WO2021102678A1 - 振动控制方法、终端设备及存储介质 - Google Patents

振动控制方法、终端设备及存储介质 Download PDF

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Publication number
WO2021102678A1
WO2021102678A1 PCT/CN2019/120925 CN2019120925W WO2021102678A1 WO 2021102678 A1 WO2021102678 A1 WO 2021102678A1 CN 2019120925 W CN2019120925 W CN 2019120925W WO 2021102678 A1 WO2021102678 A1 WO 2021102678A1
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WO
WIPO (PCT)
Prior art keywords
frequency offset
terminal device
target frequency
temperature
offset
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PCT/CN2019/120925
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English (en)
French (fr)
Inventor
林进全
Original Assignee
深圳市欢太科技有限公司
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市欢太科技有限公司, Oppo广东移动通信有限公司 filed Critical 深圳市欢太科技有限公司
Priority to CN201980100796.9A priority Critical patent/CN114503435A/zh
Priority to PCT/CN2019/120925 priority patent/WO2021102678A1/zh
Publication of WO2021102678A1 publication Critical patent/WO2021102678A1/zh

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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00Automatic control of frequency or phase; Synchronisation
    • H03L7/06Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • H03L7/08Details of the phase-locked loop
    • H03L7/081Details of the phase-locked loop provided with an additional controlled phase shifter
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00Automatic control of frequency or phase; Synchronisation
    • H03L7/06Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • H03L7/08Details of the phase-locked loop
    • H03L7/10Details of the phase-locked loop for assuring initial synchronisation or for broadening the capture range

