WO2021100505A1

WO2021100505A1 - Electronic component and method for manufacturing electronic component

Info

Publication number: WO2021100505A1
Application number: PCT/JP2020/041646
Authority: WO
Inventors: 井上　和則; 慎太郎大塚; 正宏福島
Original assignee: 株式会社村田製作所
Priority date: 2019-11-18
Filing date: 2020-11-09
Publication date: 2021-05-27

Abstract

An electronic component (100) is provided with a substrate (110), a functional element (120) formed on the substrate (110), a support (140), and a cover portion (170). The support (140) is disposed over the substrate (100) around a region in which the functional element (120) is formed. The cover portion (170) is disposed to oppose the substrate (110) and, together with the substrate (100) and the support (140), forms a hollow space (180). The cover portion (170) has a shape protruding in a direction opposite to the hollow space (180).

Description

Electronic components and manufacturing methods for electronic components

The present disclosure relates to an electronic component and a method for manufacturing the electronic component, and more specifically, to a structure of an electronic component having a WLP (Wafer Level Package) structure and a functional element formed in a hollow space.

Conventionally, an elastic wave device having a WLP structure has been known. For example, in Japanese Patent Application Laid-Open No. 2007-081613 (Patent Document 1) and International Publication No. 2016/158050 (Patent Document 2), a surface acoustic wave (IDT: Interdigital Transducer) electrode is arranged on a piezoelectric substrate. A wave (SAW: Surface Acoustic Wave) device is disclosed. In such an elastic wave device, a hollow space is formed in the device by the piezoelectric substrate, the cover portion, and the support layer instructing the cover portion so that the IDT electrode can be excited on the piezoelectric substrate. ..

Japanese Unexamined Patent Publication No. 2007-081613 International Publication No. 2016/158050

Elastic wave devices are widely used in small mobile terminals such as smartphones and mobile phones, for example. The needs for miniaturization and thinning of these mobile terminals are still high, and along with this, the built-in elastic wave device is also required to be further miniaturized and thinned.

As described above, the elastic wave device requires a package structure in which a hollow space is formed inside. Therefore, if the elastic wave device is made thinner (lowered in height), it is necessary to reduce the height (gap) of the hollow space formed inside. On the other hand, the cover portion for forming the hollow space can be deformed to some extent by an external force. Therefore, when the height of the hollow space becomes low, the cover portion may be deformed and come into contact with a functional element such as an IDT electrode, so that the characteristics of the functional element may deteriorate. In order to secure the strength of the cover portion and suppress the deformation, it is necessary to increase the thickness of the cover portion, but thickening the cover portion rather hinders the thinning.

In order to solve such a problem, in Japanese Patent Application Laid-Open No. 2007-081613 (Patent Document 1) and International Publication No. 2016/158050 (Patent Document 2), the piezoelectric substrate, the support layer and the cover portion are formed. Inside the hollow space, a support member lower than the height of the support layer is arranged. This support member prevents the deformed cover portion from coming into contact with the functional element.

However, the above-mentioned support member is premised on the case where the cover portion is deformed in a convex shape toward the substrate side, and although the functional element can be protected against the deformation, the height of the hollow space is limited. , The size (height) of the functional element arranged thereby may be limited.

The present disclosure has been made to solve such a problem, and an object thereof is to secure a space in a hollow space in an electronic component having a WLP structure and a functional element arranged in the hollow space. At the same time, it is to suppress the deterioration of the characteristics of the functional element.

An electronic component according to a certain aspect of the present disclosure includes a substrate, a functional element formed on the substrate, a first support, and a cover portion. The first support is arranged on the substrate around the region where the functional element is formed. The cover portion is arranged to face the substrate and forms a hollow space together with the substrate and the first support. The cover portion has a shape that is convex in the direction opposite to the hollow space.

