WO2021045382A1 - Wearable electronic device and optical film applied thereto - Google Patents

Abstract

An optical film according to various embodiments disclosed in the present document may comprise a base layer, an adhesion layer stacked on at least a portion of the base layer, and a pattern layer stacked on the base layer and including a plurality of patterns protruding on the surface thereof in different directions. Various other embodiments may also be possible.

Description

Wearable electronic devices and optical films applied thereto

Various embodiments disclosed in this document relate to a wearable electronic device and an optical film applied thereto.

Wearable electronic devices worn on the user's body are gradually diversifying their functions. In addition, the size of wearable electronic devices is gradually getting smaller.

As interest in health increases, wearable electronic devices are equipped with functions capable of measuring user's biometric information. Recently, various sensors including a heart rate sensor have been mounted on wearable electronic devices in the form of wrist watches.

Various electronic components that enable the electronic device to perform various functions may be mounted or connected to a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

The sensor module included in the wearable electronic device may include a sensor including a light emitting unit and a light receiving unit. In order for such a sensor to accurately detect the user's body information, it is necessary to minimize a phenomenon in which light generated from the light emitting unit is not reflected by the body and transmitted to the light receiving unit.

The optical film included in the wearable electronic device may be a film for improving the optical properties of the sensor as described above. The conventional optical film was divided into an optical film applied to a light emitting part of a sensor and an optical film applied to a light receiving part of a sensor, and applied to a wearable electronic device. For this reason, the manufacturing cost of the wearable electronic device increases, the manufacturing yield decreases, and there may be a problem that the mass productivity is inferior.

Various embodiments disclosed in this document improve the optical characteristics of the sensor so that a sensor having a light emitting unit and a light receiving unit can accurately measure the user's biometric information, and composed of a single sheet covering both the light emitting unit and the light receiving unit of the sensor. It is to provide an optical film and an electronic device to which the optical film is applied.

An optical film according to various embodiments disclosed in this document includes a base layer, an adhesive layer laminated on at least a portion of the base layer, and a plurality of patterns laminated on the base layer and protruding from the surface in different directions. It may include a pattern layer.

An electronic device according to various embodiments of the present disclosure includes a display, a cover facing the display and including a light-transmitting region at least in part, a printed circuit board disposed below the cover, a light emitting unit and a light receiving unit, and the cover It may include a sensor module mounted on the printed circuit board to face and an optical film disposed between the sensor module and the cover, wherein the optical film includes a base layer and the base so that the optical film is adhered to the cover. It may include an adhesive layer laminated on at least a portion of the layer, and a pattern layer having at least one pattern laminated on the base layer to face the sensor module and protruding in different directions.

According to various embodiments disclosed in this document, a sensor including a light emitting unit and a light receiving unit can measure the user's biometric information more accurately and accurately, lowering the manufacturing cost of an electronic device to which an optical film is applied, and improving manufacturing yield. And can improve mass production.

In connection with the description of the drawings , the same or similar reference numerals may be used for the same or similar components.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

2 is a front perspective view of a mobile electronic device according to various embodiments disclosed in this document.

3 is a perspective view of the rear side of the electronic device of FIG. 2.

4 is an exploded perspective view of the electronic device of FIG. 2.

5 is an exploded perspective view of an optical film according to various embodiments disclosed in the present document.

6A is a perspective view of a sensor module and a peripheral configuration thereof according to various embodiments disclosed in the present document in a combined state.

6B is an exploded perspective view of the sensor module disclosed in FIG. 6A and its peripheral configuration.

6C is a cross-sectional view taken along line A-A in FIG. 6A.

7A and 7B are views for explaining a pattern of a pattern layer of an optical film according to various embodiments disclosed in the present document.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1, in a network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (for example, a short-range wireless communication network), or a second network 199 It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included. In some embodiments, at least one of these components (for example, the display device 160 or the camera module 180) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to implement at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 may store commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132. It is loaded into, processes a command or data stored in the volatile memory 132, and stores result data in the nonvolatile memory 134. According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphic processing unit, an image signal processor) that can be operated independently or together. , A sensor hub processor, or a communication processor). Additionally or alternatively, the coprocessor 123 may be set to use lower power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from the main processor 121 or as a part thereof.

The co-processor 123 is, for example, in place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states associated with it. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as a part of other functionally related components (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176). The data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.

The input device 150 may receive a command or data to be used for a component of the electronic device 101 (eg, the processor 120) from outside (eg, a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output an sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.

