WO2021114432A1 - 金属线制备装置和金属线制备方法 - Google Patents

金属线制备装置和金属线制备方法 Download PDF

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Publication number
WO2021114432A1
WO2021114432A1 PCT/CN2019/129776 CN2019129776W WO2021114432A1 WO 2021114432 A1 WO2021114432 A1 WO 2021114432A1 CN 2019129776 W CN2019129776 W CN 2019129776W WO 2021114432 A1 WO2021114432 A1 WO 2021114432A1
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Prior art keywords
metal wire
solution
metal
template
preparation device
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Ceased
Application number
PCT/CN2019/129776
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English (en)
French (fr)
Inventor
张霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
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TCL China Star Optoelectronics Technology Co Ltd
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Priority to US16/647,509 priority Critical patent/US20210405401A1/en
Publication of WO2021114432A1 publication Critical patent/WO2021114432A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/136295—Materials; Compositions; Manufacture processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Definitions

  • This application relates to the field of display technology, and in particular to a metal wire preparation device and a metal wire preparation method.
  • the existing liquid crystal display will increase the aperture ratio of the display panel.
  • the width of the metal connection will be reduced. Due to the limitation of the resolution of the existing liquid crystal display panel exposure machine, the existing metal wire The width is wider, which greatly affects the improvement of resolution.
  • the existing display panel has a technical problem that the metal line width is relatively wide.
  • the present application provides a metal wire preparation device and a metal wire preparation method, which are used to solve the technical problem that the existing display panel has a wide metal wire width.
  • the present application provides a metal wire preparation device, which includes:
  • Carrying platform used to carry the substrate
  • the metal wire dissolving member is used for dissolving a part of the first metal wire using a second solution to form a second metal wire.
  • the metal wire forming member includes a curing light source, a reflector, and an objective lens
  • the curing light source is used to emit curing light to cure the first solution to form the first metal wire
  • the reflecting mirror is used to reflect the curing light so that the curing light irradiates the first solution
  • the objective lens is used to polymerize the curing light.
  • the reflecting mirror is a movable reflecting mirror, and the movable reflecting mirror is used to reflect the curing light to different angles.
  • the metal wire forming member includes a plurality of cross-arranged curing light sources and light barriers, and the curing unit is used to emit curing light to cure the first solution to form the first metal. Wire, the light barrier is used to prevent the curing light from irradiating outside the first metal wire area.
  • the metal wire preparation device further includes a first solution containing member for containing the first solution and dropping the first solution onto the ⁇ substrate.
  • the first solution containing member includes a bottom plate and a cover plate, a containing cavity is formed between the bottom plate and the cover plate, and the containing cavity is provided with the first solution, so
  • the bottom plate is provided with movable holes, and the movable holes are used for dripping the first solution onto the substrate.
  • the metal wire dissolving member includes a second solution containing unit and a third solution containing unit, and a second solution provided in the second solution containing unit is provided in the first solution containing unit.
  • the third solution of the three-solution holding unit, the second solution is used to dissolve a part of the first metal wire to form a second metal wire, and the third solution is used to clean the second metal wire.
  • the metal wire dissolving member further includes a control unit, and the control unit is used to control the flow rate of the second solution.
  • the metal wire preparation device further includes a drying member for drying the second metal wire.
  • the second solution includes at least one of a hydrogen chloride solution and a magnesium chloride solution.
  • the third solution includes water.
  • the metal wire preparation device provided in the present application further includes a template preparation member and a template removal member.
  • the template preparation member is used to prepare a template on the substrate, and the template is used to define the drip area of the first solution,
  • the template removing member is used for removing the template after forming the second metal wire.
  • the first solution includes a metal-containing precursor solution.
  • the metal-containing precursor solution includes an acrylate metal precursor, an acrylate amide ester, an acrylic resin, a two-photon initiator, a solvent, and an auxiliary agent.
  • the present application provides a method for preparing a metal wire.
  • the method for preparing a metal wire includes:
  • the metal wire dissolving member uses a second solution to dissolve a portion of the first metal wire to form a second metal wire.
  • the method further includes: forming a template on the substrate using a template preparation member, and the template is used to define a drip area of the first solution.
  • the method further includes: using a template removing member to remove the template on the substrate after forming the second metal wire.
  • the step of using the metal wire forming member to form the first metal wire using the first solution includes: using a curing light source to emit curing light to cure the first solution to form the first metal wire.
  • the metal wire preparation method further includes: using the first solution containing member to contain the first solution.
  • the metal wire preparation method further includes: using a second solution containing member to contain the second solution.
  • the present application provides a metal wire preparation device and a metal wire preparation method.
  • the metal wire preparation device includes a carrying platform, a metal wire forming member, and a metal wire dissolving member.
  • the supporting platform is used for supporting a substrate, and the metal wire forming member is used for For forming a first metal wire using a first solution, the metal wire dissolving member is used to dissolve a portion of the first metal wire using a second solution to form a second metal wire; by providing a metal wire forming member and a metal wire dissolving member, After the metal wire forming member uses the first solution to form the first metal wire, the metal wire dissolving member uses the second solution to dissolve the part of the first metal wire, so that the first metal wire is reduced to form the second metal wire, thereby solving
  • the existing display panel has a technical problem that the metal line width is relatively wide.
  • FIG. 1 is a first schematic diagram of a metal wire preparation device provided by an embodiment of the application.
