WO2021031878A1 - 指纹识别装置和电子设备 - Google Patents
指纹识别装置和电子设备 Download PDFInfo
- Publication number
- WO2021031878A1 WO2021031878A1 PCT/CN2020/107678 CN2020107678W WO2021031878A1 WO 2021031878 A1 WO2021031878 A1 WO 2021031878A1 CN 2020107678 W CN2020107678 W CN 2020107678W WO 2021031878 A1 WO2021031878 A1 WO 2021031878A1
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- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- identification device
- fingerprint identification
- positioning
- fingerprint
- Prior art date
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
Definitions
- This application relates to the field of electronic equipment, and more specifically to fingerprint identification devices and electronic equipment in electronic equipment.
- the structure of mounting the fingerprint identification device on the side of the electronic device has been applied.
- the fingerprint identification device will occupy the thickness of the middle frame of the electronic device, it will increase the thickness of the entire electronic device and affect users Experience.
- the present application provides a fingerprint identification device and electronic equipment.
- One long side of the component is flush, and the size between the two long sides of the substrate is larger than the size between the two long sides of the fingerprint chip component, which can effectively reduce the size of the fingerprint identification device in the x direction, thus, in the fingerprint identification
- the size of the main body of the electronic device in the x direction can be effectively reduced, so as to reduce the overall thickness of the electronic device.
- a fingerprint identification device including:
- a fingerprint chip assembly comprising two long sides opposite in a first direction, the first direction being parallel to the width direction of the substrate;
- the substrate is fixedly connected to the fingerprint chip assembly, and includes two long sides opposite in the first direction, wherein the size between the two long sides of the substrate is larger than the two long sides of the fingerprint chip assembly For the dimension between the long sides, one long side of the substrate is flush with one long side of the fingerprint chip assembly on the same side.
- the substrate by designing the substrate, one of the two long sides facing each other in the x-direction (the width direction of the fingerprint identification device) and the fingerprint on the same side
- One long side of the chip assembly is flush, and the size between the two long sides of the substrate is larger than the size between the two long sides of the fingerprint chip assembly, so that the other long side of the substrate is located on the same side of the fingerprint chip assembly
- the long side of the substrate is extended, and the extended part of the side of the fingerprint chip assembly on the same side can be matched with the main body of the electronic device through the long side of the substrate to lock the fingerprint identification device on the main body, which can effectively reduce fingerprints
- the size of the identification device in the x direction so that when the fingerprint identification device is installed on the side of the main body, the size of the main body in the x direction can be effectively reduced to reduce the overall thickness of the electronic device.
- the fingerprint identification device of the embodiment of the present application can also reduce the cut-out part of the main body, which can effectively improve the strength of the whole machine.
- the fingerprint identification device further includes:
- the U-shaped circuit board arranged on the side of the substrate facing away from the fingerprint chip assembly includes a first part, a bent part, and a second part.
- the bent part connects the first part and the second part. Part, the first part is located between the substrate and the second part.
- the fingerprint identification device provided by the embodiment of the present application can be equipped with a fingerprint identification device and function keys on the first part and the second part of the U-shaped circuit board by setting the circuit board of the U-shaped structure to simultaneously realize the fingerprint identification
- the electrical connection between the identification device and the function keys can reduce the buttons on the side of the electronic device, so as to improve the simplicity and beauty of the electronic device.
- the second part includes a first positioning part close to a reference side surface of the substrate, the first positioning part includes two stepped side surfaces opposite in the first direction, and the first positioning part
- the step side surface includes an inner side surface, an outer side surface, and a connecting side surface connecting the inner side surface and the outer side surface.
- the two connecting side surfaces of the first positioning portion are respectively located on both sides of the reference side surface, and the reference side surface is The short side that connects the two long sides of the substrate.
- the second part of the circuit board is provided with a first positioning part for detecting the positioning of the second part in the x direction
- the first positioning part includes two side steps. It has a connection side surface, and uses the relative position relationship between the two connection side surfaces and the reference side surface of the substrate to detect the positioning of the second part of the circuit board in the x direction, which can reduce the manufacturing process and reduce the cost.
- the connecting side surfaces of the two stepped side surfaces of the first positioning portion are respectively located on both sides of the reference side surface of the substrate, that is, the positioning of the second portion of the circuit board in the x direction can be considered to meet the requirements.
- the first positioning part is close to the bent part of the circuit board.
- the second part includes a second positioning part, the second positioning part includes two long sides opposite in the first direction, and each long side of the second positioning part is located at The inner side of the long side of the substrate on the same side.
- the second part of the circuit board is provided with a second positioning part for detecting the positioning of the second part in the y direction
- the first positioning part includes the opposite
- the relative position relationship between the two long sides and the long side of the substrate is used to detect the rated position of the second part of the circuit board in the y direction, which can reduce the manufacturing process and reduce the cost.
- each long side of the second positioning part is located inside the long side of the substrate on the same side, that is, the positioning of the second part of the circuit board in the y direction is considered to meet the requirements.
- the fingerprint identification device further includes a reinforcing member fixedly connected to the surface of the second part facing the first part; and,
- the reinforcing member includes a third positioning portion close to the reference side surface of the substrate, the third positioning portion includes two stepped side surfaces opposite in the first direction, and the stepped side surface of the third positioning portion includes The inner side surface, the outer side surface, and the connecting side surface connecting the inner side surface and the outer side surface, the two connecting side surfaces of the third positioning portion are respectively located on both sides of the reference side surface, and the reference side surface is connected to the substrate The two long sides of the short side.
- the reinforcing component fixedly connected to the second part of the circuit board is provided with a third positioning part for detecting the positioning of the second part in the x direction
- the third positioning part includes There are two step side surfaces, and the step side surface has a connecting side surface, and the positioning of the second part of the circuit board in the x-direction is detected by the relative position relationship between the two connecting side surfaces and the reference side surface of the substrate, which can reduce the manufacturing process and reduce the cost.
- the connecting side surfaces of the two step side surfaces of the third positioning part are respectively located on both sides of the reference side surface of the substrate, that is, the positioning of the second part of the circuit board in the x-direction is considered to meet the requirements.
- the third positioning part is close to the bent part of the circuit board.
- the fingerprint identification device further includes a reinforcing member fixedly connected to the surface of the second part facing the first part; and,
- the reinforcing member includes a fourth positioning portion, the fourth positioning portion includes two long sides opposite in the first direction, and each long side of the fourth positioning portion is located on the same side. The inner side of the long side of the substrate.
- the reinforcing component is provided with a fourth positioning part for detecting the positioning of the second part of the circuit board in the y direction, and the fourth positioning part includes two opposite positions in the x direction.
- the long side surface uses the relative position relationship between the two long side surfaces and the long side surface of the substrate to detect the rated position of the second part of the circuit board in the y direction, which can reduce the manufacturing process and reduce the cost.
- each long side is located on the inner side of the long side of the substrate on the same side, that is, the positioning of the second part of the circuit board in the y direction is considered to meet the requirements.
- the fingerprint chip assembly includes a working surface for contact with an external object, and the working surface is an inclined surface or a curved surface.
- the fingerprint identification device provided by the embodiment of the present application can be well applied to the scene where the side surface of the main body of the electronic device is curved or inclined by setting the working surface of the fingerprint chip assembly as an inclined or curved surface to improve the fingerprint.
- the working surface includes a plurality of detection areas
- the fingerprint chip assembly includes a plurality of gain modules corresponding to the plurality of detection areas
- each gain module is used to adjust the fingerprint chip assembly in the corresponding detection area.
- the gain of the detected signal is different from the gain of the signal adjusted by at least two gain modules in the plurality of gain modules.
- the fingerprint identification device when the working surface of the fingerprint chip assembly is inclined or curved, multiple gain modules are provided, and one gain module detects the detection area on the working surface.
- the gain of the electrical signal, the gain of the signal adjusted by at least two gain modules is different, the signal strength of the signal can be made the same as much as possible to improve the recognition effect.
- the fingerprint chip assembly includes a working surface for contact with an external object, and the edge of the working surface is a curved surface or an inclined surface.
- the width of the fingerprint identification device can be narrowed in terms of vision and feel, thereby improving user experience.
- the fingerprint identification device further includes:
- the circuit board disposed on the side of the substrate facing away from the fingerprint chip assembly includes a connecting part fixedly connected to the substrate, and the substrate includes two opposite sides from the connecting part in the first direction.
- a first overhanging area and a second overhanging area each extending along the first direction with long side edges, the first overhanging area and the second overhanging area are located in the connecting part at the first The area between the two ends of the two directions and facing the surface of the circuit board, the larger area of the first extension area and the second extension area is the glue area, the second The direction is parallel to the length direction of the substrate.
- two extended areas for example, the first extended area and the second extended area respectively extending in the x direction from the two long sides of the connecting portion are provided on the substrate.
- Overhanging area the two overhanging areas are located between the two ends of the connecting part in the y direction and facing the surface of the circuit board.
- the overhanging area with a larger area is set as the glue dispensing Area, single-side dispensing can be performed on the dispensing area, so that the glue can infiltrate or diffuse between the circuit board and the substrate by capillary phenomenon, so as to realize the waterproof between the circuit board and the substrate.
- this structure in which only one dispensing area is provided on the substrate is very suitable for the case where the size of the substrate in the x direction is small, and can also achieve the waterproof effect between the substrate and the circuit board.
- the fingerprint chip assembly includes two short sides opposed to each other in a second direction
- the substrate includes two short sides opposed to each other in the second direction
- each short side of the substrate is located at On the outside of the short side surface of the fingerprint chip assembly on the same side, the second direction is parallel to the length direction of the substrate.
- a fingerprint identification device including:
- the substrate includes two long side surfaces opposite to each other in a first direction and a reference side surface connecting the two long side surfaces, the first direction being parallel to the width direction of the substrate;
- the circuit board is arranged on one side of the substrate and includes a first part, a bent part and a second part.
- the bent part connects the first part and the second part, and the first part is located between the substrate and the second part.
- the second part of the circuit board includes a first positioning part close to the reference side surface of the substrate, and the first positioning part includes two opposing parts in the first direction.
- the step side surface includes an inner side surface, an outer side surface, and a connecting side surface connecting the inner side surface and the outer side surface, and the two connecting side surfaces are respectively located on both sides of the reference side surface.
- the second part of the circuit board is provided with a first positioning part for detecting the positioning of the second part in the x direction
- the first positioning part includes two side steps. It has a connection side surface, and uses the relative position relationship between the two connection side surfaces and the reference side surface of the substrate to detect the positioning of the second part of the circuit board in the x direction, which can reduce the manufacturing process and reduce the cost.
- the connecting side surfaces of the two stepped side surfaces of the first positioning portion are respectively located on both sides of the reference side surface of the substrate, that is, the positioning of the second portion of the circuit board in the x direction can be considered to meet the requirements.
- the first positioning part is close to the bent part of the circuit board.
- the second part of the circuit board includes a second positioning part
- the second positioning part includes two long sides opposite in the first direction, and each long side of the second positioning part They are all located on the inner side of the long side of the substrate on the same side.
- the second part of the circuit board is provided with a second positioning part for detecting the positioning of the second part in the y direction
- the first positioning part includes the opposite
- the relative position relationship between the two long sides and the long side of the substrate is used to detect the rated position of the second part of the circuit board in the y direction, which can reduce the manufacturing process and reduce the cost.
- each long side of the second positioning part is located inside the long side of the substrate on the same side, that is, the positioning of the second part of the circuit board in the y direction is considered to meet the requirements.
- a fingerprint identification device including:
- the substrate includes two long side surfaces opposite to each other in a first direction and a reference side surface connecting the two long side surfaces, the first direction being parallel to the width direction of the substrate;
- the circuit board is arranged on one side of the substrate and includes a first part, a bent part and a second part.
- the bent part connects the first part and the second part, and the first part is located between the substrate and the second part. Between the second part;
- a reinforcing part is fixedly connected to the surface of the second part facing the first part, wherein the reinforcing part includes a third positioning part close to the reference side surface of the substrate, and the third positioning part includes Two side faces of the steps opposite in the first direction, the side faces of the steps include an inner side, an outer side, and a connecting side connecting the inner side and the outer side, and the two connecting side surfaces are respectively located at the reference Both sides of the side.
- the reinforcing component fixedly connected to the second part of the circuit board is provided with a third positioning part for detecting the positioning of the second part in the x direction
- the third positioning part includes There are two step side surfaces, and the step side surface has a connecting side surface, and the positioning of the second part of the circuit board in the x-direction is detected by the relative position relationship between the two connecting side surfaces and the reference side surface of the substrate, which can reduce the manufacturing process and reduce the cost.
- the connecting side surfaces of the two step side surfaces of the third positioning portion are respectively located on both sides of the reference side surface of the substrate, that is, the positioning of the second portion of the circuit board in the x direction can be considered to meet the requirements.
- the third positioning part is close to the bent part of the circuit board.
- the reinforcing member includes a fourth positioning portion, the fourth positioning portion includes two long sides opposite in the first direction, and each long side of the fourth positioning portion is located at The inner side of the long side of the substrate on the same side.
- the reinforcing component is provided with a fourth positioning part for detecting the positioning of the second part of the circuit board in the y direction, and the fourth positioning part includes two opposite positions in the x direction.
- the long side surface uses the relative position relationship between the two long side surfaces and the long side surface of the substrate to detect the rated position of the second part of the circuit board in the y direction, which can reduce the manufacturing process and reduce the cost.
- each long side is located on the inner side of the long side of the substrate on the same side, that is, the positioning of the second part of the circuit board in the y direction is considered to meet the requirements.
- an electronic device including:
- the fingerprint identification device in any one of the possible implementations of the first aspect, the fingerprint identification device passes through the hole and is connected to the main body.
- the main body is integrally formed; and,
- the electronic device also includes a reinforcing bracket, which is respectively fixedly connected with the main body and the fingerprint identification device.
- the size of the main body can be reduced to reduce the size of the electronic device.
- an electronic device including:
- the fingerprint identification device in any one of the possible implementations of the second aspect, the fingerprint identification device passes through the hole and is connected to the main body.
- the main body includes integral molding; and,
- the electronic device also includes a reinforcing bracket, which is respectively fixedly connected with the main body and the fingerprint identification device.
- an electronic device including:
- the fingerprint identification device in any possible implementation of the third aspect, passes through the hole and is connected to the main body.
- the main body is integrally formed; and,
- the electronic device also includes a reinforcing bracket, which is respectively fixedly connected with the main body and the fingerprint identification device.
- Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
- Fig. 2 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- FIG. 3 is a schematic structural diagram of the cooperation structure of the fingerprint chip assembly and the substrate in an embodiment of the present application.
- Fig. 4 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- Fig. 5 is a schematic structural diagram of a fingerprint identification device, a main body, and a bracket according to an embodiment of the present application.
- Fig. 6 is a schematic cross-sectional view of a partial area of an electronic device of an embodiment of the present application.
- Fig. 7 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- FIG. 8 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- FIG. 9 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- Fig. 10 is a schematic cross-sectional view of a partial area of an electronic device of an embodiment of the present application.
- FIG. 11 is a schematic diagram of the manufacturing process of the fingerprint identification device of the embodiment of the present application.
- FIG. 12 is a schematic structural diagram of a circuit board with a U-shaped structure according to an embodiment of the present application.
- FIG. 13 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- FIG. 14 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- FIG. 15 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- Fig. 16 is a schematic structural diagram of a reinforcing component of an embodiment of the present application.
- FIG. 17 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- FIG. 18 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- FIG. 19 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- FIG. 20 is a schematic structural diagram of a fingerprint chip assembly according to an embodiment of the present application.
- FIG. 21 is a schematic diagram of a detection area indicating a working surface of a chip assembly according to an embodiment of the present application.
- FIG. 22 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.
- the electronic device in the embodiment of the present application may be various possible devices equipped with a fingerprint identification device.
- the electronic device may be a mobile phone, a tablet computer, a watch, or a wearable device.
- FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the application.
- the electronic device 100 includes a main body 10, a hole 101 provided on the side of the main body 10, and a fingerprint recognition device 20.
- the fingerprint recognition device 20 is installed on the main body 10 through 101.
- the electronic device 100 further includes a screen 30.
- the main body 10 can be understood as the middle frame of the mobile phone.
- the x, y, and z directions are perpendicular to each other.
- the x direction can be understood as the width direction of the fingerprint identification device
- the y direction can be understood as the length direction of the fingerprint identification device
- the z direction can be understood as the thickness direction of the fingerprint identification device.
- the fingerprint identification device can be installed on the side in the length direction of the electronic device, and can also be installed on the side in the width direction of the electronic device, which is not limited in the embodiment of the present application.
- the embodiment of the present application takes the structure of the fingerprint identification device shown in FIG. 1 installed on the side of the length direction of the electronic device as an example to describe the structure of the fingerprint identification device and the electronic device.
- the first direction is the x direction
- the second direction is the y direction.
- the embodiments of the present application describe the relationship between the long side and the short side of the component or structure of the fingerprint identification device in many places. It should be understood that the long side should be broadly understood as the component or structure in its length direction (y The short side should be broadly understood as the side of the component or structure in its width direction (x direction).
- the embodiments of the present application have made many improvements to the fingerprint identification device to achieve different purposes.
- the embodiment of the present application provides a fingerprint identification device.
- the width direction (x direction) of the substrate in the substrate can be reduced while ensuring that the substrate matches the main body of the electronic device.
- the width of the fingerprint identification device is narrowed, so that it can be connected with a body with a narrower size in the x direction to reduce the size of the electronic device in the x direction. To achieve the purpose of reducing the thickness of the whole machine.
- the embodiment of the present application also proposes a structure of single-side dispensing on one side of the length direction (y direction) of the substrate, which can be well applied to the substrate In a fingerprint recognition device with a small size in the width direction (x direction).
- the embodiment of the present application also proposes a fingerprint recognition device provided with a positioning structure on the circuit board or the reinforcing component. By performing positioning detection on the positioning structure of the circuit board or the reinforcing component itself, the manufacturing process can be reduced. To reduce costs.
- the embodiment of the application also proposes to design the working surface of the fingerprint chip assembly as a curved or inclined surface. Based on this, it is also proposed to design multiple A gain module used to adjust the gain of the signal to improve the recognition effect.
- FIG. 2 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the application.
- FIG. 3 shows a schematic structural diagram of the structure of the fingerprint chip assembly and the substrate in the embodiment of the application, wherein (a) in FIG. 3 shows the structure of the fingerprint chip assembly and the substrate in the embodiment of the application.
- (b) in FIG. 3 shows a schematic structural diagram on the xy plane of the structure of the fingerprint chip assembly and the substrate in the embodiment of the application.
- FIG. 4 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the application.
- FIG. 5 is a schematic structural diagram of the fingerprint identification device, the main body and the bracket according to the embodiment of the application, wherein (a) in FIG. (B) in FIG. 5 shows a cross-sectional view of the local area A of the main body of the embodiment of the application in the xz plane.
- FIG. 6 shows a cross-sectional view of a partial area of an electronic device according to
- the fingerprint identification device 20 includes a fingerprint chip assembly 210, a substrate 220, and a circuit board 230, which are sequentially arranged along the z direction.
- the above-mentioned three components may be attached sequentially using viscous substances, that is, the substrate 220 is attached to the fingerprint chip assembly 210, and the circuit board 230 is attached to the substrate 220.
- the circuit board 230 may be a flexible circuit board, a part of the circuit board 230 is attached to the substrate 220 to achieve a fixed connection, and the other part may extend to the inside of the main body to be fixedly connected to the main body of the electronic device, and is electrically connected to the main board in the main body.
- the fingerprint chip assembly 210 is used to collect user fingerprint information.
- the circuit board 230 receives the user fingerprint information and sends the user fingerprint information to the main board, so that the processor set on the main board performs corresponding authentication processing based on the user fingerprint information, for example, fingerprint Unlock, fingerprint payment and other functions.
- the fingerprint chip assembly 210 includes two long sides opposed in the x direction, and the substrate 220 includes two long sides opposed in the x direction, wherein the size between the two long sides of the substrate 220 is larger than that of the fingerprint chip
- the dimension between the two long sides of the assembly 210, one long side of the substrate 220 is flush with one long side of the fingerprint chip assembly 210 located on the same side.
- the two long sides of the fingerprint chip assembly 210 are respectively marked as the first long side 211 and the second long side 212
- the two long sides of the substrate 220 are respectively marked as the first long side 221 and the second long side. 222.
- the first long side 221 of the substrate 220 and the first long side 211 of the fingerprint chip assembly 210 are located on one side of the fingerprint identification device 20, and the second long side 222 of the substrate 220 and the second long side of the fingerprint chip assembly 210 212 is located on the other side of the fingerprint identification device 20.
- the second long side 222 of the substrate 220 is flush with the second long side 212 of the fingerprint chip assembly 210, and the size between the first long side 221 of the substrate 220 and the second long side 222 of the substrate 220 is larger than that of the fingerprint chip assembly 210.
- the first long side 221 is located outside the first long side 211 of the fingerprint chip assembly 210.
- the size between the two long sides of the substrate 220 is L 2
- the size between the two long sides of the fingerprint chip assembly 210 is L 1
- the first The long side surface 221 extends outward in the x direction relative to the first long side surface 211 of the fingerprint chip assembly 210, and the size of the extension is L 3 .
- the size between the two long sides of the substrate 220 is larger than the size of the two long sides of the fingerprint chip assembly 210 can be broadly understood as the shortest size between the two long sides of the substrate 220 is larger than the fingerprint chip assembly 210
- the first long side surface 211 of the 210 extends along the x direction, or in other words, the first long side surface 221 of the substrate 220 is located on the first long side surface 211 of the fingerprint chip assembly 210 away from the fingerprint chip assembly 210.
- the two long sides being flush here can be understood as the two long sides being substantially flush.
- the projection of the second long side 222 of the substrate 220 and the second long side 212 of the fingerprint chip assembly 210 on the xy plane Basically coincide.
- the outer side of the first long side 211 of the fingerprint chip assembly 210 refers to the side of the first long side 211 away from the fingerprint chip assembly 210
- the inner side of the first long side 211 of the fingerprint chip assembly 210 refers to It is the side of the first long side 211 close to the fingerprint chip assembly 210.
- the outside of the side of the component below can be understood as the side of the component away from the component
- the inside of the side of the component can be understood as the side of the component close to the component.
- the positional relationship between the two short sides of the substrate 220 in the y direction and the two short sides of the fingerprint chip assembly 210 in the y direction is not limited in any way.
- the substrate 220 includes two short sides opposite in the y direction, denoted as a first short side 223 and a second short side 224, and the fingerprint chip assembly 210 includes two short sides in the y direction.
- the two opposite short sides are denoted as the first short side 213 and the second short side 214.
- Each short side of the substrate 220 is located outside the short side of the fingerprint chip assembly 210 on the same side.
- the first short side 223 of the substrate 220 and the first short side 213 of the fingerprint chip assembly 210 are located on one side of the fingerprint identification device, and the second short side 224 of the substrate 220 and the second short side 214 of the fingerprint chip assembly 210 are located on the fingerprint identification device.
- the first short side 223 of the substrate 220 is located outside the first short side 213 of the fingerprint chip assembly 210, or in other words, the first short side 223 of the substrate 220 is opposite to the first short side 223 of the fingerprint chip assembly 210.
- the side surface 213 extends in the y direction.
- the second short side surface 224 of the substrate 220 is located outside the second short side surface 214 of the fingerprint chip assembly 210. In other words, the second short side surface 224 of the substrate 220 is opposite to the second short side surface 224 of the fingerprint chip assembly 210.
- the short side 214 extends outward in the y direction.
- one short side of the substrate 220 extends out relative to the short side of the fingerprint chip assembly 210 on the same side, and the other short side of the substrate 220 may also be flat relative to the short side of the fingerprint chip assembly 210 on the same side of the fingerprint identification device.
- Qi (not shown in the figure).
- the fingerprint chip assembly 210 and the substrate 220 there are no restrictions on the shape and structure of the fingerprint chip assembly 210 and the substrate 220, as long as one long side of the substrate 220 is flush with the long side of the fingerprint chip assembly 210 on the same side, and the two long sides of the substrate 220 The size of is larger than the size between the two long sides of the fingerprint chip assembly 210.
- the fingerprint identification device 20 includes a fingerprint chip assembly 210, a substrate 220, a circuit board 230, and a reinforcing member 241 sequentially arranged along the z direction.
- the reinforcing member 241 is attached to the side of the circuit board 230 away from the substrate 220.
- the material of the reinforcing member 241 may be steel, and such a reinforcing member made of steel may be called a reinforcing steel sheet.
- the fingerprint identification device can be installed on the electronic device in an inside-out assembly manner.
- the main body 10 may be made by integral molding.
- the material of the integrally molded main body may be pure metal (for example, aluminum), or aluminum-plastic alloy.
- the main body 10 is provided with a hole 101 (a non-shaded area as shown in (b) in FIG. 5).
- the fingerprint identification device 20 is inserted into the hole 101 and extends outward along the z-direction according to the manner of installing the fingerprint identification device from the inside to the outside.
- the substrate 220 is clamped on the main body 10 to limit the position of the fingerprint identification device 20, and the circuit board 230 is connected to one end
- the main body 10 is fixedly connected.
- the hole 101 will penetrate to the inside of the main body 10, which will virtually increase the part of the main body that is cut off.
- the reinforcing bracket 40 shown in (a) can be fixedly connected to the fingerprint identification device 20 and the main body 10, respectively.
- the fingerprint chip assembly 210 is located in the hole 101 and a small part of it is exposed in the hole 101 for the user to press to collect fingerprint information.
- the first long side 221 of the substrate 220 is opposite to the first long side 211 of the fingerprint chip assembly 210 along x
- the part extending outward in the direction cooperates with the main body 10 to lock the fingerprint identification device 20 on the main body 10; in addition, if the short side (for example, the first short side 223 or the second short side 224) of the substrate 220 is located on the same side
- the fingerprint chip assembly 210 is outside the fingerprint chip assembly 210, the short side surface of the substrate 220 extends from the short side surface of the fingerprint chip assembly 210 to also cooperate with the main body 10, and the fingerprint identification device 20 is further clamped on the main body 10.
- the reinforcing bracket 40 is fixedly connected to the reinforcing member 241 and fixedly connected to the main body 10.
- each long side of the substrate extends outward relative to the long side of the fingerprint chip assembly on the same side, and each long side of the substrate is located at The outer side of the long side of the fingerprint chip assembly on the same side makes the width of the substrate larger, thereby increasing the width of the fingerprint identification device, and seriously affecting the thickness of the electronic device.
- a fingerprint recognition device with a larger width will cut off more parts of the main body, which affects the strength of the whole machine.
- the fingerprint identification device provided by the embodiment of the present application, through the relevant design of the substrate, makes one of the two long sides of the substrate opposite in the width direction (x direction) of the substrate and the fingerprint chip assembly located on the same side
- One long side of the substrate is flush, and the size between the two long sides of the substrate is greater than the size between the two long sides of the fingerprint chip assembly, so that the other long side of the substrate is located outside the long side of the fingerprint chip assembly on the same side.
- the fingerprint identification device can be attached to the main body through the protruding part of the long side of the substrate relative to the long side of the fingerprint chip assembly located on the same side and the main body of the electronic device. At the same time, the fingerprint identification device can be effectively reduced The size in the x direction, so that when the fingerprint identification device is installed on the side of the main body, the size of the main body in the x direction can be effectively reduced to reduce the overall thickness of the electronic device.
- the fingerprint identification device of the embodiment of the present application can also reduce the cut-out part of the main body, effectively improving the strength of the whole machine.
- the circuit board 230 and the substrate 220 can be bonded by a viscous material to achieve a fixed connection.
- a dispensing area can be reserved on the substrate 220, and the dispensing area
- the glue dispensing process utilizes the capillary phenomenon, so that the glue can fully diffuse or infiltrate between the circuit board 230 and the substrate 220, so as to realize the waterproof between the circuit board 230 and the substrate 220.
- all or part of the area or part of the area around the circuit board 230 on the substrate 220 may be used as the glue dispensing area.
- one-side glue can be applied to the area of the substrate protruding from the circuit board in the x direction on the surface of the substrate facing the circuit board, which can also achieve waterproofing between the circuit board and the substrate.
- FIG. 7 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the application.
- (A) and (b) in FIG. 7 are two-dimensional schematic structural diagrams of the fingerprint identification device in the embodiment of the application in the xy plane, and (c) in FIG. 7 shows the fingerprint identification in the embodiment of the application Three-dimensional schematic structure diagram of the device.
- the circuit board 230 includes a connecting portion 231 fixedly connected to the surface of the substrate 220 on the side facing away from the fingerprint chip assembly 210.
- the connecting portion 231 includes two long sides opposite in the x direction, denoted as the first long The side 2311 and the second long side 2312.
- the base plate 220 includes a first overhanging area 2211 and a second overhanging area 2221 extending from the two long sides of the connecting portion 231 in the x direction, respectively.
- the area 2211 and the second overhanging area 2221 are areas located between the two ends of the connecting portion 231 in the y direction and facing the surface of the circuit board 230.
- the first overhanging area 2211 is opposite to the first long side of the connecting portion 231 2311 extends outward in the x direction, and the second extended region 2221 extends outward in the x direction relative to the second long side 2312 of the connecting portion 231.
- the area of the first overhanging area 2211 and the area of the second overhanging area 2221 are different, and the larger area of the first overhanging area 2211 and the second overhanging area 2221 is used as the dispensing area.
- Side glue processing is used as side glue processing.
- the area of the first overhanging area 2211 may be larger than the area of the second overhanging area 2221, or it may be smaller than the area of the second overhanging area 2221.
- the area with a large area is used as In the dispensing area, one-side dispensing is performed.
- the area of the first overhanging region 2211 with the shaded part is larger than the area of the second overhanging region 2221, and the first overhanging region 2211 is the dispensing area.
- the area of the shaded second overhanging area 2221 is larger than the area of the first overhanging area 2211, and the second overhanging area 2221 is a dispensing area.
- glue can be dispensed only on the overhanging area with a large area, and there is no need to dispense glue on the overhanging area with a small area.
- the capillary phenomenon is used to make the glue infiltrate or diffuse between the circuit board 230 and the substrate 220 to achieve Waterproof between the circuit board 230 and the substrate 220.
- glue 201 can be applied only on a part of the extended area of the substrate 220 along the x-direction with a larger area, so that the capillary phenomenon can be used to make the glue 201 finally infiltrate or diffuse into the circuit Between the board 230 and the substrate 220.
- connection part 231 The part where the circuit board 230 and the substrate 220 are fixedly connected is referred to as the connection part 231.
- the projection of the substrate 220 on the xy plane surrounds the projection of the connecting portion 231 on the xy plane.
- the projection of the substrate 220 on the xy plane can be compared with the projection of the circuit board 230 on the xy plane.
- the portion of the circuit board 230 corresponding to the area where the projections of the plane overlaps is denoted as the connecting portion 231.
- two extended areas for example, the first extended area and the second extended area respectively extending in the x direction from the two long sides of the connecting portion are provided on the substrate.
- Overhanging area the two overhanging areas are located between the two ends of the connecting part in the y direction and facing the surface of the circuit board.
- the overhanging area with a larger area is set as the glue dispensing Area, single-side dispensing can be performed on the dispensing area, so that the glue can infiltrate or diffuse between the circuit board and the substrate by capillary phenomenon, so as to realize the waterproof between the circuit board and the substrate.
- this structure with only one dispensing area on the substrate is very suitable for the case where the size of the substrate in the x-direction is small (for example, the substrate in any structure corresponding to FIG. 2 to FIG. 5).