The method for manufacturing an electronic component according to another aspect of the present disclosure includes i) a step of forming a functional element and a functional element on a substrate, and ii) arranging a support around a region on the substrate on which the functional element is formed. Iii) The step of arranging the cover portion facing the substrate to form a hollow space by the substrate, the support and the cover portion, and iv) the step of forming the cover portion in the direction opposite to the hollow space. Includes a step of forming the shape to be.

According to the electronic component according to the present disclosure, the cover portion formed by the hollow space has a shape that is convex in the direction opposite to the hollow space. Therefore, even when the height of the first support is reduced, the space of the hollow space can be secured, and the deterioration of the characteristics of the functional element can be suppressed.

It is sectional drawing of the electronic component which concerns on embodiment. It is a top view of the electronic component which concerns on embodiment. It is an enlarged view of the end part of the protrusion part of FIG. It is sectional drawing along the line IV-IV of FIG. It is a manufacturing process of the electronic component which concerns on embodiment. It is a schematic diagram of the electronic component in the assembled state before dicing. It is a figure which shows the state of the substrate before and after dicing in the electronic component of a comparative example. It is a figure which shows an example of the state of the measurement pad after dicing. It is a figure which shows the state of the substrate before and after dicing in the electronic component which concerns on embodiment.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals, and the description thereof will not be repeated.

[Configuration of electronic components]
FIG. 1 is a cross-sectional view of an electronic component 100 according to an embodiment. Further, FIG. 2 is a plan view of the electronic component 100. Note that FIG. 1 is a cross-sectional view taken along the line I-I in FIG.

With reference to FIGS. 1 and 2, the electronic component 100 includes a substrate 110, a functional element 120, a support 140, a columnar electrode 152 formed in the support 140, a protrusion 160, and a cover 170. And. In this embodiment, the case where the electronic component 100 is a surface acoustic wave (SAW) device will be described. Therefore, a case where a piezoelectric substrate is used as the substrate 110 and an IDT electrode is included as the functional element 120 will be described as an example. Hereinafter, the substrate 110 may be referred to as a "piezoelectric substrate 110". In FIG. 1, the positive direction of the Z axis may be referred to as the upper surface side, and the negative direction may be referred to as the lower surface side.

The piezoelectric substrate 110 is made of, for example, _{a piezoelectric single crystal material such as lithium tantalate (LiTaO 3} ), lithium niobate (LiNbO ₃ ), alumina, silicon (Si), and sapphire, or LiTaO ₃ or LiNbO _3. It is formed of a piezoelectric laminated material. A plurality of functional elements 120 are arranged on the first surface 111 of the piezoelectric substrate 110. The functional element 120 is formed by using, for example, a single metal composed of at least one of aluminum, copper, silver, gold, titanium, tungsten, platinum, chromium, nickel, and molybdenum, or an electrode material such as an alloy containing these as main components. A pair of IDT electrodes is included. A surface acoustic wave (SAW) resonator is formed by the piezoelectric substrate 110 and the functional element (IDT electrode) 120.

On the first surface 111 on which the functional element 120 of the piezoelectric substrate 110 is formed, a wiring electrode 130 is formed between the functional elements 120 and for electrically connecting the functional element 120 and the connection electrode 154. ing. Further, the wiring electrode 130 is formed with a terminal electrode 150 for connecting to the columnar electrode 152.

The support 140 is formed in a wall shape surrounding the functional element 120, and projects from the first surface 111 of the piezoelectric substrate 110 in the positive direction of the Z axis. The support 140 is formed of an insulating resin such as epoxy or polyimide and / or a photosensitive resin material. A part of the support 140 covers the terminal electrode 150. The support 140 corresponds to the "first support" in the present disclosure.

The columnar electrode 152 is formed by filling a through hole (through hole) formed in the support 140 with a conductive member such as copper. The columnar electrode 152 is electrically connected to the functional element 120 via the terminal electrode 150 and the wiring electrode 130. The columnar electrode 152 is also electrically connected to the connection electrode 154 arranged on the upper surface side of the support 140. The connection electrode 154 is a terminal for connecting an external device (not shown) and the electronic component 100.

