WO2021031249A1 - 预浸料、覆铜层压板及印刷电路板 - Google Patents

预浸料、覆铜层压板及印刷电路板 Download PDF

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Publication number
WO2021031249A1
WO2021031249A1 PCT/CN2019/104826 CN2019104826W WO2021031249A1 WO 2021031249 A1 WO2021031249 A1 WO 2021031249A1 CN 2019104826 W CN2019104826 W CN 2019104826W WO 2021031249 A1 WO2021031249 A1 WO 2021031249A1
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WIPO (PCT)
Prior art keywords
prepreg
flame
mass
microspheres
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/104826
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English (en)
French (fr)
Inventor
王宏远
王和志
张翼蓝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
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Filing date
Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Holdings Nanjing Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Publication of WO2021031249A1 publication Critical patent/WO2021031249A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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    • B32B19/04—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material
    • B32B19/041—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to another layer of the same or of a different material of metal
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    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • B32B2260/04—Impregnation, embedding, or binder material
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    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
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    • C08J2347/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
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Definitions

  • the invention relates to the technical field of copper-clad laminates, in particular to a prepreg, copper-clad laminates and printed circuit boards.
  • the printed circuit board is made of a copper-clad laminate, and the copper-clad laminate includes a resin substrate and a copper foil attached to the resin substrate; it is often necessary to add to the matrix resin when the resin substrate is manufactured Inorganic fillers are used to adjust the dielectric constant of the material, improve the thermodynamic properties of the material and reduce costs.
  • the commonly used inorganic fillers such as silica
  • the commonly used inorganic fillers are mostly spherical structures with smooth surfaces, resulting in agglomeration of the inorganic fillers during the mixing process with organic polymers, poor interfacial properties, etc., resulting in sedimentation of the fillers.
  • the material properties of the resin substrate are unstable; in addition, the compatibility between the inorganic filler and the organic polymer is poor, and modification is required, the process is complicated, and the production efficiency is low.
  • the purpose of the present invention is to provide a prepreg, a copper clad laminate and a printed circuit board.
  • the prepreg has good interface performance, stable material performance, simple production process, high production efficiency, and the application of the prepreg Copper clad laminates and printed circuit boards ensure stable performance while making production costs low.
  • the present invention provides a prepreg, which is a blend of fiber reinforcement, matrix resin and filler;
  • the fiber reinforcement is 20-60 parts by mass, the matrix resin is 20-65 parts by mass, and the filler is 10-40 parts by mass;
  • the filler is a flame-retardant organic microsphere or a blend of the flame-retardant organic microsphere and an inorganic filler, and the particle size of the filler is 0.1 to 15 microns.
  • the particle size of the filler is 0.1 ⁇ m to 5 ⁇ m.
  • the filler is a blend of the flame-retardant organic microspheres and an inorganic filler; the content of the flame-retardant organic microspheres is 20%-100% of the blend.
  • the flame-retardant organic microspheres include organic flame-retardant microspheres; the organic flame-retardant microspheres are insoluble in toluene solvents, acetone solvents, methyl ethyl ketone solvents and ethanol solvents; the inorganic filler is silica and titanium dioxide. Any kind of.
  • the organic flame-retardant microspheres are at least one of halogen-containing organic microspheres, phosphorus-containing organic microspheres, phosphorus-nitrogen-containing organic microspheres, and silicone microspheres;
  • the decomposition temperature is above 350°C.
  • the matrix resin includes modified polyphenylene ether, polyolefin resin and initiator; if the matrix resin is 100 parts by mass, the modified polyphenylene ether is 20-70 parts by mass, and the polyolefin resin 30-70 parts by mass, and 0-5 parts by mass of the initiator.
  • the modified polyphenylene ether is a low molecular weight polyphenylene ether made by capping a reactive functional group; the reactive functional group includes any one of an unsaturated ester and an unsaturated olefin.
  • the molecular weight of the low molecular weight polyphenylene ether is 800-6000.
  • the molecular weight of the low molecular weight polyphenylene ether is 900-4000.
  • the polyolefin resin includes any one or more of polydicyclopentadiene, polydivinylbenzene, polybutadiene and styrene.
  • the initiator is a free radical initiator, and the initiator is any one of a peroxide initiator, an azo initiator, and a dicumin.
  • the fiber reinforcement includes any one of non-woven fabric, fiber cloth, fiber felt, and unidirectional fiber cloth made of fibers.
  • the fiber is at least one of glass fiber, quartz fiber, and organic fiber.
  • the present invention also provides a copper-clad laminate, which includes at least one laminated prepreg of the invention and copper foils attached to one or both sides of the laminated prepreg.
  • the present invention also provides a printed circuit board, which includes the copper clad laminate according to the present invention.
  • the prepreg of the present invention is a blend of fiber reinforcement, matrix resin and filler; the fiber reinforcement is 20-60 parts by mass, and the matrix resin is 20-65 parts by mass.
  • the filler is 10-40 parts by mass; wherein the filler is flame-retardant organic microspheres or a blend of the flame-retardant organic microspheres and inorganic fillers, and the particle size of the filler is 0.1 to 15 microns .
  • the flame-retardant organic microspheres are filled in the matrix resin. Due to the excellent interface performance between the flame-retardant organic microspheres and the matrix resin, the filler is in the matrix resin.
  • the flame-retardant organic microspheres and the matrix resin are not prone to sedimentation, which improves the stability of the material properties of the prepreg.
  • the flame-retardant organic microspheres and the matrix resin It can be directly mixed in the solution, which simplifies the manufacturing process and effectively improves the production efficiency of the prepreg.
  • the application of the prepreg can effectively ensure the performance stability of the copper clad laminate and the printed circuit board.
  • the high production efficiency reduces the production cost of the prepreg, copper clad laminate and printed circuit board.
  • the present invention provides a prepreg, which is a blend of fiber reinforcement, matrix resin and filler; if the prepreg is 100 parts by mass, the fiber reinforcement is 20-60 parts by mass, and the The base resin is 20-65 parts by mass, and the filler is 10-40 parts by mass.
  • the filler may be flame-retardant organic microspheres, or a blend of flame-retardant organic microspheres and inorganic fillers, which can be set according to actual requirements.
  • the filler in order to ensure the material properties of the prepreg, may be a blend of flame-retardant organic microspheres and inorganic fillers, and the content of the flame-retardant organic microspheres is the total 20%-100% of the blend. Since the inorganic filler is added to the filler, the dielectric constant and the thermodynamic properties of the prepreg can be effectively increased without affecting the heat resistance and mechanical properties of the matrix resin. More specifically, the inorganic filler is any one of silica and titanium dioxide, which can be specifically selected according to actual requirements.