- Figure 8 shows two other structures for single-side glue dispensing that are different from those in Figure 7.
- only one extended area extending from the circuit board in the x direction may be provided on the surface of the substrate facing the circuit board, and the extended area is the glue dispensing area.
- the second long side 222 of the substrate 220 is flush with the second long side 2312 of the connecting portion 231, and the first long side 221 of the substrate 220 is opposite to the first long side 2311 of the connecting portion 231 Extending in the x-direction, the first long side 221 of the substrate 220 is located outside of the first long side 2311 of the connecting portion 231.
- the first long side 221 of the substrate 220 can be extended relative to the first long side 2311 of the connecting portion 231 and extending in the y direction of the connecting portion 231.
- the area between the two ends is used as the dispensing area.
- the first long side 221 of the substrate 220 is flush with the first long side 2311 of the connecting portion 231, and the second long side 222 of the substrate 220 is opposite to the second long side 2312 of the connecting portion 231 Extending in the x-direction, the second long side 222 of the substrate 220 is located outside the second long side 2312 of the connecting portion 231.
- the second long side 222 of the substrate 220 can be extended relative to the second long side 2312 of the connecting portion 231 and positioned at two sides of the connecting portion 231 in the y direction.
- the area between the ends is used as the dispensing area.
- one of the two long sides of the substrate opposite in the x direction is flush with one of the long sides of the connection part located on the same side of the fingerprint identification device.
- the other long side is located outside the long side of the connection part on the same side.
- the long side of the substrate can be extended relative to the long side of the connection part, and the connection part is in y
- the area between the two ends of the direction is used as a dispensing area to perform single-sided dispensing on the dispensing area.
- the capillary phenomenon causes the glue to infiltrate or diffuse between the circuit board and the substrate to realize the gap between the circuit board and the substrate. Waterproof.
- this structure in which only one dispensing area is provided on the substrate is very suitable, and the waterproof effect between the substrate and the circuit board can also be achieved.
- the dispensing area is provided on the area of the substrate protruding from the circuit board in the x direction on the surface of the substrate facing the circuit board.
- the embodiment of the present application may also extend the substrate from the circuit board in the y direction
- a dispensing area is set on the area to further achieve a better waterproof effect.
- the substrate 220 may be positioned on the surface of the circuit board 230 between a short side 2314 of the connecting portion 231 and a short side 220 of the substrate 220 on the same side.
- the area is used as the glue dispensing area, which can be a part or all of the glue dispensing area for dispensing.
- glue 202 can be applied to the area between the short side 2314 of the connecting portion and the short side 220 of the substrate 220 on the same side.
- the fingerprint identification device can be combined with the function keys such as the volume key or the power button originally arranged on the side of the electronic device, so that the user can press the fingerprint identification device and the function keys at the same time.
- the function of fingerprint recognition and function keys In this embodiment, a circuit board with a U-shaped structure can be provided to simultaneously realize the electrical connection between the fingerprint identification device and the function keys.
- the fingerprint identification device 20 includes a fingerprint identification component 210, a substrate 220, and a circuit board 230 with a U-shaped structure arranged in sequence along the z direction.
- the circuit board 230 includes a first part 232, a bent part 233, and a second part. 234.
- the bending part 233 is curved and connects the first part 232 and the second part 234, and the first part 232 is disposed between the substrate 220 and the second part 234.
- the first part 232 is the part of the circuit board 230 that is closest to the substrate 220 and is fixedly connected to the substrate 230.
- the second part 234 is a part extending from the bent part 233 in a direction away from the second part 233.
- the first part 232 It is approximately parallel or substantially parallel to the second portion 234.
- the fingerprint identification device 20 further includes a reinforcing component 242 and a reinforcing component 243, the reinforcing component 242 is fixedly connected to the first part 232 of the circuit board 230, and the reinforcing component 243 is connected to the first part of the circuit board 230.
- the two parts 234 are fixedly connected.
- the fingerprint identification device 20 may also include any one of the reinforcing component 242 or the reinforcing component 243, which is not limited in the embodiment of the present application.
- the function key 250 can be fixedly connected to the surface of the second part 234 of the U-shaped circuit board 230 away from the first part 232 to realize the connection between the function key 250 and the circuit board.
- Mechanical connection and electrical connection can be fixedly connected to the surface of the second part 234 of the U-shaped circuit board 230 away from the first part 232 to realize the connection between the function key 250 and the circuit board.
- a conductive base may be provided in the electronic device, and the conductive base is fixedly connected to the reinforcing bracket 40 or the main body 10. The conductive base is in contact with the function key. .
- the material of the conductive base is a non-metallic material.
- Non-metallic materials can be rubber, rubber, TPU and other materials with softer surface hardness than metal and weak elasticity, so that the function key is not easily damaged when the function key is pressed against the conductive base.
- FIG. 10 shows a schematic structural diagram of an electronic device according to an embodiment of the application.
- the electronic device includes a main body 10, a fingerprint recognition device 20, a reinforcing bracket 40, and a conductive base 50.
- the fingerprint recognition device 20 includes a fingerprint recognition assembly 210, a substrate 220, and a U-shaped structure sequentially arranged along the z direction.
- the circuit board 230, the reinforcing member 242 fixedly connected to the first part 232 of the circuit board 230, the reinforcing member 243 fixedly connected to the second part 234 of the circuit board 230, and the reinforcing member 243 arranged opposite to the reinforcing member 243 are fixedly connected to the circuit board
- the function key 250 of the second part 234 of the 230 is in contact with the conductive base 50, the conductive base 50 is fixedly connected to the reinforcing bracket 40, and the reinforcing bracket 40 is fixedly connected to the main body 10.
- the fingerprint identification device 20 moves along the z direction toward the inside of the main body 10 by a certain displacement, and the function key 250 is pressed into contact with the conductive base 50 to simultaneously realize fingerprint identification And function keys.
- the circuit board 230 can be bent at an angle of approximately 180 degrees around the x direction to form a U-shaped structure such as that shown in FIG. 11 Circuit board.
- the reinforcing part 242 and the reinforcing part 243 can be fixedly connected to the circuit board 230 respectively.
- the first part 232 and the second part 234 of the first part 232 and the second part 234, and subsequently, the circuit board 230 fixedly connected with the reinforcing member 242 and the reinforcing member 243 is bent at an angle of approximately 180 degrees around the x direction to form a U-shaped structure such as shown in FIG. 11 Circuit board.
- the area where the circuit board starts to bend and how much to bend are preset in advance. After the circuit board is bent, in order to determine whether the bent circuit board is in the preset position In order to meet the standard, it is necessary to perform positioning detection on the bent circuit board.
- the prior art proposes to use copying ink to make positioning marks on the circuit board or reinforcing parts, and to detect whether the circuit board with the U-shaped structure formed after bending meets the positioning requirements by detecting the positioning marks.
- the ink production process will increase the cost.
- the embodiment of the present application provides a fingerprint recognition device including a circuit board or a reinforcement component with a positioning structure.
- the positioning detection is performed through the positioning structure of the circuit board or the reinforcement component itself, which can reduce the manufacturing process and reduce cost.
- the positioning structure can be used to detect whether the positioning of the bent circuit board in the x direction and/or the y direction meets the positioning requirements.
- the detection of whether the positioning of the circuit board in the x direction and/or the y direction meets the positioning requirements is actually detected is whether the positioning of the second part of the circuit board in the x direction and/or the y direction meets the requirements ,
- the detection direction is z direction.
- the second portion 234 of the circuit board 230 includes a first positioning portion 2341 close to the reference side surface 225 of the substrate 220, the reference side surface 225 is connected to the first long side 221 of the substrate 220 and the second long side of the substrate 220
- the side surface of the side surface, where the first positioning portion 2341 can be used to detect whether the positioning of the second portion 234 of the bent circuit board 230 in the x direction meets the requirements.
- the first positioning portion 2341 includes two stepped sides facing each other in the x direction, denoted as a first stepped side and a second stepped side.
- the first stepped side includes an inner side 2341-11, an outer side 2341-12 and The connecting side surface 2341-13 connecting the inner side surface 2341-11 and the outer side surface 2341-12
- the second step side surface includes the inner side surface 2341-21, the outer side surface 2341-22 and the connection connecting the inner side surface 2341-21 and the outer side surface 2341-22
- the side surfaces 2341-23, the connecting side surfaces 2341-13, and the connecting side surfaces 2341-23 are respectively located on both sides of the reference side surface 225 of the substrate 220. For example, as shown in (c) of FIG.
- the connecting side surface 2341-13 is located on the reference side surface 225
- the connecting side surface 2341-23 is located on the inner side of the reference side surface 225.
- the connecting side surface 2341-13 is located on the inner side of the reference side surface 225
- the connecting side surface 2341-23 is located on the outer side of the reference side surface 225 (not shown in the figure). ).
- the first positioning portion 2341 can be understood as a nearby area located near the two connecting sides.
- the nearby area includes a stepped side.
- the stepped side includes an inner side, an outer side, and a connecting side.
- the inner side is close to the center of the circuit board relative to the outer side.
- the first positioning portion 2341 is close to the bent portion 233 of the circuit board 230.
- the first positioning portion 2341 can be various possible structures in the second portion 234 close to the reference surface 225, as long as two stepped side surfaces can be formed, and the connecting side surfaces of the two stepped side surfaces are respectively located on both sides of the reference side surface.
- the first positioning portion 2341 may be a structure formed by the second portion 234 protruding from both ends of the reference side surface 225 close to the reference side surface 225. This structure can be well adapted to the width of the circuit board. Smaller case.
- the first positioning portion 2341 may also be a structure formed by recessing the two ends of the second portion 234 close to the reference side surface 225 inward, and this structure can be well suited for circuits. When the width of the board is large.
- the reference side is the side located between the two long sides of the substrate.
- a short side of the substrate 220 can be understood as a reference side.
- the reference side can be a flat surface or a curved surface.
- the edge of the reference side can be, for example, Figure 13
- the arc shape shown may also be a shape such as a slope, and the embodiment of the present application does not make any limitation.
- the connecting side surface of the side surface of the step may be, for example, an arc surface as shown in FIG. 13 or a plane shown in (a) of FIG. 15, and the embodiment of the present application does not make any limitation.
- the distance between the connecting side and the reference side can be limited within the allowable error range, which is recorded as ⁇ x for easy detection.
- the distance between the two side surfaces in the direction perpendicular to the reference side surface can be basically the same, which is convenient for detection.
- the edge of the reference side surface 225 may be, for example, a curved surface as shown in FIG. 13, or only the edge of the reference side surface 225 may be a curved surface, or the entire reference side surface 225 may be a curved surface.
- the distance between the side surface and the reference side surface 225 is kept consistent to facilitate detection, so that the edge of the reference side surface 225 is a curved surface and the connecting side surface of each step side surface is also a curved surface.
- the detection standard is also different due to the positional relationship between the connecting side surface of the side surface of the step and the long side surface of the substrate.
- the maximum width dimension of the first positioning portion 2341 is greater than the width dimension of the substrate, so that at least part of the connecting side surface protrudes from the long side surface of the substrate, during the process of bending the circuit board 230
- the second part 234 can be regarded as The positioning in the x direction meets the requirements.
- the second part of the circuit board is provided with a first positioning part for detecting the positioning of the second part in the x direction
- the first positioning part includes two side steps. Including the connecting side surface, using the relative position relationship between the two connecting side surfaces and the reference side surface of the substrate to detect the positioning of the second part of the circuit board in the x direction, which can reduce the manufacturing process and reduce the cost.
- the connecting side surfaces of the two stepped side surfaces of the first positioning portion are respectively located on both sides of the reference side surface of the substrate, that is, the positioning of the second portion of the circuit board in the x direction can be considered to meet the requirements.
- the second portion 234 of the circuit board 230 includes a second positioning portion 2342, which can be used to detect whether the positioning of the second portion 234 of the bent circuit board 230 in the y direction meets the requirements.
- the second positioning portion 2342 includes two long sides opposite in the x direction, denoted as the first long side 2342-1 and the second long side 2342-2, and each long side of the second positioning portion 2342 is located It is on the inner side of the long side of the substrate 220 on the same side.
- the first long side 2342-1 of the second positioning portion 2342 and the first long side 221 of the substrate 220 are arranged on one side of the fingerprint identification device 20, and the second long side 2342-2 of the second positioning portion 2342 and The second long side 222 of the substrate 220 is arranged on the other side of the fingerprint identification device 20, wherein the first long side 2342-1 of the second positioning portion 2342 is retracted in the x direction relative to the first long side 221 of the substrate 220 That is, the first long side 2342-1 of the second positioning portion 2342 is located inside the first long side 221 of the substrate 220, and the second long side 2342-2 of the second positioning portion 2342 is opposite to the second long side 222 of the substrate 220. Retracted in the x direction, that is, the second long side surface 2342-2 of the second positioning portion 2342 is located inside the second long side surface 222 of the substrate 220.
- the second positioning portion 2342 may be any area of the second portion 234, and there is no limitation here.
- the second positioning portion 2342 may be an area near an end of the second portion 234 away from the bent portion 233 of the circuit board 230.
- the size of the second positioning portion 2342 is smaller than the size of the substrate 220, and the distance between each long side of the substrate 220 and the long side of the second positioning portion located on the same side can be limited Within the allowable error range, it is recorded as ⁇ y for easy detection.
- the second part of the circuit board is provided with a second positioning part for detecting the positioning of the second part in the y direction
- the first positioning part includes the opposite
- the relative position relationship between the two long sides and the long side of the substrate is used to detect the rated position of the second part of the circuit board in the y direction, which can reduce the manufacturing process and reduce the cost.
- each long side of the second positioning part is located inside the long side of the substrate on the same side, that is, the positioning of the second part of the circuit board in the y direction is considered to meet the requirements.
- the reinforcing part 242 and the reinforcing part 243 can be fixedly connected to the circuit board 230.
- the first part 232 and the second part 234 of the first part 232 and the second part 234, and subsequently, the circuit board 230 fixedly connected with the reinforcing member 242 and the reinforcing member 243 is bent at an angle of approximately 180 degrees around the x direction to form a U-shaped structure such as shown in FIG. 11 Circuit board.
- the positioning structure on the reinforcement component fixedly connected to the second part can be used to detect whether the positioning of the second part of the circuit board is indirectly. fulfil requirements.
- the reinforcing member 243 includes a third positioning portion 2431 close to the reference side surface 225 of the substrate 220, the reference side surface 225 is a side surface connecting the first long side 221 of the substrate 220 and the second long side 222 of the substrate 220
- the third positioning portion 2341 can be used to detect whether the positioning of the second portion 234 of the bent circuit board 230 in the x direction meets the requirements.
- the third positioning portion 2431 includes two stepped sides facing each other in the x direction, denoted as the third stepped side and the fourth stepped side.
- the third stepped side includes the inner side 2431-11, the outer side 2431-12 and The connecting side surface 2431-13 connecting the inner side surface 2431-11 and the outer side surface 2431-12
- the fourth step side includes the inner side surface 2431-21, the outer side surface 2431-22 and the connection connecting the inner side surface 2431-21 and the outer side surface 2431-22
- the side surfaces 2431-23, the connecting side surfaces 2431-13 and the connecting side surfaces 2431-23 are respectively located on both sides of the reference side surface 225 of the substrate 220. For example, as shown in (c) of FIG.
- the connecting side surface 2431-13 is located on the reference side surface 225
- the connecting side surface 2431-23 is located on the inner side of the reference side surface 225.
- the connecting side surface 2431-13 is located on the inner side of the reference side surface 225
- the connecting side surface 2431-23 is located on the outer side of the reference side surface 225 (not shown in the figure). ).
- the third positioning portion 2431 can be understood as the nearby area of the reinforcing component near the two connecting sides.
- the nearby area includes the stepped side.
- the stepped side includes the inner side, the outer side and the connecting side.
- the inner side is close to the center of the circuit board relative to the outer side. .
