WO2021103261A1 - 耳机的出入盒检测方法、电子设备以及耳机组件 - Google Patents

耳机的出入盒检测方法、电子设备以及耳机组件 Download PDF

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Publication number
WO2021103261A1
WO2021103261A1 PCT/CN2019/129524 CN2019129524W WO2021103261A1 WO 2021103261 A1 WO2021103261 A1 WO 2021103261A1 CN 2019129524 W CN2019129524 W CN 2019129524W WO 2021103261 A1 WO2021103261 A1 WO 2021103261A1
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Prior art keywords
earphone
box
capacitance
touch sensor
detecting
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PCT/CN2019/129524
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English (en)
French (fr)
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若文章
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歌尔股份有限公司
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Publication of WO2021103261A1 publication Critical patent/WO2021103261A1/zh
Priority to US17/646,785 priority Critical patent/US20220124429A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1025—Accumulators or arrangements for charging
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00—Monitoring arrangements; Testing arrangements
    • H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups
    • H04R2420/07—Applications of wireless loudspeakers or wireless microphones

Definitions

  • This application relates to the field of intelligent control technology, and in particular to a method for detecting an in-out box of an earphone, an electronic device, and an earphone assembly.
  • TWS Truste Wireless Stereo
  • a corresponding headset box needs to be set to store the headsets.
  • sensor elements on the earphone box such as an infrared sensor, detect the box-out and box-in operation of the TWS earphone, but the infrared sensor is greatly affected by the environment, resulting in inaccurate detection of the box.
  • the main purpose of the present application is to provide a method for detecting an in-out box of an earphone, an electronic device, and an earphone assembly, aiming to improve the accuracy of the in-out box detection.
  • the present application provides a method for detecting the in and out box of earphones.
  • the method for detecting the in and out box of the earphone is applied to the earphone box.
  • the earphone box is provided with a first touch sensor, and the earphone is provided with a second touch sensor.
  • the sensor and the capacitance electrically connected to the second touch sensor, and the method for detecting the in-out box of the earphone includes:
  • the capacitance parameter includes a capacitance value or a capacitance change value
  • the state of the earphone is determined according to the capacitance parameter, and the state includes an out-of-box state or an in-box state.
  • the capacitance parameter includes a capacitance value
  • the step of determining the state of the earphone according to the capacitance parameter includes:
  • the capacitance parameter includes a capacitance change value
  • the step of determining the state of the earphone according to the capacitance parameter includes:
  • the step of determining the state of the earphone according to the capacitance parameter includes:
  • the step of determining the state of the earphone according to the capacitance parameter further includes:
  • the step of detecting the connection information between the earphone and the earphone box includes:
  • request information is sent to the earphone box, and when response information corresponding to the request information is received, it is determined that the earphone is successfully connected to the earphone box, and the earphone box access detection method is applied to the earphone.
  • the step of detecting the connection information between the earphone and the earphone box includes:
  • the level state of the charging electrical contacts in the earphone box is detected, and when it is detected that the level is a preset state, it is determined that the earphone and the earphone box are successfully connected, and the earphone box access detection method is applied to Headphone box
  • detecting the level state of the charging electrical contacts in the earphone and when it is detected that the level is a preset state, it is determined that the earphone is successfully connected to the earphone box, and the method for detecting the in and out of the earphone is applied ⁇ Headphones.
  • the method for detecting the in-out box of the earphone further includes:
  • the Bluetooth connection is disconnected, and the method for detecting the earphone in and out of the box is applied to the earphone.
  • this application also proposes an electronic device that includes a first touch sensor, a memory, a processor, and an earphone that is stored on the memory and can run on the processor.
  • a box detection program the first touch sensor is connected to the processor, the earphone in-out box detection program is executed by the processor as the above-mentioned earphone in-out box detection method, and the electronic device is an earphone or Headphone box.
  • this application also proposes an earphone assembly, the earphone assembly includes an earphone and an earphone box, wherein:
  • the earphone box is provided with a first touch sensor, the earphone is provided with a second touch sensor, the earphone is electrically connected with the second touch sensor, and the earphone box includes a memory, a processor, and a storage device.
  • a first touch sensor is provided on the earphone
  • a second touch sensor is provided in the earphone box
  • a capacitor electrically connected to the second touch sensor is provided in the earphone box
  • the earphone includes a memory
  • the method for detecting the entry and exit of the earphone proposed in this application detects the exit and entry state of the earphone through the capacitance change of the capacitance sensor, and the capacitance change can be generated by the capacitance sensor as long as the coupling is generated.
  • the detection sensitivity is not affected by the environment, and the detection is accurate Degree is high.
  • FIG. 1 is a schematic block diagram of the hardware architecture of an electronic device involved in a method for detecting an in-out box of an earphone according to the present application;
  • FIG. 2 is a schematic flowchart of an exemplary first embodiment of a method for detecting an in-out box of an earphone according to the present application
  • FIG. 3 is a schematic flowchart of an exemplary third embodiment of a method for detecting an in and out box of an earphone according to the present application
  • FIG. 4 is a schematic circuit diagram of an embodiment of the earphone assembly involved in the method for detecting the access box of the earphone according to the present application.
  • FIG. 1 is a structural block diagram of an electronic device involved in a method for detecting an in-out box of an earphone according to the present application.
  • the electronic device involved in the method for detecting the access box of the earphone of the present application may be an earphone or an earphone box.
