WO2023234549A1 - Electronic device comprising sensor - Google Patents

Abstract

An electronic device according to various embodiments of the present invention comprises: a window arranged on a surface of the electronic device that faces towards a first direction; a frame comprising a sensor mount having an opening formed towards the first direction, inside the electronic device; and an imaging sensor which senses an optical signal incident from a second direction opposite to the first direction, and which is positioned on the sensor mount in order to face a surface of the window that faces towards the second direction, wherein the imaging sensor may comprise: an optical sensor (526) for converting the optical signal to an electrical signal; an optical system which has an optical open surface and an optical axis arranged to face towards the first direction, and which delivers the optical signal to the optical sensor (526); and a sensor holder part which extends from the open surface of the optical system, in the radial direction from the optical system, and which absorbs light incident in a direction comprising a second direction component, and which is fixed with respect to the sensor mount so as to fix the imaging sensor to the frame.

Description

Electronic devices containing sensors

Various embodiments of the present invention relate to electronic devices, and more particularly, to electronic devices including sensors.

Electronic devices may include various optical imaging sensors that recognize light, such as cameras, ambient light sensors, and/or biometric sensors. When using an electronic device, the optical imaging sensor detects various optical signals coming from the direction in which the image on the display is displayed through an optical system and an optical detector, and receives various information including image information and biometric authentication information from the surroundings of the electronic device. can be collected and utilized. Recently, in order to maximize the display area of information within the limited form factor of electronic devices, especially portable electronic devices, the optical imaging sensors are increasingly placed at the bottom of the display.

In particular, the method of using the user's fingerprint to perform biometric authentication for the user is increasing. Fingerprints have the advantage of not being inconvenient to possess, having a low risk of theft or counterfeiting, and not changing much throughout one's life. Fingerprint recognition devices that acquire such fingerprint images include optical fingerprint recognition devices and ultrasonic fingerprint recognition devices. An optical fingerprint recognition device can perform biometric authentication of a user by detecting light emitted from a display that is reflected and incident on a fingerprint.

When the optical imaging sensor disposed at the bottom of the display performs a light detection operation, stray light reflected from the frame-like structure disposed at the bottom of the display and around the optical imaging sensor flows into the optical imaging sensor, causing ghosting and flare. and/or may degrade image quality by generating various optical side effects such as halation. To prevent this, when applying a separate light-absorbing paint or placing a light-absorbing member around the optical imaging sensor, separate materials and processes are required for the application or placement of the member, which may increase the manufacturing cost of the electronic device. You can.

Electronic devices according to various embodiments of the present invention can improve the quality of optical imaging sensors.

An electronic device according to various embodiments of the present invention includes a window disposed on a side of the electronic device facing a first direction, and a sensor mount having an opening formed inside the electronic device toward the first direction. an imaging sensor positioned on the sensor mount to detect an optical signal incident from a frame and a second direction opposite to the first direction, and to face a surface of the window facing the second direction, the imaging sensor , an optical sensor 526 that converts the optical signal into an electrical signal, an optical system having an optical axis and an optical aperture oriented to face the first direction, and transmitting the optical signal to the optical sensor 526, and the optical system a sensor holder portion that extends in a radial direction from the optical system from the opening surface of the light, absorbs incident light in a direction including the second direction component, and is fixed to the sensor mount to secure the imaging sensor to the frame. It can be included.

In some embodiments, the electronic device may be disposed below the window and include a display panel that displays an image in the first direction, and the frame and the imaging sensor unit may be located below the display panel. In some embodiments, the sensor holder unit may include a light absorbing material that absorbs at least one of visible light, ultraviolet light, or infrared light.

In some embodiments, the imaging sensor includes a barrel 527 that supports the optical system, and the sensor holder portion may be molded integrally with the barrel 527. In another embodiment, at least a portion of the surface of the sensor holder portion facing the second direction may be roughened. In another embodiment, the sensor mount of the frame includes a first adhesive surface, and the sensor holder portion includes a second adhesive surface facing the first adhesive surface, and between the first and second adhesive surfaces. An adhesive member that adheres the first and second adhesive surfaces to each other may be positioned.

In some embodiments, the frame may include a coupling hole formed in a peripheral portion of the sensor mount, and the sensor holder may include a coupling pole that penetrates the coupling hole when coupled to the sensor mount. In some embodiments, the sensor holder part may be fixed to the frame by having a front end of the coupling pole fused to the frame while penetrating the coupling hole. In another embodiment, the coupling pole includes a snap hook located at a distal end of the coupling pole, and the snap hook is elastically deformed when passing through the coupling hole, thereby being snap-fastened to the frame.

In some embodiments, the sensor holder part is formed on the outer periphery of the sensor holder part around the optical axis, and includes a snap hook that is elastically deformed and snap-fastened to the frame when the sensor holder part passes through the opening of the sensor mount. can do.

