WO2021005952A1 - Capteur optique et capteur de proximité le comprenant - Google Patents

Capteur optique et capteur de proximité le comprenant Download PDF

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Publication number
WO2021005952A1
WO2021005952A1 PCT/JP2020/023039 JP2020023039W WO2021005952A1 WO 2021005952 A1 WO2021005952 A1 WO 2021005952A1 JP 2020023039 W JP2020023039 W JP 2020023039W WO 2021005952 A1 WO2021005952 A1 WO 2021005952A1
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WIPO (PCT)
Prior art keywords
light
resin body
light receiving
optical sensor
emitting element
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PCT/JP2020/023039
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English (en)
Japanese (ja)
Inventor
博 渡邊
滉平 菅原
加藤　貴敏
Original Assignee
株式会社村田製作所
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Publication of WO2021005952A1 publication Critical patent/WO2021005952A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto

Definitions

  • the present invention relates to an optical sensor and a proximity sensor including the optical sensor.
  • Such a sensor includes, for example, a proximity sensor having a tactile sensor function, as described in Patent Document 1.
  • Patent Document 1 discloses a composite sensor for attaching to the fingertip surface of a robot hand that grips an object.
  • the composite sensor of Patent Document 1 irradiates a flexible plate-shaped portion that transmits light, a light receiving portion arranged on the flexible plate-shaped portion, and a flexible plate-shaped portion from the back surface of the light receiving portion. It is composed of a light emitting unit and an electric circuit that controls a light emitting / receiving unit.
  • An elastic body is covered on the light receiving portion, and a light shielding layer that allows light from the light emitting portion to pass through is provided on the back surface side of the flexible plate-shaped portion in which the light receiving portion is arranged. ..
  • An object of the present invention is to provide an optical sensor and a proximity sensor that reduce the influence of ambient light.
  • the optical sensor according to the present invention includes a light emitting element that emits light and A light receiving element that receives the emitted light from the light emitting element and A first resin body that seals the light emitting element and the light receiving element, transmits the light emitted from the light emitting element, and emits the light to the outside.
  • a wavelength filter that transmits the wavelength of the emitted light from the light emitting element between the light receiving element and the outer surface of the first resin body and absorbs the light on the short wavelength side with respect to the peak wavelength of the emitted light. , Equipped with.
  • the proximity sensor according to the present invention is A light emitting element that emits light, a light receiving element that receives the light emitted from the light emitting element, the light emitting element, and the light receiving element are sealed, and the light emitted from the light emitting element is transmitted and emitted to the outside.
  • the wavelength of the emitted light from the light emitting element is transmitted between the first resin body, the light receiving element, and the outer surface of the first resin body, and is on the short wavelength side with respect to the peak wavelength of the emitted light.
  • An optical sensor with a wavelength filter that absorbs light, It includes a control unit that detects the proximity and contact of an object based on the signal of the light receiving element.
  • optical sensor it is possible to provide an optical sensor and a proximity sensor with reduced influence of ambient light.
  • FIG. 2A a vertical sectional view taken along the line IIB.
  • Diagram to illustrate the detection of proximity of an object Diagram to illustrate the detection of the load of an object Graph showing the amount of light received by the light receiving part during the proximity and contact process of an object
  • a graph showing the total output of the light receiving part during the proximity and contact process of an object The figure for demonstrating the deformation example of the internal structure of an optical sensor
  • each embodiment is an example, and partial replacement or combination of the configurations shown in different embodiments is possible.
  • the modified example the description of the matters common to those of the first embodiment will be omitted, and only the differences will be described. In particular, similar actions and effects with the same configuration will not be mentioned sequentially for each embodiment.
  • FIG. 1 is a diagram for explaining an outline of the proximity sensor 1 according to the first embodiment.
  • FIG. 2A shows a top view of the optical sensor 3.
  • FIG. 2B shows a vertical cross-sectional view of the optical sensor 3.
  • the proximity sensor 1 includes an optical sensor 3, a drive unit 15, an amplifier circuit unit 17, and a control unit 19.
  • the proximity sensor 1 can be applied to applications in which various objects to be gripped are objects to be sensed, for example, in a robot hand.
  • the optical sensor 3 includes a light emitting element 5, a light receiving unit 7, a substrate 9, a first resin body 11, and a second resin body 13.
  • the first resin body 11 is an example of a cover member arranged so as to cover the light emitting element 5 and the light receiving portion 7.
