WO2021039028A1 - Dispositif capteur - Google Patents

Dispositif capteur Download PDF

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Publication number
WO2021039028A1
WO2021039028A1 PCT/JP2020/023238 JP2020023238W WO2021039028A1 WO 2021039028 A1 WO2021039028 A1 WO 2021039028A1 JP 2020023238 W JP2020023238 W JP 2020023238W WO 2021039028 A1 WO2021039028 A1 WO 2021039028A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
flow rate
fixing member
passage
fixing
Prior art date
Application number
PCT/JP2020/023238
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English (en)
Japanese (ja)
Inventor
裕樹 中土
成人 廣畑
宇亨 池田
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Publication of WO2021039028A1 publication Critical patent/WO2021039028A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow

Definitions

  • the present invention relates to a sensor device.
  • Internal combustion engines such as automobiles are equipped with an electronically controlled fuel injection device for efficiently operating the internal combustion engine by appropriately adjusting the amount of air and fuel flowing into the internal combustion engine.
  • the electronically controlled fuel injection device is provided with a flow rate sensor for measuring the flow rate of air flowing into the internal combustion engine.
  • a flow rate sensor in which a diaphragm is formed on a silicon element by using micromachining technology and a flow rate sensor element having a flow rate detection unit provided on the diaphragm is mounted is attracting attention.
  • the flow rate detection unit includes a heat generation resistor and a resistance temperature detector, and measures the flow rate under the control of a control circuit unit provided on the same or different semiconductor chips.
  • a flow rate sensor has, for example, a structure in which the flow rate detection unit is exposed and the periphery of the semiconductor chip is sealed with a resin. Instead of sealing with resin, a flow sensor chip pre-packaged with a resin mold is known. Further, there is a technique related to the semiconductor module described in Patent Document 1.
  • a sensor device having a structure capable of reducing the influence of mounting variations such as thickness variations of the circuit board on the positioning accuracy of the sensor element in the flow path.
  • the sensor device is electrically connected to a detection unit having a sensor element installed in the passage and detecting a physical quantity of a gas passing through the passage, and the detection unit. It includes a circuit board, a fixing member for fixing the circuit board and the detection unit, and a passage forming unit.
  • the passage forming portion is one of the surfaces forming the passage, the first portion to which the fixing member is fixed, the second portion facing the circuit board via the gap, and the third portion facing the sensor element via the passage. The portion and the portion are on the same surface.
  • a sensor device having a structure capable of reducing the influence of mounting variations such as thickness variations of a circuit board on the positioning accuracy of sensor elements in a flow path. Issues, configurations and effects other than those described above will be clarified by the description of the following embodiments.
  • FIG. 1 It is a top view of the flow rate sensor module which concerns on Example 1.
  • FIG. 2 is sectional drawing of AA in the flow rate sensor module of FIG. It is a top view which shows a part of the structure of the flow rate sensor module of FIG.
  • FIG. 3 is a sectional view taken along line CC of the flow rate sensor module of FIG. It is sectional drawing BB in FIG. 3 about the flow rate sensor module which is the modification of Example 1.
  • FIG. It is a top view which shows a part of the structure of the flow rate sensor module which is another modification of Example 1.
  • FIG. It is a top view which shows a part of the structure of the flow rate sensor module which concerns on Example 2.
  • FIG. 1 It is a DD cross-sectional view of the flow rate sensor module of FIG. It is a top view which shows a part of the structure of the flow rate sensor module which concerns on Example 3.
  • FIG. It is sectional drawing of EE in the flow rate sensor module of FIG.
  • the subscripts may be omitted for explanation.
  • the three-dimensional coordinate axes of the X-axis, the Y-axis, and the Z-axis are shown in the lower right of each figure. Among the drawings illustrating the same embodiment, it is understood that the relationship between these three axes (X-axis, Y-axis, and Z-axis) and the configuration example (for example, flow rate sensor module) of the embodiment is the same. Good.
  • FIG. 1 is a plan view of the flow rate sensor module 1 according to the first embodiment. However, in FIG. 1, the cover 4 of the flow rate sensor module 1 is not shown.
  • FIG. 2 is a cross-sectional view taken along the line AA of the flow rate sensor module 1 of FIG. FIG. 2 also shows the cover 4 of the flow rate sensor module 1.
  • the flow rate sensor module 1 includes various sensors including a flow rate sensor chip 5, a circuit board 9 on which various sensors and the like are mounted, a housing 2, a base member 3, a cover 4, and a support member 8.