An imaging sensor according to other embodiments of the present invention includes a sensor mount having a window disposed on a side of the electronic device facing a first direction and an opening formed inside the electronic device toward the first direction. An imaging sensor located on the sensor mount of an electronic device including a frame, wherein the imaging sensor includes an optical sensor 526 that converts the optical signal into an electrical signal, an optical axis oriented to face the first direction, and an optical aperture. An optical system having a spherical surface, transmitting the optical signal to the optical sensor 526, extending in a radial direction from the optical system from the opening surface of the optical system, and absorbing light incident in a direction including the second direction component. and may include a sensor holder portion that secures the imaging sensor to the frame by being fixed to the sensor mount.

An electronic device including a biometric authentication device according to various embodiments can improve the image quality of the optical imaging sensor by reducing stray light flowing into the optical aperture of the optical imaging sensor by including a light absorption member integrated with the optical imaging sensor. there is.

In addition, since the light absorption member of the present invention is integrated with the optical imaging sensor, no separate process for its arrangement is required, and thus an increase in the manufacturing cost of the electronic device can be suppressed.

In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

Figure 2 is a perspective view of the front of an electronic device according to one embodiment.

FIG. 3 is a perspective view of the rear of the electronic device of FIG. 2 according to one embodiment.

FIG. 4 is an exploded view of the electronic device of FIG. 2 according to an embodiment.

Figure 5A is an enlarged perspective view showing a frame of an electronic device according to various embodiments of the present invention.

Figure 5b is a perspective view showing an imaging sensor of an electronic device according to various embodiments of the present invention.

Figure 5C is a cross-sectional view showing an imaging sensor of an electronic device according to various embodiments of the present invention.

Figure 6 is a cross-sectional view showing an imaging sensor according to other embodiments of the present invention.

Figure 7 is a cross-sectional view showing an imaging sensor according to other embodiments of the present invention.

8A and 8B are cross-sectional views showing an imaging sensor and a frame of an electronic device according to various embodiments.

9A to 9C are cross-sectional views showing the combination of an imaging sensor and a frame of an electronic device according to various embodiments of the present invention.

FIG. 9D is a cross-sectional view showing an imaging sensor and a frame of an electronic device according to other embodiments.

10A and 10B are cross-sectional views showing an imaging sensor and a frame of an electronic device according to various embodiments of the present invention.

11A and 11B are cross-sectional views showing an imaging sensor and a frame of an electronic device according to various embodiments of the present invention.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit (NPU) : neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Figure 2 is a perspective view of the front of the electronic device 101 according to one embodiment. FIG. 3 is a perspective view of the rear of the electronic device 101 of FIG. 2 according to one embodiment.

Referring to FIGS. 2 and 3, in one embodiment, the electronic device 101 (e.g., the electronic device 101 of FIG. 1) has a first side (or front) 210A and a second side (or back). It may include a housing 210 including (210B), and a side (210C) surrounding the space between the first side (210A) and the second side (210B). In some embodiments, the housing 210 may refer to a structure that forms at least a portion of the first side 210A, the second side 210B, and the side 210C. The first surface 210A may be formed at least in part by a substantially transparent front window (or first plate) 201 (eg, a glass plate including various coating layers, or a polymer plate). The second surface 210B may be formed by a substantially opaque back plate (or second plate) 202. Back plate 202 may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can. Side 210C may be formed by a side bezel structure (or “side member”) 203 coupled with front window 201 and rear plate 202, wherein side bezel structure 203 is made of metal and/or May contain polymers. In some embodiments, back plate 202 and side bezel structure 203 may be formed as a single piece and may include the same material (eg, a metallic material such as aluminum).

In one embodiment, the front window 201 may include two first regions 210D that are curved and seamlessly extended from the first surface 210A toward the rear plate 202. The first areas 210D may be formed adjacent to both long edges of the front window 201, respectively. The rear plate 202 may include two second regions 210E that are curved and extend seamlessly from the second surface 210B toward the front window 201. The second regions 210E may be formed adjacent to both long edges of the rear plate 202, respectively. The side 210C has a first thickness (or width) (e.g., height in the z-axis direction) on the side where the first regions 210D and the second regions 210E are not located, and the first regions 210D and 210E have a first thickness (or width) (e.g., height in the z-axis direction) The second areas 210D and 210E may have a second thickness that is smaller than the first thickness. In some embodiments, the front window 201 may be implemented including one of the first areas 210D or may be implemented without the curved first areas 210D. In some embodiments, the back plate 202 may be implemented including one of the second regions 210E, or may be implemented without the curved second regions 210E.

According to one embodiment, the electronic device 101 includes a display 301, a first audio module 302, a second audio module 303, a third audio module 304, a fourth audio module 305, Sensor module 306a, first camera module 307, plurality of second camera modules 308, light emitting module 309, input module 310, first connection terminal module 311, or second connection It may include at least one of the terminal modules 312. In some embodiments, the electronic device 101 may omit at least one of the above components or may additionally include other components.