The audio module 170 may convert sound into an electrical signal, or conversely, may convert an electrical signal into sound. According to an embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device (eg: Sound can be output through the electronic device 102) (for example, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 176 is, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used for the electronic device 101 to connect directly or wirelessly with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through tactile or motor sensations. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture a still image and a video. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 388 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 includes a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It is possible to support establishment and communication through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an application processor) and may include one or more communication processors supporting direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : A local area network (LAN) communication module, or a power line communication module) may be included. Among these communication modules, a corresponding communication module is a first network 198 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (for example, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into a single component (eg, a single chip), or may be implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information stored in the subscriber identification module 196 (eg, International Mobile Subscriber Identifier (IMSI)) in a communication network such as the first network 198 or the second network 199. The electronic device 101 can be checked and authenticated.

The antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, provided by the communication module 190 from the plurality of antennas. Can be chosen. The signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as part of the antenna module 197.

At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and a signal ( E.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the electronic devices 102 and 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 In addition or in addition, it is possible to request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101. The electronic device 101 may process the result as it is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology Can be used.

2 and 3, the electronic device 200 according to an embodiment includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a first surface 210A, and A housing 210 including a side surface 210C surrounding a space between the second surfaces 210B, and connected to at least a portion of the housing 210, and connecting the electronic device 200 to a user's body part (for example: It may include a binding member (250, 260) configured to be detachably attached to the wrist, ankle, etc.). In another embodiment (not shown), the housing may refer to a structure forming some of the first surface 210A, the second surface 210B, and the side surface 210C of FIG. 2. According to an embodiment, at least a portion of the first surface 210A may be formed by a substantially transparent front plate 201 (eg, a glass plate including various coating layers or a polymer plate). The second surface 210B may be formed by a substantially opaque rear plate 207. The back plate 207 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. The side surface 210C is coupled to the front plate 201 and the rear plate 207 and may be formed by a side bezel structure (or “side member”) 206 including metal and/or polymer. In some embodiments, the back plate 207 and the side bezel structure 206 are integrally formed and may include the same material (eg, a metallic material such as aluminum). The binding members 250 and 260 may be formed of various materials and shapes. An integral type and a plurality of unit links may be formed to flow with each other by a woven material, leather, rubber, urethane, metal, ceramic, or a combination of at least two of the above materials.

According to an embodiment, the electronic device 200 includes a display 220 (refer to FIG. 4), an audio module 205 and 208, a sensor module 211, a key input device 202, 203, and 204, and a connector hole ( 209). In some embodiments, the electronic device 200 omits at least one of the components (eg, key input devices 202, 203, 204, connector hole 209, or sensor module 211) or has other configurations. Additional elements may be included.

The display 220 may be exposed through a substantial portion of the front plate 201, for example. The shape of the display 220 may be a shape corresponding to the shape of the front plate 201, and may have various shapes such as a circle, an oval, or a polygon. The display 220 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a fingerprint sensor.

The audio modules 205 and 208 may include a microphone hole 205 and a speaker hole 208. In the microphone hole 205, a microphone for acquiring external sound may be disposed inside, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker hole 208 can be used as an external speaker and a receiver for a call.

The sensor module 211 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. The sensor module 211 may include, for example, a biometric sensor module 211 (eg, an HRM sensor) disposed on the second surface 210B of the housing 210. The electronic device 200 is a sensor module not shown, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor.

The key input device 202, 203, 204 is disposed on the first surface 210A of the housing 210 and is rotatable in at least one direction, and the wheel key 202, and/or the side surface 210C of the housing 210 ) May include a side key button 202, 203 disposed on it. The wheel key may have a shape corresponding to the shape of the front plate 202. In another embodiment, the electronic device 200 may not include some or all of the aforementioned key input devices 202, 203, 204, and the key input devices 202, 203, 204 that are not included may be displayed. It may be implemented in other forms, such as a soft key on the 220. The connector hole 209 may accommodate a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and a connector for transmitting and receiving an audio signal with an external electronic device. Other connector holes (not shown) may be included. The electronic device 200 may further include, for example, a connector cover (not shown) that covers at least a portion of the connector hole 209 and blocks the inflow of foreign substances into the connector hole.

The binding members 250 and 260 may be attached to and detached from at least a partial region of the housing 210 by using the locking members 251 and 261. The binding members 250 and 260 may include one or more of a fixing member 252, a fixing member fastening hole 253, a band guide member 254, and a band fixing ring 255.

The fixing member 252 may be configured to fix the housing 210 and the binding members 250 and 260 to a part of the user's body (eg, wrist, ankle, etc.). The fixing member fastening hole 253 may fix the housing 210 and the fixing members 250 and 260 to a part of the user's body corresponding to the fixing member 252. The band guide member 254 is configured to limit the movement range of the fixing member 252 when the fixing member 252 is fastened with the fixing member fastening hole 253, so that the binding members 250 and 260 are attached to a part of the user's body. It can be tightly attached. The band fixing ring 255 may limit the range of motion of the fixing members 250 and 260 in a state in which the fixing member 252 and the fixing member fastening hole 253 are fastened.

