WO2021075019A1 - Communication device and work machine - Google Patents

Communication device and work machine Download PDF

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Publication number
WO2021075019A1
WO2021075019A1 PCT/JP2019/040835 JP2019040835W WO2021075019A1 WO 2021075019 A1 WO2021075019 A1 WO 2021075019A1 JP 2019040835 W JP2019040835 W JP 2019040835W WO 2021075019 A1 WO2021075019 A1 WO 2021075019A1
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WO
WIPO (PCT)
Prior art keywords
slave
master
information
memory
communication device
Prior art date
Application number
PCT/JP2019/040835
Other languages
French (fr)
Japanese (ja)
Inventor
憲司 渡邉
伸夫 長坂
重典 田中丸
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2019/040835 priority Critical patent/WO2021075019A1/en
Priority to JP2021552056A priority patent/JP7199566B2/en
Publication of WO2021075019A1 publication Critical patent/WO2021075019A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/10Program control for peripheral devices
    • G06F13/12Program control for peripheral devices using hardware independent of the central processor, e.g. channel or peripheral processor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Definitions

  • the present disclosure relates to a communication device that processes control data transmitted from a master in an industrial network, and a working machine provided with the communication device.
  • Patent Document 1 Conventionally, there is a technique for suppressing competition of common buses (for example, Patent Document 1).
  • the bus conflict prevention circuit of Patent Document 1 controls a plurality of three-state buffers connected to one common bus. Each of the three-state buffers is connected to an AND gate and outputs a signal to the common bus based on the signal supplied from the AND gate. An enable signal for the AND gate and an inverted signal of the output of another AND gate are input to the AND gate corresponding to any three-state buffer.
  • the AND gate suppresses the conflict with the common bus of the 3-state buffer by outputting the logical product of the two signals to the status buffer.
  • network communication technology represented by the Internet is also utilized in the FA (Factory Automation) field, and there is what is called an industrial network for the FA field.
  • a network is configured in which a master and slaves controlled by the master are connected. By controlling the slave installed in the device to be controlled by the control data transmitted from the master, it is possible to control the operation of the device.
  • the master acquires information about the slave from the slave's memory when the device is powered on.
  • the master detects the type of slave connected to the industrial network based on the information acquired from the memory. Further, by using the memory for storing slave information for other purposes, the number of memories in the communication device including the slave can be reduced.
  • the memory is shared, a problem is that a plurality of accesses to the memory occur at the same time and a conflict occurs.
  • the present disclosure has been made in view of the above problems, and when slave information relating to a slave is stored in a memory provided in a communication device in an industrial network, competition for access to the memory is suppressed and the slave information is disclosed. It is an object of the present invention to provide a communication device and a working machine that can use a memory in addition to the purpose of storing the information.
  • the present disclosure is based on a slave connected to a master in an industrial network, a memory for storing slave information which is information related to the slave, and control data transmitted from the master.
  • the storage device includes a processing circuit that executes processing and accesses the memory, a storage device that is connected to the slave, the processing circuit, and the memory, and reads and stores the slave information from the memory.
  • a communication device including an access control circuit for transmitting the read slave information to the master via the slave is disclosed. Further, the content of the present disclosure can be implemented not only as a communication device but also as a working machine equipped with a communication device.
  • the access control circuit reads slave information from the memory to the storage device in advance.
  • the access control circuit appropriately transmits the slave information read to the storage device to the master.
  • the slave information is read from the memory in advance so that access conflict does not occur and the memory is accessed by the processing circuit. be able to.
  • FIG. 1 is a plan view showing a schematic configuration of the component mounting system 10 of the present embodiment.
  • FIG. 2 is a perspective view showing a schematic configuration of the component mounting machine 20 and the loader 13.
  • the left-right direction of FIG. 1 will be referred to as the X direction
  • the vertical direction (front-back direction) will be referred to as the Y direction
  • the X direction and the direction perpendicular to the Y direction will be referred to as the Z direction.
  • the component mounting system 10 includes a production line 11, a loader 13, and a management computer 15.
  • the production line 11 has a plurality of component mounting machines 20 arranged in the X direction, and mounts electronic components on the substrate 17.
  • the substrate 17 is carried out from the component mounting machine 20 on the left side shown in FIG. 1 to the component mounting machine 20 on the right side, and electronic components are mounted during the transportation.
  • the component mounting machine 20 includes an apparatus main body portion 21, a substrate transport device 22, a feeder base 23, a head portion 25, and a head moving mechanism 27.
  • the substrate transfer device 22 is provided on the upper portion of the device main body 21, and conveys the substrate 17 in the X direction.
  • the feeder table 23 is provided on the front surface of the device main body 21, and is an L-shaped table when viewed from the side.
  • the feeder base 23 includes slots (not shown) arranged in a plurality of X directions.
  • a feeder 29 for supplying electronic components is mounted in each slot of the feeder base 23.
  • the feeder 29 is, for example, a tape feeder that supplies electronic components from a tape that houses the electronic components at a predetermined pitch.
  • the head portion 25 includes a suction nozzle (not shown) that sucks the electronic component supplied from the feeder 29, and mounts the electronic component sucked by the suction nozzle on the substrate 17.
  • the head moving mechanism 27 moves the head portion 25 to arbitrary positions in the X direction and the Y direction on the apparatus main body portion 21. More specifically, the head moving mechanism 27 includes an X-axis slide mechanism 27A that moves the head portion 25 in the X direction and a Y-axis slide mechanism 27B that moves the head portion 25 in the Y direction.
  • the X-axis slide mechanism 27A is attached to the Y-axis slide mechanism 27B.
  • the Y-axis slide mechanism 27B has a linear motor (not shown) as a drive source.
  • the X-axis slide mechanism 27A moves to an arbitrary position in the Y direction based on the drive of the linear motor of the Y-axis slide mechanism 27B. Further, the X-axis slide mechanism 27A has a linear motor (not shown) as a drive source.
  • the head portion 25 is attached to the X-axis slide mechanism 27A and moves to an arbitrary position in the X direction based on the drive of the linear motor of the X-axis slide mechanism 27A. Therefore, the head portion 25 moves to an arbitrary position on the apparatus main body portion 21 as the X-axis slide mechanism 27A and the Y-axis slide mechanism 27B are driven. Further, the X-axis slide mechanism 27A includes a first slave 51 (see FIG. 3) connected to an industrial network described later.
  • the head portion 25 is attached to the X-axis slide mechanism 27A via a connector and can be attached and detached with one touch, and can be changed to a different type of head portion 25, for example, a dispenser head or the like. Therefore, the head portion 25 of the present embodiment is removable from the device main body portion 21.
  • a mark camera 66 (see FIG. 3) for photographing the substrate 17 is fixed to the head portion 25 in a state of facing downward. The mark camera 66 can take an image of an arbitrary position of the substrate 17 from above as the head portion 25 moves.
  • the image data GD captured by the mark camera 66 is image-processed by the main body control device 41 (see FIG. 3) of the device main body 21.
  • the main body control device 41 acquires information about the substrate 17, an error in the mounting position, and the like by image processing.
  • the head portion 25 includes a second slave 61 (see FIG. 3) connected to an industrial network.
  • the second slave 61 is connected to elements such as various sensors and processes signals input / output to / from the elements.
  • the head portion 25 is provided with a parts camera 67 that captures images of electronic components that are attracted and held by the suction nozzle.
  • the image data GD captured by the parts camera 67 is image-processed by the main body control device 41 (see FIG. 3) of the device main body 21.
  • the main body control device 41 acquires an error in the holding position of the electronic component in the suction nozzle by image processing.
  • an upper guide rail 31, a lower guide rail 33, a rack gear 35, and a non-contact power feeding coil 37 are provided on the front surface of the component mounting machine 20.
  • the upper guide rail 31 is a rail having a U-shaped cross section extending in the X direction, and the opening faces downward.
  • the lower guide rail 33 is a rail having an L-shaped cross section extending in the X direction, a vertical surface is attached to the front surface of the component mounting machine 20, and a horizontal plane extends forward.
  • the rack gear 35 is a gear provided in the lower part of the lower guide rail 33, extending in the X direction, and having a plurality of vertical grooves engraved on the front surface.
  • the upper guide rail 31, lower guide rail 33, and rack gear 35 of the component mounting machine 20 can be detachably connected to the upper guide rail 31, lower guide rail 33, and rack gear 35 of the adjacent component mounting machine 20. Therefore, the component mounting machine 20 can increase or decrease the number of the component mounting machines 20 lined up on the production line 11.
  • the non-contact power feeding coil 37 is a coil provided above the upper guide rail 31 and arranged along the X direction, and supplies electric power to the loader 13.
  • the loader 13 is a device that automatically replenishes and collects the feeder 29 from the component mounting machine 20, and includes a grip portion (not shown) that clamps the feeder 29.
  • the loader 13 is provided with an upper roller (not shown) inserted into the upper guide rail 31 and a lower roller (not shown) inserted into the lower guide rail 33. Further, the loader 13 is provided with a motor as a drive source. A gear that meshes with the rack gear 35 is attached to the output shaft of the motor.
  • the loader 13 includes a power receiving coil that receives power from the non-contact power feeding coil 37 of the component mounting machine 20. The loader 13 supplies the electric power received from the non-contact power feeding coil 37 to the motor.
  • the loader 13 can move in the X direction (left-right direction) by rotating the gear with the motor. Further, the loader 13 can rotate the rollers in the upper guide rail 31 and the lower guide rail 33 and move in the X direction while maintaining the positions in the vertical direction and the front-rear direction.
  • the management computer 15 is a device that comprehensively manages the component mounting system 10. For example, the component mounting machine 20 of the production line 11 starts the electronic component mounting work based on the management of the management computer 15. The component mounting machine 20 performs mounting work of electronic components by the head portion 25 while transporting the substrate 17. The management computer 15 also monitors the number of remaining electronic components in the feeder 29. When the management computer 15 determines that the feeder 29 needs to be replenished, for example, the management computer 15 displays an instruction on the screen for setting the feeder 29 containing the parts type that needs to be replenished in the loader 13. The user confirms the screen and sets the feeder 29 in the loader 13.
  • the management computer 15 When the management computer 15 detects that the desired feeder 29 is set in the loader 13, the management computer 15 instructs the loader 13 to start the replenishment work.
  • the loader 13 moves to the front of the component mounting machine 20 instructed, sandwiches the feeder 29 set by the user with the grip portion, and mounts the feeder 29 in the slot of the feeder base 23.
  • a new feeder 29 is replenished to the component mounting machine 20.
  • the loader 13 holds the feeder 29, which has run out of parts, between the gripping portions and pulls it out from the feeder base 23 to collect it. In this way, the loader 13 can automatically replenish the new feeder 29 and collect the out-of-parts feeder 29.
  • FIG. 3 is a block diagram showing a configuration of a multiplex communication system applied to the component mounting machine 20.
  • the component mounting machine 20 has a device main body 21 fixedly provided at a place where the device is installed and a movable portion (X-axis slide mechanism) that moves relative to the device main body 21.
  • Data transmission between the 27A and the head unit 25) is performed by a multiplex communication system.
  • the configuration of the multiplex communication system shown in FIG. 3 is an example and can be changed as appropriate.
  • the data of each device provided in the Y-axis slide mechanism 27B and the loader 13 may be transmitted by a multiplex communication system.
  • the device main body 21 includes a main body control device 41, a master 43, a first multiprocessing device 45, and the like.
  • the X-axis slide mechanism 27A is provided with a first slave 51 controlled by a master 43 of the apparatus main body 21. Further, the head portion 25 is provided with a second slave 61 controlled by the master 43.
  • the master 43 comprehensively controls the transmission of the control data CD that controls the first slave 51 and the second slave 61 connected to the industrial network.
  • the industrial network is, for example, EtherCAT®.
  • the industrial network of the present disclosure is not limited to EtherCAT (registered trademark), and other networks (communication standards) such as MECHATROLINK (registered trademark) -III and Profinet (registered trademark) can be adopted.
  • the main body control device 41 is, for example, a processing circuit mainly composed of a CPU, and inputs a control data CD collected by the master 43, an image data GD received by the first multiprocessing device 45, and the like to control the next. Determine the content (type of electronic components to be mounted, mounting position, etc.). Further, the main body control device 41 causes the master 43 to transmit a control data CD according to the determined control content. The master 43 transmits the control data CD to the first slave 51 and the second slave 61 via the industrial network.
  • the X-axis slide mechanism 27A has a relay 53 and a sensor 55 in addition to the first slave 51 described above.
  • the first slave 51 processes signals input / output by each device such as the relay 53 and the sensor 55.
  • the relay 53 is, for example, a limit switch that outputs a drive signal for driving the brake of the linear motor of the X-axis slide mechanism 27A.
  • the relay 53 outputs a drive signal to drive the brake, thereby suppressing, for example, overrun of the X-axis slide mechanism 27A.
  • the sensor 55 is, for example, a substrate height sensor that measures the height of the upper surface of the substrate 17 based on the position of the reference height set in the device main body 21.
  • the first slave 51 controls the relay 53 and the like based on the control data CD received from the master 43 of the device main body 21. Further, the first slave 51 processes the output signal of the sensor 55 or the like and transmits the control data CD to the master 43.
  • the head portion 25 has a relay 63, a sensor 65, and the like in addition to the second slave 61, the parts camera 67, and the mark camera 66 described above.
  • the second slave 61 processes signals input / output by each device such as a relay 63 and a sensor 65 provided in the head portion 25.
  • the second slave 61 controls the relay 63 and the like based on the control data CD received from the master 43 of the device main body 21. Further, the second slave 61 transmits an output signal of the sensor 65 or the like to the master 43 as a control data CD.
  • the component mounting machine 20 of the present embodiment executes data transmission between the device main body 21, the X-axis slide mechanism 27A, and the head 25 by multiplex communication.
  • the device main body 21 includes a first multiprocessing device 45 and GbE-PHY 47, 48 in addition to the main body control device 41 and the like described above.
  • GbE-PHY47,48 are, for example, ICs that function as an interface between a logical layer and a physical layer.
  • the GbE-PHY47 is connected to the GbE-PHY59 of the X-axis slide mechanism 27A via a LAN cable 71.
  • the GbE-PHY 48 is connected to the GbE-PHY 69 included in the head portion 25 via the LAN cable 72.
  • the LAN cables 71 and 72 are, for example, LAN cables conforming to the communication standard of Gigabit Ethernet (registered trademark).
  • the first multiplexing processing device 45 of the device main body 21 transmits and receives multiplexed data to and from the second multiplexing processing device 57 of the X-axis slide mechanism 27A through the LAN cable 71. Further, the first multiplexing processing device 45 of the device main body 21 transmits and receives multiplexed data to and from the third multiplexing processing device 68 of the head unit 25 through the LAN cable 72.
  • the first to third multiplexing processing devices 45, 57, 68 multiplex the control data CD of the industrial network, the image data GD of the parts camera 67, and the like by, for example, a time division multiplexing method (TDM: Time Division Multiplexing). Convert and transmit.
  • the first multiprocessing device 45 and the like are composed of, for example, a logic circuit such as a field programmable gate array (FPGA).
  • FPGA field programmable gate array
  • the second multiprocessing device 57 of the X-axis slide mechanism 27A is connected to GbE-PHY59. Further, the second multiprocessing device 57 is connected to the first slave 51 and inputs / outputs a control data CD to / from the first slave 51. The second multiprocessing device 57 multiplexes the control data CD and other data, and transmits the data to the first multiprocessing device 45 (device main body 21) through the LAN cable 71.
  • the third multiprocessing device 68 of the head unit 25 is connected to GbE-PHY69. Further, the third multiprocessing device 68 is connected to the mark camera 66 and the parts camera 67. The mark camera 66 and the parts camera 67 output the captured image data GD to the third multiprocessing device 68 according to an image transmission standard such as GigE-vision (registered trademark). The mark camera 66 and the parts camera 67 take an image in response to receiving a trigger signal from the main body control device 41 of the device main body 21 via multiplex communication, and the captured image data GD is subjected to a third multiplexing processing device, for example. Output to 68.
  • an image transmission standard such as GigE-vision (registered trademark).
  • the mark camera 66 and the parts camera 67 take an image in response to receiving a trigger signal from the main body control device 41 of the device main body 21 via multiplex communication, and the captured image data GD is subjected to a third multiplexing processing device, for example. Output to
  • the third multiprocessing device 68 is connected to the second slave 61, and inputs / outputs the control data CD to / from the second slave 61.
  • the third multiplexing processing device 68 multiplexes various data such as image data GD and control data CD, and transmits the data to the first multiplexing processing device 45 through the LAN cable 72.
  • the first multiprocessing device 45 is connected to GbE-PHY 47, 48. Further, the first multiprocessing device 45 is connected to the main body control device 41.
  • the first multiplexing processing device 45 demultiplexes the multiplexed data received from the second multiplexing processing device 57 and the third multiplexing processing device 68 via multiplex communication. For example, the first multiplexing processing device 45 demultiplexes the multiplexing data received from the third multiplexing processing device 68, and separates the image data GD of the parts camera 67.
  • the first multiprocessing device 45 outputs the separated image data GD to the main body control device 41 in a data format conforming to the GigE-vision (registered trademark) standard.
  • the first multiprocessing device 45 is connected to the master 43.
  • the master 43 constructs an industrial network for transmitting and receiving control data CDs that control devices such as the relay 53, and realizes integration (reduction) of wiring and the like.
  • the control data CD transmitted from the master 43 is, for example, the first multiprocessing device 45, the second multiprocessing device 57, the first slave 51, and the second multiprocessor. It is transmitted so as to circulate in each of the processing device 57, the first multiprocessing device 45, the third multiprocessing device 68, the second slave 61, the third multiprocessing device 68, the first multiprocessing device 45, and the master 43.