Definitions

  • the present invention relates to mobile communication technology, in particular to a vibration control method, terminal equipment and storage medium.
  • Resonant devices such as motors in current mobile terminals and other terminal devices can use General Purpose Input Output (GPIO), Pulse Width Modulation (PWM) or drive chips to control motor vibration.
  • GPIO General Purpose Input Output
  • PWM Pulse Width Modulation
  • drive chips to control motor vibration.
  • a drive chip that stores a variety of motor vibration waveform data is used to drive the motor to implement different vibration waveforms according to different scenarios, so as to achieve different vibration effects in different scenarios.
  • the frequency of the vibration waveform in different scenarios is configured by the terminal device before leaving the factory, but after the terminal device leaves the factory, the natural frequency of the resonant device may shift due to the temperature of the terminal device. , So that there is a certain deviation between the actual vibration frequency and the design value of the vibration frequency.
  • the embodiments of the present invention provide a vibration control method, terminal equipment and storage medium, which can eliminate the vibration deviation caused by the temperature of the resonance device.
  • an embodiment of the present invention provides a vibration control method, the method including:
  • the vibration of the resonance device in the terminal device is controlled according to the target frequency offset.
  • an embodiment of the present invention provides a terminal device, and the terminal device includes:
  • the collection unit is configured to collect the temperature of the terminal equipment
  • a determining unit configured to determine a target frequency offset corresponding to the temperature
  • the control unit is configured to control the vibration of the resonance device in the terminal device according to the target frequency offset.
  • an embodiment of the present invention provides a terminal device, including:
  • Memory used to store executable instructions
  • the processor is configured to implement the steps of the vibration control method when executing the executable instructions stored in the memory.
  • an embodiment of the present invention provides an executable instruction stored therein, which is used to cause a processor to execute the vibration control method described above.
  • the vibration control method, terminal device and storage medium provided by the embodiments of the present invention collect the temperature of the terminal device; determine the target frequency offset corresponding to the temperature; control the resonance in the terminal device according to the target frequency offset The vibration of the device; thus, the vibration frequency of the resonant device is corrected according to the frequency offset corresponding to the current temperature of the terminal device, so that the actual vibration frequency and the design value of the vibration frequency tend to be consistent, and the vibration of the resonant device due to temperature is eliminated Deviations ensure a better vibration feeling of the resonant device and improve the user experience of the terminal device.
  • FIG. 1 is an optional flowchart of a vibration control method according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of an optional flow chart of a vibration control method according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a waveform of a driving signal provided by an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a waveform of a driving signal provided by an embodiment of the present invention.
  • FIG. 5 is an optional flowchart of a vibration control method provided by an embodiment of the present invention.
  • FIG. 6 is an optional flowchart of a vibration control method provided by an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of an optional structure of a terminal device implemented in the present invention.
  • FIG. 8 is a schematic diagram of an optional structure of an electronic device provided by an embodiment of the present invention.
  • first ⁇ second ⁇ third involved only distinguishes similar objects, and does not represent a specific order for the objects. Understandably, “first ⁇ second ⁇ third” Where permitted, the specific order or sequence can be interchanged, so that the embodiments of the present invention described herein can be implemented in a sequence other than those illustrated or described herein.
  • the natural frequency of the resonance device such as the motor may shift due to the temperature of the terminal equipment, and the actual sampling frequency calibrated before leaving the factory may also shift, resulting in resonance.
  • the actual resonant frequency of the device There is a certain deviation between the actual resonant frequency of the device and the design value of the resonant frequency, which causes the vibration of the resonant device to change.
  • the calibration of the sampling frequency of the resonant device requires precision equipment to reconfigure the waveform data of the resonant device to adapt the calibrated sampling frequency to the shifted natural frequency. Therefore, the sampling frequency of the resonant device in the related art is not suitable Self-calibration of consumer electronic equipment after leaving the factory.
  • Terminal equipment can refer to access terminals, user equipment (UE), user units, user stations, mobile stations, mobile stations, remote stations, remote terminals, mobile equipment, user terminals, terminals, wireless communication equipment, user agents, or User device.
  • UE user equipment
  • user units user stations, mobile stations, mobile stations, remote stations, remote terminals, mobile equipment, user terminals, terminals, wireless communication equipment, user agents, or User device.
  • the access terminal can be a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a wireless local loop (Wireless Local Loop, WLL) station, a personal digital processing (Personal Digital Assistant, PDA), with wireless communication Functional handheld devices, computing devices or other processing devices connected to wireless modems, in-vehicle devices, wearable devices, terminal devices in 5G networks, or terminal devices in the future evolution of PLMN, etc.
  • SIP Session Initiation Protocol
  • WLL Wireless Local Loop
  • PDA Personal Digital Assistant
  • Resonant devices refer to components such as motors that can generate vibration based on the adaptation of natural frequency and sampling frequency.
  • the motor may be a linear resonance actuator (Linear Resonance Actuator, LRA).
  • LRA Linear Resonance Actuator
  • the vibration of the resonant device can be sensed by people to produce a tactile feedback effect.
  • the linear resonance motor includes: a spring, a magnetic mass and a coil.
  • the spring suspends the coil inside the linear resonant motor. When current flows through the coil, the coil generates a magnetic field.
  • the coil is connected with a magnetic mass. When the current flowing through the coil changes, the direction and strength of the magnetic field will also change, and the mass will move up and down in the changing magnetic field.
  • the linear resonance motor moves based on the movement of the mass, and this movement is perceived by people to produce a tactile feedback effect.
  • the terminal device uses a drive chip storing multiple drive waveform data to implement different vibration waveforms according to different scenarios, realize different vibration effects, and thereby enhance the vibration experience in different scenarios.
  • the vibration control method provided by the embodiment of the present invention, as shown in FIG. 1, includes:
  • S101 Collect the temperature of the terminal device.
  • the terminal device provided by the embodiment of the present invention may be provided with a temperature sensor, and the temperature sensor can sense the temperature of the terminal device.
  • the temperature sensor is a temperature sensor of the system in the terminal.
  • the temperature sensor is a temperature sensor added to the terminal device based on vibration control.
  • the temperature sensor is set in the terminal device at a position close to the main board of the terminal device to accurately determine the temperature of the terminal device.
  • the temperature sensor is arranged on the main board near the resonant device to collect the temperature of the area on the main board close to the resonant device in the terminal device.
  • the temperature sensor is provided in a temperature-sensitive area on the main board to be able to quickly sense the temperature change of the main board of the terminal device.
  • the temperature-sensitive area on the main board can quickly react to temperature compared to other areas on the main board. For example: when the memory consumed by the application running on the terminal device is greater than the specified memory, the processor of the terminal device runs at high power, causing the motherboard to heat up, and the temperature of the temperature-sensitive area is significantly higher than that of other areas. The memory consumed by the application is reduced or the terminal is in a dormant state, and the temperature of the temperature-sensitive area drops significantly relative to other areas. For another example: when the terminal device is in a fast charging state, the motherboard heats up, and the temperature of the temperature-sensitive area increases significantly relative to other areas. When the terminal device is finished charging, the temperature of the temperature-sensitive area decreases significantly relative to other areas.
  • the number of temperature sensors and the location of the temperature sensors are not limited in any way.
  • the highest temperature among the temperatures collected by the multiple temperature sensors may be used as the temperature of the terminal device.
  • the average temperature of the temperatures collected by the multiple temperature sensors may be used as the temperature of the terminal device.
  • the temperature collected by the terminal device through the temperature sensor is the real-time temperature of the terminal device, such as 0 degrees Celsius (°C), 5°C, and 10°C.
  • the terminal device generates a temperature detection instruction based on a received driving instruction that instructs the resonance device to vibrate; and starts collecting the temperature of the terminal device based on the temperature detection instruction.
  • the terminal device can receive drive instructions based on user operations, calls, system reminders and other events to instruct the resonance device to vibrate.
  • the terminal device generates a temperature detection instruction that instructs the temperature sensor to collect the temperature based on the trigger of the received drive instruction, and based on the temperature detection Instruct the temperature sensor to start collecting the temperature of the device, so as to collect the temperature of the terminal device through the temperature sensor.
  • the terminal device determines the target frequency offset for correcting the sampling frequency of the terminal device based on the temperature determined in S101.
  • the method for determining the target frequency offset corresponding to the temperature includes one of the following:
  • Manner 1 Obtain the temperature range included in the corresponding relationship between the set temperature range and the frequency offset; determine the target temperature range to which the temperature belongs in the acquired temperature range; determine the target temperature range according to the corresponding relationship The target frequency offset corresponding to the target temperature range;