  • the flame-retardant organic microspheres include organic flame-retardant microspheres, which are insoluble in toluene solvent, acetone solvent, methyl ethyl ketone solvent and ethanol solvent.
  • the organic flame-retardant microspheres have flame retardancy, including but not limited to halogen-containing organic microspheres, phosphorus-containing organic microspheres, phosphorus-nitrogen-containing organic microspheres, and silicone microspheres with superior flame retardant properties At least one of the organic flame-retardant microspheres can be specifically selected according to actual conditions in practical applications.
  • the flame-retardant organic microspheres also have strong heat resistance, and their thermal decomposition temperature is above 350°C. This heat resistance ensures that the flame-retardant organic microspheres are filled in the matrix. Reliability in resin.
  • the flame-retardant organic microspheres are used as organic fillers, and the flame-retardant organic microspheres do not chemically react with the matrix resin. Compared with other soluble or reactive flame retardants, insoluble organic flame-retardant microspheres have Low cost, little effect on the heat resistance, mechanical properties and dielectric properties of the composite material, and good flame retardant effect.
  • the heat resistance and mechanical properties of the matrix resin are ensured. At the same time, the interface strength between the flame-retardant organic microspheres and the matrix resin is increased, and the interface performance between the two is excellent, and it is not prone to agglomeration and sedimentation.
  • the filler can be effectively uniformly filled in the matrix resin, which effectively improves the stability of the material properties of the prepreg; at the same time, the filler can be directly mixed with the matrix resin in solution ,
  • the flame-retardant organic microspheres have strong flame retardancy Performance, under the premise of ensuring the heat resistance and thermal performance of the matrix resin, the flame retardancy of the prepreg is greatly improved.
  • the filler content is 0-40 parts by mass, and the flame-retardant organic microspheres account for 20%-100% of the filler content, which can effectively improve the prepreg
  • the flame retardant performance of the flame retardant, and the specific content of the flame retardant organic microspheres can be set according to actual needs.
  • the flame-retardant organic microspheres are formed by forming a mixture of the organic flame-retardant microspheres and a flame-retardant synergist.
  • the addition of the flame retardant synergist can effectively increase the flame retardant performance of the prepreg.
  • the filler is affected by the flame-retardant organic microspheres, which are mainly in the form of particles, and the particle size of the particles also directly affects the stability after mixing with the matrix resin.
  • the particle size of the filler can effectively improve the mixing stability of the filler and the matrix resin.
  • the particle size of the filler is 0.1 ⁇ m to 15 ⁇ m; more preferably Yes, the particle size of the filler is 0.1 to 5 microns.
  • the filler By controlling the particle size of the filler, the filler can be effectively distributed in the matrix resin more uniformly, and the interface strength between the organic filler and the matrix resin can be further improved, so that the prepreg The stability of the material performance of the material is higher, and the flame retardant performance of the prepreg is greatly improved.
  • the base resin includes modified polyphenylene ether, polyolefin resin and initiator; if the base resin is 100 parts by mass, the modified polyphenylene ether is 20-70 parts by mass, and the polyolefin resin is 30 parts by mass. -70 parts by mass, and the initiator is 0-5 parts by mass.
  • the modified polyphenylene ether is a low molecular weight polyphenylene ether made by capping a reactive functional group; the reactive functional group includes any one of unsaturated esters and unsaturated olefins, which can Make specific choices according to actual needs.
  • the molecular weight of the low molecular weight polyphenylene ether is 800-6000; more preferably, the molecular weight of the low molecular weight polyphenylene ether is 900-4000.
  • the polyolefin resin includes any one of polydicyclopentadiene, polydivinylbenzene, polybutadiene, and styrene, which can be specifically selected according to actual needs.
  • modified polyphenylene ether has a large viscosity, but its processability is poor, while polyolefin resin is a liquid resin with excellent dielectric properties.
  • the polyolefin resin and modified polyphenylene ether are combined under the action of an initiator. Mixing to form the matrix resin, polyolefin resin and modified polyphenylene ether can effectively improve the processability of the resin and reduce the cost of producing the matrix resin to a certain extent.
  • the initiator is a free radical initiator, and the initiator is any one of a peroxide initiator, an azo initiator, and a biquat, which can be specifically selected according to actual needs.
  • the fiber reinforcement includes any one of non-woven fabric, fiber cloth, fiber mat and unidirectional fiber cloth made of fibers; the fiber is at least one of glass fiber, quartz fiber, and organic fiber.
  • the present invention also provides a copper-clad laminate comprising at least one laminated prepreg according to the invention and copper foil attached to one or both sides of the laminated prepreg
  • the prepreg is used as a basic material for making the copper clad laminate, and its performance directly affects the performance of the copper clad laminate.
  • the present invention also provides a printed circuit board.
  • the printed circuit board includes the copper-clad laminate as described in the present invention; the copper-clad laminate is sequentially made into the copper-clad laminate through the steps of exposure, development, etching, and surface treatment.
  • Printed circuit board the printed circuit board has better dielectric properties.
  • the performance stability of the copper clad laminate and printed circuit board can be effectively ensured, so that the copper clad laminate Laminates and printed circuit boards have better dielectric properties, heat resistance, mechanical properties, and flame retardancy.
  • the copper clad laminate and The production cost of printed circuit boards is reduced.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of polydivinylbenzene, and 19 parts by mass of Silica, 5 parts by mass of bromine-containing organic microspheres, and 26 parts by mass of fiber cloth.
  • the polyphenylene ether and the polydivinylbenzene jointly form a resin matrix
  • the polyphenylene ether is a polyphenylene ether made by capping acrylate, and the molecular weight is preferably 2200-2400.
  • the molecular weight of the polydivinylbenzene is 10,000 to 160,000.
  • the silica is an inorganic filler with a particle size of 0.1 micron to 0.3 micron; the bromine-containing organic microspheres are organic flame-retardant microspheres; the bromine-containing organic microspheres and the silica jointly constitute the implementation The filler of Example 1.
  • the fiber cloth is preferably electronic grade E glass fiber.
  • polyphenylene ether has a high viscosity, while polydivinyl benzene is liquid, and its dielectric properties are excellent.
  • the blending of polyphenylene ether and polydivinylbenzene can effectively improve the processability of the matrix resin and reduce the production
  • the cost of the matrix resin of the first embodiment; the insoluble bromine-containing organic microspheres have the characteristics of low cost, little influence on the heat resistance, mechanical properties and dielectric properties of the composite material, and good flame retardant effect.
