WO2021063132A1 - 无线耳机 - Google Patents

无线耳机 Download PDF

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Publication number
WO2021063132A1
WO2021063132A1 PCT/CN2020/110617 CN2020110617W WO2021063132A1 WO 2021063132 A1 WO2021063132 A1 WO 2021063132A1 CN 2020110617 W CN2020110617 W CN 2020110617W WO 2021063132 A1 WO2021063132 A1 WO 2021063132A1
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WO
WIPO (PCT)
Prior art keywords
housing
circuit board
earstalk
battery module
shell
Prior art date
Application number
PCT/CN2020/110617
Other languages
English (en)
French (fr)
Inventor
邱晓辉
叶润清
朱董宜
李宝侠
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2021063132A1 publication Critical patent/WO2021063132A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/105—Manufacture of mono- or stereophonic headphone components

Definitions

  • This application relates to the field of electronic technology, and in particular to a wireless headset.
  • wireless headsets are becoming more and more intelligent, and more and more functions can be implemented. Therefore, more and more chips with different functions are integrated in the headset.
  • Traditional earphones generally set different chips on different hard circuit boards, and then connect different hard circuit boards through the flexible circuit board to realize the connection between different chips.
  • the integration cost is high and the space is large.
  • the present application provides a wireless headset, which aims to reduce the integration cost between different working modules and different chips in the wireless headset, and reduce the space occupied by the integrated structure of different working modules and different chips, and increase the space inside the wireless headset Utilization rate.
  • the present application provides a wireless headset, including a housing, a packaging structure housed in the housing, a battery module, and a battery module.
  • the housing is provided with connecting wires, and the packaging structure is connected to the housing.
  • the battery module is arranged at both ends of the connecting wire, and is electrically connected by the connecting wire on the housing;
  • the packaging structure includes a packaging material layer and embedded in the packaging material layer A plurality of chips, and the plurality of chips are electrically connected to the battery module through the connecting wires.
  • the packaged chip is placed on a hard circuit board, and then the flexible circuit board will carry different In terms of the way that the hard circuit boards of the packaged chips are connected, the number of times of packaging can be reduced, and the connection between the flexible circuit board and the hard circuit board can be reduced, thereby reducing the integration cost.
  • the electrical connection between the packaging structure and the battery module is realized by arranging the connecting wires on the housing.
  • the housing includes an inner surface facing the inside of the housing, and the connecting wires are provided on the inner surface of the housing.
  • the formation process of the connection trace is relatively simple, and the connection trace can be directly formed on the inner surface of the housing by a laser reconfiguration printing process or a laser direct molding technology or other molding methods.
  • connection trace can realize the function of connecting the packaging structure and the battery module, and can also insulate the connection trace from other devices provided in the housing, so as to avoid The above-mentioned connection traces cause the risk of short circuit to other devices.
  • the connecting wires are embedded in the housing; the housing includes an inner surface facing the inside of the housing, the inner surface of the housing is provided with a groove, and the groove extends from the housing The inner surface of the battery module extends to the connecting wire, and the packaging structure and the battery module are electrically connected to the connecting wire through the first connecting terminal.
  • the connection wires can be located in the housing more firmly, reducing the probability of the interconnection wires being broken and damaged, thereby improving the wireless The reliability of the headset.
  • the shell includes an earstalk shell and an earplug shell connected to one end of the earstalk shell
  • the battery module is accommodated in the earstalk shell
  • the packaging structure is accommodated in the earplug shell
  • the earstalk shell is an integrally formed column
  • the earplug shell includes a first part and a second part that are detachably connected
  • the first part and the earstalk shell are integrally formed
  • one end of the connecting wire is located at the One end of the earstalk shell is far away from the earplug shell, and the other end is located on the first part of the earplug shell.
  • the housing includes an earstalk housing and an earplug housing connected to one end of the earstalk housing.
  • the earplug housing includes a first part and a second part that are detachably connected, so that a battery module, a packaging structure, etc.
  • the structure can be conveniently arranged inside the shell.
  • the earstalk shell is an integrally formed column shape, so that the appearance integrity of the wireless earphone is better, and the appearance effect is better.
  • the shell includes an earstalk shell and an earplug shell connected to one end of the earstalk shell, the battery module is accommodated in the earstalk shell, and the packaging structure is accommodated in the earplug shell
  • the earstalk housing includes a detachable third part and a fourth part, the third part and the fourth part are formed by dividing a plane parallel to the axis of the earstalk housing; the connecting wire is formed With the third part on.
  • the housing includes an earstalk housing and an earplug housing connected to one end of the earstalk housing.
  • the earstalk housing includes a detachable third part and a fourth part, so that the battery module and the packaging structure Such structures can be conveniently arranged inside the housing, and can easily form connecting wires on the third part.
  • the battery module includes a circuit board and a battery electrically connected to the circuit board, the circuit board is located on a side of the battery away from the earplug housing; the circuit board is provided with a battery management Unit, the battery is electrically connected with the battery management unit; the circuit board is electrically connected with the connecting wire, so as to realize the electrical connection between the battery module and the connecting wire.
  • a microphone assembly is further provided on the circuit board, and the microphone assembly is electrically connected to the packaging structure through the circuit board.
  • the circuit board is located on the side of the battery away from the earplug housing, that is, the circuit board is located at the end of the earstalk housing away from the earplug housing.
  • the microphone assembly is arranged on the circuit board, and when the wireless headset is used, the microphone assembly is closer to the user's mouth, which can have a better sound reception effect.
  • connection wires there are multiple connection wires, and the multiple connection wires are arranged at intervals, and at least two of the connection wires among the multiple connection wires are used to transmit different signals so as to pass all the wires.
  • the connecting wires can meet the signal transmission requirements between the package structure and the battery module without adding other wires.
  • the plurality of chips includes at least two of a power chip, a memory chip, a Bluetooth chip, an audio decoding chip, and a sensor chip, so as to meet the requirements of various functions of the wireless headset.
  • FIG. 1 is a schematic structural diagram of a wireless headset according to an embodiment of the application
  • FIG. 2 is a structural diagram of the housing and internal structure of the earphone body of the embodiment shown in FIG. 1;
  • Fig. 3 is an exploded schematic diagram of the outer shell and internal structure of the earphone body of the embodiment shown in Fig. 1;
  • FIG. 4 is a schematic structural diagram of a casing of a wireless headset according to another embodiment of the application.
  • FIG. 5 is a schematic diagram showing the internal structure of the packaging structure of the wireless earphone of the embodiment shown in FIG. 2.
  • FIG. 6 is a schematic structural diagram of the outer shell and internal structure of the earphone body according to another embodiment of the application.
  • FIG. 7 is a schematic diagram showing the internal structure of the shell of the earphone body of the embodiment shown in FIG. 6 when the shell is cut along the I-I direction;
  • FIG. 8 is a schematic diagram showing the internal structure of the shell of the earphone body of another embodiment of the application, which is cut along the direction I-I in FIG. 6;
  • Fig. 9 is a schematic cross-sectional view of the housing of the earphone body of the embodiment shown in Fig. 8 along the direction II-II in Fig. 6.
  • This application provides a wireless headset, which can be used in conjunction with electronic devices such as mobile phones, laptops, tablets, smart watches, etc., to process audio services such as media and calls of electronic devices, or to process other data services.
  • the audio service can include media services such as playing music for users, recording, sound in video files, background music in games, and incoming call notification sounds; it can also include phone calls, WeChat voice messages, audio calls, video calls, games, etc.
  • call service scenarios such as voice assistant, play the voice data of the opposite end for the user, or collect the voice data of the user and send it to the opposite end, etc.
  • FIG. 1 is a schematic structural diagram of a wireless headset 100 according to some embodiments of the application.
  • the wireless headset 100 in this embodiment is a true wireless stereo (TWS) headset.
  • the wireless earphone 100 includes two earphone bodies 100a.
  • the two earphone bodies 100a can be used as a left-ear earphone and a right-ear earphone respectively.
  • the left-ear earphone can be used with the user's left ear
  • the right-ear earphone can be used with the user's right ear.
  • the wireless earphone 100 may be other types of wireless earphone 100.
  • the wireless earphone 100 may include only one earphone body 100a.
  • each earphone body 100 a includes a casing 10, a packaging structure 20 and a battery module 30 accommodated in the casing 10, and a speaker assembly 40.
