WO2020258176A1 - 一种差分谐振器及mems传感器 - Google Patents

一种差分谐振器及mems传感器 Download PDF

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Publication number
WO2020258176A1
WO2020258176A1 PCT/CN2019/093340 CN2019093340W WO2020258176A1 WO 2020258176 A1 WO2020258176 A1 WO 2020258176A1 CN 2019093340 W CN2019093340 W CN 2019093340W WO 2020258176 A1 WO2020258176 A1 WO 2020258176A1
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Prior art keywords
resonator
coupling
guide beam
guide
differential
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PCT/CN2019/093340
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English (en)
French (fr)
Inventor
占瞻
李杨
刘雨薇
陈秋玉
张睿
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AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Holdings Nanjing Co Ltd
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Priority to PCT/CN2019/093340 priority Critical patent/WO2020258176A1/zh
Priority to CN201910606444.2A priority patent/CN110311649A/zh
Priority to US16/986,306 priority patent/US11784624B2/en
Publication of WO2020258176A1 publication Critical patent/WO2020258176A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/09—Elastic or damping supports
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733—Structural details or topology
    • G01C19/574—Structural details or topology the devices having two sensing masses in anti-phase motion
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H2009/02283—Vibrating means
    • H03H2009/02291—Beams
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02244—Details of microelectro-mechanical resonators
    • H03H9/02433—Means for compensation or elimination of undesired effects
    • H03H2009/0248—Strain

Definitions

  • a differential resonator and MEMS sensor A differential resonator and MEMS sensor.
  • Differential resonators have a higher quality factor, which can suppress common mode interference such as external acceleration, vibration, and temperature, and can effectively reduce the noise level of the circuit. Therefore, the use of differential motion modes is an optimized mainstream solution to improve the performance of MEMS sensors.
  • the conventional differential resonator 4 includes a first resonator 41, a second resonator 42, a coupling mechanism 43 that connects the first resonator 41 and the second resonator 42, and a substrate 40.
  • the first resonator 41, the second resonator 42, and the coupling mechanism 43 connecting the first resonator 41 and the second resonator 42 are all fixed to the substrate 40, and the first resonator 41 and the second resonator 42 have the same
  • the amplitude-frequency response characteristics that is, it is necessary to ensure that the geometric dimensions of the first resonator 41 and the second resonator 42 are almost identical.
  • the coupling mechanism 43 adopts a rectangular coupling beam.
  • the first resonator 41 and the second resonator 42 are reversely associated with each other by stretching or contracting the rectangular coupling beam.
  • the first resonator 41 and the second resonator 42 are driven by the same external force.
  • the vibration direction is a differential motion mode with mutually reverse displacement ⁇ X.
  • the first resonator 41 and the second resonator 42 will produce different amplitude outputs, that is, the first resonator 41 and the second resonator 42 in the same vibration direction
  • the displacement X A ⁇ X B will force the coupling mechanism 43 to move ⁇ X in the unconstrained X direction. Therefore, the rectangular coupling mechanism has a weak correction effect on the difference between X A and X B. Therefore, the traditional differential resonator has It has disadvantages such as low process robustness, small quality factor, and poor common mode interference suppression.
  • the present invention provides a differential resonator and a MEMS sensor, which aims to improve the quality factor of the differential resonator to enhance the common mode interference suppression capability of the differential resonator.
  • the present invention provides a differential resonator, the differential resonator includes a substrate, a first resonator, a second resonator, and a coupling mechanism.
  • the first resonator communicates with the coupling mechanism through the coupling mechanism.
