WO2020241511A1 - Affichage tête haute, son procédé de fabrication et procédé de fabrication de dispositif d'éclairage - Google Patents

Affichage tête haute, son procédé de fabrication et procédé de fabrication de dispositif d'éclairage Download PDF

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Publication number
WO2020241511A1
WO2020241511A1 PCT/JP2020/020370 JP2020020370W WO2020241511A1 WO 2020241511 A1 WO2020241511 A1 WO 2020241511A1 JP 2020020370 W JP2020020370 W JP 2020020370W WO 2020241511 A1 WO2020241511 A1 WO 2020241511A1
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WO
WIPO (PCT)
Prior art keywords
display
light emitting
chip
wavelength
light
Prior art date
Application number
PCT/JP2020/020370
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English (en)
Japanese (ja)
Inventor
裕輝 春山
千秋 渋谷
Original Assignee
日本精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本精機株式会社 filed Critical 日本精機株式会社
Priority to JP2021522320A priority Critical patent/JPWO2020241511A1/ja
Publication of WO2020241511A1 publication Critical patent/WO2020241511A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60K—ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K35/00—Arrangement of adaptations of instruments
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/01—Head-up displays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Definitions

  • the present disclosure relates to a head-up display, a method for manufacturing a head-up display, and a method for manufacturing a lighting device.
  • a lighting device that generates white light is used as the light source for the backlight of the display of the head-up display.
  • white light is formed by passing blue light emitted by a chip of a blue light emitting diode through a yellow phosphor.
  • a luminaire having a blue light emitting diode chip and a phosphor covering the chip to generate white light. It is provided with a display that emits display light when illuminated by the lighting device.
  • a head-up display is provided in which the wavelength of light output from the chip is 452 nm or more and 468 nm or less.
  • FIG. 1A and the like for the sake of easy viewing, there are cases where a reference reference numeral is only partially attached to a plurality of parts having the same attribute.
  • FIG. 1A is a perspective view showing the internal configuration of the head-up display 1 according to the embodiment from above.
  • FIG. 1B is a diagram schematically showing a vehicle-mounted state of the head-up display 1 when viewed from the side of the vehicle. Note that in FIG. 1A, the illustration of some components of the head-up display 1 is omitted.
  • the X direction (second direction), the Y direction, and the Z direction (first direction), which are three directions orthogonal to each other, are defined in the right-handed system.
  • the Z direction is the vertical direction
  • the positive side is the upper side
  • the negative side is the lower side.
  • the head-up display 1 is mounted in the instrument panel 9 of the vehicle.
  • the head-up display 1 may be mounted in a direction in which the Y direction of FIG. 1A substantially corresponds to the vehicle width direction.
  • the head-up display 1 includes a case 2, a TFT (Thin Film Transistor) panel unit 3, mirrors 4 and 5, and a backlight unit 6.
  • TFT Thin Film Transistor
  • the case 2 forms the housing of the head-up display 1.
  • the case 2 is a lower case that forms the lower part of the housing of the head-up display 1.
  • the case 2 is combined with an upper case (not shown in FIG. 1A).
  • Case 2 is formed of a highly heat-conducting material such as aluminum. Case 2 includes a heat dissipation portion 21 as shown in FIG. 1A.
  • the heat radiating portion 21 is formed on the outer surface of the case 2 (the surface exposed to the outside).
  • the heat radiating portion 21 has a function of radiating heat generated from the backlight unit 6.
  • the heat radiating portion 21 releases heat to the air flowing outside the case 2.
  • the TFT panel unit 3 is a display device that uses the light from the backlight unit 6 as a backlight and emits image light according to the display image.
  • the TFT panel unit 3 has a color filter (not shown).
  • the display image is arbitrary, and may be, for example, an image representing navigation information, various vehicle information, and the like.
  • the TFT panel unit 3 is fixed to the case 2.
  • the TFT panel unit 3 is fastened with screws 90 at two locations on both sides in the X direction.
  • FIG. 2 is a perspective view of the TFT panel unit 3 in a single item state
  • FIG. 3 is an exploded perspective view of the TFT panel unit 3.
  • the TFT panel unit 3 includes a TFT holder 31, a TFT panel 32, a diffusion sheet 33, and a TFT cover 34.
  • the TFT holder 31 is fixed to the case 2 as described above.
  • the TFT holder 31 holds the TFT panel 32.
  • the TFT panel 32 is a dot matrix type TFT (Thin Film Transistor) panel or the like.
  • the TFT panel 32 is provided so that the long side direction corresponds to the X direction.
  • the TFT cover 34 is fitted and coupled to the TFT holder 31.
  • the TFT panel 32 and the diffusion sheet 33 are held between the TFT cover 34 and the TFT holder 31 in the Y direction.
  • the mirrors 4 and 5 reflect the image light emitted from the TFT panel unit 3 and emit the image light (display light) from the outlet provided in the upper case (not shown), and windshield the vehicle VC. Direct to glass WS (an example of a transmission / reflection part).