  • the battery module 30 is electrically connected to the packaging structure 20 to supply power to the packaging structure 20;
  • the speaker assembly 40 is electrically connected to the packaging structure 20 to transmit audio signals processed by the internal components of the packaging structure 20 through the speaker assembly 40 to realize the earphone Play the voice signal of the main body 100a.
  • a flexible circuit board 50 is further included.
  • the packaging structure 20 and the battery module 30 are respectively connected to two ends of the flexible circuit board 50, so that the electrical connection between the packaging structure 20 and the battery module 30 is realized through the flexible circuit board 50.
  • a detachable electrical connection is made between the flexible circuit board 50 and the packaging structure 20, so that the assembly between the flexible circuit board 50 and the packaging structure 20 can be facilitated, and subsequent maintenance and other tasks can be facilitated.
  • the flexible circuit board 50 and the packaging structure 20 are connected through a board-to-board (BTB) connector 60.
  • BTB board-to-board
  • the socket 61 and the plug 62 of the board-to-board connector 60 are respectively provided on one end of the flexible circuit board 50 and the packaging structure 20.
  • the socket 61 is provided on the flexible circuit board 50 and is electrically connected to the flexible circuit board 50; the plug 62 is provided on the packaging structure 20 and is electrically connected to the packaging structure 20.
  • the socket 61 of the connector 60 can be directly inserted into the plug 62 to realize the electrical connection between the flexible circuit board 50 and the packaging structure 20.
  • the flexible circuit board 50 and the packaging structure 20 may also be electrically connected by other methods such as hot-pressing and soldering.
  • the battery module 30 and the flexible circuit board 50 can also be electrically connected by means of a board-to-board connector 60 or hot-pressing and soldering.
  • the housing 10 includes an earstalk housing 11 and an earplug housing 12 connected to one end of the earstalk housing 11.
  • the battery module 30 is housed in the earstalk shell 11, and the packaging structure 20 is housed in the earplug shell 12.
  • the earplug housing 12 includes a first part 121 and a second part 122 covering the first part 121.
  • the first part 121 is connected to the earstalk shell 11 as a whole, and the second part 122 can be detachably connected to the first part 121 to facilitate the installation of the internal structure of the earphone body 100a.
  • the ear stem shell 11 includes a bottom cover 112 with a tube body 111 covering an end of the tube body 111 facing away from the earplug shell 12.
  • the bottom cover 112 is detachably covered on the tube body 111 to facilitate the installation of the internal structure of the earphone body 100a.
  • the detachable connection between the bottom cover 112 and the pipe body 111 may be a buckle connection or an adhesive bonding method. It can be understood that, in some embodiments, the bottom cover 112 may also be integrally formed with the tube body 111.
  • the tube body 111 is a tubular structure obtained by integral molding, so that the appearance of the earphone body 100a is complete and has a good appearance effect.
  • FIG. 4 is a schematic structural diagram of a housing 10 of a wireless headset 100 according to another embodiment of the application.
  • the earstalk housing 11 includes a third part 113 and a fourth part 114 that are detachably connected.
  • the third part 113 and the fourth part 114 are divided and formed by a plane parallel to the axis of the ear stem shell 11.
  • the earstalk shell 11 of this embodiment is not an integrally formed structure, but includes a third part 113 and a fourth part 114 that can be detachably connected.
  • the third part 113 faces the opening edge of the fourth part 114 and/or the fourth part 114 faces the opening edge of the third part 113 with a connecting part, so that the third part is realized by the connecting part.
  • 113 is connected to the cover of the fourth part 114.
  • the third part 113 and the fourth part 114 can be covered after the installation of the internal structure of the earphone body 100a is completed. Therefore, in this embodiment, by configuring the earstalk housing 11 to include the detachable third part 113 and the fourth part 114, the installation of the internal structure of the earphone body 100a can be facilitated.
  • the fourth part 114 and the earplug shell 12 are integrally formed.
  • the earplug housing 12 may also be an integral structure without including a detachable structure.
  • the first part 121 and the second part 122 are connected, so that the wireless earphone 100 has a better appearance effect.
  • the battery module 30 includes a battery 31 and a circuit board 32.
  • the circuit board 32 is a rigid circuit board 32 (Printed Circuit Board, PCB)
  • the battery 31 is electrically connected to the circuit board 32
  • the circuit board 32 is electrically connected to the flexible circuit board 50, that is, the battery 31 passes through the circuit board.
  • 32 and the flexible circuit board 50 are electrically connected to the packaging structure 20, and the electric energy generated by the battery 31 is transmitted to the packaging structure 20 through the circuit board 32 and the flexible circuit board 50.
  • the circuit board 32 is provided with a third connection terminal, and the circuit board 32 is electrically connected to the flexible circuit board 50 through the third connection terminal.
  • the third connection terminal may be a pogo pin, an elastic sheet, a conductive block, a conductive patch, a conductive sheet, a pin, a plug, a contact pad, a solder sheet, a pin, etc., and the specific type is not limited herein.
  • the third connection terminal is a pin
  • the flexible circuit board 50 is provided with soldering tabs. By welding the pins and the soldering tabs together, the circuit board 32 and the flexible circuit board 50 are electrically connected.
  • the circuit board 32 is provided with a battery management unit, and the battery management unit is electrically connected to the battery 31 through wires on the circuit board 32.
  • the power management unit may include a charging circuit, a voltage drop adjustment circuit, a protection circuit, a power measurement circuit, and the like.
  • the charging circuit can receive an external charging input.
  • the voltage drop regulating circuit can transform the electric signal input by the charging circuit and output it to the battery 31 to complete the charging of the battery 31. It can also transform the electric signal input from the battery 31 and output it to the package structure 20 and other working modules.
  • the components in the packaging structure 20 and other packaging structures 20 of the wireless headset 100 provide power.
  • the protection circuit can be used to prevent the battery 31 from being overcharged, over-discharged, short-circuited, or over-current.
  • the power management unit can also be used to monitor the capacity of the battery 31, the number of cycles of the battery 31, and the health status (leakage, impedance) of the battery 31 and other parameters.
  • the battery module 30 may further include a wireless charging coil for wirelessly charging the wireless headset 100.
  • each earphone body 100a may further include an earphone charging terminal, and the earphone charging terminal is exposed from the housing 10.
  • the earphone charging terminal is electrically connected to the power management unit, and the charging structure is in contact with and electrically connected to the earphone charging terminal to charge the battery 31 connected to the power management unit.
  • the charging structure is a battery box storing the wireless earphone 100, and the battery box is provided with a battery box charging terminal corresponding to the earphone charging terminal. When the wireless earphone 100 is stored in the battery box, the charging terminal of the battery box contacts with the charging terminal of the battery box, thereby charging the wireless earphone 100.
  • the two earphone charging terminals there are two earphone charging terminals and earphone box charging terminals corresponding to the earphone charging terminals, and the two earphone charging terminals are respectively connected to the positive electrode and the negative electrode of the battery 31 to charge the battery 31.
  • the two earphone charging terminals are both provided on the bottom cover 112 of the earstalk shell 11. It is understandable that in other embodiments of the present application, the two earphone charging terminals can be provided separately. For example, one earphone charging terminal is provided on the bottom cover 112, and the other earphone charging terminal is provided on the earplug housing 12 or the tube body 111. on.
  • the types of the earphone charging terminal and the earphone box charging terminal can be changed according to actual needs.
  • the earphone charging terminal may be a pogo pin, a pogo pin, an elastic sheet, a conductive block, a conductive patch, a conductive sheet, a pin, a plug, a contact pad, a jack or a socket, etc.
  • the specific embodiments of the earphone charging terminal are The type is not limited.
  • the circuit board 32 is further provided with a microphone assembly, and the microphone assembly is electrically connected to the packaging structure 20 through the circuit board 32 and the flexible circuit board 50.
  • the microphone assembly includes a microphone and a microphone radio circuit arranged on the circuit board 32, and the microphone is electrically connected to the microphone radio circuit.
  • the surface of the circuit board 32 facing away from the battery 31 faces the bottom cover 112 of the ear stem housing 11, and the bottom cover 112 is provided with a sound receiving hole. The user's voice is transmitted to the microphone through the sound receiving hole, and the audio signal received by the microphone is transmitted to the packaging structure 20 through the microphone sound receiving circuit and the flexible circuit board 50.
  • the power management unit is integrated on the battery 31, and the microphone radio circuit and the like are integrated in the packaging structure 20. Therefore, there may be no circuit board 32 in this embodiment.