  • FIG. 2 is a second schematic diagram of the metal wire preparation device provided by an embodiment of the application.
  • FIG. 3 is a flowchart of a method for preparing a metal wire provided by an embodiment of the application.
  • FIG. 4 is an effect diagram of metal wire formation provided by an embodiment of the application.
  • the present application addresses the technical problem that the existing display panel has a relatively wide metal line width, and the embodiments of the present application are used to solve the problem.
  • an embodiment of the present application provides a metal wire preparation device, and the metal wire preparation device includes:
  • the carrying platform 11 is used to carry the substrate 111;
  • the metal wire forming member 13 is used to form a first metal wire using the first solution 124;
  • the metal wire dissolving member 14 is used for dissolving a portion of the first metal wire using the second solution 1411 to form a second metal wire.
  • the embodiment of the present application provides a metal wire preparation device.
  • the metal wire preparation device includes a supporting platform, a metal wire forming member, and a metal wire dissolving member.
  • the supporting platform is used for supporting a substrate, and the metal wire forming member is used for A solution forms a first metal wire, and the metal wire dissolving member is used to dissolve a portion of the first metal wire using a second solution to form a second metal wire; by arranging a metal wire forming member and a metal wire dissolving member, the metal wire is formed After the component uses the first solution to form the first metal wire, the metal wire dissolving component uses the second solution to dissolve the part of the first metal wire, so that the first metal wire is reduced to form the second metal wire, thereby solving the existing display
  • the panel has the technical problem of wide metal line width.
  • metal wires include circuit wires and electrode patterns, but the metal wires are not limited to these, and the metal wires include all wires formed of metal or electrodes formed of metal.
  • the metal wire forming member 13 includes a curing light source 132, a reflecting mirror 133, and an objective lens 131.
  • the curing light source 132 is used to emit curing light 1321 to cure the first
  • the solution 124 forms a first metal wire
  • the reflecting mirror 133 is used to reflect the curing light 1321 so that the curing light 1321 irradiates the first solution 124
  • the objective lens 131 is used to polymerize the curing light 1321, by using
  • the combination of the curing light source, the reflector and the objective lens enables the curing light emitted by the curing light source to irradiate the first solution, so that the first solution can be cured to form the first metal wire, and considering that the light emitted by the curing light source is relatively divergent,
  • the objective lens can be used to polymerize the curing light, so that the curing light can polymerize and irradiate the first solution, so that the first solution is quickly cured into the first metal wire.
  • the reflector is a movable reflector, and the movable reflector is used to reflect the curing light to different angles, considering that the curing light is aggregated to a specific area, that is, the area formed by the first metal wire ,
  • the reflector can be a movable reflector, and the angle of the curing light is controlled by moving the movable reflector, so that the first solution is cured in a specific area to form the first metal line. It can be rotated at any angle to reflect curing light.
  • the metal wire forming member includes a plurality of curing light sources and light barriers arranged crosswise, and the curing unit is configured to emit curing light to cure the first solution to form the first metal wire, and The light barrier is used to prevent the curing light from irradiating the first metal wire area and irradiate a specific area, that is, to irradiate the first metal wire area.
  • the light barrier and the curing light source can be intersected to make the curing light source Irradiate along the area of the first metal line to cure the first solution to form the first metal line, while preventing the first solution from flowing outside the first metal line to be solidified, so that the first metal line will only be formed in the first metal line area ;
  • the light blocking plate can be extended downwards, so that the curing light will only be irradiated along the area between the light blocking plates, so that the irradiated area corresponds to the first metal wire area.
  • the metal wire forming member further includes a baking unit for baking the first metal wire to fix the first metal wire on the substrate, and to make the first metal wire It is firmly fixed on the substrate.
  • the baking unit can be used to bake the first metal wire, so that the adhesion between the first metal wire and the substrate is greater, and the fixing is better. On the substrate.
  • the first solution containing member 12 which is used to contain the first solution 124 and drip the first solution 124 to In the substrate 111, in order to set the first solution on the substrate and set the first solution on the first metal wire area, the first solution containing member may be used to contain the first solution. When the first metal wire is formed, the first solution The solution is dropped onto the substrate.
  • the first solution containing member 12 includes a bottom plate 121 and a cover plate 123.
  • a containing cavity is formed between the bottom plate 121 and the cover plate 123, and the containing cavity is A first solution 124 is provided.
  • the bottom plate is provided with movable holes 1211.
  • the movable holes 1211 are used to drip the first solution 124 onto the substrate 111.
  • the first solution is set in the containing cavity, and then the movable holes are formed on the bottom plate.
  • the hole when it is necessary to drop the first solution onto the substrate, move the movable hole to make the first solution drop onto the substrate along the movable hole, thereby forming a first metal line on the substrate.
  • the side plate 122 in FIG. 1 is formed by extending the cover plate 123 downward, or the side plate 122 is formed by the bottom plate 121, or the side plate is independent, and the side plate can be arranged in the receiving cavity array. , So that the area defined by the side plate corresponds to the first metal wire area, and the movable hole is arranged in the area defined by the side plate, so that the first solution is arranged in the area defined by the side and can be dripped along the movable hole. Substrate.