  • the first slave 51 reads and writes the control data CD received from the master 43, and transfers the control data CD to the second slave 61 of the head unit 25.
  • the first slave 51 copies data from the read data position for the first slave 51 preset in the control data CD, and drives the relay 53 or the like according to the content of the copied data.
  • the first slave 51 writes information indicating the completion of driving of the relay 53, detection information of the sensor 55, and the like to the writing data position for the first slave 51 preset in the control data CD, and writes the detection information of the sensor 55 to the head portion 25. Forward.
  • the first slave 51 and the second slave 61 exchange and transmit the control data CD at high speed while reading and writing the control data CD.
  • the configuration of the industrial network shown in FIG. 3 is an example and can be changed as appropriate.
  • the second slave 61 may be connected to the master 43 via the first slave 51.
  • the number of slaves controlled by the master 43 may be one or three or more.
  • the first slave 51 of the X-axis slide mechanism 27A has the same configuration as the second slave 61.
  • the head portion 25 is a device that is required to be smaller than the X-axis slide mechanism 27A, and it is more effective to adopt the technique according to the present application. Therefore, in the following description, the configuration of the second slave 61 will be described, and the description of the configuration of the first slave 51 will be omitted as appropriate.
  • FIG. 4 shows a block diagram of the second slave 61.
  • the second slave 61 includes a slave controller 81, a CPU 83, a non-volatile memory 85, an access control circuit 87, and the like.
  • the slave controller 81 is connected to the third multiprocessing device 68 (see FIG. 3) via, for example, a PHY (external IF) that functions as an interface between the logical layer and the physical layer. Further, the slave controller 81 can send and receive a control data CD to and from the master 43 via multiplex communication such as the third multiplexing processing device 68, the LAN cable 72, and the first multiplexing processing device 45.
  • a PHY external IF
  • the slave controller 81 is an IP core used for constructing logic circuits such as a programmable logic device (PLD), a field programmable gate array (FPGA), and a composite programmable logic device (CPLD).
  • the slave controller 81 receives, for example, the control data CD (after being transferred in the order of the master 43 and the first slave 51) from the master 43 via the first slave 51.
  • the slave controller 81 performs read / write processing on the received control data CD.
  • the slave controller 81 copies data from the read data position for the second slave 61 preset in the control data CD, and outputs the copied data to the CPU 83, for example.
  • the CPU 83 is connected to the digital IF 89 and the AD converter 91.
  • the digital IF89 is an interface for inputting / outputting digital signals.
  • the AD converter 91 is an interface that converts an analog signal and a digital signal.
  • the CPU 83 is connected to the relay 63 and the sensor 65 (see FIG. 3) via a digital IF 89, an AD converter 91, or the like.
  • the CPU 83 controls the relay 63 and the like based on the data input from the slave controller 81. Further, the CPU 83 outputs the output signal of the sensor 65 and the like to the slave controller 81.
  • the slave controller 81 writes the data input from the CPU 83 to the write data position for the second slave 61 preset in the control data CD and transfers the data to the master 43.
  • the CPU 83 executes a process related to data input / output to / from the slave controller 81 by executing a predetermined program.
  • the storage device for storing this predetermined program is not particularly limited, but for example, the non-volatile memory 85 may be used.
  • the control by the CPU 83 may be simply described by the device name.
  • the description that "the CPU 83 controls the access control circuit 87” means that "the CPU 83 outputs a command to the access control circuit 87 and controls the access control circuit 87 by executing a predetermined program.” May mean.
  • the non-volatile memory 85 (an example of the memory of the present application) is connected to the access control circuit 87.
  • the non-volatile memory 85 is, for example, an EEPROM.
  • the memory of the present application is not limited to EEPROM, and may be FLASH memory, FRAM (registered trademark), MRAM, or the like.
  • Various data such as slave information 93, operation log 95, and head eigenvalue 96 are stored in the non-volatile memory 85.
  • the slave information 93 is, for example, information indicating what kind of slave the slave controller 81 is, and is EtherCAT (registered trademark) slave information (ESI).
  • the slave information 93 is an eigenvalue for identifying the slave controller 81 and information for detecting the function of the slave controller 81.
  • the content of the slave information 93 is not particularly limited.
  • the slave information 93 may be, for example, address information used for transmission of the control data CD, or information on a device included in the second slave 61 other than the slave controller 81.
  • the slave information 93 includes, for example, information defined by a communication standard of an industrial network, and is changed depending on the type of the communication standard.
  • the operation log 95 stores the operation status of the on-board device on which the second slave 61 is mounted, that is, the head unit 25.
  • the CPU 83 stores, for example, control result information based on the control data CD, operation information of the head unit 25, and the like as an operation log 95.
  • the CPU 83 has, for example, the number of strokes (the number of suctions and attachments) in which the suction nozzle of the head portion 25 is moved in the Z direction, the number of images taken by the parts camera 67 and the mark camera 66, and the number of times the relay 63 is operated.
  • the detected value of the sensor 65 and the like are stored in the operation log 95.
  • the CPU 83 constantly monitors the operation of the head unit 25 and writes the operation log 95 to the non-volatile memory 85 via the access control circuit 87 described later.
  • the mounted device provided with the communication device in the present application is not limited to the head unit 25.
  • the X-axis slide mechanism 27A may be adopted as the mounting device.
  • the CPU 83 of the first slave 51 may store the number of slide movements, the number of accelerations, and the like of the X-axis slide mechanism 27A as the operation log 95.
  • the slave CPU 83 mounted on the board transfer device 22 may store the number of times the board transfer device 22 has conveyed the board 17 as an operation log 95. ..
  • the slave CPU 83 mounted on the loader 13 stores the number of times the feeder 29 is replaced by the loader 13 and the number of times the feeder 29 is moved to each component mounting machine 20 as an operation log 95. You may.
  • the head eigenvalue 96 (an example of the mounted device identification information of the present disclosure) is, for example, information for identifying the mounted device on which the second slave 61 is mounted, that is, the head unit 25. Specifically, it is the serial number, model number, product name, etc. of the head portion 25.
  • the head eigenvalue 96 is written to the non-volatile memory 85 by connecting the setting PC to the second slave 61 at the time of manufacturing the head portion 25, for example.
  • the access control circuit 87 includes a slave IF 101, a memory IF 102, a bus 105, and a RAM 107 (an example of the storage device of the present application).
  • the slave IF 101 is an interface for connecting the RAM 107 to the slave controller 81.
  • the memory IF 102 is an interface for connecting the RAM 107 to the non-volatile memory 85.
  • the slave IF 101 and the memory IF 102 communicate with each other by, for example, a serial bus communication method also referred to as an i-squared sea (Inter-Integrated Circuit, I2C).
  • the bus 105 is an interface for connecting the memory IF 102 and the CPU 83.
  • Bus 105 is, for example, an Avalon® bus.
  • the CPU 83 can read data from the non-volatile memory 85 to the RAM 107 via the bus 105.
  • the CPU 83 outputs a command specifying the address value and data size of the non-volatile memory 85 to the access control circuit 87 via the bus 105.
  • the access control circuit 87 reads, for example, the slave information 93 from the non-volatile memory 85 and stores it in the RAM 107.
  • the access control circuit 87 transmits the slave information 93 stored in the RAM 107 to the master 43 when a command for requesting the slave information 93 is received from the master 43 to the slave controller 81.
  • the storage device for storing the slave information 93 is not limited to a volatile memory such as RAM 107, but may be a non-volatile memory such as EEPROM.
  • FIG. 5 shows an example of processing in the second slave 61.
  • FIG. 6 shows a data flow when the process shown in FIG. 5 is executed.
  • the second slave 61 performs an activation process.
  • the component mounting machine 20 supplies electric power to the device main body 21, the X-axis slide mechanism 27A, the head 25, and the like to start the system.
  • the main body control device 41 executes the establishment of the multiplex communication line shown in FIG. 3 and the like when the system is started.
  • the second slave 61 executes an activation process such as construction of a logic circuit of the slave controller 81.
  • the CPU 83 of the second slave 61 reads a predetermined program from the non-volatile memory 85 or the like and executes it to perform initial setting.
  • the CPU 83 causes the access control circuit 87 to execute a process of reading the slave information 93 from the non-volatile memory 85.
  • the CPU 83 outputs a command specifying an address value or the like of the non-volatile memory 85 to the access control circuit 87.
  • the access control circuit 87 reads the slave information 93 from the non-volatile memory 85 based on the command from the CPU 83, and stores the read slave information 93 in the RAM 107.
  • the second slave 61 processes S15 and S17 in parallel after executing S13.
  • the second slave 61 transmits the slave information 93 stored in the RAM 107 in S13 to the master 43 in response to the request from the master 43.
  • the master 43 starts the process.
  • the master 43 acquires the slave information 93 of each slave via the established multiplex communication line, and starts the construction of the industrial network.
  • the master 43 requests the first slave 51 and the second slave 61 detected on the network to transmit the slave information 93.
  • the method of requesting the slave information 93 from the master 43 to the first slave 51 and the like is not particularly limited.
  • the master 43 may request the slave information 93 by transmitting a control command defined by the communication standard of the industrial network to the first slave 51 or the like.
  • the slave controller 81 of the second slave 61 receives the request for the slave information 93 from the master 43, it reads the slave information 93 from the RAM 107 via the slave IF 101 and transmits the slave information 93 to the master 43 (S15).
  • the master 43 Based on the slave information 93 received from the first slave 51 and the second slave 61, the master 43 detects the type of slave controller 81 connected to the industrial network, the supported communication protocol, and the like, and controls data. Set the destination address of the CD.
  • the access control circuit 87 of the present embodiment receives a request from the master 43 to instruct the second slave 61 to read the slave information 93
  • the access control circuit 87 reads the slave information 93 into the RAM 107 to the second slave. It is transmitted to the master 43 via 61 (S15).
  • the slave information 93 read from the non-volatile memory 85 to the RAM 107 in advance can be transmitted to the master 43 in response to the request from the master 43, that is, at the timing when the master 43 is needed.
  • the second slave 61 executes reading of the head eigenvalue 96 in S17.
  • the master 43 completes the industrial network settings (setting of the destination address of each slave controller 81, etc.) based on the slave information 93
  • the master 43 is equipped with the first slave 51 and the second slave 61. Acquires on-board device identification information that identifies the device.
  • the master 43 requests the first slave 51 and the second slave 61 to transmit the on-board device identification information by the control data CD of the industrial network.
  • the master 43 requests the second slave 61 to transmit the head eigenvalue 96.
  • the slave controller 81 receives the control data CD requesting the head eigenvalue 96
  • the slave controller 81 instructs the CPU 83 to read the head eigenvalue 96 (S17).
  • the CPU 83 outputs a command specifying the address value in which the head eigenvalue 96 in the non-volatile memory 85 is stored and the data size of the head eigenvalue 96 to the access control circuit 87 via the bus 105 (S17).
  • the access control circuit 87 reads the head eigenvalue 96 from the non-volatile memory 85 and outputs it to the CPU 83.
  • the CPU 83 outputs the head eigenvalue 96 received from the access control circuit 87 to the slave controller 81.
  • the slave controller 81 sets the head eigenvalue 96 at the data position for writing the control data CD and transmits it to the master 43 (S17).
  • the master 43 detects, for example, the type and model name of the head unit 25, the communication protocol when a command is transmitted to the head unit 25, and the like based on the head eigenvalue 96 received from the second slave 61, and the head The mounting work can be performed by appropriately controlling the portion 25.
  • the component mounting machine 20 acquires mounting device identification information (head eigenvalue 96, etc.) from the head portion 25 on which the second slave 61 is mounted and the X-axis slide mechanism 27A on which the first slave 51 is mounted, and then mounts the electronic components on the substrate.
  • the mounting work for mounting on 17 is started.
  • the component mounting machine 20 notifies the management computer 15 of the component mounting system 10 that the preparation is completed when the acquisition of the head eigenvalue 96 is completed and the mounting work can be started.
  • the management computer 15 receives the preparation completion notification from each component mounting machine 20 of the production line 11, the management computer 15 transmits control information necessary for the mounting work to the component mounting machine 20 to start the mounting work.
  • the control information referred to here is information on the type of substrate to be produced, information on the type of electronic component, information on the mounting position on which the electronic component is mounted, and the like.
  • the second slave 61 executes S19 after executing S17.
  • the CPU 83 of the first slave 51 and the second slave 61 of each component mounting machine 20 starts the process of storing the operation log 95 in the non-volatile memory 85 when the construction of the industrial network is completed (S19).
  • the CPU 83 stores, for example, the number of times the suction nozzle is stroked in the work of mounting the electronic component, the number of times the image is taken by the mark camera 66, and the like as the operation log 95.
  • the CPU 83 of the first slave 51 stores the number of movements of the X-axis slide mechanism 27A as an operation log 95 in the non-volatile memory 85 of the first slave 51.
  • the CPU 83 of the second slave 61 may store the control contents instructed from the master 43 to the second slave 61 in the operation log 95 using the control data CD. More specifically, the CPU 83 may store the content of the command for driving the relay 63, the time when the command is received, and the execution result in the operation log 95. Further, the CPU 83 may store the detection content and the detection time of the sensor 65 in the operation log 95.
  • the second slave 61 executes S21 after executing S19.
  • the second slave 61 determines whether or not to end the process (S21). For example, in the case of setting to continue the process until the power of the component mounting machine 20 is turned off, the second slave 61 makes a negative determination in S21 until the power of the component mounting machine 20 is turned off (S21: NO), and the process of S19. Is repeated. As a result, the second slave 61 continues to store the operation log 95 when the component mounting machine 20 is in the power-on state.
  • the second slave 61 determines that the power of the component mounting machine 20 has been turned off (S21: YES)
  • the second slave 61 ends the process of S19.
  • the CPU 83 of the present embodiment causes the access control circuit 87 to execute the process (S13) of reading the slave information 93 into the RAM 107, and then data other than the slave information 93 (operation log 95, head).
  • the process of accessing the RAM 107 for the eigenvalue 96) (S17 or S19) is started.
  • the CPU 83 reads the slave information 93 before executing the reading of the data from the non-volatile memory 85 and the writing of the data to the non-volatile memory 85 for the data other than the slave information 93. Let 87 do it.
  • the slave information 93 can be read into the RAM 107 before the access is started, and the contention for access of the non-volatile memory 85 can be suppressed more reliably.
  • the second slave 61 executes S23 after executing S15 in parallel with the above-mentioned processes of S17 and S19.
  • the second slave 61 determines whether or not the slave information 93 is requested to be retransmitted.
  • the slave controller 81 can be hot-connected.
  • the hot connect here is, for example, a function that enables attachment / detachment of a device (for example, a head portion 25) equipped with a slave controller 81 while the system of the component mounting machine 20 is in operation.
  • the topology of the industrial network is changed by attaching / detaching the slave controller 81.
  • the master 43 detects a change in the topology of the industrial network, it reacquires the slave information 93 and reconstructs the industrial network.
  • the second slave 61 determines in S23 whether or not the slave information 93 is requested from the master 43.
  • the head portion 25 is removable from the X-axis slide mechanism 27A. Therefore, if the head portion 25 is attached / detached while the power of the component mounting machine 20 is turned on, the slave information 93 is reacquired. Further, if the X-axis slide mechanism 27A and the first slave 51 are attached / detached, the slave information 93 is reacquired by the attachment / detachment. Further, for example, if one component mounting machine 20 is provided with two head portions 25 (two-head configuration), the slave information 93 is reacquired when one of the two head portions 25 is attached or detached. Will be done. Further, for example, when the loader 13 itself or a part of the loader 13 is replaced with a different type (tray type loader 13 or the like), the slave information 93 is reacquired.
  • the device head portion 25, etc.
  • the device that has been replaced by attachment / detachment starts the process of FIG. 5 after being attached to the component mounting machine 20 and supplied with power, and performs the processes of S11 to S15 described above. It can be executed and the slave information 93 can be transmitted to the master 43 to be activated.
  • the non-detachable (non-replaceable) device is connected from the master 43 to the slave information 93 by disconnecting the other device from the industrial network and reconnecting the device even if the device remains connected to the industrial network. Is required.
  • slave information 93 may be requested when reading the head eigenvalue of S17, writing the operation log 95 of S19, that is, accessing the non-volatile memory 85. There is.
  • FIG. 7 shows the data flow in the configuration of the second slave 121 of the comparative example.
  • the second slave 121 of the comparative example does not include the access control circuit 87.
  • the CPU 83 executes access to the non-volatile memory 85 via the slave controller 81.
  • S31 shown in FIG. 7 a process of requesting slave information 93 from the master 43 to the slave controller 81 occurs.
  • the reading process of the head eigenvalue 96 occurs.
  • the writing process of the operation log 95 occurs.
  • the processing of S33 and the processing of S35 are processing mainly executed by the CPU 83. Therefore, for example, the CPU 83 can exclusively control the processing of S33 and the processing of S35.
  • the process of S31 is a process that the slave controller 81 directly performs to the non-volatile memory 85 based on the request from the master 43. Therefore, the processing of S31 occurs regardless of the processing of S33 and S35, and the slave controller 81 executes the processing regardless of the processing state of the CPU 83.
  • the master 43 may request the slave information 93 from each slave controller 81. As a result, simultaneous access to the non-volatile memory 85 occurs, and access contention occurs. Failure to read the slave information 93, failure to read the head eigenvalue 96, failure to write the operation log 95, and the like occur.
