WO2021100973A1

WO2021100973A1 - Buttonless touch sensor module assembly and method of assembling same

Info

Publication number: WO2021100973A1
Application number: PCT/KR2020/002169
Authority: WO
Inventors: 권혁일; 백승현
Original assignee: 주식회사 타키온
Priority date: 2019-11-22
Filing date: 2020-02-14
Publication date: 2021-05-27
Also published as: KR102172446B1

Abstract

According to the present invention, disclosed is a buttonless touch sensor module assembly which is mounted on a mobile device (300) and outputs a detection signal in response to a user's touch operation, the buttonless touch sensor module assembly comprising: a sensor PCB (110) which has one or more sensor elements (111) for detecting the user's touch operation mounted on one side thereof, and which is signal-connected to a device PCB (310) of the mobile device (300) and outputs a detection signal of a sensor element (111); a support member (120) that has one side attached to one side of the sensor PCB (110) and has a sensor insertion hole (121) for inserting the sensor element (111), the sensor insertion hole (121) being formed open at a position corresponding to the sensor element (111); and a fixing member (130) that has one side attached to the other side of the support member (120) and the other side attached to an inner surface of a frame (320) of the mobile device (300).

Description

Buttonless touch sensor module assembly and assembly method thereof

The present invention relates to a buttonless touch sensor module assembly and a method of assembling the same, and more particularly, to a buttonless touch sensor module assembly mounted on a mobile device and outputting a sensing signal according to a user's touch operation, and a manufacturing method thereof. .

In general, mobile devices such as smartphones, tablets, earphones and cameras, smart watches and smart bands are equipped with physical buttons for user operation. And it was equipped with a volume button disposed on the left side of the frame, so that the user could control the operation of the smartphone.

However, there is a narrow gap between the body and the button in consideration of the operation range of the button, and moisture and foreign substances penetrate through this gap during use or storage, causing malfunction or failure of the device, as well as in order to form a physical button. There is a problem in that the manufacturing cost increases due to the need for parts and equipment.

Therefore, in recent years, there has been an attempt to implement buttonless by mounting a touch sensor inside a mobile device instead of such a physical button. For this, a method of attaching a touch sensor to the inside of a mobile device using an epoxy or adhesive sheet was considered. However, in the case of attaching the touch sensor using epoxy, there is a problem that the number of man-hours increases as much as the number of sensor elements because the epoxy coating process and the curing process are each performed as much as the number of sensor elements of the touch sensor. In addition, when the adhesive sheet is used, there is a problem that the surface area of the touch sensor is too small in units of several millimeters to be firmly fixed.

[Prior technical literature]

(Patent Literature)

(Patent Document 1) Registered Patent Publication No. 10-1398182 (2014.05.15), a direct execution method of application software of a smartphone using a hardware input device, and a smartphone having such a function.

The present invention was created to solve the above-described problems, and an object of the present invention is to fundamentally solve the waterproof and dustproof problems by implementing a buttonless mobile device, and an additional mold for forming an additional mechanism for forming a physical button Ease and simplicity of product design is possible through the simplification of the frame on which the button is mounted on the mobile device as it can exclude parts or components, thereby increasing the degree of freedom in design, UX, and UI design, and a single man-hour regardless of the number of sensor elements installed. It is to provide a buttonless touch sensor module assembly having a structure that can be easily fixedly mounted inside a frame of a mobile device and a method of assembling the same.

A buttonless touch sensor module assembly according to the present invention for achieving the above object is a buttonless touch sensor module assembly that is mounted on a mobile device 300 and outputs a detection signal according to a user's touch operation, wherein A sensor that has at least one sensor element 111 for detecting a user's touch operation and is signal-connected to the device PCB 310 of the mobile device 300 to output a detection signal of the sensor element 111 to the mobile device 300 side. PCB 110; A sensor insertion hole 121 for penetrating the sensor element 111 is opened at a position corresponding to the sensor element 111 to surround the circumference of the sensor element 111, and one side of the sensor PCB ( A support member 120 attached to one side of the 110); And one side is attached to the other side of the support member 120 and the other side is attached to the inner side of the mobile device 300 to fix the sensor PCB 110 to the mounting position on the mobile device 300. Member 130; includes.

