WO2020252904A1

WO2020252904A1 - Laser light source and laser projection apparatus

Info

Publication number: WO2020252904A1
Application number: PCT/CN2019/102714
Authority: WO
Inventors: 崔雷; 邢哲
Original assignee: 青岛海信激光显示股份有限公司
Priority date: 2019-06-19
Filing date: 2019-08-27
Publication date: 2020-12-24
Also published as: CN210038424U

Abstract

Provided are a laser light source and a laser projection apparatus. The laser light source comprises a laser device, and a heat dissipation device for carrying out heat dissipation on the laser device. The heat dissipation device comprises: a heat dissipation assembly and a heat conduction assembly, the heat conduction assembly being attached to a heat sink of the laser device, and the heat conduction assembly being connected between the laser device and the heat dissipation assembly for transferring the heat from the laser device to the heat dissipation assembly; and a low-emissivity pattern layer provided on a surface of at least one of the heat conduction assembly and the heat dissipation assembly.

Description

Laser light source and laser projection equipment

Cross references to related applications

This application claims the priority of the Chinese patent application filed on June 19, 2019 with application number 2019209227305, the full text of which is incorporated herein by reference.

Technical field

This application relates to the field of laser projection display technology, and in particular to a laser light source and laser projection equipment.

Background technique

Laser projection display technology uses high-power semiconductor lasers to convert electrical energy into light energy. It is a new type of display technology in which a circuit system, an optical system and a lens system project the laser onto the screen for laser image projection.

When the laser projection device is working, it emits a laser with higher energy and generates a lot of heat, so it needs to be dissipated. Air-cooled heat dissipation technology can be used to dissipate the laser. In the air-cooled heat dissipation technology, the air-cooled heat dissipation structure conducts heat dissipation on the laser through the metal material, and then uses the phase change convection heat transfer of the heat pipe to conduct the heat of the metal material to the heat dissipation fins. The fan performs convective heat dissipation on the radiating fins to achieve the purpose of quickly dissipating the heat of the laser.

Summary of the invention

The present application provides a laser light source and laser projection equipment. The heat dissipation device of the laser light source has high heat dissipation efficiency.

In one aspect, the present application provides a laser light source, the laser light source includes a laser; and a heat dissipation device, the heat dissipation device is used to dissipate the laser, the heat dissipation device includes: a heat dissipation component; and a heat conduction component, the heat conduction The component is attached to the heat sink of the laser, and the heat-conducting component is connected between the laser and the heat-dissipating component, and is used to transfer the heat from the laser to the heat-dissipating component; and the low-emissivity layer is arranged on the heat-conducting component And the surface of at least one of the heat dissipation components.

In another aspect, the present application provides a laser projection device, which includes the laser light source as described above, the laser light source includes a laser; and a heat dissipation device, the heat dissipation device is used to dissipate the laser, and the heat dissipation The device includes: a heat dissipating component; and a heat-conducting component, the heat-conducting component is attached to the heat sink of the laser, and the heat-conducting component is connected between the laser and the heat-dissipating component, and is used to transfer heat from the laser to the heat-dissipating component; And a low emissivity layer, arranged on the surface of at least one of the heat conducting component and the heat dissipation component.

Description of the drawings

In order to more clearly describe the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained from these drawings without creative work.

Fig. 1 is a schematic diagram of the structure of a laser light source according to an embodiment of the present application;

Fig. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

Figure 3 is an exploded view of a heat dissipation device according to an embodiment of the present application;

4 is a schematic diagram of the structure of a heat pipe according to an embodiment of the present application;

Fig. 5 is a schematic cross-sectional view of a heat pipe according to an embodiment of the present application;

Fig. 6 is a schematic structural diagram of a heat conducting element according to an embodiment of the present application;

Fig. 7 is a schematic structural diagram of a heat conducting element according to another embodiment of the present application.

Description of reference signs:

100-heat sink; 110-heat-conducting component; 111-heat pipe; 1111-groove; 112-heat-conducting element; 1121-first arc groove; 1122-second arc groove; 113-fixing part; 120-heat dissipation Components; 121- cooling fin group; 1211- cooling fin; 130- low emissivity coating; 140- fan; 200- laser light source; 210- laser

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of this application.

In laser projection equipment, the laser is used to emit laser light and is used as the light source of the laser projection equipment. The laser converts electrical energy into light energy in the working process. The conversion efficiency is generally about 40%. The remaining 60% of the electrical energy is converted into heat energy to make the laser. The temperature of the laser increases, and as the temperature of the laser increases, the luminous efficiency of the laser shows a downward trend. As the laser projection equipment tends to be miniaturized, the volume of the laser light source is getting smaller and smaller. As the light-emitting part of the laser light source, the laser has gradually changed from a separate arrangement to an integrated semiconductor chip. As the volume of the laser becomes smaller, the heat sink area of the heat sink decreases. The above reasons all lead to higher requirements on the heat dissipation technology of the laser, especially for the two-color or full-color laser with very strict temperature control.