  • the electronic device includes a first touch sensor 110, a processor 120, a memory 130, and a sampling capacitor 140.
  • the memory 130 stores an operating system and an earphone access box detection program.
  • the processor 120 detects the first touch sensor 110 through the sampling capacitor 140 The capacitance value.
  • the earphone box When the method for detecting the entry and exit of the earphone is applied to the earphone box, the earphone box is provided with a first touch sensor, and the first touch sensor is located on the inner surface of the accommodating cavity where the earphone is placed in the earphone box.
  • the earphone is provided with a second touch sensor and The second touch sensor is electrically connected to the capacitance.
  • the second touch sensor is located on the surface of the earphone; when the earphone in-out box detection method is applied to the earphone, the earphone is provided with a first touch sensor, and the first touch sensor is located on the surface of the earphone and in the earphone box A second touch sensor and a capacitor electrically connected to the second touch sensor are provided, and the second touch sensor is located on the inner surface of the accommodating cavity for accommodating the earphone.
  • the method for detecting the entry and exit of the earphone in the technical solution disclosed in this embodiment can be applied to the earphone or the earphone box to realize the control of the earphone or the earphone box.
  • the capacitance parameter includes a capacitance value or a capacitance change value
  • the state of the earphone is determined according to the capacitance parameter, and the state includes the out-of-box state and the in-box state.
  • FIG. 2 is a schematic flowchart of an exemplary embodiment 1 of a method for detecting an in-out box of an earphone according to the present application.
  • the method for detecting the entry and exit of the earphone is applied to the earphone box.
  • the earphone box is provided with a first touch sensor, and the earphone is provided with a second touch sensor and a capacitor electrically connected to the second touch sensor; or
  • the box detection method is applied to the earphone.
  • the earphone is provided with a first touch sensor, and the earphone box is provided with a second touch sensor and a capacitor electrically connected to the second touch sensor.
  • the earphone box detection method includes:
  • Step S10 acquiring a capacitance parameter of the first touch sensor, where the capacitance parameter includes a capacitance value or a capacitance change value;
  • the MCU in the earphone box detects the capacitance parameters, that is, the first touch sensor is arranged in the earphone box, and the first touch sensor is located in the accommodating cavity of the earphone box.
  • the earphone is provided with a second touch sensor and a capacitor electrically connected to the second touch sensor.
  • the second touch sensor is located on the surface of the earphone.
  • the second sensor Since the second sensor is connected with a capacitor, the capacitance of the first touch sensor increases, and the capacitance of the first touch sensor detected by the MCU in the earphone box increases; and when the earphone is far away from the earphone box, that is, the earphone After the box is out of the box, the coupling effect of the first touch sensor and the second touch sensor disappears, and the capacitance of the first touch sensor is reduced to the original capacitance value, and the capacitance of the first touch sensor detected by the MCU in the earphone box is reduced;
  • the MCU in the earphone detects the capacitance parameters.
  • the earphone is provided with a first touch sensor, the first touch sensor is located on the surface of the earphone, and the earphone box is provided with a second touch sensor and The second touch sensor is electrically connected to the capacitor.
  • the second touch sensor is located on the inner surface of the accommodating cavity of the earphone.
  • the first touch sensor on the earphone is coupled with the second sensor in the earphone box, Since the second sensor is connected with a capacitance, the capacitance of the first touch sensor increases, and the capacitance of the first touch sensor detected by the MCU of the headset increases; and when the headset is far away from the headset box, that is, after the headset comes out of the box, the first touch sensor The coupling effect of the sensor and the second touch sensor disappears, and the capacitance of the first touch sensor is reduced to the original capacitance value, and the capacitance of the first touch sensor detected by the MCU in the headset is reduced.
  • step S20 the state of the earphone is determined according to the capacitance parameter, and the state includes the out-of-box state or the in-box state.
  • the state of the earphone can be determined by detecting the capacitance value or the capacitance change value.
  • the capacitance change value is the absolute value of the difference between the currently detected capacitance value and the initial capacitance value, which will be described in detail below :
  • Step S20 Determine the state of the earphone by the capacitance value, that is, step S20 includes:
  • the first preset capacitance value may be determined according to the capacitance value C0 of the first touch sensor and the capacitance value C1 of the capacitor connected in series with the second touch sensor, that is, the first capacitance value may be C0+C1-K, and K is The constant can be set by the developer according to requirements, and the second preset capacitance value can be determined according to the capacitance value C0 of the first touch sensor, that is, the second preset capacitance value can be C0+H, and H is a constant, which can be determined by the developer according to Demand setting; the first preset capacitance value and the second preset capacitance value can be stored in the earphone box or earphone to determine the state of the earphone.
  • step S20 Determine the state of the earphone by the capacitance change value, that is, step S20 includes:
  • the capacitance change value is the difference between the currently detected capacitance value and the initial capacitance value
  • the capacitance change value can be determined according to the capacitance value C1 of the capacitor connected in series with the second touch sensor, that is, the capacitance change value can be C1-M, and M is a constant that can be set by the developer according to requirements, and M is less than C1; when the earphone is constantly close to the earphone box, Since the first touch sensor and the second touch sensor are coupled, and the second sensor is also connected in series with a capacitor, the capacitance of the first touch sensor detected by the MCU starts to increase from the original C0, that is, when the capacitance value is maximum (the capacitance change value is the same When the maximum), the headset is located in the headset box; similarly, when the headset moves away from the headset box, as the first touch sensor and the second touch sensor keep moving away, the capacitance of the first touch sensor detected by the MCU is continuously reduced. , When the coupling between the first touch sensor and the second touch sensor disappears, the capacitance value of the first touch sensor detected by the MCU is the smallest, that
  • the capacitance change of the capacitance sensor is used to detect the out-of-box and the box-in state of the earphone, and the capacitance change can be generated by the capacitance sensor as long as the coupling is generated.
