WO2021069448A1 - Procédé de production d'un module semi-conducteur de puissance et module semi-conducteur de puissance - Google Patents

Procédé de production d'un module semi-conducteur de puissance et module semi-conducteur de puissance Download PDF

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Publication number
WO2021069448A1
WO2021069448A1 PCT/EP2020/078016 EP2020078016W WO2021069448A1 WO 2021069448 A1 WO2021069448 A1 WO 2021069448A1 EP 2020078016 W EP2020078016 W EP 2020078016W WO 2021069448 A1 WO2021069448 A1 WO 2021069448A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
power components
webs
temporary
power
Prior art date
Application number
PCT/EP2020/078016
Other languages
German (de)
English (en)
Inventor
Jens Reiter
Christian Lammel
Thomas Schmid
Original Assignee
Vitesco Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitesco Technologies GmbH filed Critical Vitesco Technologies GmbH
Publication of WO2021069448A1 publication Critical patent/WO2021069448A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method for producing a power semiconductor module with at least one power component. It also relates to a power semiconductor module.
  • Power components are usually soldered into through holes in a circuit board using THT (through hole technology) connections and thermally connected directly to a housing or another cooling surface.
  • THT through hole technology
  • Surface-mountable power components are typically soldered to a circuit carrier in a reflow soldering process and cooling takes place indirectly, typically through thermal vias of a circuit board on the housing or a differently designed cooling surface.
  • this indirect cooling in surface mount power devices is not as effective as direct cooling.
  • THT connection in power components that can be plugged through also has disadvantages.
  • the housings of the power components usually protrude laterally beyond the printed circuit board and therefore have to be held in position with complex holders or hold-downs for the soldering process.
  • the pins of the power component protruding from the underside of the circuit board it is more difficult to isolate the circuit board from the housing.
  • a method for producing a power semiconductor module comprises providing a circuit board with a number of mounting locations for power components, the mounting locations being provided on the upper side of the circuit board in areas that are designed as temporary webs.
  • the method further comprises the application of surface-mountable power components in the assembly areas, the power components being arranged on the temporary webs and contact connections of the power components being connected to contact pads on the printed circuit board next to the temporary webs.
  • the temporary webs are then removed and the printed circuit board with the power components is applied to a heat sink, with the undersides of the power components being pressed against an upper side of the heat sink.
  • the method has the advantage that the temporary webs hold the power components in position during a reflow process, so that the use of hold-downs is not necessary.
  • the waiver of hold-down devices makes it easier to use a reflow oven for soldering the power components.
  • thermal contact can be made with the underside of the power components through a heat sink on which the circuit board is placed, so that direct cooling of the surface-mounted power components is made possible.
  • the power module can have one or more power components and also further components. It can also have one or more webs. If several power components are to be mounted in the immediate vicinity, they can expediently be mounted on a common bridge.
  • the contact connection surfaces are arranged on the circuit board next to the temporary webs means that they are not arranged on the webs themselves and consequently are not removed when the webs are removed. Furthermore, it also means that the contact connection surfaces are arranged at a small distance from the webs in order to enable the external contacts of the power components to be connected.
  • a printed circuit board is understood here and in the following to be a substrate that accommodates the power components and enables electrical contact to be made between the power components and possibly also further components mounted on the printed circuit board with one another and / or from the outside.
  • the circuit board can be a PCB wiring substrate with conductor tracks made of copper.
  • the power components have pins as contact connections, which are soldered onto the contact connection areas of the printed circuit board in a reflow process.
  • a reflow process can be carried out in a known type of reflow oven because there is no need for a hold-down device and is particularly efficient.
  • the pressing of the undersides of the power components against the top of the heat sink can take place by means of pressure elements, for example by means of pressure springs which are arranged on the power components, or screw connections.
  • the removal of the temporary webs can take place by means of a cutting process customary in electronics production, for example by means of mechanical sawing or laser cutting.
  • the temporary webs can be prepunched or already partially separated from the surrounding printed circuit board in some other way. It is also conceivable to produce the printed circuit board with such a perforation or other weak point from the outset. After the power components have been applied, only the remaining, not yet severed areas of the circuit board then have to be removed.
  • the temporary webs are particularly characterized in that they are separated from the surrounding circuit board by an easily severable weak point in the material of the circuit board.
  • Temporary webs can be provided both in one or more edge areas of the circuit board and in a central area of the circuit board, depending on where power components are to be applied.
  • a power semiconductor module which has a number of power components arranged on a circuit board, contact terminals of the power components being connected to contact pads on an upper side of the circuit board and the power components being arranged via cutouts in the circuit board.
  • the power semiconductor module has at least one heat sink with an upper side for receiving the printed circuit board, with raised areas fitted into the cutouts of the printed circuit board being formed on the upper side, which protrude into the cutouts in such a way that undersides of the power components are in contact with the upper side of the heat sink stand.
  • the top of the heat sink in the raised areas can be flush with the top of the printed circuit board.
  • the edges of the cutouts have separation points by means of which the temporary webs are separated from the circuit board after the power components have been connected.
  • the separation points can have projections which protrude laterally into the recess.
