WO2021056826A1 - 系统级封装结构和电子设备 - Google Patents

系统级封装结构和电子设备 Download PDF

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Publication number
WO2021056826A1
WO2021056826A1 PCT/CN2019/123543 CN2019123543W WO2021056826A1 WO 2021056826 A1 WO2021056826 A1 WO 2021056826A1 CN 2019123543 W CN2019123543 W CN 2019123543W WO 2021056826 A1 WO2021056826 A1 WO 2021056826A1
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Prior art keywords
package structure
mounting surface
substrate
light source
present
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PCT/CN2019/123543
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English (en)
French (fr)
Inventor
王文涛
方华斌
王德信
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潍坊歌尔微电子有限公司
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Publication of WO2021056826A1 publication Critical patent/WO2021056826A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed

Definitions

  • the present invention relates to the technical field of electronic equipment, in particular to a system-in-package structure and an electronic device using the system-in-package structure.
  • the main purpose of the present invention is to provide a system-in-package structure and an electronic device using the system-in-package structure, aiming to simplify the structure of the electronic device and improve its manufacturing convenience.
  • an embodiment of the present invention provides a system-in-package structure, which includes:
  • a base the base is provided with a mounting surface
  • a light source is arranged on the mounting surface and is electrically connected to the substrate;
  • a photoelectric conversion device the photoelectric conversion device is arranged on the mounting surface, is electrically connected to the substrate, and is arranged at an interval from the light source;
  • the analog front end is provided on the base and is electrically connected to the base.
  • the analog front end is provided in the substrate
  • the analog front end is mounted on the mounting surface, and the photoelectric conversion device is provided on a surface of the analog front end away from the mounting surface.
  • system-in-package structure further includes a light-shielding member provided on the mounting surface and surrounding the light source.
  • the shading member is a metal member or a plastic member.
  • system-in-package structure further includes an auxiliary device provided on the substrate and electrically connected to the substrate.
  • the auxiliary device is provided in the substrate
  • the auxiliary device is mounted on the mounting surface, and the photoelectric conversion device is provided on a surface of the auxiliary device away from the mounting surface.
  • the system-in-package structure further includes a light-transmitting encapsulant layer, the light-transmitting encapsulant layer is disposed on the mounting surface and covers the light source and the photoelectric conversion device.
  • the system-in-package structure further includes a light-transmitting cover plate, a surface of the light-transmitting cover plate is arranged opposite to the mounting surface, and the light source and the photoelectric conversion device are both provided Between the transparent cover plate and the substrate.
  • An embodiment of the present invention also provides an electronic device.
  • the electronic device includes a housing and a system-in-package structure.
  • the system-in-package structure includes:
  • a base the base is provided with a mounting surface
  • a light source is arranged on the mounting surface and is electrically connected to the substrate;
  • a photoelectric conversion device the photoelectric conversion device is arranged on the mounting surface, is electrically connected to the substrate, and is arranged at an interval from the light source;
  • An analog front end where the analog front end is provided on the base and is electrically connected to the base;
  • the housing is provided with a through hole connecting the inner cavity of the housing and the outside, the system-in-package structure is arranged in the housing, and the light source and the photoelectric converter are both arranged toward the through hole.
  • the electronic device further includes a lens, and the lens is provided in the through hole.
  • a system-level packaging structure integrating the light source, photoelectric conversion device, and analog front end can be obtained, thereby avoiding the existing technology.
  • the defects of complicated structure and inconvenient manufacturing caused by the way of separate installation and separate wiring of optical devices realize the purpose of compact and small overall package structure and simple connection, thereby simplifying the structure of electronic equipment and improving the manufacturing of electronic equipment Convenience.
  • the light source, photoelectric conversion device and other optical devices are placed inside the package structure. Compared with the assembly method of separate wiring, it also effectively shortens the length of the circuit inside the electronic equipment equipped with the optical device, and reduces the parasitic capacitance and inductance. , To prevent the signal from being affected.
  • FIG. 1 is a schematic structural diagram of the first embodiment of the system-in-package structure of the present invention
  • FIG. 2 is a schematic structural diagram of a second embodiment of the system-in-package structure of the present invention.
  • FIG. 3 is a schematic structural diagram of a third embodiment of the system-in-package structure of the present invention.
  • FIG. 4 is a schematic structural diagram of a fourth embodiment of the system-in-package structure of the present invention.
  • FIG. 5 is a schematic structural diagram of a fifth embodiment of the system-in-package structure of the present invention.
  • FIG. 6 is a schematic structural diagram of a sixth embodiment of the system-in-package structure of the present invention.
  • the terms “connected”, “fixed”, etc. should be interpreted broadly.
  • “fixed” can be a fixed connection, a detachable connection, or a whole; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be an internal communication between two components or an interaction relationship between two components, unless specifically defined otherwise.
