WO2020258174A1 - 振动传感器和音频设备 - Google Patents

振动传感器和音频设备 Download PDF

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Publication number
WO2020258174A1
WO2020258174A1 PCT/CN2019/093338 CN2019093338W WO2020258174A1 WO 2020258174 A1 WO2020258174 A1 WO 2020258174A1 CN 2019093338 W CN2019093338 W CN 2019093338W WO 2020258174 A1 WO2020258174 A1 WO 2020258174A1
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WO
WIPO (PCT)
Prior art keywords
cavity
vibration sensor
mems chip
elastic membrane
circuit board
Prior art date
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Ceased
Application number
PCT/CN2019/093338
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English (en)
French (fr)
Inventor
张金宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to PCT/CN2019/093338 priority Critical patent/WO2020258174A1/zh
Priority to CN201921052481.5U priority patent/CN210093551U/zh
Publication of WO2020258174A1 publication Critical patent/WO2020258174A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model relates to the field of microphones, in particular to a vibration sensor and audio equipment.
  • the prior art vibration sensor generally includes a housing having a front cavity and an opening communicating with the front cavity, an elastic membrane covering the opening and having a through hole communicating with the front cavity, a mass mounted on the side of the elastic membrane facing away from the front cavity, and a device.
  • the MEMS chip used to receive the vibration signal in the front cavity.
  • the mass vibrates up and down, causing the volume of the front cavity to change, and the gas pressure in the front cavity changes accordingly.
  • the signal is picked up by the MEMS core and converted into an electrical signal.
  • the prior art vibration sensor has the problem of complex structure and low sensitivity.
  • the purpose of the utility model is to provide a vibration sensor with high sensitivity.
  • a vibration sensor which includes a cavity with side walls, an elastic membrane mounted on the side walls, and a MEMS chip with a back cavity.
  • the MEMS chip is accommodated in the cavity and mounted on the elastic membrane.
  • the side wall includes a side surface attached to the elastic film, the side surface is recessed in a direction away from the MEMS chip to form a cavity, the elastic film covers the cavity and the elastic film is provided with a through hole, the The through hole communicates with the cavity and the back cavity of the MEMS chip.
  • the cross-sectional area of the cavity along the vibration direction of the elastic membrane is larger than the cross-sectional area of the back cavity along the vibration direction of the elastic membrane.
  • the cavity includes a circuit board and a shell fixed on the circuit board, and the elastic film is mounted on the circuit board.
  • the elastic film is adhesively connected to the circuit board.
  • the MEMS chip is adhesively connected to the elastic membrane.
  • the vibration sensor further includes an ASIC chip housed in the cavity, and the ASIC chip is electrically connected to the MEMS chip and the circuit board.
  • the ASIC chip is adhesively connected to the circuit board.
  • An audio device including the vibration sensor described above.
  • the beneficial effect of the utility model is that the MENS chip is arranged on the elastic membrane.
  • the MEMS chip vibrates up and down, causing the volume of the front cavity to change, and the gas pressure in the front cavity changes accordingly.
  • the pressure signal is picked up by the MEMS chip and converted into an electrical signal, making the changed pressure signal easier to be picked up by the MEMS chip, which improves the sensitivity of the vibration sensor and reduces the height of the product.
