WO2021110297A1 - Dispositif d'éclairage de pièce, procédé de modification associé et procédé de mesure de la surface de la pièce - Google Patents

Dispositif d'éclairage de pièce, procédé de modification associé et procédé de mesure de la surface de la pièce Download PDF

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Publication number
WO2021110297A1
WO2021110297A1 PCT/EP2020/075736 EP2020075736W WO2021110297A1 WO 2021110297 A1 WO2021110297 A1 WO 2021110297A1 EP 2020075736 W EP2020075736 W EP 2020075736W WO 2021110297 A1 WO2021110297 A1 WO 2021110297A1
Authority
WO
WIPO (PCT)
Prior art keywords
diffraction
plane
workpiece
grating
parallel plates
Prior art date
Application number
PCT/EP2020/075736
Other languages
German (de)
English (en)
Inventor
Peter Simon
Original Assignee
Institut Für Nanophotonik Göttingen E.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut Für Nanophotonik Göttingen E.V. filed Critical Institut Für Nanophotonik Göttingen E.V.
Publication of WO2021110297A1 publication Critical patent/WO2021110297A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift

Definitions

  • the invention relates to a device for illuminating a workpiece with an interference pattern, comprising a two-grating interferometer, which has two diffraction grids aligned perpendicular to its optical axis and arranged at a distance from one another, namely an input-side and an output-side diffraction grating, for generating along different beam paths Diffraction rays that run in a common diffraction plane and interfere with each other in an interference pattern plane are caused by diffraction of an input beam in the diffraction grating on the input side and renewed diffraction of the diffraction rays resulting on the diffraction grating on the output side, with tilt axes aligned in mirror-symmetrical positions in the beam paths of the diffraction beams of the same type, in order to be mirror-symmetrical, tilting axes that are synchronized perpendicular to the diffraction grating Beam modification elements are arranged.
  • the invention further relates to a method for modifying a workpiece by means of a two-grating interferometer with an input-side and an output-side diffraction grating, comprising the steps:
  • the invention finally relates to a method for measuring a workpiece surface by means of a two-grating interferometer with an input-side and an output-side diffraction grating, comprising the steps:
  • a two-grating interferometer for illuminating a workpiece with an interference pattern and - with a suitable setting of the fluence of the interference pattern - for corresponding modification of the workpiece, in particular its surface, is known.
  • a two-grating interferometer consists essentially of two parallel diffraction gratings which are spaced apart from one another and whose identically aligned grating lines are in a period ratio to one another known to the person skilled in the art and generally described in the aforementioned publication.
  • An input beam impinging on the diffraction grating on the input side is diffracted into partial beams of different diffraction orders, each with a positive and negative sign.
  • the two partial beams with different signs of a selected diffraction order diverge along diverging beam paths within a common plane, referred to here as the diffraction plane. So they hit the second diffraction grating, where they again experience diffraction in partial beams of different diffraction orders, each with a positive and a negative sign.
  • the interference pattern plane In a region of this plane, referred to here as the interference pattern plane, which is dependent on the beam width, an interference pattern arises with a periodic distribution of intensity maxima and minima. A workpiece lying in this interference pattern plane is illuminated accordingly. If the fluence of the interference pattern in the areas of its intensity maxima is above a material modification threshold of the workpiece material and if the fluence of the interference pattern in the areas of its intensity minima is below said material modification threshold, a correspondingly patterned modification of the workpiece takes place in the interference pattern plane, which in this context is then referred to as the processing plane can be.
  • the material modification achieved can consist, for example, in an ablation.
  • the workpiece surface is typically divided into the interference pattern or
  • Machining plane placed In the case of transparent materials, however, it is also possible to place a deeper area of the workpiece at a finite distance from the workpiece surface in the interference pattern or processing plane. In these cases, the modification is often associated with a change in the refractive index of the material, for example due to a radiation-induced chemical reaction.
  • the workpiece to be modified is a light guide, in the core area of which a so-called Bragg grating is inscribed should.