The display area (eg, screen display area or active area) of the display 301 may be visually exposed through, for example, the front window 201. In one embodiment, the electronic device 101 may be implemented to maximize the display area visible through the front window 201 (e.g., large screen or full screen). For example, the display 301 may be implemented to have an outline that is substantially the same as that of the front window 201. For another example, the distance between the outer edge of the display 301 and the outer edge of the front window 201 may be substantially the same. In one embodiment, display 301 may include touch sensing circuitry. In some embodiments, the display 301 may include a pressure sensor capable of measuring the intensity (pressure) of touch. In some embodiments, the display 301 may be coupled to or positioned adjacent to a digitizer (e.g., electromagnetic induction panel) that detects a magnetic pen (e.g., stylus pen).

The first audio module 302 may include, for example, a first microphone located inside the electronic device 101, and a first microphone hole formed on the side 210C to correspond to the first microphone. The second audio module 303 includes, for example, a second microphone (or second microphone module) located inside the electronic device 101, and a second microphone formed on the second surface 210B corresponding to the second microphone. 2 May include a microphone hole. The location or number of audio modules relative to the microphone is not limited to the example shown and may vary. In some embodiments, the electronic device 101 may include a plurality of microphones used to detect the direction of sound.

The third audio module 304 includes, for example, a first speaker (or first speaker module) located inside the electronic device 101, and a first speaker formed on the side 210C corresponding to the first speaker. May include holes. The fourth audio module 305 includes, for example, a second speaker (or second speaker module) located inside the electronic device 101, and a first speaker formed on the first surface 210A corresponding to the second speaker. 2 May include speaker holes. In one embodiment, the first speaker may include an external speaker. In one embodiment, the second speaker may include a receiver for a call, and the second speaker hall may be referred to as a receiver hall. The location or number of the third audio module 304 or the fourth audio module 305 is not limited to the illustrated example and may vary. In some embodiments, the microphone hall and speaker hall may be implemented as one hall. In some embodiments, the third audio module 304 or the fourth audio module 305 may include a piezo speaker without a speaker hole.

For example, the sensor module 306a may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. In one embodiment, the sensor module 306a may include an optical sensor located inside the electronic device 101 corresponding to the first surface 210A. Optical sensors may include, for example, proximity sensors or light sensors. The optical sensor may be aligned with an opening formed in display 301. External light may enter the optical sensor through the opening of the front window 201 and the display 301. In some embodiments, the optical sensor may be disposed at the bottom of the display 301 and may perform its associated function without the location of the optical sensor being visually distinguishable (or exposed). For example, the optical sensor may be located on the back of display 301, or below or beneath display 301. In some embodiments, the optical sensor may be positioned aligned with a recess formed on the back of the display 301. The optical sensor is arranged to overlap at least a portion of the screen and can perform a sensing function without being exposed to the outside. In this case, some areas of the display 301 that at least partially overlap the optical sensor may include different pixel structures and/or wiring structures than other areas. For example, some areas of the display 301 that at least partially overlap the optical sensor may have a different pixel density than other areas. In some embodiments, a plurality of pixels may not be disposed in some areas of the display 301 that at least partially overlap the optical sensor. In some embodiments, electronic device 101 may include a biometric sensor (eg, fingerprint sensor 306b) located below display 301. Biometric sensors may be implemented in an optical or ultrasonic manner, and their location or number may vary. The electronic device 101 may include various other sensor modules, such as a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a temperature sensor, or a humidity sensor. It may include at least one more.

The first camera module 307 (eg, front camera module) may be located inside the electronic device 101, for example, corresponding to the first side 210A. A plurality of second camera modules 308 (eg, rear camera modules) may be located inside the electronic device 101, for example, corresponding to the second side 210B. The first camera module 307 and/or the plurality of second camera modules 308 may include one or more lenses, an image sensor, and/or an image signal processor. The location or number of the first camera module or the second camera module is not limited to the illustrated example and may vary.

According to one embodiment, the display 301 may include an opening aligned with the first camera module 307. External light can reach the first camera module 307 through the opening of the front window 201 and the display 301. In some embodiments, the opening of the display 301 may be formed in the shape of a notch depending on the position of the first camera module 307. In some embodiments, the first camera module 307 may be disposed at the bottom of the display 301, where the location of the first camera module 307 is not visually distinguishable (or exposed) and may display related functions (e.g., images). shooting) can be performed. For example, the first camera module 307 may be located on the back of the display 301, or below or beneath the display 301, and may be used as a hidden display rear camera (e.g., under display camera (UDC)). ))) may be included. In some embodiments, the first camera module 307 may be positioned aligned with a recess formed on the back of the display 301. The first camera module 307 is arranged to overlap at least a portion of the screen and can obtain an image of an external subject without being visually exposed to the outside. In this case, some areas of the display 301 that at least partially overlap the first camera module 307 may include different pixel structures and/or wiring structures than other areas. For example, some areas of the display 301 that at least partially overlap the first camera module 307 may have a different pixel density than other areas. The pixel structure and/or wiring structure formed in a portion of the display 301 that at least partially overlaps the first camera module 307 may reduce light loss between the outside and the first camera module 307. In some embodiments, pixels may not be disposed in some areas of the display 301 that at least partially overlap the first camera module 307. In some embodiments, the electronic device 101 may further include a light emitting module (eg, a light source) located inside the electronic device 101 corresponding to the first surface 210A. For example, the light emitting module may provide status information of the electronic device 101 in the form of light. In some embodiments, the light emitting module may provide a light source linked to the operation of the first camera module 307. The light emitting module may include, for example, an LED, an IR LED, or a xenon lamp.