- the third positioning portion 2431 is close to the bent portion 233 of the circuit board 230.
- the third positioning portion 2431 can be various possible structures of the reinforcing member 243 close to the reference surface 225, as long as it can be formed as two stepped sides, and the connecting side surfaces of the two stepped sides are located on both sides of the reference side. .
- the third positioning portion 2431 may be a structure formed by a reinforcing member 243 protruding from both ends of the reference side surface 225 close to the reference side surface 225. This structure may be well suited for repairing When the width of the strong part is small.
- the third positioning portion 2431 may also be a structure formed by the reinforcement member 243 being recessed inward at both ends close to the reference side surface 225, and this structure can be well suited for compensation. When the width of the strong part is large.
- the reference side surface 220 may be a flat surface or a curved surface.
- the edge of the reference side surface may be, for example, an arc shape as shown in FIG. 17, or a bevel shape, etc., which is not limited in the embodiment of the present application.
- the connecting side surface of the stepped side surface of the reinforcing member may be, for example, an arc surface as shown in FIG. 17, or a plane as shown in (a) of FIG. 18, and the embodiment of the present application does not make any limitation.
- the distance between the connecting side surface of the reinforcing component and the reference side surface of the base plate can be limited within the allowable error range to facilitate detection.
- the edge of the reference side surface 225 may be a curved surface as shown in FIG. 17, for example, only the edge of the reference side surface 225 may be a curved surface, or the entire reference side surface 225 may be a curved surface.
- the distance between the connecting side surface of the strong component and the reference side surface 225 of the substrate is kept consistent for easy detection.
- the edge of the reference side surface 225 can be curved and the connecting side surface of each step side of the reinforcing component is also curved.
- the detection standard also differs due to the positional relationship between the connecting side surface of the step side surface of the reinforcing member and the long side surface of the substrate.
- the connecting side surfaces of the reinforcing member 243 are all located inside the long side surface of the substrate .
- the connecting side surface 2431-13 of the reinforcing member can be seen, which means that the connecting side surface 2431-23 is already located inside the reference side surface 225, it can be considered
- the positioning of the second part 234 of the circuit board 230 in the x direction meets the requirements.
- the circuit board is bent In the process of 230, when viewed from the z direction, if the connecting side surface 2431-13 is seen outside the reference side surface 225, and the connecting side surface 2431-23 is seen inside the reference side surface 225, then the second part 234 of the circuit board 230 can be considered The positioning in the x direction meets the requirements.
- the reinforcing component fixedly connected to the second part of the circuit board is provided with a third positioning part for detecting the positioning of the second part in the x direction
- the third positioning part includes There are two step side surfaces, and the step side surface has a connecting side surface, and the positioning of the second part of the circuit board in the x-direction is detected by the relative position relationship between the two connecting side surfaces and the reference side surface of the substrate, which can reduce the manufacturing process and reduce the cost.
- the connecting side surfaces of the two step side surfaces of the third positioning portion are respectively located on both sides of the reference side surface of the substrate, that is, the positioning of the second portion of the circuit board in the x direction can be considered to meet the requirements.
- the reinforcing member 243 includes a fourth positioning portion 2432, which can be used to detect whether the positioning of the second portion 234 of the bent circuit board 230 in the y direction meets the requirements.
- the fourth positioning portion 2432 includes two long sides opposite in the x direction, denoted as the first long side 2432-1 and the second long side 2432-2, and each long side of the fourth positioning portion 2432 is located at It is on the inner side of the long side of the substrate 220 on the same side.
- the first long side 2432-2 of the fourth positioning portion 2432 and the first long side 221 of the substrate 220 are located on one side of the fingerprint identification device, and the second long side 2432-2 of the fourth positioning portion 2432 and the substrate 220
- the second long side 222 of the fourth positioning portion 2432 is located on the other side of the fingerprint identification device.
- the first long side 2432-1 of the fourth positioning portion 2432 is retracted in the x direction relative to the first long side 221 of the substrate 220.
- a long side surface 2432-1 is located inside the first long side surface 221 of the base plate 220
- the second long side surface 2432-2 of the fourth positioning portion 2432 is retracted in the x direction relative to the second long side surface 222 of the base plate 220
- the fourth positioning portion The second long side 2432-2 of the 2432 is located inside the second long side 222 of the substrate 220.
- the fourth positioning portion 2432 may be any area of the reinforcing member 243, and there is no limitation here.
- the fourth positioning portion 2432 may be an area near one end of the reinforcing member 243 far away from the bent portion 233 of the circuit board 230.
- the size of the fourth positioning portion 2432 is smaller than the size of the substrate 220, and the distance between each long side of the substrate 220 and the long side of the fourth positioning portion located on the same side can be limited Within the allowable error range, it is recorded as ⁇ y for easy detection.
- the reinforcing component is provided with a fourth positioning part for detecting the positioning of the second part of the circuit board in the y direction, and the fourth positioning part includes two opposite positions in the x direction.
- the long side surface uses the relative position relationship between the two long side surfaces and the long side surface of the substrate to detect the rated position of the second part of the circuit board in the y direction, which can reduce the manufacturing process and reduce the cost.
- each long side is located on the inner side of the long side of the substrate on the same side, that is, the positioning of the second part of the circuit board in the y direction is considered to meet the requirements.
- the fingerprint identification device of the embodiment of the present application is used to install the fingerprint identification device on the side of the electronic device. Specifically, the fingerprint identification device is installed by digging a hole on the side of the main body of the electronic device. In some scenarios, the side of the main body of the electronic device will have a certain curvature or tilt. In order to reflect the integration of the fingerprint identification device and the main body and improve the user's feel, the embodiment of the application proposes to improve the fingerprint chip assembly.
- the fingerprint chip assembly 210 includes a working surface 215 for contact with external objects.
- the working surface 215 is a curved surface (as shown in (a) in FIG. 20) or an inclined surface (as shown in (b) in FIG. 20). Show).
- the fingerprint chip assembly 210 generally consists of a chip 216 and an EMC housing that wraps the chip 216.
- the surface of the EMC housing for contact with external objects is the working surface of the fingerprint chip assembly 210.
- CNC computer number control
- the fingerprint identification device of the embodiment of the present application may be a capacitive fingerprint identification, using a chip and a conductive subcutaneous electrolyte to form a capacitance difference to obtain fingerprint information.
- a gain module can be provided in the fingerprint chip assembly to adjust the measured electrical signal.
- the finger is pressed on the working surface 215 of the fingerprint chip assembly 210, and a capacitance difference is formed between the working surface 215 and the chip 216.
- the chip 216 The distances from different areas of the working surface 215 to the working surface 215 are different. For example, continuing to refer to FIG. 20, the distance from point A on the working surface 215 to the chip 216 is short, and the measured electrical signal is strong, and the point B on the working surface 215 to the chip The distance of 216 is long, and the measured electric signal is weak. The measured electric signals of different sizes will affect the recognition effect.
- the embodiment of the present application proposes another fingerprint chip assembly.
- the working surface 215 includes multiple detection areas
- the fingerprint chip assembly 210 includes multiple gain modules corresponding to the multiple detection areas
- each gain module is used to adjust the electrical output detected by the fingerprint chip assembly 210 in the corresponding detection area.
- the gain of the signal, the gain of the signal adjusted by at least two gain modules is different.
- the at least two gain modules represent two or more gain modules, and the different gains of the signals adjusted by the at least two gain modules can be understood as adjustments by any two of the at least two gain modules The gain of the signal is different.
- the signal strength of the obtained signals can be made the same as much as possible to improve the recognition effect.
- the detection area on the working surface 215 can be divided according to the distance between the working surface 215 and the chip 216.
- a detection area can be understood as a line composed of multiple detection points, or a detection area can also be understood as including multiple detection points. area.
- FIG 21 is a schematic diagram of the detection area of the working surface.
- each vertex of each small square can be understood as an electrical signal for detecting (Or fingerprint signal) detection points, along the x direction, 8 lines are used to separate the working surface 215, it can be understood that the electrical signals detected at multiple detection points on each line in the x direction Approximately the same, the electrical signals detected at the detection points on two adjacent lines in the x direction are different. Therefore, for example, a gain module can be configured for all detection points on each line, or if the difference in electrical signals detected on the detection points on multiple lines is small, it can also be used for all the detection points on the multiple lines.
- the detection point is configured with a gain module.
- the detection points on the two lines shown in Figure 21 can be configured with a gain module.
- a detection area can be understood as two lines including multiple detection points, or a detection area is also It can be understood as an area including a line formed by a plurality of detection points (for example, a plurality of small squares formed by the first line and the second line).
- a detection area can be understood as two lines including multiple detection points, or a detection area is also It can be understood as an area including a line formed by a plurality of detection points (for example, a plurality of small squares formed by the first line and the second line).
- the edge of the working surface in the fingerprint chip assembly 210 that is used for contact with external objects can be chamfered or rounded to form a curved or inclined surface.
- the width of the fingerprint identification device is narrowed in terms of vision and hand feel, thereby improving user experience.
- the working surface of the fingerprint chip assembly 210 can be understood as a surface touched by a finger, which receives the pressing of the user's finger.
- the fingerprint chip assembly 210 includes a working surface 215, and the edge 215-A of the working surface 215 is a bevel, which can be obtained by chamfering the edge of the working surface 215.
- the edge 215-A of the working surface 215 is a curved surface, which can be obtained by rounding the edge of the working surface 215.
- the intersection of the working surface 215 and the side surface of the fingerprint chip assembly 210 is an inclined surface or a circular arc surface, and the side surface is a surface formed around the working surface 215.
- the embodiment of the present application also provides an electronic device equipped with the above-mentioned fingerprint identification device.
- the electronic device includes a main body 10 and a fingerprint identification device 20.
- the side of the main body 10 is provided with 101,
- the fingerprint identification device 20 passes through the hole 101 and is connected to the main body 10.
- the main body 10 is integrally formed, and the electronic device further includes a reinforcing bracket 40 which is fixedly connected to the main body 10 and the fingerprint identification device 20 respectively.
- the fingerprint identification device 20 includes a fingerprint chip assembly 210, a substrate 220, and a circuit board 230 arranged in sequence.
- the circuit board 230 may be a circuit board with a U-shaped structure.
- the fingerprint identification device 20 further includes a reinforcing component 240 fixedly connected to the circuit board 230.
- connection in the embodiments of the present application, unless otherwise clearly defined and defined, the terms “connection”, “fixed connection” and “contact” should be interpreted broadly.
- connection in the embodiments of the present application, unless otherwise clearly defined and defined, the terms “connection”, “fixed connection” and “contact” should be interpreted broadly.
- connection in the embodiments of the present application, unless otherwise clearly defined and defined, the terms “connection”, “fixed connection” and “contact” should be interpreted broadly.
- connection in the embodiments of the present application, unless otherwise clearly defined and defined, the terms “connection”, “fixed connection” and “contact” should be interpreted broadly.
- specific meanings of the above various terms in the embodiments of the present application can be understood according to specific conditions.
- connection it can be fixed connection, rotating connection, flexible connection, mobile connection, integral molding, electrical connection, etc.; it can be directly connected, or, can be indirectly connected through an intermediate medium, or , It can be the internal communication between two elements or the interaction between two elements.
- fixed connection one element can be directly or indirectly fixedly connected to another element; fixed connection can include mechanical connection, welding, and bonding, among which mechanical connection can include riveting, bolting, Thread connection, key pin connection, snap connection, lock connection, plug-in connection, etc.
- the bonding can include adhesive bonding and solvent bonding.
- contact can mean that one element is in direct or indirect contact with another element.
- contact between two elements described in the embodiments of this application can be understood as being within the allowable range of installation error In the internal contact, there may be a small gap due to installation errors.
