WO2021085224A1 - Composition de résine et connecteur plan - Google Patents

Composition de résine et connecteur plan Download PDF

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Publication number
WO2021085224A1
WO2021085224A1 PCT/JP2020/039318 JP2020039318W WO2021085224A1 WO 2021085224 A1 WO2021085224 A1 WO 2021085224A1 JP 2020039318 W JP2020039318 W JP 2020039318W WO 2021085224 A1 WO2021085224 A1 WO 2021085224A1
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resin composition
content
mol
mass
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PCT/JP2020/039318
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English (en)
Japanese (ja)
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博樹 深津
昭宏 長永
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ポリプラスチックス株式会社
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Priority to CN202080075123.5A priority Critical patent/CN114616283B/zh
Priority to JP2021518021A priority patent/JP6944616B1/ja
Publication of WO2021085224A1 publication Critical patent/WO2021085224A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases

Definitions

  • the present invention relates to a resin composition and a planar connector.
  • Liquid crystal polymers such as all-aromatic polyester are thermoplastic resins with excellent dimensional accuracy and fluidity. Due to these characteristics, liquid crystal polymers have been adopted as materials for various electronic components.
  • Patent Document 1 states that it is molded from a resin composition containing a predetermined liquid crystal polymer, glass fiber and plate-like filler, and is excellent in flatness, weld strength and crack resistance. A resin composition for obtaining a planar connector is disclosed.
  • Sublimated products may be generated during the polymerization reaction of all aromatic polyesters. Such sublimated products may be precipitated and deposited on the inner wall of the polymerization vessel or the like, where polycondensation, deterioration, or carbonization may be mixed in the polymer as foreign matter. If foreign matter is mixed in the polymer, it may cause gate clogging during injection molding. Further, when the foreign matter is a carbide, it may cause poor continuity of the electronic component molded from the resin composition. Further, in an electronic component having a fine structure such as a planar connector having a lattice structure inside an outer frame represented by a CPU socket, foreign matter may be a starting point and cracks may occur.
  • An object of the present invention is to provide a resin composition capable of obtaining a flat connector having less foreign matter mixed in and excellent in flatness, weld strength and crack resistance, and a flat connector using the resin composition. And.
  • the present invention has the following aspects.
  • [1] Contains (A) total aromatic polyester, (B) fibrous filler, and (C) plate-like filler, and (A) total aromatic polyester is the following constituent unit as an essential component. It contains (I) to (IV), the content of the structural unit (I) is 40 to 75 mol%, and the content of the structural unit (II) is 0.5 to 7. It is 5 mol%, the content of the constituent unit (III) is 8.5 to 30 mol%, and the content of the constituent unit (IV) is 8.5 to 30 mol%, and the constituent unit ( The difference between the content of III) and the content of the structural unit (IV) is 0.150 mol% or less.
  • the content of (A) total aromatic polyester is 50 to 62.5% by mass with respect to the entire resin composition, and the content of (B) fibrous filler is 10 to 25% by mass with respect to the entire resin composition. %, The content of (C) plate-like filler is 25 to 40% by mass with respect to the entire resin composition, and the total amount of (B) fibrous filler and (C) plate-like filler is resin composition.
  • the total content of the structural units (I), (II), (III) and (IV) is 100 mol% with respect to all the structural units of (A) all aromatic polyesters, [1].
  • the resin composition according to. [3] The resin composition according to [1] or [2], wherein the (B) fibrous filler contains glass fibers.
  • the (C) plate-like filler contains one or more selected from the group consisting of talc and mica.
  • [7] Use of the resin composition according to any one of [1] to [5] for manufacturing a connector.
  • the resin composition according to any one of [1] to [5] is contained, and the outer frame portion and the lattice portion formed inside the outer frame portion have a lattice structure, and the pitch of the lattice portions in the lattice structure is A cubic connector that is 1.5 mm or less.
  • a resin composition capable of obtaining a flat connector having less foreign matter mixed in and excellent in flatness, weld strength and crack resistance, and a flat connector using the resin composition. be able to.
  • FIG. 1 It is a figure which shows the planar connector molded in an Example.
  • A is a plan view of a planar connector.
  • B is the details of part A in (a).
  • the unit of the numerical value in the figure is mm.
  • It is explanatory drawing which shows the shape of the mold used for evaluating the molding stability in an Example (a) is a plan view of the whole, (b) is a plan view which shows the dimension of a mold.
  • (C) is a side view showing the dimensions of the mold, and (d) is a side view showing the configuration of the mold.
  • the unit of the numerical value in the figure is mm.
  • "PL” represents a parting line.
  • “Tunnel gate” represents a tunnel type gate of a mold.
  • the resin composition contains (A) a total aromatic polyester, (B) a fibrous filler, and (C) a plate-like filler.
  • the total aromatic polyester contains the following structural units (I) to (IV) as essential constituents. Since the following constituent units (I) to (IV) are contained as essential constituents, it is necessary to provide a molded product having excellent heat resistance and mechanical strength (particularly mechanical strength in a high temperature environment) required for electronic parts. In addition, since the melting point can be lowered to a melting point that can be processed by a general-purpose melting processing device, excellent moldability can be realized even when molding an electronic component having a fine structure.
  • the structural unit (I) is derived from 6-hydroxy-2-naphthoic acid (hereinafter, also referred to as "HNA").
  • the total aromatic polyester contains 40 to 75 mol% of the structural unit (I) with respect to all the structural units. If the content of the structural unit (I) is less than 40 mol%, the melting point is excessively lowered and the heat resistance is insufficient. If the content of the structural unit (I) exceeds 75 mol%, solidification occurs during polymerization and a polymer cannot be obtained.
  • the content of the structural unit (I) is preferably 40 to 70 mol%, more preferably 40 to 65 mol%, and further preferably 40 to 63 mol%. , Even more preferably 40 to 62 mol%, and particularly preferably 40 to 60 mol%.