  • the specific meanings of the above-mentioned terms in the present invention can be understood according to specific situations.
  • the present invention provides a system-in-package structure 100, which can be applied to electronic devices such as mobile phones, notebook computers, tablet computers, and wearable devices, and aims to simplify the structure of the electronic device and improve its manufacturing convenience.
  • the system-in-package structure 100 includes:
  • the base 10 is provided with a mounting surface
  • the photoelectric conversion device 30 is provided on the mounting surface, is electrically connected to the substrate 10, and is spaced apart from the light source 20;
  • the analog front end 40 is provided on the base 10 and is electrically connected to the base 10.
  • the substrate 10 can be a circuit board for electrically connecting the components arranged on its mounting surface;
  • the light source 20 can be a light-emitting diode for emitting detection light;
  • the photoelectric conversion device 30 can be a photodiode, Used to receive the emitted light and convert it into a corresponding electrical signal (analog signal) and transmit it to the rear;
  • analog front-end 40 (Analog Front-end, AFE), used to transmit the analog signal transmitted from the photoelectric conversion device 30 Perform digitization and analysis.
  • the analog front end 40 may be a type of device with a small number of digital circuits and a majority of analog circuits, or a type of device with a large number of digital circuits and a small number of analog circuits.
  • the functions of the analog front end 40 include signal amplification, frequency conversion, modulation-demodulation, adjacent frequency processing, level adjustment and control, mixing, etc. Those skilled in the art can make reasonable selections according to needs, and will not be repeated here.
  • the technical solution of the present invention by integrating the light source 20, the photoelectric conversion device 30, and the analog front end 40 into an integrated system-level package, can obtain the integrated system of the light source 20, the photoelectric conversion device 30, and the analog front end 40.
  • the system-in-package structure 100 avoids the defects of complicated structure and inconvenience caused by separate installation and separate wiring of optical devices in the prior art, that is, the purpose of compact and small overall package structure and simple connection is realized.
  • the structure of the electronic device is simplified, and the manufacturing convenience of the electronic device is improved.
  • the optical devices such as the light source 20 and the photoelectric conversion device 30 are placed inside the packaging structure. Compared with the assembly method of separate wiring, it also effectively shortens the length of the circuit inside the electronic equipment equipped with the optical device and reduces the parasitic capacitance. , Inductance, to prevent the signal from being affected.
  • the light source 20 has a light-emitting surface, and the light-emitting surface is disposed at least partially facing the direction of the mounting surface of the substrate 10.
  • the light emitted by the light source 20 may sequentially pass through the air medium inside the electronic device housing, the through hole on the electronic device housing, and the air medium outside the electronic device housing to be directed to the detected object.
  • the light reflected by the detected object then passes through the air medium outside the electronic device housing, the through hole on the electronic device housing, and the air medium inside the electronic device housing, and then shoots toward the system-in-package structure 100 of the present invention, and is finally converted by photoelectricity. Receiver to complete the detection process.
  • the analog front end 40 is disposed in the substrate 10.
  • the analog front end 40 is pre-embedded in the substrate 10 and can be electrically connected to the substrate 10 through various layers of circuits inside the substrate 10.
  • the structural design of the analog front end 40 arranged in the base 10, on the one hand, can effectively protect the analog front end 40 from being exposed to damage; on the other hand, it can reduce the footprint of the mounting surface of the base 10, thereby effectively reducing the base 10.
  • the size reduces the volume of the system-in-package structure 100 of the present invention, thereby effectively realizing the miniaturization of the system-in-package structure 100 of the present invention, and reducing the space occupied by the system-in-package structure 100 of the present invention.
  • the analog front end 40 is mounted on the mounting surface, and the photoelectric conversion device 30 is disposed on the analog front end 40 away from the mounting surface. surface.
  • the analog front end 40 may be a surface mounted device (Surface Mounted Devices, SMD), using surface mount technology (Surface Mounted Technology, SMT) for mounting, not only the process is mature, but also easy to assemble, which is not only conducive to improving the present invention
  • SMD Surface Mounted Devices
  • SMT Surface Mounted Technology
  • the occupied area of the components on the substrate 10 can be effectively reduced, thereby effectively reducing the size of the substrate 10 and the volume of the system-in-package structure 100 of the present invention, thereby effectively realizing
  • the miniaturization of the system-in-package structure 100 of the present invention reduces the space occupied in the electronic device.
  • the photoelectric conversion device 30 at this time can be electrically connected to the substrate 10 in a variety of ways, for example, by bonding a wire (gold wire).
  • the system-in-package structure 100 further includes a shading member 50, which is provided on the mounting surface and It is arranged around the light source 20.
  • the shading member 50 is arranged around the light source 20 to form a cylindrical structure with open ends.
  • the lower end of the cylindrical structure is fixed to the mounting surface of the base 10, and the upper end of the cylindrical structure is set toward the direction of the mounting surface of the base 10.