  • the direction in which the first resin body 11 protrudes is referred to as the “Z direction”, and the two directions orthogonal to the Z direction and orthogonal to each other are referred to as the “X direction” and the “Y direction”.
  • the positive direction of Z is upward, and the negative direction of Z is downward.
  • the optical sensor 3 of the first embodiment causes the light emitting element 5 to emit light inside the second resin body 13, and transmits the reflected light transmitted through the second resin body 13 and the first resin body 11 and reflected by the object. Detected by the light receiving unit 7, the light receiving unit 7 outputs a light receiving signal P1 according to the amount of light received.
  • the light emitting element 5 is, for example, a solid-state light emitting element such as a surface emitting laser (VCSEL) or an LED.
  • a surface emitting laser is used as the light emitting element 5
  • a laser having a narrow emission angle can be emitted.
  • the offset of the light receiving unit 7 can be reduced, and the S / N can be improved.
  • the light emitting element 5 may be a solid-state light emitting element other than the surface emitting laser and the LED.
  • the optical sensor 3 may include a collimating lens that collimates the light from the light emitting element 5.
  • the light emitting element 5 emits light having a wavelength in the near infrared region, for example.
  • the peak wavelength of the light emitted from the light emitting element 5 is included, for example, between 700 nm and 1000 nm, and here is 850 nm.
  • Light whose peak wavelength is included in this range can be received by a light receiving element made of Si-based material.
  • the light receiving unit 7 detects the amount of reflected light reflected by the object Bt (see FIG. 4) from the light emitted from the light emitting element 5.
  • the light receiving unit 7 that detects the reflected light includes, for example, a light receiving element composed of a photodiode (PD).
  • the light receiving unit 7 includes at least one light receiving element. In FIG. 1, the light receiving unit 7 includes four light receiving elements 7a to 7d.
  • the light receiving unit 7 receives light and generates a light receiving signal P1 indicating the light receiving result.
  • the generated light receiving signal P1 is transmitted to the amplifier circuit unit 17.
  • the light receiving unit 7 is not limited to the photodiode, and may include various light receiving elements such as a position detection element (PSD) or a CMOS image sensor (CIS).
  • the substrate 9 is, for example, a resin substrate.
  • the substrate 9 supports the light emitting element 5 arranged on the same plane and the light receiving elements 7a to 7d of the light receiving unit 7.
  • the light emitting element 5 is arranged at the center of the disk-shaped substrate 9.
  • the four light receiving elements 7a to 7d of the light receiving unit 7 are arranged so as to surround the light emitting element 5 around the light emitting element 5, and two of the four light receiving elements are paired with the light receiving elements 7a and 7d, and 7b and 7c. Are arranged diagonally.
  • the substrate 9 supports a second resin body 13 that seals the light emitting element 5 and the light receiving portion 7, and a first resin body 11 that covers the side portions and the upper portion of the second resin body 13. Since the light emitting element 5 and the light receiving elements 7a to 7d are arranged on the same plane, the optical sensor 3 can be miniaturized and reduced in height.
  • the first resin body 11 seals the second resin body 13 including the light emitting element 5 and the light receiving portion 7.
  • the first resin body 11 is formed in, for example, a rotating body shape, and has, for example, a truncated cone shape.
  • the first resin body 11 having a truncated cone shape is arranged so that its central axis coincides with the central axis of the second resin body 13 having a cylindrical shape, and the substrate 9 includes the second resin body 13 inside.
  • the first resin body 11 is formed of an elastic body that deforms in response to an external force such as an external stress.
  • the first resin body 11 is made of, for example, a silicone-based or epoxy-based resin.
  • the diameter of the lower surface of the first resin body 11 is, for example, 0.5 to 50 mm.
  • the diameter of the upper surface of the first resin body 11 is equal to or smaller than the diameter of the lower surface.
  • the thickness Th1 of the first resin body 11 is the thickness from the upper surface of the substrate 9 to the outer surface of the first resin body 11 in the central axis direction of the emitted light of the light emitting element 5.
  • the thickness Th1 of the first resin body 11 is, for example, 5 mm.
  • the second resin body 13 seals the light emitting element 5 arranged on the substrate 9 and the light receiving portion 7.
  • the side surface and the upper surface of the second resin body 13 are covered with the first resin body 11.
  • the second resin body 13 is formed in, for example, a rotating body shape, and has, for example, a cylindrical shape. In the second resin body 13 having a cylindrical shape, the light emitting element 5 is located at the center thereof.
