WO2021058259A1

WO2021058259A1 - Miniaturised spectrometer device and method for producing a miniaturised spectrometer device

Info

Publication number: WO2021058259A1
Application number: PCT/EP2020/074713
Authority: WO
Inventors: Joachim Friedl
Original assignee: Robert Bosch Gmbh
Priority date: 2019-09-26
Filing date: 2020-09-04
Publication date: 2021-04-01
Also published as: DE102019126050A1

Abstract

The present invention relates to a miniaturised spectrometer device (1), comprising a housing (G) having an opening (GO), or an optical access means, through which a sample (P) can be irradiated with light, and through which light reflected by the sample can be captured; a wiring substrate (VS), which is arranged inside the housing (G) or is formed as part of the housing (G); an electrical interface (ES), by means of which the wiring substrate (VS) can be electrically contacted from outside the housing; an emission component (EK) inside the housing (G), by means of which a sample (P) can be irradiated with light through the opening (GO) or the access means, and which is electrically contacted by the wiring substrate (VS); and a detection component (DK) inside the housing (G), by means of which light reflected by the sample (P) through the opening (GO) or the access means can be detected and analysed, wherein an emission angle (EW) and a detection angle (DW), counter to one another, can be the same as or different from one another with respect to a normal (N) on a housing top face (GOS).

Description

description

title

Miniaturized spectrometer device and method for making a miniaturized spectrometer device

The present invention relates to a miniaturized spectrometer device and a method for producing a miniaturized spectrometer device.

State of the art

Spectrometry systems can comprise a sensor system consisting of an illumination and detection component. One or more light sources can be used here and illuminate an area of a sample to be analyzed. A detector is usually arranged spatially separated from the light source.

In the case of spectral sensors, the use of a tunable MEMS Fabry-Perot interferometer (FPI) seems to be a promising approach to miniaturization of the sensors for the realization of a spectral filter element.

Tunable Fabry-Perot interferometers can ideally be constructed from two parallel mirrors that can be moved relative to one another and have high reflectivity in the relevant wavelength range, with a distance between the two mirrors being adjustable by means of an actuation mechanism. To enable actuation, the Fabry-Perot interferometer can advantageously be designed as a MOEMS (micro-opto-electro-mechanical system). A transmission wavelength of the FPI can be set precisely by means of the distance.

EP 3064912 shows a spectrometer system with a module which comprises only one detection path. One emission path and one Rules are housed in a separate and higher-level assembly, which differs from a miniaturized and compact arrangement in a mobile device.

Disclosure of the invention

The present invention provides a miniaturized spectrometer device according to claim 1 and a method for manufacturing a miniaturized spectrometer device according to claim 14.

Preferred further developments are the subject of the subclaims.

Advantages of the invention

The idea on which the present invention is based consists in specifying a miniaturized spectrometer device with which a sample can be irradiated with broadband light and the light reflected by the sample can be detected and analyzed. Furthermore, the spectrometer device is characterized by a compact design, the components of the emission path and the detection path being arranged together in a housing and in a miniaturized design.

According to the invention, a miniaturized spectrometer device comprises a housing with an opening or an optical access through which or which a sample can be irradiated with light and through which or which a light reflected from the sample can be captured; a wiring substrate which is arranged within the housing, or is designed as a housing part; an electrical interface through which the wiring substrate can be electrically contacted from outside the housing; an emission component within the housing, with which a sample can be irradiated with light through the opening or the optical access and which is in electrical contact with the wiring substrate; and a detection component within the housing with which a light reflected from the sample can be detected and analyzed through the opening or the optical access, with opposite of a normal to a housing top, an emission angle and a detection angle are opposite to one another, the same or different from one another.

The miniaturized spectrometer device can serve as an optical sensor for determining the chemical composition of a sample. The wiring substrate can be part of the housing and delimit the interior of the housing towards the bottom.

In other words, the detection component is arranged in a detection path of the spectrometer device and the emission component is arranged in an emission path. The detection component can comprise a Fabry-Perot interferometer (FPI) as a tunable spectral filter element, as well as a photodetector for measuring the transmitted light intensity.

In the emission component, controlled by the control device, a light can be generated and transmitted onto the object to be examined. The object to be examined is referred to below as a sample. The light source can be a diffusely emitting light source, for example one or more LEDs, for example phosphor-coated white light LEDs. The light source can emit in the wavelength range relevant for the function of the spectrometer. The emission component can also additionally comprise optical elements for beam shaping. The light as a stimulus can advantageously encompass the entire spectral range to be analyzed.

In the detection path of the spectrometer, the light reflected by the sample can be detected and / or analyzed and, for example, the absorption spectra of the sample obtained by the FPI can be compared with known material spectra. The raw data can, for example, be transferred to a host system via the electrical interface and an external interface, and from there it can be sent to a cloud so that the chemometric examination can be carried out using cloud computing. The result can then be sent back to the host system from the cloud. With the FPI, a specific wavelength range can be covered by varying the distance (variation of the transmissivity) and an evaluation device can draw conclusions about the materials in the sample from the spectra obtained. After the light is reflected on the sample, it can have certain absorption spectra, which can result from an interaction of the light with the sample and the substances present in it. The emission angle and the detection angle can be equal to the normal, only the emission beam and the detection beam can be inclined in different directions with respect to the normal. However, it is also possible for the emission angle and the detection angle to differ in terms of amount.

