WO2020244184A1 - 超声探头 - Google Patents

超声探头 Download PDF

Info

Publication number
WO2020244184A1
WO2020244184A1 PCT/CN2019/123862 CN2019123862W WO2020244184A1 WO 2020244184 A1 WO2020244184 A1 WO 2020244184A1 CN 2019123862 W CN2019123862 W CN 2019123862W WO 2020244184 A1 WO2020244184 A1 WO 2020244184A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
conductive
ultrasonic probe
conductive adhesive
adhesive layer
Prior art date
Application number
PCT/CN2019/123862
Other languages
English (en)
French (fr)
Inventor
崔国普
郑曙光
Original Assignee
飞依诺科技(苏州)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 飞依诺科技(苏州)有限公司 filed Critical 飞依诺科技(苏州)有限公司
Publication of WO2020244184A1 publication Critical patent/WO2020244184A1/zh

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N7/00—Ultrasound therapy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50—Application to a particular transducer type
    • B06B2201/55—Piezoelectric transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/70—Specific application
    • B06B2201/76—Medical, dental

Definitions

  • the invention relates to an ultrasonic probe, more specifically, to the electromagnetic shielding of the ultrasonic probe, and belongs to the field of medical equipment and ultrasonic flaw detection.
  • Ultrasound probes are used in many occasions such as medical diagnosis, treatment and ultrasonic flaw detection.
  • electronic technology and image processing technology the performance of ultrasound probes has increasingly become a bottleneck restricting the performance of ultrasound equipment.
  • the shielding of ultrasonic probes is becoming more and more important. The shielding effect of ultrasonic probes is directly related to the detection effect.
  • the object of the present invention is to provide an ultrasonic probe with better shielding effect.
  • the present invention provides an ultrasonic probe, which includes a housing in which a backing, a piezoelectric element, a matching layer, and a lens are sequentially arranged, and the ultrasonic probe further includes a circumferential covering of the piezoelectric
  • the first shielding layer of the element and the matching layer, the radiation surface of the piezoelectric element is also provided with a second shielding layer, and the second shielding layer is a conductive adhesive layer formed by conductive glue.
  • the number of the matching layers is at least two, and the conductive adhesive layer is arranged between two adjacent matching layers.
  • the conductive adhesive layer is arranged between the matching layer and the lens.
  • the lens includes a first layer and a second layer arranged adjacently, and the conductive adhesive layer is arranged between the first layer and the second layer.
  • the conductive glue includes 7 parts by mass of conductive powder and 1 part by mass of epoxy glue.
  • the conductive powder is silver-plated metal particles.
  • the thickness of the conductive adhesive layer is less than or equal to 10 um.
  • the conductive adhesive layer and the first shielding layer are connected by a conductive wire.
  • the edges of the two parts bonded by the conductive adhesive layer are at least partially staggered to form a gap, the conductive adhesive layer covers at least a part of the gap, and the conductive wire is connected to the gap. Where the conductive adhesive layer is connected.
  • the conductive wire is a conductive silver wire.
  • the beneficial effect of the present invention is that: the radiation surface of the probe of the present invention is also provided with a shielding layer to prevent electromagnetic interference signals from entering from the radiation surface to interfere with normal signals; moreover, the second shielding layer is combined
  • the first shielding layer realizes a larger range of electromagnetic shielding, so that the probe can work normally and stably in a complex electromagnetic environment, and provides excellent anti-electromagnetic interference capabilities for ultrasonic testing and treatment equipment;
  • the conductive adhesive layer is composed of The conductive glue is formed, so that the conductive adhesive layer can not only shield electromagnetic radiation, but also bond two adjacent components, and the design is very reasonable.
  • FIG. 1 is a schematic structural diagram of an ultrasonic probe provided by a specific embodiment of the present invention
  • Fig. 2 is a three-dimensional schematic diagram of the two parts bonded by the ultrasonic probe shown in Fig. 1.
  • 100-probe 20-housing; 22-backing; 24-piezoelectric element; 30-matching layer; 31-first matching layer; 32-second matching layer; 33-Nth matching layer; 40- Lens; 51-first shielding layer; 52-second shielding layer; 53-conductive adhesive layer; 60-conductive wire; 70-notch.
  • the terms “upper”, “lower”, etc. refer to the state of the ultrasonic probe shown in FIG. 1. These terms indicating the orientation or position relationship, including but not limited to “upper” and “lower”, are only for the convenience of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation Therefore, it cannot be understood as a limitation of the present invention.
  • first, second, etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • an ultrasonic probe 100 provided by the first embodiment of the present invention, including a housing 20 in which a backing 22, a piezoelectric element 24, a matching layer 30, and a lens 40 are sequentially arranged.