  • the second resin body 13 includes light receiving elements 7a to 7d surrounding the light emitting element 5, and is provided on the substrate 9.
  • the second resin body 13 is formed of a silicone-based resin containing a wavelength filter that cuts a wavelength region on the lower wavelength side than the peak wavelength of the light emitted from the light emitting element 5.
  • silicone-based resins examples include modified silicones having an organic substituent other than a methyl group and a phenyl group as substituents, and more specifically, for example, AIR-7051A / B manufactured by Shinetsu Silicone Co., Ltd. Can be mentioned.
  • the diameter of the second resin body 13 is smaller than the diameter of the lower surface of the first resin body 11.
  • the thickness Th2 of the second resin body 13 is thicker than the thickness of the light emitting element 5 and the light receiving elements 7a to 7d.
  • the shape of the second resin body 13 may be a rectangular parallelepiped, a truncated cone shape, or a hemispherical shape in addition to the above-mentioned shapes.
  • FIG. 3 is a graph showing an example of the light transmittance of the second resin body 13. Due to the second resin body 13, the transmittance of light in the wavelength region from the near ultraviolet region to 680 nm is almost zero, and ambient light mainly in the visible light wavelength region of about 380 nm to 780 nm is incident on the light receiving unit 7. Can be significantly reduced. In such a wavelength filter, for example, the transmittance of light on the short wavelength side from the peak wavelength is 10% or less with respect to the transmittance of the peak wavelength emitted from the light emitting element 5.
  • the second resin body 13 also attenuates the peak wavelength of the light emitted from the light emitting element 5 by about 10%.
  • the thickness Th2 of the second resin body 13 is small, the light emitted from the light emitting element 5 is reflected by the object Bt and is incident on the light receiving portion 7, and the attenuation of the light in the second resin body 13 is suppressed.
  • the light receiving sensitivity can be increased.
  • the thickness Th2 of the second resin body 13 is smaller than, for example, the thickness Th3 which is the difference between the thickness Th1 of the first resin body 11 and the thickness Th2 of the second resin body 13.
  • the thickness Th3 is small, the absorption of the light emitted from the light emitting element 5 and reflected by the object Bt is reduced, which is useful for improving the accuracy of the proximity sensor. Further, when the thickness Th3 is large, the deformable range of the first resin body 11 by pushing after the object Bt comes into contact with the first resin body 11 is large, so that the detection range of the pushing amount of the object Bt is expanded. Can be done. Therefore, it is useful for improving the function as a contact sensor.
  • the thickness Th2 is the thickness from the upper surface of the substrate 9 to the outer surface of the second resin body 13 in the central axis direction of the emitted light of the light emitting element 5.
  • the thickness Th2 can be said to be the shortest distance from the upper surface of the substrate 9 to the interface between the first resin body 11 and the second resin body 13 by the light emitted from the light emitting element 5.
  • the second resin body 13 has, for example, a cylindrical shape or a truncated cone shape, it is the length of the rotation center axis of the second resin body 13.
  • the thickness Th2 is the length of the radius.
  • the second resin body 13 is harder than the first resin body 11.
  • the hardness of the first resin body 11 is, for example, shore A20 to shore A80, and for example, shore A30 to shore A50.
  • the hardness of the second resin body 13 is, for example, shore D40 to shore D90, and for example, shore D60 to shore D80.
  • the glass transition temperature Tg2 of the second resin body 13 may be higher than the glass transition temperature Tg1 of the first resin body 11.
  • the glass transition temperature Tg2 of the second resin body 13 is 50 ° C. or higher. In this case, even if the optical sensor 3 is used in a high temperature environment, the deformation of the second resin body 13 can be prevented and the load of the object Bt can be detected.
  • first resin body 11 and the second resin body 13 are made of the same material, the adhesion between the first resin body 11 and the second resin body can be improved. As a result, even if an environmental load, a repeated load from the object Bt over a long period of time, or an excessive load is applied, the occurrence of peeling is suppressed at the resin interface between the first resin body 11 and the second resin body 13. It is possible to realize a sensor having excellent durability and reliability.
  • Both the first resin body 11 and the second resin body 13 can be formed of, for example, a silicone-based material.
  • the first resin body 11 is formed of, for example, methyl silicone in which all the substituents are composed of methyl groups, or phenyl silicone in which the substituents are composed of methyl groups and phenyl groups.
