WO2021019629A1 - Structure et dispositif électronique - Google Patents

Structure et dispositif électronique Download PDF

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Publication number
WO2021019629A1
WO2021019629A1 PCT/JP2019/029545 JP2019029545W WO2021019629A1 WO 2021019629 A1 WO2021019629 A1 WO 2021019629A1 JP 2019029545 W JP2019029545 W JP 2019029545W WO 2021019629 A1 WO2021019629 A1 WO 2021019629A1
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Prior art keywords
liquid crystal
heat
heat conductive
crystal polymer
conductive portion
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PCT/JP2019/029545
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English (en)
Japanese (ja)
Inventor
由高 竹澤
慎吾 田中
寧 湯
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昭和電工マテリアルズ株式会社
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Priority to PCT/JP2019/029545 priority Critical patent/WO2021019629A1/fr
Priority to JP2021536473A priority patent/JPWO2021019629A1/ja
Publication of WO2021019629A1 publication Critical patent/WO2021019629A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances

Definitions

  • the present invention relates to structures and electronic devices.
  • the insulating materials constituting electronic devices are required to have high thermal conductivity.
  • a polymer is widely used from the viewpoint of high dielectric strength and ease of molding.
  • a method for increasing the thermal conductivity of a polymer a method of adding an insulating filler having a high thermal conductivity to a resin is generally used.
  • the filler having high thermal conductivity and insulating properties include alumina particles (for example, Patent Document 1).
  • the main object of the present invention is to provide a structure capable of efficiently conducting anisotropic heat conduction.
  • One aspect of the present invention is a structure including a heat conductive portion having heterothermal conductivity and a heat insulating portion having heat insulating properties arranged so as to be in contact with the heat conductive portion.
  • the heat insulating part is a structure containing a polymer different from the thermoplastic liquid crystal polymer.
  • the thermal conductivity in one direction of the heat conductive portion may be twice or more the thermal conductivity in the direction perpendicular to one direction of the heat conductive portion.
  • the heat conductive part may have a nematic structure.
  • the polymer different from the thermoplastic liquid crystal polymer may be a thermoplastic non-liquid crystal polymer.
  • the heat conductive portion may have a first extending portion extending in one direction, and a second extending portion and a third extending portion extending from the first extending portion may be provided. You may have more.
  • the structure may be a two-color molded product of a composition containing a thermoplastic liquid crystal polymer and a composition containing a polymer different from the thermoplastic liquid crystal polymer.
  • the structure may be used as a heat radiating member.
  • Another aspect of the present invention includes an electronic component and the above-mentioned structure, and the electronic component is an electronic device arranged so that heat generated by the electronic component can be thermally conducted to a heat conductive portion. Is.
  • the numerical range indicated by using “-" in this specification includes the numerical values before and after "-" as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerical range described stepwise. Good.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
  • each component in the composition is the sum of the plurality of substances present in the composition unless otherwise specified, when a plurality of substances corresponding to each component are present in the composition. Means the content of.
  • FIG. 1 is a perspective view schematically showing an embodiment of the structure.
  • the structure 1 according to one embodiment has a plate-shaped (sheet-shaped) heat conductive portion 2 and a plate-shaped (sheet-shaped) heat insulating portion arranged so as to be in contact with the heat conductive portion 2. It is provided with a part 3.
  • the heat conductive portion 2 contains a thermoplastic liquid crystal polymer.
  • the thermoplastic liquid crystal polymer is a polymer having a so-called mesogen structure.
  • the mesogen structure is, for example, a ring structure such as a benzene ring, a naphthalene ring, an anthracene ring (these rings may be substituted with other atoms), and these rings are via an ester bond, an ether bond, or an azomethine bond. It includes structures that are connected to each other.
  • the thermoplastic liquid crystal polymer may be a known thermoplastic liquid crystal polymer.
  • the thermoplastic liquid crystal polymer can form a higher-order structure (also referred to as a periodic structure) derived from the mesogen structure.