  • the ultrasonic probe 100 further includes a first shielding layer 51 that circumferentially wraps the piezoelectric element 24 and the matching layer 30.
  • the first shielding layer 51 is copper foil, which can shield the electromagnetic radiation of the piezoelectric element 24 and the matching layer 30 in the circumferential direction.
  • a second shielding layer 52 is further provided on the radiation surface of the piezoelectric element 24, and the second shielding layer 52 is a conductive adhesive layer 53 formed of conductive glue.
  • the radiation surface of the piezoelectric element 24 refers to a surface substantially parallel to the piezoelectric element 24 or substantially parallel to the lens 40, and the surface is located between the upper surface of the piezoelectric element 24 and the outer surface of the lens 40.
  • the plane parallel to the piezoelectric element 24 is a plane, and the surface parallel to the lens 40 is a curved surface. Therefore, the radiating surface described in this embodiment is not limited to a plane, and any solution that is the same or similar to this embodiment is covered. Within the protection scope of the present invention.
  • the radiation surface of the probe 100 of this embodiment is also provided with a shielding layer to prevent electromagnetic interference signals from entering from the radiation surface and interfering with normal signals. ; Moreover, the second shielding layer 52 combined with the first shielding layer 51 realizes a larger range of electromagnetic shielding of the probe 100, so that the probe can work normally and stably in a complex electromagnetic environment. It provides excellent anti-electromagnetic interference capability for ultrasonic testing and treatment equipment, which can greatly improve the performance of the ultrasonic probe 100; in addition, the conductive adhesive layer 53 is formed of conductive glue, so the conductive adhesive layer 53 can not only shield electromagnetic radiation, It can also bond two adjacent parts, and the design is very reasonable.
  • the number of matching layers 30 is at least two, and the conductive adhesive layer 53 is disposed between two adjacent matching layers 30.
  • the second shielding layer 52 is disposed between two adjacent matching layers 30. Electromagnetic shielding can be implemented between the matching layers 30 to prevent electromagnetic interference signals from affecting the performance of the probe 100.
  • the main function of the matching layer is to match the acoustic impedance between the ultrasound probe and the human tissue.
  • General shielding methods such as pasting shielded copper foil will break the acoustic impedance matching effect, and cause sound waves to be reflected at the shielding interface and cannot enter the target smoothly.
  • the commonly used probes mostly use organic polymer glue for bonding between the matching layer and the matching layer. This glue only serves as a bonding agent and cannot shield electromagnetic radiation.
  • the probe 100 in this embodiment improves the bonding glue between the matching layers 30, and replaces the organic polymer glue with conductive glue with a conductive effect. Not only can the matching layer 30 be bonded, but also the radiation surface of the probe 100 can be The electromagnetic shielding at the matching layer 30 has a very reasonable design.
  • the number of matching layers 30 is at least two, and two adjacent matching layers 30 are regarded as a group, and a conductive adhesive layer 53 is arranged between at least one group of matching layers 30. That is to say, the number of conductive adhesive layers 53 can be set as required, for example, the conductive adhesive layer 53 can be provided in only one group of matching layers 30, and the other groups of matching layers 30 can be bonded by conventional organic polymer glue; The conductive adhesive layer 53 is provided in the two or more matching layers 30 to further improve the shielding effect; any solution that is the same or similar to the embodiment is covered by the protection scope of the present invention.
  • the matching layer 30 closest to the lens 40 is called the first matching layer 31, and the matching layer 30 adjacent to the first matching layer 31 is called the second matching layer 32, and so on, until the Nth matching layer 33, N is greater than or equal to 2.
  • the Nth matching layer 33 to the second matching layer 32 is completed,
  • the upper surface of the second matching layer 32 and the lower surface of the first matching layer 31 are evenly coated with conductive glue, align the outer frame, and apply pressure for bonding.
  • the manufacturing is simple.
  • the conductive glue can not only bond the corresponding
  • the matching layer 30 can also achieve electromagnetic shielding, and the design is very reasonable.
  • the conductive glue includes 7 parts by mass of conductive powder and 1 part by mass of epoxy glue.
  • the mass ratio of conductive powder to epoxy glue is 7:1, which can achieve effective bonding and electromagnetic shielding.
  • the conductive powder is silver-plated metal particles.
  • silver-plated metal particles Such as silver-plated nickel powder, silver-plated aluminum powder and so on.
  • Silver-plated metal particles have good conductivity and better electromagnetic shielding effect.
  • the mesh size of the silver-plated metal particles is 2000 or more.
  • the silver-plated metal particles with a mesh size of more than 2000 are more delicate, and the fine silver-plated metal particles can make the conductive adhesive layer 53 smoother, and the bonding effect and electromagnetic shielding effect are better.
