WO2021002540A1

WO2021002540A1 - Mems microphone package

Info

Publication number: WO2021002540A1
Application number: PCT/KR2019/014472
Authority: WO
Inventors: 윤상영; 민철규
Original assignee: 주식회사 파트론
Priority date: 2019-07-03
Filing date: 2019-10-30
Publication date: 2021-01-07

Abstract

The present invention relates to a microphone and, more particularly, to a MEMS microphone. A microphone according to an example of the present invention comprises: a case including a side wall and an upper wall, and having an open lower side; a substrate coupled to the lower side of the case; a MEMS transducer positioned on the substrate and converting sound waves input from the outside into an electrical signal; and a signal processing unit provided on the substrate and amplifying and outputting the electrical signal input from the MEMS transducer, wherein the case is fixed to the substrate by an adhesive layer, and the adhesive layer is positioned between the substrate and the case and includes a metal layer containing tin (Sn) and an insulating layer covering the surface of the metal layer and containing an epoxy-based material.

Description

MEMS microphone package

The present invention relates to a microphone, and more particularly to a MEMS microphone.

Microphones are essentially used in mobile communication terminals.

Traditional condenser microphones consist of a diaphragm/backplate pair that forms a capacitor (C) that changes in response to the sound pressure caused by externally generated sound waves, and a field effect transistor (JFET) to buffer the output signal. .

In this conventional condenser microphone, the diaphragm, spacer ring, insulation ring, back plate, and current-carrying ring are sequentially inserted into one case, and finally, a printed circuit board on which circuit components are mounted, and the end of the case is inserted into a printed circuit. It was bent toward the substrate and completed into one assembly.

On the other hand, recently, a semiconductor processing technology using micromachining has been applied as a technology used to integrate micro-devices into a microphone.

This technology, called MEMS (Micro Electro Mechanical System), can fabricate microscopic sensors, actuators, and electromechanical structures in µm units by using a semiconductor process, especially a micromachining technology applying integrated circuit technology.

The MEMS microphone manufactured using this micromachining technology is manufactured by miniaturization, high performance, multifunctionalization, and integration of conventional microphone components such as a conventional diaphragm, spacer ring, insulation ring, back plate, and current-carrying ring through ultra-precise fine processing. As a result, there is an advantage that stability and reliability can be improved.

Such a MEMS microphone is composed of a printed circuit board on which electrodes are patterned, a MEMS chip, a semiconductor (ASIC) chip, and a case.

Here, the case may be adhered to the printed circuit board with a solder paste containing tin (Sn) and flux.

However, during the process of bonding the case and the printed circuit board to each other, due to the expulsion of the flux, a problem may occur in which the flux splashes into the case. And this flux can be scattered again during the reflow process of mounting the microphone on the product.

Due to the scattering of the flux, there may be a problem that the flux is buried on the MEMS chip or splashed onto the patterning electrode of an adjacent printed circuit board. This may cause a decrease in the reliability of the microphone.

An object of the present invention is to provide a microphone that solves the decrease in reliability of the microphone due to the scattering of flux by improving the material and structure of the adhesive layer that adheres the case to the substrate.

A microphone according to an example of the present invention includes a case including a side wall and an upper wall, and an open lower side thereof; A substrate coupled to the lower side of the case, a MEMS transducer positioned on the substrate and converting sound waves input from the outside into electrical signals; It is provided on the substrate and includes a signal processing unit that processes and outputs an electrical signal input from the MEMS transducer, and the case is fixed to the substrate by an adhesive layer, and the adhesive layer is formed of a metal layer and a metal layer electrically connecting the substrate and the case. It covers at least a portion of the surface and includes an insulating layer made of an epoxy-based material.

The insulating layer may not contain flux.

The adhesive layer is further located on the sidewall of the case adjacent to the substrate and on the non-overlapping area of the substrate in which the sidewall of the substrate and the case do not overlap, the metal layer and the insulating layer are located together on the sidewall of the case adjacent to the substrate, and the metal layer is not located in the non-overlapping area. Instead, the insulating layer may include a portion in contact with the substrate.