The first control device can comprise an electronic control and evaluation system and activate the FPI and control the light source, for example its emitted wavelength (switching on various LEDs), and evaluate the signal from the photodetector. In addition, the electronic control and evaluation system can communicate with the higher-level system (e.g. the application processor of the mobile phone / smartphone) in a sending and receiving function via the external interface. The first control device can advantageously be designed as an ASIC (application specific integrated circuit), but discrete circuits are also conceivable. The FPI can be controlled by the first control device or by a second control device which is arranged on the FPI, or at least in the detection component. The ASIC can also be used for functional system integration in the higher-level assembly so that the spectrometer in the end device can be used sensibly by the end user.

The miniaturized spectrometer device is advantageously suitable for use in a mobile device, for example in a mobile phone, due to its very small dimensions and a compact combination of several components to form an overall system.

The wiring substrate can comprise a printed circuit board or any other type of carrier with conductor tracks which are applied to it or in it can be integrated. The designation “substrate” can also be interpreted here as simply a designation for a carrier.

The electrical interface can comprise a printed circuit board or a carrier or a plate with conductor tracks. The electrical interface can be shaped in such a way that the wiring substrate can be arranged on the electrical interface and can cover at least a partial area of the electrical interface. The housing can then in turn be arranged on the wiring substrate and at least partially cover it. The electrical interface can comprise one or more contacts at one end and be shaped, for example, as a plug-in card (plug-in contact). The electrical interface is advantageously designed as a flexible broadband cable that can be suitable for making contact with ZIF connectors (zero insertion force connector). This design enables simple and industry-standard system integration into the higher-level assembly. This can correspond to a connection principle that can also be used in smartphones to connect the camera to the mainboard.

The miniaturized spectrometer device has a compact design, a miniaturized overall system can be created with an advantageous spatial arrangement and design of the detection component and emission component, which can have all the necessary components for the function of the spectrometer at the same connection level. This can be referred to as a so-called “first level package”. Such an arrangement of the emission and detection components within the housing and towards the opening can advantageously be achieved that the required installation space is minimized and, moreover, an advantageous beam path can be generated which can guide the light along the desired optical axis towards the sample, and block unwanted stray light.

By designing the emission component and the detection component separately, these components can advantageously be formed in subassemblies, thereby enabling an advantageous process flow in assembly and connection technology (AVT). According to a preferred embodiment of the spectrometer device, the emission component comprises a light source and a first printed circuit board section, the emission component being in electrical contact with the wiring substrate via the first printed circuit board section.

According to a preferred embodiment of the spectrometer device, the emission component comprises a first control device, the light source being stacked on the first control device.

The first control device can also be contained in the detection component, or in a further assembly within the housing, for example the first control device (ASIC) can also be attached directly to the wiring substrate.

The first printed circuit board section can comprise a printed circuit board or a carrier with conductor tracks as a component formed separately from other printed circuit boards or conductor sections.

Electrical contacting of the light source and the first control device (ASIC) can be achieved through the first printed circuit board section, as a result of which the named components can be functionally wired in the selected spatial arrangement. The first control device can comprise an electronic control and evaluation system.

According to a preferred embodiment of the spectrometer device, the detection component comprises a Fabry-Perot interferometer, a photodetector, a beam-shaping element and a second circuit board section, the light reflected from the sample being spectrally filterable by the Fabry-Perot interferometer (FPI) and by the dem Fabry-Perot interferometer in the beam path downstream beam-shaping element can be bundled on the photodetector, and wherein the detection component is electrically contacted via the second printed circuit board section with the wiring substrate. The detection component is advantageously electrically contacted via the second printed circuit board section with the wiring substrate and also with the ASIC, for example via the first printed circuit board section.

Electrical contacting of the FPI and the photodetector can be achieved through the second printed circuit board section, as a result of which the named components can be wired appropriately in the chosen spatial arrangement. The first control device can comprise an electronic control and evaluation system.

The beam-shaping element can be a parabolic mirror, for example. The components of the detection component can thus be arranged on their own conductor device, in particular the second printed circuit board section and separated from other assemblies, such as the emission component, and can be contacted with the wiring substrate and oriented according to the application.

According to a preferred embodiment of the spectrometer device, the first printed circuit board section comprises a flexible printed circuit board with a locally stiffened area on the light source, and advantageously on the first control device, and / or the second printed circuit board section comprises a flexible printed circuit board with a locally stiffened area on the Fabry-Perot Interferometer and the photodetector.

By means of a flexible printed circuit board, the assembly (component) to be arranged or already arranged on the stiffened area can be oriented depending on the application. For example, the assembly with the stiffened area can be positioned on a carrier with an area provided for the respective component and the flexible area can be guided towards the wiring substrate. Advantageous alignment and electrical contact routing to the wiring substrate can thus take place within the housing. According to a preferred embodiment of the spectrometer device, the housing comprises a glass plate or an optical access at the opening.

The optical access can advantageously be made of a material that is transparent in the spectral range relevant for the measurement operation, such as glass. By using a transparent material instead of a simple opening in the cover, it can also be ensured that no contamination in the form of particles or the like can penetrate the interior of the housing.