Here, before the fixing member 130 is attached to the inner surface of the mobile device 300, the fixing member 130 is attached to the other side of the fixing member 130 to protect the adhesive surface formed on the other side from the outside, and the fixing member 130 ) Is separated from the fixing member 130 when attached to the inner side of the mobile device 300 to expose the other side to the outside; may further include.

In addition, the mounting portion on the mobile device 300 to which the other side of the fixing member 130 is attached is made of a metal material, and the sensor element 111 emits ultrasonic waves penetrating the mounting portion of the mobile device 300 It may be an ultrasonic sensor device that receives a reflected wave and senses a user's touch operation.

In addition, the fixing member 130 is made of a curable resin material or a curable resin is applied to the surface and is cured by heat or UV rays applied while attached to the mounting position on the mobile device 300. The sensor PCB 110 can be fixedly mounted at the mounting position of ).

In addition, the support member 120 is made of a thickness (D2) corresponding to the thickness (D1) of the sensor PCB 110 so that the other side is disposed flat with the sensing surface of the sensor PCB 110, the fixing member 130 may be attached to the other side of the support member 120 in a form in which one side covers the other side of the support member 120 and the sensing surface of the sensor PCB 110 at the same time.

In addition, the fixing member 130 may be made of a curable resin material that is heat cured at a heating temperature of 50°C to 80°C, or a curable resin may be applied to the surface.

In addition, the fixing member 130 is made of a curable resin material, but an adhesive sheet 131 is disposed in a partial area of the other side, and is temporarily placed at the mounting position of the mobile device 300 by the adhesive force of the adhesive sheet 131 before being cured. Can be attached to.

A method of assembling a buttonless touch sensor module assembly according to the present invention for achieving the above object is a method of assembling a buttonless touch sensor module assembly that is mounted on a mobile device 300 and outputs a detection signal according to a user's touch operation. In the mobile device, at least one sensor device 111 for sensing a user's touch operation is mounted on one side and is signal-connected to the device PCB 310 of the mobile device 300 to transmit the detection signal of the sensor device 111 to the mobile device. A sensor PCB preparation step (S210) of preparing the sensor PCB 110 for output to the 300 side; A sensor insertion hole 121 for penetrating the sensor element 111 is opened at a position corresponding to the sensor element 111 to surround the circumference of the sensor element 111, and one side of the sensor PCB ( A support member arranging step (S220) of arranging the support member 120 attached to one side of 110); One side is attached to the other side of the support member 120, and the other side is attached to the inner side of the mobile device 300 by using a fixing member 130 to connect the sensor PCB 110 to the mobile device 300. It includes; a sensor PCB fixing step (S260) for fixing the image to the mounting position.

Here, a release film disposing step (S230) of attaching a release film 140 for protecting the adhesive surface formed on the other side of the fixing member 130 from the outside to the other side of the fixing member 130 (S230); A release film separating step (S240) of separating the release film 140 attached to the other side of the fixing member 130 from the fixing member 130; And a fixing member attaching step (S250) of attaching the other side of the fixing member 130 to a mounting position on the mobile device 300 (S250).

In addition, the mounting portion on the mobile device 300 to which the other side of the fixing member 130 is attached is made of a metal material, and the sensor PCB preparation step (S210) includes the sensor element 111 being applied to the mobile device 300 A sensor PCB, which is an ultrasonic sensor element that senses touch by emitting ultrasonic waves penetrating the mounting part of) and receiving reflected waves, can be prepared.