  • the circuit board 9 includes a flow rate sensor chip 5, a pressure sensor chip 6, a humidity sensor chip 7, and a connection portion 10.
  • the circuit board 9 may be a circuit board designed with increased versatility so that it can be used for many models in order to reduce costs.
  • the support member 8 is preferably formed of a heat-resistant material so as not to be deformed or deteriorated at the temperature of a manufacturing process such as soldering.
  • the flow rate sensor chip 5, the pressure sensor chip 6, and the humidity sensor chip 7 are mounted on a circuit board.
  • the flow rate sensor chip 5, the pressure sensor chip 6, and the humidity sensor chip 7 may be referred to as "sensor chips”.
  • the circuit board 9 is in contact with the step portion 24 of the support member 8, and may be fixed to the step portion 24 with an adhesive 22, for example.
  • connection portion 10 and the terminal 11 inserted in the housing 2 are electrically connected by, for example, a wire 12.
  • Each sensor chip (flow sensor chip 5, pressure sensor chip 6, and humidity sensor chip 7) has an electrical connection portion 13.
  • the circuit board 9 and the electrical connection portion 13 are electrically connected to each other via a flexible wire rod (not shown) or directly with a solder 14.
  • each sensor chip is connected to an electric circuit inside each sensor chip, and may be a lead that is also exposed to the outside of each sensor chip, for example. It is preferable that each sensor chip, the wire 12, the electrical connection portion 13, and the solder 14 are protected by a highly insulating resin or gel.
  • the flow rate sensor chip 5 includes a lead frame 15, a flow rate sensor element 16, a semiconductor chip 17, a wire 18, and a mold resin 19.
  • a flow rate detection unit 20 is formed on the upper surface side of the flow rate sensor element 16.
  • the flow rate detection unit 20 is a portion that is thinner than the surroundings.
  • a rectangular or trapezoidal hollow portion is formed on the lower surface side of the flow rate sensor element 16, and the flow rate detecting portion 20 is thinned by this hollow portion.
  • the flow rate detection unit 20 has, for example, a heater control bridge and a temperature sensor bridge including a heating element and a pair of measurement resistors arranged on both sides of the heating element resistor.
  • the heat generation resistor and the pair of measurement resistors are arranged along the direction in which a gas such as air for detecting the flow rate flows.
  • the resistance temperature detector on the upstream side of the gas flow to be measured is cooled by the gas, and the resistance temperature detector on the downstream side is from the resistance temperature detector. It is arranged so that it can be heated by heat.
  • the semiconductor chip 17 is composed of a CPU, an input circuit, an output circuit, a memory, and the like, and has a control circuit for measuring a gas flow rate.
  • thermosetting resin such as an epoxy resin or a phenol resin
  • metal fine particles such as gold, silver, copper and tin, or inorganic fine particles containing silica, glass, carbon, mica, talc and the like as components may be mixed. By mixing an appropriate amount of metal fine particles or inorganic fine particles, it is possible to make the resin conductive and adjust the coefficient of linear expansion of the resin.
  • the lead frame 15 for example, copper, 42% nickel lead frame material (42 alloy), or the like can be used.
  • the flow rate sensor chip 5 is fixed to both the housing 2 and the support member 8.
  • the flow path 21 is formed in a space surrounded by a base member 3, a housing 2, a support member 8, and the like.
  • the flow rate detection unit 20 of the flow rate sensor chip 5 is mounted so as to protrude into the flow path 21 shown in FIG.
  • the flow rate detection unit 20 is formed on the upper surface of the flow rate sensor element 16 of the flow rate sensor chip 5 and is arranged so as to be exposed to the flow path 21. When air flows through the flow path 21, the flow rate detection unit 20 measures the air flow rate.
  • the height from the base member 3 indicated by the arrow in FIG. 2 to the flow rate detection unit 20 of the flow rate sensor chip 5 varies due to variations in the thickness of the circuit board or the like, the flow field near the flow rate detection unit 20 changes.
  • the measured air flow rate varies. Therefore, by providing the support member 8 in contact with the flow rate sensor chip 5 and the base member 3, the height variation from the base member 3 to the flow rate detection unit 20 is suppressed.
  • FIG. 3 is a plan view showing a part of the configuration of the flow rate sensor module 1.
  • FIG. 4 is a sectional view taken along line BB in the flow rate sensor module 1 of FIG.
  • FIG. 5 is a sectional view taken along line CC of the flow rate sensor module 1 of FIG.
  • FIGS. 3, 4, and 5 show a part of the configuration of the flow rate sensor module 1.
  • FIGS. 3, 4, and 5 do not show the housing 2 and the cover 4.