At present, the technology for laser heat dissipation is mainly divided into two types: liquid cooling technology and air cooling technology. Due to the high cost of liquid cooling technology and its structure occupying a large internal space of laser projection equipment, air cooling is generally used at present The heat dissipation technology heats the laser. Air-cooled heat dissipation technology mainly uses the principles of heat conduction and convection heat transfer. Metal blocks are usually used to take away the heat of the laser, and the heat pipes are used to conduct efficient phase change heat transfer from the metal blocks to the heat dissipation fins, and the fins are forced by fans. Convection heat dissipation can quickly dissipate the heat of the laser. The air-cooled heat dissipation structure can be adjusted to adapt to different spatial structures; the material of the air-cooled heat dissipation structure has a wide selection range and relatively low cost, so it is the heat dissipation method usually used by lasers.

However, in order to ensure the thermal conductivity, the air-cooled heat dissipation structure is generally made of metal and other materials. When the laser is working, it will emit light with higher brightness and energy, that is to say, a large part of the heat is dissipated in the form of light radiation. come out. Most of these light rays hit the metal surface and are reflected back to the location of the laser. In this way, the heat generated by the laser is difficult to dissipate and is concentrated on the laser, resulting in low heat dissipation and cooling efficiency.

In view of this, the following embodiments provide an improved laser light source and laser projection equipment. The laser light source is provided with a heat dissipation device to dissipate the laser, and the radiation heat transfer between the heat dissipation device and the housing of the laser light source is less. Improve the heat dissipation efficiency of the laser light source by the heat sink.

1 is a schematic diagram of the structure of a laser light source according to an embodiment of the application; FIG. 2 is a schematic diagram of the structure of a heat dissipation device according to an embodiment of the application; FIG. 3 is an exploded view of the heat dissipation device according to an embodiment of the application; Fig. 5 is a schematic cross-sectional view of a heat pipe according to an embodiment of the present application; Fig. 6 is a schematic structural view of a heat conducting element according to an embodiment of the present application; Fig. 7 is another schematic view of an embodiment according to the present application A schematic diagram of the structure of a heat conducting element.

As shown in FIGS. 1 to 3, an embodiment of the present application provides a laser light source 200, and the laser light source 200 includes a laser 210 and a heat dissipation device 100. The heat dissipating device 100 is used to dissipate heat to the laser 210. The heat dissipating device 100 includes a heat conducting component 110 and a heat dissipating component 120. The heat conducting component 110 is attached to the heat sink of the laser 210, and the heat conducting component 110 is connected between the laser 210 and the heat dissipating component 120, For transferring the heat on the laser 210 to the heat dissipation component 120, the surface of at least one of the heat conduction component 110 and the heat dissipation component 120 is provided with a low emissivity coating 130.

The laser light source 200 includes a laser 210 and a heat dissipation device 100. The laser 210 is used to emit laser light to provide a light source. The laser 210 generates high heat when it is working. The heat sink 100 can be used to dissipate heat from the laser 210. In addition, the heat sink 100 can also be used to perform heat dissipation on other functional devices with similar structures or heating principles to the laser 210. Heat dissipation, no more details here.

The heat dissipation device 100 includes a heat conduction component 110 and a heat dissipation component 120. The heat-conducting component 110 is used to conduct the heat of the laser 210 to the heat-dissipating component 120, and radiate the heat to the outside through the heat-dissipating component 120, thereby dissipating the laser 210. Specifically, the laser 210 has a heat dissipation surface, and the heat conduction component 110 is attached to the heat dissipation surface of the laser 210. The heat conduction component 110 conducts the heat of the laser 210 to the heat conduction component 110 in a thermal conduction manner by contacting the heat dissipation surface of the laser 210, and conducts heat. The component 110 is connected to the heat dissipation component 120 to transfer the heat of the laser 210 to the heat dissipation component 120, and the heat of the laser 210 is radiated outward through the heat dissipation component 120 to dissipate the laser 210.

It should be noted that the heat-conducting component 110 and the heat-dissipating component 120 are usually made of metal materials. Metal materials have better heat transfer performance. By attaching the metal material to the heat dissipation surface of the laser 210, the heat of the laser 210 can be lower Faster and more complete transfer to the heat-conducting component 110, then the heat-conducting component 110 made of metal material can quickly transfer heat to the heat-dissipating component 120, and the heat-dissipating component 120 made of metal material can also quickly transfer the heat to Distributed outside. Of course, the materials used to make the heat-conducting component 110 and the heat-dissipating component 120 may also be non-metallic materials with good heat transfer performance, which is not limited in the embodiment of the present application.

In this embodiment, the laser 210 is located in the laser light source 200. The laser 210 generates more heat during operation. When the laser light emitted by the laser 210 irradiates the housing of the laser light source 200 and other parts, the housing of the laser light source 200 The body also generates heat. In order to enable the heat sink 100 not only to dissipate heat from the laser 210, but also to dissipate the heat radiated from the housing of the laser light source 200 to slow the increase in the housing temperature of the laser light source 200, it can be designed The heat dissipation component 120 has a relatively large size and volume, so that the heat emitted by the housing of the laser light source 200 can be dissipated through the heat dissipation component 120.

