WO2021029105A1 - Metal fixture and electronic component unit - Google Patents

Metal fixture and electronic component unit Download PDF

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Publication number
WO2021029105A1
WO2021029105A1 PCT/JP2020/013328 JP2020013328W WO2021029105A1 WO 2021029105 A1 WO2021029105 A1 WO 2021029105A1 JP 2020013328 W JP2020013328 W JP 2020013328W WO 2021029105 A1 WO2021029105 A1 WO 2021029105A1
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WO
WIPO (PCT)
Prior art keywords
electronic components
fixing bracket
holding portion
heat sink
claws
Prior art date
Application number
PCT/JP2020/013328
Other languages
French (fr)
Japanese (ja)
Inventor
智志 竹内
Original Assignee
Ｋｙｂ株式会社
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Filing date
Publication date
Application filed by Ｋｙｂ株式会社 filed Critical Ｋｙｂ株式会社
Publication of WO2021029105A1 publication Critical patent/WO2021029105A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a fixing bracket and an electronic component unit.
  • a plurality of electronic components may be fixed to one heat sink using a fixing bracket.
  • a fixing bracket for fixing a plurality of electronic components to one heat sink for example, a fixing portion screwed to a columnar post provided on the heat sink and a fixing portion screwed to the fixing portion are routed differently from each other.
  • Fixing brackets having a plurality of pressing portions that extend and press the electronic component toward the heat sink have been developed (see, for example, Patent Document 1).
  • an object of the present invention is to provide a fixing bracket and an electronic component unit that can not only equalize the pressing force for pressing the electronic component against the heat sink but also improve the number of fixable electronic components and the degree of freedom in arrangement.
  • the fixing bracket of the present invention is a fixing bracket for fixing a plurality of electronic components in a row to a heat sink, and is a frame that follows the row of electronic components and has at least both ends fixed to the heat sink.
  • a plurality of claws that are provided with a holding portion that extends from the frame to the electronic component side and presses the electronic component against the heat sink, and the holding portion is separated by a notch formed from the tip toward the frame side and abuts on the corresponding electronic component.
  • the electronic component unit includes a heat sink, a plurality of electronic components in a row, and the above-mentioned fixing metal fittings for fixing the electronic components to the heat sink.
  • the fixing bracket and the electronic component unit configured in this way, since the electronic component is pressed against the heat sink by the holding portion extending from the frame fixed to the heat sink to the electronic component side at both ends, the electronic components in a row Even if there is a change in the number of electronic parts or the distance between these electronic parts, it can be dealt with by a simple design change, and since the holding part is divided by a notch and equipped with a claw that presses each corresponding electronic part one by one, the electronic parts An appropriate pressing force can be applied to each.
  • the width of the notch provided in the holding portion of the fixing bracket may become wider toward both ends in the longitudinal direction of the holding portion.
  • the width of the notch provided in the holding portion becomes wider toward both ends in the longitudinal direction of the holding portion, so that it is possible to suppress a decrease in the pressing force arranged in the center of the holding portion. , More effectively, a uniform pressing force can be applied to the electronic component.
  • the length of the notch provided in the holding portion of the fixing bracket may be longer toward both ends in the longitudinal direction of the holding portion.
  • the fixing bracket configured in this way can suppress a decrease in the pressing force of the claw arranged at the center of the holding portion, and can more effectively exert a uniform pressing force on the electronic component.
  • the length of the notch between the claws abutting on adjacent electronic components having different heights may be longer than the length of the notch between the claws abutting on adjacent electronic components having the same height. According to the fixing bracket configured in this way, the influence of the claws pressing the electronic components having different heights on each other's pressing force can be reduced, so that the fixing metal fittings are effectively uniform even for the electronic components having different heights. Pressing pressure can be applied.
  • the height of the claw in the fixing bracket may be different depending on the height of the corresponding electronic component. According to the fixing bracket configured in this way, a uniform pressing force can be effectively applied to electronic components having different heights.
  • FIG. 1 is a plan view of the fixing bracket unit according to the embodiment.
  • FIG. 2 is an enlarged side view of the fixing bracket according to the embodiment.
  • FIG. 3 is a front view of the fixing bracket according to the embodiment.
  • FIG. 4 is a perspective view of the fixing bracket and the electronic component unit according to the embodiment.
  • FIG. 5 is a plan view of the fixing bracket in the first modification of the embodiment.
  • FIG. 6A is a front view of the fixing bracket in the second modification of the embodiment.
  • FIG. 6B is a plan view of the fixing bracket in the second modification of the embodiment.
  • FIG. 6C is a side view of the fixing bracket in the second modification of the embodiment.
  • FIG. 7 is a plan view of the fixing bracket in the third modification of the embodiment.
  • the fixing bracket B in one embodiment is configured to include a frame 1 and a holding portion 2 extending from the frame 1, and a plurality of fixing brackets B are arranged side by side in a row.
  • the electronic components 11, 12, 13, and 14 of the above are pressed against the heat sink 10 to be fixed.
  • the heat sink 10 is attached to the electronic components 11, 12, 13, 14 in order to absorb the heat generated in the electronic components 11, 12, 13, 14 and dissipate the heat to the atmosphere.
  • the fixing bracket B causes the electronic components 11, 12, 13, 14 to be brought into close contact with the heat sink 10 to increase the contact area between them. As much as possible, the pressing force is applied to the electronic components 11, 12, 13, and 14.
  • the heat sink 10 includes a plate-shaped main body 10a and two cylindrical posts 10b provided at positions sandwiching the electronic components 11, 12, 13, and 14 of the main body 10a.
  • the heat sink 10 may be provided with fins on the back surface of the main body 10a to increase the surface area facing the atmosphere in order to improve the efficiency of heat dissipation.
  • the post 10b may be provided with a screw groove inside and may be inseparably integrated with the main body 10a, or may be screwed to the main body 10a.
  • the electronic components 11, 12, 13, and 14 include a resin portion R containing an element and a terminal T extending from the resin portion R and connected to a printed circuit board (not shown).
  • the electronic components 11, 12, 13, and 14 are other electronic components of semiconductor devices such as power transistors, diodes, and thyristors that require heat dissipation.
  • the heat radiating sheet S having high thermal conductivity and insulating property is interposed between the electronic components 11, 12, 13, 14 and the main body 10a of the heat sink 10. May be abolished and the surface of the resin portion R of the electronic components 11, 12, 13, and 14 on the heat sink 10 side may be coated with a heat conductive grease having high thermal conductivity such as silicon grease and then brought into contact with the heat sink 10. ..
  • the frame 1 has a frame body 1a having an L-shaped cross section along a row of electronic components 11, 12, 13, and 14 in the longitudinal direction, and a fixing piece that horizontally projects from both ends of the frame body 1a to the front side, which is the electronic component side. It is configured to include 1b and 1b and holes 1c provided in the fixing pieces 1b and 1b.
  • the frame body 1a has a plate portion 1d parallel to the heat sink 10 and connected to the holding portion 2, and a reinforcing plate portion hanging from the back side of the plate portion 1d on the anti-electronic component side and perpendicular to the heat sink 10. It has 1e.
  • the frame 1 is screwed into the post 10b via the holes 1c after the holes 1c provided in the fixing pieces 1b and 1b are positioned at positions facing the openings of the post 10b, respectively. It is sandwiched between the screw 15 and the post 10b and fixed to the heat sink 10. In this way, the frame 1 is fixed by screws 15 whose both ends are screwed to the heat sink 10.
  • the holding portion 2 is connected at a position where the base end is on the front side of the plate portion 1d of the frame body 1a of the frame 1 and is separated from the fixing pieces 1b, 1b, and is oblique toward the electronic components 11, 12, 13, and 14 sides. It slopes downward and extends. In this way, the holding portion 2 is oriented obliquely so that the tip of the holding portion 2 approaches the electronic component side from the frame 1 so that the electronic components 11, 12, 13, and 14 can be pressed while the frame 1 is fixed to the heat sink 10. It extends. Then, the holding portion 2 is divided in the direction of forming a row of the electronic components 11, 12, 13, and 14 by the three notches 2a, 2b, and 2c formed from the tip on the electronic component side toward the frame 1. It has four claws 2d, 2e, 2f, and 2g.
  • the notches 2a, 2b, and 2c are provided in the holding portion 2 so as not to reach the frame 1.
  • the ends of the notches 2a, 2b, and 2c are circular, and when the electronic parts 11, 12, 13, and 14 are pressed by the holding portion 2, the roots of the claws 2d, 2e, 2f, and 2g in the holding portion 2 are connected.
  • the claws 2d, 2e, 2f, and 2g are separated by the notches 2a, 2b, and 2c provided in the holding portion 2 in this way, and the tip side is bent in a direction away from the electronic components 11, 12, 13, and 14.
  • the bent portions c1, c2, c3, and c4 come into contact with the resin portions R of the electronic components 11, 12, 13, and 14.
  • the bent portions c1, c2, c3, and c4 with which the electronic components 11, 12, 13, and 14 abut are curved surfaces, and even if the electronic components 11, 12, 13, and 14 are pressed, the resin portion R is damaged. Absent.
  • the claws 2d, 2e, 2f, and 2g come into contact with only the corresponding electronic components 11, 12, 13, and 14, respectively. That is, in FIG. 4, only the first claw 2d from the back of the holding portion 2 comes into contact with the electronic component 11 arranged first from the back, and the electronic component 12 arranged second from the back is in contact with the electronic component 12. Only the second claw 2e from the back of the holding portion 2 comes into contact with the electronic component 13 arranged third from the back, and only the third claw 2f from the back of the holding portion 2 comes into contact with the electronic component 13 arranged third from the back. Only the foremost claw 2g of the holding portion 2 comes into contact with the electronic component 14 arranged in.
  • the no-load distance Z which is the distance between the c2, c3, and c4 and the heat sink 10, is the vertical length of the resin portion R of the electronic components 11, 12, 13, and 14, as shown by the broken line in FIG. It is shorter than the total height of the height H and the thickness of the heat radiating sheet S.