  • the positive electrode and the negative electrode of the battery 31 are directly in contact with the first connection terminal, so that the battery 31 is directly electrically connected with the connecting wires to supply power to the components in the package structure 20.
  • FIG. 5 is a schematic diagram of the internal structure of the packaging structure 20 of the wireless earphone 100 in the embodiment shown in FIG. 2.
  • the packaging structure 20 includes a substrate 21 and an packaging layer 22 encapsulated on the substrate 21.
  • the package structure 20 further includes a second connection terminal 23, which is electrically connected to other structures outside the package structure 20 through the second connection terminal 23.
  • the second connection terminal 23 is a solder foot provided on the surface of the substrate 21 facing away from the packaging layer 22, and the solder foot is electrically connected to the traces on the substrate 21 to realize the packaging structure 20 and the other than the packaging structure 20. The electrical connection of the structure.
  • the solder pins are electrically connected to the plug 62 of the board-to-board connector 60 to fix the plug 62 on the package structure 20 and electrically connect with the package structure 20.
  • the second connection terminal 23 of the package structure 20 may also be another structure or be located at another position of the package structure 20, and the second connection terminal 23 can be connected to the substrate of the package structure 20. 21 is electrically connected to ensure that the package structure 20 can be electrically connected to other structures in the outside world through the second connection terminal 23.
  • the packaging layer 22 includes a packaging material layer 221 and a plurality of components 222 embedded in the packaging material layer 221.
  • the components 222 are electrically connected to the traces of the substrate 21, so as to realize the communication between the components 222 and the components 222 in the package structure 20 and other components 222 outside the package structure 20 through the traces on the substrate 21 Or communication between modules.
  • the component 222 may be an active device such as a chip, or a passive device such as a capacitive element, an inductance element, and a resistance element; or, the component 222 may also be partly an active device and partly a passive device.
  • the packaging structure 20 includes multiple chips, that is, multiple chips are packaged in the packaging layer 22.
  • the chips packaged in the packaging structure 20 include a power chip 222A, a memory chip 222B, a Bluetooth chip 222C, an audio decoding chip 222D, and a sensor chip 222E. It can be understood that, in some embodiments, the structure packaged by the package structure 20 can be replaced, deleted, or added as needed. For example, in some embodiments, only the memory chip 222B, the Bluetooth chip 222C, and the audio decoding chip 222D are packaged in the packaging structure 20.
  • the power chip 222A is electrically connected to the battery module 30 through the substrate 21 and the second connection terminal 23, and is electrically connected to other active devices in the package structure 20, and is mainly used to transmit the battery 31
  • the power is controlled to provide stable power to other active devices (including the chips packaged in the package structure 20);
  • the storage chip provides data buffer and data storage for the main chip;
  • the Bluetooth chip 222C is used as the main chip, on the one hand
  • the speaker assembly 40, microphone assembly and other devices are controlled through the protocol, and on the one hand, the Bluetooth antenna is used as a communication processor.
  • the Bluetooth antenna is formed on the housing 10.
  • the Bluetooth antenna can be provided on the packaging structure 20; the audio decoding chip 222D is mainly used for decoding, because the format of the audio file collected by the microphone assembly cannot be directly read by the machine, and audio decoding is required.
  • the chip 222D is decoded into a machine code, and the decoded file is transmitted to the Bluetooth chip 222C, and then transmitted through the Bluetooth antenna.
  • the audio signal received by the Bluetooth antenna needs to be decoded by the audio decoding chip 222D and then transmitted to the speaker assembly 40, and then sounded through the speaker assembly 40.
  • the wireless headset 100 includes a sensor component.
  • the sensor component includes a sensor and a sensor chip 222E.
  • Other external signals received by the sensor are converted into electrical signals by the sensor chip 222E and transmitted to the main chip.
  • the main chip performs operations according to the transmitted signals. Make a certain prediction. For example, when the earphone slips when playing music, the sensor component recognizes the speed change of the earphone and transmits it to the main chip, which can terminate the music playback.
  • the packaging structure 20 includes multiple chips, that is, multiple chips are packaged in the packaging layer 22. Compared with packaging each chip separately, arranging the packaged chip on a hard circuit board, and then connecting the hard circuit boards carrying different packaged chips through a flexible circuit board, it can save packaging Cost, and can reduce the space occupied by the chip package, and more effectively utilize the internal space of the earphone body 100a. In addition, the connection between the flexible circuit board and the rigid circuit board can be reduced, thereby reducing the integration cost, and reducing the use of the flexible circuit board and the rigid circuit board, and improving the space utilization rate inside the wireless headset 100.
  • the volume of the battery 31 may be correspondingly increased, thereby increasing the power stored in the battery 31 and extending the working time of the wireless headset 100.
  • FIG. 6 is a schematic diagram of the structure of the earphone body 100a according to another embodiment of the application;
  • FIG. 7 is the internal structure of the casing 10 after the casing 10 in FIG. 6 is cut along the II direction Schematic.
  • the difference between the earphone body 100a of this embodiment and the embodiment shown in FIG. 2 is that: this embodiment does not have a flexible circuit board 50 connecting the packaging structure 20 and the battery module 30.
  • the inner surface of the housing 10 of the earphone body 100a is provided with connecting wires 70, and the packaging structure 20 and the battery module 30 are electrically connected to both ends of the connecting wires 70, so as to pass through the connections on the housing 10.
  • the wire 70 makes electrical connection.
  • the inner surface of the housing 10 is provided with first connecting terminals 71, and the first connecting terminals 71 are respectively provided at both ends of the connecting wires 70 and electrically connected to the connecting wires 70.
  • the packaging structure 20 is arranged in the earphone shell 10
  • the second connecting terminal 23 on the packaging structure 20 is in contact with the first connecting terminal 71, and the packaging structure 20 is electrically connected to the connecting wire 70
  • the battery module 30 is arranged in the earphone shell
  • the third connection terminal 33 on the circuit board 32 of the battery module 30 is in contact with the first connection terminal 71, and the battery module 30 is electrically connected to the connecting wire 70.
  • the positive and negative poles of the battery 31 are the third connection terminals 33 of the battery module 30, and are in contact with the first connection terminals 71 to realize the connection of the battery module 30 and the wiring 70 Electrical connection.
  • the first connection terminal 71 may be a pogo pin, a pogo pin, an elastic sheet, a conductive block, a conductive patch, a conductive sheet, a pin, a plug 62, a contact pad, a jack or a socket 61, etc.
  • the implementation of this application The example does not limit the specific type of the first connection terminal 71.
  • the second connection terminal 23 and the third connection terminal 33 have structures corresponding to the first connection terminal 71.
  • the first connecting terminal 71 is a conductive sheet
  • the second connecting terminal 23 and the third connecting terminal 33 are both elastic sheets.
  • the first connection terminals 71 connected to both ends of the connecting wire 70 are the same; when the second connection terminal 23 and the third connection terminal 33 are not in phase At the same time, the first connecting terminals 71 connected to both ends of the connecting wire 70 may be different.
  • the number of connecting wires 70 may be one or more. When the connecting wires 70 are connected, a plurality of connecting wires 70 are arranged at intervals. At least two of the multiple connection wires 70 are used to transmit different signals, so as to realize the transmission of various signals. In this embodiment, there are multiple connection wires 70.
  • the multiple connection wires 70 include power wires for transmitting the power of the battery module 30, audio wires for transmitting audio signals collected by the microphone module, and ground wires. .
  • the connecting wires 70 may be provided on the inner surface of the housing 10 by a laser restructured printing process (Laser Restructured Print, LRP) or a laser direct-structuring technology (Laser-Direct-structuring, LDS) or other molding methods.
  • the laser reconfiguration printing process specifically includes: applying conductive silver paste to the housing 10 accurately and at high speed, and then by controlling the correction of the laser to form a high-precision connection trace 70 on the housing 10.
  • the laser direct structuring technology specifically includes: using the laser direct structuring technology to control the direction of the laser according to the designed connection wiring drawing, and project the laser onto the three-dimensional housing 10 to form the connection wiring 70.
  • the connecting wires 70 can also be formed on the housing 10 through other solutions.
  • the connecting wires 70 can also be formed by photomask patterning or the like.