  • the second resonator is connected, and the first resonator and the second resonator are connected to the substrate and can be displaced relative to the substrate under an external force, and the first resonator and the second resonator
  • the displacement direction of the device is opposite to each other;
  • the coupling mechanism includes a first guide beam, a second guide beam, a first coupling beam, a second coupling beam, a first connecting member, and a second connecting member; wherein, the first guide beam and the second guide beam Arranged on opposite sides of a direction perpendicular to the vibration direction of the first resonator or the second resonator;
  • One end of the first coupling beam is connected to the first guide beam, and the other end is connected to the second guide beam, and the middle of the first coupling beam is connected to the first resonant beam through the first connector ⁇ ; Connect;
  • One end of the second coupling beam is connected to the first guide beam, and the other end is connected to the second guide beam, and the middle of the second coupling beam is connected to the second resonant beam through the second connecting member ⁇ Connectors.
  • one end of the first coupling beam is connected to the middle part of the first guide beam in the vibration direction, and the other end is connected to the middle part of the second guide beam in the vibration direction;
  • One end of the second coupling beam is connected to the middle part of the first guide beam in the vibration direction, and the other end is connected to the middle part of the second guide beam in the vibration direction.
  • the first coupling beam and the second coupling beam are symmetrically arranged along a direction perpendicular to the vibration direction to form an annular coupling beam.
  • the annular coupling beam is a circular coupling beam, a diamond coupling beam or an elliptical coupling beam.
  • the distance between the first coupling beam and the second coupling beam in the vibration direction gradually decreases from the middle to the two sides.
  • the first guide beam and the second guide beam are made of elastic materials.
  • the first guide beam, the second guide beam, the first coupling beam, the second coupling beam, the first connecting piece and the second connecting piece are integrally formed to form the Coupling mechanism.
  • the present invention also provides a MEMS sensor, which includes the aforementioned differential resonator.
  • the differential resonator and MEMS sensor provided by the present invention have the following advantages:
  • first guide beam and the second guide beam By arranging the first guide beam and the second guide beam on opposite sides of the vibration direction of the first resonator or the second resonator.
  • the first resonator connects the first guide beam and the second guide beam through the first coupling beam
  • the second resonator connects the first guide beam and the second guide beam through the second coupling beam, so that the first guide beam and the second guide beam can pass through
  • the guide beam is limited when the first resonator and the second resonator vibrate, so that when the first resonator or the second resonator is driven by an external force to vibrate, the consistency of the amplitude of the two is better.
  • the common mode stiffness of the ring coupling structure is greater than the differential mode stiffness, and the guiding effect of the first guide beam and the second guide beam is used to better suppress the process error and improve the differential resonator Process robustness.
  • FIG. 1 is a schematic diagram of a plane structure of a differential resonator in the prior art
  • FIG. 2 is a schematic diagram of a plane structure of a differential resonator in the prior art in an ideal state
  • FIG. 3 is a schematic diagram of the plane structure of the differential resonator vibration in the prior art in the actual state
  • FIG. 4 is a schematic diagram of a planar structure of a differential resonator provided by the present invention.
  • FIG. 5 is a schematic plan view of a modified structure of the differential resonator of the present invention.
  • FIG. 6 is a schematic plan view of another modified structure of the differential resonator of the present invention.
  • FIG. 7 is a schematic diagram of the planar structure of the vibration of the differential resonator provided by the present invention.
  • the present invention provides a differential resonator 1.
  • the differential resonator 1 includes a substrate 10, a first resonator 11, a second resonator 12, and a coupling mechanism 13.
  • the first resonator 11 passes through the coupling mechanism 13 It is connected to the second resonator 12, and the first resonator 11 and the second resonator 12 are connected to the substrate 10 and can be displaced relative to the substrate 10 under the action of an external force.
  • the first resonator 11 includes a first vibrator 111 and a plurality of first connecting arms 112, and the plurality of first connecting arms 112 are arranged on opposite sides of the first vibrator 111 perpendicular to the vibration direction of the first vibrator 111 for
  • the first vibrator 111 is connected to the substrate 10, and the plurality of first connecting arms 112 are flexible connecting arms.