  • the document mentioned suggests using a mirror-symmetrical pair of transparent prisms behind the diffraction grating on the output side, each around a tilt axis that is perpendicular to the diffraction plane stands, are tiltable. Due to the influence of these prisms, the periodicity of the interference pattern generated in the interference pattern plane changes as a function of the specifically selected tilt angle of the prisms.
  • the input beam can be swiveled according to the fiber orientation.
  • a special feature of the two-grating interferometer is that the pattern formation and the position of the interference pattern plane are independent of the angle of incidence of the input beam.
  • a problem that cannot be solved with the generic device arises when - regardless of the question of a varying periodicity of the interference pattern - no essentially one-dimensional workpiece, such as said light guide, but an extended workpiece surface is to be provided with the interference pattern.
  • the patterning of the large surface area can be achieved by corresponding two-dimensional pivoting of the input beam.
  • the interference pattern is mapped in different surface areas above, below or (as optimally provided) exactly on the workpiece surface.
  • the position of the interference pattern plane ie that plane in which the geometric intersection of the overlapping diffraction rays lies, relative to the workpiece surface is initially unknown.
  • the diffraction rays reflected back through the second and first diffraction grating along the reversed beam paths from the workpiece surface are then imaged with an image detector, the optics of the image detector being set so that the workpiece surface lies in its depth of field.
  • the recorded image then shows two sharply mapped points, namely the two points of incidence of the diffraction rays on the workpiece surface, the lateral distance of which is directly dependent on the absolute value of the distance between the workpiece surface and the geometric intersection of the diffraction rays.
  • the latter can lie above or below the workpiece surface (whereby it is possible, especially in the second case and in the case of non-transparent workpiece material, that it is not implemented as a real ray intersection at all). Variation of the vertical distance by mechanical lifting or lowering of the workpiece leads to a variation of the lateral distance between the depicted points. If the vertical distance is small, the depicted points merge into a single one. However, it is very difficult to determine the shape of this single depicted point so precisely that the exact superimposition of the points of impact - corresponding to the coincidence of the geometric intersection point and workpiece surface - can be determined with sufficient accuracy. It is therefore customary to adjust the vertical distance, which results in two separately mapped points, the centers of which can be precisely determined by intensity measurements.
  • the vertical distance is then varied by known, vertical, mechanical displacement of the workpiece. From the resulting lateral movement of the imaged points, knowing the geometry of the apparatus, the absolute value (in particular from the lateral point spacing) and the sign (in particular from the direction of movement) of the perpendicular distance between the geometric intersection of the diffraction rays and the workpiece surface are calculated.
  • a major weak point of this approach is the insufficient speed of the mechanical workpiece adjustment.
  • the beam modification elements are designed as plane-parallel plates, the tilting of which sets a predetermined distance between the respectively illuminated area of the processing plane on the one hand and the workpiece surface on the other. In particular, this distance can be “zero”.
  • this distance can be “zero”.
  • the object is further achieved in connection with the features of the preamble of claim 11 in that said variation of the perpendicular distance between the workpiece surface and the geometric intersection of the diffraction beams takes place by mirror-symmetrical and synchronized plane-parallel plates arranged at mirror-symmetrical positions in the beam paths of the diffraction beams about tilt axes aligned perpendicular to the diffraction plane.
  • the plane-parallel plates which in their basic position are perpendicular to the respective beam path in which they are introduced, cause a parallel offset of the respective beam when tilted from this basic position.
  • the diffraction rays run in a diamond shape, ie they diverge between the input-side and the output-side diffraction grating and between the diffraction grating on the output side and the interference pattern plane again towards one another.
  • the respective diffraction angles are predetermined by the properties of the respective diffraction grating. These angles therefore remain unchanged regardless of the tilted position of the plane-parallel plates.
  • the parallel offset of the beams in the area between the diffraction gratings and / or behind the diffraction grating on the output side leads to a migration of the intersection of the diffraction beams in the Z direction, ie in the direction of the optical axis of the two-grating interferometer.