The cover portion 170 is supported by the support 140 and is arranged so as to face the first surface 111 of the piezoelectric substrate 110. The cover portion 170 is formed of, for example, a thermosetting photosensitive resin material containing epoxy, polyimide, acrylic, urethane or the like as main components. Further, the cover portion 170 may use a part of metal in addition to the above resin. The hollow space 180 is formed by the piezoelectric substrate 110, the support 140, and the cover portion 170. The functional element 120 is arranged in the hollow space 180. As shown in FIG. 1, the cover portion 170 is formed in a shape that is convex in the direction opposite to the hollow space 180 (that is, in the positive direction of the Z axis).

In the hollow space 180, a plurality of protrusions 160 are arranged at positions that do not overlap with the functional element 120. The protrusions 160 are arranged in a grid pattern or a staggered pattern. The protrusion 160 is a columnar member that protrudes from the piezoelectric substrate 110 and / or the wiring electrode 130 in the positive direction of the Z axis, and is made of the same material as the support 140. The cross section of the protrusion 160 is formed in a circular shape, an elliptical shape, or a polygonal shape. The height of the protrusion 160 (dimension in the Z-axis direction) is higher than the height of the functional element 120 and equal to or less than the height of the support 140. The protrusion 160 has a function of preventing the cover 170 from coming into contact with the functional element 120 when the cover 170 is deformed toward the hollow space 180.

A recess 162 as shown in FIG. 3 is formed at the end of the protrusion 160. The recess 162 is formed to reduce the contact area between the cover 170 and the protrusion 160 when the cover 170 is deformed and comes into contact with the protrusion 160.

Further, as shown in the plan view of FIG. 2, the electronic component 100 may further include an auxiliary support 145 for dividing the hollow space 180 into a plurality of sections. The auxiliary support 145 projects from the piezoelectric substrate 110 and / or the wiring electrode 130 in the positive direction of the Z axis. The auxiliary support 145 is formed in a wall shape or a columnar shape using the same material as the support 140. The height of the auxiliary support 145 is formed to be substantially the same as the height of the support 140. In FIG. 2, the auxiliary support 145 is arranged only in the direction along the X-axis, but in addition to or instead, it may be arranged along the Y-axis direction. The auxiliary support 145 corresponds to the "second support" in the present disclosure.

FIG. 4 is a cross-sectional view taken along the line IV-IV parallel to the Y-axis direction of FIG. As shown in FIG. 4, the cover portion 170 is supported by the auxiliary support 145 in addition to the support 140. The portion of the cover portion 170 supported by the support 140 and the auxiliary support 145 has a shape that is convex in the direction opposite to the hollow space 180.

When the convex cover portion 170 is supported only by the support 140 arranged along the outer circumference of the piezoelectric substrate 110, the amount of protrusion in the positive direction of the Z axis at the central portion of the cover portion 170 becomes large, and the entire device becomes large. The height will be high. As a result, it may hinder the miniaturization of the device size. As shown in FIG. 4, the auxiliary support 145 is arranged in the area surrounded by the support 140, and the cover portion 170 and the auxiliary support are supported by using the support 140 and the auxiliary support 145 to support the cover portion 170 and the auxiliary support. The cover portion 170 has a convex shape for each section surrounded by the body 145. Therefore, the amount of protrusion of the cover portion 170 can be reduced as compared with the case where the cover portion 170 is supported only by the support body 140. Therefore, by providing the auxiliary support 145, it is possible to prevent the size of the entire device from becoming large. Further, by increasing the number of places that support the cover portion 170, the load applied to the individual support and the auxiliary support from the cover portion 170 is dispersed, and the connection portion between the support and the auxiliary support and the substrate or the like is distributed. Since the applied moment can be reduced, peeling of the support and the auxiliary support can be suppressed.