  • the second resonator 12 includes a second vibrator 121 and a plurality of second connecting arms 122, and the plurality of second connecting arms 122 are arranged on opposite sides of the second vibrator 121 perpendicular to the vibration direction of the second vibrator 121, and the second vibrator 121
  • the vibration direction of is opposite to the vibration direction of the first vibrator 111, and is used to connect the second vibrator 121 with the substrate 10.
  • the plurality of second connecting arms 122 are flexible connecting arms or elastic connecting arms.
  • the coupling mechanism 13 includes a first guide beam 131, a second guide beam 132, a first coupling beam 133, a second coupling beam 134, a first connecting member 135 and a second connecting member 136; wherein, the first guide beam 131 and the second The guide beams 132 are arranged on opposite sides of the direction perpendicular to the vibration direction of the first resonator 11 or the second resonator 12.
  • One end of the first coupling beam 133 is connected to the first guide beam 131, and the other end is connected to the second guide beam 132, and the middle of the first coupling beam 133 is connected to the first resonator 11 through the first connector 135.
  • One end of the second coupling beam 134 is connected to the first guide beam 131, and the other end is connected to the second guide beam 132, and the middle of the second coupling beam 134 is connected to the second resonator 12 through a second connector 136.
  • the first guide beam 131 and the second guide beam 132 are both elastic guide beams made of elastic materials, and one end of the first coupling beam 133 is connected to the middle part of the first guide beam 131 in the vibration direction. The other end is connected to the middle part of the second guide beam 132 in the vibration direction.
  • One end of the second coupling beam 134 is connected to the middle part of the first guide beam 131 in the vibration direction, and the other end is connected to the middle part of the second guide beam 132 in the vibration direction to ensure the first resonator 11 and the second resonance.
  • the amplitude consistency of the device 12 is better.
  • the first coupling beam 133 and the second coupling beam 134 are symmetrically arranged along the direction of the vertical vibration direction to form a ring-shaped coupling beam.
  • the circular coupling beam can be a circular coupling beam, a diamond coupling beam or an elliptical coupling beam.
  • the stiffness of the coupling mechanism 13 is lower than that of the coupling mechanism when the mode is differential. The process error is suppressed and the process robustness of the differential resonator is improved.
  • the distance between the first coupling beam 133 and the second coupling beam 134 in the vibration direction gradually decreases from the middle to the two sides.
  • first guide beam 131, the second guide beam 132, the first coupling beam 133, the second coupling beam 134, the first connecting member 135, and the second connecting member 136 are integrally formed to form the coupling mechanism 13.
  • a first guide beam 131 and a second guide beam 132 are provided on opposite sides of the vibration direction of the first resonator 11 or the second resonator 12.
  • the first resonator 11 is connected to the first guide beam 131 and the second guide beam 132 through the first coupling beam 133
  • the second resonator 12 is connected to the first guide beam 131 and the second guide beam 132 through the second coupling beam 134, so that
  • the first guide beam 131 and the second guide beam 132 limit the position when the first resonator 11 and the second resonator 12 vibrate, so that when the first resonator 11 or the second resonator 12 is driven by external force to vibrate,
  • the consistency of the amplitude of the two is better.
  • the guiding effect of the first guide beam 131 and the second guide beam 132 can prevent the first coupling beam 133 and the second coupling beam 134 from bending in the same direction in the vibration direction.
  • the common mode stiffness of the ring-shaped coupled beam structure is greater than the differential mode stiffness, and the guiding effect of the first guide beam 131 and the second guide beam 132 is used to better suppress process errors and improve the process robustness of the differential resonator 1 Sex.
  • the present invention also provides a MEMS sensor.
  • the aforementioned differential resonator 1 of the MEMS sensor can be a differential accelerometer, a differential gyroscope, or a differential resonant pressure sensor.
  • the differential resonator and MEMS sensor provided by the present invention have the following advantages:
  • first guide beam and the second guide beam By arranging the first guide beam and the second guide beam on opposite sides of the vibration direction of the first resonator or the second resonator.