  • the slave information 93 is copied to the RAM 107 in advance at the time of startup (S13). Then, in S23 of FIG. 5, when the slave information 93 is requested from the master 43, the second slave 61 executes S15 again.
  • the slave controller 81 reads the slave information 93 from the RAM 107 of the access control circuit 87 and transmits it to the master 43 (S15). That is, in the transmission of the slave information 93, the access of the non-volatile memory 85 does not occur. Therefore, the CPU 83 can appropriately access the non-volatile memory 85 without causing an access conflict even if the processes of S17 and S19 are executed.
  • the eigenvalue for identifying the slave controller 81 is adopted as the slave information 93.
  • the master 43 can stably read the eigenvalues (slave information 93) of the slave controller 81 from the RAM 107 of the access control circuit 87 when the industrial network is connected.
  • the master 43 can determine the type and function of the slave controller 81 connected to the industrial network based on the eigenvalues, and can appropriately perform the connection with the slave controller 81 and the control of the slave controller 81.
  • the non-volatile memory 85 of the present embodiment stores a head eigenvalue 96 for identifying the head portion 25 on which the second slave 61 is mounted.
  • the CPU 83 reads the head eigenvalue 96 from the non-volatile memory 85 via the access control circuit 87.
  • the CPU 83 transmits the read head eigenvalue 96 to the master 43 via the slave controller 81.
  • the non-volatile memory 85 can be shared not only with the slave information 93 but also with the storage of the head eigenvalue 96 that identifies the head unit 25 on which the second slave 61 is mounted.
  • the CPU 83 can read the head eigenvalue 96 from the non-volatile memory 85 at any time via the access control circuit 87, and the read head eigenvalue 96 can be read. It can be sent to the master 43.
  • the type, function, type of control command, etc. of the head unit 25 can be determined based on the head eigenvalue 96, and the head unit 25 can be appropriately controlled.
  • the CPU 83 of the present embodiment writes the operation log 95 related to the operation of the head unit 25 on which the second slave 61 is mounted to the non-volatile memory 85 via the access control circuit 87 (S19). According to this, the CPU 83 uses the non-volatile memory 85 for storing the operation log 95 of the head unit 25.
  • the CPU 83 can stably write the operation log 95 to the non-volatile memory 85. That is, it is possible to suppress the failure of the writing process of the operation log 95. As a result, the operating status of the head unit 25 can be appropriately recorded in the operation log 95.
  • the second slave 61 of the present embodiment is provided on the head portion 25 that performs the work of mounting the electronic component on the substrate 17.
  • the head portion 25 for mounting the electronic component on the substrate 17 is required to be further miniaturized due to demands such as miniaturization of the electronic component, miniaturization of the component mounting machine 20, and speeding up of the working speed of the head portion 25.
  • the slave information 93 and other information are stored in separate memories, it is not necessary to read the slave information 93 in advance, and access conflict does not occur.
  • an increase in memory leads to an increase in the number of memories themselves and an increase in the number of interfaces connected to the memory. As a result, the size of the second slave 61 is increased.
  • the access control circuit 87 that reads out the slave information 93 in advance is provided to reduce the number of memories and reduce the size of the head unit 25. Can be realized more reliably.
  • the second slave 61 executes S24. Similar to S21, the second slave 61 determines whether or not to end the process (S24). For example, the second slave 61 makes a negative determination in S21 (S24: NO) until the power of the component mounting machine 20 is turned off, and repeatedly executes the process of S23. As a result, the second slave 61 can execute the writing process of the operation log 95 and the retransmission process of the slave information 93 in parallel.
  • the second slave 61 determines that the power of the component mounting machine 20 has been turned off (S24: YES)
  • the second slave 61 ends the process. If the second slave 61 determines affirmatively in both S24 and S21, the process shown in FIG. 5 ends. As a result, it is possible to suppress competition for access to the non-volatile memory 85 when the component mounting machine 20 is in operation.
  • the parts mounting machine 20 is an example of a working machine.
  • the head portion 25 is an example of a mounting device, a mounting head, and a movable portion.
  • the second slave 61 is an example of a communication device.
  • the slave controller 81 is an example of a slave.
  • the CPU 83 is an example of a processing circuit.
  • the non-volatile memory 85 is an example of the memory.
  • the head eigenvalue 96 is an example of the mounted device identification information.
  • the RAM 107 is an example of a storage device.
  • the access control circuit 87 reads the slave information 93 from the non-volatile memory 85 and stores it in the RAM 107 when the second slave 61 is activated (S13).
  • the access control circuit 87 transmits the slave information 93 read to the RAM 107 to the master 43 via the second slave 61 (S15).
  • the non-volatile memory 85 stores the slave information 93 related to the second slave 61 (slave controller 81), and the slave information 93 is accessed from the master 43.
  • the non-volatile memory 85 is also accessed from the CPU 83. That is, the non-volatile memory 85 is shared by the master 43 and the CPU 83.
  • the access control circuit 87 reads the slave information 93 from the non-volatile memory 85 into the RAM 107 in advance. Then, the access control circuit 87 transmits the slave information 93 read into the RAM 107 to the master 43.
  • the slave information 93 is read in advance from the non-volatile memory 85 so that access conflict does not occur and the CPU 83 does not occur.
  • the non-volatile memory 85 can be accessed by the above. Therefore, the non-volatile memory 85 can be used for purposes other than storing the slave information 93 by suppressing the competition for access to the non-volatile memory 85.
  • the mounting device in the present disclosure is not limited to the head portion 25, and an X-axis slide mechanism 27A, a substrate transfer device 22, a feeder 29, and the like can be adopted.
  • the CPU 83 may store the number of times the electronic components are supplied from the feeder 29 as the operation log 95.
  • the slave controller 81 and the access control circuit 87 receive a request from the master 43 to instruct the second slave 61 to read the slave information 93, the slave controller 81 transmits the slave information 93 to the master 43 (S15). ), Not limited to this.
  • the slave controller 81 and the access control circuit 87 may transmit the slave information 93 to the master 43, for example, on condition that the reading of the slave information 93 in S13 is completed. That is, the slave information 93 may be spontaneously transmitted to the master 43 at a predetermined processing timing without requiring a request from the master 43. Also in this case, by reading the slave information 93 into the RAM 107 in advance, the non-volatile memory 85 can be accessed by the CPU 83 without causing an access conflict with the non-volatile memory 85. .. Further, a slave device may be provided in the loader 13 to control the operation of the loader 13. That is, the loader 13 may be connected to the industrial network.
  • the CPU 83 may store the number of times the loader 13 is moved, the number of times the feeder 29 is replaced, and the like in the operation log 95. Further, the component mounting machine 20 may be configured not to include the loader 13. In this case, the feeder 29 may be replaced manually by the worker. Further, the CPU 83 may be configured to execute at least one of reading the head eigenvalue 96 and writing the operation log 95. Further, the CPU 83 may use the non-volatile memory 85 for purposes other than reading the head eigenvalue 96 and writing the operation log 95. For example, the CPU 83 may write the history of errors and warnings to the non-volatile memory 85.
  • the CPU 83 executes the process of reading the slave information 93 (S13) before the processes of S17 and S19, but the present invention is not limited to this.
  • the CPU 83 may execute a process of reading the slave information 93 into the RAM 107 after reading the head eigenvalue 96.
  • the head portion 25 may be configured so as not to be detached from the device main body portion 21.
  • the operation log 95 may be written and the head eigenvalue 96 may be read by a device other than the CPU 83, for example, the slave controller 81.
  • the multiplex communication line is not limited to Gigabit Ethernet (registered trademark), and may be, for example, optical communication using an optical fiber cable.
  • the multiplex communication line is not limited to wired communication but may be wireless communication. Further, the component mounting machine 20 does not have to be provided with the multiplex communication system. In this case, the master 43 may send and receive the control data CD between the first slave 51 and the like without going through the multiplex communication line.
  • the working machine in the present disclosure is not limited to the component mounting machine 20, and other working machines such as a solder printing device for applying solder to the substrate 17 can be adopted. Further, the working machine may be, for example, a machine tool or a robot that performs assembly work.
  • 17 board 20 parts mounting machine (working machine), 21 device body, 25 head (mounting device, mounting head, movable part), 43 master, 51 first slave (communication device), 61 second slave (communication device) ), 81 Slave controller (slave), 83 CPU (processing circuit), 85 non-volatile memory (memory), 93 slave information, 96 head unique value (mounted device identification information), 107 RAM (storage device), CD control data.

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Abstract

Provided are a communication device and a work machine, which suppress competition for access to a memory and with which it is possible to use the memory for a purpose other than to store slave information. This communication device comprises: a slave which is connected to a master in an industrial network; a memory which stores slave information, which is information relating to the slave; a processing circuit which performs processing based on control data transmitted from the master and accesses the memory; and an access control circuit which is connected to the slave, the processing circuit and the memory, said access control circuit comprising a storage device that reads out the slave information from the memory and stores the same, and transmitting the slave information read out to the storage device to the master via the slave.

Description

通信装置、及び作業機Communication equipment and work equipment
 本開示は、産業用ネットワークにおけるマスターから伝送される制御データを処理する通信装置、及びその通信装置を備える作業機に関するものである。 The present disclosure relates to a communication device that processes control data transmitted from a master in an industrial network, and a working machine provided with the communication device.
 従来、共通バスの競合を抑制する技術がある(例えば、特許文献1など)。特許文献1のバス競合防止回路は、1つの共通バスに接続された複数の3ステートバッファの制御を行なっている。各3ステートバッファは、ANDゲートに接続され、ANDゲートから信号が供給されることに基づいて、共通バスへの信号出力を行なう。任意の3ステートバッファに対応するANDゲートには、そのANDゲートに対するイネイブル信号と、別のANDゲートの出力の反転信号が入力される。ANDゲートは、2つの信号の論理積をステータスバッファに出力することで、3ステートバッファの共通バスに対する競合を抑制している。 Conventionally, there is a technique for suppressing competition of common buses (for example, Patent Document 1). The bus conflict prevention circuit of Patent Document 1 controls a plurality of three-state buffers connected to one common bus. Each of the three-state buffers is connected to an AND gate and outputs a signal to the common bus based on the signal supplied from the AND gate. An enable signal for the AND gate and an inverted signal of the output of another AND gate are input to the AND gate corresponding to any three-state buffer. The AND gate suppresses the conflict with the common bus of the 3-state buffer by outputting the logical product of the two signals to the status buffer.
特開2000-56874号公報Japanese Unexamined Patent Publication No. 2000-56874
 ところで、インターネットに代表されるネットワーク通信の技術は、FA(Factory Automation)分野にも活用されており、FA分野を対象とした産業用ネットワークと呼ばれるものがある。例えば、産業用ネットワークでは、マスターと、そのマスターによって制御されるスレーブとを接続したネットワークを構成する。マスターから送信した制御データによって、制御対象の装置内に取り付けたスレーブを制御することで、その装置の作動を制御することが可能となる。 By the way, network communication technology represented by the Internet is also utilized in the FA (Factory Automation) field, and there is what is called an industrial network for the FA field. For example, in an industrial network, a network is configured in which a master and slaves controlled by the master are connected. By controlling the slave installed in the device to be controlled by the control data transmitted from the master, it is possible to control the operation of the device.
 この種の産業用ネットワークでは、例えば、マスターは、装置の電源オン時に、スレーブのメモリからスレーブに関する情報を取得する。マスターは、メモリから取得した情報に基づいて、産業用ネットワークに接続されたスレーブの種類などを検出する。また、スレーブ情報を記憶するメモリを、他の用途にも使用することで、スレーブを備える通信装置内のメモリ数を減らすことができる。一方で、メモリを共用化する場合、メモリに対する複数のアクセスが同時に発生し、競合が発生することが問題となる。 In this type of industrial network, for example, the master acquires information about the slave from the slave's memory when the device is powered on. The master detects the type of slave connected to the industrial network based on the information acquired from the memory. Further, by using the memory for storing slave information for other purposes, the number of memories in the communication device including the slave can be reduced. On the other hand, when the memory is shared, a problem is that a plurality of accesses to the memory occur at the same time and a conflict occurs.
 本開示は、上記の課題に鑑みてなされたものであり、産業用ネットワークにおける通信装置が備えるメモリにスレーブに係わるスレーブ情報が記憶されている場合に、メモリに対するアクセスの競合を抑制し、スレーブ情報を記憶する用途以外にもメモリを使用できる通信装置、及び作業機を提供することを目的とする。 The present disclosure has been made in view of the above problems, and when slave information relating to a slave is stored in a memory provided in a communication device in an industrial network, competition for access to the memory is suppressed and the slave information is disclosed. It is an object of the present invention to provide a communication device and a working machine that can use a memory in addition to the purpose of storing the information.
 上記課題を解決するために、本開示は、産業用ネットワークにおけるマスターと接続されるスレーブと、前記スレーブに係わる情報であるスレーブ情報を記憶するメモリと、前記マスターから伝送される制御データに基づいた処理を実行し、前記メモリに対するアクセスを実行する処理回路と、前記スレーブ、前記処理回路、及び前記メモリに接続され、前記メモリから前記スレーブ情報を読み出して記憶する記憶装置を備え、前記記憶装置へ読み出した前記スレーブ情報を、前記スレーブを介して前記マスターへ送信するアクセス制御回路と、を備える、通信装置を開示する。
 また、本開示の内容は、通信装置としての実施だけでなく、通信装置を備える作業機としても実施し得るものである。
In order to solve the above problems, the present disclosure is based on a slave connected to a master in an industrial network, a memory for storing slave information which is information related to the slave, and control data transmitted from the master. The storage device includes a processing circuit that executes processing and accesses the memory, a storage device that is connected to the slave, the processing circuit, and the memory, and reads and stores the slave information from the memory. A communication device including an access control circuit for transmitting the read slave information to the master via the slave is disclosed.
Further, the content of the present disclosure can be implemented not only as a communication device but also as a working machine equipped with a communication device.
 本開示の通信装置、作業機によれば、アクセス制御回路は、メモリから記憶装置へスレーブ情報を予め読み出しておく。アクセス制御回路は、記憶装置へ読み出しておいたスレーブ情報を適宜マスターへ送信する。これにより、スレーブ情報の読み出しと、処理回路からメモリへのアクセスが同時に発生したとしても、スレーブ情報をメモリから予め読み出しておくことでアクセスの競合が発生せず、処理回路によるメモリのアクセスを行なうことができる。 According to the communication device and the working machine of the present disclosure, the access control circuit reads slave information from the memory to the storage device in advance. The access control circuit appropriately transmits the slave information read to the storage device to the master. As a result, even if the slave information is read and the memory is accessed from the processing circuit at the same time, the slave information is read from the memory in advance so that access conflict does not occur and the memory is accessed by the processing circuit. be able to.
本実施形態の部品装着システムの概略構成を示す平面図である。It is a top view which shows the schematic structure of the component mounting system of this embodiment. 部品装着機及びローダの概略構成を示す斜視図である。It is a perspective view which shows the schematic structure of the component mounting machine and a loader. 多重通信システムのブロック図である。It is a block diagram of a multiplex communication system. 第2スレーブのブロック図である。It is a block diagram of a second slave. 第2スレーブの処理内容を説明するためのフローチャートである。It is a flowchart for demonstrating the processing content of the 2nd slave. 図5における処理を実行した場合のデータの流れを示す図である。It is a figure which shows the flow of data when the process of FIG. 5 is executed. 比較例の第2スレーブにおけるデータの流れを示す図である。It is a figure which shows the data flow in the 2nd slave of the comparative example.
 以下、本開示の一実施形態について図面を参照しながら説明する。図1は、本実施形態の部品装着システム10の概略構成を示す平面図である。図2は、部品装着機20及びローダ13の概略構成を示す斜視図である。なお、以下の説明では、図1の左右方向をX方向と称し、上下方向(前後方向)をY方向と称し、X方向及びY方向に垂直な方向をZ方向と称して説明する。 Hereinafter, one embodiment of the present disclosure will be described with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of the component mounting system 10 of the present embodiment. FIG. 2 is a perspective view showing a schematic configuration of the component mounting machine 20 and the loader 13. In the following description, the left-right direction of FIG. 1 will be referred to as the X direction, the vertical direction (front-back direction) will be referred to as the Y direction, and the X direction and the direction perpendicular to the Y direction will be referred to as the Z direction.
 図1に示すように、部品装着システム10は、生産ライン11と、ローダ13と、管理コンピュータ15とを備えている。生産ライン11は、X方向に並べられた複数の部品装着機20を有し、基板17に対する電子部品の装着等を行う。基板17は、例えば、図1に示す左側の部品装着機20から右側の部品装着機20へと搬出され、搬送中に電子部品の装着等を実行される。 As shown in FIG. 1, the component mounting system 10 includes a production line 11, a loader 13, and a management computer 15. The production line 11 has a plurality of component mounting machines 20 arranged in the X direction, and mounts electronic components on the substrate 17. For example, the substrate 17 is carried out from the component mounting machine 20 on the left side shown in FIG. 1 to the component mounting machine 20 on the right side, and electronic components are mounted during the transportation.
