WO2020258035A1 - 线材组件和电子设备 - Google Patents

线材组件和电子设备 Download PDF

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Publication number
WO2020258035A1
WO2020258035A1 PCT/CN2019/092809 CN2019092809W WO2020258035A1 WO 2020258035 A1 WO2020258035 A1 WO 2020258035A1 CN 2019092809 W CN2019092809 W CN 2019092809W WO 2020258035 A1 WO2020258035 A1 WO 2020258035A1
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WO
WIPO (PCT)
Prior art keywords
wire assembly
wire
transmission line
conductive member
slot
Prior art date
Application number
PCT/CN2019/092809
Other languages
English (en)
French (fr)
Inventor
陈勇利
王建安
许心影
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声精密制造科技(常州)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声精密制造科技(常州)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/092809 priority Critical patent/WO2020258035A1/zh
Priority to CN201910561551.8A priority patent/CN110299591A/zh
Priority to US16/991,005 priority patent/US20200411212A1/en
Publication of WO2020258035A1 publication Critical patent/WO2020258035A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H01B11/02—Cables with twisted pairs or quads
    • H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
    • H01B11/10—Screens specially adapted for reducing interference from external sources
    • H01B11/1091—Screens specially adapted for reducing interference from external sources with screen grounding means, e.g. drain wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies

Definitions

  • the present invention relates to the technical field of wire rods, in particular to a wire rod assembly and electronic equipment.
  • the structure of the existing coaxial transmission line and microstrip transmission line is relatively simple, and the existing coaxial transmission line and microstrip transmission line require a certain amount of space, which has certain limitations for the internal layout of high-speed development terminal products, and blindly reduce the transmission line The size has to be at the expense of reduced performance.
  • the purpose of the present invention is to provide a wire assembly and electronic equipment with a small size and good signal transmission performance.
  • the present invention provides a wire assembly.
  • the wire assembly includes a conductive member and a transmission line.
  • the conductive member is provided with a strip-shaped slot, the transmission line is embedded in the slot, and the transmission line includes a cover arranged in The base material at the opening of the slot and the ground wires and signal wires separately arranged on both sides of the base material, the ground wire is exposed outside the opening of the slot, and the ground wire and the conductive element are electrically connected
  • the signal line is located in the slot, and a gap is included between the signal line and the bottom of the slot.
  • the wire assembly further includes a plurality of the fixing areas arranged at intervals on each of the opposite sides of the transmission line, the ground wire and the fixing area are integrally arranged and the ground The wire is electrically connected to the fixed area, and the fixed area is provided on the surface of the conductive member where the slot is formed and is fixedly connected and electrically connected to the surface.
  • the electrical connection and the fixed connection between the fixed area and the conductive element are performed by laser welding.
  • each of the fixing areas includes at least one laser hole.
  • the fixed areas on both sides of the transmission line are symmetrically arranged with respect to the transmission line.
  • the distance between two adjacent fixed areas is less than a quarter of the minimum wavelength of the signal transmitted by the signal line.
  • the distance between every two adjacent fixed areas is equal.
  • the dielectric constant of the substrate is 3.2 to 3.4.
  • the material of the conductive member includes copper, aluminum or silver.
  • the present invention also provides an electronic device.
  • the electronic device includes the wire assembly described above, and the conductive member of the wire assembly is a metal frame of the electronic device.
  • the embodiment of the present invention is provided with a strip-shaped slot on the conductive member, the transmission line is embedded in the slot, and the transmission line includes a cover provided at the opening of the slot.
  • the conductive member is the metal frame of the electronic device, that is, the transmission line is installed on the metal frame of the electronic device, which saves space and reduces the volume of the electronic device.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a wire assembly provided by an embodiment of the present invention
  • FIG. 2 is a schematic diagram of an exploded structure of a wire assembly provided by an embodiment of the present invention
  • FIG. 3 is a schematic diagram of a three-dimensional structure of a conductive element provided by an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of an exploded structure of a transmission line provided by an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a three-dimensional structure of a fixed area provided by an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a three-dimensional structure of a wire assembly according to another embodiment of the present invention.