  • the structural unit (II) is derived from 4-hydroxybenzoic acid (hereinafter, also referred to as "HBA").
  • HBA 4-hydroxybenzoic acid
  • the total aromatic polyester contains 0.5 to 7.5 mol% of the structural unit (II) with respect to all the structural units. If the content of the structural unit (II) is less than 0.5 mol%, solidification occurs during polymerization of a molded product such as a planar connector, and the polymer cannot be discharged. If the content of the structural unit (II) exceeds 7.5 mol%, the melting point is excessively lowered and the heat resistance is insufficient.
  • the content of the structural unit (II) is preferably 0.5 to 7.0 mol%, more preferably 1.0 to 7.0 mol%, and further preferably 1.0 to 7.0 mol%.
  • the structural unit (III) is derived from 1,4-phenylenedicarboxylic acid (hereinafter, also referred to as "TA").
  • the total aromatic polyester contains 8.5 to 30 mol% of the structural unit (III) with respect to all the structural units.
  • the content of the structural unit (III) is less than 8.5 mol% or more than 30 mol%, at least one of lowering the melting point for lowering the melting point to a temperature that can be processed by a general-purpose melting processing machine and heat resistance It tends to be insufficient.
  • the content of the structural unit (III) is preferably 10 to 30 mol%, more preferably 12 to 28 mol%, and further preferably 14 to 28. It is in mol%, more preferably 15 to 28 mol%, and particularly preferably 17 to 27 mol%.
  • the structural unit (IV) is derived from 4,4'-dihydroxybiphenyl (hereinafter, also referred to as "BP").
  • the total aromatic polyester contains 8.5 to 30 mol% of structural units (IV) with respect to all structural units. If the content of the structural unit (IV) is less than 8.5 mol% or more than 30 mol%, at least one of low melting point and heat resistance tends to be insufficient. From the viewpoint of achieving both a low melting point and heat resistance, the content of the structural unit (IV) is preferably 10 to 30 mol%, more preferably 12 to 28 mol%, and further preferably 14 to 28 mol%. It is in mol%, more preferably 15 to 28 mol%, and particularly preferably 17 to 27 mol%.
  • the total content of the constituent units (I), (II), (III) and (IV) of the total aromatic polyester is preferably 95 mol% or more based on the total constituent units of the total aromatic polyester. ..
  • the total content of the structural units (I), (II), (III) and (IV) is more preferably 100 mol% with respect to all the structural units of the total aromatic polyester.
  • the difference between the content of the structural unit (III) and the content of the structural unit (IV) is 0.150 mol% or less.
  • the difference between the content of the structural unit (III) and the content of the structural unit (IV) is preferably 0.145 mol% or less, and more preferably 0.140 mol% or less. It is more preferably 0.135 mol% or less, further preferably 0.130 mol% or less, and particularly preferably 0.125 mol% or less.
  • the temperature during the polymerization reaction is set to 140 ° C. to 360 ° C. in order to reduce the difference between the content of the structural unit (III) and the content of the structural unit (IV) to 0.150 mol% or less.
  • the temperature can be raised in stages.
  • the temperature at the time of the polymerization reaction can be raised from 140 ° C. to 360 ° C. in two or more steps or three or more steps.
  • the temperature is raised by changing the heating rate (for example, increasing the heating rate stepwise) by dividing the temperature from 140 ° C to 200 ° C, from 200 ° C to 270 ° C, and from 270 ° C to 360 ° C. Can be done.
  • the rate of temperature rise from 140 ° C. to 200 ° C. can be 0.4 ° C./min or more and less than 0.8 ° C./min.
  • the rate of temperature rise from 200 ° C. to 270 ° C. can be set to 0.8 ° C./min or more and 1.2 ° C./min or less.
  • the rate of temperature rise from 270 ° C. to 360 ° C. can be set to 0.4 ° C./min or more and 1.2 ° C./min or less.
  • All aromatic polyesters exhibit optical anisotropy when melted. Exhibiting optical anisotropy when melted means that the total aromatic polyester is a liquid crystal polymer.
  • the fact that the total aromatic polyester is a liquid crystal polymer is an indispensable element for the total aromatic polyester to have both thermal stability and easy workability.
  • the total aromatic polyester composed of the constituent units (I) to (IV) may not form an anisotropic molten phase depending on the constituent components and the sequence distribution in the polymer, but it is used in the present embodiment. Polymers are limited to all-aromatic polyesters that exhibit optical anisotropy when melted.
  • melt anisotropy can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, the confirmation of melt anisotropy can be carried out by melting a sample placed on a hot stage manufactured by Rinkamu using a polarizing microscope manufactured by Olympus and observing it at a magnification of 150 times in a nitrogen atmosphere. Liquid crystalline polymers are optically anisotropic and transmit light when inserted between orthogonal polarizers. If the sample is optically anisotropic, polarized light is transmitted even in a molten static liquid state, for example.
  • the melting point is preferably as high as possible from the viewpoint of heat resistance, but it is preferably 380 ° C. or lower in consideration of thermal deterioration during melt processing of the polymer and the heating capacity of the molding machine. It is more preferably 260 to 370 ° C, even more preferably 270 to 370 ° C, and particularly preferably 280 to 360 ° C.
  • the melt viscosity of the total aromatic polyester at a temperature 10 to 40 ° C. higher than the melting point of the total aromatic polyester and at a shear rate of 1000 / sec is preferably 1000 Pa ⁇ s or less.
  • the melt viscosity of the total aromatic polyester is more preferably 4 to 500 Pa ⁇ s, even more preferably 4 to 250 Pa ⁇ s, and particularly preferably 5 to 100 Pa ⁇ s.
  • the melt viscosity means the melt viscosity measured in accordance with ISO11443.