 図2に示すように、部品装着機20は、装置本体部21と、基板搬送装置22と、フィーダ台23と、ヘッド部25と、ヘッド移動機構27とを備える。基板搬送装置22は、装置本体部21の上部に設けられ、基板17をX方向に搬送する。フィーダ台23は、装置本体部21の前面に設けられ、側面視がL字状の台である。フィーダ台23は、X方向に複数配列されたスロット(図示略)を備える。フィーダ台23の各スロットには、電子部品を供給するフィーダ29が装着される。フィーダ29は、例えば、電子部品を所定のピッチで収容するテープから電子部品を供給するテープフィーダである。 As shown in FIG. 2, the component mounting machine 20 includes an apparatus main body portion 21, a substrate transport device 22, a feeder base 23, a head portion 25, and a head moving mechanism 27. The substrate transfer device 22 is provided on the upper portion of the device main body 21, and conveys the substrate 17 in the X direction. The feeder table 23 is provided on the front surface of the device main body 21, and is an L-shaped table when viewed from the side. The feeder base 23 includes slots (not shown) arranged in a plurality of X directions. A feeder 29 for supplying electronic components is mounted in each slot of the feeder base 23. The feeder 29 is, for example, a tape feeder that supplies electronic components from a tape that houses the electronic components at a predetermined pitch.
 ヘッド部25は、フィーダ29から供給された電子部品を吸着する吸着ノズル(図示略)を備え、吸着ノズルで吸着した電子部品を基板17に装着する。ヘッド移動機構27は、装置本体部21上において、X方向及びY方向の任意の位置にヘッド部25を移動させる。詳述すると、ヘッド移動機構27は、ヘッド部25をX方向に移動させるX軸スライド機構27Aと、ヘッド部25をY方向に移動させるY軸スライド機構27Bとを備える。X軸スライド機構27Aは、Y軸スライド機構27Bに取り付けられている。Y軸スライド機構27Bは、駆動源としてリニアモータ(図示略)を有している。X軸スライド機構27Aは、Y軸スライド機構27Bのリニアモータの駆動に基づいてY方向の任意の位置に移動する。また、X軸スライド機構27Aは、駆動源としてリニアモータ(図示略)を有している。ヘッド部25は、X軸スライド機構27Aに取り付けられ、X軸スライド機構27Aのリニアモータの駆動に基づいてX方向の任意の位置に移動する。従って、ヘッド部25は、X軸スライド機構27A及びY軸スライド機構27Bの駆動にともなって装置本体部21上の任意の位置に移動する。また、X軸スライド機構27Aは、後述する産業用ネットワークに接続される第1スレーブ51(図3参照)を備える。 The head portion 25 includes a suction nozzle (not shown) that sucks the electronic component supplied from the feeder 29, and mounts the electronic component sucked by the suction nozzle on the substrate 17. The head moving mechanism 27 moves the head portion 25 to arbitrary positions in the X direction and the Y direction on the apparatus main body portion 21. More specifically, the head moving mechanism 27 includes an X-axis slide mechanism 27A that moves the head portion 25 in the X direction and a Y-axis slide mechanism 27B that moves the head portion 25 in the Y direction. The X-axis slide mechanism 27A is attached to the Y-axis slide mechanism 27B. The Y-axis slide mechanism 27B has a linear motor (not shown) as a drive source. The X-axis slide mechanism 27A moves to an arbitrary position in the Y direction based on the drive of the linear motor of the Y-axis slide mechanism 27B. Further, the X-axis slide mechanism 27A has a linear motor (not shown) as a drive source. The head portion 25 is attached to the X-axis slide mechanism 27A and moves to an arbitrary position in the X direction based on the drive of the linear motor of the X-axis slide mechanism 27A. Therefore, the head portion 25 moves to an arbitrary position on the apparatus main body portion 21 as the X-axis slide mechanism 27A and the Y-axis slide mechanism 27B are driven. Further, the X-axis slide mechanism 27A includes a first slave 51 (see FIG. 3) connected to an industrial network described later.
 また、ヘッド部25は、X軸スライド機構27Aにコネクタを介して取り付けられ、ワンタッチで着脱可能であり、種類の異なるヘッド部25、例えば、ディスペンサヘッド等に変更できる。従って、本実施形態のヘッド部25は、装置本体部21に対して着脱可能となっている。また、ヘッド部25には、基板17を撮影するためのマークカメラ66(図3参照)が下方を向いた状態で固定されている。マークカメラ66は、ヘッド部25の移動に伴って、基板17の任意の位置を上方から撮像可能となっている。マークカメラ66が撮像した画像データGDは、装置本体部21の本体制御装置41(図3参照)において画像処理される。本体制御装置41は、画像処理によって、基板17に関する情報、装着位置の誤差等を取得する。 Further, the head portion 25 is attached to the X-axis slide mechanism 27A via a connector and can be attached and detached with one touch, and can be changed to a different type of head portion 25, for example, a dispenser head or the like. Therefore, the head portion 25 of the present embodiment is removable from the device main body portion 21. Further, a mark camera 66 (see FIG. 3) for photographing the substrate 17 is fixed to the head portion 25 in a state of facing downward. The mark camera 66 can take an image of an arbitrary position of the substrate 17 from above as the head portion 25 moves. The image data GD captured by the mark camera 66 is image-processed by the main body control device 41 (see FIG. 3) of the device main body 21. The main body control device 41 acquires information about the substrate 17, an error in the mounting position, and the like by image processing.
 また、ヘッド部25は、産業用ネットワークに接続される第2スレーブ61(図3参照)を備える。第2スレーブ61は、各種のセンサなどの素子が接続され、素子に入出力される信号を処理する。また、ヘッド部25には、吸着ノズルに吸着保持した電子部品を撮像するパーツカメラ67が設けられている。パーツカメラ67が撮像した画像データGDは、装置本体部21の本体制御装置41(図3参照)において画像処理される。本体制御装置41は、画像処理によって、吸着ノズルにおける電子部品の保持位置の誤差等を取得する。 Further, the head portion 25 includes a second slave 61 (see FIG. 3) connected to an industrial network. The second slave 61 is connected to elements such as various sensors and processes signals input / output to / from the elements. Further, the head portion 25 is provided with a parts camera 67 that captures images of electronic components that are attracted and held by the suction nozzle. The image data GD captured by the parts camera 67 is image-processed by the main body control device 41 (see FIG. 3) of the device main body 21. The main body control device 41 acquires an error in the holding position of the electronic component in the suction nozzle by image processing.
 また、図2に示すように、部品装着機20の前面には、上部ガイドレール31と、下部ガイドレール33と、ラックギヤ35と、非接触給電コイル37とが設けられている。上部ガイドレール31は、X方向に延びる断面U字状のレールであり、開口部が下を向いている。下部ガイドレール33は、X方向に延びる断面L字状のレールであり、垂直面が部品装着機20の前面に取り付けられ、水平面が前方に伸び出している。ラックギヤ35は、下部ガイドレール33の下部に設けられ、X方向に延び、前面に複数の縦溝が刻まれたギヤである。部品装着機20の上部ガイドレール31、下部ガイドレール33及びラックギヤ35は、隣接する部品装着機20の上部ガイドレール31、下部ガイドレール33及びラックギヤ35と着脱可能に連結することができる。このため、部品装着機20は、生産ライン11に並んだ部品装着機20の数を増減することができる。非接触給電コイル37は、上部ガイドレール31の上部に設けられ、X方向に沿って配置されたコイルであり、ローダ13への電力の供給を行う。 Further, as shown in FIG. 2, an upper guide rail 31, a lower guide rail 33, a rack gear 35, and a non-contact power feeding coil 37 are provided on the front surface of the component mounting machine 20. The upper guide rail 31 is a rail having a U-shaped cross section extending in the X direction, and the opening faces downward. The lower guide rail 33 is a rail having an L-shaped cross section extending in the X direction, a vertical surface is attached to the front surface of the component mounting machine 20, and a horizontal plane extends forward. The rack gear 35 is a gear provided in the lower part of the lower guide rail 33, extending in the X direction, and having a plurality of vertical grooves engraved on the front surface. The upper guide rail 31, lower guide rail 33, and rack gear 35 of the component mounting machine 20 can be detachably connected to the upper guide rail 31, lower guide rail 33, and rack gear 35 of the adjacent component mounting machine 20. Therefore, the component mounting machine 20 can increase or decrease the number of the component mounting machines 20 lined up on the production line 11. The non-contact power feeding coil 37 is a coil provided above the upper guide rail 31 and arranged along the X direction, and supplies electric power to the loader 13.
 ローダ13は、部品装着機20に対するフィーダ29の補充及び回収を自動で行う装置であり、フィーダ29をクランプする把持部(図示略)を備える。ローダ13には、上部ガイドレール31に挿入される上部ローラ(図示略)と、下部ガイドレール33に挿入される下部ローラ(図示略)とが設けられている。また、ローダ13には、駆動源としてモータが設けられている。モータの出力軸には、ラックギヤ35と噛み合うギヤが取り付けられている。ローダ13は、部品装着機20の非接触給電コイル37から電力の供給を受ける受電コイルを備えている。ローダ13は、非接触給電コイル37から受電した電力をモータに供給する。これにより、ローダ13は、モータによってギヤを回転させることで、X方向(左右方向)へ移動することができる。また、ローダ13は、上部ガイドレール31及び下部ガイドレール33内でローラを回転させ、上下方向や前後方向の位置を保持しながらX方向へ移動することができる。 The loader 13 is a device that automatically replenishes and collects the feeder 29 from the component mounting machine 20, and includes a grip portion (not shown) that clamps the feeder 29. The loader 13 is provided with an upper roller (not shown) inserted into the upper guide rail 31 and a lower roller (not shown) inserted into the lower guide rail 33. Further, the loader 13 is provided with a motor as a drive source. A gear that meshes with the rack gear 35 is attached to the output shaft of the motor. The loader 13 includes a power receiving coil that receives power from the non-contact power feeding coil 37 of the component mounting machine 20. The loader 13 supplies the electric power received from the non-contact power feeding coil 37 to the motor. As a result, the loader 13 can move in the X direction (left-right direction) by rotating the gear with the motor. Further, the loader 13 can rotate the rollers in the upper guide rail 31 and the lower guide rail 33 and move in the X direction while maintaining the positions in the vertical direction and the front-rear direction.
 管理コンピュータ15は、部品装着システム10を統括的に管理する装置である。例えば、生産ライン11の部品装着機20は、管理コンピュータ15の管理に基づいて、電子部品の装着作業を開始する。部品装着機20は、基板17を搬送しながらヘッド部25によって電子部品の装着作業を行う。また、管理コンピュータ15は、フィーダ29の残りの電子部品の数を監視する。管理コンピュータ15は、例えば、フィーダ29の補給が必要であると判断すると、補給が必要な部品種を収容したフィーダ29をローダ13にセットする指示を画面に表示する。ユーザは、画面を確認して、フィーダ29をローダ13にセットする。管理コンピュータ15は、所望のフィーダ29がローダ13にセットされたことを検出すると、ローダ13に対して補給作業の開始を指示する。ローダ13は、指示を受けた部品装着機20の前方まで移動し、ユーザによってセットされたフィーダ29を把持部で挟持してフィーダ台23のスロットに装着する。これにより、新たなフィーダ29が部品装着機20に補給される。また、ローダ13は、部品切れになったフィーダ29を把持部で挟持してフィーダ台23から引き出して回収する。このようにして、新たなフィーダ29の補給及び部品切れとなったフィーダ29の回収を、ローダ13によって自動的行うことができる。 The management computer 15 is a device that comprehensively manages the component mounting system 10. For example, the component mounting machine 20 of the production line 11 starts the electronic component mounting work based on the management of the management computer 15. The component mounting machine 20 performs mounting work of electronic components by the head portion 25 while transporting the substrate 17. The management computer 15 also monitors the number of remaining electronic components in the feeder 29. When the management computer 15 determines that the feeder 29 needs to be replenished, for example, the management computer 15 displays an instruction on the screen for setting the feeder 29 containing the parts type that needs to be replenished in the loader 13. The user confirms the screen and sets the feeder 29 in the loader 13. When the management computer 15 detects that the desired feeder 29 is set in the loader 13, the management computer 15 instructs the loader 13 to start the replenishment work. The loader 13 moves to the front of the component mounting machine 20 instructed, sandwiches the feeder 29 set by the user with the grip portion, and mounts the feeder 29 in the slot of the feeder base 23. As a result, a new feeder 29 is replenished to the component mounting machine 20. Further, the loader 13 holds the feeder 29, which has run out of parts, between the gripping portions and pulls it out from the feeder base 23 to collect it. In this way, the loader 13 can automatically replenish the new feeder 29 and collect the out-of-parts feeder 29.
 次に、部品装着機20が備える多重通信システムについて説明する。図3は、部品装着機20に適用される多重通信システムの構成を示すブロック図である。図3に示すように、部品装着機20は、当該装置を設置する場所に固定的に設けられる装置本体部21と、装置本体部21に対して相対的に移動する可動部(X軸スライド機構27A及びヘッド部25)との間のデータ伝送が多重通信システムによって行われる。尚、図3に示す多重通信システムの構成は、一例であり適宜変更可能である。例えば、Y軸スライド機構27Bやローダ13に設けられた各装置のデータを、多重通信システムにより伝送しても良い。 Next, the multiplex communication system included in the component mounting machine 20 will be described. FIG. 3 is a block diagram showing a configuration of a multiplex communication system applied to the component mounting machine 20. As shown in FIG. 3, the component mounting machine 20 has a device main body 21 fixedly provided at a place where the device is installed and a movable portion (X-axis slide mechanism) that moves relative to the device main body 21. Data transmission between the 27A and the head unit 25) is performed by a multiplex communication system. The configuration of the multiplex communication system shown in FIG. 3 is an example and can be changed as appropriate. For example, the data of each device provided in the Y-axis slide mechanism 27B and the loader 13 may be transmitted by a multiplex communication system.
 装置本体部21は、本体制御装置41と、マスター43と、第1多重処理装置45等を有している。X軸スライド機構27Aには、装置本体部21のマスター43によって制御される第1スレーブ51が設けられている。また、ヘッド部25には、マスター43によって制御される第2スレーブ61が設けられている。マスター43は、産業用ネットワークに接続される第1スレーブ51及び第2スレーブ61を制御する制御データCDの伝送を統括的に制御する。産業用ネットワークは、例えば、EtherCAT(登録商標)である。なお、本開示の産業用ネットワークとしては、EtherCAT(登録商標)に限らず、例えば、MECHATROLINK(登録商標)-IIIやProfinet(登録商標)等の他のネットワーク(通信規格)を採用できる。 The device main body 21 includes a main body control device 41, a master 43, a first multiprocessing device 45, and the like. The X-axis slide mechanism 27A is provided with a first slave 51 controlled by a master 43 of the apparatus main body 21. Further, the head portion 25 is provided with a second slave 61 controlled by the master 43. The master 43 comprehensively controls the transmission of the control data CD that controls the first slave 51 and the second slave 61 connected to the industrial network. The industrial network is, for example, EtherCAT®. The industrial network of the present disclosure is not limited to EtherCAT (registered trademark), and other networks (communication standards) such as MECHATROLINK (registered trademark) -III and Profinet (registered trademark) can be adopted.
 本体制御装置41は、例えば、CPUを主体として構成される処理回路であり、マスター43によって収集した制御データCDや、第1多重処理装置45で受信した画像データGD等を入力し、次の制御内容(装着する電子部品の種類や装着位置など)を決定する。また、本体制御装置41は、決定した制御内容に応じた制御データCDをマスター43から送信させる。マスター43は、産業用ネットワークを介して第1スレーブ51及び第2スレーブ61へ制御データCDを送信する。 The main body control device 41 is, for example, a processing circuit mainly composed of a CPU, and inputs a control data CD collected by the master 43, an image data GD received by the first multiprocessing device 45, and the like to control the next. Determine the content (type of electronic components to be mounted, mounting position, etc.). Further, the main body control device 41 causes the master 43 to transmit a control data CD according to the determined control content. The master 43 transmits the control data CD to the first slave 51 and the second slave 61 via the industrial network.
 X軸スライド機構27Aは、上記した第1スレーブ51の他に、リレー53やセンサ55を有している。第1スレーブ51は、リレー53やセンサ55などの各装置で入出力される信号を処理する。リレー53は、例えば、X軸スライド機構27Aのリニアモータのブレーキを駆動する駆動信号を出力するリミットスイッチである。リレー53は、駆動信号を出力してブレーキを駆動することで、例えば、X軸スライド機構27Aのオーバーランを抑制する。センサ55は、例えば、装置本体部21に設定された基準高さの位置に基づいて、基板17の上面の高さを計測する基板高さセンサである。第1スレーブ51は、装置本体部21のマスター43から受信した制御データCDに基づいてリレー53等を制御する。また、第1スレーブ51は、センサ55等の出力信号を処理して制御データCDとしてマスター43に向けて送信する。 The X-axis slide mechanism 27A has a relay 53 and a sensor 55 in addition to the first slave 51 described above. The first slave 51 processes signals input / output by each device such as the relay 53 and the sensor 55. The relay 53 is, for example, a limit switch that outputs a drive signal for driving the brake of the linear motor of the X-axis slide mechanism 27A. The relay 53 outputs a drive signal to drive the brake, thereby suppressing, for example, overrun of the X-axis slide mechanism 27A. The sensor 55 is, for example, a substrate height sensor that measures the height of the upper surface of the substrate 17 based on the position of the reference height set in the device main body 21. The first slave 51 controls the relay 53 and the like based on the control data CD received from the master 43 of the device main body 21. Further, the first slave 51 processes the output signal of the sensor 55 or the like and transmits the control data CD to the master 43.
