WO2021079420A1

WO2021079420A1 - Plasma generation device and plasma processing method

Info

Publication number: WO2021079420A1
Application number: PCT/JP2019/041419
Authority: WO
Inventors: 卓也岩田
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2019-10-22
Filing date: 2019-10-22
Publication date: 2021-04-29
Also published as: EP4050973A1; JP7133724B2; CN114586473A; JPWO2021079420A1; EP4050973A4

Abstract

A plasma generation device comprising: a device body in which a reaction chamber for converting a processing gas into plasma is formed; at least one discharge passage connected to the reaction chamber; a diffusion chamber connected to the at least one discharge passage; and a plurality of ejection passages that is connected to the diffusion chamber and ejects plasma gas obtained by conversion into plasma in the reaction chamber having a tapered surface formed in the opening of at least one of the plurality of ejection passages to the diffusion chamber.

Description

Plasma generator and plasma processing method

The present disclosure relates to a plasma generator or the like that ejects plasma gas from an ejection passage.

Some plasma generators have a structure in which the processing gas is turned into plasma in the reaction chamber and the turned plasma gas is ejected from the ejection passage formed in the nozzle. The following patent documents describe an example of such a plasma generator.

Japanese Unexamined Patent Publication No. 2001-066298

An object of the present specification is to improve the practicality of a plasma generator having a structure in which plasma gas is ejected from an ejection passage.

In order to solve the above problems, the present specification describes an apparatus main body in which a reaction chamber for converting a processing gas into plasma is formed, at least one discharge passage connected to the reaction chamber, and at least one discharge passage. A diffusion chamber connected to the diffusion chamber and a plurality of ejection passages connected to the diffusion chamber, and the reaction in which a tapered surface is formed in the opening of at least one of the plurality of ejection passages to the diffusion chamber. A plasma generator including a plurality of ejection passages for ejecting plasma gas turned into plasma in a chamber is disclosed.

Further, the present specification includes an apparatus main body in which a reaction chamber for converting the processing gas into plasma is formed, and a nozzle mounted on the apparatus main body and ejecting the plasma gas converted into plasma in the reaction chamber. The apparatus main body has a discharge passage for discharging the plasma gas converted into plasma in the reaction chamber to the outside of the device main body, and the nozzle opens the discharge passage to the outer wall surface of the device main body. A diffusion chamber formed so as to cover the diffusion chamber and a plurality of ejection passages for ejecting plasma gas via the diffusion chamber, and the diffusion chamber of one or more of the plurality of ejection passages. Disclosed is a plasma generator having a plurality of ejection passages for ejecting plasma-generated plasma gas in the reaction chamber having a tapered surface formed in the opening to the plasma.

Further, the present specification includes an apparatus main body in which a reaction chamber for converting the processing gas into plasma is formed, and a nozzle attached to the apparatus main body and ejecting the plasma gas converted into plasma in the reaction chamber. The apparatus main body has a discharge passage for discharging the plasma gas converted into plasma in the reaction chamber to the outside of the device main body, and the nozzle opens the discharge passage to the outer wall surface of the device main body. A diffusion chamber formed so as to cover the above, and a plurality of ejection passages for ejecting plasma gas via the diffusion chamber, and the diffusion chamber of one or more of the plurality of ejection passages. In a plasma generator having a plurality of ejection passages for ejecting plasma gas turned into plasma in the reaction chamber having a tapered surface formed in the opening to the plasma gas, the plasma gas ejected from the plurality of ejection passages is treated. A plasma treatment method for irradiating the body is disclosed.

According to the present disclosure, by forming a tapered surface in the opening of the ejection passage to the diffusion chamber, for example, even if foreign matter adheres to the opening, the opening is less likely to be closed by the foreign matter. As a result, it is possible to secure the ejection of the plasma gas from the ejection passage, and it is possible to improve the practicality of the plasma generator having a structure in which the plasma gas is ejected from the ejection passage.

It is a figure which shows the plasma apparatus. It is a perspective view which shows the plasma head. It is sectional drawing which cut the plasma head in the X direction and Z direction at the position of the electrode and the plasma passage on the main body side. It is sectional drawing in the AA line of FIG. FIG. 3 is an enlarged cross-sectional view of FIG. It is sectional drawing of the plasma head which attached the nozzle different from the nozzle of FIG.