  • the detection sensitivity is not affected by the environment, and the detection accuracy is high. .
  • the access box detection method of the earphone of the present application further includes:
  • connection information between the earphone and the earphone box can also be further combined to determine whether the earphone is out of the box. That is, the method for detecting the earphone in and out of the box further includes:
  • connection information with the earphone box can be detected through the communication pin:
  • the steps of detecting the connection information between the headset and the headset box include:
  • the request information is sent to the earphone box, and when response information corresponding to the request information is received, it is determined that the earphone and the earphone box are successfully connected, and the method for detecting the in-out box of the earphone is applied to the earphone.
  • the earphone in-out box detection method is applied to the earphone box.
  • the principle applied to the earphone is the same and will not be repeated.
  • the earphone box When the earphone box is turned on, the earphone box sends request information to the earphone.
  • the request information can be a message
  • the response information can be ACK confirmation character.
  • the headset After receiving the message, the headset will check the received message.
  • an ACK confirmation character will be sent to the headset box to indicate that the information has been received correctly, which means that the headset is connected to the headset box Success, if the earphone box sends a message to the earphone, but the ACK confirmation character is not received within the preset time, it is determined that the connection between the earphone and the earphone box has failed.
  • the level state of the charging electrical contacts in the earphone is detected, and when the level is detected as a preset state, it is determined that the earphone is successfully connected to the earphone box, and the method for detecting the in-out box of the earphone is applied to the earphone.
  • the earphone is provided with charging electrical contacts
  • the earphone box is also provided with charging electrical contacts. After the charging electrical contacts of the earphone and the charging electrical contacts in the earphone box are electrically connected, the earphone box can charge the earphones . Generally, when the charging electrical contact of the earphone and the charging electrical contact in the earphone box are not conductive, the charging electrical contact in the earphone box is in a high level state, and the earphone and the earphone box are not connected or the connection fails. Status: After the charging electrical contacts of the earphone and the charging electrical contacts in the earphone box are connected, the charging electrical contacts in the earphone box change to a low-level state.
  • the charging electrical contacts in the earphone box can be detected by To detect whether the headset is successfully connected to the headset box, that is, when the level state is detected as the low level state, it is determined that the headset and the headset box are successfully connected, and when the level state is detected as the high level state , It is determined that the connection between the earphone and the earphone box has failed.
  • the low-level state is also the preset state; it can be understood that the preset state can also be the high-level state, which can be realized only through different circuit forms. The principle of the scheme for detecting the level state of the charging contact of the earphone is the same, and will not be repeated here.
  • connection state of the earphone and the earphone box is combined on the basis of detecting the state of the earphone in and out of the box based on the capacitance to further determine the earphone in and out of the box state, and further improve the accuracy of the earphone in and out of the box state detection.
  • a third embodiment of the method for detecting the access box of the earphone of the present application is proposed.
  • the method for detecting the access box of the earphone further includes:
  • the earphone When the earphone is in the box-in state, the earphone is charged, and the method for detecting the earphone in and out of the box is applied to the earphone box;
  • the Bluetooth connection is disconnected, and the earphone in-box detection method is applied to the earphone.
  • Charging and disconnecting the earphone can be realized through the charging switch.
  • the earphone When the earphone is in the box state, the earphone can be charged by controlling the charging switch to turn on the charging circuit.
  • the charging switch When the earphone is detected in the out-of-box state, the charging switch can be controlled Disconnect the charging circuit; when the headset is in the box state, indicating that the headset is not in use at this time, you can disconnect the Bluetooth connection of the headset to reduce the energy consumption of the headset; similarly, when the headset is detected out of the box, it can be restored The Bluetooth connection of the headset, or, search for the Bluetooth device again to connect.
  • the state of the earphone in and out of the box changes, it is not limited to the above control method.
  • the communication between the earphone box and the earphone can also be carried out, and no specific examples are given here.
  • the technical solution disclosed in this embodiment limits the processing method of the earphone box or the earphone when the earphone is in the box-in state, and improves the intelligence of the earphone box or the earphone.
  • FIG. 4 is a schematic circuit diagram of an embodiment of the earphone assembly involved in the method for detecting the in-out box of earphones according to the present application.
  • the earphone assembly includes an earphone and an earphone box, wherein:
  • the earphone box 10 is provided with a first touch sensor 110, the earphone 20 is provided with a second touch sensor 150, and the earphone 20 is provided with a capacitor 160 electrically connected to the second touch sensor 150.
  • the earphone box 10 includes a first memory 130 and a first processing unit.
  • the in-out box detection program of the earphone 20 is stored on the first memory 130 and can be run on the processor 120.
  • the first touch sensor 110 is connected to the processor 120, and the in-out box detection program of the earphone 20 is executed by the processor 120.
  • the earphone 20 is provided with a first touch sensor 110
  • the earphone box 10 is provided with a second touch sensor 150
  • the earphone box 10 is provided with a capacitor 160 electrically connected to the second touch sensor 150
  • the earphone 20 includes a second memory 130
  • the second processor 120 and the earphone 20 access box detection program stored on the second memory 130 and run on the processor 120
  • the first touch sensor 110 is connected to the second processor 120
  • the earphone 20 access box detection program The program is executed by the processor 120 as the method for detecting the access box of the earphone 20 in the above embodiment.