  • the amount of sublimated material during melt polymerization can be measured from the mass change of the reflux column and the upper part of the reactor used in melt polymerization.
  • the total aromatic polyester preferably has a sublimated amount of 2.3% or less at the time of melt polymerization. When the amount of sublimated material at the time of melt polymerization is 2.3% or less, the amount of foreign matter mixed in the polymer can be further reduced.
  • the amount of sublimated material during melt polymerization is more preferably 2.0% or less, still more preferably 1.9% or less.
  • the total aromatic polyester used in the present embodiment is polymerized by a direct polymerization method, a transesterification method, or the like.
  • a melt polymerization method, a solution polymerization method, a slurry polymerization method, a solid phase polymerization method, etc., or a combination of two or more of these is used, and a melt polymerization method or a combination of the melt polymerization method and the solid phase polymerization method is used.
  • the conditions for the polymerization reaction are not particularly limited as long as the polymerization of the above-mentioned structural units proceeds, and for example, the reaction temperature is 200 to 380 ° C.
  • the temperature at the time of the polymerization reaction can be raised stepwise from 140 ° C. to 360 ° C. (divided into two or more steps or three or more steps). By gradually raising the temperature at the time of the polymerization reaction from 140 ° C. to 360 ° C., the content of the structural unit (III) and the content of the structural unit (IV) in the obtained total aromatic polyester The difference can easily be 0.150 mol% or less.
  • the temperature can be raised by changing the heating rate by dividing the temperature from 140 ° C. to 200 ° C., from 200 ° C.
  • the rate of temperature rise from 140 ° C. to 200 ° C. can be 0.4 ° C./min or more and less than 0.8 ° C./min.
  • the rate of temperature rise from 200 ° C. to 270 ° C. can be set to 0.8 ° C./min or more and 1.2 ° C./min or less.
  • the rate of temperature rise from 270 ° C. to 360 ° C. can be set to 0.4 ° C./min or more and 1.2 ° C./min or less.
  • the amount of 1,4-phenylenedicarboxylic acid used (mol%) and the amount of 4,4'-dihydroxybiphenyl used (mol%) are determined from the viewpoint of increasing the molecular weight. It is preferable that they are equal. It should be noted that the generation of sublimated products during the production of the total aromatic polyester of the present embodiment causes a difference in their contents.
  • an acylating agent for the polymerized monomer or a monomer having an activated terminal can be used as an acid chloride derivative.
  • the acylating agent include fatty acid anhydrides such as acetic anhydride.
  • catalysts can be used for these polymerizations, and typical ones are potassium acetate, magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, antimony trioxide, and tris (2).
  • 4-Pentandionato) Examples include metal salt-based catalysts such as cobalt (III) and organic compound-based catalysts such as 1-methylimidazole and 4-dimethylaminopyridine.
  • melt polymerization is carried out by starting depressurization to a predetermined decompression degree.
  • an inert gas is introduced, and the pressure is changed from a reduced pressure state to a normal pressure state to a predetermined pressure state, and the total aromatic polyester is discharged from the reaction system.
  • the total aromatic polyester produced by the above polymerization method can be further increased in molecular weight by solid-phase polymerization of normal pressure, reduced pressure, or heating in an inert gas.
  • the content of the total aromatic polyester is 50 to 62.5% by mass in the total resin composition.
  • the content of the total aromatic polyester in the resin composition is preferably 50 to 60% by mass, more preferably 52.5 to 60% by mass, from the viewpoint of heat resistance, high rigidity and high fluidity. Particularly preferably, it is 54.3 to 59.7% by mass.
  • the resin composition contains a fibrous filler.
  • the fibrous filler is not particularly limited, and examples thereof include glass fiber, carbon fiber, asbestos fiber, silica fiber, silica / alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, potassium titanate fiber and the like. Be done.
  • the fibrous filler is preferably glass fiber because the heat resistance, weld strength and crack resistance of a molded product such as a flat connector obtained from the resin composition can be easily improved.
  • the weight average fiber length of the fibrous filler is 200 to 500 ⁇ m.
  • the weight average fiber length of the fibrous filler is preferably 300 to 500 ⁇ m, more preferably 350 to 480 ⁇ m, and even more preferably 400 to 480 ⁇ m.
  • the weight average fiber length of the fibrous filler refers to the fibrous filler of the incinerated residue obtained by heating the resin composition at 600 ° C. for 2 hours to incinerate it to obtain an incinerated residue.
  • Stereomicroscopic images of 100 images are taken from a CCD camera into a PC and measured by an image measuring machine by an image processing method. This is repeated 10 times, and refers to the average value of the measured values when the number of fibrous fillers reaches about 1000.
  • the fiber diameter of the fibrous filler is not particularly limited, and generally about 5 to 15 ⁇ m is used.
  • the fibrous filler can be used alone or in combination of two or more.
  • the fiber diameter is the average value of the measured fiber diameters of 100 fibrous fillers obtained by observing the fibrous filler with a scanning electron microscope.
  • the content of the fibrous filler is 10 to 25% by mass with respect to the entire resin composition.
  • the content of the fibrous filler is less than 10% by mass with respect to the entire resin composition, the weld strength of the molded product obtained from the resin composition is low, and the molded product is a flat connector or the like. , Cracks are likely to occur in the lattice part and the like.
  • the content of the fibrous filler is more than 25% by mass with respect to the entire resin composition, the fluidity of the composition is deteriorated, and the obtained molded product is inferior in flatness and may have distortion.
  • the content of the fibrous filler is preferably 10 to 23% by mass, more preferably 10 to 22% by mass, and further preferably 10 to 20% by mass with respect to the entire resin composition.
  • the resin composition contains a plate-like filler.