Hereinafter, examples of the present invention will be described in detail with reference to the drawings as a mode for carrying out the present invention.

As shown in FIG. 1, the plasma device 10 includes a plasma head 11, a robot 13, and a control box 15. The plasma head 11 is attached to the robot 13. The robot 13 is, for example, a serial link type robot (also called an articulated robot). The plasma head 11 can irradiate plasma gas while being held at the tip of the robot 13. The plasma head 11 can move three-dimensionally according to the drive of the robot 13.

The control box 15 is mainly composed of a computer and controls the plasma device 10 in an integrated manner. The control box 15 has a power supply unit 15A that supplies electric power to the plasma head 11 and a gas supply unit 15B that supplies gas to the plasma head 11. The power supply unit 15A is connected to the plasma head 11 via a power cable (not shown). The power supply unit 15A changes the voltage applied to the electrodes 33 (see FIGS. 3 and 4) of the plasma head 11 based on the control of the control box 15.

Further, the gas supply unit 15B is connected to the plasma head 11 via a plurality of (four in this embodiment) gas tubes 19. The gas supply unit 15B supplies the reaction gas, the carrier gas, and the heat gas, which will be described later, to the plasma head 11 based on the control of the control box 15. The control box 15 controls the gas supply unit 15B, and controls the amount of gas supplied from the gas supply unit 15B to the plasma head 11. As a result, the robot 13 operates under the control of the control box 15 and irradiates the object W placed on the table 17 with plasma gas from the plasma head 11.

Further, the control box 15 includes an operation unit 15C having a touch panel and various switches. The control box 15 displays various setting screens, operating states (for example, gas supply state, etc.) and the like on the touch panel of the operation unit 15C. Further, the control box 15 receives various information by inputting an operation to the operation unit 15C.

As shown in FIG. 2, the plasma head 11 includes a plasma generation unit 21, a heat gas supply unit 23, and the like. The plasma generation unit 21 generates plasma gas by converting the processing gas supplied from the gas supply unit 15B (see FIG. 1) of the control box 15 into plasma. The heat gas supply unit 23 heats the gas supplied from the gas supply unit 15B to generate heat gas. The plasma head 11 of the present embodiment ejects the plasma gas generated by the plasma generation unit 21 together with the heat gas generated by the heat gas supply unit 23 to the object W to be processed shown in FIG. The processing gas is supplied to the plasma head 11 from the upstream side to the downstream side in the direction of the arrow shown in FIG. The plasma head 11 may not be provided with the heat gas supply unit 23. That is, the plasma apparatus of the present disclosure may have a configuration that does not use heat gas.

As shown in FIGS. 3 and 4, the plasma generation unit 21 includes a head body unit 31, a pair of electrodes 33, a plasma irradiation unit 35, and the like. 3 is a cross-sectional view taken along the positions of the pair of electrodes 33 and a plurality of plasma passages 71 on the main body side, which will be described later, and FIG. 4 is a cross-sectional view taken along the line AA of FIG. The head main body 31 is formed of a ceramic having high heat resistance, and a reaction chamber 37 for generating plasma gas is formed inside the head main body 31. Each of the pair of electrodes 33 has, for example, a cylindrical shape, and is fixed in a state where its tip is projected into the reaction chamber 37. In the following description, the pair of electrodes 33 may be simply referred to as electrodes 33. Further, the direction in which the pair of electrodes 33 are arranged is referred to as the X direction, the direction in which the plasma generation unit 21 and the heat gas supply unit 23 are arranged is referred to as the Y direction, and the axial direction of the cylindrical electrodes 33 is referred to as the Z direction. In this embodiment, the X direction, the Y direction, and the Z direction are orthogonal to each other.

The heat gas supply unit 23 includes a gas pipe 41, a heater 43, a connecting unit 45, and the like. The gas pipe 41 and the heater 43 are attached to the outer peripheral surface of the head main body 31 and are covered with the cover 47 shown in FIG. The gas pipe 41 is connected to the gas supply unit 15B of the control box 15 via the gas tube 19 (see FIG. 1). Gas (for example, air) is supplied to the gas pipe 41 from the gas supply unit 15B. The heater 43 is attached in the middle of the gas pipe 41. The heater 43 heats the gas flowing through the gas pipe 41 to generate heat gas.