  • a sampling capacitor 140 is provided in the earphone box 10 to detect the capacitance of the first touch sensor 110.
  • the processor 120 detects the capacitance of the first touch sensor 110 through the sampling capacitor 140, it will collect the capacitance value of the first touch sensor 110. Compare with the first preset capacitance value and the second preset capacitance value; or obtain the absolute value of the difference between the collected capacitance value and the initial capacitance value, and determine the state of the earphone 20 according to the absolute value; it can be deformed according to FIG. 4 ,
  • the first touch sensor and sampling capacitor are set in the earphone, and the second touch sensor is set in the earphone box, which will not be repeated here.
  • the steps of the method or algorithm described in the embodiments disclosed in this document can be directly implemented by hardware, a software module executed by a processor, or a combination of the two.
  • the software module can be placed in random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disks, removable disks, CD-ROMs, or all areas in the technical field. Any other known storage media.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Telephone Function (AREA)

Abstract

本申请公开了一种耳机的出入盒检测方法，应用于耳机盒，耳机盒内设置有第一触摸传感器，耳机上设置有第二触摸传感器以及与第二触摸传感器电连接的电容；或者，应用于耳机，耳机上设置有第一触摸传感器，耳机盒内设置有第二触摸传感器以及第二触摸传感器电连接的电容，耳机的出入盒检测方法包括：获取第一触摸传感器的电容参数，电容参数包括电容值或者电容变化值；根据电容参数确定耳机的状态，状态包括出盒状态或入盒状态。本申请还提出一种电子设备和耳机组件，通过电容传感器的电容变化来检测耳机的出盒以及入盒状态，而电容传感器只要产生耦合即可产生电容变化，检测灵敏度并不受环境影响，检测准确度高。

Description

耳机的出入盒检测方法、电子设备以及耳机组件
本申请要求于2019年11月28日提交中国专利局、申请号为201911217152.6、申请名称为“耳机的出入盒检测方法、电子设备以及耳机组件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及智能控制技术领域，尤其涉及一种耳机的出入盒检测方法、电子设备以及耳机组件。
背景技术
现有技术中，TWS(True Wireless Stereo，真无线立体声)耳机被广泛应用，由于TWS耳机一般较小，则需要设置对应的耳机盒来存放耳机。一般地，通过耳机盒上的传感器元件如红外传感器检测TWS耳机的出盒及入盒操作，但是红外传感器受环境影响较大，导致出入盒检测不准确。
发明内容
本申请的主要目的在于提供一种耳机的出入盒检测方法、电子设备以及耳机组件，旨在提高出入盒检测的准确性。
为实现上述目的，本申请提供一种耳机的出入盒检测方法，所述耳机的出入盒检测方法应用于耳机盒，所述耳机盒内设置有第一触摸传感器，所述耳机上设置有第二触摸传感器以及与所述第二触摸传感器电连接的电容；或者，所述耳机的出入盒检测方法应用于耳机，所述耳机上设置有第一触摸传感器，所述耳机盒内设置有第二触摸传感器以及所述第二触摸传感器电连接的电容，所述耳机的出入盒检测方法包括：
获取所述第一触摸传感器的电容参数，所述电容参数包括电容值或者电容变化值；
根据所述电容参数确定所述耳机的状态，所述状态包括出盒状态或入盒状态。
可选地，所述电容参数包括电容值，所述根据所述电容参数确定所述耳机的状态的步骤包括：