  • the wire dissolving member 14 includes a second solution containing unit 141 and a third solution containing unit 142, and a second solution provided in the second solution containing unit 141 1411, a third solution 1421 provided in the third solution containing unit 142, the second solution 1411 is used to dissolve a part of the first metal wire to form a second metal wire, and the third solution 1421 is used for cleaning
  • the second metal line in order to reduce the width of the metal line, after the first metal line is formed, a metal line dissolving member can be used to dissolve the first metal line, so that the width of the first metal line is reduced, and the metal line can be reduced at the same time To further realize the miniaturization of the metal wire.
  • the second solution containing unit may be used to contain the second solution. After the first metal wire is formed, the second solution containing unit drops or pours the second solution onto the first metal wire to dissolve the second solution.
  • the first metal line thereby forming the second metal line, reduces the first metal line to obtain the second metal line with a smaller line width, and can control the second solution to dissolve the part of the first metal line, for example, reduce the first metal line
  • the line width of the line can also reduce the thickness of the first metal line at the same time, so as to realize the miniaturization of the metal line.
  • a third solution containing unit may be provided, and the third solution containing unit may be used to pour the third solution onto the second metal wire. , To remove the second solution.
  • the first metal wire after a short interval of dissolving the first metal wire with the second solution, the first metal wire can be cleaned with the third solution, and then the first metal wire can be dissolved again with the second solution. After the short interval, Use the third solution to clean the first metal wire again until the second metal wire is formed.
  • This embodiment can prevent the second solution from directly dissolving the first metal wire, making the first metal wire useless; or dissolving the first metal in the second solution After the second metal line is formed, the third solution is used to clean the second metal line. This embodiment can quickly form the second metal line and save cost.
  • the second solution containing unit is connected to the third solution containing unit, so that the second solution containing unit and the third solution containing unit can be stacked and arranged, and then the second solution containing unit and the third solution containing unit can be moved by moving the second solution containing unit and the third solution containing unit.
  • the accommodating unit allows the two to be used alternately or at the same time, or the second solution accommodating unit and the third solution accommodating unit are arranged on the same plane, and the metal wire is moved to dissolve the member, so that the two are used alternately or at the same time, and the metal
  • the wire dissolving unit is connected to the carrying platform, and the wire dissolving unit is stretchable to move the wire dissolving member to the first metal wire to dissolve the first metal wire, or the wire dissolving member moves along the supporting platform to make So that the wire dissolving member moves to the first wire.
  • the metal wire dissolving member further includes a control unit for controlling the flow rate of the second solution.
  • the second solution needs to be controlled.
  • the flow of the second solution can be controlled by using the control unit, while the second solution can be controlled The use time of the second solution can partially dissolve the first metal wire, thereby forming the required second metal wire.
  • the metal wire preparation device further includes a drying member for drying the second metal wire, and after the second metal wire is cleaned by the third solution, the second metal wire is dried , The third solution can be removed, and the remaining second solution can be removed at the same time to obtain the second metal wire.
  • the metal wire preparation device further includes a template preparation member 21 and a template removal member 22.
  • the template preparation member 21 is used to form a template 20 on the substrate 111.
  • the template 20 is used to define the drip area of the first solution, and the template removing member 22 is used to remove the template 20 after the second metal line is formed.
  • a template is formed outside the first metal line area by using a template preparation member to define the first metal line area, so that the first metal line can be formed in the first metal line area, and the second metal line is formed Afterwards, the template is removed using a template removing member, thereby preventing the template from occupying space and affecting the normal operation of the second metal wire.
  • the template preparation member 21 includes an exposure light source 213 and a reticle 212. After a template layer is formed on the substrate, the template can be removed through the cooperation of the exposure light source and the reticle. The part of the layer thus forms a template 20, and the template removing member 22 includes a fourth solution 221 for removing the template. After the second metal wire is formed, the fourth solution can be used to remove the template, Prevent the template from affecting the normal operation of the second metal wire.
  • the fourth solution includes an alkaline solution, such as sodium hydroxide.
  • the fourth solution is not limited to this, but the fourth solution should try to use a solution that does not dissolve the second metal wire.
  • the second solution includes at least one of a hydrogen chloride solution and a magnesium chloride solution.
  • the metal wire is a metal
  • an acidic solution and a salt solution capable of reacting with the metal are used to dissolve the first metal wire, but
  • the second solution is not limited to this, and the second solution includes all solutions that can dissolve the first metal wire.
  • the third solution includes water, but is not limited to this.
  • an alkaline solution can be used to neutralize the acid solution to remove the second solution, but the third solution is selected on the premise that the second metal wire is not affected. Solution.
  • the first solution includes a metal-containing precursor solution, and the first solution is a solution composed of a metal complex and an acrylate hydrogel solution.
  • the metal-containing precursor solution includes an acrylate metal precursor, an acrylate amide ester, an acrylic resin, a two-photon initiator, a solvent, and an auxiliary agent.
  • the ratio of each component is limited to achieve For better results, the mass ratio of the acrylate metal precursor is 10% to 60%, the mass ratio of the acrylate amide ester is 10% to 20%, and the mass ratio of the acrylic resin is 1% to 30%. %, the mass proportion of the two-photon initiator is 0.5% to 10%, the mass proportion of the auxiliary agent is 0.5% to 2%, and the mass proportion of the solvent is determined by the mass proportion of other components , Is the sum of 100% minus the mass proportions of other ingredients.
  • the general chemical formula of the acrylate metal precursor is
  • M may be one of silver, gold, copper, magnesium, aluminum, and zinc
  • the metal-containing precursor solution may include multiple acrylate metal precursors.
  • the chemical formula of the acrylate amide ester is
  • the acrylate includes a multifunctional acrylate monomer.