  • a plate-like inorganic filler in the resin composition together with the above-mentioned fibrous filler, a molded product having excellent flatness, crack resistance and weld strength can be molded without deteriorating the fluidity of the resin composition.
  • a resin composition that can be obtained is obtained.
  • the plate-like filler include talc, mica, glass flakes, and various metal foils. It is preferable to include one or more selected from talc and mica in terms of suppressing warpage deformation of the molded product obtained from the resin composition without deteriorating the fluidity of the resin composition, and it is preferable to include talc. More preferred.
  • the average particle size of the plate-shaped filler is not particularly limited, and a smaller one is desirable in consideration of the fluidity in the thin-walled portion. On the other hand, in order to reduce the warp deformation of a molded product such as a connector obtained from the resin composition, it is necessary to maintain a certain size. Specifically, 1 to 100 ⁇ m is preferable, and 5 to 50 ⁇ m is more preferable.
  • the average particle size means a volume-based cumulative average particle size (D50) measured by a laser diffraction method.
  • the plate-shaped filler can be used alone or in combination of two or more.
  • talc As for talc, the total content of Fe 2 O 3 , Al 2 O 3 and Ca O is 2.5% by mass or less with respect to the total solid content of the talc, and the total of Fe 2 O 3 and Al 2 O 3 It is preferable that the content is more than 1.0% by mass and 2.0% by mass or less, and the CaO content is less than 0.5% by mass. That is, talc contains at least one of Fe 2 O 3 , Al 2 O 3 and Ca O in addition to SiO 2 and MgO, which are the main components thereof, and each component is contained in the above content range. There may be.
  • the total content of Fe 2 O 3 , Al 2 O 3 and CaO in the above talc is 2.5% by mass or less, the molding processability of the resin composition and the molding of a connector or the like molded from the resin composition are formed. The heat resistance of the product does not deteriorate easily.
  • the total content of Fe 2 O 3 , Al 2 O 3 and CaO is preferably 1.0% by mass or more and 2.0% by mass or less.
  • talc having a total content of Fe 2 O 3 and Al 2 O 3 of more than 1.0% by mass is easily available. Further, in the above talc, when the total content of Fe 2 O 3 and Al 2 O 3 is 2.0% by mass or less, the molding processability of the resin composition and the molding of a connector or the like molded from the resin composition are formed. The heat resistance of the product does not deteriorate easily.
  • the total content of Fe 2 O 3 and Al 2 O 3 is preferably more than 1.0% by mass and 1.7% by mass or less.
  • the CaO content is less than 0.5% by mass, the molding processability of the resin composition and the heat resistance of the molded product such as a connector molded from the resin composition are unlikely to deteriorate.
  • the CaO content is preferably 0.01% by mass or more and 0.4% by mass or less.
  • the volume-based cumulative average particle size (D50) of talc measured by laser diffraction is 4.0 to 20.0 ⁇ m from the viewpoint of preventing warpage deformation of the molded product and maintaining the fluidity of the resin composition. It is preferably 10 to 18 ⁇ m, and more preferably 10 to 18 ⁇ m.
  • Mica is a pulverized product of silicate minerals containing aluminum, potassium, magnesium, sodium, iron and the like.
  • Examples of mica include muscovite, phlogopite, biotite, and artificial mica. Of these, muscovite is preferable because it has a good hue and is inexpensive.
  • the wet pulverization method is a method in which rough mica is roughly pulverized by a dry pulverizer, water is added, and the main pulverization is performed by wet pulverization in a slurry state, and then dehydration and drying are performed.
  • the dry pulverization method is a low-cost and general method as compared with the wet pulverization method, it is easier to pulverize the mineral thinly and finely by using the wet pulverization method.
  • It is preferable to use a thin and fine pulverized product because mica having a preferable average particle size and thickness described later can be obtained. Therefore, it is preferable to use mica produced by the wet pulverization method.
  • coagulation sedimentation agents and sedimentation aids include polyaluminum chloride, aluminum sulfate, ferrous sulfate, ferric sulfate, copper chloride, polyiron sulfate, polyferric chloride, iron-silica inorganic polymer flocculant, and chloride.
  • Examples include ferric-silica inorganic polymer flocculant, slaked lime (Ca (OH) 2 ), caustic soda (NaOH), soda ash (Na 2 CO 3 ) and the like.
  • These coagulation sedimentation agents and sedimentation aids have an alkaline or acidic pH.
  • Mica preferably does not use a coagulation sedimentation agent and / or a sedimentation aid during wet pulverization. When mica that has not been treated with a coagulation sedimentation agent and / or a sedimentation aid is used, decomposition of the polymer in the resin composition is unlikely to occur, and a large amount of gas is less likely to be generated or the molecular weight of the polymer is less likely to decrease. It is easy to maintain the performance of the molded product better.
  • Mica preferably has an average particle size of 10 to 100 ⁇ m measured by a microtrack laser diffraction method, and particularly preferably has an average particle size of 20 to 80 ⁇ m.
  • the average particle size of mica is 10 ⁇ m or more, the effect of improving the rigidity of the molded product is likely to be sufficient, which is preferable.
  • the average particle size of mica is 100 ⁇ m or less, the rigidity of the molded product is likely to be sufficiently improved, and the weld strength is also likely to be sufficient, which is preferable.
  • the average particle size of mica is 100 ⁇ m or less, it is easy to secure sufficient fluidity for molding a connector or the like.
  • the average thickness actually measured for 100 pieces by observation with an electron microscope is preferably 0.01 to 1 ⁇ m, and particularly preferably 0.03 to 0.3 ⁇ m.
  • the average thickness of mica is 0.01 ⁇ m or more, the mica is less likely to crack during the melt processing of the resin composition, and the rigidity of the molded product may be easily improved, which is preferable.
  • the thickness of mica is 1 ⁇ m or less, the effect of improving the rigidity of the molded product is likely to be sufficient, which is preferable.
