WO2021112160A1 - High-frequency circuit board and electronic apparatus - Google Patents

High-frequency circuit board and electronic apparatus Download PDF

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Publication number
WO2021112160A1
WO2021112160A1 PCT/JP2020/044967 JP2020044967W WO2021112160A1 WO 2021112160 A1 WO2021112160 A1 WO 2021112160A1 JP 2020044967 W JP2020044967 W JP 2020044967W WO 2021112160 A1 WO2021112160 A1 WO 2021112160A1
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WO
WIPO (PCT)
Prior art keywords
conductor
circuit board
frequency circuit
region
ground conductor
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Application number
PCT/JP2020/044967
Other languages
French (fr)
Japanese (ja)
Inventor
市川　敬一
一平 初田
啓介 荒木
Original Assignee
株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2021112160A1 publication Critical patent/WO2021112160A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/02—Bends; Corners; Twists
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to a high frequency circuit board that realizes a high frequency signal transmission circuit or the like.
  • the first ground conductor, the second ground conductor, and the signal line conductor have a shape extending in one direction.
  • the signal line conductor is arranged between the first ground conductor and the second ground conductor in the thickness direction of the laminated body orthogonal to the extending direction.
  • the signal line conductor faces the first ground conductor and the second ground conductor substantially as a whole. As a result, the signal line realizes a stripline structure.
  • the first ground conductor is divided into two parts in the extending direction, and these two parts are connected by a connecting conductor.
  • the connecting conductor is composed of a plurality of linear conductors having a plurality of bent portions.
  • the forming portion of such a connecting conductor has a smaller conductor area than the two portions of the first ground conductor.
  • the signal line can be bent by the forming portion of the connecting conductor, and the easiness of bending is realized.
  • an object of the present invention is to realize a high-frequency circuit board capable of suppressing deterioration of transmission characteristics while ensuring ease of bending.
  • the high frequency circuit board of the present invention is arranged on a base material containing a flexible and insulating material, a linear signal conductor extending in the first direction, and placed on the base material.
  • a ground conductor having a surface facing the signal conductor along one direction is provided.
  • a high-frequency signal transmission line is formed including a signal conductor, a ground conductor, and a base material.
  • the transmission line has a first region and a second region adjacent to each other in the first direction. In the first region and the second region, the signal conductor and the ground conductor face each other at a constant distance.
  • the ground conductor in the second region has a conductor non-forming portion in which no conductor is formed at a position not facing the signal conductor in the thickness direction of the base material in which the signal conductor and the ground conductor are lined up.
  • the area of the ground conductor is smaller than that in the first region. Therefore, the second region is more bendable than the first region.
  • deterioration of transmission characteristics can be suppressed while ensuring ease of bending.
  • FIG. 1A is a cross-sectional view showing the configuration of the high-frequency circuit board according to the first embodiment
  • FIG. 1B is a plan view showing the configuration of the high-frequency circuit board according to the first embodiment.
  • 2 (A), 2 (B), and 2 (C) are plan views of each layer of the base material in the high-frequency circuit board according to the first embodiment.
  • FIG. 3A is a perspective view of the electronic device according to the first embodiment
  • FIG. 3B is a side sectional view showing a configuration of the electronic device according to the first embodiment.
  • FIG. 4 is a plan view showing the configuration of the high frequency circuit board according to the second embodiment.
  • FIG. 5 is a plan view showing the configuration of the high frequency circuit board according to the third embodiment.
  • FIG. 12 (A), 12 (B), and 12 (C) are plan views of each layer of the base material in the high-frequency circuit board according to the ninth embodiment.
  • FIG. 13 is a plan view showing the configuration of the high frequency circuit board according to the ninth embodiment.
  • 14 (A), 14 (B), and 14 (C) are plan views of each layer of the base material in the first aspect of the high frequency circuit board according to the tenth embodiment.
  • 15 (A), 15 (B), and 15 (C) are plan views of each layer of the base material in the second aspect of the high frequency circuit board according to the tenth embodiment.
  • FIG. 16 is a plan view showing the configuration of the high frequency circuit board according to the eleventh embodiment.
  • FIG. 1A is a cross-sectional view showing the configuration of the high-frequency circuit board according to the first embodiment
  • FIG. 1B is a plan view showing the configuration of the high-frequency circuit board according to the first embodiment. is there.
  • FIG. 1 (A) shows a cross section taken along the line AA of FIG. 1 (B)
  • FIG. 1 (B) is a perspective view so that the positional relationship and shape of each conductor can be understood.
  • 2 (A), 2 (B), and 2 (C) are plan views of each layer of the base material in the high-frequency circuit board according to the first embodiment.
  • FIGS. 1 (A), 1 (B), 2 (A), 2 (B), 2 (C), and each of the following embodiments the characteristics of the high-frequency circuit board are easy to understand. Therefore, the dimensions are emphasized as appropriate.
  • the high-frequency circuit board 10 includes a base material 20, a signal conductor 30, and A ground conductor 40 is provided.
  • the signal conductor 30 and the ground conductor 40 are arranged on the base material 20.
  • the base material 20 includes an insulator layer 21, an insulator layer 22, and an insulator layer 23.
  • the insulator layer 21, the insulator layer 22, and the insulator layer 23 have a flat film shape and are laminated in a direction orthogonal to the flat film surface.
  • the base material 20 has a flat plate shape or a flat film shape, and has a first main surface 201 and a second main surface 202 orthogonal to the thickness direction (third direction DIR3).
  • the base material 20 has an end surface 20E1 that is orthogonal to the first main surface 201 and the second main surface 202 and is connected to the first main surface 201 and the second main surface 202.
  • the signal conductor 30 is a linear conductor and has a shape extending along the first direction DIR1.
  • the signal conductor 30 is arranged at a position substantially in the center of the second direction DIR2 of the base material 20.
  • the signal conductor 30 is arranged at an intermediate position in the thickness direction (third direction DIR3) of the base material 20. More specifically, the signal conductor 30 is arranged along the joint surface (adhesive surface) between the insulator layer 21 and the insulator layer 22.
  • the width W30 of the signal conductor 30 is appropriately set according to the specifications of the high frequency circuit board 10.
  • the first direction DIR1 is a straight line
  • the extending direction of the signal conductor 30, that is, the extending direction of the transmission line corresponds to the first direction of the present application.
  • the directions orthogonal to the first direction IR1 defined in this way are the second direction DIR2 and the third direction DIR3, respectively.
  • the third direction DIR3 is the thickness direction of the base material 20.
  • the second direction DIR2 corresponds to the direction orthogonal to the first direction DIR1 and the third direction DIR3 (for example, if the first direction DIR1 is the length direction, the second direction DIR2 is the width direction). To do.
  • the ground conductor 40 is a flat-film conductor. Generally, the ground conductor 40 has substantially the same shape as the base material 20 in a plan view (shape seen in the third direction DIR3). The ground conductor 40 is arranged at a position different from that of the signal conductor 30 in the thickness direction (third direction DIR3) of the base material 20. More specifically, the ground conductor 40 is arranged along the joint surface (adhesive surface) between the insulator layer 22 and the insulator layer 23. With this configuration, the ground conductor 40 faces the signal conductor 30 at the same distance and in the same area regardless of the position of the signal conductor 30 in the extending direction (first direction DIR1). In other words, the signal conductor 30 and the ground conductor 40 face each other at a certain distance.
  • the high frequency circuit board 10 includes a signal conductor 30, a ground conductor 40, and a transmission line of a strip line including the base material 20.
  • the high frequency circuit board 10 has a region 101, a region 103, and a region 102 from the end face 20E1 of the base material 20 along the first direction DIR1.
  • the area 103 is arranged between the area 101 and the area 102, is adjacent to the area 101 and the area 102, respectively, and connects the area 101 and the area 102.
  • Region 101 and region 102 are non-foldable regions, and region 103 is a bendable region.
  • the region 101 corresponds to the "first region” of the present invention
  • the region 103 corresponds to the "second region” of the present invention.
  • the region 103 which is the second region, may have a larger curvature with respect to the region 101, which is the first region.
  • the region 103 may be configured to include a portion of the high-frequency circuit board 10 having the largest bending angle. That is, even if the region 101 is not completely flat due to the formation of the high-frequency circuit board 10 or when the high-frequency circuit board 10 is mounted on another circuit board, the region 103 is bent more than the region 101. If so (for example, if it is intentionally bent), the effects of the present invention can be achieved.
  • the ground conductor 40 has a recess 443 and a recess 444.
  • the recess 443 and the recess 444 are portions in the same layer as the ground conductor 40 where no conductor pattern is formed.
  • the recess 443 has a shape that is recessed from the end side 403 of the ground conductor 40 close to the side surface 203 of the base material 20 toward the center side in the second direction DIR2 direction.
  • the recess 444 has a shape that is recessed from the end side 404 of the ground conductor 40 close to the side surface 204 of the base material 20 toward the center side in the second direction DIR2 direction.
  • the recess 443 has a depth W443 and the recess 444 has a depth W444.
  • the recess 443 and the recess 444 are formed in the region 103, and in the region 103, the depth W443 and the depth W444 are constant in the first direction DIR1.
  • the third direction DIR3 (the signal conductor 30 and the ground conductor 40) orthogonal to the first direction DIR1 and the second direction DIR2 are lined up. In the thickness direction of the base material 20, they do not face each other (do not overlap).
  • the signal conductor 30 and the ground conductor 40 face each other at a constant distance and in the same area regardless of the position of the first direction DIR1.
  • the characteristic impedance in the region 101 and the region 102 and the characteristic impedance in the region 103 become substantially the same. In other words, the characteristic impedance in the regions 101 and 102 and the characteristic impedance in the region 103 do not fluctuate abruptly.
  • the impedance mismatch at the connection point between the region 101 and the region 103 can be suppressed, and the impedance mismatch at the connection point between the region 103 and the region 102 can be suppressed.
  • the high-frequency circuit board 10 can suppress deterioration of transmission characteristics.
  • the high-frequency circuit board 10 can suppress deterioration of transmission characteristics while ensuring ease of bending.
  • the terminal conductor 50, the ground terminal conductor 601 and the ground terminal conductor 602 are rectangular conductors.
  • the terminal conductor 50, the ground terminal conductor 601 and the ground terminal conductor 602 are arranged on the first main surface 201 of the base material 20, and are arranged on the end surface 20E1 or in the vicinity of the end surface 20E1. In other words, the terminal conductor 50, the ground terminal conductor 601 and the ground terminal conductor 602 are arranged in the region 101.
  • the terminal conductor 50 is arranged at a position substantially at the center of the base material 20 in the second direction DIR2, and overlaps the end portion of the signal conductor 30 in a plan view (as viewed in the third direction DIR3).
  • the terminal conductor 50 is connected to the signal conductor 30 by an interlayer connecting conductor 300 extending in the direction of the third direction DIR3.
  • the ground terminal conductor 601 is arranged on the end side 403 side of the terminal conductor 50 in the second direction DIR2 of the base material 20.
  • the ground terminal conductor 601 includes an interlayer connecting conductor 301 extending in the direction of the third direction DIR3 (more specifically, two interlayer connecting conductors 301 extending in the direction of the third direction DIR3 and an interlayer connecting auxiliary conductor 3011 (FIG. 2). (A), FIG. 2 (B), FIG. 2 (C))) to connect to the ground conductor 40.
  • the ground terminal conductor 602 is arranged on the end side 404 side of the terminal conductor 50 in the second direction DIR2 of the base material 20.
  • the ground terminal conductor 602 includes an interlayer connecting conductor 302 extending in the direction of the third direction DIR3 (more specifically, two interlayer connecting conductors 302 extending in the direction of the third direction DIR3 and an interlayer connecting auxiliary conductor 3022 (FIG. 2). (A), FIG. 2 (B), FIG. 2 (C))) to connect to the ground conductor 40.
  • the electronic device 1 includes a high-frequency circuit board 10 and a circuit member 90.
  • the circuit member 90 is, for example, a base board for an information communication terminal or the like, and has a first main surface 901 and a second main surface 902. Further, the circuit member 90 has an end surface 90E1 that is orthogonal to the first main surface 901 and the second main surface 902 and is connected to them.
  • the high frequency circuit board 10 is bent in the region 103.
  • the region 103 is bent in a shape corresponding to the shape of the end surface 90E1 of the circuit member 90 and the shape of the connection between the first main surface 901 and the second main surface 902 and the end surface 90E1.
  • the region 103 is formed by plastic deformation, and maintains its shape when the high-frequency circuit board 10 is mounted on the circuit member 90 and before and after the region 103.
  • Plastic deformation can be realized, for example, by using a thermoplastic resin as the main material of the base material 20 and heating and cooling the base material 20 while determining the shape with a mold or the like.
  • the region 101 is close to and faces the first main surface 901 of the circuit member 90.
  • the terminal conductor 50 is mounted on the land conductor 91 formed on the first main surface 901 of the circuit member 90 via a conductive bonding material.
  • the ground terminal conductor 601 is mounted on the land conductor 921 formed on the first main surface 901 of the circuit member 90 via a conductive bonding material.
  • the ground terminal conductor 602 is mounted on the land conductor 922 formed on the first main surface 901 of the circuit member 90 via a conductive bonding material.
  • the region 102 is close to and faces the second main surface 902 of the circuit member 90.
  • the region 102 is adhered to, for example, the second main surface 902 via the adhesive member 999.
  • the high-frequency circuit board 10 has a bendable region (region 103), and the region 103 has a bent shape according to the shape of the circuit member 90. Therefore, the high frequency circuit board 10 can be easily and more accurately arranged along the three surfaces (first main surface 901, end surface 90E1, and second main surface 902) of the circuit member 90, and can be arranged on the circuit member 90. Can be implemented. Further, at this time, since the high-frequency circuit board 10 can be mounted without applying unnecessary stress, it is possible to suppress deformation of the high-frequency circuit board 10 due to this unnecessary stress and accompanying damage to the internal structure. As a result, the reliability of the electronic device 1 is improved.
  • the interlayer connecting conductor 300, the interlayer connecting conductor 301, and the interlayer connecting conductor 302 are formed in the region 101 which is a non-bendable region. Therefore, the stress due to bending is less likely to be applied to the interlayer connecting conductor 300, the interlayer connecting conductor 301, and the interlayer connecting conductor 302. Therefore, the interlayer connecting conductor 300, the interlayer connecting conductor 301, and the interlayer connecting conductor 302 are damaged, the joint between the interlayer connecting conductor 300 and the signal conductor 30 and the terminal conductor 50 is damaged, and the interlayer connecting conductor 301 and the ground conductor 40 and the ground are damaged.
  • the length of the first direction DIR1 of the recess 443 is larger than the depth W443 of the recess 443 (the length of the second direction DIR2).
  • the length of the first direction DIR1 of the recess 444 is larger than the depth W444 of the recess 444 (the length of the second direction DIR2).
  • the length of the first-direction DIR1 of the recess 443 and the length of the first-direction DIR1 of the recess 444 may be defined by the length of the bottom of the recess 443 and the recess 444, and are defined by the length of the opening. You may. However, by defining the lengths of the bottoms of the recesses 443 and 444, the occurrence of cracks can be suppressed more reliably, and the reliability of the high-frequency circuit board 10 is further increased.
  • the recesses 443 and 444 gradually become deeper from the regions 101 and 102 toward the region 103 so as not to have corners.
  • the shape (tapered shape) is preferable.
  • abrupt fluctuations between the electromagnetic field distributions of the regions 101 and 102 and the electromagnetic field distributions of the regions 103 due to having the recesses 443 and 444 can be suppressed.
  • the high-frequency circuit board 10 can suppress transmission loss at the connection portion between the region 101 and the region 103 and the connection portion between the region 102 and the region 103.
  • the concentration of stress during bending, which is caused by having corners, is suppressed. Therefore, the reliability of the high frequency circuit board 10 is further increased.
  • FIG. 4 is a plan view showing the configuration of the high frequency circuit board according to the second embodiment.
  • FIG. 4 is a perspective view so that the positional relationship and shape of each conductor can be understood.
  • the high frequency circuit board 10A has a plurality of slits 71.
  • the plurality of slits 71 are conductor non-forming portions provided in the region 103 of the ground conductor 40.
  • the length L71 of the first direction DIR1 of the plurality of slits 71 is larger than the width W71 of the second direction DIR2.
  • the area 103 is easier to bend than the area 101 and the area 102.
  • the high-frequency circuit board 10A can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10. Further, the high-frequency circuit board 10A can appropriately exert the same effect as that of the high-frequency circuit board 10.
  • the length L71 of the first direction DIR1 of the plurality of slits 71 is 1/4 or less of the wavelength ⁇ of the high frequency signal transmitted by the high frequency circuit board 10A. As a result, the resonance generated in the slit 71 can be suppressed, and the loss can be reduced.
