WO2021090974A1 - Temperature sensor for battery module, and battery module including same - Google Patents

Temperature sensor for battery module, and battery module including same Download PDF

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Publication number
WO2021090974A1
WO2021090974A1 PCT/KR2019/014949 KR2019014949W WO2021090974A1 WO 2021090974 A1 WO2021090974 A1 WO 2021090974A1 KR 2019014949 W KR2019014949 W KR 2019014949W WO 2021090974 A1 WO2021090974 A1 WO 2021090974A1
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WO
WIPO (PCT)
Prior art keywords
fpcb
temperature sensor
connection circuit
temperature
wire
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PCT/KR2019/014949
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French (fr)
Korean (ko)
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박희완
하성호
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고려전자주식회사
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Priority to PCT/KR2019/014949 priority Critical patent/WO2021090974A1/en
Publication of WO2021090974A1 publication Critical patent/WO2021090974A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/42Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Definitions

  • the present invention relates to a temperature sensor for a battery module to which an FPCB printed with a connection circuit for signal transmission and a reinforcing circuit for applying rigidity is applied.
  • Lithium-ion batteries used in electric vehicle smartphones are charged and discharged as lithium ions move during operation. Accordingly, there is a problem in that a chemical reaction of lithium ions occurs slowly at a low temperature, resulting in a slow movement speed and rapid discharge. On the other hand, if the temperature is too high, there is a problem that the moving speed of lithium ions too quickly causes malfunction or ignition.
  • BMS Battery Management System
  • the thermistor chip is hard on the bonding surface between the soldered thermistor chip and the substrate, while the substrate is flexible, so that cracks occur in the solder according to the difference in the degree of deformation of the two with respect to external force.
  • the present invention is intended to solve the above problems, and to provide.
  • the temperature sensor of the present invention for solving the above problems includes an FPCB, a temperature measuring unit disposed on the upper surface of the FPCB, a connection circuit printed on one surface of the FPCB to transmit the signal measured by the temperature measuring unit, and the FPCB. It is disposed on and includes a reinforcing part for applying a certain rigidity to the FPCB.
  • it may further include a protection member provided in at least one of the front and rear of the temperature measurement unit based on the longitudinal direction of the FPCB to report the temperature measurement unit.
  • it may further include a protective cover provided on the FPCB to cover the upper portion of the temperature measuring member.
  • connection circuits may be provided, and the other end of the FPCB may be branched according to the number of connection circuits.
  • the temperature sensor may further include wires corresponding to the number of the connection circuits, and may further include a wire protection unit for fixing and protecting the plurality of wires.
  • the temperature sensor includes a wire for transmitting a signal of the temperature measuring unit, and one end of the wire is soldered with the connection circuit, and may further include a solder protection unit for protecting the soldered solder.
  • the reinforcement part may be a reinforcement circuit printed on the other surface of the FPCB to apply a certain rigidity to the FPCB.
  • connection circuit may be formed on an upper surface of the FPCB
  • reinforcement circuit may be formed on a lower surface of the FPCB
  • connection circuit may be formed on a lower surface of the FPCB, and a first via hole connecting the connection circuit and the thermistor chip may be formed in the FPCB.
  • the temperature sensor further includes a wire for transmitting a signal of the thermistor chip, the wire is coupled to the upper surface of the FPCB, and a second via hole connecting the connection circuit and the wire may be formed in the FPCB. have.
  • a plurality of reinforcing circuits may be provided to be spaced apart along the longitudinal direction of the FPCB.
  • the temperature sensor according to an embodiment of the present invention has the following effects.
  • connection circuit and the wire or element coupled to the connection circuit are arranged on the opposite side of the FPCB, it is possible to maintain a more stable coupling against repeated applied vibrations.
  • FIG. 1 is a partially exploded perspective view of a temperature sensor according to a first embodiment of the present invention
  • Fig. 2 is a perspective view of an FPCB part of the temperature sensor of the first embodiment of the present invention
  • Fig. 3 is a view showing the rear surface of the temperature sensor of the first embodiment of the present invention.
  • Fig. 4 is a diagram showing a cross section of a temperature sensor according to a first embodiment of the present invention.
  • FIG. 5 is a perspective view showing the rear of the FPCB of the temperature sensor of the second embodiment of the present invention.
  • FIG. 6 is a perspective view showing the top surface of the FPCB of the temperature sensor of the third embodiment of the present invention.
  • Fig. 7 is a perspective view showing the rear surface of the FPCB of the temperature sensor according to the third embodiment of the present invention.
  • Fig. 8 is a diagram showing a cross section of a temperature sensor according to a third embodiment of the present invention.
  • FIG. 9 is a perspective view showing the upper surface of the FPCB of the temperature sensor of the fourth embodiment of the present invention.
  • FIG. 1 is an exploded perspective view of a part of the temperature sensor of the first embodiment of the present invention
  • Figure 2 is a perspective view of the FPCB portion of the temperature sensor of the first embodiment of the present invention
  • Figure 3 is a first embodiment of the present invention. It is a view showing the rear surface of the temperature sensor
  • FIG. 4 is a view showing a cross section of the temperature sensor of the first embodiment of the present invention.
  • the temperature sensor 100 includes an FPCB 110, a temperature measuring unit 101, a connection circuit 120, and a reinforcing unit 130.
  • the FPCB 110 may be made of various flexible materials that can be bent. It is formed long in the longitudinal direction, a temperature measuring unit 101 is mounted at one end, and a wire 2 for transmitting a signal from the temperature measuring unit 101 is coupled to the other end.
  • the other end of the FPCB 110 is formed to be branched into two. Therefore, when the two wires 2 are respectively soldered to the two connection circuits 120, both are shorted or the flux in the solder is electrically energized, thereby preventing an electrical characteristic value error. .
  • the temperature measuring unit 101 measures the temperature of a battery or an environment to which the battery is exposed.
  • Various types of sensors for temperature measurement may be applied, and in this embodiment, an on thermistor chip is used, and it is electrically connected to two connection circuits 120 for converting and transmitting a thermal signal into an electrical signal. .
  • connection circuit 120 may be printed on one side of the FPCB 110 in various ways. In this embodiment, the two connection circuits 120 are printed side by side to transmit the signal of the temperature measuring unit 101 to the two wires 2.
  • connection circuit 120 is printed on the upper surface of the FPCB on which the temperature measuring unit 101 is mounted. Accordingly, the temperature measuring unit 101 is mounted on one end of the connection circuit 120 and the two wires 2 are coupled to the other end of the connection circuit 120 by soldering.
  • the reinforcing part 130 is provided in the FPCB 120 to provide a certain rigidity to the FPCB 120.