  • each of the claws 2d, 2e, 2f, and 2g of the holding portion 2 comes into contact with the resin portions R of the corresponding electronic components 11, 12, 13, and 14, respectively.
  • the holding portion 2 and the frame 1 bend and exert elastic force to press the resin portions R of the electronic components 11, 12, 13, and 14 toward the main body 10a of the heat sink 10.
  • the difference between the no-load distance Z, the height H of the resin portion R, and the total height of the thickness of the heat radiating sheet S serves as a tightening allowance in the holding portion 2, and the claws 2d, 2e, 2f, 2g and the claws of the holding portion 2 are used.
  • the heat radiating sheet S is sandwiched between the main body 10a of the heat sink 10 and the electronic components 11, 12, 13, 14 and is in close contact with both, and the thermal resistance between the heat sink 10 and the electronic components 11, 12, 13, 14 To reduce.
  • the electronic component unit U is formed by the heat sink 10, a plurality of electronic components 11, 12, 13, 14 forming a row, and the fixing metal fitting B for fixing the electronic components 11, 12, 13, 14 to the heat sink 10.
  • the reaction force received by the fixing bracket B by pressing the electronic components 11, 12, 13, 14 is the claws 2d, 2e, which abut on the electronic components 11, 12, 13, 14. It acts on the virtual line L1 connecting the bent portions c1, c2, c3, and c4 of 2f and 2g, and becomes an upward load that pushes up the holding portion 2 in FIG.
  • the portion of the fixing bracket B that receives the load is the frame 1 attached to the heat sink 10 by the screws 15. It becomes fixed pieces 1b, 1b in. Therefore, as shown in FIG.
  • the distance X can be shortened, so that the moment acting on the fixing bracket B can be reduced, which is advantageous in ensuring the strength of the fixing bracket B, and the weight of the fixing bracket B can be reduced. ..
  • the electronic components 11, 12, 13, 14 are heat-sinked by the holding portion 2 extending from the frame 1 whose both ends are fixed to the heat sink 10 toward the electronic components 11, 12, 13, and 14. Since it is pressed to 10, even if there is a change in the number of electronic components 11, 12, 13, 14 in a row or the distance between these electronic components 11, 12, 13, 14 can be dealt with by a simple design change.
  • the holding portion 2 is divided by the notches 2a, 2b, 2c and provided with claws 2d, 2e, 2f, 2g for pressing the corresponding electronic parts 11, 12, 13, 14 one by one
  • the electronic parts Appropriate pressing force can be applied to each of 11, 12, 13, and 14. That is, since the claws 2d, 2e, 2f, and 2g are separated by the notches 2a, 2b, and 2c, uniform pressing force can be applied to the corresponding electronic components 11, 12, 13, and 14 without being influenced by each other. It is.
  • the pressing force is applied. Although it tends to decrease, since the claws 2d, 2e, 2f, and 2g are separated by the notches 2a, 2b, and 2c, the claws 2e are more than the distance between the bent portions c1, c4 of the claws 2d and 2g and the heat sink 10 when no load is applied.
  • the unloaded distance between the bent portions c2 and c3 of 2f and the heat sink 10 is shortened, it is possible to suppress a decrease in the pressing force with the claws 2e and 2f on the center side pressing the electronic components 12 and 13. Since the notches 2a, 2b, and 2c do not reach the frame 1, the strength of the frame 1 fixed to the heat sink 10 is not lowered, so that the electronic components 11, 12, 13, and 14 are required or sufficient. The electronic components 11, 12, 13, and 14 can be brought into close contact with the heat sink 10.
  • the claws 2d, 2e, 2f, and 2g are separated by the notches 2a, 2b, and 2c, even if the thickness of the resin portion R of the electronic components 11, 12, 13, and 14 is different, the claws 2d, 2e, Since the no-load distance between 2f and 2g and the heat sink 10 can be adjusted to be suitable for the electronic components 11, 12, 13 and 14, the heights of the electronic components 11, 12, 13 and 14 are uniform even if they are different in this way. A strong pressing force can be applied.
  • the fixing bracket B of the present embodiment is the fixing bracket B for fixing a plurality of electronic components 11, 12, 13, 14 forming a row to the heat sink 10, and is a row of the electronic components 11, 12, 13, 14.
  • a frame 1 whose at least both ends are fixed to the heat sink 10 along the same line, and a holding portion 2 that extends from the frame 1 to the electronic components 11, 12, 13, 14 and presses the electronic components 11, 12, 13, 14 against the heat sink 10.
  • a plurality of claws 2d, 2e which are separated by notches 2a, 2b, 2c formed from the tip toward the frame 1 side and abut on the corresponding electronic components 11, 12, 13 and 14, respectively. It has 2f and 2g.
  • the electronic components 11, 12, 13, 14 are held by the holding portions 2 extending from the frame 1 whose both ends are fixed to the heat sink 10 toward the electronic components 11, 12, 13, and 14. Since it is pressed against the heat sink 10, even if the number of electronic components 11, 12, 13, 14 in a row or the distance between these electronic components 11, 12, 13, 14 is changed, it can be dealt with by a simple design change. Since the holding portion 2 is divided by the notches 2a, 2b, 2c and has claws 2d, 2e, 2f, 2g for pressing the corresponding electronic parts 11, 12, 13, 14 one by one, the electronic parts 11, Appropriate pressing force can be applied to each of 12, 13 and 14.
  • the fixing bracket B not only can the pressing force for pressing the electronic components 11, 12, 13 and 14 against the heat sink 10 be made uniform, but also the number and arrangement of the electronic components 11, 12, 13 and 14 that can be fixed can be made uniform. The degree of freedom can be improved.
  • an electronic component unit U including a heat sink 10, a plurality of electronic components 11, 12, 13, 14 in a row, and the above-mentioned fixing bracket B for fixing the electronic components 11, 12, 13, 14 to the heat sink 10.
  • the pressing force for pressing the electronic components 11, 12, 13 and 14 against the heat sink 10 is made uniform, and the number and the degree of freedom of arrangement of the number and arrangement of the electronic components 11, 12, 13 and 14 that can be fixed are also improved.
  • the widths W1, W2, and W3 of the notches 2a, 2b, and 2c provided in the holding portion 2 are in the left-right direction in FIG. 1, which is the longitudinal direction of the holding portion 2. That is, it becomes wider toward both ends in the direction in which the electronic components 11, 12, 13, and 14 in a row are arranged.
  • the holding portion 2 sandwiches the notch 2b rather than the width W2 of the notch 2b provided in the center of the holding portion 2.
  • the widths W1 and W3 of the notches 2a and 2c on both ends of the above are wider.
  • the bending of the holding portion 2 acts to reduce the pressing force on which the claws 2e and 2f on the center side of the holding portion 2 press the electronic parts 12 and 13, but the widths W1 and W3 of the notches 2a and 2c are greatly reduced.
  • the widths W1, W2, and W3 of the notches 2a, 2b, and 2c provided in the holding portion 2 become wider toward both ends in the longitudinal direction of the holding portion 2, and thus the holding portion 2 is held. It is possible to suppress a decrease in the pressing force of the claws 2e and 2f arranged in the center of the portion 2, and it is possible to more effectively exert a uniform pressing force on the electronic components 11, 12, 13 and 14.
  • the holding portion 2 In FIG. 5 the lengths D1, D2, D3 of the notches 2a, 2b, and 2c provided in the above are suppressed, and the electronic parts 11, 12, 13, and 14 in a row are arranged in the left-right direction in FIG. 5, which is the longitudinal direction of the holding portion 2. It may be longer toward both ends in the direction.
  • the holding portion 2 sandwiching the notch 2b rather than the length D2 of the notch 2b provided in the center of the holding portion 2.
  • the lengths D1 and D3 of the notches 2a and 2c on both ends of the above are longer.
  • the longer the lengths of the notches 2a, 2b, 2c provided in the holding portion 2 the more the adjacent claws 2d, 2e, 2f, 2g sandwiching the notches 2a, 2b, 2c exert pressure on each other. The effect is small.
  • the portions of the claws 2d and 2g and the holding portion 2 connected to the roots of the claws 2d and 2g also move away from the electronic components 11 and 14. Bend.
  • the bending of the holding portion 2 acts to reduce the pressing force on which the claws 2e and 2f on the center side of the holding portion 2 press the electronic parts 12 and 13, but increases the lengths D1 and D3 of the notches 2a and 2c.
  • the amount of bending of the claws 2d and 2g increases, the amount of bending of the portion of the holding portion 2 connected to the roots of the claws 2d and 2g can be reduced, so that the pressing force of the claws 2e and 2f due to the bending of the holding portion 2 can be reduced. Can be suppressed.
  • the lengths D1, D2, and D3 of the notches 2a, 2b, and 2c provided in the holding portion 2 become longer toward both ends in the longitudinal direction of the holding portion 2. Therefore, it is possible to suppress a decrease in the pressing force of the claws 2e and 2f arranged at the center of the pressing portion 2, and it is possible to more effectively exert a uniform pressing force on the electronic components 11, 12, 13 and 14.
  • the width of the notches provided on both ends of the holding portion 2 may be wider than the width of the notches on the center side, or both ends of the holding portion 2 may be provided.
  • the length of the notch provided in the center side is made longer than the length of the notch on the central side, or the width and length of the notches provided on both end sides of the holding portion 2 are made longer than the width and length of the notch on the central side. If this is the case, a uniform pressing force can be effectively applied to the electronic component.
  • each claw 2d, 2e, 2f, 2g adjusts the angle of the frame 1 of the holding portion 2 with respect to the frame body 1a, and the portion where the roots of the claws 2d, 2e, 2f, 2g of the holding portion 2 are connected.