According to one embodiment, the plurality of second camera modules 308 may have different properties (eg, angle of view) or functions, and may include, for example, dual cameras or triple cameras. The plurality of second camera modules 308 may include a plurality of camera modules including lenses having different angles of view, and the electronic device 101 may operate the electronic device 101 based on the user's selection. It can be controlled to change the angle of view of the camera module being performed. The plurality of second camera modules 308 are at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). may include. In some embodiments, an IR camera may operate as at least part of a sensor module. The light emitting module 309 (eg, flash) may include a light source for a plurality of second camera modules 308. The light emitting module 309 may include, for example, an LED or xenon lamp.

Input module 310 may include, for example, one or more key input devices. One or more key input devices may be located, for example, in an opening formed in side 210C. In some embodiments, the electronic device 101 may not include some or all of the key input devices, and the key input devices not included may be implemented as soft keys using the display 301. The location or number of input modules 310 may vary, and in some embodiments, input module 310 may include at least one sensor module.

The first connection terminal module (e.g., a first connector module or a first interface terminal module) 311 is, for example, a first connector located inside the electronic device 101. (or a first interface terminal), and a first connector hole formed on the side 210C corresponding to the first connector. The second connection terminal module (e.g., a second connector module or a second interface terminal module) 312 is, for example, a second connector (or a second interface terminal) located inside the electronic device 101, And it may include a second connector hole formed on the side surface 210C corresponding to the second connector. The electronic device 101 may transmit and/or receive power and/or data from an external electronic device electrically connected to the first connector or the second connector. In one embodiment, the first connector may include a universal serial bus (USB) connector or a high definition multimedia interface (HDMI) connector. In one embodiment, the second connector may include an audio connector (eg, a headphone connector or an earset connector). The location or number of connection terminal modules is not limited to the example shown and may vary.

FIG. 4 is an exploded view of the electronic device 101 of FIG. 2 according to an embodiment.

Referring to FIG. 4 , in one embodiment, the electronic device 101 includes a front window 201, a back plate 202, a side bezel structure 203, a first support member 410, and a second support member 420. ), a third support member 430, a display 301, a first substrate assembly 440, a second substrate assembly 450, a battery 460, or an antenna structure 470. In some embodiments, the electronic device 101 may omit at least one of the above components (eg, the second support member 420 or the third support member 430) or may additionally include other components.

For example, the first support member 410 may be located inside the electronic device 101 and connected to the side bezel structure 203, or may be formed integrally with the side bezel structure 203. The first support member 410 may be formed of, for example, a metallic material and/or a non-metallic material (eg, polymer). In one embodiment, the conductive portion included in the first support member 410 may serve as electromagnetic shielding for the display 301, the first substrate assembly 440, and/or the second substrate assembly 450. . It may be referred to as a front frame 400, including a first support member 410 and a side bezel structure 203. The first support member 410 is a part of the front frame 400 where components such as the display 301, the first substrate assembly 440, the second substrate assembly 450, or the battery 460 are placed, and is used for electronic It may contribute to the durability or rigidity (e.g., torsional rigidity) of device 101. Hereinafter, the first support member 410 may be referred to as a support structure (eg, a bracket or mounting plate). In some embodiments, the front frame 400 is formed in an area corresponding to the positions of the first camera module 307, the sensor module 306b, and the biometric sensor (e.g., the fingerprint sensor 306b) and is positioned on the front of the electronic device (e.g., It may include sensor mounts 411a and 411b having openings facing the z direction.

Display 301 may be positioned between support structure 410 and front window 201 , for example, and may be disposed on one side of support structure 410 . The first substrate assembly 440 and the second substrate assembly 450 may be positioned, for example, between the support structure 410 and the back plate 202 and may be disposed on the other side of the support structure 410. there is. Battery 460 may be positioned between support structure 410 and back plate 202 and disposed in support structure 410 , for example.

According to one embodiment, the first substrate assembly 440 may include a first printed circuit board 441 (eg, printed circuit board (PCB), or printed circuit board assembly (PBA)). The first board assembly 440 may include various electronic components electrically connected to the first printed circuit board 441. The electronic components may be placed on the first printed circuit board 441 or may be electrically connected to the first printed circuit board 441 through an electrical path such as a cable or a flexible printed circuit board (FPCB). Referring to Figures 2 and 3, the electronic components include, for example, a second microphone included in the second audio module 303, a second speaker included in the fourth audio module 305, a sensor module 306a, It may include a first camera module 307, a plurality of second camera modules 308, a light emitting module 309, or an input module 310.

