WO2018190460A1 - Optical sensor package - Google Patents

Optical sensor package Download PDF

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Publication number
WO2018190460A1
WO2018190460A1 PCT/KR2017/005487 KR2017005487W WO2018190460A1 WO 2018190460 A1 WO2018190460 A1 WO 2018190460A1 KR 2017005487 W KR2017005487 W KR 2017005487W WO 2018190460 A1 WO2018190460 A1 WO 2018190460A1
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WO
WIPO (PCT)
Prior art keywords
receiving surface
light receiving
sensor chip
adhesive film
sensor package
Prior art date
Application number
PCT/KR2017/005487
Other languages
French (fr)
Korean (ko)
Inventor
전문수
이현진
이민우
Original Assignee
주식회사 파트론
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Publication date
Application filed by 주식회사 파트론 filed Critical 주식회사 파트론
Publication of WO2018190460A1 publication Critical patent/WO2018190460A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Definitions

  • the present invention relates to an optical sensor package, and more particularly to a light receiving sensor package for detecting the light reflected from the surface of the sensing object.
  • Modern electronic devices such as smart phones, tablet computers, and wearable devices include various kinds of sensor devices.
  • recent electronic devices include proximity sensors, illuminance sensors, temperature sensors, heart rate sensors, gyro sensors, fingerprint sensors, and the like.
  • Many of the sensors correspond to optical sensors that sense and sense light.
  • a fingerprint sensor a method of sensing capacitance between a sensor and a fingerprint is mainly used in the past, but an optical method has recently been studied.
  • optical sensors are becoming increasingly slim.
  • the slim form factor is widely used because it is not only convenient for the user to use or carry, but also has excellent aesthetics. Therefore, the optical sensor accommodated in the electronic device is also required to be formed in a slim and miniaturized package.
  • the slim and compact optical sensor package not only has a difficult structural design but also requires a very precise process in assembling each component. Therefore, in the case of a slim and compact optical sensor package, there is a problem that the defect rate can be increased, thereby increasing the cost.
  • the problem to be solved by the present invention is to provide an optical sensor package that can contribute to the slimming of the electronic device mounted because the package is slim and compact.
  • Another object of the present invention is to provide an optical sensor package that is easy to assemble because the package is slim, compact, and simple in structure.
  • the optical sensor package of the present invention for solving the above problems, a sensor chip comprising a light receiving surface, an adhesive film covering the light receiving surface and the adhesive film, and comprises an optical filter covering the light receiving surface, the optical The filter has a first wavelength band as a pass band, and the adhesive film is translucent to the first wavelength band.
  • the first wavelength band may be an infrared wavelength band.
  • the adhesive film may be a die attach film.
  • it may further include a cover window facing the light receiving surface.
  • the cover window includes a recess formed in a portion facing the light receiving surface, at least a portion of the optical filter may be accommodated in the inner space of the recess.
  • the cover window may be transmissive to the first wavelength band, and the transmittance of the visible light band may be relatively lower than the first wavelength band.
  • the cover window and the optical filter may be spaced apart.
  • the adhesive film may have a light transmittance of 93% or more with respect to the first wavelength band.
  • the sensor chip further comprises a base substrate on which the sensor chip and the base substrate may be electrically connected by a wire.
  • the sensor chip further includes a surface formed stepped adjacent to the surface on which the light receiving surface is formed, the surface may be formed with a bonding pad to which the wire is coupled.
  • a lower surface is coupled to the base substrate, and further includes a bezel portion positioned around the sensor chip, the light receiving surface of the sensor chip and the upper surface of the bezel portion relative to the base substrate It can be located at the same height.
  • the sensor chip may be a fingerprint sensor chip.
  • An optical sensor package according to an embodiment of the present invention has the advantage that the size of the package is slim and small, which can contribute to slimming of the mounted electronic device.
  • the optical sensor package according to an embodiment of the present invention has the advantage that the size of the package is slim and compact, and the structure is simple and easy to assemble.
  • FIG. 1 is a perspective view of a light emitting sensor package according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line AA ′ of the light emitting sensor package according to the exemplary embodiment of the present invention shown in FIG. 1.
  • FIG. 3 is an exploded perspective view of a light emitting sensor package according to an embodiment of the present invention shown in FIG. 1.
  • FIG. 4 is a cross-sectional view of an optical sensor package according to another embodiment of the present invention.
  • FIG. 1 is a perspective view of a light emitting sensor package according to an embodiment of the present invention.
  • 2 is a cross-sectional view taken along line AA ′ of the light emitting sensor package according to the exemplary embodiment of the present invention shown in FIG. 1.
  • 3 is an exploded perspective view of a light emitting sensor package according to an embodiment of the present invention shown in FIG. 1.
  • the light emitting sensor package of the present invention includes a base substrate 100, a sensor chip 200, an adhesive film 350, an optical filter 300, and a bezel part 400.
  • the base substrate 100 may be a part forming the bottom surface of the optical sensor package of the present invention. Elements to be described later may be positioned on the base substrate 100.
  • the base substrate 100 may be a printed circuit board, a ceramic substrate, or a metal substrate having an anodization layer, but is not limited thereto.
  • the base substrate 100 may include an insulating layer, a conductor pattern, and a pad.
  • At least one pad 120 may be provided on an upper surface of the base substrate 100 to be electrically connected to the sensor chip 200 to be described later.
  • at least one pad (not shown) may be provided on the bottom surface of the base substrate 100 to transmit an electrical signal or supply power to the optical sensor package of the present invention.
  • the pad of the base substrate 100 may be coupled in various ways such as an electronic component, a semiconductor device, various passive devices, or a lead frame.
  • the mounting region 110 is provided on the top surface of the base substrate 100.
  • the sensor chip 200 to be described later is located in the mounting region 110.
  • the pad on the top surface of the base substrate 100 may be positioned around the mounting area 110.
  • the bezel part coupling part to which the bezel part 400 to be described later is coupled may be provided around the mounting area 110.
  • the sensor chip 200 is an electronic component including the light receiving surface 210.
  • the sensor chip 200 is defined as a bottom surface that is coupled to the base substrate 100, the light receiving surface 210 is formed on at least a portion of the top surface.
  • the light receiving surface 210 and at least one bonding pad 220 may be formed on an upper surface of the sensor chip 200.
  • the sensor chip 200 is coupled to the mounting region 110 of the base substrate 100. Specifically, the lower surface of the sensor chip 200 and the mounting region 110 of the base substrate 100 are positioned to face each other, and are bonded between the lower surface of the sensor chip 200 and the mounting region 110 of the base substrate 100.
  • the film 250 may be located.
  • the sensor chip 200 and the base substrate 100 may be coupled by the adhesive film 250.
  • the adhesive film 250 may be a die attach film.
  • the adhesive film 250 may have a deformable physical property under predetermined processing conditions, and may be cured in a form that is not deformed after curing.
  • predetermined processing conditions typically mean temperatures above room temperature and / or pressure above room temperature.
  • the adhesive film 250 may be an epoxy-based die attach film.
  • Such an adhesive film has a property of being heat cured by heating, and a portion of the adhesive film may be changed in the process of being cured by heating.
  • the adhesive film may be cured when treated at a temperature of 100 ° C. to 150 ° C. for a predetermined time.
  • the adhesive film may be partially changed in shape while being hot treated and completely cured.
