DE102019126050A1 - Miniaturized spectrometer device and method for making a miniaturized spectrometer device - Google Patents

Abstract

The present invention creates a miniaturized spectrometer device (1) comprising a housing (G) with an opening (GO) or an optical access through which a sample (P) can be irradiated with light and through which one of the Specimen reflected light can be captured; a wiring substrate (VS) which is arranged within the housing (G) or is formed as part of the housing (G); an electrical interface (ES) through which the wiring substrate (VS) can be electrically contacted from outside the housing; an emission component (EK) within the housing (G), with which a sample (P) can be irradiated with light through the opening (GO) or the access and which is in electrical contact with the wiring substrate (VS); and a detection component (DK) within the housing (G), with which a light reflected by the sample (P) through the opening (GO) or the access can be detected and analyzed, with a normal (N) on a housing top (GOS ) an emission angle (EW) and a detection angle (DW) are identical or different from one another in opposite directions.

Description

The present invention relates to a miniaturized spectrometer device and a method for producing a miniaturized spectrometer device.

State of the art

Spectrometry systems can comprise a sensor system consisting of an illumination and detection component. One or more light sources can be used here and illuminate an area of a sample to be analyzed. A detector is usually arranged spatially separated from the light source.

In the case of spectral sensors, the use of a tunable MEMS Fabry-Perot interferometer ( FPI ) to be a promising approach for miniaturization of the sensors.

Tunable Fabry-Perot interferometers can ideally be constructed from two parallel mirrors that can be moved relative to one another and have high reflectivity in the relevant wavelength range, with a distance between the two mirrors being adjustable by means of an actuation mechanism. To enable actuation, the Fabry-Perot interferometer can advantageously be designed as a MOEMS (micro-opto-electro-mechanical system). A transmission wavelength of the FPIs can be precisely adjusted.

In the EP 3064912 a spectrometer system is shown with a module that comprises only one detection path. An emission path and a set of rules are housed in a separate and superordinate assembly, which differs from a miniaturized and compact arrangement in a mobile device.

Disclosure of the invention

The present invention provides a miniaturized spectrometer device according to claim 1 and a method for manufacturing a miniaturized spectrometer device according to claim 14.

Preferred further developments are the subject of the subclaims.

Advantages of the invention

The idea on which the present invention is based consists in specifying a miniaturized spectrometer device with which a sample can be irradiated with broadband light and the light reflected by the sample can be detected and analyzed. Furthermore, the spectrometer device is characterized by a compact design, the components of the emission path and the detection path being arranged together in a housing and in a miniaturized design.

According to the invention, a miniaturized spectrometer device comprises a housing with an opening or an optical access through which or which a sample can be irradiated with light and through which or which a light reflected from the sample can be captured; a wiring substrate which is arranged within the housing, or is designed as a housing part; an electrical interface through which the wiring substrate can be electrically contacted from outside the housing; an emission component within the housing, with which a sample can be irradiated with light through the opening or the optical access and which is in electrical contact with the wiring substrate; and a detection component within the housing, with which a light reflected by the sample through the opening or the optical access can be detected and analyzed, with an emission angle and a detection angle opposite to a normal on a housing top side being the same or different from each other.

The miniaturized spectrometer device can serve as an optical sensor for determining the chemical composition of a sample. The wiring substrate can be part of the housing and delimit the interior of the housing towards the bottom.

In other words, the detection component is arranged in a detection path of the spectrometer device and the emission component is arranged in an emission path. The detection component can be a Fabry-Perot interferometer ( FPI ) as a tunable spectral filter element, as well as a photodetector for measuring the transmitted light intensity.

In the emission component, controlled by the control device, a light can be generated and transmitted onto the object to be examined. The object to be examined is referred to below as a sample. The light source can be a diffusely emitting light source, for example one or more LEDs, for example phosphor-coated white light LEDs. The light source can emit in the wavelength range relevant for the function of the spectrometer. The emission component can also additionally comprise optical elements for beam shaping. The light as a stimulus can advantageously encompass the entire spectral range to be analyzed.

In the detection path of the spectrometer, the light reflected from the sample can be detected and / or analyzed, and for example the light reflected by the FPI obtained absorption spectra of the sample can be compared with known material spectra. The raw data can, for example, be transferred to a host system via the electrical interface and an external interface, and from there it can be sent to a cloud so that the chemometric examination can be carried out using cloud computing. The result can then be sent back to the host system from the cloud.

With the FPI a certain wavelength range can be covered by a distance variation (variation of the transmissivity) and an evaluation device can draw conclusions about the materials in the sample from the spectra obtained. After the light is reflected on the sample, it can have certain absorption spectra, which can result from an interaction of the light with the sample and the substances present in it. The emission angle and the detection angle can be equal to the normal, only the emission beam and the detection beam can be inclined in different directions with respect to the normal. However, it is also possible for the emission angle and the detection angle to differ in terms of amount.

The first control device can comprise an electronic control and evaluation system and that FPI Activate and control the light source, such as its emitted wavelength (switching on various LEDs), and evaluate the signal from the photodetector. In addition, the electronic control and evaluation system can communicate with the higher-level system (e.g. the application processor of the mobile phone / smartphone) in a sending and receiving function via the external interface. The first control device can advantageously be used as ASIC (application specific integrated circuit), but discrete circuits are also conceivable. The control of the FPIs can be done by the first control device or by a second control device which is connected to the FPI , or at least in the detection component is arranged. Of the ASIC can also be used for functional system integration in the higher-level assembly so that the spectrometer in the end device can be used sensibly by the end user.