  • the second resin body 13 is formed of, for example, a modified silicone having an organic substituent other than a methyl group and a phenyl group as a substituent.
  • the drive unit 15 supplies electric power to the light emitting element 5 according to the timing signal from the control unit 19 to drive the light emitting element 5. As a result, the light emitting element 5 can emit light at a predetermined cycle.
  • the amplifier circuit unit 17 amplifies the light receiving signal P1 detected by each light receiving element 7a-7d of the light receiving unit 7 and transmits it to the control unit 19.
  • the control unit 19 analyzes the light receiving signal P1 from the light receiving unit 7 to detect the proximity and load of the object Bt. Further, the control unit 19 controls the light emission cycle of the light emitting element 5 and the light detection cycle of the light receiving unit 7.
  • the control unit 19 is composed of a CPU, a microprocessor, or an FPGA.
  • the optical sensor 3 may be provided as a module separate from the drive unit 15, the amplifier circuit unit 17, and the control unit 19.
  • FIG. 4 illustrates a state in which the object Bt is close to the optical sensor 3.
  • the optical sensor 3 of the first embodiment performs proximity sensing in which the state in which the object Bt is spaced near the first resin body 11 is sensed from the light receiving signal P1.
  • the light emitting element 5 emits light L1 inside the second resin body 13 as illustrated in FIG.
  • the light L1 emitted from the light emitting element 5 passes through the second resin body 13 and the first resin body 11 and is reflected on the object Bt to generate the reflected light L2.
  • the reflected light L2 passes through the first resin body 11 and the second resin body 13 again and is incident on the light receiving portion 7.
  • the reflected light L2 is diffused toward the light receiving unit 7.
  • the light receiving elements 7a-7d are designed so that the diameter Ls of the spot size of the reflected light L2 is larger than the arranged diameter Ld between the light receiving elements 7b-7c or 7a-7d facing each other of the light receiving unit 7.
  • FIG. 5 illustrates a state in which the object Bt comes into contact with the optical sensor 3 and is pushed further downward.
  • the first resin body 11 of the optical sensor 3 is deformed so as to expand laterally (in the XY plane direction) according to the contact force acting in contact with the object Bt.
  • the optical sensor 3 outputs a light receiving result that changes in response to such deformation as a light receiving signal P1 to perform tactile sensing that senses various contact forces in addition to the proximity sensing described above.
  • FIG. 6 is a graph showing the amount of light received by the light receiving unit 7 during the proximity and contact process of the object Bt.
  • the graph shows the case where the object Bt is brought closer to the optical sensor 3 from a place about 13 mm away from the upper surface of the optical sensor 3, and even after the object Bt comes into contact with the upper surface of the first resin body 11 of the optical sensor 3, it is pushed further.
  • the change of the output value of the optical sensor 3 is shown.
  • circles indicate changes in the amount of light received by the light receiving unit 7 when the illuminance of the ambient light irradiating the optical sensor 3 is 150 lux.
  • the x mark indicates a change in the amount of light received by the light receiving unit 7 under the condition that the illuminance of the ambient light is 3000 lux.
  • 3000lux is the result of positively irradiating the optical sensor 3 with indoor lighting such as a fluorescent lamp as an example of increasing the influence of ambient light.
  • the section La shows the process from the upper side of the optical sensor 3 to the contact with the upper surface of the first resin body 11 of the optical sensor 3 in the process of the object Bt approaching the optical sensor 3.
  • the diameter Ls of the spot size of the reflected light L2 in this section La is larger than the arrangement diameter Ld of the light receiving elements 7a-7d.
  • the control unit 19 can estimate the distance from the optical sensor 3 to the object Bt.
  • the light receiving element 7a-7d has the arrangement diameter Ld of the light receiving element 7a-7d and the reflected light when the object Bt just contacts the upper surface of the first resin body 11. It is designed so that the diameter Ls of the spot size of L2 is equal to that of the spot size Ls. As a result, when the object Bt just comes into contact with the optical sensor 3, the amount of light received by the light receiving unit 7 is maximized. Therefore, the contact between the object Bt and the optical sensor 3 can be detected by detecting the inflection point of the change in the amount of light.