  • the intersection of the rays defines the interference pattern plane in which said ray intersection lies and which in turn is perpendicular to the optical axis of the interferometer.
  • the interference pattern forms in the illuminated area of this plane.
  • the interference pattern plane corresponds to the machining plane of the workpiece. If a curved surface, e.g. the curved workpiece surface, is to be processed over a large area, the "drifting" of the desired processing plane that occurs when the workpiece is scanned from the interference pattern plane specified by the interferometer can be compensated for by tilting this interference pattern plane accordingly by tilting the plane-parallel plates and thus making changes the parallel offset of the diffraction beams is tracked so that it coincides exactly with the desired processing plane at least in the respectively illuminated area.
  • a workpiece can be covered with a continuous pattern projection of uniform periodicity along a curved machining surface, in particular along a curved surface, as was previously only possible in the prior art with exactly flat workpiece surfaces aligned exactly perpendicular to the optical axis.
  • Two first of the plane-parallel plates are preferably arranged in the area between the diffraction gratings. This position is particularly advantageous because the area behind the diffraction grating on the output side, in which the workpiece is arranged, remains free of additional elements, which generally makes handling of the device easier facilitated.
  • the effect according to the invention can also be achieved with first plane-parallel plates arranged behind the diffraction grating on the output side.
  • two second plane-parallel plates are additionally arranged in the area between the diffraction grating on the output side and the interference pattern plane or the processing plane. It is known that ultrashort pulses are characterized by a broad spectrum of wavelengths. However, different wavelengths are diffracted to different degrees at the diffraction gratings, i.e. they strike the plane-parallel plates at different angles of incidence, which leads to wavelength-dependent parallel offsets there.
  • this angular dispersion leads to an undesirable wavelength dependence of the position of the interference pattern plane or, in the case of broadband light, to the formation of a "stack" of interference pattern planes according to wavelengths.
  • this can be compensated for by the aforementioned arrangement of first plane-parallel plates between the diffraction gratings and second plane-parallel plates behind the diffraction grating on the output side.
  • the first and second plane-parallel plates are preferably tilted by the same angle from their respective basic position.
  • this embodiment of the invention also has the advantage of producing a desired total parallel offset or a desired total displacement of the interference pattern plane with thinner plane-parallel plates or with plane-parallel plates of a less refractive material, which is the case with a special choice of the used Radiation source can be helpful.
  • the measurement method explained at the beginning is modified according to the invention in such a way that the variation of the vertical distance between the geometric intersection of the diffraction rays and the workpiece surface is no longer carried out by a slow vertical displacement of the workpiece, but by the vertical displacement of said intersection point by means of the tilting of the plane-parallel plates explained in detail above. In this way, the workpiece surface can be measured much faster than before.
  • Figure 1 a schematic representation of a first embodiment of a lighting device according to the invention
  • FIG. 2 a schematic representation of a second embodiment of a lighting device according to the invention.
  • FIG. 3 a schematic representation of the section area of FIG.
  • FIG. 1 shows in a highly schematic representation the essential parts of the beam path in a two-grating interferometer 10 according to the invention.
  • the interferometer 10 has two diffraction gratings 11, 12, namely an input-side diffraction grating 11 and an output-side diffraction grating 12.
  • the grating lines of the diffraction gratings 11, 12, which are oriented in the same way, are in a period ratio known to the person skilled in the art, as is described in general form in DE 102006032 053 A1.
  • the input beam 20 hits the input side diffraction grating 11 on the input side. In the illustration of FIG Incidence of the input beam 20 on the diffraction grating 11 on the input side is shown. However, the input beam can also be deflected onto the input-side diffraction grating 11 at other angles of incidence by means of pivoting optics (not shown).
  • the input beam 20 is diffracted into partial beams of different diffraction orders.
  • the input beam 20 is diffracted into partial beams of different diffraction orders.
  • the symmetrical diffraction beams 21 of a single, selected diffraction order are shown in FIG.
  • the partial beams of the other diffraction orders can, if they occur at all in a relevant manner, be blocked or deflected.