Referring to FIG. 4, the electronic device 400 includes a side bezel structure 410, a wheel key 420, a front plate 201, a display 220, a first antenna 450, and a second antenna 455. , A support member 460 (eg, a bracket), a battery 470, a printed circuit board 480, a sealing member 490, a rear plate 493, and a binding member 495 and 497. At least one of the components of the electronic device 400 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2 or 3, and redundant descriptions will be omitted below. The support member 460 may be disposed inside the electronic device 400 and connected to the side bezel structure 410, or may be integrally formed with the side bezel structure 410. The support member 460 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. In the support member 460, the display 220 may be coupled to one surface and the printed circuit board 480 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 480. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit (GPU), an application processor signal processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface), an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 400 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 470 is a device for supplying power to at least one component of the electronic device 400, and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. have. At least a portion of the battery 470 may be disposed substantially on the same plane as the printed circuit board 480, for example. The battery 470 may be integrally disposed inside the electronic device 200 or may be disposed detachably from the electronic device 200.

The first antenna 450 may be disposed between the display 220 and the support member 460. The first antenna 450 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The first antenna 450, for example, may perform short-range communication with an external device or wirelessly transmit and receive power required for charging, and may transmit a short-range communication signal or a self-based signal including payment data. . In another embodiment, an antenna structure may be formed by a side bezel structure 410 and/or a part of the support member 460 or a combination thereof.

The second antenna 455 may be disposed between the circuit board 480 and the rear plate 493. The second antenna 455 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The second antenna 455, for example, may perform short-range communication with an external device or wirelessly transmit and receive power required for charging, and may transmit a short-range communication signal or a self-based signal including payment data. . In another embodiment, an antenna structure may be formed by a side bezel structure 410 and/or a part of the rear plate 493 or a combination thereof.

The sealing member 490 may be positioned between the side bezel structure 410 and the rear plate 493. The sealing member 490 may be configured to block moisture and foreign matter flowing into a space surrounded by the side bezel structure 410 and the rear plate 493 from the outside.

5 is an exploded perspective view of an optical film (eg, the optical film 540 of FIG. 4) according to various embodiments disclosed in this document.

According to various embodiments, the optical film may include a base layer 541, an adhesive layer 543, and a pattern layer 542. For example, as shown in FIG. 5, the optical film may be laminated in the order of a pattern layer 542-a base layer 541-an adhesive layer 543.

The base layer 541 may be made of, for example, a material such as polyethylene terephthalate (PET). In addition, the base layer 541 may be formed of various light-transmitting materials. The shape of the base layer 541 is not limited to the shape shown in FIG. 5 and may be variously changed.

The adhesive layer 543 may be formed of an adhesive material. For example, the adhesive layer 543 may be formed of a polymeric chemical material having adhesive properties. As shown in FIG. 5, the adhesive layer 543 may be laminated on at least a portion of the base layer 541. According to various embodiments, the adhesive layer 543 may be formed of a material having a low reflectivity. For example, the adhesive layer 543 may be formed of a dark-colored material to have low reflectivity. 5 is only one example of the adhesive layer 543 stacked on the base layer 541, and the shape of the adhesive layer 543 may be variously changed.

The pattern layer 542 may be stacked on the base layer 541. According to various embodiments, the pattern layer 542 may be formed of an ultra violet (UV) curable resin. In addition, the pattern layer 542 may be formed of various materials. The pattern layer 542 may include a pattern 542-1 protruding from the surface of the pattern layer 542 in concentric circles of different diameters. 5 is only an example of the pattern layer 542, and the overall shape of the pattern layer 542 may be variously changed. According to various embodiments, the pattern layer 542 may be a part of the base layer 541. For example, the surface of the base layer 541 may be processed by a process such as etching to form the pattern layer 542.

6A is a diagram of the sensor module 550 and its surrounding components in a combined state. 6B is an exploded perspective view of the sensor module 550 shown in FIG. 6A and its peripheral configuration. 6C is a cross-sectional view of the sensor module 550 shown in FIG. 6A and its peripheral configuration taken along line A-A. The size ratios of the components shown in the drawings are shown arbitrarily for convenience of description, and the size ratios of the components may be changed.