However, due to the high brightness and intensity of the laser light emitted by the laser 210, the heat is transferred from the heat dissipation surface of the laser 210 to the heat-conducting component 110 through the heat-conducting component 110 during the heat dissipation process of the laser 210. After the heat dissipating component 120, the heat conducting component 110 and the heat dissipating component 120 absorb the heat from the laser 210, the temperature of the surfaces of both will increase. Generally, the heat-conducting component 110 and the heat-dissipating component 120 are made of metal materials, and the emissivity of the metal material increases with the increase of surface temperature, thereby increasing the heat radiated by the heat-conducting component 110 and/or the heat-dissipating component 120 per unit time; The heat-conducting component 110 and the heat-dissipating component 120 absorb the heat of the laser 210, so the temperature of the heat-conducting component 110 and the heat-dissipating component 120 is higher than the temperature of the laser 210, and the temperature of the heat-conducting component 110 and the heat-dissipating component 120 is also higher than the housing of the laser light source 200 temperature. Therefore, during the working process of the heat dissipation device 100, the heat dissipation device 100 with a higher temperature will radiate heat to the laser 210 and the housing of the laser light source 200 that have a lower temperature, which will cause the temperature of the laser 210 and the housing of the laser light source 200 to rise. High, which is not conducive to the heat dissipation of the laser light source 200 by the heat dissipation device 100, and reduces the heat dissipation efficiency of the heat dissipation device 100.

In addition, for the case where the heat-conducting component 110 and the heat-dissipating component 120 in the heat sink 100 are made of non-metallic materials, although the emissivity of the non-metallic materials generally decreases with the increase in surface temperature, due to the The heat-conducting component 110 and the heat-dissipating component 120, which have higher emissivity, will still radiate heat to the housings of the laser 210 and the laser light source 200, which is also caused by the heat dissipation device 100 and the housings of the laser 210 and the laser light source 200. The radiation heat transfer reduces the heat dissipation efficiency of the heat dissipation device 100.

For the heat dissipation component 120 with a larger volume, it was originally intended to better dissipate heat from the housing of the laser light source 200, but on the contrary, it will radiate more heat to the housing of the laser light source 200 due to its larger volume, which may aggravate The temperature of the housing of the laser light source 200 increases, which negatively affects the heat dissipation effect of the heat dissipation device 100.

Therefore, by providing the low-emissivity coating 130 on the surface of the heat-conducting component 110 and/or the heat-dissipating component 120, the emissivity of the surface of the heat-conducting component 110 and/or the heat-dissipating component 120 can be reduced, so as to reduce the radiation of the heat sink 100 to the laser light source 200 housing Therefore, the heat dissipation efficiency of the laser 210 and the housing of the laser light source 200 by the heat dissipation device 100 is improved. Among them, the emissivity of the low-emissivity coating 130 is lower than the emissivity of the thermal conductive component 110 and the heat dissipation component 120.

It should be noted that the low-emissivity coating 130 may be provided only on the surface of the heat dissipation component 120, or only the low-emissivity coating 130 may be provided on the surface of the heat-conducting component 110, or both the heat-dissipating component 120 and the heat-conducting component 110 may be provided. Low emissivity coating 130, which can be determined according to actual conditions. In order to better reduce the heat radiation from the surface of the heat sink 100 to the housing of the laser light source 200, a low-emissivity coating 130 should be provided at least on the surface of the heat dissipation component 120 with a larger volume; The emissivity coating 130 can further reduce the surface reflection of the heat sink 100 and improve the overall heat dissipation efficiency of the heat sink 100 to the laser 210 and the laser light source 200 housing.

In a possible embodiment, the low-emissivity coating 130 may be located on the surface of the heat dissipation component 120 facing the laser 210; and/or on the surface of the heat conducting component 110 facing the laser 210. On the one hand, the low-emissivity coating 130 can reduce the emissivity of the heat dissipation component 120 and/or the heat-conducting component 110. By coating the low-emissivity coating 130 on the surface of the heat-dissipating component 120 and/or the heat-conducting component 110, it can reduce The emissivity of the heat dissipation component 120 and/or the thermal conductivity component 110. As for the specific position of the low-emissivity coating 130 on the surface of the heat dissipation component 120 and/or the heat-conducting component 110, the embodiment of the present application does not specifically limit it. As long as the low-emissivity coating 130 has a lower emissivity, the heat dissipation component 120 can be reduced. And/or the emissivity of the thermally conductive component 110 is sufficient.

On the other hand, providing the low-emissivity coating 130 can reduce the heat radiated by the heat dissipation component 120 and/or the thermal conductivity component 110 to the housing of the laser light source 200. The radiation heat transfer between the heat dissipation assembly 120 and/or the heat conduction assembly 110 and the housing of the laser light source 200 is mainly performed through a part of the surface of the heat dissipation assembly 120 and/or the heat conduction assembly 110 facing the housing of the laser light source 200. The housing of the laser light source 200 is mainly used to fix the laser 210, so for the heat sink 100, the housing of the laser light source 200 and the laser 210 are located on the same side. A low-emissivity coating 130 is provided on the surface of the heat dissipation component 120 and/or the heat conduction component 110 facing the laser 210, which can effectively reduce the heat radiated by the surface of the heat dissipation component 120 and/or the heat conduction component 110 to the housing of the laser light source 200.

