WO2021073159A1

WO2021073159A1 - Thin integrated structure vapor chamber

Info

Publication number: WO2021073159A1
Application number: PCT/CN2020/099394
Authority: WO
Inventors: 蔡文龙; 洪广; 闫晓峰; 张于光
Original assignee: 昆山联德电子科技有限公司
Priority date: 2019-10-15
Filing date: 2020-06-30
Publication date: 2021-04-22
Also published as: CN110678046A

Abstract

The present invention provides a thin integrated structure vapor chamber. A vapor chamber body and a plastic component are integrated into an integral component so that the vapor chamber is high in precision and good in strength, additional locking and fixing bonding parts and labor costs are not needed, a central heat dissipation area of the vapor chamber fills in a whole electronic mobile terminal, and heat conduction and heat dissipation effects are improved. The vapor chamber comprises the vapor chamber body and a plastic portion. The vapor chamber body comprises a middle heat dissipation portion and a peripheral connection portion. The plastic portion comprises a middle heat dissipation portion placement area and a pre-embedded frame. The central area of the pre-embedded frame is the middle heat dissipation portion placement area. The peripheral connection portion is embedded in a thickness direction area of the pre-embedded frame, the corresponding pre-embedded frame covers the upper surface and the lower surface of the peripheral connection portion, the middle heat dissipation portion is located in the middle heat dissipation portion placement area, and the upper surface and the lower surface of the middle heat dissipation portion are exposed.

Description

Thin integrated structure temperature equalizing plate

Technical field

The present invention relates to the technical field of uniform temperature plate structure, in particular to a thin integrated structure temperature uniform plate.

Background technique

With the improvement of people's living standards, the functions and appearance of computers, tablets, and mobile phones continue to upgrade, and the requirements for power consumption and thinner experience are also increasing. The uniform temperature plate has gradually replaced the traditional heat pipe for heat dissipation. The uniform temperature plate has good 2D surface thermal conductivity and has the characteristics of light weight.

The existing temperature equalizing plate structure has the following shortcomings in the application of electronic mobile terminals:

1 Existing temperature equalizing plates exist in the form of a single part in the mobile terminal. This method has low positioning accuracy and is not firm, and there is a gap in contact with the peripheral structure of the mobile terminal after installation, and the heat dissipation performance is greatly affected. ；

2 Existing uniform temperature plates exist in the form of a single part in the mobile terminal, which requires a large number of fasteners or adhesive parts to fix, the parts cost, the assembly cost is high, the efficiency is low, and most of the adhesive materials have environmental pollution. risk;

3 The existing temperature equalizing plate manufacturing process has a certain size of sealing flange around it, and the sealing flange has no thermal conductivity. The sealing flange of the usual equalizing plate occupies the internal space of the mobile terminal and does not Play the role of heat conduction and heat dissipation, and the effect of heat conduction and heat dissipation is not ideal.

Summary of the invention

In view of the above-mentioned problems, the present invention provides a thin integrated structure temperature equalizing plate, which integrates the temperature equalizing plate body and the plastic parts into an integral piece, so that the equalizing plate has high precision and good strength, and does not require additional locking and bonding parts and labor. Cost, the central heat dissipation area of the temperature equalizing plate fills the entire electronic mobile terminal, which improves heat conduction and heat dissipation.

The thin integrated structure temperature equalization plate is characterized in that it includes a temperature equalization plate body and a plastic part. The equalization plate body includes a middle heat dissipation part and an outer peripheral connection part. The plastic part includes a middle heat dissipation part placement area and a pre-embedded part. The central area of the embedded frame is the place where the central heat dissipation part is placed, the outer peripheral connecting part is embedded in the thickness direction area of the embedded frame, and the upper and lower surfaces of the outer peripheral connecting part are covered with corresponding In the embedded frame, the middle heat dissipation part is arranged in the placement area of the middle heat dissipation part, and the upper and lower surfaces of the middle heat dissipation part are exposed and arranged.