In addition, the fixing member 130 is made of a curable resin material or a curable resin is applied to the surface, and in the step of fixing the sensor PCB (S260), the fixing member 130 attached to the mounting position on the mobile device 300 is The sensor PCB 110 may be fixedly mounted at the mounting position by applying heat to cure.

Meanwhile, in the step of fixing the sensor PCB (S260), the mobile device 300 to which the sensor PCB 110 is attached to the inner side through the fixing member 130 is placed in the heating chamber 400, and heat is applied to the fixing member 130. However, it may be thermally cured at a heating temperature of 50°C to 80°C.

According to the buttonless touch sensor module assembly and manufacturing method thereof according to the present invention,

First, the sensor PCB 110 is mounted with one or more sensor elements 111 for detecting a user's touch operation on one side, and is signal-connected to the device PCB 310 of the mobile device 300 to detect the sensor element 111 A signal is output, and the support member 120 has a sensor insertion hole 121 for penetrating the sensor element 111 to be inserted at a position corresponding to the sensor element 111 to round the circumference of the sensor element 111 In the form, one side is attached to one side of the sensor PCB 110, one side of the fixing member 130 is attached to the other side of the support member 120, and the other side is attached to the inner side of the mobile device 300 As a result, it is possible to fundamentally solve the waterproof and dustproof problem by implementing buttonless of the mobile device, and it is possible to exclude additional molds or parts for forming an additional mechanism for forming a physical button, so that the button is mounted on the mobile device 300 Through the simplification of the product design, it is possible to increase the freedom of design, UX, and UI design, and it can be easily fixed and mounted inside the frame of the mobile device with one man-hour regardless of the number of sensor elements installed.

Second, the release film 140 is attached to the other side of the fixing member 130 before the fixing member 130 is attached to the frame 320 of the mobile device 300 to protect the adhesive surface formed on the other side from the outside. When the fixing member 130 is attached to the frame 320 of the mobile device 300, it is separated from the fixing member 130 and exposes the other side to the outside, so that foreign substances or moisture contact the adhesive force of the adhesive surface. This deterioration can be prevented in advance.

Third, the sensor element 111 is provided as an ultrasonic sensor element that emits ultrasonic waves penetrating the mounting portion of the mobile device 300 and receives a reflected wave to sense a touch. Even if the mounting part to which the other side is attached (for example, the frame 320) is made of a metal material, the user's touch that contacts the outer surface of the mounting part, unlike conventional capacitive or electric resistance touch sensors, etc. Manipulation can be sensitively detected.

Fourth, the fixing member 130 is made of a curable resin material or a curable resin is applied to the surface and cured by heat or UV rays applied while attached to the mounting position on the mobile device 300, while the mobile device 300 ) By fixing the sensor PCB 110 at the mounting position, it is possible to provide a more robust fixing force than the case of fixing only with an adhesive sheet, and the fixing member 130 is firmly hardened, so that the ultrasonic wave of the sensor element 111 is applied to the mobile device. It can function as a medium so that it can be delivered to the mounting portion of the 300.

Fifth, the support member 120 is made of a thickness (D2) corresponding to the thickness (D1) of the sensor PCB (110) so that the other side is disposed flat with the sensing surface of the sensor PCB (110), the fixing member 130 is attached to the other side of the support member 120 in a form in which one side covers the other side of the support member 120 and the sensing surface of the sensor PCB 110 at the same time, thereby radiating from the sensor element 111 It is possible to provide a condition in which ultrasonic waves can pass through the fixing member 130 as a medium and be transmitted to the mobile device 300.

Sixth, the fixing member 130 is made of a curable resin material that is heat-cured at a heating temperature of 50° C. to 80° C. or a curable resin is applied to the surface, thereby fixing the fixing member 130 on the inner surface of the mobile device 300. ), even if the heating process is performed while the sensor PCB 110 is attached, the phenomenon that the paint or other accessories applied to the mobile device 300 is deformed or damaged by heat can be prevented in advance, and at the same time, the fixing member 130 ) Can be used as an ultrasonic medium for the sensor element 111 by hardening it.