  • the general chemical formula of the two-photon initiator is
  • the auxiliary agent includes a leveling auxiliary agent and an adhesion auxiliary agent.
  • an embodiment of the present application provides a method for preparing a metal wire, and the method for preparing a metal wire includes:
  • the embodiment of the present application provides a metal wire preparation method.
  • the metal wire preparation device used in the metal wire preparation method includes a carrying platform, a metal wire forming member, and a metal wire dissolving member.
  • the carrying platform is used to carry a substrate, and the metal wire
  • the forming member is used to form a first metal wire using a first solution, and the metal wire dissolving member is used to use a second solution to dissolve a portion of the first metal wire to form a second metal wire; the member and the metal wire are formed by disposing the metal wire Dissolving the member.
  • the metal wire dissolving member uses the second solution to dissolve the part of the first metal wire, so that the first metal wire is reduced to form the second metal wire, This solves the technical problem that the existing display panel has a wider metal line width.
  • the metal wire preparation method further includes using a template preparation member to form a template on the substrate, the template is used to define the drip area of the first solution, and before the first metal wire is formed A template is formed on the substrate, so that the first metal line is formed in the first metal line area.
  • the metal wire preparation method further includes using a template removing member to remove the template on the substrate after forming the second metal line, and after forming the second metal line, removing the template to prevent the template from affecting the second metal line. Two metal wire work.
  • the step of using the metal wire forming member to form the first metal wire using the first solution includes: using a curing light source to emit curing light to cure the first solution to form the first metal wire.
  • the metal wire manufacturing method further includes using the first solution containing member to contain the first solution, so as to use the first solution containing member to set the first solution on the substrate.
  • the metal wire preparation method further includes using a second solution containing member to contain a second solution, so as to use the second solution to dissolve the first metal wire to form a second metal wire.
  • an embodiment of the present application provides a metal line formation effect diagram.