  • FIG. 7 is a schematic diagram of an enlarged structure at A in FIG. 6;
  • FIG. 8 is a schematic diagram of a three-dimensional structure of a wire assembly according to another embodiment of the present invention.
  • FIG. 9 is a schematic diagram of an enlarged structure at B in FIG. 8.
  • the present invention provides a wire assembly 10, which can transmit signals to other devices, for example, the wire assembly 10 can be used in an antenna.
  • the wire assembly 10 includes a conductive member 11, a transmission line 12, a conductive adhesive 13, and a plurality of fixing areas 14.
  • the conductive member 11 is provided with a strip-shaped slot 111 extending along the length of the conductive member 11, and the transmission line 12 is embedded in the slot 111,
  • the transmission line 12 is fixedly connected to the slot 111 through the conductive adhesive 13, and the transmission line 12 is also fixedly connected and electrically connected to the conductive member 11 through the fixing area 14.
  • the length of the conductive member 11 can be set as required.
  • the material of the conductive member 11 includes a conductive material.
  • the material of the conductive member 11 may include but is not limited to metal or alloy, such as copper, aluminum, or silver. It can be understood that the shape of the conductive member 11 can be changed as required. If the wire assembly 10 needs to be bent, the conductive member 11 is also bent as required.
  • the conductive member 11 may also adopt other shapes, such as a pentagonal prism shape, a hexagonal prism shape, and the like.
  • the slot 111 is opened on a surface extending in the length direction of the conductive member 11, and the slot 111 extends in the length direction of the conductive member 11.
  • the length of the slot 111 is equal to the length of the conductive member 11, that is, the slot 111 penetrates the conductive member 11 along the length direction of the conductive member 11.
  • the slot 111 includes a bottom 1111 and two opposite sides connected to the bottom 1111. ⁇ 1112.
  • the conductive adhesive 13 is both conductive and adhesive, and functions as an electrical connection and a fixed connection.
  • the conductive adhesive 13 can electrically and fixedly connect the bottom of the slot 111 of the conductive member 11 and the transmission line 12.
  • the conductive adhesive 13 may be a conductive double-sided adhesive.
  • the transmission line 12 is a microstrip line.
  • the transmission line 12 includes a ground line 121, a signal line 122 and a base material 123, the base material 123 is disposed at the opening of the slot 111, and the ground line 121 is disposed on the side of the base material 123 far away from the bottom of the groove 111.
  • the ground line 121 and the fixed area 14 are electrically connected and fixedly connected, the signal line 122 is located in the slot 111, the ground line 121 is fixedly connected to the base material 123, and the base material 123 is fixedly connected to the bottom portion 1111 of the slot 111 through the conductive adhesive 13,
  • the signal line 122 is located in the substrate 123.
  • the ground line 121, the base material 123 and the conductive glue 13 are stacked in sequence.
  • the signal line 122 is used to transmit signals.
  • the signal line 122 and the ground line 121 are spaced apart. Such as a signal with a certain wavelength and frequency.
  • the wavelength of the signal transmitted by the signal line 122 may be a variable value, that is, the signal transmitted by the signal line 122 is a signal in a frequency band instead of a fixed frequency signal.
  • the ground wire 121 is a conductive wire, and the ground wire 121 is used for grounding.
  • the ground wire 121 is exposed outside the opening of the slot 111.
  • the ground line 121 shields the opening 112 of the slot 111, which can reduce the leakage of the signal transmitted in the signal line 122.
  • the material of the ground wire 121 is not limited.
  • the material of the ground wire 121 may include conductive metal or alloy.
  • the base 123 is provided with perforations 1231 extending through the opposite end faces of the base 123 along the length direction of the base 123, and the perforations 1231 are used to accommodate the signal line 122.
  • the dielectric constant of the substrate 123 is 3.2 to 3.4, and the dielectric constant of the substrate 123 is preferably 3.3.
  • the material of the substrate 123 includes but is not limited to PI (Polyimide, polyimide), PTFE (Poly tetra fluoroethylene, polytetrafluoroethylene), PEEK (Polyetherether ketone, polyether ether ketone) and LCP (Liquid Crystal Polymer, liquid crystal polymer ⁇ ).