The miniaturized spectrometer device is advantageously suitable for use in a mobile device, for example in a mobile phone, due to its very small dimensions and a compact combination of several components to form an overall system.

The wiring substrate can comprise a printed circuit board or any other type of carrier with conductor tracks which can be applied to it or integrated into it. The designation “substrate” can also be interpreted here as simply a designation for a carrier.

The electrical interface can comprise a printed circuit board or a carrier or a plate with conductor tracks. The electrical interface can be shaped in such a way that the wiring substrate can be arranged on the electrical interface and can cover at least a partial area of the electrical interface. The housing can then in turn be arranged on the wiring substrate and at least partially cover it. The electrical interface can comprise one or more contacts at one end and be shaped, for example, as a plug-in card (plug-in contact). The electrical interface is advantageously designed as a flexible broadband cable that can be suitable for making contact with ZIF connectors (zero insertion force connector). This design enables simple and industry-standard system integration into the higher-level assembly. This can correspond to a connection principle that can also be used in smartphones to connect the camera to the mainboard.

The miniaturized spectrometer device has a compact design, a miniaturized overall system can be created with an advantageous spatial arrangement and design of the detection component and emission component, which can have all the necessary components for the function of the spectrometer at the same connection level. This can be referred to as a so-called “first level package”. Such an arrangement of the emission and detection components within the housing and towards the opening can advantageously be achieved that the required installation space is minimized and, moreover, an advantageous beam path can be generated which can guide the light along the desired optical axis towards the sample, and block unwanted stray light.

By designing the emission component and the detection component separately, these components can advantageously be formed in subassemblies, thereby enabling an advantageous process flow in assembly and connection technology (AVT).

According to a preferred embodiment of the spectrometer device, the emission component comprises a light source and a first printed circuit board section, the emission component is in electrical contact with the wiring substrate via the first printed circuit board section.

According to a preferred embodiment of the spectrometer device, the emission component comprises a first control device, the light source being stacked on the first control device.

The first control device can also be contained in the detection component, or in a further assembly within the housing, for example the first control device ( ASIC ) can also be joined directly to the wiring substrate.

The first printed circuit board section can comprise a printed circuit board or a carrier with conductor tracks as a component formed separately from other printed circuit boards or conductor sections.

Electrical contact between the light source and the first control device ( ASIC ) can be achieved, whereby the named components can be wired functionally in the chosen spatial arrangement. The first control device can comprise an electronic control and evaluation system.

According to a preferred embodiment of the spectrometer device, the detection component comprises a Fabry-Perot interferometer, a photodetector, a beam-shaping element and a second circuit board section, the light reflected from the sample being passed through the Fabry-Perot interferometer ( FPI ) spectrally filterable and bundled on the photodetector by the beam-shaping element arranged downstream of the Fabry-Perot interferometer in the beam path, and wherein the detection component is in electrical contact with the wiring substrate via the second printed circuit board section.

The detection component is advantageous via the second printed circuit board section with the wiring substrate and also with the ASIC electrically contacted, for example via the first printed circuit board section.

Electrical contacting of FPI and photodetector can be achieved, whereby said components can be wired functionally in the chosen spatial arrangement. The first control device can comprise an electronic control and evaluation system.

The beam-shaping element can be a parabolic mirror, for example. The components of the detection component can thus be arranged on their own conductor device, in particular the second printed circuit board section and separated from other assemblies, such as the emission component, and can be contacted with the wiring substrate and oriented according to the application.

According to a preferred embodiment of the spectrometer device, the first printed circuit board section comprises a flexible printed circuit board with a locally stiffened area on the light source, and advantageously on the first control device, and / or the second printed circuit board section comprises a flexible printed circuit board with a locally stiffened area on the Fabry-Perot Interferometer and the photodetector.

By means of a flexible printed circuit board, the assembly (component) to be arranged or already arranged on the stiffened area can be oriented depending on the application. For example, the assembly with the stiffened area can be positioned on a carrier with an area provided for the respective component and the flexible area can be guided towards the wiring substrate. Advantageous alignment and electrical contact routing to the wiring substrate can thus take place within the housing.

According to a preferred embodiment of the spectrometer device, the housing comprises a glass plate or an optical access at the opening.

The optical access can advantageously be made of a material that is transparent in the spectral range relevant for the measurement operation, such as glass. By using a transparent material instead of a simple opening in the cover, it can also be ensured that no contamination in the form of particles or the like can penetrate the interior of the housing.

The inside of the housing can be shielded from environmental influences by the glass plate. Furthermore, a vacuum or a defined internal pressure of a gas can be set in the housing.

According to a preferred embodiment of the spectrometer device, the beam-shaping element comprises a parabolic mirror or a reflective cavity in a carrier element.

The parabolic mirror or the reflective cavity can do that from FPI Bundle transmitted light advantageously on a photodetector. Here, a detection area of the photodetector can be smaller, about half or even smaller than that Radiating surface of the FPI whereby a compact detection component can be provided.

According to a preferred embodiment of the spectrometer device, the Fabry-Perot interferometer comprises a mirror element, on which a glass plate is arranged in each case on an upper side and on a lower side.

The FPI can comprise a silicon layer as a mirror element, which can furthermore comprise actuatable and variable spacing, for example high and low refractive index layers, which depending on the spacing can transmit a predetermined wavelength and can reflect the other wavelengths.