  • the first metal line 311 is formed, the first metal line 311 is dissolved to form a second metal line 312, as can be seen from FIG. 4 ,
  • the second metal wire is reduced in width and thickness relative to the first metal wire.
  • a smaller first metal wire can be formed, and then the second metal wire is formed by dissolving the first metal wire to realize the metal wire Of miniaturization.
  • the embodiments of the present application provide a metal wire preparation device and a metal wire preparation method.
  • the metal wire preparation device includes a carrying platform, a metal wire forming member, and a metal wire dissolving member.
  • the supporting platform is used to carry a substrate, and the metal wire is formed
  • the member is used to form a first metal wire using a first solution
  • the metal wire dissolving member is used to use a second solution to dissolve a portion of the first metal wire to form a second metal wire;
  • the metal wire dissolving member uses the second solution to dissolve the part of the first metal wire, so that the first metal wire is reduced to form the second metal wire. It solves the technical problem that the existing display panel has a wide metal line width.

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Abstract

一种金属线制备装置和金属线制备方法，该金属线制备装置通过设置金属线形成构件（13）和金属线溶解构件（14），金属线形成构件（13）在使用第一溶液（124）形成第一金属线后，金属线溶解构件（14）使用第二溶液（1411）溶解了第一金属线的部分，从而使得第一金属线减小形成第二金属线，从而解决了现有显示面板存在金属线宽较宽的技术问题。

Description

金属线制备装置和金属线制备方法 技术领域
本申请涉及显示技术领域，尤其是涉及一种金属线制备装置和金属线制备方法。
背景技术
现有液晶显示屏为实现高分辨率，会提升显示面板的开口率，相应的会需要金属间连线的宽度变小，而由于现有液晶显示面板曝光机解析度的限制，现有金属线宽较宽，极大影响分辨率的提升。
所以，现有显示面板存在金属线宽较宽的技术问题。
技术问题
本申请提供一种金属线制备装置和金属线制备方法，用于解决现有显示面板存在金属线宽较宽的技术问题。
技术解决方案
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种金属线制备装置，该金属线制备装置包括：
承载平台，用于承载基板；
金属线形成构件，用于使用第一溶液形成第一金属线；
金属线溶解构件，用于使用第二溶液溶解所述第一金属线的部分形成第二金属线。
在本申请提供的金属线制备装置中，所述金属线形成构件包括固化光源、反射镜和物镜，所述固化光源用于发出固化光线，以固化所述第一溶液形成第一金属线，所述反射镜用于反射所述固化光线，以使所述固化光线照射第一溶液，所述物镜用于聚合所述固化光线。
在本申请提供的金属线制备装置中，所述反射镜为活动反射镜，所述活动反射镜用于将固化光线反射至不同角度。
在本申请提供的金属线制备装置中，所述金属线形成构件包括多个交叉设 置的固化光源和挡光板，所述固化单元用于发出固化光线，以固化所述第一溶液形成第一金属线，所述挡光板用于防止所述固化光线照射到第一金属线区域外。
在本申请提供的金属线制备装置中，该金属线制备装置还包括第一溶液容纳构件，所述第一溶液容纳构件用于容纳所述第一溶液，并将所述第一溶液滴至所述基板。
在本申请提供的金属线制备装置中，所述第一溶液容纳构件包括底板和盖板，所述底板与所述盖板之间形成容纳腔，所述容纳腔内设有第一溶液，所述底板上设有活动孔，所述活动孔用于第一溶液滴至所述基板。
在本申请提供的金属线制备装置中，所述金属线溶解构件包括第二溶液容纳单元和第三溶液容纳单元，以及设置于所述第二溶液容纳单元的第二溶液，设置于所述第三溶液容纳单元的第三溶液，所述第二溶液用于溶解第一金属线的部分，以形成第二金属线，所述第三溶液用于清洗第二金属线。
在本申请提供的金属线制备装置中，所述金属线溶解构件还包括控制单元，所述控制单元用于控制所述第二溶液的流量。
在本申请提供的金属线制备装置中，该金属线制备装置还包括干燥构件，用于干燥所述第二金属线。
在本申请提供的金属线制备装置中，所述第二溶液包括氯化氢溶液和氯化镁溶液中的至少一种。
在本申请提供的金属线制备装置中，所述第三溶液包括水。
在本申请提供的金属线制备装置中，还包括模板制备构件和模板去除构件，所述模板制备构件用于在所述基板上制备模板，所述模板用于限定第一溶液的滴入区域，所述模板去除构件用于在形成第二金属线后，去除所述模板。
