sub-area, and the touch trace of the cutting area passes through the first via hole and the second via hole. The touch control traces of the non-display sub-area are connected.
  6. 根据权利要求1所述的显示面板，其中，所述切割区内任一相邻两所述触控走线中心线之间的距离均大于等于180um。The display panel of claim 1, wherein the distance between the center lines of any two adjacent touch traces in the cutting area is greater than or equal to 180um.
  7. 根据权利要求6所述的显示面板，其中，所述非显示子区内任一相邻两所述触控走线中心线之间的距离均小于等于40 um。7. The display panel of claim 6, wherein the distance between the center lines of any two adjacent touch traces in the non-display subregion is less than or equal to 40 um.
  8. 一种如权利要求1所述的显示面板的测试方法，包括：A method for testing a display panel according to claim 1, comprising:
    通过所述切割区的触控走线对所述触控电极进行测试；Testing the touch electrodes through the touch traces in the cutting area;
    测试完成后，将所述显示面板对应所述切割区的部分切除，以得到所述显示面板对应所述成品区的部分。After the test is completed, the part of the display panel corresponding to the cutting area is cut to obtain the part of the display panel corresponding to the finished product area.
  9. 根据权利要求8所述的显示面板的测试方法，其中，所述通过所述切割区的触控走线对所述触控电极进行测试包括：8. The method for testing the display panel according to claim 8, wherein the testing the touch electrodes through the touch traces in the cutting area comprises:
    将一触控电极测试板采用假压的方式与所述切割区的触控走线连接；Connecting a touch electrode test board to the touch trace in the cutting area by means of false pressing;
    通过触控电极测试板对所述切割区的触控走线输入测试信号，以对所述触控电极进行测试。A test signal is input to the touch trace in the cutting area through the touch electrode test board to test the touch electrode.
  10. 根据权利要求8所述的显示面板的测试方法，其中，通过刀轮切割或激光切割的方式将所述显示面板对应所述切割区的部分切除。8. The test method of the display panel according to claim 8, wherein the part of the display panel corresponding to the cutting area is cut off by means of knife wheel cutting or laser cutting.
PCT/CN2019/129892 2019-12-18 2019-12-30 Display panel and testing method therefor WO2021120323A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111653548A (en) * 2020-06-18 2020-09-11 京东方科技集团股份有限公司 Display substrate, display panel and preparation method thereof
CN111949158B (en) * 2020-08-11 2022-03-01 昆山国显光电有限公司 Touch display panel and touch display device
CN112650417B (en) * 2021-01-11 2023-02-24 武汉华星光电半导体显示技术有限公司 Touch display panel and touch display device
US11755138B2 (en) 2021-03-04 2023-09-12 Tcl China Star Optoelectronics Technology Co., Ltd. Touch control substrate, test method thereof, and manufacturing method of touch control screen
CN113064506B (en) * 2021-03-04 2023-06-30 Tcl华星光电技术有限公司 Touch substrate, detection method thereof, touch screen and manufacturing method thereof
CN113097094B (en) * 2021-04-29 2022-11-25 云谷（固安）科技有限公司 Substrate to be cut, display panel and preparation method of display panel
CN114860110A (en) * 2022-05-19 2022-08-05 武汉华星光电半导体显示技术有限公司 Touch display panel and display device
WO2024012426A1 (en) * 2022-07-11 2024-01-18 广州视源电子科技股份有限公司 Touch-control panel and touch-control display apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130050226A1 (en) * 2011-08-30 2013-02-28 Qualcomm Mems Technologies, Inc. Die-cut through-glass via and methods for forming same
CN104238823A (en) * 2014-09-26 2014-12-24 上海天马微电子有限公司 Touch display panel, preparation method thereof and touch display device
CN106775173A (en) * 2017-02-07 2017-05-31 上海天马微电子有限公司 A kind of touch-control display panel and touch control display apparatus
CN108550552A (en) * 2018-04-24 2018-09-18 昆山国显光电有限公司 Display panel, display device, display panel motherboard and preparation method thereof
CN109064903A (en) * 2018-09-21 2018-12-21 武汉华星光电半导体显示技术有限公司 Display panel and electronic device
CN109614012A (en) * 2019-01-25 2019-04-12 武汉华星光电半导体显示技术有限公司 Polarisation touch-control component and preparation method, flexible display apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63306633A (en) * 1987-06-08 1988-12-14 Toshiba Corp Film carrier
TW558772B (en) * 2001-08-08 2003-10-21 Matsushita Electric Ind Co Ltd Semiconductor wafer, semiconductor device and fabrication method thereof
JP2005123542A (en) * 2003-10-20 2005-05-12 Genusion:Kk Package structure for semiconductor device and method for packaging
JP2005277338A (en) * 2004-03-26 2005-10-06 Nec Electronics Corp Semiconductor device and inspecting method therefor
JP2011149938A (en) * 2010-01-22 2011-08-04 Kodi-S Co Ltd Film type probe unit, and method of manufacturing the same
US20140063360A1 (en) * 2010-06-17 2014-03-06 Yousuke KUNISHI Input device
KR20120015890A (en) * 2010-08-13 2012-02-22 삼성전자주식회사 Flexible display apparatus and control method thereof
JP2014174851A (en) * 2013-03-11 2014-09-22 Japan Display Inc Touch sensor device, display device and electronic device
TWI512568B (en) * 2013-11-15 2015-12-11 Au Optronics Corp Touch panel and manufacturing method thereof
JP2015143933A (en) * 2014-01-31 2015-08-06 株式会社ジャパンディスプレイ Display device with capacitance sensor and driving method therefor
KR102256223B1 (en) * 2014-09-02 2021-05-27 삼성디스플레이 주식회사 Mother substrate for a touch screen panel and array testing method thereof
CN104765169B (en) * 2015-02-04 2018-01-05 深圳市华星光电技术有限公司 The detection circuit and array base palte of a kind of array base palte
JP6112432B2 (en) * 2015-12-28 2017-04-12 株式会社ジャパンディスプレイ Coordinate input device
CN108845702B (en) * 2018-06-28 2021-12-28 武汉华星光电技术有限公司 Touch display panel, test method thereof and touch display device
CN109659277B (en) * 2018-12-18 2020-12-04 武汉华星光电半导体显示技术有限公司 Display panel and manufacturing method thereof
CN111736380A (en) * 2019-07-26 2020-10-02 友达光电股份有限公司 Display panel and method for manufacturing the same
KR102256917B1 (en) * 2019-12-11 2021-05-27 엘지디스플레이 주식회사 Touch display device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130050226A1 (en) * 2011-08-30 2013-02-28 Qualcomm Mems Technologies, Inc. Die-cut through-glass via and methods for forming same
CN104238823A (en) * 2014-09-26 2014-12-24 上海天马微电子有限公司 Touch display panel, preparation method thereof and touch display device
CN106775173A (en) * 2017-02-07 2017-05-31 上海天马微电子有限公司 A kind of touch-control display panel and touch control display apparatus
CN108550552A (en) * 2018-04-24 2018-09-18 昆山国显光电有限公司 Display panel, display device, display panel motherboard and preparation method thereof
CN109064903A (en) * 2018-09-21 2018-12-21 武汉华星光电半导体显示技术有限公司 Display panel and electronic device
CN109614012A (en) * 2019-01-25 2019-04-12 武汉华星光电半导体显示技术有限公司 Polarisation touch-control component and preparation method, flexible display apparatus

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