WO2021090974A1 - Capteur de température pour module de batterie, et module de batterie le comprenant - Google Patents

Capteur de température pour module de batterie, et module de batterie le comprenant Download PDF

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Publication number
WO2021090974A1
WO2021090974A1 PCT/KR2019/014949 KR2019014949W WO2021090974A1 WO 2021090974 A1 WO2021090974 A1 WO 2021090974A1 KR 2019014949 W KR2019014949 W KR 2019014949W WO 2021090974 A1 WO2021090974 A1 WO 2021090974A1
Authority
WO
WIPO (PCT)
Prior art keywords
fpcb
temperature sensor
connection circuit
temperature
wire
Prior art date
Application number
PCT/KR2019/014949
Other languages
English (en)
Korean (ko)
Inventor
박희완
하성호
Original Assignee
고려전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 고려전자주식회사 filed Critical 고려전자주식회사
Priority to PCT/KR2019/014949 priority Critical patent/WO2021090974A1/fr
Publication of WO2021090974A1 publication Critical patent/WO2021090974A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a temperature sensor for a battery module to which an FPCB printed with a connection circuit for signal transmission and a reinforcing circuit for applying rigidity is applied.
  • Lithium-ion batteries used in electric vehicle smartphones are charged and discharged as lithium ions move during operation. Accordingly, there is a problem in that a chemical reaction of lithium ions occurs slowly at a low temperature, resulting in a slow movement speed and rapid discharge. On the other hand, if the temperature is too high, there is a problem that the moving speed of lithium ions too quickly causes malfunction or ignition.
  • BMS Battery Management System
  • the thermistor chip is hard on the bonding surface between the soldered thermistor chip and the substrate, while the substrate is flexible, so that cracks occur in the solder according to the difference in the degree of deformation of the two with respect to external force.
  • the present invention is intended to solve the above problems, and to provide.
  • the temperature sensor of the present invention for solving the above problems includes an FPCB, a temperature measuring unit disposed on the upper surface of the FPCB, a connection circuit printed on one surface of the FPCB to transmit the signal measured by the temperature measuring unit, and the FPCB. It is disposed on and includes a reinforcing part for applying a certain rigidity to the FPCB.
  • it may further include a protection member provided in at least one of the front and rear of the temperature measurement unit based on the longitudinal direction of the FPCB to report the temperature measurement unit.
  • it may further include a protective cover provided on the FPCB to cover the upper portion of the temperature measuring member.
  • connection circuits may be provided, and the other end of the FPCB may be branched according to the number of connection circuits.
  • the temperature sensor may further include wires corresponding to the number of the connection circuits, and may further include a wire protection unit for fixing and protecting the plurality of wires.
  • the temperature sensor includes a wire for transmitting a signal of the temperature measuring unit, and one end of the wire is soldered with the connection circuit, and may further include a solder protection unit for protecting the soldered solder.
  • the reinforcement part may be a reinforcement circuit printed on the other surface of the FPCB to apply a certain rigidity to the FPCB.
  • connection circuit may be formed on an upper surface of the FPCB
  • reinforcement circuit may be formed on a lower surface of the FPCB
  • connection circuit may be formed on a lower surface of the FPCB, and a first via hole connecting the connection circuit and the thermistor chip may be formed in the FPCB.
  • the temperature sensor further includes a wire for transmitting a signal of the thermistor chip, the wire is coupled to the upper surface of the FPCB, and a second via hole connecting the connection circuit and the wire may be formed in the FPCB. have.
  • a plurality of reinforcing circuits may be provided to be spaced apart along the longitudinal direction of the FPCB.
  • the temperature sensor according to an embodiment of the present invention has the following effects.
  • connection circuit and the wire or element coupled to the connection circuit are arranged on the opposite side of the FPCB, it is possible to maintain a more stable coupling against repeated applied vibrations.
  • FIG. 1 is a partially exploded perspective view of a temperature sensor according to a first embodiment of the present invention
  • Fig. 2 is a perspective view of an FPCB part of the temperature sensor of the first embodiment of the present invention
  • Fig. 3 is a view showing the rear surface of the temperature sensor of the first embodiment of the present invention.
  • Fig. 4 is a diagram showing a cross section of a temperature sensor according to a first embodiment of the present invention.