  • the plurality of slits 71 have no corners, for example, a shape in which the corners are R-chamfered in a plan view. As a result, it is possible to suppress breakage, cracks, and electric field concentration at the corners of the ground conductor 40 from the corners.
  • the plurality of slits 71 do not all have to have the same shape.
  • the length of the first direction DIR1 may be the same, the length of the second direction DIR2 may be different, or the shape may be different.
  • FIG. 5 is a plan view showing the configuration of the high frequency circuit board according to the third embodiment.
  • FIG. 5 is a perspective view so that the positional relationship and shape of each conductor can be understood.
  • the high-frequency circuit board 10B according to the third embodiment differs from the high-frequency circuit board 10 according to the first embodiment in the shapes of the recess 443B and the recess 444B.
  • the other configuration of the high-frequency circuit board 10B is the same as that of the high-frequency circuit board 10, and the description of the same parts will be omitted.
  • the recess 443B and the recess 444B have, for example, asymmetrical shapes on both sides of the first direction (region 101 side and region 102 side) with reference to the center of the first direction DIR1 (see SA in FIG. 5).
  • the high-frequency circuit board 10B can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10.
  • the position where the width W403B in the region 103 of the ground conductor 40 is the shortest is a position close to the region 101 in the first direction DIR1.
  • the stress due to bending is concentrated at the position where the width W403B is the shortest, and the stress related to the region 101 can be suppressed more effectively.
  • the shapes of the recesses 443B and the recesses 444B that is, the depth distribution in the first direction DIR1, is not limited to FIG. 5, and may be other shapes (distributions).
  • the shape (distribution) of 5 is better.
  • FIG. 6A is a cross-sectional view showing the configuration of the high frequency circuit board according to the fourth embodiment
  • FIG. 6B is a plan view showing the configuration of the high frequency circuit board according to the fourth embodiment. is there.
  • FIG. 6B is a perspective view so that the positional relationship and shape of each conductor can be understood.
  • 7 (A) and 7 (B) are plan views of each layer of the base material in the high-frequency circuit board according to the fourth embodiment.
  • the high frequency circuit board 10C according to the fourth embodiment relates to the first embodiment.
  • the difference is that the coplanar line is used instead of the strip line realized by the high frequency circuit board 10.
  • Other configurations of the high-frequency circuit board 10C are the same as those of the high-frequency circuit board 10, and the description of the same parts will be omitted.
  • the high frequency circuit board 10C includes a ground conductor 41 and a ground conductor 42.
  • the ground conductor 41 and the ground conductor 42 are arranged in the same layer as the signal conductor 30 in the base material 20.
  • the ground conductor 41 is arranged on the side surface 203 side of the signal conductor 30, and is separated from the signal conductor 30.
  • the ground conductor 42 is arranged on the side surface 204 side of the signal conductor 30 and is separated from the signal conductor 30.
  • the side surface 4132 of the ground conductor 41 on the signal conductor 30 side is along the side surface of the signal conductor 30 on the side surface 203 side.
  • the side surface 4132 of the ground conductor 41 and the side surface of the signal conductor 30 on the side surface 203 side face each other.
  • the separation distance CL123 between the side surface 4132 of the ground conductor 41 in the region 103 and the side surface on the side surface 203 side of the signal conductor 30 is the same.
  • the side surface 4242 of the ground conductor 42 on the signal conductor 30 side is along the side surface of the signal conductor 30 on the side surface 204 side.
  • the side surface 4242 of the ground conductor 42 and the side surface of the signal conductor 30 on the side surface 204 side face each other.
  • the distance CL223 between the side surface 4242 of the ground conductor 42 in the region 103 and the side surface 204 on the side surface of the signal conductor 30 is the same.
  • the region 103 of the ground conductor 41 has a recess 443 recessed from the side surface 4131 on the side surface 203 side.
  • the region 103 of the ground conductor 42 has a recess 444 recessed from the side surface 4241 on the side surface 204 side.
  • the high-frequency circuit board 10C has a region 103 that is a bendable region and a region 101 and a region 102 that are not bendable, and the area where the signal conductor 30 and the ground conductor 41 and the ground conductor 42 face each other. And the separation distance can be the same. As a result, the high frequency circuit board 10C can suppress deterioration of transmission characteristics.
  • the area and volume of the conductor in the region 103 can be made smaller than the area and volume of the conductor in the regions 101 and 102.
  • the high-frequency circuit board 10C can easily bend in the region 103, and can realize a structure in which the high-frequency circuit board 10C does not easily bend in the regions 101 and 102.
  • the high-frequency circuit board 10C can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10.
  • FIG. 8 is a plan view showing the configuration of the high frequency circuit board according to the fifth embodiment.
  • FIG. 8 is a perspective view so that the positional relationship and shape of each conductor can be understood.
  • the high frequency circuit board 10D according to the fifth embodiment is different from the high frequency circuit board 10C according to the fourth embodiment in that it has a plurality of slits 71 and a plurality of slits 72.
  • Other configurations of the high-frequency circuit board 10D are the same as those of the high-frequency circuit board 10C, and the description of the same parts will be omitted.
  • the high-frequency circuit board 10D can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10C. Further, the high frequency circuit board 10D can be further easily bent by providing both the recess and the slit.
  • FIG. 9 is a plan view showing the configuration of the high frequency circuit board according to the sixth embodiment.
  • FIG. 9 is a perspective view so that the positional relationship and shape of each conductor can be understood.
  • the high-frequency circuit board 10E according to the sixth embodiment differs from the high-frequency circuit board 10D according to the fifth embodiment in the shape and arrangement of the plurality of slits 71 and the plurality of slits 72. ..
  • Other configurations of the high-frequency circuit board 10E are the same as those of the high-frequency circuit board 10D, and the description of the same parts will be omitted.
  • the plurality of slits 71 include those arranged at different positions in the first direction DIR1.
  • the plurality of slits 71 arranged at different positions in the first direction DIR1 partially overlap each other in the first direction DIR1 (see the hatched area in FIG. 9).
  • the area and volume of the conductor are locally smaller than those at other locations where the plurality of slits 71 are arranged. .. Therefore, the portion where the plurality of slits 71 partially overlap in the first direction DIR1 is easier to bend.
  • the plurality of slits 72 include those arranged at different positions in the first direction DIR1.
  • the plurality of slits 72 arranged at different positions in the first direction DIR1 partially overlap the arrangement positions in the first direction DIR1 (see the hatched area in FIG. 9).
  • the area and volume of the conductor are locally smaller than those at other locations where the plurality of slits 72 are arranged. .. Therefore, the portion where the plurality of slits 72 partially overlap in the first direction DIR1 is easier to bend.
  • the high-frequency circuit board 10E can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10D. Further, the high frequency circuit board 10E can realize further easiness of bending by locally increasing the number of the plurality of slits 71 and the plurality of slits 72 arranged at a specific position in the first direction DIR1. Further, the high frequency circuit board 10E can make the bending position in the first direction DIR1 more stable.
  • FIG. 10 is a plan view showing the configuration of the high frequency circuit board according to the seventh embodiment.
  • FIG. 10 is a perspective view so that the positional relationship and shape of each conductor can be understood.
  • the high-frequency circuit board 10F according to the seventh embodiment is different from the high-frequency circuit board 10E according to the sixth embodiment in that the recess 443 and the recess 444 are eliminated.
  • Other configurations of the high-frequency circuit board 10F are the same as those of the high-frequency circuit board 10E, and the description of the same parts will be omitted.
  • the high frequency circuit board 10F does not have a recess in the region 103. That is, in the high-frequency circuit board 10F, the ground conductor 41 has the same width W411 in the region 101, width W412 in the region 102, and width W413F in the region 103. Further, in the high frequency circuit board 10F, the ground conductor 42 has the same width W421 in the region 101, width W422 in the region 102, and width W423F in the region 103.
  • the high-frequency circuit board 10F can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10E.
  • FIG. 11 is a plan view showing the configuration of the high frequency circuit board according to the eighth embodiment.
  • FIG. 11 is a perspective view so that the positional relationship and shape of each conductor can be understood.
  • the high-frequency circuit board 10G according to the eighth embodiment is different from the high-frequency circuit board 10F according to the seventh embodiment in that it has a plurality of slits 73.
  • Other configurations of the high-frequency circuit board 10G are the same as those of the high-frequency circuit board 10F, and the description of the same parts will be omitted.
  • the signal conductor 30 includes a plurality of slits 73 in the region 103.
  • the plurality of slits 73 are conductor non-forming portions provided in the signal conductor 30.
  • the plurality of slits 73 have a shape that does not open from the side surfaces (both end surfaces of the second direction DIR2) of the signal conductor 30.
  • the area and volume of the conductor in the region 103 portion of the signal conductor 30 can be reduced without changing the distance and the facing area between the signal conductor 30 and the ground conductor 41 and the ground conductor 42. As a result, the region 103 is more easily bent.
  • the number of slits 73 formed in the signal conductor 30 may be one. Then, it is preferable that one of the plurality of slits 73 or one slit 73 is formed near the boundary between the region 103 and the region 101. As a result, the bending stress is likely to be applied to the position of the slit 73, and the stress on the region 101 can be suppressed.
  • FIG. 12 (A), 12 (B), and 12 (C) are plan views of each layer of the base material in the high-frequency circuit board according to the ninth embodiment.
  • FIG. 13 is a plan view showing the configuration of the high frequency circuit board according to the ninth embodiment.
  • the high-frequency circuit board 10H according to the ninth embodiment is the high-frequency circuit board according to the first embodiment. It differs from 10 microstrip lines in that it constitutes a strip line. Other configurations of the high-frequency circuit board 10H are the same as those of the high-frequency circuit board 10, and the description of the same parts will be omitted.
  • the high frequency circuit board 10H includes a ground conductor 41 and a ground conductor 42.
  • the ground conductor 41 and the ground conductor 42 have the same shape as the ground conductor 40 shown in the first embodiment.
  • the ground conductor 41 has a recess 4431 and a recess 4441 in the region 103.
  • the recess 4431 has a shape that is recessed from the side surface 4031 of the ground conductor 41 in the second direction DIR2.
  • the recess 4441 has a shape that is recessed from the side surface 4041 of the ground conductor 41 in the second direction DIR2.
  • the ground conductor 42 has a recess 4432 and a recess 4442 in the region 103.
  • the recess 4432 has a shape that is recessed from the side surface 4032 of the ground conductor 42 in the second direction DIR2.
  • the recess 4442 has a shape that is recessed from the side surface 4042 of the ground conductor 42 in the second direction DIR2.
  • the ground conductor 41 is arranged on the first main surface 201 side of the base material 20 with respect to the signal conductor 30.
  • the ground conductor 42 is arranged on the second main surface 202 side of the base material 20 with respect to the signal conductor 30.
  • the ground conductor 41 and the ground conductor 42 are arranged so as to sandwich the signal conductor 30 in the second direction DIR2, face the signal conductor 30 in a certain area, and have a certain separation distance. There is.
  • the shape of the recess 4431 of the ground conductor 41 and the recess 4432 of the ground conductor 42 are the same and overlap.
  • the recess 4441 of the ground conductor 41 and the recess 4442 of the ground conductor 42 have the same shape and overlap. This stabilizes the balance of the electromagnetic field distribution of the strip line.
  • the high frequency circuit board according to the tenth embodiment of the present invention will be described with reference to the drawings.
  • 14 (A), 14 (B), and 14 (C) are plan views of each layer of the base material in the first aspect of the high frequency circuit board according to the tenth embodiment.
  • 15 (A), 15 (B), and 15 (C) are plan views of each layer of the base material in the second aspect of the high frequency circuit board according to the tenth embodiment.
  • the high-frequency circuit board 10I1 according to the tenth embodiment is based on the high-frequency circuit board 10H according to the ninth embodiment. The difference is that the ground conductor 42 does not have a recess.
  • the other configuration of the high-frequency circuit board 10I1 is the same as that of the high-frequency circuit board 10H, and the description of the same parts will be omitted.
  • the high frequency circuit board 10I1 does not have a recess, that is, a non-conductor forming portion in the region 103 of the ground conductor 42. Even with such a configuration, since the recesses 4431 and 4441 are formed in the region 103 of the ground conductor 41, deterioration of transmission characteristics can be suppressed while ensuring ease of bending. Further, in this configuration, for example, when mounted on the circuit member 90 as shown in FIG. 3 described above, since the ground conductor 42 is arranged on the outermost side of the electronic device 1, unnecessary electromagnetic field coupling to the outside is effective. Can be suppressed.
  • the high-frequency circuit board 10I2 according to the tenth embodiment is based on the high-frequency circuit board 10H according to the ninth embodiment. The difference is that the ground conductor 41 does not have a recess.
  • Other configurations of the high-frequency circuit board 10I2 are the same as those of the high-frequency circuit board 10H, and the description of the same parts will be omitted.
  • the high frequency circuit board 10I2 does not have a recess, that is, a non-conductor forming portion in the region 103 of the ground conductor 41. Even with such a configuration, since the recesses 4432 and 4442 are formed in the region 103 of the ground conductor 42, deterioration of transmission characteristics can be suppressed while ensuring ease of bending. Further, in this configuration, for example, when mounted on the circuit member 90 as shown in FIG. 3 described above, the ground conductor 41 is arranged between the circuit member 90 and the high frequency circuit board 10I2, so that the circuit member 90 and the high frequency are generated. Unnecessary electromagnetic field coupling with the circuit board 10I2 can be effectively suppressed.
  • FIG. 16 is a plan view showing the configuration of the high frequency circuit board according to the eleventh embodiment.
  • the high-frequency circuit board 10J according to the eleventh embodiment has a signal conductor 31, a signal conductor 32, a ground conductor 41, and a ground conductor 42 with respect to the high-frequency circuit board 10F according to the seventh embodiment. , And a ground conductor 43 is provided.
  • Other configurations of the high-frequency circuit board 10J are the same as those of the high-frequency circuit board 10F, and the description of the same parts will be omitted.
  • the high frequency circuit board 10J includes a signal conductor 31, a signal conductor 32, a ground conductor 41, a ground conductor 42, and a ground conductor 43.
  • the ground conductor 43, the signal conductor 32, the ground conductor 41, the signal conductor 31, and the ground conductor 42 are arranged in this order from the side surface 203 side.
  • the distance between the side surface of the signal conductor 31 on the ground conductor 41 side and the side surface 4132 of the ground conductor 41 on the signal conductor 31 side is the same in the area 101, the area 102, and the area 103.
  • the distance between the side surface of the signal conductor 31 on the ground conductor 42 side and the side surface 4242 of the ground conductor 42 on the signal conductor 31 side is the same in the regions 101, 102, and 103.
  • the distance between the side surface of the signal conductor 32 on the ground conductor 41 side and the side surface 4131 of the ground conductor 41 on the signal conductor 32 side is the same in the area 101, the area 102, and the area 103.
  • the distance between the side surface of the signal conductor 32 on the ground conductor 43 side and the side surface of the ground conductor 43 on the signal conductor 32 side is the same in the region 101, the region 102, and the region 103.
  • a plurality of slits 71 are formed in the region 103 of the ground conductor 41.
  • a plurality of slits 72 are formed in the region 103 of the ground conductor 42.
  • a plurality of slits 73 are formed in the region 103 of the ground conductor 43.
  • the high-frequency circuit board 10J provided with the multi-core line can suppress deterioration of transmission characteristics while ensuring ease of bending, as in the case of the high-frequency circuit board of each of the above-described embodiments.
  • the dimension in the width direction of the circuit board tends to be large. .. Even with such a shape, it is more effective because the ease of bending can be ensured by providing the above-mentioned configuration.
  • the boundary may have a width in the first direction DIR1 and may not be exactly parallel to the second direction DIR2.
  • Circuit member 90E1 End face 91: Land conductor 101, 102, 103: Region 201: First main surface 202: 2nd main surface 203, 204: side surface 300, 301, 302: interlayer connection conductor 403, 404: end side 443, 443B, 444, 444B, 4431, 4432, 4441, 4442: recess 601, 602: ground terminal conductor 901: First main surface 902: Second main surface 921, 922: Land conductor 999: Adhesive member 3011, 3022: Auxiliary conductor for interlayer connection 4031, 4032, 4041, 4042

Abstract

A high-frequency circuit board (10) is provided with: a base material (20) having flexibility and comprising an insulating material; a linear signal conductor (30) disposed in the base material (20) and extending in a first direction (DIR1); and a ground conductor (40) disposed in the base material (20) and having a surface opposing the signal conductor (30) along the first direction (DIR1). The signal conductor (30), the ground conductor (40), and the base material (20) together form a high-frequency signal transmission line. The transmission line includes a region (101) and a region (103) adjacent to each other in the first direction (DIR1). The region (101) is a non-bending region, and the region (103) is a bending region. In the region (101) and the region (103), the signal conductor (30) and the ground conductor (40) oppose each other across a certain distance. The ground conductor (40) in the region (103) includes recesses (443, 444) at positions not opposing the signal conductor (30) in which no conductor is formed.

