WO2021117364A1 - Dispositif d'affichage et appareil électronique - Google Patents
Dispositif d'affichage et appareil électronique Download PDFInfo
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- WO2021117364A1 WO2021117364A1 PCT/JP2020/040243 JP2020040243W WO2021117364A1 WO 2021117364 A1 WO2021117364 A1 WO 2021117364A1 JP 2020040243 W JP2020040243 W JP 2020040243W WO 2021117364 A1 WO2021117364 A1 WO 2021117364A1
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- display device
- substrate
- display
- light
- sealing
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- 239000000463 material Substances 0.000 claims abstract description 141
- 239000000758 substrate Substances 0.000 claims abstract description 123
- 239000011162 core material Substances 0.000 claims abstract description 42
- 239000011159 matrix material Substances 0.000 claims abstract description 10
- 239000012780 transparent material Substances 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims description 39
- 238000000576 coating method Methods 0.000 claims description 39
- 238000007789 sealing Methods 0.000 claims description 39
- 239000003566 sealing material Substances 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011521 glass Substances 0.000 claims description 14
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 238000005401 electroluminescence Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 239000000049 pigment Substances 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000009719 polyimide resin Substances 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 26
- 238000000034 method Methods 0.000 description 21
- 239000010408 film Substances 0.000 description 17
- 230000035699 permeability Effects 0.000 description 13
- 239000012044 organic layer Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 238000005192 partition Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 230000011514 reflex Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 230000012447 hatching Effects 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011325 microbead Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Definitions
- This disclosure relates to display devices and electronic devices.
- a display element provided with a current-driven light emitting unit and a display device provided with such a display element are well known.
- a display element provided with a light emitting unit composed of an organic electroluminescence element (hereinafter, may be simply abbreviated as [organic EL light emitting unit]) is attracting attention as a display element capable of high-luminance light emission by low-voltage direct current drive. Has been done.
- a display device including a display element having an organic EL light emitting unit usually faces the organic EL light emitting unit with respect to a first substrate on which a drive circuit for driving the organic EL light emitting unit and an organic EL light emitting unit are laminated. It is formed by laminating the second substrate so as to do so. The display element deteriorates when exposed to moisture in the atmosphere. Therefore, the periphery of the first substrate and the second substrate is sealed with a sealing material.
- the above-mentioned display device is a self-luminous type, and further has sufficient responsiveness to a high-definition high-speed video signal.
- the pixel size is required to be about several micrometers to 10 micrometers.
- the display device is a module having a structure in which a second substrate is bonded to a chip-shaped first substrate, but further miniaturization and cost reduction are required.
- the outer frame of the display area of the display device must be a light-shielding area.
- a structure in which a frame-shaped member is prepared separately from the substrate and bonded to the frame-shaped member is a factor for expanding the outer shape and a factor for increasing the cost. Therefore, it has been proposed to form a light-shielding portion by laminating color filters, apply a sealing material on the light-shielding portion, and bond the second substrate to the first substrate (for example, Patent Document 1). reference). It has also been proposed that the sealing material be provided with light-shielding performance (see, for example, Patent Document 2).
- the end portion of the color filter is arranged on the end face of the display device. Since the material constituting the color filter has relatively high moisture permeability, a problem remains from the viewpoint of moisture permeability. Further, if the sealing material has a light-shielding performance, the adhesion is lowered. Therefore, when the sealing area is reduced with the miniaturization, a problem remains from the viewpoint of adhesion.
- an object of the present disclosure is to provide a display device having a configuration suitable for miniaturization, having low moisture permeability by sealing and excellent adhesion, and an electronic device provided with such a display device.
- the display device for achieving the above object is A first substrate having a display area composed of display elements arranged in a matrix, and A second substrate made of transparent material and A seal that surrounds the outside of the display area, Have and
- the sealing portion is composed of a core material made of a light-shielding material and a covering material made of a sealing material. The first substrate and the second substrate are sealed so that the surfaces of the covering material of the sealing portion are in contact with each other. It is a display device.
- the electronic devices according to the present disclosure for achieving the above objectives are A first substrate having a display area composed of display elements arranged in a matrix, and A second substrate made of transparent material and A seal that surrounds the outside of the display area, Have and
- the sealing portion is composed of a core material made of a light-shielding material and a covering material made of a sealing material. The first substrate and the second substrate are sealed so that the surfaces of the covering material of the sealing portion are in contact with each other. It is an electronic device equipped with a display device.
- FIG. 1A and 1B are schematic views for explaining the display device according to the first embodiment.