Seventh, the fixing member 130 is made of a curable resin material, but an adhesive sheet 131 is disposed in a partial area of the other side, and is temporarily placed at the mounting position of the mobile device 300 by the adhesive force of the adhesive sheet 131 before being cured. By being attached, it is possible to prevent the fixing member 130 from being separated from the frame 320 or moving in position when moving in the heating process.

1 is a perspective view showing a state in which a buttonless touch sensor module assembly according to a preferred embodiment of the present invention is mounted on an inner side of a mobile device;

2 is an exploded perspective view showing the configuration of a buttonless touch sensor module assembly according to a preferred embodiment of the present invention,

3 to 6 are side cross-sectional views for explaining the assembly process of the buttonless touch sensor module assembly according to a preferred embodiment of the present invention;

7 and 8 are side cross-sectional views showing a configuration in which a buttonless touch sensor module assembly according to a preferred embodiment of the present invention is attached to an inner surface of a mobile device;

9 is a schematic view showing a configuration for thermally curing a fixing member according to a preferred embodiment of the present invention,

10 is a block diagram showing each step of a method of assembling a buttonless touch sensor module assembly according to a preferred embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as being limited to their usual or dictionary meanings, and the inventors appropriately explain the concept of terms in order to explain their own invention in the best way. Based on the principle that it can be defined, it should be interpreted as a meaning and concept consistent with the technical idea of the present invention.

Accordingly, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferred embodiment of the present invention, and do not represent all the technical spirit of the present invention. It should be understood that there may be equivalents and variations.

First, the configuration and function of the buttonless touch sensor module assembly 100 according to a preferred embodiment of the present invention will be described. As shown in Figure 1, the buttonless touch sensor module assembly 100 according to a preferred embodiment of the present invention is mounted on mobile devices 300 such as smartphones, tablets, earphones, cameras, smart watches, and smart bands. A detection signal according to a user's touch operation is output, and for this purpose, as shown in FIG. 2, a sensor PCB 110, a support member 120 and a fixing member 130 are included.

The sensor PCB 110 is mounted with one or more sensor elements 111 for detecting a user's touch operation on one side (top surface based on the drawing), and the device PCB 310 (refer to FIG. 1) of the mobile device 300 and The signal is connected to output a detection signal of the sensor element 111.

Here, the drawings illustrate that two sensor elements 111 are arranged on one sensor PCB 110, but are not limited thereto, and one or three or more sensor elements ( It goes without saying that 111) can be deployed. In addition, although the drawing illustrates that the sensor PCB 110 is mounted on the frame 320 constituting the border of the mobile device 300, the conventional push button method is also used if the surface of the mobile device 300 requires a touch operation. Can be equipped in place of the physical button of. Hereinafter, it will be described by exemplifying that the sensor PCB 110 is fixedly mounted on the frame 320 of the mobile device 300.

The support member 120 is an empty space generated between the mounting surface of the mobile device 300 and one side of the sensor PCB 110 due to the protruding shape of the sensor element 111, that is, each sensor element 111 A member disposed in the circumferential space of the liver to form an adhesive surface with the mounting portion of the mobile device 300 by the fixing member 130, and the sensor element 111 penetrates at a position corresponding to the sensor element 111 A sensor insertion hole 121 for insertion is opened to surround the sensor element 111 and one side (a bottom surface based on the drawing) is attached to one side of the sensor PCB 110.

Here, the support member 120 may be made of a plate-shaped base material (substrate) and an adhesive disposed on one or more of both surfaces, and basically, an adhesive is disposed on one side of the sensor PCB 110. Attached to and on the other side, an adhesive may be selectively disposed according to the adhesive component of the fixing member 130.