An electronic device (eg, the electronic device 101 of FIG. 1, the electronic device 200 of FIG. 2, or the electronic device 400 of FIG. 4) according to various embodiments disclosed in this document is a display (eg, display of FIG. 1 ). The device 160 or the display 220 of FIG. 4), a processor (e.g., the processor 120 of FIG. 1), a cover 510 (e.g., the rear plate 493 of FIG. 4), and a printed circuit board 520, a wireless charging coil 530 (for example, the second antenna 455 of FIG. 4), and a sensor module 550 may be included. Here, the printed circuit board 520 may be a flexible printed circuit board formed of a flexible material.

The display may deliver, for example, information processed by the wearable electronic device to the user. The display of an electronic device according to various embodiments disclosed in this document may be the display device of FIG. 1 or the display of FIG. 4. The description of the display will be replaced with the description of the display device of FIG. 1 and the display of FIG. 4.

The cover 510 may be installed on the electronic device at a position facing the display. If the direction in which the display displays information in the electronic device is the front side of the electronic device, the cover 510 may be disposed on the back side of the electronic device. 6C, the cover 510 may have a convex shape. If the surface facing the printed circuit board 520 is referred to as the inside of the cover 510 and the opposite side is referred to as the outside of the cover 510, the outside of the cover 510 may be formed to be convex. When the electronic device according to various embodiments disclosed in this document is a type of electronic device that is worn on a wrist, the outside of the cover 510 may contact the user's wrist. As shown in FIG. 6B, the cover 510 may include a light-transmitting region 511 at least in part. The light-transmitting region 511 may be formed of a material capable of transmitting light. According to various embodiments, the cover 510 may be formed of a material capable of transmitting light, such as glass or a transparent synthetic resin.

The sensor module 550 may be mounted on the printed circuit board 520. The sensor module 550 may include a light emitting part 551 and a light receiving part 553. According to various embodiments, the sensor module 550 may be a photoplethysmography (PPG) sensor module 550 capable of detecting a bio-signal related to a user's heartbeat. In addition, the sensor module 550 may include sensors for sensing various bio signals.

The light emitting unit 551 may be a device such as a light emitting diode (LED) or an organic light emitting diode (OLED) capable of emitting light. In addition, the light-emitting unit 551 may be composed of various devices capable of emitting light.

As shown in FIG. 6B, a plurality of light-receiving units 553 may be provided and arranged in a circular shape around the light-emitting unit 551. The light-receiving unit 553 may be a light-receiving element that converts light energy into electrical energy. For example, the light receiving unit 553 may include a photo diode.

According to various embodiments, the sensor module 550 may use a difference in optical response according to oxygen saturation of hemoglobin in blood. Light provided from the light emitting unit 551 is transmitted to the user's body through the cover 510. The light receiving unit 553 receives reflected light of light transmitted to the body. The reflected light received by the light receiving unit 553 has periodicity due to a difference in optical reaction according to the oxygen saturation of hemoglobin described above. The sensor module 550 may detect a signal related to the user's heartbeat by using this periodicity. In some cases, a user's movement may be indirectly measured through a sensor (eg, an acceleration sensor or a gyro sensor) that detects the position of the electronic device, and the signal related to the heart rate may be processed more precisely through the movement information. The biosignal detection of the sensor module 550 described above describes a typical principle of detecting heart rate-related information using the light emitting unit 551 and the light receiving unit 553, and the sensor module 550 according to various embodiments disclosed in this document. ) Can also detect the user's heart rate-related information as a bio-signal in various ways.

As described above, the sensor module 550 may utilize a phenomenon in which light generated from the light emitting unit 551 is reflected on the user's body and received by the light receiving unit 553. In order to accurately and accurately detect the bio-signal, it may be desirable to suppress a phenomenon in which light generated from the light emitting unit 551 is not reflected by the body and transmitted to the light receiving unit 553. For example, it may be desirable to suppress a phenomenon in which light generated from the light emitting unit 551 proceeds in the -X direction of FIG. 6C. It may be desirable to suppress a phenomenon in which light generated from the light emitting unit 551 is reflected in the process of passing through the base layer 541 or the cover 510 and transmitted to the light receiving unit 553.

According to various embodiments, the electronic device may include a light blocking barrier 581. The light blocking partition 581 may divide a region in which the light-emitting unit 551 is mounted and a region in which the light-receiving unit 553 of the sensor module 550 is mounted. The light blocking partition 581 may block a path through which light generated from the light emitting unit 551 is not reflected to an external object and is directly transmitted to the light receiving unit 553. Hereinafter, an area in which the light-emitting unit 551 is mounted (eg, A-1 in FIG. 6C) is defined as a light-emitting area, and an area in which the light-receiving unit 553 is mounted (eg, B-1 in FIG. 6C) is used as a light-receiving area. Define and proceed with explanation.