  • the size can also be adjusted by adjusting the angle (bending angle) of each of the claws 2d, 2e, 2f, and 2g. Therefore, when the vertical lengths of the resin portions R of the electronic components 11 and 12 and the electronic components 13 and 14 are different, the corresponding electronic components 11 are like the fixing bracket B of the second modified example shown in FIG.
  • the bending angles ⁇ of the claws 2d, 2e, 2f, and 2g are changed according to the heights of the claws 2, 13, and 14, and the heights of the claws 2d, 2e, 2f, and 2g (distance Z at no load) are made different. May be good. In this way, even if the vertical lengths of the resin portions R of the electronic components 11, 12, 13, and 14 are different, the heights of the claws 2d, 2e, 2f, and 2 g (no-load distance Z) and the resin portion R If the tightening allowance, which is the difference between the height H of the above and the total height of the thickness of the heat radiating sheet S, is made equal, a uniform pressing force is applied to the electronic components 11, 12, 13, and 14.
  • the length of the notch 2b between the 2e and 2f is the notch between the claws 2d and 2e and the claws 2f and 2g that abut the adjacent electronic components 11 and 12 and the electronic components 13 and 14 having the same height H. It may be longer than the lengths of 2a and 2b. As the length of the notch 2b is increased, the influence of the claws 2e and 2f pressing the electronic components 12 and 13 having different heights H on each other's pressing force can be reduced. Therefore, the fixing configured in this manner. In the metal fitting B, a uniform pressing force can be effectively applied to electronic components 11, 12, 13, and 14 having different heights H.
  • a plurality of holding portions 2 are provided on the frame main body 1a in the frame 1 as in the fixing bracket B of the third modification shown in FIG.
  • a fixing piece 1b having a hole 1c is provided between the holding portions 2 and 2, so that the fixing piece 1b is fixed to the post 10b of the heat sink 10 even in the intermediate portion in the longitudinal direction of the frame 1, and the pressing force of the holding portions 2 and 2 It is sufficient to suppress the decrease in the pressure and apply a uniform pressing force to the electronic component even in the middle portion of the frame 1.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A metal fixture (B) fixes a row of a plurality of electronic components (11, 12, 13, 14) onto a heatsink (10), the metal fixture (B) comprising: a frame (1) extending along the row of the electronic component (11, 12, 13, 14) and having at least both ends thereof fixed to the heatsink (10); and a holding portion (2) extending from the frame (1) toward the electronic components (11, 12, 13, 14) and pressing the electronic components (11, 12, 13, 14). The holding portion (2) includes a plurality of prongs (2d, 2e, 2f, 2g) which are separated by cutouts (2a, 2b, 2c) formed from the tip of the holding portion (2) toward the frame (1), and which respectively abut the corresponding electronic components (11, 12, 13, 14).

Description

固定金具および電子部品ユニットFixing bracket and electronic component unit
　本発明は、固定金具および電子部品ユニットに関する。 The present invention relates to a fixing bracket and an electronic component unit.
　半導体デバイス等の電子部品は、使用中に発熱して高温となり焼損する恐れがある。そのため、電子部品にヒートシンクを固定して電子部品で生じた熱を放熱して電子部品を冷却する必要がある。 Electronic components such as semiconductor devices generate heat during use and become hot, which may cause burning. Therefore, it is necessary to fix the heat sink to the electronic component and dissipate the heat generated in the electronic component to cool the electronic component.
　電子部品が列を成して基板上に配置される場合、固定金具を利用して複数の電子部品を一つのヒートシンクに固定する場合がある。このように複数の電子部品を一つのヒートシンクに固定する固定金具としては、たとえば、ヒートシンクに設けた柱状のポストに螺子止めされる固定部と、固定部の螺子止めされる部位から互いに異なる経路で伸びて電子部品をヒートシンクへ向けて押圧する複数の押圧部とを備えた固定金具が開発されている（たとえば、特許文献１参照）。 When electronic components are arranged in a row on a board, a plurality of electronic components may be fixed to one heat sink using a fixing bracket. As the fixing bracket for fixing a plurality of electronic components to one heat sink in this way, for example, a fixing portion screwed to a columnar post provided on the heat sink and a fixing portion screwed to the fixing portion are routed differently from each other. Fixing brackets having a plurality of pressing portions that extend and press the electronic component toward the heat sink have been developed (see, for example, Patent Document 1).
ＪＰ２０１５－１１８９８５ＡJP2015-118985A
　このような固定金具では、固定部の螺子止めされる部位から各押圧部まで力の導線が異なっているので、各押圧部が電子部品をヒートシンクへ押圧する押圧力を均一にすることができるというメリットがある。しかしながら、従来の固定金具は、固定部の螺子止めされる部位から各押圧部まで力の導線を異なる経路に設定しなければならないため、構造が複雑となるだけでなく、固定可能な電子部品の個数や配置に制限ができてしまうという問題がある。 In such a fixing bracket, since the force conducting wire is different from the screwed portion of the fixing portion to each pressing portion, the pressing force that each pressing portion presses the electronic component against the heat sink can be made uniform. There are merits. However, in the conventional fixing bracket, the force conducting wire must be set in a different path from the screwed portion of the fixing portion to each pressing portion, which not only complicates the structure but also fixes the electronic component. There is a problem that the number and arrangement can be limited.
　そこで、本発明は、電子部品をヒートシンクへ押圧する押圧力を均一化できるだけでなく、固定可能な電子部品の個数や配置の自由度を向上できる固定金具および電子部品ユニットの提供を目的とする。 Therefore, an object of the present invention is to provide a fixing bracket and an electronic component unit that can not only equalize the pressing force for pressing the electronic component against the heat sink but also improve the number of fixable electronic components and the degree of freedom in arrangement.
　上記の目的を達成するため、本発明の固定金具は、列をなす複数の電子部品をヒートシンクに固定する固定金具であって、電子部品の列に沿うとともに少なくとも両端がヒートシンクに固定されるフレームと、フレームから電子部品側へ延びて電子部品をヒートシンクに押圧する抑え部とを備え、抑え部が先端からフレーム側へ向けて形成した切欠によって分離されて対応する電子部品にそれぞれ当接する複数の爪を有している。また、電子部品ユニットは、ヒートシンクと、列をなす複数の電子部品と、ヒートシンクに電子部品を固定する前述の固定金具とを備えている。 In order to achieve the above object, the fixing bracket of the present invention is a fixing bracket for fixing a plurality of electronic components in a row to a heat sink, and is a frame that follows the row of electronic components and has at least both ends fixed to the heat sink. , A plurality of claws that are provided with a holding portion that extends from the frame to the electronic component side and presses the electronic component against the heat sink, and the holding portion is separated by a notch formed from the tip toward the frame side and abuts on the corresponding electronic component. have. Further, the electronic component unit includes a heat sink, a plurality of electronic components in a row, and the above-mentioned fixing metal fittings for fixing the electronic components to the heat sink.
　このように構成された固定金具および電子部品ユニットによれば、両端がヒートシンクに固定されるフレームから電子部品側へ延びる抑え部によって電子部品をヒートシンクへ押圧しているので、列を成す電子部品の個数やこれら電子部品の距離に変更があっても簡単な設計変更で対応でき、抑え部が切欠によって分割されてそれぞれ対応する電子部品を一つずつ押圧する爪を備えているので、電子部品のそれぞれに適切な押圧力を付加できる。 According to the fixing bracket and the electronic component unit configured in this way, since the electronic component is pressed against the heat sink by the holding portion extending from the frame fixed to the heat sink to the electronic component side at both ends, the electronic components in a row Even if there is a change in the number of electronic parts or the distance between these electronic parts, it can be dealt with by a simple design change, and since the holding part is divided by a notch and equipped with a claw that presses each corresponding electronic part one by one, the electronic parts An appropriate pressing force can be applied to each.
　また、固定金具における抑え部に設けた切欠の幅は、抑え部の長手方向の両端に向かうほど広くなっていてもよい。このように構成された固定金具は、抑え部に設けた切欠の幅が抑え部の長手方向の両端に向かうほど広くなっているので抑え部の中央に配置されるの押圧力の低下を抑制でき、より効果的に電子部品へ均一な押圧力作用させ得る。 Further, the width of the notch provided in the holding portion of the fixing bracket may become wider toward both ends in the longitudinal direction of the holding portion. In the fixing bracket configured in this way, the width of the notch provided in the holding portion becomes wider toward both ends in the longitudinal direction of the holding portion, so that it is possible to suppress a decrease in the pressing force arranged in the center of the holding portion. , More effectively, a uniform pressing force can be applied to the electronic component.
　さらに、固定金具における抑え部に設けた切欠の長さは、抑え部の長手方向の両端に向かうほど長くてもよい。このように構成された固定金具は、抑え部の中央に配置される爪の押圧力の低下を抑制でき、より効果的に電子部品へ均一な押圧力作用させ得る。 Further, the length of the notch provided in the holding portion of the fixing bracket may be longer toward both ends in the longitudinal direction of the holding portion. The fixing bracket configured in this way can suppress a decrease in the pressing force of the claw arranged at the center of the holding portion, and can more effectively exert a uniform pressing force on the electronic component.
　また、高さが異なる隣り合う電子部品に当接する爪同士の間の切欠の長さは、高さが等しい隣り合う電子部品に当接する爪同士の間の切欠の長さよりも長くてもよい。このように構成された固定金具によれば、高さが異なる電子部品を押圧する爪同士が互いの押圧力に与える影響を低減できるので、高さが異なる電子部品に対しても効果的に均一な押圧力を作用させ得る。 Further, the length of the notch between the claws abutting on adjacent electronic components having different heights may be longer than the length of the notch between the claws abutting on adjacent electronic components having the same height. According to the fixing bracket configured in this way, the influence of the claws pressing the electronic components having different heights on each other's pressing force can be reduced, so that the fixing metal fittings are effectively uniform even for the electronic components having different heights. Pressing pressure can be applied.