  • the addition of organic microspheres ensures the heat resistance, mechanical properties and dielectric properties of the prepreg of the first embodiment, and effectively enhances the flame retardancy of the prepreg of the first embodiment.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of polydivinylbenzene, and 16 parts by mass of Silica, 8 parts by mass of bromine-containing organic microspheres, and 26 parts by mass of fiber cloth.
  • the polyphenylene ether and the polydivinylbenzene jointly constitute a matrix resin
  • the polyphenylene ether is a polyphenylene ether made by capping acrylate, and the molecular weight is preferably 2200-2400.
  • the molecular weight of the polydivinylbenzene is 10,000 to 160,000.
  • the silica is an inorganic filler with a particle size of 0.1 micron to 0.3 micron; the bromine-containing organic microspheres are organic flame-retardant microspheres; the bromine-containing organic microspheres and the silica jointly constitute the implementation The filler of Example 2.
  • the fiber cloth is preferably electronic grade E glass fiber.
  • polyphenylene ether has a high viscosity, while polydivinyl benzene is liquid, and its dielectric properties are excellent.
  • the blending of polyphenylene ether and polydivinylbenzene can effectively improve the processability of the matrix resin and reduce the production
  • the cost of the matrix resin of the second embodiment; the insoluble bromine-containing organic microspheres have the characteristics of low cost, little effect on the heat resistance, mechanical properties and dielectric properties of the composite material, and good flame retardant effect.
  • the addition of organic microspheres ensures the heat resistance, mechanical properties and dielectric properties of the prepreg of the second embodiment, and effectively enhances the flame retardancy of the prepreg of the second embodiment.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of polydivinylbenzene, and 24 parts by mass of Bromine-containing organic microspheres and 26 parts by mass of fiber cloth.
  • the polyphenylene ether and the polydivinylbenzene jointly constitute a matrix resin
  • the polyphenylene ether is a polyphenylene ether made by capping acrylate
  • the molecular weight is preferably 2200-2400.
  • the molecular weight of the polydivinylbenzene is 10,000 to 160,000.
  • the bromine-containing organic microspheres are organic flame-retardant microspheres, and the bromine-containing organic microspheres serve as the filler in the third embodiment.
  • the fiber cloth is preferably electronic grade E glass fiber.
  • polyphenylene ether has a high viscosity, while polydivinyl benzene is liquid, and its dielectric properties are excellent.
  • the blending of polyphenylene ether and polydivinylbenzene can effectively improve the processability of the matrix resin and reduce the production
  • the cost of the matrix resin of the third embodiment; the insoluble bromine-containing organic microspheres have the characteristics of low cost, little effect on the heat resistance, mechanical properties and dielectric properties of the composite material, and good flame retardant effect.
  • the addition of organic microspheres ensures the heat resistance, mechanical properties and dielectric properties of the prepreg of the third embodiment, and effectively enhances the flame retardancy of the prepreg of the third embodiment.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of styrene butadiene rubber, and 19 parts by mass of dioxide Silicon, 5 parts by mass of phosphorus-nitrogen-containing organic microspheres, and 26 parts by mass of fiber cloth.
  • the polyphenylene ether and the styrene-butadiene rubber jointly constitute a matrix resin
  • the polyphenylene ether is a polyphenylene ether made by capping acrylate, and the molecular weight is preferably 2200-2400.
  • the silica is an inorganic filler with a particle size of 0.1 micron to 0.3 micron; the phosphorus-nitrogen-containing organic microspheres are organic flame-retardant microspheres; the phosphorus-nitrogen-containing organic microspheres and the silica Together they constitute the filler of the fourth embodiment.
  • the fiber cloth is preferably electronic grade E glass fiber.
  • polyphenylene ether has a high viscosity, while styrene-butadiene rubber is liquid, and its dielectric properties are excellent.
  • the blending of polyphenylene ether and styrene-butadiene rubber can effectively improve the processability of the matrix resin and reduce the production of the fourth embodiment.
  • the cost of the matrix resin; the insoluble phosphorus-nitrogen-containing organic microspheres have the characteristics of low cost, little effect on the heat resistance, mechanical properties and dielectric properties of the composite material, and good flame retardant effect.
  • the addition of organic microspheres ensures the heat resistance, mechanical properties and dielectric properties of the prepreg of Example 4, while effectively enhancing the flame retardancy of the prepreg of Example 4.
  • the phosphorus-containing -Nitrogen organic microspheres do not contain halogen elements and can meet the halogen-free flame retardant requirements of copper clad laminates.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of styrene butadiene rubber, and 14 parts by mass of dioxide Silicon, 10 parts by mass of phosphorus-nitrogen-containing organic microspheres, and 26 parts by mass of fiber cloth.
  • the polyphenylene ether and the styrene-butadiene rubber jointly constitute a matrix resin
  • the polyphenylene ether is a polyphenylene ether made by capping acrylate, and the molecular weight is preferably 2200-2400.
  • the silica is an inorganic filler with a particle size of 0.1 micron to 0.3 micron; the phosphorus-nitrogen-containing organic microspheres are organic flame-retardant microspheres; the phosphorus-nitrogen-containing organic microspheres and the silica Together they constitute the filler of the fifth embodiment.
  • the fiber cloth is preferably electronic grade E glass fiber.
  • the polyphenylene ether has a high viscosity, while the styrene-butadiene rubber is liquid, and its dielectric properties are excellent.
  • the blending of the polyphenylene ether and the styrene-butadiene rubber can effectively improve the processability of the matrix resin and reduce the production of the fifth embodiment.
  • the cost of the matrix resin; the insoluble phosphorus-nitrogen-containing organic microspheres have the characteristics of low cost, little effect on the heat resistance, mechanical properties and dielectric properties of the composite material, and good flame retardant effect.
  • the addition of organic microspheres ensures the heat resistance, mechanical properties, and dielectric properties of the prepreg of Example 5, while effectively enhancing the flame retardancy of the prepreg of Example 5.
  • the phosphorus-containing -Nitrogen organic microspheres do not contain halogen elements and can meet the halogen-free flame retardant requirements of copper clad laminates.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of styrene butadiene rubber, and 24 parts by mass of phosphorus -Nitrogen organic microspheres and 26 parts by mass of fiber cloth.
  • the polyphenylene ether and the styrene-butadiene rubber jointly constitute a matrix resin
  • the polyphenylene ether is a polyphenylene ether made by capping acrylate, and the molecular weight is preferably 2200-2400.
  • the phosphorus-nitrogen-containing organic microspheres are organic flame-retardant microspheres; the phosphorus-nitrogen-containing organic microspheres serve as the filler in the sixth embodiment.
  • the fiber cloth is preferably electronic grade E glass fiber.
  • polyphenylene ether has a high viscosity, while styrene-butadiene rubber is liquid, and its dielectric properties are excellent.