The inside of the housing can be shielded from environmental influences by the glass plate. Furthermore, a vacuum or a defined internal pressure of a gas can be set in the housing.

According to a preferred embodiment of the spectrometer device, the beam-shaping element comprises a parabolic mirror or a reflective cavity in a carrier element.

The parabolic mirror or the reflective cavity can advantageously focus the light transmitted by the FPI on a photodetector. Here, a detection area of the photodetector can be smaller, about half or even smaller, than the emission area of the FPI, whereby a compact detection component can be provided.

According to a preferred embodiment of the spectrometer device, the Fabry-Perot interferometer comprises a mirror element, on which a glass plate is arranged in each case on an upper side and on a lower side.

The FPI can comprise a silicon layer as a mirror element, which can furthermore comprise actuatable and variable spacing, for example high and low refractive index layers, which depending on the spacing can transmit a predetermined wavelength and can reflect the other wavelengths. Glass plates can be joined to the top and bottom of the silicon layer, the glass being designed in such a way that it can be transparent in the wavelength range relevant for the function of the spectrometer. A hermetically sealed encapsulation can be achieved by means of such an arrangement and material selection. A correspondingly selectable internal pressure can be achieved or provided for an advantageous operation of the FPI. Such an FPI can be executed at chip level.

According to a preferred embodiment of the spectrometer device, the second circuit board section comprises an interferometer section for the Fabry-Perot interferometer and a detector section for the photodetector.

The second printed circuit board section can advantageously be divided into two separate areas that are separate from one another. The assembly of the FPI and the assembly of the photodetector with the beam-shaping element can be arranged in a spatially separate area in the housing.

According to a preferred embodiment of the spectrometer device, the interferometer section and the detector section are completely separated from one another and the interferometer section comprises a flexible printed circuit board with a locally stiffened area on the Fabry-Perot interferometer and the detector section comprises a flexible printed circuit board a locally stiffened area on the photodetector, the flexible printed circuit board and the locally stiffened area having an optical opening at an optical aperture of the Fabry-Perot interferometer.

The assembly of the FPI and the assembly of the photodetector with the beam-shaping element can be arranged spatially separated from one another and aligned with one another, advantageously adapted to the shape and available space of the housing.

According to a preferred embodiment of the spectrometer device, it comprises a carrier element with a first sub-area on which the emission component is arranged and with a second sub-area on which the detection component is arranged, the first sub-area and the second sub-area are each aligned with the opening or the optical access in the housing (cover).

The subregions of the carrier element can each have advantageous orientations for the orientation of the components to be attached there, advantageous for the emission component and for the detection component towards the opening. The assemblies can then be joined in the respective alignment on the respective sub-area of the carrier element. The carrier element can be produced as an injection-molded part and comprise both subregions as an overall element. However, the subregions can also be formed as separate parts which can be fixed to the wiring substrate and / or can be connected to one another.

According to a preferred embodiment of the spectrometer device, it comprises a diaphragm which is arranged on the carrier element and has a reflective and beam-shaping emission opening above the emission component and a detection aperture above the detection component and prevents direct irradiation of the detection component by the emission component.

The diaphragm can advantageously interrupt a direct beam path from the emission component to the detection component, so that little or no scattered light can be radiated directly from the emission component into the detection component. The beam-shaping emission opening can have a circular cross section and the emitted light can radiate onto the sample in a predetermined illumination area. A wall surface for blocking light can be positioned between the detection aperture and the light source. This wall surface can be part of the panel.

According to a preferred embodiment of the spectrometer device, the interferometer section is arranged on the second partial area of the carrier and the second partial area comprises a recess, and the carrier element includes a detector carrier on which the detector section is arranged and wherein the detector carrier can be positioned within the recess and in a beam path of the Fabry-Perot interferometer.

The detector carrier can be inserted into the recess as a separate carrier part and can carry the photodetector and a beam-shaping element. The subcomponents of the detection component can be arranged and contacted separately in this way.

Alternatively, the preassembled detector carrier (which can include the photodetector) can be glued to the wiring substrate. Then the pre-assembled carrier (which is already equipped with FPI, ASIC, LED) can be glued over it.

According to the invention, in the method for producing a miniaturized spectrometer device, a wiring substrate is provided, which is electrically contacted with an electrical interface; placing an emission component on the wiring substrate and electrically connecting the emission component to the wiring substrate; placing a detection component on the wiring substrate and electrically connecting the detection component to the wiring substrate; and arranging a housing on or around the wiring substrate, which in this case encloses the detection component and the emission component, wherein the housing comprises an opening or an optical access and, before the housing is arranged, the detection component and the emission component are aligned in such a way that a sample passes through the The opening or the access can be irradiated with light and a light reflected by the sample through the opening or the access can be detected and analyzed, with an emission angle and a detection angle opposite to a normal on a housing top side being the same or different from one another.

The method can also be distinguished by the features mentioned in connection with the spectrometer device and their advantages, and vice versa. Further features and advantages of embodiments of the invention emerge from the following description with reference to the accompanying drawings.

Brief description of the drawings

The present invention is explained in more detail below with reference to the exemplary embodiments specified in the schematic figures of the drawing.

Show it:

La is a schematic view of a miniaturized spectrometer device according to an embodiment of the present invention;

FIG. 1b shows a side sectional view of the miniaturized spectrometer device according to an exemplary embodiment of the present invention; FIG.