  • the width of the substrate 123 and the width of the slot 111 are equal.
  • the substrate 123 is connected to the bottom 1111 of the slot 111 through the conductive adhesive 13, which increases the stability of the transmission line 12.
  • a plurality of fixed areas 14 are arranged at intervals on each of two opposite sides of the ground wire 121.
  • the fixing area 14 is also provided on the surface of the conductive member 11 where the slot 111 is formed, and is fixedly and electrically connected to the surface.
  • the ground wire 121 and the fixed area 14 are integrally provided and the ground wire 121 and the fixed area 14 are electrically connected.
  • the material of the fixing area 14 is not limited.
  • the material of the fixing area 14 may include conductive metal or alloy, and for example, the fixing area 14 may be a metal sheet.
  • the fixing area 14 may be integrally formed with the ground wire 121.
  • the fixed areas 14 on both sides of the ground line 121 are symmetrically arranged with respect to the ground line 121.
  • the distance L between two adjacent fixed areas 14 is less than a quarter of the minimum wavelength of the signal transmitted by the signal line 122.
  • the distance L between every two adjacent fixing areas 14 is equal.
  • the fixed area 14 and the conductive member 11 are electrically connected and fixedly connected by laser welding, and a laser hole 141 is formed on the fixed area 14 of the ground line 121.
  • the laser process is the laser process, and the laser process can be realized by continuous or pulsed laser beam welding.
  • the power density of the laser is preferably greater than 107 W/cm 2 , and the metal surface is recessed into "cavities" under the action of heating, that is, laser holes 141 are formed to form deep penetration welding, with fast welding speed and large aspect ratio specialty.
  • Laser welding is used to tightly fix the fixed area 14 and the conductive element 11, and the electrical connection effect is good.
  • the fixed area 14 and the conductive element 11 are fully electrically connected, and the ground line 121 or the conductive element 11 is grounded, which can reduce the signal line 122 Signal leakage.
  • Each fixing area 14 includes at least one laser hole 141.
  • each fixed area 14 includes four laser holes 141, and the four laser holes 141 form a square and are respectively located at four corners of the square. The laser hole 141 reduces signal leakage.
  • the structure of the wire assembly 10 of this embodiment is simple, and the size of the wire assembly 10 is small, which meets the requirement of miniaturization.
  • the conductive glue 13 is omitted, and the signal line 122 is no longer located in the substrate 123, and the signal line 122 is disposed on the side of the substrate 123 away from the ground 121 and Connected to the base material 123, a gap 124 is provided between the signal line 122 and the bottom 1111 of the slot 111.
  • the wire assembly 10 includes a conductive member 11, a transmission line 12 and a plurality of fixed areas.
  • the conductive member 11 is provided with a strip-shaped slot 111 extending along the length of the conductive member 11, and the transmission line 12 is embedded in the slot 111.
  • the transmission line 12 is fixedly connected and electrically connected through the fixed area 14 and the conductive member 11
  • the transmission line 12 is a microstrip line. Specifically, the transmission line 12 includes a ground line 121, a signal line 122, and a base material 123.
  • the base material 123 is disposed at the opening of the slot 111.
  • the ground line 121 and the signal line 122 are separately disposed on both sides of the base material 123.
  • the ground line 121 Located on the side of the base material 123 far away from the bottom of the groove 111, the ground wire 121 and the fixing area 14 are electrically and fixedly connected.
  • the signal line 122 is located in the slot 111, the ground line 121 is fixedly connected to the base material 123, the signal line 122 is arranged on the side of the base material 123 away from the ground line 121 and is connected to the base material 123, the signal line 122 and the slot 111
  • a gap 124 is provided between the bottom portion 1111 of the device, and the gap 124 is air.
  • the ground line 121, the base material 123 and the signal line 122 are stacked in sequence. Since the dielectric constant of air is 1, the dielectric constant of the substrate 123 is 3.2 ⁇ 3.4, and the dielectric constant of air is less than the dielectric constant of the substrate 123.
  • the gap 124 can reduce the overall dielectric constant of the wire assembly 10. The signal leakage and loss in the signal line 122 are reduced.
  • the transmission line 12 further includes a second ground line 126.