  • the side surface of the connecting wire 70 facing the inside of the earphone body 100a is covered with an insulating layer, and the insulating layer is hollowed out at a position where the connecting wire 70 is connected to the packaging structure 20 and the battery module 30, so that the connecting wire 70
  • the connecting wire 70 can be insulated from other devices provided in the housing 10, so as to avoid the risk of short circuit caused by the connecting wire 70 to other devices.
  • insulating paper or insulating ink or insulating glue layer can be pasted on the surface of the connecting wire 70 facing the inner side of the back of the wireless earphone 100.
  • one end of the connecting wire 70 is located at an end of the earstalk housing 11 away from the earplug housing 12, and the other end is located on the first part 121 of the earplug housing 12.
  • the upper connecting wire 70 is provided on the shell of the earstalk shell 11, that is, the first connecting terminals 71 provided at both ends of the connecting wire 70 are all located on the shell of the earstalk shell 11.
  • connection One end of the wire 70 can extend to the bottom cover 112 of the earstalk housing 11 and/or the other end to the first part 121 of the earplug housing 12 integrally connected with the earstalk housing 11.
  • the housing 10 of the earphone body 100a has the same structure as the housing 10 of the earphone body 100a shown in FIG. 4.
  • the earstalk shell 11 of this embodiment is divided into a detachable third part 113 and a fourth part 114, so that it is convenient to form a connection on the inner surface of the shell 10 through a laser reconstruction printing process or a laser direct molding technology.
  • Route 70 it can be understood that, in some embodiments of the present application, the housing 10 of the earphone body 100a may also have the same structure as the housing 10 of the earphone body 100a shown in FIG. 2. In this embodiment, the connecting wire 70 is located on the third part 113.
  • the third part 113 is connected to the first part 121 of the earplug housing 12, the fourth part 114 is connected to the second part 122 of the earplug housing 12, and one end of the connecting wire 70 is located in the third part.
  • One end of 113 is away from the earplug housing 12 and the other end is located on the first part 121 to facilitate the electrical connection between the packaging structure 20 and the battery assembly 30 and the connecting wires 70.
  • the connecting wires 70 can be arranged in other positions of the housing 10 according to actual needs.
  • the connecting wires 70 can be arranged on the fourth part 114, or one end is located in the fourth part 114 away from the earplug housing 12. One end is located on the second part 122, and the other end is located on the second part 122.
  • the electrical connection between the packaging structure 20 and the battery module 30 is realized by arranging the connecting wires 70 on the housing 10, as opposed to the realization of the electrical connection between the packaging structure 20 and the battery module 30 through a flexible circuit board.
  • the use of flexible circuit boards connecting the packaging structure 20 and the battery module 30 can be reduced, thereby further reducing the space occupied by the integrated structure and reducing the gap between the flexible circuit board and the rigid circuit board. The connection, thereby reducing the production cost of the integrated structure.
  • FIG. 8 is a schematic diagram showing the internal structure of the shell 10 of the earphone body 100a according to another embodiment of the application, which is cut along the direction II in FIG. 6;
  • FIG. 9 is a diagram A schematic cross-sectional view of the housing 10 of the earphone body 100a of the embodiment shown in FIG. 6 along the direction II-II in FIG. 6.
  • the difference between the earphone body 100a of this embodiment and the earphone body 100a of the embodiment shown in FIG. 6 is that: in this embodiment, the connecting wire 70 is embedded in the housing 10.
  • grooves are provided on the inner surface of the housing 10 at positions corresponding to the two ends of the connecting wires 70, and the grooves extend from the inner surface of the housing 10 to the connecting wires 70.
  • the first connecting terminal 71 is disposed in the groove and electrically connected to the connecting wire 70.
  • the first connecting terminal 71 is a conductive sheet, and the conductive sheet is arranged in the groove. It can be understood that, in some embodiments, no conductive sheet is provided in the groove, and the portion of the connecting wire 70 that exposes the groove is the first connecting terminal 71.
  • the connecting wires 70 can be located in the housing 10 more firmly, reducing the probability of breakage and damage of the interconnecting wires, thereby improving the reliability of the wireless earphone 100.
  • the peripheral wall of the groove can restrict the movement of the second connection terminal 23, and This enables the second connection terminal 23 to be more accurately positioned to the first connection terminal 71, and can avoid the movement of the second connection terminal 23 relative to the first connection terminal 71, thereby improving the reliability of contact.
  • the groove can ensure that the solder concentrates on The location of the groove prevents the solder from rolling to other locations, thereby contributing to improved soldering reliability.
  • At least part of the earphone shell 10 may include a base layer and a cover layer covering the base layer, and the connecting trace 70 is located between the base layer and the cover layer, thereby forming a connecting trace 70 embedded in the shell 10 structure.
  • the three-dimensional printing process LRP technology or LDS technology can be used to form the connection trace 70 on the outer surface of the base layer (that is, the side of the base layer facing the covering layer), and then use the injection molding process to form the connection trace 70 on the outer surface of the base layer.
  • a covering layer is formed on the surface, so that the connecting wires 70 are embedded in the earphone shell 10.
  • the earphone housing 10 of the earphone body 100a in this embodiment may have the same structure as the earphone housing 10 of the earphone body 100a in the embodiment shown in FIG.
  • the tubular structure makes the appearance of the earphone body 100a complete and has a good appearance effect.
  • the bottom cover and the tube body in this embodiment are integrally formed, so that the appearance of the earphone body 100a is complete.
  • the earphone housing 10 of the earphone body 100a shown in FIG. 8 may also have the same structure as the earphone housing 10 of the earphone body 100a of the embodiment shown in FIG. 4.
  • this application integrates multiple chips into one package structure 20, which can save package cost, reduce the space occupied by chip package, and make more effective use of the earphone body. 100a internal space.
  • the connection between the flexible circuit board and the rigid circuit board can be reduced, thereby reducing the integration cost, and reducing the space occupied by the flexible circuit board and the rigid circuit board, so as to more effectively use the internal space of the earphone body 100a.
  • the electrical connection between the packaging structure 20 and the battery module 30 is achieved by arranging the connecting wires 70 on the housing 10, as opposed to the realization of the electrical connection between the packaging structure 20 and the battery module 30 through a flexible circuit board.