  • Epoxy glue should use low temperature curable glue, such as E51, E41, etc.
  • the curing conditions of the conductive glue after bonding should be set according to the curing conditions of the epoxy glue used for the conductive glue.
  • the "low temperature” in this embodiment means that the temperature is 80°C or lower. Low-temperature curable glue can cure fast and have high bonding strength in a low-temperature environment.
  • the thickness of the conductive adhesive layer 53 is less than or equal to 10 um.
  • the thickness of the conductive adhesive layer 53 is less than or equal to 10 um, which can make the conductive adhesive layer 53 lighter and thinner. While effectively bonding the two matching layers 30 and shielding radiation, it can also avoid affecting the function of the matching layer 30.
  • the conductive adhesive layer 53 and the first shielding layer 51 are connected by a conductive wire 60.
  • the conductive adhesive layer 53 and the first shielding layer 51 can be electrically connected, thereby exerting a shielding effect as a whole, realizing omnidirectional electromagnetic shielding of the probe 100, and improving the detection quality of the probe 100.
  • the edges of the two components bonded by the conductive adhesive layer 53 are at least partially staggered to form a gap 70, the conductive adhesive layer 53 covers at least part of the gap 70, and the conductive wire 60 and the conductive adhesive layer at the gap 70 53 connections.
  • the two components bonded by the conductive adhesive layer 53 are two adjacent matching layers 30.
  • the first matching layer 31 and the second matching layer 32 as an example, the first matching layer The width of 31 is smaller than the width of the second matching layer 32, the edges of the first matching layer 31 and the second matching layer 32 are staggered to form a gap 70, and the conductive wire 60 is connected to the conductive adhesive layer 53 at the gap 70.
  • the conductive wire 60 does not need to be arranged between the two matching layers 30, thereby avoiding unevenness of the matching layer 30, resulting in poor detection effect of the probe 100.
  • the conductive wire 60 is a conductive silver wire.
  • the conductive silver wire has a better conductive effect, so that the electromagnetic shielding effect of the first shielding layer 51 and the conductive adhesive layer 53 are better.
  • the conductive adhesive layer 53 is disposed between two adjacent matching layers 30. In another preferred embodiment of the present invention, the conductive adhesive layer 53 is disposed between the matching layer 30 and the lens 40. In this way, electromagnetic shielding can be realized between the matching layer 30 and the lens 40 to prevent electromagnetic interference signals from affecting the performance of the probe 100.
  • the lens 40 includes a first layer and a second layer arranged adjacently, and the conductive adhesive layer is arranged between the first layer and the second layer.
  • the sublayer between the first layer and the second layer can be flat or curved.
  • the lens 40 adopts a step-by-step bonding lens, and the lens layers are bonded by conductive glue.
  • the lens is divided into an upper lens layer and a lower lens layer, and the upper lens layer and the lower lens layer are bonded by conductive glue, and the conductive glue forms a conductive adhesive layer.
  • electromagnetic shielding can be realized between the lens layers, and electromagnetic interference signals can be prevented from affecting the performance of the probe 100.
  • the number of layers of the lens is not limited to two, and can be set as required.
  • the number of conductive adhesive layers between the lens layers can also be set according to needs, and any solution that is the same or similar to the embodiment is covered by the protection scope of the present invention.
  • the number and position of the conductive adhesive layer 53 can be set as required. For example, only one layer of conductive adhesive layer 53 is provided, and this layer of conductive adhesive layer 53 can be provided on two adjacent ones.
  • the matching layers 30 can also be arranged between the matching layer 30 and the lens 40, or between the lens layers adjacent to the lens. Two or more conductive adhesive layers 53 can also be provided. Two or more conductive adhesive layers 53 can be arranged adjacently or spaced apart. The details will not be repeated here, and the same or similar ones as in this embodiment are used. The solutions are all covered by the protection scope of the present invention.
  • this embodiment is mainly to solve the shielding problem of ultrasound probes used in medical treatment and diagnosis
  • the scope of application of this application is not only applicable to ultrasound probes used in medical treatment and diagnosis.
  • This application has the effect of improving the shielding effect and enhancing the anti-electromagnetic interference ability for the probe using the matching technology of the matching layer technology.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Animal Behavior & Ethology (AREA)
  • Veterinary Medicine (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Public Health (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Medical Informatics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Biophysics (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