  • Manner 2 Input the temperature into the offset network model to obtain the target frequency offset output by the offset network model.
  • the terminal device is provided with a frequency offset list.
  • the frequency offset list includes the corresponding relationship between the set temperature range and the frequency offset, where different corresponding relationships have different temperature ranges, and different temperature ranges correspond to different frequency offsets.
  • the terminal device obtains the temperature range included in the corresponding relationship, determines the temperature range to which the collected temperature belongs, that is, the target temperature range, and uses the frequency offset corresponding to the target temperature range in the frequency offset list as the target corresponding to the collected temperature The temperature offset.
  • the frequency offset list is shown in Table 1, and the temperature ranges included in the set correspondence relationship include: -20 to 25°C, 25 to 30°C, and 30 to 80°C.
  • the temperature is -10°C, -20 to 25°C, 25 to 30°C, and 30 to 80°C. If the target temperature range of -10°C is -20 to 25°C, the corresponding target frequency offset is -2 Hz (HZ); When the collected terminal device temperature is 20°C, and the target temperature range to which it belongs is 25 to 30°C, the corresponding target frequency offset is 0HZ.
  • the frequency offset is -2, which means that the sampling frequency of the resonant device is reduced by 2HZ, and +5 means that the sampling frequency of the resonant device is increased by 5HZ.
  • frequency offset positive, zero, and negative.
  • the frequency offset is a positive number, it means that the sampling frequency of the resonant device is increased; when the frequency offset is zero, it means that the sampling frequency of the resonant device remains unchanged; when the frequency offset is a negative number, it means that the resonance is reduced The sampling frequency of the device.
  • the vibration correction method provided by the embodiment of the present invention can be applied to different scenarios, such as game scenes, incoming field scenes, alarm clock reminding scenes, and so on.
  • the waveforms of the driving signals for driving the resonance device to vibrate are different.
  • the terminal device uses the same frequency offset list for different scenarios.
  • the relationship between the temperature range and the frequency offset in the offset list in the terminal device can be set according to actual requirements.
  • the terminal device is provided with an offset network model trained based on temperature samples and corresponding frequency offset samples.
  • the terminal device inputs the collected temperature to the offset network model, and the output of the offset network model is the target frequency offset corresponding to the input temperature.
  • the temperature sample and the corresponding frequency offset sample may be sample data obtained by the terminal device from the network, or may be sample data input by the user received by the terminal device.
  • the temperature sample and the corresponding frequency offset sample may also include the historical temperature of the vibration of the control resonance device in the terminal device and the corresponding historical frequency offset.
  • the embodiment of the present invention does not impose any limitation on the acquisition path of the sample data for training the offset network model.
  • the algorithm adopted by the offset network model of the terminal device is a neural network algorithm, and there is no restriction on the structure of the offset network model.
  • the method for the terminal device to determine the target frequency offset corresponding to the temperature includes: sending the collected temperature to the network side, and receiving the target frequency offset corresponding to the sent temperature returned by the network side. There is no restriction on the way the network side determines the target frequency offset to be returned based on the received temperature.
  • the terminal device After determining the target frequency offset, the terminal device adjusts the sampling frequency of the driving signal that drives the resonance device to vibrate through the target frequency offset, so as to adjust the sampling frequency of the resonance device, which tends to be consistent with the natural frequency of the resonance device.
  • the vibration of the resonance device in the terminal device is controlled to be corrected.
  • S103 includes:
  • S1031 Obtain a reference frequency of a driving signal for driving the resonance device to vibrate.
  • the reference frequency is the sampling frequency of the drive signal set by the terminal device to drive the resonance device to vibrate.
  • the reference frequency of the driving signal in different scenarios is the same.
  • the terminal device After obtaining the reference frequency, the terminal device adds the target frequency offset to the reference frequency to obtain the target frequency after the reference frequency is corrected according to the target frequency offset.
  • the reference frequency is Fref
  • the target frequency offset is ⁇ F
  • the target frequency is F calculated by formula (1):
  • the vibration time of the resonant device is from t1 to t2, where the waveform of the drive signal before being corrected based on the target frequency is shown in Fig. 3.
  • the sampling frequency during the period from t1 to t2 is the reference frequency.
  • the size of the frequency is f1.
  • the waveform of the drive signal after being corrected based on the target frequency is shown in Figure 4.
  • the sampling frequency during the period from t1 to t2 is the target frequency.
  • the size of is f2, where f1 ⁇ f2.
  • the terminal equipment drives the resonant device to vibrate with the driving signal with the sampling frequency as the target frequency, so that the sampling frequency is adapted to the natural frequency of the resonant device, thereby correcting the vibration of the terminal equipment.
  • the waveform of the driving signal is not adjusted. Therefore, after controlling the vibration of the resonant device in the terminal device based on the target frequency offset, the resonant device is different Different vibrations can continue to be performed under the scenes, so as to meet the needs of multiple scenes, so that users can distinguish different scenes according to the current vibration situation.
  • the method further includes:
  • the detection resonance device corrects the sampling frequency of the driving signal based on the target frequency offset to obtain the frequency of vibration when the sampling frequency is driven, thereby monitoring the correction effect of the current target frequency offset.
  • the frequency of the vibration of the resonance device is detected.
  • the terminal device corrects the target frequency offset according to the detected correction effect of the current target frequency offset.
  • the correction effect reaches the expected correction effect
  • the current target frequency offset is not corrected.
  • the correction effect does not reach the expected correction effect
  • the current target frequency offset is corrected.
  • the corrected target frequency offset is used to control the vibration of the resonance device.
  • the reference frequency of the driving signal for driving the resonance device to vibrate is used as a measurement parameter of the correction effect.
  • S105 includes: comparing the detected frequency with the reference frequency of the driving signal that drives the resonant device to vibrate; when the frequency difference between the detected frequency and the reference frequency is greater than the specified frequency difference threshold, pass the The frequency difference corrects the target frequency offset to obtain the corrected target frequency offset.
  • the frequency difference between the detected frequency and the reference frequency is greater than the specified frequency difference threshold, it indicates that the correction effect has not reached the expected correction effect, and the target frequency offset needs to be corrected.
  • the frequency difference between the detected frequency and the reference frequency is not greater than the specified frequency difference threshold, it indicates that the correction effect has reached the expected correction effect, and the target frequency offset does not need to be corrected.
  • the method for correcting the target frequency offset includes: correcting the target frequency offset by the frequency difference between the detected frequency and the reference frequency to obtain the corrected target frequency offset.
  • the target frequency offset correction can be corrected ⁇ F (2) calculated by the equation:
  • ⁇ F school F difference + ⁇ F formula (2)
  • F difference is the frequency difference between the detected frequency and the reference frequency.
  • the target frequency offset or the offset network model is updated.
  • the terminal device determines the target frequency offset corresponding to the temperature by way of mode 1
  • the corresponding relationship between the temperature range and the frequency offset is determined
  • the target frequency offset is updated.
  • the target frequency offset in the frequency offset list is updated and updated to the corrected target frequency offset.
  • the corresponding relationship of the frequency offset list is shown in Table 1.
  • the target frequency offset is 5HZ
  • the corrected target frequency offset is obtained after the target frequency offset is corrected.
  • the shift amount is 6HZ
  • the updated frequency offset list is shown in Table 2.
  • the parameters of the offset network model are updated based on the corrected target frequency offset.
  • the terminal device updates the parameters of the offset network model based on the current temperature and the corrected target frequency offset, so that the output of the offset network model makes the offset network model output frequency offset for the input temperature
  • the amount is adapted to the use of the terminal equipment, and the sampling frequency of the drive signal is maintained to adapt to the natural frequency of the resonance device.
  • the target frequency offset in the correspondence relationship or the parameters of the offset network model are updated by the corrected target frequency offset, so that the temperature range of the target frequency offset is determined by the correction effect.
  • the corresponding relationship with the frequency offset, or the offset network model for feedback adjustment, to accurately determine the frequency offset that eliminates the vibration deviation caused by the temperature of the resonant device, so that the frequency offset stored in the terminal device The list and the offset network model can be dynamically adjusted as the deviation of the natural frequency of the resonance device in the terminal device is adjusted.
  • the method 1 is used to determine the target frequency offset corresponding to the temperature, and the motor is taken as an example to illustrate the vibration control method provided by the embodiment of the present invention, as shown in FIG. 6, including:
  • S601 Preset a relationship table between different temperature ranges and frequency offsets.
  • the corresponding relationship between different temperature ranges and frequency offsets is preset in the system of the terminal equipment to form a frequency offset relationship table.
  • the terminal device regularly obtains the system temperature.