The above-mentioned electronic components may be used for mobile terminals such as mobile phones and smartphones, but in such mobile terminals, there is still a high need for miniaturization and thinning, and these electronic components are associated therewith. Further miniaturization is needed. In an electronic component having a hollow space, an external force may act on the cover portion forming the hollow space due to sealing of the substrate or the like, and the cover portion may be deformed. In such a case, the cover portion has a convex shape toward the hollow space side, and the height of the hollow space is reduced. Therefore, the height of the functional element arranged inside the hollow space is limited, or the support is specified. It is necessary to maintain the height above.

In the electronic component of the present embodiment, the cover portion supported by the support and the auxiliary support has a shape that is convex on the opposite side (upper side) of the hollow space. As a result, the height (margin) of the hollow space can be secured even when the height of the support is lowered. Further, since the cover portion has a convex shape on the upper side, more external force is required to deform the cover portion into a convex shape on the lower side as compared with the case where the cover portion is flat. That is, the load bearing capacity against an external force can be increased. Further, in the electronic component of the embodiment, since the protrusion is arranged in the hollow space, even if the cover portion is deformed to have a downwardly convex shape, the cover portion and the functional element are still connected. Contact can be suppressed, which makes it possible to suppress deterioration of the characteristics of the functional element.

[Manufacturing process]
Next, the manufacturing process of the electronic component 100 according to the present embodiment will be described with reference to FIG. The manufacturing process includes the steps from FIGS. 5 (a) to 5 (f). FIG. 5 shows a cross-sectional view of an electronic component in each process.

In the step of FIG. 5A, a metal film such as copper is formed on the first surface 111 of the piezoelectric substrate 110 by, for example, sputtering, and the metal film is subjected to processing such as patterning and etching to perform a functional element. 120 and the wiring electrode 130 are formed. Further, the terminal electrode 150 is formed on the wiring electrode 130.

Next, in the step of FIG. 5 (b), the support 140 and the protrusion 160 are formed on the intermediate parts formed in FIG. 5 (a). The support 140 and the protrusion 160 are formed, for example, by photolithography using a photosensitive resin material. More specifically, a negative type photosensitive resin material sheet is laminated and arranged on the intermediate component formed in FIG. 5A. Then, the portion other than the region to be the support 140 and the protrusion 160 is masked and irradiated with light. In the photosensitive resin material, only the portion irradiated with light is cured. Therefore, by performing the developing process after the exposure, the portions of the support 140 and the protrusion 160 remain, and the photosensitive resin material of the portions other than the support 140 and the protrusion 160 is removed.

Since the curing of the photosensitive resin material depends on the amount of light emitted, the height of the protrusion 160 having a small light receiving area is lower than that of the support 140. The auxiliary support 145 is also formed in this step.

In the step of FIG. 5C, a through hole 142 is formed in the formed support 140 by laser processing or the like. The through hole 142 may be formed at the same time by photolithography in FIG. 5 (b).

In the step of FIG. 5 (d), the columnar electrode (via) 152 is formed in the through hole 142 formed in the step of FIG. 5 (c) (or FIG. 5 (b)). As the columnar electrode 152, for example, a method of filling the through hole 142 with a conductive paste, a method of forming by electrolytic plating, or the like is used. When electrolytic plating is used, a metal seed layer is formed on the inner surface of the through hole 142 by sputtering or the like prior to the plating treatment.

Further, a connection electrode 154 electrically connected to the formed columnar electrode 152 is formed on the upper surface of the support 140.

Next, in the process of FIG. 5 (e), the cover portion 170 is arranged on the support 140 to create a hollow space 180. The cover portion 170 is made of, for example, a thermosetting resin material, and FIG. 5 (e) shows a state before thermosetting. In the step of FIG. 5 (e), since the material of the cover portion 170 is uncured and flexible, the cover portion 170 has a convex shape toward the hollow space 180 side. In this state, at least a part of the protrusions 160 may come into contact with the cover 170. The protrusion 160 suppresses the contact of the cover 170 with the functional element 120.