  • the higher-order structure (periodic structure) referred to here means a state in which molecules are oriented and arranged in the heat conductive portion 2, and for example, a state in which a crystal structure or a liquid crystal structure exists in the heat conductive portion 2. To do. The existence of such a crystal structure or liquid crystal structure can be confirmed by observation with a polarizing microscope (for example, OPTIPHOT2-POL manufactured by Nikon Corporation) under an orthogonal Nicol or X-ray scattering.
  • a polarizing microscope for example, OPTIPHOT2-POL manufactured by Nikon Corporation
  • Higher-order structures with high regularity derived from the mesogen structure include nematic structures and smectic structures.
  • the nematic structure is a liquid crystal structure in which the molecular major axis is oriented in a uniform direction and has only orientation order.
  • the smectic structure is a liquid crystal structure having a layered structure having a fixed period in addition to the orientation order. Further, within the same periodic structure of the smectic structure, the direction of the period of the layer structure is uniform.
  • the heat conductive portion 2 has, for example, a nematic structure.
  • the content of the thermoplastic liquid crystal polymer in the heat conductive portion 2 is preferably 50% by volume or more, more preferably 70% by volume or more, still more preferably 70% by volume or more, based on the total amount of the heat conductive part 2 from the viewpoint of further excellent thermal conductivity. Is 80% by volume or more, particularly preferably 95% by volume or more.
  • the content of the thermoplastic liquid crystal polymer in the heat conductive portion 2 is a value calculated by the following formula.
  • each variable is as follows.
  • Aw Mass ratio (mass%) of components other than thermoplastic liquid crystal polymer
  • Bw Mass ratio (mass%) of thermoplastic liquid crystal polymer
  • Ad Specific gravity of components other than the thermoplastic liquid crystal polymer
  • Bd Specific gravity of the thermoplastic liquid crystal polymer
  • the heat conductive portion 2 may further contain a polymer other than the thermoplastic liquid crystal polymer.
  • the other polymer may be a thermoplastic polymer that does not exhibit liquid crystallinity, and may be, for example, a thermoplastic acrylic polymer or polyester that does not exhibit liquid crystallinity.
  • the content of the other polymer may be, for example, 5 parts by volume or more, preferably 30 parts by volume or less, more preferably 20 parts by volume or less, and further preferably 10 parts by volume with respect to 100 parts by volume of the thermoplastic liquid crystal polymer. It is as follows.
  • the heat conductive portion 2 may further contain a filler.
  • the filler may be ceramic particles from the viewpoint of further improving the thermal conductivity and also improving the insulating property.
  • the ceramic particles include alumina particles, silica particles, magnesium oxide particles, boron nitride particles, aluminum nitride particles, and silicon nitride particles.
  • the filler preferably contains at least one selected from the group consisting of alumina particles, boron nitride particles, aluminum nitride particles and magnesium oxide particles, and more preferably contains alumina particles.
  • the alumina particles preferably contain highly crystalline alumina particles, and more preferably ⁇ -alumina particles.
  • the content of the filler may be, for example, 10 parts by volume or more and 50 parts by volume or less with respect to 100 parts by volume of the thermoplastic liquid crystal polymer.
  • the heat conductive portion 2 is obtained by molding a thermoplastic liquid crystal polymer composition containing a thermoplastic liquid crystal polymer (which further contains other polymers, fillers, etc., if necessary). That is, the heat conductive portion 2 is a molded product of the thermoplastic liquid crystal polymer composition.
  • the thermoplastic liquid crystal polymer molecules are self-oriented in the flow direction of the thermoplastic liquid crystal polymer composition to form a higher-order structure. It is considered that this is due to the flow orientation of the thermoplastic liquid crystal polymer and the shear stress with the wall surface of the flow path.
  • By orienting the thermoplastic liquid crystal polymer molecules high thermal conductivity is exhibited in the orientation direction. That is, the heat conductive portion 2 has an anisotropically high thermal conductivity (anisotropic thermal conductivity) in the orientation direction of the thermoplastic liquid crystal polymer.