  • the ground line 121 of the foregoing embodiment is called a first ground line 125.
  • the second ground wire 126 is located in the slot 111, the base material 123 is connected to the second ground wire 126, and the second ground wire 126 is connected to the bottom 1111 of the slot 111 through the conductive glue 13. Since the conductive adhesive 13 is conductive, the electrical connection and fixed connection between the second ground wire 126 and the conductive element 11 are realized.
  • the wire assembly 10 includes a conductive member 11, a transmission line 12, a conductive adhesive 13, and a plurality of fixed areas 14.
  • the conductive member 11 is provided with a strip-shaped slot 111 extending along the length of the conductive member 11, and the transmission line 12 is embedded in the slot 111 Inside, the transmission line 12 is fixedly connected to the slot 111 through the conductive glue 13, and the transmission line 12 is also fixedly connected and electrically connected to the conductive member 11 through the fixing area 14.
  • the transmission line 12 is a strip line.
  • the transmission line 12 includes a first ground line 125, a signal line 122, a base material 123, and a second ground line 126.
  • the base material 123 is covered at the opening of the slot 111.
  • the first ground line 125 and the second ground line 126 They are separately arranged on both sides of the base material 123.
  • the first ground wire 125 is arranged on the side of the base material 123 far away from the bottom of the groove 111.
  • the first ground wire 125 and the fixed area 14 are electrically and fixedly connected, and the signal wire 122 and the second The ground wire 126 is located in the slot 111, the first ground wire 125 is fixedly connected to the base material 123, the base material 123 is connected to the second ground wire 126, and the second ground wire 126 passes through the conductive glue 13 and the bottom 1111 of the slot 111
  • the signal line 122 is located in the substrate 123.
  • the first ground wire 125, the base material 123, the second ground wire 126 and the conductive glue 13 are stacked in sequence.
  • the second ground wire 126 is a conductive wire, and the second ground wire 126 is used for grounding.
