WO2020258174A1 - Capteur de vibration, et dispositif audio - Google Patents

Capteur de vibration, et dispositif audio Download PDF

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Publication number
WO2020258174A1
WO2020258174A1 PCT/CN2019/093338 CN2019093338W WO2020258174A1 WO 2020258174 A1 WO2020258174 A1 WO 2020258174A1 CN 2019093338 W CN2019093338 W CN 2019093338W WO 2020258174 A1 WO2020258174 A1 WO 2020258174A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
vibration sensor
mems chip
elastic membrane
circuit board
Prior art date
Application number
PCT/CN2019/093338
Other languages
English (en)
Chinese (zh)
Inventor
张金宇
Original Assignee
瑞声声学科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/093338 priority Critical patent/WO2020258174A1/fr
Priority to CN201921052481.5U priority patent/CN210093551U/zh
Publication of WO2020258174A1 publication Critical patent/WO2020258174A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model relates to the field of microphones, in particular to a vibration sensor and audio equipment.
  • the prior art vibration sensor generally includes a housing having a front cavity and an opening communicating with the front cavity, an elastic membrane covering the opening and having a through hole communicating with the front cavity, a mass mounted on the side of the elastic membrane facing away from the front cavity, and a device.
  • the MEMS chip used to receive the vibration signal in the front cavity.
  • the mass vibrates up and down, causing the volume of the front cavity to change, and the gas pressure in the front cavity changes accordingly.
  • the signal is picked up by the MEMS core and converted into an electrical signal.
  • the prior art vibration sensor has the problem of complex structure and low sensitivity.
  • the purpose of the utility model is to provide a vibration sensor with high sensitivity.
  • a vibration sensor which includes a cavity with side walls, an elastic membrane mounted on the side walls, and a MEMS chip with a back cavity.
  • the MEMS chip is accommodated in the cavity and mounted on the elastic membrane.
  • the side wall includes a side surface attached to the elastic film, the side surface is recessed in a direction away from the MEMS chip to form a cavity, the elastic film covers the cavity and the elastic film is provided with a through hole, the The through hole communicates with the cavity and the back cavity of the MEMS chip.
  • the cross-sectional area of the cavity along the vibration direction of the elastic membrane is larger than the cross-sectional area of the back cavity along the vibration direction of the elastic membrane.
  • the cavity includes a circuit board and a shell fixed on the circuit board, and the elastic film is mounted on the circuit board.
  • the elastic film is adhesively connected to the circuit board.
  • the MEMS chip is adhesively connected to the elastic membrane.
  • the vibration sensor further includes an ASIC chip housed in the cavity, and the ASIC chip is electrically connected to the MEMS chip and the circuit board.
  • the ASIC chip is adhesively connected to the circuit board.
  • An audio device including the vibration sensor described above.
  • the beneficial effect of the utility model is that the MENS chip is arranged on the elastic membrane.
  • the MEMS chip vibrates up and down, causing the volume of the front cavity to change, and the gas pressure in the front cavity changes accordingly.
  • the pressure signal is picked up by the MEMS chip and converted into an electrical signal, making the changed pressure signal easier to be picked up by the MEMS chip, which improves the sensitivity of the vibration sensor and reduces the height of the product.
  • Figure 1 is a schematic structural view of a vibration sensor provided by an embodiment of the utility model
  • Figure 2 is an exploded view of the vibration sensor in Figure 1;
  • Fig. 3 is a schematic cross-sectional view along line A-A of Fig. 1.
  • Vibration sensor 1. Cavity; 101, side; 102, cavity; 11. Circuit board; 2. Elastic membrane; 3. MEMS chip; 12, housing; 20, through hole; 30, back cavity; 4. ASIC chip; 120, sound hole.
  • the present invention provides a vibration sensor 100, which includes a cavity with a side wall 1, an elastic membrane 2 mounted on the side wall, and a MEMS chip 3 with a back cavity.
  • the MEMS chip 3 is accommodated in The MEMS chip 3 in the cavity 1 and mounted on the elastic membrane 2 and capable of vibrating with the elastic membrane 2.
  • the sidewall includes a side surface 101 attached to the elastic membrane 2, and the side surface 101 A cavity 102 is recessed away from the MEMS chip 3, the elastic membrane 2 covers the cavity 102, and the elastic membrane 2 is provided with a through hole 20, and the through hole 20 communicates with the cavity 102 And the back cavity 30 of the MEMS chip 3.
  • the MEMS chip 3 is mounted on the upper side of the elastic membrane 2.
  • the MEMS chip 3 vibrates up and down with the elastic membrane 2, causing the volume of the cavity 102 to change.
  • the medium in the cavity 102 is like a gas.
  • the pressure changes accordingly, and the changed pressure signal is picked up by the MEMS chip 3.
  • the cross-sectional area of the cavity 102 along the vibration direction of the elastic membrane 2 is larger than the cross-sectional area of the back cavity 30 along the vibration direction of the elastic membrane 2.
  • the cavity 1 includes a circuit board 11 and a housing 12 fixed on the circuit board 11, and the elastic membrane 2 is mounted on the circuit board 11.
  • the cavity 102 is formed on the inner surface of the circuit board 11. Understandably, the sidewalls forming the cavity 102 and the circuit board 11 may also be separately provided.
  • the elastic film 2 and the circuit board 11 are adhesively connected.
  • the MEMS chip 3 and the elastic membrane 2 are adhesively connected.
  • the vibration sensor 100 further includes an ASIC chip 4 housed in the cavity 1, and the ASIC chip 4 is electrically connected to the MEMS chip 3 and the circuit board 11.
  • the ASIC chip 4 is used to process the vibration signal picked up by the MEMS chip 4.
  • the ASIC chip 4 and the circuit board 11 are adhesively connected.
  • a sound hole 120 is opened on the housing 12.
  • the sound hole 120 is used to allow sound to enter the cavity, so that the MEMS chip 3 can pick up vibration signals and sound signals at the same time.
  • the sound hole 120 is opened on the side wall of the housing 12 opposite to the circuit board 11. In this way, the sound hole 120 is opposite to the MEMS chip 3, which facilitates the MEMS chip 3 to receive sound signals.
  • the present invention also provides an audio device (not shown in the figure), including the vibration sensor 100 as described above.
  • the MEMS chip 3 vibrates up and down with the elastic membrane 2, causing the volume of the cavity 102 to change, and the pressure of the medium such as gas in the cavity 102
  • the changed pressure signal is picked up by the MEMS chip 3, and the MEMS chip 3 functions as a mass block, the height of the vibration sensor 100 is reduced, and the sensitivity is increased.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