Glass plates can be joined to the top and bottom of the silicon layer, the glass being designed in such a way that it can be transparent in the wavelength range relevant for the function of the spectrometer. A hermetically sealed encapsulation can be achieved by means of such an arrangement and material selection. For an advantageous operation of the FPI a correspondingly selectable internal pressure can be achieved or provided. The execution of such a FPIs can be done at chip level.

According to a preferred embodiment of the spectrometer device, the second circuit board section comprises an interferometer section for the Fabry-Perot interferometer and a detector section for the photodetector.

The second printed circuit board section can advantageously be divided into two separate areas that are separate from one another. The assembly of the FPIs and the assembly of the photodetector with the beam-shaping element can be arranged in a spatially separate area in the housing.

According to a preferred embodiment of the spectrometer device, the interferometer section and the detector section are completely separated from one another and the interferometer section comprises a flexible printed circuit board with a locally stiffened area on the Fabry-Perot interferometer and the detector section comprises a flexible printed circuit board a locally stiffened area on the photodetector, the flexible printed circuit board and the locally stiffened area having an optical opening at an optical aperture of the Fabry-Perot interferometer.

The assembly of the FPIs and the assembly of the photodetector with the beam-shaping element can be arranged spatially separated from one another and aligned with one another, advantageously adapted to the shape and the available space of the housing.

According to a preferred embodiment of the spectrometer device, this comprises a carrier element with a first sub-area on which the emission component is arranged and with a second sub-area on which the detection component is arranged, the first sub-area and the second sub-area each pointing to the opening or the optical access in the housing (cover).

The subregions of the carrier element can each have advantageous orientations for the orientation of the components to be attached there, advantageous for the emission component and for the detection component towards the opening. The assemblies can then be joined in the respective alignment on the respective sub-area of the carrier element. The carrier element can be produced as an injection-molded part and comprise both subregions as an overall element. However, the subregions can also be formed as separate parts which can be fixed to the wiring substrate and / or can be connected to one another.

According to a preferred embodiment of the spectrometer device, it comprises a diaphragm which is arranged on the carrier element and has a reflective and beam-shaping emission opening above the emission component and a detection aperture above the detection component and prevents direct irradiation of the detection component by the emission component.

The diaphragm can advantageously interrupt a direct beam path from the emission component to the detection component, so that little or no scattered light can be radiated directly from the emission component into the detection component. The beam-shaping emission opening can have a circular cross section and the emitted light can radiate onto the sample in a predetermined illumination area. A wall surface for blocking light can be positioned between the detection aperture and the light source. This wall surface can be part of the panel.

According to a preferred embodiment of the spectrometer device, the interferometer section is arranged on the second partial area of the carrier and the second partial area comprises a recess, and the carrier element comprises a detector carrier on which the detector section is arranged and wherein the detector carrier can be positioned within the recess and in a beam path of the Fabry-Perot interferometer.

The detector carrier can be inserted into the recess as a separate carrier part and can carry the photodetector and a beam-shaping element. The subcomponents of the detection component can be arranged and contacted separately in this way.

Alternatively, the preassembled detector carrier (which can include the photodetector) can be glued to the wiring substrate. Then the preassembled carrier (the one that comes with FPI , ASIC , LED is fitted) are glued over it.

According to the invention, in the method for producing a miniaturized spectrometer device, a wiring substrate is provided, which is electrically contacted with an electrical interface; placing an emission component on the wiring substrate and electrically connecting the emission component to the wiring substrate; placing a detection component on the wiring substrate and electrically connecting the detection component to the wiring substrate; and arranging a housing on or around the wiring substrate, which in this case encloses the detection component and the emission component, wherein the housing comprises an opening or an optical access and, before the housing is arranged, the detection component and the emission component are aligned in such a way that a sample passes through the The opening or the access can be irradiated with light and a light reflected by the sample through the opening or the access can be detected and analyzed, with an emission angle and a detection angle opposite to a normal on a housing top side being the same or different from one another.

The method can also be distinguished by the features mentioned in connection with the spectrometer device and their advantages, and vice versa.

Further features and advantages of embodiments of the invention emerge from the following description with reference to the accompanying drawings.

Figure list

The present invention is explained in more detail below with reference to the exemplary embodiments specified in the schematic figures of the drawing.

• 1a eine schematische Ansicht einer miniaturisierten Spektrometereinrichtung gemäß einem Ausführungsbeispiel der vorliegenden Erfindung;
• 1b eine seitliche Schnittansicht der miniaturisierten Spektrometereinrichtung gemäß einem Ausführungsbeispiel der vorliegenden Erfindung;
• 2a - d perspektivische Ansichten einer Detektionskomponente in einer Spektrometereinrichtung gemäß einem Ausführungsbeispiel der vorliegenden Erfindung;
• 3a - c perspektivische Ansichten einer Detektionskomponente in einer Spektrometereinrichtung gemäß einem weiteren Ausführungsbeispiel der vorliegenden Erfindung;
• 4a - c perspektivische Ansichten einer Emissionskomponente in einer Spektrometereinrichtung gemäß einem Ausführungsbeispiel der vorliegenden Erfindung;
• 5a eine Draufsicht auf ein Trägerelement in einer Spektrometereinrichtung;
• 5b eine Ansicht eines Trägerelements in einer Spektrometereinrichtung;
• 6a - c perspektivische Ansichten eines Trägerelements mit einer Emissionskomponente und einer Detektionskomponente in einer Spektrometereinrichtung gemäß einem Ausführungsbeispiel der vorliegenden Erfindung;
• 7a - c perspektivische Ansichten einer Blende für ein Trägerelement;
• 8a - c perspektivische Ansichten eines Trägerelements mit einer Emissionskomponente und einer Detektionskomponente in einer Spektrometereinrichtung gemäß einem weiteren Ausführungsbeispiel der vorliegenden Erfindung;
• 9a - c perspektivische Ansichten eines Trägerelements für eine Spektrometereinrichtung gemäß einem weiteren Ausführungsbeispiel der vorliegenden Erfindung;
• 10a - c perspektivische Ansichten einer Detektionskomponente für eine Spektrometereinrichtung gemäß einem weiteren Ausführungsbeispiel der vorliegenden Erfindung;
• 11a - b perspektivische Ansichten eines Trägerelements mit einer Emissionskomponente und einer Detektionskomponente in einer Spektrometereinrichtung gemäß einem weiteren Ausführungsbeispiel der vorliegenden Erfindung; und
• 12 eine Blockdarstellung von Verfahrensschritten eines Verfahrens zum Herstellen einer miniaturisierten Spektrometereinrichtung gemäß einem Ausführungsbeispiel der vorliegenden Erfindung.