  • Mica may be surface-treated with a silane coupling agent or the like, and / or may be granulated with a binder to form granules.
  • the content of the plate-shaped filler is 25 to 40% by mass with respect to the entire resin composition. If the content of the plate-shaped filler is less than 25% by mass with respect to the entire resin composition, the flatness of the molded product such as the flat connector obtained from the resin composition is not sufficient, which is not preferable. If the content of the plate-shaped filler is more than 40% by mass with respect to the entire resin composition, the fluidity of the resin composition may deteriorate and molding of the resin composition may become difficult, which is not preferable. ..
  • the content of the plate-shaped filler is preferably 25 to 38% by mass, more preferably 25 to 37% by mass, and further preferably 25 to 35% by mass with respect to the entire resin composition.
  • the total amount of the fibrous filler and the plate-shaped filler is 37.5 to 50% by mass with respect to the entire resin composition.
  • the molded product such as a planar connector obtained from the resin composition has a low deflection temperature under load, insufficient high-temperature rigidity, and is not sufficient. , It is not preferable because the flatness may be insufficient.
  • the total amount is preferably 40 to 50% by mass, more preferably 40 to 47.5% by mass, and further preferably 40 to 45% by mass with respect to the entire resin composition.
  • the release agent is not particularly limited as long as it is generally available, and examples thereof include fatty acid esters, fatty acid metal salts, fatty acid amides, low molecular weight polyolefins, and the like. Fatty acid esters (eg, pentaerythritol tetrastearate) are preferred.
  • the amount of the release agent to be blended is preferably in the range of 0.1 to 3% by mass in the resin composition.
  • the blending amount of the release agent is 0.1% by mass or more, the releasability at the time of molding is improved.
  • the compounding amount of the release agent is 3% by mass or less, the mold deposit (that is, the deposit on the mold in molding; hereinafter, also referred to as “MD”) is easily reduced and the flat surface is excellent in crack resistance. Easy to get a shape connector.
  • the blending amount of the release agent is more preferably 0.1 to 1% by mass, still more preferably 0.1 to 0.5% by mass.
  • the resin composition includes pigments such as nucleating agents, carbon black, and inorganic calcined pigments, antioxidants, stabilizers, plasticizers, flame retardants, and components other than the above components (B) and (C).
  • pigments such as nucleating agents, carbon black, and inorganic calcined pigments, antioxidants, stabilizers, plasticizers, flame retardants, and components other than the above components (B) and (C).
  • One or more of the known inorganic fillers of the above may be blended in an amount of 5% by mass or less.
  • the resin composition includes liquid crystal resins other than the above-mentioned all aromatic polyesters, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, polyether ether ketone resin, polyallyl sulfone resin, thermoplastic polyimide resin, and thermoplastic.
  • Other thermoplastic resins such as urethane resin, polyaminobismaleimide resin, polyamideimide resin, and poly
  • the resin composition according to the present embodiment described above contains less foreign matter derived from the sublimated product during polymer polymerization.
  • a white backlight to a film (0.5 g / sheet, film thickness 100 ⁇ m) prepared by hot pressing the resin composition, and check the number of foreign matter using a loupe. It can be evaluated by doing.
  • the resin composition in which foreign matter is suppressed can suppress gate clogging during injection molding, and can also suppress foreign matter from being mixed into the obtained molded product. As a result, it is possible to suppress poor continuity of the electronic component formed from the resin composition.
  • the minimum filling pressure during molding is unlikely to be excessive, and a connector, particularly a component having a small and fine lattice structure such as a planar connector or the like. Etc. can be preferably molded.
  • the degree of fluidity is determined by the minimum filling pressure of the connector. That is, the minimum injection filling pressure at which a good molded product can be obtained when the planar connector shown in FIG. 1 is injection molded is specified as the minimum filling pressure. The lower the minimum filling pressure, the better the fluidity is evaluated.
  • the resin composition has a melt viscosity of 1 ⁇ 105 Pa ⁇ s or less (more preferably) measured in accordance with ISO11443 at a temperature 10 to 30 ° C. higher than the melting point of the total aromatic polyester at a shear rate of 1000 / sec. Is 5 Pa ⁇ s or more and 1 ⁇ 102 Pa ⁇ s or less), which is preferable in that the fluidity of the resin composition is ensured and the filling pressure does not become excessive at the time of molding the connector, particularly the planar connector.
  • the resin composition according to the above-described embodiment contains a fully aromatic polyester, it has excellent heat resistance.
  • As an index showing the heat resistance of the resin composition there is a deflection temperature under load (hereinafter, also referred to as “DTUL”).
  • DTUL deflection temperature under load
  • the DTUL of the resin composition is preferably 265 ° C. or higher and 310 ° C. or lower, and more preferably 267 ° C. or higher and 300 ° C. or lower.
  • the method for producing the resin composition is not particularly limited as long as the components in the resin composition can be uniformly mixed, and can be appropriately selected from the conventionally known methods for producing the resin composition.
  • a method in which each component is melt-kneaded and extruded using a melt-kneading device such as a single-screw or twin-screw extruder, and then the obtained resin composition is processed into a desired form such as powder, flakes, and pellets. can be mentioned.
  • the resin composition according to the present embodiment can produce a molded product having excellent fluidity and heat resistance, a connector, a CPU socket, a relay switch component, a bobbin, an actuator, a noise reduction filter case, and an electronic circuit can be manufactured. It can be preferably used for manufacturing a substrate or a heat fixing roll for OA equipment. In particular, since it is possible to manufacture a molded product having excellent flatness, weld strength and crack resistance, it can be preferably used for manufacturing a connector having a fine structure such as a flat connector.
  • the molded product according to the present embodiment is molded from the resin composition according to the present embodiment and includes the above resin composition. Since it is formed from a resin composition, it can be a molded product having excellent flatness, weld strength and crack resistance.