  • the adhesive film 250 is exposed to a predetermined curing condition in a state located between the base substrate 100 and the sensor chip 200. In the exposed state, the thickness (height) of the adhesive film 250 may be adjusted. Accordingly, the separation distance and the inclination of the sensor chip 200 with respect to the base substrate 100 may be adjusted.
  • the sensor chip 200 may be electrically connected to the base substrate 100 by a wire 230.
  • the wire 230 may be a conductive wire 230 formed of gold, silver, copper, or the like.
  • the wire 230 may be coupled to the bonding pad 220 of the base substrate 100 and the pad of the upper surface of the base substrate 100 to achieve electrical connection.
  • the light receiving surface 210 may be formed on the upper surface of the sensor chip 200.
  • the light receiving surface 210 is a light receiving element that detects light emitted from the outside and converts it into an electrical signal.
  • a plurality of light receiving elements may be integrated on the light receiving surface 210.
  • the light receiving surface 210 may correspond to an active area of the image sensor.
  • the light receiving surface 210 may be determined to operate best in a predetermined wavelength band. Specifically, the light receiving surface 210 may operate most suitably in the first wavelength band to be described later. However, the light receiving surface 210 may not detect only light of the first wavelength band. The light receiving surface 210 may detect light other than the first wavelength band, and in some cases, the sensor chip 200 may recognize the noise as noise. Therefore, the optical filter 300 to be described later may be coupled to the upper portion of the light receiving surface 210. The optical filter 300 will be described in detail below.
  • the sensor chip 200 may be a fingerprint recognition sensor chip 200 that optically recognizes a unique pattern of a fingerprint.
  • the fingerprint to be recognized is located above the light receiving surface 210.
  • the sensor chip 200 includes an imaging sensor for imaging at least the unique pattern of the fingerprint.
  • the sensor chip 200 may further include a signal processor that processes an image of the captured fingerprint and converts the image into data.
  • the sensor chip 200 may further include a determination unit that determines whether the fingerprint is matched by comparing the converted data with already stored data. If the sensor chip 200 does not include a signal processor or a determiner, a separate component for performing such a function may be provided.
  • the optical filter 300 is formed to cover the light receiving surface 210.
  • the optical filter 300 has a predetermined wavelength band as a pass band.
  • the optical filter 300 has a first wavelength band as a pass band.
  • the first wavelength band may correspond to the infrared wavelength band. Since the optical filter 300 covers the light receiving surface 210, only light passing through the optical filter 300 may be irradiated to the light receiving surface 210. Therefore, only light in the infrared band may be irradiated to the light receiving surface 210. Some of the light may be irradiated onto the light receiving surface 210 without passing through the optical filter 300 through the space between the optical filter 300 and the light receiving surface 210, but this may be relatively insignificant.
  • the optical filter 300 may be an optical element based on a film and having at least one coating layer or a deposition layer formed thereon.
  • the optical filter 300 is substantially film or layer formed.
  • the optical filter 300 is provided with the same area as the light receiving surface 210 or larger than the light receiving surface 210 to cover the light receiving surface 210.
  • the optical filter 300 is coupled to the light receiving surface 210 by the adhesive film 350.
  • the adhesive film 350 is positioned between the optical filter 300 and the light receiving surface 210 to couple the optical filter 300 to the light receiving surface 210.
  • the adhesive film 350 may be formed to cover the light receiving surface 210. Therefore, the light passing through the optical filter 300 passes through the adhesive film 350 to be irradiated to the light receiving surface 210.
  • the adhesive film 350 may be a die attach film.
  • the adhesive film 350 may have a deformable physical property under predetermined processing conditions, and may be cured in a form that does not deform at room temperature.
  • predetermined processing conditions typically mean temperatures above room temperature and / or pressure above room temperature.
  • the adhesive film 350 is exposed to a predetermined processing condition in a state located between the optical filter 300 and the light receiving surface 210. In the exposed state, the thickness of the adhesive film 350 may be adjusted. Accordingly, the separation distance and the inclination of the optical filter 300 with respect to the light receiving surface 210 may be adjusted.
  • the adhesive film 350 is transparent to the first wavelength band.
  • the first wavelength band may correspond to the infrared wavelength band.
  • the adhesive film 350 may have a light transmittance of 88% or more with respect to the first wavelength band.
  • the adhesive film 350 may have a transmissivity of 93% or more with respect to the first wavelength band. Accordingly, the external light passing through the optical filter 300 is irradiated to the light receiving surface 210 with little loss in the adhesive film 350. Therefore, the light receiving surface 210 can detect a relatively large amount of light, which contributes to improving the sensing accuracy of the sensor chip 200.
  • attaching the optical filter 300 to the light receiving surface 210 using the adhesive film 350 may maintain the distance of the optical filter 300 from the light receiving surface 210 uniformly.
  • the adhesive film 350 since the adhesive film 350 is relatively solid unlike a viscous liquid epoxy material, the adhesive film 350 may be formed to protrude up to the upper portion of the optical filter 300.
  • the adhesive film 350 since the adhesive film 350 may maintain a thin thickness uniformly, the adhesive film 350 may contribute to keeping the height of the optical sensor package of the present invention, that is, the distance from the base substrate 100 to the optical filter 300 small. .
  • the bezel part 400 is coupled to the base substrate 100 and is positioned around the sensor chip 200.
  • the bezel part 400 may be formed to surround at least a portion of the sensor chip 200.
  • the bezel part 400 has a lower surface coupled to the base substrate 100, and an upper end thereof is formed to protrude from the base substrate 100.
  • the bezel part 400 is provided with a flat upper surface.
  • An upper surface of the bezel part 400 may be positioned on the same plane P1 as the light receiving surface 210 of the sensor chip 200.
  • the upper surface of the bezel part 400 and the light receiving surface 210 of the sensor chip 200 are positioned at the same height with respect to the base substrate 100. More specifically, one plane positioned on the upper surface of the bezel part 400 and the light receiving surface 210 of the sensor chip 200 may be substantially parallel to the base substrate 100.
  • the bezel part 400 may be coupled to the base substrate 100 before the sensor chip 200. That is, the bezel part 400 is first coupled to determine the height based on the base substrate 100, and the sensor chip 200 is subsequently coupled to the base substrate 100 so that the light receiving surface 210 is bezel part. It is adjusted to be located on the same plane (P1) and the upper surface of the (400). The position of the sensor chip 200 can be adjusted by modifying the shape of the adhesive film 250 described above.
  • FIG. 4 is a cross-sectional view of an optical sensor package according to another embodiment of the present invention.
  • a cover window is added to the optical sensor package described above with reference to FIGS. 1 to 3. Therefore, in describing the optical sensor package illustrated in FIG. 4, the description will be made based on differences from the optical sensor package of FIGS. 1 to 3.
  • the optical sensor package may further include a cover window 600.
  • the cover window 600 may be positioned to face the light receiving surface 210. This means that the cover window 600 is positioned not only on the light receiving surface 210 but also on the base substrate 100.
  • the cover window 600 may be a cover window of an electronic device on which the optical sensor package of the present invention is mounted.
  • the cover window 600 may cover the front surface of the electronic device.
  • at least a portion of the cover window 600 may cover the display unit of the electronic device.
  • the optical sensor package of the present invention is located under the cover window 600.
  • the cover window 600 may be transmissive to the first wavelength band.
  • the first wavelength band may correspond to the infrared wavelength band.
