WO2021098529A1 - 扬声器模组及电子装置 - Google Patents

扬声器模组及电子装置 Download PDF

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Publication number
WO2021098529A1
WO2021098529A1 PCT/CN2020/126906 CN2020126906W WO2021098529A1 WO 2021098529 A1 WO2021098529 A1 WO 2021098529A1 CN 2020126906 W CN2020126906 W CN 2020126906W WO 2021098529 A1 WO2021098529 A1 WO 2021098529A1
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layer
alloy layer
module housing
module
embedded
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English (en)
French (fr)
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丁庆霞
王琪忠
牟宗君
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Goertek Inc
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Goertek Inc
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets

Definitions

  • the present invention relates to the technical field of acoustics, and more specifically, to a speaker module and an electronic device provided with the speaker module.
  • the existing speaker module shell usually adopts the structure of injection-molded steel sheet.
  • the steel sheet is usually made of a single stainless steel material.
  • the main defects include: due to the obvious difference in the physical properties of the two materials of the steel sheet and the injection molded part, the resonance frequency is also Due to the difference, the combined strength of the two cannot be guaranteed.
  • the module housing is relatively low in strength, which is prone to resonance, which causes the resonance problem of the front acoustic cavity, and the product has poor high-frequency sound effects and short service life.
  • the purpose of the present invention is to provide a speaker module and an electronic device to solve the problems of the existing speaker module housings, such as low strength and easy resonance, resulting in poor high-frequency sound effects and short service life of the product. .
  • the speaker module provided by the present invention includes a module housing with a cavity, and a speaker unit accommodated in the cavity.
  • the module housing is combined with an embedded portion at a position corresponding to the speaker unit; the embedded portion includes a first An alloy layer, a damping layer and a second alloy layer.
  • the first alloy layer and/or the second alloy layer is at least one of a copper alloy layer, an aluminum alloy layer, a titanium alloy layer, a nickel alloy layer, and an aluminum-magnesium alloy layer.
  • the material of the first alloy layer and/or the second alloy layer includes at least one element of aluminum, magnesium, copper, titanium, and nickel.
  • first alloy layer and the second alloy layer are made of the same/different materials.
  • the damping layer is at least one of a silica gel layer, a silicone rubber layer, a polyurethane layer, a polyvinyl chloride layer, an epoxy resin layer, a rubber layer, a foam layer, a paint layer, and a foam plastic layer.
  • the silica gel layer includes at least one of butyl, acrylate, polysulfide, and nitrile.
  • the module housing includes an upper module housing and a lower module housing that are adapted to be connected; corresponding embedding parts are provided at the positions of the upper module housing and the lower module housing corresponding to the speaker unit.
  • a preferred structure is that a trapezoidal recessed structure is provided in the middle of the insertion portion.
  • a preferred structure is that a coupling part embedded in the injection molding part is provided on the embedding part; a limit groove is provided on the coupling part; wherein the limit groove is a continuous positioning groove surrounding the coupling part; or, the limit groove Are at least two positioning grooves arranged at intervals on the joint part.
  • an electronic device including the speaker module as described in any one of the above.
  • the embedded part of the module housing is set in a three-layer structure, namely the first alloy layer, the damping layer, and the second alloy layer.
  • the three-layer structure can not only improve the overall strength and The heat dissipation performance can also effectively reduce the front acoustic cavity resonance of the speaker and reduce high-frequency distortion.
  • the product has a simple structure, long service life and stable performance.
  • FIG. 1 is a schematic diagram of a module housing structure of a module housing according to an embodiment of the present invention
  • Fig. 2 is a partial structural diagram of an embedded part of a module housing according to an embodiment of the present invention.
  • the reference signs include: the injection molding part 1, the embedded part 2, the first alloy layer 21, the damping layer 22, the second alloy layer 23, and the concave structure 3.
  • Fig. 1 shows a schematic structure of a module housing according to an embodiment of the present invention
  • Fig. 2 shows a partial schematic structure of an embedded part of a module housing according to an embodiment of the present invention.
  • the speaker module of the embodiment of the present invention includes a module housing with a cavity, and a speaker unit accommodated in the cavity; the module housing is combined at a position corresponding to the speaker unit There is an embedded part 2; the embedded part 2 includes a first alloy layer, a damping layer and a second alloy layer arranged in sequence.