  • the material of the second ground wire 126 is not limited.
  • the material of the second ground wire 126 may include conductive metal or alloy.
  • the width of the second ground wire 126 is equal to the width of the slot 111.
  • the present invention also provides an electronic device.
  • the electronic device may be a mobile terminal, such as a mobile phone.
  • the electronic device includes the aforementioned wire assembly 10, and the conductive member 11 of the wire assembly 10 is the metal frame of the electronic device, such as the wire assembly 10
  • the conductive member 11 is a metal middle frame or a metal outer frame of the electronic device. Installing the transmission line 12 on the metal frame of the electronic device is a new assembly method, saving space and reducing the volume of the electronic device.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Near-Field Transmission Systems (AREA)
  • Telephone Set Structure (AREA)

Abstract

一种线材组件和电子设备，涉及线材技术领域。线材组件包括导电件和传输线，导电件上开设有一条状开槽，传输线嵌设于开槽内，传输线包括一盖设于开槽的开口处的基材以及分设于基材两侧的地线和信号线，地线裸露在开槽的开口外，地线和导电件电性连接且固定连接，信号线位于开槽内，信号线和开槽的底部之间包括间隙。电子设备包括线材组件，线材组件的导电件为电子设备的金属框体。本发明的线材组件和电子设备具有体积小且传输信号性能好的优点。

Description

线材组件和电子设备 技术领域
本发明涉及线材技术领域，尤其涉及一种线材组件和电子设备。
 背景技术
现有的同轴传输线和微带传输线的结构较为单一，现有的同轴传输线和微带传输线需要一定的空间，对于高速发展的终端产品内部布局有一定的局限性，而一味地减小传输线尺寸又不得不以降低性能为代价。
因此，如何提供一种体积小，且传输信号性能好的线材，就成了现有技术的需求。
 技术问题
本发明的目的在于提供一种体积小且传输信号性能好的线材组件和电子设备。
 技术解决方案
本发明的技术方案如下：
本发明提供一种线材组件，所述线材组件包括导电件和传输线，所述导电件上开设有一条状开槽，所述传输线嵌设于所述开槽内，所述传输线包括一盖设于所述开槽的开口处的基材以及分设于所述基材两侧的地线和信号线，所述地线裸露在所述开槽的开口外，所述地线和所述导电件电性连接且固定连接，所述信号线位于所述开槽内，所述信号线和所述开槽的底部之间包括间隙。
作为一种改进方式，所述线材组件还包括在所述传输线的相对的两侧的每一侧间隔设置的多个所述固定区，所述地线和所述固定区一体设置且所述地线和所述固定区电性连接，所述固定区设于所述导电件开设开槽的表面且与该表面固定连接和电性连接。
作为一种改进方式，所述固定区和所述导电件之间通过镭射工艺焊接的方式进行电性连接和固定连接。
作为一种改进方式，每个所述固定区上至少包括一个镭射孔。
作为一种改进方式，所述传输线两侧的固定区关于所述传输线对称设置。
作为一种改进方式，在所述传输线的同一侧，两个相邻的固定区之间的距离小于信号线传输信号的最小波长的四分之一。
作为一种改进方式，在所述传输线的同一侧，每两个相邻的固定区之间的距离相等。
作为一种改进方式，所述基材的介电常数为3.2~3.4。
作为一种改进方式，所述导电件的材质包括铜、铝或银。
本发明还提供一种电子设备，电子设备包括上述的线材组件，所述线材组件的所述导电件为所述电子设备的金属框体。
 有益效果
本发明实施方式相对于现有技术而言，导电件上开设有一条状开槽，所述传输线嵌设于所述开槽内，所述传输线包括一盖设于所述开槽的开口处的基材以及分设于所述基材两侧的地线和信号线，所述地线裸露在所述开槽的开口外，所述地线和所述导电件电性连接且固定连接，信号线位于所述开槽内，信号线和开槽的底部之间包括间隙能减少信号线中传输信号的泄露和损耗，信号传输性能好，传输信号稳定，且线材组件结构简单，能制作的体积小，符合了小型化的需求。本发明的电子设备中，导电件为电子设备的金属框体，即在电子设备的金属框体上安装传输线，节省了空间，减小了电子设备的体积。
 附图说明
图1为本发明实施例提供的线材组件的立体结构示意图；