In order to ensure high heat dissipation efficiency of the heat dissipation device 100, it is avoided that the low-emissivity coating 130 is set at an inappropriate position, which may reduce the effect of the heat dissipation component 120 and/or the heat conduction component 110 on the housing of the laser light source 200. Therefore, not only the low emissivity coating 130 can be provided on the side of the heat dissipation component 120 and/or the heat conduction component 110 facing the laser 210, but also the low emissivity coating 130 can be provided on the surface of the heat dissipation component 120 and/or the heat conduction component 110. The coating 130 is used to ensure that all parts of the heat sink 100 have low emissivity.

It should be noted that, since the low-emissivity coating 130 provided on the surface of the heat dissipation component 120 and/or the heat conduction component 110 can be used to reduce the heat radiated by the heat dissipation device 100 to the housing of the laser 210 and the laser light source 200, therefore, in this embodiment The surface of the heat dissipation component 120 and/or the heat conduction component 110 facing the laser 210 not only includes the surface facing the laser 210, but may be the surface facing the entire laser light source 200, including the surface facing the laser 210, the housing of the laser light source 200, and the like.

In a possible embodiment, the surface of the low-emissivity coating 130 may have better flatness. The better the flatness, the smaller the surface roughness of the low-emissivity coating 130, so that the low-emissivity coating 130 The lower the emissivity, the better the effect of reducing the emissivity of the heat sink 100. Therefore, when setting the low-emissivity coating 130, the particle size of the material for making the low-emissivity coating 130 can be set within a reasonable range, or the uniformity of the low-emissivity coating 130 can be controlled to make the low-emissivity coating 130 The low-emissivity coating 130 has better flatness, and the low-emissivity coating 130 itself has a lower emissivity, and its emissivity is further reduced.

In a possible embodiment, the low-emissivity coating 130 may be composed of a brighter color material. The low-emissivity coating 130 is made of a brighter color material, so that the low-emissivity coating 130 has a lower Emissivity, which can effectively reduce or even prevent the heat dissipation component 120 and/or the heat conduction component 110 from radiating heat to the laser 210 and the laser light source 200 housing. By reducing the radiation heat transfer between the heat sink 100 and the housing of the laser light source 200, the temperature increase of the housing of the laser 210 and the laser light source 200 can be slowed down.

Generally, the low-emissivity coating 130 made of a darker material has a higher emissivity than the low-emissivity coating 130 made of a brighter material. Therefore, in the embodiment of the present application, a material with a brighter color is selected to make the low emissivity coating 130. However, for some special materials with darker color but lower emissivity, it is also suitable for the low emissivity coating 130 in the embodiment of the present application, which is not limited in the embodiment of the present application.

Of course, while the low-emissivity coating 130 can be made of brighter materials, the surface of the low-emissivity coating 130 can have better flatness, which can better improve the heat dissipation device 100 and the laser light source 200 housing The radiation heat transfer between the bodies can more significantly slow down the temperature increase of the laser 210 and the laser light source 200 housing.

Specifically, the thickness of the low-emissivity coating 130 may be between 0.03-0.06 mm; and/or, the emissivity of the low-emissivity coating 130 may be less than 0.2. By setting the thickness of the low-emissivity coating 130 between 0.03-0.06mm, it can be ensured that the low-emissivity coating 130 has sufficient thickness to cover the surface of the heat dissipation component 120 and/or the heat conduction component 110 to ensure low emission The low-emissivity coating 130 can effectively reduce the emissivity of the heat dissipation component 120 and/or the heat-conducting component 110, and at the same time avoids the structure size of the heat-dissipating component 120/or the heat-conducting component 110 being affected by the excessive thickness of the low-emissivity coating 130, ensuring that the temperature is relatively high. In the case of high, there is still sufficient adhesion between the low-emissivity coating 130 and the heat dissipation component 120 and/or the heat-conducting component 110 to ensure the stability of the low-emissivity coating 130. The thickness of the low-emissivity coating 130 may be 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, etc., which is not limited in this embodiment.

By controlling the emissivity of the low-emissivity coating 130 to be less than 0.2, the emissivity of the low-emissivity coating 130 is sufficiently small, and the low-emissivity coating 130 covers the heat dissipation component 120 and/or the heat conduction component 110, thus reducing The emissivity of the heat-dissipating component 120 and/or the heat-conducting component 110 reduces the heat radiated by the heat-dissipating component 120 and/or the heat-conducting component 110 to the housing of the laser 210 and the laser light source 200, and improves the gap between the heat dissipation device 100 and the housing of the laser light source 200 The radiant heat transfer of the radiator slows down the temperature increase of the laser 210 and the laser light source 200 housing.

In addition, the thickness of the low-emissivity coating 130 can be controlled to be between 0.03-0.06 mm, and the emissivity of the low-emissivity coating 130 is less than 0.2, which will not be repeated here.

Optionally, the low-emissivity coating 130 may include at least one low-emissivity coating, such as a metal layer. The metal layer is composed of a metal material, and the emissivity of the metal material is low. By providing a low-emissivity coating 130 on the surface of the heat dissipation component 120 and/or the heat conduction component 110, the emission of the heat dissipation component 120 and/or the heat conduction component 110 can be effectively reduced. rate. Among them, the metal layer as the low emissivity coating 130 can reduce the emissivity of the heat dissipation component 120 and/or the heat conduction component 110, thereby reducing the heat radiated by the heat dissipation component 120 and/or the heat conduction component 110 to the housing of the laser light source 200.