  • the support member 8 has a structure that straddles at least a part of the circuit board 9, and has a structure in which a part of the support members 8 that face each other across the circuit board 9 are connected.
  • the support member 8 has a step portion 24.
  • the step portion 24 is in contact with at least a part of the mounting surface of the circuit board 9.
  • the step portion 24 and the circuit board 9 are fixed by the adhesive 22 at at least a part of the contact points thereof.
  • the support member 8 has a structure having legs protruding toward the base member 3 side from the lowermost surface of the circuit board 9.
  • the support member 8 and the base member 3 are in contact with each other at the legs, and a space is provided between the base member 3 and the circuit board 9. Even if the thickness of the circuit board 9 varies, the legs of the support member 8 are designed to have a sufficient length so that this space exists. Due to such a structure, even if there is a thickness variation (within the allowable range in the specifications) of the circuit board 9, since there is a space between the base member 3 and the circuit board 9, the flow rate from the base member 3 It is possible to suppress the influence on the height up to the detection unit 20.
  • this space can prevent the height from the base member 3 to the flow rate detecting unit 20 from being affected. Therefore, it is possible to suppress height variation from the base member 3 to the flow rate detection unit 20.
  • the flow rate sensor chip 5 is fixed to the support member 8, and the flow rate detection unit 20 is installed so as to face the base member 3.
  • the support member 8 and the base member 3 are in contact with each other on at least two sides to prevent the support member 8 from tilting, and the height variation from the base member 3 to the flow rate detection unit 20. Can be suppressed.
  • the support member 8 and the base member 3 are adhered to each other with, for example, an adhesive 22.
  • the flow sensor chip 5 and the support member 8 are integrated by molding a part of the flow sensor chip 5 with the resin of the support member 8 before solder connection with the circuit board 9. It is also possible to do.
  • the resin of the support member 8 needs to be a resin having high heat resistance, and for example, epoxy resin, polyetheretherketone (PEEK), polyimide, polyphenylene sulfide (PPS), etc. are suitable. is there.
  • FIGS. 1 and 3 A plan view showing a part of the configuration of the flow rate sensor module 1 which is a modification of the first embodiment is shown in FIGS. 1 and 3 as in the first embodiment.
  • FIG. 6 is a sectional view taken along line BB in FIG. 3 of the flow rate sensor module 1 which is a modification of the first embodiment.
  • the flow rate sensor module 1 which is a modification of the first embodiment has a structure in which a notch 23 is provided in a support member 8 in contact with a circuit board 9.
  • the circuit board 9 thermally expands and expands during heating in a manufacturing process (for example, a soldering process).
  • a manufacturing process for example, a soldering process.
  • FIG. 7 is a plan view showing a part of the configuration of the flow rate sensor module 1a.
  • the flow rate sensor module 1a which is another modification of the first embodiment, is the support member 8 in a plan view from the Z-axis direction from the support member 8 of the flow rate sensor module 1 of the first embodiment of FIG. It is a structure in which the side wall portion forming one side of the rectangle is removed.
  • the support member 8 of the flow rate sensor module 1a may have two sides facing each other with the circuit board 9 in contact with the base member 3, and for example, a part of the support member 8 may be opened as shown in FIG.
  • the support member 8 of the flow rate sensor module 1a may have a U-shaped structure having three sides in a plan view from the Z-axis direction.
  • the shape of the support member 8 can be any shape such as a circular shape, an elliptical shape, a rectangular shape, or a polygonal shape.
  • the other configurations of the flow rate sensor module 1a may be the same as those of the flow rate sensor module 1 of the first embodiment.
  • FIG. 8 is a plan view showing a part of the configuration of the flow rate sensor module 1b according to the second embodiment.
  • FIG. 9 is a sectional view taken along line DD of the flow rate sensor module 1b of FIG.
  • the flow rate sensor chip 5 is supported by two opposing sides of the support member 8. As a result, the displacement of the flow rate sensor chip 5 at the time of mounting is further suppressed.
  • the other configurations of the flow sensor module 1b may be the same as those of the flow sensor module 1 of the first embodiment.
  • FIG. 10 is a plan view showing a part of the configuration of the flow rate sensor module 1c according to the third embodiment.
  • FIG. 11 is a cross-sectional view taken along the line EE of the flow rate sensor module 1c of FIG.
  • the support member 8 of the flow rate sensor module 1c of the third embodiment has a structure that surrounds the circuit board 9.
  • the end face in the negative Z direction is in contact with the base member 3 over the entire surface.
