WO2021068582A1

WO2021068582A1 - Diamond single wire electric spark composite machining method and device

Info

Publication number: WO2021068582A1
Application number: PCT/CN2020/102013
Authority: WO
Inventors: 仇健; 葛任鹏
Original assignee: 青岛高测科技股份有限公司
Priority date: 2019-10-12
Filing date: 2020-07-15
Publication date: 2021-04-15
Also published as: CN110539413A

Abstract

A diamond single wire electric spark composite machining device, comprising a wire roller drive motor (1); one end of the wire roller drive motor is provided with a wire roller (2), the front end of the wire roller is provided with a pulse power supply (3), the lower end of the wire roller is provided with a cutting head frame (4), the outer surface of the wire roller is provided with a diamond wire (5), the lower end of the cutting head frame is provided with a silicon rod (6), and the lower end of the silicon rod (6) is provided with rod holders (11). Further disclosed is a diamond single wire electric spark composite machining method. By means of providing the pulse power supply, a positive lead wire (13), a negative lead wire (14), and an electric brush (12), traditional electric spark machining and diamond wire cutting techniques are combined to implement electric spark diamond wire composite machining on semiconductor crystalline silicon. On the basis of diamond wire single wire cutting, electric discharge machining is added to improve the machined surface. In addition, pits on the machined surface produced by electric spark machining are beneficial in reducing the work intensity of a subsequent texturing process.

Description

Method and device for diamond single-wire electric spark composite machining

Technical field

The invention relates to the technical field of composite processing, in particular to a diamond single-wire EDM composite processing method and device.

Background technique

The diamond wire cutting machine adopts the unidirectional or reciprocating movement of the diamond wire to form a relative grinding movement between the diamond wire and the object to be cut, so as to achieve the purpose of cutting.

The diamond wire cutting machine can cut many materials, including semiconductor crystalline silicon. The conductivity of semiconductor crystalline silicon at room temperature is between conductors and insulators. Single crystal silicon is an important semiconductor material for manufacturing. High-power transistors, rectifiers, solar cells, etc. However, in actual use, diamond wire cutting processes semiconductors and other crystalline silicon materials, and the surface of the crystalline silicon materials is prone to surface defects such as microcracks, scratches, and the processing efficiency is low. , The cost is high, and it is not conducive to people's use. For this reason, we propose a diamond single-wire EDM composite machining method and device.

Summary of the invention

The technical problem to be solved by the present invention is to overcome the existing defects and provide a diamond single wire EDM composite machining method and device, which can effectively solve the problems in the background art.

In order to achieve the above objective, the present invention provides the following technical solutions: a diamond single wire EDM composite machining method and device, including a wire roller drive motor, one end of the wire roller drive motor is provided with a wire roller, and the front end of the wire roller is provided with Pulse power supply, the lower end of the wire roller is provided with a cutting head frame, the outer surface of the wire roller is provided with a diamond wire, the lower end of the cutting head frame is provided with a silicon rod, and the lower end of the silicon rod is provided with a bar clamp .

Preferably, one side of the cutting head frame is provided with a No. 2 tension wheel, the other side of the cutting head frame is provided with a No. 2 tension wheel, and one side of the silicon rod is provided with a No. cutting wheel, the silicon rod There is a No. 2 cutting wheel on the other side, the diamond wire is connected in series with a wire roller, a No. 1 tension wheel, a No. 2 tension wheel, a No. 1 cutting wheel and a No. 2 cutting wheel.

Preferably, the number of the bar clamps is two groups, the gap between the two groups of bar clamps is aligned with the outer surface of the lower end of the silicon rod, and the diamond wire passes through the gap to connect the No. 1 cutting wheel and the No. 2 cutting wheel. Cutting wheel.

Preferably, the outer surface of the rear end of the pulse power supply is provided with a negative incoming wire, an incoming brush is arranged between the negative incoming wire and the diamond wire, and a positive incoming wire is arranged on the outer surface of the lower end of the pulse power supply, so The outer surface of one end of the positive incoming wire is fixedly connected to the outer surface of the front end of the silicon rod through the incoming metal.

Preferably, the outer surface of the front end of the line roller driving motor is provided with a rotating shaft, and the outer surface of the rear end of the line roller is fixedly connected to the rotating shaft.

Preferably, the specifications of the No. 1 tension wheel and the No. 2 tension wheel are the same, and the specifications of the No. 1 cutting wheel and the No. 2 cutting wheel are the same.

Preferably, the top shape of the bar clamp is a "V" shape.