  • the diffraction beams 21 each strike first plane-parallel plates 31 arranged at mirror-symmetrical positions in a mirror-symmetrical alignment.
  • the plane-parallel plates 31 are each shown in two positions.
  • the respective basic position in which the first plane-parallel plates 31 are exactly perpendicular to the respectively assigned diffraction beam 21 is shown with dashed lines. In this basic position there is no change in the beam path, as indicated by the dotted continuation of the diffraction beams 21 behind the first plane-parallel plates 31.
  • the diffraction beams 21 then fall on the diffraction grating 12 on the output side and are again diffracted there in partial beams of different diffraction orders.
  • a selected diffraction order which depends on the period ratio of the diffraction gratings 11, 12, produces partial beams of the two diffraction beams 21 which intersect in an interference pattern plane 40, are superimposed there and form an interference pattern. If a machining plane of a workpiece lies in this interference pattern plane 40 and the fluence of the diffraction rays 21 is suitably selected, the material of the workpiece can be used in this machining or
  • Interference pattern plane 40 can be modified accordingly. Such a workpiece is not shown in FIG.
  • the first plane-parallel plates 31 can be aligned mirror-symmetrically around perpendicular to the diffraction plane spanned by the diffraction beams 21 (corresponding to the plane of the paper in FIG. 1) Tilt axes are tilted.
  • the first plane-parallel plates 31 located in such a tilted position are shown in FIG. 1 with solid lines.
  • the right one of the first plane-parallel plates 31 is tilted in the clockwise direction and the left one of the first plane-parallel plates is tilted counterclockwise.
  • the parallel offset of the diffraction beams 21 by the first plane-parallel plates 31, which in particular does not imply any change in the angle of the beam path, does not change anything in the previously described renewed diffraction of the diffraction beams 21 at the diffraction grating 12 on the output side Diffraction grating 12 impinge, shifted towards one another compared to the situation with the first plane-parallel plates 31 in the basic position.
  • the Z position of the interference pattern plane 40 and thus the processing plane for a workpiece can be set precisely.
  • the processing plane can track a curved surface of the workpiece or be guided along a curved, predetermined processing surface when the workpiece is scanned by pivoting the input beam 20 in the course of a large-area processing.
  • FIG. 2 shows, in a representation similar to FIG. 1, a further development of the lighting device according to the invention, in addition to the first plane-parallel plates 31 arranged between the diffraction gratings 11, 12, second plane-parallel plates 32 being arranged behind the diffraction grating 12 on the output side.
  • the device of FIG. 2 is particularly suitable for cases in which the input beam 20 is a pulsed laser beam with a short pulse duration.
  • the necessary spectral bandwidth within a laser pulse is greater, the shorter its pulse duration.
  • the wavelength spectrum within the pulse is very broad.
  • the diffraction gratings 11, 12 have a significant angular dispersion, ie a dependence of the diffraction angle on the wavelength of the input beam.
  • components of different wavelengths are thus diffracted at different angles, which is symbolized in FIG. 1 in a greatly exaggerated manner by the double representation of diffraction beams 21, 22 in each case.
  • the diffraction beams 21, 22 are intended to represent the beam paths of the respectively shortest (diffraction beams 22) and respectively longest wavelengths (diffraction beams 21) within the input beam spectrum.
  • the plane-parallel plates 31, 32 are set in such a way that the short-wave diffraction rays 22 impinge perpendicularly in their basic position.
  • FIG. 3 shows, likewise in a highly schematic manner, the intersection area of the diffraction beams 21 when the two-grating interferometer 10 according to the invention is not shown in detail, in which the interference pattern plane 40, in which the geometric intersection 23 of the diffraction beams 21 lies, is around perpendicular distance 61 is arranged above a workpiece surface 50.
  • the interference pattern plane 40 in which the geometric intersection 23 of the diffraction beams 21 lies
  • perpendicular distance 61 is arranged above a workpiece surface 50.
  • the person skilled in the art will also be able to imagine the opposite situation in which the geometric intersection point 23 lies below the workpiece surface 50.
  • the diffraction beams 21 impinge on the workpiece surface 50 at points of incidence 24 laterally spaced from one another. Their lateral spacing 62 changes with the change in vertical spacing 61.
  • this is varied by vertical displacement of geometric intersection point 23 by tilting plane-parallel plates 31, 32 (not shown in FIG. 3).
  • the points of impact 24 are imaged on an image detector and their movement is analyzed as a function of the tilting of the plate.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)