  • the FPCB 120 is formed long in the longitudinal direction and made of a flexible material, when used for a battery of a vehicle, it is continuously deformed according to external vibrations generated during a driving process. In this case, there is a problem in that a lot of deformation occurs in parts that are coupled to each other, such as the FPCB 110, the connection circuit 120, the temperature measuring unit 101, and the wire 2, resulting in poor durability. Accordingly, in the present invention, the FPCB 110 is provided with the reinforcing portion 130 to limit the deformation of the portion in contact with the reinforcing portion 130 of the FPCB.
  • the reinforcing part 130 may be made of various materials having greater rigidity than the FPCB 120, and various bonding methods may be adopted.
  • the reinforcing part 130 in this embodiment may be provided in the form of a reinforcing circuit 130 printed on one side of the connection circuit 120 and the FPCB 110.
  • a method of printing a circuit on an FPCB is applied, but this is not for electrical connection, but will be printed for use in utilizing the rigidity of the printed material (eg, copper).
  • the printed material eg, copper
  • connection circuit 120 and the reinforcement circuit 130 may be printed in one process.
  • the reinforcement circuit 130 will be printed on the rear surface of the FPCB 110 along the lengthwise direction of the FPCB 120 as shown in FIG. 3. Therefore, by cutting a separate material into a size that can be attached to the FPCB 120 and printing a circuit without a process such as bonding, a certain rigidity can be provided to the FPCB 120 simply.
  • connection circuit 120 for transmitting a signal from the temperature measuring unit 101 to the battery monitoring system is printed on the upper surface of the FPCB 110 through a process of printing a commonly used circuit, and the FPCB A certain stiffness is provided to the FPCB 110 through a simple process of printing a reinforcement circuit 130 for securing a certain stiffness to the FPCB 110 on the rear surface of (110).
  • the temperature sensor 100 of the present embodiment further includes a connection terminal (1), a wire (2), a wire protection unit (3), a solder protection unit (4).
  • connection terminal 2 is connected to a battery monitoring system (BMS) that monitors the voltage, temperature, and current of the battery in real time, and transmits the signal measured by the temperature measuring unit 101 to be described later to the battery monitoring system. do.
  • BMS battery monitoring system
  • the wire 3 serves as a path through which the signal measured by the temperature measuring unit 101 is transmitted, and in this embodiment, a wire protection unit 3 may be provided to protect the two wires 3 from spreading. .
  • solder protection unit 4 functions to protect the connection circuit 120 and the solder 5 soldered to the wire 2 from an external environment.
  • the temperature sensor 100 of this embodiment includes a protective member 102 and a protective cover 103 for protecting the temperature measuring unit 101 from external impact.
  • Two protective members 102 are provided at the front and rear of the temperature measuring unit 101 based on the longitudinal direction of the FPCB 110.
  • the protective cover 103 is formed with a width equal to or smaller than that of the FPCB 110.
  • one end is coupled to the front of the protection member 102 located in front of the temperature measurement unit 101, and is provided to cover the upper portion of the two protection members 102 and the temperature measurement unit 101, the other end at the rear end. It is coupled to the protective member 102 to be disposed. That is, both left and right sides of the protective cover 103 will be formed in an open state in order to measure the temperature of the temperature measuring unit 101.
  • FIG. 5 is a perspective view showing the rear surface of the FPCB of the temperature sensor of the second embodiment of the present invention.
  • the reinforcing circuits 230 are disposed at a predetermined distance along the longitudinal direction of the FPCB 210. Therefore, the point where the reinforcing circuit 230 is not formed is relatively easily bent compared to the point where the reinforcing circuit 230 is formed.
  • the reinforcing circuit 230 is provided only in a portion that is not a portion that should be bent in consideration of the internal design of the battery pack to be actually applied. Therefore, it can be configured to facilitate bending of a portion to be bent and arranged according to the installation structure.
  • Fig. 6 is a perspective view showing the top of the FPCB of the temperature sensor of the third embodiment of the present invention
  • Fig. 7 is a perspective view showing the rear of the FPCB of the temperature sensor of the third embodiment of the present invention
  • Fig. 8 is a fourth of the present invention. It is a perspective view showing a cross section of the temperature sensor of the embodiment.
  • connection circuit 320 is provided on the rear surface of the FPCB 310 (see FIG. 7 ), and the reinforcement circuit 330 is disposed on the upper surface of the FPCB 310.
  • the temperature control unit 101 is mounted on the upper surface of the FPCB 310 as in the above embodiments, and the wire 2 is also coupled to the upper surface of the FPCB 310 by solder 5. .
  • connection pad 321 in consideration of the contact area with the temperature control unit 101 and the wire 2 may be formed on the upper surface of the FPCB 310 in which the first via hole 310a and the second via hole 310b are formed.
  • connection pad 321 may be printed like the reinforcement circuit 330 printed on the upper surface of the FPCB 310.
  • the FPCB 110 when the wire 2 is located on the upper surface of the connection circuit 120 and soldering the upper surface thereof with solder, the FPCB 110, the connection circuit 120, the wire 2, and the solder If the FPCB 110 is repeatedly bent due to the difference in the stiffness of (5), a crack occurs in the peripheral portion of the contact between the solder 5 and the connection circuit 120, or a short circuit causes the signal from the temperature measuring unit 101 to be There are cases where it cannot be accurately delivered.
  • connection circuit 320 is provided on the rear surface of the FPCB 310 and is electrically connected to the wire 2 through the second via hole 310b.
  • FIG. 9 is a perspective view showing the upper surface of the FPCB of the temperature sensor of the fourth embodiment of the present invention.
  • the reinforcing circuits 430 are disposed to be spaced apart a predetermined distance along the length direction. Accordingly, the point where the reinforcing circuit 430 is not formed is relatively easily bent compared to the point where the reinforcing circuit 430 is formed.
  • the reinforcing circuit 230 is provided in a portion that is not a portion that should be bent. Therefore, it can be configured to facilitate bending of a portion to be bent and arranged according to the installation structure.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

A temperature sensor, according to an embodiment of the present invention, comprises: an FPCB; a temperature measurement unit disposed on the upper surface of the FPCB; a connection circuit printed on one surface of the FPCB in order to deliver a signal measured by the temperature measurement unit; and a reinforcement unit which is disposed on the FPCB and provides a set stiffness to the FPCB.

Description

전지모듈용 온도센서 및 이를 포함하는 전지모듈Temperature sensor for battery module and battery module including the same
본 발명은 신호 전달을 위한 연결회로 및 강성 인가를 위한 보강회로가 인쇄된 FPCB가 적용되는 전지모듈용 온도센서에 관한 것이다.The present invention relates to a temperature sensor for a battery module to which an FPCB printed with a connection circuit for signal transmission and a reinforcing circuit for applying rigidity is applied.