It should be noted that the embodiment of the present application does not specifically limit the low emissivity coating 130 including several metal layers, which can be determined according to actual requirements. In addition, in order to ensure the strength of the connection between the metal layer and the surface of the heat dissipation component 120 and/or the heat conduction component 110, an adhesive layer may also be provided between the surface of the heat dissipation component 120 and/or the heat conduction component 110 and the metal layer; or, In order to protect the metal layer from damage, a protective layer and other structures can also be provided on the metal layer, which is not limited in this embodiment.

In a possible embodiment, the heat dissipation assembly 120 may include a heat dissipation fin group 121, and the heat dissipation fin group 121 may include a plurality of heat dissipation fins 1211 arranged at intervals, and at least part of the surface of the heat dissipation fin 1211 is covered with low emission Rate coating 130.

As shown in Figures 2 and 3, the heat dissipation assembly 120 includes a heat dissipation fin group 121, which includes a plurality of heat dissipation fins 1211 arranged at intervals, and the plurality of heat dissipation fins 1211 can be welded by fasteners or welding. The heat dissipation fins 1211 can extend perpendicular to the substrate. The heat of the laser 210 is transferred to the heat dissipation fins 1211 by the heat conduction assembly 110. The heat dissipation area is increased by the heat dissipation fins 1211, so that the heat of the laser 210 is increased. Was quickly lost. Wherein, the spacing between adjacent heat dissipation fins 1211 may be equal, so that the heat dissipation fin group 121 can uniformly dissipate heat outward through all the heat dissipation fins 1211.

When the heat dissipation component 120 is arranged next to the housing of the laser light source 200, the volume of the heat dissipation component 120 can be larger to provide more heat dissipation fins 1211 to enhance the heat dissipation performance of the heat dissipation component 120, and reduce the heat dissipation through the low emissivity coating 130 The emissivity of the fin set 121 reduces the heat radiated by the heat dissipation fin set 121 to the laser 210 and the laser light source 200 housing. The low emissivity coating 130 can be covered on at least part of the surface of the heat dissipation fin 1211 facing the laser 210 and the laser light source 200, so that the low emissivity coating 130 on the surface of the heat dissipation fin 1211 can effectively reduce the emissivity of the heat dissipation fin 1211 . Among them, the surface of all heat dissipation fins 1211 can be covered with a low-emissivity coating 130 to reduce the emissivity of each heat dissipation fin 1211, thereby effectively reducing the impact of all heat dissipation fins 1211 on the laser 210 and laser light source 200 housing Radiated heat.

As shown in FIGS. 3 to 5, in a possible implementation manner, the heat conducting component 110 may include at least one heat pipe 111. Among the plurality of heat pipes 111, the surface of at least one heat pipe 111 is covered with a low emissivity coating 130. In this embodiment, the heat conducting component 110 includes a heat pipe 111 connected to the heat dissipation fin set 121, the heat of the laser 210 is transferred to the heat dissipation fin set 121 through the heat pipe 111, and the heat is dissipated outward through the heat dissipation fin 1211.

Specifically, the heat conducting assembly 110 may include multiple heat pipes 111. Due to the large volume of the heat dissipation fin group 121, the heat pipe 111 is connected to the heat dissipation fin group 121, and one end of the heat pipe 111 is connected to the heat dissipation fin group 121 It may be arranged at intervals in the center of each row of the heat dissipation fins 1211 in the heat dissipation fin group 121. In this way, the multiple heat pipes 111 transfer heat to the center of each row of radiating fins 1211, and evenly transfer heat from the center of each row of radiating fins 1211 to all parts of the radiating fin group 121, and pass the radiating fins 1211 to the outside. Dissipate heat evenly. Wherein, the heat pipe 111 may penetrate through the heat dissipation fins 1211 at both ends of the heat dissipation fin group 121 so that the heat pipe 111 can transfer heat to each heat dissipation fin 1211.

Among the multiple heat pipes 111, the surface of at least one heat pipe 111 is covered with a low-emissivity coating 130. The low-emissivity coating 130 reduces the emissivity of the surface of the heat pipe 111 and reduces the radiation of the heat pipe 111 to the laser 210 and the laser light source 200 shell. The heat further slows down the temperature increase of the laser 210 and the housing of the laser light source 200, which will not be repeated here. The surface of all the heat pipes 111 can be covered with a low-emissivity coating 130 to reduce the emissivity of each heat pipe 111 and reduce the heat radiated by all the heat pipes 111 to the shell of the laser light source 200 and the laser 210; in addition, the number of heat pipes 111 can be There are 3, 4, 5 or even more, which can be determined according to actual needs, and this embodiment does not specifically limit it.

Specifically, a plurality of arc-shaped grooves 1111 may be distributed on the inner wall of the heat pipe 111 at intervals, the depth of the grooves 1111 may be less than 0.05 mm, and the diameter of the grooves 1111 may be less than 0.03 mm. As shown in FIGS. 4 and 5, the heat pipe 111 may be a hollow metal tube body, and a plurality of arc-shaped grooves 1111 are distributed on the inner wall of the heat pipe 111, and the plurality of arc-shaped grooves 1111 are along the circumference of the heat pipe 111. The grooves 1111 extend along the axial direction of the heat pipe 111. The depth of the groove 1111 is less than 0.05mm and the diameter of the groove 1111 is less than 0.03mm to ensure that the liquid in the heat pipe 111 has high evaporation and condensation. Therefore, the heat transfer efficiency of the heat pipe 111 is further improved. The heat of the laser 210 can be quickly transferred to the heat dissipation assembly 120 through the heat conduction assembly 110 through the heat pipe 111, and the heat can be dissipated in time through the heat dissipation fin group 121 of the heat dissipation assembly 120.