Show it:

• 1a a schematic view of a miniaturized spectrometer device according to an embodiment of the present invention;
• 1b a side sectional view of the miniaturized spectrometer device according to an embodiment of the present invention;
• 2a - d perspective views of a detection component in a spectrometer device according to an exemplary embodiment of the present invention;
• 3a - c perspective views of a detection component in a spectrometer device according to a further exemplary embodiment of the present invention;
• 4a - c perspective views of an emission component in a spectrometer device according to an embodiment of the present invention;
• 5a a plan view of a carrier element in a spectrometer device;
• 5b a view of a support element in a spectrometer device;
• 6a - c perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to an embodiment of the present invention;
• 7a - c perspective views of a cover for a carrier element;
• 8a - c perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to a further exemplary embodiment of the present invention;
• 9a - c perspective views of a carrier element for a spectrometer device according to a further exemplary embodiment of the present invention;
• 10a - c perspective views of a detection component for a spectrometer device according to a further exemplary embodiment of the present invention;
• 11a - b perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to a further embodiment of the present invention; and
• 12th a block diagram of method steps of a method for producing a miniaturized spectrometer device according to an embodiment of the present invention.

In the figures, identical reference symbols denote identical or functionally identical elements.

1a shows a schematic view of a miniaturized spectrometer device according to an embodiment of the present invention.

The miniaturized spectrometer device 1 , comprises a housing G with an opening GO through which a sample can be irradiated with light and through which a light reflected from the sample can be captured; a wiring substrate within the housing G or implemented as part of the housing; and an electrical interface ES, through which the wiring substrate can be electrically contacted from outside the housing. The electrical interface ES can be a printed circuit board with contacts Kt include at the end and be formed as a plug-in card or plug-in contact for a higher-level assembly. Such a package enables electrical testing and calibration of the overall system at module level, advantageously also before system integration into the higher-level assembly, for example in a mobile phone. Such a system integration can easily be made possible by an external shape of the package. So can the case G comprise a deep-drawn lid, which can enable simple mechanical referencing for positive positioning and fixing. The electrical interface ES can itself comprise a flexible printed circuit board in the area outside the housing, which can enable a simple and reversible connection of the package to a power and signal line of the higher-level assembly. On the case G a marking, such as a logo or coding, can be applied. The case G can be a metallic deep-drawn part. Protection against contamination can be guaranteed with a glass plate. The glass used is selected so that it is transparent in the wavelength range relevant for the function of the spectrometer. The glass plate can also be glued to the housing from an inside.

1b shows a side sectional view of the miniaturized spectrometer device according to an embodiment of the present invention.

The miniaturized spectrometer device 1 , comprises a housing G with an opening GO through which a sample P can be irradiated with light and through which a light reflected from the sample can be captured; a wiring substrate VS inside the case G ; an electrical interface ES through which the wiring substrate VS can be electrically contacted from outside the housing; an emissions component EK inside the case G with which a sample P through the opening GO is irradiated with light and which with the wiring substrate VS is electrically contacted; and a detection component DK inside the case G with which a light reflected from the sample P passes through the opening GO can be detected and analyzed, with an emission angle β and a detection angle α opposite to a normal N to a housing top side GOS being identical or different from one another.

The emissions component EK can be a light source LQ , a first control device ASIC and a first printed circuit board portion, wherein the emission component EK is electrically contacted via the first printed circuit board section with the wiring substrate and the light source can be stacked on the first control device. The detection component DK can be a Fabry-Perot interferometer FPI , a photodetector PD , a beam-shaping element E and a second printed circuit board section, the light reflected from the sample P passing through the Fabry-Perot interferometer FPI filterable and through the Fabry-Perot interferometer FPI downstream beam-shaping element E on the photodetector in the beam path PD can be bundled, and wherein the detection component DK via the second printed circuit board section to the wiring substrate VS and the ASIC can be electrically contacted. The emissions component EK and the detection component DK can on the opening GO be facing. In the case G a glass plate can be enclosed in the area of the opening.

The opening GO can represent a common optical access for the emission component and for the detection component. The wiring substrate can represent a rewiring substrate for connecting the components to the circuit board sections. The detection component and emission components and their subcomponents can be fixed to the wiring substrate, for example by gluing. An electrical contact between the components and the conductor track sections can be made, for example, by wire bonds DB (Wirebonding) can be achieved, but there are also other types of electrical contact possible, such as soldered connections.