  • the module housing may include an upper module housing and a lower module housing (not shown in the figure) that is adapted to connect with the upper module housing; the embedded part may be provided on the upper module housing and/or the lower module housing Above, as an example, the following will describe the case where the embedded part is provided on the upper shell of the module.
  • the upper shell of the module further includes an injection molded part 1 fixed to the lower shell of the module and an embedded part 2 embedded in the injection molded part 1, the embedded part 2 corresponds to the installation position of the speaker unit; the embedded part 2 includes successively The first alloy layer 21, the damping layer 22, and the second alloy layer 23 are provided, and the combination of the alloy layer (the first alloy layer 21 and the second alloy layer 23, the same below) and the damping layer 22 can make the module housing have a high Hardness, low density, not easy to oxidize, good heat dissipation, good electromagnetic shielding effect and other characteristics.
  • the first alloy layer 21 and/or the second alloy layer 23 can be selected from at least one or a combination of a copper alloy layer, an aluminum alloy layer, a titanium alloy layer, a nickel alloy layer, and an aluminum-magnesium alloy layer; for example, The first alloy layer 21 may be a copper alloy layer, or a combination layer of a copper alloy layer and a titanium alloy layer or other layers.
  • the second alloy layer 23 has a similar structure to the first alloy layer 21.
  • the material of the first alloy layer 21 and/or the second alloy layer 23 includes at least one element or a combination of multiple elements of aluminum, magnesium, copper, titanium, and nickel, in other words,
  • the first alloy layer 21 and/or the second alloy layer 23 have a single-layer structure, but one or more metal materials are added to the first alloy layer 21 and/or the second alloy layer 23.
  • the main element of the first alloy layer 21 and/or the second alloy layer 23 is aluminum, and then a certain amount of magnesium or other metal materials are added to increase the hardness of the upper shell of the module.
  • first alloy layer 21 and the second alloy layer 23 can be made of the same material/metal layer (copper alloy layer, aluminum alloy layer, titanium alloy layer, nickel alloy layer or aluminum-magnesium alloy layer, etc., the same below), or, The first alloy layer 21 and the second alloy layer 23 are made of different materials/metal layers, etc., and the effect of improving the compression resistance and electromagnetic shielding ability of the upper shell of the module is greatly improved by setting the alloy layer.
  • the damping layer 22 located between the two alloy layers may be a silicone layer, a silicone rubber layer, a polyurethane layer, a polyvinyl chloride layer, an epoxy resin layer, a rubber layer, or a foam layer.
  • the damping layer 22 can adjust the damping characteristics of the upper shell of the module, thereby improving the high-frequency sound effect of the speaker module and reducing high-frequency distortion.
  • the thickness of the first alloy layer 21 and the second alloy layer 23 occupy more than 2/3 of the entire thickness of the embedded portion 2, if less than this ratio If it is, it is easy to cause insufficient strength.
  • the thickness of the damping layer 22 in the middle can be flexibly adjusted according to actual conditions.
  • a trapezoidal concave structure 3 may also be provided on the embedded part 2.
  • the concave structure 3 Depressed toward the side close to the lower shell of the module.
  • the embedded part 2 in the module housing of the present invention is set to a non-planar structure of other structures.
  • the cross section of the upper housing of the module is set to a wavy structure or a zigzag structure.
  • the upper shell offsets the assembly stress during the assembly process of the upper module shell and the lower module shell, and improves the strength of the upper shell of the module.
  • a joining part (not shown in the figure) embedded in the injection part 1 is provided on the insertion part 2, in order to improve the firmness of the connection between the joining part and the injection part 1.
  • a limit groove or a limit bend can also be provided on the joint part; wherein the limit groove is set as a continuous positioning groove surrounding the joint part; or the limit groove is set as at least two positioning grooves arranged on the joint part at intervals groove.
  • the present invention also provides an electronic device including the above-mentioned speaker module; wherein, the speaker module includes the above-mentioned module housing and a speaker unit housed in the module housing.
  • the speaker module provided by the present invention has high hardness, low density, high temperature resistance, resistance to oxidation, and good heat dissipation performance.
  • the speaker module provided with the module housing can adjust the damping characteristics of the product through the module housing.
  • the module shell has good electromagnetic shielding effect, which can reduce the front acoustic cavity resonance of the product, thereby improving the high-frequency sound effect of the product and reducing high-frequency distortion.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本发明提供一种扬声器模组及电子装置，其中的扬声器模组包括具有腔体的模组外壳，以及收容在腔体内的扬声器单体，模组外壳上对应于扬声器单体的位置结合有嵌入部，嵌入部包括依次设置的第一合金层、阻尼层和第二合金层。利用上述发明能够使得模组外壳具有耐高温、硬度高及阻尼可调等特性。