Here, the thickness of the insulating layer may become thicker as it progresses from the sidewall of the case adjacent to the substrate toward the end of the non-overlapping region of the substrate.

In addition, the width of the portion where the insulating layer contacts the substrate may be greater than the thickness of the insulating layer positioned on the sidewall of the case adjacent to the substrate.

In addition, the curing temperature of the adhesive layer may be between 130 ℃ ~ 350 ℃.

Here, the curing temperature of the insulating layer may be higher than the curing temperature of the metal layer. For example, the curing temperature of the insulating layer may be higher than the curing temperature of the metal layer by 5°C to 20°C.

An acoustic hole through which sound waves are input may be provided on an upper wall of the substrate or case.

In the microphone according to the exemplary embodiment of the present invention, the reliability of the microphone can be prevented from deteriorating by eliminating the scattering phenomenon of the flux when the adhesive layer is formed or when the microphone is mounted on a product by including an epoxy-based material in the adhesive layer instead of the flux.

In addition, in the microphone according to an exemplary embodiment of the present invention, an insulating layer including an epoxy-based material is formed to prevent a short circuit between a metal layer included in the adhesive layer and a surrounding structure, thereby preventing defects.

1 shows an example of the appearance of a microphone according to the present invention.

2 is an exploded perspective view of the microphone shown in FIG. 1.

FIG. 3 is an example of a cross section of the microphone shown in FIG. 1 cut in the direction of I-I.

4 is an example of an enlarged view of a portion K1 in FIG. 3.

5 is a flow chart for explaining an example of a method of forming an adhesive layer shown in FIG. 4.

6 is a diagram for describing each step according to the flow chart of FIG. 5 in relation to temperature.

7 is a diagram for explaining another example of a microphone according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is determined that adding a detailed description of a technology or configuration already known in the relevant field may make the subject matter of the present invention unclear, some of these will be omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express embodiments of the present invention, and these may vary according to related people or customs in the field. Accordingly, definitions of these terms should be made based on the contents throughout the present specification.

Hereinafter, a microphone according to the present invention will be described with reference to the accompanying drawings.

1 is a diagram showing an example of the external appearance of the microphone according to the present invention, FIG. 2 is an exploded perspective view of the microphone shown in FIG. 1, and FIG. 3 is a cross-sectional view of the microphone shown in FIG. 1 cut in the direction Ⅰ-Ⅰ. Yes.

The microphone according to the present invention may be a MEMS microphone equipped with a MEMS transducer (300), and is a device that converts sound waves such as voice, sound, sound, etc. into electric signals, and is mainly used for mobile phones, smartphones, and small acoustic devices. Can be used.

In FIGS. 1 to 3, a case where the sound hole H200 through which sound waves are introduced from the outside is formed in the substrate 200 is described as an example, but the present invention is not necessarily limited thereto, and the sound hole H100 is the case 100 ) Is also possible. A case in which the sound hole H100 is provided in the case 100 will be described with reference to FIG. 7.

The microphone of the present invention can be mainly used in mobile communication terminals such as mobile phones and smart phones.

However, the use is not necessarily limited thereto, and can be applied to all small electronic devices using a small MEMS microphone.

A microphone according to an example of the present invention may include a case 100, a substrate 200, a MEMS transducer 300, and a signal processing unit 400 as shown in FIGS. 1 to 3.

As shown in FIG. 1, the external shape of the microphone may be formed by bonding the substrate 200 to the lower side of the case 100.

The case 100 may include a side wall 103 and an upper wall 101 as shown in FIG. 3, and the lower side may be open. Specifically, the case 100 may be provided with four sidewalls 103 in a vertical direction at the edge of the upper wall 101, each of the four sidewalls 103 is provided in a rectangular shape, and four sidewalls The lower side of 103 can be open. Accordingly, the case 100 may be provided in a rectangular parallelepiped shape with an open lower side.