According to one embodiment, the second substrate assembly 450 is, when viewed from above the front window 201 (e.g., when viewed in the -z axis direction), the first substrate assembly 440 with the battery 460 interposed therebetween. ) can be placed separately from the The second substrate assembly 450 may include a second printed circuit board 442 electrically connected to the first printed circuit board 441 of the first substrate assembly 440 . The second board assembly 450 may include various electronic components electrically connected to the second printed circuit board 442. The electronic components may be placed on the second printed circuit board 442 or may be electrically connected to the second printed circuit board 442 through an electrical path such as a cable or FPCB. 2 and 3, the electronic components include, for example, a first microphone (or first microphone module) included in the first audio module 302, a first microphone included in the third audio module 304, and It may include a speaker, a first connector included in the first connection terminal module 311, a second connector included in the second connection terminal module 312, and/or a fingerprint sensor 306b.

According to some embodiments, the first substrate assembly 440 or the second substrate assembly 450 includes a main PCB, a slave PCB partially overlapping with the main PCB, and/or an interposer substrate between the main PCB and the slave PCB. may include an interposer substrate).

The battery 460 is a device for supplying power to at least one component of the electronic device 101 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . The battery 460 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.

According to one embodiment, the second support member 420 may be positioned between the support structure 410 and the back plate 202 and may be coupled to the support structure 410 using fastening elements such as bolts. . At least a portion of the first substrate assembly 440 may be positioned between the support structure 410 and the second support member 420, where the second support member 420 covers and protects the first substrate assembly 440. can do. When viewed from above the rear plate 202 (e.g., when viewed in the +z axis direction), the third support member 430 is at least partially spaced apart from the second support member 420 with the battery 460 interposed therebetween. can be located The third support member 430 may be positioned between the support structure 410 and the back plate 202 and may be coupled to the support structure 410 using fastening elements such as bolts. At least a portion of the second substrate assembly 450 may be positioned between the support structure 410 and the third support member 430, where the third support member 430 covers and protects the second substrate assembly 450. can do. The second support member 420 and/or the third support member 430 may be formed of a metallic material and/or a non-metallic material (eg, polymer). In some embodiments, the second support member 420 serves as an electromagnetic shield for the first substrate assembly 440 and the third support member 430 serves as an electromagnetic shield for the second substrate assembly 450. can do. In some embodiments, the second support member 420 and/or the third support member 430 may be referred to as a rear case.

According to some embodiments, an integrated substrate assembly including the first substrate assembly 440 and the second substrate assembly 450 may be implemented. For example, when viewed from above the back plate 202 (e.g., when viewed in the +z axis direction), the substrate assembly includes a first portion and a second portion positioned spaced apart from each other with a battery 460 therebetween, and It may include a third portion extending between the battery 460 and the side bezel structure 203 and connecting the first portion and the second portion. In this case, all support members including the second support member 420 and the third support member 430 may be implemented.

According to one embodiment, the antenna structure 470 may be positioned between the second support member 420 and the back plate 202. In some embodiments, antenna structure 470 may be located between battery 460 and back plate 202. The antenna structure 470 may be implemented in a film form, such as an FPCB, for example. The antenna structure 470 may include at least one conductive pattern used as a loop-type radiator. For example, the at least one conductive pattern may include a planar spiral conductive pattern (eg, a planar coil or a pattern coil). In one embodiment, at least one conductive pattern included in the antenna structure 470 may be electrically connected to a wireless communication circuit (or wireless communication module) included in the first substrate assembly 440. For example, at least one conductive pattern may be utilized in short-range wireless communication such as near field communication (NFC). As another example, at least one conductive pattern may be utilized in magnetic secure transmission (MST) for transmitting and/or receiving magnetic signals. In some embodiments, at least one conductive pattern included in the antenna structure 470 may be electrically connected to a power transmission/reception circuit included in the first substrate assembly 440. The power transmission/reception circuit may wirelessly receive power from an external electronic device or transmit power wirelessly to an external electronic device using at least one conductive pattern. The power transmission/reception circuit may include a power management module, for example, a power management integrated circuit (PMIC), or a charger integrated circuit (IC). The power transmission/reception circuit can charge the battery 460 using power received wirelessly using a conductive pattern.

According to one embodiment, the electronic device 101 has a bar-type or plate-type appearance, but is not limited thereto. For example, the illustrated electronic device 101 may be a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device ( It may be part of a rollable electronic device.

The electronic device 101 may further include various components depending on the form in which it is provided. These components cannot be all listed as their variations vary according to the convergence trend of the electronic device 101, but components equivalent to the above-mentioned components may be added to the electronic device 101. may be included. In various embodiments, certain components may be excluded from the above-described components or replaced with other components depending on the form of provision.

FIG. 5A is an enlarged perspective view showing a frame 501 of an electronic device according to various embodiments of the present invention.

FIG. 5B is a perspective view showing an imaging sensor 520 of an electronic device according to various embodiments of the present invention.

FIG. 5C is a cross-sectional view showing an imaging sensor 520 of an electronic device according to various embodiments of the present invention.

FIG. 5A is an enlarged view of area A of FIG. 4, and the cross section of FIG. 5C is a cross section taken along the B-B' direction of FIG. 5.