  • the use of the flexible circuit board connecting the packaging structure 20 and the battery module 30 can be reduced, thereby further reducing the space occupied by the integrated structure and reducing the gap between the flexible circuit board and the rigid circuit board. In order to reduce the production cost of the integrated structure.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Headphones And Earphones (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

本申请提供一种无线耳机，包括外壳以及收容于外壳内的封装结构以及电池模组，外壳上设有连接走线，封装结构与电池模组设通过外壳上的连接走线进行电连接。封装结构包括封装材料层以及嵌设于封装材料层内的多个芯片。本申请通过将多个芯片集成在一个封装结构内，能够节约封装成本，减小芯片封装占用的空间。并且，能够减少柔性电路板与硬质电路板的连接，减小集成成本，并减少柔性电路板与硬质电路板占用的空间。并且，通过将连接走线设于外壳上，实现封装结构与电池模组的电连接，能够减少连接封装结构与电池模组之间的柔性电路板的使用，降低集成结构的制作成本，减小集成结构占用的空间。

Description

无线耳机
本申请要求于2019年9月30日提交中国专利局，申请号为201910948212.5、申请名称为“无线耳机”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，尤其涉及一种无线耳机。
背景技术
随着科技的进步，无线耳机越来越智能，能够实现的功能也越来越多，因此，耳机内部集成的不同作用的芯片越来越多。传统的耳机一般将不同的芯片设于不同的硬质电路板上，再通过该柔性电路板连接不同的硬质电路板以实现不同的芯片之间的连接，集成成本高且占用空间较大。
发明内容
本申请提供一种无线耳机，旨在降低无线耳机中的不同工作模组以及不同芯片之间的集成成本，并降低不同工作模组以及不同芯片的集成结构占用的空间，提高无线耳机内部的空间利用率。
第一方面，本申请提供一种无线耳机，包括外壳、收容于所述外壳内的封装结构、电池模组以及设于所述，所述外壳上设有连接走线，所述封装结构与所述电池模组设于所述连接走线的两端，并通过所述外壳上的所述连接走线进行电连接；所述封装结构包括封装材料层以及嵌设于所述封装材料层内的多个芯片，多个所述芯片通过所述连接走线与所述电池模组电连接。
本申请实施例中，通过将多个芯片集成在一个封装结构内，相对于将每个芯片分别进行封装，将封装后的芯片设于硬质电路板上，再通过柔性电路板将承载有不同的封装芯片的硬质电路板连接起来的方式来说，能够减少封装的次数，减少柔性电路板与硬质电路板的连接，从而减小集成成本。并且，由于将数个芯片封装于一个封装结构内，且减少柔性电路板及硬质电路板的使用，从而能够减小不同芯片的集成结构占用的空间，提高无线耳机内部的空间利用率。本申请实施例中，通过将连接走线设外壳上，从而实现封装结构与电池模组之间的电连接，相对于通过柔性电路板实现封装结构与电池模组之间的电连接来说，能够减少连接封装结构与电池模组之间的柔性电路板的使用，从而进一步的减小集成结构占用的空间，并减小柔性电路板与硬质电路板之间的连接，从而降低集成结构的制作成本。
一些实施例中，所述外壳包括朝向所述外壳内部的内表面，所述连接走线设于所述外壳的内表面。本实施例中，所述连接走线的形成工艺较为简单，所述连接走线能够直接通过激光重构印刷工艺或者激光直接成型技术等成型方式形成于所述外壳的内表面。
一些实施例中，所述连接走线背离所述外壳的一面覆盖有绝缘层，所述绝缘层位于所述连接走线与所述封装结构及所述电池模组连接的位置镂空。本实施例中，所述连接走线能够实现连接所述封装结构以及所述电池模组的作用外，还能够将所述连接走线与设于所述外壳内的其它器件进行绝缘，避免所述连接走线给其它的器件造成短路的风险。
一些实施例中，所述连接走线内嵌于所述外壳中；所述外壳包括朝向所述外壳内部的内表面，所述外壳的内表面设有凹槽，所述凹槽从所述外壳的内表面延伸至所述连接走线，所述封装结构及所述电池模组通过所述第一连接端子与所述连接走线电连接。本实施例中，通过将所述连接走线内嵌于所述外壳内，使得所述连接走线能够更加牢固的位于所述外壳内，减少互联走线断裂损坏的概率，从而提高所述无线耳机的可靠性。
一些实施例中，所述外壳包括耳柄外壳以及连接于所述耳柄外壳一端的耳塞外壳，所述电池模组收容于所述耳柄外壳内，所述封装结构收容于所述耳塞外壳内；所述耳柄外壳为一体成型的柱状，所述耳塞外壳包括可拆卸连接的第一部分以及第二部分，所述第一部分与所述耳柄外壳一体成型，所述连接走线的一端位于所述耳柄外壳远离耳塞外壳的一端，另一端位于所述耳塞外壳的第一部分上。
本申请实施例中，所述外壳包括耳柄外壳以及连接于所述耳柄外壳一端的耳塞外壳，所述耳塞外壳包括可拆卸连接的第一部分以及第二部分，使得电池模组、封装结构等结构能够方便的设置于所述外壳的内部。并且，本实施例中，所述耳柄外壳为一体成型的柱状，使得无线耳机的外观完整性更好，具有更佳的外观效果。
一些实施例中，所述外壳包括耳柄外壳以及连接于所述耳柄外壳一端的耳塞外壳，所述电池模组收容于所述耳柄外壳内，所述封装结构收容于所述耳塞外壳内；所述耳柄外壳包括可拆卸的第三部分以及第四部分，所述第三部分与所述第四部分通过平行于所述耳柄外壳的轴线的平面分割形成；所述连接走线形成与所述第三部分上。
本申请实施例中，所述外壳包括耳柄外壳以及连接于所述耳柄外壳一端的耳塞外壳，所述耳柄外壳包括可拆卸的第三部分以及第四部分，使得电池模组、封装结构等结构能够方便的设置于所述外壳的内部，并能够容易的在所述第三部分上形成连接走线。
一些实施例中，所述电池模组包括电路板以及与所述电路板电连接的电池，所述电路板位于所述电池背离所述耳塞外壳的一侧；所述电路板上设有电池管理单元，所述电池与所述电池管理单元进行电连接；所述电路板与所述连接走线电连接，以实现所述电池模组与所述连接走线的电连接。
一些实施例中，所述电路板上还设有麦克风组件，所述麦克风组件通过所述电路板与所述封装结构电连接。
本申请实施例中，所述电路板位于所述电池背离所述耳塞外壳的一侧，即使得所述电路板位于所述耳柄外壳远离耳塞外壳的末端。所述麦克风组件设于电路板上，使用所述无线耳机时，所述麦克风组件更加的靠近用户的嘴巴，能够有更好的收音效果。
一些实施例中，所述连接走线为多条，多条所述连接走线间隔设置，多条所述连接走线中至少两条所述连接走线用于传输不同的信号，从而通过所述连接走线即能够满足封装结构与电池模组之间信号传输的要求，不需要增加其它的线路。
一些实施例中，多个所述芯片包括电源芯片、存储芯片、蓝牙芯片、音频解码芯片以及传感器芯片中至少两个，从而满足无线耳机的各种功能的需求。
附图说明
为更清楚地阐述本申请的构造特征和功效，下面结合附图与具体实施例来对其进行详细说明。
图1所示为本申请一实施例的无线耳机的结构示意图；
图2所示为图1所示实施例的耳机本体的外壳以及内部结构的结构示意图；
图3所示为图1所示实施例的耳机本体的外壳以及内部结构的爆炸示意图；
图4所示为本申请另一种实施例的无线耳机的外壳的结构示意图；
图5所示为图2所示实施例的无线耳机的封装结构的内部结构示意图。
图6所示为本申请另一实施例的耳机本体的外壳以及内部结构的结构示意图；
图7所示为图6所所示实施例的耳机本体的外壳沿I-I方向的截开后外壳的内部结构示意图；
图8所示为本申请的另一实施例的耳机本体的外壳的沿图6中I-I方向截开后外壳的内部结构示意图；
图9所示为图8所示实施例的耳机本体的外壳的沿图6中II-II方向的截面示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述。
本申请提供一种无线耳机，无线耳机可以与手机、笔记本电脑、平板、智能手表等电子设备配合使用，用于处理电子设备的媒体、通话等音频业务，或者处理其他的一些数据业务。例如，该音频业务可以包括为用户播放音乐、录音、视频文件中的声音、游戏中的背景音乐、来电提示音等媒体业务；还可以包括在电话、微信语音消息、音频通话、视频通话、游戏、语音助手等通话业务场景下，为用户播放对端的语音数据，或采集用户的语音数据发送给对端等。
请参阅图1，图1所示为本申请一些实施例的无线耳机100的结构示意图。本实施例的无线耳机100为真无线立体声(true wireless stereo，TWS)耳机。该无线耳机100包括两个耳机本体100a，两个耳机本体100a能够分别作为左耳耳机以及右耳耳机，其中，左耳耳机能够配合用户的左耳使用，右耳耳机能够配合用户的右耳使用。可以理解的是，本申请的其它一些实施例中，无线耳机100可以为其它类型的无线耳机100。或者，无线耳机100可以仅包括有一个耳机本体100a。