  • glass WS an example of a transmission / reflection part
  • two mirrors 4 and 5 are provided, but the number of mirrors is arbitrary.
  • the mirror 4 is a flat mirror and the mirror 5 is a concave mirror.
  • the mirror 5 may be rotatably supported with respect to the case 2 so that the vertical position of the area exposed to the image light on the windshield glass WS can be adjusted.
  • the display image obtained by the irradiation is in front of the windshield glass WS.
  • Virtual image display) VI can be seen.
  • the driver can visually recognize the display image VI by superimposing it on the front scenery, and can grasp the vehicle information and the like in a mode in which the line of sight movement is small, and the convenience and safety are improved.
  • the backlight unit 6 is provided behind the TFT panel unit 3 (negative side in the Y direction).
  • the backlight unit 6 cooperates with the TFT panel unit 3 to generate image light.
  • the backlight unit 6 is fixed to the case 2.
  • FIG. 4 is a perspective view of the backlight unit 6 in a single item state
  • FIG. 5 is an exploded perspective view of the backlight unit 6.
  • the backlight unit 6 includes a light emitting element body 8 (an example of a lighting device).
  • the backlight unit 6 has a function of emitting light from the light emitting element body 8 to the TFT panel unit 3 and transferring the heat generated by the light emitting element body 8 to the heat radiating portion 21.
  • the backlight unit 6 includes a lens cover 61, a first lens spring 62, a condenser lens 63 (an example of a lens), a diffuser plate 64 (an example of a lens), a lens holder 65, and a second lens spring 66. , A lens array 67 (an example of a lens), a light emitting substrate 68, and a control substrate 69.
  • the lens cover 61 covers the front surface (positive side in the Y direction) of the backlight unit 6.
  • the lens cover 61 has an opening 611 from which the condenser lens 63 is exposed.
  • the lens cover 61 is fitted and coupled to the lens holder 65.
  • the lens cover 61 has claws 612 extending in the negative direction in the Y direction at four corners, and is fitted and coupled to the lens holder 65 by the claws 612.
  • the first lens spring 62 is in the form of a leaf spring, and is provided between the lens cover 61 and the condenser lens 63 in the Y direction.
  • the first lens springs 62 are provided in pairs in the vertical direction.
  • Each of the first lens springs 62 is fixed to the upper side and the lower side side surfaces of the lens cover 61.
  • Each of the first lens springs 62 urges the condenser lens 63 together with the diffuser plate 64 toward the lens holder 65.
  • the first lens spring 62 has a function of defining the positions of the condenser lens 63 and the diffuser plate 64 in the Y direction with respect to the lens holder 65.
  • the diffuser plate 64 and the condenser lens 63 diffuse and collect the light from the light emitting element body 8 that is incident through the lens array 67 toward the front surface (positive side in the Y direction) of the backlight unit 6. It has a function of emitting light.
  • the diffusion plate 64 is, for example, a plate shape formed of a translucent resin material and having at least one surface subjected to fine unevenness processing.
  • the diffuser plate 64 and the condenser lens 63 are held on the positive side of the lens holder 65 in the Y direction.
  • the diffuser plate 64 and the condenser lens 63 each have through holes 641,631 through which the pin portion 650 of the lens holder 65 passes, and the positions in the Z direction and the X direction with respect to the lens holder 65 are defined.
  • the lens holder 65 holds the diffuser plate 64 and the condenser lens 63, and also holds the lens array 67.
  • the lens holder 65 is fixed to the case 2.
  • the backlight unit 6 is fixed to the case 2 by fixing the lens holder 65 to the case 2.
  • the second lens spring 66 is in the form of a leaf spring and is fixed to the lens holder 65.
  • the second lens spring 66 has a function of urging the lens array 67 toward the light emitting substrate 68.
  • the lens array 67 is formed of a translucent resin material and is arranged so as to cover the positive side of the light emitting substrate 68 in the Y direction.
  • the lens array 67 includes a collimator portion 671 having a conical convex outer peripheral surface obtained by rotating a substantially parabolic disconnection.
  • the lens array 67 is located so as to face the light emitting element 8 mounted on the light emitting substrate 68, and transmits the light radiated from the light emitting element 8 to the positive side in the Y direction.
  • the outer shape of the lens array 67 is a rectangle (a rectangle whose long side is in the X direction) that is substantially the same as the outer shape of the TFT panel unit 3 (and the TFT panel 32).
  • the light emitting substrate 68 is provided behind the lens array 67 (on the negative side in the Y direction).
  • a plurality of light emitting element bodies 8 are mounted in an array on the surface of the light emitting substrate 68 on the side facing the lens array 67.
  • Each light emitting element 8 is one or a plurality of LEDs (Light Emitting Diodes).
  • the arrangement method and number of the light emitting element bodies 8 are arbitrary.