- FIG. 1A shows a schematic plan view when the display device is viewed from the front.
- FIG. 1B is a schematic cross-sectional view of a portion shown by AA in FIG.
- FIG. 2 is a schematic circuit diagram for explaining a basic configuration of a display element.
- FIG. 3 is a schematic partial cross-sectional view of a portion of the first substrate including a display element.
- FIG. 4 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate.
- 5A and 5B are schematic partial cross-sectional views for explaining a sealing process between the first substrate and the second substrate.
- FIG. 6 is a schematic plan view for explaining the planar shape of the coating material made of the sealing material applied in the process of FIG. 5B.
- FIG. 7 is a schematic partial cross-sectional view for explaining a sealing process between the first substrate and the second substrate, following FIG. 5B.
- FIG. 8 is a schematic plan view for explaining the plan shape of the core material made of the light-shielding material applied in the process of FIG. 7.
- FIG. 9 is a schematic partial cross-sectional view for explaining a sealing process between the first substrate and the second substrate, following FIG. 7.
- FIG. 10 is a schematic plan view for explaining the planar shape of the coating material made of the sealing material applied in the process of FIG. FIG.
- FIG. 11 is a schematic partial cross-sectional view for explaining a sealing process between the first substrate and the second substrate, following FIG. 9.
- 12A and 12B are schematic views for explaining a nozzle structure when a core material made of a light-shielding material and a coating material made of a sealing material are collectively applied.
- FIG. 13 is a schematic partial cross section for explaining a sealing state between the first substrate and the second substrate when the core material made of a light-shielding material and the coating material made of a sealing material are collectively applied. It is a figure.
- FIG. 14 is a schematic partial cross-sectional view for explaining an example of a more specific cross-sectional shape of the core material.
- FIG. 14 is a schematic partial cross-sectional view for explaining an example of a more specific cross-sectional shape of the core material.
- FIG. 15 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate according to the first modification.
- FIG. 16 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate according to the second modification.
- FIG. 17 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate according to the third modification.
- FIG. 18 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate according to the fourth modification.
- 19A and 19B are external views of a single-lens reflex type digital still camera with interchangeable lenses.
- FIG. 19A shows a front view thereof
- FIG. 19B shows a rear view thereof.
- FIG. 20 is an external view of the head-mounted display.
- FIG. 21 is an external view of the see-through head-mounted display.
- the display device according to the present disclosure and the display device used for the electronic device according to the present disclosure are as described above.
- the sealing portion is composed of a core material made of a light-shielding material and a covering material made of a sealing material. The first substrate and the second substrate are sealed so that the surfaces of the covering material of the sealing portion are in contact with each other. It is a display device.
- the side surfaces of the sealing portion excluding the contact surface at least one of the outer side surface and the inner side surface of the display device may be covered with a covering material.
- a covering material from the viewpoint of lowering the moisture permeability, of the surfaces of the sealing portion excluding the contact surface, both the outer side surface and the inner side surface of the display device shall be covered with a covering material. Is preferable.
- At least one of the first substrate and the second substrate has a light-shielding portion formed of a laminated color filter and formed so as to surround the outside of the display area. Therefore, a part of the light-shielding portion that overlaps with the seal portion can be configured such that the light-shielding portion is removed in a groove shape along the seal portion.
- the material constituting the color filter has high moisture permeability. Therefore, the moisture permeability of the seal portion can be kept low by adopting a structure in which the region from which the light-shielding portion is removed in the shape of a groove is embedded with a coating material.
- the coating material may be composed of a sealing material using a resin.
- the coating material may be composed of a thermosetting resin or a photocurable resin. Since the core material has a light-shielding property, it is preferable that the coating material is made of a thermosetting resin from the viewpoint of efficiency of the curing treatment.
- the covering material may be composed of an acrylic resin, a urethane resin, or a resin in which these are mixed.
- the coating material may be composed of a sealing material using low melting point glass.
- the low melting point glass so-called frit glass can be exemplified.
- frit glass By using low melting point glass as a sealing material, higher airtightness can be obtained as compared with the case where resin is used.
- the coating material may be configured to be a sealing material containing a spacer.
- a spacer a sphere or a cylinder made of an inorganic insulating material such as silica can be used.
- the viscosity and strength of the sealing material can be adjusted, and the thickness of the covering material in the sealing portion can be made substantially constant.
- the core material can be configured to be a light-shielding material using a black resin.
- the core material may be composed of a thermosetting or photocurable polyimide resin in which at least one of black pigment, carbon black and titanium black is mixed.