전기자동차 스마트폰 등에 사용되는 리튬이온 배터리는 작동 과정에서 리튬이온이 움직이면서 충전 및 방전을 하게 된다. 이에 따라 낮은 온도에서는 리튬이온의 화학 작용이 천천히 일어나 이동 속도가 느려지고, 방전이 빨리 된다는 문제점이 있다. 이에 반해 온도가 너무 높은 경우 리튬이온의 이동속도가 너무 빨리 오작동 또는 발화의 원인이 된다는 문제점이 있다. Lithium-ion batteries used in electric vehicle smartphones are charged and discharged as lithium ions move during operation. Accordingly, there is a problem in that a chemical reaction of lithium ions occurs slowly at a low temperature, resulting in a slow movement speed and rapid discharge. On the other hand, if the temperature is too high, there is a problem that the moving speed of lithium ions too quickly causes malfunction or ignition.
이에 따라 리튬이온배터리를 사용하는 경우 적절한 온도의 유지가 매우 중요하다. 특히 전기자동차 등에 사용되는 경우 다량의 리튬이온배터리가 사용됨에 따라 적절한 온도관리가 더욱 중요한 요소이다. Accordingly, it is very important to maintain an appropriate temperature when using a lithium-ion battery. In particular, when used in electric vehicles, proper temperature management is more important as a large amount of lithium-ion batteries are used.
이에 따라 리튬이온배터리 사용시 배터리의 효율증대 및 수명저하방지 등을 위하여 배터리의 상태를 실시간으로 모니터링하는 시스템(BMS: Battery Management System)이 채택되는 것이 일반적으로, 이 중 배터리의 온도의 측정은 매우 중요한 측정인자이다. Accordingly, when using a lithium-ion battery, a system that monitors the condition of the battery in real time (BMS: Battery Management System) is generally adopted to increase the efficiency of the battery and prevent the life of the battery from deteriorating. Among these, the measurement of the temperature of the battery is very important. It is a measurement factor.
따라서 전기자동차용 리튬이온배터리팩 등에는 다수의 온도센서가 구비되는 것이 일반적이다. 그러나 차량에 사용되는 리튬이온배터리팩의 경우 운행과정의 진동 등에 대한 단선 등을 방지하고, 배터리팩에 설치자유도 등을 고려하여 대한민국 등록공보 제10-1750489호와 같이 FPCB를 사용하는 경우가 있다. Therefore, it is common to have a plurality of temperature sensors in lithium-ion battery packs for electric vehicles. However, in the case of lithium-ion battery packs used in vehicles, there are cases in which FPCBs are used as in Korean Registered Gazette No. 10-1750489 in consideration of the degree of freedom of installation in the battery pack and to prevent disconnection due to vibration during operation. .
그러나 FPCB를 사용하는 경우, 플랙서블한 소재의 특정상 차량운행에 따른 진동 등에 따라 미세 진동을 하여 오히려 단선의 위험이 있다는 문제점이 있다. However, in the case of using the FPCB, there is a problem in that there is a risk of disconnection due to fine vibration due to vibration caused by vehicle operation due to the specificity of the flexible material.
특히, 솔더링(Soldering)된 써미스터칩과 기판의 접합면에서 써미스터칩은 하드한 반면, 기판은 플랙서블하여 외력에 대한 양자의 변형 정도의 차이에 따라 솔더에 크랙이 발생하는 등의 문제점이 있었다.In particular, the thermistor chip is hard on the bonding surface between the soldered thermistor chip and the substrate, while the substrate is flexible, so that cracks occur in the solder according to the difference in the degree of deformation of the two with respect to external force.
본 발명은 상기와 같은 문제를 해결하기 위한 것으로서, 제공하는데 있다.The present invention is intended to solve the above problems, and to provide.
본 발명이 해결하고자 하는 과제가 상술한 과제로 제한되는 것은 아니며, 언급되지 아니한 과제들은 본 명세서 및 첨부된 도면으로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다.The problem to be solved by the present invention is not limited to the above-described problems, and problems that are not mentioned will be clearly understood by those of ordinary skill in the art from the present specification and the accompanying drawings. .
상기의 과제를 해결하기 위한 본 발명의 온도센서는 FPCB, FPCB의 상면에 배치되는 온도측정부, 상기 상기 온도측정부에서 측정된 신호를 전달하기 위하여 상기 FPCB의 일면에 인쇄되는 연결회로 및 상기 FPCB에 배치되어 FPCB에 일정 강성을 인가하기 위한 보강부를 포함한다. The temperature sensor of the present invention for solving the above problems includes an FPCB, a temperature measuring unit disposed on the upper surface of the FPCB, a connection circuit printed on one surface of the FPCB to transmit the signal measured by the temperature measuring unit, and the FPCB. It is disposed on and includes a reinforcing part for applying a certain rigidity to the FPCB.
여기서 상기 FPCB의 길이방향을 기준으로 온도측정부의 전방 및 후방 중 적어도 하나에 구비되어 상기 온도측정부를 보고하기 위한 보호부재를 더 포함할 수 있다. Here, it may further include a protection member provided in at least one of the front and rear of the temperature measurement unit based on the longitudinal direction of the FPCB to report the temperature measurement unit.
또한, 상기 온도측정부재의 상부를 덮도록 상기 FPCB에 구비되는 보호커버를 더 포함할 수 있다.In addition, it may further include a protective cover provided on the FPCB to cover the upper portion of the temperature measuring member.
한편, 상기 연결회로는 복수 개가 구비되고, 상기 FPCB의 타단은 상기 연결회로의 개수에 따라 분지 형성될 수 있다. Meanwhile, a plurality of connection circuits may be provided, and the other end of the FPCB may be branched according to the number of connection circuits.
그리고 상기 온도센서는 상기 연결회로의 개수에 대응되는 와이어를 더 포함하고, 상기 복수개의 와이어를 고정 및 보호하기 위한 와이어보호부를 더 포함할 수 있다. In addition, the temperature sensor may further include wires corresponding to the number of the connection circuits, and may further include a wire protection unit for fixing and protecting the plurality of wires.
그리고 상기 온도센서는 상기 온도측정부의 신호를 전달하기 위한 와이어를 포함하고, 상기 와이어의 일단은 상기 연결회로와 솔더링되며, 상기 솔더링된 솔더를 보호하기 위한 솔더보호부를 더 포함할 수 있다. In addition, the temperature sensor includes a wire for transmitting a signal of the temperature measuring unit, and one end of the wire is soldered with the connection circuit, and may further include a solder protection unit for protecting the soldered solder.
한편, 상기 보강부는 상기 FPCB의 타면에 인쇄되어 상기 FPCB에 일정 강성을 인가하는 보강회로일 수 있다.Meanwhile, the reinforcement part may be a reinforcement circuit printed on the other surface of the FPCB to apply a certain rigidity to the FPCB.