La présente invention concerne un capteur de vibration et un dispositif audio. Le capteur de vibration comprend une cavité ayant une paroi latérale, un film élastique monté sur la paroi latérale, et une puce MEMS ayant une cavité arrière. La puce MEMS est reçue à l'intérieur de la cavité et montée sur le film élastique. La paroi latérale comprend une surface latérale fixée au film élastique. Les renfoncements de surface latérale dans une direction s'éloignant de la puce MEMS forment une cavité évidée. Le film élastique recouvre la cavité évidée et est pourvu d'un trou traversant. Le trou traversant amène la cavité évidée et la cavité arrière de la puce MEMS à être en communication l'une avec l'autre. Le capteur de vibration de la présente invention présente une petite hauteur et une sensibilité élevée.
PCT/CN2019/093338 2019-06-27 2019-06-27 Capteur de vibration, et dispositif audio WO2020258174A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2019/093338 WO2020258174A1 (fr) 2019-06-27 2019-06-27 Capteur de vibration, et dispositif audio
CN201921052481.5U CN210093551U (zh) 2019-06-27 2019-07-05 振动传感器和音频设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/093338 WO2020258174A1 (fr) 2019-06-27 2019-06-27 Capteur de vibration, et dispositif audio

Publications (1)

Publication Number Publication Date
WO2020258174A1 true WO2020258174A1 (fr) 2020-12-30

Family

ID=69484818

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/093338 WO2020258174A1 (fr) 2019-06-27 2019-06-27 Capteur de vibration, et dispositif audio

Country Status (2)

Country Link
CN (1) CN210093551U (fr)
WO (1) WO2020258174A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218679379U (zh) * 2020-06-30 2023-03-21 瑞声声学科技(深圳)有限公司 振动传感器
WO2022140921A1 (fr) * 2020-12-28 2022-07-07 深圳市韶音科技有限公司 Capteur de vibrations

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110198714A1 (en) * 2010-02-18 2011-08-18 Analog Devices, Inc. Packages and methods for packaging mems microphone devices
CN104219610A (zh) * 2013-05-29 2014-12-17 山东共达电声股份有限公司 微机电系统麦克风
CN208386931U (zh) * 2018-06-29 2019-01-15 歌尔股份有限公司 振动传感器和音频设备
CN109916502A (zh) * 2018-04-30 2019-06-21 索尼昂荷兰有限公司 振动传感器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110198714A1 (en) * 2010-02-18 2011-08-18 Analog Devices, Inc. Packages and methods for packaging mems microphone devices
CN104219610A (zh) * 2013-05-29 2014-12-17 山东共达电声股份有限公司 微机电系统麦克风
CN109916502A (zh) * 2018-04-30 2019-06-21 索尼昂荷兰有限公司 振动传感器
CN208386931U (zh) * 2018-06-29 2019-01-15 歌尔股份有限公司 振动传感器和音频设备

Also Published As

Publication number Publication date
CN210093551U (zh) 2020-02-18

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