  • the light emitting element body 8 is provided so that the optical axis direction (Y direction) is perpendicular to the light emitting substrate 68.
  • the control board 69 is electrically connected to the light emitting board 68 and controls the lighting of a plurality of light emitting element bodies 8 provided on the light emitting board 68.
  • the present embodiment can be applied to a head-up display having an arbitrary structure as long as the light emitting element body 8 is provided.
  • the mirrors 4 and 5 are provided, but one or both of the mirrors 4 and 5 may be omitted.
  • FIG. 6 is a plan view showing an example of one light emitting device body 8
  • FIG. 7 is a cross-sectional view taken along the line AA of FIG.
  • one light emitting device 8 will be described.
  • the light emitting device 8 includes a chip 80 and a phosphor 82.
  • the chip 80 is a blue light emitting diode chip (die).
  • the phosphor 82 is, for example, a YAG (Yttrium aluminum garnet) -based yellow phosphor that covers the chip 80.
  • the phosphor 82 may be formed of a resin containing the phosphor.
  • the phosphor 82 is a ⁇ -sialon (SiAlON) -based green phosphor and a CASN (or SCASSN or 1113 phosphor) or KSF-based red phosphor instead of the yellow phosphor. And may be mixed.
  • the light emitting element body 8 also has a substrate 81, a reflective material 84, and the like.
  • the blue light emitted from the chip 80 becomes white when passing through the phosphor 82, and white light is emitted.
  • FIG. 8 is a diagram showing the characteristics related to the spectrum of the white light generated by the light emitting device 8, and the horizontal axis represents the wavelength and the vertical axis represents the relative emission intensity, and the characteristics are shown.
  • the white light generated by the light emitting element body 8 that is, the white light output from the chip 80 of the blue light emitting diode via the phosphor 82, preferably has a wavelength of 444 nm, as shown in FIG. It is 460 nm or less. In this case, high-quality white light with less yellowness is obtained, and the display quality of the head-up display 1 can be improved.
  • the phosphor 82 for converting the blue light from the chip 80 of the blue light emitting diode into white light is the same individual. If this is the case, the relationship between the wavelength of blue light from the chip 80 of the blue light emitting diode and the wavelength of white light obtained through the phosphor 82 is the same. That is, if the phosphor 82 is the same, the wavelength of blue light from the chip 80 of the blue light emitting diode and the wavelength of white light obtained through the phosphor 82 are in a proportional relationship.
  • FIG. 9 is a diagram showing the characteristics of the color filter of the TFT panel unit 3.
  • the horizontal axis represents the wavelength and the vertical axis represents the transmittance, and the characteristics are shown.
  • the color filter has a characteristic of transmittance with respect to the wavelength of light, that is, the transmittance increases monotonically as the wavelength increases from 450 nm to 500 nm.
  • the color filter shown in FIG. 9 has a characteristic that the transmittance monotonically increases by at least 3% or more as the wavelength increases from 450 nm to 500 nm.
  • the transmittance changes relatively significantly within the wavelength range of 444 nm or more and 460 nm, so that the change in the blue transmittance with respect to the change in the wavelength of white light becomes large. Therefore, even if the wavelength of the white light deviates slightly from the desired range, the white light tends to be yellowish.
  • each light emitting element body 8 of the backlight unit 6 adjusts a white point (hereinafter, also referred to as “white point adjustment”) so as to realize a desired white light with respect to the light passed through the above-mentioned color filter.
  • the brightness adjustment hereinafter, also referred to as “brightness adjustment”
  • the white point adjustment is a process of adjusting the tone of RGB to a desired white color by lowering the tone.
  • the brightness adjustment is a process of raising the brightness reduced due to the white point adjustment to a required level.
  • the wavelength of the white light generated by the light emitting element 8 by limiting the wavelength of the white light generated by the light emitting element 8 to 444 nm or more and 460 nm or less, the decrease in brightness caused by the White point adjustment is suppressed. be able to. As a result, the incidence of defective products can be appropriately reduced.
  • the white light generated by the light emitting element 8 is generated by passing the blue light emitted from the chip 80 of the blue light emitting diode through the phosphor 82. Therefore, when the white light output from the blue light emitting diode chip 80 via the phosphor 82 has a wavelength of 444 nm or more and 460 nm or less for a certain light emitting element body 8, the cause is only the chip 80. However, there may be other factors such as the phosphor 82 and the like. In general, it is difficult to take out only the chip 80 after covering the phosphor 82 and measure the wavelength of the blue light output from the chip 80.
  • the wavelength of blue light output from the chip 80 of the blue light emitting diode is limited to 452 nm or more and 468 nm or less.