  • the planar connector according to the present embodiment is molded from the resin composition according to the present embodiment and includes the above resin composition. Since it is formed from a resin composition, it can be a flat connector having excellent flatness, weld strength and crack resistance. Further, since the amount of foreign matter mixed in is small, it is possible to prevent poor continuity and the occurrence of cracks originating from the foreign matter.
  • the shape of the planar connector is not particularly limited, but may be a planar connector having a lattice structure inside the outer frame portion and having a pitch interval of the lattice portions of 1.5 mm or less in the lattice structure.
  • the planar connector has an outer frame portion and a lattice structure formed inside (in the plate surface direction) of the outer frame portion, and the pitch of the lattice portions in the lattice structure is 1.5 mm or less. It is preferably 1.3 mm or less, and more preferably 1.2 mm or less.
  • a plurality of through holes are formed at predetermined intervals in the vertical direction and the horizontal direction by a plurality of resin portions extending in the vertical direction and the horizontal direction of the plate surface of the planar connector.
  • "Lattice portion” means a portion including one through hole and a resin portion between the through hole and the adjacent through hole.
  • the “pitch” is the sum of the width of the resin portion of the lattice portion constituting the lattice structure and the width of the through hole.
  • the width of the through hole is the longest linear distance (interval) between adjacent resin portions.
  • the width of the resin portion of the lattice portion that holds the terminals in the planar connector is preferably 0.5 mm or less, more preferably 0.3 mm or less, still more preferably 0.2 mm or less, and the height (thickness) of the entire product. It may be a very thin flat connector having a thickness of 5.0 mm or less, more preferably 3.0 mm or less, still more preferably 2.0 mm or less, and particularly preferably 1.0 mm or less. As a specific shape of the planar connector, for example, the one shown in FIG. 1 can be mentioned.
  • the planar connector 10 shown in FIG. 1 has a plate shape of 39.82 mm ⁇ 39.82 mm ⁇ height (thickness) 1.0 mm, 5.0 mm from the upper and lower ends of the outer frame portion 1, and left and right ends, respectively. It has a lattice structure 3 inside (inside) from a position of 2.0 mm from each.
  • the lattice structure 3 includes a lattice portion 2 composed of a resin portion formed of a conductive material and a pin insertion hole, and has a pitch interval of 1.2 mm and 30 columns ⁇ 25 rows inside the outer frame portion 1. (A total of 750 pieces) of lattice portions 2 are formed.
  • the number of the lattice portions 2 can be selected as needed, and can be, for example, 500 to 1000.
  • the shape of the pin insertion hole in the lattice portion of the planar connector is not particularly limited, and may be a square, round, irregular hole, or the like.
  • the molding method for obtaining a flat connector is not particularly limited, but in order to prevent deformation of the obtained flat connector and obtain a flat connector having good flatness, a molding condition with a small residual internal stress should be selected. Is preferable.
  • the cylinder temperature of the molding machine is preferably a temperature equal to or higher than the melting point of the liquid crystal polymer.
  • the mold temperature is preferably 70 to 100 ° C. When the mold temperature is 70 to 100 ° C., it is possible to prevent the resin composition filled in the mold from causing poor flow, and it is also possible to prevent the occurrence of burrs.
  • the injection speed is preferably 150 mm / sec or more. When the injection speed is 150 mm / sec or more, it is possible to prevent the generation of unfilled molded products, prevent the increase in residual internal stress due to the filling pressure becoming too high, and make the connector with good flatness. ..
  • the flat connector suppresses the entry of foreign matter.
  • the degree of contamination of foreign matter is determined as follows. That is, the degree of mixing can be determined by the number of times the gate is clogged during molding of the planar connector. Since gate clogging is caused by the generation of foreign matter during molding, it can be evaluated that the mixing of foreign matter is suppressed when the gate clogging does not occur.
  • a blister is a fine bulge that occurs on the surface of a molded product when it is left in hot air or liquid for a long time.
  • the degree of blister generation is determined by the blister temperature. That is, the presence or absence of blister generation on the surface of the molded product sandwiched in a hot press at a predetermined temperature for 5 minutes is visually observed, and the maximum temperature at which the number of blister generation becomes zero is defined as the blister temperature. It is evaluated that the higher the blister temperature, the more the blister generation is suppressed.
  • the flat connector has excellent flatness with suppressed deformation and warpage.
  • the flat connector has excellent weld strength and crack resistance. Although the weld strength and crack resistance of the molded product correlate with each other, a flat connector having good weld strength and crack resistance can be obtained.
  • the connector has excellent heat resistance, for example, heat resistance as evaluated by high temperature rigidity.
  • High temperature rigidity is evaluated by measuring the deflection temperature under load in accordance with ISO75-1 and ISO75-1.
  • the temperature of the reaction system was raised to 140 ° C, and the reaction was carried out at 140 ° C for 1 hour. After that, the temperature is further raised under the speed conditions shown in Table 1 (that is, the temperature is raised from 140 ° C to 200 ° C at a heating rate of 0.6 ° C./min, and then to 270 ° C. at a heating rate of 1 ° C./min. Then, the temperature is raised to 360 ° C. at a heating rate of 0.5 ° C./min), and then the pressure is reduced to 10 Torr (that is, 1330 Pa) over 20 minutes to remove acetic acid, excess acetic anhydride, and other low boiling points. Melt polymerization was carried out while distilling.
  • Table 1 that is, the temperature is raised from 140 ° C to 200 ° C at a heating rate of 0.6 ° C./min, and then to 270 ° C. at a heating rate of 1 ° C./min.
  • the temperature is raised to 360 ° C.