As shown in FIG. 4, the connecting portion 45 connects the gas pipe 41 to the plasma irradiation portion 35. In the state where the plasma irradiation unit 35 is attached to the head main body 31, the connecting portion 45 is connected to the gas pipe 41 at one end and to the heat gas passage 51 formed in the plasma irradiation portion 35 at the other end. .. Heat gas is supplied to the heat gas passage 51 via the gas pipe 41.

As shown in FIG. 4, a part of the outer peripheral portion of the electrode 33 is covered with an electrode cover 53 made of an insulator such as ceramics. The electrode cover 53 has a substantially hollow tubular shape, and openings are formed at both ends in the longitudinal direction. The gap between the inner peripheral surface of the electrode cover 53 and the outer peripheral surface of the electrode 33 functions as a gas passage 55. The opening on the downstream side of the electrode cover 53 is connected to the reaction chamber 37. The lower end of the electrode 33 projects from the opening on the downstream side of the electrode cover 53.

Further, a reaction gas flow path 61 and a pair of carrier gas flow paths 63 are formed inside the head main body 31. The reaction gas flow path 61 is provided in a substantially central portion of the head main body portion 31 and is connected to the gas supply unit 15B via a gas tube 19 (see FIG. 1) to react the reaction gas supplied from the gas supply unit 15B. It flows into the chamber 37. Further, the pair of carrier gas flow paths 63 are arranged at positions sandwiching the reaction gas flow path 61 in the X direction. Each of the pair of carrier gas flow paths 63 is connected to the gas supply unit 15B via the gas tube 19 (see FIG. 1), and the carrier gas is supplied from the gas supply unit 15B. The carrier gas flow path 63 allows the carrier gas to flow into the reaction chamber 37 through the gas passage 55.

Oxygen (O2) can be used as the reaction gas (seed gas). The gas supply unit 15B allows, for example, a mixed gas of oxygen and nitrogen (N2) (for example, dry air (Air)) to flow between the electrodes 33 of the reaction chamber 37 via the reaction gas flow path 61. Hereinafter, this mixed gas may be referred to as a reaction gas for convenience, and oxygen may be referred to as a seed gas. Nitrogen can be used as the carrier gas. The gas supply unit 15B allows carrier gas to flow in from each of the gas passages 55 so as to surround each of the pair of electrodes 33.

AC voltage is applied to the pair of electrodes 33 from the power supply unit 15A of the control box 15. By applying a voltage, for example, as shown in FIG. 4, a pseudo arc A is generated between the lower ends of the pair of electrodes 33 in the reaction chamber 37. When the reaction gas passes through the pseudo arc A, the reaction gas is turned into plasma. Therefore, the pair of electrodes 33 generate the discharge of the pseudo arc A, turn the reaction gas into plasma, and generate the plasma gas.

Further, in the portion of the head main body 31 on the downstream side of the reaction chamber 37, a plurality of plasmas on the main body side (six in this embodiment) formed by arranging them at intervals in the X direction and extending in the Z direction. A passage 71 is formed. The upstream end of the plurality of main body side plasma passages 71 is open to the reaction chamber 37, and the downstream end of the plurality of main body side plasma passages 71 is opened to the lower end surface of the head main body 31. There is.

The plasma irradiation unit 35 includes a nozzle 73, a nozzle cover 75, and the like. The nozzle 73 is generally T-shaped when viewed from the side in the X direction, and is composed of a nozzle body 77 and a nozzle tip 79. The nozzle 73 is an integral body of the nozzle body 77 and the nozzle tip 79, and is made of highly heat-resistant ceramic. The nozzle body 77 generally has a flange shape, and is fixed to the lower surface of the head body 31 by bolts 80. Therefore, the nozzle 73 is detachable from the head main body 31, and can be changed to a different type of nozzle. Further, the nozzle tip 79 has a shape extending downward from the lower surface of the nozzle body 77.

The nozzle 73 is formed with a pair of grooves 81 that open on the upper end surface of the nozzle body 77. The pair of grooves 81 are formed side by side in a row so as to extend in the X direction, and in a state where the nozzle 73 is mounted on the head main body 31, each of the pair of grooves 81 is under the head main body 31. Three main body-side plasma passages 71 that open to the end face communicate with each other. That is, the openings at the lower ends of the three main body-side plasma passages 71 out of the six main body-side plasma passages 71 communicate with one of the pair of grooves 81, and the lower ends of the remaining three main body-side plasma passages 71. The opening communicates with the other of the pair of grooves 81.