 ヘッド部25は、上記した第2スレーブ61、パーツカメラ67、マークカメラ66の他に、リレー63、センサ65等を有している。第2スレーブ61は、ヘッド部25に設けられたリレー63やセンサ65等の各装置で入出力される信号を処理する。第2スレーブ61は、装置本体部21のマスター43から受信した制御データCDに基づいてリレー63等を制御する。また、第2スレーブ61は、センサ65等の出力信号を、制御データCDとしてマスター43に向けて送信する。 The head portion 25 has a relay 63, a sensor 65, and the like in addition to the second slave 61, the parts camera 67, and the mark camera 66 described above. The second slave 61 processes signals input / output by each device such as a relay 63 and a sensor 65 provided in the head portion 25. The second slave 61 controls the relay 63 and the like based on the control data CD received from the master 43 of the device main body 21. Further, the second slave 61 transmits an output signal of the sensor 65 or the like to the master 43 as a control data CD.
 次に、上記した産業用ネットワークの制御データCDやパーツカメラ67等の画像データGDを伝送する多重通信について説明する。本実施形態の部品装着機20は、装置本体部21、X軸スライド機構27A及びヘッド部25の間のデータ伝送を多重通信によって実行する。図3に示すように、装置本体部21は、上記した本体制御装置41などの他に、第1多重処理装置45と、GbE-PHY47,48とを有する。GbE-PHY47,48は、例えば、論理層と物理層のインタフェースとして機能するICである。GbE-PHY47は、X軸スライド機構27Aが有するGbE-PHY59と、LANケーブル71を介して接続されている。同様に、GbE-PHY48は、ヘッド部25が有するGbE-PHY69と、LANケーブル72を介して接続されている。LANケーブル71,72は、例えば、Gigabit Ethernet(登録商標)の通信規格に準拠したLANケーブルである。 Next, the multiplex communication for transmitting the control data CD of the industrial network and the image data GD of the parts camera 67 and the like described above will be described. The component mounting machine 20 of the present embodiment executes data transmission between the device main body 21, the X-axis slide mechanism 27A, and the head 25 by multiplex communication. As shown in FIG. 3, the device main body 21 includes a first multiprocessing device 45 and GbE- PHY 47, 48 in addition to the main body control device 41 and the like described above. GbE-PHY47,48 are, for example, ICs that function as an interface between a logical layer and a physical layer. The GbE-PHY47 is connected to the GbE-PHY59 of the X-axis slide mechanism 27A via a LAN cable 71. Similarly, the GbE-PHY 48 is connected to the GbE-PHY 69 included in the head portion 25 via the LAN cable 72. The LAN cables 71 and 72 are, for example, LAN cables conforming to the communication standard of Gigabit Ethernet (registered trademark).
 装置本体部21の第1多重処理装置45は、LANケーブル71を通じて、X軸スライド機構27Aの第2多重処理装置57との間で多重化データを送受信する。また、装置本体部21の第1多重処理装置45は、LANケーブル72を通じて、ヘッド部25の第3多重処理装置68との間で多重化データを送受信する。第1~第3多重処理装置45,57,68は、産業用ネットワークの制御データCDや、パーツカメラ67の画像データGD等を、例えば、時分割多重化方式(TDM:Time Division Multiplexing)で多重化して伝送する。第1多重処理装置45等は、例えば、フィールドプログラマブルゲートアレイ(FPGA)などの論理回路で構成されている。 The first multiplexing processing device 45 of the device main body 21 transmits and receives multiplexed data to and from the second multiplexing processing device 57 of the X-axis slide mechanism 27A through the LAN cable 71. Further, the first multiplexing processing device 45 of the device main body 21 transmits and receives multiplexed data to and from the third multiplexing processing device 68 of the head unit 25 through the LAN cable 72. The first to third multiplexing processing devices 45, 57, 68 multiplex the control data CD of the industrial network, the image data GD of the parts camera 67, and the like by, for example, a time division multiplexing method (TDM: Time Division Multiplexing). Convert and transmit. The first multiprocessing device 45 and the like are composed of, for example, a logic circuit such as a field programmable gate array (FPGA).
 X軸スライド機構27Aの第2多重処理装置57は、GbE-PHY59に接続されている。また、第2多重処理装置57は、第1スレーブ51に接続されており、第1スレーブ51との間で制御データCDを入出力する。第2多重処理装置57は、制御データCDと他のデータを多重化し、LANケーブル71を通じて第1多重処理装置45(装置本体部21)へ送信する。 The second multiprocessing device 57 of the X-axis slide mechanism 27A is connected to GbE-PHY59. Further, the second multiprocessing device 57 is connected to the first slave 51 and inputs / outputs a control data CD to / from the first slave 51. The second multiprocessing device 57 multiplexes the control data CD and other data, and transmits the data to the first multiprocessing device 45 (device main body 21) through the LAN cable 71.
 また、ヘッド部25の第3多重処理装置68は、GbE-PHY69に接続されている。また、第3多重処理装置68は、マークカメラ66及びパーツカメラ67に接続されている。マークカメラ66及びパーツカメラ67は、例えば、GigE-vision(登録商標)等の画像伝送規格により、撮像した画像データGDを第3多重処理装置68に出力する。マークカメラ66及びパーツカメラ67は、例えば、装置本体部21の本体制御装置41から多重通信を介してトリガ信号を受信するのに応じて撮像を行い、撮像した画像データGDを第3多重処理装置68に出力する。また、第3多重処理装置68は、第2スレーブ61に接続されており、第2スレーブ61との間で制御データCDを入出力する。第3多重処理装置68は、画像データGDや制御データCD等の各種データを多重化し、LANケーブル72を通じて第1多重処理装置45へ送信する。 Further, the third multiprocessing device 68 of the head unit 25 is connected to GbE-PHY69. Further, the third multiprocessing device 68 is connected to the mark camera 66 and the parts camera 67. The mark camera 66 and the parts camera 67 output the captured image data GD to the third multiprocessing device 68 according to an image transmission standard such as GigE-vision (registered trademark). The mark camera 66 and the parts camera 67 take an image in response to receiving a trigger signal from the main body control device 41 of the device main body 21 via multiplex communication, and the captured image data GD is subjected to a third multiplexing processing device, for example. Output to 68. Further, the third multiprocessing device 68 is connected to the second slave 61, and inputs / outputs the control data CD to / from the second slave 61. The third multiplexing processing device 68 multiplexes various data such as image data GD and control data CD, and transmits the data to the first multiplexing processing device 45 through the LAN cable 72.
 第1多重処理装置45は、GbE-PHY47,48に接続されている。また、第1多重処理装置45は、本体制御装置41と接続されている。第1多重処理装置45は、多重通信を介して第2多重処理装置57や第3多重処理装置68から受信した多重化データを非多重化する。例えば、第1多重処理装置45は、第3多重処理装置68から受信した多重化データを非多重化し、パーツカメラ67の画像データGDを分離する。第1多重処理装置45は、分離した画像データGDを、GigE-vision(登録商標)の規格に準拠したデータ形式で本体制御装置41に出力する。 The first multiprocessing device 45 is connected to GbE- PHY 47, 48. Further, the first multiprocessing device 45 is connected to the main body control device 41. The first multiplexing processing device 45 demultiplexes the multiplexed data received from the second multiplexing processing device 57 and the third multiplexing processing device 68 via multiplex communication. For example, the first multiplexing processing device 45 demultiplexes the multiplexing data received from the third multiplexing processing device 68, and separates the image data GD of the parts camera 67. The first multiprocessing device 45 outputs the separated image data GD to the main body control device 41 in a data format conforming to the GigE-vision (registered trademark) standard.
 また、第1多重処理装置45は、マスター43と接続されている。マスター43は、リレー53等の装置を制御する制御データCDの送受信を行う産業用ネットワークを構築し、配線の統合(削減)等を実現する。より具体的には、本実施形態の産業用ネットワークにおいて、マスター43から送信された制御データCDは、例えば、第1多重処理装置45、第2多重処理装置57、第1スレーブ51、第2多重処理装置57、第1多重処理装置45、第3多重処理装置68、第2スレーブ61、第3多重処理装置68、第1多重処理装置45、マスター43の各々を循環するように伝送される。例えば、第1スレーブ51は、マスター43から受信した制御データCDに読み取り及び書き込み処理を行い、ヘッド部25の第2スレーブ61に転送する。第1スレーブ51は、制御データCDに予め設定された第1スレーブ51用の読み取りのデータ位置からデータをコピーし、コピーしたデータの内容に応じてリレー53の駆動などを行う。また、第1スレーブ51は、制御データCDに予め設定された第1スレーブ51用の書き込みのデータ位置にリレー53の駆動の完了を示す情報やセンサ55の検出情報などを書き込んでヘッド部25に転送する。このように、第1スレーブ51及び第2スレーブ61は、制御データCDに読み取り及び書き込み処理を行いつつ、制御データCDを高速に交換して伝送する。尚、図3に示す産業用ネットワークの構成は、一例であり適宜変更可能である。例えば、第2スレーブ61は、第1スレーブ51を介してマスター43と接続される構成でも良い。また、マスター43により制御されるスレーブは、1つ又は3つ以上でも良い。 Further, the first multiprocessing device 45 is connected to the master 43. The master 43 constructs an industrial network for transmitting and receiving control data CDs that control devices such as the relay 53, and realizes integration (reduction) of wiring and the like. More specifically, in the industrial network of the present embodiment, the control data CD transmitted from the master 43 is, for example, the first multiprocessing device 45, the second multiprocessing device 57, the first slave 51, and the second multiprocessor. It is transmitted so as to circulate in each of the processing device 57, the first multiprocessing device 45, the third multiprocessing device 68, the second slave 61, the third multiprocessing device 68, the first multiprocessing device 45, and the master 43. For example, the first slave 51 reads and writes the control data CD received from the master 43, and transfers the control data CD to the second slave 61 of the head unit 25. The first slave 51 copies data from the read data position for the first slave 51 preset in the control data CD, and drives the relay 53 or the like according to the content of the copied data. Further, the first slave 51 writes information indicating the completion of driving of the relay 53, detection information of the sensor 55, and the like to the writing data position for the first slave 51 preset in the control data CD, and writes the detection information of the sensor 55 to the head portion 25. Forward. In this way, the first slave 51 and the second slave 61 exchange and transmit the control data CD at high speed while reading and writing the control data CD. The configuration of the industrial network shown in FIG. 3 is an example and can be changed as appropriate. For example, the second slave 61 may be connected to the master 43 via the first slave 51. Further, the number of slaves controlled by the master 43 may be one or three or more.
 次に、ヘッド部25が備える第2スレーブ61の構成について説明する。なお、X軸スライド機構27Aの第1スレーブ51は、第2スレーブ61と同様の構成となっている。しかしながら、ヘッド部25は、X軸スライド機構27Aに比べて小型化が要求される装置であり、本願に係わる技術を採用することがより効果的である。このため、以下の説明では、第2スレーブ61の構成を説明し、第1スレーブ51の構成についての説明を適宜省略する。 Next, the configuration of the second slave 61 included in the head unit 25 will be described. The first slave 51 of the X-axis slide mechanism 27A has the same configuration as the second slave 61. However, the head portion 25 is a device that is required to be smaller than the X-axis slide mechanism 27A, and it is more effective to adopt the technique according to the present application. Therefore, in the following description, the configuration of the second slave 61 will be described, and the description of the configuration of the first slave 51 will be omitted as appropriate.
 図4は、第2スレーブ61のブロック図を示している。図4に示すように、第2スレーブ61は、スレーブコントローラ81と、CPU83と、不揮発性メモリ85と、アクセス制御回路87等を有している。スレーブコントローラ81は、例えば、論理層と物理層のインタフェースとして機能するPHYなど(外部IF)を介して第3多重処理装置68(図3参照)と接続されている。また、スレーブコントローラ81は、第3多重処理装置68、LANケーブル72、第1多重処理装置45などの多重通信を介してマスター43との間で制御データCDの送受信が可能となっている。 FIG. 4 shows a block diagram of the second slave 61. As shown in FIG. 4, the second slave 61 includes a slave controller 81, a CPU 83, a non-volatile memory 85, an access control circuit 87, and the like. The slave controller 81 is connected to the third multiprocessing device 68 (see FIG. 3) via, for example, a PHY (external IF) that functions as an interface between the logical layer and the physical layer. Further, the slave controller 81 can send and receive a control data CD to and from the master 43 via multiplex communication such as the third multiplexing processing device 68, the LAN cable 72, and the first multiplexing processing device 45.
 スレーブコントローラ81は、例えば、プログラマブルロジックデバイス(PLD)、フィールドプログラマブルゲートアレイ(FPGA)、複合プログラマブルロジックデバイス(CPLD)といった論理回路の構築に使用されるIPコアである。スレーブコントローラ81は、例えば、マスター43から第1スレーブ51を介して(マスター43、第1スレーブ51の順に転送された後の)制御データCDを受信する。スレーブコントローラ81は、受信した制御データCDに対し読み取り及び書き込み処理を行う。スレーブコントローラ81は、例えば、制御データCDに予め設定された第2スレーブ61用の読み取りのデータ位置からデータをコピーし、コピーしたデータをCPU83へ出力する。 The slave controller 81 is an IP core used for constructing logic circuits such as a programmable logic device (PLD), a field programmable gate array (FPGA), and a composite programmable logic device (CPLD). The slave controller 81 receives, for example, the control data CD (after being transferred in the order of the master 43 and the first slave 51) from the master 43 via the first slave 51. The slave controller 81 performs read / write processing on the received control data CD. The slave controller 81 copies data from the read data position for the second slave 61 preset in the control data CD, and outputs the copied data to the CPU 83, for example.
 CPU83は、デジタルIF89及びADコンバータ91に接続されている。デジタルIF89は、デジタル信号を入出力するためのインタフェースである。ADコンバータ91は、アナログ信号とデジタル信号との変換を行うインタフェースである。CPU83は、デジタルIF89やADコンバータ91等を介してリレー63やセンサ65(図3参照)に接続されている。CPU83は、スレーブコントローラ81から入力されたデータに基づいてリレー63等を制御する。また、CPU83は、センサ65の出力信号等をスレーブコントローラ81に出力する。スレーブコントローラ81は、制御データCDに予め設定された第2スレーブ61用の書き込みのデータ位置に、CPU83から入力したデータを書き込んでマスター43に転送する。 The CPU 83 is connected to the digital IF 89 and the AD converter 91. The digital IF89 is an interface for inputting / outputting digital signals. The AD converter 91 is an interface that converts an analog signal and a digital signal. The CPU 83 is connected to the relay 63 and the sensor 65 (see FIG. 3) via a digital IF 89, an AD converter 91, or the like. The CPU 83 controls the relay 63 and the like based on the data input from the slave controller 81. Further, the CPU 83 outputs the output signal of the sensor 65 and the like to the slave controller 81. The slave controller 81 writes the data input from the CPU 83 to the write data position for the second slave 61 preset in the control data CD and transfers the data to the master 43.
 CPU83は、所定のプログラムを実行することで、スレーブコントローラ81と入出力するデータに係わる処理を実行する。この所定のプログラムを記憶する記憶装置は特に限定されないが、例えば、不揮発性メモリ85でも良い。なお、以下の説明では、CPU83による制御を、単に装置名で記載する場合がある。例えば、「CPU83がアクセス制御回路87を制御する」という記載は、「CPU83が、所定のプログラムを実行することで、アクセス制御回路87に対する指令を出力し、アクセス制御回路87を制御するということを意味する場合がある。 The CPU 83 executes a process related to data input / output to / from the slave controller 81 by executing a predetermined program. The storage device for storing this predetermined program is not particularly limited, but for example, the non-volatile memory 85 may be used. In the following description, the control by the CPU 83 may be simply described by the device name. For example, the description that "the CPU 83 controls the access control circuit 87" means that "the CPU 83 outputs a command to the access control circuit 87 and controls the access control circuit 87 by executing a predetermined program." May mean.
 不揮発性メモリ85(本願のメモリの一例)は、アクセス制御回路87に接続されている。不揮発性メモリ85は、例えば、EEPROMである。なお、本願のメモリは、EEPROMに限らず、FLASHメモリ、FRAM(登録商標)、MRAM等でも良い。不揮発性メモリ85には、スレーブ情報93、稼動ログ95、ヘッド固有値96等の各種のデータが記憶されている。 The non-volatile memory 85 (an example of the memory of the present application) is connected to the access control circuit 87. The non-volatile memory 85 is, for example, an EEPROM. The memory of the present application is not limited to EEPROM, and may be FLASH memory, FRAM (registered trademark), MRAM, or the like. Various data such as slave information 93, operation log 95, and head eigenvalue 96 are stored in the non-volatile memory 85.
 スレーブ情報93は、例えば、スレーブコントローラ81がどのようなスレーブであるのかを示す情報であり、EtherCAT(登録商標)スレーブ情報(ESI)である。スレーブ情報93は、スレーブコントローラ81を識別するための固有値や、スレーブコントローラ81の機能を検出するための情報である。尚、スレーブ情報93の内容は、特に限定されない。スレーブ情報93は、例えば、制御データCDの伝送に用いるアドレス情報でも良く、スレーブコントローラ81以外の第2スレーブ61が備える装置の情報でも良い。また、スレーブ情報93は、例えば、産業用ネットワークの通信規格で定められた情報を含み、通信規格の種類によって変更される。 The slave information 93 is, for example, information indicating what kind of slave the slave controller 81 is, and is EtherCAT (registered trademark) slave information (ESI). The slave information 93 is an eigenvalue for identifying the slave controller 81 and information for detecting the function of the slave controller 81. The content of the slave information 93 is not particularly limited. The slave information 93 may be, for example, address information used for transmission of the control data CD, or information on a device included in the second slave 61 other than the slave controller 81. Further, the slave information 93 includes, for example, information defined by a communication standard of an industrial network, and is changed depending on the type of the communication standard.