- the display element can be configured to have a light emitting unit including an organic electroluminescence element, an LED element, a semiconductor laser element, and the like. These devices can be constructed using well-known materials and methods. From the viewpoint of configuring a flat display device, it is preferable that the display element has a light emitting portion composed of an organic electroluminescence element.
- the display device of the present disclosure may be configured to include a drive circuit for driving the light emitting unit.
- the light emitting portion and the drive circuit can be connected via, for example, a conductive portion made of vias provided in an interlayer insulating film.
- a semiconductor material, a glass material, or a plastic material can be exemplified.
- the drive circuit is composed of transistors formed on a semiconductor substrate, for example, a well region may be provided on a semiconductor substrate made of silicon, and a transistor may be formed in the wells.
- the drive circuit is composed of a thin film transistor or the like, a semiconductor thin film can be formed on the substrate made of a glass material or a plastic material to form the drive circuit.
- the various types of wiring can have a well-known configuration and structure.
- the configuration of the drive circuit and the like for controlling the light emission of the light emitting unit is not particularly limited.
- the light emitting portion may be formed, for example, in a certain plane on the substrate, and may be arranged above the drive circuit for driving the light emitting portion via, for example, an interlayer insulating layer.
- the configuration of the transistors constituting the drive circuit is not particularly limited. It may be a p-channel type field-effect transistor or an n-channel type field-effect transistor.
- the light emitting unit can be configured to be a so-called top light emitting type.
- a light emitting unit composed of an organic electroluminescence element is configured by sandwiching an organic layer including a hole transport layer, a light emitting layer, an electron transport layer, and the like between a lower electrode and an upper electrode.
- the cathode is shared, the upper electrode is the cathode electrode and the lower electrode is the anode electrode.
- the lower electrode is provided on the substrate for each light emitting part.
- the lower electrode functions as an anode electrode of the light emitting portion.
- the lower electrode can be made of a metal such as aluminum (Al), an aluminum alloy, platinum (Pt), gold (Au), chromium (Cr), tungsten (W), or an alloy thereof.
- a transparent conductive material layer such as indium tin oxide (ITO) or indium zinc oxide (IZO) and a reflective layer made of a light reflecting material may be laminated.
- the lower electrode is preferably set in the range of 100 to 300 nanometers in thickness.
- the organic layer is formed by laminating a plurality of material layers, and is provided on the entire surface including the lower electrode and the partition wall as a common continuous film.
- the organic layer emits light when a voltage is applied between the lower electrode and the upper electrode.
- the organic layer can be composed of, for example, a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially laminated from the lower electrode side.
- the hole transporting material, the hole transporting material, the electron transporting material, and the organic light emitting material constituting the organic layer are not particularly limited, and well-known materials can be used.
- the organic layer may include a structure in which a plurality of light emitting layers are laminated.
- a light emitting portion that emits white light can be configured by stacking light emitting layers of red light emitting, blue light emitting, and green light emitting, or by stacking light emitting layers of blue light emitting and yellow light emitting.
- the display device of the present disclosure may have a color display configuration.
- the color filter can be formed by using, for example, a resin material containing a pigment or a dye.
- a so-called monochrome display configuration may be used.
- one display element constitutes one pixel.
- one display element constitutes one sub-pixel.
- one pixel is composed of a plurality of sub-pixels, specifically, one pixel is composed of three sub-pixels of a red display sub-pixel, a green display sub-pixel, and a blue display sub-pixel. be able to.
- a set of these three types of sub-pixels plus one or more types of sub-pixels for example, a set of sub-pixels that emit white light to improve brightness, and a color reproduction range
- the partition wall for partitioning the adjacent display element can be formed by using a material appropriately selected from known inorganic materials and organic materials.
- a physical vapor deposition method exemplified by a vacuum deposition method or a sputtering method can be used. It can be formed by a combination of a well-known film forming method such as (PVD method) or various chemical vapor deposition methods (CVD method) and a well-known patterning method such as an etching method or a lift-off method.
- VGA 640,480
- S-VGA 800,600
- XGA XGA
- APRC APRC
- S-XGA 1280,1024
- Image display such as U-XGA (1600,1200), HD-TV (1920,1080), Q-XGA (2048,1536), (1920,1035), (720,480), (1280,960), etc.
- various electronic devices having an image display function can be exemplified in addition to the direct-view type and projection type display devices.
- FIG. 3 which will be described later, shows the cross-sectional structure of the display device, but does not show the ratios such as width, height, and thickness.