  • the molecules of the thermoplastic liquid crystal polymer are oriented, whereby the thermal conductivity in the orientation direction is improved, and the heat conductive portion 2 has anisotropic thermal conductivity.
  • the thermal conductivity in one direction (for example, the orientation direction of the thermoplastic liquid crystal polymer) is preferably 1.5 times the thermal conductivity in the direction perpendicular to the one direction (orientation direction). As mentioned above, it is more preferably 2 times or more, further preferably 3 times or more, and particularly preferably 4 times or more.
  • the heat insulating portion 3 has a heat insulating property, and is arranged so as to be in contact with the heat conductive portion 2 in order to suppress radiant heat leaking from the heat conductive portion 2.
  • the thermal conductivity of the heat insulating portion 3 is, for example, 0.2 W / m ⁇ K or less, preferably 0.1 W / m ⁇ K or less, and more preferably 0.05 W / m ⁇ K or less.
  • the heat insulating portion 3 contains a polymer (non-liquid crystal polymer) different from the thermoplastic liquid crystal polymer.
  • the non-liquid crystal polymer may be a thermoplastic non-liquid crystal polymer or a thermosetting non-liquid crystal polymer, and is preferably a thermoplastic non-liquid crystal polymer from the viewpoint of being capable of two-color molding.
  • the non-liquid crystal polymer is preferably a polymer that has heat resistance and does not decompose at the glass transition point of the thermoplastic liquid crystal polymer.
  • the 5% weight loss temperature of the non-liquid crystal polymer is preferably 250 ° C. or higher, more preferably 300 ° C. or higher, still more preferably 350 ° C. or higher.
  • the 5% weight loss temperature is set under the conditions of a temperature rise rate of 10 ° C./min and a nitrogen flow of 400 mL / min using a differential thermogravimetric simultaneous measuring device (for example, TG / DTA6300 manufactured by Hitachi High-Tech Science Co., Ltd.). Measured below.
  • the non-liquid crystal polymer may be, for example, polycarbonate, polyester, polyamideimide, polyimide, polysulfone, polyethersulfone, polyphenylene sulfide, polyphenylene oxide, polyacrylonitrile, polymethylpentene, or the like.
  • the thermoplastic liquid crystal polymer is in a direction perpendicular to the stacking direction of the heat conductive portion 2 and the heat insulating portion 3 (direction parallel to the main surface of the heat conductive portion 2).
  • the heat transferred to the structure 1 is transferred to the direction perpendicular to the stacking direction of the heat conductive portion 2 and the heat insulating portion 3 (direction parallel to the main surface of the heat conductive portion 2).
  • the heat conductive portion 2 conducts heat alienally due to the molecular orientation of the thermoplastic liquid crystal polymer, and the heat insulating portion 3 suppresses the radiant heat leaking from the heat conductive portion 2, so that the structure is formed.
  • the heat transferred to the body 1 (heat conduction portion 2) can be efficiently and heterogeneously conducted.
  • the structure 1 having such heterogeneous thermal conductivity easily transports heat in a predetermined direction, it can be suitably used as a heat conductive member (so-called thermal circuit) for conducting heat in a predetermined path. ..
  • FIG. 2 is a perspective view schematically showing another embodiment of the structure (so-called thermal circuit).
  • the heat conductive portion 12 exhibits a square columnar shape extending in one direction. It can be said that the heat conductive portion 12 is composed of a square columnar extending portion (first extending portion) extending in one direction.
  • the heat insulating portion 13 has a plate shape, and a square columnar recess extending in one direction is formed on one surface of the heat insulating portion 13 so as to correspond to the shape of the heat conductive portion 22.
  • the heat conductive portion 12 is arranged in the recess of the heat insulating portion 13 so as to be in contact with the heat insulating portion 13.
  • FIG. 3 is a perspective view schematically showing another embodiment of the structure (so-called thermal circuit).
  • the heat conductive portion 22 has a square columnar first extending portion 22a extending in one direction and a first extending portion 22a. It is composed of a square columnar second extending portion 22b and a third extending portion 22c branching from and extending from. That is, the heat conductive portion 22 has a Y shape in a plan view.