2a-d perspective views of a detection component in a spectrometer device according to an exemplary embodiment of the present invention;

3a-c perspective views of a detection component in a spectrometer device according to a further exemplary embodiment of the present invention;

4a-c are perspective views of an emission component in a spectrometer device according to an exemplary embodiment of the present invention;

5a shows a plan view of a carrier element in a spectrometer device; 5b shows a view of a carrier element in a spectrometer device;

6a-c are perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to an exemplary embodiment of the present invention;

7a-c are perspective views of a screen for a carrier element;

8a-c are perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to a further exemplary embodiment of the present invention;

9a-c are perspective views of a carrier element for a spectrometer device according to a further exemplary embodiment of the present invention;

10a-c are perspective views of a detection component for a spectrometer device according to a further exemplary embodiment of the present invention;

11a-b perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to a further exemplary embodiment of the present invention; and

12 shows a block diagram of method steps of a method for producing a miniaturized spectrometer device according to an exemplary embodiment of the present invention.

In the figures, identical reference symbols denote identical or functionally identical elements. Fig. La shows a schematic view of a miniaturized spectrometer device according to an embodiment of the present invention.

The miniaturized spectrometer device 1 comprises a housing G with an opening GO through which a sample can be irradiated with light and through which a light reflected from the sample can be captured; a wiring substrate within the housing G or embodied as part of the housing; and an electrical interface ES, through which the wiring substrate can be electrically contacted from outside the housing. The electrical interface ES can comprise a printed circuit board with contacts Kt at its end and be designed as a plug-in card or plug-in contact for a higher-level assembly. Such a package enables electrical testing and calibration of the overall system at module level, advantageously also before system integration into the higher-level assembly, for example in a mobile phone. Such a system integration can easily be made possible by an external shape of the package. The housing G can thus comprise a deep-drawn cover, which can enable simple mechanical referencing for positive positioning and fixing. The electrical interface ES can itself comprise a flexible printed circuit board in the area outside the housing, which can enable a simple and reversible connection of the package to a power and signal line of the higher-level assembly. A marking, for example a logo or a code, can be applied to the housing G. The housing G can be a metallic deep-drawn part. Protection against contamination can be guaranteed with a glass plate. The glass used is selected so that it is transparent in the wavelength range relevant for the function of the spectrometer. The glass plate can also be glued to the housing from an inside.

Fig. Lb shows a side sectional view of the miniaturized spectrometer device according to an embodiment of the present invention. The miniaturized spectrometer device 1 comprises a housing G with an opening GO through which a sample P can be irradiated with light and through which a light reflected from the sample can be captured; a wiring substrate VS within the case G; an electrical interface ES through which the wiring substrate VS can be electrically contacted from outside the housing; an emission component EK within the housing G, with which a sample P can be irradiated with light through the opening GO and which is in electrical contact with the wiring substrate VS; and a detection component DK within the housing G, with which a light reflected by the sample P through the opening GO can be detected and analyzed, with an emission angle β and a detection angle α being the same or different from each other in opposite directions to a normal N to a housing top GOS.

The emission component EK can comprise a light source LQ, a first control device ASIC and a first printed circuit board section, the emission component EK being in electrical contact with the wiring substrate via the first printed circuit board section and the light source being stacked on the first control device. The detection component DK can comprise a Fabry-Perot interferometer FPI, a photodetector PD, a beam-shaping element E and a second printed circuit board section, the light reflected from the sample P being filterable by the Fabry-Perot interferometer FPI and by that of the Fabry-Perot -Interferometer FPI in the beam path downstream beam-shaping element E can be bundled on the photodetector PD, and wherein the detection component DK can be electrically contacted via the second printed circuit board section with the wiring substrate VS and the ASIC. The emission component EK and the detection component DK can face the opening GO. A glass plate can be enclosed in the housing G in the region of the opening.

The opening GO can represent a common optical access for the emission component and for the detection component. The wiring substrate can represent a rewiring substrate for connecting the components to the circuit board sections. The detection component and emission components and their sub-components can be fixed to the wiring substrate, for example, by gluing. Electrical contact between the components and the conductor track sections can be achieved, for example, by means of wire bonds DB (wirebonding), but other types of electrical contact are also possible, for example soldered connections.

The beam-shaping element E can, for example, be shaped as an injection-molded part and have a local metallization to create a reflective layer. By means of a corresponding arrangement and shape of the beam-shaping element E, for example as a parabolic mirror, the light of a wide beam profile, which can result from the aperture of the FPI, can be focused onto a small point on the photodetector. In this way, a high signal intensity of the detection signal can be achieved despite a small photodetector. The photodetector is advantageously made as small as possible in order to reduce costs, since the price of photodiodes scales with their base area. Electrical contacts between the photodetector and the flexible printed circuit board of the second printed circuit board section can be created by wire bonds (wire contacts DB) before the assembled flexible printed circuit board is joined to the beam-shaping element.

It is also possible to join the housing G to the wiring substrate, in this case designed as a ceramic substrate with a sufficiently thick surface metallization, in a hermetically sealed manner using a suitable method, such as resistance pressure welding. With such a hermetic encapsulation of the housing G, the need for the hermetically sealed FPI encapsulation can be dispensed with (for example glass plates on the FPI), which can result in a simpler MEMS wafer process. In this embodiment, the FPI can then be provided as a pure silicon chip without glass plates on the top and bottom.

