CN210900132U - Thin type integrated structure temperature equalizing plate - Google Patents
Thin type integrated structure temperature equalizing plate Download PDFInfo
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- CN210900132U CN210900132U CN201921720151.9U CN201921720151U CN210900132U CN 210900132 U CN210900132 U CN 210900132U CN 201921720151 U CN201921720151 U CN 201921720151U CN 210900132 U CN210900132 U CN 210900132U
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- temperature
- heat dissipation
- uniforming plate
- plastic
- plate body
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Abstract
The utility model provides a slim integrated configuration samming board, it forms the whole with samming board body and plastic part set for the samming board precision is high, intensity is good, and does not need extra lock solid to bind part and cost of labor, and the central heat dissipation area of samming board fills up whole electron mobile terminal, has improved the heat conduction radiating effect. The temperature-uniforming plate comprises a temperature-uniforming plate body and a plastic part, wherein the temperature-uniforming plate body comprises a middle heat dissipation part and a peripheral connecting part, the plastic part comprises a middle heat dissipation part placing area and a pre-embedded frame, the central area of the pre-embedded frame is the middle heat dissipation part placing area, the peripheral connecting part is embedded in the thickness direction area of the pre-embedded frame, the upper surface and the lower surface of the peripheral connecting part are covered with the corresponding pre-embedded frames, the middle heat dissipation part is located in the middle heat dissipation part placing area, and the upper surface and the lower surface of the middle heat dissipation part are exposed and arranged.
Description
Technical Field
The utility model relates to a technical field of vapor chamber structure specifically is slim integrated configuration vapor chamber.
Background
With the improvement of living standard of people, the functions and the appearances of computers, tablet computers and mobile phones are continuously upgraded, and the requirements of power consumption and light and thin experience are also continuously improved. The vapor chamber has gradually replaced the conventional heat pipe for heat dissipation. The temperature equalizing plate has good 2D surface heat conduction capability and has the characteristic of light weight.
The existing temperature equalizing plate structure has the following defects in the application of the electronic mobile terminal:
1 the existing temperature equalizing plate exists in a mobile terminal in the form of a single part, the matching and positioning precision of the mode is low and insecure, and after the temperature equalizing plate is installed, a gap is formed between the temperature equalizing plate and the peripheral structure of the mobile terminal, so that the heat radiation performance is greatly influenced;
2 the existing temperature equalizing plate exists in the form of single part in the mobile terminal, needs a large amount of locking pieces or sticking pieces for fixation, has high part cost and assembly cost and low efficiency, and most sticking substances have the risk of environmental pollution;
3 the existing process for manufacturing the uniform temperature plate has a sealing flange edge with a certain size at the periphery, the sealing flange edge has no heat conduction capability, the sealing flange edge of the common uniform temperature plate occupies the internal space of the mobile terminal, and does not play a role in heat conduction and heat dissipation, so that the heat conduction and heat dissipation effect is not ideal.
Disclosure of Invention
To the above problem, the utility model provides a slim integrated configuration samming board, it forms the whole piece with samming board body and plastic part set for the samming board precision is high, intensity is good, and does not need extra lock solid to bind part and cost of labor, and whole electron mobile terminal is filled up in the central heat dissipation area of samming board, has improved the heat conduction radiating effect.
Thin integrated structure temperature-uniforming plate, its characterized in that: the temperature-uniforming plate comprises a temperature-uniforming plate body and a plastic part, wherein the temperature-uniforming plate body comprises a middle heat dissipation part and a peripheral connecting part, the plastic part comprises a middle heat dissipation part placing area and a pre-embedded frame, the central area of the pre-embedded frame is the middle heat dissipation part placing area, the peripheral connecting part is embedded in the thickness direction area of the pre-embedded frame, the upper surface and the lower surface of the peripheral connecting part are covered with the corresponding pre-embedded frames, the middle heat dissipation part is located in the middle heat dissipation part placing area, and the upper surface and the lower surface of the middle heat dissipation part are exposed and arranged.