Description

高周波回路基板および電子機器High frequency circuit boards and electronic devices
　本発明は、高周波信号の伝送回路等を実現する高周波回路基板に関する。 The present invention relates to a high frequency circuit board that realizes a high frequency signal transmission circuit or the like.
　特許文献１には、多層基板によって実現される信号線路が記載されている。信号線路であるフラットケーブルは、積層体を備える。積層体には、第１のグランド導体、第２のグランド導体、および、信号ライン用導体が形成されている。 Patent Document 1 describes a signal line realized by a multilayer board. The flat cable, which is a signal line, includes a laminated body. A first ground conductor, a second ground conductor, and a signal line conductor are formed in the laminated body.
　第１のグランド導体、第２のグランド導体、および、信号ライン用導体は、一方向に延びる形状である。延びる方向に直交する積層体の厚み方向において、信号ライン用導体は、第１のグランド導体と第２のグランド導体との間に配置されている。信号ライン用導体は、第１のグランド導体と第２のグランド導体とに、略全体に亘って対向している。これにより、信号線路は、ストリップライン構造を実現する。 The first ground conductor, the second ground conductor, and the signal line conductor have a shape extending in one direction. The signal line conductor is arranged between the first ground conductor and the second ground conductor in the thickness direction of the laminated body orthogonal to the extending direction. The signal line conductor faces the first ground conductor and the second ground conductor substantially as a whole. As a result, the signal line realizes a stripline structure.
　第１のグランド導体は、延びる方向において、２個の部分に分かれており、これらの２個の部分は、連結導体によって接続される。連結導体は、複数の屈曲部を有する複数の線状導体によって構成される。 The first ground conductor is divided into two parts in the extending direction, and these two parts are connected by a connecting conductor. The connecting conductor is composed of a plurality of linear conductors having a plurality of bent portions.
　このような連結導体の形成部は、第１のグランド導体の２個の部分よりも、導体の面積が小さい。信号線路は、この連結導体の形成部によって、折り曲げを可能にし、折り曲げ易さを実現する。 The forming portion of such a connecting conductor has a smaller conductor area than the two portions of the first ground conductor. The signal line can be bent by the forming portion of the connecting conductor, and the easiness of bending is realized.
国際公開２０１５／１０８０９４号International Publication 2015/108094
　しかしながら、特許文献１に記載の構成では、連結導体の形成部、すなわち、曲げ部と曲げ部以外の部分とにおいて、第１のグランド導体と信号ライン用導体との対向状態が異なる。このため、曲げ部と曲げ部以外の部分とで、インピーダンスの変動が大きくなり易く、伝送特性が劣化してしまうことがある。 However, in the configuration described in Patent Document 1, the facing state of the first ground conductor and the signal line conductor is different in the forming portion of the connecting conductor, that is, the bent portion and the portion other than the bent portion. Therefore, the impedance fluctuates easily between the bent portion and the portion other than the bent portion, and the transmission characteristics may deteriorate.
　したがって、本発明の目的は、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる高周波回路基板を実現することにある。 Therefore, an object of the present invention is to realize a high-frequency circuit board capable of suppressing deterioration of transmission characteristics while ensuring ease of bending.
　この発明の高周波回路基板は、可撓性を有し、絶縁性の材料を含む基材と、基材に配置され、第１方向に延びる線状の信号導体と、基材に配置され、第１方向に沿って、信号導体に対向する面を有するグランド導体と、を備える。信号導体とグランド導体と基材とを含んで高周波信号の伝送線路が形成されている。伝送線路は、第１方向において、隣接する第１領域と第２領域とを有する。第１領域と第２領域とにおいて、信号導体とグランド導体とは、一定の距離で対向する。第２領域におけるグランド導体は、信号導体とグランド導体とが並ぶ基材の厚み方向において、信号導体に対向しない位置に、導体が形成されていない導体非形成部を有する。 The high frequency circuit board of the present invention is arranged on a base material containing a flexible and insulating material, a linear signal conductor extending in the first direction, and placed on the base material. A ground conductor having a surface facing the signal conductor along one direction is provided. A high-frequency signal transmission line is formed including a signal conductor, a ground conductor, and a base material. The transmission line has a first region and a second region adjacent to each other in the first direction. In the first region and the second region, the signal conductor and the ground conductor face each other at a constant distance. The ground conductor in the second region has a conductor non-forming portion in which no conductor is formed at a position not facing the signal conductor in the thickness direction of the base material in which the signal conductor and the ground conductor are lined up.
　この構成では、第１領域と第２領域とで、信号導体とグランド導体との電磁界結合の度合いは、略同じである。したがって、第１領域と第２領域とで、高周波信号に対する特性インピーダンスは、殆ど変化しない。 In this configuration, the degree of electromagnetic field coupling between the signal conductor and the ground conductor is substantially the same in the first region and the second region. Therefore, the characteristic impedance with respect to the high frequency signal hardly changes between the first region and the second region.
　そして、第２領域は、第１領域と比較して、グランド導体の面積が小さい。したがって、第２領域は、第１領域よりも曲がり易い。 And, in the second region, the area of the ground conductor is smaller than that in the first region. Therefore, the second region is more bendable than the first region.
　この発明によれば、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。 According to the present invention, deterioration of transmission characteristics can be suppressed while ensuring ease of bending.
図１（Ａ）は、第１の実施形態に係る高周波回路基板の構成を示す断面図であり、図１（Ｂ）は、第１の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 1A is a cross-sectional view showing the configuration of the high-frequency circuit board according to the first embodiment, and FIG. 1B is a plan view showing the configuration of the high-frequency circuit board according to the first embodiment. is there. 図２（Ａ）、図２（Ｂ）、および、図２（Ｃ）は、第１の実施形態に係る高周波回路基板における基材の各層の平面図である。2 (A), 2 (B), and 2 (C) are plan views of each layer of the base material in the high-frequency circuit board according to the first embodiment. 図３（Ａ）は、第１の実施形態に係る電子機器の斜視図であり、図３（Ｂ）は、第１の実施形態に係る電子機器の構成を示す側面断面図である。FIG. 3A is a perspective view of the electronic device according to the first embodiment, and FIG. 3B is a side sectional view showing a configuration of the electronic device according to the first embodiment. 図４は、第２の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 4 is a plan view showing the configuration of the high frequency circuit board according to the second embodiment. 図５は、第３の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 5 is a plan view showing the configuration of the high frequency circuit board according to the third embodiment. 図６（Ａ）は、第４の実施形態に係る高周波回路基板の構成を示す断面図であり、図６（Ｂ）は、第４の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 6A is a cross-sectional view showing the configuration of the high frequency circuit board according to the fourth embodiment, and FIG. 6B is a plan view showing the configuration of the high frequency circuit board according to the fourth embodiment. is there. 図７（Ａ）、および、図７（Ｂ）は、第４の実施形態に係る高周波回路基板における基材の各層の平面図である。7 (A) and 7 (B) are plan views of each layer of the base material in the high-frequency circuit board according to the fourth embodiment. 図８は、第５の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 8 is a plan view showing the configuration of the high frequency circuit board according to the fifth embodiment. 図９は、第６の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 9 is a plan view showing the configuration of the high frequency circuit board according to the sixth embodiment. 図１０は、第７の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 10 is a plan view showing the configuration of the high frequency circuit board according to the seventh embodiment. 図１１は、第８の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 11 is a plan view showing the configuration of the high frequency circuit board according to the eighth embodiment. 図１２（Ａ）、図１２（Ｂ）、および、図１２（Ｃ）は、第９の実施形態に係る高周波回路基板における基材の各層の平面図である。12 (A), 12 (B), and 12 (C) are plan views of each layer of the base material in the high-frequency circuit board according to the ninth embodiment. 図１３は、第９の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 13 is a plan view showing the configuration of the high frequency circuit board according to the ninth embodiment. 図１４（Ａ）、図１４（Ｂ）、および、図１４（Ｃ）は、第１０の実施形態に係る高周波回路基板の第１態様における基材の各層の平面図である。14 (A), 14 (B), and 14 (C) are plan views of each layer of the base material in the first aspect of the high frequency circuit board according to the tenth embodiment. 図１５（Ａ）、図１５（Ｂ）、および、図１５（Ｃ）は、第１０の実施形態に係る高周波回路基板の第２態様における基材の各層の平面図である。15 (A), 15 (B), and 15 (C) are plan views of each layer of the base material in the second aspect of the high frequency circuit board according to the tenth embodiment. 図１６は、第１１の実施形態に係る高周波回路基板の構成を示す平面図である。FIG. 16 is a plan view showing the configuration of the high frequency circuit board according to the eleventh embodiment.
　（第１の実施形態）
　本発明の第１の実施形態に係る高周波回路基板および電子機器について、図を参照して説明する。図１（Ａ）は、第１の実施形態に係る高周波回路基板の構成を示す断面図であり、図１（Ｂ）は、第１の実施形態に係る高周波回路基板の構成を示す平面図である。図１（Ａ）は、図１（Ｂ）のＡ－Ａ断面を示しており、図１（Ｂ）は、各導体の位置関係および形状が分かるように透視した図である。図２（Ａ）、図２（Ｂ）、および、図２（Ｃ）は、第１の実施形態に係る高周波回路基板における基材の各層の平面図である。図１（Ａ）、図１（Ｂ）、図２（Ａ）、図２（Ｂ）、図２（Ｃ）、および、以下の各実施形態の各図では、高周波回路基板の特徴が分かり易くなるように、適宜寸法を強調して記載している。 (First Embodiment)
The high frequency circuit board and the electronic device according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a cross-sectional view showing the configuration of the high-frequency circuit board according to the first embodiment, and FIG. 1B is a plan view showing the configuration of the high-frequency circuit board according to the first embodiment. is there. FIG. 1 (A) shows a cross section taken along the line AA of FIG. 1 (B), and FIG. 1 (B) is a perspective view so that the positional relationship and shape of each conductor can be understood. 2 (A), 2 (B), and 2 (C) are plan views of each layer of the base material in the high-frequency circuit board according to the first embodiment. In FIGS. 1 (A), 1 (B), 2 (A), 2 (B), 2 (C), and each of the following embodiments, the characteristics of the high-frequency circuit board are easy to understand. Therefore, the dimensions are emphasized as appropriate.
　図１（Ａ）、図１（Ｂ）、図２（Ａ）、図２（Ｂ）、図２（Ｃ）に示すように、高周波回路基板１０は、基材２０、信号導体３０、および、グランド導体４０を備える。信号導体３０およびグランド導体４０は、基材２０に配置されている。 As shown in FIGS. 1 (A), 1 (B), 2 (A), 2 (B), and 2 (C), the high-frequency circuit board 10 includes a base material 20, a signal conductor 30, and A ground conductor 40 is provided. The signal conductor 30 and the ground conductor 40 are arranged on the base material 20.
　基材２０は、絶縁体層２１、絶縁体層２２、および、絶縁体層２３を備える。絶縁体層２１、絶縁体層２２、および、絶縁体層２３は、平膜状であり、平膜面に直交する方向に積層されている。これにより、基材２０は、平板状または平膜状であり、厚み方向（第３方向ＤＩＲ３）に直交する第１主面２０１と第２主面２０２とを有する。また、基材２０は、第１主面２０１と第２主面２０２とに直交し、これらの連接する端面２０Ｅ１を有する。 The base material 20 includes an insulator layer 21, an insulator layer 22, and an insulator layer 23. The insulator layer 21, the insulator layer 22, and the insulator layer 23 have a flat film shape and are laminated in a direction orthogonal to the flat film surface. As a result, the base material 20 has a flat plate shape or a flat film shape, and has a first main surface 201 and a second main surface 202 orthogonal to the thickness direction (third direction DIR3). Further, the base material 20 has an end surface 20E1 that is orthogonal to the first main surface 201 and the second main surface 202 and is connected to the first main surface 201 and the second main surface 202.
　絶縁体層２１、絶縁体層２２、および、絶縁体層２３は、可撓性を有する材料からなる。例えば、絶縁体層２１、絶縁体層２２、および、絶縁体層２３は、液晶ポリマ等の熱可塑性樹脂を主材料としている。絶縁体層２１、絶縁体層２２、および、絶縁体層２３が可撓性を有する材料からなることによって、基材２０も可撓性を有する。 The insulator layer 21, the insulator layer 22, and the insulator layer 23 are made of a flexible material. For example, the insulator layer 21, the insulator layer 22, and the insulator layer 23 are mainly made of a thermoplastic resin such as a liquid crystal polymer. Since the insulator layer 21, the insulator layer 22, and the insulator layer 23 are made of a flexible material, the base material 20 is also flexible.
　信号導体３０は、線状の導体であり、第１方向ＤＩＲ１に沿って延びる形状である。信号導体３０は、基材２０の第２方向ＤＩＲ２の略中央の位置に配置されている。信号導体３０は、基材２０の厚み方向（第３方向ＤＩＲ３）の途中位置に配置されている。より具体的には、信号導体３０は、絶縁体層２１と絶縁体層２２との接合面（接着面）に沿って配置されている。なお、信号導体３０の幅Ｗ３０は、高周波回路基板１０の仕様に応じて適宜設定されている。 The signal conductor 30 is a linear conductor and has a shape extending along the first direction DIR1. The signal conductor 30 is arranged at a position substantially in the center of the second direction DIR2 of the base material 20. The signal conductor 30 is arranged at an intermediate position in the thickness direction (third direction DIR3) of the base material 20. More specifically, the signal conductor 30 is arranged along the joint surface (adhesive surface) between the insulator layer 21 and the insulator layer 22. The width W30 of the signal conductor 30 is appropriately set according to the specifications of the high frequency circuit board 10.
　本願の実施形態では、第１方向ＤＩＲ１が直線である場合を示すが、信号導体３０の延びる方向、すなわち、伝送線路の延びる方向が、本願の第１方向に対応する。また、このように定義される第１方向ＩＲ１に対して、それぞれ直交する方向が第２方向ＤＩＲ２、第３方向ＤＩＲ３であり、上述のように、第３方向ＤＩＲ３は、基材２０の厚み方向に対応し、第２方向ＤＩＲ２は、これら第１方向ＤＩＲ１と第３方向ＤＩＲ３とに直交する方向（例えば、第１方向ＤＩＲ１を長さ方向とすれば、第２方向ＤＩＲ２は幅方向）に対応する。 In the embodiment of the present application, the case where the first direction DIR1 is a straight line is shown, but the extending direction of the signal conductor 30, that is, the extending direction of the transmission line corresponds to the first direction of the present application. Further, the directions orthogonal to the first direction IR1 defined in this way are the second direction DIR2 and the third direction DIR3, respectively. As described above, the third direction DIR3 is the thickness direction of the base material 20. The second direction DIR2 corresponds to the direction orthogonal to the first direction DIR1 and the third direction DIR3 (for example, if the first direction DIR1 is the length direction, the second direction DIR2 is the width direction). To do.
　グランド導体４０は、平膜状の導体である。概略的には、グランド導体４０は、基材２０を平面視した形状（第３方向ＤＩＲ３に視た形状）と略同じである。グランド導体４０は、基材２０の厚み方向（第３方向ＤＩＲ３）における信号導体３０と異なる位置に配置されている。より具体的には、グランド導体４０は、絶縁体層２２と絶縁体層２３との接合面（接着面）に沿って配置されている。この構成によって、グランド導体４０は、信号導体３０の延びる方向（第１方向ＤＩＲ１）の位置によらず、信号導体３０から同じ距離で、且つ、同面積にて対向している。言い換えれば、信号導体３０とグランド導体４０とは、一定の距離で対向している。 The ground conductor 40 is a flat-film conductor. Generally, the ground conductor 40 has substantially the same shape as the base material 20 in a plan view (shape seen in the third direction DIR3). The ground conductor 40 is arranged at a position different from that of the signal conductor 30 in the thickness direction (third direction DIR3) of the base material 20. More specifically, the ground conductor 40 is arranged along the joint surface (adhesive surface) between the insulator layer 22 and the insulator layer 23. With this configuration, the ground conductor 40 faces the signal conductor 30 at the same distance and in the same area regardless of the position of the signal conductor 30 in the extending direction (first direction DIR1). In other words, the signal conductor 30 and the ground conductor 40 face each other at a certain distance.