请参阅图2及图3，图2所示为图1所示耳机本体100a的外壳以及内部结构的结构示意图，图3所示为图1所示耳机本体100a的外壳10以及内部结构的爆炸示意图。本实施例中，每个耳机本体100a均包括外壳10以及收容于外壳10内的封装结构20以及电池模组30、以及扬声器组件40。电池模组30与封装结构20电连接，以为封装结构20供电；扬声器组件40与封装结构20进行电连接，以将封装结构20内部元器件处理后的音频信号经扬声器组件40传输，以实现耳机本体100a的语音信号的播放。
本实施例中，还包括柔性电路板50。封装结构20以及电池模组30分别连接于柔性电路板50的两端，从而通过柔性电路板50实现封装结构20与电池模组30的电连接。本实施例中，柔性电路板50与封装结构20之间进行可拆卸的电连接，从而能够方便柔性电路板50与封装结构20之间的装配，并能够方便后续的维护等工作。本实施例中，柔性电路板50与封装结构20之间通过板对板(board to board，BTB)连接器60进行连接。具体的，将板对板连接器60的插座61以及插头62分别设于柔性电路板50的一端以及封装结构20上。本实施例中，插座61设于柔性电路板50上并与柔性电路板50进行电连接；插头62设于封装结构20上并与封装结构20进行电连接。将柔性电路板50与封装结构20装配在一起时，能够直接将连接器60的插座61插入插头62中，即可实现柔性电路板50 与封装结构20之间的电连接。
可以理解的是，本申请的其它一些实施例中，柔性电路板50与封装结构20之间还可以通过热压熔锡焊接等其它方式进行电连接。本实施例中，电池模组30与柔性电路板50之间也可以通过板对板连接器60或者热压熔锡焊接等方式进行电连接。
本实施中，外壳10包括耳柄外壳11以及连接于耳柄外壳11一端的耳塞外壳12。电池模组30收容于耳柄外壳11内，封装结构20收容于耳塞外壳12内。本实施例中，耳塞外壳12包括第一部分121以及盖合于第一部分121上的第二部分122。第一部分121与耳柄外壳11连接为一体，第二部分122能够与第一部分121可拆卸的连接，以便于安装耳机本体100a内部结构的安装。
耳柄外壳11包括管体111盖合于管体111背离耳塞外壳12一端的底盖112。底盖112可拆卸盖合于管体111上，以便于安装耳机本体100a内部结构的安装。其中，底盖112与管体111之间的可拆卸连接方式可以为扣合或者通过粘胶胶合等方式。可以理解的是，一些实施例中，底盖112也可以与管体111一体成型得到。
本实施例中，管体111为一体成型得到的管状结构，使得耳机本体100a的外观完整，具有良好的外观效果。
请参阅图4，图4所示为本申请另一种实施例的无线耳机100的外壳10的结构示意图。本申请的一些实施例中，耳柄外壳11包括可拆卸连接的第三部分113以及第四部分114。第三部分113与第四部分114通过平行于耳柄外壳11的轴线的平面分割形成。换句话说，本实施例的耳柄外壳11并非为一体成型的结构，而是包括能够可拆卸连接的第三部分113以及第四部分114。可以理解的是，一些实施例中，第三部分113朝向第四部分114的开口边缘和/或第四部分114朝向第三部分113的开口边缘设有连接部，以通过连接部实现第三部分113与第四部分114的盖合连接。本实施例中，能够在完成耳机本体100a内部结构的安装后再将第三部分113与第四部分114盖合。因此，本实施例，通过将耳柄外壳11设为包括可拆卸的第三部分113与第四部分114的结构，能够方便耳机本体100a内部结构的安装。本实施例中，第四部分114与耳塞外壳12为一体成型的结构。可以理解的是，一些实施例中，由于第三部分113与第四部分114能够拆装，从而方便耳机本体100a内部结构的安装，因此，耳塞外壳12也可以为一体结构，而不包括可拆卸连接的第一部分121以及第二部分122，从而使得无线耳机100具有更好的外观效果。
请重新参阅图2及图3。本实施例中，电池模组30包括电池31及电路板32。本实施例中，电路板32为硬质电路板32(Printed Circuit Board，PCB)，电池31与电路板32进行电连接，电路板32与柔性电路板50进行电连接，即电池31通过电路板32以及柔性电路板50与封装结构20电连接，电池31产生的电能通过电路板32以及柔性电路板50传输至封装结构20。本实施例中，电路板32上设有第三连接端子，电路板32通过第三连接端子与柔性电路板50进行电连接。其中，第三连接端子可以为弹簧针、弹片、导电块、导电贴片、导电片、插针、插头、接触垫、焊片、引脚等，在此对其具体类型不进行限制。本实施例中，第三连接端子为引脚，柔性电路板50上设有焊片，通过将引脚与焊片焊接在一起，实现电路板32与柔性电路板50的电连接。
本实施例中，电路板32上设有电池管理单元，电池管理单元通过电路板32上的走线与电池31进行电连接。电源管理单元可以包括充电电路、压降调节电路、保护电路、电量测量电路等。充电电路可以接收外部的充电输入。压降调节电路可以将充电电路输入的 电信号变压后输出给电池31以完成对电池31充电，还可以将电池31输入的电信号变压后输出至封装结构20以及其它的工作模块，以为封装结构20内的元器件以及无线耳机100的其它封装结构20进行供电。保护电路可以用于防止电池31过充、过放、短路或过流等。另外，电源管理单元还可以用于监测电池31容量，电池31循环次数，电池31健康状态(漏电，阻抗)等参数。在一些实施例中，电池模组30还可以包括无线充电线圈，用于对无线耳机100进行无线充电。
一些实施例中，每个耳机本体100a还可以包括耳机充电端子，耳机充电端子露出外壳10。耳机充电端子与电源管理单元进行电连接，充电结构与耳机充电端子接触并电连接，以为与电源管理单元连接的电池31进行充电。例如，一些实施例中，充电结构为存放无线耳机100的电池盒，电池盒内设有与耳机充电端子相对应电池盒充电端子。无线耳机100存放于电池盒内时，电池盒充电端子与电池盒充电端子进行接触，从而为无线耳机100进行充电。本实施中，耳机充电端子以及与耳机充电端子相对应的耳机盒充电端子均为两个，两个耳机充电端子分别连接至电池31的正极及负极，从而为电池31进行充电。本实施例中，两个耳机充电端子均设于耳柄外壳11的底盖112上。可以理解的是，本申请的其它实施例中，两个耳机充电端子可以分开设置，例如，一个耳机充电端子设于底盖112上，另一个耳机充电端子设于耳塞外壳12上或者管体111上。本申请实施例中，耳机充电端子以及耳机盒充电端子的类型可以根据实际需求进行变化。例如，该耳机充电端子可以为pogo pin、弹簧针、弹片、导电块、导电贴片、导电片、插针、插头、接触垫、插孔或插座等，本申请实施例对耳机充电端子的具体类型不予限定。
一些实施例中，电路板32上还设有麦克风组件，麦克风组件通过电路板32以及柔性电路板50与封装结构20电连接。麦克风组件包括设于麦克风以及设于电路板32上的麦克风收音电路，麦克风与麦克风收音电路电连接。本实施例中，电路板32背离电池31的表面朝向耳柄外壳11的底盖112，底盖112上设有收音孔。用户的声音经过收音孔传输至麦克风，麦克风的接收的音频信号经麦克风收音电路以及柔性电路板50传输至封装结构20中。
可以理解的是，一些实施例中，电源管理单元集成于电池31上，麦克风收音电路等集成于封装结构20内。因此，该实施例中可以没有电路板32。电池31的正极以及负极直接与第一连接端子进行接触，以使得电池31直接与连接走线进行电连接，为封装结构20内的元器件进行供电。
请参阅图5，图5所示为图2所示实施例的无线耳机100的封装结构20的内部结构示意图。封装结构20包括基板21以及封装于基板21上的封装层22。本实施例中，封装结构20还包括第二连接端子23，通过第二连接端子23与封装结构20外的其它结构进行电连接。本实施例中，第二连接端子23为设于基板21背离封装层22的表面上的焊脚，焊脚与基板21上的走线电连接，以实现封装结构20与封装结构20外的其它结构的电连接。本实施例中，通过焊脚与板对板连接器60的插头62电连接，以将插头62固定于封装结构20上，并与封装结构20电连接。可以理解的是，本申请的其它实施例中，封装结构20的第二连接端子23还可以为其它的结构或者位于封装结构20的其它位置，且第二连接端子23能够与封装结构20的基板21进行电连接，以保证能够通过第二连接端子23实现封装结构20与外界的其它结构的电连接。
封装层22包括封装材料层221以及嵌设于封装材料层221内的多个元器件222。元器 件222均与基板21的走线进行电连接，以通过基板21上的走线实现各元器件222之间的通信以及封装结构20内的元器件222与封装结构20外的其它元器件222或者模块之间的通信。其中，元器件222可以为芯片等有源器件，也可以为电容元件、电感元件、电阻元件等无源器件；或者，元器件222也可以部分为有源器件，部分为无源器件。本实施例中，封装结构20包括有多个芯片，即封装层22内封装有多个芯片。