本发明揭示了一种超声探头，包括壳体，壳体中依次设置有背衬、压电元件、匹配层和透镜，所述超声探头还包括周向包覆所述压电元件及匹配层的第一屏蔽层，所述压电元件的辐射面上还设置有第二屏蔽层，所述第二屏蔽层为导电胶水形成的导电粘接层。本发明的探头实现了更大范围的电磁屏蔽，使探头可以在复杂电磁环境下正常并稳定的工作，为超声检测、治疗器械提供优异的抗电磁干扰能力。

Description

超声探头 技术领域
本发明涉及一种超声探头，更具体的，涉及超声探头的电磁屏蔽，属于医疗器械及超声探伤领域。
背景技术
超声探头在医学诊断、治疗及超声探伤等多种场合被应用。随着电子技术及图像处理技术的发展，超声探头的性能也越来越成为制约超声设备性能的瓶颈。随着超声探测器械使用的电磁环境越来越复杂，超声探头的屏蔽也越来越重要，超声探头的屏蔽效果与探测效果直接相关。
目前的超声探头多采用在压电元件及匹配层周围包覆屏蔽铜箔的方法实现屏蔽。这种屏蔽方法虽然屏蔽了探头是四周，但是无法包覆探头辐射面。这就给电磁干扰留下来一个“窗口”，尤其当探头接触被测体(如人体等)，电磁信号极易从这个未屏蔽的‘窗口’干扰到正常的信号从而导致探测图像质量下降。
发明内容
本发明的目的在于提供一种超声探头，该超声探头的屏蔽效果更好。
为实现上述发明目的，本发明提供一种超声探头，包括壳体，壳体中依次设置有背衬、压电元件、匹配层和透镜，所述超声探头还包括周向包覆所述压电元件及匹配层的第一屏蔽层，所述压电元件的辐射面上还设置有第二屏蔽层，所述第二屏蔽层为导电胶水形成的导电粘接层。
作为本发明一实施方式的进一步改进，所述匹配层的数量至少为两个，所述导电粘接层设置在相邻的两个匹配层之间。
作为本发明一实施方式的进一步改进，导电粘接层设置在匹配层和透镜之间。
作为本发明一实施方式的进一步改进，所述透镜包括相邻设置的第一层和第二层，所述导电粘接层设置在所述第一层和所述第二层之间。
作为本发明一实施方式的进一步改进，所述导电胶水包括7份质量的导电粉和1份质量的环氧胶水。
作为本发明一实施方式的进一步改进，所述导电粉为镀银金属颗粒。
作为本发明一实施方式的进一步改进，所述导电粘接层的厚度小于等于10um。
作为本发明一实施方式的进一步改进，所述导电粘接层和所述第一屏蔽层之间通过导电线连接。
作为本发明一实施方式的进一步改进，所述导电粘接层所粘接的两个部件的边缘至少部分错开形成缺口，所述导电粘接层覆盖至少部分缺口，所述导电线与所述缺口处的导电粘接层连接。
作为本发明一实施方式的进一步改进，所述导电线为导电银线。
与现有技术相比，本发明的有益效果在于：本发明的探头的辐射面上亦设置有屏蔽层，避免电磁干扰信号从辐射面进入而干扰到正常的信号；而且，第二屏蔽层结合第一屏蔽层，实现了更大范围的电磁屏蔽，使探头可以在复杂电磁环境下正常并稳定的工作，为超声检测、治疗器械提供优异的抗电磁干扰能力；再者，导电粘接层由导电胶水形成，由此，导电粘接层不仅可以屏蔽电磁辐射，还可粘接相邻的两个部件，设计十分合理。
附图说明
图1是本发明具体实施方式提供的超声探头的结构示意图；
图2是图1所示的超声探头粘接的两个部件的立体结构示意图。
其中，100-探头；20-壳体；22-背衬；24-压电元件；30-匹配层；31-第一匹配层；32-第二匹配层；33-第N匹配层；40-透镜；51-第一屏蔽层；52-第二屏蔽层；53-导电粘接层；60-导电线；70-缺口。
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施方式。附图中以相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的，例如为了便于图示，结构或部分的某些尺寸会相对其它结构或部分适当夸大，因此，附图仅用于图示出本申请的主题的基本结构。
具体实施方式
以下将结合附图所示的具体实施方式对本发明进行详细描述。但这些实施方式并不限制本发明，本领域的普通技术人员根据这些实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。
需要理解的是，在本发明的描述中，术语“上”“下”等以图1所示的超声探头的状态为参考。这些指示方位或位置关系的术语，包括但不限于“上”“下”，仅是为了方便描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明的描述中，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