In addition, the sensor insertion hole 121 is opened up and down as shown in the drawing, and the sensor element 111 of the sensor PCB 110 is inserted downward, so that the surface of the sensor element 111 may be exposed to the top. The sensor insertion hole 121 is provided to enable replacement or maintenance of the sensor element 111 by preventing the adhesive of the fixing member 130 from contacting the surface of the sensor element 111 because the lower portion is open but the upper portion is not open. Can be. In this case, it is preferable that the base material of the support member 120 or the material of the upper portion of the sensor insertion hole 121 that is not open is made of a solid material so as to act as a medium of ultrasonic waves.

The fixing member 130 is a means for attaching the support member 120 and the sensor PCB 110 to the set mounting position of the mobile device 300, that is, to the inside of the frame 320, one side (the bottom surface based on the drawing) is It is attached to the other side of the support member 120 and the other side (top surface based on the drawing) is attached to the inner side of the mobile device 300, so that the sensor PCB 110 is mounted on the mobile device 300 (frame 320 )).

Here, the fixing member 130 may be formed in a form in which adhesives are disposed on both surfaces of a plate-shaped base material, like the support member 120 described above, and alternatively, the fixing member 130 may be formed of only the adhesive itself. However, the adhesive component of the fixing member 130 is made of the above-described curable material.

Through the combination of the sensor PCB 110, the support member 120, and the fixing member 130, the buttonless of the mobile device 300 can be implemented to fundamentally solve the waterproof and dustproof problems, and to form a physical button. Since additional molds or parts for additional mechanism formation can be excluded, the ease and simplification of product design is possible through the simplification of the frame on which the button is mounted on the mobile device 300, thereby increasing the design, UX, and UI design freedom, and the sensor Regardless of the number of devices 111 to be mounted, it can be easily fixedly mounted on the inner surface of the mobile device 300 with a single man-hour.

Meanwhile, the buttonless touch sensor module assembly 100 according to a preferred embodiment of the present invention may be provided with a release film 140 for protecting the adhesive surface of the fixing member 130.

The release film 140 is attached to the other side of the fixing member 130 before the fixing member 130 is attached to the inner surface of the mobile device 300 to protect the adhesive surface formed on the other side from the outside, When the fixing member 130 is attached to the inner surface of the mobile device 300, it is separated from the fixing member 130 and exposes the other side to the outside. Can be prevented.

Meanwhile, as the sensor element 111 mounted on the sensor PCB 110, various sensor elements capable of detecting a user's touch operation, such as a capacitive type, an electric resistance type, and a pressure type, may be used. In addition, a portion of the mobile device 300 on which the sensor element 111 is mounted may be made of a metal material or a synthetic resin material having high strength and high hardness. However, when a portion of the mobile device 300 on which the sensor element 111 is mounted is made of a material that conducts electricity, such as a metal material, the use of a capacitive type sensor element or an electric resistance type sensor element is limited. However, recently, in the case of smartphones or tablets, in order to increase the durability of the device and make the appearance beautiful, the frame is frequently formed of a metal material.

Accordingly, the sensor element 111 is provided as an ultrasonic sensor element that emits ultrasonic waves penetrating the mounting portion of the mobile device 300 and receives the reflected wave to sense a touch. Even if the mounting part to which the other side is attached is made of a metal material, unlike a conventional capacitive type or electric resistance type touch sensor, it is possible to sensitively detect a user's touch operation in contact with the outer surface of the mounting part.

However, when the sensor element 111 is made of an ultrasonic sensor element, when the fixing member 130 disposed between the mounting portion of the mobile device 300 and the surface of the sensor element 111 is made of a soft material, the detection performance is reduced. As a result, the touch operation may be erroneously sensed or malfunction may occur. Accordingly, the fixing member 130 is made of a curable resin material or a curable resin is applied to the surface and cured by heat or UV rays applied while attached to the mounting position on the mobile device 300, and the mobile device 300 By fixing the sensor PCB 110 at the mounting position of the sensor PCB 110, it is possible to provide a more robust fixing force than the case of fixing only with the adhesive sheet, and the fixing member 130 is firmly hardened so that the ultrasonic waves of the sensor element 111 are applied to the mobile device ( It can function as a medium so that it can be delivered to the mounting portion of 300).