  • the current temperature of the terminal device can be acquired by the temperature sensor added in the terminal device, or it can be acquired by the temperature sensor that comes with the system.
  • S603 Determine whether there is a frequency offset corresponding to the temperature of the current system in the relationship table.
  • the upper-level software service of the terminal device queries the preset relationship table to determine whether there is a frequency offset corresponding to the current system temperature in the preset relationship. If not, execute S604, if yes, execute S605.
  • the drive chip uses the default frequency to output the drive signal.
  • the upper software service department of the terminal device sets the drive system, and the drive chip in the drive system outputs a drive signal at a default frequency to drive the resonance device to vibrate.
  • the upper software service sets the bottom system, and the drive system sets the driver IC;
  • S606 Set the output frequency of the driver chip to the current output sampling frequency plus the frequency offset.
  • the upper-layer software service of the terminal device sets the drive system of the underlying system to set the output frequency of the drive chip to the current output sampling frequency plus the frequency offset.
  • the driving chip is used to output a driving waveform at a set output frequency.
  • the drive chip uses the current output actual frequency plus the frequency offset to output the drive waveform to drive the resonant device, so that the frequency of the actual drive voltage waveform of the resonant device tends to be consistent with the actual natural frequency of the resonant device.
  • the system of the terminal device includes two levels: an upper layer service and a lower layer system; the upper layer service is responsible for logical judgment, and the lower layer system is responsible for setting the driver chip.
  • the hardware composition of the terminal device includes: a terminal system, a driving chip, and a resonance device (such as a motor).
  • the terminal system and the driver chip can communicate with each other through an interrupt pin, a serial peripheral interface (Serial Peripheral Interface, SPI), or a two-wire serial bus (Inter-Integrated Circuit, I2C) interface.
  • SPI Serial Peripheral Interface
  • I2C Inter-Integrated Circuit
  • the vibration control method detects the temperature of the terminal system during operation in real time, queries the relationship table between the temperature range and the frequency offset, obtains the linear motor resonance frequency offset corresponding to the current temperature, and drives the chip to finally
  • the corrected actual frequency is used to output the driving waveform to drive the resonant device, so that the frequency of the actual driving voltage waveform of the resonant device is consistent with the actual natural frequency of the resonant device, and solves the resonant frequency of the resonant device caused by a large change in temperature There is a deviation, so as to ensure a better vibration feeling of the resonant device, and further improve the user experience.
  • an embodiment of the present invention also provides a terminal device.
  • the composition structure of the terminal device is shown in FIG. 7, and the terminal device 700 includes:
  • the collection unit 701 is configured to collect the temperature of the terminal device
  • the determining unit 702 is configured to determine the target frequency offset corresponding to the temperature
  • the control unit 703 is configured to control the vibration of the resonance device in the terminal device according to the target frequency offset.
  • the terminal device further includes:
  • a triggering unit configured to generate a temperature detection instruction based on a received triggering of a driving instruction that instructs the resonance device to vibrate
  • the collecting unit 701 is further configured to start collecting the temperature of the terminal device based on the temperature detection instruction.
  • the determining unit 702 is further configured to:
  • the target frequency offset corresponding to the target temperature range is determined.
  • the determining unit 702 is further configured to:
  • the temperature is input into the offset network model to obtain the target frequency offset output by the offset network model.
  • control unit 703 is further configured to:
  • the resonance device is driven to vibrate at the target frequency.
  • the terminal device further includes:
  • the detection unit is configured to detect the frequency of the vibration of the resonance device after controlling the vibration of the resonance device in the terminal device according to the target frequency offset;
  • the correction unit is configured to correct the target frequency offset according to the detected frequency to obtain the corrected target frequency offset.
  • the correction unit is further configured as:
  • the target frequency offset is corrected by the frequency difference to obtain the corrected target frequency offset.
  • the terminal device further includes:
  • the first updating unit is configured to update the target frequency offset in the correspondence relationship between the temperature range and the frequency offset based on the corrected target frequency offset.
  • the terminal device further includes:
  • the second update unit is configured to update the parameters of the offset network model based on the corrected target frequency offset.
  • An embodiment of the present invention also provides a terminal device, including a processor and a memory for storing a computer program that can run on the processor, wherein the processor is used to execute the above-mentioned terminal device when the computer program is running. Steps of vibration control method.
  • FIG. 8 is a schematic diagram of the hardware composition structure of an electronic device (terminal device) according to an embodiment of the present invention.
  • the electronic device 800 includes: at least one processor 801, a memory 802, a resonance device 803, and at least one network interface 804.
  • the various components in the electronic device 800 are coupled together through the bus system 805.
  • the bus system 805 is used to implement connection and communication between these components.
  • the bus system 805 also includes a power bus, a control bus, and a status signal bus.
  • various buses are marked as the bus system 805 in FIG. 8.
  • the memory 802 may be a volatile memory or a non-volatile memory, and may also include both volatile and non-volatile memory.
  • non-volatile memory can be ROM, Programmable Read-Only Memory (PROM, Programmable Read-Only Memory), Erasable Programmable Read-Only Memory (EPROM, Erasable Programmable Read-Only Memory), and electrically erasable Programmable read-only memory (EEPROM, Electrically Erasable Programmable Read-Only Memory), magnetic random access memory (FRAM, ferromagnetic random access memory), flash memory (Flash Memory), magnetic surface memory, optical disk, or CD-ROM (CD) -ROM, Compact Disc Read-Only Memory); Magnetic surface memory can be disk storage or tape storage.
  • the volatile memory may be a random access memory (RAM, Random Access Memory), which is used as an external cache.
  • RAM random access memory
  • SRAM static random access memory
  • SSRAM synchronous static random access memory
  • Synchronous Static Random Access Memory Synchronous Static Random Access Memory
  • DRAM Dynamic Random Access Memory
  • SDRAM Synchronous Dynamic Random Access Memory
  • DDRSDRAM Double Data Rate Synchronous Dynamic Random Access Memory
  • ESDRAM Enhanced Synchronous Dynamic Random Access Memory
  • SLDRAM synchronous connection dynamic random access memory
  • DRRAM Direct Rambus Random Access Memory
  • the memory 802 described in the embodiment of the present invention is intended to include, but is not limited to, these and any other suitable types of memory.
  • the memory 802 in the embodiment of the present invention is used to store various types of data to support the operation of the electronic device 800. Examples of these data include: any computer program used to operate on the electronic device 800, such as an application program 8021.
  • the program for implementing the method of the embodiment of the present invention may be included in the application program 8021.
  • the method disclosed in the foregoing embodiment of the present invention may be applied to the processor 801 or implemented by the processor 801.
  • the processor 801 may be an integrated circuit chip with signal processing capabilities. In the implementation process, the steps of the foregoing method can be completed by an integrated logic circuit of hardware in the processor 801 or instructions in the form of software.
  • the aforementioned processor 801 may be a general-purpose processor, a digital signal processor (DSP, Digital Signal Processor), or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, and the like.
  • the processor 801 may implement or execute various methods, steps, and logical block diagrams disclosed in the embodiments of the present invention.
  • the general-purpose processor may be a microprocessor or any conventional processor or the like.
  • the steps of the method disclosed in the embodiments of the present invention can be directly embodied as execution and completion by a hardware decoding processor, or execution and completion by a combination of hardware and software modules in the decoding processor.
  • the software module may be located in a storage medium, and the storage medium is located in the memory 802.
  • the processor 801 reads the information in the memory 802 and completes the steps of the foregoing method in combination with its hardware.
  • the electronic device 800 may be used by one or more application specific integrated circuits (ASIC, Application Specific Integrated Circuit), DSP, programmable logic device (PLD, Programmable Logic Device), and complex programmable logic device (CPLD). , Complex Programmable Logic Device), FPGA, general-purpose processor, controller, MCU, MPU, or other electronic components to implement the foregoing method.
  • ASIC Application Specific Integrated Circuit
  • DSP digital signal processor
  • PLD programmable logic device
  • CPLD complex programmable logic device
  • FPGA field-programmable logic device
  • controller MCU
  • MPU or other electronic components to implement the foregoing method.
  • the embodiment of the present invention also provides a storage medium for storing computer programs.
  • the storage medium can be applied to the terminal device in the embodiment of the present invention, and the computer program causes the computer to execute the corresponding process in each method of the embodiment of the present invention.
  • the computer program causes the computer to execute the corresponding process in each method of the embodiment of the present invention.
  • These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing equipment to work in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture including the instruction device.
  • the device implements the functions specified in one process or multiple processes in the flowchart and/or one block or multiple blocks in the block diagram.
  • These computer program instructions can also be loaded on a computer or other programmable data processing equipment, so that a series of operation steps are executed on the computer or other programmable equipment to produce computer-implemented processing, so as to execute on the computer or other programmable equipment.
  • the instructions provide steps for implementing the functions specified in one process or multiple processes in the flowchart and/or one block or multiple blocks in the block diagram.