  • the light emitted by the light source 20 can be emitted from the upper end opening of the cylindrical structure.
  • the shading member 50 at this time can also play a role of guiding and condensing light to avoid scattering of light, thereby effectively improving the effectiveness of the optical path propagation of the system-in-package structure 100 of the present invention and improving its reliability.
  • the arrangement of the shading member 50 can also achieve effective isolation between the light emitted by the light source 20 and the light received by the photoelectric converter, and prevent the crosstalk of the optical path from causing abnormal received signals.
  • the shading member 50 is a metal member or a plastic member.
  • the metal member may be an iron member, an iron alloy member, an aluminum member, an aluminum alloy member, a copper member, a copper alloy member, etc.; of course, those skilled in the art can also use In the actual situation, other types of metal parts should be selected reasonably, so I will not repeat them here.
  • the plastic part may be a liquid crystal polymer plastic part, a glass fiber modified liquid crystal polymer plastic part, a polyphenylene sulfide plastic part, a polyimide plastic part, or a polyether ether ketone plastic part.
  • the system-in-package structure 100 of the present invention will be subsequently mounted on the circuit board of the complete machine, it will be burned by high temperature.
  • setting the shading member 50 as a metal or plastic part can effectively improve the high temperature resistance of the shading member 50 and ensure its structural stability at high temperatures, thereby ensuring the light emitted by the light source 20 and the light received by the photoelectric converter The reliability and durability of the isolation between.
  • the system-in-package structure 100 further includes an auxiliary device 60 that is provided on the substrate 10 and is connected to the The substrate 10 is electrically connected.
  • the auxiliary device 60 may be a power manager, a Microcontroller Unit (MCU), a Micro-Electro-Mechanical System (MEMS) sensor (such as an accelerometer, a gyroscope, a magnetometer, an ambient light sensor). , Color sensor, proximity sensor, etc.).
  • MCU Microcontroller Unit
  • MEMS Micro-Electro-Mechanical System
  • the power manager can be used to supply power to various components.
  • the micro-control unit (with internal programming algorithm) can be used to perform functional calculation (analysis and processing) on the signal processed by the analog front end 40, and then directly output to the complete machine
  • the main control part performs subsequent operations, so that the pressure of the main control part can be effectively shared, thereby greatly improving the operating speed of the electronic device.
  • MEMS sensors can be used to obtain specific parameters, thereby enriching the functions of electronic devices (such as step counting, dynamic heart rate calculation, etc.).
  • the auxiliary device 60 is provided in the substrate 10.
  • the auxiliary device 60 is embedded in the substrate 10 and can be electrically connected to the substrate 10 through various layers of circuits inside the substrate 10.
  • the structural design of the auxiliary device 60 arranged in the substrate 10, on the one hand, can effectively protect the auxiliary device 60 from exposure and damage; on the other hand, it can reduce the occupied area of the mounting surface of the substrate 10, thereby effectively reducing the substrate 10.
  • the size can reduce the volume of the system-in-package structure 100 of the present invention, thereby effectively realizing the miniaturization of the system-in-package structure 100 of the present invention, and reducing the space occupied by the system in electronic equipment.
  • the auxiliary device 60 is mounted on the mounting surface, and the photoelectric conversion device 30 is provided on the auxiliary device.
  • the auxiliary device 60 may be a surface mount device (Surface Mounted Devices, SMD), which uses surface mount technology (Surface Mounted Technology, SMT) for mounting. Not only the process is mature, but also the assembly is convenient, which is not only helpful for improving the present invention.
  • SMD surface Mounted Devices
  • SMT Surface Mounted Technology
  • the structural stability and functional reliability of the system-in-package structure 100 can also effectively improve the production efficiency of the system-in-package structure 100 of the present invention and reduce resource consumption.
  • the occupied area of the components on the substrate 10 can be effectively reduced, thereby effectively reducing the size of the substrate 10, reducing the volume of the system-in-package structure 100 of the present invention, and effectively achieving The miniaturization of the system-in-package structure 100 of the present invention reduces the space occupied in the electronic device.
  • the photoelectric conversion device 30 at this time can be electrically connected to the substrate 10 in a variety of ways, for example, by bonding a wire (gold wire).
  • the system-in-package structure 100 further includes a light-transmitting encapsulant layer 70, and the light-transmitting encapsulant layer 70 is disposed on The mounting surface covers the light source 20 and the photoelectric conversion device 30.
  • the transparent sealing glue layer 70 can be formed by curing optical glue.
  • the light emitted by the light source 20 can pass through the light-transmitting sealant layer 70 and be emitted, and then pass through the air medium inside the electronic device housing, the through-holes on the electronic device housing, and the air medium outside the electronic device housing to be emitted toward the target.