  • the four side surfaces (wall surfaces) of the support member 8 indicated by the two sides parallel to the Y axis and the two sides parallel to the X axis are in contact with the base member 3. There is. As a result, the stability of the support member 8 is improved because all of the wall surfaces on all four sides are stably supported by the base member 3.
  • the circuit board 9 since the circuit board 9 is surrounded by the support member 8, it can also be used as a resin casting dam material when protecting the electrical connection portion 13 with an insulating material. As a result, waste of the resin filler and the like is reduced, so that the material efficiency can be improved.
  • the other configurations of the flow rate sensor module 1c may be the same as those of the flow rate sensor module 1 of the first embodiment.
  • the following sensor device is also an example of the embodiment.
  • the sensor device (for example, flow rate sensor modules 1, 1a, 1b, 1c) is installed in a passage (for example, flow path 21) and has a sensor element (for example, flow rate sensor element 16) for detecting a physical amount of gas passing through the passage.
  • a passage is formed by a unit (for example, a flow sensor chip 5), a circuit board (for example, a circuit board 9) that is electrically connected to the detection unit, a fixing member (for example, a support member 8) that fixes the circuit board and the detection unit, respectively.
  • a portion (for example, a base member 3) is provided.
  • the passage forming portion is one of the surfaces forming the passage, the first portion to which the fixing member is fixed, the second portion facing the circuit board via the gap, and the third portion facing the sensor element via the passage. The portion and the portion are on the same surface.
  • the passage forming portion further has a fourth portion to which the fixing member is fixed on the same surface as the first portion. Between the first portion and the fourth portion to which the fixing member is fixed, there is a second portion facing the circuit board via a gap. Further, the distance between the second portion of the passage forming portion and the circuit board is shorter than the distance between the third portion of the passage forming portion and the sensor element.
  • the sensor device further includes a housing (eg, housing 2) that forms at least a portion of the passage, along with a passage forming portion and a fixing member. The sensor element detects at least the flow rate of the gas passing through the passage as a physical quantity relating to the gas passing through the passage.
  • the circuit board includes a calculation unit that calculates and processes the detected flow rate.
  • the fixing member has at least two sides that sandwich the circuit board in a plan view from the thickness direction of the circuit board. Further, the fixing member includes a first step portion and a second step portion.
  • the first step portion includes a first fixed portion fixed to the first portion of the passage forming portion, and a second fixed portion fixed to the circuit board.
  • the second step portion includes a third fixing portion fixed to the circuit board, and a fourth fixing portion fixed to the fourth portion of the passage forming portion.
  • the first step portion and the second step portion are two sides that sandwich the circuit board in a plan view from the thickness direction of the circuit board. Further, there may be a gap between the first step portion of the fixing member and the first side surface of the circuit board facing the first step portion. Similarly, there may be a gap between the second step portion of the fixing member and the second side surface of the circuit board facing the second step portion.
  • the first step portion of the fixing member has a first groove (for example, a notch portion 23) formed in the thickness direction of the circuit board between the first fixing portion and the second fixing portion.
  • the second step portion of the fixing member has a second groove (for example, a notch portion 23) formed in the thickness direction of the circuit board between the third fixing portion and the fourth fixing portion.
  • at least a part of the first side surface of the circuit board is located at a position overlapping the first groove in a plan view from the thickness direction of the circuit board.
  • at least a part of the second side surface of the circuit board is located at a position overlapping the second groove in a plan view from the thickness direction of the circuit board.
  • the fixing member may have an intermediate portion between the first step portion and the second step portion.
  • the fixing member may have three sides that are U-shaped in a plan view from the thickness direction of the circuit board.
  • the fixing member may be a frame made of resin.
  • the detection unit may penetrate at least a part of the frame body. In this case, the sensor element of the detection unit may be on the outside of the frame, and the portion where the detection unit and the circuit board are connected may be on the inside of the frame. Further, the fixing member may be a frame body surrounding the circuit board.