  • the processability of the matrix resin can be effectively improved, and the production of the sixth embodiment is reduced.
  • the cost of the matrix resin; the insoluble phosphorus-nitrogen-containing organic microspheres have the characteristics of low cost, little effect on the heat resistance, mechanical properties and dielectric properties of the composite material, and good flame retardant effect.
  • the addition of organic microspheres ensures the heat resistance, mechanical properties and dielectric properties of the prepreg of Example 6, while effectively enhancing the flame retardancy of the prepreg of Example 6.
  • the phosphorus-containing -Nitrogen organic microspheres do not contain halogen elements, which can meet the halogen-free flame retardant requirements of copper clad laminates.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of styrene butadiene rubber, and 16 parts by mass of dioxide Silicon, 8 parts by mass of bromine-containing organic microspheres, and 26 parts by mass of fiber cloth.
  • the polyphenylene ether and the styrene-butadiene rubber jointly constitute a matrix resin
  • the polyphenylene ether is a polyphenylene ether made by capping acrylate, and the molecular weight is preferably 2200-2400;
  • the silica is an inorganic filler with a particle size of 0.1 micron to 0.3 micron; the bromine-containing organic microspheres are organic flame-retardant microspheres; the bromine-containing organic microspheres and the silica jointly constitute the implementation The filler of Example 7.
  • the fiber cloth is preferably electronic grade E glass fiber.
  • polyphenylene ether has a high viscosity, while styrene-butadiene rubber is liquid, and its dielectric properties are excellent.
  • the blending of polyphenylene ether and styrene-butadiene rubber can effectively improve the processability of the matrix resin and reduce the production of the seventh embodiment.
  • the cost of the matrix resin; insoluble bromine-containing organic microspheres have the characteristics of low cost, little effect on the heat resistance, mechanical properties and dielectric properties of the composite material, and good flame retardant effect.
  • the bromine-containing organic microspheres While ensuring the heat resistance, mechanical properties and dielectric properties of the prepreg of the seventh embodiment, the addition can effectively enhance the flame retardancy of the prepreg of the seventh embodiment.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of polydivinylbenzene, and 24 parts by mass of Silica and 26 parts by mass of fiber cloth.
  • polyphenylene ether and polydivinylbenzene jointly constitute a matrix resin
  • the polyphenylene ether is a polyphenylene ether made by capping acrylate
  • the molecular weight is preferably 2200-2400.
  • the molecular weight of the polydivinylbenzene It is preferably 10000 to 160,000; the silica is an inorganic filler with a particle size of 0.1 micron to 0.3 micron; the fiber cloth is used as a fiber reinforcement, which is preferably electronic grade E glass fiber.
  • the prepreg specifically includes: 20 parts by mass of polyphenylene ether, 30 parts by mass of styrene butadiene rubber, and 26 parts by mass of Fiber cloth.
  • polyphenylene ether and polydivinylbenzene jointly constitute a matrix resin
  • the polyphenylene ether is a polyphenylene ether made of acrylate-terminated, and the molecular weight is preferably 2200-2400;
  • the fiber cloth is used as a fiber reinforcement, It is preferably electronic grade E glass fiber.
  • the prepreg of Example 1, the prepreg of Example 2, the prepreg of Example 3, the prepreg of Example 4, and the prepreg of Example 5 The water absorption, heat resistance, copper peel strength and dielectric properties of composite materials prepared from the prepreg of Example 6, the prepreg of Example 7, the prepreg of Comparative Example 1 and the prepreg of Comparative Example 2 Basically maintained at a similar level, the flame retardancy of the composite material prepared from the prepreg of the example filled with organic microspheres has been significantly improved.
  • the prepreg of Example 1, the prepreg of Example 2, and the The flame retardant properties of the composite material prepared from the prepreg of Example 3, the prepreg of Example 5, the prepreg of Example 6, and the prepreg of Example 7 can all reach the UL94-V0 level.
  • the flame retardant properties of the composite materials prepared by the dipping material can reach the UL94-V1 level, and the flame retardant performance is significantly better than that of the prepregs of Comparative Example 1 and Comparative Example 2. Therefore, it can be concluded from the above that the prepreg filled with organic flame-retardant microspheres can effectively improve its own flame-retardant performance while maintaining better material properties.
  • the prepreg of the present invention is a blend of fiber reinforcement, matrix resin and filler; the fiber reinforcement is 20-60 parts by mass, and the matrix resin is 20-65 parts by mass.
  • the filler is 10-40 parts by mass; wherein the filler is flame-retardant organic microspheres or a blend of the flame-retardant organic microspheres and inorganic fillers, and the particle size of the filler is 0.1 to 15 microns .
  • the flame-retardant organic microspheres are filled in the matrix resin. Due to the excellent interface performance between the flame-retardant organic microspheres and the matrix resin, the filler is in the matrix resin.
  • the flame-retardant organic microspheres and the matrix resin are not prone to sedimentation, which improves the stability of the material properties of the prepreg.
  • the flame-retardant organic microspheres and the matrix resin It can be directly mixed in the solution, which simplifies the manufacturing process and effectively improves the production efficiency of the prepreg.
  • the application of the prepreg can effectively ensure the stability of the performance of the copper clad laminate and the printed circuit board.
  • the high production efficiency reduces the production cost of the prepreg, copper clad laminate and printed circuit board.