Further, the nozzle 73 is formed with a plurality of nozzle-side plasma passages 82 (10 in this embodiment) that penetrate the nozzle body 77 and the nozzle tip 79 in the vertical direction, that is, in the Z direction. The plurality of nozzle-side plasma passages 82 are arranged at intervals in the X direction. The upper ends of the five nozzle-side plasma passages 82 out of the ten nozzle-side plasma passages 82 are opened to the bottom surface of one of the pair of grooves 81, and the upper ends of the remaining five nozzle-side plasma passages 82 are open. , Is open to the other bottom surface of the pair of grooves 81.

The nozzle cover 75 is generally T-shaped when viewed from the side in the X direction, and is composed of a cover body 85 and a cover tip 87. The nozzle cover 75 is an integral part of the cover body 85 and the cover tip 87, and is made of highly heat-resistant ceramic. The cover main body 85 has a generally plate-shaped plate thickness, and the cover main body 85 is formed with a concave portion 89 having an opening on the upper surface and a concave shape in the Z direction. The cover body 85 is fixed to the lower surface of the head body 31 by bolts 90 so that the nozzle body 77 of the nozzle 73 is housed in the recess 89. Therefore, the nozzle cover 75 is detachable from the head main body 31, and is removed from the head main body 31 when the nozzle 73 is replaced. Further, the cover body 85 is formed with a heat gas passage 51 so as to extend in the Y direction, one end of the heat gas passage 51 opens into the recess 89, and the other end of the heat gas passage 51 is the cover body. It is open to the side of 85. The end of the heat gas passage 51 that opens on the side surface of the cover body 85 is connected to the connecting portion 45 of the heat gas supply portion 23 described above.

The cover tip 87 extends downward from the lower surface of the cover body 85. One through hole 93 penetrating in the Z direction is formed in the cover tip 87, and the upper end portion of the through hole 93 communicates with the recess 89 of the cover main body 85. Then, the nozzle tip 79 of the nozzle 73 is inserted into the through hole 93. As a result, the nozzle 73 is entirely covered by the nozzle cover 75. The lower end of the nozzle tip 79 of the nozzle 73 and the lower end of the cover tip 87 of the nozzle cover 75 are located at the same height.

Further, in a state where the nozzle 73 is covered with the nozzle cover 75, the nozzle body 77 of the nozzle 73 is located inside the recess 89 of the nozzle cover 75, and the nozzle tip 79 of the nozzle 73 is inside the through hole 93 of the nozzle cover 75. Is located. In such a state, there is a gap between the recess 89 and the nozzle body 77 and between the through hole 93 and the nozzle tip 79, and the gap functions as a heat gas output passage 95. Heat gas is supplied to the heat gas output passage 95 via the heat gas passage 51.

With such a structure, the plasma gas generated in the reaction chamber 37 is ejected into the groove 81 together with the carrier gas via the plasma passage 71 on the main body side. Then, the plasma gas diffuses inside the groove 81 and is ejected from the opening 82A at the lower end of the nozzle-side plasma passage 82 via the nozzle-side plasma passage 82. Further, the heat gas supplied from the gas pipe 41 to the heat gas passage 51 flows through the heat gas output passage 95. This heat gas functions as a shield gas that protects the plasma gas. The heat gas flows through the heat gas output passage 95 and is ejected from the opening 95A at the lower end of the heat gas output passage 95 along the plasma gas ejection direction. At this time, the heat gas is ejected so as to surround the plasma gas ejected from the opening 82A of the nozzle-side plasma passage 82. By ejecting the heated heat gas around the plasma gas in this way, the effectiveness (wetting property, etc.) of the plasma gas can be enhanced.