　このような構成によって、高周波回路基板１０は、信号導体３０、グランド導体４０、および、基材２０を含むストリップ線路の伝送線路を備える。 With such a configuration, the high frequency circuit board 10 includes a signal conductor 30, a ground conductor 40, and a transmission line of a strip line including the base material 20.
　そして、高周波回路基板１０は、基材２０の端面２０Ｅ１から、第１方向ＤＩＲ１に沿って、領域１０１、領域１０３、および、領域１０２を有する。言い換えれば、領域１０３は、領域１０１と領域１０２との間に配置され、領域１０１と領域１０２とにそれぞれ隣接し、領域１０１と領域１０２とを接続する。 Then, the high frequency circuit board 10 has a region 101, a region 103, and a region 102 from the end face 20E1 of the base material 20 along the first direction DIR1. In other words, the area 103 is arranged between the area 101 and the area 102, is adjacent to the area 101 and the area 102, respectively, and connects the area 101 and the area 102.
　領域１０１および領域１０２は、折り曲げられない領域であり、領域１０３は、折り曲げられる領域である。そして、領域１０１が、本発明の「第１領域」に対応し、領域１０３が、本発明の「第２領域」に対応する。なお、第２の領域である領域１０３は、第１の領域である領域１０１に対して、曲率が大きければよい。また、領域１０３は、高周波回路基板１０における折り曲げ角度が最も大きい部分を含んでいる構成であってもよい。すなわち、領域１０１が高周波回路基板１０の形成上、または、高周波回路基板１０を他の回路基板に実装する際に、完全な平坦なものでなくなっても、領域１０３は、領域１０１よりも大きく曲がっていれば（例えば、意図的に曲げていれば）、本願発明の作用効果を奏することができる。 Region 101 and region 102 are non-foldable regions, and region 103 is a bendable region. The region 101 corresponds to the "first region" of the present invention, and the region 103 corresponds to the "second region" of the present invention. The region 103, which is the second region, may have a larger curvature with respect to the region 101, which is the first region. Further, the region 103 may be configured to include a portion of the high-frequency circuit board 10 having the largest bending angle. That is, even if the region 101 is not completely flat due to the formation of the high-frequency circuit board 10 or when the high-frequency circuit board 10 is mounted on another circuit board, the region 103 is bent more than the region 101. If so (for example, if it is intentionally bent), the effects of the present invention can be achieved.
　ここで、グランド導体４０は、凹部４４３と凹部４４４とを有する。凹部４４３および凹部４４４は、グランド導体４０と同層において、導体パターンが形成されていない部分である。凹部４４３は、基材２０の側面２０３に近接するグランド導体４０の端辺４０３から、第２方向ＤＩＲ２方向の中央側に凹む形状である。凹部４４４は、基材２０の側面２０４に近接するグランド導体４０の端辺４０４から、第２方向ＤＩＲ２方向の中央側に凹む形状である。凹部４４３は、深さＷ４４３を有し、凹部４４４は、深さＷ４４４を有する。 Here, the ground conductor 40 has a recess 443 and a recess 444. The recess 443 and the recess 444 are portions in the same layer as the ground conductor 40 where no conductor pattern is formed. The recess 443 has a shape that is recessed from the end side 403 of the ground conductor 40 close to the side surface 203 of the base material 20 toward the center side in the second direction DIR2 direction. The recess 444 has a shape that is recessed from the end side 404 of the ground conductor 40 close to the side surface 204 of the base material 20 toward the center side in the second direction DIR2 direction. The recess 443 has a depth W443 and the recess 444 has a depth W444.
　凹部４４３および凹部４４４は、領域１０３に形成されており、領域１０３において、第１方向ＤＩＲ１において、深さＷ４４３および深さＷ４４４は、一定である。 The recess 443 and the recess 444 are formed in the region 103, and in the region 103, the depth W443 and the depth W444 are constant in the first direction DIR1.
　このような構成によって、領域１０３におけるグランド導体４０の幅Ｗ４０３は、領域１０１におけるグランド導体４０の幅Ｗ４０１、および、領域１０２におけるグランド導体４０の幅Ｗ４０２よりも小さくなる。いいかえれば、グライド導体４０は、領域１０３に凹部４４３、凹部４４４を有することによって、領域１３０のグランド導体４０の幅（第２方向ＤＩＲ２の長さ）を小さくしている。 With such a configuration, the width W403 of the ground conductor 40 in the region 103 is smaller than the width W401 of the ground conductor 40 in the region 101 and the width W402 of the ground conductor 40 in the region 102. In other words, the glide conductor 40 has the recess 443 and the recess 444 in the region 103, thereby reducing the width of the ground conductor 40 in the region 130 (the length of the second direction DIR2).
　そして、凹部４４３および凹部４４４、すなわち、領域１０３におけるグランド導体４０の導体非形成領域は、第１方向ＤＩＲ１および第２方向ＤＩＲ２に直交する第３方向ＤＩＲ３（信号導体３０とグランド導体４０とが並ぶ基材２０の厚み方向）において、対向しない（重ならない）。 Then, in the recess 443 and the recess 444, that is, the non-conductor forming region of the ground conductor 40 in the region 103, the third direction DIR3 (the signal conductor 30 and the ground conductor 40) orthogonal to the first direction DIR1 and the second direction DIR2 are lined up. In the thickness direction of the base material 20, they do not face each other (do not overlap).
　これにより、領域１０３は、領域１０１および領域１０２よりも導体の面積および体積が小さくなる。したがって、領域１０３は、領域１０１および領域１０２と比較して曲がり易い。この結果、高周波回路基板１０は、領域１０３を折り曲げられる領域とし、領域１０１および領域１０２を折り曲げられない領域として、途中に折り曲げ箇所を有する所望の形状を、容易に実現できる。また、容易に曲げられる領域が形成されることによって、信号導体３０およびグランド導体４０の断線耐性は、向上する。 As a result, the area 103 has a smaller conductor area and volume than the areas 101 and 102. Therefore, the region 103 is more bendable than the regions 101 and 102. As a result, the high-frequency circuit board 10 can easily realize a desired shape having a bent portion in the middle, with the region 103 as a bendable region and the region 101 and the region 102 as a non-foldable region. Further, the disconnection resistance of the signal conductor 30 and the ground conductor 40 is improved by forming the easily bendable region.
　また、高周波回路基板１０は、上述のように、第１方向ＤＩＲ１の位置によらず、信号導体３０とグランド導体４０とは、一定の距離で、且つ、同面積にて対向している。これにより、高周波回路基板１０では、領域１０１および領域１０２における特性インピーダンスと、領域１０３における特性インピーダンスとは、略同じになる。言い換えれば、領域１０１および領域１０２における特性インピーダンスと、領域１０３における特性インピーダンスとは、急激に変動しない。 Further, as described above, in the high frequency circuit board 10, the signal conductor 30 and the ground conductor 40 face each other at a constant distance and in the same area regardless of the position of the first direction DIR1. As a result, in the high frequency circuit board 10, the characteristic impedance in the region 101 and the region 102 and the characteristic impedance in the region 103 become substantially the same. In other words, the characteristic impedance in the regions 101 and 102 and the characteristic impedance in the region 103 do not fluctuate abruptly.
　したがって、領域１０１と領域１０３との接続箇所におけるインピーダンスの不整合を抑制し、領域１０３と領域１０２との接続箇所におけるインピーダンスの不整合を抑制できる。この結果、高周波回路基板１０は、伝送特性の劣化を抑制できる。 Therefore, the impedance mismatch at the connection point between the region 101 and the region 103 can be suppressed, and the impedance mismatch at the connection point between the region 103 and the region 102 can be suppressed. As a result, the high-frequency circuit board 10 can suppress deterioration of transmission characteristics.
　以上のように、本実施形態の構成を用いることによって、高周波回路基板１０は、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。 As described above, by using the configuration of the present embodiment, the high-frequency circuit board 10 can suppress deterioration of transmission characteristics while ensuring ease of bending.
　高周波回路基板１０は、次に示す他の特徴も有する。高周波回路基板１０は、さらに、端子導体５０、グランド端子導体６０１、グランド端子導体６０２、層間接続導体３００、層間接続導体３０１、および、層間接続導体３０２を備える。 The high frequency circuit board 10 also has the following other features. The high-frequency circuit board 10 further includes a terminal conductor 50, a ground terminal conductor 601, a ground terminal conductor 602, an interlayer connecting conductor 300, an interlayer connecting conductor 301, and an interlayer connecting conductor 302.
　端子導体５０、グランド端子導体６０１、および、グランド端子導体６０２は、矩形の導体である。端子導体５０、グランド端子導体６０１、および、グランド端子導体６０２は、基材２０の第１主面２０１に配置されており、端面２０Ｅ１、または、端面２０Ｅ１の近傍に配置されている。言い換えれば、端子導体５０、グランド端子導体６０１、および、グランド端子導体６０２は、領域１０１内に配置されている。 The terminal conductor 50, the ground terminal conductor 601 and the ground terminal conductor 602 are rectangular conductors. The terminal conductor 50, the ground terminal conductor 601 and the ground terminal conductor 602 are arranged on the first main surface 201 of the base material 20, and are arranged on the end surface 20E1 or in the vicinity of the end surface 20E1. In other words, the terminal conductor 50, the ground terminal conductor 601 and the ground terminal conductor 602 are arranged in the region 101.
　端子導体５０は、基材２０の第２方向ＤＩＲ２における略中央の位置に配置されており、平面視において（第３方向ＤＩＲ３に視て）、信号導体３０の端部に重なっている。端子導体５０は、第３方向ＤＩＲ３の方向に延びる層間接続導体３００によって、信号導体３０に接続する。 The terminal conductor 50 is arranged at a position substantially at the center of the base material 20 in the second direction DIR2, and overlaps the end portion of the signal conductor 30 in a plan view (as viewed in the third direction DIR3). The terminal conductor 50 is connected to the signal conductor 30 by an interlayer connecting conductor 300 extending in the direction of the third direction DIR3.
　グランド端子導体６０１は、基材２０の第２方向ＤＩＲ２において、端子導体５０よりも端辺４０３側に配置されている。グランド端子導体６０１は、第３方向ＤＩＲ３の方向に延びる層間接続導体３０１（より具体的には、第３方向ＤＩＲ３の方向に延びる２個の層間接続導体３０１と層間接続用補助導体３０１１（図２（Ａ）、図２（Ｂ）、図２（Ｃ）参照））によって、グランド導体４０に接続する。 The ground terminal conductor 601 is arranged on the end side 403 side of the terminal conductor 50 in the second direction DIR2 of the base material 20. The ground terminal conductor 601 includes an interlayer connecting conductor 301 extending in the direction of the third direction DIR3 (more specifically, two interlayer connecting conductors 301 extending in the direction of the third direction DIR3 and an interlayer connecting auxiliary conductor 3011 (FIG. 2). (A), FIG. 2 (B), FIG. 2 (C))) to connect to the ground conductor 40.
　グランド端子導体６０２は、基材２０の第２方向ＤＩＲ２において、端子導体５０よりも端辺４０４側に配置されている。グランド端子導体６０２は、第３方向ＤＩＲ３の方向に延びる層間接続導体３０２（より具体的には、第３方向ＤＩＲ３の方向に延びる２個の層間接続導体３０２と層間接続用補助導体３０２２（図２（Ａ）、図２（Ｂ）、図２（Ｃ）参照））によって、グランド導体４０に接続する。 The ground terminal conductor 602 is arranged on the end side 404 side of the terminal conductor 50 in the second direction DIR2 of the base material 20. The ground terminal conductor 602 includes an interlayer connecting conductor 302 extending in the direction of the third direction DIR3 (more specifically, two interlayer connecting conductors 302 extending in the direction of the third direction DIR3 and an interlayer connecting auxiliary conductor 3022 (FIG. 2). (A), FIG. 2 (B), FIG. 2 (C))) to connect to the ground conductor 40.
　このような構成の高周波回路基板１０は、例えば、図３に示すように、他の回路部材に、物理的および電気的に接続される。図３（Ａ）は、第１の実施形態に係る電子機器の斜視図であり、図３（Ｂ）は、第１の実施形態に係る電子機器の構成を示す側面断面図である。 The high frequency circuit board 10 having such a configuration is physically and electrically connected to other circuit members, for example, as shown in FIG. FIG. 3A is a perspective view of the electronic device according to the first embodiment, and FIG. 3B is a side sectional view showing a configuration of the electronic device according to the first embodiment.
　図３（Ａ）、図３（Ｂ）に示すように、電子機器１は、高周波回路基板１０および回路部材９０を備える。回路部材９０は、例えば、情報通信端末等のベース基板であり、第１主面９０１と第２主面９０２とを有する。また、回路部材９０は、第１主面９０１と第２主面９０２とに直交し、これらに連接する端面９０Ｅ１を有する。 As shown in FIGS. 3 (A) and 3 (B), the electronic device 1 includes a high-frequency circuit board 10 and a circuit member 90. The circuit member 90 is, for example, a base board for an information communication terminal or the like, and has a first main surface 901 and a second main surface 902. Further, the circuit member 90 has an end surface 90E1 that is orthogonal to the first main surface 901 and the second main surface 902 and is connected to them.
　高周波回路基板１０は、領域１０３において折り曲げられている。領域１０３は、回路部材９０の端面９０Ｅ１の形状、第１主面９０１および第２主面９０２と端面９０Ｅ１との連接形状に応じた形状で折り曲げられている。領域１０３は、塑性変形によって形成されており、高周波回路基板１０を回路部材９０に実装するとき、および、その前後において、形状を維持している。塑性変形は、例えば、基材２０の主材料を熱可塑性樹脂として、金型等で形状を決定しながら、加熱、冷却することによって実現可能である。 The high frequency circuit board 10 is bent in the region 103. The region 103 is bent in a shape corresponding to the shape of the end surface 90E1 of the circuit member 90 and the shape of the connection between the first main surface 901 and the second main surface 902 and the end surface 90E1. The region 103 is formed by plastic deformation, and maintains its shape when the high-frequency circuit board 10 is mounted on the circuit member 90 and before and after the region 103. Plastic deformation can be realized, for example, by using a thermoplastic resin as the main material of the base material 20 and heating and cooling the base material 20 while determining the shape with a mold or the like.
　領域１０１は、回路部材９０の第１主面９０１に近接し、対向する。端子導体５０は、回路部材９０の第１主面９０１に形成されたランド導体９１に、導電性接合材を介して実装される。グランド端子導体６０１は、回路部材９０の第１主面９０１に形成されたランド導体９２１に、導電性接合材を介して実装される。グランド端子導体６０２は、回路部材９０の第１主面９０１に形成されたランド導体９２２に、導電性接合材を介して実装される。 The region 101 is close to and faces the first main surface 901 of the circuit member 90. The terminal conductor 50 is mounted on the land conductor 91 formed on the first main surface 901 of the circuit member 90 via a conductive bonding material. The ground terminal conductor 601 is mounted on the land conductor 921 formed on the first main surface 901 of the circuit member 90 via a conductive bonding material. The ground terminal conductor 602 is mounted on the land conductor 922 formed on the first main surface 901 of the circuit member 90 via a conductive bonding material.
　領域１０２は、回路部材９０の第２主面９０２に近接しており、対向している。領域１０２は、例えば、第２主面９０２に対して、接着部材９９９を介して、接着している。 The region 102 is close to and faces the second main surface 902 of the circuit member 90. The region 102 is adhered to, for example, the second main surface 902 via the adhesive member 999.
　このような構成において、上述のように、高周波回路基板１０は、折り曲げられる領域（領域１０３）を有し、領域１０３が、回路部材９０の形状に応じた折り曲げ形状である。したがって、高周波回路基板１０は、回路部材９０の三面（第１主面９０１、端面９０Ｅ１、および、第２主面９０２）に沿って、容易に、且つ、より正確に配置でき、回路部材９０に実装できる。また、この際、不要な応力を与えることなく、高周波回路基板１０を実装できるので、この不要な応力による高周波回路基板１０の変形、それに伴う、内部構造の破損等を抑制できる。これにより、電子機器１の信頼性は向上する。 In such a configuration, as described above, the high-frequency circuit board 10 has a bendable region (region 103), and the region 103 has a bent shape according to the shape of the circuit member 90. Therefore, the high frequency circuit board 10 can be easily and more accurately arranged along the three surfaces (first main surface 901, end surface 90E1, and second main surface 902) of the circuit member 90, and can be arranged on the circuit member 90. Can be implemented. Further, at this time, since the high-frequency circuit board 10 can be mounted without applying unnecessary stress, it is possible to suppress deformation of the high-frequency circuit board 10 due to this unnecessary stress and accompanying damage to the internal structure. As a result, the reliability of the electronic device 1 is improved.