  • the cover window 600 may have a relatively low light transmittance for the visible light band than the first wavelength band. Accordingly, the optical sensor package may be invisible or blurred on the opposite side of the optical sensor package based on the cover window 600. However, the light to be detected by the sensor chip 200 may pass through the cover window 600.
  • a recess 610 may be formed on a surface of the cover window 600 at the side of the optical sensor package.
  • the recess 610 may be formed at a portion of the optical sensor package that faces the light receiving surface 210.
  • the recess 610 may be formed to have a uniform depth compared to other portions of the periphery.
  • At least a portion of the optical filter 300 may be accommodated in the inner space of the recess 610. Specifically, since the optical filter 300 protrudes upward with respect to the surface on which the light receiving surface 210 of the sensor chip 200 is formed, at least a part of the protruding portion is accommodated in the inner space of the recess 610. . In some cases, not only the optical filter 300 but also at least a portion of the adhesive film 350 may be accommodated in the inner space of the recess 610. However, even in this case, the optical filter 300 and the cover window 600 may be spaced apart from each other.
  • the distance from the base substrate 100 to the cover window 600 can be formed as small as possible.
  • base substrate 110 mounting area

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)

Abstract

An optical sensor package is disclosed. An optical sensor package of the present invention is slim and compact and thus contributes to slimming an electronic device mounted therewith. The optical sensor package of the present invention comprises: a sensor chip including a light-receiving surface; an adhesive film covering the light-receiving surface; and an optical filter coupled to the adhesive film and covering the light-receiving surface, wherein the optical filter has a first wavelength band as a passband, and the adhesive film is transparent in the first wavelength band.

Description

광학센서 패키지Optical sensor package
본 발명은 광학센서 패키지에 관한 것으로, 더욱 상세하게는 피감지체의 표면에서 반사된 빛을 감지하는 수광센서 패키지에 관한 것이다.The present invention relates to an optical sensor package, and more particularly to a light receiving sensor package for detecting the light reflected from the surface of the sensing object.
스마트폰, 태블릿 컴퓨터, 웨어러블 디바이스 등 최근의 전자 장치는 다양한 종류의 센서 장치를 포함한다. 예를 들어, 최근의 전자 장치는 근접 센서, 조도 센서, 온도 센서, 심박 센서, 자이로 센서 및 지문인식 센서 등을 포함한다. 이중 다수의 센서들은 빛을 감지하여 센싱하는 광학센서에 해당한다. 지문인식 센서의 경우, 종래에는 센서와 지문 사이의 정전용량을 감지하는 방식이 주로 사용되었지만 최근에는 광학 방식이 검토되고 있다.Modern electronic devices such as smart phones, tablet computers, and wearable devices include various kinds of sensor devices. For example, recent electronic devices include proximity sensors, illuminance sensors, temperature sensors, heart rate sensors, gyro sensors, fingerprint sensors, and the like. Many of the sensors correspond to optical sensors that sense and sense light. In the case of a fingerprint sensor, a method of sensing capacitance between a sensor and a fingerprint is mainly used in the past, but an optical method has recently been studied.
광학센서가 탑재되는 전자 장치는 점차 슬림화되는 추세이다. 슬림한 폼팩터는 사용자가 사용하거나 휴대하기 편리할 뿐만 아니라 미감도 우수하여 널리 적용되고 있다. 따라서 이러한 전자 장치 내부에 수용되는 광학센서도 슬림화되고 소형화된 패키지로 형성될 것이 요구되고 있다.Electronic devices equipped with optical sensors are becoming increasingly slim. The slim form factor is widely used because it is not only convenient for the user to use or carry, but also has excellent aesthetics. Therefore, the optical sensor accommodated in the electronic device is also required to be formed in a slim and miniaturized package.
슬림하고 소형인 광학센서 패키지는 구조적인 설계가 난해할 뿐만 아니라 각 구성들을 조립하는 과정에서도 매우 정밀한 공정이 요구된다. 따라서 슬림하고 소형인 광학센서 패키지의 경우에 불량률이 높아질 수 있고, 이에 따라 원가가 상승할 수 있다는 문제점이 있다.The slim and compact optical sensor package not only has a difficult structural design but also requires a very precise process in assembling each component. Therefore, in the case of a slim and compact optical sensor package, there is a problem that the defect rate can be increased, thereby increasing the cost.
본 발명이 해결하려는 과제는, 패키지의 크기가 슬림하면서 소형이어서 탑재되는 전자 장치의 슬림화에 기여할 수 있는 광학센서 패키지를 제공하는 것이다. The problem to be solved by the present invention is to provide an optical sensor package that can contribute to the slimming of the electronic device mounted because the package is slim and compact.
본 발명이 해결하려는 다른 과제는, 패키지의 크기가 슬림하고 소형이면서 구조가 간단하여 조립이 용이한 광학센서 패키지를 제공하는 것이다. Another object of the present invention is to provide an optical sensor package that is easy to assemble because the package is slim, compact, and simple in structure.
상기 과제를 해결하기 위한 본 발명의 광학센서 패키지는, 수광면을 포함하는 센서칩, 상기 수광면을 덮는 접착 필름 및 상기 접착 필름에 결합되고, 상기 수광면을 덮는 광학필터를 포함하고, 상기 광학필터는 제1 파장대역을 통과대역으로 가지고, 상기 접착 필름은 상기 제1 파장대역에 대해서 투광성이다.The optical sensor package of the present invention for solving the above problems, a sensor chip comprising a light receiving surface, an adhesive film covering the light receiving surface and the adhesive film, and comprises an optical filter covering the light receiving surface, the optical The filter has a first wavelength band as a pass band, and the adhesive film is translucent to the first wavelength band.
본 발명의 일 실시예에 있어서, 상기 제1 파장대역은 적외선 파장대역일 수 있다.In one embodiment of the present invention, the first wavelength band may be an infrared wavelength band.
본 발명의 일 실시예에 있어서, 상기 접착 필름은 다이 부착 필름(die attach film)일 수 있다.In one embodiment of the present invention, the adhesive film may be a die attach film.
본 발명의 일 실시예에 있어서, 상기 수광면과 대향하는 커버 윈도우를 더 포함할 수 있다.In one embodiment of the present invention, it may further include a cover window facing the light receiving surface.
본 발명의 일 실시예에 있어서, 상기 커버 윈도우는 상기 수광면과 대향하는 부분에 형성된 리세스를 포함하고, 상기 광학필터의 적어도 일부는 상기 리세스의 내부 공간에 수용될 수 있다.In one embodiment of the present invention, the cover window includes a recess formed in a portion facing the light receiving surface, at least a portion of the optical filter may be accommodated in the inner space of the recess.
본 발명의 일 실시예에 있어서, 상기 커버 윈도우는 상기 제1 파장대역에 대해서 투광성이고, 가시광선 대역에 대해서는 상기 제1 파장대역보다 투광성이 상대적으로 낮을 수 있다.In one embodiment of the present invention, the cover window may be transmissive to the first wavelength band, and the transmittance of the visible light band may be relatively lower than the first wavelength band.
본 발명의 일 실시예에 있어서, 상기 커버 윈도우와 상기 광학필터는 이격되어 위치할 수 있다.In one embodiment of the present invention, the cover window and the optical filter may be spaced apart.