The beam-shaping element E can, for example, be shaped as an injection-molded part and have a local metallization to create a reflective layer. By means of a corresponding arrangement and shape of the Beam-shaping element E, for example as a parabolic mirror, can emit the light of a wide beam profile, which emerges from the aperture of the FPIs can be focused onto a small point on the photodetector. In this way, a high signal intensity of the detection signal can be achieved despite a small photodetector. The photodetector is advantageously made as small as possible in order to reduce costs, since the price of photodiodes scales with their base area. Electrical contacts between the photodetector and the flexible printed circuit board of the second printed circuit board section can be made by wirebonds (wire contacts DB ) be created.

It is still possible to use the housing G using a suitable method, such as resistance pressure welding, to be hermetically sealed onto the wiring substrate, in this case designed as a ceramic substrate with a sufficiently thick surface metallization. With such a hermetic encapsulation of the housing G can meet the need of hermetically sealed FPI Encapsulation is not required (e.g. glass plates on the FPI ), which can result in a simpler MEMS wafer process. The FPI can then be provided in this embodiment as a pure silicon chip without glass plates on the top and bottom.

Instead of a deep-drawn case G Other manufacturing principles are also possible, for example as a plastic injection-molded part. This can reduce costs and installation space and enables an injection-molded cover with the attachment of further geometric elements on the outside of the housing, which are advantageous for mounting in the higher-level assembly, such as snap hooks or guide ribs.

2a - d show perspective views of a detection component in a spectrometer device according to an exemplary embodiment of the present invention. This embodiment shows an arrangement in which the photodetector is not shifted along the detection path, but rather shifted from the optical axis and is arranged at a remote side. The advantage of this arrangement is that a partial shadowing of the by the FPI Transmitted light on the back of the photodetector (or its holder) can be avoided.

According to the 2a can be a support element T be provided on which the detection component DK can be arranged and the second flexible circuit board section LE2 around this carrier element T can be led around. The 2a shows a side view. In the 2 B is a top view of the carrier element T (Element TE in the 5a) shown. This can comprise a recess with an opening to an upper side, into which the of the FPI transmitted light can be irradiated. The beam-shaping element E can be located at the bottom of the opening. The opening can be aligned obliquely in accordance with an angle of incidence.

The detection component DK can use a photodetector PD and a beam-shaping element E and a second circuit board section LE2 The light reflected from a sample can be filtered by the Fabry-Perot interferometer and by the beam-shaping element E on the photodetector, which is arranged downstream of the Fabry-Perot interferometer in the beam path PD can be bundled, and wherein the detection component DK over the second printed circuit board section LE2 with the wiring substrate VS and the ASIC can be electrically contacted, as shown in the 2a to 2d is shown. At the end of the second printed circuit board section LE2 which is for connection to the wiring substrate VS is provided, the circuit board section LE2 further contacts Kt , e.g. for wire bonds, include ( 2 B) .

The 2c shows a side sectional view of the carrier element T with the photodetector PD and the beam-shaping element E and the 2d Fig. 13 shows a perspective side view on a wiring substrate VS . Like in the 2a and 2 B shown, the second printed circuit board section LE2 a flexible printed circuit board with a locally stiffened area LB2 include on which the photodetector PD can be arranged. According to the 2 B can the locally stiffened area LB2 comprise a projection which extends centrally over the recess in the carrier element T can extend, and at that FPI facing away from the bottom of the photodetector PD can be arranged ( 2c ). The photodetector can according to the 2c via a wire contact DB with the locally stiffened area of the second printed circuit board section LE2 be contacted. The beam-shaping element E can be used as a reflective layer, for example in the form of a parabolic mirror, for example a metallization, on the carrier element T be shaped.

The second printed circuit board section LE2 can thus be flexible to the position of the photodetector PD in the housing G be led, for example on a carrier area for the photodetector and connect this to the wiring substrate. The local stiffening can comprise a metal layer or metal plate, which can be arranged on the flexible printed circuit board section. The second printed circuit board section LE2 can have a detector section LE2-D for the photodetector PD include, as in 2d is shown. The detector section LE2-D can even with wire contacts DB with the wiring substrate VS be connected and become one Contact position laterally shifted from the position of the carrier element T be led.

3a - c show perspective views of a detection component in a spectrometer device according to a further exemplary embodiment of the present invention.

The 3a shows a side view of the portion of the detection component DK , which is a Fabry-Perot interferometer FPI includes. The FPI can be used as a mirror element SP comprise a silicon layer. Glass plates can be placed on the top and bottom of the silicon layer GP be joined, wherein the glass can be designed in such a way that it can be transparent in the wavelength range relevant for the function of the spectrometer. This can be done in a page area FPI via a wire contact DB on a locally stiffened area V of the second printed circuit board section LE2 , which has an interferometer section LE2-I can include, connected. As in the perspective side view of the 3b this interferometer section can be shown LE2-I at the end of this further contacts Kt include, with which this can be contactable on the wiring substrate (not shown).

The 3c shows a side sectional view of the FPIs , the mirror element SP in the middle as an optical aperture IF comprises a recess in which the distance between two mirror positions can be varied. In the beam path below this optical aperture IF can stiffen the second printed circuit board section and / or the second printed circuit board section LE2-I even an opening O include, through which the dated FPI Transmitted light can be emitted onto the beam-shaping element (not shown).