 稼動ログ95は、第2スレーブ61を搭載する搭載装置、即ち、ヘッド部25の稼動状況を記憶したものである。CPU83は、例えば、制御データCDに基づいた制御の結果情報、ヘッド部25の動作情報などを、稼動ログ95として記憶する。具体的には、CPU83は、例えば、ヘッド部25の吸着ノズルをZ方向へ移動させたストローク回数(吸着、装着回数)、パーツカメラ67やマークカメラ66で撮像した撮像回数、リレー63の稼動回数、センサ65の検出値などを、稼動ログ95に記憶する。CPU83は、ヘッド部25の動作等を常時監視し、後述するアクセス制御回路87を介して稼動ログ95を不揮発性メモリ85に書き込む。 The operation log 95 stores the operation status of the on-board device on which the second slave 61 is mounted, that is, the head unit 25. The CPU 83 stores, for example, control result information based on the control data CD, operation information of the head unit 25, and the like as an operation log 95. Specifically, the CPU 83 has, for example, the number of strokes (the number of suctions and attachments) in which the suction nozzle of the head portion 25 is moved in the Z direction, the number of images taken by the parts camera 67 and the mark camera 66, and the number of times the relay 63 is operated. , The detected value of the sensor 65 and the like are stored in the operation log 95. The CPU 83 constantly monitors the operation of the head unit 25 and writes the operation log 95 to the non-volatile memory 85 via the access control circuit 87 described later.
 尚、本願における通信装置を備える搭載装置は、ヘッド部25に限らない。例えば、搭載装置としてX軸スライド機構27Aを採用しても良い。この場合、第1スレーブ51のCPU83は、X軸スライド機構27Aのスライド移動の回数、加速の回数などを稼動ログ95として記憶しても良い。また、例えば、搭載装置として基板搬送装置22を採用した場合、基板搬送装置22に搭載されたスレーブのCPU83は、基板搬送装置22が基板17を搬送した回数を稼動ログ95として記憶しても良い。また、例えば、搭載装置としてローダ13を採用した場合、ローダ13に搭載されたスレーブのCPU83は、ローダ13によるフィーダ29の交換回数、各部品装着機20への移動回数を稼動ログ95として記憶しても良い。 The mounted device provided with the communication device in the present application is not limited to the head unit 25. For example, the X-axis slide mechanism 27A may be adopted as the mounting device. In this case, the CPU 83 of the first slave 51 may store the number of slide movements, the number of accelerations, and the like of the X-axis slide mechanism 27A as the operation log 95. Further, for example, when the board transfer device 22 is adopted as the mounting device, the slave CPU 83 mounted on the board transfer device 22 may store the number of times the board transfer device 22 has conveyed the board 17 as an operation log 95. .. Further, for example, when the loader 13 is adopted as the mounting device, the slave CPU 83 mounted on the loader 13 stores the number of times the feeder 29 is replaced by the loader 13 and the number of times the feeder 29 is moved to each component mounting machine 20 as an operation log 95. You may.
 ヘッド固有値96(本開示の搭載装置識別情報の一例)は、例えば、第2スレーブ61を搭載する搭載装置、即ち、ヘッド部25を識別するための情報である。具体的には、ヘッド部25のシリアル番号、型番、製品名等である。ヘッド固有値96は、例えば、ヘッド部25の製造時に、設定用のPCを第2スレーブ61に接続し、不揮発性メモリ85に書き込まれる。 The head eigenvalue 96 (an example of the mounted device identification information of the present disclosure) is, for example, information for identifying the mounted device on which the second slave 61 is mounted, that is, the head unit 25. Specifically, it is the serial number, model number, product name, etc. of the head portion 25. The head eigenvalue 96 is written to the non-volatile memory 85 by connecting the setting PC to the second slave 61 at the time of manufacturing the head portion 25, for example.
 また、アクセス制御回路87は、スレーブIF101と、メモリIF102と、バス105と、RAM107(本願の記憶装置の一例)とを備えている。スレーブIF101は、RAM107をスレーブコントローラ81に接続するインタフェースである。また、メモリIF102は、RAM107を不揮発性メモリ85に接続するインタフェースである。スレーブIF101及びメモリIF102は、例えば、アイ・スクエアド・シー(Inter-Integrated Circuit、I2C)とも称されるシリアルバス通信方式により、通信を行なう。 Further, the access control circuit 87 includes a slave IF 101, a memory IF 102, a bus 105, and a RAM 107 (an example of the storage device of the present application). The slave IF 101 is an interface for connecting the RAM 107 to the slave controller 81. The memory IF 102 is an interface for connecting the RAM 107 to the non-volatile memory 85. The slave IF 101 and the memory IF 102 communicate with each other by, for example, a serial bus communication method also referred to as an i-squared sea (Inter-Integrated Circuit, I2C).
 バス105は、メモリIF102と、CPU83を接続するインタフェースである。バス105は、例えば、Avalon(登録商標)バスである。CPU83は、バス105を介して不揮発性メモリ85からRAM107へのデータの読み出しが可能となっている。CPU83は、例えば、不揮発性メモリ85のアドレス値やデータサイズを指定した指令を、バス105を介してアクセス制御回路87へ出力する。アクセス制御回路87は、CPU83からの指令に基づいて、例えば、不揮発性メモリ85からスレーブ情報93を読み出してRAM107に記憶する。そして、後述するように、アクセス制御回路87は、マスター43からスレーブコントローラ81へスレーブ情報93を要求する指令が受信された場合に、RAM107に記憶したスレーブ情報93をマスター43へ送信する。尚、スレーブ情報93を記憶する記憶装置は、RAM107のような揮発性メモリに限らず、EEPROMのような不揮発性メモリでも良い。 The bus 105 is an interface for connecting the memory IF 102 and the CPU 83. Bus 105 is, for example, an Avalon® bus. The CPU 83 can read data from the non-volatile memory 85 to the RAM 107 via the bus 105. For example, the CPU 83 outputs a command specifying the address value and data size of the non-volatile memory 85 to the access control circuit 87 via the bus 105. Based on the command from the CPU 83, the access control circuit 87 reads, for example, the slave information 93 from the non-volatile memory 85 and stores it in the RAM 107. Then, as will be described later, the access control circuit 87 transmits the slave information 93 stored in the RAM 107 to the master 43 when a command for requesting the slave information 93 is received from the master 43 to the slave controller 81. The storage device for storing the slave information 93 is not limited to a volatile memory such as RAM 107, but may be a non-volatile memory such as EEPROM.
 次に、上記した構成の第2スレーブ61における処理について説明する。図5は、第2スレーブ61における処理の一例を示している。また、図6は、図5における処理を実行した場合のデータの流れを示している。 Next, the processing in the second slave 61 having the above configuration will be described. FIG. 5 shows an example of processing in the second slave 61. Further, FIG. 6 shows a data flow when the process shown in FIG. 5 is executed.
 まず、図5のステップ(以下、単に「S」と記載する)11において、第2スレーブ61は、起動処理を行う。部品装着機20は、例えば、部品装着システム10の起動にともなって電源を投入されると、装置本体部21、X軸スライド機構27A、ヘッド部25等へ電力を供給しシステムを起動する。本体制御装置41は、システムの起動時に、図3に示す多重通信回線の確立などを実行する。第2スレーブ61は、ヘッド部25に電力を供給されると、スレーブコントローラ81の論理回路の構築などの起動処理を実行する。第2スレーブ61のCPU83は、電力を供給されると、不揮発性メモリ85等から所定のプログラムを読み出して実行し、初期設定を行なう。 First, in step 11 of FIG. 5 (hereinafter, simply referred to as “S”) 11, the second slave 61 performs an activation process. For example, when the power is turned on when the component mounting system 10 is started, the component mounting machine 20 supplies electric power to the device main body 21, the X-axis slide mechanism 27A, the head 25, and the like to start the system. The main body control device 41 executes the establishment of the multiplex communication line shown in FIG. 3 and the like when the system is started. When power is supplied to the head unit 25, the second slave 61 executes an activation process such as construction of a logic circuit of the slave controller 81. When power is supplied, the CPU 83 of the second slave 61 reads a predetermined program from the non-volatile memory 85 or the like and executes it to perform initial setting.
 次に、CPU83は、アクセス制御回路87に対し、不揮発性メモリ85からスレーブ情報93を読み出す処理を実行させる。CPU83は、不揮発性メモリ85のアドレス値等を指定した指令をアクセス制御回路87へ出力する。アクセス制御回路87は、CPU83からの指令に基づいて、不揮発性メモリ85からスレーブ情報93を読み出し、読み出したスレーブ情報93をRAM107に記憶する。 Next, the CPU 83 causes the access control circuit 87 to execute a process of reading the slave information 93 from the non-volatile memory 85. The CPU 83 outputs a command specifying an address value or the like of the non-volatile memory 85 to the access control circuit 87. The access control circuit 87 reads the slave information 93 from the non-volatile memory 85 based on the command from the CPU 83, and stores the read slave information 93 in the RAM 107.
 第2スレーブ61は、S13を実行した後、S15と、S17を並列的に処理する。S15において、第2スレーブ61は、マスター43からの要求に応じて、S13でRAM107に記憶したスレーブ情報93をマスター43へ送信する。例えば、本体制御装置41は、多重通信回線の確立を検出すると、マスター43による処理を開始させる。マスター43は、確立した多重通信回線を介して各スレーブのスレーブ情報93を取得し、産業用ネットワークの構築を開始する。 The second slave 61 processes S15 and S17 in parallel after executing S13. In S15, the second slave 61 transmits the slave information 93 stored in the RAM 107 in S13 to the master 43 in response to the request from the master 43. For example, when the main body control device 41 detects the establishment of the multiplex communication line, the master 43 starts the process. The master 43 acquires the slave information 93 of each slave via the established multiplex communication line, and starts the construction of the industrial network.
 マスター43は、ネットワーク上で検出した第1スレーブ51や第2スレーブ61に対して、スレーブ情報93の送信を要求する。マスター43から第1スレーブ51等へスレーブ情報93を要求する方法は、特に限定されない。例えば、マスター43は、産業用ネットワークの通信規格で定められた制御コマンドを第1スレーブ51等へ送信することで、スレーブ情報93を要求しても良い。第2スレーブ61のスレーブコントローラ81は、マスター43からスレーブ情報93の要求を受信すると、スレーブIF101を介してRAM107からスレーブ情報93を読み出しマスター43へ送信する(S15)。マスター43は、第1スレーブ51及び第2スレーブ61から受信したスレーブ情報93に基づいて、産業用ネットワークに接続されているスレーブコントローラ81の種類、サポートしている通信プロトコルなどを検出し、制御データCDの送信先アドレスの設定などを行う。 The master 43 requests the first slave 51 and the second slave 61 detected on the network to transmit the slave information 93. The method of requesting the slave information 93 from the master 43 to the first slave 51 and the like is not particularly limited. For example, the master 43 may request the slave information 93 by transmitting a control command defined by the communication standard of the industrial network to the first slave 51 or the like. When the slave controller 81 of the second slave 61 receives the request for the slave information 93 from the master 43, it reads the slave information 93 from the RAM 107 via the slave IF 101 and transmits the slave information 93 to the master 43 (S15). Based on the slave information 93 received from the first slave 51 and the second slave 61, the master 43 detects the type of slave controller 81 connected to the industrial network, the supported communication protocol, and the like, and controls data. Set the destination address of the CD.
 従って、本実施形態のアクセス制御回路87は、マスター43から第2スレーブ61に対してスレーブ情報93の読み出しを指示する要求が受信された場合に、RAM107へ読み出したスレーブ情報93を、第2スレーブ61を介してマスター43へ送信する(S15)。これによれば、マスター43からの要求に応じて、即ち、マスター43が必要となったタイミングで、予め不揮発性メモリ85からRAM107へ読み出しておいたスレーブ情報93をマスター43へ送信できる。 Therefore, when the access control circuit 87 of the present embodiment receives a request from the master 43 to instruct the second slave 61 to read the slave information 93, the access control circuit 87 reads the slave information 93 into the RAM 107 to the second slave. It is transmitted to the master 43 via 61 (S15). According to this, the slave information 93 read from the non-volatile memory 85 to the RAM 107 in advance can be transmitted to the master 43 in response to the request from the master 43, that is, at the timing when the master 43 is needed.
 一方、第2スレーブ61は、S17において、ヘッド固有値96の読み出しを実行する。例えば、マスター43は、スレーブ情報93に基づいて、産業用ネットワークの設定(各スレーブコントローラ81の送信先アドレスの設定など)を完了すると、第1スレーブ51や第2スレーブ61を搭載している搭載装置を識別する搭載装置識別情報を取得する。マスター43は、産業用ネットワークの制御データCDにより、第1スレーブ51や第2スレーブ61に対して搭載装置識別情報の送信を要求する。第2スレーブ61の場合、マスター43は、ヘッド固有値96の送信を第2スレーブ61に要求する。スレーブコントローラ81は、ヘッド固有値96を要求する制御データCDを受信すると、ヘッド固有値96の読み出しをCPU83に指令する(S17)。 On the other hand, the second slave 61 executes reading of the head eigenvalue 96 in S17. For example, when the master 43 completes the industrial network settings (setting of the destination address of each slave controller 81, etc.) based on the slave information 93, the master 43 is equipped with the first slave 51 and the second slave 61. Acquires on-board device identification information that identifies the device. The master 43 requests the first slave 51 and the second slave 61 to transmit the on-board device identification information by the control data CD of the industrial network. In the case of the second slave 61, the master 43 requests the second slave 61 to transmit the head eigenvalue 96. When the slave controller 81 receives the control data CD requesting the head eigenvalue 96, the slave controller 81 instructs the CPU 83 to read the head eigenvalue 96 (S17).
 CPU83は、不揮発性メモリ85におけるヘッド固有値96が記憶されたアドレス値や、ヘッド固有値96のデータサイズを指定した指令を、バス105を介してアクセス制御回路87へ出力する(S17)。アクセス制御回路87は、指令を受信すると、不揮発性メモリ85からヘッド固有値96を読み出してCPU83へ出力する。CPU83は、アクセス制御回路87から受信したヘッド固有値96をスレーブコントローラ81へ出力する。スレーブコントローラ81は、例えば、制御データCDの書き込み用のデータ位置に、ヘッド固有値96を設定してマスター43へ送信する(S17)。これにより、マスター43は、例えば、第2スレーブ61から受信したヘッド固有値96に基づいて、ヘッド部25の種類、型名、ヘッド部25に指令を送信する場合の通信プロトコルなどを検出し、ヘッド部25を適切に制御して装着作業を行なうことができる。 The CPU 83 outputs a command specifying the address value in which the head eigenvalue 96 in the non-volatile memory 85 is stored and the data size of the head eigenvalue 96 to the access control circuit 87 via the bus 105 (S17). When the access control circuit 87 receives the command, the access control circuit 87 reads the head eigenvalue 96 from the non-volatile memory 85 and outputs it to the CPU 83. The CPU 83 outputs the head eigenvalue 96 received from the access control circuit 87 to the slave controller 81. For example, the slave controller 81 sets the head eigenvalue 96 at the data position for writing the control data CD and transmits it to the master 43 (S17). As a result, the master 43 detects, for example, the type and model name of the head unit 25, the communication protocol when a command is transmitted to the head unit 25, and the like based on the head eigenvalue 96 received from the second slave 61, and the head The mounting work can be performed by appropriately controlling the portion 25.
 部品装着機20は、第2スレーブ61を搭載するヘッド部25や、第1スレーブ51を搭載するX軸スライド機構27Aから搭載装置識別情報(ヘッド固有値96など)を取得した後、電子部品を基板17に装着する装着作業を開始する。例えば、部品装着機20は、ヘッド固有値96の取得を完了させ、装着作業を開始できる状態になると、準備が完了した旨を部品装着システム10の管理コンピュータ15へ通知する。管理コンピュータ15は、生産ライン11の各部品装着機20から準備完了通知を受信すると、装着作業に必要な制御情報を部品装着機20へ送信し、装着作業を開始させる。ここでいう制御情報とは、生産する基板の種類の情報、電子部品の種類の情報、電子部品を装着する装着位置の情報などである。 The component mounting machine 20 acquires mounting device identification information (head eigenvalue 96, etc.) from the head portion 25 on which the second slave 61 is mounted and the X-axis slide mechanism 27A on which the first slave 51 is mounted, and then mounts the electronic components on the substrate. The mounting work for mounting on 17 is started. For example, the component mounting machine 20 notifies the management computer 15 of the component mounting system 10 that the preparation is completed when the acquisition of the head eigenvalue 96 is completed and the mounting work can be started. When the management computer 15 receives the preparation completion notification from each component mounting machine 20 of the production line 11, the management computer 15 transmits control information necessary for the mounting work to the component mounting machine 20 to start the mounting work. The control information referred to here is information on the type of substrate to be produced, information on the type of electronic component, information on the mounting position on which the electronic component is mounted, and the like.
 第2スレーブ61は、S17を実行した後、S19を実行する。例えば、各部品装着機20の第1スレーブ51や第2スレーブ61のCPU83は、産業用ネットワークの構築が完了すると、稼動ログ95を不揮発性メモリ85へ記憶する処理を開始する(S19)。CPU83は、例えば、電子部品の装着作業において吸着ノズルをストロークさせた回数、マークカメラ66で撮像した回数などを稼動ログ95として記憶する。あるいは、第1スレーブ51のCPU83は、X軸スライド機構27Aの移動回数を稼動ログ95として第1スレーブ51の不揮発性メモリ85に記憶する。 The second slave 61 executes S19 after executing S17. For example, the CPU 83 of the first slave 51 and the second slave 61 of each component mounting machine 20 starts the process of storing the operation log 95 in the non-volatile memory 85 when the construction of the industrial network is completed (S19). The CPU 83 stores, for example, the number of times the suction nozzle is stroked in the work of mounting the electronic component, the number of times the image is taken by the mark camera 66, and the like as the operation log 95. Alternatively, the CPU 83 of the first slave 51 stores the number of movements of the X-axis slide mechanism 27A as an operation log 95 in the non-volatile memory 85 of the first slave 51.