　また、この構成では、折り曲げられない領域である領域１０１に層間接続導体３００、層間接続導体３０１、および、層間接続導体３０２が形成される。したがって、曲げによる応力は、層間接続導体３００、層間接続導体３０１、および、層間接続導体３０２にかかり難い。したがって、層間接続導体３００、層間接続導体３０１、および、層間接続導体３０２の破損、層間接続導体３００と信号導体３０および端子導体５０との接合部の破損、層間接続導体３０１とグランド導体４０およびグランド端子導体６０１との接合部の破損、層間接続導体３０２とグランド導体４０およびグランド端子導体６０２との接合部の破損を抑制できる。これにより、高周波回路基板１０および電子機器１の信頼性は、高くなる。 Further, in this configuration, the interlayer connecting conductor 300, the interlayer connecting conductor 301, and the interlayer connecting conductor 302 are formed in the region 101 which is a non-bendable region. Therefore, the stress due to bending is less likely to be applied to the interlayer connecting conductor 300, the interlayer connecting conductor 301, and the interlayer connecting conductor 302. Therefore, the interlayer connecting conductor 300, the interlayer connecting conductor 301, and the interlayer connecting conductor 302 are damaged, the joint between the interlayer connecting conductor 300 and the signal conductor 30 and the terminal conductor 50 is damaged, and the interlayer connecting conductor 301 and the ground conductor 40 and the ground are damaged. It is possible to suppress damage to the joint with the terminal conductor 601 and damage to the joint between the interlayer connection conductor 302 and the ground conductor 40 and the ground terminal conductor 602. As a result, the reliability of the high-frequency circuit board 10 and the electronic device 1 is increased.
　高周波回路基板１０は、さらに次に示す各種の特徴も有する。高周波回路基板１０では、折り曲げられる領域である領域１０３の長さＬ１０３（第１方向ＤＩＲ１の長さ）は、基材２０の幅Ｗ２０よりも小さい。言い換えれば、基材２０の幅Ｗ２０は、折り曲げられる領域である領域１０３の長さＬ１０３よりも小さい。このような場合、寸法関係の場合、一般的には、領域１０１を第２方向ＤＩＲ２（第１主面２０１および第２主面２０２）に直交する方向に折り曲げ難い。また、折り曲げたとしても、第１方向ＤＩＲ１における折り曲げ位置を、所定位置に、より確実に合わせることは難しい。しかしながら、高周波回路基板１０は、上述の構成を備えることによって、第１方向ＤＩＲ１において領域１０３の位置で容易に折り曲げることが可能になる。すなわち、高周波回路基板１０は、所望の折り曲げ形状を、容易に実現できる。 The high frequency circuit board 10 also has various features as shown below. In the high-frequency circuit board 10, the length L103 (the length of the first direction DIR1) of the region 103, which is a bendable region, is smaller than the width W20 of the base material 20. In other words, the width W20 of the base material 20 is smaller than the length L103 of the region 103 which is a bendable region. In such a case, in the case of dimensional relation, it is generally difficult to bend the region 101 in the direction orthogonal to the second direction DIR2 (first main surface 201 and second main surface 202). Further, even if it is bent, it is difficult to more reliably align the bent position in the first direction DIR1 with a predetermined position. However, by providing the above-mentioned configuration, the high-frequency circuit board 10 can be easily bent at the position of the region 103 in the first direction DIR1. That is, the high-frequency circuit board 10 can easily realize a desired bent shape.
　また、凹部４４３の第１方向ＤＩＲ１の長さは、凹部４４３の深さＷ４４３（第２方向ＤＩＲ２の長さ）よりも大きい。同様に、凹部４４４の第１方向ＤＩＲ１の長さは、凹部４４４の深さＷ４４４（第２方向ＤＩＲ２の長さ）よりも大きい。これにより、領域１０３の曲げ時に、グランド導体４０に対して第２方向ＤＩＲ２に延びる亀裂が発生することを抑制できる。これにより、高周波回路基板１０の信頼性は、高くなる。なお、凹部４４３の第１方向ＤＩＲ１の長さおよび凹部４４４の第１方向ＤＩＲ１の長さは、凹部４４３および凹部４４４の底部の長さで定義してもよく、開口部の長さで定義してもよい。ただし、凹部４４３および凹部４４４の底部の長さで定義することによって、亀裂の発生を、より確実に抑制でき、高周波回路基板１０の信頼性は、さらに高くなる。 Further, the length of the first direction DIR1 of the recess 443 is larger than the depth W443 of the recess 443 (the length of the second direction DIR2). Similarly, the length of the first direction DIR1 of the recess 444 is larger than the depth W444 of the recess 444 (the length of the second direction DIR2). As a result, when the region 103 is bent, it is possible to suppress the occurrence of cracks extending in the second direction DIR2 with respect to the ground conductor 40. As a result, the reliability of the high frequency circuit board 10 is increased. The length of the first-direction DIR1 of the recess 443 and the length of the first-direction DIR1 of the recess 444 may be defined by the length of the bottom of the recess 443 and the recess 444, and are defined by the length of the opening. You may. However, by defining the lengths of the bottoms of the recesses 443 and 444, the occurrence of cracks can be suppressed more reliably, and the reliability of the high-frequency circuit board 10 is further increased.
　また、凹部４４３の深さＷ４４３と凹部４４４の深さＷ４４４は、同じであることが好ましいが、異なっていてもよい。凹部４４３の深さＷ４４３と凹部４４４の深さとが同じであることによって、信号導体３０の幅方向の両側の電磁界分布を同じにできる。 Further, the depth W443 of the recess 443 and the depth W444 of the recess 444 are preferably the same, but may be different. Since the depth W443 of the recess 443 and the depth of the recess 444 are the same, the electromagnetic field distributions on both sides of the signal conductor 30 in the width direction can be made the same.
　また、図１（Ｂ）、図２（Ｃ）に示すように、凹部４４３および凹部４４４は、領域１０３に形成されており、その一部は、領域１０１および領域１０２に係っていてもよい。但し、凹部４４３および凹部４４４における領域１０１および領域１０２に係る部分の凹む深さ（第２方向ＤＩＲ２の長さ）は、領域１０３の部分の凹む深さＷ４４３、Ｗ４４４よりも小さい。 Further, as shown in FIGS. 1 (B) and 2 (C), the recess 443 and the recess 444 are formed in the region 103, and a part thereof may be related to the region 101 and the region 102. .. However, the recessed depth (the length of the second direction DIR2) of the portions 101 and 102 in the recesses 443 and 444 is smaller than the recessed depths W443 and W444 of the regions 103.
　この構成によって、領域１０１および領域１０２にグランド導体４０の幅の狭い部分があっても、領域１０３のグランド導体４０の幅Ｗ４０２の方が小さい。したがって、領域１０３が、より確実に、折れ曲げられる領域となる。 With this configuration, even if the area 101 and the area 102 have a narrow portion of the ground conductor 40, the width W402 of the ground conductor 40 in the area 103 is smaller. Therefore, the region 103 becomes a region that can be bent more reliably.
　また、図１（Ｂ）、図２（Ｃ）に示すように、凹部４４３および凹部４４４は、領域１０１および領域１０２から領域１０３に向かって、角部を有さないように、徐々に深くなる形状（テーパ形状）であることが好ましい。これにより、凹部４４３および凹部４４４を有することによる領域１０１および領域１０２の電磁界分布と領域１０３の電磁界分布との間の急激な変動を抑制できる。これにより、高周波回路基板１０は、領域１０１と領域１０３との接続部、および、領域１０２と領域１０３との接続部における伝送損失を抑制できる。 Further, as shown in FIGS. 1B and 2C, the recesses 443 and 444 gradually become deeper from the regions 101 and 102 toward the region 103 so as not to have corners. The shape (tapered shape) is preferable. As a result, abrupt fluctuations between the electromagnetic field distributions of the regions 101 and 102 and the electromagnetic field distributions of the regions 103 due to having the recesses 443 and 444 can be suppressed. As a result, the high-frequency circuit board 10 can suppress transmission loss at the connection portion between the region 101 and the region 103 and the connection portion between the region 102 and the region 103.
　特に、領域１０３の幅の半分が、信号導体３０とグランド導体４０との離間距離ｄの約３倍（３ｄ）以下の場合、凹部４４３および凹部４４４を設けることによる伝送特性への影響は大きくなり易い。したがって、このような場合に、テーパ形状を有することによる伝送損失の抑制効果は、より高くなり、有効になる。 In particular, when half the width of the region 103 is about 3 times (3d) or less of the separation distance d between the signal conductor 30 and the ground conductor 40, the effect of providing the recess 443 and the recess 444 on the transmission characteristics becomes large. easy. Therefore, in such a case, the effect of suppressing the transmission loss by having the tapered shape becomes higher and more effective.
　また、テーパ形状を有することによって、角部を有することによって生じるような、曲げ時の応力の集中が抑制される。したがって、高周波回路基板１０の信頼性は、さらに高くなる。 Also, by having a tapered shape, the concentration of stress during bending, which is caused by having corners, is suppressed. Therefore, the reliability of the high frequency circuit board 10 is further increased.
　（第２の実施形態）
　本発明の第２の実施形態に係る高周波回路基板について、図を参照して説明する。図４は、第２の実施形態に係る高周波回路基板の構成を示す平面図である。図４は、各導体の位置関係および形状が分かるように透視した図である。 (Second Embodiment)
The high frequency circuit board according to the second embodiment of the present invention will be described with reference to the drawings. FIG. 4 is a plan view showing the configuration of the high frequency circuit board according to the second embodiment. FIG. 4 is a perspective view so that the positional relationship and shape of each conductor can be understood.
　図４に示すように、第２の実施形態に係る高周波回路基板１０Ａは、第１の実施形態に係る高周波回路基板１０に対して、凹部４４３および凹部４４４を有さない点、複数のスリット７１を有する点で異なる。高周波回路基板１０Ａの他の構成は、高周波回路基板１０と同様であり、同様の箇所の説明は省略する。 As shown in FIG. 4, the high-frequency circuit board 10A according to the second embodiment does not have the recess 443 and the recess 444 with respect to the high-frequency circuit board 10 according to the first embodiment, and a plurality of slits 71. It differs in that it has. The other configuration of the high-frequency circuit board 10A is the same as that of the high-frequency circuit board 10, and the description of the same parts will be omitted.
　高周波回路基板１０Ａは、複数のスリット７１を有する。複数のスリット７１は、グランド導体４０における領域１０３に設けられた導体非形成部である。複数のスリット７１の第１方向ＤＩＲ１の長さＬ７１は、第２方向ＤＩＲ２の幅Ｗ７１よりも大きい。 The high frequency circuit board 10A has a plurality of slits 71. The plurality of slits 71 are conductor non-forming portions provided in the region 103 of the ground conductor 40. The length L71 of the first direction DIR1 of the plurality of slits 71 is larger than the width W71 of the second direction DIR2.
　複数のスリット７１は、第２方向ＤＩＲ２に沿って互いに離間して配置されている。複数のスリット７１は、信号導体３０に重ならないように配置されている。 The plurality of slits 71 are arranged apart from each other along the second direction DIR2. The plurality of slits 71 are arranged so as not to overlap the signal conductor 30.
　このような構成では、領域１０３の幅Ｗ４０３が、領域１０１の幅Ｗ４０１および領域１０２の幅Ｗ４０２と同じであっても、領域１０３を、領域１０１および領域１０２よりも折り曲げ易い。 In such a configuration, even if the width W403 of the area 103 is the same as the width W401 of the area 101 and the width W402 of the area 102, the area 103 is easier to bend than the area 101 and the area 102.
　したがって、高周波回路基板１０Ａは、高周波回路基板１０と同様に、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。また、高周波回路基板１０Ａは、適宜、高周波回路基板１０と同様の作用効果を奏することができる。 Therefore, the high-frequency circuit board 10A can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10. Further, the high-frequency circuit board 10A can appropriately exert the same effect as that of the high-frequency circuit board 10.
　なお、複数のスリット７１は、第１方向ＤＩＲ１の長さＬ７１が、高周波回路基板１０Ａで伝送する高周波信号の波長λの１／４以下であることが好ましい。これにより、スリット７１に生じる共振を抑制でき、損失を低減できる。 It is preferable that the length L71 of the first direction DIR1 of the plurality of slits 71 is 1/4 or less of the wavelength λ of the high frequency signal transmitted by the high frequency circuit board 10A. As a result, the resonance generated in the slit 71 can be suppressed, and the loss can be reduced.
　また、複数のスリット７１は、角部が無い形状、例えば、平面視において角部がＲ面取りされている形状であることが好ましい。これにより、角部からのグランド導体４０の破断、亀裂、角部における電界集中を抑制できる。 Further, it is preferable that the plurality of slits 71 have no corners, for example, a shape in which the corners are R-chamfered in a plan view. As a result, it is possible to suppress breakage, cracks, and electric field concentration at the corners of the ground conductor 40 from the corners.
　また、複数のスリット７１は、全て同じ形状である必要はなく、例えば、第１方向ＤＩＲ１の長さが同じで、第２方向ＤＩＲ２の長さが異なっていたり、形状が異なっていてもよい。 Further, the plurality of slits 71 do not all have to have the same shape. For example, the length of the first direction DIR1 may be the same, the length of the second direction DIR2 may be different, or the shape may be different.
　（第３の実施形態）
　本発明の第３の実施形態に係る高周波回路基板について、図を参照して説明する。図５は、第３の実施形態に係る高周波回路基板の構成を示す平面図である。図５は、各導体の位置関係および形状が分かるように透視した図である。 (Third Embodiment)
The high frequency circuit board according to the third embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a plan view showing the configuration of the high frequency circuit board according to the third embodiment. FIG. 5 is a perspective view so that the positional relationship and shape of each conductor can be understood.
　図５に示すように、第３の実施形態に係る高周波回路基板１０Ｂは、第１の実施形態に係る高周波回路基板１０に対して、凹部４４３Ｂおよび凹部４４４Ｂの形状において異なる。高周波回路基板１０Ｂの他の構成は、高周波回路基板１０と同様であり、同様の箇所の説明は省略する。 As shown in FIG. 5, the high-frequency circuit board 10B according to the third embodiment differs from the high-frequency circuit board 10 according to the first embodiment in the shapes of the recess 443B and the recess 444B. The other configuration of the high-frequency circuit board 10B is the same as that of the high-frequency circuit board 10, and the description of the same parts will be omitted.
　高周波回路基板１０Ｂは、領域１０３にかかる凹部４４３Ｂと凹部４４４Ｂとを有する。凹部４４３Ｂと凹部４４４Ｂとは、第１方向ＤＩＲ１における位置によって深さが異なる形状である。より具体的には、凹部４４３Ｂと凹部４４４Ｂとは、領域１０３と領域１０１との接続部の近傍に深さの極大を有し、領域１０３と領域１０２との接続部から、この極大の位置に向けて、徐々に深くなる形状である。すなわち、凹部４４３Ｂと凹部４４４Ｂとは、例えば、第１方向ＤＩＲ１の中心を基準（図５のＳＡ参照）に、第１方向の両側（領域１０１側と領域１０２側）で非対称な形状である。 The high frequency circuit board 10B has a recess 443B and a recess 444B over the region 103. The recess 443B and the recess 444B have different depths depending on their positions in the first direction DIR1. More specifically, the recess 443B and the recess 444B have a maximum depth in the vicinity of the connection portion between the region 103 and the region 101, and are located at this maximum position from the connection portion between the region 103 and the region 102. It is a shape that gradually deepens toward it. That is, the recess 443B and the recess 444B have, for example, asymmetrical shapes on both sides of the first direction (region 101 side and region 102 side) with reference to the center of the first direction DIR1 (see SA in FIG. 5).
　このような構成によって、高周波回路基板１０Ｂは、高周波回路基板１０と同様に、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。さらに、高周波回路基板１０Ｂは、グランド導体４０における領域１０３での幅Ｗ４０３Ｂが最短の位置（深さが極大の位置）は、第１方向ＤＩＲ１における領域１０１に近接する位置になる。これにより、曲げによる応力は、幅Ｗ４０３Ｂが最短の位置に集中し、領域１０１に係る応力を、より効果的に抑制できる。 With such a configuration, the high-frequency circuit board 10B can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10. Further, in the high frequency circuit board 10B, the position where the width W403B in the region 103 of the ground conductor 40 is the shortest (the position where the depth is maximum) is a position close to the region 101 in the first direction DIR1. As a result, the stress due to bending is concentrated at the position where the width W403B is the shortest, and the stress related to the region 101 can be suppressed more effectively.