Referring to FIG. 5A, a frame 501 (e.g., front frame 400 of FIG. 4) of an electronic device (e.g., electronic device 200 of FIGS. 2 to 4) 501 includes a sensor mount 510 (e.g., FIG. It includes four sensor mounts 510 (411a, 411b), and an imaging sensor 520 (eg, sensor module 306a and fingerprint sensor 306b in FIG. 2) may be located in the sensor mount 510. The sensor mount 510 may have an opening formed through the frame 501 in the first direction of the electronic device. The shape of the sensor mount 510 is similar to the sensor holder portion of the imaging sensor 520, which will be described later. It may have a shape corresponding to the shape of 530. The imaging sensor 520 and the frame 501 may be located at the bottom (-z direction) of the window of the electronic device (e.g., the front window 201 in FIG. 4). In another embodiment, the imaging sensor 520 may be disposed below the display of the electronic device (for example, the display 301 of FIG. 2). The back of the display has a high reflectivity to improve the brightness of the display, There may be a high possibility that light introduced through the window is reflected between the frame 501 and the back of the display and flows as stray light or ambient light into the optical opening surface 523 of the imaging sensor 520. Therefore, there may be a high possibility that it will be reflected between the frame 501 and the back of the display. When the disposed imaging sensor 520 includes the sensor holder unit 530 of the present invention, the effect of improving image quality is high.

Referring to FIGS. 5B and 5C , the imaging sensor 520 may include an optical system 521, an optical sensor 526, an optical barrel 527, and a sensor holder unit 530. The imaging sensor 520 may be a device that forms an image from an optical signal flowing from a first direction through the optical system 521 and reads the image in the form of an electrical signal through the optical sensor 526. The optical system 521 includes at least one optical element ( optical element) (521a, 521b, 521c, 521d, 521e). The optical elements 521a, 521b, 521c, 521d, and 521e may include, for example, lenses, aspherical lenses, Fresnel lenses, spherical or aspherical reflectors. The optical axis 522 of the optical system 521 is aligned in a direction including the front direction (e.g., z-axis direction) or the front direction component of the electronic device, and the optical aperture surface 523 of the optical system 521 is aligned in the front direction of the electronic device. It can be opened in the z-axis direction (for example). The barrel 527 may be a member that fixes at least one optical element 521a, 521b, 521c, 521d, and 521e of the optical system 521. In some embodiments, the lens barrel 527 may be fixed to the optical sensor 526 within the imaging sensor 520, but in other embodiments, the barrel 527 may be movable in the direction of the optical axis 522 (e.g., z-axis direction). You can.

The optical sensor 526 may be an element that receives the optical signal image transmitted and formed by the optical system 521 and converts it into an electrical signal. The optical sensor 526 may include a CCD, CMOS, or stacked image sensor. In some embodiments, the imaging sensor 520 may include a cable 524 and a connector 525 for transmitting the output signal of the optical sensor 526.

The sensor holder unit 530 may be a member that is combined with the sensor mount 510 to fix the imaging sensor 520 and reduce stray light from entering the optical system 521 . The sensor holder portion 530 may have a shape corresponding to the opening of the sensor mount 510. The sensor holder portion 530 may extend radially around the optical axis 522 to the periphery of the optical system 521 . In some embodiments, the sensor holder unit 530 may extend radially and upward from the periphery of the optical system 521, that is, in a direction toward the window of the electronic device. The sensor holder unit 530 receives light that passes through the window and enters the interior of the electronic device, that is, when ambient light or miscellaneous light excluding the optical signal that the imaging sensor 520 wants to detect is incident on the periphery of the optical system 521. By absorbing and/or blocking this, optical defects caused by stray light such as flare or ghosting occurring in the imaging sensor 520 can be reduced, thereby improving the image quality of the optical signal detected by the imaging sensor 520. The light band absorbed by the sensor holder unit 530 may include infrared rays, visible rays, and/or ultraviolet rays.

The sensor holder portion 530 may be molded from a light absorbing material. The light absorbing material may include a light absorbing pigment that absorbs light in the infrared, visible, and/or ultraviolet bands, such as black resin, mixed with the resin composition. Light absorbing pigments may include, for example, lamp black, carbon black, carbon fiber, magnetite, manganese dioxide, fullerene, and/or carbon nanotubes. In some embodiments, the light absorbing material may include a composite material in which black resin is impregnated with reinforcing fibers such as carbon fibers or aramid fibers. As the sensor holder part 530 is molded from a light absorbing material, the need to apply a separate paint for light absorption to the molded sensor holder part 530 is reduced, so the manufacturing process of the sensor holder part 530 can be simplified. there is.

In some embodiments, the upper surface 530a of the sensor holder portion 530, that is, the surface facing the direction passing through the window of the electronic device (eg, -z direction), may be roughened. For example, the upper surface 530a of the sensor holder portion 530 may have a plurality of fine irregularities. The roughened upper surface 530a may improve image quality by further increasing absorption of stray or ambient light.