- the first embodiment relates to a display device according to the first aspect of the present disclosure.
- FIG. 1A and 1B are schematic views for explaining the display device according to the first embodiment.
- FIG. 1A shows a schematic plan view when the display device is viewed from the front.
- FIG. 1B is a schematic cross-sectional view of a portion shown by AA in FIG.
- a part of the second substrate 200 which will be described later, is cut out and shown.
- Display device 1 A first substrate 100 having a display area 11 composed of display elements 10 arranged in a matrix, and a first substrate 100.
- a second substrate 200 made of a transparent material and A seal portion 310 arranged so as to surround the outside of the display area 11 and have.
- display elements 10 are actually arranged, they are simplified for convenience of illustration. The same applies to other components.
- the seal portion 310 is composed of a core material 312 made of a light-shielding material and a coating material 311 made of a seal material.
- the first substrate 100 and the second substrate 200 are sealed so that the surfaces of the covering material 311 of the sealing portion 310 are in contact with each other.
- a filler 320 for, for example, an optical coupling is arranged between the first substrate 100 and the second substrate 200.
- the space between the first substrate 100 and the second substrate 200 may be hollow.
- An electrode CT for inputting a video signal or the like supplied from the outside is provided in a portion of the first substrate 100 that is not covered by the second substrate 200.
- FIG. 2 is a schematic circuit diagram for explaining a basic configuration of a display element.
- the wiring relationship of one display element 10, more specifically, the display element 10 in the mth row and nth column is shown.
- the display device 1 includes a power supply unit 21, a scanning unit 22, and a data driver 23.
- the display element 10 is formed on a support made of, for example, glass.
- the power supply unit 21, the scanning unit 22, and the data driver 23 are also formed on the same support. That is, the display device 1 is a display device integrated with a driver circuit. In some cases, the driver circuit may be configured as a separate body.
- the display element 10 includes a current-driven light emitting unit ELP and a circuit for driving the light emitting unit ELP.
- This drive circuit includes at least a write transistor TR W for writing a video signal and a drive transistor TR D for passing a current through the light emitting unit ELP. These are composed of p-channel transistors.
- Driving circuit further includes a capacitor portion C S.
- the capacitance portion CS is used to hold the voltage of the gate electrode (so-called gate-source voltage) with respect to the source region of the drive transistor TR D.
- the display element 10 emits light
- one source / drain region of the drive transistor TR D acts as a source region
- the other source / drain region acts as a drain region. ..
- One electrode and the other electrode constituting the capacitor portion C S are respectively connected to one of the source / drain regions and the gate electrode of the driving transistor TR D.
- the other source / drain region of the drive transistor TR D is connected to the anode electrode of the light emitting unit ELP.
- the display element 10 has a light emitting unit ELP composed of an organic electroluminescence element.
- the light emitting unit ELP is a current-driven light emitting unit whose emission brightness changes according to the flowing current value, and is a well-known unit including an anode electrode, a hole transport layer, a light emitting layer, an electron transport layer, a cathode electrode, and the like. It has a structure and structure.
- the other end (specifically, the cathode electrode) of the light emitting unit ELP is connected to the common feeder line PS2.
- a predetermined voltage V CATH (for example, ground potential) is supplied to the common feeder line PS2.
- the capacitance of the light emitting unit ELP is represented by the symbol C EL. If the capacity C EL of the light emitting unit ELP is so small that it causes a problem in driving, an auxiliary capacity connected in parallel to the light emitting unit ELP may be provided as necessary.
- the write transistor TR W includes a gate electrode connected to the scanning line SCL, one source / drain region connected to the data line DTL, and the other source / drain region connected to the gate electrode of the drive transistor TR D. Has. As a result, a signal voltage from the data line DTL is written via a write transistor TR W in a capacitor portion C S.
- the capacitance portion CS is connected between one source / drain region of the drive transistor TR D and the gate electrode.
- the one of the source / drain regions of the driving transistor TR D power supply voltage V CC is applied from the power supply unit 21 via a feeder line PS1 m.
- the capacitance section C S is the voltage such (V CC -V Sig), gate of the driving transistor TR D Hold as source-to-source voltage.
- a drain current I ds represented by the following equation (1) flows through the drive transistor TR D , and the light emitting unit ELP emits light with a brightness corresponding to the current value.
- I ds k ⁇ ⁇ ⁇ (( VCC -V Sig ) -
- FIG. 3 is a schematic partial cross-sectional view of a portion of the first substrate including a display element.
- the drive circuit of the display element 10 is formed on a support 110 made of, for example, a glass material.