Description

扬声器模组及电子装置 技术领域
本发明涉及声学技术领域，更为具体地，涉及一种扬声器模组及设置有该扬声器模组的电子装置。
背景技术
目前，消费类电子市场的扩大，使得大量手机、笔记本电脑得到广泛应用，而作为消费类电子产品中重要的声学部件，发声装存在广泛的需求。随着消费类电子产品在外观上轻薄化及性能上更加卓越化的要求，发声装置作为此类产品的一个重要组成单元，在其性能、尺寸、安全等方面也提出了越来越高的要求。
现有的扬声器模组外壳通常采用注塑钢片的结构，钢片通常采用单一的不锈钢材质，其存在的主要缺陷包括：因钢片与注塑件两种材质的物性存在明显差异，共振频点也不同，导致二者结合强度不能得到保证，模组外壳的强度比较低，易产生谐振，从而引起前声腔的共振问题，产品高频音效差、使用寿命短。
发明内容
鉴于上述问题，本发明的目的是提供一种扬声器模组及电子装置，以解决现有的扬声器模组外壳存在的强度低、易产生谐振，从而导致产品高频音效差、使用寿命短等问题。
本发明提供的扬声器模组，包括具有腔体的模组外壳，以及收容在腔体内的扬声器单体，模组外壳上对应于扬声器单体的位置结合有嵌入部；嵌入部包括依次设置的第一合金层、阻尼层和第二合金层。
此外，优选的结构是，第一合金层和/或第二合金层为铜合金层、铝合金层、钛合金层、镍合金层、铝镁合金层中的至少一层。
此外，优选的结构是，第一合金层和/或第二合金层的材质包括铝、镁、 铜、钛、镍中的至少一种元素。
此外，优选的结构是，第一合金层与第二合金层采用相同/不同材质。
此外，优选的结构是，阻尼层为硅胶层、硅橡胶层、聚氨酯层、聚氯乙烯层、环氧树脂层、橡胶层、泡棉层、涂料层、泡沫塑料层中的至少一层。
此外，优选的结构是，硅胶层包括丁基、丙烯酸酯、聚硫和丁腈中的至少一种材质。
此外，优选的结构是，模组外壳包括适配连接的模组上壳和模组下壳；在模组上壳和模组下壳对应扬声器单体的位置均设置对应的嵌入部。
此外，优选的结构是，在嵌入部的中部设置有梯形下凹结构。
此外，优选的结构是，在嵌入部上设置有嵌设在注塑部内的结合部；在结合部上设置有限位槽；其中，限位槽为环绕结合部的连续定位槽；或者，限位槽为间隔设置在结合部上的至少两个定位槽。
根据本发明的另一方面，提供一种电子装置，包括如上任一项所述的扬声器模组。
利用上述扬声器模组及电子装置，将模组外壳的嵌入部设置为三层结构，即第一合金层、阻尼层和第二合金层，该三层结构不仅能够提高模组外壳的整体强度及散热性能，还能够有效减小扬声器的前声腔谐振，降低高频失真，产品结构简单、使用寿命长、性能稳定。
为了实现上述以及相关目的，本发明的一个或多个方面包括后面将详细说明的特征。下面的说明以及附图详细说明了本发明的某些示例性方面。然而，这些方面指示的仅仅是可使用本发明的原理的各种方式中的一些方式。此外，本发明旨在包括所有这些方面以及它们的等同物。
附图说明
通过参考以下结合附图的说明，并且随着对本发明的更全面理解，本发明的其它目的及结果将更加明白及易于理解。在附图中：
图1为根据本发明实施例的模组外壳的模组外壳结构示意图；
图2为根据本发明实施例的模组外壳的嵌入部的局部结构示意图。
其中的附图标记包括：注塑部1、嵌入部2、第一合金层21、阻尼层22、 第二合金层23、下凹结构3。
在所有附图中相同的标号指示相似或相应的特征或功能。
具体实施方式
在下面的描述中，出于说明的目的，为了提供对一个或多个实施例的全面理解，阐述了许多具体细节。然而，很明显，也可以在没有这些具体细节的情况下实现这些实施例。在其它例子中，为了便于描述一个或多个实施例，公知的结构和设备以方框图的形式示出。
为详细描述本发明的模组外壳结构，以下将结合附图对本发明的具体实施例进行详细描述。
图1示出了根据本发明实施例的模组外壳的示意结构；图2示出了根据本发明实施例的模组外壳的嵌入部的局部示意结构。