  • the heat insulating portion 23 has a plate shape, and a Y-shaped recess is formed on one surface of the heat insulating portion 23 in a plan view so as to correspond to the shape of the heat conductive portion 22.
  • thermoplastic liquid crystal polymer is oriented in the extending direction of the heat conductive portions 12 and 22, the heat conductive portions 12 and 22 are oriented along the extending direction. Therefore, heat can be conducted anisotropically.
  • Each of the above structures 1, 11 and 21 is suitably used as a heat radiating member (heat radiating material), and is particularly preferably used as a heat radiating member in an electronic device. That is, in an electronic device including an electronic component that generates heat, heat is conducted not only in the direction in which heat should be conducted (for example, in the direction from the electronic component to the heat sink) but also in the direction of other electronic components in the electronic device, for example. If this happens, the heat-sensitive electronic components will be exposed to heat, which may impair the reliability of the electronic device. Therefore, the structures 1, 11 and 21 capable of efficiently and anisotropically conducting heat are particularly preferably used in electronic devices.
  • one embodiment of the present invention includes an electronic component and the above-mentioned structure, and the electronic component is arranged so that the heat generated by the electronic component can be thermally conducted to the heat conductive portion. It is a device.
  • the heat insulating portion 3 is provided only on a part of the surfaces of the heat conductive portions 2, 12 and 22 (some surfaces of the heat conductive portions 2, 12 and 22 are provided. (Exposed), but in another embodiment, heat insulating portions may be provided on all surfaces of the heat conductive portion (the heat conductive portion may not have exposed surfaces).
  • the method for manufacturing a structure includes a step A1 for molding a heat conductive portion, a step A2 for molding a heat insulating portion, and a step A3 for combining the heat conductive portion and the heat insulating portion so as to be in contact with each other.
  • the manufacturing method A In this manufacturing method A, the order of steps A1 and A2 is arbitrary and can be interchanged with each other.
  • step A1 the above-mentioned thermoplastic liquid crystal polymer composition is molded while flowing.
  • a molding method is not particularly limited, but is preferably injection molding.
  • injection molding as described above, a heat conductive portion having a higher-order structure is formed in the flow path to be injection-molded by the flow orientation of the thermoplastic liquid crystal polymer and the shear stress with the wall surface of the flow path.
  • the molding temperature can be set according to, for example, the glass transition point Tg (° C.) of the thermoplastic liquid crystal polymer.
  • the molding temperature is preferably Tg (° C.) or higher, preferably Tg + 30 (° C.) or lower, more preferably Tg + 20 (° C.) or lower, and even more preferably Tg + 10 (° C.) or lower.
  • the molding temperature is preferably 220 ° C. or higher, preferably 250 ° C. or lower, more preferably 240 ° C. or lower, still more preferably 230 ° C. or lower. ..
  • the pressure at the time of molding is not particularly limited, but is preferably 20 MPa or more, more preferably 30 MPa or more, preferably 60 MPa or less, and more preferably 50 MPa or less.
  • the holding time under the pressure is not particularly limited, but is preferably 1 second or longer, more preferably 5 seconds or longer, preferably 20 minutes or shorter, and more preferably 10 minutes or shorter.
  • the above-mentioned non-liquid crystal polymer is molded.
  • the molding method is not particularly limited, but may be, for example, injection molding.
  • the molding temperature can be set according to, for example, the glass transition point Tg (° C.) of the non-liquid polymer.
  • the molding temperature is preferably Tg (° C.) or higher, preferably Tg + 30 (° C.) or lower, more preferably Tg + 20 (° C.) or lower, and even more preferably Tg + 10 (° C.) or lower.
  • the molding temperature is preferably 290 ° C. or higher, preferably 320 ° C. or lower, more preferably 310 ° C. or lower, still more preferably 300 ° C. or lower.
  • the pressure at the time of molding is not particularly limited, but is preferably 20 MPa or more, more preferably 30 MPa or more, preferably 60 MPa or less, and more preferably 50 MPa or less.