  • the first resonator connects the first guide beam and the second guide beam through the first coupling beam
  • the second resonator connects the first guide beam and the second guide beam through the second coupling beam, so that the first guide beam and the second guide beam can pass through
  • the guide beam is limited when the first resonator and the second resonator vibrate, so that when the first resonator or the second resonator is driven by an external force to vibrate, the consistency of the amplitude of the two is better.
  • the guiding effect of the first guide beam and the second guide beam can prevent the first coupling beam and the second coupling beam from bending in the same direction in the vibration direction.
  • the ring coupling beam structure is formed by the first coupling beam and the second coupling beam.
  • the common mode stiffness of the ring coupling beam structure is greater than the differential mode stiffness, and the guiding effect of the first guide beam and the second guide beam is used to improve The process error is well suppressed, and the process robustness of the differential resonator is improved.

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  • Acoustics & Sound (AREA)
  • Micromachines (AREA)
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Abstract

一种差分谐振器（1）及MEMS传感器，其中，差分谐振器（1）包括基底（10）、第一谐振器（11）、第二谐振器（12）以及耦合机构（13），第一谐振器（11）通过耦合机构（13）与第二谐振器（12）连接，且第一谐振器（11）和第二谐振器（12）与基底（10）连接并且在外力作用下可相对基底（10）位移，耦合机构（13）包括第一导向梁（131）、第二导向梁（132）、第一耦合梁（133）、第二耦合梁（134）、第一连接件（135）以及第二连接件（136）；其中，第一导向梁（131）和第二导向梁（132）设置于与第一谐振器（11）或第二谐振器（12）的振动方向相垂直的方向的相对两侧；第一耦合梁（133）的一端与第一导向梁（131）连接，另一端与第二导向梁（132）连接，并且第一耦合梁（133）通过第一连接件（135）与第一谐振器（11）连接；第二耦合梁（134）的一端与第一导向梁（131）连接，另一端与第二导向梁（132）连接，并且第二耦合梁（134）通过第二连接件（136）与第二谐振器（12）连接。