　なお、凹部４４３Ｂおよび凹部４４４Ｂの形状、すなわち、第１方向ＤＩＲ１における深さの分布は、図５に限るものではなく、他の形状（分布）であってもよいが、上述の理由により、図５の形状（分布）であると、よりよい。 The shapes of the recesses 443B and the recesses 444B, that is, the depth distribution in the first direction DIR1, is not limited to FIG. 5, and may be other shapes (distributions). The shape (distribution) of 5 is better.
　（第４の実施形態）
　本発明の第４の実施形態に係る高周波回路基板について、図を参照して説明する。図６（Ａ）は、第４の実施形態に係る高周波回路基板の構成を示す断面図であり、図６（Ｂ）は、第４の実施形態に係る高周波回路基板の構成を示す平面図である。図６（Ｂ）は、各導体の位置関係および形状が分かるように透視した図である。図７（Ａ）、および、図７（Ｂ）は、第４の実施形態に係る高周波回路基板における基材の各層の平面図である。 (Fourth Embodiment)
The high frequency circuit board according to the fourth embodiment of the present invention will be described with reference to the drawings. FIG. 6A is a cross-sectional view showing the configuration of the high frequency circuit board according to the fourth embodiment, and FIG. 6B is a plan view showing the configuration of the high frequency circuit board according to the fourth embodiment. is there. FIG. 6B is a perspective view so that the positional relationship and shape of each conductor can be understood. 7 (A) and 7 (B) are plan views of each layer of the base material in the high-frequency circuit board according to the fourth embodiment.
　図６（Ａ）、図６（Ｂ）、図７（Ａ）、および、図７（Ｂ）に示すように、第４の実施形態に係る高周波回路基板１０Ｃは、第１の実施形態に係る高周波回路基板１０で実現されるストリップ線路を用いずに、コプレーナ線路を用いる点で異なる。高周波回路基板１０Ｃの他の構成は、高周波回路基板１０と同様であり、同様の箇所の説明は省略する。 As shown in FIGS. 6 (A), 6 (B), 7 (A), and 7 (B), the high frequency circuit board 10C according to the fourth embodiment relates to the first embodiment. The difference is that the coplanar line is used instead of the strip line realized by the high frequency circuit board 10. Other configurations of the high-frequency circuit board 10C are the same as those of the high-frequency circuit board 10, and the description of the same parts will be omitted.
　高周波回路基板１０Ｃは、グランド導体４１およびグランド導体４２を備える。グランド導体４１およびグランド導体４２は、基材２０における信号導体３０と同層に配置されている。第２方向ＤＩＲ２において、グランド導体４１は、信号導体３０よりも側面２０３側に配置されており、信号導体３０から離間している。第２方向ＤＩＲ２において、グランド導体４２は、信号導体３０よりも側面２０４側に配置されており、信号導体３０から離間している。 The high frequency circuit board 10C includes a ground conductor 41 and a ground conductor 42. The ground conductor 41 and the ground conductor 42 are arranged in the same layer as the signal conductor 30 in the base material 20. In the second direction DIR2, the ground conductor 41 is arranged on the side surface 203 side of the signal conductor 30, and is separated from the signal conductor 30. In the second direction DIR2, the ground conductor 42 is arranged on the side surface 204 side of the signal conductor 30 and is separated from the signal conductor 30.
　グランド導体４１の信号導体３０側の側面４１３２は、信号導体３０における側面２０３側の側面に沿っている。グランド導体４１の側面４１３２と信号導体３０における側面２０３側の側面とは、対向している。領域１０１におけるグランド導体４１の側面４１３２と信号導体３０における側面２０３側の側面との離間距離ＣＬ１２１、領域１０２におけるグランド導体４１の側面４１３２と信号導体３０における側面２０３側の側面との離間距離ＣＬ１２２、および、領域１０３におけるグランド導体４１の側面４１３２と信号導体３０における側面２０３側の側面との離間距離ＣＬ１２３は同じである。 The side surface 4132 of the ground conductor 41 on the signal conductor 30 side is along the side surface of the signal conductor 30 on the side surface 203 side. The side surface 4132 of the ground conductor 41 and the side surface of the signal conductor 30 on the side surface 203 side face each other. The separation distance CL121 between the side surface 4132 of the ground conductor 41 in the region 101 and the side surface 203 side of the signal conductor 30, and the separation distance CL122 between the side surface 4132 of the ground conductor 41 in the region 102 and the side surface 203 side of the signal conductor 30. The separation distance CL123 between the side surface 4132 of the ground conductor 41 in the region 103 and the side surface on the side surface 203 side of the signal conductor 30 is the same.
　グランド導体４２の信号導体３０側の側面４２４２は、信号導体３０における側面２０４側の側面に沿っている。グランド導体４２の側面４２４２と信号導体３０における側面２０４側の側面とは、対向している。領域１０１におけるグランド導体４２の側面４２４２と信号導体３０における側面２０４側の側面との離間距離ＣＬ２２１、領域１０２におけるグランド導体４２の側面４２４２と信号導体３０における側面２０４側の側面との離間距離ＣＬ２２２、および、領域１０３におけるグランド導体４２の側面４２４２と信号導体３０における側面２０４側の側面との離間距離ＣＬ２２３は同じである。 The side surface 4242 of the ground conductor 42 on the signal conductor 30 side is along the side surface of the signal conductor 30 on the side surface 204 side. The side surface 4242 of the ground conductor 42 and the side surface of the signal conductor 30 on the side surface 204 side face each other. The separation distance CL221 between the side surface 4242 of the ground conductor 42 in the region 101 and the side surface 204 side of the signal conductor 30, the separation distance CL222 between the side surface 4242 of the ground conductor 42 in the region 102 and the side surface 204 side surface of the signal conductor 30. The distance CL223 between the side surface 4242 of the ground conductor 42 in the region 103 and the side surface 204 on the side surface of the signal conductor 30 is the same.
　グランド導体４１における領域１０３には、側面２０３側の側面４１３１から凹む凹部４４３を有する。グランド導体４２における領域１０３には、側面２０４側の側面４２４１から凹む凹部４４４を有する。 The region 103 of the ground conductor 41 has a recess 443 recessed from the side surface 4131 on the side surface 203 side. The region 103 of the ground conductor 42 has a recess 444 recessed from the side surface 4241 on the side surface 204 side.
　このような構成によって、高周波回路基板１０Ｃは、折り曲げられる領域である領域１０３と、折り曲げられない領域である領域１０１および領域１０２とで、信号導体３０とグランド導体４１およびグランド導体４２との対向面積および離間距離を同じにできる。これにより、高周波回路基板１０Ｃは、伝送特性の劣化を抑制できる。 With such a configuration, the high-frequency circuit board 10C has a region 103 that is a bendable region and a region 101 and a region 102 that are not bendable, and the area where the signal conductor 30 and the ground conductor 41 and the ground conductor 42 face each other. And the separation distance can be the same. As a result, the high frequency circuit board 10C can suppress deterioration of transmission characteristics.
　また、高周波回路基板１０Ｃは、領域１０３での導体の面積および体積を、領域１０１および領域１０２での導体の面積および体積よりも小さくできる。これにより、高周波回路基板１０Ｃは、領域１０３にて折り曲がれ易く、領域１０１および領域１０２において折り曲がれ難い構造を実現できる。 Further, in the high frequency circuit board 10C, the area and volume of the conductor in the region 103 can be made smaller than the area and volume of the conductor in the regions 101 and 102. As a result, the high-frequency circuit board 10C can easily bend in the region 103, and can realize a structure in which the high-frequency circuit board 10C does not easily bend in the regions 101 and 102.
　したがって、高周波回路基板１０Ｃは、高周波回路基板１０と同様に、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。 Therefore, the high-frequency circuit board 10C can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10.
　（第５の実施形態）
　本発明の第５の実施形態に係る高周波回路基板について、図を参照して説明する。図８は、第５の実施形態に係る高周波回路基板の構成を示す平面図である。図８は、各導体の位置関係および形状が分かるように透視した図である。 (Fifth Embodiment)
The high frequency circuit board according to the fifth embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a plan view showing the configuration of the high frequency circuit board according to the fifth embodiment. FIG. 8 is a perspective view so that the positional relationship and shape of each conductor can be understood.
　図８に示すように、第５の実施形態に係る高周波回路基板１０Ｄは、第４の実施形態に係る高周波回路基板１０Ｃに対して、複数のスリット７１および複数のスリット７２を有する点で異なる。高周波回路基板１０Ｄの他の構成は、高周波回路基板１０Ｃと同様であり、同様の箇所の説明は省略する。 As shown in FIG. 8, the high frequency circuit board 10D according to the fifth embodiment is different from the high frequency circuit board 10C according to the fourth embodiment in that it has a plurality of slits 71 and a plurality of slits 72. Other configurations of the high-frequency circuit board 10D are the same as those of the high-frequency circuit board 10C, and the description of the same parts will be omitted.
　複数のスリット７１および複数のスリット７２は、上述の実施形態に示したスリット７１と同様の構成を有する。複数のスリット７１は、グランド導体４１における領域１０３の部分に形成されている。複数のスリット７２は、グランド導体４２における領域１０３の部分に形成されている。 The plurality of slits 71 and the plurality of slits 72 have the same configuration as the slits 71 shown in the above-described embodiment. The plurality of slits 71 are formed in the portion of the region 103 in the ground conductor 41. The plurality of slits 72 are formed in the portion of the region 103 in the ground conductor 42.
　このような構成によって、高周波回路基板１０Ｄは、高周波回路基板１０Ｃと同様に、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。さらに、高周波回路基板１０Ｄは、凹部とスリットとを両方備えることによって、更なる折り曲げ易さを実現できる。 With such a configuration, the high-frequency circuit board 10D can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10C. Further, the high frequency circuit board 10D can be further easily bent by providing both the recess and the slit.
　（第６の実施形態）
　本発明の第６の実施形態に係る高周波回路基板について、図を参照して説明する。図９は、第６の実施形態に係る高周波回路基板の構成を示す平面図である。図９は、各導体の位置関係および形状が分かるように透視した図である。 (Sixth Embodiment)
The high frequency circuit board according to the sixth embodiment of the present invention will be described with reference to the drawings. FIG. 9 is a plan view showing the configuration of the high frequency circuit board according to the sixth embodiment. FIG. 9 is a perspective view so that the positional relationship and shape of each conductor can be understood.
　図９に示すように、第６の実施形態に係る高周波回路基板１０Ｅは、第５の実施形態に係る高周波回路基板１０Ｄに対して、複数のスリット７１および複数のスリット７２の形状および配置において異なる。高周波回路基板１０Ｅの他の構成は、高周波回路基板１０Ｄと同様であり、同様の箇所の説明は省略する。 As shown in FIG. 9, the high-frequency circuit board 10E according to the sixth embodiment differs from the high-frequency circuit board 10D according to the fifth embodiment in the shape and arrangement of the plurality of slits 71 and the plurality of slits 72. .. Other configurations of the high-frequency circuit board 10E are the same as those of the high-frequency circuit board 10D, and the description of the same parts will be omitted.
　複数のスリット７１は、第１方向ＤＩＲ１において異なる位置に配置されているものを含んでいる。第１方向ＤＩＲ１において異なる位置に配置されている複数のスリット７１は、第１方向ＤＩＲ１において部分的に重なっている（図９のハッチング領域参照）。この構成では、複数のスリット７１が第１方向ＤＩＲ１において部分的に重なっている箇所は、複数のスリット７１が配置される他の箇所に対して、局所的に、導体の面積および体積が小さくなる。したがって、複数のスリット７１が第１方向ＤＩＲ１において部分的に重なっている箇所は、より折り曲げ易い。 The plurality of slits 71 include those arranged at different positions in the first direction DIR1. The plurality of slits 71 arranged at different positions in the first direction DIR1 partially overlap each other in the first direction DIR1 (see the hatched area in FIG. 9). In this configuration, where the plurality of slits 71 partially overlap in the first direction DIR1, the area and volume of the conductor are locally smaller than those at other locations where the plurality of slits 71 are arranged. .. Therefore, the portion where the plurality of slits 71 partially overlap in the first direction DIR1 is easier to bend.
　複数のスリット７２は、第１方向ＤＩＲ１において異なる位置に配置されているものを含んでいる。第１方向ＤＩＲ１において異なる位置に配置されている複数のスリット７２は、第１方向ＤＩＲ１において配置位置が部分的に重なっている（図９のハッチング領域参照）。この構成では、複数のスリット７２が第１方向ＤＩＲ１において部分的に重なっている箇所は、複数のスリット７２が配置される他の箇所に対して、局所的に、導体の面積および体積が小さくなる。したがって、複数のスリット７２が第１方向ＤＩＲ１において部分的に重なっている箇所は、より折り曲げ易い。 The plurality of slits 72 include those arranged at different positions in the first direction DIR1. The plurality of slits 72 arranged at different positions in the first direction DIR1 partially overlap the arrangement positions in the first direction DIR1 (see the hatched area in FIG. 9). In this configuration, where the plurality of slits 72 partially overlap in the first direction DIR1, the area and volume of the conductor are locally smaller than those at other locations where the plurality of slits 72 are arranged. .. Therefore, the portion where the plurality of slits 72 partially overlap in the first direction DIR1 is easier to bend.
　このような構成によって、高周波回路基板１０Ｅは、高周波回路基板１０Ｄと同様に、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。さらに、高周波回路基板１０Ｅは、第１方向ＤＩＲ１における特定位置において局所的に複数のスリット７１および複数のスリット７２の配置数を増加させることで、更なる折り曲げ易さを実現できる。また、高周波回路基板１０Ｅは、第１方向ＤＩＲ１における折り曲げ位置を、より安定させることができる。 With such a configuration, the high-frequency circuit board 10E can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10D. Further, the high frequency circuit board 10E can realize further easiness of bending by locally increasing the number of the plurality of slits 71 and the plurality of slits 72 arranged at a specific position in the first direction DIR1. Further, the high frequency circuit board 10E can make the bending position in the first direction DIR1 more stable.
　（第７の実施形態）
　本発明の第７の実施形態に係る高周波回路基板について、図を参照して説明する。図１０は、第７の実施形態に係る高周波回路基板の構成を示す平面図である。図１０は、各導体の位置関係および形状が分かるように透視した図である。 (7th Embodiment)
The high frequency circuit board according to the seventh embodiment of the present invention will be described with reference to the drawings. FIG. 10 is a plan view showing the configuration of the high frequency circuit board according to the seventh embodiment. FIG. 10 is a perspective view so that the positional relationship and shape of each conductor can be understood.
　図１０に示すように、第７の実施形態に係る高周波回路基板１０Ｆは、第６の実施形態に係る高周波回路基板１０Ｅに対して、凹部４４３および凹部４４４を無くした点で異なる。高周波回路基板１０Ｆの他の構成は、高周波回路基板１０Ｅと同様であり、同様の箇所の説明は省略する。 As shown in FIG. 10, the high-frequency circuit board 10F according to the seventh embodiment is different from the high-frequency circuit board 10E according to the sixth embodiment in that the recess 443 and the recess 444 are eliminated. Other configurations of the high-frequency circuit board 10F are the same as those of the high-frequency circuit board 10E, and the description of the same parts will be omitted.
　高周波回路基板１０Ｆは、領域１０３に凹部を有していない。すなわち、高周波回路基板１０Ｆでは、グランド導体４１は、領域１０１での幅Ｗ４１１、領域１０２での幅Ｗ４１２、および、領域１０３での幅Ｗ４１３Ｆが同じである。また、高周波回路基板１０Ｆでは、グランド導体４２は、領域１０１での幅Ｗ４２１、領域１０２での幅Ｗ４２２、および、領域１０３での幅Ｗ４２３Ｆが同じである。 The high frequency circuit board 10F does not have a recess in the region 103. That is, in the high-frequency circuit board 10F, the ground conductor 41 has the same width W411 in the region 101, width W412 in the region 102, and width W413F in the region 103. Further, in the high frequency circuit board 10F, the ground conductor 42 has the same width W421 in the region 101, width W422 in the region 102, and width W423F in the region 103.
　このような構成によって、高周波回路基板１０Ｆは、高周波回路基板１０Ｅと同様に、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。 With such a configuration, the high-frequency circuit board 10F can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10E.
　（第８の実施形態）
　本発明の第８の実施形態に係る高周波回路基板について、図を参照して説明する。図１１は、第８の実施形態に係る高周波回路基板の構成を示す平面図である。図１１は、各導体の位置関係および形状が分かるように透視した図である。 (8th Embodiment)
The high frequency circuit board according to the eighth embodiment of the present invention will be described with reference to the drawings. FIG. 11 is a plan view showing the configuration of the high frequency circuit board according to the eighth embodiment. FIG. 11 is a perspective view so that the positional relationship and shape of each conductor can be understood.