  • Detect objects The light reflected by the detected object then passes through the air medium outside the electronic device housing, the through-hole on the electronic device housing, and the air medium inside the electronic device housing, and then shoots toward the system-in-package structure 100 of the present invention, and finally passes through the light transmission.
  • the sealant layer 70 is received by the photoelectric converter to complete the detection process.
  • the light-transmitting encapsulant layer 70 covers the surface of the mounting surface and the arrangement of the components on it, which can protect the mounting surface of the substrate 10 and the components on it from being exposed to avoid accidental damage, thereby improving the system-in-package structure 100 of the present invention.
  • each functional unit improves the reliability of the system-in-package structure 100 of the present invention; on the other hand, the components on the mounting surface of the substrate 10 are fixedly sealed in the light-transmitting encapsulant layer 70, which can also improve the structure of the components
  • the stability improves the integrity of the system-in-package structure 100 of the present invention, thereby making it more convenient for subsequent assembly and electrical conduction with the circuit board of the complete machine, thereby improving the manufacturing convenience of electronic devices.
  • the system-in-package structure 100 further includes a light-transmitting cover 80, and a surface of the light-transmitting cover 80 is The mounting surfaces are arranged oppositely, and the light source 20 and the photoelectric conversion device 30 are both arranged between the transparent cover 80 and the base 10.
  • the transparent cover 80 may be a transparent glass cover.
  • the light emitted by the light source 20 can be emitted through the air medium under the light-transmitting cover 80 and the light-transmitting cover 80 in sequence, and then pass through the air medium inside the electronic device housing, the through holes on the electronic device housing, and the electronic device housing in turn.
  • the external air medium is projected toward the detected object.
  • the light reflected by the detected object passes through the air medium outside the electronic device housing, the through-hole on the electronic device housing, and the air medium inside the electronic device housing in turn, and then shoots toward the system-in-package structure 100 of the present invention, and finally passes through the penetrating device.
  • the air medium under the light cover plate 80 and the light transmission cover plate 80 is received by the photoelectric converter, thereby completing the detection process.
  • the arrangement of the light-transmitting cover 80 can protect the mounting surface of the substrate 10 and its components from being exposed and avoid accidental damage, thereby increasing the service life of each functional unit of the system-in-package structure 100 of the present invention and improving the system of the present invention. Level package structure 100 reliability.
  • the light-transmitting cover 80 can be fixed to the mounting surface of the substrate 10 by means of adhesive bonding (for example, the outer edge of the mounting surface is arranged at a height higher than the component frame on the mounting surface, and the light-transmitting cover The 80 cover is set on the frame, and the contact between the two is fixed with adhesive; at this time, the frame can also be fixed on the mounting surface with adhesive), and it can also be fixed to the base by screw connection 10 mounting surface (for example, the height of the outer edge of the mounting surface is higher than the component frame on the mounting surface, and the transparent cover 80 is placed on the frame; at this time, the mounting surface of the frame is away from the base 10 A threaded hole is opened on the surface of the light-transmitting cover plate 80, and a through threaded hole is opened at the corresponding position of the transparent cover plate 80, and the two can be fixedly connected by screws; at this time, the frame can be fixed on the mounting surface by adhesive bonding, It can also be fixed on the mounting surface by screws).
  • adhesive bonding
  • the present invention also provides an electronic device, which includes a housing and a system-in-package structure 100 as described above.
  • an electronic device which includes a housing and a system-in-package structure 100 as described above.
  • the housing is provided with a through hole connecting the inner cavity of the housing and the outside
  • the system-in-package structure 100 is provided in the housing
  • the light source 20 and the photoelectric converter are both set toward the through hole .
  • the electronic device may be a mobile phone, a notebook computer, a tablet computer, a wearable device, etc.