Instead of a deep-drawn housing G, other manufacturing principles are also possible, for example as a plastic injection-molded part. This can reduce costs and installation space and enables an injection-molded cover with the attachment of further geometric elements on the outside of the housing, which are suitable for assembly in the superordinate assembly are advantageous, such as snap hooks or guide ribs.

2a-d show perspective views of a detection component in a spectrometer device according to an exemplary embodiment of the present invention. This embodiment shows an arrangement in which the photodetector is not shifted along the detection path, but rather shifted from the optical axis and is arranged at a remote side. The advantage of this arrangement is that partial shading of the light transmitted through the FPI on the rear side of the photodetector (or its holder) can be avoided.

According to FIG. 2a, a carrier element T can be provided on which the detection component DK can be arranged and the second flexible printed circuit board section LE2 can be guided around this carrier element T. 2a shows a side view of this. FIG. 2b shows a top view of the carrier element T (element TE in FIG. 5a). This can comprise a recess with an opening towards an upper side, into which the light transmitted by the FPI can be radiated. The beam-shaping element E can be located at the bottom of the opening. The opening can be aligned obliquely in accordance with an angle of incidence.

The detection component DK can comprise a photodetector PD and a beam-shaping element E and a second printed circuit board section LE2, the light reflected from a sample being filterable by the Fabry-Perot interferometer and by the beam-shaping element E arranged downstream of the Fabry-Perot interferometer in the beam path the photodetector PD can be bundled, and wherein the detection component DK can be electrically contactable with the wiring substrate VS and the ASIC via the second printed circuit board section LE2, as shown in FIGS. 2a to 2d. At the end of the second printed circuit board section LE2, which is provided for connection to the wiring substrate VS, the printed circuit board section LE2 can comprise further contacts Kt, for example for wire bonds (FIG. 2b).

FIG. 2c shows a side sectional view of the carrier element T with the photodetector PD and the beam-shaping element E, and FIG. 2d shows one perspective side view on a wiring substrate VS. As shown in FIGS. 2a and 2b, the second printed circuit board section LE2 can comprise a flexible printed circuit board with a locally stiffened area LB2 on which the photodetector PD can be arranged. According to FIG. 2b, the locally stiffened area LB2 can comprise a projection which can extend centrally over the recess in the carrier element T and on the underside of which, facing away from the FPI, the photodetector PD can be arranged (FIG. 2c). According to FIG. 2c, the photodetector can be contacted via a wire contact DB with the locally stiffened area of the second printed circuit board section LE2. The beam-shaping element E can be formed on the carrier element T as a reflective layer, for example in the form of a parabolic mirror, for example a metallization.

The second printed circuit board section LE2 can thus be guided flexibly to the position of the photodetector PD in the housing G, for example on a support area for the photodetector and connect it to the wiring substrate. The local stiffening can comprise a metal layer or metal plate, which can be arranged on the flexible printed circuit board section. The second printed circuit board section LE2 can comprise a detector section LE2-D for the photodetector PD, as is shown in FIG. 2d. The detector section LE2-D can itself be connected to the wiring substrate VS with wire contacts DB and guided laterally shifted from the position of the carrier element T to a contact position.

3a-c show perspective views of a detection component in a spectrometer device according to a further exemplary embodiment of the present invention.

FIG. 3 a shows a side view of the partial area of the detection component DK, which comprises a Fabry-Perot interferometer FPI. The FPI can comprise a silicon layer as the mirror element SP. Glass plates GP can be joined to the top and bottom of the silicon layer, wherein the glass can be designed in such a way that it can be transparent in the wavelength range relevant for the function of the spectrometer. In one side area, the FPI can be connected to a locally stiffened area V of the second via a wire contact DB Printed circuit board section LE2, which may include an interferometer section LE2-I, are connected. As shown in the perspective side view of FIG. 3b, this interferometer section LE2-I can comprise further contacts Kt at its end, with which it can be contacted on the wiring substrate (not shown).

3c shows a lateral sectional view of the FPI, the mirror element SP including a recess in the center as an optical aperture OB, in which the distance between two mirror positions can be varied. In the beam path below this optical aperture OB, the stiffening of the second printed circuit board section and / or the second printed circuit board section LE2-I itself can include an opening O through which the light transmitted by the FPI can be emitted onto the beam-shaping element (not shown).

The mirror element SP and the glass plates GP can represent a chip sandwich. The opening O can be coaxial with the optical aperture OB of the FPI in order to ensure the optical signal access to the photodetector. For a local stiffening V, a material can advantageously be selected whose thermal expansion coefficient is adapted to glass and silicon in order to avoid thermomechanical deformation of the FPI sandwich via temperature changes. The alloy NiCo 2918 (nickel-cobalt) can be a suitable material.

FIGS. 4a-c show perspective views of an emission component in a spectrometer device according to an exemplary embodiment of the present invention.