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Abstract

一种振动控制方法、终端设备及存储介质,所述方法包括:采集终端设备的温度(S101);确定所述温度对应的目标频率偏移量(S102);根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动(S103)。

Description

振动控制方法、终端设备及存储介质 技术领域
本发明涉及移动通信技术,尤其涉及一种振动控制方法、终端设备及存储介质。
背景技术
当前的移动终端等终端设备中的马达等谐振装置可利用通用输入输出口(General Purpose Input Output,GPIO)、脉冲宽度调制(Pulse width modulation,PWM)或驱动芯片来控制马达振动。例如:为了提升不同场景下的体验,利用存储多种马达振动波形数据的驱动芯片来根据不同的场景去驱动马达实施不同的振动波形,从而在不同的场景下实现不同的振动效果。
现有的技术中,针对不同场景下的振动波形的频率为终端设备在出厂前配置好的,但终端设备出厂后,因终端设备所处的温度原因,谐振装置的固有频率有可能发生偏移,使其实际的振动频率与振动频率设计值存在一定的偏差。
发明内容
本发明实施例提供一种振动控制方法、终端设备及存储介质,能够消除谐振装置因为温度所带来的振动偏差。
第一方面,本发明实施例提供一种振动控制方法,所述方法包括:
采集终端设备的温度;
确定所述温度对应的目标频率偏移量;
根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动。
第二方面,本发明实施例提供一种终端设备,所述终端设备包括:
采集单元,配置为采集终端设备的温度;
确定单元,配置为确定所述温度对应的目标频率偏移量;
控制单元,配置为根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动。
第三方面,本发明实施例提供一种终端设备,包括:
存储器,用于存储可执行指令;
处理器,用于执行所述存储器中存储的可执行指令时,实现上述振动控制方法的步骤。
第四方面,本发明实施例提供一种存储有可执行指令,用于引起处理器执行时,实现上述振动控制方法。
本发明实施例提供的振动控制方法、终端设备和存储介质,采集终端设备的温度;确定所述温度对应的目标频率偏移量;根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动;从而根据终端设备当前的温度对应的频率偏移量对谐振装置的振动频率进行修正,使实际的振动频率与振动频率设计值趋于一致,消除谐振装置因为温度所带来的振动偏差,保证谐振装置的振感较佳,提高用户对终端设备的使用体验。
附图说明
图1为本发明实施例振动控制方法的一种可选的流程示意图;
图2为本发明实施例振动控制方法的一种可选的流程示意图;
图3为本发明实施例提供的一种驱动信号的波形示意图;
图4为本发明实施例提供的一种驱动信号的波形示意图;
图5为本发明实施例提供的振动控制方法的一种可选的流程示意图;
图6为本发明实施例提供的振动控制方法的一种可选的流程示意图;
图7为本发明实施的终端设备的一个可选的结构示意图;
图8为本发明实施例提供的电子设备的一个可选的结构示意图。
具体实施方式
为了能够更加详尽地了解本发明实施例的特点和技术内容,下面结合附图对本发明实施例的实现进行详细阐述,所附附图仅供参考说明之用,并非用来限定本发明实施例。
在以下的描述中,涉及到“一些实施例”,其描述了所有可能实施例的子集,但是可以理解,“一些实施例”可以是所有可能实施例的相同子集或不同子集,并且可以在不冲突的情况下相互结合。
在以下的描述中,所涉及的术语“第一\第二\第三”仅仅是是区别类似的对象,不代表针对对象的特定排序,可以理解地,“第一\第二\第三”在允许的情况下可以互换特定的顺序或先后次序,以使这里描述的本发明实施例能够以除了在这里图示或描述的以 外的顺序实施。
除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中所使用的术语只是为了描述本发明实施例的目的,不是旨在限制本发明。
相关技术中,随着终端设备的长时间使用,终端设备所处的温度原因,马达等谐振装置的固有频率有可能发生偏移,出厂前校准过的实际采样频率也有可能会偏移,导致谐振装置成品实际的谐振频率与谐振频率设计值存在一定的偏差,使得谐振装置的振动量发生变。而谐振装置的采样频率的校准需要依靠精密设备,以重新配置谐振装置的波形数据,以使校准后的采样频率适配偏移后的固有频率,因此,相关技术中谐振装置的采样频率不适合消费电子设备出厂后的自校准。
基于上述问题,本发明实施例提供一种振动控制方法,应用于具有谐振装置的终端设备。终端设备可以指接入终端、用户设备(User Equipment,UE)、用户单元、用户站、移动站、移动台、远方站、远程终端、移动设备、用户终端、终端、无线通信设备、用户代理或用户装置。接入终端可以是蜂窝电话、无绳电话、会话启动协议(Session Initiation Protocol,SIP)电话、无线本地环路(Wireless Local Loop,WLL)站、个人数字处理(Personal Digital Assistant,PDA)、具有无线通信功能的手持设备、计算设备或连接到无线调制解调器的其它处理设备、车载设备、可穿戴设备、5G网络中的终端设备或者未来演进的PLMN中的终端设备等。
谐振装置指马达等能够基于固有频率和采样频率的适配产生振动的组件。其中,马达可为线性谐振马达(Linear Resonance Actuator,LRA)。谐振装置的振动能够被人们感知从而产生触觉反馈效果。
线性谐振马达包括:弹簧、带有磁性的质量块和线圈。弹簧将线圈悬浮在线性谐振马达内部,当线圈中有电流流过时,线圈会产生磁场。线圈和带有磁性的质量块相连,当流过线圈的电流改变时,磁场的方向和强弱也会改变,质量块就会在变化的磁场中上下移动。线性谐振马达基于质量块的移动而运动,这种运动被人们感知从而产生触觉反馈效果。
本发明实施例中,终端设备利用存储多种驱动波形数据的驱动芯片来根据不同的场景去实现不同的振动波形,实现不一样的振动效果,从而提升不同场景下的振动体验。
本发明实施例提供的振动控制方法,如图1所示,包括:
S101,采集终端设备的温度。
本发明实施例提供的终端设备中可设置有温度传感器,温度传感器能够感应终端设备的温度。可选地,温度传感器为终端中系统的温度传感器。可选地,温度传感器为基于振动控制在终端设备中增设的温度传感器。
以温度传感器为基于振动控制在终端设备中增设的温度传感器为例,温度传感器在终端设备中设置的位置为靠近终端设备中主板的位置,以精确地确定终端设备的温度。
在一示例中,温度传感器设置在主板上靠近谐振装置的周围,以采集终端设备中主板上靠近谐振装置的区域的温度。
在一示例中,温度传感器为设置在主板上温度敏感的区域,以能够快速地感应终端设备的主板的温度的变化。其中,主板上温度敏感的区域相对于主板上的其它区域,能够快速地对温度做出反应。比如:当终端设备运行的应用程序的所消耗的内存大于指定内存时,终端设备的处理器高功率运行,使得主板发热,温度敏感的区域相对其他的区域的温度明显升高,且当运行的应用程序的所消耗的内存减小或终端处于休眠状态,温度敏感的区域相对其他的区域的温度明显下降。又比如:当终端设备处于快速充电状态使得主板发热,温度敏感的区域相对其他的区域的温度明显升高,当终端设备结束充电,温度敏感的区域相对其他的区域的温度明显下降。
本发明实施例中,对温度传感器的数量和温度传感器的设置位置不进行任何限定。
在一示例中,当终端设备中设置多个温度传感器,可将多个温度传感器所采集的温度中的最高温度作为终端设备的温度。
在一示例中,当终端设备中设置多个温度传感器,可将多个温度传感器所采集的温度的平均温度作为终端设备的温度。
终端设备通过温度传感器采集的温度为终端设备的实时温度,比如:0摄氏度(℃)、5℃、10℃。
可选地,终端设备基于接收到的指示所述谐振装置进行振动的驱动指令的触发,生成温度检测指令;基于所述温度检测指令开始采集所述终端设备的温度。
终端设备可基于用户操作、来电、系统提醒等事件接收到驱动指令,以指示谐振装置进行振动,终端设备基于接收到的驱动指令的触发生成指示温度传感器采集温度的温度检测指令,并基于温度检测指令控制温度传感器开始采集设备的温度,以通过温度传感器采集终端设备的温度。
S102,确定所述温度对应的目标频率偏移量。
终端设备基于S101确定的温度确定对终端设备的采样频率进行校正的目标频率偏移量。
本发明实施例中,确定温度对应的目标频率偏移量的方式包括以下之一:
方式一、获取设定的温度范围与频率偏移量的对应关系所包括的的温度范围;确定所获取的温度范围中,所述温度所属的目标温度范围;根据所述对应关系,确定所述目标温度范围对应的目标频率偏移量;
方式二、将所述温度输入偏移量网络模型,得到所述偏移量网络模型输出的目标频率偏移量。
在方式一中,终端设备设置有频率偏移量列表。频率偏移量列表中包括有设定的温度范围和频率偏移量的对应关系,其中,不同的对应关系中,温度范围不同,且不同的温度范围对应的频率偏移量不同。终端设备获取对应关系所包括的温度范围,并确定采集的温度所属的温度范围即目标温度范围,将频率偏移量列表中该目标温度范围对应的频率偏移量作为所采集的温度对应的目标温度偏移量。