 尚、第1スレーブ51や第2スレーブ61などの全てのスレーブが、稼動ログ95の記憶を実行しなくとも良い。また、稼動ログ95に記憶する情報は、上記した情報に限らない。例えば、第2スレーブ61のCPU83は、制御データCDを用いてマスター43から第2スレーブ61に指示した制御内容を稼動ログ95に記憶しても良い。より具体的には、CPU83は、リレー63を駆動するコマンドの内容、コマンドを受信した時間、実行結果を稼動ログ95に記憶しても良い。また、CPU83は、センサ65の検出内容や検出時間を稼動ログ95に記憶しても良い。 Note that all slaves such as the first slave 51 and the second slave 61 do not have to execute the storage of the operation log 95. Further, the information stored in the operation log 95 is not limited to the above-mentioned information. For example, the CPU 83 of the second slave 61 may store the control contents instructed from the master 43 to the second slave 61 in the operation log 95 using the control data CD. More specifically, the CPU 83 may store the content of the command for driving the relay 63, the time when the command is received, and the execution result in the operation log 95. Further, the CPU 83 may store the detection content and the detection time of the sensor 65 in the operation log 95.
 第2スレーブ61は、S19を実行した後、S21を実行する。第2スレーブ61は、処理を終了するか否かを判定する(S21)。例えば、部品装着機20の電源が切られるまで処理を継続する設定の場合、第2スレーブ61は、部品装着機20の電源が切られるまでS21で否定判定し(S21:NO)、S19の処理を繰り返し実行する。これにより、第2スレーブ61は、部品装着機20が電源ON状態において、稼動ログ95の記憶を継続する。第2スレーブ61は、部品装着機20の電源が切られたと判定すると(S21:YES)、S19の処理を終了する。 The second slave 61 executes S21 after executing S19. The second slave 61 determines whether or not to end the process (S21). For example, in the case of setting to continue the process until the power of the component mounting machine 20 is turned off, the second slave 61 makes a negative determination in S21 until the power of the component mounting machine 20 is turned off (S21: NO), and the process of S19. Is repeated. As a result, the second slave 61 continues to store the operation log 95 when the component mounting machine 20 is in the power-on state. When the second slave 61 determines that the power of the component mounting machine 20 has been turned off (S21: YES), the second slave 61 ends the process of S19.
 ここで、上記したように、本実施形態のCPU83は、スレーブ情報93をRAM107へ読み出す処理(S13)を、アクセス制御回路87に実行させた後、スレーブ情報93以外のデータ(稼動ログ95、ヘッド固有値96)についてRAM107へアクセスする処理(S17やS19)を開始する。これによれば、CPU83は、スレーブ情報93以外のデータについて不揮発性メモリ85からのデータの読み出しや、不揮発性メモリ85へのデータの書き込みを実行する前に、スレーブ情報93の読み出しをアクセス制御回路87に実行させる。これにより、アクセスを開始する前にスレーブ情報93をRAM107へ読み出しておき、不揮発性メモリ85のアクセスの競合をより確実に抑制することができる。 Here, as described above, the CPU 83 of the present embodiment causes the access control circuit 87 to execute the process (S13) of reading the slave information 93 into the RAM 107, and then data other than the slave information 93 (operation log 95, head). The process of accessing the RAM 107 for the eigenvalue 96) (S17 or S19) is started. According to this, the CPU 83 reads the slave information 93 before executing the reading of the data from the non-volatile memory 85 and the writing of the data to the non-volatile memory 85 for the data other than the slave information 93. Let 87 do it. As a result, the slave information 93 can be read into the RAM 107 before the access is started, and the contention for access of the non-volatile memory 85 can be suppressed more reliably.
 一方、第2スレーブ61は、上記したS17やS19の処理と並列的に、S15を実行した後にS23を実行する。S23において、第2スレーブ61は、スレーブ情報93の再送を要求されたか否かを判定する。ここで、EtherCAT(登録商標)などの産業用ネットワークにおいては、スレーブコントローラ81のホットコネクトが可能となっている。ここでいうホットコネクトとは、例えば、部品装着機20のシステムが稼働中である状態において、スレーブコントローラ81を搭載した装置(例えば、ヘッド部25)の脱着を可能にする機能である。ホットコネクトが行なわれた場合、スレーブコントローラ81の着脱によって産業用ネットワークのトポロジが変更される。マスター43は、産業用ネットワークのトポロジの変更を検出すると、スレーブ情報93の再取得を実行し、産業用ネットワークの再構築を実行する。 On the other hand, the second slave 61 executes S23 after executing S15 in parallel with the above-mentioned processes of S17 and S19. In S23, the second slave 61 determines whether or not the slave information 93 is requested to be retransmitted. Here, in an industrial network such as EtherCAT (registered trademark), the slave controller 81 can be hot-connected. The hot connect here is, for example, a function that enables attachment / detachment of a device (for example, a head portion 25) equipped with a slave controller 81 while the system of the component mounting machine 20 is in operation. When hot connection is performed, the topology of the industrial network is changed by attaching / detaching the slave controller 81. When the master 43 detects a change in the topology of the industrial network, it reacquires the slave information 93 and reconstructs the industrial network.
 そこで、第2スレーブ61は、S23において、マスター43からスレーブ情報93を要求されたか否かを判定する。本実施形態の部品装着機20では、ヘッド部25がX軸スライド機構27Aに対して着脱可能となっている。このため、部品装着機20の電源を投入したままヘッド部25を着脱すると、スレーブ情報93の再取得が実行される。また、仮に、X軸スライド機構27Aや第1スレーブ51が着脱されると、その着脱によってスレーブ情報93の再取得が実行される。また、例えば、1台の部品装着機20が2台のヘッド部25を備える構成(ツーヘッドの構成)であれば、2つのヘッド部25の一方を着脱した際にスレーブ情報93の再取得が実行される。また、例えば、ローダ13自体やローダ13の一部を、種類の異なるもの(トレイ型のローダ13など)に交換する場合にもスレーブ情報93の再取得が実行される。 Therefore, the second slave 61 determines in S23 whether or not the slave information 93 is requested from the master 43. In the component mounting machine 20 of the present embodiment, the head portion 25 is removable from the X-axis slide mechanism 27A. Therefore, if the head portion 25 is attached / detached while the power of the component mounting machine 20 is turned on, the slave information 93 is reacquired. Further, if the X-axis slide mechanism 27A and the first slave 51 are attached / detached, the slave information 93 is reacquired by the attachment / detachment. Further, for example, if one component mounting machine 20 is provided with two head portions 25 (two-head configuration), the slave information 93 is reacquired when one of the two head portions 25 is attached or detached. Will be done. Further, for example, when the loader 13 itself or a part of the loader 13 is replaced with a different type (tray type loader 13 or the like), the slave information 93 is reacquired.
 この場合、例えば、着脱によって交換された後のデバイス(ヘッド部25など)は、部品装着機20に装着され電源を供給された後に図5の処理を開始し、上記したS11~S15の処理を実行してスレーブ情報93をマスター43に送信し起動できる。一方で、着脱されない(交換されない)デバイスは、産業用ネットワークに接続されたままの状態であっても、他のデバイスが産業用ネットワークから切断され再度接続されることで、マスター43からスレーブ情報93を要求される。このような着脱されないデバイスでは、S17のヘッド固有値の読み出しや、S19の稼動ログ95の書き込み、即ち、不揮発性メモリ85へのアクセスを実行している際に、スレーブ情報93を要求される可能性がある。 In this case, for example, the device (head portion 25, etc.) that has been replaced by attachment / detachment starts the process of FIG. 5 after being attached to the component mounting machine 20 and supplied with power, and performs the processes of S11 to S15 described above. It can be executed and the slave information 93 can be transmitted to the master 43 to be activated. On the other hand, the non-detachable (non-replaceable) device is connected from the master 43 to the slave information 93 by disconnecting the other device from the industrial network and reconnecting the device even if the device remains connected to the industrial network. Is required. In such a non-detachable device, slave information 93 may be requested when reading the head eigenvalue of S17, writing the operation log 95 of S19, that is, accessing the non-volatile memory 85. There is.
 図7は、比較例の第2スレーブ121の構成におけるデータの流れを示している。図7に示すように、比較例の第2スレーブ121は、アクセス制御回路87を備えていない。CPU83は、スレーブコントローラ81を介して不揮発性メモリ85へのアクセスを実行する。例えば、図7に示すS31において、マスター43からスレーブコントローラ81へスレーブ情報93を要求する処理が発生する。それと同時に、S33に示すように、ヘッド固有値96の読み出し処理が発生する。あるいは、S35に示すように、稼動ログ95の書き込み処理が発生する。 FIG. 7 shows the data flow in the configuration of the second slave 121 of the comparative example. As shown in FIG. 7, the second slave 121 of the comparative example does not include the access control circuit 87. The CPU 83 executes access to the non-volatile memory 85 via the slave controller 81. For example, in S31 shown in FIG. 7, a process of requesting slave information 93 from the master 43 to the slave controller 81 occurs. At the same time, as shown in S33, the reading process of the head eigenvalue 96 occurs. Alternatively, as shown in S35, the writing process of the operation log 95 occurs.
 S33の処理と、S35の処理は、CPU83が主体となって実行する処理である。このため、例えば、CPU83は、S33の処理とS35の処理を排他的に制御できる。一方で、S31の処理は、マスター43からの要求に基づいて、スレーブコントローラ81が、不揮発性メモリ85へ直接行なう処理である。このため、S33やS35の処理とは関係なくS31の処理が発生し、スレーブコントローラ81が、CPU83の処理状態とは関係なく実行する。特に、上記したように、ホットコネクトによってスレーブコントローラ81の着脱が発生すると、マスター43が、各スレーブコントローラ81へスレーブ情報93を要求する場合がある。その結果、不揮発性メモリ85への同時アクセスが発生し、アクセスの競合が発生する。スレーブ情報93の読み出しの失敗、ヘッド固有値96の読み出しの失敗、稼動ログ95の書き込みの失敗などが発生する。 The processing of S33 and the processing of S35 are processing mainly executed by the CPU 83. Therefore, for example, the CPU 83 can exclusively control the processing of S33 and the processing of S35. On the other hand, the process of S31 is a process that the slave controller 81 directly performs to the non-volatile memory 85 based on the request from the master 43. Therefore, the processing of S31 occurs regardless of the processing of S33 and S35, and the slave controller 81 executes the processing regardless of the processing state of the CPU 83. In particular, as described above, when the slave controller 81 is attached or detached by the hot connect, the master 43 may request the slave information 93 from each slave controller 81. As a result, simultaneous access to the non-volatile memory 85 occurs, and access contention occurs. Failure to read the slave information 93, failure to read the head eigenvalue 96, failure to write the operation log 95, and the like occur.
 一方で、上記したように、本実施形態の第2スレーブ61では、予め起動時にスレーブ情報93をRAM107にコピーする(S13)。そして、図5のS23において、マスター43からスレーブ情報93を要求されると、第2スレーブ61は、S15を再度実行する。スレーブコントローラ81は、アクセス制御回路87のRAM107からスレーブ情報93を読み出してマスター43へ送信する(S15)。即ち、スレーブ情報93の送信において、不揮発性メモリ85のアクセスが発生しない。従って、CPU83は、S17やS19の処理を実行してもアクセスの競合が発生せずに、不揮発性メモリ85へ適切にアクセスすることができる。 On the other hand, as described above, in the second slave 61 of the present embodiment, the slave information 93 is copied to the RAM 107 in advance at the time of startup (S13). Then, in S23 of FIG. 5, when the slave information 93 is requested from the master 43, the second slave 61 executes S15 again. The slave controller 81 reads the slave information 93 from the RAM 107 of the access control circuit 87 and transmits it to the master 43 (S15). That is, in the transmission of the slave information 93, the access of the non-volatile memory 85 does not occur. Therefore, the CPU 83 can appropriately access the non-volatile memory 85 without causing an access conflict even if the processes of S17 and S19 are executed.
 上記したように、本実施形態では、スレーブ情報93として、スレーブコントローラ81を識別するための固有値を採用している。これによれば、マスター43は、産業用ネットワークの接続時などに、アクセス制御回路87のRAM107からスレーブコントローラ81の固有値(スレーブ情報93)を安定して読み出すことができる。マスター43は、固有値に基づいて、産業用ネットワークに接続されたスレーブコントローラ81の種類や機能を判定することができ、スレーブコントローラ81との接続やスレーブコントローラ81に対する制御を適切に行なうことができる。 As described above, in the present embodiment, the eigenvalue for identifying the slave controller 81 is adopted as the slave information 93. According to this, the master 43 can stably read the eigenvalues (slave information 93) of the slave controller 81 from the RAM 107 of the access control circuit 87 when the industrial network is connected. The master 43 can determine the type and function of the slave controller 81 connected to the industrial network based on the eigenvalues, and can appropriately perform the connection with the slave controller 81 and the control of the slave controller 81.
 また、本実施形態の不揮発性メモリ85は、第2スレーブ61を搭載するヘッド部25を識別するためのヘッド固有値96を記憶する。CPU83は、マスター43からスレーブコントローラ81に対してヘッド固有値96の読み出しを指示する制御データCDが受信された場合に、アクセス制御回路87を介して不揮発性メモリ85からヘッド固有値96を読み出す。CPU83は、読み出したヘッド固有値96を、スレーブコントローラ81を介してマスター43へ送信する。 Further, the non-volatile memory 85 of the present embodiment stores a head eigenvalue 96 for identifying the head portion 25 on which the second slave 61 is mounted. When the master 43 receives the control data CD instructing the slave controller 81 to read the head eigenvalue 96, the CPU 83 reads the head eigenvalue 96 from the non-volatile memory 85 via the access control circuit 87. The CPU 83 transmits the read head eigenvalue 96 to the master 43 via the slave controller 81.
 これによれば、不揮発性メモリ85は、スレーブ情報93の他に、第2スレーブ61を搭載するヘッド部25を識別するヘッド固有値96の記憶にも共用できる。スレーブ情報93を予めアクセス制御回路87のRAM107へ記憶させておくことで、CPU83は、アクセス制御回路87を介して不揮発性メモリ85からヘッド固有値96をいつでも読み出すことができ、読み出したヘッド固有値96をマスター43へ送信できる。マスター43側では、ヘッド固有値96に基づいて、ヘッド部25の種類、機能、制御コマンドの種類などを判定でき、ヘッド部25に対する制御を適切に行なうことができる。 According to this, the non-volatile memory 85 can be shared not only with the slave information 93 but also with the storage of the head eigenvalue 96 that identifies the head unit 25 on which the second slave 61 is mounted. By storing the slave information 93 in the RAM 107 of the access control circuit 87 in advance, the CPU 83 can read the head eigenvalue 96 from the non-volatile memory 85 at any time via the access control circuit 87, and the read head eigenvalue 96 can be read. It can be sent to the master 43. On the master 43 side, the type, function, type of control command, etc. of the head unit 25 can be determined based on the head eigenvalue 96, and the head unit 25 can be appropriately controlled.
 また、本実施形態のCPU83は、第2スレーブ61を搭載するヘッド部25の稼動に係わる稼動ログ95を、アクセス制御回路87を介して不揮発性メモリ85へ書き込む(S19)。これによれば、CPU83は、ヘッド部25の稼動ログ95の記憶に不揮発性メモリ85を用いる。スレーブ情報93を予めアクセス制御回路87のRAM107へ記憶させておくことで、CPU83は、稼動ログ95を安定的に不揮発性メモリ85に書き込むことができる。即ち、稼動ログ95の書き込み処理の失敗などを抑制できる。これにより、ヘッド部25の稼動状況を、稼動ログ95に適切に残すことができる。 Further, the CPU 83 of the present embodiment writes the operation log 95 related to the operation of the head unit 25 on which the second slave 61 is mounted to the non-volatile memory 85 via the access control circuit 87 (S19). According to this, the CPU 83 uses the non-volatile memory 85 for storing the operation log 95 of the head unit 25. By storing the slave information 93 in the RAM 107 of the access control circuit 87 in advance, the CPU 83 can stably write the operation log 95 to the non-volatile memory 85. That is, it is possible to suppress the failure of the writing process of the operation log 95. As a result, the operating status of the head unit 25 can be appropriately recorded in the operation log 95.
 また、本実施形態の第2スレーブ61は、電子部品を基板17に装着する作業を行なうヘッド部25に設けられる。電子部品の小型化、部品装着機20の小型化、ヘッド部25の作業スピードの高速化などの要求から、電子部品を基板17に装着するヘッド部25は、より小型化が要求されている。ここで、スレーブ情報93と、その他の情報(稼動ログ95やヘッド固有値96)を別々のメモリに記憶すれば、予めスレーブ情報93を読み出す必要がなく、アクセスの競合も発生しない。しかしながら、メモリの増加は、メモリ自体の個数の増加、メモリと接続するインタフェースの増加を招く。結果として第2スレーブ61の大型化を招く。これに対し、小型化が特に要求されるヘッド部25が備える第2スレーブ61において、スレーブ情報93を予め読み出すアクセス制御回路87を設けることで、メモリ数の低減を図り、ヘッド部25の小型化をより確実に実現できる。 Further, the second slave 61 of the present embodiment is provided on the head portion 25 that performs the work of mounting the electronic component on the substrate 17. The head portion 25 for mounting the electronic component on the substrate 17 is required to be further miniaturized due to demands such as miniaturization of the electronic component, miniaturization of the component mounting machine 20, and speeding up of the working speed of the head portion 25. Here, if the slave information 93 and other information (operation log 95 and head eigenvalue 96) are stored in separate memories, it is not necessary to read the slave information 93 in advance, and access conflict does not occur. However, an increase in memory leads to an increase in the number of memories themselves and an increase in the number of interfaces connected to the memory. As a result, the size of the second slave 61 is increased. On the other hand, in the second slave 61 included in the head unit 25, which is particularly required to be miniaturized, the access control circuit 87 that reads out the slave information 93 in advance is provided to reduce the number of memories and reduce the size of the head unit 25. Can be realized more reliably.