Its further features are:

Corresponding lateral convex positioning pieces are provided on the outer circumference of the outer circumferential connecting portion, and the lateral convex positioning pieces are embedded in the interior of the embedded frame;

The side convex positioning member is arranged on the outer side of a pair of sides of the outer peripheral connecting portion;

The side convex positioning member includes, but is not limited to, a trapezoidal, rectangular, rectangular with positioning hole, rectangular with positioning hooks on the outside, and a horizontal T-shaped shape; which makes the embedded frame of the plastic part cover the residence The side convex positioning parts ensure that the connection between the body of the temperature equalizing plate and the plastic part is stable and reliable;

The temperature equalizing plate body is formed by a combination of an upper cover plate and a lower cover plate, and the outer peripheries of the upper cover plate and the lower cover plate are spliced to form a process flange. The temperature equalizing plate body corresponds to the corresponding shape of the electronic product of the corresponding model. Corresponding through holes and slots are provided at the outer peripheral connection part of the temperature equalization plate body corresponding to the assembly position of the electronic product to ensure that the connection is quick and convenient;

The plastic part integrates the temperature equalizing plate body and the plastic part structure through the plastic embedding and injection molding method. The equalizing plate body is put into the plastic molding mold, and after the mold is closed, fluid is injected into the plastic to form the corresponding plastic part. The pre-embedded frame of the plastic part covers the corresponding outer peripheral connection part, and is formed into a thin integrated structure temperature equalizing plate after being taken out;

The plastic part corresponds to the configuration corresponding to the electronic product, and the plastic part also includes positioning holes and connecting holes at the outer frame position, so that the integral structure formed by connecting the plastic part with the temperature equalizing plate body is directly used for assembling electronic products.

After adopting the above technical solution, the body of the temperature equalization plate and the integrated plastic part are formed by plastic embedding and injection molding. After molding, the temperature equalization plate and the plastic part are combined into one structure, which has relatively high accuracy, good strength, and tight fit. The thermal impedance between the two is low and the heat conduction and heat dissipation effect is good; the injection processing method can embed the temperature equalizing plate body into the plastic part for one-time molding, no need for additional locking or bonding, reducing the use of locking and bonding parts, Its one-time molding efficiency is high, and there is no need for additional locking and adhesive parts and labor costs, and no adhesive materials are needed, so it is safe and environmentally friendly; the body and the plastic part of the uniform temperature plate form a mechanical part, which is used as the middle board or back of the electronic product. The plate also functions as a mechanism structural part, which is convenient for the assembly of other functional elements. Because the present invention embeds the process flange of the uniform temperature plate into the surrounding plastic parts, the actual central portion of the uniform temperature plate that plays a role of heat dissipation is filled. The entire middle part of the mechanism greatly improves the heat conduction and heat dissipation effect of the temperature equalization plate; the technology of the present invention integrates the temperature equalization plate and the plastic part together, avoids the use of a large number of screws in the traditional technology, and effectively ensures that the thickness of the electronic product is up to The thinnest is 0.3mm. In terms of design, the uniform temperature plate and the plastic mechanism can be of any shape, which is convenient for reducing or adding accessories in the integrated structure. The design compatibility is strong, and the design and manufacturing time period and manufacturing cost are greatly reduced.

Description of the drawings

Fig. 1 is a schematic structural diagram of a three-dimensional view of a specific embodiment of the temperature equalizing plate of the present invention;

2 is a schematic structural diagram of a three-dimensional view of the second embodiment of the temperature equalizing plate of the present invention;

3 is a schematic structural diagram of a three-dimensional view of a specific embodiment three of the temperature equalizing plate of the present invention;

4 is a schematic structural diagram of a three-dimensional view of the fourth embodiment of the uniform temperature plate of the present invention;

FIG. 5 is a schematic structural diagram of a three-dimensional view of the plastic part of a specific embodiment of the present invention