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Abstract

本发明提供了一种预浸料，其为纤维增强体、基体树脂与填料的共混物；纤维增强体为20-60质量份，基体树脂为20-65质量份，填料为10-40质量份；其中，填料为阻燃有机微球或阻燃有机微球与无机填料的共混物，填料的粒径为0.1微米至15微米。本发明还提供了应用本发明的预浸料制成的覆铜层压板和印刷电路板。与相关技术相比，本发明的预浸料界面性能好、材料性能稳定，且其制作工艺简单、生产效率高，而本发明的覆铜层压板及印刷电路板性能稳定、且生产成本低。

Description

预浸料、覆铜层压板及印刷电路板 技术领域
本发明涉及覆铜层压板技术领域，尤其涉及一种预浸料、覆铜层压板及印刷电路板。
 背景技术
近年来，随着电子信息技术的发展，电子设备安装的小型化、高密度化，信息的大容量化、高速化，对印刷电路板的耐热性、吸水性、耐化学性、机械性能、尺寸稳定性和介电性能等综合性能提出了更高的要求。
相关技术中，印刷电路板由覆铜层压板制成，而所述覆铜层压板包括树脂基板和贴设于所述树脂基板的铜箔；在所述树脂基板制造时常需要在基体树脂中加入无机填料以调整材料的介电常数、提高材料的热力学性能并降低成本。
 技术问题
然而，相关技术中，常用的无机填料如二氧化硅等多为表面光滑的球形结构，导致该无机填料在与有机聚合物混合过程中出现团聚，界面性能差等问题，导致填料发生沉降，使得树脂基板的材料性能不稳定；另外，无机填料与有机聚合物之间的相容性差，需要进行改性，工艺繁琐，生产效率低。
因此，实有必要提供一种新的预浸料、覆铜层压板及印刷电路板解决上述技术问题。
 技术解决方案
本发明的目的在于提供一种预浸料、覆铜层压板及印刷电路板，该预浸料界面性能好、材料性能稳定，且其制作工艺简单、生产效率高，而应用该预浸料的覆铜层压板及印刷电路板在保证性能稳定的同时，使得生产成本低。
为达到上述目的，本发明提供一种预浸料，其为纤维增强体、基体树脂与填料的共混物；
所述纤维增强体为20-60质量份，所述基体树脂为20-65质量份，所述填料为10-40质量份；
其中，所述填料为阻燃有机微球或所述阻燃有机微球与无机填料的共混物，所述填料的粒径为0.1微米至15微米。
优选的，所述填料的粒径为0.1微米至5微米。
优选的，所述填料为所述阻燃有机微球与无机填料的共混物；所述阻燃有机微球含量为所述共混物的20%-100%。
优选的，所述阻燃有机微球包括有机阻燃微球；所述有机阻燃微球不溶于甲苯溶剂、丙酮溶剂、丁酮溶剂及乙醇溶剂；所述无机填料为二氧化硅，二氧化钛中的任意一种。
优选的，所述有机阻燃微球为含卤有机微球、含磷有机微球、含磷-氮有机微球和有机硅微球中的至少一种；所述有机阻燃微球的热分解温度350℃以上。
优选的，所述基体树脂包括改性聚苯醚、聚烯烃树脂和引发剂；以所述基体树脂为100质量份，则所述改性聚苯醚20-70质量份，所述聚烯烃树脂30-70质量份，所述引发剂0-5质量份。
优选的，所述改性聚苯醚为由可反应性官能团封端制成的低分子量聚苯醚；所述可反应性官能团包括不饱和酯和不饱和烯烃中的任意一种。
优选的，所述低分子量聚苯醚的分子量为800-6000。
优选的，所述低分子量聚苯醚的分子量为900-4000。
优选的，所述聚烯烃树脂包括聚双环戊二烯、聚二乙烯基苯、聚丁二烯和苯乙烯中的任意一种或多种。
优选的，所述引发剂为自由基引发剂，所述引发剂为过氧化物类引发剂、偶氮类引发剂和联枯中的任意一种。
优选的，所述纤维增强体包括由纤维制成的无纺布、纤维布、纤维毡和单向纤维布中的任意一种。
优选的，所述纤维为玻璃纤维、石英纤维、有机纤维中的至少一种。
本发明还提供一种覆铜层压板，其包括至少一张叠合的本发明所述的预浸料和贴设于叠合后的所述预浸料的一侧或两侧的铜箔。
本发明还提供一种印刷电路板，其包括本发明所述的覆铜层压板。
 有益效果
与相关技术相比，本发明的预浸料为其为纤维增强体、基体树脂与填料的共混物；所述纤维增强体为20-60质量份，所述基体树脂为20-65质量份，所述填料为10-40质量份；其中，所述填料为阻燃有机微球或所述阻燃有机微球与无机填料的共混物，所述填料的粒径为0.1微米至15微米。上述的预浸料中，将所述阻燃有机微球填充在所述基体树脂中，由于所述阻燃有机微球与所述基体树脂的界面性能优，使得所述填料在所述基体树脂中均匀分布，所述阻燃有机微球与所述基体树脂之间不易发生沉降，提高了所述预浸料的材料性能的稳定性，另外，所述阻燃有机微球与所述基体树脂可以直接在溶液中混合，简化了制作工艺，有效提高所述预浸料的生产效率。而本发明的覆铜层压板及印刷电路板中，所述预浸料的应用能够有效地保证所述覆铜层压板及印刷电路板的性能的稳定性，同时，由于所述预浸料的生产效率高，使得所述预浸料、覆铜层压板及印刷电路板的制作成本下降。
 本发明的实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
本发明提供一种预浸料，其为纤维增强体、基体树脂与填料的共混物；以所述预浸料为100质量份，则所述纤维增强体为20-60质量份，所述基体树脂为20-65质量份，所述填料为10-40质量份。
所述填料可以为阻燃有机微球，也可以为阻燃有机微球与无机填料的共混物，其可以根据实际使用的需求进行设置。
比如，在本实施方式中，为了保证诉所述预浸料的材料性能，所述填料可以为阻燃有机微球与无机填料的共混物，所述阻燃有机微球含量为所述共混物的20%-100%。由于所述填料中加入所述无机填料，能够在不影响所述基体树脂的耐热性、力学性能的前提条件下，有效地提高所述预浸料的介电常数、提高其热力学性能。更具体的，所述无机填料为二氧化硅和二氧化钛中的任意一种，其可根据实际的需求进行具体的选择。
进一步的，所述阻燃有机微球包括有机阻燃微球，所述有机阻燃微球不溶于甲苯溶剂、丙酮溶剂、丁酮溶剂及乙醇溶剂。
具体的，所述有机阻燃微球具有阻燃性，包括但不限于具有较优阻燃性能的含卤有机微球、含磷有机微球、含磷-氮有机微球和有机硅微球中的至少一种，在实际应用中，可以根据实际情况对所述有机阻燃微球的种类进行具体的选择。
值得一提的是，所述阻燃有机微球还具备较强的耐热性能，其热分解的温度为350℃以上，该耐热性能保证了所述阻燃有机微球填充在所述基体树脂内的可靠性。
所述阻燃有机微球作为有机填料，所述阻燃有机微球不与所述基体树脂发生化学反应，相对于其他可溶性或可反应性阻燃剂而言，不溶的有机阻燃微球具有成本低，对复合材料耐热性、力学性能及介电性能影响小，阻燃效果佳等特点。