In the step of FIG. 5 (f), the cover portion 170 is cured by applying heat to the intermediate part formed in FIG. 5 (e). Since the material forming the cover portion 170 generates gas during thermosetting, the gas generated during the process fills the hollow space 180 and expands. As a result, the cover portion 170 has a convex shape upward, and is cured in that state to complete the electronic component 100 as shown in FIG.

As described with reference to FIG. 3, a recess 162 is formed at the end of the protrusion 160. As described above, when the cover portion 170 is formed, the protrusion 160 comes into contact with the cover 170 in FIG. 5 (e), and the cover 170 is separated from the protrusion 160 in FIG. 5 (f). Since the contact area between the protrusion 160 and the cover 170 can be reduced by the recess 162 of the protrusion 160 as described above, in the curing process of the cover 170 in FIG. 5 (f), the cover 170 from the protrusion 160 Is easy to separate.

In the finally formed electronic component 100, the cover portion 170 and the protrusion 160 are not in contact with each other. Therefore, the stress from the outside applied to the cover portion 170 is not transmitted to the piezoelectric substrate 110 via the protrusion 160, so that the characteristic fluctuation of the functional element 120 due to the external force can be suppressed. Further, since corrosive substances that can be contained in the moisture component that passes through the cover portion 170 and infiltrates are difficult to reach the functional element 120 through the protrusion 160, these corrosive substances are applied to the functional element 120. The influence is reduced, and the characteristic fluctuation of the functional element 120 can be suppressed.

As described above, by executing the steps of FIGS. 5A to 5F, the electronic component 100 having the structure shown in FIG. 1 is formed.

In the above description, the case where the electronic component is a surface acoustic wave (SAW) device has been described as an example, but a hollow space is formed inside the component and functional elements are arranged in the hollow space. If so, the structure of the present disclosure can be applied to electronic components other than SAW devices. For example, it may be a Bulk Acoustic Wave (BAW) device, or it may be a MEMS device in which a small sensor or actuator is formed.

(Arrangement of measurement wiring)
When manufacturing electronic components as described above, a method is used in which a plurality of electronic components are formed on the same substrate by the manufacturing process described with reference to FIG. 5, and then divided into individual substrates by dicing or the like. There is. In such a method, the characteristics of individual electronic components may be evaluated in advance on the collective substrate before being divided into individual substrates. The signal state is measured using a contact-type probe when evaluating the characteristics, but in many cases, it is used when evaluating the characteristics in consideration of the possibility that contact with the probe may cause scratches on the electrodes. A dedicated measurement electrode is formed on the substrate.

Since the measurement electrode becomes unnecessary when it becomes a product, in order to effectively utilize the area in the substrate, the measurement electrode is generally arranged at the boundary between the individual substrates (that is, on the dicing line). Will be done. In this case, the measurement substrate is cut by the dicing saw at the time of division by dicing, but depending on the cutting state, a part of the cut end of the measurement electrode is peeled off and protrudes from the substrate. May be.

On the other hand, the measurement electrode is an electrode (product electrode) that is actually used as a signal electrode or a ground electrode when the electronic component becomes a product in order to measure the electrical state of the electronic component. It is connected to the. Therefore, in the electronic component divided into individual substrates, if the measurement electrode and the product electrode are still connected, the measurement electrode may be in a state where an electric potential is generated. Then, as described above, when a part of the measurement electrode is peeled off due to the division into individual substrates, the peeled portion of the measurement electrode in the state where the voltage is applied is the other conductive part on the substrate. May cause a malfunction or functional malfunction.