6B, the optical film 540 may be disposed between the cover 510 of the electronic device and the sensor module 550.

According to various embodiments, the optical film 540 may be configured to cover both the light emitting portion 551 and the light receiving portion 553 of the sensor module 550. For example, the optical film 540 is not divided into a portion covering the light-emitting portion 551 and a portion covering the light-receiving portion 553, but may be configured as a single sheet. In this way, since the optical film 540 is composed of one sheet, it is possible to lower the manufacturing cost of the electronic device, increase the manufacturing yield, and secure mass production.

It may be attached to the cover 510 of the electronic device through the adhesive layer 543 of the optical film 540. As described above, the cover 510 may include a light transmissive region 511. The adhesive layer 543 of the optical film 540 may be laminated on the base layer 541 of the optical film 540 at a portion of the cover 510 that faces an area other than the light-transmitting region 511. Light generated from the light emitting portion 551 of the sensor module 550 may travel to the user's skin through the light-transmitting region 511 of the cover 510. Since the adhesive layer 543 is laminated at a portion opposite to the region other than the light-transmitting region 511, the propagation of light generated from the light emitting unit 551 may not be disturbed by the adhesive layer 543.

According to various embodiments, as illustrated in FIG. 6B, the adhesive layer 543 of the optical film 540 is formed at a boundary between the first region A-2 and the second region B-2 of the pattern layer 542. It can be stacked on the base layer so as to face each other. As described above, the adhesive layer 543 may be formed of a material having a low reflectance, and the adhesive layer 543 is disposed at a portion facing the boundary between the first region A-2 and the second region B-2. As a result, it is possible to block a path where light that has passed through the first region A-2 of the pattern layer 542 does not pass through the user's body and is directly incident to the second region B-2 of the pattern layer 542. .

According to various embodiments, the adhesive layer 543 of the optical film 540 may be laminated on a part of the base layer 541. Accordingly, as shown in FIG. 6C, a gap 548 may be formed between the optical film 540 and the cover 510. The gap 548 formed as described above may reduce the frequency in which the light generated from the light-emitting unit 551 is directly transmitted to the light-receiving unit 553.

The pattern layer 542 of the optical film 540 may include at least one pattern 545 and 547 protruding from the surface of the pattern layer 542 in concentric circles of different diameters. The pattern layer 542 may include a first region A-2 and a second region B-2. The first area A-2 may be an area substantially facing the light emitting part 551 of the sensor module 550. According to various embodiments, the first region A-2 may be a region substantially facing the light emitting region A-1. As described above, the light-emitting area A-1 may be an area in which the light-emitting portion 551 partitioned by the light blocking partition wall 581 is mounted. The second area B-2 may be an area substantially facing the light receiving part 553. According to various embodiments, the second area B-2 may be an area substantially facing the light-receiving area B-1. As described above, the light-receiving area B-1 may be an area in which the light-receiving part 553 partitioned by the light-blocking partition wall 581 is mounted.

A first pattern 545 may be formed in the first region A-2 and a second pattern 547 may be formed in the second region B-2. The first pattern 545 and the second pattern 547 may be formed to protrude in different directions. The first pattern 545 may be formed such that light generated from the light emitting unit 551 proceeds in a first direction substantially perpendicular to the extending direction of the pattern layer 542 (eg, -Y direction in FIG. 6C). . The second pattern 547 is reflected on the user's skin and the light incident on the second pattern 547 proceeds in a second direction opposite to the first direction (eg, +Y direction in FIG. 6C), and the light receiving unit 553 It may be formed to be incident on. In the first pattern 545 and the second pattern 547 formed by protruding from the pattern layer 542 in different directions, the light generated from the light emitting unit 551 does not pass through the user's body, but directly to the light receiving unit 553. Incident phenomenon can be reduced. For example, the pattern layer 542 of the optical film 540 according to various embodiments disclosed in this document may induce light generated from the light emitting unit 551 of the sensor module 550 to proceed to the user's body. In addition, it is possible to induce light reflected on the user's body to be incident on the light receiving unit 553 of the sensor module 550.

Next, the patterns 545 and 547 of the pattern layer 542 will be described in more detail with reference to FIGS. 7A and 7B. 7A and 7B are views for explaining patterns 545 and 547 of the pattern layer 542 according to various embodiments disclosed in this document. The size ratios of the components shown in the drawings are shown arbitrarily for convenience of description, and the size ratios of the components may be changed.