　図１１に示すように、第８の実施形態に係る高周波回路基板１０Ｇは、第７の実施形態に係る高周波回路基板１０Ｆに対して、複数のスリット７３を有する点で異なる。高周波回路基板１０Ｇの他の構成は、高周波回路基板１０Ｆと同様であり、同様の箇所の説明は省略する。 As shown in FIG. 11, the high-frequency circuit board 10G according to the eighth embodiment is different from the high-frequency circuit board 10F according to the seventh embodiment in that it has a plurality of slits 73. Other configurations of the high-frequency circuit board 10G are the same as those of the high-frequency circuit board 10F, and the description of the same parts will be omitted.
　信号導体３０は、領域１０３に、複数のスリット７３を備える。複数のスリット７３は、信号導体３０に設けられた導体非形成部である。複数のスリット７３は、信号導体３０における側面（第２方向ＤＩＲ２の両端面）から開口しない形状である。 The signal conductor 30 includes a plurality of slits 73 in the region 103. The plurality of slits 73 are conductor non-forming portions provided in the signal conductor 30. The plurality of slits 73 have a shape that does not open from the side surfaces (both end surfaces of the second direction DIR2) of the signal conductor 30.
　このような構成によって、信号導体３０とグランド導体４１およびグランド導体４２との距離、対向面積を変えることなく、信号導体３０における領域１０３の部分での導体の面積および体積を小さくできる。これにより、領域１０３は、さらに曲がり易い。 With such a configuration, the area and volume of the conductor in the region 103 portion of the signal conductor 30 can be reduced without changing the distance and the facing area between the signal conductor 30 and the ground conductor 41 and the ground conductor 42. As a result, the region 103 is more easily bent.
　複数のスリット７３は、第１方向ＤＩＲ１の長さが第２方向ＤＩＲ２の長さよりも大きいことが好ましい。これにより、領域１０３を曲げるときに、第２方向ＤＩＲ２に沿った亀裂が信号導体３０に生じることを抑制できる。 It is preferable that the length of the first direction DIR1 of the plurality of slits 73 is larger than the length of the second direction DIR2. Thereby, when the region 103 is bent, it is possible to prevent the signal conductor 30 from being cracked along the second direction DIR2.
　なお、信号導体３０に形成するスリット７３は、１個であってもよい。そして、複数のスリット７３の内の１個、または、１個のスリット７３は、領域１０３と領域１０１との境界付近に形成されていることが好ましい。これにより、曲げの応力は、スリット７３の位置に加わりやすく、領域１０１への応力を抑制できる。 The number of slits 73 formed in the signal conductor 30 may be one. Then, it is preferable that one of the plurality of slits 73 or one slit 73 is formed near the boundary between the region 103 and the region 101. As a result, the bending stress is likely to be applied to the position of the slit 73, and the stress on the region 101 can be suppressed.
　（第９の実施形態）
　本発明の第９の実施形態に係る高周波回路基板について、図を参照して説明する。図１２（Ａ）、図１２（Ｂ）、および、図１２（Ｃ）は、第９の実施形態に係る高周波回路基板における基材の各層の平面図である。図１３は、第９の実施形態に係る高周波回路基板の構成を示す平面図である。 (9th Embodiment)
The high frequency circuit board according to the ninth embodiment of the present invention will be described with reference to the drawings. 12 (A), 12 (B), and 12 (C) are plan views of each layer of the base material in the high-frequency circuit board according to the ninth embodiment. FIG. 13 is a plan view showing the configuration of the high frequency circuit board according to the ninth embodiment.
　図１２（Ａ）、図１２（Ｂ）、図１２（Ｃ）、および、図１３に示すように、第９の実施形態に係る高周波回路基板１０Ｈは、第１の実施形態に係る高周波回路基板１０のマイクロストリップ線路に対して、ストリップ線路を構成する点で異なる。高周波回路基板１０Ｈの他の構成は、高周波回路基板１０と同様であり、同様の箇所の説明は省略する。 As shown in FIGS. 12A, 12B, 12C, and 13, the high-frequency circuit board 10H according to the ninth embodiment is the high-frequency circuit board according to the first embodiment. It differs from 10 microstrip lines in that it constitutes a strip line. Other configurations of the high-frequency circuit board 10H are the same as those of the high-frequency circuit board 10, and the description of the same parts will be omitted.
　高周波回路基板１０Ｈは、グランド導体４１およびグランド導体４２を備える。グランド導体４１およびグランド導体４２は、第１の実施形態に示したグランド導体４０と同様の形状である。 The high frequency circuit board 10H includes a ground conductor 41 and a ground conductor 42. The ground conductor 41 and the ground conductor 42 have the same shape as the ground conductor 40 shown in the first embodiment.
　具体的には、グランド導体４１は、領域１０３に凹部４４３１および凹部４４４１を有する。凹部４４３１は、グランド導体４１の側面４０３１から第２方向ＤＩＲ２に凹む形状である。凹部４４４１は、グランド導体４１の側面４０４１から第２方向ＤＩＲ２に凹む形状である。これにより、グランド導体４１の領域１０３の幅Ｗ４１３は、グランド導体４１の領域１０１の幅Ｗ４１１および領域１０２の幅Ｗ４１２よりも小さくなる。 Specifically, the ground conductor 41 has a recess 4431 and a recess 4441 in the region 103. The recess 4431 has a shape that is recessed from the side surface 4031 of the ground conductor 41 in the second direction DIR2. The recess 4441 has a shape that is recessed from the side surface 4041 of the ground conductor 41 in the second direction DIR2. As a result, the width W413 of the region 103 of the ground conductor 41 becomes smaller than the width W411 of the region 101 of the ground conductor 41 and the width W412 of the region 102.
　グランド導体４２は、領域１０３に凹部４４３２および凹部４４４２を有する。凹部４４３２は、グランド導体４２の側面４０３２から第２方向ＤＩＲ２に凹む形状である。凹部４４４２は、グランド導体４２の側面４０４２から第２方向ＤＩＲ２に凹む形状である。これにより、グランド導体４２の領域１０３の幅Ｗ４２３は、グランド導体４２の領域１０１の幅Ｗ４２１および領域１０２の幅Ｗ４２２よりも小さくなる。 The ground conductor 42 has a recess 4432 and a recess 4442 in the region 103. The recess 4432 has a shape that is recessed from the side surface 4032 of the ground conductor 42 in the second direction DIR2. The recess 4442 has a shape that is recessed from the side surface 4042 of the ground conductor 42 in the second direction DIR2. As a result, the width W423 of the region 103 of the ground conductor 42 becomes smaller than the width W421 of the region 101 of the ground conductor 42 and the width W422 of the region 102.
　グランド導体４１は、信号導体３０に対して、基材２０の第１主面２０１側に配置されている。グランド導体４２は、信号導体３０に対して、基材２０の第２主面２０２側に配置されている。これにより、グランド導体４１とグランド導体４２とは、第２方向ＤＩＲ２に信号導体３０を挟んで配置されており、信号導体３０に対して一定の面積で対向し、一定の離間距離を有している。 The ground conductor 41 is arranged on the first main surface 201 side of the base material 20 with respect to the signal conductor 30. The ground conductor 42 is arranged on the second main surface 202 side of the base material 20 with respect to the signal conductor 30. As a result, the ground conductor 41 and the ground conductor 42 are arranged so as to sandwich the signal conductor 30 in the second direction DIR2, face the signal conductor 30 in a certain area, and have a certain separation distance. There is.
　このような構成によって、高周波回路基板１０Ｈは、高周波回路基板１０と同様に、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。特に、第２方向ＤＩＲ２、すなわち、厚み方向に、二層のグランド導体４１、４２を備える高周波回路基板１０Ｈは、一層のグランド導体からなる構成よりも曲がり難い。しかしながら、領域１０３に凹部（導体非形成部）を有することによって、高周波回路基板１０Ｈは、領域１０３において曲がり易くなる。 With such a configuration, the high-frequency circuit board 10H can suppress deterioration of transmission characteristics while ensuring ease of bending, similarly to the high-frequency circuit board 10. In particular, the second-direction DIR2, that is, the high-frequency circuit board 10H provided with the two- layer ground conductors 41 and 42 in the thickness direction is more difficult to bend than the configuration composed of the single-layer ground conductors. However, by having the concave portion (conductor non-forming portion) in the region 103, the high frequency circuit board 10H is easily bent in the region 103.
　また、図１２（Ａ）、図１２（Ｂ）、図１２（Ｃ）、および、図１３に示す高周波回路基板１０Ｈの構成では、グランド導体４１の凹部４４３１とグランド導体４２の凹部４４３２との形状が同じであり、重なっている。同様に、グランド導体４１の凹部４４４１とグランド導体４２の凹部４４４２との形状が同じであり、重なっている。これにより、ストリップ線路の電磁界分布のバランスが安定する。 Further, in the configuration of the high frequency circuit board 10H shown in FIGS. 12A, 12B, 12C, and 13, the shape of the recess 4431 of the ground conductor 41 and the recess 4432 of the ground conductor 42 Are the same and overlap. Similarly, the recess 4441 of the ground conductor 41 and the recess 4442 of the ground conductor 42 have the same shape and overlap. This stabilizes the balance of the electromagnetic field distribution of the strip line.
　なお、グランド導体４１の凹部４４３１とグランド導体４２の凹部４４３２との形状が同じでなく、グランド導体４１の凹部４４４１とグランド導体４２の凹部４４４２との形状が同じでなくても、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。 Even if the shape of the recess 4431 of the ground conductor 41 and the recess 4432 of the ground conductor 42 are not the same, and the shape of the recess 4441 of the ground conductor 41 and the recess 4442 of the ground conductor 42 are not the same, the ease of bending is improved. While ensuring, deterioration of transmission characteristics can be suppressed.
　（第１０の実施形態）
　本発明の第１０の実施形態に係る高周波回路基板について、図を参照して説明する。図１４（Ａ）、図１４（Ｂ）、および、図１４（Ｃ）は、第１０の実施形態に係る高周波回路基板の第１態様における基材の各層の平面図である。図１５（Ａ）、図１５（Ｂ）、および、図１５（Ｃ）は、第１０の実施形態に係る高周波回路基板の第２態様における基材の各層の平面図である。 (10th Embodiment)
The high frequency circuit board according to the tenth embodiment of the present invention will be described with reference to the drawings. 14 (A), 14 (B), and 14 (C) are plan views of each layer of the base material in the first aspect of the high frequency circuit board according to the tenth embodiment. 15 (A), 15 (B), and 15 (C) are plan views of each layer of the base material in the second aspect of the high frequency circuit board according to the tenth embodiment.
　図１４（Ａ）、図１４（Ｂ）、および、図１４（Ｃ）に示すように、第１０の実施形態に係る高周波回路基板１０Ｉ１は、第９の実施形態に係る高周波回路基板１０Ｈに対して、グランド導体４２に凹部を有さない点で異なる。高周波回路基板１０Ｉ１の他の構成は、高周波回路基板１０Ｈと同様であり、同様の箇所の説明は省略する。 As shown in FIGS. 14 (A), 14 (B), and 14 (C), the high-frequency circuit board 10I1 according to the tenth embodiment is based on the high-frequency circuit board 10H according to the ninth embodiment. The difference is that the ground conductor 42 does not have a recess. The other configuration of the high-frequency circuit board 10I1 is the same as that of the high-frequency circuit board 10H, and the description of the same parts will be omitted.
　高周波回路基板１０Ｉ１は、グランド導体４２の領域１０３に、凹部、すなわち、導体非形成部を有さない。このような構成であっても、グランド導体４１の領域１０３に凹部４４３１、４４４１が形成されていることによって、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。また、この構成では、例えば、上述の図３に示すように回路部材９０に装着する場合、電子機器１の最も外側にグランド導体４２が配置されるので、外部に対する不要な電磁界結合を、効果的に抑制できる。 The high frequency circuit board 10I1 does not have a recess, that is, a non-conductor forming portion in the region 103 of the ground conductor 42. Even with such a configuration, since the recesses 4431 and 4441 are formed in the region 103 of the ground conductor 41, deterioration of transmission characteristics can be suppressed while ensuring ease of bending. Further, in this configuration, for example, when mounted on the circuit member 90 as shown in FIG. 3 described above, since the ground conductor 42 is arranged on the outermost side of the electronic device 1, unnecessary electromagnetic field coupling to the outside is effective. Can be suppressed.
　図１５（Ａ）、図１５（Ｂ）、および、図１５（Ｃ）に示すように、第１０の実施形態に係る高周波回路基板１０Ｉ２は、第９の実施形態に係る高周波回路基板１０Ｈに対して、グランド導体４１に凹部を有さない点で異なる。高周波回路基板１０Ｉ２の他の構成は、高周波回路基板１０Ｈと同様であり、同様の箇所の説明は省略する。 As shown in FIGS. 15 (A), 15 (B), and 15 (C), the high-frequency circuit board 10I2 according to the tenth embodiment is based on the high-frequency circuit board 10H according to the ninth embodiment. The difference is that the ground conductor 41 does not have a recess. Other configurations of the high-frequency circuit board 10I2 are the same as those of the high-frequency circuit board 10H, and the description of the same parts will be omitted.
　高周波回路基板１０Ｉ２は、グランド導体４１の領域１０３に、凹部、すなわち、導体非形成部を有さない。このような構成であっても、グランド導体４２の領域１０３に凹部４４３２、４４４２が形成されていることによって、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。また、この構成では、例えば、上述の図３に示すように回路部材９０に装着する場合、回路部材９０と高周波回路基板１０Ｉ２との間にグランド導体４１が配置されるので、回路部材９０と高周波回路基板１０Ｉ２との不要な電磁界結合を、効果的に抑制できる。 The high frequency circuit board 10I2 does not have a recess, that is, a non-conductor forming portion in the region 103 of the ground conductor 41. Even with such a configuration, since the recesses 4432 and 4442 are formed in the region 103 of the ground conductor 42, deterioration of transmission characteristics can be suppressed while ensuring ease of bending. Further, in this configuration, for example, when mounted on the circuit member 90 as shown in FIG. 3 described above, the ground conductor 41 is arranged between the circuit member 90 and the high frequency circuit board 10I2, so that the circuit member 90 and the high frequency are generated. Unnecessary electromagnetic field coupling with the circuit board 10I2 can be effectively suppressed.
　（第１１の実施形態）
　本発明の第１１の実施形態に係る高周波回路基板について、図を参照して説明する。図１６は、第１１の実施形態に係る高周波回路基板の構成を示す平面図である。 (11th Embodiment)
The high frequency circuit board according to the eleventh embodiment of the present invention will be described with reference to the drawings. FIG. 16 is a plan view showing the configuration of the high frequency circuit board according to the eleventh embodiment.
　図１６に示すように、第１１の実施形態に係る高周波回路基板１０Ｊは、第７の実施形態に係る高周波回路基板１０Ｆに対して、信号導体３１、信号導体３２、グランド導体４１、グランド導体４２、および、グランド導体４３を備える点で異なる。高周波回路基板１０Ｊの他の構成は、高周波回路基板１０Ｆと同様であり、同様の箇所の説明は省略する。 As shown in FIG. 16, the high-frequency circuit board 10J according to the eleventh embodiment has a signal conductor 31, a signal conductor 32, a ground conductor 41, and a ground conductor 42 with respect to the high-frequency circuit board 10F according to the seventh embodiment. , And a ground conductor 43 is provided. Other configurations of the high-frequency circuit board 10J are the same as those of the high-frequency circuit board 10F, and the description of the same parts will be omitted.
　高周波回路基板１０Ｊは、信号導体３１、信号導体３２、グランド導体４１、グランド導体４２、および、グランド導体４３を備える。第２方向ＤＩＲ２に沿って、側面２０３側から、グランド導体４３、信号導体３２、グランド導体４１、信号導体３１、グランド導体４２の順に並んでいる。 The high frequency circuit board 10J includes a signal conductor 31, a signal conductor 32, a ground conductor 41, a ground conductor 42, and a ground conductor 43. Along the second direction DIR2, the ground conductor 43, the signal conductor 32, the ground conductor 41, the signal conductor 31, and the ground conductor 42 are arranged in this order from the side surface 203 side.
　信号導体３１におけるグランド導体４１側の側面とグランド導体４１における信号導体３１側の側面４１３２との距離は、領域１０１、領域１０２、領域１０３で同じである。信号導体３１のグランド導体４２側の側面とグランド導体４２の信号導体３１側の側面４２４２との距離は、領域１０１、領域１０２、領域１０３で同じである。 The distance between the side surface of the signal conductor 31 on the ground conductor 41 side and the side surface 4132 of the ground conductor 41 on the signal conductor 31 side is the same in the area 101, the area 102, and the area 103. The distance between the side surface of the signal conductor 31 on the ground conductor 42 side and the side surface 4242 of the ground conductor 42 on the signal conductor 31 side is the same in the regions 101, 102, and 103.