  • Figure 1 is a schematic structural view of a vibration sensor provided by an embodiment of the utility model
  • Figure 2 is an exploded view of the vibration sensor in Figure 1;
  • Fig. 3 is a schematic cross-sectional view along line A-A of Fig. 1.
  • Vibration sensor 1. Cavity; 101, side; 102, cavity; 11. Circuit board; 2. Elastic membrane; 3. MEMS chip; 12, housing; 20, through hole; 30, back cavity; 4. ASIC chip; 120, sound hole.
  • the present invention provides a vibration sensor 100, which includes a cavity with a side wall 1, an elastic membrane 2 mounted on the side wall, and a MEMS chip 3 with a back cavity.
  • the MEMS chip 3 is accommodated in The MEMS chip 3 in the cavity 1 and mounted on the elastic membrane 2 and capable of vibrating with the elastic membrane 2.
  • the sidewall includes a side surface 101 attached to the elastic membrane 2, and the side surface 101 A cavity 102 is recessed away from the MEMS chip 3, the elastic membrane 2 covers the cavity 102, and the elastic membrane 2 is provided with a through hole 20, and the through hole 20 communicates with the cavity 102 And the back cavity 30 of the MEMS chip 3.
  • the MEMS chip 3 is mounted on the upper side of the elastic membrane 2.
  • the MEMS chip 3 vibrates up and down with the elastic membrane 2, causing the volume of the cavity 102 to change.
  • the medium in the cavity 102 is like a gas.
  • the pressure changes accordingly, and the changed pressure signal is picked up by the MEMS chip 3.
  • the cross-sectional area of the cavity 102 along the vibration direction of the elastic membrane 2 is larger than the cross-sectional area of the back cavity 30 along the vibration direction of the elastic membrane 2.
  • the cavity 1 includes a circuit board 11 and a housing 12 fixed on the circuit board 11, and the elastic membrane 2 is mounted on the circuit board 11.
  • the cavity 102 is formed on the inner surface of the circuit board 11. Understandably, the sidewalls forming the cavity 102 and the circuit board 11 may also be separately provided.
  • the elastic film 2 and the circuit board 11 are adhesively connected.
  • the MEMS chip 3 and the elastic membrane 2 are adhesively connected.
  • the vibration sensor 100 further includes an ASIC chip 4 housed in the cavity 1, and the ASIC chip 4 is electrically connected to the MEMS chip 3 and the circuit board 11.
  • the ASIC chip 4 is used to process the vibration signal picked up by the MEMS chip 4.
  • the ASIC chip 4 and the circuit board 11 are adhesively connected.
  • a sound hole 120 is opened on the housing 12.
  • the sound hole 120 is used to allow sound to enter the cavity, so that the MEMS chip 3 can pick up vibration signals and sound signals at the same time.
  • the sound hole 120 is opened on the side wall of the housing 12 opposite to the circuit board 11. In this way, the sound hole 120 is opposite to the MEMS chip 3, which facilitates the MEMS chip 3 to receive sound signals.
  • the present invention also provides an audio device (not shown in the figure), including the vibration sensor 100 as described above.
  • the MEMS chip 3 vibrates up and down with the elastic membrane 2, causing the volume of the cavity 102 to change, and the pressure of the medium such as gas in the cavity 102
  • the changed pressure signal is picked up by the MEMS chip 3, and the MEMS chip 3 functions as a mass block, the height of the vibration sensor 100 is reduced, and the sensitivity is increased.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