여기서 상기 연결회로는 상기 FPCB의 상면에 형성되고, 상기 보강회로는 상기 FPCB의 하면에 형성될 수 있다.Here, the connection circuit may be formed on an upper surface of the FPCB, and the reinforcement circuit may be formed on a lower surface of the FPCB.
그리고 상기 연결회로는 상기 FPCB의 하면에 형성되고, 상기 FPCB에는 상기 연결회로 및 상기 써미스터칩을 연결하는 제1비아홀이 형성될 수 있다.In addition, the connection circuit may be formed on a lower surface of the FPCB, and a first via hole connecting the connection circuit and the thermistor chip may be formed in the FPCB.
그리고 상기 온도센서는 상기 써미스터칩의 신호를 전달하기 위한 와이어를 더 포함하고, 상기 와이어는 상기 FPCB의 상면에 결합되고, 상기 FPCB에는 상기 연결회로와 상기 와이어를 연결하는 제2비아홀이 형성될 수 있다.And the temperature sensor further includes a wire for transmitting a signal of the thermistor chip, the wire is coupled to the upper surface of the FPCB, and a second via hole connecting the connection circuit and the wire may be formed in the FPCB. have.
상기 보강회로는 상기 FPCB의 길이방향을 따라 복수 개가 이격되어 구비되될 수 있다.A plurality of reinforcing circuits may be provided to be spaced apart along the longitudinal direction of the FPCB.
본 발명의 일 실시예에 따른 온도센서는 아래와 같은 효과가 있다. The temperature sensor according to an embodiment of the present invention has the following effects.
첫째, FPCB에 일정 강성을 인가하기 위한 보강부를 간단한 공정으로 구현이 가능하다.First, it is possible to implement a reinforcement part for applying a certain rigidity to the FPCB through a simple process.
둘째, 연결회로와 연결회로와 결합되는 와이어 또는 소자를 FPCB의 반대편에 배치하여 반복적으로 인가되는 진동에 보다 안정적인 결합을 유지할 수 있다. Second, by arranging the connection circuit and the wire or element coupled to the connection circuit on the opposite side of the FPCB, it is possible to maintain a more stable coupling against repeated applied vibrations.
셋째, FPCB가 휘어져야 하는 지점을 제외한 지점에만 간단한 공정으로 보강회로를 형성할 수 있다. Third, it is possible to form a reinforcement circuit with a simple process only at points excluding the points where the FPCB should be bent.
본 발명의 효과가 상술한 효과들로 제한되는 것은 아니며, 언급되지 아니한 효과들은 본 명세서 및 첨부된 도면으로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 명확히 이해될 수 있을 것이다.The effects of the present invention are not limited to the above-described effects, and effects that are not mentioned will be clearly understood by those of ordinary skill in the art from the present specification and the accompanying drawings.
도1은 본 발명의 제1실시예의 온도센서의 일부 구성이 분해된 사시도;1 is a partially exploded perspective view of a temperature sensor according to a first embodiment of the present invention;
도2는 본 발명의 제1실시예의 온도센서의 FPCB 부분의 사시도;Fig. 2 is a perspective view of an FPCB part of the temperature sensor of the first embodiment of the present invention;
도3은 본 발명의 제1실시예의 온도센서의 배면을 나타내는 도면;Fig. 3 is a view showing the rear surface of the temperature sensor of the first embodiment of the present invention;
도4는 본 발명의 제1실시예의 온도센서의 단면을 나타내는 도면;Fig. 4 is a diagram showing a cross section of a temperature sensor according to a first embodiment of the present invention;
도5는 본 발명의 제2실시예의 온도센서의 FPCB 배면을 나타내는 사시도;5 is a perspective view showing the rear of the FPCB of the temperature sensor of the second embodiment of the present invention;
도6은 본 발명의 제3실시예의 온도센서의 FPCB의 상면을 나타내는 사시도;6 is a perspective view showing the top surface of the FPCB of the temperature sensor of the third embodiment of the present invention;
도7은 본 발명의 제3실시예의 온도센서의 FPCB의 배면을 나타내는 사시도;Fig. 7 is a perspective view showing the rear surface of the FPCB of the temperature sensor according to the third embodiment of the present invention;
도8은 본 발명의 제3실시예의 온도센서의 단면을 나타내는 도면;Fig. 8 is a diagram showing a cross section of a temperature sensor according to a third embodiment of the present invention;
도9는 본 발명의 제4실시예의 온도센서의 FPCB 상면을 나타내는 사시도. 9 is a perspective view showing the upper surface of the FPCB of the temperature sensor of the fourth embodiment of the present invention.
이하에서는 도면을 참조하여 본 발명의 구체적인 실시예를 상세하게 설명한다. 다만, 본 발명의 사상은 제시되는 실시예에 제한되지 아니하고, 본 발명의 사상을 이해하는 당업자는 동일한 사상의 범위 내에서 다른 구성요소를 추가, 변경, 삭제 등을 통하여, 퇴보적인 다른 발명이나 본 발명 사상의 범위 내에 포함되는 다른 실시예를 용이하게 제안할 수 있을 것이나, 이 또한 본원 발명 사상 범위 내에 포함된다고 할 것이다. Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. However, the spirit of the present invention is not limited to the presented embodiments, and those skilled in the art who understand the spirit of the present invention can add, change, or delete other elements within the scope of the same idea. Other embodiments included within the scope of the inventive concept may be easily proposed, but this will also be said to be included within the scope of the inventive concept.
도1은 본 발명의 제1실시예의 온도센서의 일부 구성이 분해된 사시도이고, 도2는 본 발명의 제1실시예의 온도센서의 FPCB 부분의 사시도이고, 도3은 본 발명의 제1실시예의 온도센서의 배면을 나타내는 도면이고, 도4는 본 발명의 제1실시예의 온도센서의 단면을 나타내는 도면이다. 1 is an exploded perspective view of a part of the temperature sensor of the first embodiment of the present invention, Figure 2 is a perspective view of the FPCB portion of the temperature sensor of the first embodiment of the present invention, and Figure 3 is a first embodiment of the present invention. It is a view showing the rear surface of the temperature sensor, and FIG. 4 is a view showing a cross section of the temperature sensor of the first embodiment of the present invention.
도1 내지 도4을 참조하면, 본 발명의 일실시예의 온도센서(100)는 FPCB(110), 온도측정부(101), 연결회로(120), 보강부(130)를 포함한다. 1 to 4, the temperature sensor 100 according to an embodiment of the present invention includes an FPCB 110, a temperature measuring unit 101, a connection circuit 120, and a reinforcing unit 130.