The mirror element SP and the glass plates GP can represent a chip sandwich. The opening O can be coaxial with the optical aperture IF of FPI to ensure optical signal access to the photodetector. For local stiffening V a material can advantageously be selected whose thermal expansion coefficient is adapted to glass and silicon in order to avoid thermomechanical deformation of the FPI sandwich via temperature changes. The alloy NiCo 2918 (nickel-cobalt) can be a suitable material.

4a - c show perspective views of an emission component in a spectrometer device according to an embodiment of the present invention.

The 4a Figure 3 shows a side view of the emission component EK . The emissions component EK can be a light source LQ comprise a first control device ASIC and a first circuit board section LE1 , where the emissions component EK over the first printed circuit board section LE1 can be electrically contacted with the wiring substrate and the light source LQ stacked on the first controller ASIC can be arranged. The first printed circuit board section LE1 can be a local stiffening V have on which the stack of light source and control device ASIC can be arranged. The light source can be designed in such a way that it transmits light in the relevant wavelength range. Phosphor-coated LEDs can represent an advantageous space-saving solution here.

In the 4b becomes a top view of the emissions component EK (Emission direction), with electrical contacts in a lateral area of the first printed circuit board section LE1 Kt may be present over which wire contacts DB from the first printed circuit board section LE1 to the first control device ASIC and from there further wire contacts DB to the light source LQ can be guided. The power supply to the light source is advantageously carried out directly via the ASIC , but other configurations are also conceivable. The right end of the first printed circuit board section LE1 can be flexible and even have electrical contacts Kt include. The flexible end can be led to the wiring substrate.

In the 4c Figure 11 is a perspective view of the emissions component EK shown at which the light source LQ is rotated in the emission direction and the flexible first printed circuit board section LE1 may be rotated into a plane of the wiring substrate which is different from the plane of the light source LQ can deviate in the direction of radiation.

5a shows a plan view of a carrier element in a spectrometer device.

The carrier element TE comprises a first sub-area TE1 on which the emission component can be arranged and a second partial area TE2 on which the detection component can be arranged. The carrier element TE can be manufactured as an injection-molded part as one piece or as two separate pieces that can be plugged together. The second part TE2 can have a detection opening DO for an irradiation of the photodetector PD exhibit.

5b shows a view of a carrier element in a spectrometer device.

In the 5b a side perspective view is shown. The first part TE1 and the second sub-area TE2 can each be aligned with the opening in the housing, i.e. have different orientations. The first sub-area and the second sub-area can have different heights and widths, adapted to the components to be arranged there. Below the second sub-area TE2 this can have a recess in which a detector support ( 8c ) can be arranged and through the detection opening DO can be irradiated.

A plastic injection-molded carrier as a carrier element TE can alternatively be designed as a metal stamped and bent part with a laminated flexible circuit board. In this way, simple joining and wire bonding of the electronic components ( ASIC , LQ and FPI and photodetector). Such process steps could be carried out (at panel level) and in one plane, advantageously before punching and bending the carrier element. By bending the carrier element, the components can ultimately be brought into their final spatial orientation relative to one another.

As a further alternative, the carrier element can be used as MID (molded interconnected device). Signal routing and module assembly can be simplified by printing the conductor tracks directly onto the carrier. You can do that FPI and the ASIC can be contacted directly by wire bonding on the carrier. At another point on the carrier element, these signals can then also be routed to the wiring substrate by wire bonding. Local stiffening of circuit board sections or entire circuit board sections for signal routing could be dispensed with here.

6a - c show perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to an exemplary embodiment of the present invention.

The 6a shows a side view of the emission component EK which on the first sub-area TE1 of the carrier element TE is arranged and on the detection component DK , which on the second sub-area TE2 is arranged. From the emissions component EK becomes the first printed circuit board section LE1 obliquely from the carrier element TE led down and from that FPI becomes the second printed circuit board section LE2 along the second sub-area TE2 out on a plane of the wiring substrate. The FPI can be formed here as a microelectromechanical component (MEMS).

The 6c shows a rear view of the second portion TE2 , which has a detection opening DO for the light from the optical aperture IF of FPI having.

The 6c shows a to 6a associated perspective view. Here is below the second sub-area TE a detector carrier TE-D arranged on which the detector section LE2-D is arranged and wherein the detector support TE-D within the recess and in a beam path of the Fabry-Perot interferometer FPI is positionable. The detector section LE2-D and the interferometer section ( LE2-I ) of the second printed circuit board section, like the first printed circuit board section, are routed to the level of the wiring substrate and contacted there, advantageously with wire bonds.

7a - c show perspective views of a cover for a carrier element.

On the execution of the 6a - 6c can be an aperture BL be put on.

The 7a shows a plan view of a diaphragm BL . The aperture BL can be arranged on the carrier element and have a reflective and beam-shaping emission opening EO above the emission component and a detection aperture THERE have over the detection component and direct irradiation of the detection component DK through the emissions component EK prevent. The detection aperture THERE can be circular in the direction of irradiation, as can the emission opening EO circular in the direction of radiation.

The 7b shows a side sectional view of the bezel BL which is a wall surface DL for blocking light between the detection aperture and the light source. This wall surface can be part of the panel.

The 7c shows a perspective view of the screen on the carrier element. A detector carrier can be placed under the carrier element TE-D be positioned and the carrier element on the wiring substrate VS and this can be arranged on the electrical interface ES. The screen can also be an injection-molded part with local metallization, advantageously in the inner wall surface of the emission opening EO , be shaped for a reflective area. Adjacent to the emission opening EO For example, there may be a recess in the diaphragm for wire bonds of the light source, facing the light source (not shown).