本申请提供了振动传感器和音频设备，振动传感器包括带侧壁的腔体、安装于所述侧壁的弹性膜及具有背腔的MEMS芯片，所述MEMS芯片收容于所述腔体内并安装于弹性膜上，所述侧壁包括与所述弹性膜贴合的侧面，所述侧面向远离所述MEMS芯片方向凹陷形成凹腔，所述弹性膜覆盖所述凹腔且所述弹性膜上开设有通孔，所述通孔连通所述凹腔与所述MEMS芯片的背腔。本申请的振动传感器高度小且灵敏度高。

Description

振动传感器和音频设备 技术领域
本实用新型涉及麦克风领域，特别涉及一种振动传感器和音频设备。
 背景技术
现有技术的振动传感器一般包括具有前腔以及连通前腔的开口的外壳、覆盖开口且具有与前腔连通的通孔的弹性膜、安装于弹性膜背离前腔的侧面上的质量块以及设于前腔内用于接收振动信号的MEMS芯片，当外界振动信号通过结构传导至振动传感器上时，质量块上下振动，引起前腔体积变化，前腔内气体压强随之发生变化，变化的压强信号被MEMS芯体拾取到，转化为电信号，但是，现有技术的振动传感器存在结构复杂且灵敏度低的问题。
因此，有必要提供一种结构简单且灵敏度高的振动传感器。
 技术问题
本实用新型的目的在于提供一种灵敏度高的振动传感器。
 技术解决方案
本实用新型的技术方案如下：
提供一种振动传感器，包括带侧壁的腔体、安装于所述侧壁的弹性膜及具有背腔的MEMS芯片，所述MEMS芯片收容于所述腔体内并安装于弹性膜上，所述侧壁包括与所述弹性膜贴合的侧面，所述侧面向远离所述MEMS芯片方向凹陷形成凹腔，所述弹性膜覆盖所述凹腔且所述弹性膜上开设有通孔，所述通孔连通所述凹腔与所述MEMS芯片的背腔。
进一步地，所述凹腔沿所述弹性膜振动方向的横截面积大于所述背腔沿所述弹性膜振动方向的横截面积。
进一步地，所述腔体包括电路板及固定于所述电路板上的外壳，所述弹性膜安装于所述电路板上。
进一步地，所述弹性膜与所述电路板胶粘连接。
进一步地，所述MEMS芯片与所述弹性膜胶粘连接。
进一步地，所述振动传感器还包括收容于所述腔体内的ASIC芯片，所述ASIC芯片与所述MEMS芯片和所述电路板均电连接。
进一步地，所述ASIC芯片与所述电路板胶粘连接。
进一步地，所述外壳上开设有声孔。
还提供一种音频设备，包括如上所述的振动传感器。
 有益效果
本实用新型的有益效果在于：将MENS芯片设于弹性膜上，当外界振动信号通过结构传导至振动传感器，MEMS芯片上下振动，引起前腔体积变化，前腔内气体压强随之发生变化，变化的压强信号被MEMS芯片拾取到，转化为电信号，使得变化的压强信号更容易被MEMS芯片拾取到，提高了振动传感器的灵敏度，产品的高度降低。
 附图说明
图1为本实用新型实施例提供的振动传感器的结构示意图;
图2为图1中振动传感器的爆炸图；
图3为图1沿A-A线的剖面示意图。
图中：
100、振动传感器； 1、腔体；101、侧面；102、凹腔；11、电路板； 2、弹性膜；3、MEMS芯片；12、外壳；20、通孔；30、背腔；4、ASIC芯片；120、声孔。
 本发明的实施方式
下面结合附图和实施方式对本实用新型作进一步说明。
请参阅图1，本实用新型提供一种振动传感器100，包括带侧壁的腔体1、安装于所述侧壁的弹性膜2以及具有背腔的MEMS芯片3，所述MEMS 芯片3收容于所述腔体1内并安装于所述弹性膜2上并可随所述弹性膜2振动的MEMS芯片3，所述侧壁包括与所述弹性膜2贴合的侧面101，所述侧面101向远离所述MEMS芯片3方向凹陷形成凹腔102，所述弹性膜2覆盖所述凹腔102，且所述弹性膜2上开设有通孔20，所述通孔20连通所述凹腔102与所述MEMS芯片3的背腔30。
MEMS芯片3安装于弹性膜2的上侧面，当外界振动信号通过结构传导至振动传感器100，MEMS芯片3随弹性膜2上下振动，引起凹腔102体积变化，凹腔102内的介质如气体的压力随之发生变化，变化的压力信号被MEMS芯片3拾取。
优选地，所述凹腔102沿所述弹性膜2振动方向的横截面积大于背腔30沿所述弹性膜2振动方向的横截面积。
优选地，腔体1包括电路板11和固定于所述电路板11上的外壳12，所述弹性膜2安装于所述电路板11上。所述凹腔102形成于所述电路板11的内表面。可以理解地，形成所述凹腔102的侧壁与电路板11也可以分开设置。
优选地，所述弹性膜2与所述电路板11胶粘连接。
优选地，所述MEMS芯片3与所述弹性膜2胶粘连接。
优选地，所述振动传感器100还包括收容于所述腔体1内的ASIC芯片4，所述ASIC芯片4与所述MEMS芯片3和所述电路板11均电连接。ASIC芯片4用于处理MEMS芯片4所拾取的振动信号。
优选地，所述ASIC芯片4与所述电路板11胶粘连接。
优选地，所述外壳12上开设有声孔120。声孔120用于供声音进入腔体内，使得MEMS芯片3同时可以拾取振动信号和声音信号。优选声孔120开设于外壳12的与所述电路板11相对的侧壁上，如此，声孔120与MEMS芯片3相对，有利于MEMS芯片3接收声音信号。
本发明还提供一种音频设备（图中未示），包括如上所述的振动传感器100。
本实用新型提供的振动传感器100，当外界振动信号通过结构传导至振动传感器100，MEMS芯片3随弹性膜2上下振动，引起凹腔102体积变化，凹腔102内的介质如气体的压力随之发生变化，变化的压力信号被MEMS芯片3拾取，MEMS芯片3起到质量块的作用，振动传感器100的高度降低，且灵敏度提高。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。
 