Referring to FIG. 7A, the first pattern 545 may include a first surface 545-1 and a second surface 545-2, respectively. The first surface 545-1 of the first pattern 545 is a surface positioned closer to the center M of the pattern layer 542 than the second surface 545-2 of the first pattern 545, The second surface 545-2 of the first pattern 545 may be a surface located far from the center M of the pattern layer 542 compared to the first surface 545-1 of the first pattern 545. . The angle θ1 formed between the first surface 545-1 of the first pattern 545 and the surface of the pattern layer 542 is equal to the second surface 545-2 of the first pattern 545 and the pattern layer 542. ) May be smaller than the angle θ2 formed by the surface. The angle θ2 formed between the second surface 545-2 of the first pattern 545 and the surface of the pattern layer 542 may be 80 degrees or more and 95 degrees or less. The ratio of the width L of the first pattern 545 to the height H of the first pattern 545 may be 0.4 or more and 1.0 or less. The first pattern 545 formed in such a shape guides the light generated from the light emitting unit 551 to proceed in the first direction (for example, in the -Y direction in FIG. 6B), and at the same time, the light generated from the light emitting unit 551 It is possible to reduce a phenomenon that proceeds in the direction in which the light receiving part 553 is located.

Referring to FIG. 7A, the second pattern 547 may have a first surface 547-1 and a second surface 547-2, respectively. The first surface 547-1 of the second pattern is a surface positioned closer to the center M of the pattern layer 542 than the second surface 547-2 of the second pattern 547, and the second pattern The second surface 547-2 of the second pattern 547 may be a surface located far from the center M of the pattern layer 542 compared to the first surface 547-1 of the second pattern 547. The angle θ3 formed between the first surface 547-1 of the second pattern 547 and the surface of the pattern layer 542 is equal to the second surface 547-2 and the pattern layer 542 of the second pattern 547. ) May be greater than the angle θ4 formed by the surface. An angle θ3 formed between the first surface 547-1 of the second pattern 547 and the surface of the pattern layer 542 may be 80 degrees or more and 95 degrees or less. The ratio of the width L of the second pattern 547 to the height H of the second pattern 547 may be 0.4 or more and 00 or less. The second pattern 547 formed in such a shape induces the light reflected from the user's skin to proceed in the second direction (eg, +Y direction in FIG. 6B), and at the same time, the reflected light is transferred back to the light emitting unit 551. Incident phenomenon can be reduced.

According to various embodiments, as shown in FIG. 7B, the cross section of the first surface 545-1 of the first pattern 545 may be curved, and the second surface 547 of the second pattern 547 is The cross section of -2) can be curved. Referring to FIG. 7B, a point where the first surface 545-1 and the second surface 545-2 of the first pattern 545 meet and the first surface 545-1 of the first pattern 545 The angle θ1 formed by the line segment connecting the point where the surface of the pattern layer 542 meets and the surface of the pattern layer 542 is between the second surface 545-2 of the first pattern 545 and the pattern layer 542. It may be smaller than the angle θ2 formed by the surface. The point where the second surface 547-2 of the second pattern 547 and the first surface 547-1 of the second pattern 547 meet and the second surface 547-2 of the second pattern 547 The angle θ4 formed by the line segment connecting the surface of the pattern layer 542 and the surface of the pattern layer 542 is the first surface 547-1 of the second pattern 547 and the pattern layer 542 It may be smaller than the angle (θ3) formed by the surface of.

An optical film according to various embodiments disclosed in this document includes a pattern layer having a base layer, an adhesive layer stacked on at least a portion of the base layer, and at least one pattern stacked on the base layer and protruding in different directions. It may include.

In addition, the pattern of the pattern layer may be formed to protrude from the surface of the pattern layer in the form of concentric circles having different diameters.

In addition, the pattern layer includes a first region and a second region, and the first pattern formed in the first region and the second pattern formed in the second region protrude in different directions with respect to the surface of the pattern layer. Can be formed.

In addition, the first region of the pattern layer may be a region including a central region of the pattern layer.

In addition, the first pattern of the pattern layer may be formed such that light incident on the first pattern proceeds in a first direction perpendicular to the extending direction of the pattern layer, and the second pattern of the pattern layer is the second pattern. The light incident in the pattern may be formed to proceed in a second direction opposite to the first direction.

In addition, the first pattern of the pattern layer may have a first surface and a second surface positioned farther from the center of the pattern layer than the first surface of the first pattern, and the first surface of the first pattern And the surface of the pattern layer may be smaller than an angle formed between the second surface of the first pattern and the surface of the pattern layer, and the second pattern of the pattern layer may be formed between the first surface and the second pattern. Each of the second surfaces located farther from the center of the pattern layer than the first surface may be provided, and an angle formed between the first surface of the second pattern and the surface of the pattern layer is It may be larger than the angle formed by the surface of the pattern layer.