  • the holding time under the pressure is not particularly limited, but is preferably 1 second or longer, more preferably 5 seconds or longer, preferably 20 minutes or shorter, and more preferably 10 minutes or shorter.
  • step A3 the heat conductive portion obtained in step A1 and the heat insulating portion obtained in step A2 are combined and joined so as to be in contact with each other. More specifically, for example, the bonding portion can be bonded by heating the bonding portion to the glass transition point Tg or higher of the thermoplastic liquid crystal polymer or the non-liquid crystal polymer and crimping. As a result, a structure including a heat conductive portion and a heat insulating portion arranged so as to be in contact with the heat conductive portion can be obtained.
  • the method for producing the structure may be a production method B including a step B1 for two-color molding of a composition containing a thermoplastic liquid crystal polymer and a composition containing a non-liquid crystal polymer. ..
  • This manufacturing method B is preferable to the above-mentioned manufacturing method A from the viewpoint of excellent moldability and reduction in the number of steps. That is, the structure may be a two-color molded product of a composition containing a thermoplastic liquid crystal polymer and a composition containing a non-liquid crystal polymer.
  • the method of two-color molding in step B1 may be a known method.
  • the step B1 is, in one embodiment, a heat insulating portion 13 and 23 having a recess in the composition containing the non-liquid crystal polymer.
  • This may be a step of molding the heat conductive portions 22 and 32 with the composition containing the thermoplastic liquid crystal polymer in the recesses after molding.
  • the molding method of the heat insulating portion and the heat conductive portion may be, for example, injection molding.
  • the conditions at the time of injection molding of the heat insulating portion and the heat conductive portion may be the same as the conditions at the time of injection molding of the heat insulating portion and the heat conductive portion described in the above-mentioned manufacturing method A, respectively.
  • step B1 forms a flat heat insulating portion with a composition containing a non-liquid crystal polymer, processes the heat insulating portion to form a recess, and then contains the thermoplastic liquid crystal polymer in the recess. It may be a step of molding the heat conductive portions 22 and 32 with the composition to be formed.
  • Example 1 A structure (two-color molded body) was produced by two-color molding (two injection moldings). Specifically, first, as the first injection molding, polyphenylene sulfide (PPS-SC, manufactured by Toray Industries, Inc.), which is a thermoplastic non-liquid crystal polymer, is pre-dried at 140 ° C. for 6 hours and then 140 ° C. in advance. The mold was injection-molded at 320 ° C. and 100 MPa.
  • PPS-SC polyphenylene sulfide
  • a heat insulating portion having a width of 100 mm, a length of 100 mm, and a thickness of 50 mm having a square columnar recess having a width of 15 mm, a length of 100 mm, and a depth of 15 mm was obtained.
  • thermoplastic liquid crystal polymer 1 (A-8100 manufactured by Ueno Fine Chemicals Industry Co., Ltd.) was pre-dried at 140 ° C. for 6 hours, and then heat-insulated fitted in a mold preheated to 100 ° C. Injection molding was performed from one end of the concave portion of the portion under the conditions of 225 ° C. and 50 MPa. As a result, a square columnar heat conductive portion having a width of 15 mm, a length of 100 mm, and a thickness of 15 mm was formed in the recess of the heat insulating portion to obtain a structure (two-color molded body).
  • Example 2 In Example 1, the shape of the concave portion of the heat insulating portion in the first injection molding and the shape of the heat conductive portion in the second injection molding are changed to a square columnar having a width of 10 mm, a length of 100 mm, and a depth (thickness) of 10 mm. A structure (two-color molded product) was obtained in the same manner as in Example 1.
  • the shape of the recess of the heat insulating portion in the first injection molding and the shape of the heat conductive portion in the second injection molding are Y-shaped (width 15 mm, length 60 mm, depth (thickness) 15 mm square).
  • a structure (two-color molded body) was obtained in the same manner as in Example 1 except that the shape was changed to an extending portion.