- first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
- the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
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Abstract
本申请提供了一种指纹识别装置和电子设备,该指纹识别装置包括指纹芯片组件和基板,通过对基板做改进,使得基板在基板的宽度方向(x方向)上相对的两个长侧面中的一个长侧面与位于同侧的指纹芯片组件的一个长侧面平齐,基板的两个长侧面之间的尺寸大于所述指纹芯片组件的两个长侧面之间的尺寸,可以有效减少指纹识别装置在x方向的尺寸,从而,在将指纹识别装置安装在电子设备的侧面上时,可以有效减少电子设备的主体在x方向的尺寸,以减少电子设备的整体厚度。
Description
本申请要求于2019年8月19日提交中国专利局、申请号为201910764023.2、申请名称为“指纹识别的装置和电子设备”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
本申请涉及电子设备领域,更具体地,涉及电子设备中的指纹识别装置和电子设备。
随着全面屏的不断普及,将指纹识别装置安装在电子设备的侧面的结构得到应用,但是,由于指纹识别装置会占据电子设备的中框的厚度,会增加电子设备的整机厚度,影响用户体验。
发明内容
本申请提供一种指纹识别装置和电子设备,通过对基板做改进,使得基板在x方向(指纹识别装置的宽度方向)上相对的两个长侧面中的一个长侧面与位于同侧的指纹芯片组件的一个长侧面平齐,基板的两个长侧面之间的尺寸大于指纹芯片组件的两个长侧面之间的尺寸,可以有效减少指纹识别装置在x方向的尺寸,从而,在将指纹识别装置安装在电子设备的侧面上时,可以有效地减少电子设备的主体在x方向的尺寸,以减少电子设备的整体厚度。
第一方面,提供了一种指纹识别装置,包括:
指纹芯片组件,包括在第一方向上相对的两个长侧面,所述第一方向平行于所述基板的宽度方向;
基板,固定连接在所述指纹芯片组件上,包括在所述第一方向上相对的两个长侧面,其中,所述基板的两个长侧面之间的尺寸大于所述指纹芯片组件的两个长侧面之间的尺寸,所述基板的一个长侧面和位于同侧的所述指纹芯片组件的一个长侧面平齐。
因此,本申请实施例提供的指纹识别装置,通过对基板做相关设计,使得基板在x方向(指纹识别装置的宽度方向)上相对的两个长侧面中的一个长侧面与位于同侧的指纹芯片组件的一个长侧面平齐,基板的两个长侧面之间的尺寸大于所述指纹芯片组件的两个长侧面之间的尺寸,使得基板的另一个长侧面相对位于同侧的指纹芯片组件的长侧面外伸,在可以通过基板的长侧面相对位于同侧的指纹芯片组件的侧面外伸的部分与电子设备的主体配合以将指纹识别装置卡设在主体的同时,可以有效地减少指纹识别装置在x方向的尺寸,从而,在将指纹识别装置安装在主体的侧面上时,可以有效地减少主体在x方向的尺寸,以减少电子设备的整体厚度。
此外,对于相同尺寸的主体,本申请实施例的指纹识别装置也可以减少在主体上切除 的部分,可以有效地提高整机强度。
可选地,所述指纹识别装置还包括:
设置在所述基板上背离所述指纹芯片组件的一侧的U型结构的电路板,包括第一部分、弯折部分和第二部分,所述弯折部分连接所述第一部分和所述第二部分,所述第一部分位于所述基板与所述第二部分之间。
因此,本申请实施例提供的指纹识别装置,通过设置U型结构的电路板,可以在U型结构的电路板的第一部分和第二部分分别安装指纹识别装置和功能键,以同时实现针对指纹识别装置和功能键的电连接,可以减少电子设备的侧面的按键,以提高电子设备的简洁美观度。
可选地,所述第二部分包括靠近所述基板的基准侧面的第一定位部分,所述第一定位部分包括在所述第一方向上相对的两个台阶侧面,所述第一定位部分的台阶侧面包括内侧面、外侧面和连接所述内侧面与所述外侧面的连接侧面,所述第一定位部分的两个连接侧面分别位于所述基准侧面的两侧,所述基准侧面是连接所述基板的两个长侧面的短侧面。
因此,本申请实施例提供的指纹识别装置,电路板的第二部分上设置有用于检测第二部分在x方向的定位的第一定位部分,该第一定位部分包括两个台阶侧面,台阶侧面具有连接侧面,利用两个连接侧面与基板的基准侧面的相对位置关系检测电路板的第二部分在x方向的定位,可以减少制作工序,以减少成本。具体地,第一定位部分的两个台阶侧面的连接侧面分别位于基板的基准侧面的两侧,即可认为电路板的第二部分在x方向的定位满足要求。
可选地,所述第一定位部分靠近所述电路板的弯折部分。
可选地,所述第二部分包括第二定位部分,所述第二定位部分包括在所述第一方向上相对的两个长侧面,所述第二定位部分的每个长侧面都位于处于同侧的所述基板的长侧面的内侧。
因此,本申请实施例提供的指纹识别装置,电路板的第二部分上设置有用于检测该第二部分在y方向的定位的第二定位部分,该第一定位部分包括在x方向上相对的两个长侧面,利用两个长侧面与基板的长侧面的相对位置关系检测电路板的第二部分在y方向的额定位,可以减少制作工序,以减少成本。具体地,第二定位部分的每个长侧面都位于处于同侧的基板的长侧面的内侧,即可认为电路板的第二部分在y方向的定位满足要求。
可选地,所述指纹识别装置还包括固定连接在所述第二部分中朝向所述第一部分的表面上的补强部件;以及,
所述补强部件包括靠近所述基板的基准侧面的第三定位部分,所述第三定位部分包括在所述第一方向上相对的两个台阶侧面,所述第三定位部分的台阶侧面包括内侧面、外侧面和连接所述内侧面与所述外侧面的连接侧面,所述第三定位部分的两个连接侧面分别位于所述基准侧面的两侧,所述基准侧面是连接所述基板的两个长侧面的短侧面。
因此,本申请实施例提供的指纹识别装置,固定连接在电路板的第二部分上的补强部件设置有用于检测第二部分在x方向的定位的第三定位部分,该第三定位部分包括两个台阶侧面,台阶侧面具有连接侧面,利用两个连接侧面与基板的基准侧面的相对位置关系检测电路板的第二部分在x方向的定位,可以减少制作工序,以减少成本。具体地,第三定位部分的两个台阶侧面的连接侧面分别位于基板的基准侧面的两侧,即可认为电路板的第 二部分在x方向的定位满足要求。
可选地,所述第三定位部分靠近所述电路板的弯折部分。
可选地,所述指纹识别装置还包括固定连接在所述第二部分中朝向所述第一部分的表面上的补强部件;以及,
所述补强部件包括第四定位部分,所述第四定位部分包括在所述第一方向上相对的两个长侧面,所述第四定位部分的每个长侧面都位于处于同侧的所述基板的长侧面的内侧。
因此,本申请实施例提供的指纹识别装置,补强部件设置有用于检测电路板的第二部分在y方向的定位的第四定位部分,该第四定位部分包括在x方向上相对的两个长侧面,利用两个长侧面与基板的长侧面的相对位置关系检测电路板的第二部分在y方向的额定位,可以减少制作工序,以减少成本。具体地,每个长侧面都位于同侧的基板的长侧面的内侧,即可认为电路板的第二部分在y方向的定位满足要求。
可选地,所述指纹芯片组件包括用于和外部物体接触的工作表面,所述工作表面为斜面或弧面。
因此,本申请实施例提供的指纹识别装置,通过将指纹芯片组件的工作表面设置为斜面或弧面,可以很好地应用于电子设备的主体的侧面具有弧度或倾斜的场景中,以提高指纹识别装置与主体结合的一体性以及用户的使用手感。
可选地,所述工作表面包括多个检测区域,所述指纹芯片组件包括对应所述多个检测区域的多个增益模块,每个增益模块用于调节所述指纹芯片组件在对应的检测区域检测到的信号的增益,所述多个增益模块中的至少两个增益模块所调节的信号的增益不同。
因此,本申请实施例提供的指纹识别装置,在指纹芯片组件的工作表面是斜面或弧面的情况下,通过设置多个增益模块,一个增益模块检测在工作表面的一个检测区域上检测到的电信号的增益,至少两个增益模块所调节的信号的增益不同,可以尽可能使得信号的信号强度相同,以提高识别效果。
可选地,所述指纹芯片组件包括用于和外部物体接触的工作表面,所述工作表面的边缘为弧面或斜面。
因此,本申请实施例提供的指纹识别装置,通过将指纹芯片组件的工作表面的边缘设置为弧面或斜面,可以使得指纹识别装置的宽度在视觉和手感上变窄,从而提高用户体验。
可选地,所述指纹识别装置还包括:
设置在所述基板上背离所述指纹芯片组件的一侧的电路板,包括固定连接在所述基板上的连接部分,所述基板包括自所述连接部分在所述第一方向上相对的两个长侧边分别沿所述第一方向都外伸的第一外伸区域和第二外伸区域,所述第一外伸区域和所述第二外伸区域是位于所述连接部分在第二方向的两端之间且朝向所述电路板的表面的区域,所述第一外伸区域和所述第二外伸区域中面积较大的外伸区域是点胶区域,所述第二方向平行于所述基板的长度方向。
因此,本申请实施例提供的指纹识别装置,通过在基板上设置自连接部分的两个长侧边分别沿x方向都外伸的两个外伸区域(例如,第一外伸区域和第二外伸区域),该两个外伸区域都是位于连接部分在y方向的两端之间且朝向电路板的表面的区域,将面积较大的外伸区域设置为用于点胶的点胶区域,可以在该点胶区域上进行单侧点胶,以通过毛细现象使得胶水浸润或扩散至电路板与基板之间,以实现电路板和基板之间的防水。特别地, 这种在基板上仅设置一个点胶区域的结构非常适用于基板在x方向的尺寸较小的情况,同样可以实现基板和电路板之间的防水效果。
可选地,所述指纹芯片组件包括在第二方向上相对的两个短侧面,所述基板包括在所述第二方向上相对的两个短侧面,所述基板的每个短侧面位于处于同侧的所述指纹芯片组件的短侧面的外侧,所述第二方向平行于所所述基板的长度方向。
第二方面,提供了一种指纹识别装置,包括:
基板,包括在第一方向上相对的两个长侧面和连接两个所述长侧面的基准侧面,所述第一方向平行于所述基板的宽度方向;
电路板,设置在所述基板的一侧,包括第一部分、弯折部分和第二部分,所述弯折部分连接所述第一部分和所述第二部分,所述第一部分位于所述基板与所述第二部分之间,其中,所述电路板的第二部分包括靠近所述基板的基准侧面的第一定位部分,所述第一定位部分包括在所述第一方向上相对的两个台阶侧面,所述台阶侧面包括内侧面、外侧面和连接所述内侧面与所述外侧面的连接侧面,两个所述连接侧面分别位于所述基准侧面的两侧。
因此,本申请实施例提供的指纹识别装置,电路板的第二部分上设置有用于检测第二部分在x方向的定位的第一定位部分,该第一定位部分包括两个台阶侧面,台阶侧面具有连接侧面,利用两个连接侧面与基板的基准侧面的相对位置关系检测电路板的第二部分在x方向的定位,可以减少制作工序,以减少成本。具体地,第一定位部分的两个台阶侧面的连接侧面分别位于基板的基准侧面的两侧,即可认为电路板的第二部分在x方向的定位满足要求。
可选地,所述第一定位部分靠近所述电路板的弯折部分。
可选地,所述电路板的第二部分包括第二定位部分,所述第二定位部分包括在所述第一方向上相对的两个长侧面,所述第二定位部分的每个长侧面都位于处于同侧的所述基板的长侧面的内侧。
因此,本申请实施例提供的指纹识别装置,电路板的第二部分上设置有用于检测该第二部分在y方向的定位的第二定位部分,该第一定位部分包括在x方向上相对的两个长侧面,利用两个长侧面与基板的长侧面的相对位置关系检测电路板的第二部分在y方向的额定位,可以减少制作工序,以减少成本。具体地,第二定位部分的每个长侧面都位于处于同侧的基板的长侧面的内侧,即可认为电路板的第二部分在y方向的定位满足要求。
第三方面,提供了一种指纹识别装置,包括:
基板,包括在第一方向上相对的两个长侧面和连接两个所述长侧面的基准侧面,所述第一方向平行于所述基板的宽度方向;
电路板,设置在所述基板的一侧,包括第一部分、弯折部分和第二部分,所述弯折部分连接所述第一部分和所述第二部分,所述第一部分位于所述基板与所述第二部分之间;
补强部件,固定连接在所述第二部分中朝向所述第一部分的表面上,其中,所述补强部件包括靠近所述基板的基准侧面的第三定位部分,所述第三定位部分包括在所述第一方向上相对的两个台阶侧面,所述台阶侧面包括内侧面、外侧面和连接所述内侧面与所述外侧面的连接侧面,两个所述连接侧面分别位于所述基准侧面的两侧。
因此,本申请实施例提供的指纹识别装置,固定连接在电路板的第二部分上的补强部 件设置有用于检测第二部分在x方向的定位的第三定位部分,该第三定位部分包括两个台阶侧面,台阶侧面具有连接侧面,利用两个连接侧面与基板的基准侧面的相对位置关系检测电路板的第二部分在x方向的定位,可以减少制作工序,以减少成本。具体地,第三定位部分的两个台阶侧面的连接侧面分别位于基板的基准侧面的两侧,即可认为电路板的第二部分在x方向的定位满足要求。
可选地,所述第三定位部分靠近所述电路板的弯折部分。
可选地,所述补强部件包括第四定位部分,所述第四定位部分包括在所述第一方向上相对的两个长侧面,所述第四定位部分的每个长侧面都位于处于同侧的所述基板的长侧面的内侧。
因此,本申请实施例提供的指纹识别装置,补强部件设置有用于检测电路板的第二部分在y方向的定位的第四定位部分,该第四定位部分包括在x方向上相对的两个长侧面,利用两个长侧面与基板的长侧面的相对位置关系检测电路板的第二部分在y方向的额定位,可以减少制作工序,以减少成本。具体地,每个长侧面都位于同侧的基板的长侧面的内侧,即可认为电路板的第二部分在y方向的定位满足要求。
第四方面,提供了一种电子设备,包括:
主体,所述主体的侧面上设置有孔;
上述第一方面中任一项可能的实现方式中的指纹识别装置,所述指纹识别装置穿过所述孔且连接于所述主体。
可选地,所述主体被一体成型;以及,
所述电子设备还包括补强支架,分别与所述主体和所述指纹识别装置固定连接。
因此,通过将主体一体成型,可以减少主体的尺寸,以减少电子设备的尺寸。
第五方面,提供了一种电子设备,包括:
主体,所述主体的侧面上设置有孔;
上述第二方面中任一种可能的实现方式中的指纹识别装置,所述指纹识别装置穿过所述孔且连接于所述主体。
可选地,所述主体包括一体成型;以及,
所述电子设备还包括补强支架,分别与所述主体和所述指纹识别装置固定连接。
第六方面,提供了一种电子设备,包括:
主体,所述主体的侧面上设置有孔;
上述第三方面中任一种可能的实现方式中的指纹识别装置,所述指纹识别装置穿过所述孔且连接于所述主体。
可选地,所述主体一体成型;以及,
所述电子设备还包括补强支架,分别与所述主体和所述指纹识别装置固定连接。
图1是本申请实施例的电子设备的示意性结构图。
图2是本申请实施例的指纹识别装置的示意性结构图。
图3是本申请实施例的指纹芯片组件和基板配合的结构的示意性结构图。
图4是本申请实施例的指纹识别装置的示意性结构图。
图5是本申请实施例的指纹识别装置、主体和支架的示意性结构图。
图6是本申请实施例的电子设备的局部区域的示意性截面图。
图7是本申请实施例的指纹识别装置的另一示意性结构图。
图8是本申请实施例的指纹识别装置的另一示意性结构图。
图9是本申请实施例的指纹识别装置的另一示意性结构图。
图10是本申请实施例的电子设备的局部区域的示意性截面图。
图11是本申请实施例的指纹识别装置的制作过程的示意图。
图12是本申请实施例的U型结构的电路板的示意性结构图。
图13是本申请实施例的指纹识别装置的另一示意性结构图。
图14是本申请实施例的指纹识别装置的另一示意性结构图。
图15是本申请实施例的指纹识别装置的另一示意性结构图。
图16是本申请实施例的补强部件的示意性结构图。
图17是本申请实施例的指纹识别装置的另一示意性结构图。
图18是本申请实施例的指纹识别装置的另一示意性结构图。
图19是本申请实施例的指纹识别装置的另一示意性结构图。
图20是本申请实施例的指纹芯片组件的示意性结构图。
图21是本申请实施例的指示芯片组件的工作表面的检测区域的示意图。
图22是本申请实施例的指纹识别装置的另一示意性结构图。
下面将结合附图,对本申请中的技术方案进行描述。
本申请实施例的电子设备可以是各种可能的配置有指纹识别装置的设备,例如,该电子设备可以是手机、平板电脑、手表或可穿戴设备等。
图1所示为本申请实施例的电子设备的示意性结构图。参考图1,电子设备100包括主体10、设置在主体10的侧面的孔101和指纹识别装置20,指纹识别装置20通过101安装在主体10上,可选地,电子设备100还包括屏幕30。以手机为例,主体10可以理解为手机的中框。