Such a case 100 includes a material of a metal component, and may play a role of electrically shielding the internal space of the microphone, and for this purpose, the case 100 is opened by an adhesive layer 500 including a metal material. The lower side of the substrate 200 may be adhered to the S200 line.

Here, although not shown in FIG. 2, a case connection electrode (not shown) that is electrically connected to the case 100 and grounds the case 100 may be patterned on the edge line S200 of the substrate 200. have. Accordingly, the case 100 is connected to the case connection electrode (not shown) formed on the substrate 200 by an adhesive layer 500 including a metal material, thereby electrically shielding the internal space of the microphone.

Such an adhesive layer 500 is located between the substrate 200 and the case 100 and covers at least a portion of the surface of the metal layer 501 and the metal layer 501 including tin (Sn), and includes an epoxy-based material. , It may include an insulating layer 503 that does not contain a flux. A detailed description of this will be given below in FIG. 4.

The substrate 200 may be a printed circuit board (PCB) in which the electrode E200 is patterned on the upper surface of the substrate 200, as shown in FIGS. 2 and 3. It can be joined to the lower side.

In this way, the case 100 and the substrate 200 with the lower side open are combined, and the MEMS transducer 300 and the signal processing unit 400 may be located between the case 100 and the substrate 200. A space may be provided, and the MEMS transducer 300 and the signal processing unit 400 may be mounted on the substrate 200 as shown in FIG. 3.

In addition, the electrode (E200) connected to the signal processing unit 400 may be patterned on the substrate 200. The electric signal amplified by the signal processing unit 400 through the patterned electrode E200 may be transmitted to the outside of the microphone.

In addition, an acoustic hole H200 into which sound waves are input may be provided in the substrate 200. Sound waves may be transmitted from the outside to the MEMS inner space E300 through the acoustic hole H200 as described above.

The MEMS transducer 300 may be positioned on the substrate 200 and may include an internal MEMS space E300. When the sound hole H200 is provided on the substrate 200, the MEMS transducer 300 may be positioned to overlap the sound hole H200, and the MEMS inner space E300 is Can be connected to.

In addition, the MEMS transducer 300 includes a membrane, which is a diaphragm that converts an acoustic signal corresponding to a vibrational state into an electric signal, and when external sound waves are input to the acoustic hole H200, the MEMS transducer The membrane of the transducer 300 may convert the sound wave into an electrical signal while vibrating by the sound pressure of the sound wave.

Such MEMS transducer 300 may be attached to the substrate 200 by a non-conductive adhesive, die bonding, wire bonding, etc. so as to correspond to the acoustic hole H200, as shown. The electric signal converted by the MEMS transducer 300 may be input to the signal processing unit 400 by being electrically connected to the signal processing unit 400 through the same conductive wire L1.

The signal processing unit 400 may be provided on the substrate 200 and may amplify and output an electrical signal input from the MEMS transducer 300. To this end, the signal processing unit 400 may be configured as, for example, an application-specific integrated circuit (ASIC), but the present invention is not limited thereto.

The signal processing unit 400 may be mounted on the substrate 200 by a non-conductive adhesive, die bonding, wire bonding, or the like.

The electrical signal deposited by the signal processing unit 400 may be connected to the electrode E200 patterned on the substrate 200 through a conductive wire L2 and may be output to the outside of the microphone.

The microphone according to an example of the present invention includes an adhesive layer 500 for bonding the case 100 to the substrate 200. The adhesive layer 500 includes a metal layer 501 and an insulating layer 503.

The metal layer 501 may include a conductive metal such as lead (Pb) or tin (Sn).

In addition, the insulating layer 503 is formed to cover the surface of the metal layer 501. In addition, the insulating layer 503 may include an epoxy-based material and may not include a flux.

Through this, when the case 100 is adhered to the substrate 200 with a solder paste including a flux, a scattering phenomenon of the flux generated can be eliminated. Accordingly, it is possible to prevent the fly-product of the flux from adhering to the MEMS transducer 300 and the like and negatively affecting reliability.