在本申请提供的金属线制备装置中，所述第一溶液包括含金属前驱体溶液。
在本申请提供的金属线制备装置中，所述含金属前驱体溶液包括丙烯酸酯金属前驱体、丙烯酸酰胺酯、丙烯酸树脂、双光子起始剂、溶剂和助剂。
同时，本申请提供一种金属线制备方法，该金属线制备方法包括：
提供承载平台，所述承载平台上承载有基板；
使用金属线形成构件使用第一溶液形成第一金属线；
使用金属线溶解构件使用第二溶液溶解所述第一金属线的部分形成第二金属线。
在本申请提供的金属线制备方法中，还包括：使用模板制备构件在所述基板上形成模板，所述模板用于限定第一溶液的滴入区域。
在本申请提供的金属线制备方法中，还包括：使用模板去除构件在形成第二金属线后，去除所述基板上的模板。
在本申请提供的金属线制备方法中，所述使用金属线形成构件使用第一溶液形成第一金属线的步骤包括：使用固化光源发出固化光线固化所述第一溶液形成第一金属线。
在本申请提供的金属线制备方法中，还包括：使用第一溶液容纳构件容纳第一溶液。
在本申请提供的金属线制备方法中，还包括：使用第二溶液容纳构件容纳第二溶液。
有益效果
本申请提供一种金属线制备装置和金属线制备方法，该金属线制备装置包括承载平台、金属线形成构件和金属线溶解构件，所述承载平台用于承载基板，所述金属线形成构件用于使用第一溶液形成第一金属线，所述金属线溶解构件用于使用第二溶液溶解所述第一金属线的部分形成第二金属线；通过设置金属线形成构件和金属线溶解构件，金属线形成构件在使用第一溶液形成第一金属线后，金属线溶解构件使用第二溶液溶解了第一金属线的部分，从而使得第一金属线减小形成第二金属线，从而解决了现有显示面板存在金属线宽较宽的技术问题。
附图说明
图1为本申请实施例提供的金属线制备装置的第一示意图。
图2为本申请实施例提供的金属线制备装置的第二示意图。
图3为本申请实施例提供的金属线制备方法的流程图。
图4为本申请实施例提供的金属线形成效果图。
本发明的实施方式
本申请提供一种金属线制备装置和金属线制备方法，为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
本申请针对现有显示面板存在金属线宽较宽的技术问题，本申请实施例用以解决该问题。
如图1所示，本申请实施例提供一种金属线制备装置，该金属线制备装置包括：
承载平台11，用于承载基板111；
金属线形成构件13，用于使用第一溶液124形成第一金属线；
金属线溶解构件14，用于使用第二溶液1411溶解所述第一金属线的部分形成第二金属线。
本申请实施例提供一种金属线制备装置，该金属线制备装置包括承载平台、金属线形成构件和金属线溶解构件，所述承载平台用于承载基板，所述金属线形成构件用于使用第一溶液形成第一金属线，所述金属线溶解构件用于使用第二溶液溶解所述第一金属线的部分形成第二金属线；通过设置金属线形成构件和金属线溶解构件，金属线形成构件在使用第一溶液形成第一金属线后，金属线溶解构件使用第二溶液溶解了第一金属线的部分，从而使得第一金属线减小形成第二金属线，从而解决了现有显示面板存在金属线宽较宽的技术问题。
需要说明的是，金属线包括电路走线、电极图案，但金属线不限于此，金属线包括所有由金属形成的走线或者以金属形成的电极。
在一种实施例中，如图1所示，所述金属线形成构件13包括固化光源132、反射镜133和物镜131，所述固化光源132用于发出固化光线1321，以固化所述第一溶液124形成第一金属线，所述反射镜133用于反射所述固化光线1321，以使所述固化光线1321照射第一溶液124，所述物镜131用于聚合所述固化光线1321，通过使用固化光源、反射镜和物镜三者的配合，使得固化光源发出的固化光线能照射到第一溶液，从而使得第一溶液能够固化形成第一 金属线，且考虑到固化光源发出的光较为发散，可使用物镜聚合固化光线，从而使得固化光线能聚合照射到第一溶液上，从而使第一溶液快速固化为第一金属线。
在一种实施例中，所述反射镜为活动反射镜，所述活动反射镜用于将固化光线反射至不同角度，考虑到将固化光线聚合到特定的区域，即第一金属线形成的区域，以形成第一金属线，可使反射镜为活动反射镜，通过移动活动反射镜来控制固化光线的角度，从而使得在特定的区域固化第一溶液形成第一金属线，所述活动反射镜可沿任意角度旋转以反射固化光线。
在一种实施例中，所述金属线形成构件包括多个交叉设置的固化光源和挡光板，所述固化单元用于发出固化光线，以固化所述第一溶液形成第一金属线，所述挡光板用于防止所述固化光线照射到第一金属线区域外，对特定的区域进行照射，即对第一金属线区域进行照射，可通过挡光板和固化光源的交叉设置，以使固化光源沿第一金属线区域进行照射，固化第一溶液形成第一金属线，同时可以防止第一溶液流动到第一金属线外被固化，从而使得第一金属线只会形成在第一金属线区域；且可将挡光板向下延伸，使得固化光线只会沿挡光板之间的区域照射，使照射区域与第一金属线区域对应。
在一种实施例中，金属线形成构件还包括烘烤单元，所述烘烤单元用于烘烤所述第一金属线，以使第一金属线固定在基板上，为了使第一金属线紧固的固定在基板上，可在形成第一金属线后，使用烘烤单元对第一金属线进行烘烤，从而使得第一金属线与基板之间的附着力更大，较好的固定在基板上。
在一种实施例中，如图1所示，还包括第一溶液容纳构件12，所述第一溶液容纳构件12用于容纳所述第一溶液124，并将所述第一溶液124滴至所述基板111，为使第一溶液设置在基板，且使第一溶液设置在第一金属线区域，可使用第一溶液容纳构件容纳第一溶液，在形成第一金属线时，将第一溶液滴至所述基板上。
在一种实施例中，如图1所示，所述第一溶液容纳构件12包括底板121和盖板123，所述底板121与所述盖板123之间形成容纳腔，所述容纳腔内设有第一溶液124，所述底板上设有活动孔1211，所述活动孔1211用于第一溶液124滴至所述基板111，在容纳腔内设置第一溶液，然后在底板上形成活动 孔，在需要将第一溶液滴至基板时，移动活动孔，使第一溶液沿活动孔滴至基板，从而在基板上形成第一金属线。
需要说明的是，活动孔为多个，在图1中只示出了1个活动孔，活动孔对应第一金属线区域。
在一种实施例中，图1中的侧板122由盖板123向下延伸形成，或者所述侧板122由底板121形成，或者所述侧板独立，可将侧板在容纳腔阵列设置，使得侧板限定出的区域与第一金属线区域对应，在所述侧板限定出的区域内设置活动孔，使得第一溶液设置在侧边限定出的区域，且可沿活动孔滴至基板。