为了便于描述,首先,对本申请实施例的附图的坐标系进行说明。x、y和z方向两两垂直,x方向可以理解为指纹识别装置的宽度方向,y方向可以理解为指纹识别装置的长度方向,z方向可以理解为指纹识别装置的厚度方向。指纹识别装置可以安装在电子设备的长度方向上的侧面,也可以安装在电子设备的宽度方向上的侧面,本申请实施例不做限定。示例性地,本申请实施例以图1所示的指纹识别装置安装在电子设备的长度方向的侧面的结构为例,对指纹识别装置和电子设备的结构进行说明。下文中的第一方向为x方向,第二方向为y方向。
需要说明的是,本申请实施例多处描述了指纹识别装置的部件或结构的长侧面和短侧面之间的关系,应理解,长侧面应广义地理解为部件或结构在其长度方向(y方向)的侧面,短侧面应广义地理解为部件或结构在其宽度方向(x方向)的侧面。
本申请实施例对指纹识别装置做了多方面改进,以实现不同目的。
第一,如背景技术所述,将指纹识别装置安装在电子设备的侧面,会占据电子设备的 中框的厚度,会增加电子设备的整机厚度,影响用户体验。基于此,本申请实施例提供了一种指纹识别装置,通过对指纹识别装置的基板做改进,在可以保证基板与电子设备的主体配合的情况下,减少基板在基板的宽度方向(x方向)上的尺寸,以减少指纹识别装置在x方向的尺寸,使得指纹识别装置的宽度变窄,从而,可以和在x方向的尺寸较窄的主体配合连接,以减少电子设备在x方向的尺寸,达到减少整机厚度的目的。
第二、为了提高电路板与基板之间的防水性能,本申请实施例还提出了在基板的长度方向(y方向)的一侧进行单侧点胶的结构,可以很好地应用于基板的宽度方向(x方向)的尺寸较小的指纹识别装置中。
第三,本申请实施例还提出了一种在电路板或补强部件上设置有定位结构的指纹识别装置,通过在电路板或补强部件本身具有的定位结构进行定位检测,可以减少制作工序,以减少成本。
第四、为了体现指纹识别装置与主体结合的一体性以及提高用户的使用手感,本申请实施例还提出将指纹芯片组件的工作表面设计为弧面或斜面,基于此,也提出通过设计多个用于调节信号的增益的增益模块以提高识别效果的方案。
以下,结合图2至图22,对本申请实施例的指纹识别装置的各个方面的改进做详细说明。
第一方面
图2所示为本申请实施例的指纹识别装置的示意性结构图。图3所示为本申请实施例的指纹芯片组件和基板配合的结构的示意性结构图,其中,图3中的(a)所示为本申请实施例的指纹芯片组件和基板配合的结构在xz平面的示意性结构图,图3中的(b)所示为本申请实施例的指纹芯片组件和基板配合的结构在xy平面的示意性结构图。图4所示为本申请实施例的指纹识别装置的另一示意性结构图。图5所示为本申请实施例的指纹识别装置、主体和支架的示意性结构图,其中,图5中的(a)所示为本申请实施例的指示识别装置、主体和支架的立体图,图5中的(b)所示为本申请实施例的主体的局部区域A在xz平面的截面图。图6所示为本申请实施例的电子设备的局部区域的截面图。
参考图2,指纹识别装置20包括指纹芯片组件210、基板220和电路板230,沿着z方向依次设置。示例性地,上述三个部件可以采用粘性物质依次贴合,即,基板220贴合在指纹芯片组件210上,电路板230贴合在基板220上。电路板230可以是柔性电路板,电路板230的一部分与基板220贴合以实现固定连接,另一部分可以延伸至主体的内部和电子设备的主体固定连接,且和主体中的主板电连接。指纹芯片组件210用于采集用户指纹信息,电路板230接收用户指纹信息,将该用户指纹信息发送给主板,使得设置在主板上的处理器基于该用户指纹信息进行相应的认证处理,例如,指纹解锁、指纹付款等功能。
参考图3,指纹芯片组件210包括在x方向上相对的两个长侧面,基板220包括在x方向上相对的两个长侧面,其中,基板220的两个长侧面之间的尺寸大于指纹芯片组件210的两个长侧面之间的尺寸,基板220的一个长侧面和位于同侧的指纹芯片组件210的一个长侧面平齐。
为了便于描述,将指纹芯片组件210的两个长侧面分别记为第一长侧面211和第二长侧面212,将基板220的两个长侧面分别记为第一长侧面221和第二长侧面222。
示例性地,基板220的第一长侧面221和指纹芯片组件210的第一长侧面211位于指 纹识别装置20的一侧,基板220的第二长侧面222和指纹芯片组件210的第二长侧面212位于指纹识别装置20的另一侧。基板220的第二长侧面222和指纹芯片组件210的第二长侧面212平齐,基板220的第一长侧面221和基板220的第二长侧面222之间的尺寸大于指纹芯片组件210的第一长侧面211和指纹芯片组件210的第二长侧面212之间的尺寸,或者说,基板220的第一长侧面221相对指纹芯片组件210的第一长侧面211沿x方向外伸,基板220的第一长侧面221位于指纹芯片组件210的第一长侧面211的外侧。例如,以图3中的(b)为例,基板220的两个长侧面之间的尺寸为L
2,指纹芯片组件210的两个长侧面之间的尺寸为L
1,基板220的第一长侧面221相对指纹芯片组件210的第一长侧面211沿x方向外伸,外伸的尺寸为L
3。
需要指出的是,基板220的两个长侧面之间的尺寸大于指纹芯片组件210的两个长侧面的尺寸可以广义地理解为基板220的两个长侧面之间的最短尺寸大于指纹芯片组件210的两个长侧面之间的最长尺寸,在基板220的第二长侧面222与指纹芯片组件210的第二长侧面212平齐的情况下,基板220的第一长侧面221相对指纹芯片组件210的第一长侧面211沿x方向外伸,或者说,基板220的第一长侧面221位于指纹芯片组件210的第一长侧面211上远离指纹芯片组件210的一侧。
应理解,这里所说的两个长侧面平齐可以理解为两个长侧面基本平齐,换言之,基板220的第二长侧面222和指纹芯片组件210的第二长侧面212在xy平面的投影基本重合。
还应理解,指纹芯片组件210的第一长侧面211的外侧指的是第一长侧面211上远离指纹芯片组件210的一侧,对应地,指纹芯片组件210的第一长侧面211的内侧指的是第一长侧面211上靠近指纹芯片组件210的一侧。同理,下文中关于部件的侧面的外侧都可以理解为该部件的侧面上远离该部件的一侧,部件的侧面的内侧可以理解为该部件的侧面上靠近该部件的一侧,后续不再赘述。
基板220在y方向的两个短侧面与指纹芯片组件210在y方向的两个短侧面的位置关系不做任何限定。
可选地,继续参考图3中的(b),基板220包括在y方向上相对的两个短侧面,记为第一短侧面223和第二短侧面224,指纹芯片组件210包括在y方向上相对的两个短侧面,记为第一短侧面213和第二短侧面214,基板220的每个短侧面位于处于同侧的指纹芯片组件210的短侧面的外侧。
例如,基板220的第一短侧面223和指纹芯片组件210的第一短侧面213位于指纹识别装置的一侧,基板220的第二短侧面224和指纹芯片组件210的第二短侧面214位于指纹识别装置的另一侧,基板220的第一短侧面223位于指纹芯片组件210的第一短侧面213的外侧,或者说,基板220的第一短侧面223相对于指纹芯片组件210的第一短侧面213沿y方向外伸,基板220的第二短侧面224位于指纹芯片组件210的第二短侧面214的外侧,或者说,基板220的第二短侧面224相对于指纹芯片组件210的第二短侧面214沿y方向外伸。
示例性地,基板220的一个短侧面相对位于同侧的指纹芯片组件210的短侧面外伸,基板220的另一个短侧面也可以相对位于指纹识别装置同侧的指纹芯片组件210的短侧面平齐(图中未示出)。
此外,针对指纹芯片组件210和基板220的形状结构不做任何限定,只要使得基板 220的一个长侧面和位于同侧的指纹芯片组件210的长侧面平齐,基板220的两个长侧面之间的尺寸大于指纹芯片组件210的两个长侧面之间的尺寸即可。
在电路板230是柔性电路板的情况下,为了提高指纹识别装置的强度,可选地,可以在指纹识别装置中设置补强部件。参考图4,指纹识别装置20包括沿着z方向依次设置的指纹芯片组件210、基板220、电路板230和补强部件241,补强部件241贴合在电路板230背离基板220的一侧的表面上。可选地,补强部件241的材料可以是钢,可以将这种采用钢制成的补强部件称为补强钢片。
基于本申请实施例的指纹识别装置,可以采用由内向外的组装方式将指纹识别装置安装在电子设备上。示例性地,参考图5和图6,主体10可以采用一体成型的方式制成,示例性地,该一体成型的主体的材料可以是纯金属(例如,铝),也可以是铝塑合金。主体10上设置有孔101(如图5中的(b)所示的非阴影区域),按照由内向外安装指纹识别装置的方式,将指纹识别装置20伸入孔101且沿着z方向外推指纹识别装置20,通过基板220伸出指纹芯片组件210的部分与主体10配合,将基板220卡设在主体10上,以限制指纹识别装置20的位置,并且,将电路板230的一端与主体10固定连接。在主体10是采用一体成型的方式制成的情况中,孔101会贯穿至主体10的内侧,无形中会增加主体被切除的部分,为了提高主体10的强度,可以设置一个如图5中的(a)所示的补强支架40,补强支架40可分别与指纹识别装置20和主体10固定连接。
继续参考图6,指纹芯片组件210位于孔101中且少部分外露于孔101,便于用户按压以采集指纹信息,基板220的第一长侧面221相对指纹芯片组件210的第一长侧面211沿x方向外伸的部分与主体10配合,以将指纹识别装置20卡设在主体10上;此外,若基板220的短侧面(例如,第一短侧面223或第二短侧面224)位于处于同侧的指纹芯片组件210的外侧,那么,基板220的短侧面相对指纹芯片组件210的短侧面外伸的部分也与主体10配合,进一步将指纹识别装置20卡设在主体10上。可选地,补强支架40与补强部件241固定连接,与主体10固定连接。
目前,在按照内向外的方式在电子设备的侧面组装指纹识别装置的结构中,基板的每个长侧面相对位于同侧的指纹芯片组件的长侧面都外伸,基板的每个长侧面位于处于同侧的指纹芯片组件的长侧面的外侧,使得基板的宽度尺寸较大,从而,增加了指纹识别装置的宽度尺寸,严重影响电子设备的厚度。此外,由于需要切除主体的一部分以安装指纹识别装置,所以,宽度尺寸较大的指纹识别装置会切除主体中较多的部分,影响整机强度。
因此,本申请实施例提供的指纹识别装置,通过对基板做相关设计,使得基板在基板的宽度方向(x方向)上相对的两个长侧面中的一个长侧面与位于同侧的指纹芯片组件的一个长侧面平齐,基板的两个长侧面之间的尺寸大于指纹芯片组件的两个长侧面之间的尺寸,使得基板的另一个长侧面相对位于同侧的指纹芯片组件的长侧面外伸,在可以通过基板的长侧面相对位于同侧的指纹芯片组件的长侧面外伸的部分与电子设备的主体配合以将指纹识别装置卡设在主体的同时,可以有效地减少指纹识别装置在x方向的尺寸,从而,在将指纹识别装置安装在主体的侧面上时,可以有效地减少主体在x方向的尺寸,以减少电子设备的整体厚度。
此外,对于相同尺寸的主体,本申请实施例的指纹识别装置也可以减少在主体上切除的部分,有效地提高整机强度。
第二方面
在本申请实施例中,电路板230与基板220之间可以通过粘性物质贴合以实现固定连接,此外,为了提高防水性能,可以在基板220上预留点胶区域,在点胶区域上做点胶处理,利用毛细现象,使得胶水可以充分扩散或浸润到电路板230与基板220之间,以实现电路板230与基板220之间的防水。示例性地,可以将基板220上位于电路板230周边的全部区域或部分区域作为点胶区域。
在基板的宽度较小的情况下,可以在基板朝向电路板的表面上沿x方向上伸出电路板的区域进行单侧点胶,也能实现电路板与基板之间的防水。
图7所示为本申请实施例的指纹识别装置的另一示意性结构图。图7中的(a)和(b)所示为本申请实施例的指纹识别装置在xy平面的二维示意性结构图,图7中的(c)所示为本申请实施例的指纹识别装置的三维示意性结构图。
参考图7,电路板230包括固定连接在基板220背离指纹芯片组件210的一侧的表面上的连接部分231,连接部分231包括在x方向上相对的两个长侧边,记为第一长侧边2311和第二长侧边2312,基板220包括自连接部分231的两个长侧边分别沿x方向都外伸的第一外伸区域2211和第二外伸区域2221,第一外伸区域2211和第二外伸区域2221是位于连接部分231在y方向的两端之间且朝向电路板230的表面的区域,例如,第一外伸区域2211相对连接部分231的第一长侧边2311沿x方向外伸,第二外伸区域2221相对连接部分231的第二长侧边2312沿x方向外伸。其中,第一外伸区域2211的面积和第二外伸区域2221的面积不同,将第一外伸区域2211和第二外伸区域2221中面积较大的外伸区域作为点胶区域,进行单侧点胶处理。
示例性地,第一外伸区域2211的面积可以大于第二外伸区域2221的面积,也可以小于第二外伸区域2221的面积,在本申请实施例中,将面积大的外伸区域作为点胶区域,进行单侧点胶处理。例如,参考图7中的(a),有阴影部分的第一外伸区域2211的面积大于第二外伸区域2221的面积,第一外伸区域2211是点胶区域,参考图7中的(b),有阴影部分的第二外伸区域2221的面积大于第一外伸区域2211的面积,第二外伸区域2221是点胶区域。制作过程中,可以仅在面积大的外伸区域上点胶,不需要在面积小的外伸区域点胶,利用毛细现象,使得胶水浸润或扩散到电路板230与基板220之间,以实现电路板230与基板220之间的防水。
需要说明的是,在点胶过程中,可以在预留的点胶区域的全部或部分区域做点胶处理,此处不做任何限定。参考图7中的(c),可以仅在基板220沿x方向外伸的面积较大的外伸区域的部分区域上点上胶201,以利用毛细现象,使得胶201最终浸润或扩散到电路板230与基板220之间。
需要说明的是如前所述,电路板230的一部分固定连接在基板220上,另一部分延伸至主体10的内部固定连接在主体10的主板上,以实现电连接,在本申请实施例中,将电路板230与基板220固定连接的部分记为连接部分231。参考图7中的(a)和(b),在xy平面中,基板220在xy平面的投影包围连接部分231在xy平面的投影,可以将基板220在xy平面的投影与电路板230在xy平面的投影重合的区域对应的电路板230的部分记为连接部分231。
因此,本申请实施例提供的指纹识别装置,通过在基板上设置自连接部分的两个长侧 边分别沿x方向都外伸的两个外伸区域(例如,第一外伸区域和第二外伸区域),该两个外伸区域都是位于连接部分在y方向的两端之间且朝向电路板的表面的区域,将面积较大的外伸区域设置为用于点胶的点胶区域,可以在该点胶区域上进行单侧点胶,以通过毛细现象使得胶水浸润或扩散至电路板与基板之间,以实现电路板和基板之间的防水。特别地,这种在基板上仅设置一个点胶区域的结构非常适用于基板在x方向的尺寸较小的情况(例如,图2至图5对应的任一个结构中的基板),同样可以实现基板和电路板之间的防水效果。
图8所示的是另外两个区别于图7的用于单侧点胶的结构。在该实施例中,可以在基板朝向电路板的表面上仅设置一个沿x方向伸出电路板的外伸区域,该外伸区域就是点胶区域。
参考图8中的(a),基板220的第二长侧面222与连接部分231的第二长侧边2312平齐,基板220的第一长侧面221相对连接部分231的第一长侧边2311沿x方向外伸,基板220的第一长侧面221位于连接部分231的第一长侧边2311上的外侧。
在该结构中,在基板220朝向电路板230的表面上,可以将基板220的第一长侧边221相对连接部分231的第一长侧边2311外伸的且在连接部分231在y方向的两端之间的区域作为点胶区域。
参考图8中的(b),基板220的第一长侧面221与连接部分231的第一长侧边2311平齐,基板220的第二长侧面222相对连接部分231的第二长侧边2312沿所述x方向外伸,基板220的第二长侧面222位于连接部分231的第二长侧边2312的外侧。
在该结构中,在基板220朝向电路板230的表面上,可以将基板220的第二长侧面222相对连接部分231的第二长侧边2312外伸的且在连接部分231在y方向的两端之间的区域作为点胶区域。