本实施例中，封装结构20内封装的芯片包括电源芯片222A、存储芯片222B、蓝牙芯片222C、音频解码芯片222D以及传感器芯片222E。可以理解的是，一些实施例中，封装结构20封装的结构可以根据需要进行更换、删减或者增加。例如，一些实施例中，封装结构20内仅封装有存储芯片222B、蓝牙芯片222C以及音频解码芯片222D。
本实施例中，电源芯片222A通过基板21以及第二连接端子23与电池模组30进行电连接，并与封装结构20内的其它有源器件进行电连接，主要用于将电池31传输来的电能进行控制，以给其他有源器件(包括封装结构20内封装的各芯片)提供稳定的电源；储存芯片是给主芯片提供数据的缓存以及数据的存储；蓝牙芯片222C作为主芯片，一方面通过协议控制扬声器组件40与麦克风组件等器件，一方面通过蓝牙天线作为通讯处理器。本实施例中，蓝牙天线形成于外壳10上。可以理解的是，一些实施例中，蓝牙天线可以设于封装结构20上；音频解码芯片222D主要就是用来解码，因为麦克风组件采集的音频文件的格式机器并不能直接读取，需要通过音频解码芯片222D解码成机器码，再将解码后的文件传输至蓝牙芯片222C，并经蓝牙天线传输出去。或者，经蓝牙天线接收的音频信号需要经过音频解码芯片222D解码后再传输至扬声器组件40，并经扬声器组件40发声。
一些实施例中，无线耳机100中包括传感器组件，传感器组件包括传感器以及传感器芯片222E，传感器接收的外部其它信号经传感器芯片222E转化为电信号并传输给主芯片，主芯片根据所传输的信号做出一定的预判。比如说，播放音乐时耳机滑落后，传感器组件识别耳机的速度变化，传递给主芯片，主芯片可以终止音乐的播放。
本实施例中，封装结构20包括有多个芯片，即封装层22内封装有多个芯片。相较于每个芯片分别进行封装，将封装后的芯片设于硬质电路板上，再通过柔性电路板将承载有不同的封装芯片的硬质电路板连接起来的方式来说，能够节约封装成本，并能够减小芯片封装占用的空间，更有效的利用耳机本体100a的内部空间。并且，还能够减少柔性电路板与硬质电路板的连接，从而减小集成成本，并减少柔性电路板及硬质电路板的使用，提高无线耳机100内部的空间利用率。本申请一些实施例中，通过提高无线耳机100内部的空间利用率，从而能够在耳机内部集成更多的工作模块，以丰富无线耳机100的功能。或者，一些实施例中，还可以相应的增大电池31的体积，从而提高电池31中存储的电量，延长无线耳机100的工作时长。
请参阅图6及图7，图6所示为本申请另一实施例的耳机本体100a的结构示意图；图7所示为图6中的外壳10沿I-I方向的截开后外壳10的内部结构示意图。本实施例与图2所示实施例的耳机本体100a的差别在于：本实施例没有连接封装结构20以及电池模组30的柔性电路板50。本实施例中，耳机本体100a的外壳10的内表面上设有连接走线70，封装结构20与电池模组30分别电连接于连接走线70的两端，从而通过外壳10上的连接走线70进行电连接。
本实施例中，外壳10的内表面设有第一连接端子71，第一连接端子71分别设于连接 走线70的两端并与连接走线70电连接。封装结构20设于耳机的外壳10内时，封装结构20上的第二连接端子23与第一连接端子71接触，封装结构20与连接走线70电连接；电池模组30设于耳机的外壳10内时，电池模组30的电路板32上的第三连接端子33与第一连接端子71接触，电池模组30与连接走线70电连接。当电池模组30没有电路板32时，电池31的正负极即为电池模组30的第三连接端子33，并与第一连接端子71接触，以实现电池模组30与连接走线70的电连接。
本申请实施例中，第一连接端子71可以为pogo pin、弹簧针、弹片、导电块、导电贴片、导电片、插针、插头62、接触垫、插孔或插座61等，本申请实施例对第一连接端子71的具体类型不予限定。第二连接端子23及第三连接端子33为与第一连接端子71相对应的结构。本实施例中，第一连接端子71为导电片，第二连接端子23与第三连接端子33均为弹片。可以理解的是，当第二连接端子23与第三连接端子33相同时，连接走线70两端连接的第一连接端子71均相同；当第二连接端子23与第三连接端子33不相同时，连接走线70两端连接的第一连接端子71可以不相同。
连接走线70的数量可以为一条或者多条。连接走线70为时，多条连接走线70间隔设置。多条连接走线70中至少两条连接走线70用于传输不同的信号，从而实现多种信号的传输。本实施例中，连接走线70为多条，多条连接走线70中包括用于传输电池模组30的电量的电源走线、传输麦克风模组采集的音频信号的音频走线以及接地线。
本实施例中，连接走线70可以通过激光重构印刷工艺(Laser Restructured Print,LRP)或者激光直接成型技术(Laser-Direct-structuring,LDS)等成型方式设于外壳10的内表面。其中，激光重构印刷工艺具体包括：将导电银浆高速精准地涂敷到外壳10上，再通过控制激光的修正，在外壳10的上形成高精度的连接走线70。激光直接成型技术具体包括：使用激光直接成型技术按照设计的连接走线的图纸，控制激光的方向，将激光投射到三维的外壳10上，从而形成连接走线70。可以理解的是，还可以通过其它的方案在外壳10上形成连接走线70。例如，还可以通过光罩图案化等方式形成连接走线70。
一些实施例中，连接走线70朝向耳机本体100a内部的一侧表面覆盖有绝缘层，且绝缘层位于连接走线70与封装结构20及电池模组30连接的位置镂空，使得连接走线70能够实现连接封装结构20以及电池模组30的作用外，还能够将连接走线70与设于外壳10内的其它器件进行绝缘，避免连接走线70给其它的器件造成短路的风险。例如，可以在连接走线70朝向无线耳机100背内部的一侧表面上贴上绝缘纸或者涂上绝缘的油墨或者涂上的绝缘胶层。
本实施例中，连接走线70一端位于耳柄外壳11远离耳塞外壳12的一端，另一端位于所述耳塞外壳12的第一部分121上。可以理解的是，一些实施例中，上连接走线70设于耳柄外壳11的壳体上，即设于连接走线70两端的第一连接端子71均位于耳柄外壳11的壳体上，封装结构20的第二连接端子23及电池模组30的第三连接端子33均朝向第一连接端子71，并与第一连接端子71接触；或者，本申请的其它一些实施例中，连接走线70的一端能够延伸至耳柄外壳11的底盖112上，和/或另一端延伸至与耳柄外壳11一体连接的耳塞外壳12的第一部分121上。本实施例中，耳机本体100a的外壳10与图4所示的耳机本体100a的外壳10的结构相同。即本实施例的耳柄外壳11分为可拆卸连接的第三部分113以及第四部分114，从而能够方便通过激光重构印刷工艺或者激光直接成型技术等成型方式在外壳10的内表面形成连接走线70。可以理解的是，本申请一些实施例 中，耳机本体100a的外壳10也可以与图2所示的耳机本体100a的外壳10的结构相同。本实施例中，连接走线70位于第三部分113上。本申请的其它一些实施例中，第三部分113与耳塞壳体12的第一部分121连接，第四部分114与耳塞壳体12的第二部分122连接，连接走线70的一端位于第三部分113背离耳塞壳体12的一端，另一端位于第一部分121上，以便于封装结构20以及电池组件30与连接走线70的电连接。可以理解的是，可以根据实际需求将连接走线70设于外壳10的其它位置，例如，将连接走线70设于第四部分114上，或者，一端位于第四部分114背离耳塞壳体12的一端，另一端位于第二部分122上。
本实施例中，通过将连接走线70设于外壳10上，以实现封装结构20与电池模组30之间的电连接，相对于通过柔性电路板实现封装结构20与电池模组30之间的电连接来说，能够减少连接封装结构20与电池模组30之间的柔性电路板的使用，从而进一步的减小集成结构占用的空间，并减小柔性电路板与硬质电路板之间的连接，从而降低集成结构的制作成本。
请参阅图8及图9，图8所示为本申请的另一实施例的耳机本体100a的外壳10的沿图6中I-I方向截开后外壳10的内部结构示意图；图9所示为图8所示实施例的耳机本体100a的外壳10的沿图6中II-II方向的截面示意图。本实施例的耳机本体100a与图6所示的实施例的耳机本体100a的差别在于：本实施例中，连接走线70内嵌于外壳10内。并且，外壳10的内表面上对应于连接走线70的两端的位置设有凹槽，凹槽从外壳10的内表面延伸至连接走线70。第一连接端子71设于凹槽内并与连接走线70电连接。本实施例中，第一连接端子71为导电片，导电片设于凹槽内。可以理解的是，一些实施例中，凹槽内没有设置导电片，连接走线70露出凹槽的部分即为第一连接端子71。
本实施例中，通过将连接走线70内嵌于外壳10内，使得连接走线70能够更加牢固的位于外壳10内，减少互联走线断裂损坏的概率，从而提高无线耳机100的可靠性。并且，本实施例中，由于第一连接端子71设于凹槽内，当第二连接端子23与第一连接端子71进行接触时，凹槽的周壁能够限制第二连接端子23的移动，并使得第二连接端子23能够更加准确的定位至第一连接端子71，并能够避免第二连接端子23相对第一连接端子71的移动，提高接触的可靠度。一些实施例中，当需要将第一连接端子71与第二连接端子23焊接在一起时以提高连接第一连接端子71与第二连接端子23连接的可靠性时，凹槽能够保证焊料集中于凹槽所在位置，避免焊料滚动至其它位置，从而有助于提高的焊接可靠性。