It is further characterized in that:
the periphery of the peripheral connecting part is provided with corresponding side convex positioning pieces, and the side convex positioning pieces are embedded in the embedded frame;
the side convex positioning piece is arranged at the outer side of one pair of sides of the periphery connecting part;
the side convex positioning piece comprises but is not limited to a trapezoid with outward flaring, a rectangle with a positioning hole, a rectangle with a positioning hook on the outer side and a horizontal T-shaped shape; the embedded frame of the plastic part covers the side convex positioning piece, so that the stable and reliable connection of the uniform temperature plate body and the plastic part is ensured;
the temperature-uniforming plate body is formed by combining an upper cover plate and a lower cover plate, the peripheries of the upper cover plate and the lower cover plate are spliced to form a process flange, the temperature-uniforming plate body is correspondingly provided with a shape corresponding to an electronic product of a corresponding model, and a corresponding through hole groove is formed in the position, corresponding to the assembling position of the electronic product, of the peripheral connecting part of the temperature-uniforming plate body, so that the connection is rapid and convenient;
the plastic part integrates the temperature-uniforming plate body and the plastic part structure into a whole in a plastic embedding and injection molding mode, the temperature-uniforming plate body is placed in a plastic molding die, fluid plastic is injected into the die after die assembly to be molded into a corresponding plastic part, a pre-embedded frame of the plastic part covers the corresponding peripheral connecting part, and the plastic part is taken out to be molded into the thin integrated structure temperature-uniforming plate;
the plastic part is provided with a corresponding shape corresponding to the electronic product, and also comprises a positioning hole and a connecting hole at the position of the outer frame, so that the plastic part is communicated with the temperature equalizing plate body to form an integral structure which is directly used for assembling the electronic product.
After the technical scheme is adopted, the temperature-equalizing plate body and the integrated plastic part are molded by plastic embedding and injection, and the molded temperature-equalizing plate and the plastic part are structurally combined into a whole, so that the temperature-equalizing plate has the characteristics of high relative precision, good strength, low thermal impedance between the temperature-equalizing plate body and the plastic part, good heat conduction and heat dissipation effects and the like; the injection processing mode can embed the temperature-uniforming plate body into the plastic part for one-time molding without additional locking or pasting, so that the use of locking pasting parts is reduced, the one-time molding efficiency is high, additional locking pasting parts and labor cost are not needed, and meanwhile, pasting substances are not needed any more, so that the temperature-uniforming plate is safe and environment-friendly; the temperature equalizing plate body and the plastic part form a machine component, and the machine component can play a role of a mechanism structural part when being used as a middle plate or a back plate of an electronic product, thereby being convenient for assembling other functional elements; the utility model discloses the technique is originally integrated together with the plastic part with the samming board, has avoided the use of a large amount of screws of traditional technique, and the effectual thickness of guaranteeing the electronic product is to thinnest 0.3mm, and samming board and plastic mechanism spare can arbitrary shape in the aspect of the design, and it is strong to be convenient for reduce or increase accessory design compatibility at integrated structure, the time cycle and the manufacturing cost greatly reduced of design, manufacturing.
Drawings
Fig. 1 is a schematic perspective view of a vapor chamber according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a second perspective view of a temperature-uniforming plate according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a three-dimensional view of a specific embodiment of the vapor chamber of the present invention;
fig. 4 is a schematic structural view of a four-dimensional view of a specific embodiment of the vapor chamber of the present invention;
FIG. 5 is a schematic perspective view of a plastic part according to an embodiment of the present invention
FIG. 6 is a schematic perspective view of the temperature equalization plate of FIG. 2 formed by combining FIG. 1 and FIG. 4;
FIG. 7 is a front view cross-sectional structural schematic of FIG. 6;
the names corresponding to the sequence numbers in the figure are as follows:
the temperature equalizing plate comprises a temperature equalizing plate body 1, a middle heat radiating part 11, a peripheral connecting part 12, a side convex positioning piece 13, a through hole groove 14, an upper cover plate 101, a lower cover plate 102, a process flange 103, a plastic part 2, a middle heat radiating part placing area 21, a pre-buried frame 22, a positioning hole 23 and a connecting hole 24.