4a shows a side view of the emission component EK. The emission component EK can comprise a light source LQ, a first control device ASIC and a first printed circuit board section LEI, wherein the emission component EK can be electrically contacted with the wiring substrate via the first printed circuit board section LEI and the light source LQ can be stacked on the first control device ASIC. The first printed circuit board section LEI can have a local stiffening V, on which the stack of light source and control device ASIC is arranged can. The light source can be designed in such a way that it transmits light in the relevant wavelength range. Phosphor-coated LEDs can represent an advantageous space-saving solution here.

4b shows a top view of the emission component EK (emission direction), wherein electrical contacts Kt can be present in a lateral area of the first printed circuit board section LEI, via which wire contacts DB from the first printed circuit board section LEI to the first control device ASIC and from there further ones Wire contacts DB can be led to the light source LQ. The light source is advantageously supplied with power directly via the ASIC, but other configurations are also conceivable. The right end of the first printed circuit board section LEI can be designed to be flexible and can itself comprise electrical contacts Kt. The flexible end can be led to the wiring substrate.

4c shows a perspective view of the emission component EK, in which the light source LQ is rotated in the emission direction and the flexible first printed circuit board section LEI can be rotated into a plane of the wiring substrate which can deviate from the plane of the light source LQ in the emission direction.

5a shows a plan view of a carrier element in a spectrometer device.

The carrier element TE comprises a first partial area TE1 on which the emission component can be arranged and a second partial area TE2 on which the detection component can be arranged. The carrier element TE can be produced as an injection-molded part as one piece or as two separate pieces that can be plugged together. The second sub-area TE2 can have a detection opening DO for irradiating the photodetector PD.

5b shows a view of a carrier element in a spectrometer device. A perspective side view is shown in FIG. 5b. The first sub-area TE1 and the second sub-area TE2 can each be aligned with the opening in the housing, that is to say have different alignments. The first sub-area and the second sub-area can have different heights and widths, adapted to the components to be arranged there. Below the second partial area TE2, it can have a recess in which a detector carrier (FIG. 8c) can be arranged and can be irradiated through the detection opening DO.

A plastic injection-molded carrier as a carrier element TE can alternatively also be designed as a metal stamped and bent part with a flexible printed circuit board laminated on. In this way, simple joining and wire bonding of the electronic components (ASIC, LQ and FPI and photodetector) can be made possible. Such process steps could be carried out (at panel level) and in one plane, advantageously before punching and bending the carrier element. By bending the carrier element, the components can ultimately be brought into their final spatial orientation relative to one another.

As a further alternative, the carrier element can be designed as a MID (molded interconnected device). Signal routing and module assembly can be simplified by printing the conductor tracks directly onto the carrier. The FPI and the ASIC can be contacted directly by wire bonding on the carrier. At another point on the carrier element, these signals can then also be routed to the wiring substrate by wire bonding. Local stiffening of circuit board sections or entire circuit board sections for signal routing could be dispensed with here.

6a-c show perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to an exemplary embodiment of the present invention. 6a shows a side view of the emission component EK, which is arranged on the first partial area TE1 of the carrier element TE, and of the detection component DK, which is arranged on the second partial area TE2. From the emission component EK, the first printed circuit board section LEI is led down obliquely from the carrier element TE and the second printed circuit board section LE2 is led from the FPI along the second partial area TE2 onto a plane of the wiring substrate. The FPI can be designed as a microelectromechanical component (MEMS).

6c shows a rear view of the second partial area TE2, which has a detection opening DO for the light from the optical aperture OB of the FPI.

FIG. 6c shows a perspective view associated with FIG. 6a. Here, a detector carrier TE-D is arranged below the second sub-area TE, on which the detector section LE2-D is arranged and wherein the detector carrier TE-D can be positioned within the recess and in a beam path of the Fabry-Perot interferometer FPI. The detector section LE2-D and the interferometer section (LE2-I) of the second circuit board section, like the first circuit board section, are routed to the level of the wiring substrate and contacted there, advantageously with wire bonds.

FIGS. 7a-c show perspective views of a screen for a carrier element.

A screen BL can be placed on the embodiment of FIGS. 6a-6c.

7a shows a plan view of a diaphragm BL. The diaphragm BL can be arranged on the carrier element and have a reflective and beam-shaping emission opening EO above the emission component and a detection aperture DA above the detection component and prevent direct irradiation of the detection component DK by the emission component EK. The detection aperture DA can be circular in the direction of radiation, as can the emission opening EO circular in the direction of radiation. 7b shows a side sectional view of the diaphragm BL, which can have a wall surface DL for blocking light between the detection aperture and the light source. This wall surface can be part of the panel.

7c shows a perspective view of the screen on the carrier element. A detector carrier TE-D can be positioned under the carrier element and the carrier element can be arranged on the wiring substrate VS and the latter can be arranged on the electrical interface ES. The screen can also be formed as an injection-molded part with local metallization, advantageously in the inner wall surface of the emission opening EO, for a reflective area. Adjacent to the emission opening EO, there can be a cutout in the screen for wire bonds of the light source, facing the light source (not shown).

The panel shown in FIG. 7c can advantageously be closed with a cover to protect against environmental influences and to simplify assembly.

8a-c show perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to a further exemplary embodiment of the present invention.