In addition, when the case 100 is adhered to the substrate 200 with a solder paste including a flux, the flux may splash onto the patterning electrode E200 of the adjacent substrate 200 due to the flux scattering. In this case, a problem may occur, such as the flux affecting the electrical signal transmission of the patterning electrode E200.

However, when the case 100 is adhered to the substrate 200 using the adhesive layer 500 according to the present invention, the flux does not scatter. By including the insulating layer 503 included in the adhesive layer 500, the possibility that the metal layer 501 of the adhesive layer 500 may be short-circuited with the adjacent patterning electrode E200 can be further reduced. Accordingly, it is possible to solve the reliability problem of the microphone.

In FIG. 3, it is illustrated as an example that the sidewall 103 of the case 100 and the substrate 200 are spaced apart from each other, and an adhesive layer 500 is provided therebetween, but the present invention is not necessarily limited thereto. It is also possible for the sidewall 103 of 100 to directly contact the substrate 200 or a case connection electrode (not shown) provided on the substrate 200.

Hereinafter, for convenience of explanation, as shown in FIG. 3, the sidewall 103 of the case 100 and the substrate 200 are spaced apart from each other, and the adhesive layer between the sidewall 103 and the substrate 200 of the case 100 ( 500) will be described as an example.

The adhesive layer 500 will be described in more detail as follows.

4 is an example of an enlarged view of a portion K1 in FIG. 3.

As shown in FIG. 4, in order to bond between the case 100 and the substrate 200, the adhesive layer 500 may be positioned in an overlapping area OA between the substrate 200 and the case 100. In addition, the adhesive layer 500 is further formed on the sidewall 103 of the case 100 adjacent to the substrate 200 and on a non-overlapping area (NOA) in which the sidewall 103 of the case 100 does not overlap among the substrate 200 Can be.

As shown in FIG. 4, the adhesive layer 500 is a metal layer 501 that electrically connects the case 100 and the substrate 200 to each other, and does not contain a flux, but includes an epoxy-based material. The layer 503 may be provided to coat the surface of the metal layer 501.

Such an adhesive layer 500 may include a metal layer 501 including tin (Sn) and an insulating layer 503 covering the surface of the metal layer 501 and not including flux, as shown in FIG. 4. have.

The insulating layer 503 may include, for example, an epoxy-based material. The epoxy-based material included in the insulating layer 503 is a patterning electrode of the surface of the solder powder forming the metal layer 501 and the substrate 200 connected to the case 100 when forming the adhesive layer 500 By reducing the surface of, it can function to expose the solder powder and the metal surface of the electrode in a clean state.

In addition, when the adhesive layer 500 is cured, the insulating layer 503 including an epoxy-based material coats the metal layer 501 to prevent oxidation of the metal layer 501 and insulate it.

As described above, the insulating layer 503 containing no flux and including an epoxy-based material does not generate a scattering phenomenon, which is an inherent characteristic of the flux, during the heat treatment process, so that the reliability of the microphone signal can be secured.

Here, a metal layer 501 and an insulating layer 503 may be provided together in an adhesive layer positioned on the sidewall 103 of the case 100 adjacent to the substrate 200, and a non-overlapping area NOA on the substrate 200 The metal layer 501 is not positioned in the, and the insulating layer 503 may include a portion that contacts the substrate 200.

Here, the thickness of the insulating layer 503 may increase as it progresses toward the end of the non-overlapping area NOA of the substrate 200 from the sidewall 103 of the case 100 adjacent to the substrate 200. That is, the thickness of the insulating layer 503 positioned on the metal layer 501 may increase as it progresses from the top of the metal layer 501 toward the lower end.

Accordingly, the width W1 of the portion where the insulating layer 503 abuts the substrate 200 is the thickness T1 of the insulating layer 503 positioned on the sidewall 103 of the case 100 adjacent to the substrate 200 Can be greater than

In this way, the width W1 of the portion where the insulating layer 503 abuts the substrate 200 is relatively large, so that the gap between the patterning electrode E200 and the metal layer 501 connected to the signal processing unit 400 is more reliably provided. By insulating, it is possible to more effectively prevent a short circuit.