因此,本申请实施例提供的指纹识别装置,通过使得基板在x方向上相对的两个长侧面中的一个长侧面的相对位于指纹识别装置同侧的连接部分的一个长侧边平齐,基板的另一个长侧面位于处于同侧的连接部分的长侧边的外侧,在基板朝向电路板的表面上,可以将基板的长侧面相对连接部分的长侧边外伸的且在连接部分在y方向的两端之间的区域作为点胶区域,以在该点胶区域上进行单侧点胶,通过毛细现象使得胶水浸润或扩散至电路板与基板之间,以实现电路板和基板之间的防水。同理,对于基板在x方向的尺寸较小的情况,这种在基板上仅设置一个点胶区域的结构非常适用,同样可以实现基板和电路板之间的防水效果。
上述实施例描述的都是在基板朝向电路板的表面上沿x方向伸出电路板的区域上设置点胶区域,可选地,本申请实施例也可以在基板沿y方向上伸出电路板的区域上设置点胶区域,以进一步达到更好的防水效果。示例性地,以图7中的(a)为例,可以将基板220朝向电路板230的表面上在连接部分231的一个短侧边2314与位于同侧的基板220的短侧面220之间的区域作为点胶区域,可以是该点胶区域中的部分或全部区域上进行点胶。参考图7中的(c),可以在连接部分的短侧边2314与位于同侧的基板220的短侧面220之间的区域点上胶202。
第三方面
在本申请实施例中,将指纹识别装置安装在电子设备的侧面,会导致侧面的按键过多, 影响电子设备的简洁美观度。基于此,可以将指纹识别装置与原本设置在电子设备的侧面的例如音量键或电源键等功能键二合一,可以使得用户可以通过按压指纹识别装置的同时也能按压功能键,以同时实现指纹识别和功能键的功能。在该实施例中,可以设置U型结构的电路板,以同时实现针对指纹识别装置和功能键的电连接。
参考图9,指纹识别装置20包括沿着z方向依次设置的指纹识别组件210、基板220和U型结构的电路板230,其中,电路板230包括第一部分232、弯折部分233和第二部分234,弯折部分233呈弯曲状且连接第一部分232和第二部分234,第一部分232设置在基板220与第二部分234之间。
具体地,第一部分232是电路板230中最靠近基板220的部分,与基板230固定连接,第二部分234是自弯折部分233朝着远离第二部分233的方向延伸的部分,第一部分232和第二部分234近似平行或基本平行。
可选地,继续参考图9,指纹识别装置20还包括补强部件242和补强部件243,补强部件242与电路板230的第一部分232固定连接,补强部件243与电路板230的第二部分234固定连接。
示例性地,指纹识别装置20也可以包括补强部件242或补强部件243中的任一个,本申请实施例不做任何限定。
基于U型结构的电路板的设计想法,可以在U型结构的电路板230的第二部分234背离第一部分232的表面上固定连接有功能键250,以实现功能键250和电路板之间的机械连接和电连接。
可选地,基于在电路板230上设置的功能键250,在安装指纹识别装置20的过程中,可以在电子设备中设置导电基,该导电基和补强支架40或主体10固定连接,该导电基与功能键接触。。
可选地,导电基的材料是非金属材料。非金属材料可以是橡胶、rubber、TPU等表面硬度比金属软,存在微弱弹性的材料,以使得功能键按压导电基时不易损坏功能键。
图10所示为本申请实施例的电子设备的示意性结构图。参考图10,电子设备包括主体10、指纹识别装置20、补强支架40和导电基50,其中,指纹识别装置20包括沿着z方向依次设置的指纹识别组件210、基板220和U型结构的电路板230、固定连接在电路板230的第一部分232的补强部件242和固定连接在电路板230的第二部分234的补强部件243、与补强部件243相对设置的固定连接在电路板230的第二部分234的功能键250,功能键250与导电基50接触,导电基50与补强支架40固定连接,补强支架40与主体10固定连接。
当指纹识别组件210的工作表面被按压时,指纹识别装置20沿着z方向朝着主体10的内部移动一定位移,通过功能键250与导电基50之间的压紧接触,以同时实现指纹识别和功能键的功能。
对于设置有U型结构的电路板的指纹识别装置,参考图11,在制作过程中,可以将电路板230绕x方向弯折近似180度的角度,形成例如图11所示的U形结构的电路板。
对于设置有固定连接在U型结构的电路板的补强部件的指纹识别装置,继续参考图12,在制作过程中,可以先将补强部件242和补强部件243分别固定连接在电路板230的第一部分232和第二部分234,随后,将固定连接有补强部件242和补强部件243的电路 板230绕x方向弯折近似180度的角度,形成例如图11所示的U形结构的电路板。
在上述弯折电路板的过程中,电路板在哪个区域开始弯折以及弯折多少,都是提前预设好的,电路板弯折后,为了确定弯折后的电路板是否位于预设位置以达到标准,有必要对弯折后的电路板做定位检测。
现有技术提出在电路板或补强部件上采用复印油墨的方式做定位标记,通过检测定位标记来检测弯折后形成的U型结构的电路板是否达到定位要求,但是,由于需要额外的复印油墨的制作工序,会增加成本。基于此,本申请实施例提供了一种包括具有定位结构的电路板或补强部件的指纹识别装置,通过电路板或补强部件本身具有的定位结构进行定位检测,可以减少制作工序,以减少成本。其中,定位结构可以分别用来检测弯折后的电路板在x方向和/或y方向的定位是否达到定位要求。应理解,在该情况中,检测电路板在x方向和/或y方向的定位是否达到定位要求,实际上检测的是电路板的第二部分在x方向和/或y方向的定位是否达到要求,检测方向为z方向。以下,分别对电路板上的定位结构和补强部件上的定位结构做详细说明。
一、电路板的定位结构
1、检测x方向的定位
参考图12和图13,电路板230的第二部分234包括靠近基板220的基准侧面225的第一定位部分2341,基准侧面225是连接基板220的第一长侧面221和基板220的第二长侧面的侧面,其中,第一定位部分2341可以用来检测弯折后的电路板230的第二部分234在x方向的定位是否满足要求。
具体而言,第一定位部分2341包括在x方向上相对的两个台阶侧面,记为第一台阶侧面和第二台阶侧面,第一台阶侧面包括内侧面2341-11、外侧面2341-12和连接内侧面2341-11与外侧面2341-12的连接侧面2341-13,第二台阶侧面包括内侧面2341-21、外侧面2341-22和连接内侧面2341-21与外侧面2341-22的连接侧面2341-23,连接侧面2341-13和连接侧面2341-23分别位于基板220的基准侧面225的两侧,例如,如图13中的(c)所示,连接侧面2341-13位于基准侧面225的外侧,连接侧面2341-23位于基准侧面225的内侧,反过来,也可以是连接侧面2341-13位于基准侧面225的内侧,连接侧面2341-23位于基准侧面225的外侧(图中未示出)。
第一定位部分2341可以理解为位于两个连接侧面附近的附近区域,该附近区域包括台阶侧面,台阶侧面包括内侧面、外侧面和连接侧面,内侧面相对外侧面靠近电路板的中心。
可选地,第一定位部分2341靠近电路板230的弯折部分233。
第一定位部分2341可以是第二部分234中靠近基准面225的各种可能的结构,只要可以形成两个台阶侧面,并且,两个台阶侧面的连接侧面分别位于基准侧面的两侧即可。示例性地。参考图13中的(c),第一定位部分2341可以是通过第二部分234靠近基准侧面225的两端向外凸出形成的结构,这种结构可以很好地适用于电路板的宽度尺寸较小的情况。示例性地,参考图14中的(a),第一定位部分2341也可以是通过第二部分234靠近基准侧面225的两端向内凹陷形成的结构,这种结构可以很好地适用于电路板的宽度尺寸较大的情况。
基准侧面是位于基板的两个长侧面之间的侧面,可以将基板220的一个短侧面理解为 基准侧面,基准侧面可以是平面,也可以是曲面,此外,基准侧面的边缘可以是例如图13所示的圆弧状,也可以是斜面等形状,本申请实施例都不做任何限定。
同理,台阶侧面的连接侧面可以是例如图13所示的弧面,也可以是例如图15中的(a)所示的平面,本申请实施例也不做任何限定。
设计过程中,在垂直于基准侧面的方向上,可以将连接侧面与基准侧面之间的距离限制在允许误差范围内,记为±x,以便于检测。
可以想来,连接侧面与基准侧面都是平面的话,在垂直于基准侧面的方向(即,y方向)上,两个侧面之间的距离可以基本保持一致,便于检测。在一些实施例中,基准侧面225的边缘可以是例如图13所示的弧面,可以是只有基准侧面225的边缘是弧面,也可以是整个基准侧面225是弧面,为了尽可能使得连接侧面与基准侧面225之间的距离保持一致,便于检测,可以使得基准侧面225的边缘是弧面以及每个台阶侧面的连接侧面也是弧面。
基于第一定位部分的台阶侧面,由于台阶侧面的连接侧面与基板的长侧面之间的位置关系,检测标准也存在差异。
示例性地,参考图13中的(c)和图14中的(a),若第一定位部分2341的宽度尺寸小于或等于基板220的宽度尺寸,使得连接侧面都位于基板的长侧面的内侧,则在弯折电路板230的过程中,从z方向观察,若只能看到连接侧面2341-13,意味着连接侧面2341-23已经位于基准侧面225的内侧,则可以认为第二部分234在x方向的定位满足要求。
示例性地,参考图14中的(b),若第一定位部分2341的最大宽度尺寸大于基板的宽度尺寸,使得连接侧面的至少部分伸出基板的长侧面,在弯折电路板230的过程中,从z方向观察,若看到连接侧面2341-13的至少部分位于基准侧面225的外侧,看到连接侧面2341-23的至少部分位于基准侧面225的内侧,则可以认为第二部分234在x方向的定位满足要求。
因此,本申请实施例提供的指纹识别装置,电路板的第二部分上设置有用于检测第二部分在x方向的定位的第一定位部分,该第一定位部分包括两个台阶侧面,台阶侧面包括连接侧面,利用两个连接侧面与基板的基准侧面的相对位置关系检测电路板的第二部分在x方向的定位,可以减少制作工序,以减少成本。具体地,第一定位部分的两个台阶侧面的连接侧面分别位于基板的基准侧面的两侧,即可认为电路板的第二部分在x方向的定位满足要求。
2、检测y方向的定位
参考图12和图15,电路板230的第二部分234包括第二定位部分2342,可以用来检测弯折后的电路板230的第二部分234在y方向的定位是否满足要求。
具体而言,第二定位部分2342包括在x方向上相对的两个长侧面,记为第一长侧面2342-1和第二长侧面2342-2,第二定位部分2342的每个长侧面位于处于同侧的基板220的长侧面的内侧。示例性地,第二定位部分2342的第一长侧面2342-1和基板220的第一长侧面221设置在指纹识别装置20的一侧,第二定位部分2342的第二长侧面2342-2和基板220的第二长侧面222设置在所述指纹识别装置20的另一侧,其中,第二定位部分2342的第一长侧面2342-1相对基板220的第一长侧面221沿x方向内缩,即,第二定位 部分2342的第一长侧面2342-1位于基板220的第一长侧面221的内侧,第二定位部分2342的第二长侧面2342-2相对基板220的第二长侧面222沿x方向内缩,即,第二定位部分2342的第二长侧面2342-2位于基板220的第二长侧面222的内侧。
第二定位部分2342可以是第二部分234的任意区域,此处不做任何限定。可选地,继续参考图12,第二定位部分2342可以是第二部分234中远离电路板230的弯折部分233的一端附近的区域。
设计过程中,在x方向上,第二定位部分2342的尺寸小于基板220的尺寸,并且,可以将基板220的每个长侧面与位于同侧的第二定位部分的长侧面之间的距离限制在允许误差范围内,记为±y,以便于检测。
参考图15,在弯折电路板230的过程中,从z方向观察,若看不到第二定位部分2342的两个长侧面,意味着第二定位部分2342的每个长侧面都已经位于同侧的基板220的长侧面的内侧,则可以认为第二部分234在y方向的定位满足要求。
因此,本申请实施例提供的指纹识别装置,电路板的第二部分上设置有用于检测该第二部分在y方向的定位的第二定位部分,该第一定位部分包括在x方向上相对的两个长侧面,利用两个长侧面与基板的长侧面的相对位置关系检测电路板的第二部分在y方向的额定位,可以减少制作工序,以减少成本。具体地,第二定位部分的每个长侧面都位于处于同侧的基板的长侧面的内侧,即可认为电路板的第二部分在y方向的定位满足要求。
二、补强部件的定位结构
如前所述,对于设置有固定连接在U型结构的电路板的补强部件的指纹识别装置,在制作过程中,可以先将补强部件242和补强部件243分别固定连接在电路板230的第一部分232和第二部分234,随后,将固定连接有补强部件242和补强部件243的电路板230绕x方向弯折近似180度的角度,形成例如图11所示的U形结构的电路板。
在上述制作过程中,补强部件与电路板之间是有精确定位的,因此,可以间接通过固定连接在第二部分上的补强部件上的定位结构检测电路板的第二部分的定位是否满足要求。
1、检测x方向的定位
参考图16和图17,补强部件243包括靠近基板220的基准侧面225的第三定位部分2431,基准侧面225是连接基板220的第一长侧面221和基板220的第二长侧面222的侧面,其中,第三定位部分2341可以用来检测弯折后的电路板230的第二部分234在x方向的定位是否满足要求。
具体而言,第三定位部分2431包括在x方向上相对的两个台阶侧面,记为第三台阶侧面和第四台阶侧面,第三台阶侧面包括内侧面2431-11、外侧面2431-12和连接内侧面2431-11和外侧面2431-12的连接侧面2431-13,第四台阶侧面包括内侧面2431-21、外侧面2431-22和连接内侧面2431-21和外侧面2431-22的连接侧面2431-23,连接侧面2431-13和连接侧面2431-23分别位于基板220的基准侧面225的两侧,例如,如图17中的(c)所示,连接侧面2431-13位于基准侧面225的外侧,连接侧面2431-23位于基准侧面225的内侧,反过来,也可以是连接侧面2431-13位于基准侧面225的内侧,连接侧面2431-23位于基准侧面225的外侧(图中未示出)。
第三定位部分2431可以理解为补强部件中位于两个连接侧面附近的附近区域,该附 近区域包括台阶侧面,台阶侧面包括内侧面、外侧面和连接侧面,内侧面相对外侧面靠近电路板的中心。
可选地,第三定位部分2431靠近电路板230的弯折部分233。
第三定位部分2431可以是补强部件243中靠近基准面225的各种可能的结构,只要可以形成为两个台阶侧面,并且,两个台阶侧面的连接侧面分别位于基准侧面的两侧即可。示例性地,参考图17中的(c),第三定位部分2431可以是通过补强部件243靠近基准侧面225的两端向外凸出形成的结构,这种结构可以很好地适用于补强部件的宽度尺寸较小的情况。示例性地,参考图18中的(a),第三定位部分2431也可以是通过补强部件243靠近基准侧面225的两端向内凹陷形成的结构,这种结构可以很好地适用于补强部件的宽度尺寸较大的情况。
基准侧面220可以是平面,也可以是曲面,此外,基准侧面的边缘可以是例如图17所示的圆弧状,也可以是斜面等形状,本申请实施例都不做任何限定。
补强部件的台阶侧面的连接侧面可以是例如图17所示的弧面,也可以是例如图18中的(a)所示的平面,本申请实施例也不做任何限定。
设计过程中,在垂直于基准侧面的各个方向上,可以将补强部件的连接侧面与基板的基准侧面之间的距离限制在允许误差范围内,以便于检测。
在一些实施例中,基准侧面225的边缘可以是例如图17所示的弧面,可以是只有基准侧面225的边缘是弧面,也可以是整个基准侧面225是弧面,为了尽可能使得补强部件的连接侧面与基板的基准侧面225之间的距离保持一致,便于检测,可以使得基准侧面225的边缘是弧面以及补强部件的每个台阶侧面的连接侧面也是弧面。
基于补强部件的台阶侧面,由于补强部件的台阶侧面的连接侧面与基板的长侧面之间的位置关系,检测标准也存在差异。
参考图17中的(c)和图18中的(a),若补强部件243的宽度尺寸小于或等于基板220的宽度尺寸,使得补强部件243的连接侧面都位于基板的长侧面的内侧,则在弯折电路板230的过程中,从z方向观察,若只能看到补强部件的连接侧面2431-13,意味着连接侧面2431-23已经位于基准侧面225的内侧,则可以认为电路板230的第二部分234在x方向的定位满足要求。