Description

一种差分谐振器及MEMS传感器 技术领域
一种差分谐振器及MEMS传感器。
 背景技术
差分谐振器拥有更高品质因数，能够实现抑制外界加速度、振动、温度等共模干扰，并且可以有效降低电路噪声等级。因此，采用差分运动模态是提升MEMS传感器性能的优化主流方案。
如图1-2所示，传统的差分谐振器4包括第一谐振器41，第二谐振器42、连接该第一谐振器41和第二谐振器42的耦合机构43以及基底40，其中，第一谐振器41，第二谐振器42、连接该第一谐振器41和第二谐振器42的耦合机构43均固定于基底40，且第一谐振器41和第二谐振器42拥有相同的幅频响应特性，也即需要确保第一谐振器41与第二谐振器42几何尺寸几乎完全相同。耦合机构43的采用矩形耦合梁，通过矩形耦合梁拉伸或收缩，反向关联第一谐振器41和第二谐振器42，同一外力驱动下实现第一谐振器41和第二谐振器42在振动方向进行相互反向位移△X的差分运动模态。
然而，在差分谐振器4的制造过程中，尚无法做到第一谐振器41和第二谐振器42的几何尺寸几乎完全相同。
如图3所示，在同一外力驱动作用下，第一谐振器41和第二谐振器42会产生不相同的振幅输出，即第一谐振器41和第二谐振器42在同一振动方向上的位移量X A≠X B，将迫使耦合机构43在无约束的X方向产生移动△X，故，矩形耦合机构对X A、X B差异的矫正效果较弱，因此，传统的差分谐振器具有工艺鲁棒性低，品质因数小，共模干扰抑制能力差等缺点。
因此，如何提升差分谐振器的工艺鲁棒性，以增强差分谐振器的品质因数以及共模干扰抑制能力，是本领域技术人员亟待解决的技术问题。
 技术问题
本发明提供了一种差分谐振器及MEMS传感器，旨在提升差分谐振器的品质因数，以增强差分谐振器的共模干扰抑制能力。
 技术解决方案
为实现上述目的，本发明提供了一种差分谐振器，所述差分谐振器包括基底、第一谐振器、第二谐振器以及耦合机构，所述第一谐振器通过所述耦合机构与所述第二谐振器连接，且所述第一谐振器和所述第二谐振器与所述基底连接并且在外力作用下可相对所述基底位移，且所述第一谐振器和所述第二谐振器位移方向互为相反；
所述耦合机构包括第一导向梁、第二导向梁、第一耦合梁、第二耦合梁、第一连接件以及第二连接件；其中，所述第一导向梁和所述第二导向梁设置于与所述第一谐振器或所述第二谐振器的振动方向相垂直的方向的相对两侧；
所述第一耦合梁的一端与所述第一导向梁连接，另一端与所述第二导向梁连接，并且所述第一耦合梁的中部通过所述第一连接件与所述第一谐振器连接；
所述第二耦合梁的一端与所述第一导向梁连接，另一端与所述第二导向梁连接，并且所述第二耦合梁的中部通过所述第二连接件与所述第二谐振器连接。
优选地，所述第一耦合梁的一端与所述第一导向梁在所述振动方向上的中间部位连接，另一端与所述第二导向梁在所述振动方向上的中间部位连接；
所述第二耦合梁的一端与所述第一导向梁在所述振动方向上的中间部位连接，另一端与所述第二导向梁在所述振动方向上的中间部位连接。
优选地，所述第一耦合梁与所述第二耦合梁沿着垂直所述振动方向的方向对称设置，形成环形耦合梁。
优选地，所述环形耦合梁为圆形耦合梁、菱形耦合梁或椭圆形耦合梁。
优选地，所述第一耦合梁和所述第二耦合梁在所述振动方向之间的间距由中间向两侧逐渐递减。
优选地，所述第一导向梁和所述第二导向梁均为弹性材料制成。
优选地，所述第一导向梁、所述第二导向梁、所述第一耦合梁、所述第二耦合梁、所述第一连接件以及所述第二连接件一体成型，形成所述耦合机构。
为实现上述目的，本发明还提供一种MEMS传感器，所述MEMS传感器包括前述的差分谐振器。
 有益效果
与现有技术相比，本发明提供的差分谐振器及MEMS传感器具有以下优点：
1、通过在第一谐振器或第二谐振器的振动方向的相对两侧设置第一导向梁和第二导向梁。第一谐振器通过第一耦合梁连接第一导向梁和第二导向梁，第二谐振器通过第二耦合梁连接第一导向梁和第二导向梁，从而可以通过第一导向梁和第二导向梁在第一谐振器和第二谐振器振动时进行限位，从而使得第一谐振器或第二谐振器在外力驱动从而振动时，两者的振幅的一致性更优。