图2为本发明实施例提供的线材组件的爆炸结构示意图；
图3为本发明实施例提供的导电件的立体结构示意图；
图4为本发明实施例提供的传输线的爆炸结构示意图；
图5为本发明实施例提供的固定区的立体结构示意图；
图6为本发明实施例提供的另一实施例线材组件的立体结构示意图；
图7为图6中A处的放大结构示意图；
图8为本发明实施例提供的又一实施例线材组件的立体结构示意图；
图9为图8中B处的放大结构示意图。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产 品或设备固有的其它步骤或单元。
需要说明的是，在本发明中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
请一并参照图1和图2，本发明提供了一种线材组件10，该线材组件10能传输信号给其他装置，如线材组件10能用于天线上。线材组件10包括导电件11、传输线12、导电胶13和多个固定区14，导电件11上开设沿导电件11长度方向延伸的条状开槽111，传输线12嵌设于开槽111内，传输线12通过所述导电胶13和所述开槽111固定连接，传输线12还通过固定区14和导电件11固定连接且电性连接。
请参阅图3，导电件11的长度可根据需要进行设置。导电件11的材质包括可导电的材质，具体的，导电件11的材质可以包括但不限于金属或合金，如铜，铝或银等。可以理解，导电件11的形状可根据需要做改变，如需要线材组件10弯折，则导电件11也根据需要进行弯折。导电件11也可以采用其他形状，如五棱柱形，六棱柱形等。
开槽111开设在导电件11的沿长度方向延伸的一表面上，开槽111沿导电件11的长度方向延伸。本实施例中，开槽111的长度等于导电件11的长度，即开槽111沿导电件11的长度方向贯穿导电件11，开槽111包括底部1111和与底部1111连接的相对的两个侧壁1112。
导电胶13既能导电，又具有粘性，起到电性连接和固定连接的作用，导电胶13能把导电件11的开槽111的底部和传输线12电性连接和固定连接。导电胶13可以为导电双面胶。
请参阅图4，传输线12为微带线。具体的，传输线12包括地线121、信号线122和基材123，基材123盖设于开槽111的开口处，地线121设于基材123远离开槽111底部的一侧。地线121和固定区14电性连接且固定连接，信号线122位于开槽111内，地线121和基材123固定连接，基材123通过导电胶13和开槽111的底部1111固定连接，信号线122位于所述基材123内。其中，地线121、基材123和导电胶13依次层叠设置。
信号线122用于传输信号。信号线122和地线121间隔设置。如具有一定波长和频率的信号。信号线122传输的信号的波长可以为一个变化值，即信号线122传输的信号为在一个频段内的信号，而不是一个固定频率的信号。
地线121为能够导电的导线，地线121用于接地。地线121裸露在所述开槽111的开口外。地线121遮蔽所述开槽111的开口112，能减少信号线122中传输的信号的泄露。地线121的材质不做限定，如地线121的材质可以包括导电的金属或合金。
基材123上沿基材123的长度方向开设贯穿基材123相对的两端面的穿孔1231，穿孔1231用于容纳信号线122。基材123的介电常数为3.2~3.4，基材123的介电常数优选为3.3。基材123的材质包括但不限于PI（Polyimide，聚酰亚胺）、PTFE（Poly tetra fluoroethylene，聚四氟乙烯）、PEEK（Polyetherether ketone，聚醚醚酮）和LCP（Liquid Crystal Polymer，液晶聚合物）。优选地，基材123的宽度和开槽111的宽度相等。基材123通过导电胶13和开槽111的底部1111连接，增加了传输线12的稳定性。
请一并参阅图5和图1，多个固定区14在地线121的相对的两侧的每一侧间隔设置。固定区14还设于导电件11开设开槽111的表面且与该表面固定连接和电性连接。优选的，地线121和固定区14一体设置且地线121和固定区14电性连接。固定区14的材质不做限定，如固定区14的材质可以包括导电的金属或合金，如固定区14可以为金属片。固定区14可以和地线121一体成型。地线121两侧的固定区14关于地线121对称设置。优选地，在地线121的同一侧，两个相邻的固定区14之间的距离L小于信号线122传输信号的最小波长的四分之一。优选地，在地线121的同一侧，每两个相邻的固定区14之间的距离L相等。固定区14和导电件11之间通过镭射工艺焊接的方式进行电性连接和固定连接，并在地线121的固定区14上形成镭射孔141。镭射工艺即激光工艺，镭射工艺焊接时可以采用连续或脉冲激光束加以实现。镭射工艺焊接时，采用激光的功率密度优选为大于107 W/cm 2，金属表面受热作用下凹成“孔穴”，即形成镭射孔141，形成深熔焊，具有焊接速度快、深宽比大的特点。采用镭射工艺焊接，使固定区14和导电件11紧密固定，且电性连接效果好，固定区14和导电件11充分电性连接，地线121或导电件11接地，能减少信号线122中信号的泄露。每个固定区14上至少包括一个镭射孔141。在本实施中，每个固定区14上包括四个镭射孔141，所述四个镭射孔141形成正方形、并分别位于正方形的四个角上。镭射孔141减少了信号的泄露。
本实施例的线材组件10的结构简单，线材组件10的体积较小，符合了小型化的需求。