保证了所述基体树脂的耐热性、力学性能，同时，所述阻燃有机微球与所述基体树脂之间的界面强度增加，两者之间的界面性能优，不易出现团聚、沉降的问题，能够有效地使得所述填料均匀地填充在所述基体树脂中，有效地提高了所述预浸料的材料性能的稳定性；同时，所述填料可直接与所述基体树脂在溶液混合，无需进行超声、研磨或高速搅拌的处理工序，简化了混合工艺，大大提高了生产效率，降低了所述预浸料生产的成本；另外，所述阻燃有机微球具有较强的阻燃性能，在保证所述基体树脂的耐热性和热学性能的前提下，使得所述预浸料的阻燃性大幅度提高。
在所述预浸料中，若所述阻燃有机微球的含量过低，会导致该预浸料的阻燃性下降，即其阻燃性级别达不到UL94-V0级别（该级别为覆铜板行业对阻燃性能的标准要求）；但所述阻燃有机微球的含量太高，也会增加成本。因此，在所述预浸料中，所述填料的含量为0-40质量份，所述阻燃有机微球含量占所述填料含量的20%-100%能够有效地提高所述预浸料的阻燃性能，而所述阻燃有机微球具体的含量可以根据实际使用的需要进行设置。
为了进一步提高所述阻燃有机微球的阻燃性能，作为一种优选的实施方案，所述阻燃有机微球为所述有机阻燃微球与阻燃协效剂形成混合物，通过所述阻燃协效剂的加入，能够有效地增加所述预浸料的阻燃性能。
值得一提的是，所述填料受所述阻燃有机微球的影响，其主要呈颗粒状，其颗粒的粒径大小也直接影响其与所述基体树脂混合之后的稳定性，通过减小所述填料的粒径大小，能够有效地提高所述填料与所述基体树脂的混合稳定性，在此，作为一个优选的实施方案，所述填料的粒径为0.1微米至15微米；更优的，所述填料的粒径为0.1微米至5微米。
通过控制所述填料的粒径大小，能够有效地使得所述填料更加均匀地分布在所述基体树脂内，进一步提高所述有机填料与所述基体树脂之间的界面强度，使得所述预浸料的材料性能的稳定性更高，且大大提高了所述预浸料的阻燃性能。
所述基体树脂包括改性聚苯醚、聚烯烃树脂和引发剂；以所述基体树脂为100质量份，则所述改性聚苯醚为20-70质量份，所述聚烯烃树脂为30-70质量份，所述引发剂为0-5质量份。
更具体的，所述改性聚苯醚为由可反应性官能团封端制成的低分子量聚苯醚；所述可反应性官能团包括不饱和酯和不饱和烯烃中的任意一种，其可以根据实际的需求进行具体的选择。优选的，所述低分子量聚苯醚的分子量为800-6000；更优的，所述低分子量聚苯醚的分子量为900-4000。
所述聚烯烃树脂包括聚双环戊二烯、聚二乙烯基苯、聚丁二烯和苯乙烯中的任意一种，其可以根据实际的需求进行具体的选择。
在基体树脂中，改性聚苯醚的粘度大，但其工艺性差，而聚烯烃树脂为液态树脂，其介电性能优异，将聚烯烃树脂与改性聚苯醚在引发剂的作用下共混形成所述基体树脂，聚烯烃树脂与改性聚苯醚可以有效的改善树脂的工艺性，并在一定程度上降低生产所述基体树脂的成本。
所述引发剂为自由基引发剂，所述引发剂为过氧化物类引发剂、偶氮类引发剂和联枯中的任意一种，其可以根据实际的需求进行具体的选择。
所述纤维增强体包括由纤维制成的无纺布、纤维布、纤维毡和单向纤维布中的任意一种；所述纤维为玻璃纤维，石英纤维，有机纤维中的至少一种。
本发明还提供一种覆铜层压板，其包括至少一张叠合的如本发明所述的预浸料和贴设于叠合后的所述预浸料的一侧或两侧的铜箔；所述预浸料作为制作所述覆铜层压板的基础材料，其性能直接影响所述覆铜层压板的性能。
本发明还提供一种印刷电路板，所述印刷电路板包括如本发明所述的覆铜层压板；所述覆铜层压板依次通过曝光、显影、刻蚀和表面处理等工序制成所述印刷电路板，所述印刷电路板具有较优的介电性能。
上述的预浸料、覆铜层压板及印刷电路板中，由于所述预浸料的应用，能够有效地保证所述覆铜层压板及印刷电路板的性能的稳定性，使得所述覆铜层压板及印刷电路板具有较优的介电性能、耐热性、力学性能及阻燃性，同时，由于所述预浸料的生产效率高、生产成本低，使得所述覆铜层压板及印刷电路板的制作成本下降。
为了验证本发明所述预浸料的实施效果进行以下几组对照例和实施例来验证，其他没有具体说明的简称均为本领域内技术人员熟知的产品简称。
[根据细则26改正13.11.2019]　
表一、各实施例和各对照例的成分表


Figure t1-1

Figure t1-2







实施例一
如上表一所示，以该实施例一的预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的聚二乙烯基苯、19质量份的二氧化硅、5质量份的含溴有机微球及26质量份的纤维布。
具体的，所述聚苯醚和所述聚二乙烯基苯共同构成树脂基体，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400。
所述聚二乙烯基苯的分子量为10000-160000。
所述二氧化硅为无机填料，其粒径为0.1微米至0.3微米；所述含溴有机微球为有机阻燃微球；所述含溴有机微球和所述二氧化硅共同构成该实施例一的填料。
所述纤维布作为纤维增强体，其优选为电子级E玻纤。
上述结构中，聚苯醚粘度大，而聚二乙烯基笨为液态，其介电性能优异，将聚苯醚与聚二乙烯基苯共混后可以有效的改善基体树脂的工艺性，降低制作该实施例一的基体树脂的成本；而不溶的含溴有机微球具有成本低，对复合材料的耐热性、力学性能及介电性能的影响小，阻燃效果佳等特点，该含溴有机微球的加入在保证该实施例一的预浸料的耐热性、力学性能及介电性能的同时，有效增强该实施例一的预浸料的阻燃性。
实施例二
如上表一所示，以该实施例二的预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的聚二乙烯基苯、16质量份的二氧化硅、8质量份的含溴有机微球及26质量份的纤维布。
具体的，所述聚苯醚和所述聚二乙烯基苯共同构成基体树脂，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400。
所述聚二乙烯基苯的分子量为10000-160000。
所述二氧化硅为无机填料，其粒径为0.1微米至0.3微米；所述含溴有机微球为有机阻燃微球；所述含溴有机微球和所述二氧化硅共同构成该实施例二的填料。
所述纤维布作为纤维增强体，其优选为电子级E玻纤。
上述结构中，聚苯醚粘度大，而聚二乙烯基笨为液态，其介电性能优异，将聚苯醚与聚二乙烯基苯共混后可以有效的改善基体树脂的工艺性，降低制作该实施例二的基体树脂的成本；而不溶的含溴有机微球具有成本低，对复合材料的耐热性、力学性能及介电性能的影响小，阻燃效果佳等特点，该含溴有机微球的加入在保证该实施例二的预浸料的耐热性、力学性能及介电性能的同时，有效增强该实施例二的预浸料的阻燃性。
实施例三
如上表一所示，以该实施例三的预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的聚二乙烯基苯、24质量份的含溴有机微球及26质量份的纤维布。
具体的，所述聚苯醚和所述聚二乙烯基苯共同构成基体树脂，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400。所述聚二乙烯基苯的分子量为10000-160000。