본 발명의 일 실시예에 있어서, 상기 접착 필름은 상기 제1 파장대역에 대해서 투광성이 93% 이상일 수 있다.In one embodiment of the present invention, the adhesive film may have a light transmittance of 93% or more with respect to the first wavelength band.
본 발명의 일 실시예에 있어서, 상기 센서칩이 실장되는 베이스 기판을 더 포함하고, 상기 센서칩과 상기 베이스 기판은 와이어에 의해 전기적으로 연결될 수 있다.In one embodiment of the present invention, the sensor chip further comprises a base substrate on which the sensor chip and the base substrate may be electrically connected by a wire.
본 발명의 일 실시예에 있어서, 상기 센서칩은 상기 수광면이 형성된 면과 인접하여 단차지게 형성된 일면을 더 포함하고, 상기 일면에는 상기 와이어가 결합되는 본딩 패드가 형성될 수 있다.In one embodiment of the present invention, the sensor chip further includes a surface formed stepped adjacent to the surface on which the light receiving surface is formed, the surface may be formed with a bonding pad to which the wire is coupled.
본 발명의 일 실시예에 있어서, 하면이 상기 베이스 기판에 결합되고, 상기 센서칩의 주변에 위치하는 베젤부를 더 포함하고, 상기 센서칩의 수광면과 상기 베젤부의 상면은 상기 베이스 기판을 기준으로 동일한 높이에 위치할 수 있다.In one embodiment of the present invention, a lower surface is coupled to the base substrate, and further includes a bezel portion positioned around the sensor chip, the light receiving surface of the sensor chip and the upper surface of the bezel portion relative to the base substrate It can be located at the same height.
본 발명의 일 실시예에 있어서, 상기 제1 파장대역의 광을 방출하는 발광부를 더 포함하고, 상기 센서칩은 지문인식용 센서칩일 수 있다. In one embodiment of the present invention, further comprising a light emitting unit for emitting the light of the first wavelength band, the sensor chip may be a fingerprint sensor chip.
본 발명의 일 실시예에 따른 광학센서 패키지는 패키지의 크기가 슬림하면서 소형이어서 탑재되는 전자 장치의 슬림화에 기여할 수 있다는 장점이 있다.An optical sensor package according to an embodiment of the present invention has the advantage that the size of the package is slim and small, which can contribute to slimming of the mounted electronic device.
또한, 본 발명의 일 실시예에 따른 광학센서 패키지는 패키지의 크기가 슬림하고 소형이면서 구조가 간단하여 조립이 용이하다는 장점이 있다.In addition, the optical sensor package according to an embodiment of the present invention has the advantage that the size of the package is slim and compact, and the structure is simple and easy to assemble.
도 1은 본 발명의 일 실시예에 따른 발광센서 패키지의 사시도이다.1 is a perspective view of a light emitting sensor package according to an embodiment of the present invention.
도 2는 도 1에 도시된 본 발명의 일 실시예에 따른 발광센서 패키지를 AA'선으로 절단한 단면도이다.2 is a cross-sectional view taken along line AA ′ of the light emitting sensor package according to the exemplary embodiment of the present invention shown in FIG. 1.
도 3은 도 1에 도시된 본 발명의 일 실시예에 따른 발광센서 패키지의 분해사시도이다.3 is an exploded perspective view of a light emitting sensor package according to an embodiment of the present invention shown in FIG. 1.
도 4는 본 발명의 다른 일 실시예에 따른 광학센서 패키지의 단면도이다.4 is a cross-sectional view of an optical sensor package according to another embodiment of the present invention.
이하, 첨부된 도면을 참조하여 본 발명의 실시예들을 상세히 설명한다. 본 발명을 설명하는데 있어서, 해당 분야에 이미 공지된 기술 또는 구성에 대한 구체적인 설명을 부가하는 것이 본 발명의 요지를 불분명하게 할 수 있다고 판단되는 경우에는 상세한 설명에서 이를 일부 생략하도록 한다. 또한, 본 명세서에서 사용되는 용어들은 본 발명의 실시예들을 적절히 표현하기 위해 사용된 용어들로서, 이는 해당 분야의 관련된 사람 또는 관례 등에 따라 달라질 수 있다. 따라서, 본 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention; In describing the present invention, if it is determined that adding specific descriptions of techniques or configurations already known in the art may make the gist of the present invention unclear, some of them will be omitted from the detailed description. In addition, terms used in the present specification are terms used to properly express the embodiments of the present invention, which may vary according to related persons or customs in the art. Therefore, the definitions of the terms should be made based on the contents throughout the specification.
이하, 첨부한 도 1 내지 도 3를 참조하여, 본 발명의 일 실시예에 따른 광학센서 패키지에 대해 설명한다.Hereinafter, an optical sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3.
도 1은 본 발명의 일 실시예에 따른 발광센서 패키지의 사시도이다. 도 2는 도 1에 도시된 본 발명의 일 실시예에 따른 발광센서 패키지를 AA'선으로 절단한 단면도이다. 도 3은 도 1에 도시된 본 발명의 일 실시예에 따른 발광센서 패키지의 분해사시도이다.1 is a perspective view of a light emitting sensor package according to an embodiment of the present invention. 2 is a cross-sectional view taken along line AA ′ of the light emitting sensor package according to the exemplary embodiment of the present invention shown in FIG. 1. 3 is an exploded perspective view of a light emitting sensor package according to an embodiment of the present invention shown in FIG. 1.
도 1 내지 도 3을 참조하면, 본 발명의 발광센서 패키지는 베이스 기판(100), 센서칩(200), 접착 필름(350), 광학필터(300) 및 베젤부(400)를 포함한다.1 to 3, the light emitting sensor package of the present invention includes a base substrate 100, a sensor chip 200, an adhesive film 350, an optical filter 300, and a bezel part 400.
베이스 기판(100)은 본 발명의 광학센서 패키지의 바닥면을 이루는 부분일 수 있다. 베이스 기판(100)의 상에는 후술할 요소들이 위치할 수 있다.The base substrate 100 may be a part forming the bottom surface of the optical sensor package of the present invention. Elements to be described later may be positioned on the base substrate 100.
베이스 기판(100)은 인쇄회로기판, 세라믹 기판, 양극 산화층을 가지는 금속 기판 등일 수 있으나, 이에 한정되는 것은 아니다. 베이스 기판(100)은 절연층, 도체 패턴 및 패드를 포함할 수 있다.The base substrate 100 may be a printed circuit board, a ceramic substrate, or a metal substrate having an anodization layer, but is not limited thereto. The base substrate 100 may include an insulating layer, a conductor pattern, and a pad.
구체적으로, 베이스 기판(100)의 상면에는 적어도 하나의 패드(120)가 마련되어 후술할 센서칩(200)과 전기적으로 연결될 수 있다. 또한, 베이스 기판(100)의 하면에는 적어도 하나의 패드(미도시)가 마련되어 본 발명의 광학센서 패키지에 전기 신호를 전달하거나 전력을 공급할 수 있다. 베이스 기판(100)의 패드는 전자부품, 반도체소자, 각종 수동소자 또는 리드프레임 등과 다양한 방식으로 결합될 수 있다.In detail, at least one pad 120 may be provided on an upper surface of the base substrate 100 to be electrically connected to the sensor chip 200 to be described later. In addition, at least one pad (not shown) may be provided on the bottom surface of the base substrate 100 to transmit an electrical signal or supply power to the optical sensor package of the present invention. The pad of the base substrate 100 may be coupled in various ways such as an electronic component, a semiconductor device, various passive devices, or a lead frame.