  • the quality control of the light emitting device 8 can be performed in a manner in which other factors (for example, the phosphor 82) are excluded, as compared with the case where the wavelength of the white light obtained through the phosphor 82 is limited.
  • the backlight unit 6 satisfying the required quality can be efficiently manufactured.
  • the blue light emitting diode chip 80 in addition to limiting the wavelength of blue light output from the blue light emitting diode chip 80 to 452 nm or more and 468 nm or less, the blue light emitting diode chip 80 to the phosphor 82 It may be specified that the wavelength of the white light output via the LED is limited to 444 nm or more and 460 nm or less.
  • FIG. 10 is a schematic flowchart showing an outline of a method for manufacturing the light emitting element body 8.
  • the method for manufacturing the light emitting element body 8 includes a first inspection step S1, an assembly step S2, and a second inspection step S3.
  • the first inspection step S1 and the assembly step S2 do not have to be executed in parallel, and may be executed at different places. This also applies to the assembly process S2 and the second inspection process S3, and also applies to the first inspection process S1 and the second inspection process S3.
  • the first inspection step S1 includes steps from step S100 to step S112.
  • step S100 a chip of a blue light emitting diode to be inspected is prepared, and one of them is selected. For example, a plurality of blue light emitting diode chips to be inspected are prepared.
  • step S102 blue light is generated from the selected chip, and the wavelength of the blue light is measured.
  • step S104 it is determined whether or not the measured value of the wavelength is 452 nm or more and 468 nm or less based on the measurement result obtained in step S102. For example, it is determined whether or not the wavelength at which the peak of the spectrum is 452 nm or more and 468 nm or less. If the determination result is "YES”, the process proceeds to step S106, and if not, the process proceeds to step S108.
  • step S106 the chip selected in step S102 is determined as a non-defective product.
  • step S108 the chip selected in step S102 is determined as a defective product.
  • step S110 it is determined whether or not all the chips of the blue light emitting diode to be inspected have been selected. If the determination result is "YES”, the process ends, and if not, the process proceeds to step S112. In step S112, the next one chip is selected from the chips of the blue light emitting diode to be inspected, and the process is repeated from step S104.
  • the assembly step S2 includes the steps from step S200 to step S202.
  • step S200 a chip judged to be a non-defective product in the first inspection step S1 is selected.
  • step S202 the light emitting element body 8 is manufactured using the chip selected in step S200.
  • the chip selected in step S200 becomes a chip 80 that is sealed with a resin containing a phosphor and is covered with the phosphor 82.
  • the second inspection step S3 includes the steps from step S300 to step S302.
  • step S300 another inspection regarding the chromaticity range and the like is performed on the light emitting element body 8 obtained in step S202.
  • step S302 only the light emitting element 8 that satisfies the regulation in step S300 is ready to be shipped as a product of a predetermined model number.
  • the blue light emitting diode chip 80 whose measured value of the wavelength of the emitted light is 452 nm or more and 468 nm or less is used as a good product, and the good product chip 80 is used. Only the light emitting element 8 covered with the phosphor 82 can be shipped.
  • the measured value of the wavelength of light is 452 nm or more and 468 nm or less.
  • the head-up display 1 can be manufactured by using the light emitting element body 8 which has been inspected before shipment.
  • FIG. 11 is a schematic flowchart showing an outline of the manufacturing method of the head-up display 1.
  • step S400 the light emitting element body 8 to which a predetermined model number is assigned is prepared. That is, the light emitting element 8 manufactured from the chip 80 of the blue light emitting diode whose measured value of the wavelength of the emitted light is 452 nm or more and 468 nm or less is prepared.
  • step S402 the backlight unit 6 is assembled using the light emitting element body 8 prepared in step S400.
  • step S404 the head-up display 1 is assembled using the backlight unit 6 obtained in step S402.
  • step S406 the white point adjustment and the brightness adjustment described above are executed.
  • step S408 other necessary inspections and the like are performed, and only the head-up display 1 that meets the regulations can be shipped as a product of a predetermined model number.
  • the chip 80 of the blue light emitting diode whose measured value of the wavelength of the emitted light is 452 nm or more and 468 nm or less can be used for the backlight unit 6.
  • the possibility that the decrease in brightness after adjusting the white point becomes large can be reduced, and the yield is improved.
  • the possibility that the blue light emitting diode chip 80 itself is defective can be substantially eliminated, so that it is easy to take measures against defects. Become.