8a shows a detection component DK with a holder PL which has a holding web H for the photodetector PD in order to arrange it in an optical aperture on the optical axis of the FPI. The photodetector can be arranged along the optical axis of the FPI. This embodiment shows an arrangement along an optical axis of the system in which the photodetector is arranged along the detection path. The advantage of this arrangement is a simpler assembly of the pre-assembled flexible printed circuit board on the beam-shaping element, since a larger joining surface is available, which enables easier gluing.

For this purpose, the holder can have an optical recess OA in the holder PL. The photodetector PD can be attached to the FPI in the middle of the retaining web H be arranged facing away, wherein a reflective cavity K in a detector carrier TE-D can focus the light from the FPI on the photodetector PD, as shown in FIG. 8b. The holder PL can be arranged on a detector section LE2-D of a flexible printed circuit board with a local stiffener V. The detector section LE2-D can be led down onto the wiring substrate.

8c shows a perspective view of the detector carrier TE-D, for example with a cavity, under a carrier element TE.

9a-c show perspective views of a carrier element for a spectrometer device according to a further exemplary embodiment of the present invention.

FIG. 9a shows an embodiment of the carrier element TE, comparable to FIG. 5b, which, however, can be formed as exactly one coherent element, for example as an injection-molded part. This can include a first sub-area TE1 and a second sub-area TE2. Furthermore, the detection opening DO in the second partial area can be shaped as a reflective cavity, for example coated in this way.

FIG. 9b shows a view from an underside of the carrier element TE, a bulge of the cavity being seen in the middle in the second partial area.

In FIG. 9c, a side sectional view of the carrier element TE is shown. Here, the contour L shows the course of the surface through the cavity, which can be reflective coated at least in the cavity. A detector component according to FIG. 8a, for example, can be arranged above the cavity K. The carrier element TE can thus be implemented as a single injection-molded part.

10a-c show perspective views of a detection component for a spectrometer device according to a further exemplary embodiment of the present invention. 10a shows a detector component DK with a second printed circuit board section LE2, which includes both the interferometer section LE2-I and the detector section LE2-D. These two can comprise a common flexible area, wherein the interferometer section LE2-I can comprise contact elements KE for contacting the FPI in a stiffened area of the second printed circuit board section LE2, wherein the FPI can be contacted with the contact elements KE via wire bonds. At one end of the flexible printed circuit board, these contacts can comprise Kt for making contact with the wiring substrate. As a base plate, the detection component DK can comprise a holder PL, for example according to FIG. 8a, at the edge region of which a recess can be present up to the printed circuit board, on which the contact elements KE can be located. With such a configuration, the number of printed circuit boards can be reduced. The photodetector, for example according to FIG. 8b, can be present on the holder. The solution from FIGS. 10a-c can usefully be used in combination with the carrier from FIGS. 9a-9c.

The embodiment of FIGS. 10a-c favors equipping the flexible printed circuit board on both sides. The FPI can be glued to the front and contacted by wire bonds; the photodiode (photodetector) can be glued onto the back and contacted with wire bonds. In the area LE2-D, the signals from both the FPI and the photodiode can then be transferred to the wiring substrate and / or the ASIC.

10b shows the detector component DK from a perspective view.

FIG. 10c shows the detector component DK from a perspective view, wherein (similar to FIG. 8a) the detector section LE2-D can extend up to the retaining web H above the optical recess OA and, after assembly, the photodetector PD via wire bonds DB can be electrically contacted at the retaining web H. 10c only shows the detector section LE2-D. The stiffeners and contact elements (V and KE from FIG. 8a) are not shown for reasons of clarity.

11a-b show perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to a further exemplary embodiment of the present invention.

11a shows a rear view of the carrier element TE from FIG. 9b with a detector component DK from FIG. 10a arranged thereon and an FPI arranged thereon. The carrier element TE is arranged on a wiring substrate VS.

11b shows an arrangement of a detection component DK and an emission component EK on the carrier element TE from FIGS. 9a-c and with a detection component DK according to FIG. 10a in a lateral sectional view. Here, the carrier element TE can advantageously consist of a single injection-molded part, on which the components can be arranged and contacted with only two printed circuit board sections.

FIG. 12 shows a block diagram of method steps of a method for producing a miniaturized spectrometer device according to an exemplary embodiment of the present invention.

In the method for producing a miniaturized spectrometer device, a wiring substrate is provided S1, which is electrically contacted with an electrical interface; placing S2 an emission component on the wiring substrate and electrically connecting the emission component to the wiring substrate; placing S3 a detection component on the wiring substrate and electrically connecting the detection component to the wiring substrate; arranging S4 a housing on or around the wiring substrate, which in this case encloses the detection component and the emission component, the housing having an opening or a includes optical access and before arranging the housing, the detection component and the emission component are aligned in such a way that a sample can be irradiated with light through the opening and light reflected by the sample can be detected and analyzed through the opening, with a normal to a housing top a

Emission angle and a detection angle are oppositely the same or different from one another.

Although the present invention has been fully described above on the basis of the preferred exemplary embodiment, it is not restricted thereto, but rather can be modified in many different ways.