  • the surfaces of the separation points may have sawing or breakage marks or traces of laser processing.
  • the power semiconductor module has the advantages already described in connection with the method.
  • the power components are pressed against the top of the heat sink by means of a pressure element.
  • the heat sink can be designed, for example, as a die-cast body with water cooling and thus enable particularly effective cooling, as is advantageous for power semiconductor modules operating in the high-voltage range of 400-800 V and higher.
  • Figure 1 shows a circuit board for a power module according to a
  • Embodiment of the invention in a perspective view
  • FIG. 2 shows the circuit board according to FIG. 1, but already equipped with power components
  • FIG. 3 shows the circuit board according to FIG. 2 with the removal of the temporary webs
  • FIG. 4 shows a cross section through the printed circuit board according to FIG. 3 after the removal of the temporary webs
  • FIG. 5 shows the circuit board according to FIG. 4 in a perspective view
  • FIG. 6 shows the printed circuit board connected to a heat sink according to FIG.
  • FIG. 7 shows the printed circuit board connected to the heat sink according to FIG. 6 after the application of pressure springs and
  • FIG. 8 shows the printed circuit board according to FIG. 7 connected to the heat sink in a cross section.
  • FIG. 1 shows a printed circuit board 1 designed as a PCB substrate for a power module according to an embodiment of the invention.
  • the printed circuit board 1 is rectangular in the embodiment shown and has an upper side 7 and an underside (not shown) opposite the upper side 7.
  • the assembly locations 3 are formed on temporary webs 5.
  • the temporary webs 5 are areas of the printed circuit board 1 that are removed in a later method step in the production of a power module.
  • the temporary webs 5 are already partially separated from the rest of the printed circuit board 1 by means of weak points in the form of perforations 4.
  • the openings 4 can be made in the printed circuit board 1, for example, by punching, sawing or laser cutting or another suitable method. So that the temporary webs 5 remain on the circuit board 1 during the assembly of the power components, the openings 4 are not continuous, but rather the temporary webs 5 are connected to the rest of the circuit board 1 in certain areas 6. In these areas 6, the printed circuit board 1 still has to be severed in a later process step in order to remove the temporary webs 5.
  • several temporary webs 5 are provided in central areas of the circuit board 1. Furthermore, however, a plurality of temporary webs 5 are also provided in the edge regions of the circuit board 1.
  • Figure 2 shows the circuit board 1 after the application of power components 9 in the assembly areas 3 to form a power module 21.
  • the power components 9 can be power diodes, thyristors and / or transistors, for example.
  • the power components 9 have unspecified undersides and upper sides and are mounted with their undersides on the upper side 7 of the printed circuit board 1 or the temporary webs 5.
  • a metallic cooling surface, via which the power components 9 are cooled, is typically exposed on the underside of the power components 9.
  • the power components 9 have contact connections 11 in the form of pins that extend out of their housing.
  • the contact connections 11 are soldered to contact connection areas (not shown) on the top side 7 of the circuit board 1.
  • the contact pads of the circuit board 1 are not arranged on the temporary webs 5, but next to them, i.e. beyond an opening 4.
  • the power components 9 are arranged on the temporary webs 5, but their mechanical fixation and electrical contacting takes place via the ones next to the webs 5 arranged on the circuit board 1 contact pads.
  • FIG. 3 shows the circuit board 1 during the removal of the temporary webs 5.
  • the temporary webs 5 leave recesses 13 in the circuit board 1 after their removal.
  • the power components 9 are with their undersides 23 after removal of the temporary webs 5 arranged directly above these recesses 13 and continue to be mechanically and electrically connected to the contact terminals 11 Printed circuit board 1 connected. The undersides 23 of the power components 9 are thus exposed in the recesses 13.
  • FIG. 6 shows the printed circuit board 1 after it has been applied to a heat sink 15.
  • the heat sink 15 forms part of a structure that accommodates the power module 21.
  • the heat sink 15 has raised areas 17 on its upper side 16 which are fitted into the recesses 13 of the circuit board 1.
  • the raised areas 17 come to lie in the recesses 13 and protrude into them.
  • the height of the raised areas 17 can correspond in particular to the thickness of the circuit board 1, so that the top side 16 of the cooling body 15 in the raised areas 17 is flush with the top side 7 of the surrounding circuit board 1.
  • FIG. 7 shows the power module 21 after pressure elements 19 have been applied to the power components 9.
  • a pressure element 19 designed as a spring is provided for each recess 17, with spring legs, one of which makes contact with a power component 9.
  • the pressure elements 19 exert pressure on the upper sides of the power components 9 and press them against the raised areas 17.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé de production d'un module semi-conducteur de puissance (21), comprenant les étapes suivantes : la fourniture d'une carte de circuit imprimé (1) ayant un certain nombre d'emplacements de montage (2) pour des composants de puissance (9), les emplacements de montage (2) étant disposés sur la partie supérieure (7) de la carte de circuit imprimé (1) dans des zones se présentant sous la forme de bandes temporaires (5) ; le placement des composants de puissance (9) pouvant être montés en surface dans les emplacements de montage (3), les composants de puissance (9) étant disposés sur les bandes temporaires (5), et des bornes de contact (11) des composants de puissance (9) étant reliées à des surfaces de connexion de contact sur la carte de circuit imprimé (1) à proximité des bandes temporaires (5) ; le retrait des bandes temporaires (5) ; le placement de la carte de circuit imprimé (1) avec les composants de puissance (9) sur un dissipateur thermique (15), les fonds (23) des composants de puissance (9) étant pressés sur une partie supérieure (16) du dissipateur thermique. L'invention concerne également un module semi-conducteur de puissance (21).
PCT/EP2020/078016 2019-10-09 2020-10-06 Procédé de production d'un module semi-conducteur de puissance et module semi-conducteur de puissance WO2021069448A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019215430.1 2019-10-09
DE102019215430.1A DE102019215430A1 (de) 2019-10-09 2019-10-09 Verfahren zur Herstellung eines Leistungshalbleitermoduls sowie Leistungshalbleitermodul