- a flattening film 127 formed so as to cover the entire surface is formed.
- An anode electrode 131 is formed on the flattening film 127 for each display element 10.
- the anode electrode 131 is connected to the source / drain electrode 126 through the contact 128.
- a partition wall 132 for partitioning the display element is formed between the adjacent anode electrodes 131.
- the organic layer 133 is formed on the entire surface including the anode electrode 131 and the partition wall 132.
- the light emitting layer of the organic layer 133 is commonly formed over each pixel 10, and basically emits white light.
- the cathode electrode 134 is formed on the entire surface including the top of the organic layer 133.
- the cathode electrode 134 is made of a material having good light transmission and a small work function, for example, indium zinc oxide (IZO).
- IZO indium zinc oxide
- the light emitting portion ELP shown in FIG. 3 is formed by the portion in which the anode electrode 131, the organic layer 133, and the cathode electrode 134 are laminated.
- the protective film 141 is formed on the entire surface including the cathode electrode 134.
- the protective film 141 is for preventing the invasion of water into the organic layer 133, and is formed by using a material having low water permeability.
- a color filter corresponding to the color to be displayed is arranged on the protective film 141. That is, the color filter 142 is formed a color filter 142 corresponding to the red display pixel 10 R R, color filters 142 B corresponding to the blue display pixel 10 B, the color filter 142 G corresponding to green display pixel 10 G ..
- Reference numeral 142 BK indicates a so-called black matrix portion.
- a protective film 143 is further formed on the color filter 142. The light from the light emitting unit ELP is emitted through the color filter 142 and is observed as a color image.
- the three-dimensional arrangement relationship of the light emitting unit ELP, the transistor, and the like on the first substrate 100 has been described above. Subsequently, the sealed state of the first substrate and the second substrate will be described.
- FIG. 4 is a schematic partial cross-sectional view for explaining the sealed state of the first substrate and the second substrate.
- the display of the semiconductor material layer, the light emitting portion ELP, and the like on the first substrate 100 is omitted. The same applies to other drawings described later.
- the seal portion 310 is composed of a core material 312 made of a light-shielding material and a coating material 311 made of a seal material.
- the core material 312 is made of a light-shielding material using a black resin, more specifically, a thermosetting or photocurable polyimide resin in which at least one of a black pigment, carbon black and titanium black is mixed.
- the coating material 311 that coats the core material 312 is made of a sealing material using a resin, and is made of, for example, a thermosetting resin or a photocurable resin. More specifically, it can be composed of an acrylic resin, a urethane resin, or a resin in which these are mixed. In some cases, the coating material 311 may be made of a sealing material using low melting point glass.
- the first substrate 100 and the second substrate 200 are sealed in a state where the surface of the covering material 311 of the sealing portion 310 is the contact surface TS.
- the light-shielding property of the seal portion 310 is exclusively ensured by the core material 312. Therefore, the material of the covering material 311 can be selected by giving priority to the characteristics such as low moisture permeability and high sealing property.
- the surfaces of the sealing portion 310 excluding the contact surface TS at least one of the side surface SF Air facing the outside and the side surface SF In facing the inside of the display device 1 is covered with the covering material 311 in the example shown in the figure. It has been.
- 5 to 11 are schematic views for explaining a sealing process between the first substrate and the second substrate.
- Step-100 (see FIGS. 5A, 5B and 6)
- the first substrate 100 shown in FIG. 3 is prepared (see FIG. 5A), and an annular shape surrounding the outside of the display area is formed.
- Apply the dressing 311 B (see FIGS. 5B and 6).
- FIG. 6 the planar shape of the covering material 311 B made of the sealing material applied in the step shown in FIG. 5B is shown with hatching.
- Step-110 (see FIGS. 7 and 8)
- the core material 312 is applied on the covering material 311 B.
- the core material 312 is applied narrower than the coating material 311 B.
- FIG. 8 the planar shape of the core material 312 made of the light-shielding material applied in the step shown in FIG. 7 is shown with hatching.
- Step-120 (see FIGS. 9 and 10)
- the coating material 311 T is applied onto the coating material 311 B including the core material 312.
- the covering material 311 T With the same width as the covering material 311 B , the portion corresponding to the side surface SF Air and the inner side surface SF In is also covered with the covering material 311 T.
- FIG. 10 the planar shape of the covering material 311 T made of the sealing material applied in the step shown in FIG. 9 is shown with hatching.
- the sealing portion 310 composed of the core material 312 and the coating materials 311 B and 311 T is formed.