The one in the 7c The screen shown can advantageously be closed with a cover to protect against environmental influences and to simplify assembly.

8a - c FIG. 13 shows perspective views of a carrier element with an emission component and a detection component in FIG a spectrometer device according to a further embodiment of the present invention.

The 8a shows a detection component DK with a bracket PL , which has a holding bar H for the photodetector PD has to this in an optical aperture on the optical axis of the FPIs to arrange. The photodetector can here along the optical axis of the FPIs be arranged. This embodiment shows an arrangement along an optical axis of the system in which the photodetector is arranged along the detection path. The advantage of this arrangement is a simpler assembly of the pre-assembled flexible printed circuit board on the beam-shaping element, since a larger joining surface is available, which enables easier gluing.

For this purpose, the holder can have an optical recess OA in the holder PL exhibit. In the middle of the holding bridge H can the photodetector PD the FPI be arranged facing away, with a reflective cavity K in a detector carrier TE-D the light from FPI on the photodetector PD can bundle, as in the 8b shown. The bracket PL can be on a detector section LE2-D a flexible printed circuit board with a local stiffener V be arranged. The detector section LE2-D can be run down onto the wiring substrate.

The 8c Figure 3 shows a perspective view of the detector support TE-D , for example with a cavity, under a carrier element TE .

9a - c show perspective views of a carrier element for a spectrometer device according to a further exemplary embodiment of the present invention.

The 9a shows an embodiment of the carrier element TE , comparable to the 5b which, however, can be shaped as exactly one coherent element, for example as an injection-molded part. This can be a first sub-area TE1 and a second sub-area TE2 include. Furthermore, the detection opening DO be formed in the second partial area as a reflective cavity, for example coated in this way.

In the 9b FIG. 11 is a view from an underside of the carrier element TE shown, whereby a bulge of the cavity can be seen in the middle of the second partial area.

In the 9c Figure 11 is a side sectional view of the support member TE shown. Here the contour shows L. the course of the surface through the cavity, which can be reflective coated at least in the cavity. Above the cavity K for example, a detector component according to FIG 8a be arranged. The carrier element TE can thus be realized as a single injection-molded part.

10a - c show perspective views of a detection component for a spectrometer device according to a further exemplary embodiment of the present invention.

The 10a shows a detector component DK with a second printed circuit board section LE2 which is both the interferometer section LE2-I as well as the detector section LE2-D includes. These two can comprise a common flexible area, the interferometer section LE2-I in a stiffened area of the second printed circuit board section LE2 Contact elements KE for contacting the FPIs may include, wherein a contacting of the FPIs with the contact elements KE can be done via wire bonds. These contacts can be made at one end of the flexible printed circuit board Kt to make contact with the wiring substrate. The detection component DK can be a bracket as a base plate PL , roughly according to the 8a , include, at the edge area of which there may be a recess up to the printed circuit board, on which the contact elements are located KE can be located. With such a configuration, the number of printed circuit boards can be reduced. The photodetector can be attached to the holder, for example according to FIG 8b , to be available. The solution 10a - c can be useful in combination with the carrier from the 9a - 9c stand.

The execution of the 10a - c favors the two-sided assembly of the flexible circuit board. This can be done on the front FPI be glued on and contacted by wire bonds; the photodiode (photodetector) can be glued onto the back and contacted with wire bonds. In the area LE2-D can then send the signals from both FPI as well as from the photodiode to the wiring substrate and / or the ASIC be handed over.

The 10b shows the detector component DK from a perspective view.

The 10c shows the detector component DK from a perspective view, where (similar to the 8a) down the detector section LE2-D except for the bridge H above the optical recess OA can extend and after assembling the photodetector PD via wire bonds DB at the holding bridge H can be electrically contacted.

The 10c shows only the detector section LE2-D . The stiffeners and contact elements ( V and KE from the 8a) are not shown for reasons of clarity.

11a - b show perspective views of a carrier element with an emission component and a detection component in a spectrometer device according to a further exemplary embodiment of the present invention.

The 11a shows a rear view of the carrier element TE from the 9b with a detector component arranged thereon DK from the 10a and one arranged on it FPI . The carrier element TE is on a wiring substrate VS arranged.

The 11b shows an arrangement of a detection component DK and an emissions component EK on the carrier element TE from the 9a - c and with a detection component DK after 10a in a side sectional view. Here, the carrier element TE advantageously consist of a single injection-molded part on which the components can be arranged and contacted with only two circuit board sections.

12th shows a block diagram of method steps of a method for producing a miniaturized spectrometer device according to an embodiment of the present invention.

In the method for producing a miniaturized spectrometer device, provision takes place S1 a wiring substrate electrically contacted with an electrical interface; an arranging S2 an emission component on the wiring substrate and electrically connecting the emission component to the wiring substrate; an arranging S3 a detection component on the wiring substrate and electrically connecting the detection component to the wiring substrate; an arranging S4 a housing on or around the wiring substrate, which encloses the detection component and the emission component, wherein the housing comprises an opening or an optical access and, before the housing is arranged, the detection component and the emission component are aligned in such a way that a sample is exposed to light through the opening can be irradiated and a light reflected by the sample can be detected and analyzed through the opening, with an emission angle and a detection angle opposite to a normal on a housing top being the same or different from one another.

Although the present invention has been fully described above on the basis of the preferred exemplary embodiment, it is not restricted thereto, but rather can be modified in many different ways.