Figure 6 is a cross-sectional view showing an imaging sensor 520 according to other embodiments of the present invention.

Referring to FIG. 6 , the sensor holder portion 530 of the imaging sensor 520 may be integrally molded with the barrel 527. Since the sensor holder portion 530 is integrally molded with the barrel 527, the manufacturing cost can be reduced and the assembly process can be simplified compared to an embodiment in which the sensor holder portion 530 and the barrel 527 are molded separately. In addition, when the barrel 527 and the sensor holder portion 530 are integrally molded with a single light-absorbing material, the diffuse reflection and scattering of light inside the barrel 527 can be suppressed due to the light-absorbing material, so that the imaging sensor The image quality of 520 can be improved. When the sensor holder portion 530 is integrally molded with the barrel 527, the optical system 521 is configured to have a fixed focus as in the case of a fingerprint recognition sensor (e.g., the fingerprint sensor 306b in FIG. 2). It may be configured to have a hyperfocal distance below the intended usage distance range.

Figure 7 is a cross-sectional view showing an imaging sensor 520 according to other embodiments of the present invention.

Referring to FIG. 7, a plurality of ribs 531 are formed on the upper surface 530a of the sensor holder portion 530 of the imaging sensor 520, that is, on the surface facing the direction passing through the window of the electronic device (for example, -z direction). ) can be formed. The plurality of ribs 531 may be formed concentrically along the periphery of the optical opening surface 523 of the optical system 521, for example, on the upper surface 530a of the sensor holder portion 530. The rib 531 may be a wrinkle-shaped member having various cross-sections such as square, triangular, or stepped. By including a plurality of ribs 531 on the upper surface 530a of the sensor holder portion 530, the stray light passing through the window and incident on the peripheral part of the optical system 521 is at least partially blocked by the ribs 531, The inflow into (521) can be further reduced.

FIGS. 8A and 8B are cross-sectional views showing an imaging sensor 520 and a frame 501 of an electronic device according to various embodiments.

Referring to FIGS. 8A and 8B, the sensor mount 510 of the frame 501 includes a first adhesive surface 512, and the sensor holder portion 530 has a second adhesive surface facing the first adhesive surface 512. It includes a surface 532, and an adhesive member 513 may be positioned between the first adhesive surface 512 and the second adhesive surface 532. The adhesive member 513 may include, for example, an adhesive tape such as a double-sided tape, a foam tape, or various adhesives such as an epoxy resin or acrylic resin. By being bonded by the adhesive member 513, the imaging sensor 520 can be joined to the frame 501 in a simplified process without a separate coupling member, thereby reducing the cost of the electronic device. The first adhesive surface 512 may be formed on the lower or upper surface of the frame 501, and the imaging sensor 520 may be coupled from the lower or upper surface of the frame 501.

9A to 9C are cross-sectional views showing the combination of an imaging sensor 520 and a frame 501 of an electronic device according to various embodiments of the present invention.

FIG. 9D is a cross-sectional view showing an imaging sensor 520 and a frame 501 of an electronic device according to other embodiments.

9A and 9B, the frame 501 includes a coupling hole 514 formed on the periphery of the sensor mount 510, and the sensor holder portion 530 is located at a position corresponding to the coupling hole 514. When the sensor holder portion 530 is coupled to the sensor mount 510 of the frame 501, it may include a coupling pole 533 (pole) penetrating the coupling hole 514. The coupling pole 533 may be inserted into the coupling hole 514 to reinforce the coupling between the frame 501 and the imaging sensor 520. In some embodiments, the coupling pole 533 and the coupling hole 514 may be coupled by interference fitting, but referring to FIG. 9C, in another embodiment, the front end of the coupling pole 533 penetrates the coupling hole 514. (533a) is fused to the surface of the frame 501, so that the coupling pole 533 and the coupling hole 514 can be more firmly coupled. Referring to FIGS. 9C and 9D , in some embodiments, the imaging sensor 520 may be coupled from the bottom to the top of the frame 501, or from the top to the bottom.

10A and 10B are cross-sectional views showing an imaging sensor 520 and a frame 501 of an electronic device according to various embodiments of the present invention.

Referring to FIGS. 10A and 10B , the coupling pole 533 may include a first snap hook located at the distal end of the coupling pole 533 . The first snap hook 534 may be, for example, a cantilever-type snap hook extending from the front end of the coupling pole 533 and including an elastically deformable cantilever 534a. The first snap hook is elastically deformed within the coupling hole 514 when the imaging sensor 520 is coupled to the frame 501, and when it passes through the coupling hole 514, the elastic deformation is released and the first snap hook is attached to the coupling hole 514. Can be snapped together. According to the embodiment of FIGS. 11A and 11B, the imaging sensor 520 and the frame 501 are coupled by snap coupling without applying a separate coupling means, thereby simplifying the manufacturing process of the electronic device.

FIGS. 11A and 11B are cross-sectional views showing an imaging sensor 520 and a frame 501 of an electronic device according to various embodiments of the present invention.