在一种实施例中，如图1所示，所述金属线溶解构件14包括第二溶液容纳单元141和第三溶液容纳单元142，以及设置于所述第二溶液容纳单元141的第二溶液1411，设置于所述第三溶液容纳单元142的第三溶液1421，所述第二溶液1411用于溶解第一金属线的部分，以形成第二金属线，所述第三溶液1421用于清洗第二金属线；为了减小金属线的宽度，可在形成第一金属线后，使用金属线溶解构件溶解第一金属线，从而使得第一金属线的宽度减小，且同时可降低金属线的厚度，从而进一步实现金属线的微型化。
在一种实施例中，可使用第二溶液容纳单元容纳第二溶液，在形成第一金属线后，通过第二溶液容纳单元向第一金属线滴或者浇第二溶液，使第二溶液溶解第一金属线，从而形成第二金属线，减小第一金属线，得到线宽较小的第二金属线，且可控制第二溶液溶解第一金属线的部分，例如减小第一金属线的线宽，还可以同时减小第一金属线的厚度，以实现金属线的微型化。
在一种实施例中，为了防止第二溶液残留在第二金属线上，继续腐蚀第二金属线，可设置第三溶液容纳单元，使用第三溶液容纳单元向第二金属线浇第三溶液，以去除第二溶液。
在一种实施例中，可在使用第二溶液溶解第一金属线的短暂间隔后，使用第三溶液清洗第一金属线，然后再次使用第二溶液溶解第一金属线，在短暂间隔后，使用第三溶液再次清洗第一金属线，直到形成第二金属线，该实施方式可以防止第二溶液直接将第一金属线溶断，使第一金属线失效；或者在第二溶液溶解第一金属线形成第二金属线后，使用第三溶液清洗第二金属线，该实施方式可快速形成第二金属线，且节约成本。
在一种实施例中，所述第二溶液容纳单元与第三溶液容纳单元连接，可使第二溶液容纳单元与第三溶液容纳单元层叠设置，然后通过移动第二溶液容纳单元和第三溶液容纳单元，以使两者交替使用或者同时使用，或者将第二溶液容纳单元与第三溶液容纳单元设置在同一平面，通过移动金属线溶解构件，以使两者交替使用或者同时使用，且金属线溶解单元与承载平台连接，金属线溶解单元可伸缩，以使金属线溶解构件移动到第一金属线上，从而对第一金属线进行溶解，或者金属线溶解构件沿承载平台移动，以使以使金属线溶解构件移动到第一金属线上。
在一种实施例中，所述金属线溶解构件还包括控制单元，所述控制单元用于控制所述第二溶液的流量，在使用第二溶液溶解第一金属线时，需要控制第二溶液，以防止第二溶液将第一金属线溶解过小，或者将第一金属线溶解穿孔等问题，造成第二金属线失效，通过使用控制单元控制第二溶液的流量，同时可控制第二溶液的使用时间，使得第二溶液能部分溶解第一金属线，从而形成所需的第二金属线。
在一种实施例中，所述金属线制备装置还包括干燥构件，所述干燥构件用于干燥所述第二金属线，在第三溶液清洗第二金属线后，对第二金属线进行干燥，可去除第三溶液，同时可去除残留的第二溶液，以得到第二金属线。
在一种实施例中，如图2所示，所述金属线制备装置还包括模板制备构件21和模板去除构件22，所述模板制备构件21用于在所述基板111上形成模板20，所述模板20用于限定第一溶液的滴入区域，所述模板去除构件22用于在形成第二金属线后，去除所述模板20，在形成金属线时，为了防止第一金属线形成在第一金属线区域外，通过使用模板制备构件在第一金属线区域外形成模板，限定出第一金属线区域，使得第一金属线能够第一金属线区域形成，且在形成第二金属线后，使用模板去除构件去除所述模板，从而防止模板占用空间，以及影响第二金属线的正常工作。
在一种实施例中，如图2所示，所述模板制备构件21包括曝光光源213和掩模版212，在基板上形成一层模板层后，通过曝光光源和掩模版的配合，可去除模板层的部分从而形成模板20，所述模板去除构件22包括第四溶液221，所述第四溶液用于去除所述模板，在形成第二金属线后，可使用第四溶 液去除所述模板，防止所述模板影响第二金属线的正常工作。
在一种实施例中，所述第四溶液包括碱性溶液，例如氢氧化钠，第四溶液不限于此，但第四溶液应尽量采用不会溶解掉第二金属线的溶液。
在一种实施例中，所述第二溶液包括氯化氢溶液和氯化镁溶液中的至少一种，考虑到金属线为金属，使用酸性溶液以及能与金属反应的盐溶液来溶解第一金属线，但第二溶液不限于此，第二溶液包括所有能溶解第一金属线的溶液。
在一种实施例中，所述第三溶液包括水，但不限于此，例如可使用碱性溶液来中和酸性溶液以去除第二溶液，但以不影响第二金属线为前提选取第三溶液。
在一种实施例中，所述第一溶液包括含金属前驱体溶液，所述第一溶液为金属配合物与丙烯酸酯水凝胶溶液组成的溶液。
在一种实施例中，所述含金属前驱体溶液包括丙烯酸酯金属前驱体、丙烯酸酰胺酯、丙烯酸树脂、双光子起始剂、溶剂和助剂，进一步的，限定各个成分的比例，以达到较好的效果，丙烯酸酯金属前驱体的质量占比为10％至60％，所述丙烯酸酰胺酯的质量占比为10％至20％，所述丙烯酸树脂的质量占比为1％至30％，所述双光子起始剂的质量占比为0.5％至10％，所述助剂的质量占比为0.5％至2％，所述溶剂的质量占比依其他成分的质量占比决定，为100％减去其他成分的质量占比的和。
在一种实施例中，所述丙烯酸酯金属前驱体的化学通式为
Figure PCTCN2019129776-appb-000001
其中M可为银、金、铜、镁、铝、锌中的一种，而含金属前驱体溶液可包括多种丙烯酸酯金属前驱体。
在一种实施例中，所述丙烯酸酰胺酯的化学通式为
Figure PCTCN2019129776-appb-000002
在一种实施例中，所述丙烯酸酯，包括多官能基丙烯酸酯单体。
在一种实施例中，所述双光子起始剂的化学通式为
Figure PCTCN2019129776-appb-000003
在一种实施例中，所述助剂包括流平助剂和附着助剂。
如图3所示，本申请实施例提供一种金属线制备方法，该金属线制备方法包括：
S1，提供承载平台，所述承载平台上承载有基板；
S2，使用金属线形成构件使用第一溶液形成第一金属线；
S3，使用金属线溶解构件使用第二溶液溶解所述第一金属线的部分形成第二金属线。