  • the electronic device further includes a lens, and the lens is provided in the through hole to achieve the functions of dustproof, waterproof, impurity prevention, and light transmission.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
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Abstract

一种系统级封装结构（100）和应用该系统级封装结构（100）的电子设备。其中，系统级封装结构（100）包括：基底（10），所述基底（10）设有安装面；光源（20），所述光源（20）设于所述安装面，并与所述基底（10）电性连接；光电转换器件（30），所述光电转换器件（30）设于所述安装面，并与所述基底（10）电性连接，且与所述光源（20）间隔设置；模拟前端（40），所述模拟前端（40）设于所述基底（10），并与所述基底（10）电性连接。所述系统级封装结构（100）可简化电子设备的结构，提升其制造便捷性。

Description

系统级封装结构和电子设备 技术领域
本发明涉及电子设备技术领域，特别涉及一种系统级封装结构和应用该系统级封装结构的电子设备。
背景技术
现有的电子设备(例如手机、笔记本电脑、平板电脑以及穿戴设备)，普遍会搭载多种光学器件(例如发光二极管、光电二极管等)，用以实现相应的功能。但是，目前绝大多数的电子设备之中，光学器件均采用单独安装、单独布线的方式实现位置固定和电路导通。显然，这样的方式存在结构复杂、制造不便的缺陷。
上述内容仅用于辅助理解本发明的技术方案，并不代表承认上述内容为现有技术。
发明内容
本发明的主要目的是提供一种系统级封装结构和应用该系统级封装结构的电子设备，旨在简化电子设备的结构，提升其制造便捷性。
为实现上述目的，本发明的一实施例提出一种系统级封装结构，该系统级封装结构包括：
基底，所述基底设有安装面；
光源，所述光源设于所述安装面，并与所述基底电性连接；
光电转换器件，所述光电转换器件设于所述安装面，并与所述基底电性连接，且与所述光源间隔设置；
模拟前端，所述模拟前端设于所述基底，并与所述基底电性连接。
在本发明一实施例中，所述模拟前端设于所述基底之中；
或者，所述模拟前端贴装于所述安装面，所述光电转换器件设于所述模 拟前端的背离所述安装面的表面。
在本发明一实施例中，所述系统级封装结构还包括遮光件，所述遮光件设于所述安装面，并环绕设置于所述光源四周。
在本发明一实施例中，所述遮光件为金属件或塑料件。
在本发明一实施例中，所述系统级封装结构还包括辅助器件，所述辅助器件设于所述基底，并与所述基底电性连接。
在本发明一实施例中，所述辅助器件设于所述基底之中；
或者，所述辅助器件贴装于所述安装面，所述光电转换器件设于所述辅助器件的背离所述安装面的表面。
在本发明一实施例中，所述系统级封装结构还包括透光封胶层，所述透光封胶层设于所述安装面，并包覆所述光源、所述光电转换器件。
在本发明一实施例中，所述系统级封装结构还包括透光盖板，所述透光盖板的一板面与所述安装面相对设置，所述光源和所述光电转换器件均设于所述透光盖板与所述基底之间。
本发明的一实施例还提出一种电子设备，该电子设备包括外壳和系统级封装结构，该系统级封装结构包括：
基底，所述基底设有安装面；
光源，所述光源设于所述安装面，并与所述基底电性连接；
光电转换器件，所述光电转换器件设于所述安装面，并与所述基底电性连接，且与所述光源间隔设置；
模拟前端，所述模拟前端设于所述基底，并与所述基底电性连接；
所述外壳开设有连通所述外壳内腔和外界的贯通孔，所述系统级封装结构设于所述外壳内，所述光源和所述光电转换器均朝向所述贯通孔设置。
在本发明一实施例中，所述电子设备还包括透镜，所述透镜设于所述贯通孔内。
本发明的技术方案，通过将光源、光电转换器件、模拟前端进行一体化系统级封装，便可得到集光源、光电转换器件、模拟前端于一体的系统级封装结构，从而避免了现有技术中光学器件采用单独安装、单独布线的方式所带来的结构复杂、制造不便的缺陷，即实现了整体封装结构紧凑小巧、连接简单的目的，从而简化了电子设备的结构，提升了电子设备的制造便捷性。同时，光源、光电转换器件等学光器件置于封装结构内部，相比单独布线的组装方式而言，还有效缩短了搭载有光学器件的电子设备内部的线路长度，减小了寄生电容、电感，避免了信号受到影响。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明系统级封装结构第一实施例的结构示意图；
图2为本发明系统级封装结构第二实施例的结构示意图；
图3为本发明系统级封装结构第三实施例的结构示意图；
图4为本发明系统级封装结构第四实施例的结构示意图；
图5为本发明系统级封装结构第五实施例的结构示意图；
图6为本发明系统级封装结构第六实施例的结构示意图。
附图标号说明：
标号 名称 标号 名称