In addition, the fixing member 130 is made of a curable resin material that is heat-cured at a heating temperature of 50°C to 80°C, or a curable resin is applied to the surface, thereby fixing the fixing member 130 on the inner surface of the mobile device 300. ), even if the heating process is performed while the sensor PCB 110 is attached, the phenomenon that the paint or other accessories applied to the mobile device 300 is deformed or damaged by heat can be prevented in advance, and at the same time, the fixing member 130 ) Can be used as an ultrasonic medium for the sensor element 111 by hardening it. Here, when the heating temperature is less than 50 degrees Celsius, the thermosetting resin may not be solidly cured or the time required for curing may be too long. If the heating temperature exceeds 80 degrees Celsius, the thermosetting resin is over-deformed or the mobile device 300 The structure of the paint or synthetic resin material applied to the part side may be deformed or damaged.

In addition, the support member 120 has a thickness (D2) corresponding to the thickness (D1) of the sensor PCB (110) as shown in Figure 4 so that the other side is disposed flat with the sensing surface of the sensor PCB (110). The fixing member 130 is attached to the other side of the support member 120 in a form in which one side of the fixing member 130 covers the other side of the support member 120 and the sensing surface of the sensor PCB 110 at the same time, It is possible to provide a condition in which ultrasonic waves emitted from the device 111 can pass through the fixing member 130 as a medium and are transmitted to the mobile device 300.

In addition, if the fixing member 130 is made of a curable resin, but a material having a certain adhesive force acting on the surface in a state before curing, the other side may be attached to the inner surface of the mobile device 300 before the curing process, but the adhesive strength is It may be a material that does not act on the surface and only works when it is cured. To this end, as shown in FIG. 8, the fixing member 130 is made of a curable resin material, but an adhesive sheet 131 is disposed in a partial area of the other side, so that the mobile device ( By being temporarily attached to the mounting position of 300), it is possible to prevent the fixing member 130 from being separated from the frame 320 or moving in position when moving in the heating process.

Next, a method of assembling a buttonless touch sensor module assembly according to a preferred embodiment of the present invention will be described with reference to FIG. 10. Referring to the drawings, a method of assembling a buttonless touch sensor module assembly according to a preferred embodiment of the present invention includes a sensor PCB preparation step (S210), a support member arrangement step (S220), and a sensor PCB fixing step (S260).

First, the sensor PCB preparation step (S210) is a step of preparing the sensor PCB 110 to be mounted on the mobile device 300. As shown in FIG. 3, one or more sensor elements ( 111) is mounted on one side and is signal-connected to the device PCB 310 of the mobile device 300 to prepare a sensor PCB 110 for outputting a detection signal of the sensor element 111 to the mobile device 300 side. . Here, the drawing illustrates that two sensor elements 111 are arranged on one sensor PCB 110, but one or three or more sensor elements 111 are arranged according to the product design or the required number of touch positions. It goes without saying that the sensor PCB 110 can be prepared.

The support member arranging step (S220) is a step of disposing a support member 120 forming a contact surface for attaching the sensor PCB 110 to the mobile device 300, at a position corresponding to the sensor element 111 One side of the support member 120 in which the sensor insertion hole 121 is opened for the sensor element 111 to be inserted therethrough surrounds the circumference of the sensor element 111, and one side of the sensor PCB 110 is Arrange to be attached to one side.

In the step of fixing the sensor PCB (S260), one side is attached to the other side of the support member 120 and the other side is attached to the inner side of the mobile device 300 by using the sensor PCB ( 110) is fixed to the mounting position on the mobile device 300.