在一示例中,频率偏移量列表如表1所示,设定的对应关系中包括的温度范围包括:-20至25℃、25至30℃以及30至80℃,当采集的终端设备的温度为-10℃,-20至25℃、25至30℃以及30至80℃中,-10℃所属的目标温度范围为-20至25℃,则对应的目标频率偏移量为-2赫兹(HZ);当采集的终端设备的温度为20℃,所属的目标温度范围为25至30℃,则对应的目标频率偏移量为0HZ。
表1 频率偏移量列表示例
温度范围,单位:摄氏度 频率偏移量,单位:HZ
-20-25 -2
25-30 0
30-80 +5
其中,在表1中,频率偏移量为-2,表征将谐振装置的采样频率减小2HZ,+5表征将谐振装置的采样频率增大5HZ。
本发明实施例中,频率偏移量存在正数、零、负数三类。当频率偏移量为正数时,表征增大谐振装置的采样频率;当频率偏移量为零时,表征谐振装置的采样频率不变;当频率偏移量为负数时,表征减小谐振装置的采样频率。
本发明实施例提供的振动校正方法可应用于不同的场景,比如:游戏场景、来电场 景、闹钟提醒场景等。针对不同的场景,驱动谐振装置振动的驱动信号的波形不同。可选地,终端设备针对不同场景采用同一频率偏移量列表。
本发明实施例中,终端设备中的偏移量列表中的温度范围与频率偏移量的关系可根据实际需求进行设置。
在方式二中,终端设备中设置有基于温度样本和对应的频率偏移量样本训练的偏移量网络模型。终端设备将采集到的温度输入至偏移量网络模型,偏移量网络模型的输出为输入的温度对应的目标频率偏移量。
本发明实施例中,温度样本和对应的频率偏移量样本可为终端设备从网络获取的样本数据,也可为终端设备接收的用户输入的样本数据。可选地,,温度样本和对应的频率偏移量样本还可包括终端设备中控制谐振装置的振动的历史温度以及对应的历史频率偏移量。本发明实施例对训练偏移量网络模型的样本数据的获取途径不进行任何的限定。
本发明实施例中,终端设备的偏移量网络模型所采用的算法为神经网络算法,对偏移量网络模型的结构不进行任何的限定。
可选地,终端设备确定温度对应的目标频率偏移量的方式包括:将采集的温度发送至网络侧,并接收网络侧返回的发送的温度对应的目标频率偏移量。对于网络侧根据接收的温度确定需返回的目标频率偏移量的确定方式不进行任何的限定。
S103,根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动。
终端设备确定目标频率偏移量后,通过目标频率偏移量对驱动谐振装置振动的驱动信号的采样频率进行调整,以对谐振装置的采样频率进行调整,与谐振装置的固有频率趋于一致,控制所述终端设备中的谐振装置的振动得到校正。
可选地,如图2所示,S103包括:
S1031,获取驱动所述谐振装置进行振动的驱动信号的参考频率。
这里,参考频率为终端设备设置的驱动谐振装置振动的驱动信号的采样频率。可选地,不同的场景下驱动信号的参考频率相同。
S1032,根据所述目标频率偏移量对所述参考频率进行校正,得到目标频率。
终端设备获取参考频率后,将目标频率偏移量与参考频率相加,得到根据目标频率偏移量对参考频率进行校正之后的目标频率。
在一示例中,参考频率为F ref,目标频率偏移量为ΔF,目标频率为F通过公式(1)计算得到:
F=F ref+ΔF       公式(1)。
在一示例中,谐振装置的振动时间为t1至t2,其中,驱动信号在基于目标频率进行校正之前的波形如图3所示,在t1至t2这段时间内的采样频率为参考频率,参考频率的大小为f1,当电子设备的温度为40℃时,驱动信号在基于目标频率进行校正之后的波形如图4所示,在t1至t2这段时间内的采样频率为目标频率,目标频率的大小为f2,其中,且f1<f2。
S1033,以所述目标频率驱动所述谐振装置进行振动。
终端设备以采样频率为目标频率的驱动信号驱动谐振装置进行振动,使得采样频率适配谐振装置的固有频率,从而对终端设备的振动进行校正。
本发明实施例中,对驱动信号的采样频率进行调整时,对驱动信号的波形不进行调整,因此,基于目标频率偏移量控制所述终端设备中的谐振装置的振动后,谐振装置在不同的场景下能够继续进行不同的振动,从而满足多场景的需求,使得用户针对当前的振动情况区分不同的场景。
本发明实施例中,在S103之后,如图5所示,还包括:
S104,检测所述谐振装置振动的频率。
这里,检测谐振装置基于目标频率偏移量对驱动信号的采样频率校正的得到采样频率驱动时振动的频率,从而监测当前目标频率偏移量的校正效果。
可选地,当终端设备的温度属于当前目标频率偏移量对应的温度范围时,检测谐振装置振动的频率。
S105,根据所检测的频率,对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。
终端设备根据检测的当前目标频率偏移量的校正效果对目标频率偏移量进行校正。可选地,当校正效果达到预期的校正效果,则对当前目标频率偏移量不进行校正。可选地,当校正效果未达到预期的校正效果,则对当前目标频率偏移量进行校正。
当终端设备对目标频率偏移量进行校正,得到校正后的目标频率偏移量,则使用校正后的目标频率偏移量控制谐振装置的振动。
可选地,以驱动所述谐振装置振动的驱动信号的参考频率作为校正效果的衡量参数。此时,S105包括:将所检测的频率和驱动所述谐振装置振动的驱动信号的参考频率进行比较;当所检测的频率和所述参考频率的频率差值大于指定的频率差阈值,通过所述频率差值对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。
当所检测的频率和所述参考频率的频率差值大于指定的频率差阈值,表征校正效果未达到预期的校正效果,需要对目标频率偏移量进行校正。当所检测的频率和所述参考频率的频率差值不大于指定的频率差阈值,表征校正效果达到预期的校正效果,不需要对目标频率偏移量进行校正。
对目标频率偏移量进行校正的方式包括:通过检测的频率和参考频率的频率差值对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。这里,校正后的目标频率偏移量ΔF 可通过公式(2)计算得到:
ΔF =F +ΔF         公式(2);
其中,F 为检测的频率和参考频率的频率差值。
本发明实施例中,在得到校正后的目标频率偏移量,对目标频率偏移量或偏移量网络模型进行更新。
可选地,在终端设备确定温度对应的目标频率偏移量的方式为方式一的情况下,基于所述校正后的目标频率偏移量,对温度范围与频率偏移量的对应关系中的所述目标频率偏移量进行更新。
这里,对频率偏移量列表中的目标频率偏移量进行更新,更新为校正后的目标频率偏移量。
在一示例中,频率偏移量列表的对应关系如表1所示,当温度为40℃时,目标频率偏移量为5HZ,对目标频率偏移量校正后得到的校正后的目标频率偏移量为6HZ,则更新后的频率偏移列表如表2所示。
表2 更新后的频率偏移量列表示例
温度范围,单位:摄氏度 频率偏移量,单位:HZ
-20-25 -2
25-30 0
30-80 +6
可选地,在终端设备确定温度对应的目标频率偏移量的方式为方式二的情况下,基于所述校正后的目标频率偏移量,对偏移量网络模型的参数进行更新。
终端设备基于当前温度和校正后的目标频率偏移量对偏移量网络模型的参数进行更新,使得偏移量网络模型的输出,使得偏移量网络模型针对输入的温度所输出的频率 偏移量适应终端设备的使用情况,保持驱动信号的采样频率适配谐振装置的固有频率。
本发明实施例中,通过校正后的目标频率偏移量对对应关系中的目标频率偏移量或偏移量网络模型的参数进行更新,从而通过校正效果对确定目标频率偏移量的温度范围和频率偏移量的对应关系,或偏移量网络模型进行反馈调节,以精确地确定消除谐振装置因为温度所带来的振动偏差的频率偏移量,使得终端设备中存储的频率偏移量列表、以及偏移量网络模型能够随着终端设备中谐振装置的固有频率的偏差的调整而动态调整。
下面,以确定温度对应的目标频率偏移量为方式一,且马达为为例,对本发明实施例提供的振动控制方法进行举例说明,如图6所示,包括:
S601,预设不同的温度范围和频率偏移量的关系表。
终端设备的系统中预设不同的温度范围和频率偏移量的对应关系,形成频率偏移量关系表。
S602,获取系统温度,
终端设备定时获取系统温度。当前终端设备的温度可以由终端设备内增加的温度传感器去获取,也可以通过系统自带的温度传感器去获取。
S603,判断关系表中是否有对应当前系统的温度的频率偏移量。
终端设备的上层软件服务查询预设的关系表,以判断在预设的关系中是否存在当前系统的温度是所对应的频率偏移量。若没有,则执行S604,若有,则执行S605。
S604,通过驱动芯片使用默认的频率输出驱动信号。
终端设备的上层软件服务部对驱动系统进行设置,驱动系统中的驱动芯片以默认的频率输出驱动信号,以驱动谐振装置振动。
上层软件服务则设置底层系统,驱动系统则设置驱动IC;
S605,获取当前温度对应的频率偏移量。
S606,设置驱动芯片的输出频率为当前输出的采样频率加上频率偏移量。
终端设备的上层软件服务,设置底层系统的驱动系设驱动芯片的输出频率为当前输出的采样频率加上频率偏移量。
S607,通过驱动芯片以设置的输出频率输出驱动波形。
驱动芯片以当前输出的实际频率加上频率偏移量,来输出驱动波形,驱动谐振装置,从而使得谐振装置的实际驱动电压波形的频率,与谐振装置的实际固有频率趋于一致。
本发明实施例中,终端设备的系统包括:上层服务和底层系统两个层级;上层服务则负责逻辑的判断,而底层系统则负责设置驱动芯片。