In a possible implementation, as shown in FIGS. 6 and 7, the heat-conducting component 110 may further include a heat-conducting member 112. The first side surface of the heat-conducting member 112 may be attached to the heat dissipation surface of the laser 210. A plurality of first circular arc grooves 1121 may be provided on the second side surface opposite to the first side surface, the heat pipe 111 is located in the first circular arc groove 1121, and the outer wall of the heat pipe 111 is aligned with the first circular arc groove. The inner wall of the groove 1121 is attached.

The heat conduction component 110 includes not only the heat pipe 111 but also the heat conduction element 112. The heat conduction element 112 is attached to the heat dissipation surface of the laser 210 to conduct the heat of the laser 210 to the heat conduction element 112 by means of heat transfer. The heat pipe 111 connects the heat conduction element 112 and The heat dissipation fin group 121, the heat in the heat conducting member 112 is transferred to the heat dissipation fin group 121 through the heat pipe 111.

Specifically, for the connection between the heat pipe 111 and the heat conducting element 112, since the first side surface of the heat conducting element 112 is attached to the heat dissipation surface of the laser 210, the first side surface of the heat conduction element 112 can be set as The matching plane is such that the heat conducting member 112 can be completely attached to the heat dissipation surface of the laser 210. The end connecting the heat pipe 111 and the heat conducting element 112 is arranged on the second side surface of the heat conducting element 112. In order to make the connection between the heat pipe 111 and the heat conducting element 112 more stable, and to increase the heat transfer area between the heat conducting element 112 and the heat pipe 111, A plurality of first arc grooves 1121 may be provided on the second side surface of the heat conducting member 112, the number of the first arc grooves 1121 may be the same as the number of the heat pipes 111, and the inner diameter of the first arc grooves 1121 is equal to The outer diameter of the heat pipe 111 matches. In this way, the heat pipe 111 can be fixed in the first arc groove 1121, and the outer wall of the heat pipe 111 fits with the inner wall of the first arc groove 1121, so that the heat pipe 111 is firmly fixed on the heat conducting member 112 and passes through the first arc groove 1121. The inner wall of the arc groove 1121 transfers heat to the heat pipe 111.

As shown in FIG. 6, in a specific implementation, the first arc groove 1121 provided on the second side surface of the heat conducting member 112 connected to the heat pipe 111 may be semi-arc-shaped, and the heat pipe 111 is clamped in the semi-arc shape. The heat pipe 111 is fixed in the first arc groove 1121 by welding, and the connection between the heat pipe 111 and the heat conducting element 112 is realized.

As shown in FIG. 7, in another specific embodiment, the heat-conducting component 110 may further include a fixing member 113, the fixing member 113 is arranged on the second side of the heat-conducting member 112, and a semicircular arc is provided on the surface of the heat-conducting member 112. The first circular arc groove 1121 of the fixing member 113 and the heat-conducting member 112 are correspondingly provided with a second circular arc groove 1122. When the heat-conducting member 112 and the fixing member 113 are aligned, the circles on the two surfaces The arc grooves are butted together to form a complete cylindrical hole, the heat pipe 111 is arranged in the cylindrical hole, and the outer wall of the heat pipe 111 is attached to the inner wall of the cylindrical hole, that is, the outer wall of the heat pipe and the second arc groove The inner wall of 1122 fits. This arrangement enables the heat pipe 111 to be more firmly fixed on the heat-conducting component 110, and the fixing member 113 and the heat-conducting member 112 can be fixed on the heat dissipation surface of the laser 210 through a connecting member, which may be a threaded fastener.

It should be noted that the heat pipe 111 may have a hot end and a cold end. The hot end of the heat pipe 111 is connected to the heat conducting element 112, the cold end of the heat pipe 111 is connected to the heat dissipation fin set 121, and the heat of the laser 210 is transferred by the hot end of the heat pipe 111. To the cold end of the heat pipe 111. As shown in Figs. 1 and 2, since the heat dissipation fin group 121 has a relatively large volume and the heat dissipation fin group 121 can face the housing of the laser light source 200, the heat dissipation fin group 121 can be located on the side of the heat conducting member 112, In this way, there may be a bending part in the middle of the heat pipe 111, and the heat pipe 111 is bent so that the hot end of the heat pipe 111 is located in the first arc groove 1121 of the heat conducting element 112, and the cold end of the heat pipe 111 is located in the heat dissipation fin group 121 . According to the specific positional relationship between the heat dissipation fin group 121 and the heat conducting element 112, the specific bending angle of the heat pipe 111 can be determined. For example, the bending angle is between 90° and 95°, and the bending temperature is between 150°C and 300°C. The bending force is between 150N-250N.