FPCB(110)는 휘어질 수 있는 다양한 연성소재로 이루어질 수 있다. 길이방향으로 길게 형성되고, 일단에는 온도측정부(101)가 실장되고, 타단에는 온도측정부(101)의 신호를 전달하기 위한 와이어(2)가 결합된다. The FPCB 110 may be made of various flexible materials that can be bent. It is formed long in the longitudinal direction, a temperature measuring unit 101 is mounted at one end, and a wire 2 for transmitting a signal from the temperature measuring unit 101 is coupled to the other end.
FPCB(110)의 타단은 2개로 분지되도록 형성된다. 따라서 2개의 와이어(2)가 2개의 연결회로(120)와 각각 솔더링되는 경우 양자가 단락(short)되거나, 솔더 내의 플럭스(flux)가 전기적으로 통전되어 전기적 특성값 오류를 일으키는 것을 방지할 수 있다. The other end of the FPCB 110 is formed to be branched into two. Therefore, when the two wires 2 are respectively soldered to the two connection circuits 120, both are shorted or the flux in the solder is electrically energized, thereby preventing an electrical characteristic value error. .
온도측정부(101)는 배터리 또는 배터리가 노출되는 환경의 온도를 측정한다. 온도측정을 위한 다양한 종류의 센서가 적용될 수 있을 것이며, 본 실시예에서는 온 서미스터칩(Thermistor chip)이 사용되고, 열적 신호를 전기적 신호로 바꾸어 전달하기 위한 2개의 연결회로(120)와 전기적으로 연결된다. The temperature measuring unit 101 measures the temperature of a battery or an environment to which the battery is exposed. Various types of sensors for temperature measurement may be applied, and in this embodiment, an on thermistor chip is used, and it is electrically connected to two connection circuits 120 for converting and transmitting a thermal signal into an electrical signal. .
연결회로(120)는 다양한 방식으로 FPCB(110)의 일면에 인쇄될 수 있을 것이다. 그리고 본 실시예에서는 2개 연결회로(120)가 나란히 인쇄되어 온도측정부(101)의 신호를 2개의 와이어(2)로 전달한다. The connection circuit 120 may be printed on one side of the FPCB 110 in various ways. In this embodiment, the two connection circuits 120 are printed side by side to transmit the signal of the temperature measuring unit 101 to the two wires 2.
한편, 본 실시예에서는 연결회로(120)는 온도측정부(101)가 실장되는 FPCB의 상면에 인쇄된다. 따라서 온도측정부(101)는 연결회로(120)의 일단 상부에 실장되고, 2개의 와이어(2)는 연결회로(120)의 타단 상부에 솔더링에 의하여 결합된다. Meanwhile, in this embodiment, the connection circuit 120 is printed on the upper surface of the FPCB on which the temperature measuring unit 101 is mounted. Accordingly, the temperature measuring unit 101 is mounted on one end of the connection circuit 120 and the two wires 2 are coupled to the other end of the connection circuit 120 by soldering.
보강부(130)는 FPCB(120)에 구비되어 FPCB(120)에 일정 강성을 제공한다. 도면에 도시된 것과 같이 FPCB(120)의 경우 길이 방향으로 길게 형성되고, 유연한 소재로 형성되므로, 차량의 배터리에 사용되는 경우 운행과정 등에서 발생하는 외부 진동에 따라 지속적으로 변형을 하게 된다. 이 경우 FPCB(110), 연결회로(120), 온도측정부(101), 와이어(2) 등 서로 결합을 하고 있는 부분에 많은 변형이 발생하여 결국 내구성이 떨어진다는 문제가 있다. 따라서 본 발명에서는 FPCB(110)에 보강부(130)을 구비하여, FPCB의 보강부(130)와 접촉을 하고 있는 부분의 변형을 제한하게 된다. The reinforcing part 130 is provided in the FPCB 120 to provide a certain rigidity to the FPCB 120. As shown in the drawing, since the FPCB 120 is formed long in the longitudinal direction and made of a flexible material, when used for a battery of a vehicle, it is continuously deformed according to external vibrations generated during a driving process. In this case, there is a problem in that a lot of deformation occurs in parts that are coupled to each other, such as the FPCB 110, the connection circuit 120, the temperature measuring unit 101, and the wire 2, resulting in poor durability. Accordingly, in the present invention, the FPCB 110 is provided with the reinforcing portion 130 to limit the deformation of the portion in contact with the reinforcing portion 130 of the FPCB.
보강부(130)는 FPCB(120)보다 강성이 큰 다양한 소재가 사용될 수 있고, 다양한 접착방식이 채택될 수 있을 것이다. 본 실시예에서의 보강부(130)는 연결회로(120)와 FPCB(110) 일면에 인쇄되는 보강회로(130) 형태로 구비될 수 있을 것이다. The reinforcing part 130 may be made of various materials having greater rigidity than the FPCB 120, and various bonding methods may be adopted. The reinforcing part 130 in this embodiment may be provided in the form of a reinforcing circuit 130 printed on one side of the connection circuit 120 and the FPCB 110.
즉, 일반적으로 FPCB에 회로를 인쇄하는 방법이 적용되나, 이는 전기적인 연결을 위한 것이 아니고, 인쇄되는 소재(예를 들어 구리)의 강성을 이용하기 위한 용도로 인쇄가 될 것이다. That is, in general, a method of printing a circuit on an FPCB is applied, but this is not for electrical connection, but will be printed for use in utilizing the rigidity of the printed material (eg, copper).
그리고 상기 설명한 연결회로(120)와 동일한 면에 인쇄가 되는 경우 연결회로(120) 및 보강회로(130)가 하나의 공정으로 인쇄가 가능할 것이다. In addition, when printing is performed on the same surface as the connection circuit 120 described above, the connection circuit 120 and the reinforcement circuit 130 may be printed in one process.
본 실시예에서는 보강회로(130)는 도3에 도시된 것과 같이 FPCB(110)의 배면에 FPCB(120)의 길이방향을 따라 길게 인쇄가 될 것이다. 따라서 별도의 소재를 FPCB(120)에 부착을 할 수 있는 크기로 재단을 하고, 접착을 하는 등의 과정 없이 회로를 인쇄하는 공정으로 간편하게 FPCB(120)에 일정 강성을 제공할 수 있다. In this embodiment, the reinforcement circuit 130 will be printed on the rear surface of the FPCB 110 along the lengthwise direction of the FPCB 120 as shown in FIG. 3. Therefore, by cutting a separate material into a size that can be attached to the FPCB 120 and printing a circuit without a process such as bonding, a certain rigidity can be provided to the FPCB 120 simply.
그리고 차량의 배터리에 적용이 되는 경우 지속적으로 진동이 인가되므로 접착제 등으로 부착을 하는 것보다 보다 견고한 결합상태를 유지할 수 있다. In addition, when applied to the battery of a vehicle, since vibration is continuously applied, it is possible to maintain a more rigid bonded state than attaching with an adhesive or the like.