　信号導体３２におけるグランド導体４１側の側面とグランド導体４１における信号導体３２側の側面４１３１との距離は、領域１０１、領域１０２、領域１０３で同じである。信号導体３２のグランド導体４３側の側面とグランド導体４３の信号導体３２側の側面４３３２との距離は、領域１０１、領域１０２、領域１０３で同じである。 The distance between the side surface of the signal conductor 32 on the ground conductor 41 side and the side surface 4131 of the ground conductor 41 on the signal conductor 32 side is the same in the area 101, the area 102, and the area 103. The distance between the side surface of the signal conductor 32 on the ground conductor 43 side and the side surface of the ground conductor 43 on the signal conductor 32 side is the same in the region 101, the region 102, and the region 103.
　グランド導体４１における領域１０３には、複数のスリット７１が形成されている。グランド導体４２における領域１０３には、複数のスリット７２が形成されている。グランド導体４３における領域１０３には、複数のスリット７３が形成されている。 A plurality of slits 71 are formed in the region 103 of the ground conductor 41. A plurality of slits 72 are formed in the region 103 of the ground conductor 42. A plurality of slits 73 are formed in the region 103 of the ground conductor 43.
　このような構成によって、多芯線路を備える高周波回路基板１０Ｊは、上述の各実施形態の高周波回路基板と同様に、折り曲げ易さを確保しながら、伝送特性の劣化を抑制できる。特に、図１６に示すように、信号導体の延びる方向の直交する方向に、複数の線路導体が並ぶ場合、回路基板の幅方向（信号導体の延びる方向の直交する方向）の寸法は大きくなり易い。このような形状であっても、上述の構成を備えることによって、折り曲げ易さを確保でき、より有効である。 With such a configuration, the high-frequency circuit board 10J provided with the multi-core line can suppress deterioration of transmission characteristics while ensuring ease of bending, as in the case of the high-frequency circuit board of each of the above-described embodiments. In particular, as shown in FIG. 16, when a plurality of line conductors are arranged in a direction orthogonal to the extending direction of the signal conductor, the dimension in the width direction of the circuit board (the direction orthogonal to the extending direction of the signal conductor) tends to be large. .. Even with such a shape, it is more effective because the ease of bending can be ensured by providing the above-mentioned configuration.
　なお、上述の説明では、領域１０２側の具体的な構成例を示していないが、領域１０２側には、アンテナ回路、フィルタ回路等、所定機能を有する回路が形成されていてもよく、領域１０１、領域１０３とともに、伝送線路のみが形成されていてもよい。 Although the above description does not show a specific configuration example on the region 102 side, a circuit having a predetermined function such as an antenna circuit or a filter circuit may be formed on the region 102 side, and the region 101 may be formed. , Only the transmission line may be formed together with the region 103.
　また、上述の各実施形態では、領域１０１と領域１０３との境界、および、領域１０２と領域１０３との境界を、第１方向ＤＩＲ１の特定の一点に示す態様を示した。しかしながら、境界は、第１方向ＤＩＲ１において幅を有していてもよく、第２方向ＤＩＲ２に厳密に平行でなくてもよい。 Further, in each of the above-described embodiments, the embodiment showing the boundary between the area 101 and the area 103 and the boundary between the area 102 and the area 103 at a specific point in the first direction DIR1 is shown. However, the boundary may have a width in the first direction DIR1 and may not be exactly parallel to the second direction DIR2.
　また、上述の各実施形態の構成は、適宜組み合わせることができ、組み合わせに応じた作用効果を奏することができる。 Further, the configurations of the above-described embodiments can be combined as appropriate, and the action and effect can be achieved according to the combination.
１：電子機器
１０、１０Ａ、１０Ｂ、１０Ｃ、１０Ｄ、１０Ｅ、１０Ｆ、１０Ｇ、１０Ｈ、１０Ｉ１、１０Ｉ２、１０Ｊ：高周波回路基板
２０：基材
２０Ｅ１：端面
２１、２２、２３：絶縁体層
３０、３１、３２：信号導体
４０、４１、４２、４３：グランド導体
５０：端子導体
７１、７２、７３：スリット
９０：回路部材
９０Ｅ１：端面
９１：ランド導体
１０１、１０２、１０３：領域
２０１：第１主面
２０２：第２主面
２０３、２０４：側面
３００、３０１、３０２：層間接続導体
４０３、４０４：端辺
４４３、４４３Ｂ、４４４、４４４Ｂ、４４３１、４４３２、４４４１、４４４２：凹部
６０１、６０２：グランド端子導体
９０１：第１主面
９０２：第２主面
９２１、９２２：ランド導体
９９９：接着部材
３０１１、３０２２：層間接続用補助導体
４０３１、４０３２、４０４１、４０４２、４１３１、４１３２、４２４１、４２４２、４３３２：側面 1: Electronic equipment 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I1, 10I2, 10J: High frequency circuit board 20: Base material 20E 1: End faces 21, 22, 23: Insulator layers 30, 31 , 32: Signal conductors 40, 41, 42, 43: Ground conductor 50: Terminal conductors 71, 72, 73: Slit 90: Circuit member 90E1: End face 91: Land conductor 101, 102, 103: Region 201: First main surface 202: 2nd main surface 203, 204: side surface 300, 301, 302: interlayer connection conductor 403, 404: end side 443, 443B, 444, 444B, 4431, 4432, 4441, 4442: recess 601, 602: ground terminal conductor 901: First main surface 902: Second main surface 921, 922: Land conductor 999: Adhesive member 3011, 3022: Auxiliary conductor for interlayer connection 4031, 4032, 4041, 4042, 4131, 4132, 4241, 4242, 4332: Side surface

Claims (24)

  1. 　可撓性を有し、絶縁性の材料を含む基材と、
    　前記基材に配置され、伝送線路の延びる方向である第１方向に延びる線状の信号導体と、
    　前記基材に配置され、前記第１方向に沿って、前記信号導体に対向する面を有するグランド導体と、
    　を備え、
    　前記信号導体と前記グランド導体と前記基材とを含んで、高周波信号の前記伝送線路が形成されており、
    　前記伝送線路は、前記第１方向において、隣接する第１領域と第２領域とを有し、
    　前記第１領域と前記第２領域とにおいて、前記信号導体と前記グランド導体とは、一定の距離で対向し、
    　前記第２領域における前記グランド導体は、前記信号導体と前記グランド導体とが並ぶ前記基材の厚み方向において、前記信号導体に対向しない位置に、導体が形成されていない導体非形成部を有する、
    　高周波回路基板。     With a base material that is flexible and contains an insulating material,
    A linear signal conductor arranged on the base material and extending in the first direction, which is the direction in which the transmission line extends,
    A ground conductor arranged on the base material and having a surface facing the signal conductor along the first direction.
    With
    The transmission line for high-frequency signals is formed by including the signal conductor, the ground conductor, and the base material.
    The transmission line has a first region and a second region adjacent to each other in the first direction.
    In the first region and the second region, the signal conductor and the ground conductor face each other at a constant distance.
    The ground conductor in the second region has a conductor non-forming portion in which no conductor is formed at a position not facing the signal conductor in the thickness direction of the base material in which the signal conductor and the ground conductor are lined up.
    High frequency circuit board.
  2. 　前記第２領域は、折れ曲がっている領域である、
    　請求項１に記載の高周波回路基板。     The second region is a bent region,
    The high frequency circuit board according to claim 1.
  3. 　前記第２領域は、塑性変形によって折り曲げられている、
    　請求項２に記載の高周波回路基板。     The second region is bent by plastic deformation.
    The high frequency circuit board according to claim 2.
  4. 　前記導体非形成部は、
    　前記第１方向の長さが、前記第１方向に直交する第２方向の長さよりも大きい、
    　請求項１乃至請求項３のいずれかに記載の高周波回路基板。     The non-conductor forming portion is
    The length in the first direction is larger than the length in the second direction orthogonal to the first direction.
    The high frequency circuit board according to any one of claims 1 to 3.
  5. 　前記導体非形成部は、角部を有さない形状である、
    　請求項１乃至請求項４のいずれかに記載の高周波回路基板。     The non-conductor forming portion has a shape having no corners.
    The high frequency circuit board according to any one of claims 1 to 4.
  6. 　前記導体非形成部は、前記第２領域における前記グランド導体の前記第１方向に直交する第２方向の長さを、前記第１領域における前記グランド導体の前記第２方向の長さよりも短くすることで形成される、
    　請求項１乃至請求項５のいずれかに記載の高周波回路基板。     The non-conductor forming portion makes the length of the ground conductor in the second region orthogonal to the first direction shorter than the length of the ground conductor in the first region in the second direction. Formed by
    The high frequency circuit board according to any one of claims 1 to 5.
  7. 　前記第２領域における前記グランド導体の前記第２方向の最短の長さは、前記信号導体と前記グランド導体との対向距離以上、前記対向距離の約３倍以下である、
    　請求項６に記載の高周波回路基板。     The shortest length of the ground conductor in the second region in the second direction is equal to or greater than the facing distance between the signal conductor and the ground conductor, and is approximately three times or less the facing distance.
    The high frequency circuit board according to claim 6.
  8. 　前記第２領域の前記グランド導体の形状は、前記第２領域における前記第1方向の中心を基準にして、前記第1方向の両側で非対称である、
    　請求項５乃至請求項７のいずれかに記載の高周波回路基板。     The shape of the ground conductor in the second region is asymmetric on both sides of the first direction with respect to the center of the first direction in the second region.
    The high frequency circuit board according to any one of claims 5 to 7.
  9. 　前記導体非形成部は、前記第２領域における前記グランド導体に形成された、スリットを含む、
    　請求項１乃至請求項８のいずれかに記載の高周波回路基板。     The non-conductor forming portion includes a slit formed on the ground conductor in the second region.
    The high frequency circuit board according to any one of claims 1 to 8.
  10. 　前記スリットの前記第１方向の長さは、前記高周波信号の波長の１／４未満である、
    　請求項９に記載の高周波回路基板。     The length of the slit in the first direction is less than 1/4 of the wavelength of the high frequency signal.
    The high frequency circuit board according to claim 9.
  11. 　前記スリットは、複数である、
    　請求項９または請求項１０に記載の高周波回路基板。     There are a plurality of the slits.
    The high frequency circuit board according to claim 9 or 10.
  12. 　前記複数のスリットの前記第１方向における配置位置は、異なっており、少なくとも部分的に重なる、
    　請求項１１に記載の高周波回路基板。     The positions of the plurality of slits in the first direction are different and at least partially overlap.
    The high frequency circuit board according to claim 11.
  13. 　前記伝送線路は、コプレーナ線路である、
    　請求項１乃至請求項１２のいずれかに記載の高周波回路基板。     The transmission line is a coplanar line.
    The high frequency circuit board according to any one of claims 1 to 12.
  14. 　前記伝送線路は、ストリップ線路である、
    　請求項１乃至請求項１２のいずれかに記載の高周波回路基板。     The transmission line is a strip line.
    The high frequency circuit board according to any one of claims 1 to 12.
  15. 　前記グランド導体は、前記信号導体に対して、折り曲げられた形状の外側にある、
    　請求項１乃至請求項１４のいずれかに記載の高周波回路基板。     The ground conductor is outside the bent shape with respect to the signal conductor.
    The high frequency circuit board according to any one of claims 1 to 14.
  16. 　前記グランド導体は、第１グランド導体と、第２グランド導体とを備え、
    　前記第１グランド導体と前記第２グランド導体とは、前記第１方向および前記第２方向に直交する第３方向において、前記信号導体を間におく位置に配置されている、
    　請求項１４に記載の高周波回路基板。     The ground conductor includes a first ground conductor and a second ground conductor.
    The first ground conductor and the second ground conductor are arranged at positions with the signal conductor in between in the first direction and the third direction orthogonal to the second direction.
    The high frequency circuit board according to claim 14.
  17. 　前記第１グランド導体および前記第２グランド導体の少なくとも一方は、前記導体非形成部を有する、
    　請求項１６に記載の高周波回路基板。     At least one of the first ground conductor and the second ground conductor has the non-conductor forming portion.
    The high frequency circuit board according to claim 16.
  18. 　前記第１グランド導体は、折り曲げられた内側に配置され、
    　前記第２グランド導体は、前記折り曲げられた外側に配置され、
    　前記第１グランド導体の面積に対する前記第１グランド導体に対して形成された導体非形成部の面積の比率は、前記第２グランド導体の面積に対する前記第２グランド導体に対して形成された導体非形成部の比率よりも大きい、
    　請求項１７に記載の高周波回路基板。     The first ground conductor is placed inside the bend and
    The second ground conductor is arranged on the bent outer side.
    The ratio of the area of the non-conductor formed portion to the first ground conductor to the area of the first ground conductor is the non-conductor formed to the second ground conductor to the area of the second ground conductor. Greater than the ratio of forming parts,
    The high frequency circuit board according to claim 17.
  19. 　前記第１グランド導体は、折り曲げられた内側に配置され、
    　前記第２グランド導体は、前記折り曲げられた外側に配置され、
    　前記第１グランド導体の面積に対する前記第１グランド導体に対して形成された導体非形成部の面積の比率は、前記第２グランド導体の面積に対する前記第２グランド導体に対して形成された導体非形成部の比率よりも小さい、
    　請求項１７に記載の高周波回路基板。     The first ground conductor is placed inside the bend and
    The second ground conductor is arranged on the bent outer side.
    The ratio of the area of the non-conductor formed portion to the first ground conductor to the area of the first ground conductor is the non-conductor formed to the second ground conductor to the area of the second ground conductor. Less than the ratio of forming parts,
    The high frequency circuit board according to claim 17.
  20. 　前記第１グランド導体に形成された導体非形成部と、前記第２グランド導体に形成された導体非形成部とは、異なる形状である、
    　請求項１６に記載の高周波回路基板。     The non-conductor-formed portion formed on the first ground conductor and the non-formed conductor portion formed on the second ground conductor have different shapes.
    The high frequency circuit board according to claim 16.
  21. 　前記第１領域には、前記基材の厚み方向に延びる層間接続導体を有する、
    　請求項１乃至請求項２０のいずれかに記載の高周波回路基板。     The first region has an interlayer connecting conductor extending in the thickness direction of the base material.
    The high frequency circuit board according to any one of claims 1 to 20.
  22. 　前記基材の前記第１方向に直交する第２方向の長さは、前記折り曲げ部の第１方向の長さがよりも大きい、
    　請求項１乃至請求項２１のいずれかに記載の高周波回路基板。     The length of the base material in the second direction orthogonal to the first direction is larger than the length of the bent portion in the first direction.
    The high frequency circuit board according to any one of claims 1 to 21.
  23. 　前記信号導体は、複数であり、
    　前記複数の信号導体は、前記基材の前記第１方向に直交する第２方向に間隔を空けて配置されている、
    　請求項１乃至請求項２２のいずれかに記載の高周波回路基板。     There are a plurality of the signal conductors,
    The plurality of signal conductors are arranged at intervals in a second direction orthogonal to the first direction of the base material.
    The high frequency circuit board according to any one of claims 1 to 22.
  24. 　請求項１乃至請求項２３のいずれかに記載の高周波回路基板と、
    　前記高周波回路基板に対して電気的且つ物理的に接続する他の回路部材と、
    　を備え、
    　前記高周波回路基板の前記第２領域は、前記他の回路部材の形状に応じて曲がる形状であり、
    　前記第１領域は、前記他の回路部材に実装されている、
    　電子機器。     The high-frequency circuit board according to any one of claims 1 to 23,
    With other circuit members that are electrically and physically connected to the high frequency circuit board,
    With
    The second region of the high-frequency circuit board has a shape that bends according to the shape of the other circuit member.
    The first region is mounted on the other circuit member.
    Electronics.
PCT/JP2020/044967 2019-12-06 2020-12-03 High-frequency circuit board and electronic apparatus WO2021112160A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146767A (en) * 1984-08-13 1986-03-07 Nissan Motor Co Ltd Steering gear for four-wheel steering car
JP2000091801A (en) * 1998-09-10 2000-03-31 Toshiba Corp Connection line substrate
JP2014086655A (en) * 2012-10-26 2014-05-12 Murata Mfg Co Ltd Flexible substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146767A (en) * 1984-08-13 1986-03-07 Nissan Motor Co Ltd Steering gear for four-wheel steering car
JP2000091801A (en) * 1998-09-10 2000-03-31 Toshiba Corp Connection line substrate
JP2014086655A (en) * 2012-10-26 2014-05-12 Murata Mfg Co Ltd Flexible substrate

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