Referring to FIGS. 11A and 11B , the sensor holder portion 530 may include a second snap hook formed at a peripheral portion of the sensor holder with respect to the optical axis 522 . The second snap hook may be elastically deformed when the sensor holder portion 530 passes through the opening of the sensor mount 510 and then snap-coupled to the sensor mount 510 by releasing the elastic deformation. In some embodiments, the sensor mount 510 includes a locking protrusion 515 formed inside the opening, and the second snap hook can be fixed by being snap-coupled to the locking protrusion 515. According to the embodiment of FIGS. 11A and 11B, the imaging sensor 520 and the frame 501 are coupled by snap coupling without applying a separate coupling means, thereby simplifying the manufacturing process of the electronic device. Additionally, since the snap hook is adjacent to the sensor holder portion 530, the strength and stability of the snap connection can be further improved.

In addition, the embodiments of the present invention disclosed in the specification and drawings are merely presented as specific examples to easily explain the technical content according to the embodiments of the present invention and to aid understanding of the embodiments of the present invention, and are not limited to the scope of the embodiments of the present invention. It is not intended to limit it. Therefore, the scope of the various embodiments of the present invention should be construed as including all changes or modified forms derived based on the technical idea of the various embodiments of the present invention in addition to the embodiments disclosed herein.

Claims (15)

1. In electronic devices,

   a window disposed on a side of the electronic device facing a first direction;

   Inside the electronic device, a frame including a sensor mount having an opening formed toward the first direction; and

   An imaging sensor detecting an optical signal incident from a second direction opposite to the first direction, and positioned on the sensor mount to face a surface of the window facing the second direction;

   The imaging sensor is,

   an optical sensor that converts the optical signal into an electrical signal;

   an optical system having an optical axis and an optical aperture oriented to face the first direction and transmitting the optical signal to the optical sensor;

   A sensor that extends in a radial direction from the opening surface of the optical system, absorbs incident light in a direction including the second direction component, and is fixed with respect to the sensor mount, thereby securing the imaging sensor to the frame. An electronic device including a holder unit.
2. According to clause 1,

   The sensor holder part is an electronic device including a light absorbing material that absorbs at least one of visible light, ultraviolet ray, or infrared ray.
3. According to claim 1,

   The imaging sensor includes a barrel supporting the optical system,

   An electronic device wherein the sensor holder portion is integrally molded with the lens barrel.
4. According to claim 1,

   The sensor holder portion is an electronic device in which at least a portion of a surface facing the second direction is roughened.
5. According to clause 1,

   The sensor holder portion includes at least one rib formed on a surface facing the second direction.
6. According to clause 1,

   The sensor mount of the frame includes a first adhesive surface,

   The sensor holder portion includes a second adhesive surface facing the first adhesive surface,

   An electronic device wherein an adhesive member for adhering the first and second adhesive surfaces to each other is positioned between the first and second adhesive surfaces.
7. According to clause 1,

   The frame includes a coupling hole formed on the periphery of the sensor mount,

   The sensor holder part includes a coupling pole that penetrates the coupling hole when coupled to the sensor mount, and secures the sensor holder part to the frame by having a tip fused to the frame while penetrating the coupling hole. electronic device that does.
8. According to clause 7,

   The coupling pole includes a snap hook located at the front end of the coupling pole,

   The electronic device is snap-fastened to the frame by elastically deforming the snap hook when it passes through the coupling hole.
9. a window disposed on a side of the electronic device facing a first direction; and

   In the imaging sensor located on the sensor mount of the electronic device, including a frame including a sensor mount having an opening formed toward the first direction, inside the electronic device,

   The imaging sensor is,

   an optical sensor that converts the optical signal into an electrical signal;

   an optical system having an optical axis and an optical aperture oriented to face the first direction and transmitting the optical signal to the optical sensor;

   A sensor that extends in a radial direction from the opening surface of the optical system, absorbs incident light in a direction including the second direction component, and is fixed with respect to the sensor mount, thereby securing the imaging sensor to the frame. An imaging sensor including a holder unit.
10. According to clause 9,

    The sensor holder portion is an imaging sensor including a light-absorbing material that absorbs at least one of visible light, ultraviolet ray, or infrared ray.
11. According to clause 9,

    Includes an optical barrel supporting the optical system,

    An imaging sensor wherein the sensor holder portion is integrally molded with the lens barrel.
12. According to clause 9,

    The sensor holder portion is an imaging sensor in which at least a portion of a surface facing the second direction is roughened.
13. According to clause 9,

    The sensor holder portion is an imaging sensor including at least one rib formed on a surface facing the second direction.
14. According to clause 9,

    The frame of the electronic device includes a coupling hole formed on the periphery of the sensor mount,

    The sensor holder part includes a coupling pole that penetrates the coupling hole when coupled to the sensor mount, and secures the sensor holder part to the frame by having a tip fused to the frame while penetrating the coupling hole. imaging sensor.
15. According to clause 14,

    The coupling pole includes a snap hook located at the front end of the coupling pole,

    The snap hook is elastically deformed when passing through the coupling hole and is thus snap-fastened to the frame.

Images