In this way, in the plasma head 11, a discharge is generated in the reaction chamber 37, and when plasma is generated, the plasma gas is ejected from the tip of the nozzle 73, and the plasma treatment is applied to the object W to be processed. However, due to the electric discharge in the reaction chamber 37, the inner wall surface of the head main body 31 that partitions the reaction chamber 37, the electrode 33, and the like are carbonized, and foreign matter is generated. In this way, when foreign matter is generated in the reaction chamber 37, the foreign matter is discharged into the groove 81 via the plasma passage 71 on the main body side. At this time, inside the groove 81, foreign matter adheres to and accumulates in the opening of the nozzle-side plasma passage 82 that opens in the groove 81. Then, foreign matter accumulated in the opening of the nozzle-side plasma passage 82 may block the opening of the nozzle-side plasma passage 82, and in such a case, the internal pressure of the reaction chamber 37 rises to generate an appropriate discharge. It will not be possible to secure it. In order to prevent such a situation, the nozzle 73 may be removed from the head main body 31 and the opening to the inside of the groove 81 of the plasma passage 82 on the nozzle side may be cleaned. It needs to be stopped, which reduces productivity.

Therefore, in the plasma head 11, as shown in FIG. 5, a tapered surface 100 is formed in the opening of the nozzle-side plasma passage 82 into the groove 81. That is, the opening to the inside of the groove 81 of the nozzle-side plasma passage 82 is chamfered, and the inner diameter of the end portion of the nozzle-side plasma passage 82 on the opening side to the inside of the groove 81 is gradually increased. The inner diameter of the nozzle-side plasma passage 82 where the tapered surface 100 is not formed is made uniform. By forming the tapered surface 100 in the opening of the nozzle-side plasma passage 82 to the groove 81 in this way, even if foreign matter adheres to the opening of the nozzle-side plasma passage 82 and accumulates, the opening is opened. It becomes difficult to be blocked. As a result, it is possible to reduce the frequency of cleaning the opening of the plasma passage 82 on the nozzle side, and it is possible to suppress a decrease in productivity.

Further, in the plasma head 11, the tapered surface 100 is not formed on all of the plurality of nozzle-side plasma passages 82, and the tapered surface is formed only on a part of the nozzle-side plasma passages 82 among the plurality of nozzle-side plasma passages 82. 100 is formed. Specifically, the plasma gas generated in the reaction chamber 37 flows into the inside of the groove 81 from the plasma passage 71 on the main body side and diffuses inside the groove 81. Then, it flows out from the inside of the groove 81 to the plurality of nozzle-side plasma passages 82. At this time, since the flow of the plasma gas is different when the plasma gas is diffused inside the groove 81 and when the plasma gas flows from the groove 81 into each of the plurality of nozzle-side plasma passages 82, the plasma gas is charged. It has been found that foreign matter tends to stay in places where vortices are generated by the flow.

Therefore, at the time of manufacturing the nozzle 73, the flow of plasma gas in the plasma head 11 is based on the dimensions, number, arrangement, flow rate of plasma gas, etc. of the main body side plasma passage 71, groove 81, nozzle side plasma passage 82, and the like. Simulated by computer analysis. At this time, in the simulated plasma gas flow, vortices are generated near the second and third openings from both ends in the X direction of the ten nozzle-side plasma passages 82. Therefore, the tapered surface 100 is formed in the openings to the grooves 81 of the four nozzle-side plasma passages 82 located second and third from both ends in the X direction among the ten nozzle-side plasma passages 82. To. That is, the openings to the grooves 81 of the four nozzle-side plasma passages 82, which are symmetrically located at the third and fourth positions from the center, centered on the center of the ten nozzle-side plasma passages 82 in the line-up direction. , The tapered surface 100 is formed.

In this way, by forming the tapered surface 100 in the openings of some of the nozzle-side plasma passages 82 among the plurality of nozzle-side plasma passages 82, the openings of the nozzle-side plasma passages 82 where foreign matter is likely to accumulate become large. .. As a result, even if foreign matter accumulates in the opening of the nozzle-side plasma passage 82 to the groove 81 over time, the nozzle-side plasma passage 82 of the opening where the foreign matter easily accumulates and the nozzle of the opening where the foreign matter does not easily accumulate. The difference in the flow rate of the plasma gas from the side plasma passage 82 becomes small, and appropriate plasma processing is ensured.

Further, in the plasma head 11, as described above, the nozzle 73 can be replaced. For example, instead of the nozzle 73, the nozzle 110 shown in FIG. 6 can be mounted on the head main body 31. It is possible. The nozzle 110 is formed with a pair of grooves 112 and six nozzle-side plasma passages 114. Then, three nozzle-side plasma passages 114 out of the six nozzle-side plasma passages 114 open in one of the pair of grooves 112, and the remaining three nozzle-side plasma passages 114 form a pair of grooves. It is open to the other side of 112.