2、通过设置环形耦合梁结构，利用环形耦合结构的共模刚度大于差模刚度的特点，配合第一导向梁和第二导向梁的导向作用，以更好的抑制工艺误差，提升差分谐振器的工艺鲁棒性。
 附图说明
图1是现有技术的差分谐振器的平面结构示意图；
图2是理想状态下现有技术的差分谐振器振动的平面结构示意图；
图3是实际状态下现有技术的差分谐振器振动的平面结构示意图；
图4是本发明提供的一种差分谐振器的平面结构示意图；
图5是本发明的差分谐振器一种变形结构的平面结构示意图；
图6是本发明的差分谐振器另一种变形结构的平面结构示意图；
图7是本发明提供的差分谐振器振动的平面结构示意图。
 本发明的实施方式
为了使本发明的目的，技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
请参阅图4-6，本发明提供一种差分谐振器1，差分谐振器1包括基底10、第一谐振器11、第二谐振器12以及耦合机构13，第一谐振器11通过耦合机构13与第二谐振器12连接，且第一谐振器11和第二谐振器12与基底10连接并且在外力作用下可相对基底10位移。
具体地，第一谐振器11包括第一振子111以及若干第一连接臂112，该若干第一连接臂112布设于第一振子111垂直于第一振子111的振动方向的相对两侧，用于将第一振子111连接与基底10，该若干第一连接臂112为柔性连接臂。
第二谐振器12包括第二振子121以及若干第二连接臂122，该若干第二连接臂122布设于第二振子121垂直于第二振子121的振动方向的相对两侧，且第二振子121的振动方向与第一振子111的振动方向互为相反，用于将第二振子121连接与基底10，该若干第二连接臂122为柔性连接臂或弹性连接臂。
耦合机构13包括第一导向梁131、第二导向梁132、第一耦合梁133、第二耦合梁134、第一连接件135以及第二连接件136；其中，第一导向梁131和第二导向梁132设置于与第一谐振器11或第二谐振器12的振动方向相垂直的方向的相对两侧。
第一耦合梁133的一端与第一导向梁131连接，另一端与第二导向梁132连接，并且第一耦合梁133的中部通过第一连接件135与第一谐振器11连接。第二耦合梁134的一端与第一导向梁131连接，另一端与第二导向梁132连接，并且第二耦合梁134的中部通过第二连接件136与第二谐振器12连接。
在部分实施例中，第一导向梁131和第二导向梁132均为弹性材料制成的弹性导向梁，第一耦合梁133的一端与第一导向梁131在振动方向上的中间部位连接，另一端与第二导向梁132在振动方向上的中间部位连接。第二耦合梁134的一端与第一导向梁131在振动方向上的中间部位连接，另一端与第二导向梁132在振动方向上的中间部位连接，以确保第一谐振器11和第二谐振器12的振幅一致性更优。
在部分实施例中，第一耦合梁133与第二耦合梁134沿着垂直振动方向的方向对称设置，形成环形耦合梁。该环形耦合梁可以为圆形耦合梁、菱形耦合梁或椭圆形耦合梁，环形耦合梁具有共模振型时耦合机构13呈现的刚度比差分振型时耦合机构呈现的刚度小，可以更好的抑制工艺误差，提升差分谐振器的工艺鲁棒性。
在部分实施例中，第一耦合梁133和第二耦合梁134在振动方向之间的间距由中间向两侧逐渐递减。
在部分实施例中，第一导向梁131、第二导向梁132、第一耦合梁133、第二耦合梁134、第一连接件135以及第二连接件136一体成型，形成耦合机构13。
请参阅图7，通过在第一谐振器11或第二谐振器12的振动方向的相对两侧设置第一导向梁131和第二导向梁132。第一谐振器11通过第一耦合梁133 连接第一导向梁131和第二导向梁132，第二谐振器12通过第二耦合梁134 连接第一导向梁131和第二导向梁132，从而可以通过第一导向梁131和第二导向梁132在第一谐振器11和第二谐振器12振动时进行限位，从而使得第一谐振器11或第二谐振器12在外力驱动从而振动时，两者的振幅的一致性更优。
同时，利用第一导向梁131和第二导向梁132的导向作用，可以防止第一耦合梁133和第二耦合梁134发生在振动方向上同向弯曲的形变。
进一步，利用环形耦合梁结构的共模刚度大于差模刚度特点，配合第一导向梁131和第二导向梁132的导向作用，以更好的抑制工艺误差，提升差分谐振器1的工艺鲁棒性。