즉 본 실시예에서는 일반적으로 많이 사용되는 회로를 인쇄하는 공정을 통하여 FPCB(110)의 상면에는 온도측정부(101)의 신호를 배터리 모니터링 시스템으로 전달하기 위한 연결회로(120)를 인쇄하고, FPCB(110)의 배면에는 FPCB(110)에 일정 강성을 확보하기 위한 보강회로(130)을 인쇄하는 방식의 간단한 공정을 통하여 FPCB(110)에 일정 강성을 제공하게 된다. That is, in this embodiment, a connection circuit 120 for transmitting a signal from the temperature measuring unit 101 to the battery monitoring system is printed on the upper surface of the FPCB 110 through a process of printing a commonly used circuit, and the FPCB A certain stiffness is provided to the FPCB 110 through a simple process of printing a reinforcement circuit 130 for securing a certain stiffness to the FPCB 110 on the rear surface of (110).
한편, 본 실시예의 온도센서(100)는 연결단자(1), 와이어(2), 와이어보호부(3), 솔더보호부(4)를 더 포함한다. On the other hand, the temperature sensor 100 of the present embodiment further includes a connection terminal (1), a wire (2), a wire protection unit (3), a solder protection unit (4).
연결단자(2)는 배터리의 전압, 온도, 전류 등을 실시간으로 모니터링 하는 배터리 모니터링 시스템(BMS: Battery Monitoring System)에 연결되어 후술하는 온도측정부(101)에서 측정된 신호를 배터리 모니터링 시스템으로 전달한다. The connection terminal 2 is connected to a battery monitoring system (BMS) that monitors the voltage, temperature, and current of the battery in real time, and transmits the signal measured by the temperature measuring unit 101 to be described later to the battery monitoring system. do.
와이어(3)는 온도측정부(101)에서 측정된 신호를 전달하는 통로 역할을 하고, 본 실시예에서는 2개의 와이어(3)가 벌어지지 않도록 보호하는 와이어보호부(3)가 구비될 수 있다. The wire 3 serves as a path through which the signal measured by the temperature measuring unit 101 is transmitted, and in this embodiment, a wire protection unit 3 may be provided to protect the two wires 3 from spreading. .
그리고 솔더보호부(4)는 연결회로(120)와 와이어(2)에 솔더링된 솔더(5)를 외부환경으로부터 보호하는 기능을 수행한다. In addition, the solder protection unit 4 functions to protect the connection circuit 120 and the solder 5 soldered to the wire 2 from an external environment.
본 실시예의 온도센서(100)는 온도측정부(101)를 외부 충격으로부터 보호하기 위한 보호부재(102) 및 보호커버(103)을 포함한다. 보호부재(102)는 FPCB(110)의 길이방향을 기준으로 온도측정부(101)의 전방 및 후방에 2개가 구비된다. 그리고 보호커버(103)는 FPCB(110)와 같거나 작은 폭으로 형성된다. 그리고 일단이 온도측정부(101) 전방에 위치하는 보호부재(102)의 전방에 결합되고, 2개의 보호부재(102) 및 온도측정부(101)의 상부를 커버하도록 구비되며, 타단은 후단에 배치되는 보호부재(102)에 결합된다. 즉 온도측정부(101)의 온도측정을 위하여 보호커버(103)의 좌, 우 양측은 개방된 상태가 되도록 형성될 것이다. The temperature sensor 100 of this embodiment includes a protective member 102 and a protective cover 103 for protecting the temperature measuring unit 101 from external impact. Two protective members 102 are provided at the front and rear of the temperature measuring unit 101 based on the longitudinal direction of the FPCB 110. And the protective cover 103 is formed with a width equal to or smaller than that of the FPCB 110. And one end is coupled to the front of the protection member 102 located in front of the temperature measurement unit 101, and is provided to cover the upper portion of the two protection members 102 and the temperature measurement unit 101, the other end at the rear end. It is coupled to the protective member 102 to be disposed. That is, both left and right sides of the protective cover 103 will be formed in an open state in order to measure the temperature of the temperature measuring unit 101.
도5는 본 발명의 제2실시예의 온도센서의 FPCB 배면을 나타내는 사시도이다. 5 is a perspective view showing the rear surface of the FPCB of the temperature sensor of the second embodiment of the present invention.
본 실시예에에서는 상기 제1실시예와 달리 FPCB(210)의 길이방향을 따라 보강회로(230)가 일정 거리 이격되어 배치된다. 따라서 보강회로(230)가 형성되지 않는 지점은 형성된 지점에 비하여 상대적으로 절곡이 용이하게 된다. In the present embodiment, unlike the first embodiment, the reinforcing circuits 230 are disposed at a predetermined distance along the longitudinal direction of the FPCB 210. Therefore, the point where the reinforcing circuit 230 is not formed is relatively easily bent compared to the point where the reinforcing circuit 230 is formed.
따라서 실제 적용이 될 배터리팩의 내부 설계 등을 고려하여 절곡이 되어야 하는 부분이 아닌 부분에만 보강회로(230)을 구비한다. 따라서 설치 구조적에 따라 절곡이 되어 배치되어야 하는 부분의 절곡이 용이하도록 구성할 수 있다. Therefore, the reinforcing circuit 230 is provided only in a portion that is not a portion that should be bent in consideration of the internal design of the battery pack to be actually applied. Therefore, it can be configured to facilitate bending of a portion to be bent and arranged according to the installation structure.
나아가 복수 개의 지점이 절곡이 되어야 하는 경우 복수 개의 보강부를 접착제 등으로 고정하는 것이 아니라 1회의 인쇄공정으로 구현하므로 복수 개의 보강회로(230)의 배치 형상이 복잡하더라도 용이하게 구현이 가능할 것이다. Furthermore, when a plurality of points are to be bent, a plurality of reinforcing parts are not fixed with an adhesive, but are implemented in a single printing process, so even if the arrangement shape of the plurality of reinforcing circuits 230 is complicated, it will be possible to easily implement them.
본 실시예의 온도센서의 다른 구성 등은 상기 설명한 제1실시예와 동일하므로 이하 설명을 생략한다. Other configurations of the temperature sensor of the present embodiment are the same as those of the first embodiment described above, and thus a description thereof will be omitted.
도6은 본 발명의 제3실시예의 온도센서의 FPCB의 상면을 나타내는 사시도이고, 도7은 본 발명의 제3실시예의 온도센서의 FPCB의 배면을 나타내는 사시도이며, 도8은 본 발명의 제4실시예의 온도센서의 단면을 나타내는 사시도이다. Fig. 6 is a perspective view showing the top of the FPCB of the temperature sensor of the third embodiment of the present invention, Fig. 7 is a perspective view showing the rear of the FPCB of the temperature sensor of the third embodiment of the present invention, and Fig. 8 is a fourth of the present invention. It is a perspective view showing a cross section of the temperature sensor of the embodiment.