Further, even when the nozzle 110 is manufactured, the flow of plasma gas in the plasma head 11 is based on the dimensions, number, arrangement, flow rate of plasma gas, etc. of the main body side plasma passage 71, groove 112, nozzle side plasma passage 114, and the like. Is simulated by computer analysis. At this time, in the simulated plasma gas flow, a vortex is generated near the second opening from both ends in the X direction of the six nozzle-side plasma passages 114. Therefore, the tapered surface 120 is formed in the opening of the two nozzle-side plasma passages 114 located second from both ends in the X direction among the six nozzle-side plasma passages 114 to the groove 112. That is, a tapered surface is formed at the opening of the two nozzle-side plasma passages 114, which are symmetrically located second from the center of the six nozzle-side plasma passages 114 in the direction in which they are lined up, into the groove 112. 120 is formed.

As described above, the

tapered surfaces

100 and 120 are formed in the openings of some of the nozzle-

side plasma passages

82 and 114 among the plurality of nozzle-

side plasma passages

82 and 114 for each type of

nozzles

73 and 110. As a result, in each of the plurality of types of

nozzles

73 and 110, it is possible to prevent a decrease in productivity due to the accumulation of foreign matter, and to ensure appropriate plasma treatment.

By the way, the plasma device 10 is an example of a plasma generator. The head main body 31 is an example of the device main body. The reaction chamber 37 is an example of the reaction chamber. The nozzle 73 is an example of a nozzle. The main body side plasma passage 71 is an example of a discharge passage. The groove 81 is an example of a diffusion chamber. The nozzle-side plasma passage 82 is an example of an ejection passage. The tapered surface 100 is an example of a tapered surface. The nozzle 110 is an example of a nozzle. The groove 112 is an example of a diffusion chamber. The nozzle-side plasma passage 114 is an example of an ejection passage. The tapered surface 120 is an example of a tapered surface.

As described above, the above-described embodiment has the following effects.

In the plasma head 11, tapered

surfaces

100 and 120 are formed in the openings of one or more nozzle-

side plasma passages

82 and 114 among the plurality of nozzle-

side plasma passages

82 and 114. As a result, it is possible to reduce the frequency of cleaning the opening of the plasma passage 82 on the nozzle side, and it is possible to suppress a decrease in productivity.

Further, in the plasma head 11, the

tapered surfaces

100 and 120 are not formed on all of the plurality of nozzle-

side plasma passages

82 and 114, and some of the plurality of nozzle-

side plasma passages

82 and 114 are nozzle-side plasma passages.

Tapered surfaces

100 and 120 are formed only on 82 and 114. As a result, the difference in the flow rate of plasma gas between the nozzle-

side plasma passages

82 and 114 of the opening where foreign matter is likely to accumulate and the nozzle-

side plasma passages

82 and 114 of the opening where foreign matter is difficult to accumulate is reduced, and appropriate plasma treatment is performed. It is possible to secure it.

Further, in the plasma head 11, tapered

surfaces

100 and 120 are formed so as to be symmetrically located about the center in the direction in which the plurality of nozzle-

side plasma passages

82 and 114 are arranged. As a result, nozzle clogging can be suitably suppressed in the entire plurality of nozzle-

side plasma passages

82 and 114.

Further, in the plasma head 11, the

nozzles

73 and 110 are relatively immovably mounted on the head main body 31. As a result, the plasma gas can be stably ejected to the object W to be processed. Furthermore, in the plasma head 11, as described above, the heat gas is ejected so as to surround the plasma gas to be ejected. Therefore, by mounting the

nozzles

73 and 110 relatively immovably on the head body 31, the plasma gas can be ejected in a state of being appropriately covered with the heat gas.

Note that the present disclosure is not limited to the above embodiment, and can be implemented in various modes with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the plasma head 11, the

tapered surfaces

100 and 120 are formed only in some of the nozzle-

side plasma passages

82 and 114 among the plurality of nozzle-

side plasma passages

82 and 114.

Tapered surfaces

100 and 120 may be formed on all of the nozzle-

side plasma passages

82 and 114.