 そして、第2スレーブ61は、S23において、マスター43からスレーブ情報93が要求されていないと判定すると(S23:NO)、S24を実行する。第2スレーブ61は、S21と同様に、処理を終了するか否かを判定する(S24)。例えば、第2スレーブ61は、部品装着機20の電源が切られるまでの間、S21で否定判定し(S24:NO)、S23の処理を繰り返し実行する。これにより、第2スレーブ61は、稼動ログ95の書き込み処理と、スレーブ情報93の再送処理とを並列的に実行することができる。第2スレーブ61は、部品装着機20の電源が切られたと判定すると(S24:YES)、処理を終了する。第2スレーブ61は、S24及びS21の両方で肯定判定すると、図5に示す処理を終了する。これにより、部品装着機20の稼働時において、不揮発性メモリ85に対するアクセスの競合を抑制することができる。 Then, when the second slave 61 determines in S23 that the slave information 93 is not requested from the master 43 (S23: NO), the second slave 61 executes S24. Similar to S21, the second slave 61 determines whether or not to end the process (S24). For example, the second slave 61 makes a negative determination in S21 (S24: NO) until the power of the component mounting machine 20 is turned off, and repeatedly executes the process of S23. As a result, the second slave 61 can execute the writing process of the operation log 95 and the retransmission process of the slave information 93 in parallel. When the second slave 61 determines that the power of the component mounting machine 20 has been turned off (S24: YES), the second slave 61 ends the process. If the second slave 61 determines affirmatively in both S24 and S21, the process shown in FIG. 5 ends. As a result, it is possible to suppress competition for access to the non-volatile memory 85 when the component mounting machine 20 is in operation.
 因みに、部品装着機20は、作業機の一例である。ヘッド部25は、搭載装置、装着ヘッド、及び可動部の一例である。第2スレーブ61は、通信装置の一例である。スレーブコントローラ81は、スレーブの一例である。CPU83は、処理回路の一例である。不揮発性メモリ85は、メモリの一例である。ヘッド固有値96は、搭載装置識別情報の一例である。RAM107は、記憶装置の一例である。 By the way, the parts mounting machine 20 is an example of a working machine. The head portion 25 is an example of a mounting device, a mounting head, and a movable portion. The second slave 61 is an example of a communication device. The slave controller 81 is an example of a slave. The CPU 83 is an example of a processing circuit. The non-volatile memory 85 is an example of the memory. The head eigenvalue 96 is an example of the mounted device identification information. The RAM 107 is an example of a storage device.
 以上、上記した本実施例によれば以下の効果を奏する。
 本実施例の一態様では、アクセス制御回路87は、第2スレーブ61の起動時において、スレーブ情報93を不揮発性メモリ85から読み出してRAM107へ記憶する(S13)。アクセス制御回路87は、RAM107へ読み出したスレーブ情報93を、第2スレーブ61を介してマスター43へ送信する(S15)。
As described above, according to the above-described embodiment, the following effects are obtained.
In one aspect of this embodiment, the access control circuit 87 reads the slave information 93 from the non-volatile memory 85 and stores it in the RAM 107 when the second slave 61 is activated (S13). The access control circuit 87 transmits the slave information 93 read to the RAM 107 to the master 43 via the second slave 61 (S15).
 これによれば、不揮発性メモリ85は、第2スレーブ61(スレーブコントローラ81)に係わるスレーブ情報93を記憶しており、マスター43からスレーブ情報93をアクセスされる。また、不揮発性メモリ85は、CPU83からもアクセスされる。即ち、マスター43とCPU83とで共用して不揮発性メモリ85を使用する。これに対し、アクセス制御回路87は、不揮発性メモリ85からRAM107へスレーブ情報93を予め読み出しておく。そして、アクセス制御回路87は、RAM107へ読み出しておいたスレーブ情報93をマスター43へ送信する。これにより、スレーブ情報93の読み出しと、CPU83から不揮発性メモリ85へのアクセスが同時に発生したとしても、スレーブ情報93を不揮発性メモリ85から予め読み出しておくことでアクセスの競合が発生せず、CPU83による不揮発性メモリ85のアクセスを行なうことができる。従って、不揮発性メモリ85に対するアクセスの競合を抑制し、スレーブ情報93を記憶する用途以外にも不揮発性メモリ85を使用できる。 According to this, the non-volatile memory 85 stores the slave information 93 related to the second slave 61 (slave controller 81), and the slave information 93 is accessed from the master 43. The non-volatile memory 85 is also accessed from the CPU 83. That is, the non-volatile memory 85 is shared by the master 43 and the CPU 83. On the other hand, the access control circuit 87 reads the slave information 93 from the non-volatile memory 85 into the RAM 107 in advance. Then, the access control circuit 87 transmits the slave information 93 read into the RAM 107 to the master 43. As a result, even if the slave information 93 is read and the CPU 83 accesses the non-volatile memory 85 at the same time, the slave information 93 is read in advance from the non-volatile memory 85 so that access conflict does not occur and the CPU 83 does not occur. The non-volatile memory 85 can be accessed by the above. Therefore, the non-volatile memory 85 can be used for purposes other than storing the slave information 93 by suppressing the competition for access to the non-volatile memory 85.
 尚、本開示は上記の実施例に限定されるものではなく、本願の趣旨を逸脱しない範囲内での種々の改良、変更が可能であることは言うまでもない。
 例えば、本開示における搭載装置とは、ヘッド部25に限らず、X軸スライド機構27A、基板搬送装置22、フィーダ29等を採用できる。フィーダ29を採用した場合、CPU83は、フィーダ29から電子部品を供給した回数を稼動ログ95として記憶しても良い。
 また、スレーブコントローラ81及びアクセス制御回路87は、マスター43から第2スレーブ61に対してスレーブ情報93の読み出しを指示する要求が受信された場合に、スレーブ情報93をマスター43へ送信したが(S15)、これに限らない。スレーブコントローラ81やアクセス制御回路87は、例えば、S13のスレーブ情報93の読み出しが完了したことを条件として、マスター43へスレーブ情報93を送信しても良い。即ち、マスター43からの要求を必要とせず、所定の処理のタイミングでスレーブ情報93をマスター43へ自発的に送信しても良い。この場合にも、予めスレーブ情報93をRAM107へ読み出しておくことで不揮発性メモリ85に対するアクセスの競合が発生せず、CPU83による不揮発性メモリ85のアクセスを行なうことができる。。
 また、スレーブ装置をローダ13に設けてローダ13の動作を制御しても良い。即ち、ローダ13を産業用ネットワークに接続しても良い。この場合、CPU83は、ローダ13の移動回数、フィーダ29の交換回数などを稼動ログ95に記憶しても良い。
 また、部品装着機20は、ローダ13を備えない構成でも良い。この場合、作業員が手作業でフィーダ29を交換する構成でも良い。
 また、CPU83は、ヘッド固有値96の読み出しと、稼動ログ95の書き込みの少なくとも一方を実行する構成でも良い。また、CPU83は、ヘッド固有値96の読み出し、及び稼動ログ95の書き込み以外の用途で不揮発性メモリ85を使用しても良い。例えば、CPU83は、エラーや警告の履歴を不揮発性メモリ85に書き込んでも良い。
It goes without saying that the present disclosure is not limited to the above-described embodiment, and various improvements and changes can be made without departing from the spirit of the present application.
For example, the mounting device in the present disclosure is not limited to the head portion 25, and an X-axis slide mechanism 27A, a substrate transfer device 22, a feeder 29, and the like can be adopted. When the feeder 29 is adopted, the CPU 83 may store the number of times the electronic components are supplied from the feeder 29 as the operation log 95.
Further, when the slave controller 81 and the access control circuit 87 receive a request from the master 43 to instruct the second slave 61 to read the slave information 93, the slave controller 81 transmits the slave information 93 to the master 43 (S15). ), Not limited to this. The slave controller 81 and the access control circuit 87 may transmit the slave information 93 to the master 43, for example, on condition that the reading of the slave information 93 in S13 is completed. That is, the slave information 93 may be spontaneously transmitted to the master 43 at a predetermined processing timing without requiring a request from the master 43. Also in this case, by reading the slave information 93 into the RAM 107 in advance, the non-volatile memory 85 can be accessed by the CPU 83 without causing an access conflict with the non-volatile memory 85. ..
Further, a slave device may be provided in the loader 13 to control the operation of the loader 13. That is, the loader 13 may be connected to the industrial network. In this case, the CPU 83 may store the number of times the loader 13 is moved, the number of times the feeder 29 is replaced, and the like in the operation log 95.
Further, the component mounting machine 20 may be configured not to include the loader 13. In this case, the feeder 29 may be replaced manually by the worker.
Further, the CPU 83 may be configured to execute at least one of reading the head eigenvalue 96 and writing the operation log 95. Further, the CPU 83 may use the non-volatile memory 85 for purposes other than reading the head eigenvalue 96 and writing the operation log 95. For example, the CPU 83 may write the history of errors and warnings to the non-volatile memory 85.
 また、CPU83は、スレーブ情報93を読み出す処理(S13)を、S17やS19の処理前に実行したが、これに限らない。例えば、CPU83が、ヘッド固有値96を読み出した後、スレーブ情報93をRAM107に読み出す処理を実行しても良い。
 また、ヘッド部25は、装置本体部21に対して脱できない構成でも良い。
 また、稼動ログ95の書き込みやヘッド固有値96の読み出しは、CPU83以外の装置、例えば、スレーブコントローラ81が実行しても良い。
 また、多重通信回線は、Gigabit Ethernet(登録商標)に限らず、例えば、光ファイバーケーブルを用いた光通信でも良い。また、多重通信回線は、有線通信に限らず無線通信でも良い。
 また、部品装着機20は、多重通信システムを備えなくとも良い。この場合、マスター43は、多重通信回線を介さずに、第1スレーブ51等の間で制御データCDを送受信しても良い。
Further, the CPU 83 executes the process of reading the slave information 93 (S13) before the processes of S17 and S19, but the present invention is not limited to this. For example, the CPU 83 may execute a process of reading the slave information 93 into the RAM 107 after reading the head eigenvalue 96.
Further, the head portion 25 may be configured so as not to be detached from the device main body portion 21.
Further, the operation log 95 may be written and the head eigenvalue 96 may be read by a device other than the CPU 83, for example, the slave controller 81.
Further, the multiplex communication line is not limited to Gigabit Ethernet (registered trademark), and may be, for example, optical communication using an optical fiber cable. Further, the multiplex communication line is not limited to wired communication but may be wireless communication.
Further, the component mounting machine 20 does not have to be provided with the multiplex communication system. In this case, the master 43 may send and receive the control data CD between the first slave 51 and the like without going through the multiplex communication line.
 また、上記実施例では本開示における作業機として、電子部品を基板17に装着する部品装着機20を採用した例について説明した。しかしながら、本開示における作業機は、部品装着機20に限定されるものではなく、基板17にはんだを塗布するはんだ印刷装置などの他の作業機を採用することができる。また、作業機は、例えば、工作機械や組立て作業を実施するロボットでも良い。 Further, in the above embodiment, an example in which the component mounting machine 20 for mounting electronic components on the substrate 17 is adopted as the working machine in the present disclosure has been described. However, the working machine in the present disclosure is not limited to the component mounting machine 20, and other working machines such as a solder printing device for applying solder to the substrate 17 can be adopted. Further, the working machine may be, for example, a machine tool or a robot that performs assembly work.
 17 基板、20 部品装着機(作業機)、21 装置本体部、25 ヘッド部(搭載装置、装着ヘッド、可動部)、43 マスター、51 第1スレーブ(通信装置)、61 第2スレーブ(通信装置)、81 スレーブコントローラ(スレーブ)、83 CPU(処理回路)、85 不揮発性メモリ(メモリ)、93 スレーブ情報、96 ヘッド固有値(搭載装置識別情報)、107 RAM(記憶装置)、CD 制御データ。 17 board, 20 parts mounting machine (working machine), 21 device body, 25 head (mounting device, mounting head, movable part), 43 master, 51 first slave (communication device), 61 second slave (communication device) ), 81 Slave controller (slave), 83 CPU (processing circuit), 85 non-volatile memory (memory), 93 slave information, 96 head unique value (mounted device identification information), 107 RAM (storage device), CD control data.

Claims (8)

  1.  産業用ネットワークにおけるマスターと接続されるスレーブと、
     前記スレーブに係わる情報であるスレーブ情報を記憶するメモリと、
     前記マスターから伝送される制御データに基づいた処理を実行し、前記メモリに対するアクセスを実行する処理回路と、
     前記スレーブ、前記処理回路、及び前記メモリに接続され、前記メモリから前記スレーブ情報を読み出して記憶する記憶装置を備え、前記記憶装置へ読み出した前記スレーブ情報を、前記スレーブを介して前記マスターへ送信するアクセス制御回路と、
    を備える、通信装置。
    Slave connected to master in industrial network,
    A memory that stores slave information, which is information related to the slave, and
    A processing circuit that executes processing based on the control data transmitted from the master and executes access to the memory, and
    The slave, the processing circuit, and a storage device connected to the memory and reading and storing the slave information from the memory are provided, and the slave information read into the storage device is transmitted to the master via the slave. Access control circuit and
    A communication device.
  2.  前記アクセス制御回路は、
     前記マスターから前記スレーブに対して前記スレーブ情報の読み出しを指示する要求が受信された場合に、前記記憶装置へ読み出した前記スレーブ情報を前記マスターへ送信する、請求項1に記載の通信装置。
    The access control circuit
    The communication device according to claim 1, wherein when a request for instructing the slave to read the slave information is received from the master, the slave information read to the storage device is transmitted to the master.
  3.  前記処理回路は、
     前記スレーブ情報を前記記憶装置へ読み出す処理を、前記アクセス制御回路に実行させた後、前記スレーブ情報以外のデータについて前記メモリへアクセスする処理を開始する、請求項1又は請求項2に記載の通信装置。
    The processing circuit
    The communication according to claim 1 or 2, wherein the access control circuit executes a process of reading the slave information to the storage device, and then starts a process of accessing the memory for data other than the slave information. apparatus.
  4.  前記スレーブ情報は、
     前記スレーブを識別するための固有値である、請求項1乃至請求項3の何れか1項に記載の通信装置。
    The slave information is
    The communication device according to any one of claims 1 to 3, which is an eigenvalue for identifying the slave.
  5.  前記メモリは、
     前記通信装置を搭載する搭載装置を識別するための搭載装置識別情報を記憶し、
     前記処理回路は、
     前記マスターから前記スレーブに対して前記搭載装置識別情報の読み出しを指示する前記制御データが受信された場合に、前記アクセス制御回路を介して前記メモリから前記搭載装置識別情報を読み出し、読み出した前記搭載装置識別情報を、前記スレーブを介して前記マスターへ送信する、請求項1乃至請求項4の何れか1項に記載の通信装置。
    The memory is
    The on-board device identification information for identifying the on-board device on which the communication device is mounted is stored.
    The processing circuit
    When the control data instructing the slave to read the mounted device identification information is received from the master, the mounted device identification information is read from the memory via the access control circuit and read out. The communication device according to any one of claims 1 to 4, wherein the device identification information is transmitted to the master via the slave.
  6.  前記処理回路は、
     前記通信装置を搭載する搭載装置の稼動に係わる稼動ログを、前記アクセス制御回路を介して前記メモリへ書き込む、請求項1乃至請求項5の何れか1項に記載の通信装置。
    The processing circuit
    The communication device according to any one of claims 1 to 5, wherein an operation log related to the operation of the on-board device on which the communication device is mounted is written to the memory via the access control circuit.
  7.  前記通信装置は、
     電子部品を基板に装着する作業を行なう装着ヘッドに設けられる、請求項1乃至請求項6の何れか1項に記載の通信装置。
    The communication device is
    The communication device according to any one of claims 1 to 6, which is provided on a mounting head for mounting an electronic component on a substrate.
  8.  請求項1乃至請求項7の何れか1項に記載の前記通信装置を備える作業機であって、
     前記マスターと、
     前記マスターが設けられる装置本体部と、
     前記通信装置が設けられ、前記装置本体部に対して相対的に移動する可動部と、
    を備える、作業機。
    A working machine provided with the communication device according to any one of claims 1 to 7.
    With the master
    The main body of the device on which the master is provided and
    A movable portion provided with the communication device and moving relative to the main body of the device, and a movable portion.
    Equipped with a working machine.
PCT/JP2019/040835 2019-10-17 2019-10-17 Communication device and work machine WO2021075019A1 (en)

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JP2008198098A (en) * 2007-02-15 2008-08-28 Oki Data Corp Information processor
JP2018106628A (en) * 2016-12-28 2018-07-05 ルネサスエレクトロニクス株式会社 Semiconductor apparatus, security processing executing apparatus, and security processing executing method
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