베이스 기판(100)의 상면에는 실장 영역(110)이 마련된다. 실장 영역(110)에는 후술할 센서칩(200)이 위치하게 된다. 베이스 기판(100)의 상면의 패드는 실장 영역(110) 주변에 위치할 수 있다. 실장 영역(110)의 주변으로는 후술할 베젤부(400)가 결합되는 베젤부 결합부가 마련될 수 있다.The mounting region 110 is provided on the top surface of the base substrate 100. The sensor chip 200 to be described later is located in the mounting region 110. The pad on the top surface of the base substrate 100 may be positioned around the mounting area 110. The bezel part coupling part to which the bezel part 400 to be described later is coupled may be provided around the mounting area 110.
센서칩(200)은 수광면(210)을 포함하는 전자부품이다. 센서칩(200)은 베이스 기판(100)과 결합되는 면을 하면으로 정의하면, 상면의 적어도 일부에 수광면(210)이 형성된다. 센서칩(200)의 상면에는 수광면(210)과 적어도 하나의 본딩 패드(220)가 형성될 수 있다.The sensor chip 200 is an electronic component including the light receiving surface 210. When the sensor chip 200 is defined as a bottom surface that is coupled to the base substrate 100, the light receiving surface 210 is formed on at least a portion of the top surface. The light receiving surface 210 and at least one bonding pad 220 may be formed on an upper surface of the sensor chip 200.
센서칩(200)은 베이스 기판(100)의 실장 영역(110)에 결합된다. 구체적으로, 센서칩(200)의 하면과 베이스 기판(100)의 실장 영역(110)이 서로 마주보게 위치하고, 센서칩(200)의 하면과 베이스 기판(100)의 실장 영역(110) 사이에 접착 필름(250)이 위치할 수 있다. 접착 필름(250)에 의해서 센서칩(200)과 베이스 기판(100)이 결합될 수 있다. 접착 필름(250)은 다이 부착 필름(die attach film)일 수 있다.The sensor chip 200 is coupled to the mounting region 110 of the base substrate 100. Specifically, the lower surface of the sensor chip 200 and the mounting region 110 of the base substrate 100 are positioned to face each other, and are bonded between the lower surface of the sensor chip 200 and the mounting region 110 of the base substrate 100. The film 250 may be located. The sensor chip 200 and the base substrate 100 may be coupled by the adhesive film 250. The adhesive film 250 may be a die attach film.
접착 필름(250)은 미리 정해진 가공 조건에서는 변형 가능한 물성을 가지고, 경화(cure)된 이후에는 변형되지 않는 형태로 경화될 수 있다. 여기서, 미리 정해진 가공 조건이란 상온은 해당되지 않는다. 미리 정해진 가공 조건은 통상적으로, 상온보다 높은 온도 및/또는 상온보다 높은 압력을 의미한다.The adhesive film 250 may have a deformable physical property under predetermined processing conditions, and may be cured in a form that is not deformed after curing. Here, normal processing conditions do not correspond to room temperature. Predetermined processing conditions typically mean temperatures above room temperature and / or pressure above room temperature.
예를 들어, 접착 필름(250)은 에폭시 계열의 다이 부착 필름일 수 있다. 이러한 접착 필름은 가열에 의해 경화(heat cure)되는 성질을 가지고 있으며, 가열에 의해 경화되는 과정에서 형태가 일정 부분이 변화될 수 있다. 구체적으로, 접착 필름은 100℃ 내지 150℃의 온도에서 소정의 시간동안 처리되면 경화될 수 있다. 접착 필름은 고온 처리되면서 그리고 완전히 경화되기 전에는 형태가 일정 부분 변화될 수 있다.For example, the adhesive film 250 may be an epoxy-based die attach film. Such an adhesive film has a property of being heat cured by heating, and a portion of the adhesive film may be changed in the process of being cured by heating. Specifically, the adhesive film may be cured when treated at a temperature of 100 ° C. to 150 ° C. for a predetermined time. The adhesive film may be partially changed in shape while being hot treated and completely cured.
접착 필름(250)은 베이스 기판(100)과 센서칩(200) 사이에 위치한 상태에서 미리 정해진 경화 조건에 노출된다. 노출된 상태에서 접착 필름(250)의 두께(높이) 등이 조절될 수 있다. 이에 따라 베이스 기판(100)에 대한 센서칩(200)의 이격 거리 및 기울기 등이 조절될 수 있다.The adhesive film 250 is exposed to a predetermined curing condition in a state located between the base substrate 100 and the sensor chip 200. In the exposed state, the thickness (height) of the adhesive film 250 may be adjusted. Accordingly, the separation distance and the inclination of the sensor chip 200 with respect to the base substrate 100 may be adjusted.
센서칩(200)은 베이스 기판(100)과 와이어(230)에 의해 전기적으로 연결될 수 있다. 와이어(230)는 금, 은, 구리 등으로 형성된 도전성 와이어(230)일 수 있다. 구체적으로, 와이어(230)는 베이스 기판(100)의 본딩 패드(220)와 베이스 기판(100)의 상면의 패드와 결합되어 전기적 연결을 달성할 수 있다.The sensor chip 200 may be electrically connected to the base substrate 100 by a wire 230. The wire 230 may be a conductive wire 230 formed of gold, silver, copper, or the like. In detail, the wire 230 may be coupled to the bonding pad 220 of the base substrate 100 and the pad of the upper surface of the base substrate 100 to achieve electrical connection.
수광면(210)은 센서칩(200)의 상면에 형성될 수 있다. 수광면(210)은 외부에서 조사된 광을 감지하여 전기신호로 변환하는 수광소자이다. 수광면(210)에는 복수의 수광소자가 집적되어 있을 수 있다. 수광면(210)은 이미지 센서의 액티브 영역(active area)에 해당할 수 있다.The light receiving surface 210 may be formed on the upper surface of the sensor chip 200. The light receiving surface 210 is a light receiving element that detects light emitted from the outside and converts it into an electrical signal. A plurality of light receiving elements may be integrated on the light receiving surface 210. The light receiving surface 210 may correspond to an active area of the image sensor.
수광면(210)은 미리 정해진 파장대역에 가장 적합하게 동작하도록 정해져 있을 수 있다. 구체적으로, 수광면(210)은 후술할 제1 파장대역에서 가장 적합하게 동작할 수 있다. 그러나 수광면(210)은 제1 파장대역의 광만을 감지하는 것은 아닐 수 있다. 수광면(210)은 제1 파장대역 이외의 광도 감지할 수 있고, 경우에 따라서 이는 센서칩(200)이 노이즈로 인식할 수 있다. 따라서 수광면(210)의 상부에는 후술할 광학필터(300)가 결합될 수 있다. 광학필터(300)에 대해서는 아래에서 상술하도록 한다.The light receiving surface 210 may be determined to operate best in a predetermined wavelength band. Specifically, the light receiving surface 210 may operate most suitably in the first wavelength band to be described later. However, the light receiving surface 210 may not detect only light of the first wavelength band. The light receiving surface 210 may detect light other than the first wavelength band, and in some cases, the sensor chip 200 may recognize the noise as noise. Therefore, the optical filter 300 to be described later may be coupled to the upper portion of the light receiving surface 210. The optical filter 300 will be described in detail below.