在所述电容值增大且大于第一预设电容值时，判定所述耳机处于入盒状态；
在所述电容值减小且小于第二预设电容值时，判定所述耳机处于出盒状态。
可选地，所述电容参数包括电容变化值，所述根据所述电容参数确定所述耳机的状态的步骤包括：
在所述电容值增大且所述电容变化值大于预设变化值时，判定所述耳机处于入盒状态，其中，所述电容变化值为当前检测到的电容值与初始电容值之间的差值；
在所述电容值减小且所述电容变化值大于预设变化值时，判定所述耳机处于出盒状态。
可选地，所述根据所述电容参数确定所述耳机的状态的步骤包括：
在所述电容值增大且大于第一预设电容值时或在所述电容值增大且所述电容变化值大于预设变化值时，检测所述耳机与耳机盒的连接信息；
在根据所述连接信息确定耳机与耳机盒连接成功时，判定所述耳机处于入盒状态。
可选地，所述根据所述电容参数确定所述耳机的状态的步骤还包括：
在所述电容值减小且小于第二预设电容值时或者在所述电容值减小且所述电容变化值大于预设变化值时，检测所述耳机与耳机盒的连接信息；
在根据所述连接信息确定耳机与耳机盒断开连接时，判定所述耳机处于入盒状态。
可选地，所述检测所述耳机与耳机盒的连接信息的步骤包括：
向所述耳机发送请求信息，在接收到与所述请求信息对应的响应信息时，确定所述耳机与所述耳机盒连接成功，所述耳机的出入盒检测方法应用于耳机盒；
或者，向所述耳机盒发送请求信息，在接收到与所述请求信息对应的响应信息时，确定所述耳机与所述耳机盒连接成功，所述耳机的出入盒检测方法应用于耳机。
可选地，所述检测所述耳机与耳机盒的连接信息的步骤包括：
检测所述耳机盒内充电电触点的电平状态，在检测到所述电平为预设状态时，确定所述耳机与所述耳机盒连接成功，所述耳机的出入盒检测方法应用于耳机盒；
或者，检测所述耳机内充电电触点的电平状态，在检测到所述电平为预设状态时，确定所述耳机与所述耳机盒连接成功，所述耳机的出入盒检测方法应用于耳机。
可选地，所述根据所述电容参数确定所述耳机的状态的步骤之后，所述耳机的出入盒检测方法还包括：
在所述耳机处于入盒状态时，对所述耳机进行充电操作，所述耳机的出入盒检测方法应用于耳机盒；
或者，在所述耳机处于入盒状态时，断开蓝牙连接，所述耳机的出入盒检测方法应用于耳机。
此外，为实现上述目的，本申请还提出一种电子设备，所述电子设备包括第一触摸传感器、存储器、处理器及存储在所述存储器上并可在所述处理器上运行的耳机的出入盒检测程序，所述第一触摸传感器与所述处理器连接，所述耳机的出入盒检测程序被所述处理器执行如以上所述的耳机的出入盒检测方法，所述电子设备为耳机或者耳机盒。
此外，为实现上述目的，本申请还提出一种耳机组件，所述耳机组件包括耳机以及耳机盒，其中：
所述耳机盒内设置有第一触摸传感器，所述耳机上设置有第二触摸传感器，所述耳机上与所述第二触摸传感器电连接的电容，所述耳机盒包括存储器、处理器及存储在所述存储器上并可在所述处理器上运行的耳机的出入盒检测程序，所述第一触摸传感器与所述处理器连接，所述耳机的出入盒检测程序被所述处理器执行如以上所述的耳机的出入盒检测方法；
或者，所述耳机上设置有第一触摸传感器，所述耳机盒内设置有第二触摸传感器，所述耳机盒内设置有与所述第二触摸传感器电连接的电容，所述耳机包括存储器、处理器及存储在所述存储器上并可在所述处理器上运行的 耳机的出入盒检测程序，所述第一触摸传感器与所述处理器连接，所述耳机的出入盒检测程序被所述处理器执行如以上所述的耳机的出入盒检测方法。
本申请提出的耳机的出入盒检测方法，通过电容传感器的电容变化来检测耳机的出盒以及入盒状态，而电容传感器只要产生耦合即可产生电容变化，检测灵敏度并不受环境影响，检测准确度高。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一部分附图，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1为本申请耳机的出入盒检测方法涉及的电子设备的硬件架构示意框图；
图2为本申请耳机的出入盒检测方法示例性第一实施例的流程示意图；
图3为本申请耳机的出入盒检测方法示例性第三实施例的流程示意图；
图4为本申请耳机的出入盒检测方法涉及的耳机组件的一实施例的电路示意图。
本申请目的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
参照图1，图1为本申请耳机的出入盒检测方法涉及的电子设备的结构框图。
本申请的耳机的出入盒检测方法涉及的电子设备可为耳机或者耳机盒。 电子设备中包括第一触摸传感器110、处理器120、存储器130以及采样电容140，存储器130中存储有操作系统以及耳机的出入盒检测程序，处理器120通过采样电容140来检测第一触摸传感器110的电容值。
耳机的出入盒检测方法应用于耳机盒时，耳机盒内设置有第一触摸传感器，第一触摸传感器位于耳机盒中放置耳机的容置腔的内表面，耳机上设置有第二触摸传感器以及与第二触摸传感器电连接的电容，第二触摸传感器位于耳机的表面；耳机的出入盒检测方法应用于耳机时，耳机上设置有第一触摸传感器，第一触摸传感器位于耳机的表面，耳机盒内设置有第二触摸传感器以及与第二触摸传感器电连接的电容，第二触摸传感器位于容置耳机的容置腔的内表面。
本实施例公开的技术方案耳机的出入盒检测方法可应用与耳机或者耳机盒中，以实现对耳机或者耳机盒的控制。