如图1和图2所示，本发明实施例的扬声器模组，包括具有腔体的模组外壳，以及收容在腔体内的扬声器单体；在模组外壳上对应于扬声器单体的位置结合有嵌入部2；嵌入部2包括依次设置的第一合金层、阻尼层和第二合金层。
具体地，模组外壳可以包括模组上壳以及与模组上壳适配连接的模组下壳(图中未示出)；嵌入部可设置在模组上壳和/或模组下壳上，作为示例以下将以嵌入部设置在模组上壳的情况进行阐述。
其中，模组上壳进一步包括与模组下壳相固定的注塑部1以及嵌设在注塑部1内的嵌入部2，该嵌入部2对应扬声器单体的设置位置；该嵌入部2包括依次设置的第一合金层21、阻尼层22和第二合金层23，通过合金层(第一合金层21和第二合金层23，下同)和阻尼层22的配合能够使得模组外壳具有高硬度、密度低、不易氧化、散热性好、电磁屏蔽效果好等特性。
具体地，第一合金层21和/或第二合金层23可以选用铜合金层、铝合金层、钛合金层、镍合金层、铝镁合金层中的至少一层或多层的组合；例如，第一合金层21可以采用铜合金层，也可以采用铜合金层与钛合金层或其它层相结合的结合层，第二合金层23与第一合金层21结构相类似。
在本发明的一个具体实施方式中，第一合金层21和/或第二合金层23的材质包括铝、镁、铜、钛、镍中的至少一种元素或多种元素的组合，换言之， 第一合金层21和/或第二合金层23为单层结构，但是，在第一合金层21和/或第二合金层23中添加一种或多种金属材质。例如，第一合金层21和/或第二合金层23的主要元素采用铝，然后添加一定量的镁或其它金属材质来增加模组上壳的硬度。
可知，第一合金层21和第二合金层23可采用相同材质/金属层(铜合金层、铝合金层、钛合金层、镍合金层或铝镁合金层等，下同)，或者，第一合金层21和第二合金层23采用不同的材质/金属层等，通过设置合金层大搞提高模组上壳的抗压性及电磁屏蔽能力的效果。
在本发明的另一具体实施方式中，位于两个合金层之间的阻尼层22可选用硅胶层、硅橡胶层、聚氨酯层、聚氯乙烯层、环氧树脂层、橡胶层、泡棉层、涂料层、泡沫塑料层中的至少一层或多层的结合；进一步地，硅胶层包括丁基、丙烯酸酯、聚硫和丁腈中的至少一种材质或多种材质。通过阻尼层22能够对模组上壳的阻尼特性进行调节，从而提高扬声器模组的高频音效、降低高频失真。
在具体实施时，由于嵌入部2需要保证足够的机械强度，因此，优选为第一合金层21和第二合金层23的厚度占据嵌入部2整体厚度的2/3以上，如果低于该比例的话，容易造成强度不够。位于中间的阻尼层22的厚度则可以根据实际情况进行灵活的调整。
需要说明的是，为降低模组外壳对扬声器模组声腔造成的影响，还可以在嵌入部2上设置梯形下凹结构3，当模组上壳与模组下壳组装时，该下凹结构3向靠近模组下壳一侧凹陷。
进一步地，在本发明的模组外壳中的嵌入部2设置为其他结构的非平面结构，例如，将模组上壳的横截面设置为波浪形结构或者锯齿形结构，通过特殊形状的模组上壳抵消模组上壳与模组下壳装配过程中的装配应力，提高模组上壳的强度。
在本发明的另一具体实施方式中，在嵌入部2上设置有嵌设在注塑部1内的结合部(图中未示出)，为提高结合部与注塑部1之间的连接牢固程度，还可在结合部上设置限位槽或限位弯折；其中，限位槽设置为环绕结合部的连续定位槽；或者，限位槽设置为间隔设置在结合部上的至少两个定位槽。
与上述模组外壳相对应，本发明还提供一种电子装置，包括如上所述的 扬声器模组；其中，该扬声器模组包括上述模组外壳以及收容在模组外壳内的扬声器单体。
可知，本发明提供的扬声器模组，其模组外壳硬度高、密度低、耐高温、不易氧化、散热性能好，设置有该模组外壳的扬声器模组可通过模组外壳调整产品的阻尼特性，且模组外壳电磁屏蔽效果好，能够减小产品的前声腔谐振，从而提高产品的高频音效，降低高频失真。
如上参照图1和图2以示例的方式描述根据本发明的扬声器模组及电子装置。但是，本领域技术人员应当理解，对于上述本发明所提出的扬声器模组及电子装置，还可以在不脱离本发明内容的基础上做出各种改进。因此，本发明的保护范围应当由所附的权利要求书的内容确定。