　そして、さらに、固定金具における爪の高さが対応する電子部品の高さに応じて異なっていてもよい。このように構成された固定金具によれば、高さが異なる電子部品に対しても効果的に均一な押圧力を与えられる。 Further, the height of the claw in the fixing bracket may be different depending on the height of the corresponding electronic component. According to the fixing bracket configured in this way, a uniform pressing force can be effectively applied to electronic components having different heights.
図１は、一実施の形態における固定金具ユニットの平面図である。FIG. 1 is a plan view of the fixing bracket unit according to the embodiment. 図２は、一実施の形態における固定金具の拡大側面図である。FIG. 2 is an enlarged side view of the fixing bracket according to the embodiment. 図３は、一実施の形態における固定金具の正面図である。FIG. 3 is a front view of the fixing bracket according to the embodiment. 図４は、一実施の形態における固定金具および電子部品ユニットの斜視図である。FIG. 4 is a perspective view of the fixing bracket and the electronic component unit according to the embodiment. 図５は、一実施の形態の第一変形例における固定金具の平面図である。FIG. 5 is a plan view of the fixing bracket in the first modification of the embodiment. 図６（Ａ）は、一実施の形態の第二変形例における固定金具の正面図である。図６（Ｂ）は、一実施の形態の第二変形例における固定金具の平面図である。図６（Ｃ）は、一実施の形態の第二変形例における固定金具の側面図である。FIG. 6A is a front view of the fixing bracket in the second modification of the embodiment. FIG. 6B is a plan view of the fixing bracket in the second modification of the embodiment. FIG. 6C is a side view of the fixing bracket in the second modification of the embodiment. 図７は、一実施の形態の第三変形例における固定金具の平面図である。FIG. 7 is a plan view of the fixing bracket in the third modification of the embodiment.
　以下、図に示した実施の形態に基づき、本発明を説明する。一実施の形態における固定金具Ｂは、図１から図４に示すように、フレーム１と、フレーム１から延びる抑え部２とを備えて構成されており、列を成して並べて配置される複数の電子部品１１，１２，１３，１４をヒートシンク１０に押し当てて固定するものである。 Hereinafter, the present invention will be described based on the embodiments shown in the figure. As shown in FIGS. 1 to 4, the fixing bracket B in one embodiment is configured to include a frame 1 and a holding portion 2 extending from the frame 1, and a plurality of fixing brackets B are arranged side by side in a row. The electronic components 11, 12, 13, and 14 of the above are pressed against the heat sink 10 to be fixed.
　ヒートシンク１０は、電子部品１１，１２，１３，１４で発生した熱を吸収して大気へ放熱するために電子部品１１，１２，１３，１４に取り付けられる。電子部品１１，１２，１３，１４とヒートシンク１０との間の熱抵抗を低減するため、固定金具Ｂは、電子部品１１，１２，１３，１４をヒートシンク１０へ密着させて両者の接触面積を大きくするべく押圧力を電子部品１１，１２，１３，１４へ作用させる。 The heat sink 10 is attached to the electronic components 11, 12, 13, 14 in order to absorb the heat generated in the electronic components 11, 12, 13, 14 and dissipate the heat to the atmosphere. In order to reduce the thermal resistance between the electronic components 11, 12, 13, 14 and the heat sink 10, the fixing bracket B causes the electronic components 11, 12, 13, 14 to be brought into close contact with the heat sink 10 to increase the contact area between them. As much as possible, the pressing force is applied to the electronic components 11, 12, 13, and 14.
　ヒートシンク１０は、板状の本体１０ａと、本体１０ａの電子部品１１，１２，１３，１４を挟む位置に設けられる二つの円筒状のポスト１０ｂとを備えている。なお、図示はしないが、ヒートシンク１０は、本体１０ａの背面に放熱の効率の向上のために大気に面する表面積を大きくするフィンを備えていてもよい。なお、ポスト１０ｂは、内部に螺子溝を備えており、本体１０ａに分離不能に一体とされてもよいし、本体１０ａにねじ締結されるものであってもよい。 The heat sink 10 includes a plate-shaped main body 10a and two cylindrical posts 10b provided at positions sandwiching the electronic components 11, 12, 13, and 14 of the main body 10a. Although not shown, the heat sink 10 may be provided with fins on the back surface of the main body 10a to increase the surface area facing the atmosphere in order to improve the efficiency of heat dissipation. The post 10b may be provided with a screw groove inside and may be inseparably integrated with the main body 10a, or may be screwed to the main body 10a.
　また、電子部品１１，１２，１３，１４は、素子を内包する樹脂部Ｒと、樹脂部Ｒから延びて図示しないプリント基板に接続される端子Ｔとを備えている。なお、電子部品１１，１２，１３，１４は、パワートランジスタ、ダイオード、サイリスタ等といった半導体デバイスの他の放熱が必要な電子部品である。本実施の形態では、電子部品１１，１２，１３，１４とヒートシンク１０における本体１０ａとの間には、熱伝導率が高く絶縁性を備えた放熱シートＳを介在させているが、放熱シートＳを廃止して電子部品１１，１２，１３，１４の樹脂部Ｒのヒートシンク１０側の面にシリコングリスなどの熱伝導性が高い熱伝導グリスを塗布してからヒートシンク１０に当接させてもよい。 Further, the electronic components 11, 12, 13, and 14 include a resin portion R containing an element and a terminal T extending from the resin portion R and connected to a printed circuit board (not shown). The electronic components 11, 12, 13, and 14 are other electronic components of semiconductor devices such as power transistors, diodes, and thyristors that require heat dissipation. In the present embodiment, the heat radiating sheet S having high thermal conductivity and insulating property is interposed between the electronic components 11, 12, 13, 14 and the main body 10a of the heat sink 10. May be abolished and the surface of the resin portion R of the electronic components 11, 12, 13, and 14 on the heat sink 10 side may be coated with a heat conductive grease having high thermal conductivity such as silicon grease and then brought into contact with the heat sink 10. ..
　以下、固定金具Ｂの各部について詳細に説明する。フレーム１は、長手方向が電子部品１１，１２，１３，１４の列に沿う断面Ｌ字状のフレーム本体１ａと、フレーム本体１ａから両端から電子部品側である正面側へ水平に突出する固定片１ｂ，１ｂと、固定片１ｂ，１ｂに設けた孔１ｃとを備えて構成されている。 Hereinafter, each part of the fixing bracket B will be described in detail. The frame 1 has a frame body 1a having an L-shaped cross section along a row of electronic components 11, 12, 13, and 14 in the longitudinal direction, and a fixing piece that horizontally projects from both ends of the frame body 1a to the front side, which is the electronic component side. It is configured to include 1b and 1b and holes 1c provided in the fixing pieces 1b and 1b.
　フレーム本体１ａは、ヒートシンク１０に対して平行であって抑え部２に連なるプレート部１ｄと、プレート部１ｄの反電子部品側である背面側から垂下されてヒートシンク１０に対して垂直な補強板部１ｅとを備えている。 The frame body 1a has a plate portion 1d parallel to the heat sink 10 and connected to the holding portion 2, and a reinforcing plate portion hanging from the back side of the plate portion 1d on the anti-electronic component side and perpendicular to the heat sink 10. It has 1e.
　フレーム１は、図４に示すように、固定片１ｂ，１ｂにそれぞれ設けられた孔１ｃをそれぞれポスト１０ｂの開口に対向する位置に位置決めされた後、孔１ｃを介いてポスト１０ｂに螺着される螺子１５とポスト１０ｂとで挟持されてヒートシンク１０に固定される。このように、フレーム１は、両端がヒートシンク１０に螺着される螺子１５によって固定される。 As shown in FIG. 4, the frame 1 is screwed into the post 10b via the holes 1c after the holes 1c provided in the fixing pieces 1b and 1b are positioned at positions facing the openings of the post 10b, respectively. It is sandwiched between the screw 15 and the post 10b and fixed to the heat sink 10. In this way, the frame 1 is fixed by screws 15 whose both ends are screwed to the heat sink 10.
　抑え部２は、基端がフレーム１のフレーム本体１ａのプレート部１ｄの正面側であって固定片１ｂ，１ｂから離間した位置に連なって電子部品１１，１２，１３，１４側へ向けて斜め下方へ傾斜して延びている。このように、抑え部２は、フレーム１をヒートシンク１０に固定した状態で、各電子部品１１，１２，１３，１４を押圧できるようフレーム１から先端が電子部品側へ接近するように斜めに向けて延びている。そして、抑え部２は、電子部品側となる先端からフレーム１側へ向けて形成される３つの切欠２ａ，２ｂ，２ｃによって電子部品１１，１２，１３，１４の列を成す方向に分割された４つの爪２ｄ，２ｅ，２ｆ，２ｇを備えている。 The holding portion 2 is connected at a position where the base end is on the front side of the plate portion 1d of the frame body 1a of the frame 1 and is separated from the fixing pieces 1b, 1b, and is oblique toward the electronic components 11, 12, 13, and 14 sides. It slopes downward and extends. In this way, the holding portion 2 is oriented obliquely so that the tip of the holding portion 2 approaches the electronic component side from the frame 1 so that the electronic components 11, 12, 13, and 14 can be pressed while the frame 1 is fixed to the heat sink 10. It extends. Then, the holding portion 2 is divided in the direction of forming a row of the electronic components 11, 12, 13, and 14 by the three notches 2a, 2b, and 2c formed from the tip on the electronic component side toward the frame 1. It has four claws 2d, 2e, 2f, and 2g.