所述含溴有机微球为有机阻燃微球，所述含溴有机微球充当该实施例三的填料。
所述纤维布作为纤维增强体，其优选为电子级E玻纤。
上述结构中，聚苯醚粘度大，而聚二乙烯基笨为液态，其介电性能优异，将聚苯醚与聚二乙烯基苯共混后可以有效的改善基体树脂的工艺性，降低制作该实施例三的基体树脂的成本；而不溶的含溴有机微球具有成本低，对复合材料的耐热性、力学性能及介电性能的影响小，阻燃效果佳等特点，该含溴有机微球的加入在保证该实施例三的预浸料的耐热性、力学性能及介电性能的同时，有效增强该实施例三的预浸料的阻燃性。
实施例四
如上表一所示，以该实施例四的预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的丁苯橡胶、19质量份的二氧化硅、5质量份的含磷-氮有机微球及26质量份的纤维布。
具体的，所述聚苯醚和所述丁苯橡胶共同构成基体树脂，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400。
所述二氧化硅为无机填料，其粒径为0.1微米至0.3微米；所述含磷-氮有机微球为有机阻燃微球；所述含磷-氮有机微球和所述二氧化硅共同构成该实施例四的填料。
所述纤维布作为纤维增强体，其优选为电子级E玻纤。
上述结构中，聚苯醚粘度大，而丁苯橡胶为液态，其介电性能优异，将聚苯醚与丁苯橡胶共混后可以有效的改善基体树脂的工艺性，降低制作该实施例四的基体树脂的成本；而不溶的含磷-氮有机微球具有成本低，对复合材料的耐热性、力学性能及介电性能的影响小，阻燃效果佳等特点，该含磷-氮有机微球的加入在保证该实施例四的预浸料的耐热性、力学性能及介电性能的同时，有效增强该实施例四的预浸料的阻燃性，另外，所述含磷-氮有机微球不包含卤族元素，能够满足覆铜层压板无卤阻燃的要求。
实施例五
如上表一所示，以该实施例五的预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的丁苯橡胶、14质量份的二氧化硅、10质量份的含磷-氮有机微球及26质量份的纤维布。
具体的，所述聚苯醚和所述丁苯橡胶共同构成基体树脂，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400。
所述二氧化硅为无机填料，其粒径为0.1微米至0.3微米；所述含磷-氮有机微球为有机阻燃微球；所述含磷-氮有机微球和所述二氧化硅共同构成该实施例五的填料。
所述纤维布作为纤维增强体，其优选为电子级E玻纤。
上述结构中，聚苯醚粘度大，而丁苯橡胶为液态，其介电性能优异，将聚苯醚与丁苯橡胶共混后可以有效的改善基体树脂的工艺性，降低制作该实施例五的基体树脂的成本；而不溶的含磷-氮有机微球具有成本低，对复合材料的耐热性、力学性能及介电性能的影响小，阻燃效果佳等特点，该含磷-氮有机微球的加入在保证该实施例五的预浸料的耐热性、力学性能及介电性能的同时，有效增强该实施例五的预浸料的阻燃性，另外，所述含磷-氮有机微球不包含卤族元素，能够满足覆铜层压板无卤阻燃的要求。
实施例六
如上表一所示，以该实施例六的预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的丁苯橡胶、24质量份的含磷-氮有机微球及26质量份的纤维布。
具体的，所述聚苯醚和所述丁苯橡胶共同构成基体树脂，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400。
所述含磷-氮有机微球为有机阻燃微球；所述含磷-氮有机微球充当该实施例六的填料。
所述纤维布作为纤维增强体，其优选为电子级E玻纤。
上述结构中，聚苯醚粘度大，而丁苯橡胶为液态，其介电性能优异，将聚苯醚与丁苯橡胶共混后可以有效的改善基体树脂的工艺性，降低制作该实施例六的基体树脂的成本；而不溶的含磷-氮有机微球具有成本低，对复合材料的耐热性、力学性能及介电性能的影响小，阻燃效果佳等特点，该含磷-氮有机微球的加入在保证该实施例六的预浸料的耐热性、力学性能及介电性能的同时，有效增强该实施例六的预浸料的阻燃性，另外，所述含磷-氮有机微球不包含卤族元素，能够满足覆铜层压板无卤阻燃的要求。
实施例七
如上表一所示，以该实施例七的预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的丁苯橡胶、16质量份的二氧化硅、8质量份的含溴有机微球及26质量份的纤维布。
具体的，所述聚苯醚和所述丁苯橡胶共同构成基体树脂，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400；
所述二氧化硅为无机填料，其粒径为0.1微米至0.3微米；所述含溴有机微球为有机阻燃微球；所述含溴有机微球和所述二氧化硅共同构成该实施例七的填料。
所述纤维布作为纤维增强体，其优选为电子级E玻纤。
上述结构中，聚苯醚粘度大，而丁苯橡胶为液态，其介电性能优异，将聚苯醚与丁苯橡胶共混后可以有效的改善基体树脂的工艺性，降低制作该实施例七的基体树脂的成本；而不溶的含溴有机微球具有成本低，对复合材料的耐热性、力学性能及介电性能的影响小，阻燃效果佳等特点，该含溴有机微球的加入在保证该实施例七的预浸料的耐热性、力学性能及介电性能的同时，有效增强该实施例七的预浸料的阻燃性。
对照例一
如上表一所示，以该对照例一的预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的聚二乙烯基苯、24质量份的二氧化硅及26质量份的纤维布。
具体的，聚苯醚和聚二乙烯基苯共同构成基体树脂，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400，所述聚二乙烯基苯的分子量优选为10000-160000；所述二氧化硅为无机填料，其粒径为0.1微米至0.3微米；所述纤维布作为纤维增强体，其优选为电子级E玻纤。
对照例二
如上表一所示，以该对照例二的所述预浸料为100质量份计，该预浸料具体包括：20质量份的聚苯醚、30质量份的丁苯橡胶及26质量份的纤维布。
具体的，聚苯醚和聚二乙烯基苯共同构成基体树脂，所述聚苯醚为丙烯酸酯封端制成的聚苯醚，分子量优选为2200-2400；所述纤维布作为纤维增强体，其优选为电子级E玻纤。
[根据细则26改正13.11.2019]　
表二、实施例和各对照例的性能对照表

Figure T2