Claims (9)

  1. 一种振动传感器，其特征在于，包括带侧壁的腔体、安装于所述侧壁的弹性膜及具有背腔的MEMS芯片，所述MEMS芯片收容于所述腔体内并安装于弹性膜上，所述侧壁包括与所述弹性膜贴合的侧面，所述侧面向远离所述MEMS芯片方向凹陷形成凹腔，所述弹性膜覆盖所述凹腔且所述弹性膜上开设有通孔，所述通孔连通所述凹腔与所述MEMS芯片的背腔。
  2. 根据权利要求1所述的振动传感器，其特征在于：所述凹腔沿所述弹性膜振动方向的横截面积大于所述背腔沿所述弹性膜振动方向的横截面积。
  3. 根据权利要求1所述的振动传感器，其特征在于：所述腔体包括电路板及固定于所述电路板上的外壳，所述弹性膜安装于所述电路板上。
  4. 根据权利要求3所述的振动传感器，其特征在于：所述弹性膜与所述电路板胶粘连接。
  5. 根据权利要求3所述的振动传感器，其特征在于：所述MEMS芯片与所述弹性膜胶粘连接。
  6. 根据权利要求3所述的振动传感器，其特征在于：所述振动传感器还包括收容于所述腔体内的ASIC芯片，所述ASIC芯片与所述MEMS芯片和所述电路板均电连接。
  7. 根据权利要求6所述的振动传感器，其特征在于：所述ASIC芯片与所述电路板胶粘连接。
  8. 根据权利要求3所述的振动传感器，其特征在于：所述外壳上开设有声孔。
  9. 一种音频设备，其特征在于：包括如权利要求1-8中任意一项所述的振动传感器。
PCT/CN2019/093338 2019-06-27 2019-06-27 振动传感器和音频设备 Ceased WO2020258174A1 (zh)

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PCT/CN2019/093338 WO2020258174A1 (zh) 2019-06-27 2019-06-27 振动传感器和音频设备
CN201921052481.5U CN210093551U (zh) 2019-06-27 2019-07-05 振动传感器和音频设备

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CN218679379U (zh) * 2020-06-30 2023-03-21 瑞声声学科技(深圳)有限公司 振动传感器
JP7590564B2 (ja) 2020-12-28 2024-11-26 シェンツェン・ショックス・カンパニー・リミテッド 振動センサ
WO2022140921A1 (zh) * 2020-12-28 2022-07-07 深圳市韶音科技有限公司 一种振动传感器
KR102941737B1 (ko) 2020-12-28 2026-03-23 썬전 샥 컴퍼니, 리미티드 진동센서

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US20110198714A1 (en) * 2010-02-18 2011-08-18 Analog Devices, Inc. Packages and methods for packaging mems microphone devices
CN104219610A (zh) * 2013-05-29 2014-12-17 山东共达电声股份有限公司 微机电系统麦克风
CN208386931U (zh) * 2018-06-29 2019-01-15 歌尔股份有限公司 振动传感器和音频设备
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US20110198714A1 (en) * 2010-02-18 2011-08-18 Analog Devices, Inc. Packages and methods for packaging mems microphone devices
CN104219610A (zh) * 2013-05-29 2014-12-17 山东共达电声股份有限公司 微机电系统麦克风
CN109916502A (zh) * 2018-04-30 2019-06-21 索尼昂荷兰有限公司 振动传感器
CN208386931U (zh) * 2018-06-29 2019-01-15 歌尔股份有限公司 振动传感器和音频设备

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