存储器130中的耳机的出入盒检测程序被处理器执行时实现以下步骤：
获取第一触摸传感器的电容参数，电容参数包括电容值或者电容变化值；
根据电容参数确定耳机的状态，状态包括出盒状态和入盒状态。
参照图2，图2为本申请耳机的出入盒检测方法示例性实施例一的流程示意图。本实施例中，耳机的出入盒检测方法应用于耳机盒，耳机盒内设置有第一触摸传感器，耳机上设置有第二触摸传感器以及与第二触摸传感器电连接的电容；或者，耳机的出入盒检测方法应用于耳机，耳机上设置有第一触摸传感器，耳机盒内设置有第二触摸传感器以及第二触摸传感器电连接的电容，耳机的出入盒检测方法包括：
步骤S10，获取第一触摸传感器的电容参数，电容参数包括电容值或者电容变化值；
耳机的出入盒检测方法应用于耳机盒时，由耳机盒中的MCU来检测电容参数，即耳机盒内设置有第一触摸传感器，第一触摸传感器位于耳机盒中放置耳机的容置腔的内表面，耳机上设置有第二触摸传感器以及与第二触摸传感器电连接的电容，第二触摸传感器位于耳机的表面，在耳机放入耳机盒时耳机盒上的第一触摸传感器与耳机上的第二传感器产生耦合，由于第二传感器连接有电容，导致第一触摸传感器的的电容增大，则耳机盒内的MCU 检测到的第一触摸传感器的电容增大；而在耳机远离耳机盒即耳机出盒后，第一触摸传感器以及第二触摸传感器的耦合效应消失，则第一触摸传感器的电容减小至原始电容值，则耳机盒内的MCU检测到的第一触摸传感器的电容减小；
耳机的出入盒检测方法应用于耳机时，由耳机中的MCU来检测电容参数，耳机上设置有第一触摸传感器，第一触摸传感器位于耳机的表面，耳机盒内设置有第二触摸传感器以及与第二触摸传感器电连接的电容，第二触摸传感器位于容置耳机的容置腔的内表面，在耳机放入耳机盒时耳机上的第一触摸传感器与耳机盒内的第二传感器产生耦合，由于第二传感器连接有电容，导致第一触摸传感器的的电容增大，则耳机的MCU检测到的第一触摸传感器的电容增大；而在耳机远离耳机盒即耳机出盒后，第一触摸传感器以及第二触摸传感器的耦合效应消失，则第一触摸传感器的电容减小至原始电容值，则耳机内的MCU检测到的第一触摸传感器的电容减小。
步骤S20，根据电容参数确定耳机的状态，状态包括出盒状态或入盒状态。
本实施例公开的技术方案中，可通过检测电容值或者电容变化值来确定耳机的状态，电容变化值为当前检测到的电容值与初始电容值之间的差值绝对值，以下进行具体说明：
方式一，通过电容值确定耳机的状态，即步骤S20包括：
在电容值增大且大于第一预设电容值时，判定耳机处于入盒状态；
在电容值减小且小于第二预设电容值时，判定耳机处于出盒状态。
本实施例中，第一预设电容值可根据第一触摸传感器的电容值C0以及第二触摸传感器串联的电容的电容值C1确定，即第一电容值可为C0+C1-K，K为常量，可由开发人员根据需求设置，而第二预设电容值，可根据第一触摸传感器的电容值C0确定，即第二预设电容值可为C0+H，H为常量，可由开发人员根据需求设置；则可在耳机盒或者耳机中存储第一预设电容值以及第二预设电容值来确定耳机的状态。
方式二，通过电容变化值确定耳机的状态，即步骤S20包括：
在电容值增大且电容变化值大于预设变化值时，判定耳机处于入盒状态，其中，电容变化值为当前检测到的电容值与初始电容值之间的差值；
在电容值减小且电容变化值大于预设变化值时，判定耳机处于出盒状态。
电容变化值可根据第二触摸传感器串联的电容的电容值C1确定，即电容变化值可为C1-M，M为常量可由开发人员根据需求设置，M小于C1；在耳机不断靠近耳机盒时，由于第一触摸传感器和第二触摸传感器耦合，第二传感器上还串联有电容，则MCU检测得到的第一触摸传感器的电容由原始的C0开始增大，即在电容值最大(电容变化值同样最大)时，耳机位于耳机盒内；同理，在耳机远离耳机盒的过程中，由于第一触摸传感器和第二触摸传感器不断远离，则MCU检测得到的第一触摸传感器的电容不断检测减小，则第一触摸传感器和第二触摸传感器的耦合消失时，MCU检测得到的第一触摸传感器的电容值最小，即电容变化值同样最大。
本实施例公开的技术方案中，通过电容传感器的电容变化来检测耳机的出盒以及入盒状态，而电容传感器只要产生耦合即可产生电容变化，检测灵敏度并不受环境影响，检测准确度高。
进一步地，基于第一实施例提出本申请耳机的出入盒检测方法第二实施例，在本实施例中，本申请耳机的出入盒检测方法还包括：
在电容值增大且大于第一预设电容值时或在电容值增大且电容变化值大于预设变化值时，检测耳机与耳机盒的连接信息；
在根据连接信息确定耳机与耳机盒连接成功时，判定耳机处于入盒状态。
可以理解的是，在根据电容确定耳机出盒时，也可进一步结合耳机与耳机盒的连接信息进一步确定耳机是否出盒，即耳机的出入盒检测方法还包括：
在电容值减小且小于第二预设电容值时或者在电容值减小且电容变化值大于预设变化值时，检测耳机与耳机盒的连接信息；
在根据连接信息确定耳机与耳机盒断开连接时，判定耳机处于入盒状态。
检测耳机与耳机盒的连接信息可包括多种方式：
方式一，与耳机盒的连接信息可通过通信引脚进行检测：
耳机以及耳机盒中均设置有通信引脚，在耳机正确放入耳机盒后，耳机与耳机盒之间的通信引脚会连通，则可进一步通过通信引脚的联通来确定耳机是否确实出入盒，避免对耳机的误操作，即检测耳机与耳机盒的连接信息的步骤包括：