Here, the mounting portion on the mobile device 300 to which the other side of the fixing member 130 is attached is made of a metal material, and the sensor PCB preparation step (S210) includes the sensor element 111 being the mobile device 300 A sensor PCB, which is an ultrasonic sensor element that senses touch by emitting ultrasonic waves penetrating the mounting part of) and receiving reflected waves, can be prepared.

In addition, the fixing member 130 is made of a curable resin material or a curable resin is applied to the surface, and as shown in FIG. 9, the step of fixing the sensor PCB (S260) is attached to the mounting position on the mobile device 300 The sensor PCB 110 may be fixedly mounted at the mounting position by applying heat or UV light so that the fixed fixing member 130 is cured.

In addition, in the step of fixing the sensor PCB (S260), the mobile device 300 to which the sensor PCB 110 is attached to the inner side through the fixing member 130 is placed in the heating chamber 400 and fixed by applying heat. Although the member 130 is thermally cured, it may not be deformed even if the paint is coated on the mobile device 300 by thermally curing the member 130 at a heating temperature of 50°C to 80°C.

Meanwhile, after performing the process of attaching the support member 120 to the sensor PCB 110 and attaching the fixing member 130 to the support member 120, the buttonless touch sensor module assembly 100 in a mutually assembled state. A process of attaching and curing the mobile device 300 to the mobile device 300 as a post process in another place may be performed.

To this end, the method of assembling a buttonless touch sensor module assembly according to a preferred embodiment of the present invention is, after the process of attaching one side of the goblet to the other side of the support member 120, the other side of the fixing member 130 A release film disposing step (S230) of attaching a release film 140 for protecting the adhesive surface formed on the outside to the other side of the fixing member 130, and a release film attached to the other side of the fixing member 130 ( 140) a release film separation step (S240) of separating the fixing member 130 from the fixing member 130, and a fixing member attaching step (S250) of attaching the other side of the fixing member 130 to a mounting position on the mobile device 300 (S250). You can do more.

In addition, after the fixing member attaching step (S250), in the sensor PCB fixing step (S260), a process of curing the fixing member 130 attached to the inner surface of the mobile device 300 is performed to provide the sensor to the mobile device 300. The PCB 110 may be rigidly mounted.

As described above, although the present invention has been described by the limited embodiments and drawings, the present invention is not limited thereto, and the technical spirit of the present invention and the following by those of ordinary skill in the technical field to which the present invention pertains. It goes without saying that various modifications and variations are possible within the equal range of the claims to be described.

(Explanation of code)

100...buttonless touch sensor module assembly

110...sensor PCB 111...sensor element

120...Support member 121...Sensor insertion hole

130...Fixed material 140...release film

300...mobile device 310...device PCB

S210...Sensor PCB preparation step S220...Support member arrangement step

S230...Release Film Arrangement Step S250...Release Film Separation Step

S250...Fixing material attaching step S260...Sensor PCB fixing step

Claims

In the buttonless touch sensor module assembly that is mounted on the mobile device 300 and outputs a detection signal according to a user's touch operation,

On one side, one or more sensor elements 111 for detecting a user's touch operation are mounted, and the signal is connected to the device PCB 310 of the mobile device 300 to transmit the detection signal of the sensor element 111 to the mobile device 300. A sensor PCB 110 that outputs;

A sensor insertion hole 121 for penetrating the sensor element 111 is opened at a position corresponding to the sensor element 111 to surround the circumference of the sensor element 111, and one side of the sensor PCB ( A support member 120 attached to one side of the 110); And

A fixing member having one side attached to the other side of the support member 120 and the other side attached to the inner side of the mobile device 300 to fix the sensor PCB 110 to the mounting position on the mobile device 300 (130); buttonless touch sensor module assembly comprising a.
The method according to claim 1,