Further, in the above embodiment, the groove 81 is adopted as the diffusion chamber, but if it communicates with the plasma passage 71 on the main body side, various things such as a recess, a passage, and a partitioned space can be used as the diffusion chamber. It is possible to adopt it.

Further, in the above embodiment, the main body side plasma passage 71 is formed in the head main body portion 31, and the groove 81 and the nozzle side plasma passage 82 are formed in the nozzle 73, but the main body side plasma is formed in the head main body portion 31. The passage 71 and the groove 81 may be formed, and the nozzle-side plasma passage 82 may be formed in the nozzle 73.

Further, in the above embodiment, the head main body 31 and the nozzle 73 are detachable, but the head main body 31 and the nozzle 73 may be integrally formed. That is, the reaction chamber 37, the main body side plasma passage 71, the groove 81, and the nozzle side plasma passage 82 may be formed inside the integrated apparatus main body.

Further, in the plasma head 11, the flow of plasma gas is simulated, and the nozzle-side plasma passage on which the tapered surface is formed is determined based on the simulated flow of plasma gas, but based on another method. Therefore, the nozzle-side plasma passage in which the tapered surface is formed may be determined. For example, based on an empirical rule, the nozzle-side plasma passage at a position where foreign matter is likely to accumulate may be determined as the nozzle-side plasma passage on which the tapered surface is formed.

10: Plasma device (plasma generator), 31: Head body (device body), 37: Reaction chamber, 71: Main body side plasma passage (discharge passage), 73: Nozzle, 81: Groove (diffusion chamber), 82: Nozzle side plasma passage (spout passage), 100: tapered surface, 110: nozzle, 112: groove (diffusion chamber), 114: nozzle side plasma passage (spout passage), 120: tapered surface

Claims

The main body of the device, which has a reaction chamber for turning the processing gas into plasma,
With at least one discharge passage connected to the reaction chamber,
A diffusion chamber connected to the at least one discharge passage and
A plurality of ejection passages connected to the diffusion chamber, and plasma converted into plasma in the reaction chamber in which a tapered surface is formed at an opening of at least one of the plurality of ejection passages to the diffusion chamber. Multiple ejection passages that eject gas and
A plasma generator equipped with.
The main body of the device, which has a reaction chamber for turning the processing gas into plasma,
A nozzle mounted on the main body of the apparatus and ejecting plasma gas turned into plasma in the reaction chamber,
With
The device body
It has a discharge passage for discharging the plasma gas converted into plasma in the reaction chamber to the outside of the main body of the apparatus.
The nozzle
A diffusion chamber formed so as to cover the opening of the discharge passage to the outer wall surface of the apparatus main body,
A plurality of ejection passages for ejecting plasma gas via the diffusion chamber, and a tapered surface is formed in an opening of one or more of the plurality of ejection passages to the diffusion chamber. Multiple ejection passages that eject plasma gas turned into plasma in the reaction chamber,
Plasma generator with.
No tapered surface is formed in the openings of all the ejection passages of the plurality of ejection passages to the diffusion chamber, and a tapered surface is formed in the openings of some of the plurality of ejection passages to the diffusion chamber. The plasma generator according to claim 2.
A plurality of ejection passages are formed in a row in the nozzle.
The plasma generator according to claim 3, wherein the tapered surfaces are formed so as to be symmetrically positioned with respect to a center in a direction in which the plurality of ejection passages are arranged in a row.
The nozzle
The plasma generator according to any one of claims 2 to 4, which is mounted on the main body of the device so as to be relatively immovable.
The main body of the device, which has a reaction chamber for turning the processing gas into plasma,
A nozzle mounted on the main body of the apparatus and ejecting plasma gas turned into plasma in the reaction chamber,
With
The device body
It has a discharge passage for discharging the plasma gas converted into plasma in the reaction chamber to the outside of the main body of the apparatus.
The nozzle
A diffusion chamber formed so as to cover the opening of the discharge passage to the outer wall surface of the apparatus main body,
A plurality of ejection passages for ejecting plasma gas via the diffusion chamber, and a tapered surface is formed in an opening of one or more of the plurality of ejection passages to the diffusion chamber. Multiple ejection passages that eject plasma gas turned into plasma in the reaction chamber,
In a plasma generator with
A plasma treatment method for irradiating an object to be treated with plasma gas ejected from the plurality of ejection passages.