Detailed Description
The thin integrated structure vapor chamber is shown in fig. 1-7: it includes temperature-uniforming plate body 1, plastic part 2, temperature-uniforming plate body 1 includes middle part heat dissipation part 11, periphery coupling part 12, plastic part 2 places region 21 including middle part heat dissipation part, pre-buried frame 22, the central zone of pre-buried frame 22 is middle part heat dissipation part places region 21, periphery coupling part 12 buries and installs in pre-buried frame 22's thickness direction region, periphery coupling part 12 is last, the lower surface all covers has corresponding pre-buried frame 22, middle part heat dissipation part 11 is located middle part heat dissipation part places region 21 and sets up, middle part heat dissipation part 11 is last, the lower surface exposes and arranges.
The periphery of the peripheral connecting part 12 is provided with a corresponding side convex positioning piece 13, and the side convex positioning piece 13 is embedded in the embedded frame;
the side convex positioning pieces 13 are arranged at intervals and uniformly distributed on the outer sides of the pair of long sides of the outer periphery connecting part 12, so that the structure is simple, and the positioning is firm and accurate;
the side convex positioning pieces include, but are not limited to, a ladder shape (see fig. 2) with outward flaring, a rectangle shape with positioning holes (see fig. 3), a rectangle shape with positioning hooks at the outer side (see fig. 4), and a horizontal T-shape (see fig. 1); the embedded frame 22 of the plastic part 2 covers the side convex positioning piece 13, so that the connection between the uniform temperature plate body 1 and the plastic part 2 is stable and reliable;
the temperature-uniforming plate body 1 is formed by combining an upper cover plate 101 and a lower cover plate 102, the peripheries of the upper cover plate 101 and the lower cover plate 102 are spliced to form a process flange 103, the temperature-uniforming plate body 1 is correspondingly arranged in a shape corresponding to an electronic product of a corresponding model, and a corresponding through hole groove 14 is formed in the position, corresponding to the assembling position of the electronic product, of a peripheral connecting part 12 of the temperature-uniforming plate body 1, so that the connection is rapid and convenient;
the plastic part 2 structurally combines the temperature-uniforming plate body 1 with the plastic part 2 into a whole by a plastic embedding injection molding mode, the temperature-uniforming plate body 1 is placed into a plastic molding die, fluid plastic is injected into the die after die assembly to be molded into the corresponding plastic part 2, an embedded frame 22 of the plastic part 2 covers the corresponding peripheral connecting part 12, and the temperature-uniforming plate with the thin integrated structure is molded after being taken out;
the plastic part 2 is provided with a corresponding shape corresponding to the electronic product, and the plastic part 2 further comprises a positioning hole 23 and a connecting hole 24 at the outer frame position, so that the plastic part 2 and the temperature-uniforming plate body 1 form an integral structure which is directly used for assembling the electronic product.
The beneficial effects are as follows:
1, a plastic embedded injection molding mode is adopted for the temperature-equalizing plate body and the integrated plastic part, and the temperature-equalizing plate and the plastic part are structurally combined into a whole after molding, so that the temperature-equalizing plate has the characteristics of high relative precision, good strength, low thermal impedance between the temperature-equalizing plate body and the plastic part which are tightly attached, good heat conduction and heat dissipation effects and the like;
2, the injection processing mode can embed the temperature-uniforming plate body into the plastic part for one-time molding without additional locking or sticking, so that the use of locking and sticking parts is reduced, the one-time molding efficiency is high, additional locking and sticking parts and labor cost are not needed, and sticking substances are not needed any more, so that the temperature-uniforming plate is safe and environment-friendly;
3 the temperature equalizing plate body and the plastic part form a machine component, and the machine component has the function of a mechanism structural part when being used as a middle plate or a back plate of an electronic product, thereby being convenient for assembling other functional elements;
the utility model discloses the technique is originally integrated together with the plastic part with the samming board, has avoided the use of a large amount of screws of traditional technique, and effectual thickness to the thinnest 0.3mm of guaranteeing the electronic product, and samming board and plastic mechanism spare can arbitrary shape in the aspect of the design, are convenient for reduce or increase the accessory design compatibility at integrated structure strong, the time cycle and the manufacturing cost greatly reduced of design, manufacturing.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. Thin integrated structure temperature-uniforming plate, its characterized in that: the temperature-uniforming plate comprises a temperature-uniforming plate body and a plastic part, wherein the temperature-uniforming plate body comprises a middle heat dissipation part and a peripheral connecting part, the plastic part comprises a middle heat dissipation part placing area and a pre-embedded frame, the central area of the pre-embedded frame is the middle heat dissipation part placing area, the peripheral connecting part is embedded in the thickness direction area of the pre-embedded frame, the upper surface and the lower surface of the peripheral connecting part are covered with the corresponding pre-embedded frames, the middle heat dissipation part is located in the middle heat dissipation part placing area, and the upper surface and the lower surface of the middle heat dissipation part are exposed and arranged.