6 is a schematic diagram of a three-dimensional structure of an integrated structure temperature equalizing plate formed by combining FIGS. 1 and 4 of FIG. 2;

Fig. 7 is a schematic sectional view of the front view of Fig. 6;

The names corresponding to the serial numbers in the figure are as follows:

The temperature equalizing plate body 1, the middle heat dissipation part 11, the outer peripheral connection part 12, the side convex positioning member 13, the through hole slot 14, the upper cover 101, the lower cover 102, the process flange 103, the plastic part 2, the middle heat dissipation part is placed Area 21, embedded frame 22, positioning hole 23, connection hole 24.

Detailed ways

Thin-type integrated structure uniform temperature plate, see Figure 1-7: It includes uniform temperature plate body 1, plastic part 2, uniform temperature plate body 1 includes middle heat dissipation part 11, outer peripheral connecting part 12, plastic part 2 includes middle heat dissipation part Placement area 21, pre-embedded frame 22, the central area of the pre-embedded frame 22 is the central heat sink placement area 21, the outer peripheral connecting part 12 is embedded in the thickness direction area of the embedded frame 22, the upper and lower surfaces of the outer peripheral connecting part 12 Both are covered with a corresponding embedded frame 22, the middle heat dissipating part 11 is arranged in the middle heat dissipating part placement area 21, and the upper and lower surfaces of the middle heat dissipating part 11 are exposed and arranged.

Corresponding side convex positioning pieces 13 are provided on the outer circumference of the outer circumferential connecting portion 12, and the side convex positioning pieces 13 are embedded in the interior of the embedded frame;

The side convex positioning members 13 are evenly distributed on the outer side of a pair of long sides of the outer peripheral connecting portion 12 to ensure a simple structure and a firm and accurate positioning;

Side convex positioning parts include, but are not limited to, outwardly flared trapezoid (see Figure 2), rectangle, rectangle with positioning holes (see Figure 3), rectangle with positioning hooks on the outside (see Figure 4), horizontal T-shaped Shape (see Figure 1); it makes the embedded frame 22 of the plastic part 2 wrap the side convex positioning member 13, and ensure that the connection between the temperature equalizing plate body 1 and the plastic part 2 is stable and reliable;

The temperature equalizing plate body 1 is formed by a combination of an upper cover plate 101 and a lower cover plate 102. The outer peripheries of the upper cover plate 101 and the lower cover plate 102 are spliced to form a process flange 103. The temperature equalizing plate body 1 corresponds to the corresponding type of electronic product setting. In the form of, the outer peripheral connecting portion 12 of the uniform temperature plate body 1 is provided with a corresponding through hole slot 14 corresponding to the assembly position of the electronic product to ensure that the connection is quick and convenient;

The plastic part 2 combines the structure of the temperature equalizing plate body 1 and the plastic part 2 through the plastic embedding and injection molding method. Put the temperature equalizing plate body 1 into the plastic molding mold, and after the mold is closed, the fluid is injected into the plastic to form the corresponding plastic part. 2. The pre-embedded frame 22 of the plastic part 2 covers the corresponding outer peripheral connecting part 12, and after taking it out, it is formed into a thin integrated structure uniform temperature plate;

The plastic part 2 corresponds to the configuration corresponding to the electronic product. The plastic part 2 also includes a positioning hole 23 and a connecting hole 24 at the outer frame position, which makes the plastic part 2 and the temperature equalizing plate body 1 form an integral structure directly used for assembling electronics product.