도 6 내지 도8을 참조하면, 본 실시예에서는 연결회로(320)가 FPCB(310)의 배면에 구비되고(도7 참조), 보강회로(330)가 FPCB(310)의 상면에 배치된다. 6 to 8, in this embodiment, the connection circuit 320 is provided on the rear surface of the FPCB 310 (see FIG. 7 ), and the reinforcement circuit 330 is disposed on the upper surface of the FPCB 310.
한편, 본 실시예에서 역시 상기 실시예들과 마찬가지로 온도조절부(101)는 FPCB(310)의 상면에 실장되고, 와이어(2) 역시 FPCB(310)의 상면에 솔더(5)의 의하여 결합된다. Meanwhile, in this embodiment, the temperature control unit 101 is mounted on the upper surface of the FPCB 310 as in the above embodiments, and the wire 2 is also coupled to the upper surface of the FPCB 310 by solder 5. .
따라서 본 실시예에서의 FPCB(310)에는 FPCB(310) 하면에 인쇄되는 연결회로(320)와 FPCB(310) 상면에 실장되는 온도조절부(101)를 전기적으로 연결하기 위한 제1비아홀(310a) 및 상면에 배치되는 와이어(2)와 연결회로(320)를 전기적으로 연결하기 위한 제2비아홀(310b)이 형성된다. Therefore, in the FPCB 310 in this embodiment, the first via hole 310a for electrically connecting the connection circuit 320 printed on the lower surface of the FPCB 310 and the temperature controller 101 mounted on the upper surface of the FPCB 310 ) And a second via hole 310b for electrically connecting the wire 2 disposed on the upper surface and the connection circuit 320 are formed.
그리고 제1비아홀(310a) 및 제2비아홀(310b)가 형성된 FPCB(310)의 상면에는 온도조절부(101) 및 와이어(2)와 접촉면적을 고려한 연결패드(321)이 형성될 수 있을 것이다. In addition, a connection pad 321 in consideration of the contact area with the temperature control unit 101 and the wire 2 may be formed on the upper surface of the FPCB 310 in which the first via hole 310a and the second via hole 310b are formed. .
그리고 연결패드(321)는 FPCB(310)의 상면에 인쇄되는 보강회로(330)와 같이 인쇄가 될 수 있을 것이다. In addition, the connection pad 321 may be printed like the reinforcement circuit 330 printed on the upper surface of the FPCB 310.
한편, 상기 제1실시예에서와 같이 연결회로(120)의 상면에 와이어(2)가 위치하고, 그 위를 솔더로 솔더링하는 경우 FPCB(110), 연결회로(120), 와이어(2), 솔더(5)의 강성의 차이로 인하여 FPCB(110)가 반복적으로 휘는 경우 솔더(5)와 연결회로(120)의 접촉 둘레부에 크랙이 발생하거나, 단락이 되어 온도측정부(101)의 신호가 정확하게 전달이 안되는 경우가 있다. On the other hand, as in the first embodiment, when the wire 2 is located on the upper surface of the connection circuit 120 and soldering the upper surface thereof with solder, the FPCB 110, the connection circuit 120, the wire 2, and the solder If the FPCB 110 is repeatedly bent due to the difference in the stiffness of (5), a crack occurs in the peripheral portion of the contact between the solder 5 and the connection circuit 120, or a short circuit causes the signal from the temperature measuring unit 101 to be There are cases where it cannot be accurately delivered.
이에 따라 본 실시예에서는 연결회로(320)를 FPCB(310)의 배면에 구비하고, 제2비아홀(310b)를 통하여 와이어(2)와 전기적으로 연결을 한다. Accordingly, in the present embodiment, the connection circuit 320 is provided on the rear surface of the FPCB 310 and is electrically connected to the wire 2 through the second via hole 310b.
따라서 상기 제1실시예와 비교하였을 때, 솔더(5)와 FPCB(310)의 접촉 둘레부에 크랙이 발생을 한다고 하더라도 와이어(2)는 FPCB(310) 배면의 연결회로(320)과 제2비아홀(312b)를 통하여 전기적으로 연결된 상태를 유지하기 때문에 외부 진동 등에 대하여 보다 안정적으로 신호의 전달이 가능하다는 장점이 있다. Therefore, when compared to the first embodiment, even if a crack occurs in the peripheral portion of the contact between the solder 5 and the FPCB 310, the wire 2 is connected to the connection circuit 320 on the rear of the FPCB 310 and the second Since the state of being electrically connected through the via hole 312b is maintained, there is an advantage in that a signal can be transmitted more stably against external vibrations.
도9는 본 발명의 제4실시예의 온도센서의 FPCB 상면을 나타내는 사시도이다. 9 is a perspective view showing the upper surface of the FPCB of the temperature sensor of the fourth embodiment of the present invention.
본 실시예에서는 상기 제2실시예와 같이 보강회로(430)가 길이방향을 따라 일정 거리 이격되어 배치된다. 따라서 보강회로(430)가 형성되지 않는 지점은 형성된 지점에 비하여 상대적으로 절곡이 용이하게 된다. In this embodiment, as in the second embodiment, the reinforcing circuits 430 are disposed to be spaced apart a predetermined distance along the length direction. Accordingly, the point where the reinforcing circuit 430 is not formed is relatively easily bent compared to the point where the reinforcing circuit 430 is formed.
따라서 실제 적용이 될 배터리팩의 내부 설계 등을 고려하여 절곡이 되어야 하는 부분이 아닌 부분에 보강회로(230)을 구비하다. 따라서 설치 구조적에 따라 절곡이 되어 배치되어야 하는 부분의 절곡이 용이하도록 구성할 수 있다. Therefore, in consideration of the internal design of the battery pack to be actually applied, the reinforcing circuit 230 is provided in a portion that is not a portion that should be bent. Therefore, it can be configured to facilitate bending of a portion to be bent and arranged according to the installation structure.
나아가 복수 개의 지점이 절곡이 되어야 하는 경우 복수 개의 보강부를 접착제 등으로 고정하는 것이 아니라 1회의 인쇄공정으로 구현하므로 복수 개의 보강회로(430)의 배치 형상이 복잡하더라도 용이하게 구현이 가능할 것이다.Furthermore, when a plurality of points should be bent, a plurality of reinforcing parts are not fixed with an adhesive or the like, but are implemented in a single printing process, so even if the arrangement shape of the plurality of reinforcing circuits 430 is complicated, it will be possible to easily implement them.