- Step-130 (see FIG. 11)
- the second substrate 100 is aligned and bonded.
- the curing treatment of the seal portion 310 can be performed by performing a treatment such as heat curing or photocuring depending on the material constituting the seal portion 310.
- the core material and the coating material were applied separately, but they can also be applied collectively.
- FIGS. 12A and 12B are schematic views for explaining a nozzle structure when a core material made of a light-shielding material and a coating material made of a sealing material are collectively applied.
- the nozzle 400 having a coaxial structure shown in FIG. 12A is composed of an inner nozzle 402 and an outer nozzle 401 arranged coaxially. Then, the core material 312 is discharged from the inner nozzle 402, and at the same time, the covering material 311 is discharged from the outer nozzle 401. By using this nozzle 400, the core material 312 and the coating material 311 can be applied at once.
- the collective nozzle 410 shown in FIG. 12B is formed as an aggregate of a plurality of small nozzles (7 in the example shown in the figure). Specifically, the configuration is such that six nozzles 411 are arranged around the central nozzle 412. Then, the core material 312 is discharged from the central nozzle 412, and at the same time, the covering material 311 is discharged from the surrounding nozzles 411. By using this nozzle 410, the core material 312 and the coating material 311 can be applied together.
- FIG. 13 is a schematic partial cross section for explaining a sealing state between the first substrate and the second substrate when the core material made of a light-shielding material and the coating material made of a sealing material are collectively applied. It is a figure.
- the width of the covering material 311 on the first substrate 100 side tends to be wide in the sealing portion 310.
- the covering material 311 has substantially the same width on the first substrate 100 and the second substrate 200 side. In the present disclosure, any configuration may be used.
- FIG. 14 is a schematic partial cross-sectional view for explaining an example of a more specific cross-sectional shape of the core material.
- FIG. 15 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate according to the first modification.
- FIG. 16 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate according to the second modification.
- one of the outer side surface SF Air and the inner side surface SF In of the display device 1 is covered with the covering material 311 among the side surfaces of the sealing portion 310 excluding the contact surface. Even with such a configuration, the moisture permeability can be kept low by the seal portion 310.
- FIG. 17 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate according to the third modification.
- the first substrate 100 has a light-shielding portion 142 BK made of laminated color filters 142 and formed so as to surround the outside of the display area.
- the light-shielding unit 142 BK is configured by stacking filters of two different colors (for example, a red filter and a green filter, a green filter and a blue filter, or a red filter and a blue filter).
- Reference numeral GV indicates a region from which the light-shielding portion 142 BK has been removed.
- the groove-shaped region GV is embedded by the covering material 311.
- the materials that make up color filters have high moisture permeability. Therefore, if the first substrate 100 and the second substrate 200 are sealed without providing the groove-shaped region GV, water vapor or the like easily enters the inside from the outside of the display device 1 via the color filter.
- the moisture permeability can be kept low by forming the region GV in which the light-shielding portion is removed in a groove shape by the covering material 311.
- FIG. 18 is a schematic partial cross-sectional view for explaining a sealed state between the first substrate and the second substrate according to the fourth modification.
- the covering material 311 is made of a sealing material containing a spacer 311A.
- a spacer 311A An example in which a sphere (microbead) made of an inorganic insulating material such as silica is used as the spacer 311A is shown.
- the display device of the present disclosure described above is used as a display unit (display device) of an electronic device in all fields for displaying a video signal input to an electronic device or a video signal generated in the electronic device as an image or a video.
- a display unit of, for example, a television set, a digital still camera, a notebook personal computer, a mobile terminal device such as a mobile phone, a video camera, a head mount display (head-mounted display), or the like.
- the display device of the present disclosure also includes a modular device having a sealed configuration.
- the display module may be provided with a circuit unit for inputting / outputting a signal or the like from the outside to the display area, a flexible printed circuit (FPC), or the like.
- FPC flexible printed circuit
- a digital still camera and a head-mounted display will be illustrated as specific examples of the electronic device using the display device of the present disclosure. However, the specific examples illustrated here are only examples, and are not limited to these.
- FIG. 19A and 19B are external views of a single-lens reflex type digital still camera with interchangeable lenses.
- FIG. 19A shows a front view thereof
- FIG. 19B shows a rear view thereof.
- An interchangeable lens single-lens reflex type digital still camera has, for example, an interchangeable photographing lens unit (interchangeable lens) 512 on the front right side of the camera body (camera body) 511, and is gripped by the photographer on the front left side. It has a grip portion 513 for the purpose.