  • the stirring torque After the stirring torque reaches a predetermined value, nitrogen is introduced to change the pressure from a reduced pressure state to a pressurized state through normal pressure, and the product is discharged from the lower part of the polymerization vessel and pelletized to obtain a pellet-shaped prepolymer. It was.
  • the obtained prepolymer was heat-treated (solid-phase polymerization) at 300 ° C. for 3 hours under a nitrogen stream to obtain the desired polymer.
  • melt viscosity Using Capillograph (manufactured by Toyo Seiki Seisakusho Co., Ltd.), using an orifice with an inner diameter of 0.5 mm and a length of 30 mm at a temperature of 380 ° C., a shear rate of 1000 / sec, and ISO11443, all aromatic polyester. (The melt viscosity of Synthesis Examples 4 and 8 was measured at a temperature of 350 ° C.).
  • the monomer composition was calculated by the pyrolysis gas chromatography method described in Polymer Degradation and Stability 76 (2002) 85-94. Specifically, using a pyrolysis device (“PY2020iD” manufactured by Frontier Lab Co., Ltd.), all aromatic polyester is heated in the presence of tetramethylammonium hydroxide (TMAH), and gas is pyrolyzed / methylated. Was generated. This gas was analyzed using gas chromatography (“GC-6890N” manufactured by Azilent Technology Co., Ltd.), and the peak area derived from 1,4-phenylenedicarboxylic acid and the peak derived from 4,4′-dihydroxybiphenyl were analyzed. From the ratio to the area, the difference between the content of the constituent unit derived from 1,4-phenylenedicarboxylic acid and the content of the constituent unit derived from 4,4'-dihydroxybiphenyl was calculated.
  • TMAH tetramethylammonium hydroxide
  • Example 1 The total aromatic polyester obtained in Synthesis Example 1 and the components shown in Table 1 were mixed using a twin-screw extruder to obtain a resin composition.
  • the extrusion conditions are as follows.
  • the blending amount of each component is as shown in Table 1.
  • the fillers used in Examples and Comparative Examples are as follows.
  • Fibrous filler Glass fiber Nippon Electric Glass Co., Ltd., "ECS03T-786", fiber diameter 10 ⁇ m, average fiber length 3 mm (manufacturer's nominal value) Milled glass fiber (milled fiber): “EPH-80M” manufactured by Nippon Electric Glass Co., Ltd., fiber diameter 10.5 ⁇ m, average fiber length 80 ⁇ m (manufacturer's nominal value)
  • the manufacturer's nominal value is different from the measured value (weight average fiber length) in the composition. The weight average fiber length will be described later.
  • Plate-shaped filler talc "Crown talc PP” manufactured by Matsumura Sangyo Co., Ltd., average particle size 10 ⁇ m Mica: “AB-25S” manufactured by Yamaguchi Mica Industry Co., Ltd., average particle size 25 ⁇ m
  • Release agent Pentaerythritol tetrastearate (manufactured by Emery Oleo Chemicals Japan Co., Ltd.)
  • Examples 2 to 9, Comparative Examples 1 to 8 A resin composition was obtained in the same manner as in Example 1 except that the blending amount of each component was as shown in Table 1.
  • Comparative Examples 9 to 18 A resin composition was obtained in the same manner as in Example 1 except that the blending amount of each component was as shown in Table 2.
  • Weight average fiber length of fibrous filler 5 g of the resin composition pellet was heated at 600 ° C. for 2 hours to incinerate. After the ashing residue was sufficiently dispersed in a 5 mass% polyethylene glycol aqueous solution, it was transferred to a petri dish with a dropper, and the fibrous filler was observed under a microscope. At the same time, the weight average fiber length of the fibrous filler was measured using an image measuring device (LUZEXFS manufactured by Nireco Corporation). That is, a stereomicroscopic image of about 100 fibrous fillers of the ashing residue was taken from the CCD camera into a PC and measured by an image processing method with an image measuring machine. This was repeated 10 times, and the average value of the measured values when the number of fibrous fillers reached about 1000 was taken as the weight average fiber length. The results are shown in Tables 1 and 2 as "weight average fiber length".
  • the resin composition was made into a film (0.5 g / sheet, film thickness 100 ⁇ m) using a high temperature hot press machine (“NP-SNH” manufactured by Toyo Seiki Seisakusho Co., Ltd.). A white backlight was applied to the film, and the number of foreign substances of 0.3 mm or more was confirmed using a loupe. The number of foreign substances was confirmed for 5 films (2.5 g), and the number of foreign substances per unit weight was determined. Evaluation was made according to the following criteria. 2 (good): The number of foreign substances was 0 / g. 1 (defective): 1 piece / g or more.
  • the resin composition was injection-molded on a test piece for measurement (125 mm ⁇ 13 mm ⁇ 0.4 mm, 2-point film gate) under the following molding conditions.
  • the weld strength of the obtained test piece was measured under the following measurement conditions.
  • Molding machine Sumitomo Heavy Industries SE100DU Cylinder temperature; 370 ° C (Examples 1 to 7, Example 9, Comparative Examples 1 to 7, Comparative Examples 9 to 18) 340 ° C (Example 8, Comparative Example 8) Mold temperature; 90 ° C Injection speed; 200 mm / sec Holding pressure; 70 MPa ⁇ Measurement conditions> Measuring machine: RTM-100 manufactured by Orientec Tencilon Universal Testing Machine Load cell; 100 kg Distance between chucks; 2.5 mm Chuck force; 2.0 kgf / cm2 Tensile speed; 0.5 mm / min
  • the resin composition is injection-molded to obtain a molded product of 12.5 mm ⁇ 120 mm ⁇ 0.8 mm, 30 of these molded products are immersed in silicone oil at a predetermined temperature, washed with a detergent, and then naturally. It was dried and visually inspected for blisters on the surface.
  • the blister temperature was set to the minimum temperature at which the number of blisters generated was zero out of 30 molded products.