In addition, in the pattern layer, a cross section of the first surface of the first pattern may be curved, and a cross section of the second surface of the second pattern may be curved.

In addition, in the pattern layer, an angle formed between the second surface of the first pattern and the surface of the pattern layer may be 80 degrees or more and 95 degrees or less, and the first surface of the second pattern layer and the surface of the pattern layer are The angle formed may be 80 degrees or more and 95 degrees or less.

In addition, the pattern of the pattern layer may have a height ratio of the width of the pattern to the height of the pattern of 0.4 or more and 1.0 or less.

A wearable electronic device according to various embodiments of the present disclosure includes a display, a cover facing the display and including a light-transmitting region at least in part, a printed circuit board disposed under the cover, a light emitting unit, and a light receiving unit, and the It may include a sensor module mounted on the printed circuit board facing the cover and an optical film disposed between the sensor module and the cover, wherein the optical film includes a base layer and the optical film so that the optical film is adhered to the cover. It may include an adhesive layer laminated on at least a portion of the base layer, and a pattern layer having at least one pattern laminated on the base layer to face the sensor module and protruding in different directions.

In addition, the pattern of the pattern layer of the optical film may be formed to protrude from the surface of the pattern layer in the form of concentric circles having different diameters.

In addition, the pattern layer of the optical film may include a first region facing the light emitting portion of the sensor module and a second region facing the light receiving portion of the sensor module, and the first pattern formed in the first region and The second pattern formed in the second region may be formed to protrude in different directions with respect to the surface of the pattern layer.

In addition, the first pattern of the pattern layer of the optical film may be formed such that light incident from the light emitting portion of the sensor module to the first pattern proceeds in a first direction perpendicular to the extending direction of the pattern layer, and the The second pattern of the pattern layer of the optical film may be formed such that light incident on the second pattern proceeds in a second direction opposite to the first direction and enters the light receiving unit of the sensor module.

In addition, the first pattern of the pattern layer of the optical film may have a first surface and a second surface positioned farther from the center of the pattern layer than the first surface of the first pattern, An angle formed between the first surface and the surface of the pattern layer may be smaller than an angle formed between the second surface of the first pattern and the surface of the pattern layer, and the second pattern of the pattern layer of the optical film is the first surface And a second surface positioned further from the center of the pattern layer than the first surface of the second pattern, and an angle formed between the first surface of the second pattern and the surface of the pattern layer is the second pattern It may be greater than an angle formed between the second surface of and the surface of the pattern layer.

In addition, in the pattern layer of the optical film, a cross section of the first surface of the first pattern may be curved, and a cross section of the second surface of the second pattern may be curved.

In addition, in the printed circuit board, the optical circuit board may divide a light-emitting area, which is an area on which the light emitting unit of the sensor module is mounted on the printed circuit board, and a light-receiving area, which is an area on which the light receiving unit of the sensor module is mounted. It may further include a light-shielding partition wall extending to the film, the first region of the pattern layer of the optical film faces the light-emitting region, and the second region of the pattern layer of the optical film faces the light-receiving region. I can.

In addition, the adhesive layer of the optical film may be formed of a material having a low reflectance.

In addition, the adhesive layer of the optical film may be laminated on the base layer of the optical film in a region facing a region other than the light-transmitting region of the cover.

In addition, the adhesive layer of the optical film may be laminated on the base layer of the optical film so as to face the boundary between the first region and the second region of the pattern layer of the optical film.

In addition, in the base layer of the optical film, a gap may be formed between the cover and a region facing the first region and the second region of the pattern layer of the optical film.

In addition, the embodiments disclosed in the present specification and the drawings are provided only to provide specific examples in order to easily describe the technical content according to the embodiments disclosed in this document and to aid understanding of the embodiments disclosed in this document. It is not intended to limit the scope of the embodiment. Therefore, the scope of the various embodiments disclosed in this document is interpreted as being included in the scope of the various embodiments disclosed in this document, in addition to the embodiments disclosed herein, all changes or modified forms derived based on the technical idea of the various embodiments disclosed in this document. It should be.