请一并参阅图6和图7，在一个实施例中，省略设置导电胶13，且信号线122不再位于基材123内，信号线122设置在基材123远离地线121的一侧且和基材123连接，信号线122和开槽111的底部1111之间设有间隙124。
具体的，线材组件10包括导电件11、传输线12和多个固定区，导电件11上开设沿导电件11长度方向延伸的条状开槽111，传输线12嵌设于开槽111内。传输线12通过固定区14和导电件11固定连接且电性连接
传输线12为微带线。具体的，传输线12包括地线121、信号线122和基材123，基材123盖设于开槽111的开口处，地线121和信号线122分设于基材123的两侧，地线121设于基材123远离开槽111底部的一侧，地线121和固定区14电性连接且固定连接。信号线122位于所述开槽111内，地线121和基材123固定连接，信号线122设置在基材123远离地线121的一侧且和基材123连接，信号线122和开槽111的底部1111之间设有间隙124，间隙124内为空气。其中，地线121、基材123和信号线122依次层叠设置。由于空气的介电常数为1，基材123的介电常数为3.2~3.4，空气的介电常数小于基材123的介电常数，间隙124能减小线材组件10的整体介电常数，减小了信号线122中的信号泄露和损耗。
请一并参阅图8和图9，在一个实施例中，传输线12还包括第二地线126，为加以区别，前述实施例的地线121称为第一地线125。第二地线126位于开槽111内，基材123和第二地线126连接，第二地线126通过导电胶13和开槽111的底部1111连接。由于导电胶13导电，实现了第二地线126和导电件11的电性连接和固定连接。
具体的，线材组件10包括导电件11、传输线12导电胶13和多个固定区14，导电件11上开设沿导电件11长度方向延伸的条状开槽111，传输线12嵌设于开槽111内，传输线12通过所述导电胶13和所述开槽111固定连接，传输线12还通过固定区14和导电件11固定连接且电性连接。
在本实施例中，传输线12为带状线。具体的，传输线12包括第一地线125、信号线122、基材123和第二地线126，基材123盖设于开槽111的开口处，第一地线125和第二地线126分设于基材123的两侧，第一地线125设于基材123远离开槽111底部的一侧，第一地线125和固定区14电性连接且固定连接，信号线122和第二地线126位于所述开槽111内，第一地线125和基材123固定连接，基材123和第二地线126连接，第二地线126通过导电胶13和开槽111的底部1111连接，信号线122位于所述基材123内。其中，第一地线125、基材123、第二地线126和导电胶13依次层叠设置。
第二地线126为能够导电的导线，第二地线126用于接地。第二地线126的材质不做限定，如第二地线126的材质可以包括导电的金属或合金。优选地，第二地线126的宽度等于开槽111的宽度。其中，第一地线125的地线121、基材123、第二地线126和导电胶13依次层叠设置。
本发明还提供一种电子设备，电子设备可以是移动终端，如手机，电子设备包括上述的线材组件10，线材组件10的导电件11为所述电子设备的金属框体，如线材组件10的导电件11为所述电子设备的金属中框或金属外框。在电子设备的金属框体上安装传输线12，为新的装配方式，节省了空间，减小了电子设备的体积。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。

Claims (10)

  1. 一种线材组件，其特征在于：所述线材组件包括导电件和传输线，所述导电件上开设有一条状开槽，所述传输线嵌设于所述开槽内，所述传输线包括一盖设于所述开槽的开口处的基材以及分设于所述基材两侧的地线和信号线，所述地线裸露在所述开槽的开口外，所述地线和所述导电件电性连接且固定连接，所述信号线位于所述开槽内，所述信号线和所述开槽的底部之间包括间隙。
  2. 根据权利要求1所述的线材组件，其特征在于：所述线材组件还包括在所述传输线的相对的两侧的每一侧间隔设置的多个所述固定区，所述地线和所述固定区一体设置且所述地线和所述固定区电性连接，所述固定区设于所述导电件开设开槽的表面且与该表面固定连接和电性连接。
  3. 根据权利要求2所述的线材组件，其特征在于：所述固定区和所述导电件之间通过镭射工艺焊接的方式进行电性连接和固定连接。
  4. 根据权利要求2所述的线材组件，其特征在于：每个所述固定区上至少包括一个镭射孔。
  5. 根据权利要求2所述的线材组件，其特征在于：所述传输线两侧的固定区关于所述传输线对称设置。
  6. 根据权利要求2所述的线材组件，其特征在于：在所述传输线的同一侧，两个相邻的固定区之间的距离小于信号线传输信号的最小波长的四分之一。
  7. 根据权利要求2所述的线材组件，其特征在于：在所述传输线的同一侧，每两个相邻的固定区之间的距离相等。
  8. 根据权利要求1所述的线材组件，其特征在于：所述基材的介电常数为3.2~3.4。
  9. 根据权利要求1所述的线材组件，其特征在于：所述导电件的材质包括铜、铝或银。
  10. 一种电子设备，其特征在于：包括如权利要求1-9所述的线材组件，所述线材组件的所述导电件为所述电子设备的金属框体。
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