向耳机发送请求信息，在接收到与请求信息对应的响应信息时，确定耳机与耳机盒连接成功，耳机的出入盒检测方法应用于耳机盒；
或者，向耳机盒发送请求信息，在接收到与请求信息对应的响应信息时，确定耳机与耳机盒连接成功，耳机的出入盒检测方法应用于耳机。
以下以耳机的出入盒检测方法应用于耳机盒为例进行说明，应用于耳机的原理相同，不再赘述，开即耳机盒向耳机发送请求信息，例如请求信息可以是报文，响应信息可以是ACK确认字符，耳机接到报文后，对所收到的报文进行检查，若未发现错误，便向耳机盒发出ACK确认字符，表明信息已被正确接收，也即表明耳机与耳机盒连接成功，若耳机盒向耳机发出了报文，但在预设时间内未接收到ACK确认字符，则确定耳机与耳机盒连接失败。
方式二，通过充电触点检测：
检测耳机盒内充电电触点的电平状态，在检测到电平为预设状态时，确定耳机与耳机盒连接成功，耳机的出入盒检测方法应用于耳机盒；
或者，检测耳机内充电电触点的电平状态，在检测到电平为预设状态时，确定耳机与耳机盒连接成功，耳机的出入盒检测方法应用于耳机。
耳机上设置有充电电触点，耳机盒内也设置有充电电触点，在耳机的充电电触点与耳机盒内的充电电触点电性导通后，耳机盒就可以对耳机进行充电。一般地，在耳机的充电电触点与耳机盒内的充电电触点不导通时，耳机盒内的充电电触点处于高电平状态，耳机与耳机盒处于未连接或者说连接失败的状态；在耳机的充电电触点与耳机盒内的充电电触点导通后，耳机盒内的充电电触点转变为低电平状态，因此，可以通过检测耳机盒内的充电电触点的电平状态来检测耳机是否与耳机盒连接成功，也即，在检测到电平状态为低电平状态时，确定耳机与耳机盒连接成功，在检测到电平状态为高电平状态时，确定耳机与耳机盒连接失败，在该实施例中，低电平状态也即预设状态；可以理解，预设状态也可以是高电平状态，只需通过不同的电路形式实现即可。检测耳机的充电触点的电平状态的方案原理相同，在此不再赘述。
本实施例公开的技术方案中，在根据电容检测耳机出入盒状态的基础上结合耳机与耳机盒的连接状态来进一步确定耳机的出入盒状态，进一步提高耳机出入盒状态检测的准确性。
参照图3，基于第一或第二实施例提出本申请耳机的出入盒检测方法第三实施例，在本实施例中，步骤S20之后，耳机的出入盒检测方法还包括：
步骤S30：
在耳机处于入盒状态时，对耳机进行充电操作，耳机的出入盒检测方法应用于耳机盒；
或者，在耳机处于入盒状态时，断开蓝牙连接，耳机的出入盒检测方法应用于耳机。
对耳机进行充电以及断开可通过充电开关实现，在耳机处于入盒状态时，可通过控制充电开关导通充电回路对耳机进行充电，在检测到耳机处于出盒状态时，可通过控制充电开关断开充电回路；在耳机处于入盒状态时，表明耳机此时处于非使用状态，则可断开耳机的蓝牙连接，减少耳机的能耗；同理，在检测到耳机出盒时，可恢复耳机的蓝牙连接，或者，重新搜索蓝牙设备进行连接。
在耳机的出入盒状态变化时，并不限于上述控制方式，例如在耳机处于入盒状态时，还可进行耳机盒以及耳机之间的通信，在此不再具体举例。
本实施例公开的技术方案，对耳机处于入盒状态时，耳机盒或者耳机的处理方式进行限定，提高耳机盒或者耳机的智能性。
参照图4，图4为本申请耳机的出入盒检测方法涉及的耳机组件的一实施例的电路示意图，本实施例中，耳机组件包括耳机以及耳机盒，其中：
耳机盒10内设置有第一触摸传感器110，耳机20上设置有第二触摸传感器150，耳机20上与第二触摸传感器150电连接的电容160，耳机盒10包括第一存储器130、第一处理器120及存储在第一存储器130上并可在处理器120上运行的耳机20的出入盒检测程序，第一触摸传感器110与处理器120连接，耳机20的出入盒检测程序被处理器120执行如以上实施例的耳机20的出入盒检测方法；
或者，耳机20上设置有第一触摸传感器110，耳机盒10内设置有第二触摸传感器150，耳机盒10内设置有与第二触摸传感器150电连接的电容160，耳机20包括第二存储器130、第二处理器120及存储在第二存储器130上并可在处理器120上运行的耳机20的出入盒检测程序，第一触摸传感器 110与第二处理器120连接，耳机20的出入盒检测程序被处理器120执行如以上实施例的耳机20的出入盒检测方法。
参照图4，耳机盒10中设置采样电容140来检测第一触摸传感器110的电容，处理器120通过采样电容140检测到第一触摸传感器110的电容后，将采集第一触摸传感器110的电容值与第一预设电容值以及第二预设电容值进行比对；或者获取采集的电容值与初始电容值的差值的绝对值，根据绝对值确定耳机20的状态；根据图4可进行变形，在耳机中设置第一触摸传感器以及采样电容，在耳机盒中设置第二触摸传感器，不再赘述。
本说明书中各个实施例采用并列或者递进的方式描述，每个实施例重点说明的都是与其它实施例的不同之处，各个实施例之间相同或相似部分互相参见即可。对于实施例公开的装置而言，由于其与实施例公开的方法相对应，所以描述的比较简单，相关之处可参见方法部分说明。
本领域普通技术人员还可以理解，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
结合本文中所公开的实施例描述的方法或算法的步骤可以直接用硬件、处理器执行的软件模块，或者二者的结合来实施。软件模块可以置于随机存储器(RAM)、内存、只读存储器(ROM)、电可编程ROM、电可擦除可编程ROM、寄存器、硬盘、可移动磁盘、CD-ROM、或技术领域内所公知的任意其它形式的存储介质中。