In a specific embodiment, in order to ensure close contact between the heat conducting element 112 and the heat dissipation surface of the laser 210, a heat conduction layer may be provided between the heat conduction element 112 and the heat dissipation surface of the laser 210, and the heat conduction layer may be, for example, thermally conductive silicon. The thermal conductive material of grease is filled between the thermal conductive member 112 and the heat dissipation surface of the laser 210. Thermally conductive silicone grease can not only ensure that the heat-dissipating surface of the heat-conducting element 112 and the laser 210 are in close contact, and ensure the heat transfer efficiency between the two, but also can reduce the contact thermal resistance between the two and further improve the heat transfer efficiency between the two .

Exemplarily, the material of the heat-conducting member 112 and the fixing member 113 may be a metal material, such as pure copper, which may be formed by casting; the material of the heat dissipation fin set 121 of the heat dissipation assembly 120 may be a metal material, such as aluminum; The thickness of each heat dissipation fin 1211 may be between 0.3-0.4 mm, and the distance between adjacent heat dissipation fins 1211 may be between 1.6-1.7 mm. Of course, according to the actual requirements of the laser 210 and the laser light source 200 of different specifications, the heat-conducting member 112, the fixing member 113, and the heat-dissipating component 120 can be made of other metal or non-metal materials. The thickness of the heat dissipation fin 1211 and the distance between adjacent heat dissipation fins 1211 Other size ranges can also be selected for the pitch of, which is not limited in this embodiment.

In addition, a fan 140 may be arranged in a direction perpendicular to the heat dissipation fin 1211, and the air outlet direction of the fan 140 may be toward the heat dissipation fin 1211. The fan 140 is used to perform forced convection heat dissipation on the heat dissipation fin 1211 to speed up the heat dissipation fin 1211. The heat dissipation efficiency enables the heat of the laser 210 to be dissipated to the outside through the heat dissipation fin 1211 in a timely and rapid manner via the heat conducting component 110. Among them, according to the specific size of the heat dissipation fin group 121 and the fan 140, one or more fans 140 can be provided for convective heat dissipation, and the fan 140 can be assembled with the heat dissipation assembly 120 as a whole, or the fan 140 can be provided separately, which is not used in this embodiment. limit.

The laser light source 200 provided in this embodiment includes a laser 210 and a heat dissipation device 100. The heat dissipation device 100 is used to dissipate heat from the laser 210. The heat dissipation device 100 includes a heat conduction component 110 and a heat dissipation component 120. The heat conduction component 110 is connected to the laser 210 and the heat dissipation group 120. Between the components, the heat-conducting component 110 is attached to the heat sink of the laser 210. The heat-conducting component 110 is used to transfer the heat of the laser 210 to the heat-conducting component 110 by means of heat transfer. The heat-conducting component 110 can transfer the heat to the heat-dissipating component 120, and The heat generated by the laser 210 is dissipated to the outside through the heat dissipation assembly 120 through the heat conduction assembly 110 to dissipate the laser 210. Wherein, by providing a low-emissivity coating 130 on the surface of at least one of the heat-conducting component 110 and the heat-dissipating component 120, the emissivity of the surface of the heat-conducting component 110 and/or the heat-dissipating component 120 is effectively reduced, thereby improving the heat-conducting component 110 and/ Or the radiation heat transfer between the heat dissipation component 120 and the housing of the laser 210 and the laser light source 200 slows down the temperature increase of the laser 210 and the laser light source 200, meets the heat transfer requirements of the heat dissipation device 100, and improves the heat dissipation efficiency of the heat dissipation device 100.

An embodiment of the present application provides a laser projection device, which may include the above-mentioned laser light source 200. The laser projection equipment further includes an opto-mechanical assembly and a lens assembly. The laser light source 200 may include a housing, a laser 210, and a heat dissipation device 100. The heat dissipation device 100 is used to dissipate the laser 210. The structure, function, and working principle of the heat dissipation device 100 have been described in detail in the first embodiment, and will not be repeated here.

The laser projection device of this embodiment includes a laser light source 200, an optomechanical component, and a lens component. The laser light source 200 is used to provide a light source. The laser light source 200 is condensed and homogenized through the optomechanical component, and finally image is projected through the lens component. The laser light source 200 includes a laser 210 and a housing. The laser 210 is used to emit laser light and serves as a light source. The housing of the laser light source 200 fixes the laser 210 and other components. The laser 210 generates heat and increases in temperature during operation. Therefore, the heat dissipating device 100 is provided to dissipate the laser 210; wherein, the heat dissipating device 100 includes a heat conducting component 110 and a heat dissipating component 120. The heat conducting component 110 is attached to the heat dissipation surface (for example, a heat sink) of the laser 210 to absorb the heat of the laser 210 in a thermally conductive manner. For heat, the heat dissipating component 120 is connected to the heat conducting component 110, and the heat conducting component 110 transfers the absorbed heat of the laser 210 to the heat dissipating component 120 through the heat conducting component 110 and radiates it to the outside through the heat dissipating component 120.

At least one of the heat dissipation component 120 and the heat conduction component 110 is provided with a low emissivity coating 130, and the low emissivity coating 130 reduces the emissivity of the heat dissipation component 120 and/or the heat conduction component 110 to reduce the heat dissipation component 120 and/or The heat radiated by the heat-conducting component 110 to the housing of the laser 210 and the laser light source 200 can reduce the temperature increase of the housing of the laser 210 and the laser light source 200.