  • Example 4 In Example 1, the same as in Example 1 except that the thermoplastic liquid crystal polymer 2 (manufactured by Ueno Fine Chemicals Industry Co., Ltd., A-5000) was used instead of the thermoplastic liquid crystal polymer 1 in the second injection molding. A structure (two-color molded product) was obtained.
  • the thermoplastic liquid crystal polymer 2 manufactured by Ueno Fine Chemicals Industry Co., Ltd., A-5000
  • Example 5 a structure (two-color molded product) was obtained in the same manner as in Example 3 except that the thermoplastic liquid crystal polymer 2 was used instead of the thermoplastic liquid crystal polymer 1 in the second injection molding.
  • Example 1 (Comparative Example 1) In Example 1, instead of the thermoplastic liquid crystal polymer 1 in the second injection molding, polycarbonate which is a non-liquid crystal polymer was used, and the injection molding conditions were changed to 280 ° C. and 100 MPa in the same manner as in Example 1. A structure (two-color molded product) was obtained.
  • Example 2 In Example 1, instead of the second injection molding, the thermoplastic liquid crystal polymer was molded by potting in the recess of the heat insulating portion preheated to 100 ° C. without pressurizing at 225 ° C. A structure (two-color molded product) was obtained in the same manner.
  • the heat conductive portion has anisotropic heat conductivity.
  • Comparative Example 1 since the non-liquid crystal polymer (polycarbonate) is used, the heat conductive portion does not form a liquid crystal structure (nematic structure) and does not have anisotropic heat conductivity.
  • Comparative Example 2 although the nematic structure is formed in the heat conductive portion, the heat conductive portion does not have anisotropic heat conductivity because the thermoplastic liquid crystal polymer is not oriented.

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Abstract

Un aspect de la présente invention est une structure comprenant : une partie conductrice de chaleur qui est conductrice de la chaleur anisotrope; et une partie isolante qui est disposée de manière à entrer en contact avec la partie conductrice de chaleur et a des propriétés isolantes, la partie thermoconductrice comprenant un polymère à cristaux liquides thermoplastique, et la partie isolante comprenant un polymère différent du polymère à cristaux liquides thermoplastique.
PCT/JP2019/029545 2019-07-26 2019-07-26 Structure et dispositif électronique WO2021019629A1 (fr)

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PCT/JP2019/029545 WO2021019629A1 (fr) 2019-07-26 2019-07-26 Structure et dispositif électronique
JP2021536473A JPWO2021019629A1 (fr) 2019-07-26 2019-07-26

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005066968A (ja) * 2003-08-22 2005-03-17 Toray Ind Inc 積層熱可塑性樹脂フィルム
JP2010150377A (ja) * 2008-12-25 2010-07-08 Kaneka Corp 高熱伝導性熱可塑性樹脂及び組成物
JP2012188624A (ja) * 2011-03-14 2012-10-04 Kaneka Corp 高熱伝導性樹脂組成物の製造方法および成形体の製造方法
WO2013133181A1 (fr) * 2012-03-07 2013-09-12 株式会社カネカ Compact de résine thermoconductrice et procédé de fabrication d'un compact de résine thermoconductrice
JP2014511922A (ja) * 2011-04-06 2014-05-19 サムスン ファイン ケミカルズ カンパニー リミテッド 熱伝導性高分子複合素材及びそれを含む物品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005066968A (ja) * 2003-08-22 2005-03-17 Toray Ind Inc 積層熱可塑性樹脂フィルム
JP2010150377A (ja) * 2008-12-25 2010-07-08 Kaneka Corp 高熱伝導性熱可塑性樹脂及び組成物
JP2012188624A (ja) * 2011-03-14 2012-10-04 Kaneka Corp 高熱伝導性樹脂組成物の製造方法および成形体の製造方法
JP2014511922A (ja) * 2011-04-06 2014-05-19 サムスン ファイン ケミカルズ カンパニー リミテッド 熱伝導性高分子複合素材及びそれを含む物品
WO2013133181A1 (fr) * 2012-03-07 2013-09-12 株式会社カネカ Compact de résine thermoconductrice et procédé de fabrication d'un compact de résine thermoconductrice

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