Before the fixing member 130 is attached to the inner surface of the mobile device 300, it is attached to the other side of the fixing member 130 to protect the adhesive surface formed on the other side from the outside, and the fixing member 130 When attached to the inner surface of the mobile device 300, the release film 140 is separated from the fixing member 130 to expose the other side to the outside; a buttonless touch sensor module assembly, characterized in that it further comprises.
The method according to claim 1,

The mounting portion on the mobile device 300 to which the other side of the fixing member 130 is attached is made of a metal material,

The sensor element 111 is a buttonless touch sensor module assembly, characterized in that the ultrasonic sensor element for detecting a user's touch operation by emitting ultrasonic waves penetrating the mounting portion of the mobile device 300 and receiving a reflected wave.
The method of claim 3,

The fixing member 130 is made of a curable resin material or a curable resin is applied to the surface and cured by heat or UV rays applied while attached to the mounting position on the mobile device 300. A buttonless touch sensor module assembly, characterized in that the sensor PCB 110 is fixedly mounted at the mounting position.
The method of claim 4,

The support member 120 is made of a thickness (D2) corresponding to the thickness (D1) of the sensor PCB (110) so that the other side is disposed flat with the sensing surface of the sensor PCB (110),

The fixing member 130 is buttonless, characterized in that one side is attached to the other side of the support member 120 in a form that covers the other side of the support member 120 and the sensing surface of the sensor PCB 110 at the same time. Touch sensor module assembly.
In the method of assembling a buttonless touch sensor module assembly mounted on a mobile device 300 and outputting a detection signal according to a user's touch operation,

At least one sensor element 111 for sensing a user's touch operation is mounted on one side and is signal-connected to the device PCB 310 of the mobile device 300 to transmit a detection signal of the sensor element 111 to the mobile device 300 A sensor PCB preparation step (S210) of preparing the sensor PCB 110 for output to the side;

A sensor insertion hole 121 for penetrating the sensor element 111 is opened at a position corresponding to the sensor element 111 to surround the circumference of the sensor element 111, and one side of the sensor PCB ( A support member arranging step (S220) of arranging the support member 120 attached to one side of 110);

One side is attached to the other side of the support member 120, and the other side is attached to the inner side of the mobile device 300 by using a fixing member 130 to connect the sensor PCB 110 to the mobile device 300. A method of assembling a buttonless touch sensor module assembly comprising a; sensor PCB fixing step (S260) for fixing to the mounting position on the top.
The method of claim 6,

A release film disposing step (S230) of attaching a release film 140 for protecting the adhesive surface formed on the other side of the fixing member 130 from the outside to the other side of the fixing member 130;

A release film separating step (S240) of separating the release film 140 attached to the other side of the fixing member 130 from the fixing member 130; And

A method of assembling a buttonless touch sensor module assembly, further comprising: attaching the other side of the fixing member 130 to the mounting position on the mobile device 300 (S250).
The method of claim 6,

The mounting portion on the mobile device 300 to which the other side of the fixing member 130 is attached is made of a metal material,

The sensor PCB preparation step (S210) comprises preparing a sensor PCB, which is an ultrasonic sensor element that senses a touch by emitting an ultrasonic wave passing through the mounting portion of the mobile device 300 by the sensor element 111 and receiving a reflected wave. Method of assembling the buttonless touch sensor module assembly.
The method of claim 8,

The fixing member 130 is made of a curable resin material or a curable resin is applied to the surface,

The sensor PCB fixing step (S260) is a button, characterized in that the sensor PCB 110 is fixedly mounted at the mounting position by applying heat so that the fixing member 130 attached to the mounting position on the mobile device 300 is cured. How to assemble the lease touch sensor module assembly.
The method of claim 9,

In the step of fixing the sensor PCB (S260), the mobile device 300 to which the sensor PCB 110 is attached to the inside is placed in the heating chamber 400 through the fixing member 130, and heat is applied to heat the fixing member 130. Curing, but the method of assembling a buttonless touch sensor module assembly, characterized in that the heat curing at a heating temperature of 50 °C to 80 °C.