Therefore, in the present embodiment, at least a part of the wiring portion connecting the product electrode and the measurement electrode is formed on the dicing line. With such a configuration, the product electrode and the measurement electrode can be electrically separated when they are divided into individual substrates in the dicing process, so that the measurement electrode after separation is set to no voltage. can do. As a result, even if a peeled portion is formed on the measurement electrode after the division, it is possible to prevent the characteristics of the electronic component from being affected.

FIG. 6 is a diagram showing an example of the assembly substrate 10 before the electronic component 100 according to the present embodiment is separated by dicing. In the assembly substrate 10 of FIG. 6, as an example, six electronic components 100 are integrally formed. A region (hereinafter, also referred to as “dicing line”) 300 that is removed by dicing when each electronic component 100 is divided into individual substrates is formed at a boundary portion between the electronic components 100. Further, in each electronic component 100, the measurement electrode 200 is arranged so that at least a part of the electronic component 100 overlaps the dicing line 300.

FIG. 7 is a diagram showing the state of the substrate before and after dicing in the assembly substrate 10 # including the electronic components of the comparative example. FIG. 7 is an enlarged view of the portion corresponding to the region AR1 including the boundary portion of the four electronic components in FIG. 6, and FIG. 7A shows the state before dicing, and FIG. 7A shows the state before dicing. (B) shows the state after dicing.

With reference to FIG. 7, a dicing line 300 is formed in the region between the four electronic components 100 # 1 to 100 # 4. The measuring electrode 210 is arranged between the electronic component 100 # 1 and the electronic component 100 # 3, and the measuring electrode 220 is arranged between the electronic component 100 # 3 and the electronic component 100 # 4. Has been done. Further, the measurement electrode 230 is arranged between the electronic component 100 # 1 and the electronic component 100 # 2. The measuring

electrodes

210, 220, and 230 are all arranged so as to straddle the dicing line 300.

In the example of FIG. 7, four connection electrodes 1541 to 1544 are arranged for each of the electronic components 100 # 1 to 100 # 4. The

connection electrodes

1541 and 1542 are ground electrodes (GND) for connecting to the ground potential. Further, the

connection electrodes

1543 and 1544 are signal electrodes (SIG) to which a signal line or a power supply line is connected.

The measurement electrode 210 is connected to the connection electrode 1543 by the wiring 131 # formed in the region of the electronic component 100 # 3. The measurement electrode 220 is connected to the connection electrode 1544 by the wiring 132 # formed in the region of the electronic component 100 # 4. The measurement electrode 230 is connected to the connection electrode 1541 by the wiring 133 # formed in the region of the electronic component 100 # 1.

FIG. 7 (b) shows a state after the collective substrate 10 # in such a connection mode is divided by dicing. By dicing, the dicing line 300 shown in FIG. 7A has been removed. The measuring electrode 210 is divided into

electrodes

211 and 212, the measuring electrode 220 is divided into

electrodes

221, and 222, and the measuring electrode 230 is divided into

electrodes

231 and 232.

Electrodes 211,221,232 are "floating electrodes" that are not connected to other elements. On the other hand, the electrode 212 is connected to the connection electrode 1543 by the wiring 131 #, the electrode 222 is connected to the connection electrode 1544 by the wiring 132 #, and the electrode 231 is connected to the connection electrode 1541 by the wiring 133 #. .. That is, in the actual use of the electronic component, the

electrodes

212, 222, 231 may be in a state of being electrically connected to the circuit in the electronic component.

FIG. 8 is a diagram showing an example in the vicinity of the cut surface when the collective substrate is divided into individual substrates by dicing. In FIG. 8, the electronic component is cut by the cut surface 310. In the example of FIG. 8, a part of the end portion of the divided electrode 212 is peeled off and turned up. The peeled portion 215 can be generated by an impact during dicing. In the case of the comparative example, since the electrode 212 is connected to the connection electrode 1543 by the wiring 131 #, when the peeled portion 215 as shown in FIG. 8 is generated, the same potential as that of the connection electrode 1543 is generated in the peeled portion 215. To do.