本申请实施例提供一种金属线制备方法，该金属线制备方法使用的金属线制备装置包括承载平台、金属线形成构件和金属线溶解构件，所述承载平台用于承载基板，所述金属线形成构件用于使用第一溶液形成第一金属线，所述金属线溶解构件用于使用第二溶液溶解所述第一金属线的部分形成第二金属线；通过设置金属线形成构件和金属线溶解构件，金属线形成构件在使用第一溶液形成第一金属线后，金属线溶解构件使用第二溶液溶解了第一金属线的部分，从而使得第一金属线减小形成第二金属线，从而解决了现有显示面板存在金属线宽较宽的技术问题。
在一种实施例中，该金属线制备方法还包括使用模板制备构件在所述基板上形成模板，所述模板用于限定第一溶液的滴入区域，在形成第一金属线前，先在基板上形成模板，以时第一金属线形成在第一金属线区域。
在一种实施例中，该金属线制备方法还包括使用模板去除构件在形成第二金属线后，去除所述基板上的模板，在形成第二金属线后，去除模板，以防止模板影响第二金属线工作。
在一种实施例中，所述使用金属线形成构件使用第一溶液形成第一金属线的步骤包括：使用固化光源发出固化光线固化所述第一溶液形成第一金属线。
在一种实施例中，该金属线制备方法还包括使用第一溶液容纳构件容纳第一溶液，以使用第一溶液容纳构件在基板上设置第一溶液。
在一种实施例中，该金属线制备方法还包括使用第二溶液容纳构件容纳第二溶液，以使用第二溶液溶解第一金属线形成第二金属线。
如图4所示，本申请实施例提供一种金属线形成效果图，在形成第一金属 线311后，将第一金属线311溶解后形成第二金属线312，从图4中可以看出，第二金属线相对第一金属线从宽度和厚度均减小，在实际需求中，可形成较小的第一金属线，然后通过溶解第一金属线形成第二金属线，以实现金属线的微型化。
根据以上实施例可知：
本申请实施例提供一种金属线制备装置和金属线制备方法，该金属线制备装置包括承载平台、金属线形成构件和金属线溶解构件，所述承载平台用于承载基板，所述金属线形成构件用于使用第一溶液形成第一金属线，所述金属线溶解构件用于使用第二溶液溶解所述第一金属线的部分形成第二金属线；通过设置金属线形成构件和金属线溶解构件，金属线形成构件在使用第一溶液形成第一金属线后，金属线溶解构件使用第二溶液溶解了第一金属线的部分，从而使得第一金属线减小形成第二金属线，从而解决了现有显示面板存在金属线宽较宽的技术问题。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (20)

  1. 一种金属线制备装置，其包括：
    承载平台，用于承载基板；
    金属线形成构件，用于使用第一溶液形成第一金属线；
    金属线溶解构件，用于使用第二溶液溶解所述第一金属线的部分形成第二金属线。
  2. 如权利要求1所述的金属线制备装置，其中，所述金属线形成构件包括固化光源、反射镜和物镜，所述固化光源用于发出固化光线，以固化所述第一溶液形成第一金属线，所述反射镜用于反射所述固化光线，以使所述固化光线照射第一溶液，所述物镜用于聚合所述固化光线。
  3. 如权利要求2所述的金属线制备装置，其中，所述反射镜为活动反射镜，所述活动反射镜用于将固化光线反射至不同角度。
  4. 如权利要求1所述的金属线制备装置，其中，所述金属线形成构件包括多个交叉设置的固化光源和挡光板，所述固化单元用于发出固化光线，以固化所述第一溶液形成第一金属线，所述挡光板用于防止所述固化光线照射到第一金属线区域外。
  5. 如权利要求1所述的金属线制备装置，其中，还包括第一溶液容纳构件，所述第一溶液容纳构件用于容纳所述第一溶液，并将所述第一溶液滴至所述基板。
  6. 如权利要求5所述的金属线制备装置，其中，所述第一溶液容纳构件包括底板和盖板，所述底板与所述盖板之间形成容纳腔，所述容纳腔内设有第一溶液，所述底板上设有活动孔，所述活动孔用于第一溶液滴至所述基板。
  7. 如权利要求1所述的金属线制备装置，其中，所述金属线溶解构件包括第二溶液容纳单元和第三溶液容纳单元，以及设置于所述第二溶液容纳单元的第二溶液，设置于所述第三溶液容纳单元的第三溶液，所述第二溶液用于溶解第一金属线的部分，以形成第二金属线，所述第三溶液用于清洗第二金属线。
  8. 如权利要求7所述的金属线制备装置，其中，所述金属线溶解构件还包括控制单元，所述控制单元用于控制所述第二溶液的流量。
  9. 如权利要求7所述的金属线制备装置，其中，还包括干燥构件，用于 干燥所述第二金属线。
  10. 如权利要求7所述的金属线制备装置，其中，所述第二溶液包括氯化氢溶液和氯化镁溶液中的至少一种。
  11. 如权利要求7所述的金属线制备装置，其中，所述第三溶液包括水。
  12. 如权利要求1所述的金属线制备装置，其中，还包括模板制备构件和模板去除构件，所述模板制备构件用于在所述基板上制备模板，所述模板用于限定第一溶液的滴入区域，所述模板去除构件用于在形成第二金属线后，去除所述模板。
  13. 如权利要求1所述的金属线制备装置，其中，所述第一溶液包括含金属前驱体溶液。
  14. 如权利要求13所述的金属线制备装置，其中，所述含金属前驱体溶液包括丙烯酸酯金属前驱体、丙烯酸酰胺酯、丙烯酸树脂、双光子起始剂、溶剂和助剂。
  15. 一种金属线制备方法，其包括：
    提供承载平台，所述承载平台上承载有基板；
    使用金属线形成构件使用第一溶液形成第一金属线；
    使用金属线溶解构件使用第二溶液溶解所述第一金属线的部分形成第二金属线。
  16. 如权利要求15所述的金属线制备方法，其中，还包括：使用模板制备构件在所述基板上形成模板，所述模板用于限定第一溶液的滴入区域。
  17. 如权利要求16所述的金属线制备方法，其中，还包括：使用模板去除构件在形成第二金属线后，去除所述基板上的模板。
  18. 如权利要求15所述的金属线制备方法，其中，所述使用金属线形成构件使用第一溶液形成第一金属线的步骤包括：使用固化光源发出固化光线固化所述第一溶液形成第一金属线。
  19. 如权利要求15所述的金属线制备方法，其中，还包括：使用第一溶液容纳构件容纳第一溶液。
  20. 如权利要求15所述的金属线制备方法，其中，还包括：使用第二溶液容纳构件容纳第二溶液。
PCT/CN2019/129776 2019-12-12 2019-12-30 金属线制备装置和金属线制备方法 Ceased WO2021114432A1 (zh)

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