请参见图1，示出了本发明第一实施方式提供的一种超声探头100，包括壳体20，壳体20中依次设置有背衬22、压电元件24、匹配层30和透镜40，超声探头100还包括周向包覆压电元件24及匹配层30的第一屏蔽层51。
本实施方式中，第一屏蔽层51为铜箔，可屏蔽压电元件24及匹配层30周向方向的电磁辐射。
本实施方式中，压电元件24的辐射面上还设置有第二屏蔽层52，第二屏蔽层52为导电胶水形成的导电粘接层53。
需要说明的是，压电元件24的辐射面是指大致平行于压电元件24或大 致平行于透镜40的表面，且该表面位于压电元件24上表面至透镜40外表面之间。平行于压电元件24的平面是是平面，平行于透镜40的表面是弧面，因此，本实施方式中所述的辐射面不限于平面，凡采用与本实施方式相同或类似的方案均涵盖在本发明的保护范围内。
由于压电元件24的辐射面上设置有第二屏蔽层52，由此，本实施方式的探头100的辐射面上亦设置有屏蔽层，避免电磁干扰信号从辐射面进入而干扰到正常的信号；而且，第二屏蔽层52结合第一屏蔽层51，实现了探头100更大范围的电磁屏蔽，使探头可以在复杂电磁环境下正常，稳定的工作。为超声检测、治疗器械提供优异的抗电磁干扰能力，可以大大提高超声探头100的性能；再者，导电粘接层53由导电胶水形成，由此，导电粘接层53不仅可以屏蔽电磁辐射，还可粘接相邻的两个部件，设计十分合理。
本实施方式优选的，匹配层30的数量至少为两个，导电粘接层53设置在相邻的两个匹配层30之间。
也就是说，第二屏蔽层52设置在相邻的两个匹配层30之间。可以在匹配层30间实现电磁屏蔽，避免电磁干扰信号影响探头100性能。
匹配层主要作用是为了匹配超声探头和人体组织之间的声阻抗。一般的屏蔽手段如粘贴屏蔽铜箔等会破获声阻抗匹配效果，导致声波因为在屏蔽界面处产生反射而无法顺利进入目标内部。而常用的探头在匹配层与匹配层之间多用有机高分子胶水粘合，这种胶水仅起到粘接作用，无法屏蔽电磁辐射。
本实施方式中的探头100，改进了匹配层30之间的粘接胶水，用具有导电效果的配置导电胶水代替有机高分子胶水，不仅可以粘接匹配层30，还可实现探头100辐射面在匹配层30处的电磁屏蔽，设计十分合理。
需要说明的是，匹配层30的数量至少为两个，将相邻两个匹配层30视为一组，至少一组匹配层30之间设置有导电粘接层53。也就是说，导电粘接层53的数量可以根据需要设置，例如可以仅在一组匹配层30中设置导电粘接层53，其它组匹配层30间采用常规有机高分子胶水粘接；也可以在两 组及以上匹配层30中设置导电粘接层53，进一步提高屏蔽效果；凡采用与本实施方式相同或类似的方案均涵盖在本发明的保护范围内。
本实施方式中，将最靠近透镜40的匹配层30称为第一匹配层31，与第一匹配层31相邻的匹配层30称为第二匹配层32，如此继续，直到第N匹配层33，N大于等于2。
以第一匹配层31和第二匹配层32的为例进行描述，本实施方式的探头100安装时，在完成压电元件24、第N匹配层33至第二匹配层32的安装后，在第二匹配层32的上表面及第一匹配层31的下表面均匀涂覆导电胶水，对齐外边框，施加压力进行粘接即可，制造简单，而且由此，导电胶水不仅可以粘接对应的匹配层30，还可实现电磁屏蔽，设计十分合理。
本实施方式优选的，导电胶水包括7份质量的导电粉和1份质量的环氧胶水。
也就是说，导电粉与环氧胶水质量比为7:1，可以实现有效的粘接及电磁屏蔽。
本实施方式优选的，导电粉为镀银金属颗粒。如镀银镍粉，镀银铝粉等。镀银金属颗粒导电性良好，电磁屏蔽效果更佳。
本实施方式优选的，镀银金属颗粒的目粒度在2000以上。目粒度在2000以上的镀银金属颗粒更细腻，细腻的镀银金属颗粒可以使导电粘接层53更平整，粘接效果及电磁屏蔽效果都更好。
环氧胶水应选用低温可固化胶水，如E51，E41等。导电胶水粘接后固化条件应按照导电胶水使用的环氧胶水固化条件设置。本实施方式中所谓的“低温”是指温度在80℃以下。低温可固化胶水可以在低温环境下固化速度快、粘接强度高。
本实施方式优选的，导电粘接层53的厚度小于等于10um。
导电粘接层53的厚度小于等于10um，可以使导电粘接层53更轻薄，在有效粘接两个匹配层30并屏蔽辐射的同时，还可以避免影响匹配层30功 能。
请结合图1和图2，本实施方式优选的，导电粘接层53和第一屏蔽层51之间通过导电线60连接。
可以使导电粘接层53和第一屏蔽层51电连接，从而整体发挥屏蔽作用，实现探头100全方位电磁屏蔽，提高探头100的探测质量。
本实施方式优选的，导电粘接层53所粘接的两个部件的边缘至少部分错开形成缺口70，导电粘接层53覆盖至少部分缺口70，导电线60与缺口70处的导电粘接层53连接。