参考图18中的(b),若补强部件243的最大宽度尺寸大于基板220的宽度尺寸,使得补强部件243的连接侧面的至少部分伸出基板220的长侧面,则在弯折电路板230的过程中,从z方向观察,若看到连接侧面2431-13位于基准侧面225的外侧,看到连接侧面2431-23位于基准侧面225的内侧,则可以认为电路板230的第二部分234在x方向的定位满足要求。
因此,本申请实施例提供的指纹识别装置,固定连接在电路板的第二部分上的补强部件设置有用于检测第二部分在x方向的定位的第三定位部分,该第三定位部分包括两个台阶侧面,台阶侧面具有连接侧面,利用两个连接侧面与基板的基准侧面的相对位置关系检测电路板的第二部分在x方向的定位,可以减少制作工序,以减少成本。具体地,第三定位部分的两个台阶侧面的连接侧面分别位于基板的基准侧面的两侧,即可认为电路板的第二部分在x方向的定位满足要求。
2、检测y方向的定位
参考图16和图19,补强部件243包括第四定位部分2432,可以用来检测弯折后的电路板230的第二部分234在y方向的定位是否满足要求。
具体而言,第四定位部分2432包括在x方向上相对的两个长侧面,记为第一长侧面2432-1和第二长侧面2432-2,第四定位部分2432的每个长侧面位于处于同侧的基板220的长侧面的内侧。示例性地,第四定位部分2432的第一长侧面2432-1和基板220的第一长侧面221位于指纹识别装置的一侧,第四定位部分2432的第二长侧面2432-2和基板220的第二长侧面222位于指纹识别装置的另一侧,第四定位部分2432的第一长侧面2432-1相对基板220的第一长侧面221沿x方向内缩,第四定位部分2432的第一长侧面2432-1位于基板220的第一长侧面221的内侧,第四定位部分2432的第二长侧面2432-2相对基板220的第二长侧面222沿x方向内缩,第四定位部分2432的第二长侧面2432-2位于基板220的第二长侧面222的内侧。
第四定位部分2432可以是补强部件243的任意区域,此处不做任何限定。可选地,继续参考图16和图17,第四定位部分2432可以是补强部件243中远离电路板230的弯折部分233的一端附近的区域。
设计过程中,在x方向上,第四定位部分2432的尺寸小于基板220的尺寸,并且,可以将基板220的每个长侧面与位于同侧的第四定位部分的长侧面之间的距离限制在允许误差范围内,记为±y,以便于检测。
参考图19,在弯折电路板230的过程中,从z方向观察,若看不到第四定位部分2432的两个长侧面,意味着第四定位部分2432的每个长侧面都已经位于同侧的基板220的长侧面的内侧,则可以认为第三部分234在y方向的定位满足要求。
因此,本申请实施例提供的指纹识别装置,补强部件设置有用于检测电路板的第二部分在y方向的定位的第四定位部分,该第四定位部分包括在x方向上相对的两个长侧面,利用两个长侧面与基板的长侧面的相对位置关系检测电路板的第二部分在y方向的额定位,可以减少制作工序,以减少成本。具体地,每个长侧面都位于同侧的基板的长侧面的内侧,即可认为电路板的第二部分在y方向的定位满足要求。
第四方面
本申请实施例的指纹识别装置用于安装在电子设备的侧面上,具体地,通过在电子设备的主体的侧面挖孔以安装指纹识别装置。在一些场景中,电子设备的主体的侧面会有一定的弧度或倾斜,为了体现指纹识别装置与主体结合的一体性以及提高用户的使用手感,本申请实施例提出对指纹芯片组件做改进。
参考图20,指纹芯片组件210包括用于和外部物体接触的工作表面215,工作表面215为弧面(如图20中的(a)所示)或斜面(如图20中的(b)所示)。
继续参考图20,指纹芯片组件210一般由芯片216和包裹芯片216的EMC壳体组成,EMC壳体中用于和外部物体接触的表面是指纹芯片组件210的工作表面。
示例性地,制作过程中,可以采用计算机数字控制(computer number control,CNC)的方式对工作表面215加工。
本申请实施例的指纹识别装置可以是电容式指纹识别,利用芯片与导电的皮下电解液形成电容差,以获得指纹信息。此外,为了使测得的电信号满足实际需求,可以在指纹芯片组件中设置增益模块,用于调节测得的电信号。
在指纹识别过程中,手指按压于指纹芯片组件210的工作表面215上,在工作表面215与芯片216之间形成电容差,在工作表面215是非平面(弧面或斜面)的情况下,芯片216的不同区域到工作表面215的距离都不同,例如,继续参考图20,工作表面215上的A点到芯片216的距离短,测得的电信号较强,工作表面215上的B点到芯片216的距离长,测得的电信号较弱,测得的不同大小的电信号会影响识别效果。
基于此,本申请实施例提出了另一指纹芯片组件。可选地,工作表面215包括多个检测区域,指纹芯片组件210包括对应该多个检测区域的多个增益模块,每个增益模块用于调节指纹芯片组件210在对应的检测区域检测到的电信号的增益,至少两个增益模块所调节的信号的增益不同。其中,该至少两个增益模块表示两个或两个以上的增益模块,该至少两个增益模块所调节的信号的增益不同可以理解为该至少两个增益模块中任意两个增益模块所调节的信号的增益都不同。
这样,可以尽可能使获得的信号的信号强度相同,以提高识别效果。
其中,工作表面215上的检测区域可以根据工作表面215到芯片216的距离划分,一个检测区域可以理解为多个检测点构成的线,或者,一个检测区域也可以理解为包括多个检测点的区域。
图21所示为工作表面的检测区域的示意图,示例性地,以图20所示的工作表面为例,参考图21,每个小方格的每个顶点可以理解为一个用于检测电信号(或,指纹信号)的检测点,沿着x方向,采用8条线将工作表面215分开,可以理解的是,在x方向上的每条线上的多个检测点上检测到的电信号近似相同,在x方向上相邻的两条线上的检测点上检测到的电信号不同。因此,例如,可以为每条线上的所有检测点配置一个增益模块,或者,若多条线上的检测点上检测到的电信号的差异较小,也可以为该多条线上的所有检测点配置一个增益模块,如图21所示的两条线上的检测点可以配置一个增益模块,这里,一个检测区域可以理解为包括多个检测点的两条线,或者,一个检测区域也可以理解为包括多个检测点构成的线的区域(例如,第一条线和和第二条线构成的多个小方格)。以图20中的(a)所示的弧面为例,可以理解的是,增益模块1对应的检测区域到芯片的距离较小,检测到的电信号较大,因此,所调节的电信号的增益较小,增益模块2对应的检测区域到芯片的距离较大,检测到的电信号较小,因此,所调节的电信号的增益较大,这样,可以获得信号强度近似相同的电信号。
为了提高用户体验,可以对指纹芯片组件210中用于和外部物体接触的工作表面的边缘进行倒角或倒圆角处理,使其形成为弧面或斜面,这样,对于用户来说,可以使得指纹识别装置的宽度在视觉和手感上变窄,从而提高用户体验。应理解,指纹芯片组件210的工作表面可以理解为手指接触的表面,接收用户手指的按压。
参考图22中的(a)和(b),指纹芯片组件210包括工作表面215,工作表面215的边缘215-A为斜面,可以对工作表面215的边缘进行倒角处理得到。参考图22中的(c),工作表面215的边缘215-A为弧面,可以对工作表面215的边缘进行倒圆角处理得到。或者说,指纹芯片组件210的工作表面215和侧面的交汇处为斜面或圆弧面,该侧面是在工作表面215的四周围成的面。
以上,对本申请实施例的指纹识别装置做了详细说明。此外,本申请实施例还提供了配置有上述指纹识别装置的电子设备,参考图1、图5和图6,该电子设备包括主体10和 指纹识别装置20,主体10的侧面上设置有101,指纹识别装置20穿过孔101且连接于主体10上。可选地,主体10一体成型,以及,电子设备还包括补强支架40,分别与主体10和指纹识别装置20固定连接。
其中,指纹识别装置20包括:依次设置的指纹芯片组件210、基板220和电路板230。可选地,电路板230可以为U型结构的电路板。可选地,指纹识别装置20还包括与电路板230固定连接的补强部件240。
关于指纹识别装置中各个部分的改进的具体说明可以参考上文对应图1至图22各个附图对应的实施例的相关描述,为了简洁,此处不再赘述。
应理解,在本申请实施例中,除非另有明确的规定和限定,术语“连接”、“固定连接”以及“接触”等术语应做广义理解。对于本领域的普通技术人员而言,可以根据具体情况理解上述各种术语在本申请实施例中的具体含义。
示例性地,针对“连接”,可以是固定连接、转动连接、柔性连接、移动连接、一体成型、电连接等各种连接方式;可以是直接相连,或,可以是通过中间媒介间接相连,或,可以是两个元件内部的连通或两个元件的相互作用关系。
示例性地,针对“固定连接”,可以是一个元件直接或间接固定连接在另一个元件上;固定连接可以包括机械连接、焊接以及粘接等方式,其中,机械连接可以包括铆接、螺栓连接、螺纹连接、键销连接、卡扣连接、锁扣连接、插接等方式,粘接可以包括粘合剂粘接以及溶剂粘接等方式。
示例性地,对于“接触”的解释,可以是一个元件与另一个元件直接接触或间接接触,此外,本申请实施例所描述的两个元件之间的接触,可以理解为在安装误差允许范围内的接触,可以存在由于安装误差原因造成的很小的间隙。
还应理解,本申请实施例描述的“平行”或“垂直”,可以理解为“近似平行”或“近似垂直”。
还应理解,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。
需要说明的是,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。
Claims (21)
- 一种指纹识别装置,其特征在于,包括:指纹芯片组件,包括在第一方向上相对的两个长侧面,所述第一方向平行于所述基板的宽度方向;基板,固定连接在所述指纹芯片组件上,包括在所述第一方向上相对的两个长侧面,其中,所述基板的两个长侧面之间的尺寸大于所述指纹芯片组件的两个长侧面之间的尺寸,所述基板的一个长侧面和位于同侧的所述指纹芯片组件的一个长侧面平齐。
- 根据权利要求1所述的指纹识别装置,其特征在于,所述指纹识别装置还包括:设置在所述基板上背离所述指纹芯片组件的一侧的U型结构的电路板,包括第一部分、弯折部分和第二部分,所述弯折部分连接所述第一部分和所述第二部分,所述第一部分位于所述基板与所述第二部分之间。
- 根据权利要求2所述的指纹识别装置,其特征在于,所述第二部分包括靠近所述基板的基准侧面的第一定位部分,所述第一定位部分包括在所述第一方向上相对的两个台阶侧面,所述第一定位部分的台阶侧面包括内侧面、外侧面和连接所述内侧面与所述外侧面的连接侧面,所述第一定位部分的两个连接侧面分别位于所述基准侧面的两侧,所述基准侧面是连接所述基板的两个长侧面的短侧面。
- 根据权利要求2或3所述的指纹识别装置,其特征在于,所述第二部分包括第二定位部分,所述第二定位部分包括在所述第一方向上相对的两个长侧面,所述第二定位部分的每个长侧面都位于处于同侧的所述基板的长侧面的内侧。
- 根据权利要求2至4中任一项所述的指纹识别装置,其特征在于,所述指纹识别装置还包括固定连接在所述第二部分中朝向所述第一部分的表面上的补强部件;以及,所述补强部件包括靠近所述基板的基准侧面的第三定位部分,所述第三定位部分包括在所述第一方向上相对的两个台阶侧面,所述第三定位部分的台阶侧面包括内侧面、外侧面和连接所述内侧面与所述外侧面的连接侧面,所述第三定位部分的两个连接侧面分别位于所述基准侧面的两侧,所述基准侧面是连接所述基板的两个长侧面的短侧面。
- 根据权利要求2至5中任一项所述的指纹识别装置,其特征在于,所述指纹识别装置还包括固定连接在所述第二部分中朝向所述第一部分的表面上的补强部件;以及,所述补强部件包括第四定位部分,所述第四定位部分包括在所述第一方向上相对的两个长侧面,所述第四定位部分的每个长侧面都位于处于同侧的所述基板的长侧面的内侧。
- 根据权利要求1至6中任一项所述的指纹识别装置,其特征在于,所述指纹芯片组件包括用于和外部物体接触的工作表面,所述工作表面为斜面或弧面。
- 根据权利要求7所述的指纹识别装置,其特征在于,所述工作表面包括多个检测区域,所述指纹芯片组件包括对应多个所述检测区域的多个增益模块,每个增益模块用于调节所述指纹芯片组件在对应的检测区域检测到的信号的增益,所述多个增益模块中的至少两个增益模块所调节的信号的增益不同。
- 根据权利要求1至8中任一项所述的指纹识别装置,其特征在于,所述指纹芯片组件包括用于和外部物体接触的工作表面,所述工作表面的边缘为弧面或斜面。
- 根据权利要求1至9中任一项所述的指纹识别装置,其特征在于,所述指纹识别装置还包括:设置在所述基板上背离所述指纹芯片组件的一侧的电路板,所述电路板包括固定连接在所述基板上的连接部分,所述基板包括自所述连接部分在所述第一方向上相对的两个长侧边分别沿所述第一方向都外伸的第一外伸区域和第二外伸区域,所述第一外伸区域和所述第二外伸区域是位于所述连接部分在第二方向的两端之间且朝向所述电路板的表面的区域,所述第一外伸区域和所述第二外伸区域中面积较大的外伸区域是点胶区域,所述第二方向平行于所述基板的长度方向。
- 根据权利要求1至10中任一项所述的指纹识别装置,其特征在于,所述指纹芯片组件包括在第二方向上相对的两个短侧面,所述基板包括在所述第二方向上相对的两个短侧面,所述基板的每个短侧面位于处于同侧的所述指纹芯片组件的短侧面的外侧,所述第二方向平行于所所述基板的长度方向。
- 一种指纹识别装置,其特征在于,包括:基板,包括在第一方向上相对的两个长侧面和连接两个所述长侧面的基准侧面,所述第一方向平行于所述基板的宽度方向;电路板,设置在所述基板的一侧,包括第一部分、弯折部分和第二部分,所述弯折部分连接所述第一部分和所述第二部分,所述第一部分位于所述基板与所述第二部分之间,其中,所述第二部分包括靠近所述基板的基准侧面的第一定位部分,所述第一定位部分包括在所述第一方向上相对的两个台阶侧面,所述台阶侧面包括内侧面、外侧面和连接所述内侧面与所述外侧面的连接侧面,两个所述连接侧面分别位于所述基准侧面的两侧。
- 根据权利要求12所述的指纹识别装置,其特征在于,所述第二部分包括第二定位部分,所述第二定位部分包括在所述第一方向上相对的两个长侧面,所述第二定位部分的每个长侧面都位于处于同侧的所述基板的长侧面的内侧。
- 一种指纹识别装置,其特征在于,包括:基板,包括在第一方向上相对的两个长侧面和连接两个所述长侧面的基准侧面,所述第一方向平行于所述基板的宽度方向;电路板,设置在所述基板的一侧,包括第一部分、弯折部分和第二部分,所述弯折部分连接所述第一部分和所述第二部分,所述第一部分位于所述基板与所述第二部分之间;补强部件,固定连接在所述第二部分中朝向所述第一部分的表面上,其中,所述补强部件包括靠近所述基板的基准侧面的第三定位部分,所述第三定位部分包括在所述第一方向上相对的两个台阶侧面,所述台阶侧面包括内侧面、外侧面和连接所述内侧面与所述外侧面的连接侧面,两个所述连接侧面分别位于所述基准侧面的两侧。
- 根据权利要求14所述的指纹识别装置,其特征在于,所述补强部件包括第四定位部分,所述第四定位部分包括在所述第一方向上相对的两个长侧面,所述第四定位部分的每个长侧面都位于处于同侧的所述基板的长侧面的内侧。
- 一种电子设备,其特征在于,包括:主体,所述主体的侧面上设置有孔;如权利要求1至11中任一项所述的指纹识别装置,所述指纹识别装置穿过所述孔且连接于所述主体。
- 根据权利要求16所述的电子设备,其特征在于,所述主体一体成型;以及,所述电子设备还包括补强支架,分别与所述主体和所述指纹识别装置固定连接。
- 一种电子设备,其特征在于,包括:主体,所述主体的侧面上设置有孔;如权利要求12或13所述的指纹识别装置,所述指纹识别装置穿过所述孔且连接于所述主体。
- 根据权利要求18所述的电子设备,其特征在于,所述主体一体成型;以及,所述电子设备还包括补强支架,分别与所述主体和所述指纹识别装置固定连接。
- 一种电子设备,其特征在于,包括:主体,所述主体的侧面上设置有孔;如权利要求14或15所述的指纹识别装置,所述指纹识别装置穿过所述孔且连接于所述主体。
- 根据权利要求20所述的电子设备,其特征在于,所述主体一体成型;以及所述电子设备还包括补强支架,分别与所述主体和所述指纹识别装置固定连接。
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