　切欠２ａ，２ｂ，２ｃは、抑え部２に設けられていて、フレーム１まで到達しない範囲で設けられている。３つの切欠２ａ，２ｂ，２ｃのうち、抑え部２の中央に設けられた切欠２ｂの幅Ｗ２よりも切欠２ｂを挟んで抑え部２の両端側の切欠２ａ，２ｃの幅Ｗ１，Ｗ３の方が広くなっている。また、切欠２ａ，２ｂ，２ｃの終端を円形としており、抑え部２で電子部品１１，１２，１３，１４を押圧した際に、抑え部２における爪２ｄ，２ｅ，２ｆ，２ｇの根元が連なる部分、つまり、爪２ｄ，２ｅ，２ｆ，２ｇとフレーム１とを接続する部分に対して爪２ｄ，２ｅ，２ｆ，２ｇが撓んでも抑え部２に応力集中が生じるのを回避している。応力集中による抑え部２の疲労が問題とならない場合には、切欠２ａ，２ｂ，２ｃの終端形状は任意に変更できる。 The notches 2a, 2b, and 2c are provided in the holding portion 2 so as not to reach the frame 1. Of the three notches 2a, 2b, 2c, the widths W1 and W3 of the notches 2a, 2c on both ends of the holding portion 2 with the notch 2b sandwiched from the width W2 of the notch 2b provided in the center of the holding portion 2. Is getting wider. Further, the ends of the notches 2a, 2b, and 2c are circular, and when the electronic parts 11, 12, 13, and 14 are pressed by the holding portion 2, the roots of the claws 2d, 2e, 2f, and 2g in the holding portion 2 are connected. Even if the claws 2d, 2e, 2f, 2g are bent with respect to the portion, that is, the portion connecting the claws 2d, 2e, 2f, 2g and the frame 1, stress concentration is avoided in the holding portion 2. When the fatigue of the holding portion 2 due to stress concentration does not matter, the terminal shapes of the notches 2a, 2b, and 2c can be arbitrarily changed.
　爪２ｄ，２ｅ，２ｆ，２ｇは、このように抑え部２に設けた切欠２ａ，２ｂ，２ｃによってセパレートされており、先端側が電子部品１１，１２，１３，１４から離間する方向へ向けて屈曲して曲がっており、屈曲部ｃ１，ｃ２，ｃ３，ｃ４が電子部品１１，１２，１３，１４の樹脂部Ｒに当接するようになっている。電子部品１１，１２，１３，１４が当接する屈曲部ｃ１，ｃ２，ｃ３，ｃ４は、湾曲した面となっており、電子部品１１，１２，１３，１４を押圧しても樹脂部Ｒを傷めない。 The claws 2d, 2e, 2f, and 2g are separated by the notches 2a, 2b, and 2c provided in the holding portion 2 in this way, and the tip side is bent in a direction away from the electronic components 11, 12, 13, and 14. The bent portions c1, c2, c3, and c4 come into contact with the resin portions R of the electronic components 11, 12, 13, and 14. The bent portions c1, c2, c3, and c4 with which the electronic components 11, 12, 13, and 14 abut are curved surfaces, and even if the electronic components 11, 12, 13, and 14 are pressed, the resin portion R is damaged. Absent.
　そして、爪２ｄ，２ｅ，２ｆ，２ｇは、それぞれ対応する電子部品１１，１２，１３，１４のみに当接する。つまり、図４中で、奥から一番目に配置された電子部品１１に対して抑え部２の奥から一番目の爪２ｄのみが当接し、奥から二番目に配置された電子部品１２に対して抑え部２の奥から二番目の爪２ｅのみが当接し、奥から三番目に配置された電子部品１３に対して抑え部２の奥から三番目の爪２ｆのみが当接し、一番手前に配置された電子部品１４に対して抑え部２の一番手前の爪２ｇのみが当接する。 Then, the claws 2d, 2e, 2f, and 2g come into contact with only the corresponding electronic components 11, 12, 13, and 14, respectively. That is, in FIG. 4, only the first claw 2d from the back of the holding portion 2 comes into contact with the electronic component 11 arranged first from the back, and the electronic component 12 arranged second from the back is in contact with the electronic component 12. Only the second claw 2e from the back of the holding portion 2 comes into contact with the electronic component 13 arranged third from the back, and only the third claw 2f from the back of the holding portion 2 comes into contact with the electronic component 13 arranged third from the back. Only the foremost claw 2g of the holding portion 2 comes into contact with the electronic component 14 arranged in.
　このように構成された固定金具Ｂをヒートシンク１０に螺子１５で取り付けると、電子部品１１，１２，１３，１４が存在しない状態における抑え部２の各爪２ｄ，２ｅ，２ｆ，２ｇにおける屈曲部ｃ１，ｃ２，ｃ３，ｃ４とヒートシンク１０との間の距離である無負荷時距離Ｚは、図２中破線で示すように、電子部品１１，１２，１３，１４の樹脂部Ｒの上下方向長さである高さＨと放熱シートＳの厚みの合計高さより短い。そのため、固定金具Ｂをヒートシンク１０に螺子１５で取り付けると、抑え部２の各爪２ｄ，２ｅ，２ｆ，２ｇがそれぞれ対応する電子部品１１，１２，１３，１４の樹脂部Ｒに当接するとともに、抑え部２およびフレーム１が撓んで弾発力を発揮して各電子部品１１，１２，１３，１４の樹脂部Ｒをヒートシンク１０の本体１０ａへ向けて押し付ける。無負荷時距離Ｚと樹脂部Ｒの高さＨと放熱シートＳの厚みの合計高さとの差分が抑え部２における締代となって、爪２ｄ，２ｅ，２ｆ，２ｇおよび抑え部２の爪２ｄ，２ｅ，２ｆ，２ｇの根元が連なる部分が撓んで電子部品１１，１２，１３，１４を押圧する。そして、固定金具Ｂによって押圧された各電子部品１１，１２，１３，１４は、放熱シートＳに密着してヒートシンク１０に固定される。放熱シートＳは、ヒートシンク１０の本体１０ａと電子部品１１，１２，１３，１４との間で挟み込まれて両者に密着してヒートシンク１０と電子部品１１，１２，１３，１４との間の熱抵抗を低減する。そして、ヒートシンク１０、列を成す複数の電子部品１１，１２，１３，１４と、ヒートシンク１０に電子部品１１，１２，１３，１４を固定する固定金具Ｂとで電子部品ユニットＵが形成される。 When the fixing bracket B configured in this way is attached to the heat sink 10 with the screw 15, the bent portions c1 in the claws 2d, 2e, 2f, and 2g of the holding portion 2 in the state where the electronic components 11, 12, 13, and 14 are not present. The no-load distance Z, which is the distance between the c2, c3, and c4 and the heat sink 10, is the vertical length of the resin portion R of the electronic components 11, 12, 13, and 14, as shown by the broken line in FIG. It is shorter than the total height of the height H and the thickness of the heat radiating sheet S. Therefore, when the fixing bracket B is attached to the heat sink 10 with a screw 15, each of the claws 2d, 2e, 2f, and 2g of the holding portion 2 comes into contact with the resin portions R of the corresponding electronic components 11, 12, 13, and 14, respectively. The holding portion 2 and the frame 1 bend and exert elastic force to press the resin portions R of the electronic components 11, 12, 13, and 14 toward the main body 10a of the heat sink 10. The difference between the no-load distance Z, the height H of the resin portion R, and the total height of the thickness of the heat radiating sheet S serves as a tightening allowance in the holding portion 2, and the claws 2d, 2e, 2f, 2g and the claws of the holding portion 2 are used. The portion where the roots of 2d, 2e, 2f, and 2g are connected bends and presses the electronic components 11, 12, 13, and 14. Then, the electronic components 11, 12, 13, and 14 pressed by the fixing bracket B are in close contact with the heat radiating sheet S and fixed to the heat sink 10. The heat radiating sheet S is sandwiched between the main body 10a of the heat sink 10 and the electronic components 11, 12, 13, 14 and is in close contact with both, and the thermal resistance between the heat sink 10 and the electronic components 11, 12, 13, 14 To reduce. Then, the electronic component unit U is formed by the heat sink 10, a plurality of electronic components 11, 12, 13, 14 forming a row, and the fixing metal fitting B for fixing the electronic components 11, 12, 13, 14 to the heat sink 10.
　また、図１に示すように、固定金具Ｂが電子部品１１，１２，１３，１４を押圧することによって受ける反力は、電子部品１１，１２，１３，１４に当接する各爪２ｄ，２ｅ，２ｆ，２ｇの屈曲部ｃ１，ｃ２，ｃ３，ｃ４を結ぶ仮想線Ｌ１上で作用し、図２中で抑え部２を押し上げる上向きの荷重となる。これに対して、図４に示すように、固定金具Ｂがフレーム１の両端が螺子１５によって固定されるので、固定金具Ｂの前記荷重を受ける部位は、螺子１５によってヒートシンク１０に取り付けられるフレーム１における固定片１ｂ，１ｂとなる。よって、図１に示すように、螺子１５が挿通される各固定片１ｂ，１ｂにおける孔１ｃ，１ｃの中心を結ぶ仮想線Ｌ２と仮想線Ｌ１との距離Ｘが短くなればなるほど、固定金具Ｂの全体を回転させようとするモーメントを低減できる。螺子１５が挿通される孔１ｃがフレーム１のプレート部１ｄの両端に設けられても、フレーム１の背面側の補強板部１ｅにフランジを設けてフランジをヒートシンク１０に螺子止めする構造に比較して固定金具Ｂの全体を回転させるモーメントを低減できるが、本実施の形態のようにフレーム１の両端に電子部品１１，１２，１３，１４側へ突出する固定片１ｂ，１ｂを設けて固定片１ｂ，１ｂをヒートシンク１０に固定する部位とすると、距離Ｘをより短くできるので固定金具Ｂに作用するモーメントを低減でき、固定金具Ｂの強度確保の上で有利となり固定金具Ｂの軽量化を図れる。 Further, as shown in FIG. 1, the reaction force received by the fixing bracket B by pressing the electronic components 11, 12, 13, 14 is the claws 2d, 2e, which abut on the electronic components 11, 12, 13, 14. It acts on the virtual line L1 connecting the bent portions c1, c2, c3, and c4 of 2f and 2g, and becomes an upward load that pushes up the holding portion 2 in FIG. On the other hand, as shown in FIG. 4, since both ends of the frame 1 of the fixing bracket B are fixed by the screws 15, the portion of the fixing bracket B that receives the load is the frame 1 attached to the heat sink 10 by the screws 15. It becomes fixed pieces 1b, 1b in. Therefore, as shown in FIG. 1, the shorter the distance X between the virtual line L2 and the virtual line L1 connecting the centers of the holes 1c and 1c in the fixed pieces 1b and 1b through which the screw 15 is inserted, the more the fixing bracket B It is possible to reduce the moment that tries to rotate the whole of. Even if holes 1c through which the screw 15 is inserted are provided at both ends of the plate portion 1d of the frame 1, a flange is provided on the reinforcing plate portion 1e on the back side of the frame 1 and the flange is screwed to the heat sink 10. Although the moment for rotating the entire fixing bracket B can be reduced, fixing pieces 1b and 1b protruding toward the electronic components 11, 12, 13 and 14 are provided at both ends of the frame 1 as in the present embodiment. When 1b and 1b are fixed to the heat sink 10, the distance X can be shortened, so that the moment acting on the fixing bracket B can be reduced, which is advantageous in ensuring the strength of the fixing bracket B, and the weight of the fixing bracket B can be reduced. ..