请参见图2，本实施方式中，导电粘接层53粘接的两个部件是相邻的两个匹配层30，以第一匹配层31和第二匹配层32为例，第一匹配层31的宽度小于第二匹配层32的宽度，第一匹配层31和第二匹配层32的边缘错开形成缺口70，导电线60与缺口70处的导电粘接层53连接。
从而导电线60不用设置有两个匹配层30之间，进而避免匹配层30不平整，导致探头100探测效果不佳。
本实施方式优选的，导电线60为导电银线。
导电银线的导电效果更佳，从而第一屏蔽层51和导电粘接层53的电磁屏蔽效果都更优异。
上述实施方式中，导电粘接层53设置在相邻的两个匹配层30之间，在本发明的另一优选实施例中，导电粘接层53设置在匹配层30和透镜40之间。从而可以在匹配层30和透镜40之间实现电磁屏蔽，避免电磁干扰信号影响探头100性能。
在本发明的再一优选实施例中，透镜40包括相邻设置的第一层和第二层，导电粘接层设置在第一层和第二层之间。第一层和第二层之间的分层面可以是平面，也可以是弧面。
也就是说，透镜40采用分次粘接透镜，透镜层之间通过导电胶水粘接。例如将透镜分成透镜上层和透镜下层，透镜上层和透镜下层之间通过导电胶 水粘接，导电胶水形成导电粘接层。
从而可以在透镜层之间实现电磁屏蔽，避免电磁干扰信号影响探头100性能。
需要说明的是，透镜的层数不限于两层，可以根据需要设置。透镜层之间的导电粘接层的数量也可以根据需要设置，凡采用与本实施方式相同或类似的方案均涵盖在本发明的保护范围内。
需要说明的是，本实施方式中，导电粘接层53的数量及位置可以根据需要设置，如仅设置一层导电粘接层53，这层导电粘接层53可以设置在相邻的两个匹配层30之间，也可以设置在匹配层30和透镜40之间，还可以设置在透镜相邻的透镜层之间。也可以设置两层以上的导电粘接层53，两层以上的导电粘接层53可以相邻设置也可以间隔设置，凡此等等，不再赘述，凡采用与本实施方式相同或类似的方案均涵盖在本发明的保护范围内。
虽然本实施方式主要为解决医用治疗、诊断使用的超声探头的屏蔽问题，但本申请在适用范围上并不只适用与医用治疗、诊断使用的超声探头。本申请对使用匹配层技术匹配技术的探头均可起到提高屏蔽效果，增强抗电磁干扰能力的效果。
应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施方式中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明，它们并非用以限制本发明的保护范围，凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种超声探头，包括壳体，壳体中依次设置有背衬、压电元件、匹配层和透镜，所述超声探头还包括周向包覆所述压电元件及匹配层的第一屏蔽层，其特征在于：所述压电元件的辐射面上还设置有第二屏蔽层，所述第二屏蔽层为导电胶水形成的导电粘接层。
  2. 根据权利要求1所述的超声探头，其特征在于：所述匹配层的数量至少为两个，所述导电粘接层设置在相邻的两个匹配层之间。
  3. 根据权利要求1所述的超声探头，其特征在于：导电粘接层设置在匹配层和透镜之间。
  4. 根据权利要求1所述的超声探头，其特征在于：所述透镜包括相邻设置的第一层和第二层，所述导电粘接层设置在所述第一层和所述第二层之间。
  5. 根据权利要求1所述的超声探头，其特征在于：所述导电胶水包括7份质量的导电粉和1份质量的环氧胶水。
  6. 根据权利要求5所述的超声探头，其特征在于：所述导电粉为镀银金属颗粒。
  7. 根据权利要求1所述的超声探头，其特征在于：所述导电粘接层的厚度小于等于10um。
  8. 根据权利要求1所述的超声探头，其特征在于：所述导电粘接层和所述第一屏蔽层之间通过导电线连接。
  9. 根据权利要求8所述的超声探头，其特征在于：所述导电粘接层所粘接的两个部件的边缘至少部分错开形成缺口，所述导电粘接层覆盖至少部分缺口，所述导电线与所述缺口处的导电粘接层连接。
  10. 根据权利要求8所述的超声探头，其特征在于：所述导电线为导电银线。
PCT/CN2019/123862 2019-06-03 2019-12-09 超声探头 WO2020244184A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910475096.X 2019-06-03
CN201910475096.XA CN110090792B (zh) 2019-06-03 2019-06-03 超声探头