本申请一些实施例中，至少部分的耳机外壳10可以包括基层以及覆盖于基层上的覆盖层，连接走线70位于基层以及覆盖层之间，从而形成连接走线70内嵌于外壳10内的结构。本申请实施例中，可以采用三维印刷工艺LRP技术或者LDS技术等工艺技术在基层的外表面(即基层朝向覆盖层的一面)形成连接走线70，再通过使用注塑的工艺，在基层的外表面再形成覆盖层，从而将连接走线70内嵌于耳机外壳10内。本实施例中的耳机本体100a的耳机外壳10可以与图2所示实施例的耳机本体100a的耳机外壳10的结构相同，即本实施例中的耳柄外壳11的管体为一体成型得到的管状结构，使得耳机本体100a的外观完整，具有良好的外观效果。并且，本实施例中的底盖与管体一体成型得到，使得耳机本体100a的外观完整。可以理解的是，本申请一些实施例中，图8所示耳机本体100a的耳机外壳10也可以与图4所示实施例的耳机本体100a的耳机外壳10的结构相同。
本申请实施例中，通过将多个芯片集成在一个封装结构20内，相对于将每个芯片分别进行封装，再将封装后的芯片设于硬质电路板上，再通过柔性电路板将承载有不同的封装芯片的硬质电路板连接起来的方式来说，本申请将多个芯片集成在一个封装结构20内，能够节约封装成本，减小芯片封装占用的空间，更有效的利用耳机本体100a的内部空间。并且，能够减少柔性电路板与硬质电路板的连接，从而减小集成成本，减少柔性电路板与硬质电路板占用的空间，以更有效的利用耳机本体100a的内部空间。本实施例中，还通过将连接走线70设于外壳10上，从而实现封装结构20与电池模组30之间的电连接，相对于通过柔性电路板实现封装结构20与电池模组30之间的电连接来说，能够减少连接封装结构20与电池模组30之间的柔性电路板的使用，从而进一步的减小集成结构占用的空间，并减小柔性电路板与硬质电路板之间的连接，从而降低集成结构的制作成本。
以上为本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (10)

  1. 一种无线耳机，其特征在于，包括外壳、收容于所述外壳内的封装结构、电池模组以及设于所述，所述外壳上设有连接走线，所述封装结构与所述电池模组设于所述连接走线的两端，并通过所述外壳上的所述连接走线进行电连接；
    所述封装结构包括封装材料层以及嵌设于所述封装材料层内的多个芯片，多个所述芯片通过所述连接走线与所述电池模组电连接。
  2. 如权利要求1所述的无线耳机，其特征在于，所述外壳包括朝向所述外壳内部的内表面，所述连接走线设于所述外壳的内表面。
  3. 如权利要求2所述的无线耳机，其特征在于，所述连接走线背离所述外壳的一面覆盖有绝缘层，所述绝缘层位于所述连接走线与所述封装结构及所述电池模组连接的位置镂空。
  4. 如权利要求1所述的无线耳机，其特征在于，所述连接走线内嵌于所述外壳中；所述外壳包括朝向所述外壳内部的内表面，所述外壳的内表面设有凹槽，所述凹槽从所述外壳的内表面延伸至所述连接走线，所述封装结构及所述电池模组通过所述第一连接端子与所述连接走线电连接。
  5. 如权利要求1-3任一项所述的无线耳机，其特征在于，所述外壳包括耳柄外壳以及连接于所述耳柄外壳一端的耳塞外壳，所述电池模组收容于所述耳柄外壳内，所述封装结构收容于所述耳塞外壳内；
    所述耳柄外壳为一体成型的柱状，所述耳塞外壳包括可拆卸连接的第一部分以及第二部分，所述第一部分与所述耳柄外壳一体成型，所述连接走线的一端位于所述耳柄外壳远离耳塞外壳的一端，另一端位于所述耳塞外壳的第一部分上。
  6. 如权利要求1-3任一项所述的无线耳机，其特征在于，所述外壳包括耳柄外壳以及连接于所述耳柄外壳一端的耳塞外壳，所述电池模组收容于所述耳柄外壳内，所述封装结构收容于所述耳塞外壳内；
    所述耳柄外壳包括可拆卸的第三部分以及第四部分，所述第三部分与所述第四部分通过平行于所述耳柄外壳的轴线的平面分割形成；所述连接走线形成与所述第三部分上。
  7. 如权利要求5或6任一项所述的无线耳机，其特征在于，所述电池模组包括电路板以及与所述电路板电连接的电池，所述电路板位于所述电池背离所述耳塞外壳的一侧；所述电路板上设有电池管理单元，所述电池与所述电池管理单元进行电连接；所述电路板与所述连接走线电连接，以实现所述电池模组与所述连接走线的电连接。
  8. 如权利要求7所述的无线耳机，其特征在于，所述电路板上还设有麦克风组件，所述麦克风组件通过所述电路板与所述封装结构电连接。
  9. 如权利要求1-8任一项所述的无线耳机，其特征在于，所述连接走线为多条，多条所述连接走线间隔设置，多条所述连接走线中至少两条所述连接走线用于传输不同的信号。
  10. 如权利要求1所述的无线耳机，其特征在于，多个所述芯片包括电源芯片、存储芯片、蓝牙芯片、音频解码芯片以及传感器芯片中至少两个。
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Publication number Priority date Publication date Assignee Title
US11170089B2 (en) 2013-08-22 2021-11-09 Staton Techiya, Llc Methods and systems for a voice ID verification database and service in social networking and commercial business transactions
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103841478A (zh) * 2012-11-20 2014-06-04 清华大学 耳机
US20170013346A1 (en) * 2015-07-09 2017-01-12 Samsung Electronics Co., Ltd. Electronic device and method for controlling power signal using the same
CN207382517U (zh) * 2017-10-13 2018-05-18 深圳市耳海声学技术有限公司 一种线控式蓝牙耳机
CN108702559A (zh) * 2016-01-06 2018-10-23 三星电子株式会社 耳朵可佩戴类型的无线设备和支持其的系统
CN109391871A (zh) * 2018-12-04 2019-02-26 安克创新科技股份有限公司 一种蓝牙耳机
CN110650401A (zh) * 2019-09-30 2020-01-03 华为技术有限公司 无线耳机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170064830A1 (en) * 2015-08-24 2017-03-02 Motorola Mobility Llc Circuit Assembly for Compact Acoustic Device
CN107240576A (zh) * 2017-07-12 2017-10-10 昆山丘钛微电子科技有限公司 一体化系统指纹芯片封装结构及指纹模组
CN109671679A (zh) * 2017-10-13 2019-04-23 南昌欧菲生物识别技术有限公司 指纹芯片封装结构及设有指纹芯片封装结构的指纹模组
CN207800895U (zh) * 2017-12-18 2018-08-31 歌尔股份有限公司 一种电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103841478A (zh) * 2012-11-20 2014-06-04 清华大学 耳机
US20170013346A1 (en) * 2015-07-09 2017-01-12 Samsung Electronics Co., Ltd. Electronic device and method for controlling power signal using the same
CN108702559A (zh) * 2016-01-06 2018-10-23 三星电子株式会社 耳朵可佩戴类型的无线设备和支持其的系统
CN207382517U (zh) * 2017-10-13 2018-05-18 深圳市耳海声学技术有限公司 一种线控式蓝牙耳机
CN109391871A (zh) * 2018-12-04 2019-02-26 安克创新科技股份有限公司 一种蓝牙耳机
CN110650401A (zh) * 2019-09-30 2020-01-03 华为技术有限公司 无线耳机

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