The curing temperature of the adhesive layer 500 may be between 130°C and 350°C. And the curing temperature of the insulating layer 503 may be higher than the curing temperature of the metal layer 501, for example, the curing temperature of the insulating layer 503 may be higher than the curing temperature of the metal layer 501 by 5 ℃ ~ 20 ℃. I can.

Hereinafter, the heat treatment process of forming the adhesive layer 500 will be briefly described.

FIG. 5 is a flowchart illustrating an example of a method of forming the adhesive layer 500 illustrated in FIG. 4, and FIG. 6 is a diagram illustrating each step according to the flow chart of FIG. 5 in relation to temperature.

In the heat treatment method of forming the adhesive layer 500 according to the present invention, a temperature raising step (S1), a metal layer forming step (S2), an insulating layer forming step (S3), and a descending step (S4) may be formed.

In this way, the adhesive layer 500 may be formed using an epoxy solder paste. In this heat treatment method, after first forming an epoxy solder paste on the edge line S200 of the substrate 200 shown in FIG. 2, the case 100 is brought into contact with the edge line S200 of the substrate 200. Can proceed to the state.

In addition, a case connection electrode (not shown) electrically connected to the case 100 may be formed on the edge line S200 of the substrate 200.

Such an epoxy solder paste contains a solder powder containing tin (Sn) and an insulating powder containing no flux and containing an epoxy-based material, and in addition, a hardener, a solvent, and an additive are further added. Can be included. Here, the curing agent, the solvent, and the additive may be removed by evaporation during the heat treatment process.

Solder powder containing tin (Sn) may be formed as a metal layer 501 through a heat treatment process, and an insulating powder containing no flux and containing an epoxy-based material is formed as an insulating layer 503 through a heat treatment process. Can be.

In the temperature raising step (S1), the temperature of the heat treatment process rises to the first temperature (K1), and the epoxy-based insulating powder is used as the surface oxide of the solder powder and the case connection electrode such as a copper line patterned on the substrate 200. By reducing the oxide, the metal surface from which the oxide has been removed may be exposed on the surface of the solder powder and the case connection electrode electrically connected to the case 100.

Accordingly, the insulating powder sufficiently reduces the solder powder and the metal oxide layer formed on the surface of the case connecting electrode, so that the solid solder powder is melted into a liquid, so that the package lead and the case connecting electrode of the substrate 200 can be sufficiently wetted. have.

In the temperature raising step S1, the shape of the epoxy solder paste formed on the substrate 200 may be maintained. That is, the solder powder and the insulating powder can be maintained in a powder state.

Thereafter, in the metal layer forming step S2, each of the solder powders is melted to change into a liquid state, and each of the liquid solders adjacent to each other is combined with each other due to the surface tension, thereby forming a liquid structure to form the metal layer 501.

In addition, in the metal layer forming step (S2), the viscosity of the insulating powder rapidly decreases, and due to the difference in interfacial energy with the liquid solder, the insulating powder may flow out of the junction of the metal layer 501 formed of the liquid structure.

The metal layer 501 is located on the case connection electrode (not shown) on the substrate 200, but a part of the metal layer 501 is formed on the surface of the sidewall 103 of the case 100 adjacent to the substrate 200 by surface tension. Can be formed.

In addition, the insulating powder including the epoxy-based material pushed to the outside of the metal layer 501 may be partially located on the surface of the substrate 200 and may rise above the metal layer 501 while riding the surface of the metal layer 501.

In the insulating layer forming step (S3), the first temperature (K1) of the metal layer forming step (S2) can be increased to the second temperature (K2), and at the second temperature (K2), the insulating powder containing an epoxy-based material is It is melted and cured, so that the insulating layer 503 may be formed.