本发明实施例中,终端设备的硬件组成包括:终端系统、驱动芯片和谐振装置(比如:马达)。其中,终端系统和驱动芯片可通过中断引脚、串行外设接口(Serial Peripheral Interface,SPI)或者两线式串行总线(Inter-Integrated Circuit,I2C)接口进行数据交互通信。
本发明实施例提供的振动控制方法,通过实时检测终端系统运行时的温度,查询温度范围和频率偏移量的关系表,获取当前温度的对应的线性马达谐振频率偏移量,驱动芯片以最终校正后的实际频率来输出驱动波形,驱动谐振装置,从而将谐振装置的实际驱动电压波形的频率,与谐振装置的实际固有频率趋于一致,解决因为温度的较大变化引起谐振装置的谐振频率存在偏差,从而保证谐振装置的振感较佳,进一步提高用户体验。
为实现上述振动控制方法,本发明实施例还提供一种终端设备,所述终端设备的组成结构,如图7所示,终端设备700包括:
采集单元701,配置为采集终端设备的温度;
确定单元702,配置为确定所述温度对应的目标频率偏移量;
控制单元703,配置为根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动。
本发明实施中,所述终端设备还包括:
触发单元,配置为基于接收到的指示所述谐振装置进行振动的驱动指令的触发,生成温度检测指令;
采集单元701,还配置为基于所述温度检测指令开始采集所述终端设备的温度。
本发明实施中,确定单元702,还配置为:
获取设定的温度范围与频率偏移量的对应关系所包括的温度范围;
确定所获取的温度范围中,所述温度所属的目标温度范围;
根据所述对应关系,确定所述目标温度范围对应的目标频率偏移量。
本发明实施中,确定单元702,还配置为:
将所述温度输入偏移量网络模型,得到所述偏移量网络模型输出的目标频率偏移量。
本发明实施中,控制单元703,还配置为:
获取驱动所述谐振装置进行振动的驱动信号的参考频率;
根据所述目标频率偏移量对所述参考频率进行校正,得到目标频率;
以所述目标频率驱动所述谐振装置进行振动。
本发明实施中,所述终端设备还包括:
检测单元,配置为在根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动之后,检测所述谐振装置振动的频率;
校正单元,配置为根据所检测的频率,对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。
本发明实施中,所述校正单元,还配置为:
将所检测的频率和驱动所述谐振装置振动的驱动信号的参考频率进行比较;
当所检测的频率和所述参考频率的频率差值大于指定的频率差阈值,通过所述频率差值对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。
本发明实施中,所述终端设备还包括:
第一更新单元,配置为:基于所述校正后的目标频率偏移量,对温度范围与频率偏移量的对应关系中的所述目标频率偏移量进行更新。
本发明实施中,所述终端设备还包括:
第二更新单元,配置为:基于所述校正后的目标频率偏移量,对偏移量网络模型的参数进行更新。
本发明实施例还提供一种终端设备,包括处理器和用于存储能够在处理器上运行的计算机程序的存储器,其中,所述处理器用于运行所述计算机程序时,执行上述终端设备执行的振动控制方法的步骤。
图8是本发明实施例的电子设备(终端设备)的硬件组成结构示意图,电子设备800包括:至少一个处理器801、存储器802、谐振装置803和至少一个网络接口804。电子设备800中的各个组件通过总线系统805耦合在一起。可理解,总线系统805用于实现这些组件之间的连接通信。总线系统805除包括数据总线之外,还包括电源总线、控制总线和状态信号总线。但是为了清楚说明起见,在图8中将各种总线都标为总线系统805。
可以理解,存储器802可以是易失性存储器或非易失性存储器,也可包括易失性和非易失性存储器两者。其中,非易失性存储器可以是ROM、可编程只读存储器(PROM, Programmable Read-Only Memory)、可擦除可编程只读存储器(EPROM,Erasable Programmable Read-Only Memory)、电可擦除可编程只读存储器(EEPROM,Electrically Erasable Programmable Read-Only Memory)、磁性随机存取存储器(FRAM,ferromagnetic random access memory)、快闪存储器(Flash Memory)、磁表面存储器、光盘、或只读光盘(CD-ROM,Compact Disc Read-Only Memory);磁表面存储器可以是磁盘存储器或磁带存储器。易失性存储器可以是随机存取存储器(RAM,Random Access Memory),其用作外部高速缓存。通过示例性但不是限制性说明,许多形式的RAM可用,例如静态随机存取存储器(SRAM,Static Random Access Memory)、同步静态随机存取存储器(SSRAM,Synchronous Static Random Access Memory)、动态随机存取存储器(DRAM,Dynamic Random Access Memory)、同步动态随机存取存储器(SDRAM,Synchronous Dynamic Random Access Memory)、双倍数据速率同步动态随机存取存储器(DDRSDRAM,Double Data Rate Synchronous Dynamic Random Access Memory)、增强型同步动态随机存取存储器(ESDRAM,Enhanced Synchronous Dynamic Random Access Memory)、同步连接动态随机存取存储器(SLDRAM,SyncLink Dynamic Random Access Memory)、直接内存总线随机存取存储器(DRRAM,Direct Rambus Random Access Memory)。本发明实施例描述的存储器802旨在包括但不限于这些和任意其它适合类型的存储器。
本发明实施例中的存储器802用于存储各种类型的数据以支持电子设备800的操作。这些数据的示例包括:用于在电子设备800上操作的任何计算机程序,如应用程序8021。实现本发明实施例方法的程序可以包含在应用程序8021中。
上述本发明实施例揭示的方法可以应用于处理器801中,或者由处理器801实现。处理器801可能是一种集成电路芯片,具有信号的处理能力。在实现过程中,上述方法的各步骤可以通过处理器801中的硬件的集成逻辑电路或者软件形式的指令完成。上述的处理器801可以是通用处理器、数字信号处理器(DSP,Digital Signal Processor),或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件等。处理器801可以实现或者执行本发明实施例中的公开的各方法、步骤及逻辑框图。通用处理器可以是微处理器或者任何常规的处理器等。结合本发明实施例所公开的方法的步骤,可以直接体现为硬件译码处理器执行完成,或者用译码处理器中的硬件及软件模块组合执行完成。软件模块可以位于存储介质中,该存储介质位于存储器802,处理器801读取存储器802中的信息,结合其硬件完成前述方法的步骤。
在示例性实施例中,电子设备800可以被一个或多个应用专用集成电路(ASIC,Application Specific Integrated Circuit)、DSP、可编程逻辑器件(PLD,Programmable Logic Device)、复杂可编程逻辑器件(CPLD,Complex Programmable Logic Device)、FPGA、通用处理器、控制器、MCU、MPU、或其他电子元件实现,用于执行前述方法。
本发明实施例还提供了一种存储介质,用于存储计算机程序。
可选的,该存储介质可应用于本发明实施例中的终端设备,并且该计算机程序使得计算机执行本发明实施例的各个方法中的相应流程,为了简洁,在此不再赘述。
本发明是参照根据本发明实施例的方法、设备(系统)、和计算机程序产品的流程图和/或方框图来描述的。应理解可由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计算机、嵌入式处理机或其他可编程数据处理设备的处理器以产生一个机器,使得通过计算机或其他可编程数据处理设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。
这些计算机程序指令也可存储在能引导计算机或其他可编程数据处理设备以特定方式工作的计算机可读存储器中,使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品,该指令装置实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能。
这些计算机程序指令也可装载到计算机或其他可编程数据处理设备上,使得在计算机或其他可编程设备上执行一系列操作步骤以产生计算机实现的处理,从而在计算机或其他可编程设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。
以上所述,仅为本发明的较佳实施例而已,并非用于限定本发明的保护范围,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。