Preferably, it includes the following steps:

(S1) The silicon rod is placed in the "V"-shaped notch area of the bar fixture, and clamped and tightened;

(S2) The diamond wire is wound in series with wire rollers, No. 1 tension wheel, No. 2 tension wheel, No. 1 cutting wheel and No. 2 cutting wheel, and the diamond wire passes through the gap between the two sets of bar clamps, and Fit the lowest point of the silicon rod;

(S3) The wire roller drive motor is energized to provide a power source to drive the diamond wire to reciprocate;

(S4) The pulse power supply is energized. The pulse power supply outputs a positive charge to the silicon rod through the positive incoming wire, and the pulse power supply outputs a negative charge to the incoming brush through the negative incoming wire. The incoming brush is connected to the diamond wire. At this time, the diamond wire is attached. Negative charge, the first tension wheel and the second tension wheel provide positioning and limit function for the diamond wire. The movement path of the diamond wire passes through the first cutting wheel and the second cutting wheel and passes through the gap between the two sets of bar clamps. Grinding and cutting the silicon rod, the silicon rod is attached with a positive charge, the diamond wire is attached with a negative charge, and the positive and the negative attract each other to form an electric spark to complete the diamond single-wire electric spark composite machining.

Compared with the prior art, the beneficial effects of the present invention are:

1. Combine the traditional EDM and diamond wire cutting technology to realize the compound processing of semiconductor crystalline silicon by EDM diamond wire. Aiming at the surface defects such as micro-cracks and scratches on the processing surface of crystalline silicon such as diamond wire cutting. On the basis of wire single wire cutting, electric discharge machining is added to realize the improvement of the machined surface, which provides help for its promotion and application in the semiconductor industry.

2. In order to further reduce the cutting force of cutting, the diamond wire slices are added to the auxiliary processing of EDM to achieve the purpose of reducing the macro cutting force.

3. Combining traditional EDM and diamond wire cutting technology to realize EDM diamond wire compound machining of semiconductor crystalline silicon. The pits on the machining surface produced by EDM help reduce the work intensity of the subsequent texturing process, and even further Realize the integration of wafer texturing after the crystalline silicon sliced by the diamond multi-wire cutting machine.

Description of the drawings

Figure 1 is the overall view of the present invention;

Figure 2 is a schematic diagram of single-wire composite machining of EDM diamond wire according to the present invention;

In the picture: 1. Line roller drive motor; 2. Line roller; 3. Pulse power supply; 4. Cutting head frame; 5. Diamond wire; 6. Silicon rod; 7. No. 1 tension wheel; 8. No. 1 cutting wheel; 9. No. 2 tension wheel; 10. No. 2 cutting wheel; 11. Bar clamp; 12. Electric brush; 13. Positive electric wire; 14. Negative electric wire.

Detailed ways

In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention will be further explained below in conjunction with specific implementations.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" The orientation or positional relationship of other indications is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation or a specific orientation. The azimuth structure and operation cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise clearly defined and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense, for example, "connected" may be a fixed connection It can also be detachably connected or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the present invention can be understood in specific situations.

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention. (1) Method

A compound cutting method for crystalline silicon EDM diamond wire. By adding an electric spark discharge device to the single wire saw diamond wire cutting equipment, the silicon rod is placed on the single wire saw diamond wire cutting table, and the diamond wire is used as a tool for EDM wire cutting The electrode realizes the combined EDM machining of EDM and diamond wire grinding during the machining process, aiming to realize the high-efficiency and high-quality cutting of crystalline silicon wafers. (2) Structure

Please refer to Figure 1-2, the present invention provides a technical solution: a diamond single wire EDM composite machining method and device, driven by wire roller motor 1, wire roller 2, pulse power supply 3, cutting head frame 4, diamond wire 5 , Silicon rod 6, No. 1 tension wheel 7, No. 1 cutting wheel 8, No. 2 tension wheel 9, No. 2 cutting wheel 10, bar fixture 11, power brush 12, positive wire 13 and negative wire 14 , The wire roller drive motor 1 provides power to drive the diamond wire 5 to reciprocate, the first tension wheel 7 and the second tension wheel 9 provide positioning and limit functions for the diamond wire 5, and the movement path of the diamond wire 5 passes through the first cutting wheel 8. With the second cutting wheel 10 and passing through the gap between the two sets of bar holders 11, it is attached to the lowest point of the silicon rod 6, and the silicon rod 6 is ground. The silicon rod 6 enters the wire 13 and the pulse power source 3 through the positive electrode. The positive pole of the power supply brush 12 is connected to the negative pole of the pulse power supply 3. The negative pole of the pulse power supply 3 is output to the diamond wire 5 through the power supply brush 12, that is, the diamond wire 5 can realize the electric discharge machining method, which is the traditional electric discharge machining Combine with diamond wire cutting technology to realize the EDM diamond wire compound processing of semiconductor crystalline silicon. Aiming at the surface defects of diamond wire 5 cutting processing semiconductor and other crystalline silicon, such as surface defects, on the basis of diamond wire 5 single wire cutting Join EDM to improve the surface quality of the machined surface, and provide help for its promotion and application in the semiconductor industry. The 5 slices of diamond wire add EDM to assist processing to achieve the purpose of reducing the macro cutting force, and EDM The pits on the processing surface produced by the processing are beneficial to reduce the work intensity of the subsequent texturing process, and even further realize the integration of wafer texturing after the crystalline silicon sliced by the diamond multi-wire cutting machine.

Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, and substitutions can be made to these embodiments without departing from the principle and spirit of the present invention. And variations, the scope of the present invention is defined by the appended claims and their equivalents.

Claims

A diamond single wire EDM compound processing device, comprising a wire roller driving motor (1), characterized in that: one end of the wire roller driving motor (1) is provided with a wire roller (2), and the front end of the wire roller (2) A pulse power supply (3) is provided, the lower end of the wire roller (2) is provided with a cutting head frame (4), the outer surface of the wire roller (2) is provided with a diamond wire (5), and the cutting head frame ( The lower end of 4) is provided with a silicon rod (6), and the lower end of the silicon rod (6) is provided with a bar clamp (11).
A diamond single wire EDM composite machining device according to claim 1, characterized in that: a tension wheel (7) is provided on one side of the cutting head frame (4), and the cutting head frame (4) The other side is provided with a No. 2 tension wheel (9), one side of the silicon rod (6) is provided with a No. 2 cutting wheel (8), and the other side of the silicon rod (6) is provided with a No. 2 cutting wheel ( 10) The diamond wire (5) is connected in series with the wire roller (2), the No. 1 tension wheel (7), the No. 2 tension wheel (9), the No. 1 cutting wheel (8) and the No. 2 cutting wheel (10).
A diamond single-wire EDM composite machining device according to claim 1, characterized in that: the number of bar clamps (11) is two groups, and the gap between the two groups of bar clamps (11) is equal to The outer surface of the lower end of the silicon rod (6) is aligned, and the diamond wire (5) passes through the gap to connect the first cutting wheel (8) and the second cutting wheel (10).
A diamond single-wire EDM composite machining device according to claim 1, characterized in that: the outer surface of the rear end of the pulse power supply (3) is provided with a negative lead wire (14), and the negative lead wire (14) A power-in brush (12) is arranged between it and the diamond wire (5), the outer surface of the lower end of the pulse power supply (3) is provided with a positive wire (13), and the outer surface of one end of the positive wire (13) It is fixedly connected with the outer surface of the front end of the silicon rod (6) through the feeding metal.
A diamond single wire EDM composite machining device according to claim 1, characterized in that: the outer surface of the front end of the wire roller drive motor (1) is provided with a rotating shaft, and the outer surface of the rear end of the wire roller (2) Fixedly connected with the rotating shaft.
A diamond single wire EDM composite machining device according to claim 2, characterized in that: the specifications of the first tension wheel (7) and the second tension wheel (9) are the same, and the first cutting wheel (8) ) The specifications are the same as the No. 2 cutting wheel (10).
A diamond single wire EDM composite machining device according to claim 1, wherein the top shape of the bar holder (11) is a "V" shape.
A diamond single wire EDM composite machining method is characterized in that it comprises the following steps:

(S1) The silicon rod (6) is placed in the "V"-shaped notch area of the rod holder (11), and clamped and tightened;

(S2) Diamond wire (5) is wound in series with wire roller (2), No. 1 tension wheel (7), No. 2 tension wheel (9), No. 1 cutting wheel (8) and No. 2 cutting wheel (10) And, the diamond wire (5) passes through the gap between the two sets of bar holders (11), and is attached to the lowest point of the silicon rod (6);

(S3) The wire roller drive motor (1) is energized to provide a power source to drive the diamond wire (5) to reciprocate;

(S4) The pulse power supply (3) is energized. The pulse power supply (3) outputs a positive charge to the silicon rod (6) through the positive input wire (13), and the pulse power supply (3) is the power supply brush (3) through the negative input wire (14). 12) Output negative charge, and connect the power brush (12) to the diamond wire (5). At this time, the diamond wire (5) has a negative charge, and the tension wheel No. 1 (7) and tension wheel No. 2 (9) are diamonds. The wire (5) provides positioning and limit functions. The movement path of the diamond wire (5) passes through the first cutting wheel (8) and the second cutting wheel (10) and passes through the gap between the two sets of bar clamps (11) , Grinding and cutting the silicon rod (6), the silicon rod (6) is attached with a positive charge, the diamond wire (5) is attached with a negative charge, the positive and the negative are attracted to form an electric spark, and the diamond single-wire electric spark composite machining is completed.