  • Molding machine Sumitomo Heavy Industries, SE100DU Cylinder temperature: 370 ° C (Examples 1 to 7, Example 9, Comparative Examples 1 to 7, Comparative Examples 9 to 18) 340 ° C (Example 8, Comparative Example 8) Mold temperature: 90 ° C Injection speed: 33 mm / sec
  • the resin composition has the shape shown in FIG. 1, the overall size is 39.82 mm ⁇ 39.82 mm ⁇ 1 mmt, and the grid portion pitch interval is 1.2 mm.
  • the gate a film gate from the long side of the lattice portion was used, and the gate thickness was set to 0.3 mm.
  • ⁇ Molding conditions > Molding machine; Sumitomo Heavy Industries SE100DUZ Cylinder temperature; 370 ° C (Examples 1 to 7, Example 9, Comparative Examples 1 to 7, Comparative Examples 9 to 18) 340 ° C (Example 8, Comparative Example 8) Mold temperature; 80 ° C Injection speed; 200 mm / sec Holding pressure; 50 MPa
  • the obtained connector was allowed to stand on a horizontal desk, and the height of the connector was measured by a Mitutoyo Quick Vision 404PROCNC image measuring device. At that time, the position of 0.5 mm from the end face of the connector was measured at intervals of 10 mm, and the difference between the maximum height and the minimum height was specified as the flatness. The lower the flatness value, the flatter the connector. The flatness was measured before and after the IR reflow performed under the following conditions, and evaluated according to the following criteria.
  • Mold Tunnel gate mold, gate diameter 0.1 mm, 2 pieces (inject into 2 molds of the same shape at the same time) Cylinder temperature: 370 ° C (Examples 1 to 7, Example 9, Comparative Examples 1 to 7, Comparative Examples 9 to 18) 340 ° C (Example 8, Comparative Example 8) Mold temperature: 80 ° C Injection speed: 33 mm / sec Holding pressure: 50 MPa Number of shots: 360 shots Molding stability and the presence or absence of foreign matter mixed in the molded product were evaluated according to the following criteria. 2 (excellent molding stability and few foreign substances): Gate clogging did not occur. 1 (poor molding stability and a large amount of foreign matter): Gate clogging occurred once or more.
  • the resin composition obtained in the examples can produce a flat connector having excellent fluidity, less foreign matter mixed in, and less warpage and / or deformation.
  • the connector formed from this resin composition was excellent in flatness, weld strength and crack resistance, and blister generation was suppressed.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Le problème décrit par la présente invention est de fournir : une composition de résine susceptible de donner à un connecteur plan dans lequel peu de corps étrangers sont présents et qui est excellent en termes de planéité, une résistance à la soudure et de résistance à la fissuration ; et un connecteur plan obtenu en utilisant ladite composition de résine. La solution selon l'invention porte sur une composition de résine qui contient (A) un polyester entièrement aromatique, (B) une charge fibreuse et (C) une charge en forme de plaque. Le constituant (A) contient des motifs constitutifs (I) à (IV) comme motifs constitutifs essentiels. Les valeurs des teneurs des motifs constitutifs (I), (II), (III) et (IV) tombent à l'intérieur de plages de % en mole prescrites par rapport à la quantité totale de tous les motifs constitutifs. La différence entre la teneur du motif constitutif (III) et la teneur du motif constitutif (IV) est de 0,150 % en mole ou moins. La teneur du polyester entièrement aromatique (A) est de 50 à 62,5 % en masse. La teneur du constituant (B) est de 10 à 25 % en masse par rapport à la composition totale de la résine. La teneur du constituant (C) est de 25 à 40 % en masse par rapport à la composition totale de la résine. La quantité totale des constituants (B) et (C) est de 37,5 à 50 % en masse par rapport à la composition totale de la résine. La longueur de fibre moyenne en poids du constituant (B) est de 200 à 500 µm.
PCT/JP2020/039318 2019-10-31 2020-10-20 Composition de résine et connecteur plan WO2021085224A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003268252A (ja) * 2002-03-19 2003-09-25 Polyplastics Co 液晶性ポリマー組成物
JP2006037061A (ja) * 2004-07-30 2006-02-09 Polyplastics Co 液晶性ポリエステル樹脂組成物
WO2014050370A1 (fr) * 2012-09-27 2014-04-03 ポリプラスチックス株式会社 Composition de résine composite et connecteur plat moulé à partir de celle-ci

Family Cites Families (7)

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JP5165492B2 (ja) * 2008-05-23 2013-03-21 ポリプラスチックス株式会社 平面状コネクター
JP2010037364A (ja) * 2008-07-31 2010-02-18 Polyplastics Co コネクター
MY166937A (en) * 2011-04-01 2018-07-25 Polyplastics Co Wholly Aromatic Polyester and Polyester Resin Composition
JP5485216B2 (ja) * 2011-04-01 2014-05-07 ポリプラスチックス株式会社 平面状コネクター
JP5753144B2 (ja) * 2012-09-21 2015-07-22 ポリプラスチックス株式会社 全芳香族ポリエステル及びポリエステル樹脂組成物、並びにポリエステル成形品
JP6157778B1 (ja) * 2015-10-21 2017-07-05 ポリプラスチックス株式会社 全芳香族ポリエステル及びその製造方法
MY191157A (en) * 2019-04-03 2022-06-02 Polyplastics Co Wholly aromatic polyester and polyester resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003268252A (ja) * 2002-03-19 2003-09-25 Polyplastics Co 液晶性ポリマー組成物
JP2006037061A (ja) * 2004-07-30 2006-02-09 Polyplastics Co 液晶性ポリエステル樹脂組成物
WO2014050370A1 (fr) * 2012-09-27 2014-04-03 ポリプラスチックス株式会社 Composition de résine composite et connecteur plat moulé à partir de celle-ci

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