Publications (1)

Publication Number Publication Date
WO2021069448A1 true WO2021069448A1 (fr) 2021-04-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2020/078016 WO2021069448A1 (fr) 2019-10-09 2020-10-06 Procédé de production d'un module semi-conducteur de puissance et module semi-conducteur de puissance

Country Status (2)

Country Link
DE (1) DE102019215430A1 (fr)
WO (1) WO2021069448A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114727565A (zh) * 2022-05-11 2022-07-08 深圳市首航新能源股份有限公司 一种制作散热装置的方法、散热装置及光伏逆变器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3631963A1 (de) * 1986-09-19 1988-03-31 Siemens Ag Verfahren zum erstellen einer flachbaugruppe
DE19601649A1 (de) * 1996-01-18 1997-07-24 Telefunken Microelectron Anordnung zur Verbesserung der Wärmeableitung bei elektrischen und elektronischen Bauelementen

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3631963A1 (de) * 1986-09-19 1988-03-31 Siemens Ag Verfahren zum erstellen einer flachbaugruppe
DE19601649A1 (de) * 1996-01-18 1997-07-24 Telefunken Microelectron Anordnung zur Verbesserung der Wärmeableitung bei elektrischen und elektronischen Bauelementen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114727565A (zh) * 2022-05-11 2022-07-08 深圳市首航新能源股份有限公司 一种制作散热装置的方法、散热装置及光伏逆变器
CN114727565B (zh) * 2022-05-11 2022-08-16 深圳市首航新能源股份有限公司 一种制作散热装置的方法、散热装置及光伏逆变器

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