100 系统级封装结构 50 遮光件
10 基底 60 辅助器件
20 光源 70 透光封胶层
30 光电转换器件 80 透光盖板
40 模拟前端    
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“连接”、“固定”等应做广义理解，例如，“固定”可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
另外，本发明各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无 法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
本发明提出一种系统级封装结构100，该系统级封装结构100可应用于手机、笔记本电脑、平板电脑以及穿戴设备等电子设备之中，旨在简化电子设备的结构，提升其制造便捷性。
以下将就本发明系统级封装结构100的具体结构进行说明，并以系统级封装结构100水平放置为例进行介绍：
如图1所示，在本发明系统级封装结构100一实施例中，该系统级封装结构100包括：
基底10，所述基底10设有安装面；
光源20，所述光源20设于所述安装面，并与所述基底10电性连接；
光电转换器件30，所述光电转换器件30设于所述安装面，并与所述基底10电性连接，且与所述光源20间隔设置；
模拟前端40，所述模拟前端40设于所述基底10，并与所述基底10电性连接。
具体地，基底10可采用电路板，用于将设置在其安装面上的各元器件进行电性连接；光源20可采用发光二极管，用于发出检测光；光电转换器件30可采用光电二极管，用于接收发射回来的光线，并将其转换为相应的电信号(模拟信号)而向后方传递；模拟前端40(Analog Front-end，AFE)，用于将光电转换器件30传递来的模拟信号进行数字化及分析处理。模拟前端40可以是少数为数字电路、多数为模拟电路的一类器件，也可以是多数为数字电路、少数为模拟电路的一类器件。模拟前端40的功能包括信号放大、频率变换、调制-解调、邻频处理、电平调整与控制、混合等，本领域技术人员可根据需要进行合理选择，在此不再一一赘述。
因此，可以理解的，本发明的技术方案，通过将光源20、光电转换器件30、模拟前端40进行一体化系统级封装，便可得到集光源20、光电转换器件30、模拟前端40于一体的系统级封装结构100，从而避免了现有技术中光学器件采用单独安装、单独布线的方式所带来的结构复杂、制造不便的缺陷，即实现了整体封装结构紧凑小巧、连接简单的目的，从而简化了电子设 备的结构，提升了电子设备的制造便捷性。同时，光源20、光电转换器件30等学光器件置于封装结构内部，相比单独布线的组装方式而言，还有效缩短了搭载有光学器件的电子设备内部的线路长度，减小了寄生电容、电感，避免了信号受到影响。
需要说明的是，光源20具有发光面，该发光面至少部分面向基底10安装面的面向方向设置。此时，光源20发出的光线可依次经过电子设备外壳内部的空气介质、电子设备外壳上的贯通孔、电子设备外壳外部的空气介质而射向被检测物体。之后由被检测物体反射回来的光线，依次经过电子设备外壳外部的空气介质、电子设备外壳上的贯通孔、电子设备外壳内部的空气介质而射向本发明系统级封装结构100，最后被光电转换器接收，从而完成检测过程。
下面对模拟前端40的具体设置方式进行说明：
如图1所示，在系统级封装结构100一实施例中，所述模拟前端40设于所述基底10之中。此时，模拟前端40预埋在基底10之中，可通过基底10内部的各层线路实现与基底10的电性导通。模拟前端40设置在基底10中的结构设计，一方面，可对模拟前端40进行有效的保护，避免其外露受到损坏；另一方面，可减少基底10安装面的占用面积，从而有效降低基底10大小，降低本发明系统级封装结构100的体积，进而有效实现本发明系统级封装结构100的小型化，减少其在电子设备中的占用空间。
如图2所示，在系统级封装结构100一实施例中，所述模拟前端40贴装于所述安装面，所述光电转换器件30设于所述模拟前端40的背离所述安装面的表面。此时，模拟前端40可为表面贴装器件(Surface Mounted Devices，SMD)，利用表面贴装技术(Surface Mounted Technology，SMT)进行贴装，不仅工艺成熟，而且组装方便，不仅有利于提升本发明系统级封装结构100的结构稳定性和功能可靠性，同时还可有效提升本发明系统级封装结构100的生产效率，降低资源消耗。并且，通过将模拟前端40和光电转换器件30层叠设置，还可有效减省基底10上元器件的占用面积，从而有效降低基底10大小，降低本发明系统级封装结构100的体积，进而有效实现本发明系统级封装结构100的小型化，减少其在电子设备中的占用空间。 可以理解的，此时的光电转换器件30可利用多种方式与基底10进行电性连接，例如通过导线(金线)绑定的方式。
如图1至图6所示，在本发明系统级封装结构100的一类实施例中，所述系统级封装结构100还包括遮光件50，所述遮光件50设于所述安装面，并环绕设置于所述光源20四周。