Claims (15)

1. In the electronic device,

   display;

   A cover facing the display and including a light-transmitting region at least in part;

   A printed circuit board disposed below the cover;

   A sensor module mounted on the printed circuit board so as to face the cover and having a light emitting part and a light receiving part; And

   Including; an optical film disposed between the sensor module and the cover,

   The optical film,

   With the base layer,

   An adhesive layer laminated on at least a portion of the base layer so that the optical film is adhered to the cover,

   An electronic device comprising a pattern layer having at least one pattern stacked on the base layer to face the sensor module and protruding in different directions.
2. The method of claim 1,

   The pattern of the pattern layer of the optical film,

   The electronic device is formed to protrude from the surface of the pattern layer in the form of concentric circles of different diameters.
3. The method of claim 1,

   The pattern layer of the optical film,

   A first area substantially facing the light emitting portion of the sensor module and a second area substantially facing the light receiving portion of the sensor module,

   The first pattern formed in the first region and the second pattern formed in the second region are formed to protrude in different directions with respect to the surface of the pattern layer,

   The first pattern of the pattern layer of the optical film,

   It is formed so that light incident on the first pattern from the light emitting part of the sensor module proceeds in a first direction substantially perpendicular to the extending direction of the pattern layer,

   The second pattern of the pattern layer of the optical film,

   An electronic device formed such that light incident on the second pattern proceeds in a second direction opposite to the first direction and enters the light receiving unit of the sensor module.
4. The method of claim 3,

   The first pattern of the pattern layer of the optical film,

   Each having a first surface and a second surface located farther from the center of the pattern layer than the first surface of the first pattern,

   The angle formed between the first surface of the first pattern and the surface of the pattern layer is smaller than the angle formed between the second surface of the first pattern and the surface of the pattern layer,

   The second pattern of the pattern layer of the optical film,

   Each having a first surface and a second surface located farther from the center of the pattern layer than the first surface of the second pattern,

   An electronic device in which an angle formed between the first surface of the second pattern and the surface of the pattern layer is greater than an angle formed between the second surface of the second pattern and the surface of the pattern layer.
5. The method of claim 4,

   The pattern layer of the optical film,

   The cross section of the first surface of the first pattern is curved,

   The electronic device in which the cross section of the second surface of the second pattern is curved.
6. The method of claim 3,

   The printed circuit board extends from the printed circuit board to the optical film so as to partition a light-emitting area, which is an area where the light-emitting unit of the sensor module is mounted on the printed circuit board, and a light-receiving area, that is an area where the light-receiving unit of the sensor module is mounted on the printed circuit board. It further includes;

   An electronic device in which a first region of the pattern layer of the optical film substantially faces the light-emitting region, and a second region of the pattern layer of the optical film substantially faces the light-receiving region.
7. The method of claim 1,

   The adhesive layer of the optical film,

   An electronic device made of a material with low reflectivity.
8. The method of claim 1,

   The adhesive layer of the optical film,

   An electronic device that is stacked on the base layer of the optical film in a region facing a region other than the light-transmitting region of the cover.
9. The method of claim 2,

   The adhesive layer of the optical film,

   An electronic device stacked on the base layer of the optical film to substantially face a boundary between the first region and the second region of the pattern layer of the optical film.
10. The method of claim 1,

    The base layer of the optical film,

    An electronic device in which a gap is formed between the cover and a region facing the first region and the second region of the pattern layer of the optical film.
11. In the optical film,

    Base layer;

    An adhesive layer laminated on at least a portion of the base layer; And

    An optical film comprising; a pattern layer stacked on the base layer and having at least one pattern formed to protrude in different directions.
12. The method of claim 11,

    The pattern of the pattern layer,

    Optical film formed by protruding from the surface of the pattern layer in the form of concentric circles of different diameters.
13. The method of claim 11,

    The pattern layer,

    Including a first area and a second area,

    The first pattern formed in the first region and the second pattern formed in the second region are formed to protrude in different directions with respect to the surface of the pattern layer,

    The first pattern of the pattern layer is formed so that light incident on the first pattern proceeds in a first direction substantially perpendicular to the extending direction of the pattern layer,

    The second pattern of the pattern layer is an optical film formed such that light incident on the second pattern proceeds in a second direction opposite to the first direction.
14. The method of claim 12,

    The first pattern of the pattern layer,

    Each having a first surface and a second surface located farther from the center of the pattern layer than the first surface of the first pattern,

    The angle formed between the first surface of the first pattern and the surface of the pattern layer is smaller than the angle formed between the second surface of the first pattern and the surface of the pattern layer,

    The second pattern of the pattern layer,

    Each having a first surface and a second surface located farther from the center of the pattern layer than the first surface of the second pattern,

    An angle formed between the first surface of the second pattern and the surface of the pattern layer is greater than an angle formed between the second surface of the second pattern and the surface of the pattern layer.
15. The method of claim 14,

    The pattern layer,

    The angle formed between the second surface of the first pattern and the surface of the pattern layer is 80 degrees or more and 95 degrees or less,

    An angle formed by the first surface of the second pattern layer and the surface of the pattern layer is 80 degrees or more and 95 degrees or less.

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