Claims

Expectations

1. Miniaturized spectrometer device (1), comprising a housing (G) with an opening (GO) or an optical access through which or which a sample (P) can be irradiated with light and through which or which a light reflected from the sample can be captured ; a wiring substrate (VS) which is arranged within the housing (G) or is designed as part of the housing (G); an electrical interface (ES) through which the wiring substrate (VS) can be electrically contacted from outside the housing; an emission component (EK) within the housing (G), with which a sample (P) can be irradiated with light through the opening (GO) or the optical access and which is in electrical contact with the wiring substrate (VS); and a detection component (DK) within the housing (G), with which a light reflected from the sample (P) can be detected and analyzed through the opening (GO) or the optical access, wherein opposite a normal (N) on a housing top ( GOS) an emission angle (β) and a detection angle (α) are opposite to one another, the same or different from one another.

2. Spectrometer device (1) according to claim 1, in which the emission component (EK) comprises a light source (LQ) and a first printed circuit board section (LEI), the emission component (EK) via the first printed circuit board section (LEI) to the wiring substrate (VS) is electrically contacted.

3. spectrometer device (1) according to claim 2, wherein the emission component (EK) comprises a first control device (ASIC), wherein the light source (LQ) is stacked on the first control device (ASIC).

4. Spectrometer device (1) according to one of claims 1 to 3, in which the detection component (DK) is a Fabry-Perot interferometer (FPI), a photodetector (PD), a beam-shaping element (E) and a second printed circuit board section (LE2) comprises, the light reflected from the sample (P) being spectrally filterable by the Fabry-Perot interferometer (FPI) and by the beam-shaping element (E) arranged downstream of the Fabry-Perot interferometer (FPI) in the beam path on the photodetector (PD) can be bundled, and wherein the detection component (DK) is in electrical contact with the wiring substrate (VS) via the second printed circuit board section (LE2).

5. spectrometer device (1) according to one of claims 2, 3 or 4, in which the first printed circuit board section (LEI) comprises a flexible printed circuit board with a locally stiffened area (LB1) on the light source (LQ) and / or the second printed circuit board section (LE2 ) comprises a flexible printed circuit board with a locally stiffened area (LB2) on the Fabry-Perot interferometer (FPI) and the photodetector (PD).

6. spectrometer device (1) according to one of claims 1 to 5, wherein the housing (G) at the opening (GO) comprises a glass plate or an optical access.

7. Spectrometer device (1) according to one of claims 1 to 6, in which the beam-shaping element (E) comprises a parabolic mirror or a reflective cavity in a carrier element.

8. spectrometer device (1) according to one of claims 1 to 7, in which the Fabry-Perot interferometer (FPI) comprises a mirror element (SP), on which a glass plate is arranged in each case on an upper side and on a lower side.

9. spectrometer device (1) according to one of claims 1 to 8, wherein the second printed circuit board section (LE2) has an interferometer section (LE2-I) for the Fabry-Perot interferometer (FPI) and a detector section (LE2-D ) for the photodetector (PD).

10. spectrometer device (1) according to claim 9, wherein the interferometer section (LE2-I) and the detector section (LE2-D) are completely separated from each other and the interferometer section (LE2-I) is a flexible printed circuit board with a includes locally stiffened area (LB2) on the Fabry-Perot interferometer (FPI) and the detector section (LE2-D) comprises a flexible circuit board with a locally stiffened area (LB2) on the photodetector (PD), the flexible circuit board and the locally stiffened region has an optical opening (OB) at an optical aperture of the Fabry-Perot interferometer (FPI).

11. Spectrometer device (1) according to one of claims 1 to 10, which comprises a carrier element (TE), with a first sub-area (TE1) on which the emission component (EK) is arranged and with a second sub-area (TE2) on which the detection component (DK) is arranged, wherein the first sub-area (TE1) and the second sub-area (TE2) are each aligned with the opening (GO).

12. Spectrometer device (1) according to claim 11, which comprises a diaphragm (BL) which is arranged on the carrier element (TE) and a reflective and beam-shaping emission opening (EO) over the emission component (EK) and a detection aperture (DA) over the Detection component (DK) and prevents direct irradiation of the detection component (DK) by the emission component (EK).

13. Spectrometer device (1) according to claim 11 or 12, wherein the interferometer section (LE2-I) is arranged on the second sub-area (TE2) and the second sub-area (TE2) comprises a recess, and the carrier element (TE) one Detector carrier (TE-D) comprises, on which the detector section (LE2-D) is arranged and wherein the detector carrier (TE-D) can be positioned within the recess and in a beam path of the Fabry-Perot interferometer (FPI).

14. A method for producing a miniaturized spectrometer device (1) comprising the steps:

Providing (Sl) a wiring substrate (VS), which is electrically contacted with an electrical interface (ES); Arranging (S2) an emission component (EK) on the wiring substrate (VS) and electrically connecting the emission component (EK) to the wiring substrate (VS);

Arranging (S3) a detection component (DK) on the wiring substrate (VS) and electrically connecting the detection component

(DK) with the wiring substrate (VS);

Arranging (S4) a housing (G) on or around the wiring substrate (VS), which encloses the detection component (DK) and the emission component (EK), the housing (G) comprising an opening (GO) or an optical access and before arranging the case

(G) the detection component (DK) and the emission component (EK) are aligned in such a way that a sample (P) can be irradiated with light through the opening (GO) or the optical access and a light reflected from the sample (P) through the Opening (GO) or the access can be detected and analyzed, with a housing top side (GOS) facing a normal (N)

Emission angle (β) and a detection angle (α) are opposite to one another, the same or different.