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)

Abstract

Le dispositif capteur de l'invention comprend : une unité de détection constituée d'un élément capteur disposé dans un passage et détectant une quantité physique relative à un gaz qui traverse le passage ; un substrat de circuit qui est électriquement connecté à l'unité de détection ; un élément de fixation servant à fixer le substrat de circuit et l'unité de détection ; et une partie de formation de passage La partie de formation de passage comprend, sur la même surface, une première partie à laquelle l'élément de fixation est fixé, une deuxième partie fait face au substrat de circuit par l'intermédiaire d'un espace, et une troisième partie qui constitue l'une des surfaces formant le passage et qui fait face à l'élément de capteur par l'intermédiaire du passage.
PCT/JP2020/023238 2019-08-29 2020-06-12 Dispositif capteur WO2021039028A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019156926A JP7225062B2 (ja) 2019-08-29 2019-08-29 センサ装置
JP2019-156926 2019-08-29

Publications (1)

Publication Number Publication Date
WO2021039028A1 true WO2021039028A1 (fr) 2021-03-04

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PCT/JP2020/023238 WO2021039028A1 (fr) 2019-08-29 2020-06-12 Dispositif capteur

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JP (1) JP7225062B2 (fr)
WO (1) WO2021039028A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016075506A (ja) * 2014-10-03 2016-05-12 三菱電機株式会社 流量測定装置
JP2017083323A (ja) * 2015-10-29 2017-05-18 三菱電機株式会社 流量測定装置
JP2019095387A (ja) * 2017-11-27 2019-06-20 日立オートモティブシステムズ株式会社 流量計

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10036290A1 (de) * 2000-07-26 2002-02-07 Bosch Gmbh Robert Vorrichtung zur Bestimmung zumindest eines Parameters eines strömenden Mediums
DE102015225358B4 (de) * 2015-12-16 2020-04-02 Continental Automotive Gmbh Luftmassenmesser

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016075506A (ja) * 2014-10-03 2016-05-12 三菱電機株式会社 流量測定装置
JP2017083323A (ja) * 2015-10-29 2017-05-18 三菱電機株式会社 流量測定装置
JP2019095387A (ja) * 2017-11-27 2019-06-20 日立オートモティブシステムズ株式会社 流量計

Also Published As

Publication number Publication date
JP7225062B2 (ja) 2023-02-20
JP2021032845A (ja) 2021-03-01

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