  • FIG. 5 is a perspective view showing the rear of the FPCB of the temperature sensor of the second embodiment of the present invention.
  • FIG. 6 is a perspective view showing the top surface of the FPCB of the temperature sensor of the third embodiment of the present invention.
  • Fig. 7 is a perspective view showing the rear surface of the FPCB of the temperature sensor according to the third embodiment of the present invention.
  • Fig. 8 is a diagram showing a cross section of a temperature sensor according to a third embodiment of the present invention.
  • FIG. 9 is a perspective view showing the upper surface of the FPCB of the temperature sensor of the fourth embodiment of the present invention.
  • FIG. 1 is an exploded perspective view of a part of the temperature sensor of the first embodiment of the present invention
  • Figure 2 is a perspective view of the FPCB portion of the temperature sensor of the first embodiment of the present invention
  • Figure 3 is a first embodiment of the present invention. It is a view showing the rear surface of the temperature sensor
  • FIG. 4 is a view showing a cross section of the temperature sensor of the first embodiment of the present invention.
  • the temperature sensor 100 includes an FPCB 110, a temperature measuring unit 101, a connection circuit 120, and a reinforcing unit 130.
  • the FPCB 110 may be made of various flexible materials that can be bent. It is formed long in the longitudinal direction, a temperature measuring unit 101 is mounted at one end, and a wire 2 for transmitting a signal from the temperature measuring unit 101 is coupled to the other end.
  • the other end of the FPCB 110 is formed to be branched into two. Therefore, when the two wires 2 are respectively soldered to the two connection circuits 120, both are shorted or the flux in the solder is electrically energized, thereby preventing an electrical characteristic value error. .
  • the temperature measuring unit 101 measures the temperature of a battery or an environment to which the battery is exposed.
  • Various types of sensors for temperature measurement may be applied, and in this embodiment, an on thermistor chip is used, and it is electrically connected to two connection circuits 120 for converting and transmitting a thermal signal into an electrical signal. .
  • connection circuit 120 may be printed on one side of the FPCB 110 in various ways. In this embodiment, the two connection circuits 120 are printed side by side to transmit the signal of the temperature measuring unit 101 to the two wires 2.
  • connection circuit 120 is printed on the upper surface of the FPCB on which the temperature measuring unit 101 is mounted. Accordingly, the temperature measuring unit 101 is mounted on one end of the connection circuit 120 and the two wires 2 are coupled to the other end of the connection circuit 120 by soldering.
  • the reinforcing part 130 is provided in the FPCB 120 to provide a certain rigidity to the FPCB 120.
  • the FPCB 120 is formed long in the longitudinal direction and made of a flexible material, when used for a battery of a vehicle, it is continuously deformed according to external vibrations generated during a driving process. In this case, there is a problem in that a lot of deformation occurs in parts that are coupled to each other, such as the FPCB 110, the connection circuit 120, the temperature measuring unit 101, and the wire 2, resulting in poor durability. Accordingly, in the present invention, the FPCB 110 is provided with the reinforcing portion 130 to limit the deformation of the portion in contact with the reinforcing portion 130 of the FPCB.
  • the reinforcing part 130 may be made of various materials having greater rigidity than the FPCB 120, and various bonding methods may be adopted.
  • the reinforcing part 130 in this embodiment may be provided in the form of a reinforcing circuit 130 printed on one side of the connection circuit 120 and the FPCB 110.
  • a method of printing a circuit on an FPCB is applied, but this is not for electrical connection, but will be printed for use in utilizing the rigidity of the printed material (eg, copper).
  • the printed material eg, copper
  • connection circuit 120 and the reinforcement circuit 130 may be printed in one process.
  • the reinforcement circuit 130 will be printed on the rear surface of the FPCB 110 along the lengthwise direction of the FPCB 120 as shown in FIG. 3. Therefore, by cutting a separate material into a size that can be attached to the FPCB 120 and printing a circuit without a process such as bonding, a certain rigidity can be provided to the FPCB 120 simply.
  • connection circuit 120 for transmitting a signal from the temperature measuring unit 101 to the battery monitoring system is printed on the upper surface of the FPCB 110 through a process of printing a commonly used circuit, and the FPCB A certain stiffness is provided to the FPCB 110 through a simple process of printing a reinforcement circuit 130 for securing a certain stiffness to the FPCB 110 on the rear surface of (110).