还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备 所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。

Claims (10)

  1. 一种耳机的出入盒检测方法，其特征在于，所述耳机的出入盒检测方法应用于耳机盒，所述耳机盒内设置有第一触摸传感器，所述耳机上设置有第二触摸传感器以及与所述第二触摸传感器电连接的电容；或者，所述耳机的出入盒检测方法应用于耳机，所述耳机上设置有第一触摸传感器，所述耳机盒内设置有第二触摸传感器以及所述第二触摸传感器电连接的电容，所述耳机的出入盒检测方法包括：
    获取所述第一触摸传感器的电容参数，所述电容参数包括电容值或者电容变化值；
    根据所述电容参数确定所述耳机的状态，所述状态包括出盒状态或入盒状态。
  2. 如权利要求1所述的耳机的出入盒检测方法，其特征在于，所述电容参数包括电容值，所述根据所述电容参数确定所述耳机的状态的步骤包括：
    在所述电容值增大且大于第一预设电容值时，判定所述耳机处于入盒状态；
    在所述电容值减小且小于第二预设电容值时，判定所述耳机处于出盒状态。
  3. 如权利要求1所述的耳机的出入盒检测方法，其特征在于，所述电容参数包括电容变化值，所述根据所述电容参数确定所述耳机的状态的步骤包括：
    在所述电容值增大且所述电容变化值大于预设变化值时，判定所述耳机处于入盒状态，其中，所述电容变化值为当前检测到的电容值与初始电容值之间的差值绝对值；
    在所述电容值减小且所述电容变化值大于预设变化值时，判定所述耳机处于出盒状态。
  4. 如权利要求1-3任一项所述的耳机的出入盒检测方法，其特征在于，所述根据所述电容参数确定所述耳机的状态的步骤包括：
    在所述电容值增大且大于第一预设电容值时或在所述电容值增大且所述电容变化值大于预设变化值时，检测所述耳机与耳机盒的连接信息；
    在根据所述连接信息确定耳机与耳机盒连接成功时，判定所述耳机处于入盒状态。
  5. 如权利要求1-3任一项所述的耳机的出入盒检测方法，其特征在于，所述根据所述电容参数确定所述耳机的状态的步骤包括：
    在所述电容值减小且小于第二预设电容值时或者在所述电容值减小且所述电容变化值大于预设变化值时，检测所述耳机与耳机盒的连接信息；
    在根据所述连接信息确定耳机与耳机盒断开连接时，判定所述耳机处于入盒状态。
  6. 如权利要求4所述的耳机的出入盒检测方法，其特征在于，所述检测所述耳机与耳机盒的连接信息的步骤包括：
    向所述耳机发送请求信息，在接收到与所述请求信息对应的响应信息时，确定所述耳机与所述耳机盒连接成功，所述耳机的出入盒检测方法应用于耳机盒；
    或者，向所述耳机盒发送请求信息，在接收到与所述请求信息对应的响应信息时，确定所述耳机与所述耳机盒连接成功，所述耳机的出入盒检测方法应用于耳机。
  7. 如权利要求4所述的耳机的出入盒检测方法，其特征在于，所述检测所述耳机与耳机盒的连接信息的步骤包括：
    检测所述耳机盒内充电电触点的电平状态，在检测到所述电平为预设状态时，确定所述耳机与所述耳机盒连接成功，所述耳机的出入盒检测方法应用于耳机盒；
    或者，检测所述耳机内充电电触点的电平状态，在检测到所述电平为预设状态时，确定所述耳机与所述耳机盒连接成功，所述耳机的出入盒检测方 法应用于耳机。
  8. 如权利要求1所述的耳机的出入盒检测方法，其特征在于，所述根据所述电容参数确定所述耳机的状态的步骤之后，所述耳机的出入盒检测方法还包括：
    在所述耳机处于入盒状态时，对所述耳机进行充电操作，所述耳机的出入盒检测方法应用于耳机盒；
    或者，在所述耳机处于入盒状态时，断开蓝牙连接，所述耳机的出入盒检测方法应用于耳机。
  9. 一种电子设备，其特征在于，所述电子设备包括第一触摸传感器、存储器、处理器及存储在所述存储器上并可在所述处理器上运行的耳机的出入盒检测程序，所述第一触摸传感器与所述处理器连接，所述耳机的出入盒检测程序被所述处理器执行如权利要求1-8任一项所述的耳机的出入盒检测方法，所述电子设备为耳机或者耳机盒。
  10. 一种耳机组件，其特征在于，所述耳机组件包括耳机以及耳机盒，其中：
    所述所述耳机盒内设置有第一触摸传感器，所述耳机上设置有第二触摸传感器，所述耳机上与所述第二触摸传感器电连接的电容，所述耳机盒包括存储器、处理器及存储在所述存储器上并可在所述处理器上运行的耳机的出入盒检测程序，所述第一触摸传感器与所述处理器连接，所述耳机的出入盒检测程序被所述处理器执行如权利要求1-8任一项所述的耳机的出入盒检测方法；
    或者，所述耳机上设置有第一触摸传感器，所述耳机盒内设置有第二触摸传感器，所述耳机盒内设置有与所述第二触摸传感器电连接的电容，所述耳机包括存储器、处理器及存储在所述存储器上并可在所述处理器上运行的耳机的出入盒检测程序，所述第一触摸传感器与所述处理器连接，所述耳机的出入盒检测程序被所述处理器执行如权利要求1-7任一项所述的耳机的出入盒检测方法。
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