Claims (20)

  1. 一种振动控制方法,所述方法包括:
    采集终端设备的温度;
    确定所述温度对应的目标频率偏移量;
    根据所述目标频率偏移量控制所述终端设备中谐振装置的振动。
  2. 根据权利要求1所述的方法,其中,所述方法还包括:
    基于接收到的指示所述谐振装置进行振动的驱动指令的触发,生成温度检测指令;
    基于所述温度检测指令开始采集所述终端设备的温度。
  3. 根据权利要求1所述的方法,其中,所述确定所述温度对应的目标频率偏移量,包括:
    获取设定的温度范围与频率偏移量的对应关系所包括的温度范围;
    确定所获取的温度范围中,所述温度所属的目标温度范围;
    根据所述对应关系,确定所述目标温度范围对应的目标频率偏移量。
  4. 根据权利要求1所述的方法,其中,所述确定所述温度对应的目标频率偏移量,包括:
    将所述温度输入偏移量网络模型,得到所述偏移量网络模型输出的目标频率偏移量。
  5. 根据权利要求1至4任一项所述的方法,其中,所述根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动,包括:
    获取驱动所述谐振装置进行振动的驱动信号的参考频率;
    根据所述目标频率偏移量对所述参考频率进行校正,得到目标频率;
    以所述目标频率驱动所述谐振装置进行振动。
  6. 根据权利要求1至4任一项所述的方法,其中,在根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动之后,所述方法还包括:
    检测所述谐振装置振动的频率;
    根据所检测的频率,对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。
  7. 根据权利要求6所述的方法,其中,所述根据所检测的频率,对所述目标频 率偏移量进行校正,得到校正后的目标频率偏移量,包括:
    将所检测的频率和驱动所述谐振装置振动的驱动信号的参考频率进行比较;
    当所检测的频率和所述参考频率的频率差值大于指定的频率差阈值,通过所述频率差值对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。
  8. 根据权利要求6所述的方法,其中,所述方法还包括:
    基于所述校正后的目标频率偏移量,对温度范围与频率偏移量的对应关系中的所述目标频率偏移量进行更新。
  9. 根据权利要求6所述的方法,其中,所述方法还包括:
    基于所述校正后的目标频率偏移量,对偏移量网络模型的参数进行更新。
  10. 一种终端设备,所述终端设备包括:
    采集单元,配置为采集终端设备的温度;
    确定单元,配置为确定所述温度对应的目标频率偏移量;
    控制单元,配置为根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动。
  11. 根据权利要求10所述的终端设备,其中,所述终端设备还包括:
    触发单元,配置为基于接收到的指示所述谐振装置进行振动的驱动指令的触发,生成温度检测指令;
    所述采集单元,还配置为基于所述温度检测指令开始采集所述终端设备的温度。
  12. 根据权利要求10所述的终端设备,其中,所述确定单元,还配置为:
    获取设定的温度范围与频率偏移量的对应关系所包括的温度范围;
    确定所获取的温度范围中,所述温度所属的目标温度范围;
    根据所述对应关系,确定所述目标温度范围对应的目标频率偏移量。
  13. 根据权利要求10所述的终端设备,其中,所述确定单元,还配置为:
    将所述温度输入偏移量网络模型,得到所述偏移量网络模型输出的目标频率偏移量。
  14. 根据权利要求10至13任一项所述的终端设备,其中,所述控制单元,还配置为:
    获取驱动所述谐振装置进行振动的驱动信号的参考频率;
    根据所述目标频率偏移量对所述参考频率进行校正,得到目标频率;
    以所述目标频率驱动所述谐振装置进行振动。
  15. 根据权利要求10至13任一项所述的终端设备,其中,所述终端设备还包括:
    检测单元,配置为在根据所述目标频率偏移量控制所述终端设备中的谐振装置的振动之后,检测所述谐振装置振动的频率;
    校正单元,配置为根据所检测的频率,对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。
  16. 根据权利要求15所述的终端设备,其中,所述校正单元,还配置为:
    将所检测的频率和驱动所述谐振装置振动的驱动信号的参考频率进行比较;
    当所检测的频率和所述参考频率的频率差值大于指定的频率差阈值,通过所述频率差值对所述目标频率偏移量进行校正,得到校正后的目标频率偏移量。
  17. 根据权利要求15所述的终端设备,其中,所述终端设备还包括:
    第一更新单元,配置为:基于所述校正后的目标频率偏移量,对温度范围与频率偏移量的对应关系中的所述目标频率偏移量进行更新。
  18. 根据权利要求15所述的终端设备,其中,所述终端设备还包括:
    第二更新单元,配置为:基于所述校正后的目标频率偏移量,对偏移量网络模型的参数进行更新。
  19. 一种终端设备,包括:
    存储器,用于存储可执行指令;
    处理器,用于执行所述存储器中存储的可执行指令时,实现权利要求1至9任一项所述的振动控制方法的步骤。
  20. 一种存储介质,存储有可执行指令,用于引起处理器执行时,实现权利要求1至9任一项所述的振动控制方法。
PCT/CN2019/120925 2019-11-26 2019-11-26 振动控制方法、终端设备及存储介质 WO2021102678A1 (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113625658A (zh) * 2021-08-17 2021-11-09 杭州飞钛航空智能装备有限公司 偏移信息处理方法、装置、电子设备和制孔机构

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7145402B2 (en) * 2004-06-24 2006-12-05 Nokia Corporation Multi-mode frequency synthesizer with temperature compensation
CN102141771A (zh) * 2011-03-08 2011-08-03 无锡辐导微电子有限公司 一种频率校正方法和装置
CN103138749A (zh) * 2011-11-24 2013-06-05 无锡辐导微电子有限公司 改进的频率校正方法和装置
CN105720971A (zh) * 2014-12-22 2016-06-29 英特尔Ip公司 锁相环的粗调谐选择
US9621170B2 (en) * 2013-08-13 2017-04-11 Silicon Laboratories Inc. Accurate frequency control using a MEMS-based oscillator
CN107306132A (zh) * 2016-04-25 2017-10-31 精工爱普生株式会社 电路装置、振荡器、电子设备以及移动体
CN110380724A (zh) * 2019-07-26 2019-10-25 北京智芯微电子科技有限公司 Rtc时钟频率温度补偿芯片

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7145402B2 (en) * 2004-06-24 2006-12-05 Nokia Corporation Multi-mode frequency synthesizer with temperature compensation
CN102141771A (zh) * 2011-03-08 2011-08-03 无锡辐导微电子有限公司 一种频率校正方法和装置
CN103138749A (zh) * 2011-11-24 2013-06-05 无锡辐导微电子有限公司 改进的频率校正方法和装置
US9621170B2 (en) * 2013-08-13 2017-04-11 Silicon Laboratories Inc. Accurate frequency control using a MEMS-based oscillator
CN105720971A (zh) * 2014-12-22 2016-06-29 英特尔Ip公司 锁相环的粗调谐选择
CN107306132A (zh) * 2016-04-25 2017-10-31 精工爱普生株式会社 电路装置、振荡器、电子设备以及移动体
CN110380724A (zh) * 2019-07-26 2019-10-25 北京智芯微电子科技有限公司 Rtc时钟频率温度补偿芯片

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113625658A (zh) * 2021-08-17 2021-11-09 杭州飞钛航空智能装备有限公司 偏移信息处理方法、装置、电子设备和制孔机构

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