Abstract

L'objectif de la présente invention est de fournir un dispositif d'éclairage qui satisfait la qualité requise et qui peut être fabriqué efficacement ainsi que de fabriquer efficacement un dispositif d'éclairage et similaire qui satisfont à la qualité requise. L'invention concerne un dispositif d'affichage tête haute comprenant : un dispositif d'éclairage qui a une puce de diode électroluminescente bleue, un phosphore recouvrant la puce et qui génère une lumière blanche ; ainsi qu'un instrument d'affichage qui émet une lumière d'affichage en étant éclairé par le dispositif d'éclairage, la longueur d'onde de la lumière émise par la puce de diode électroluminescente bleue étant comprise entre 452 et 468 nm.
PCT/JP2020/020370 2019-05-24 2020-05-22 Affichage tête haute, son procédé de fabrication et procédé de fabrication de dispositif d'éclairage WO2020241511A1 (fr)

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JP2019097729 2019-05-24
JP2019-097729 2019-05-24

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WO2020241511A1 true WO2020241511A1 (fr) 2020-12-03

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076749A (ja) * 2007-09-21 2009-04-09 Toyoda Gosei Co Ltd Ｌｅｄ装置及びその製造方法
US20130062637A1 (en) * 2011-09-14 2013-03-14 Express Imaging Systems, Llc Apparatus, method to enhance color contrast in phosphor-based solid state lights
JP2015091915A (ja) * 2013-10-04 2015-05-14 三菱化学株式会社 発光装置、及び波長変換部材
JP2015222384A (ja) * 2014-05-23 2015-12-10 大日本印刷株式会社 液晶表示装置およびカラーフィルタ
JP2017151403A (ja) * 2016-02-23 2017-08-31 株式会社デンソー ヘッドアップディスプレイ装置
JP2018021193A (ja) * 2016-07-26 2018-02-08 三菱ケミカル株式会社 焼結蛍光体、発光装置、照明装置、画像表示装置および車両用表示灯
JP2018078285A (ja) * 2016-10-31 2018-05-17 日亜化学工業株式会社 発光装置
JP2019078685A (ja) * 2017-10-26 2019-05-23 株式会社ブイ・テクノロジー Ｌｅｄチップの検査方法、その検査装置及びｌｅｄディスプレイの製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076749A (ja) * 2007-09-21 2009-04-09 Toyoda Gosei Co Ltd Ｌｅｄ装置及びその製造方法
US20130062637A1 (en) * 2011-09-14 2013-03-14 Express Imaging Systems, Llc Apparatus, method to enhance color contrast in phosphor-based solid state lights
JP2015091915A (ja) * 2013-10-04 2015-05-14 三菱化学株式会社 発光装置、及び波長変換部材
JP2015222384A (ja) * 2014-05-23 2015-12-10 大日本印刷株式会社 液晶表示装置およびカラーフィルタ
JP2017151403A (ja) * 2016-02-23 2017-08-31 株式会社デンソー ヘッドアップディスプレイ装置
JP2018021193A (ja) * 2016-07-26 2018-02-08 三菱ケミカル株式会社 焼結蛍光体、発光装置、照明装置、画像表示装置および車両用表示灯
JP2018078285A (ja) * 2016-10-31 2018-05-17 日亜化学工業株式会社 発光装置
JP2019078685A (ja) * 2017-10-26 2019-05-23 株式会社ブイ・テクノロジー Ｌｅｄチップの検査方法、その検査装置及びｌｅｄディスプレイの製造方法

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