If the curing initiation temperature of the insulating powder is lower than or under the same temperature condition as the curing initiation temperature of the solder powder, the insulating powder containing an epoxy-based material interferes with the formation of the liquid structure of the solder forming the metal layer 501. , Electrical connection between the case 100 and the case connection electrode of the substrate 200 may be difficult.

In addition, when the curing start temperature of the insulating powder including the epoxy-based material is set too high than the melting temperature of the solder powder, the reflow peak temperature may increase more than necessary.

However, if the second hardening temperature (K2) of the insulating layer 503 is set higher than the first temperature (K1) at which the metal layer 501 is hardened by 5°C to 20°C, the existing reflow profile Can be applied without changing.

Thereafter, in the descending step S4, the temperature may be continuously decreased to room temperature. Accordingly, it is possible to provide a time for the insulating layer 503 including the epoxy to be completely cured.

The adhesive layer 500 according to the present invention includes an epoxy-based material that performs substantially the same role as the flux instead of the flux during the heat treatment process, thereby removing the scattering shape of the flux generated when using the solder paste containing the flux. Can be done, and thus the reliability of the microphone can be secured.

Until now, the microphone according to an example of the present invention has been described as an example in which an acoustic hole H200 is provided in the substrate 200, but the present invention is not necessarily limited thereto, and the upper wall 101 of the case 100 The same can be applied even when the sound hole H200 is provided in ).

In FIG. 7, descriptions of contents overlapping with those described in FIGS. 1 to 6 will be omitted, and other parts will be mainly described.

Another example of the microphone according to the present invention may include a case 100, a substrate 200, a MEMS transducer 300, and a signal processing unit 400 as shown in FIG. 7.

However, unlike FIGS. 1 to 3, the sound hole H100 may be provided in the upper wall 101 of the case 100.

Even in this case, the adhesive layer 500 connecting the case 100 and the substrate 200 to each other covers the surfaces of the metal layer 501 and the metal layer 501 including tin (Sn), and is insulated without flux. A layer 503 may be included.

Accordingly, the present invention can secure the reliability of the microphone by eliminating the scattering phenomenon.

The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and variations are possible from the perspective of those of ordinary skill in the field to which the present invention belongs. Therefore, the scope of the present invention should be defined by the claims of the present specification as well as those equivalent to the claims.

Claims

A case including a sidewall and an upper wall, and an open lower side thereof;

A substrate coupled to the lower side of the case;

A MEMS transducer located on the substrate and converting sound waves input from the outside into electrical signals;

Includes; a signal processing unit provided on the substrate, processing and outputting the electrical signal input from the MEMS transducer,

The case is fixed to the substrate by an adhesive layer,

The adhesive layer includes a metal layer electrically connecting the substrate and the case, and an insulating layer covering at least a portion of the surface of the metal layer and comprising an epoxy-based material.
The method of claim 1,

The insulating layer is a microphone that does not contain a flux.
The method of claim 2,

The adhesive layer

It is further located on a sidewall of the case adjacent to the substrate and on a non-overlapping region in which the sidewalls of the case and the substrate do not overlap among the substrates,

The metal layer and the insulating layer are positioned together on a sidewall of the case adjacent to the substrate,

A microphone including a portion in which the metal layer is not located in the non-overlapping region and the insulating layer abuts the substrate.
The method of claim 3,

A microphone in which the thickness of the insulating layer becomes thicker as it progresses from the sidewall of the case adjacent to the substrate toward the end of the non-overlapping region of the substrate.
The method of claim 4,

A microphone having a width of a portion where the insulating layer contacts the substrate is greater than a thickness of an insulating layer positioned on a sidewall of the case adjacent to the substrate.
The method of claim 1,

The curing temperature of the adhesive layer is 130 ℃ ~ 350 ℃ microphone.
The method of claim 1,

A microphone having a curing temperature of the insulating layer higher than that of the metal layer.
The method of claim 7,

A microphone having a curing temperature of the insulating layer higher than the curing temperature of the metal layer by 5°C to 20°C.
The method of claim 1,

A microphone having an acoustic hole through which the sound wave is inputted on an upper wall of the substrate or the case.