具体地，遮光件50环绕光源20设置，形成两端开口的筒状结构，筒状结构的下端固定于基底10的安装面，筒状结构的上端朝向基底10安装面的面向方向设置。此时，光源20发出的光线可由该筒状结构的上端开口射出。也就是说，此时的遮光件50还可以起到导光、聚光的作用，避免光线的散射，从而有效提升本发明系统级封装结构100的光路传播的有效性，提升其可靠性。
需要说明的是，遮光件50的设置，还可实现光源20发射的光线与光电转换器接收的光线之间的有效隔离，防止光路串扰造成接收信号的异常。
在本发明系统级封装结构100一实施例中，所述遮光件50为金属件或塑料件。
具体地，当遮光件50为金属件时，该金属件可为铁质件、铁合金件、铝质件、铝合金件、铜质件、铜合金件等；当然，本领域技术人员还可根据实际情况，合理选择其他类型的金属件，在此不再一一赘述。
而当遮光件50为塑料件时，该塑料件可为液晶聚合物塑料件、玻璃纤维改性液晶聚合物塑料件、聚苯硫醚塑料件、聚酰亚胺塑料件、聚醚醚酮塑料件、聚砜塑料件、聚芳砜塑料件、聚醚砜塑料件等；当然，本领域技术人员还可根据实际情况，合理选择其他类型的塑料件，在此不再一一赘述。
需要说明的是，由于本发明系统级封装结构100后续会贴装到整机的线路板上，因此会受到高温的炙烤。此时，将遮光件50设置为金属件或塑料件，可有效提升遮光件50的耐高温性能，保障其在高温下的结构稳定性，从而保障光源20发射的光线与光电转换器接收的光线之间隔离的可靠性和耐久性。
如图1至图6所示，在本发明系统级封装结构100的实施例中，所述系统级封装结构100还包括辅助器件60，所述辅助器件60设于所述基底10，并与所述基底10电性连接。
具体地，辅助器件60可以为电源管理器、微控制单元(Microcontroller Unit，MCU)、微机电系统(Micro-Electro-Mechanical System，MEMS)传感器(例如加速度计、陀螺仪、磁力计、环境光传感器、颜色传感器、接近度传感器等)。其中，电源管理器可用于给各元器件供电，其独立于整机的线路板而单独存在于系统级封装结构100内部，可实现更快更准确的电源管理功能，从而增加系统级封装结构100的运行稳定性和可靠性，提升电源管理的效率；微控制单元(其内部烧录有算法)可用于对经过模拟前端40处理的信号进行功能演算(分析处理)，之后直接输出至整机的主控部分进行后续操作，这样，可有效分担主控部分的压力，从而大大提升电子设备的运行速度。微机电系统传感器可用于对特定参数的获取，从而丰富电子设备的功能(例如计步、动态心率计算等)。
下面对辅助器件60的具体设置方式进行说明：
如图1、图3、图5所示，在本发明系统级封装结构100的一类实施例中，所述辅助器件60设于所述基底10之中。此时，辅助器件60预埋在基底10之中，可通过基底10内部的各层线路实现与基底10的电性导通。辅助器件60设置在基底10中的结构设计，一方面，可对辅助器件60进行有效的保护，避免其外露受到损坏；另一方面，可减少基底10安装面的占用面积，从而有效降低基底10大小，降低本发明系统级封装结构100的体积，进而有效实现本发明系统级封装结构100的小型化，减少其在电子设备中的占用空间。
如图2图4、图6所示，在本发明系统级封装结构100的一类实施例中，所述辅助器件60贴装于所述安装面，所述光电转换器件30设于所述辅助器件60的背离所述安装面的表面。此时，辅助器件60可为表面贴装器件(Surface Mounted Devices，SMD)，利用表面贴装技术(Surface Mounted Technology，SMT)进行贴装，不仅工艺成熟，而且组装方便，不仅有利于提升本发明系统级封装结构100的结构稳定性和功能可靠性，同时还可有效 提升本发明系统级封装结构100的生产效率，降低资源消耗。并且，通过将辅助器件60和光电转换器件30层叠设置，还可有效减省基底10上元器件的占用面积，从而有效降低基底10大小，降低本发明系统级封装结构100的体积，进而有效实现本发明系统级封装结构100的小型化，减少其在电子设备中的占用空间。可以理解的，此时的光电转换器件30可利用多种方式与基底10进行电性连接，例如通过导线(金线)绑定的方式。
如图3和图4所示，在本发明系统级封装结构100的一类实施例中，所述系统级封装结构100还包括透光封胶层70，所述透光封胶层70设于所述安装面，并包覆所述光源20、所述光电转换器件30。
具体地，透光封胶层70可由光学胶水固化形成。此时，光源20发出的光线可穿过透光封胶层70而射出，并依次经过电子设备外壳内部的空气介质、电子设备外壳上的贯通孔、电子设备外壳外部的空气介质而射向被检测物体。之后由被检测物体反射回来的光线，依次经过电子设备外壳外部的空气介质、电子设备外壳上的贯通孔、电子设备外壳内部的空气介质而射向本发明系统级封装结构100，最后经由透光封胶层70而被光电转换器接收，从而完成检测过程。
可以理解的，透光封胶层70包覆安装面表面及其上元器件的设置，可保护基底10安装面及其上元器件不外露而避免意外损坏，从而提升本发明系统级封装结构100各功能单元的使用寿命，提升本发明系统级封装结构100可靠性；另一方面，基底10安装面上各元器件被固封在透光封胶层70中，还可提升各元器件的结构稳定性，使得本发明系统级封装结构100的整体性更佳，从而使得其在后续与整机的线路板进行装配和电性导通时更加方便，进而提升电子设备的制造便捷性。