在部分实施例中，本发明还提供一种MEMS传感器，该MEMS传感器前述的差分谐振器1，该MEMS传感器可以是差分式加速度计、差分式陀螺仪、差分式谐振式压力传感器。
与现有技术相比，本发明提供的差分谐振器及MEMS传感器具有以下优点：
1、通过在第一谐振器或第二谐振器的振动方向的相对两侧设置第一导向梁和第二导向梁。第一谐振器通过第一耦合梁连接第一导向梁和第二导向梁，第二谐振器通过第二耦合梁连接第一导向梁和第二导向梁，从而可以通过第一导向梁和第二导向梁在第一谐振器和第二谐振器振动时进行限位，从而使得第一谐振器或第二谐振器在外力驱动从而振动时，两者的振幅的一致性更优。
同时，利用第一导向梁和第二导向梁的导向作用，可以防止第一耦合梁和第二耦合梁发生在振动方向上同向弯曲的形变。
2、通过第一耦合梁和第二耦合梁形成环形耦合梁结构，利用环形耦合梁结构的共模刚度大于差模刚度的特点，配合第一导向梁和第二导向梁的导向作用，以更好的抑制工艺误差，提升差分谐振器的工艺鲁棒性。
以上所述的仅是发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离发明创造构思的前提下，还可以做出改进，但这些均属于发明的保护范围。

Claims (8)

  1. 一种差分谐振器，所述差分谐振器包括基底、第一谐振器、第二谐振器以及耦合机构，所述第一谐振器通过所述耦合机构与所述第二谐振器连接，且所述第一谐振器和所述第二谐振器与所述基底连接并且在外力作用下可相对所述基底位移，且所述第一谐振器和所述第二谐振器位移方向互为相反，其特征在于：
    所述耦合机构包括第一导向梁、第二导向梁、第一耦合梁、第二耦合梁、第一连接件以及第二连接件；其中，所述第一导向梁和所述第二导向梁设置于与所述第一谐振器或所述第二谐振器的振动方向相垂直的方向的相对两侧；
    所述第一耦合梁的一端与所述第一导向梁连接，另一端与所述第二导向梁连接，并且所述第一耦合梁的中部通过所述第一连接件与所述第一谐振器连接；
    所述第二耦合梁的一端与所述第一导向梁连接，另一端与所述第二导向梁连接，并且所述第二耦合梁的中部通过所述第二连接件与所述第二谐振器连接。
  2. 一种差分谐振器，所述差分谐振器包括基底、第一谐振器、第二谐振器以及耦合机构，所述第一谐振器通过所述耦合机构与所述第二谐振器连接，且所述第一谐振器和所述第二谐振器与所述基底连接并且在外力作用下可相对所述基底位移，且所述第一谐振器和所述第二谐振器位移方向互为相反，其特征在于：
    所述耦合机构包括第一导向梁、第二导向梁、第一耦合梁、第二耦合梁、第一连接件以及第二连接件；其中，所述第一导向梁和所述第二导向梁设置于与所述第一谐振器或所述第二谐振器的振动方向相垂直的方向的相对两侧；
    所述第一耦合梁的一端与所述第一导向梁连接，另一端与所述第二导向梁连接，并且所述第一耦合梁的中部通过所述第一连接件与所述第一谐振器连接；
    所述第二耦合梁的一端与所述第一导向梁连接，另一端与所述第二导向梁连接，并且所述第二耦合梁的中部通过所述第二连接件与所述第二谐振器连接。
  3. 如权利要求1所述的差分谐振器，其特征在于：所述第一耦合梁与所述第二耦合梁沿着垂直所述振动方向的方向对称设置，形成环形耦合梁。
  4. 如权利要求3所述的差分谐振器，其特征在于：所述环形耦合梁为圆形耦合梁、菱形耦合梁或椭圆形耦合梁。
  5. 如权利要求3所述的差分谐振器，其特征在于：所述第一耦合梁和所述第二耦合梁在所述振动方向之间的间距由中间向两侧逐渐递减。
  6. 如权利要求1所述的差分谐振器，其特征在于：所述第一导向梁和所述第二导向梁均为弹性材料制成。
  7. 如权利要求1所述的差分谐振器，其特征在于：所述第一导向梁、所述第二导向梁、所述第一耦合梁、所述第二耦合梁、所述第一连接件以及所述第二连接件一体成型，形成所述耦合机构。
  8. 一种MEMS传感器，其特征在于：所述MEMS传感器包括如权利要求1-7任意一项所述的差分谐振器。
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