- interchangeable photographing lens unit interchangeable lens
- a monitor 514 is provided in the center of the back of the camera body 511.
- a viewfinder (eyepiece window) 515 is provided above the monitor 514. By looking into the viewfinder 515, the photographer can visually recognize the light image of the subject guided from the photographing lens unit 512 and determine the composition.
- the display device of the present disclosure can be used as the viewfinder 515. That is, the interchangeable lens type single-lens reflex type digital still camera according to this example is manufactured by using the display device of the present disclosure as its viewfinder 515.
- FIG. 20 is an external view of the head-mounted display.
- the head-mounted display has, for example, ear hooks 612 for being worn on the user's head on both sides of the eyeglass-shaped display unit 611.
- the display device of the present disclosure can be used as the display unit 611. That is, the head-mounted display according to this example is manufactured by using the display device of the present disclosure as the display unit 611.
- FIG. 21 is an external view of the see-through head-mounted display.
- the see-through head-mounted display 711 is composed of a main body 712, an arm 713, and a lens barrel 714.
- the main body 712 is connected to the arm 713 and the glasses 700. Specifically, the end of the main body 712 in the long side direction is connected to the arm 713, and one side of the side surface of the main body 712 is connected to the eyeglasses 700 via a connecting member.
- the main body 712 may be directly attached to the head of the human body.
- the main body 712 incorporates a control board for controlling the operation of the see-through head-mounted display 711 and a display unit.
- the arm 713 connects the main body 712 and the lens barrel 714, and supports the lens barrel 714. Specifically, the arm 713 is coupled to the end of the main body 712 and the end of the lens barrel 714, respectively, to fix the lens barrel 714. Further, the arm 713 has a built-in signal line for communicating data related to an image provided from the main body 712 to the lens barrel 714.
- the lens barrel 714 projects the image light provided from the main body 712 via the arm 713 toward the eyes of the user who wears the see-through head-mounted display 711 through the eyepiece.
- the display device of the present disclosure can be used for the display unit of the main body unit 712.
- the technology of the present disclosure can also have the following configuration.
- the sealing portion is composed of a core material made of a light-shielding material and a covering material made of a sealing material.
- the first substrate and the second substrate are sealed so that the surfaces of the covering material of the sealing portion are in contact with each other.
- Of the surfaces of the sealing portion excluding the contact surface at least one of the side surface facing the outside and the side surface facing the inside of the display device is covered with a covering material.
- both the outward facing side surface and the inward facing side surface of the display device are covered with a covering material.
- At least one of the first substrate and the second substrate has a light-shielding portion made of laminated color filters and formed so as to surround the outside of the display area.
- a part of the light-shielding part that overlaps with the seal part has the light-shielding part removed in a groove shape along the seal part.
- [A5] The area where the light-shielding part is removed in the shape of a groove is embedded by the covering material.
- the covering material consists of a sealing material using resin.
- the coating material consists of thermosetting resin or photocurable resin.
- the coating material consists of an acrylic resin and a urethane resin or a resin in which these are mixed.
- the coating material consists of a sealing material using low melting point glass.
- the coating material consists of a sealing material containing spacers, The display device according to any one of the above [A1] to [A9].
- the core material is made of a light-shielding material using black resin.
- the core material consists of a thermosetting or photocurable polyimide resin in which at least one of black pigment, carbon black and titanium black is mixed.
- the display element has a light emitting unit composed of an organic electroluminescence element. The display device according to any one of the above [A1] to [A12].
- the sealing portion is composed of a core material made of a light-shielding material and a covering material made of a sealing material.
- the first substrate and the second substrate are sealed so that the surfaces of the covering material of the sealing portion are in contact with each other.
- both the outward facing side surface and the inward facing side surface of the display device are covered with a covering material.
- At least one of the first substrate and the second substrate has a light-shielding portion made of laminated color filters and formed so as to surround the outside of the display area.
- a part of the light-shielding part that overlaps with the seal part has the light-shielding part removed in a groove shape along the seal part.
- [B5] The area where the light-shielding part is removed in the shape of a groove is embedded by the covering material.
- the covering material consists of a sealing material using resin.
- the coating material consists of thermosetting resin or photocurable resin.
- the coating material consists of an acrylic resin and a urethane resin or a resin in which these are mixed.
- the coating material consists of a sealing material using low melting point glass.
- the coating material consists of a sealing material containing spacers, The electronic device according to any one of the above [B1] to [B9].
- the core material is made of a light-shielding material using black resin.