FIG. 9 is a diagram showing a state of the substrate before and after dicing in the collective substrate 10 including the electronic components according to the present embodiment. FIG. 9A shows the state before dicing, and FIG. 9B shows the state after dicing.

Similarly to the comparative example, the assembly substrate 10 of FIG. 9 also includes four electronic components 1001 to 1004, and a dicing line 300 is formed in the region between the electronic components. The

measurement electrodes

210, 220, and 230 are arranged so as to straddle the dicing line 300.

In the assembly substrate 10, a part of the wiring 131 connecting the measurement electrode 210 and the connection electrode 1543, a part of the wiring 132 connecting the measurement electrode 220 and the connection electrode 1544, and the measurement electrode 230 are connected. A part of the wiring 133 connecting the electrode 1541 is formed on the dicing line 300.

Further, in the assembly substrate 10, the connection electrode 1541 and the connection electrode 1542 are connected by wiring in order to unify the ground potential at the time of measurement, and further, the

electronic components

1003 and 1004 are connected via the wiring 135. It is connected to a grounding connection electrode (not shown). At this time, a part of the wiring 135 is formed on the dicing line 300.

When a part of the wiring connected to the measurement electrode is formed on the dicing line 300 in this way, after the dicing is performed, as shown in FIG. 7B, the divided electrodes 211,212, All of 221,222 and 231,232 are "floating electrodes". This makes it possible to prevent the potential in the circuit from being generated in the measurement electrode when the electronic component is used. Therefore, even when the measurement electrode is peeled off as shown in FIG. 8 due to dicing, it is possible to prevent the characteristics of the electronic component from being affected.

The embodiments disclosed this time should be considered to be exemplary in all respects and not restrictive. The scope of the present disclosure is indicated by the scope of claims rather than the description of the embodiment described above, and is intended to include all modifications within the meaning and scope equivalent to the scope of claims.

10,10 # Assembly board, 100,1001,1003,1004,100 # 1-100 # 4 Electronic components, 110 board, 111 first surface, 120 functional elements, 130 wiring electrodes, 131-133, 135 wiring, 140 support Body, 142 through holes, 145 auxiliary supports, 150 terminal electrodes, 152 columnar electrodes, 154,1541-1544 connection electrodes, 160 protrusions, 162 recesses, 170 covers, 180 hollow spaces, 200, 210, 220, 230 measurements Electrodes, 211,212,221,222,231,232 electrodes, 215 peeled parts, 300 dicing lines, 310 cut surfaces, AR1 area.

Claims

With the board
The functional element formed on the substrate and
On the substrate, a first support arranged around the region where the functional element is formed, and
A cover portion that is arranged to face the substrate and forms a hollow space together with the substrate and the first support is provided.
The cover portion is an electronic component having a shape that is convex in the direction opposite to the hollow space.
The electronic component according to claim 1, further comprising a protrusion that is arranged in the hollow space and projects from the substrate.
The electronic component according to claim 2, wherein the protrusion is made of a photosensitive resin.
The electronic component according to claim 2 or 3, wherein the first support and the protrusion are made of the same material.
The electronic component according to any one of claims 2 to 4, wherein a recess is formed at the end of the protrusion.
The electronic component according to any one of claims 2 to 5, wherein the height of the protrusion is lower than the height of the first support.
The electronic component according to any one of claims 1 to 6, wherein the cover portion is made of a photosensitive resin.
Further comprising a second support arranged in the area surrounded by the first support.
The electronic component according to any one of claims 1 to 7, wherein the cover portion is supported by the first support and the second support.
A process of forming a functional element and the functional element on a substrate, and
A step of arranging a support around a region on which the functional element is formed on the substrate, and a step of arranging the support.
A step of arranging a cover portion facing the substrate to form a hollow space by the substrate, the support, and the cover portion.
A method for manufacturing an electronic component, which comprises a step of forming the cover portion into a shape that is convex in a direction opposite to the hollow space.