상기에서는 본 발명에 따른 실시예를 기준으로 본 발명의 구성과 특징을 설명하였으나 본 발명은 이에 한정되지 않으며, 본 발명의 사상과 범위 내에서 다양하게 변경 또는 변형할 수 있음은 본 발명이 속하는 기술분야의 당업자에게 명백한 것이며, 따라서 이와 같은 변경 또는 변형은 첨부된 특허청구범위에 속함을 밝혀둔다.In the above, the configuration and features of the present invention have been described based on the embodiments according to the present invention, but the present invention is not limited thereto, and it is understood that various changes or modifications can be made within the spirit and scope of the present invention. It will be apparent to those skilled in the art, and therefore, such changes or modifications should be found to fall within the scope of the appended claims.

Claims (12)

  1. FPCB;FPCB;
    FPCB의 상면에 배치되는 온도측정부;A temperature measuring unit disposed on the upper surface of the FPCB;
    상기 상기 온도측정부에서 측정된 신호를 전달하기 위하여 상기 FPCB의 일면에 인쇄되는 연결회로; 및A connection circuit printed on one surface of the FPCB to transmit the signal measured by the temperature measuring unit; And
    상기 FPCB에 배치되어 FPCB에 일정 강성을 인가하기 위한 보강부를 포함하는 온도센서. A temperature sensor disposed on the FPCB and including a reinforcing part for applying a certain rigidity to the FPCB.
  2. 제1항에 있어서,The method of claim 1,
    상기 FPCB의 길이방향을 기준으로 온도측정부의 전방 및 후방 중 적어도 하나에 구비되어 상기 온도측정부를 보고하기 위한 보호부재를 더 포함하는 온도센서.A temperature sensor further comprising a protection member provided in at least one of a front and a rear of the temperature measurement unit based on the longitudinal direction of the FPCB to report the temperature measurement unit.
  3. 제1항에 있어서,The method of claim 1,
    상기 온도측정부재의 양 측면을 개방한 상태를 유지하면서 상부를 덮도록 상기 FPCB에 구비되는 보호커버를 더 포함하는 온도센서.Temperature sensor further comprising a protective cover provided on the FPCB so as to cover an upper portion while keeping both sides of the temperature measuring member open.
  4. 제1항에 있어서,The method of claim 1,
    상기 연결회로는 복수 개가 구비되고,The connection circuit is provided with a plurality,
    상기 FPCB의 타단은 상기 연결회로의 개수에 따라 분지 형성되는 온도센서.The other end of the FPCB is a temperature sensor that is branched according to the number of the connection circuits.
  5. 제4항에 있어서,The method of claim 4,
    상기 온도센서는 상기 연결회로의 개수에 대응되는 와이어를 더 포함하고,The temperature sensor further comprises a wire corresponding to the number of the connection circuit,
    상기 복수개의 와이어를 고정 및 보호하기 위한 와이어보호부를 더 포함하는 온도센서. Temperature sensor further comprising a wire protection unit for fixing and protecting the plurality of wires.
  6. 제1항에 있어서,The method of claim 1,
    상기 온도센서는 상기 온도측정부의 신호를 전달하기 위한 와이어를 포함하고,The temperature sensor includes a wire for transmitting a signal of the temperature measuring unit,
    상기 와이어의 일단은 상기 연결회로와 솔더링되며, One end of the wire is soldered with the connection circuit,
    상기 솔더링된 솔더를 보호하기 위한 솔더보호부를 더 포함하는 온도센서.Temperature sensor further comprising a solder protection unit for protecting the soldered solder.
  7. 제1항에 있어서,The method of claim 1,
    상기 보강부는 상기 FPCB의 타면에 인쇄되어 상기 FPCB에 일정 강성을 인가하는 보강회로인 온도센서.The reinforcing part is a temperature sensor that is a reinforcing circuit printed on the other surface of the FPCB to apply a certain rigidity to the FPCB.
  8. 제7항에 있어서,The method of claim 7,
    상기 연결회로는 상기 FPCB의 상면에 형성되고, The connection circuit is formed on the upper surface of the FPCB,
    상기 보강회로는 상기 FPCB의 하면에 형성되는 온도센서.The reinforcing circuit is a temperature sensor formed on a lower surface of the FPCB.
  9. 제7항에 있어서,The method of claim 7,
    상기 연결회로는 상기 FPCB의 하면에 형성되고, The connection circuit is formed on the lower surface of the FPCB,
    상기 FPCB에는 상기 연결회로 및 상기 온도측정부을 연결하는 제1비아홀이 형성되는 온도센서.A temperature sensor in which a first via hole connecting the connection circuit and the temperature measuring unit is formed in the FPCB.
  10. 제9항에 있어서,The method of claim 9,
    상기 온도센서는 상기 온도측정부의 신호를 전달하기 위한 와이어를 더 포함하고, The temperature sensor further comprises a wire for transmitting a signal of the temperature measuring unit,
    상기 와이어는 상기 FPCB의 상면에 결합되고,The wire is coupled to the upper surface of the FPCB,
    상기 FPCB에는 상기 연결회로와 상기 와이어를 연결하는 제2비아홀이 형성되는 온도센서.A temperature sensor in which a second via hole connecting the connection circuit and the wire is formed in the FPCB.
  11. 제7항에 있어서,The method of claim 7,
    상기 보강회로는 상기 FPCB의 길이방향을 따라 복수 개가 이격되어 구비되는 온도센서. The temperature sensor is provided with a plurality of the reinforcing circuit is spaced apart along the longitudinal direction of the FPCB.
  12. 제1항 내지 제11항 중 어느 한 항에 있어서,The method according to any one of claims 1 to 11,
    상기 온도센서를 포함하는 전지모듈.A battery module comprising the temperature sensor.
PCT/KR2019/014949 2019-11-06 2019-11-06 Temperature sensor for battery module, and battery module including same WO2021090974A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060070869A (en) * 2004-12-21 2006-06-26 삼성전자주식회사 Semiconductor chip package employing reinforcement pattern, and liquid crystal display thereof
KR20090062078A (en) * 2007-12-12 2009-06-17 엘지디스플레이 주식회사 Flexible printed circuits board comprising a supporting layer and oled
KR20170116634A (en) * 2016-04-11 2017-10-20 희성전자 주식회사 Battery module
KR101872833B1 (en) * 2016-12-30 2018-06-29 주식회사 유라코퍼레이션 Temperature sensor fixing structure of battery cell module
JP2019036616A (en) * 2017-08-14 2019-03-07 住友電気工業株式会社 Flexible printed wiring board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060070869A (en) * 2004-12-21 2006-06-26 삼성전자주식회사 Semiconductor chip package employing reinforcement pattern, and liquid crystal display thereof
KR20090062078A (en) * 2007-12-12 2009-06-17 엘지디스플레이 주식회사 Flexible printed circuits board comprising a supporting layer and oled
KR20170116634A (en) * 2016-04-11 2017-10-20 희성전자 주식회사 Battery module
KR101872833B1 (en) * 2016-12-30 2018-06-29 주식회사 유라코퍼레이션 Temperature sensor fixing structure of battery cell module
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