  • the temperature sensor 100 of the present embodiment further includes a connection terminal (1), a wire (2), a wire protection unit (3), a solder protection unit (4).
  • connection terminal 2 is connected to a battery monitoring system (BMS) that monitors the voltage, temperature, and current of the battery in real time, and transmits the signal measured by the temperature measuring unit 101 to be described later to the battery monitoring system. do.
  • BMS battery monitoring system
  • the wire 3 serves as a path through which the signal measured by the temperature measuring unit 101 is transmitted, and in this embodiment, a wire protection unit 3 may be provided to protect the two wires 3 from spreading. .
  • solder protection unit 4 functions to protect the connection circuit 120 and the solder 5 soldered to the wire 2 from an external environment.
  • the temperature sensor 100 of this embodiment includes a protective member 102 and a protective cover 103 for protecting the temperature measuring unit 101 from external impact.
  • Two protective members 102 are provided at the front and rear of the temperature measuring unit 101 based on the longitudinal direction of the FPCB 110.
  • the protective cover 103 is formed with a width equal to or smaller than that of the FPCB 110.
  • one end is coupled to the front of the protection member 102 located in front of the temperature measurement unit 101, and is provided to cover the upper portion of the two protection members 102 and the temperature measurement unit 101, the other end at the rear end. It is coupled to the protective member 102 to be disposed. That is, both left and right sides of the protective cover 103 will be formed in an open state in order to measure the temperature of the temperature measuring unit 101.
  • FIG. 5 is a perspective view showing the rear surface of the FPCB of the temperature sensor of the second embodiment of the present invention.
  • the reinforcing circuits 230 are disposed at a predetermined distance along the longitudinal direction of the FPCB 210. Therefore, the point where the reinforcing circuit 230 is not formed is relatively easily bent compared to the point where the reinforcing circuit 230 is formed.
  • the reinforcing circuit 230 is provided only in a portion that is not a portion that should be bent in consideration of the internal design of the battery pack to be actually applied. Therefore, it can be configured to facilitate bending of a portion to be bent and arranged according to the installation structure.
  • Fig. 6 is a perspective view showing the top of the FPCB of the temperature sensor of the third embodiment of the present invention
  • Fig. 7 is a perspective view showing the rear of the FPCB of the temperature sensor of the third embodiment of the present invention
  • Fig. 8 is a fourth of the present invention. It is a perspective view showing a cross section of the temperature sensor of the embodiment.
  • connection circuit 320 is provided on the rear surface of the FPCB 310 (see FIG. 7 ), and the reinforcement circuit 330 is disposed on the upper surface of the FPCB 310.
  • the temperature control unit 101 is mounted on the upper surface of the FPCB 310 as in the above embodiments, and the wire 2 is also coupled to the upper surface of the FPCB 310 by solder 5. .
  • connection pad 321 in consideration of the contact area with the temperature control unit 101 and the wire 2 may be formed on the upper surface of the FPCB 310 in which the first via hole 310a and the second via hole 310b are formed.
  • connection pad 321 may be printed like the reinforcement circuit 330 printed on the upper surface of the FPCB 310.
  • the FPCB 110 when the wire 2 is located on the upper surface of the connection circuit 120 and soldering the upper surface thereof with solder, the FPCB 110, the connection circuit 120, the wire 2, and the solder If the FPCB 110 is repeatedly bent due to the difference in the stiffness of (5), a crack occurs in the peripheral portion of the contact between the solder 5 and the connection circuit 120, or a short circuit causes the signal from the temperature measuring unit 101 to be There are cases where it cannot be accurately delivered.
  • connection circuit 320 is provided on the rear surface of the FPCB 310 and is electrically connected to the wire 2 through the second via hole 310b.
  • FIG. 9 is a perspective view showing the upper surface of the FPCB of the temperature sensor of the fourth embodiment of the present invention.
  • the reinforcing circuits 430 are disposed to be spaced apart a predetermined distance along the length direction. Accordingly, the point where the reinforcing circuit 430 is not formed is relatively easily bent compared to the point where the reinforcing circuit 430 is formed.
  • the reinforcing circuit 230 is provided in a portion that is not a portion that should be bent. Therefore, it can be configured to facilitate bending of a portion to be bent and arranged according to the installation structure.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