Its beneficial effects are as follows:

1 The body of the homogenizing plate and the integrated plastic part are formed by plastic embedding and injection molding. After molding, the homogenizing plate and the plastic part are combined into one structure, which has relatively high precision, good strength, and close thermal resistance between the two. Features such as low thermal conductivity and good heat dissipation effect;

2 The injection processing method can embed the body of the uniform temperature plate into the plastic part for one-time molding, no additional locking or bonding is required, reducing the use of locking and bonding parts, and its one-time molding efficiency is high, and no additional locks are required. Fixed adhesive parts and labor costs, and no adhesive materials are needed, so it is safe and environmentally friendly;

3 The body of the temperature equalizing plate and the plastic part form a mechanical part, which serves as the middle plate or back plate of the electronic product and functions as a mechanical structural part at the same time, facilitating the assembly of other functional elements, because the present invention embeds the edge of the process flange Into the surrounding plastic parts, the actual heat-dissipating part of the temperature equalizing plate in the middle part fills the middle of the whole mechanism, which greatly improves the heat conduction and heat dissipation effect of the equalizing plate;

4 The technology of the present invention integrates the temperature equalizing plate and the plastic part, avoiding the use of a large number of screws in the traditional technology, and effectively ensuring the thickness of the electronic product to the thinnest 0.3mm. In terms of design, the equalizing plate and the plastic mechanism can be of any shape , It is convenient to reduce or increase the design compatibility of accessories in the integrated structure, and the design and manufacturing time cycle and manufacturing cost are greatly reduced.

For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description, and therefore it is intended to fall into the claims. All changes within the meaning and scope of the equivalent elements of are included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

In addition, it should be understood that although this specification is described in accordance with the implementation manners, not each implementation manner only includes an independent technical solution. This narration in the specification is only for the sake of clarity, and those skilled in the art should regard the specification as a whole The technical solutions in the various embodiments can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

The thin integrated structure temperature equalization plate is characterized in that it includes a temperature equalization plate body and a plastic part. The equalization plate body includes a middle heat dissipation part and an outer peripheral connection part. The plastic part includes a middle heat dissipation part placement area and a pre-embedded part. The central area of the pre-embedded frame is the place where the central heat dissipation part is placed, the outer peripheral connecting part is embedded in the thickness direction area of the embedded frame, and the upper and lower surfaces of the outer peripheral connecting part are covered with corresponding In the embedded frame, the middle heat dissipation part is arranged in the placement area of the middle heat dissipation part, and the upper and lower surfaces of the middle heat dissipation part are exposed and arranged.
The thin integrated structure temperature equalization plate according to claim 1, wherein the outer periphery of the outer peripheral connecting portion is provided with a corresponding side convex positioning member, and the side convex positioning member is embedded in the interior of the embedded frame .
The thin integrated structure temperature equalization plate according to claim 2, wherein the side convex positioning member is located outside a pair of sides of the outer peripheral connecting portion.
The thin integrated structure temperature equalizing plate according to claim 2 or 3, characterized in that: the side convex positioning member includes, but is not limited to, an outwardly flaring trapezoid, a rectangle, a rectangle with a positioning hole, and a positioning hook on the outside. The rectangular, horizontal T-shaped shape.
The thin integrated structure temperature equalization plate according to claim 1, wherein the temperature equalization plate body is formed by a combination of an upper cover plate and a lower cover plate, and the outer peripheries of the upper cover plate and the lower cover plate are spliced to form a process flange, The uniform temperature plate body is provided with a corresponding form corresponding to the electronic product of the corresponding model, and the outer peripheral connection part of the uniform temperature plate body is provided with a corresponding through hole slot corresponding to the assembly position of the electronic product.
The thin integrated structure temperature equalization plate of claim 1, wherein the plastic part is formed by embedding the plastic injection molding method to integrate the temperature equalization plate body and the plastic part structure into one body, and inserting the equalization plate body into the plastic In the molding mold, after closing the mold, fluid plastic is injected to form a corresponding plastic part, and the embedded frame of the plastic part covers the corresponding outer peripheral connection part, and after taking it out, it is formed into a thin integrated structure uniform temperature plate.
The thin integrated structure temperature equalization plate according to claim 1, wherein the plastic part corresponds to the configuration corresponding to the electronic product, and the plastic part further includes a positioning hole and a connecting hole at the position of the outer frame.