如图5和图6所示，在本发明系统级封装结构100一实施例中，所述系统级封装结构100还包括透光盖板80，所述透光盖板80的一板面与所述安装面相对设置，所述光源20和所述光电转换器件30均设于所述透光盖板80与所述基底10之间。
具体地，透光盖板80可采用透明玻璃盖板。此时，光源20发出的光线 可依次经过透光盖板80下空气介质和透光盖板80而射出，并依次经过电子设备外壳内部的空气介质、电子设备外壳上的贯通孔、电子设备外壳外部的空气介质而射向被检测物体。之后由被检测物体反射回来的光线，依次经过电子设备外壳外部的空气介质、电子设备外壳上的贯通孔、电子设备外壳内部的空气介质而射向本发明系统级封装结构100，最后依次经过透光盖板80和透光盖板80下空气介质而被光电转换器接收，从而完成检测过程。
可以理解的，透光盖板80的设置，可保护基底10安装面及其上元器件不外露而避免意外损坏，从而提升本发明系统级封装结构100各功能单元的使用寿命，提升本发明系统级封装结构100可靠性。
需要说明的是，透光盖板80可通过胶接的方式固定于基底10的安装面(例如，在安装面的外缘环绕设置高度高于安装面上元器件边框，并将透光盖板80盖设于边框之上，二者的接触处使用胶黏剂粘接固定；此时，边框同样可利用胶黏剂粘接固定在安装面上)，还可通过螺钉连接的方式固定于基底10的安装面(例如，在安装面的外缘环绕设置高度高于安装面上元器件边框，并将透光盖板80盖设于边框之上；此时，在边框的背离基底10安装面的表面开设螺纹孔，并在透光盖板80的对应位置处开设贯通的螺纹孔，便可利用螺钉将二者固定连接；此时，边框可通过胶黏剂粘接固定在安装面上，也可通过螺钉固定于安装面上)。当然，如图5和图6所示，透光盖板80还可利用遮光件50实现上述的胶接固定或螺钉固定。
本发明还提出一种电子设备，该电子设备包括外壳和如前所述的系统级封装结构100，该系统级封装结构100的具体结构参照前述实施例。由于本电子设备采用了前述所有实施例的全部技术方案，因此至少具有前述所有实施例的全部技术方案所带来的所有有益效果，在此不再一一赘述。其中，所述外壳开设有连通所述外壳内腔和外界的贯通孔，所述系统级封装结构100设于所述外壳内，所述光源20和所述光电转换器均朝向所述贯通孔设置。
可以理解的，电子设备可以是手机、笔记本电脑、平板电脑、穿戴设备等。
进一步地，所述电子设备还包括透镜，所述透镜设于所述贯通孔内，以实现防尘、防水、防杂质、透光的作用。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (10)

  1. 一种系统级封装结构，应用于电子设备，其特征在于，包括：
    基底，所述基底设有安装面；
    光源，所述光源设于所述安装面，并与所述基底电性连接；
    光电转换器件，所述光电转换器件设于所述安装面，并与所述基底电性连接，且与所述光源间隔设置；
    模拟前端，所述模拟前端设于所述基底，并与所述基底电性连接。
  2. 如权利要求1所述的系统级封装结构，其特征在于，所述模拟前端设于所述基底之中；
    或者，所述模拟前端贴装于所述安装面，所述光电转换器件设于所述模拟前端的背离所述安装面的表面。
  3. 如权利要求1所述的系统级封装结构，其特征在于，所述系统级封装结构还包括遮光件，所述遮光件设于所述安装面，并环绕设置于所述光源四周。
  4. 如权利要求3所述的系统级封装结构，其特征在于，所述遮光件为金属件或塑料件。
  5. 如权利要求1所述的系统级封装结构，其特征在于，所述系统级封装结构还包括辅助器件，所述辅助器件设于所述基底，并与所述基底电性连接。
  6. 如权利要求5所述的系统级封装结构，其特征在于，所述辅助器件设于所述基底之中；
    或者，所述辅助器件贴装于所述安装面，所述光电转换器件设于所述辅助器件的背离所述安装面的表面。
  7. 如权利要求1至6中任一项所述的系统级封装结构，其特征在于，所述系统级封装结构还包括透光封胶层，所述透光封胶层设于所述安装面，并包覆所述光源、所述光电转换器件。
  8. 如权利要求1至6中任一项所述的系统级封装结构，其特征在于，所述系统级封装结构还包括透光盖板，所述透光盖板的一板面与所述安装面相对设置，所述光源和所述光电转换器件均设于所述透光盖板与所述基底之间。
  9. 一种电子设备，其特征在于，包括外壳和如权利要求1至9中任一项所述的系统级封装结构，所述外壳开设有连通所述外壳内腔和外界的贯通孔，所述系统级封装结构设于所述外壳内，所述光源和所述光电转换器均朝向所述贯通孔设置。
  10. 如权利要求9所述的电子设备，其特征在于，所述电子设备还包括透镜，所述透镜设于所述贯通孔内。
PCT/CN2019/123543 2019-09-29 2019-12-06 系统级封装结构和电子设备 WO2021056826A1 (zh)

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