Claims (10)

  1. 一种扬声器模组，包括具有腔体的模组外壳，以及收容在所述腔体内的扬声器单体；其特征在于，
    所述模组外壳上对应于所述扬声器单体的位置结合有嵌入部；
    所述嵌入部包括依次设置的第一合金层、阻尼层和第二合金层。
  2. 如权利要求1所述的模组外壳，其特征在于，
    所述第一合金层和/或所述第二合金层为铜合金层、铝合金层、钛合金层、镍合金层、铝镁合金层中的至少一层。
  3. 如权利要求1所述的模组外壳，其特征在于，
    所述第一合金层和/或所述第二合金层的材质包括铝、镁、铜、钛、镍中的至少一种元素。
  4. 如权利要求2或3所述的模组外壳，其特征在于，
    所述第一合金层与所述第二合金层采用相同/不同材质。
  5. 如权利要求1所述的模组外壳，其特征在于，
    所述阻尼层为硅胶层、硅橡胶层、聚氨酯层、聚氯乙烯层、环氧树脂层、橡胶层、泡棉层、涂料层、泡沫塑料层中的至少一层。
  6. 如权利要求5所述的模组外壳，其特征在于，
    所述硅胶层包括丁基、丙烯酸酯、聚硫和丁腈中的至少一种材质。
  7. 如权利要求1所述的模组外壳，其特征在于，
    所述模组外壳包括适配连接的模组上壳和模组下壳；
    在所述模组上壳和所述模组下壳对应所述扬声器单体的位置均设置对应的嵌入部。
  8. 如权利要求1所述的模组外壳，其特征在于，
    在所述嵌入部的中部设置有梯形下凹结构。
  9. 如权利要求1所述的模组外壳，其特征在于，在所述嵌入部上设置有嵌设在所述注塑部内的结合部；其中，
    在所述结合部上设置有限位槽；
    所述限位槽为环绕所述结合部的连续定位槽；或者，
    所述限位槽为间隔设置在所述结合部上的至少两个定位槽。
  10. 一种电子装置，其特征在于，包括如权利要求1至9任一项所述的扬声器模组。
PCT/CN2020/126906 2019-11-22 2020-11-06 扬声器模组及电子装置 Ceased WO2021098529A1 (zh)

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CN107708032A (zh) * 2017-10-17 2018-02-16 李傲 一种电磁屏蔽高音质音响
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