　そして、本実施の形態の固定金具Ｂは、両端がヒートシンク１０に固定されるフレーム１から電子部品１１，１２，１３，１４側へ延びる抑え部２によって電子部品１１，１２，１３，１４をヒートシンク１０へ押圧しているので、列を成す電子部品１１，１２，１３，１４の個数やこれら電子部品１１，１２，１３，１４の距離に変更があっても簡単な設計変更で対応できる。 Then, in the fixing bracket B of the present embodiment, the electronic components 11, 12, 13, 14 are heat-sinked by the holding portion 2 extending from the frame 1 whose both ends are fixed to the heat sink 10 toward the electronic components 11, 12, 13, and 14. Since it is pressed to 10, even if there is a change in the number of electronic components 11, 12, 13, 14 in a row or the distance between these electronic components 11, 12, 13, 14 can be dealt with by a simple design change.
　また、抑え部２が切欠２ａ，２ｂ，２ｃによって分割されてそれぞれ対応する電子部品１１，１２，１３，１４を一つずつ押圧する爪２ｄ，２ｅ，２ｆ，２ｇを備えているので、電子部品１１，１２，１３，１４のそれぞれに適切な押圧力を付加できる。つまり、爪２ｄ，２ｅ，２ｆ，２ｇは、切欠２ａ，２ｂ，２ｃによってセパレートされているので、互いに影響されずに対応する電子部品１１，１２，１３，１４に均一な押圧力を作用させ得るのである。フレーム１の中央側の爪２ｅ，２ｆは、フレーム１の両端のヒートシンク１０への固定部位である固定片１ｂ，１ｂに近い爪２ｄ，２ｇよりも固定片１ｂ，１ｂから遠いために押圧力が低下しやすいが、爪２ｄ，２ｅ，２ｆ，２ｇが切欠２ａ，２ｂ，２ｃによってセパレートされているので、爪２ｄ，２ｇの屈曲部ｃ１，ｃ４とヒートシンク１０との無負荷時距離よりも爪２ｅ，２ｆの屈曲部ｃ２，ｃ３とヒートシンク１０との無負荷時距離を短くしておけば、中央側の爪２ｅ，２ｆが電子部品１２，１３を押圧する押圧力の低下を抑制できる。そして、切欠２ａ，２ｂ，２ｃは、フレーム１に至らないので、ヒートシンク１０に固定されるフレーム１の強度を低下させることがないので、電子部品１１，１２，１３，１４に必要十分か押圧力を作用させて電子部品１１，１２，１３，１４をヒートシンク１０へ密着させ得る。 Further, since the holding portion 2 is divided by the notches 2a, 2b, 2c and provided with claws 2d, 2e, 2f, 2g for pressing the corresponding electronic parts 11, 12, 13, 14 one by one, the electronic parts Appropriate pressing force can be applied to each of 11, 12, 13, and 14. That is, since the claws 2d, 2e, 2f, and 2g are separated by the notches 2a, 2b, and 2c, uniform pressing force can be applied to the corresponding electronic components 11, 12, 13, and 14 without being influenced by each other. It is. Since the claws 2e and 2f on the center side of the frame 1 are farther from the fixing pieces 1b and 1b than the claws 2d and 2g closer to the fixing pieces 1b and 1b, which are the fixing parts to the heat sinks 10 at both ends of the frame 1, the pressing force is applied. Although it tends to decrease, since the claws 2d, 2e, 2f, and 2g are separated by the notches 2a, 2b, and 2c, the claws 2e are more than the distance between the bent portions c1, c4 of the claws 2d and 2g and the heat sink 10 when no load is applied. If the unloaded distance between the bent portions c2 and c3 of 2f and the heat sink 10 is shortened, it is possible to suppress a decrease in the pressing force with the claws 2e and 2f on the center side pressing the electronic components 12 and 13. Since the notches 2a, 2b, and 2c do not reach the frame 1, the strength of the frame 1 fixed to the heat sink 10 is not lowered, so that the electronic components 11, 12, 13, and 14 are required or sufficient. The electronic components 11, 12, 13, and 14 can be brought into close contact with the heat sink 10.
　また、爪２ｄ，２ｅ，２ｆ，２ｇが切欠２ａ，２ｂ，２ｃによってセパレートされているので、電子部品１１，１２，１３，１４の樹脂部Ｒの厚みが異なっていても、爪２ｄ，２ｅ，２ｆ，２ｇとヒートシンク１０との無負荷時距離を電子部品１１，１２，１３，１４に適するように調整できるので、このように電子部品１１，１２，１３，１４の高さが異なっても均一な押圧力を作用させ得る。 Further, since the claws 2d, 2e, 2f, and 2g are separated by the notches 2a, 2b, and 2c, even if the thickness of the resin portion R of the electronic components 11, 12, 13, and 14 is different, the claws 2d, 2e, Since the no-load distance between 2f and 2g and the heat sink 10 can be adjusted to be suitable for the electronic components 11, 12, 13 and 14, the heights of the electronic components 11, 12, 13 and 14 are uniform even if they are different in this way. A strong pressing force can be applied.
　以上、本実施の形態の固定金具Ｂは、列をなす複数の電子部品１１，１２，１３，１４をヒートシンク１０に固定する固定金具Ｂであって、電子部品１１，１２，１３，１４の列に沿うとともに少なくとも両端がヒートシンク１０に固定されるフレーム１と、フレーム１から電子部品１１，１２，１３，１４側へ延びて電子部品１１，１２，１３，１４をヒートシンク１０に押圧する抑え部２とを備え、抑え部２が先端からフレーム１側へ向けて形成した切欠２ａ，２ｂ，２ｃによって分離されて対応する電子部品１１，１２，１３，１４にそれぞれ当接する複数の爪２ｄ，２ｅ，２ｆ，２ｇを有している。 As described above, the fixing bracket B of the present embodiment is the fixing bracket B for fixing a plurality of electronic components 11, 12, 13, 14 forming a row to the heat sink 10, and is a row of the electronic components 11, 12, 13, 14. A frame 1 whose at least both ends are fixed to the heat sink 10 along the same line, and a holding portion 2 that extends from the frame 1 to the electronic components 11, 12, 13, 14 and presses the electronic components 11, 12, 13, 14 against the heat sink 10. A plurality of claws 2d, 2e, which are separated by notches 2a, 2b, 2c formed from the tip toward the frame 1 side and abut on the corresponding electronic components 11, 12, 13 and 14, respectively. It has 2f and 2g.
　このように構成された固定金具Ｂによれば、両端がヒートシンク１０に固定されるフレーム１から電子部品１１，１２，１３，１４側へ延びる抑え部２によって電子部品１１，１２，１３，１４をヒートシンク１０へ押圧しているので、列を成す電子部品１１，１２，１３，１４の個数やこれら電子部品１１，１２，１３，１４の距離に変更があっても簡単な設計変更で対応でき、抑え部２が切欠２ａ，２ｂ，２ｃによって分割されてそれぞれ対応する電子部品１１，１２，１３，１４を一つずつ押圧する爪２ｄ，２ｅ，２ｆ，２ｇを備えているので、電子部品１１，１２，１３，１４のそれぞれに適切な押圧力を付加できる。よって、固定金具Ｂによれば、電子部品１１，１２，１３，１４をヒートシンク１０へ押圧する押圧力を均一化できるだけでなく、固定可能な電子部品１１，１２，１３，１４の個数や配置の自由度を向上できる。 According to the fixing bracket B configured in this way, the electronic components 11, 12, 13, 14 are held by the holding portions 2 extending from the frame 1 whose both ends are fixed to the heat sink 10 toward the electronic components 11, 12, 13, and 14. Since it is pressed against the heat sink 10, even if the number of electronic components 11, 12, 13, 14 in a row or the distance between these electronic components 11, 12, 13, 14 is changed, it can be dealt with by a simple design change. Since the holding portion 2 is divided by the notches 2a, 2b, 2c and has claws 2d, 2e, 2f, 2g for pressing the corresponding electronic parts 11, 12, 13, 14 one by one, the electronic parts 11, Appropriate pressing force can be applied to each of 12, 13 and 14. Therefore, according to the fixing bracket B, not only can the pressing force for pressing the electronic components 11, 12, 13 and 14 against the heat sink 10 be made uniform, but also the number and arrangement of the electronic components 11, 12, 13 and 14 that can be fixed can be made uniform. The degree of freedom can be improved.