  • the section Lc indicates a section from when the object Bt comes into contact with the upper surface of the first resin body 11 until it is further pushed down. After the object Bt comes into contact with the upper surface of the first resin body 11, the more the object Bt pushes down the first resin body 11, the more the spot size diameter Ls of the reflected light L2 is larger than the arrangement diameter Ld of the light receiving element 7a-7d. Also becomes smaller, so the amount of light to be detected decreases.
  • the tactile sensation is sensed by the light receiving signal P1 from the light receiving unit 7.
  • various contact forces can be detected by analyzing the received light signal P1.
  • a known technique can be appropriately applied.
  • the optical sensor 3 according to the first embodiment is a sensor that is extremely less susceptible to the influence of the ambient light. Shown.
  • FIG. 7 is a graph showing the total output of the light receiving unit 7 in the proximity and contact process of the object Bt when the reflecting surface of the object Bt is a mirror surface.
  • the graph Ps1 showing the total output of the four light receiving elements 7a-7d gradually increases in the section La where the object Bt approaches the upper surface of the first resin body 11, and the object Bt is on the upper surface of the first resin body 11. It becomes an inflection point at the position Lb where it just contacts, and gradually decreases in the section Lc where the object Bt pushes down the upper surface of the first resin body 11.
  • the graph Fs1 showing the load applied to the first resin body 11 is calculated by the control unit 19.
  • the graph Fs1 showing the load increases in the interval Lc.
  • FIG. 8 is a graph showing the total output of the light receiving unit 7 in the proximity and contact process of the object Bt when the reflecting surface of the object Bt is a scatterer.
  • the absolute value of the reflected light amount is smaller than that in the case of a mirror surface.
  • the reflected light L2 passes through the object Bt ⁇ air ⁇ the first resin body 11 and their respective media.
  • the object Bt comes into contact with the optical sensor 3 as in the position Lb and the section Lc, the object Bt ⁇ the first resin body 11.
  • the air layer disappears in the optical path at the position Lb and the section Lc, the reflection conditions change greatly, and when the reflection surface of the object Bt is a scatterer, the influence is particularly large.
  • the spot size of the reflected light does not easily decrease even if the object Bt approaches the light receiving portion 7, so that the object The closer the Bt is to the light receiving unit 7, the more the reflected light amount increases.
  • the light emitting element 5 that emits light
  • the light receiving element 7a-7d that receives the light emitted from the light emitting element 5
  • the light emitting element 5 and the light receiving element 7a- Between the first resin body 11 that seals the 7d and transmits the light emitted from the light emitting element 5 and emits it to the outside, and the light receiving element 7a-7d and the outer surface 11a of the first resin body 11.
  • a wavelength filter that transmits the wavelength of the emitted light from the light emitting element 5 and absorbs the light on the short wavelength side with respect to the peak wavelength of the emitted light is provided.
  • a wavelength filter that transmits the wavelength of the emitted light of the light emitting element 5 and cuts the wavelength of light on the shorter wavelength side than the peak wavelength of the emitted light is between the light receiving element 7a-7d and the outer surface 11a of the first resin body 11. It is in.
  • the first resin body 11 that is deformed according to the distance from the change in the amount of reflected light to the object Bt and the force applied to the sensor is transmitted without being affected by the disturbance light and the light transmission of the object Bt.
  • the reflected light can be detected accurately.
  • the second resin body 13 may seal the light emitting element 5 and the light receiving element 7a-7d, and the second resin body 13 may be harder than the first resin body 11. According to this configuration, the hardness of the resin of the second resin body 13 that directly seals the light emitting element 5 and the light receiving element 7a-7d is high, and the periphery thereof is covered with the first resin body 11, which is a flexible resin. As a result, it is possible to reduce the direct influence of the strain due to the external force on the light emitting element 5 and the light receiving element 7a-7d, enhance the overload resistance, and improve the durability.
  • the second resin body 13 may contain the same material as the first resin body 11. Since the first resin body 11 and the second resin body 13 are made of the same material system, the adhesive force between the resins is strong, and the resin is hard to peel off due to strong external force, repeated external force, and environmental load. Therefore, the reliability during long-term operation can be improved.
  • the optical sensor 3 includes the second resin body 13, but the optical sensor 3 is not limited to this.
  • the light emitting element 5 and the light receiving portion 7 may be directly sealed by the first resin body 11A.
  • the first resin body 11A includes, in addition to the characteristics of the first resin body 11 of the first embodiment, a wavelength filter that absorbs a wavelength on the short wavelength side instead of the second resin body 13. It may have wavelength filter performance.