Publications (1)

Publication Number Publication Date
WO2020244184A1 true WO2020244184A1 (zh) 2020-12-10

Family

ID=67450075

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/123862 WO2020244184A1 (zh) 2019-06-03 2019-12-09 超声探头

Country Status (2)

Country Link
CN (1) CN110090792B (zh)
WO (1) WO2020244184A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113951920A (zh) * 2021-09-24 2022-01-21 聚融医疗科技(杭州)有限公司 全屏蔽超声探头

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110090792B (zh) * 2019-06-03 2020-08-18 飞依诺科技(苏州)有限公司 超声探头
CN117297653A (zh) * 2019-09-05 2023-12-29 深圳迈瑞生物医疗电子股份有限公司 超声探头的声头及超声探头

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08223697A (ja) * 1995-02-13 1996-08-30 Nippon Dempa Kogyo Co Ltd 配列型の超音波探触子
CN103300889A (zh) * 2013-05-17 2013-09-18 深圳市理邦精密仪器股份有限公司 一种超声阵列探头信号采集元件及其探头与其制备方法
CN103930035A (zh) * 2011-08-05 2014-07-16 柯尼卡美能达株式会社 超声波探头及使用于超声波探头的可挠性基板
CN207576838U (zh) * 2017-12-14 2018-07-06 无锡祥生医疗科技股份有限公司 一种医用换能器阵列
CN108451544A (zh) * 2017-02-20 2018-08-28 深圳市理邦精密仪器股份有限公司 超声成像诊断阵列探头和其制造方法及其设备
CN207885101U (zh) * 2017-09-15 2018-09-18 中山国安火炬科技发展有限公司 一种电磁屏蔽膜
CN109700479A (zh) * 2019-02-25 2019-05-03 南京广慈医疗科技有限公司 一种二维面阵超声成像探头
CN110090792A (zh) * 2019-06-03 2019-08-06 飞依诺科技(苏州)有限公司 超声探头