　また、ヒートシンク１０と、列をなす複数の電子部品１１，１２，１３，１４と、ヒートシンク１０に電子部品１１，１２，１３，１４を固定する前述の固定金具Ｂとを備えた電子部品ユニットＵによれば、電子部品１１，１２，１３，１４をヒートシンク１０へ押圧する押圧力を均一化され、固定可能な電子部品１１，１２，１３，１４の個数や配置の自由度も向上する。 Further, an electronic component unit U including a heat sink 10, a plurality of electronic components 11, 12, 13, 14 in a row, and the above-mentioned fixing bracket B for fixing the electronic components 11, 12, 13, 14 to the heat sink 10. According to the above, the pressing force for pressing the electronic components 11, 12, 13 and 14 against the heat sink 10 is made uniform, and the number and the degree of freedom of arrangement of the number and arrangement of the electronic components 11, 12, 13 and 14 that can be fixed are also improved.
　また、本実施の形態の固定金具Ｂにあっては、抑え部２に設けた切欠２ａ，２ｂ，２ｃの幅Ｗ１，Ｗ２，Ｗ３は、抑え部２の長手方向である図１中左右方向、つまり、列を成す電子部品１１，１２，１３，１４が並んでいる方向の両端に向かうほど広くなっている。具体的には、本実施の形態の固定金具Ｂでは、３つの切欠２ａ，２ｂ，２ｃのうち、抑え部２の中央に設けられた切欠２ｂの幅Ｗ２よりも切欠２ｂを挟んで抑え部２の両端側の切欠２ａ，２ｃの幅Ｗ１，Ｗ３の方が広くなっている。抑え部２に設けられる切欠２ａ，２ｂ，２ｃの幅を広くすれば広くするほど、切欠２ａ，２ｂ，２ｃを挟んで隣合う爪２ｄ，２ｅ，２ｆ，２ｇ同士が互いに相手方の押圧力に与える影響が小さくなる。固定金具Ｂの両端にある爪２ｄ，２ｇが電子部品１１，１４に当接すると爪２ｄ，２ｇとこれら爪２ｄ，２ｇの根元に連なる抑え部２も電子部品１１，１４から遠ざかる方向へ撓む。この抑え部２の撓みは、抑え部２の中央側の爪２ｅ，２ｆが電子部品１２，１３を押圧する押圧力が低下させるよう作用するが、切欠２ａ，２ｃの幅Ｗ１，Ｗ３を大きくすればするほど、爪２ｄ，２ｅ間の距離および爪２ｆ，２ｇ間の距離が長くなり、前記抑え部２の撓みによる爪２ｅ，２ｆの押圧力を減少させる影響が小さくなる。以上より、本実施の形態の固定金具Ｂは、抑え部２に設けた切欠２ａ，２ｂ，２ｃの幅Ｗ１，Ｗ２，Ｗ３が抑え部２の長手方向の両端に向かうほど広くなっているので抑え部２の中央に配置される爪２ｅ，２ｆの押圧力の低下を抑制でき、より効果的に電子部品１１，１２，１３，１４へ均一な押圧力作用させ得る。 Further, in the fixing bracket B of the present embodiment, the widths W1, W2, and W3 of the notches 2a, 2b, and 2c provided in the holding portion 2 are in the left-right direction in FIG. 1, which is the longitudinal direction of the holding portion 2. That is, it becomes wider toward both ends in the direction in which the electronic components 11, 12, 13, and 14 in a row are arranged. Specifically, in the fixing bracket B of the present embodiment, of the three notches 2a, 2b, 2c, the holding portion 2 sandwiches the notch 2b rather than the width W2 of the notch 2b provided in the center of the holding portion 2. The widths W1 and W3 of the notches 2a and 2c on both ends of the above are wider. The wider the width of the notches 2a, 2b, 2c provided in the holding portion 2, the wider the claws 2d, 2e, 2f, 2g adjacent to each other with the notches 2a, 2b, 2c sandwiched, the more the pressing force of the other party is applied. The impact is small. When the claws 2d and 2g at both ends of the fixing bracket B come into contact with the electronic parts 11 and 14, the claws 2d and 2g and the holding portion 2 connected to the roots of these claws 2d and 2g also bend in the direction away from the electronic parts 11 and 14. .. The bending of the holding portion 2 acts to reduce the pressing force on which the claws 2e and 2f on the center side of the holding portion 2 press the electronic parts 12 and 13, but the widths W1 and W3 of the notches 2a and 2c are greatly reduced. As the distance increases, the distance between the claws 2d and 2e and the distance between the claws 2f and 2g become longer, and the effect of reducing the pressing force of the claws 2e and 2f due to the bending of the holding portion 2 becomes smaller. From the above, in the fixing metal fitting B of the present embodiment, the widths W1, W2, and W3 of the notches 2a, 2b, and 2c provided in the holding portion 2 become wider toward both ends in the longitudinal direction of the holding portion 2, and thus the holding portion 2 is held. It is possible to suppress a decrease in the pressing force of the claws 2e and 2f arranged in the center of the portion 2, and it is possible to more effectively exert a uniform pressing force on the electronic components 11, 12, 13 and 14.
　なお、このように抑え部２の中央側の爪２ｅ，２ｆの押圧力の低下を抑制する別な構造としては、図５に示す本実施の形態の第一変形例のように、抑え部２に設けた切欠２ａ，２ｂ，２ｃの長さＤ１，Ｄ２，Ｄ３を抑え部２の長手方向である図５中左右方向、つまり、列を成す電子部品１１，１２，１３，１４が並んでいる方向の両端に向かうほど長くしてもよい。具体的には、本実施の形態の固定金具Ｂの３つの切欠２ａ，２ｂ，２ｃのうち、抑え部２の中央に設けられた切欠２ｂの長さＤ２よりも切欠２ｂを挟んだ抑え部２の両端側の切欠２ａ，２ｃの長さＤ１，Ｄ３の方を長くしてある。抑え部２に設けられる切欠２ａ，２ｂ，２ｃの長さを長くすれば長くするほど、切欠２ａ，２ｂ，２ｃを挟んで隣合う爪２ｄ，２ｅ，２ｆ，２ｇ同士が互いに相手方の押圧力に与える影響が小さくなる。固定金具Ｂの両端にある爪２ｄ，２ｇが電子部品１１，１４に当接すると爪２ｄ，２ｇと抑え部２のこれら爪２ｄ，２ｇの根元に連なる部分も電子部品１１，１４から遠ざかる方向へ撓む。この抑え部２の撓みは、抑え部２の中央側の爪２ｅ，２ｆが電子部品１２，１３を押圧する押圧力が低下させるよう作用するが、切欠２ａ，２ｃの長さＤ１，Ｄ３を大きくすればするほど爪２ｄ，２ｇの撓み量が増える代わりに抑え部２の爪２ｄ，２ｇの根元に連なる部分の撓み量を小さくできるので、前記抑え部２の撓みによる爪２ｅ，２ｆの押圧力の減少を抑制できる。図５に示した一変形例における固定金具Ｂは、抑え部２に設けた切欠２ａ，２ｂ，２ｃの長さＤ１，Ｄ２，Ｄ３が抑え部２の長手方向の両端に向かうほど長くなっているので抑え部２の中央に配置される爪２ｅ，２ｆの押圧力の低下を抑制でき、より効果的に電子部品１１，１２，１３，１４へ均一な押圧力作用させ得る。 As another structure for suppressing the decrease in the pressing force of the claws 2e and 2f on the center side of the holding portion 2 in this way, as in the first modification of the present embodiment shown in FIG. 5, the holding portion 2 In FIG. 5, the lengths D1, D2, D3 of the notches 2a, 2b, and 2c provided in the above are suppressed, and the electronic parts 11, 12, 13, and 14 in a row are arranged in the left-right direction in FIG. 5, which is the longitudinal direction of the holding portion 2. It may be longer toward both ends in the direction. Specifically, of the three notches 2a, 2b, and 2c of the fixing bracket B of the present embodiment, the holding portion 2 sandwiching the notch 2b rather than the length D2 of the notch 2b provided in the center of the holding portion 2. The lengths D1 and D3 of the notches 2a and 2c on both ends of the above are longer. The longer the lengths of the notches 2a, 2b, 2c provided in the holding portion 2, the more the adjacent claws 2d, 2e, 2f, 2g sandwiching the notches 2a, 2b, 2c exert pressure on each other. The effect is small. When the claws 2d and 2g at both ends of the fixing bracket B come into contact with the electronic components 11 and 14, the portions of the claws 2d and 2g and the holding portion 2 connected to the roots of the claws 2d and 2g also move away from the electronic components 11 and 14. Bend. The bending of the holding portion 2 acts to reduce the pressing force on which the claws 2e and 2f on the center side of the holding portion 2 press the electronic parts 12 and 13, but increases the lengths D1 and D3 of the notches 2a and 2c. As the amount of bending of the claws 2d and 2g increases, the amount of bending of the portion of the holding portion 2 connected to the roots of the claws 2d and 2g can be reduced, so that the pressing force of the claws 2e and 2f due to the bending of the holding portion 2 can be reduced. Can be suppressed. In the fixing bracket B in one modification shown in FIG. 5, the lengths D1, D2, and D3 of the notches 2a, 2b, and 2c provided in the holding portion 2 become longer toward both ends in the longitudinal direction of the holding portion 2. Therefore, it is possible to suppress a decrease in the pressing force of the claws 2e and 2f arranged at the center of the pressing portion 2, and it is possible to more effectively exert a uniform pressing force on the electronic components 11, 12, 13 and 14.
　このように、抑え部２に設ける切欠が３つ以上であれば、抑え部２の両端側に設けられる切欠の幅を中央側の切欠の幅よりも広くし、或いは、抑え部２の両端側に設けられる切欠の長さを中央側の切欠の長さよりも長くし、或いは、抑え部２の両端側に設けられる切欠の幅と長さを中央側の切欠の幅と長さよりも長くするようにすれば、効果的に均一な押圧力を電子部品へ作用させ得るのである。 In this way, if there are three or more notches provided in the holding portion 2, the width of the notches provided on both ends of the holding portion 2 may be wider than the width of the notches on the center side, or both ends of the holding portion 2 may be provided. The length of the notch provided in the center side is made longer than the length of the notch on the central side, or the width and length of the notches provided on both end sides of the holding portion 2 are made longer than the width and length of the notch on the central side. If this is the case, a uniform pressing force can be effectively applied to the electronic component.