센서칩(200)은 지문의 고유 패턴을 광학적으로 인식하는 지문인식 센서칩(200)일 수 있다. 인식하려는 지문은 수광면(210)의 상부에 위치하게 된다. 구체적으로, 센서칩(200)은 적어도 지문의 고유 패턴을 촬상하는 촬상센서를 포함한다. 또한, 센서칩(200)은 촬상한 지문의 이미지를 처리하여 데이터로 변환하는 신호처리부를 더 포함할 수 있다. 또한, 센서칩(200)은 변환된 데이터를 이미 저장된 데이터와 비교하여 지문의 일치여부를 판단하는 판단부를 더 포함할 수 있다. 만약, 센서칩(200)이 신호처리부 또는 판단부를 포함하지 않을 경우, 이러한 기능을 수행하는 별도의 부품이 마련될 수 있다.The sensor chip 200 may be a fingerprint recognition sensor chip 200 that optically recognizes a unique pattern of a fingerprint. The fingerprint to be recognized is located above the light receiving surface 210. Specifically, the sensor chip 200 includes an imaging sensor for imaging at least the unique pattern of the fingerprint. In addition, the sensor chip 200 may further include a signal processor that processes an image of the captured fingerprint and converts the image into data. In addition, the sensor chip 200 may further include a determination unit that determines whether the fingerprint is matched by comparing the converted data with already stored data. If the sensor chip 200 does not include a signal processor or a determiner, a separate component for performing such a function may be provided.
광학필터(300)는 수광면(210)을 덮도록 형성된다. 광학필터(300)는 미리 정해진 파장대역을 통과대역으로 가진다. 구체적으로, 광학필터(300)는 제1 파장대역을 통과대역으로 가진다. 여기서, 제1 파장대역은 적외선 파장대역에 해당할 수 있다. 광학필터(300)는 수광면(210)을 덮기 때문에 수광면(210)에는 실질적으로 광학필터(300)를 통과한 광만이 조사될 수 있다. 따라서 수광면(210)에는 실질적으로 적외선 대역의 광만이 조사될 수 있다. 광학필터(300)와 수광면(210) 사이의 공간을 통해 일부의 광이 광학필터(300)를 통과하지 않고 수광면(210)으로 조사될 수 있으나, 이는 상대적으로 미미한 수준일 것이다.The optical filter 300 is formed to cover the light receiving surface 210. The optical filter 300 has a predetermined wavelength band as a pass band. Specifically, the optical filter 300 has a first wavelength band as a pass band. Here, the first wavelength band may correspond to the infrared wavelength band. Since the optical filter 300 covers the light receiving surface 210, only light passing through the optical filter 300 may be irradiated to the light receiving surface 210. Therefore, only light in the infrared band may be irradiated to the light receiving surface 210. Some of the light may be irradiated onto the light receiving surface 210 without passing through the optical filter 300 through the space between the optical filter 300 and the light receiving surface 210, but this may be relatively insignificant.
광학필터(300)는 필름을 베이스로 하고, 적어도 한 층 이상의 코팅층 또는 증착층이 형성된 광학소자일 수 있다. 광학필터(300)는 실질적으로 필름 또는 막(layer) 형성된다. 광학필터(300)는 수광면(210)과 같거나 수광면(210)보다 큰 넓이로 마련되어 수광면(210)을 덮는다.The optical filter 300 may be an optical element based on a film and having at least one coating layer or a deposition layer formed thereon. The optical filter 300 is substantially film or layer formed. The optical filter 300 is provided with the same area as the light receiving surface 210 or larger than the light receiving surface 210 to cover the light receiving surface 210.
광학필터(300)는 접착 필름(350)에 의해 수광면(210)에 결합된다. 접착 필름(350)은 광학필터(300)와 수광면(210) 사이에 위치하여 광학필터(300)와 수광면(210)을 결합시킨다. 접착 필름(350)은 수광면(210)을 덮도록 형성될 수 있다. 따라서 광학필터(300)를 통과한 광은 접착 필름(350) 또한 통과해서 수광면(210)에 조사되게 된다. 접착 필름(350)은 다이 부착 필름(die attach film)일 수 있다.The optical filter 300 is coupled to the light receiving surface 210 by the adhesive film 350. The adhesive film 350 is positioned between the optical filter 300 and the light receiving surface 210 to couple the optical filter 300 to the light receiving surface 210. The adhesive film 350 may be formed to cover the light receiving surface 210. Therefore, the light passing through the optical filter 300 passes through the adhesive film 350 to be irradiated to the light receiving surface 210. The adhesive film 350 may be a die attach film.
접착 필름(350)은 미리 정해진 가공 조건에서는 변형 가능한 물성을 가지고, 상온에서는 변형되지 않는 형태로 경화될 수 있다. 여기서, 미리 정해진 가공 조건이란 상온은 해당되지 않는다. 미리 정해진 가공 조건은 통상적으로, 상온보다 높은 온도 및/또는 상온보다 높은 압력을 의미한다.The adhesive film 350 may have a deformable physical property under predetermined processing conditions, and may be cured in a form that does not deform at room temperature. Here, normal processing conditions do not correspond to room temperature. Predetermined processing conditions typically mean temperatures above room temperature and / or pressure above room temperature.
접착 필름(350)은 광학필터(300)와 수광면(210) 사이에 위치한 상태에서 미리 정해진 가공 조건에 노출된다. 노출된 상태에서 접착 필름(350)의 두께 등이 조절될 수 있다. 이에 따라 수광면(210)에 대한 광학필터(300)의 이격 거리 및 기울기 등이 조절될 수 있다.The adhesive film 350 is exposed to a predetermined processing condition in a state located between the optical filter 300 and the light receiving surface 210. In the exposed state, the thickness of the adhesive film 350 may be adjusted. Accordingly, the separation distance and the inclination of the optical filter 300 with respect to the light receiving surface 210 may be adjusted.
접착 필름(350)은 제1 파장대역에 대해서 투광성이다. 여기서, 제1 파장대역은 적외선 파장대역에 해당할 수 있다. 구체적으로, 접착 필름(350)은 제1 파장대역에 대해서 88% 이상의 투광성을 가질 수 있다. 바람직하게, 접착 필름(350)은 제1 파장대역에 대해서 93% 이상의 투광성을 가질 수 있다. 따라서 광학필터(300)를 통과한 외부의 광은 접착 필름(350)에서 거의 손실되지 않고 수광면(210)에 조사되게 된다. 따라서 수광면(210)은 상대적으로 많은 광을 감지할 수 있고, 이는 센서칩(200)의 센싱 정확도를 향상시키는데 기여한다.The adhesive film 350 is transparent to the first wavelength band. Here, the first wavelength band may correspond to the infrared wavelength band. Specifically, the adhesive film 350 may have a light transmittance of 88% or more with respect to the first wavelength band. Preferably, the adhesive film 350 may have a transmissivity of 93% or more with respect to the first wavelength band. Accordingly, the external light passing through the optical filter 300 is irradiated to the light receiving surface 210 with little loss in the adhesive film 350. Therefore, the light receiving surface 210 can detect a relatively large amount of light, which contributes to improving the sensing accuracy of the sensor chip 200.