- the core material consists of a thermosetting or photocurable polyimide resin in which at least one of black pigment, carbon black and titanium black is mixed.
- the display element has a light emitting unit composed of an organic electroluminescence element.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
L'invention concerne un dispositif d'affichage qui comprend : un premier substrat muni d'une région d'affichage comprenant des éléments d'affichage agencés selon une géométrie de matrice ; un second substrat composé d'un matériau transparent ; et une partie de scellage disposée de façon à encercler l'extérieur de la région d'affichage, la partie de scellage étant configurée à partir d'un matériau d'âme composé d'un matériau de blocage de lumière et d'un matériau de couverture composé d'un matériau de scellage, et le premier substrat et le second substrat sont scellés tandis qu'une surface du matériau de couverture de la partie de scellage sert de surface de contact.
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JP2021563779A JPWO2021117364A1 (fr) | 2019-12-10 | 2020-10-27 | |
CN202080080307.0A CN114731745A (zh) | 2019-12-10 | 2020-10-27 | 显示装置和电子设备 |
US17/774,654 US20220376206A1 (en) | 2019-12-10 | 2020-10-27 | Display device and electronic apparatus |
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JP2019222813 | 2019-12-10 | ||
JP2019-222813 | 2019-12-10 |
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WO2021117364A1 true WO2021117364A1 (fr) | 2021-06-17 |
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PCT/JP2020/040243 WO2021117364A1 (fr) | 2019-12-10 | 2020-10-27 | Dispositif d'affichage et appareil électronique |
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US (1) | US20220376206A1 (fr) |
JP (1) | JPWO2021117364A1 (fr) |
CN (1) | CN114731745A (fr) |
WO (1) | WO2021117364A1 (fr) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002258261A (ja) * | 2001-03-01 | 2002-09-11 | Advanced Display Inc | 液晶表示装置 |
US20110140599A1 (en) * | 2009-12-10 | 2011-06-16 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display apparatus |
JP2011258555A (ja) * | 2010-06-11 | 2011-12-22 | Samsung Mobile Display Co Ltd | 有機発光ディスプレイ装置及びその製造方法 |
WO2013171966A1 (fr) * | 2012-05-14 | 2013-11-21 | シャープ株式会社 | Appareil d'affichage électroluminescent organique |
WO2014024455A1 (fr) * | 2012-08-10 | 2014-02-13 | シャープ株式会社 | Écran d'affichage |
US20140132148A1 (en) * | 2012-11-14 | 2014-05-15 | Samsung Display Co., Ltd. | Organic light emitting diode (oled) display |
US20180159070A1 (en) * | 2015-08-25 | 2018-06-07 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Organic light emitting diode package and display device comprising the same |
CN209401656U (zh) * | 2018-12-21 | 2019-09-17 | 惠科股份有限公司 | 一种显示面板 |
-
2020
- 2020-10-27 WO PCT/JP2020/040243 patent/WO2021117364A1/fr active Application Filing
- 2020-10-27 JP JP2021563779A patent/JPWO2021117364A1/ja active Pending
- 2020-10-27 CN CN202080080307.0A patent/CN114731745A/zh active Pending
- 2020-10-27 US US17/774,654 patent/US20220376206A1/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002258261A (ja) * | 2001-03-01 | 2002-09-11 | Advanced Display Inc | 液晶表示装置 |
US20110140599A1 (en) * | 2009-12-10 | 2011-06-16 | Samsung Mobile Display Co., Ltd. | Organic light-emitting display apparatus |
JP2011258555A (ja) * | 2010-06-11 | 2011-12-22 | Samsung Mobile Display Co Ltd | 有機発光ディスプレイ装置及びその製造方法 |
WO2013171966A1 (fr) * | 2012-05-14 | 2013-11-21 | シャープ株式会社 | Appareil d'affichage électroluminescent organique |
WO2014024455A1 (fr) * | 2012-08-10 | 2014-02-13 | シャープ株式会社 | Écran d'affichage |
US20140132148A1 (en) * | 2012-11-14 | 2014-05-15 | Samsung Display Co., Ltd. | Organic light emitting diode (oled) display |
US20180159070A1 (en) * | 2015-08-25 | 2018-06-07 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Organic light emitting diode package and display device comprising the same |
CN209401656U (zh) * | 2018-12-21 | 2019-09-17 | 惠科股份有限公司 | 一种显示面板 |
Also Published As
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CN114731745A (zh) | 2022-07-08 |
JPWO2021117364A1 (fr) | 2021-06-17 |
US20220376206A1 (en) | 2022-11-24 |
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