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2646173A2 (en) * 2010-12-03 2013-10-09 Research Triangle Institute Ultrasound device, and associated cable assembly
CN206473341U (zh) * 2016-11-28 2017-09-08 深圳市理邦精密仪器股份有限公司 超声探头

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08223697A (ja) * 1995-02-13 1996-08-30 Nippon Dempa Kogyo Co Ltd 配列型の超音波探触子
CN103930035A (zh) * 2011-08-05 2014-07-16 柯尼卡美能达株式会社 超声波探头及使用于超声波探头的可挠性基板
CN103300889A (zh) * 2013-05-17 2013-09-18 深圳市理邦精密仪器股份有限公司 一种超声阵列探头信号采集元件及其探头与其制备方法
CN108451544A (zh) * 2017-02-20 2018-08-28 深圳市理邦精密仪器股份有限公司 超声成像诊断阵列探头和其制造方法及其设备
CN207885101U (zh) * 2017-09-15 2018-09-18 中山国安火炬科技发展有限公司 一种电磁屏蔽膜
CN207576838U (zh) * 2017-12-14 2018-07-06 无锡祥生医疗科技股份有限公司 一种医用换能器阵列
CN109700479A (zh) * 2019-02-25 2019-05-03 南京广慈医疗科技有限公司 一种二维面阵超声成像探头
CN110090792A (zh) * 2019-06-03 2019-08-06 飞依诺科技(苏州)有限公司 超声探头

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113951920A (zh) * 2021-09-24 2022-01-21 聚融医疗科技(杭州)有限公司 全屏蔽超声探头

Also Published As

Publication number Publication date
CN110090792B (zh) 2020-08-18
CN110090792A (zh) 2019-08-06

Similar Documents

Publication Publication Date Title
WO2020244184A1 (zh) 超声探头
WO2019052247A1 (zh) 一种电磁屏蔽膜及其制备方法
US7936232B2 (en) Substrate for semiconductor package
CN103293548B (zh) 放射线检测设备
US9609793B2 (en) Electromagnetic shielding film, flexible printed wiring board with electromagnetic shielding film, electronic device and method for forming the same
CN104241303B (zh) 电器件、其制造方法和放射线检查装置
JP6285021B2 (ja) 低電磁干渉配線を有するダイパッケージ
CN205105522U (zh) 电磁波屏蔽片和电子设备
TW201003881A (en) Electronic device package with electromagnetic compatibility (EMC) coating thereon
WO2020111210A1 (ja) 導電性不織布
CN109492495A (zh) 超声波指纹识别模组及电子设备
KR101162296B1 (ko) 전자파 차폐 필름 및 이를 구비하는 회로기판 어셈블리
TWM599391U (zh) 具有屏蔽功能的探針頭組件
KR20230052867A (ko) 반도체 패키지 제조 방법
CN108377609A (zh) 一种屏蔽膜、柔性电路板组件及移动终端
US20240130097A1 (en) Electromagnetic wave absorption structure
CN114121908A (zh) 一种电子电路封装及电子设备
JP2004057806A (ja) 超音波探触子
JP3602684B2 (ja) 超音波トランスデューサ及びその製造方法
KR101804458B1 (ko) 초음파 프로브 및 이의 제조방법
CN109219335B (zh) 宽频带吸波片及其制作方法
CN108134213B (zh) 宽频段复合吸波器及其应用
JP3528255B2 (ja) 混成集積回路素子及びその製造方法
CN110564320A (zh) 高柔软超薄电磁屏蔽胶带及其制备工艺
CN214457737U (zh) 一种电磁屏蔽型胶带

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19931929

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19931929

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 06.07.2022)

122 Ep: pct application non-entry in european phase

Ref document number: 19931929

Country of ref document: EP

Kind code of ref document: A1