상술한 것과 같이, 접착 필름(350)을 이용하여 광학필터(300)를 수광면(210)에 부착하는 것은 수광면(210)에서 광학필터(300)의 거리를 균일하게 유지할 수 있게 한다. 또한, 접착 필름(350)은 점성이 있는 액상의 에폭시 등의 재질과 달리 상대적으로 고형이기 때문에 광학필터(300)의 상부까지 돌출되도록 형성될 염려가 적다. 또한, 접착 필름(350)은 얇은 두께를 균일하게 유지할 수 있기 때문에, 본 발명의 광학센서 패키지의 높이, 즉, 베이스 기판(100)에서 광학필터(300)까지의 거리를 작게 유지하는데 기여할 수 있다.As described above, attaching the optical filter 300 to the light receiving surface 210 using the adhesive film 350 may maintain the distance of the optical filter 300 from the light receiving surface 210 uniformly. In addition, since the adhesive film 350 is relatively solid unlike a viscous liquid epoxy material, the adhesive film 350 may be formed to protrude up to the upper portion of the optical filter 300. In addition, since the adhesive film 350 may maintain a thin thickness uniformly, the adhesive film 350 may contribute to keeping the height of the optical sensor package of the present invention, that is, the distance from the base substrate 100 to the optical filter 300 small. .
베젤부(400)는 베이스 기판(100)에 결합되고, 센서칩(200)의 주변에 위치한다. 구체적으로, 베젤부(400)는 센서칩(200)의 적어도 일부를 둘러싸도록 형성될 수 있다. 베젤부(400)는 하면이 베이스 기판(100)에 결합되고, 상단은 베이스 기판(100)에서 돌출된 형태로 형성된다. 베젤부(400)에는 평평한 상면이 마련된다. 베젤부(400)의 상면은 센서칩(200)의 수광면(210)과 동일한 평면(P1) 상에 위치할 수 있다. 구체적으로, 베젤부(400)의 상면과 센서칩(200)의 수광면(210)은 베이스 기판(100)을 기준으로 동일한 높이에 위치한다. 더욱 구체적으로, 베젤부(400)의 상면과 센서칩(200)의 수광면(210)에 위치하는 하나의 평면은 베이스 기판(100)과 실질적으로 평행할 수 있다.The bezel part 400 is coupled to the base substrate 100 and is positioned around the sensor chip 200. In detail, the bezel part 400 may be formed to surround at least a portion of the sensor chip 200. The bezel part 400 has a lower surface coupled to the base substrate 100, and an upper end thereof is formed to protrude from the base substrate 100. The bezel part 400 is provided with a flat upper surface. An upper surface of the bezel part 400 may be positioned on the same plane P1 as the light receiving surface 210 of the sensor chip 200. In detail, the upper surface of the bezel part 400 and the light receiving surface 210 of the sensor chip 200 are positioned at the same height with respect to the base substrate 100. More specifically, one plane positioned on the upper surface of the bezel part 400 and the light receiving surface 210 of the sensor chip 200 may be substantially parallel to the base substrate 100.
베이스 기판(100)에는 베젤부(400)가 센서칩(200)보다 먼저 결합될 수 있다. 즉, 베젤부(400)가 먼저 결합되어 베이스 기판(100)을 기준으로 한 높이가 결정되고, 센서칩(200)이 후속적으로 베이스 기판(100)에 결합되면서 수광면(210)이 베젤부(400)의 상면과 동일한 평면(P1) 상에 위치하도록 조절되는 것이다. 센서칩(200)의 위치는 상술한 접착 필름(250)의 형태를 변형하는 것을 통해 조절될 수 있다.The bezel part 400 may be coupled to the base substrate 100 before the sensor chip 200. That is, the bezel part 400 is first coupled to determine the height based on the base substrate 100, and the sensor chip 200 is subsequently coupled to the base substrate 100 so that the light receiving surface 210 is bezel part. It is adjusted to be located on the same plane (P1) and the upper surface of the (400). The position of the sensor chip 200 can be adjusted by modifying the shape of the adhesive film 250 described above.
도 4는 본 발명의 다른 일 실시예에 따른 광학센서 패키지의 단면도이다. 도 4에 도시된 광학센서 패키지는 도 1 내지 도 3을 참조하여 상술한 광학센서 패키지에서 커버 윈도우가 부가된 것이다. 따라서 도 4에 도시된 광학센서 패키지를 설명하는데 있어서, 도 1 내지 도 3의 광학센서 패키지와 다른 점을 중심으로 설명하도록 한다.4 is a cross-sectional view of an optical sensor package according to another embodiment of the present invention. In the optical sensor package illustrated in FIG. 4, a cover window is added to the optical sensor package described above with reference to FIGS. 1 to 3. Therefore, in describing the optical sensor package illustrated in FIG. 4, the description will be made based on differences from the optical sensor package of FIGS. 1 to 3.
도 4를 참조하면, 광학센서 패키지는 커버 윈도우(600)를 더 포함할 수 있다. 커버 윈도우(600)는 수광면(210)과 대향하게 위치할 수 있다. 이는 커버 윈도우(600)가 수광면(210)뿐만 아니라 베이스 기판(100)에도 대향하게 위치함을 의미한다.Referring to FIG. 4, the optical sensor package may further include a cover window 600. The cover window 600 may be positioned to face the light receiving surface 210. This means that the cover window 600 is positioned not only on the light receiving surface 210 but also on the base substrate 100.
커버 윈도우(600)는 본 발명의 광학센서 패키지가 탑재되는 전자 장치의 커버 윈도우일 수 있다. 구체적으로, 커버 윈도우(600)는 전자 장치의 전면을 덮는 것일 수 있다. 또한, 커버 윈도우(600)는 적어도 일 부분은 전자 장치의 디스플레이부를 덮는 것일 수 있다. 이러한 경우, 본 발명의 광학센서 패키지는 커버 윈도우(600)의 하부에 위치하게 된다.The cover window 600 may be a cover window of an electronic device on which the optical sensor package of the present invention is mounted. In detail, the cover window 600 may cover the front surface of the electronic device. In addition, at least a portion of the cover window 600 may cover the display unit of the electronic device. In this case, the optical sensor package of the present invention is located under the cover window 600.
커버 윈도우(600)는 제1 파장대역에 대해서 투광성일 수 있다. 상술한 것과 같이, 여기서 제1 파장대역은 적외선 파장대역에 해당할 수 있다. 그러나 커버 윈도우(600)는 가시광선 대역에 대해서는 제1 파장대역보다 투광성이 상대적으로 낮을 수 있다. 따라서 커버 윈도우(600)를 기준으로 광학센서 패키지의 반대측에서는 광학센서 패키지가 시각적으로 보이지 않거나 흐리게 보일 수 있다. 그러나 센서칩(200)이 감지하려는 광은 커버 윈도우(600)를 통과할 수 있다.The cover window 600 may be transmissive to the first wavelength band. As described above, the first wavelength band may correspond to the infrared wavelength band. However, the cover window 600 may have a relatively low light transmittance for the visible light band than the first wavelength band. Accordingly, the optical sensor package may be invisible or blurred on the opposite side of the optical sensor package based on the cover window 600. However, the light to be detected by the sensor chip 200 may pass through the cover window 600.
커버 윈도우(600)의 광학센서 패키지 측의 면에는 리세스(610)가 형성될 수 있다. 리세스(610)는 광학센서 패키지의 수광면(210)과 대향하는 부분에 형성될 수 있다. 리세스(610)부는 주변의 다른 부분에 비해서 균일한 깊이를 가지도록 형성될 수 있다.A recess 610 may be formed on a surface of the cover window 600 at the side of the optical sensor package. The recess 610 may be formed at a portion of the optical sensor package that faces the light receiving surface 210. The recess 610 may be formed to have a uniform depth compared to other portions of the periphery.