  • the first resin body 11A is made of AIR-7051A / B manufactured by Shinetsu Silicone Co., Ltd.
  • the optical sensor 3 includes the second resin body 13, but the optical sensor 3 is not limited to this.
  • the optical sensor 3B may be provided with a bandpass filter 23 on the light receiving surface of the light receiving elements 7a to 7d of the light receiving unit 7.
  • the bandpass filter 23 is, for example, a thin film formed by vapor deposition.
  • the thin film is, for example, SiO 2 or SiN.
  • the bandpass filter 23 is a thin film, the bandpass filter 23 with an accuracy of about ⁇ 60 nm with respect to the peak wavelength of the light emitting element 5 can be formed, so that the noise immunity to ambient light can be further improved.
  • the number of light emitting elements is not particularly limited to one, and a plurality of light emitting elements may be adopted. Further, the position of the light emitting element 5 is not limited to the center, and can be appropriately set to various positions.
  • the light receiving elements 7b and 7c are located on both sides of the light emitting element 5 in the X direction.
  • the position of the light receiving unit 7 is not limited to the straight line centered on the light emitting element 5, and can be appropriately set to various positions.
  • the light receiving unit 7 may be configured by arranging a plurality of light receiving elements around the light emitting element 5. Further, instead of the plurality of light receiving elements, a plurality of light emitting elements 5 may be caused to emit light from a plurality of positions in a time division manner as a light emitting unit, and sensing by the optical sensor 3 may be performed.
  • the shape of the first resin body 11 of the optical sensor 3 is not limited to the rotating body, and may be formed by using various curved surfaces such as a spherical surface.
  • the side portion of the second resin body 13 is also covered with the first resin body 11, but the present invention is not limited to this.
  • the side portion of the second resin body 13 may be exposed to the outside.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
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  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

L'invention concerne un capteur optique (3) pourvu : d'un élément électroluminescent (5) destiné à émettre de la lumière; d'éléments de réception de lumière (7a-7d) destinés à recevoir la lumière émise par l'élément électroluminescent (5); d'un premier corps en résine (11) encapsulant l'élément électroluminescent (5) et les éléments de réception de lumière (7a-7d), le premier corps en résine (11) transmettant la lumière émise par l'élément électroluminescent (5) et émettant la lumière émise vers l'extérieur; et d'un filtre de longueur d'onde disposé entre les éléments de réception de lumière (7a-7d) et une surface externe (11a) du premier corps en résine (11), le filtre de longueur d'onde transmettant une longueur d'onde de la lumière émise par l'élément électroluminescent (5) et absorbant la lumière du côté de la plus courte longueur d'onde par rapport à une longueur d'onde de pic de la lumière émise.
PCT/JP2020/023039 2019-07-10 2020-06-11 Capteur optique et capteur de proximité le comprenant WO2021005952A1 (fr)

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JP2019-128195 2019-07-10

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Publication number Priority date Publication date Assignee Title
US20220406762A1 (en) * 2021-06-16 2022-12-22 Advanced Semiconductor Engineering, Inc. Semicondutor package, wearable device, and temperature detection method

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JP2000357816A (ja) * 1999-06-15 2000-12-26 Sharp Corp 光結合装置
JP2016162895A (ja) * 2015-03-02 2016-09-05 株式会社東芝 光結合装置および絶縁装置
US20170052277A1 (en) * 2015-08-21 2017-02-23 Stmicroelectronics Pte Ltd Molded range and proximity sensor with optical resin lens
WO2017099022A1 (fr) * 2015-12-10 2017-06-15 京セラ株式会社 Substrat de capteur et dispositif de capteur
JP2018019013A (ja) * 2016-07-29 2018-02-01 コーデンシ株式会社 光センサ

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Publication number Priority date Publication date Assignee Title
JP2000357816A (ja) * 1999-06-15 2000-12-26 Sharp Corp 光結合装置
JP2016162895A (ja) * 2015-03-02 2016-09-05 株式会社東芝 光結合装置および絶縁装置
US20170052277A1 (en) * 2015-08-21 2017-02-23 Stmicroelectronics Pte Ltd Molded range and proximity sensor with optical resin lens
WO2017099022A1 (fr) * 2015-12-10 2017-06-15 京セラ株式会社 Substrat de capteur et dispositif de capteur
JP2018019013A (ja) * 2016-07-29 2018-02-01 コーデンシ株式会社 光センサ

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