QUOTES INCLUDED IN THE DESCRIPTION

This list of the documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent literature cited

• EP 3064912 [0005]

Claims (14)

Miniaturized spectrometer device (1), comprising - A housing (G) with an opening (GO) or an optical access through which or through which a sample (P) can be irradiated with light and through which or which light reflected from the sample can be captured; - A wiring substrate (VS) which is arranged within the housing (G) or is designed as part of the housing (G); - An electrical interface (ES) through which the wiring substrate (VS) can be electrically contacted from outside the housing; - An emission component (EK) within the housing (G), with which a sample (P) can be irradiated with light through the opening (GO) or the optical access and which is in electrical contact with the wiring substrate (VS); and - A detection component (DK) within the housing (G), with which a light reflected from the sample (P) through the opening (GO) or the optical access can be detected and analyzed, with a normal (N) on a housing top ( GOS) an emission angle (β) and a detection angle (α) are oppositely identical or different from one another. Spectrometer device (1) according to Claim 1 , in which the emission component (EK) comprises a light source (LQ) and a first printed circuit board section (LE1), the emission component (EK) being in electrical contact with the wiring substrate (VS) via the first printed circuit board section (LE1). Spectrometer device (1) according to Claim 2 , in which the emission component (EK) comprises a first control device (ASIC), the light source (LQ) being stacked on the first control device (ASIC). Spectrometer device (1) according to one of the Claims 1 to 3 , in which the detection component (DK) comprises a Fabry-Perot interferometer (FPI), a photodetector (PD), a beam-shaping element (E) and a second printed circuit board section (LE2), the light reflected from the sample (P) through the Fabry-Perot interferometer (FPI) is spectrally filterable and can be bundled on the photodetector (PD) by the beam-shaping element (E) arranged downstream of the Fabry-Perot interferometer (FPI), and the detection component (DK) via the second Circuit board section (LE2) is electrically contacted with the wiring substrate (VS). Spectrometer device (1) according to one of the Claims 2 , 3 or 4th , in which the first printed circuit board section (LE1) comprises a flexible printed circuit board with a locally stiffened area (LB1) on the light source (LQ) and / or the second printed circuit board section (LE2) comprises a flexible printed circuit board with a locally stiffened area (LB2) on the Fabry - Includes perot interferometer (FPI) and the photodetector (PD). Spectrometer device (1) according to one of the Claims 1 to 5 , in which the housing (G) comprises a glass plate or an optical access at the opening (GO). Spectrometer device (1) according to one of the Claims 1 to 6th , in which the beam-shaping element (E) comprises a parabolic mirror or a reflective cavity in a carrier element. Spectrometer device (1) according to one of the Claims 1 to 7th , in which the Fabry-Perot interferometer (FPI) comprises a mirror element (SP), on which a glass plate is arranged in each case on an upper side and on a lower side. Spectrometer device (1) according to one of the Claims 1 to 8th , in which the second printed circuit board section (LE2) comprises an interferometer section (LE2-I) for the Fabry-Perot interferometer (FPI) and a detector section (LE2-D) for the photodetector (PD). Spectrometer device (1) according to Claim 9 , in which the interferometer section (LE2-I) and the detector section (LE2-D) are completely separated from each other and the interferometer section (LE2-I) is a flexible printed circuit board with a locally stiffened area (LB2) on the Fabry - Perot interferometer (FPI) comprises and the detector section (LE2-D) comprises a flexible printed circuit board with a locally stiffened area (LB2) on the photodetector (PD), the flexible printed circuit board and the locally stiffened area at an optical aperture of the Fabry-Perot interferometer (FPI) have an optical aperture (OB). Spectrometer device (1) according to one of the Claims 1 to 10 , which comprises a carrier element (TE), with a first sub-area (TE1) on which the emission component (EK) is arranged and with a second sub-area (TE2) on which the detection component (DK) is arranged, the first sub-area (TE1) and the second partial area (TE2) are each aligned with the opening (GO). Spectrometer device (1) according to Claim 11 , which comprises a screen (BL) which is arranged on the carrier element (TE) and a reflective and beam-shaping emission opening (EO) over the emission component (EK) and a Has detection aperture (DA) above the detection component (DK) and prevents direct irradiation of the detection component (DK) by the emission component (EK). Spectrometer device (1) according to Claim 11 or 12th , in which the interferometer section (LE2-I) is arranged on the second sub-area (TE2) and the second sub-area (TE2) comprises a recess, and the support element (TE) comprises a detector support (TE-D) on which the Detector section (LE2-D) is arranged and wherein the detector carrier (TE-D) can be positioned within the recess and in a beam path of the Fabry-Perot interferometer (FPI). A method for producing a miniaturized spectrometer device (1) comprising the steps: - Providing (S1) a wiring substrate (VS), which is electrically contacted with an electrical interface (ES); - Arranging (S2) an emission component (EK) on the wiring substrate (VS) and electrically connecting the emission component (EK) to the wiring substrate (VS); - Arranging (S3) a detection component (DK) on the wiring substrate (VS) and electrically connecting the detection component (DK) to the wiring substrate (VS); - Arranging (S4) a housing (G) on or around the wiring substrate (VS), which encloses the detection component (DK) and the emission component (EK), the housing (G) comprising an opening (GO) or an optical access and before the housing (G) is arranged, the detection component (DK) and the emission component (EK) are aligned in such a way that a sample (P) can be irradiated with light through the opening (GO) or the optical access and a sample ( P) reflected light through the opening (GO) or the access can be detected and analyzed, with an emission angle (β) and a detection angle (α) opposite to a normal (N) on a housing top side (GOS) being the same or different from one another.

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