　また、各爪２ｄ，２ｅ，２ｆ，２ｇの押圧力は、抑え部２のフレーム１のフレーム本体１ａに対する角度調整の他、抑え部２の各爪２ｄ，２ｅ，２ｆ，２ｇの根元が連なる部分に対する各爪２ｄ，２ｅ，２ｆ，２ｇの角度調整（折り曲げ角度）によっても大小調節可能である。よって、電子部品１１，１２と電子部品１３，１４の樹脂部Ｒの上下方向長さが異なる場合には、図６に示した第二変形例の固定金具Ｂのように、対応する電子部品１１，１２，１３，１４の高さに応じて爪２ｄ，２ｅ，２ｆ，２ｇの折り曲げ角度θを変えてこれら爪２ｄ，２ｅ，２ｆ，２ｇの高さ（無負荷時距離Ｚ）を異ならせてもよい。このように、電子部品１１，１２，１３，１４の樹脂部Ｒの上下方向長さが異なっても、爪２ｄ，２ｅ，２ｆ，２ｇの高さ（無負荷時距離Ｚ）と、樹脂部Ｒの高さＨと放熱シートＳの厚みの合計高さとの差分である締代を等しくすれば、均一な押圧力を各電子部品１１，１２，１３，１４へ与えられる。なお、このように一つの固定金具Ｂで固定する電子部品１１，１２，１３，１４の樹脂部Ｒの高さＨが異なる場合、高さＨが異なる隣り合う電子部品１２，１３に当接する爪２ｅ，２ｆ同士の間の切欠２ｂの長さは、高さＨが等しい隣り合う電子部品１１，１２と電子部品１３，１４に当接する爪２ｄ，２ｅ同士と爪２ｆ，２ｇ同士の間の切欠２ａ，２ｂの長さよりも長くするとよい。切欠２ｂの長さを長くすればするほど、高さＨが異なる電子部品１２，１３を押圧する爪２ｅ，２ｆ同士が互いの押圧力に与える影響を低減できるので、このように構成された固定金具Ｂでは、高さＨが異なる電子部品１１，１２，１３，１４に対しても効果的に均一な押圧力を作用させ得る。 Further, the pressing force of each claw 2d, 2e, 2f, 2g adjusts the angle of the frame 1 of the holding portion 2 with respect to the frame body 1a, and the portion where the roots of the claws 2d, 2e, 2f, 2g of the holding portion 2 are connected. The size can also be adjusted by adjusting the angle (bending angle) of each of the claws 2d, 2e, 2f, and 2g. Therefore, when the vertical lengths of the resin portions R of the electronic components 11 and 12 and the electronic components 13 and 14 are different, the corresponding electronic components 11 are like the fixing bracket B of the second modified example shown in FIG. The bending angles θ of the claws 2d, 2e, 2f, and 2g are changed according to the heights of the claws 2, 13, and 14, and the heights of the claws 2d, 2e, 2f, and 2g (distance Z at no load) are made different. May be good. In this way, even if the vertical lengths of the resin portions R of the electronic components 11, 12, 13, and 14 are different, the heights of the claws 2d, 2e, 2f, and 2 g (no-load distance Z) and the resin portion R If the tightening allowance, which is the difference between the height H of the above and the total height of the thickness of the heat radiating sheet S, is made equal, a uniform pressing force is applied to the electronic components 11, 12, 13, and 14. When the heights H of the resin portions R of the electronic components 11, 12, 13, and 14 fixed by one fixing bracket B are different in this way, the claws that come into contact with the adjacent electronic components 12, 13 having different heights H. The length of the notch 2b between the 2e and 2f is the notch between the claws 2d and 2e and the claws 2f and 2g that abut the adjacent electronic components 11 and 12 and the electronic components 13 and 14 having the same height H. It may be longer than the lengths of 2a and 2b. As the length of the notch 2b is increased, the influence of the claws 2e and 2f pressing the electronic components 12 and 13 having different heights H on each other's pressing force can be reduced. Therefore, the fixing configured in this manner. In the metal fitting B, a uniform pressing force can be effectively applied to electronic components 11, 12, 13, and 14 having different heights H.
　また、一つの固定金具Ｂで固定する電子部品の数が多くなる場合、図７に示した第三変形例の固定金具Ｂのように、フレーム１におけるフレーム本体１ａに複数の抑え部２を設けて抑え部２，２間に孔１ｃを備えた固定片１ｂを設けて、フレーム１の長手方向の中間部においてもヒートシンク１０のポスト１０ｂに固定するようにして、抑え部２，２の押圧力の低下を抑制してフレーム１の中間部においても電子部品へ均一な押圧力を作用させるようにすればよい。 Further, when the number of electronic components to be fixed by one fixing bracket B is large, a plurality of holding portions 2 are provided on the frame main body 1a in the frame 1 as in the fixing bracket B of the third modification shown in FIG. A fixing piece 1b having a hole 1c is provided between the holding portions 2 and 2, so that the fixing piece 1b is fixed to the post 10b of the heat sink 10 even in the intermediate portion in the longitudinal direction of the frame 1, and the pressing force of the holding portions 2 and 2 It is sufficient to suppress the decrease in the pressure and apply a uniform pressing force to the electronic component even in the middle portion of the frame 1.
　以上、本発明の好ましい実施の形態を詳細に説明したが、特許請求の範囲から逸脱しない限り、改造、変形、および変更が可能である。本願は、２０１９年８月９日に日本国特許庁に出願された特願２０１９－１４７１７０に基づく優先権を主張し、この出願の全ての内容は参照により本明細書に組み込まれる。 Although the preferred embodiments of the present invention have been described in detail above, they can be modified, modified, and modified as long as they do not deviate from the claims. The present application claims priority based on Japanese Patent Application No. 2019-147170 filed with the Japan Patent Office on August 9, 2019, and the entire contents of this application are incorporated herein by reference.
１・・・フレーム、２・・・抑え部、２ａ，２ｂ，２ｃ・・・切欠、２ｄ，２ｅ，２ｆ，２ｇ・・・爪、１０・・・ヒートシンク、１１，１２，１３，１４・・・電子部品、Ｂ・・・固定金具 1 ... frame, 2 ... holding part, 2a, 2b, 2c ... notch, 2d, 2e, 2f, 2g ... claw, 10 ... heat sink, 11, 12, 13, 14 ...・ Electronic parts, B ・ ・ ・ Fixing bracket

Claims (5)

  1. 　固定金具であって、
    　列をなす複数の電子部品をヒートシンクに固定する固定金具であって、
    　前記電子部品の列に沿うとともに、少なくとも両端が前記ヒートシンクに固定されるフレームと、
    　前記フレームから前記電子部品側へ延びて前記電子部品を前記ヒートシンクに押圧する抑え部とを備え、
    　前記抑え部は、先端から前記フレーム側へ向けて形成した切欠によって分離されて対応する前記電子部品にそれぞれ当接する複数の爪を有する
    　固定金具。     It is a fixing bracket
    A fixing bracket that fixes multiple electronic components in a row to a heat sink.
    A frame that follows the row of electronic components and has at least both ends fixed to the heat sink.
    A holding portion extending from the frame toward the electronic component side and pressing the electronic component against the heat sink is provided.
    The holding portion is a fixing bracket having a plurality of claws separated by a notch formed from the tip toward the frame side and abutting on the corresponding electronic component.
  2. 　請求項１に記載の固定金具であって
    　前記切欠の長さは、前記抑え部の長手方向の両端に向かうほど長い
    　固定金具。     The fixing bracket according to claim 1, wherein the notch length is longer toward both ends in the longitudinal direction of the holding portion.
  3. 　請求項１に記載の固定金具であって、
    　前記切欠の幅は、前記抑え部の長手方向の両端に向かうほど広い
    　固定金具。     The fixing bracket according to claim 1.
    A fixing bracket in which the width of the notch is widened toward both ends in the longitudinal direction of the holding portion.
  4. 　請求項１に記載の固定金具であって、
    　高さが異なる隣り合う電子部品に当接する爪同士の間の切欠の長さは、高さが等しい隣り合う電子部品に当接する爪同士の間の切欠の長さよりも長い
    　固定金具。     The fixing bracket according to claim 1.
    A fixing bracket whose notch length between claws that contact adjacent electronic components with different heights is longer than the length of the notch between claws that contact adjacent electronic components with the same height.
  5. 　電子部品ユニットであって、
    　ヒートシンクと、
    　列をなす複数の電子部品と、
    　前記ヒートシンクに前記電子部品を固定する請求項１に記載の固定金具とを備えた
    　電子部品ユニット。     It is an electronic component unit
    With a heat sink
    With multiple electronic components in a row
    An electronic component unit including the fixing bracket according to claim 1, which fixes the electronic component to the heat sink.
PCT/JP2020/013328 2019-08-09 2020-03-25 Metal fixture and electronic component unit WO2021029105A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-147170 2019-08-09
JP2019147170A JP2021028923A (en) 2019-08-09 2019-08-09 Fixing metal fitting and electronic component unit

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JP2017212275A (en) * 2016-05-24 2017-11-30 矢崎総業株式会社 Electronic component fixing structure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09283674A (en) * 1996-04-09 1997-10-31 Yaskawa Electric Corp Heating element fixing structure
WO2010119546A1 (en) * 2009-04-16 2010-10-21 三菱電機株式会社 Fitting for fixing heat producing parts
JP2016025161A (en) * 2014-07-17 2016-02-08 三菱電機株式会社 Heat radiator
JP2017212275A (en) * 2016-05-24 2017-11-30 矢崎総業株式会社 Electronic component fixing structure

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