광학필터(300)의 적어도 일부는 리세스(610)의 내부 공간에 수용될 수 있다. 구체적으로, 광학필터(300)는 센서칩(200)의 수광면(210)이 형성된 면에 대해서 상방으로 돌출되어 있기 때문에 돌출된 부분의 적어도 일부가 리세스(610)의 내부 공간에 수용되는 것이다. 경우에 따라서 광학필터(300)뿐만 아니라 접착 필름(350)의 적어도 일부도 리세스(610)의 내부 공간에 수용될 수 있다. 그러나 이러한 경우에도 광학필터(300)와 커버 윈도우(600)는 이격되어 위치하는 것이 바람직하다.At least a portion of the optical filter 300 may be accommodated in the inner space of the recess 610. Specifically, since the optical filter 300 protrudes upward with respect to the surface on which the light receiving surface 210 of the sensor chip 200 is formed, at least a part of the protruding portion is accommodated in the inner space of the recess 610. . In some cases, not only the optical filter 300 but also at least a portion of the adhesive film 350 may be accommodated in the inner space of the recess 610. However, even in this case, the optical filter 300 and the cover window 600 may be spaced apart from each other.
상술한 구조에 의해서 전자 장치의 슬림화가 달성될 수 있다. 즉, 베이스 기판(100)에서 커버 윈도우(600)까지의 거리를 최대한 작게 형성할 수 있다.By the above-described structure, slimming of the electronic device can be achieved. That is, the distance from the base substrate 100 to the cover window 600 can be formed as small as possible.
이상, 본 발명의 광학센서 패키지의 실시예들에 대해 설명하였다. 본 발명은 상술한 실시예 및 첨부한 도면에 한정되는 것은 아니며, 본 발명이 속하는 분야에서 통상의 지식을 가진 자의 관점에서 다양한 수정 및 변형이 가능할 것이다. 따라서 본 발명의 범위는 본 명세서의 특허청구범위뿐만 아니라 이 특허청구범위와 균등한 것들에 의해 정해져야 한다.In the above, embodiments of the optical sensor package of the present invention have been described. The present invention is not limited to the above-described embodiment and the accompanying drawings, and various modifications and variations will be possible in view of those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be defined not only by the claims of the present specification but also by the equivalents of the claims.
100: 베이스 기판 110: 실장 영역100: base substrate 110: mounting area
120: 패드 250: 접착필름120: pad 250: adhesive film
200: 센서칩 210: 수광면200: sensor chip 210: light receiving surface
220: 본딩 패드 230: 와이어220: bonding pad 230: wire
300: 광학필터 350: 접착필름300: optical filter 350: adhesive film
500: 베젤부 600: 커버 윈도우500: bezel part 600: cover window
610: 리세스610 recess

Claims (12)

  1. 수광면을 포함하는 센서칩;A sensor chip comprising a light receiving surface;
    상기 수광면을 덮는 접착 필름; 및An adhesive film covering the light receiving surface; And
    상기 접착 필름에 결합되고, 상기 수광면을 덮는 광학필터를 포함하고,An optical filter coupled to the adhesive film and covering the light receiving surface;
    상기 광학필터는 제1 파장대역을 통과대역으로 가지고,The optical filter has a first wavelength band as a pass band,
    상기 접착 필름은 상기 제1 파장대역에 대해서 투광성인 광학센서 패키지.The adhesive film is optical sensor package is transmissive for the first wavelength band.
  2. 제1 항에 있어서,According to claim 1,
    상기 제1 파장대역은 적외선 파장대역인 광학센서 패키지.The first wavelength band is an infrared sensor band.
  3. 제1 항에 있어서,According to claim 1,
    상기 접착 필름은 다이 부착 필름(die attach film)인 광학센서 패키지.The adhesive film is a die attach film (die attach film) optical sensor package.
  4. 제1 항에 있어서,According to claim 1,
    상기 수광면과 대향하는 커버 윈도우를 더 포함하는 광학센서 패키지.The optical sensor package further comprises a cover window facing the light receiving surface.
  5. 제4 항에 있어서,The method of claim 4, wherein
    상기 커버 윈도우는 상기 수광면과 대향하는 부분에 형성된 리세스를 포함하고,The cover window includes a recess formed in a portion facing the light receiving surface,
    상기 광학필터의 적어도 일부는 상기 리세스의 내부 공간에 수용되는 광학센서 패키지.At least a portion of the optical filter is accommodated in an inner space of the recess.
  6. 제4 항에 있어서,The method of claim 4, wherein
    상기 커버 윈도우는 상기 제1 파장대역에 대해서 투광성이고, 가시광선 대역에 대해서는 상기 제1 파장대역보다 투광성이 상대적으로 낮은 광학센서 패키지.The cover window is transmissive to the first wavelength band, the optical sensor package for the visible light band is relatively lower than the first wavelength band.
  7. 제4 항에 있어서,The method of claim 4, wherein
    상기 커버 윈도우와 상기 광학필터는 이격되어 위치하는 광학센서 패키지.And the cover window and the optical filter are spaced apart from each other.
  8. 제1 항에 있어서,According to claim 1,
    상기 접착 필름은 상기 제1 파장대역에 대해서 투광성이 93% 이상인 광학센서 패키지.The adhesive film has an optical sensor package of 93% or more light transmittance with respect to the first wavelength band.
  9. 제1 항에 있어서,According to claim 1,
    상기 센서칩이 실장되는 베이스 기판을 더 포함하고,Further comprising a base substrate on which the sensor chip is mounted,
    상기 센서칩과 상기 베이스 기판은 와이어에 의해 전기적으로 연결되는 광학센서 패키지.The sensor chip and the base substrate is an optical sensor package electrically connected by a wire.
  10. 제9 항에 있어서,The method of claim 9,
    상기 센서칩은 상기 수광면이 형성된 면과 인접하여 단차지게 형성된 일면을 더 포함하고,The sensor chip further includes a surface formed stepped adjacent to the surface on which the light receiving surface is formed,
    상기 일면에는 상기 와이어가 결합되는 본딩 패드가 형성되는 광학센서 패키지.The one surface of the optical sensor package is formed with a bonding pad coupled to the wire.
  11. 제9 항에 있어서,The method of claim 9,
    하면이 상기 베이스 기판에 결합되고, 상기 센서칩의 주변에 위치하는 베젤부를 더 포함하고,A lower surface is coupled to the base substrate and further includes a bezel part positioned around the sensor chip;
    상기 센서칩의 수광면과 상기 베젤부의 상면은 상기 베이스 기판을 기준으로 동일한 높이에 위치하는 광학센서 패키지.The light receiving surface of the sensor chip and the top surface of the bezel portion are located at the same height relative to the base substrate.
  12. 제1 항에 있어서,According to claim 1,
    상기 제1 파장대역의 광을 방출하는 발광부를 더 포함하고,Further comprising a light emitting unit for emitting light of the first wavelength band,
    상기 센서칩은 지문인식용 센서칩인 광학센서 패키지.The sensor chip is an optical sensor package that is a sensor chip for fingerprint recognition.
PCT/KR2017/005487 2017-04-10 2017-05-26 Optical sensor package WO2018190460A1 (en)

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