Un capteur de température, selon un mode de réalisation de la présente invention, comprend : une FPCB; une unité de mesure de température disposée sur la surface supérieure de la FPCB; un circuit de connexion imprimé sur une surface de la FPCB afin de délivrer un signal mesuré par l'unité de mesure de température; et une unité de renforcement qui est disposée sur la FPCB et fournit une rigidité réglée à la FPCB.
PCT/KR2019/014949 2019-11-06 2019-11-06 Capteur de température pour module de batterie, et module de batterie le comprenant WO2021090974A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2019/014949 WO2021090974A1 (fr) 2019-11-06 2019-11-06 Capteur de température pour module de batterie, et module de batterie le comprenant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2019/014949 WO2021090974A1 (fr) 2019-11-06 2019-11-06 Capteur de température pour module de batterie, et module de batterie le comprenant

Publications (1)

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WO2021090974A1 true WO2021090974A1 (fr) 2021-05-14

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PCT/KR2019/014949 WO2021090974A1 (fr) 2019-11-06 2019-11-06 Capteur de température pour module de batterie, et module de batterie le comprenant

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060070869A (ko) * 2004-12-21 2006-06-26 삼성전자주식회사 보강 패턴을 포함하는 반도체 칩 패키지 및 이를 포함하는액정표시장치
KR20090062078A (ko) * 2007-12-12 2009-06-17 엘지디스플레이 주식회사 보강층이 형성된 연성회로기판 및 유기 전계 발광 표시장치
KR20170116634A (ko) * 2016-04-11 2017-10-20 희성전자 주식회사 배터리 모듈
KR101872833B1 (ko) * 2016-12-30 2018-06-29 주식회사 유라코퍼레이션 배터리셀 모듈의 온도센서 고정 구조
JP2019036616A (ja) * 2017-08-14 2019-03-07 住友電気工業株式会社 フレキシブルプリント配線板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060070869A (ko) * 2004-12-21 2006-06-26 삼성전자주식회사 보강 패턴을 포함하는 반도체 칩 패키지 및 이를 포함하는액정표시장치
KR20090062078A (ko) * 2007-12-12 2009-06-17 엘지디스플레이 주식회사 보강층이 형성된 연성회로기판 및 유기 전계 발광 표시장치
KR20170116634A (ko) * 2016-04-11 2017-10-20 희성전자 주식회사 배터리 모듈
KR101872833B1 (ko) * 2016-12-30 2018-06-29 주식회사 유라코퍼레이션 배터리셀 모듈의 온도센서 고정 구조
JP2019036616A (ja) * 2017-08-14 2019-03-07 住友電気工業株式会社 フレキシブルプリント配線板

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