同时参阅上述表一、表二所示，实施例一的预浸料、实施例二的预浸料、实施例三的预浸料、实施例四的预浸料、实施例五的预浸料、实施例六的预浸料、实施例七的预浸料、对照例一的预浸料及对照例二的预浸料制备的复合材料的吸水性、耐热性、铜剥离强度及介电性能基本保持在相近的水平，而填充了有机微球的实施例的预浸料制备的复合材料的阻燃性得到明显改善，其中实施例一的预浸料、实施例二的预浸料、实施例三的预浸料、实施例五的预浸料、实施例六的预浸料、实施例七的预浸料制备的复合材料阻燃性能均能够达到UL94-V0级别，实施例四的预浸料制备的复合材料阻燃性能均能够达到UL94-V1级别，阻燃性能明显优于对照例一、对照例二的预浸料的阻燃性能。因此，综上得出，填充有有机阻燃微球的预浸料在保持较优的材料性能的同时，有效地提高了其自身的阻燃性能。
与相关技术相比，本发明的预浸料为其为纤维增强体、基体树脂与填料的共混物；所述纤维增强体为20-60质量份，所述基体树脂为20-65质量份，所述填料为10-40质量份；其中，所述填料为阻燃有机微球或所述阻燃有机微球与无机填料的共混物，所述填料的粒径为0.1微米至15微米。上述的预浸料中，将所述阻燃有机微球填充在所述基体树脂中，由于所述阻燃有机微球与所述基体树脂的界面性能优，使得所述填料在所述基体树脂中均匀分布，所述阻燃有机微球与所述基体树脂之间不易发生沉降，提高了所述预浸料的材料性能的稳定性，另外，所述阻燃有机微球与所述基体树脂可以直接在溶液中混合，简化了制作工艺，有效提高所述预浸料的生产效率。而本发明的覆铜层压板及印刷电路板中，所述预浸料的应用能够有效地保证所述覆铜层压板及印刷电路板的性能的稳定性，同时，由于所述预浸料的生产效率高，使得所述预浸料、覆铜层压板及印刷电路板的制作成本下降。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (15)

  1. 一种预浸料，其特征在于，所述预浸料为纤维增强体、基体树脂与填料的共混物；
    所述纤维增强体为20-60质量份，所述基体树脂为20-65质量份，所述填料为10-40质量份；
    其中，所述填料为阻燃有机微球或所述阻燃有机微球与无机填料的共混物，所述填料的粒径为0.1微米至15微米。
  2. 根据权利要求1所述的预浸料，其特征在于，所述填料的粒径为0.1微米至5微米。
  3. 根据权利要求1所述的预浸料，其特征在于，所述填料为所述阻燃有机微球与无机填料的共混物；所述阻燃有机微球含量为所述共混物的20%-100%。
  4. 根据权利要求3所述的预浸料，其特征在于，所述阻燃有机微球包括有机阻燃微球；所述有机阻燃微球不溶于甲苯溶剂、丙酮溶剂、丁酮溶剂及乙醇溶剂；所述无机填料为二氧化硅，二氧化钛中的任意一种。
  5. 根据权利要求4所述的预浸料，其特征在于，所述有机阻燃微球为含卤有机微球、含磷有机微球、含磷-氮有机微球和有机硅微球中的至少一种；所述有机阻燃微球的热分解温度350℃以上。
  6. 根据权利要求1所述的预浸料，其特征在于，所述基体树脂包括改性聚苯醚、聚烯烃树脂和引发剂；以所述基体树脂为100质量份，则所述改性聚苯醚20-70质量份，所述聚烯烃树脂30-70质量份，所述引发剂0-5质量份。
  7. 根据权利要求6所述的预浸料，其特征在于，所述改性聚苯醚为由可反应性官能团封端制成的低分子量聚苯醚；所述可反应性官能团包括不饱和酯和不饱和烯烃中的任意一种。
  8. 根据权利要求7所述的预浸料，其特征在于，所述低分子量聚苯醚的分子量为800-6000。
  9. 根据权利要求8所述的预浸料，其特征在于，所述低分子量聚苯醚的分子量为900-4000。
  10. 根据权利要求6所述的预浸料，其特征在于，所述聚烯烃树脂包括聚双环戊二烯、聚二乙烯基苯、聚丁二烯和苯乙烯中的任意一种或多种。
  11. 根据权利要求6所述的预浸料，其特征在于，所述引发剂为自由基引发剂，所述引发剂为过氧化物类引发剂、偶氮类引发剂和联枯中的任意一种。
  12. 根据权利要求1所述的预浸料，其特征在于，所述纤维增强体包括由纤维制成的无纺布、纤维布、纤维毡和单向纤维布中的任意一种。
  13. 根据权利要求12所述的预浸料，其特征在于，所述纤维为玻璃纤维、石英纤维、有机纤维中的至少一种。
  14. 一种覆铜层压板，其特征在于，所述覆铜层压板包括至少一张叠合的如权利要求1-13任意一项所述的预浸料和贴设于叠合后的所述预浸料的一侧或两侧的铜箔。
  15. 一种印刷电路板，其特征在于，所述印刷电路板包括如权利要求14所述的覆铜层压板。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060177666A1 (en) * 2005-02-08 2006-08-10 Masanao Kawabe Curable resin compositions
CN105936745A (zh) * 2015-12-09 2016-09-14 中山台光电子材料有限公司 一种树脂组合物
US20180051170A1 (en) * 2015-03-13 2018-02-22 Kyocera Corporation Resin composition, prepreg, metal-clad laminated plate, and wiring board
CN109852031A (zh) * 2019-02-02 2019-06-07 广东生益科技股份有限公司 热固性树脂组合物、预浸料、层压板和印制电路板
CN110591241A (zh) * 2019-08-21 2019-12-20 瑞声科技（南京）有限公司 预浸料、覆铜层压板及印刷电路板

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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060177666A1 (en) * 2005-02-08 2006-08-10 Masanao Kawabe Curable resin compositions
US20180051170A1 (en) * 2015-03-13 2018-02-22 Kyocera Corporation Resin composition, prepreg, metal-clad laminated plate, and wiring board
CN105936745A (zh) * 2015-12-09 2016-09-14 中山台光电子材料有限公司 一种树脂组合物
CN109852031A (zh) * 2019-02-02 2019-06-07 广东生益科技股份有限公司 热固性树脂组合物、预浸料、层压板和印制电路板
CN110591241A (zh) * 2019-08-21 2019-12-20 瑞声科技（南京）有限公司 预浸料、覆铜层压板及印刷电路板

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