2. The thin integrated structure vapor chamber of claim 1, wherein: the periphery of the periphery connecting part is provided with corresponding side convex positioning pieces, and the side convex positioning pieces are embedded in the embedded frame.
3. The thin integrated structure vapor chamber of claim 2, wherein: the side protruding positioning piece is arranged at the outer side of one pair of sides of the periphery connecting part.
4. The thin integrated structure vapor chamber according to claim 2 or 3, wherein: the side convex positioning piece comprises, but is not limited to, a trapezoid with outward flaring, a rectangle with positioning holes, a rectangle with positioning hooks on the outer side, and a horizontal T-shaped shape.
5. The thin integrated structure vapor chamber of claim 1, wherein: the temperature-uniforming plate body is formed by combining an upper cover plate and a lower cover plate, the peripheries of the upper cover plate and the lower cover plate are spliced to form a process flange, the temperature-uniforming plate body is correspondingly provided with corresponding shapes corresponding to electronic products of corresponding models, and corresponding through hole grooves are formed in the positions, corresponding to the assembling positions of the electronic products, of the peripheral connecting parts of the temperature-uniforming plate body.
6. The thin integrated structure vapor chamber of claim 1, wherein: the plastic part combines the temperature-uniforming plate body and the plastic part structure into a whole in a plastic embedding and injection molding mode, the temperature-uniforming plate body is placed into a plastic molding die, fluid plastic is injected into the die after die assembly to be molded into the corresponding plastic part, the embedded frame of the plastic part covers the corresponding peripheral connecting part, and the temperature-uniforming plate with the thin integrated structure is formed after being taken out.
7. The thin integrated structure vapor chamber of claim 1, wherein: the plastic part is provided with a corresponding shape corresponding to the electronic product, and also comprises a positioning hole and a connecting hole at the position of the outer frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921720151.9U CN210900132U (en) | 2019-10-15 | 2019-10-15 | Thin type integrated structure temperature equalizing plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921720151.9U CN210900132U (en) | 2019-10-15 | 2019-10-15 | Thin type integrated structure temperature equalizing plate |
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| CN210900132U true CN210900132U (en) | 2020-06-30 |
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| CN201921720151.9U Active CN210900132U (en) | 2019-10-15 | 2019-10-15 | Thin type integrated structure temperature equalizing plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678046A (en) * | 2019-10-15 | 2020-01-10 | 联德精密材料（中国）股份有限公司 | Thin type integrated structure temperature equalizing plate |
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2019
- 2019-10-15 CN CN201921720151.9U patent/CN210900132U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678046A (en) * | 2019-10-15 | 2020-01-10 | 联德精密材料（中国）股份有限公司 | Thin type integrated structure temperature equalizing plate |
| WO2021073159A1 (en) * | 2019-10-15 | 2021-04-22 | 昆山联德电子科技有限公司 | Thin integrated structure vapor chamber |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200728 Address after: 215300 workshop 5, No.128 weita Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshan Liande Electronic Technology Co.,Ltd. Address before: Suzhou City, Jiangsu province 215300 Zhangpu town Kunshan city Wei Road No. 128 Patentee before: LIANDE PRECISION MATERIALS (CHINA) Co.,Ltd. |
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| TR01 | Transfer of patent right |