The laser projection equipment involved in this embodiment includes a laser light source 200, an opto-mechanical assembly, and a lens assembly. The laser light source 200 includes a laser 210 and a heat dissipation device 100. The heat dissipation device 100 is used to dissipate heat from the laser 210. The heat dissipation device 100 includes a heat conduction assembly 110 and For the heat dissipation component 120, the specific heat dissipation process, principle and method can be referred to the foregoing embodiments, which will not be repeated here.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the application, not to limit them; although the application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: It is still possible to modify the technical solutions described in the foregoing embodiments, or equivalently replace some or all of the technical features; these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the application range.

Claims

A laser light source, including:

Laser; and

A heat dissipation device, the heat dissipation device is used to dissipate heat of the laser, and the heat dissipation device includes:

Cooling components

A heat-conducting component, the heat-conducting component is attached to the heat sink of the laser, and the heat-conducting component is connected between the laser and the heat-dissipating component, and is used to transfer the heat on the laser to the heat-dissipating component ;with

The low-emissivity coating is provided on the surface of at least one of the heat-conducting component and the heat-dissipating component.
The laser light source according to claim 1, wherein the low emissivity coating is located at:

The surface of the heat dissipation component facing the laser; and/or

The surface of the thermally conductive component facing the laser.
The laser light source according to claim 1 or 2, wherein the thickness of the low emissivity coating is between 0.03-0.06 mm.
The laser light source of claim 1 or 2, wherein the emissivity of the low emissivity coating is less than 0.2.
The laser light source according to claim 1 or 2, wherein the low emissivity coating comprises a metal layer.
The laser light source according to claim 1 or 2, characterized in that:

The heat dissipation assembly includes a plurality of heat dissipation fins arranged at intervals,

At least part of the surface of the heat dissipation fin is covered with the low emissivity coating.
The laser light source according to claim 1 or 2, characterized in that:

The heat conducting component includes at least one heat pipe,

The surface of the at least one heat pipe is covered with the low emissivity coating.
The laser light source according to claim 7, wherein:

A plurality of arc-shaped grooves are distributed on the inner wall of the heat pipe at intervals,

The depth of the groove is less than 0.05mm,

The diameter of the groove is less than 0.03 mm.
The laser light source according to claim 7, wherein:

The thermally conductive component further includes a thermally conductive element,

The first side surface of the heat conducting member is attached to the heat sink of the laser,

A plurality of first arc grooves are provided on the second side surface of the heat conducting member opposite to the first side surface,

The heat pipe is located in the first arc groove, and the outer wall of the heat pipe is attached to the inner wall of the first arc groove.
The laser light source according to claim 9, wherein:

The heat-conducting component further includes a fixing part that cooperates with the heat-conducting part;

A plurality of second arc grooves are provided on the fixing member,

The heat pipe is located in the second arc groove, and the outer wall of the heat pipe is attached to the inner wall of the second arc groove.
A laser projection device includes a laser light source, and the laser light source includes:

Laser; and

A heat dissipation device, the heat dissipation device is used to dissipate heat of the laser, and the heat dissipation device includes:

Cooling components

A heat-conducting component, the heat-conducting component is attached to the heat sink of the laser, and the heat-conducting component is connected between the laser and the heat-dissipating component, and is used to transfer the heat on the laser to the heat-dissipating component ;with

The low-emissivity coating is provided on the surface of at least one of the heat-conducting component and the heat-dissipating component.
The laser light source according to claim 10, wherein the low emissivity coating is located at:

The surface of the heat dissipation component facing the laser; and/or

The surface of the thermally conductive component facing the laser.
The laser light source according to claim 11 or 12, wherein the thickness of the low emissivity coating is between 0.03-0.06 mm.
The laser light source according to claim 11 or 12, wherein the emissivity of the low emissivity coating is less than 0.2.
The laser light source according to claim 11 or 12, wherein the low-emissivity coating comprises a metal layer.
The laser light source according to claim 11 or 12, wherein:

The heat dissipation assembly includes a plurality of heat dissipation fins arranged at intervals,

At least part of the surface of the heat dissipation fin is covered with the low emissivity coating.
The laser light source according to claim 11 or 12, wherein:

The heat conducting component includes at least one heat pipe,

The surface of the at least one heat pipe is covered with the low emissivity coating.
The laser light source according to claim 17, wherein:

A plurality of arc-shaped grooves are distributed on the inner wall of the heat pipe at intervals,

The depth of the groove is less than 0.05mm,

The diameter of the groove is less than 0.03 mm.
The laser light source according to claim 17, wherein:

The thermally conductive component further includes a thermally conductive element,

The first side surface of the heat conducting member is attached to the heat sink of the laser,

A plurality of first arc grooves are provided on the second side surface of the heat conducting member opposite to the first side surface,

The heat pipe is located in the first arc groove, and the outer wall of the heat pipe is attached to the inner wall of the first arc groove.
The laser light source according to claim 19, wherein:

The heat-conducting component further includes a fixing part that cooperates with the heat-conducting part;

A plurality of second arc grooves are provided on the fixing member,

The heat pipe is located in the second arc groove, and the outer wall of the heat pipe is attached to the inner wall of the second arc groove.