Abstract

L'invention concerne un dispositif d'éclairage d'une pièce ayant un motif d'interférence, comprenant un interféromètre à deux réseaux (10) qui comporte deux réseaux de diffraction espacés l'un de l'autre (11, 12), à savoir un réseau de diffraction côté entrée (11) et un réseau de diffraction côté sortie (12), perpendiculairement alignés avec l'axe optique de l'interféromètre pour générer des faisceaux de diffraction (21, 22) qui s'étendent le long de différents trajets de faisceaux sur un plan de diffraction commun et qui se chevauchent mutuellement sur un plan de motif d'interférence (40) de manière à produire de l'interférence, en diffractant un faisceau d'entrée (21) au niveau du réseau de diffraction côté entrée (11) et en diffractant les faisceaux de diffraction résultants (21, 22) à nouveau au niveau du réseau de diffraction côté sortie (12), des éléments identiques de modification de faisceaux qui peuvent être inclinés autour d'axes d'inclinaison orientés de façon perpendiculaire au plan de diffraction de manière synchronisée et à symétrie spéculaire étant disposés à des positions qui présentent une symétrie spéculaire dans les trajets de faisceaux des faisceaux de diffraction (21, 22). L'invention est caractérisée en ce que les éléments de modification de faisceaux sont réalisés sous la forme de panneaux parallèles plans (31, 32). L'invention concerne en outre un procédé de traitement et de mesure utilisant un tel dispositif d'éclairage.
PCT/EP2020/075736 2019-12-04 2020-09-15 Dispositif d'éclairage de pièce, procédé de modification associé et procédé de mesure de la surface de la pièce WO2021110297A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019133009.2A DE102019133009B4 (de) 2019-12-04 2019-12-04 Vorrichtung zum Beleuchten eines Werkstücks, Verfahren zu dessen Modifizierung und Verfahren zum Vermessen seiner Oberfläche
DEDE102019133009.2 2019-12-04

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WO2021110297A1 true WO2021110297A1 (fr) 2021-06-10

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PCT/EP2020/075736 WO2021110297A1 (fr) 2019-12-04 2020-09-15 Dispositif d'éclairage de pièce, procédé de modification associé et procédé de mesure de la surface de la pièce

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231977A1 (fr) * 1986-02-03 1987-08-12 Koninklijke Philips Electronics N.V. Dispositif de formation d'image comportant un dispositif opto-électronique de détection de l'erreur de focalisation
US6904201B1 (en) 2001-05-09 2005-06-07 Intel Corporation Phase-controlled fiber Bragg gratings and manufacturing methods
DE102006032053A1 (de) 2006-07-10 2008-01-17 Laser-Laboratorium Göttingen eV Oberflächenmodifikationsverfahren und- vorrichtung
US20080206685A1 (en) * 2007-02-22 2008-08-28 Nikon Corporation Exposure method, method for manufacturing flat panel display substrate, and exposure apparatus

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
US5995224A (en) * 1998-01-28 1999-11-30 Zygo Corporation Full-field geometrically-desensitized interferometer employing diffractive and conventional optics
US7561252B2 (en) * 2005-12-29 2009-07-14 Asml Holding N.V. Interferometric lithography system and method used to generate equal path lengths of interfering beams
DE102013007524B4 (de) * 2013-04-22 2021-04-01 Technische Universität Dresden Optische Anordnung zur Ausbildung von Strukturelementen auf Bauteiloberflächen sowie deren Verwendung
DE102015214960B4 (de) * 2015-08-05 2018-03-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Interferenzstrukturierung einer Oberfläche einer flächigen Probe und deren Verwendung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0231977A1 (fr) * 1986-02-03 1987-08-12 Koninklijke Philips Electronics N.V. Dispositif de formation d'image comportant un dispositif opto-électronique de détection de l'erreur de focalisation
US6904201B1 (en) 2001-05-09 2005-06-07 Intel Corporation Phase-controlled fiber Bragg gratings and manufacturing methods
DE102006032053A1 (de) 2006-07-10 2008-01-17 Laser-Laboratorium Göttingen eV Oberflächenmodifikationsverfahren und- vorrichtung
US20080206685A1 (en) * 2007-02-22 2008-08-28 Nikon Corporation Exposure method, method for manufacturing flat panel display substrate, and exposure apparatus

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DE102019133009B4 (de) 2021-11-11

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